Display module and preparation method thereof

Abstract

The embodiment of the invention provides a display module and a preparation method of the display module. The display module is provided with a display area, and in the display area, the display module comprises a display unit layer, a first electrode layer and a second electrode layer, the conductive shielding layer is located on one side of the display unit layer, and the conductive shielding layer is grounded or connected with a direct current signal; the first insulating layer is positioned on one side, far away from the display unit layer, of the conductive shielding layer; the touch electrode layer is located on the side, away from the display unit layer, of the first insulating layer and used for providing a touch function for the display module. According to the embodiment of the invention, the problem that the touch performance is affected by coupling capacitance is reduced, and the use performance of an OLED display product is improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and more particularly to a display module and a method for preparing the display module. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In view of this, embodiments of the present application provide a display module and a method for manufacturing the display module to at least partially solve the above problems.

[0005] According to a first aspect of an embodiment of the present application, a display module is provided, wherein the display module has a display area, and within the display area, the display module includes:

[0006] Display unit layer;

[0007] A conductive shielding layer, located at one side of the display unit layer, and the conductive shielding layer is grounded or connected to a DC signal;

[0008] A first insulating layer, located on a side of the conductive shielding layer away from the display unit layer;

[0009] The touch electrode layer is located on a side of the first insulating layer away from the display unit layer and is used to provide a touch function for the display module.

[0010] In an optional embodiment, the display module further has a frame area, which is located at the periphery of the display area. In the frame area, the display module includes: the display unit layer, the conductive shielding layer, the first insulating layer, the touch electrode layer, and,

[0011] An electrical connection layer, a portion of which is electrically connected to the conductive shielding layer;

[0012] Preferably, the electrical connection layer comprises a metal material, and the resistivity of the material of the electrical connection layer is less than the resistivity of the material of the conductive shielding layer;

[0013] Preferably, the conductive shielding layer is grounded or connected to a DC signal through a portion of the electrical connection layer.

[0014] In an optional embodiment, the display unit layer includes a light-emitting unit and a metal circuit layer, the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction close to the conductive shielding layer, the metal circuit layer is located on a side of the first electrode away from the light-emitting functional layer, wherein a first target circuit layer portion of the metal circuit layer is located in the border area;

[0015] The electrical connection layer includes a first electrical connection portion, and the first electrical connection portion is used to electrically connect the touch electrode layer and the first target circuit layer.

[0016] In an optional embodiment, the electrical connection layer further includes a second electrical connection portion, the second target circuit layer portion of the metal circuit layer is located in the border area, and the second electrical connection portion is used to electrically connect the conductive shielding layer and the second target circuit layer.

[0017] In an optional embodiment, the first insulating layer includes at least one organic layer.

[0018] In an optional embodiment, in the display area, the first insulating layer includes:

[0019] A first organic layer, located on a side of the conductive shielding layer away from the display unit layer;

[0020] a second organic layer, located between the first organic layer and the touch electrode layer;

[0021] Preferably, the thickness of the first organic layer is less than the thickness of the second organic layer;

[0022] Preferably, the dielectric constant of the first organic layer is greater than the dielectric constant of the second organic layer;

[0023] Preferably, the thickness of the first organic layer is greater than 2 micrometers and less than 5 micrometers, and / or the thickness of the second organic layer is greater than 17 micrometers;

[0024] Preferably, the first organic layer and the second organic layer are made of different organic materials.

[0025] In an optional embodiment, the conductive shielding layer comprises a transparent material;

[0026] Preferably, the conductive shielding layer comprises a transparent metal oxide material;

[0027] Preferably, the conductive shielding layer comprises indium tin oxide material;

[0028] Preferably, the conductive shielding layer and part of the metal circuit layer in the display unit layer are connected to the same signal.

[0029] In an optional embodiment, the touch electrode layer includes:

[0030] A first touch electrode layer, located on a side of the first insulating layer away from the display unit layer;

[0031] a second insulating layer, located on a side of the first touch electrode layer away from the display unit layer;

[0032] A second touch electrode layer is located on a side of the second insulating layer away from the display unit layer;

[0033] Preferably, a side of the second touch electrode layer away from the display unit layer is further covered with a first protective layer.

[0034] In an optional embodiment, the display module further includes:

[0035] An encapsulation layer, located between the display unit layer and the conductive shielding layer, and used to encapsulate the display unit layer;

[0036] Preferably, the encapsulation layer comprises at least one organic layer and at least one inorganic layer;

[0037] Preferably, the encapsulation layer comprises: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, wherein the first inorganic encapsulation layer covers at least a portion of the display unit layer, the organic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the display unit layer, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the display unit layer;

[0038] Preferably, there is a second protective layer between the encapsulation layer and the conductive shielding layer.

[0039] According to a second aspect of an embodiment of the present application, a method for preparing a display module is provided, comprising:

[0040] preparing a display unit layer on a substrate;

[0041] Preparing a conductive shielding layer for grounding or connecting a DC signal on the display unit layer;

[0042] Preparing a first insulating layer on a side of the conductive shielding layer away from the display unit layer;

[0043] A touch electrode layer for providing a touch function for the display module is prepared on a side of the first insulating layer away from the display unit layer.

[0044] According to the solution provided in the embodiment of the present application, the display module has a display area, and in the display area, the display module includes: a display unit layer; a conductive shielding layer, located on one side of the display unit layer, and the conductive shielding layer is grounded or connected to a DC signal, reducing coupling ripples, preventing coupling ripples from affecting touch signals, and reducing power consumption; a first insulating layer, located on the side of the conductive shielding layer away from the display unit layer, and by adjusting the thickness and material of the material in the first insulating layer, the coupling capacitance can be effectively reduced; a touch electrode layer, located on the side of the first insulating layer away from the display unit layer, and used to provide a touch function for the display module. According to the solution provided in the embodiment of the present application, the problem of the coupling capacitance affecting the touch performance is reduced, and the performance of the OLED display product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0046] Figure 1 is a schematic diagram of an exemplary film layer structure of a display module;

[0047] Figure 2a is a partial cross-sectional schematic diagram of a first display module film structure according to an embodiment of the present application;

[0048] Figure 2b is a partial cross-sectional schematic diagram of a second display module film structure according to an embodiment of the present application;

[0049] Figure 2c is a partial cross-sectional schematic diagram of a third display module film structure according to an embodiment of the present application;

[0050] Figure 2d is a partial cross-sectional schematic diagram of a fourth display module film structure according to an embodiment of the present application;

[0051] Figure 3 The present invention is a flowchart of a method for preparing a display module according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0053] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in the embodiments of the present application refers to and includes any or all possible combinations of one or more associated listed items.

[0054] It should be understood that in the description of the embodiments of the present application, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the schemes of the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0055] In addition, when an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.

[0056] The terms first, second, etc. are used to describe various elements, components, regions, layers and / or parts, but these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or part from another element, component, region, layer and / or part.

[0057] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0058] The specific implementation of the embodiment of the present application is further explained below in conjunction with the accompanying drawings of the embodiment of the present application.

[0059] Existing flexible display technologies include TOE (Touch On Encap), which realizes the integration of touch sensing, that is, the touch function is directly realized on the OLED film package without adding an additional touch panel. Figure 1 As shown, a large coupling capacitance is generated between the metal in the touch electrode layer 50 and the cathode metal in the display unit layer 10, so that the voltage ripple of the pixel array in the display unit layer 10 is transmitted to the touch electrode layer 50, thereby affecting the touch signal in the touch electrode layer 50, which is not conducive to the transmission and reception of the touch signal in the touch electrode layer 50.

[0060] Based on this, the present application embodiment provides a display module, please refer to the attached Figure 2a As shown, the display module of the embodiment of the present application has a display area and a frame area, specifically including: a display unit layer 10, a conductive shielding layer 30, a first insulating layer 40 and a touch electrode layer 50, wherein the conductive shielding layer 30 and the first insulating layer 40 are located between the display unit layer 10 and the touch electrode layer 50, specifically, the conductive shielding layer 30 is located on one side of the display unit layer 10, and the first insulating layer 40 is located on the side of the conductive shielding layer 30 away from the display unit layer 10.

[0061] In a feasible manner, the display unit layer 10 is located on the substrate, and the substrate can be implemented as a TFT (Thin Film Transistor) array substrate, the array substrate includes a plurality of TFTs, each of which includes a source electrode, a drain electrode, a gate insulating film, a gate electrode and other parts. In a feasible manner, the display unit layer 10 includes a plurality of light-emitting units and a metal circuit layer, wherein the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the substrate, the metal circuit layer is located on the side of the first electrode away from the light-emitting functional layer, and further, the first target circuit layer portion of the metal circuit layer is located in the border area; optionally, when a voltage is applied to the control electrode gate in the TFT, the TFT is in a conducting state, a conductive channel is formed between the source electrode and the drain electrode, and current can enter the first electrode through the conductive channel, thereby driving the light-emitting unit to emit light. In one feasible method, the light-emitting functional layer includes EL (Electro-Luminescence) material, the first electrode is implemented as an anode, and the second electrode is implemented as a cathode. The light-emitting functional layer is driven to emit light under the joint action of the first electrode and the second electrode to realize the display function of the display module.

[0062] In a feasible manner, the side of the display unit layer 10 away from the substrate is also covered with an encapsulation layer 20 for encapsulating the display unit layer 10. In a feasible manner, the encapsulation layer 20 includes at least one organic layer and at least one inorganic layer, for example, the encapsulation layer 20 includes a first inorganic encapsulation layer 201, an organic encapsulation layer 202, and a second inorganic encapsulation layer 203, the first inorganic encapsulation layer 201 at least partially covers the display unit layer 10, the organic encapsulation layer 202 is located on the side of the first inorganic encapsulation layer 201 away from the display unit layer 10, and the second inorganic encapsulation layer 203 is located on the side of the organic encapsulation layer 202 away from the display unit layer 10; wherein, the organic encapsulation layer 202 is used as an encapsulation layer to encapsulate and protect the display unit layer 10, and the organic encapsulation layer 202 and the display unit layer 10 are further encapsulated by two inorganic layers to prevent the intrusion of water vapor and oxygen, etc., thereby ensuring the reliability and stability of the encapsulation, thereby extending the service life of the display module. In one feasible manner, at least one organic layer is prepared by IJP (Ink Jet Printing) technology, which can achieve precise deposition of organic materials by precisely controlling the ejection of ink droplets, and IJP technology does not require a mask, so it is easier to process large-sized panels, simplifying the manufacturing process. In one feasible manner, at least one inorganic layer is deposited by CVD (Chemical Vapor Deposition) technology.

[0063] The conductive shielding layer 30 is located on the side of the packaging layer 20 away from the display unit layer 10. The conductive shielding layer 30 is grounded or connected to a DC signal, thereby reducing interference between different circuits. The conductive shielding layer 30 is grounded or connected to a stable DC signal, thereby reducing the AC coupling between the display unit layer 10 and the touch electrode layer 50, thereby reducing the coupling ripple and preventing the coupling ripple from affecting the touch signal of the touch electrode layer 50, thereby improving the touch performance of the touch electrode layer 50 and reducing power consumption.

[0064] The conductive shielding layer 30 of the embodiment of the present application includes a transparent material for transmitting light to realize the picture display in the display area. In a feasible manner, the conductive shielding layer 30 includes a transparent metal oxide material, for example, an indium tin oxide (ITO) material. Through the good conductivity and optical transparency of the transparent metal oxide material, the function of shielding the display ripple of the conductive shielding layer 30 is realized while ensuring the light transmission of the display area. In a feasible manner, the conductive shielding layer 30 of the embodiment of the present application includes a metal material, and the conductive shielding layer 30 is implemented as a metal grid. When the conductive shielding layer 30 is grounded or connected to a DC signal, the coupling ripple is reduced to prevent the coupling ripple from affecting the touch signal of the touch electrode layer 50, thereby improving the touch performance of the touch electrode layer 50 and reducing power consumption.

[0065] In one feasible embodiment, a second protective layer is provided between the conductive shielding layer 30 and the encapsulation layer 20. The second protective layer prevents the encapsulation layer 20 from being damaged due to excessive etching when preparing the second inorganic encapsulation layer 203, thereby preventing the display unit layer 10 from being affected by etching, ensuring the reliability and stability of the encapsulation, and thus extending the service life of the display module.

[0066] The first insulating layer 40 includes at least one organic layer. In one feasible manner, the first insulating layer 40 includes a first organic layer 401 and a second organic layer 402. The first organic layer 401 is located on the side of the conductive shielding layer 30 away from the display unit layer 10, and the second organic layer 402 is located between the first organic layer 401 and the touch electrode layer 50. In one feasible manner, the thickness of the first organic layer 401 is less than the thickness of the second organic layer 402. For example, the thickness of the first organic layer 401 is greater than 2 microns and less than 5 microns, and / or the thickness of the second organic layer 402 is greater than 17 microns; the dielectric constant of the first organic layer 401 is greater than the dielectric constant of the second organic layer 402. In a parallel plate capacitor, the dielectric constant is proportional to the capacitance and inversely proportional to the distance between the two plates. Therefore, adjusting the dielectric constant and the distance between the display unit layer 10 and the touch electrode layer 50 can effectively change the capacitance value. By adjusting the dielectric constant of the second organic layer 402 and the thickness of the first organic layer 401 and the second organic layer 402, the coupling capacitance between the display unit layer 10 and the touch electrode layer 50 can be effectively reduced. In one feasible manner, the first organic layer 401 and the second organic layer 402 are made of different organic materials. In one feasible manner, the material of the first organic layer 401 includes organic optical glue. In one feasible manner, the second organic layer 402 is prepared using IJP technology.

[0067] In a feasible manner, the touch electrode layer 50 of the embodiment of the present application includes: a first touch electrode layer 501, a second insulating layer 502 and a second touch electrode layer 503, which are used to provide a touch function for the display module. Among them, the first touch electrode layer 501 is located on the side of the first insulating layer 40 away from the display unit layer 10, the second insulating layer 502 is located on the side of the first touch electrode layer 501 away from the display unit layer 10, and the second touch electrode layer 503 is located on the side of the second insulating layer 502 away from the display unit layer 10, thereby, the touch electrode layer 50 of the embodiment of the present application can receive touch signals and provide touch functions for the display module. The second insulating layer 502 separates the first touch electrode layer 501 and the second touch electrode layer 503 to prevent different electrical signals from affecting each other. In a feasible manner, the material of the first touch electrode layer 501 and the second touch electrode layer 503 includes a metal material, for example: a metal laminate structure of titanium / aluminum / titanium, or silver. In one feasible manner, the material of the second insulating layer 502 includes an inorganic insulating material, such as silicon oxide. In one feasible manner, the side of the second touch electrode layer 503 away from the display unit layer 10 is also covered with a first protective layer 60, which is used to encapsulate and protect the touch electrode layer 50 to prevent water vapor or oxygen from invading and affecting the touch function of the touch electrode layer 50, thereby improving the service life of the display module.

[0068] In the frame area outside the display area, the display module of the embodiment of the present application also includes an electrical connection layer 70. Part of the electrical connection layer 70 is electrically connected to the conductive shielding layer 30. In one feasible manner, the electrical connection layer 70 includes a metal material, and the resistivity of the material of the electrical connection layer 70 is less than the resistivity of the material of the conductive shielding layer 30, so that the electrical signal can be transmitted more effectively. In one feasible manner, in the frame area, the conductive shielding layer 30 is grounded or connected to a DC signal through part of the electrical connection layer 70.

[0069] Specifically, Figure 2a As shown, in one feasible manner, the electrical connection layer 70 includes a first electrical connection portion 701, and the first electrical connection portion 701 electrically connects the touch electrode layer 50 to the first target circuit layer. For example, the first electrical connection portion 701 passes through each film layer structure covered on the metal circuit layer in the display unit layer 10 to electrically connect the touch electrode layer 50 to the first target circuit layer. In another feasible manner, as Figure 2b As shown, the first electrical connection portion 701 is also electrically connected to the conductive shielding layer 30, so that the conductive shielding layer 30 and the partial circuit layer of the touch electrode layer 50 in the frame area are connected to the same signal. For example, the conductive shielding layer 30 and the partial circuit layer of the touch electrode layer 50 in the frame area are connected to the same GND (Ground) signal, thereby achieving grounding of the conductive shielding layer 30 and further reducing interference between different circuits. Among them, the GND signal can be implemented as a GND signal provided by a touch chip, etc.

[0070] In another possible approach, Figure 2c As shown, the electrical connection layer 70 also includes a second electrical connection portion 702. The second target circuit layer portion of the metal circuit layer is located in the frame area, and the second electrical connection portion 702 is used to electrically connect the conductive shielding layer 30 with the second target circuit layer. For example, the second electrical connection portion 702 passes through each film layer structure covered on the metal circuit layer in the display unit layer 10 to electrically connect the conductive shielding layer 30 with the second target circuit layer. Figure 2c The relative position relationship between the first electrical connection part 701 and the second electrical connection part 702 shown in is only an example. In practical applications, those skilled in the art can appropriately adjust the relative position relationship between the first electrical connection part 701 and the second electrical connection part 702 according to actual needs, and this embodiment is not limited here. For example, the relative position relationship between the first electrical connection part 701 and the second electrical connection part 702 is adjusted so that in a partial cross-sectional schematic diagram of the membrane structure of a display module, the first electrical connection part 701 and the second electrical connection part 702 overlap. Among them, the first electrical connection part 701 and the second electrical connection part 702 transmit signals independently.

[0071] In a feasible manner, the conductive shielding layer 30 and a part of the metal circuit layer in the display unit layer 10 are connected to the same signal. For example, the conductive shielding layer 30 and the second target circuit layer in the display unit layer 10 are connected to the same signal. Specifically, the conductive shielding layer 30 and the second target circuit layer in the display unit layer 10 are connected to the same GND signal, or DC signal. The GND signal in the display unit layer 10 can be implemented as a GND signal provided by a display chip, a power chip, etc.

[0072] In a feasible manner, the conductive shielding layer 30 can be directly connected to a DC signal through a portion of the electrical connection layer 70 , for example, connected to a DC signal provided by a display chip, a power chip, a touch chip, etc.

[0073] As a result, the conductive shielding layer 30 is grounded or connected to a stable DC signal, thereby reducing interference between different circuits; and reducing the AC coupling between the display unit layer 10 and the touch electrode layer 50, thereby reducing the coupling ripple and preventing the coupling ripple from affecting the touch signal of the touch electrode layer 50, thereby improving the touch performance of the touch electrode layer 50 and reducing power consumption.

[0074] In one feasible manner, the electrical connection layer 70 is partially located between the first insulating layer 40 and the display unit layer 10, for example, Figure 2a and Figure 2b As shown, the first electrical connection portion 701 in the electrical connection layer 70 is partially located between the first insulating layer 40 and the display unit layer 10. In another feasible manner, the electrical connection layer 70 is partially located between the first insulating layer 40 and the conductive shielding layer 30. For example, Figure 2d As shown, the first electrical connection portion 701 in the electrical connection layer 70 is partially located between the first insulating layer 40 and the conductive shielding layer 30 .

[0075] In a feasible manner, the material of the electrical connection layer 70 includes a metal material, for example, the electrical connection layer 70 is a metal stacked structure of titanium / aluminum / titanium, or the material of the electrical connection layer 70 includes silver. The first electrical connection portion 701 slows down the descent of the first touch electrode layer 501 and the second touch electrode layer 503 in the frame area, so that the first touch electrode layer 501 and the second touch electrode layer 503 do not need to descend too far at one time, thereby reducing the process difficulty of the jumper of the first touch electrode layer 501 and the second touch electrode layer 503 in the frame area.

[0076] In the display module of the embodiment of the present application, a conductive shielding layer 30 and a first insulating layer 40 are added between the display unit layer 10 and the touch electrode layer 50. The conductive shielding layer 30 is grounded or connected to a stable DC signal, which reduces the coupling ripple and prevents the coupling ripple from affecting the touch signal of the touch electrode layer 50, thereby improving the touch performance of the touch electrode layer 50 and reducing power consumption. At the same time, the first insulating layer 40 effectively reduces the coupling capacitance between the display unit layer 10 and the touch electrode layer 50 by adjusting the parameters of the internal film layer. Therefore, for a larger OLED display module, the problem of reducing the touch performance due to the influence of the coupling capacitance when using the TOE technology is reduced, and the performance of the OLED display product is improved.

[0077] The present application also provides a method for preparing a display module. Figure 3 As shown, a method for preparing a display module according to an embodiment of the present application includes the following steps:

[0078] Step S302. Preparing a display unit layer on the substrate;

[0079] Step S304. Prepare a conductive shielding layer for grounding or connecting a DC signal on the display unit layer;

[0080] In one possible embodiment, the conductive shielding layer is grounded or connected to a DC signal.

[0081] Step S306. Preparing a first insulating layer on a side of the conductive shielding layer away from the display unit layer;

[0082] Step S308: On a side of the first insulating layer away from the display unit layer, a touch electrode layer for providing a touch function for the display module is prepared.

[0083] In one feasible manner, before step S304, a method for preparing a display module of an embodiment of the present application further includes: preparing an encapsulation layer on a side of the display unit layer away from the substrate; wherein the encapsulation layer includes at least one organic layer and at least one inorganic layer, and in one feasible manner, at least one organic layer is prepared using IJP technology, and at least one inorganic layer is deposited using CVD technology.

[0084] The display module has a display area and a frame area. In one feasible manner, the display unit layer includes a plurality of light-emitting units and a metal circuit layer, wherein the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction away from the substrate, the metal circuit layer is located on a side of the first electrode away from the light-emitting functional layer, and further, a first target circuit layer portion of the metal circuit layer is located in the frame area.

[0085] In a feasible manner, before step S306 , a method for preparing a display module according to an embodiment of the present application further includes: preparing an electrical connection layer on the display unit layer in the frame area.

[0086] Part of the electrical connection layer is electrically connected to the conductive shielding layer. In a feasible manner, the electrical connection layer includes a metal material, and the resistivity of the material of the electrical connection layer is smaller than the resistivity of the material of the conductive shielding layer, so that the electrical signal can be transmitted more effectively.

[0087] In a feasible manner, the conductive shielding layer is grounded or connected to a DC signal through a portion of the electrical connection layer.

[0088] Specifically, specifically, such as Figure 2a As shown, in one feasible manner, the electrical connection layer includes a first electrical connection portion, and the first electrical connection portion electrically connects the touch electrode layer with the first target circuit layer. For example, the first electrical connection portion passes through each film layer structure covered on the metal circuit layer in the display unit layer to electrically connect the touch electrode layer with the first target circuit layer. In another feasible manner, as Figure 2b As shown, the first electrical connection portion is also electrically connected to the conductive shielding layer, so that the conductive shielding layer and the part of the circuit layer of the touch electrode layer in the frame area are connected to the same signal. For example, the conductive shielding layer and the part of the circuit layer of the touch electrode layer in the frame area are connected to the same GND signal, thereby achieving grounding of the conductive shielding layer and further reducing interference between different circuits. The GND signal can be implemented as a GND signal provided by a touch chip, etc.

[0089] In another possible approach, Figure 2c As shown, the electrical connection layer also includes a second electrical connection portion. The second target circuit layer portion of the metal circuit layer is located in the frame area, and the second electrical connection portion is used to electrically connect the conductive shielding layer with the second target circuit layer. For example, the second electrical connection portion passes through each film layer structure covered on the metal circuit layer in the display unit layer to electrically connect the conductive shielding layer with the second target circuit layer. Figure 2c The relative position relationship between the first electrical connection part and the second electrical connection part shown in is only an example. In practical applications, those skilled in the art can appropriately adjust the relative position relationship between the first electrical connection part and the second electrical connection part according to actual needs, and this embodiment is not limited here. For example, the relative position relationship between the first electrical connection part and the second electrical connection part is adjusted so that in a partial cross-sectional schematic diagram of the membrane structure of a display module, the first electrical connection part overlaps with the second electrical connection part. The first electrical connection part and the second electrical connection part transmit signals independently.

[0090] In one feasible manner, the conductive shielding layer and a portion of the metal circuit layer in the display unit layer are connected to the same signal. For example, the conductive shielding layer and the second target circuit layer in the display unit layer are connected to the same signal. Specifically, the conductive shielding layer and the second target circuit layer in the display unit layer are connected to the same GND signal, or DC signal. The GND signal in the display unit layer can be implemented as a GND signal provided by a display chip, a power chip, etc.

[0091] In a feasible manner, the conductive shielding layer can be directly connected to the DC signal through a part of the electrical connection layer, for example, connected to the DC signal provided by the display chip, the power chip, the touch chip, etc.

[0092] In one feasible manner, in step S306, the first insulating layer includes a first organic layer and a second organic layer, the second organic layer is located between the first organic layer and the touch electrode layer, the thickness of the first organic layer is less than the thickness of the second organic layer, for example, the thickness of the first organic layer is greater than 2 microns and less than 5 microns, and / or the thickness of the second organic layer is greater than 17 microns; the dielectric constant of the first organic layer is greater than the dielectric constant of the second organic layer. In one feasible manner, the first organic layer and the second organic layer are made of different organic materials. In one feasible manner, the material of the first organic layer includes organic optical glue. In one feasible manner, the second organic layer is prepared using I JP technology.

[0093] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A display module, characterized in that: The display module has a display area, and within the display area, the display module includes: Display unit layer; A conductive shielding layer, located at one side of the display unit layer, and the conductive shielding layer is grounded or connected to a DC signal; A first insulating layer, located on a side of the conductive shielding layer away from the display unit layer; The touch electrode layer is located on a side of the first insulating layer away from the display unit layer and is used to provide a touch function for the display module.

2. The display module according to claim 1, characterized in that: The display module further has a frame area, which is located at the periphery of the display area. In the frame area, the display module includes: the display unit layer, the conductive shielding layer, the first insulating layer, the touch electrode layer, and, An electrical connection layer, a portion of which is electrically connected to the conductive shielding layer; Preferably, the electrical connection layer comprises a metal material, and the resistivity of the material of the electrical connection layer is less than the resistivity of the material of the conductive shielding layer; Preferably, the conductive shielding layer is grounded or connected to a DC signal through a portion of the electrical connection layer.

3. The display module according to claim 2, characterized in that: The display unit layer includes a light-emitting unit and a metal circuit layer, wherein the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence in a direction close to the conductive shielding layer, and the metal circuit layer is located on a side of the first electrode away from the light-emitting functional layer, wherein a first target circuit layer portion of the metal circuit layer is located in the frame area; The electrical connection layer includes a first electrical connection portion, and the first electrical connection portion is used to electrically connect the touch electrode layer and the first target circuit layer.

4. The display module according to claim 3, characterized in that: The electrical connection layer further includes a second electrical connection portion, the second target circuit layer portion of the metal circuit layer is located in the frame area, and the second electrical connection portion is used to electrically connect the conductive shielding layer and the second target circuit layer.

5. The display module according to any one of claims 1 to 4, characterized in that: The first insulating layer includes at least one organic layer.

6. The display module according to claim 5, characterized in that: In the display area, the first insulating layer includes: A first organic layer, located on a side of the conductive shielding layer away from the display unit layer; a second organic layer, located between the first organic layer and the touch electrode layer; Preferably, the thickness of the first organic layer is less than the thickness of the second organic layer; Preferably, the dielectric constant of the first organic layer is greater than the dielectric constant of the second organic layer; Preferably, the thickness of the first organic layer is greater than 2 micrometers and less than 5 micrometers, and / or the thickness of the second organic layer is greater than 17 micrometers; Preferably, the first organic layer and the second organic layer are made of different organic materials.

7. The display module according to claim 4, characterized in that: The conductive shielding layer comprises a transparent material; Preferably, the conductive shielding layer comprises a transparent metal oxide material; Preferably, the conductive shielding layer comprises indium tin oxide material; Preferably, the conductive shielding layer and part of the metal circuit layer in the display unit layer are connected to the same signal.

8. The display module according to any one of claims 1 to 4, characterized in that: The touch electrode layer comprises: A first touch electrode layer, located on a side of the first insulating layer away from the display unit layer; a second insulating layer, located on a side of the first touch electrode layer away from the display unit layer; A second touch electrode layer is located on a side of the second insulating layer away from the display unit layer; Preferably, a side of the second touch electrode layer away from the display unit layer is further covered with a first protective layer.

9. The display module according to any one of claims 1 to 4, characterized in that: The display module also includes: An encapsulation layer, located between the display unit layer and the conductive shielding layer, and used to encapsulate the display unit layer; Preferably, the encapsulation layer comprises at least one organic layer and at least one inorganic layer; Preferably, the encapsulation layer comprises: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer, wherein the first inorganic encapsulation layer covers at least a portion of the display unit layer, the organic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the display unit layer, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the display unit layer; Preferably, a second protective layer is provided between the encapsulation layer and the conductive shielding layer.

10. A method for preparing a display module, characterized in that: include: preparing a display unit layer on a substrate; Preparing a conductive shielding layer for grounding or connecting a DC signal on the display unit layer; Preparing a first insulating layer on a side of the conductive shielding layer away from the display unit layer; A touch electrode layer for providing a touch function for the display module is prepared on a side of the first insulating layer away from the display unit layer.

Images