Test arrangement for air transmission testing of an angular device to be test angular to a surface of

Abstract

The invention relates to a test arrangement for over-the-air transmission (OTA) testing of an angled device under test, wherein the test arrangement comprises a carrier structure. The test arrangement includes a receptacle of a device under test coupled with a carrier structure, where the receptacle of the device under test is configured to establish electrical contact with an inner surface of the angled device under test or with a connector arranged on the inner surface of the angled device under test. The receptacle of the device under test is configured to position the angled device under test such that the first outer surface of the angled device under test is inclined at least an degree relative to the surface of the carrier structure.

Description

Technical Field

[0001] Embodiments according to the invention relate to a test arrangement for over-the-air testing, in particular using an angled device under test that is tilted relative to a surface of a carrier structure.

[0002] An embodiment according to the present invention is directed to a socket for over-the-air testing of an L-type antenna in a package module using automated testing equipment. Background Art

[0003] The test arrangement can be used to test a device under test (e.g., an antenna in a packaged device) that is capable of receiving and / or emitting electromagnetic radiation. Typically, the device under test has a planar shape with two opposing surfaces so that, for example, the device under test can be mounted in a socket of the device under test (e.g., an over-the-air (OTA) socket for radiated near-field testing of a packaged antenna device) so that one of the surfaces faces the socket of the device under test and the other surface faces away from the socket of the device under test. For example, the device under test can be oriented so that the surface of the device under test with the antenna faces away from the socket of the device under test.

[0004] However, the shape of the device under test may not be planar. For example, the device under test may have an angled shape, such as an L-shape. In addition, the angled device may be configured to transmit and / or receive electromagnetic radiation at at least one exterior surface. For example, the angled device under test may have one or more antenna arrays (or other antennas) on one or both exterior surfaces.

[0005] Research has found that testing of angled DUTs that include wireless communication components on one or more external surfaces often requires a high level of effort to place the DUT in a DUT receptacle, and that test results for such DUTs are often degraded by artifacts.

[0006] Therefore, there is a need for a testing arrangement that improves the trade-off between testing efficiency, accuracy and repeatability. Summary of the invention

[0007] Embodiments of the present invention are directed to a test arrangement for performing over-the-air (OTA) testing on an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test), wherein the test arrangement includes a carrier structure (e.g., a printed circuit board (PCB) test fixture or a load board). The test arrangement includes a socket of the device under test, wherein the socket of the device under test is coupled to the carrier structure (e.g., a PCB test fixture or a load board) (e.g., directly coupled, or coupled using an extender component and / or a PCB interposer between the carrier structure and the socket of the device under test). The socket of the device under test is configured to establish electrical contact with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test that is opposite to a second outer surface of the angled device under test) or a connector, wherein the connector is arranged on the inner surface of the angled (e.g., L-shaped) device under test. The socket of the device under test is configured to position an angled device under test so that a first outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees relative to a surface (e.g., a major surface) of a carrier structure (e.g., a printed circuit board (PCB) test fixture or a load board).

[0008] The socket of the device under test allows coupling of an angled device under test to the test arrangement. In addition, the electrical contact allows transmission (unidirectional or bidirectional) of at least one of the following between the test arrangement and the device under test coupled to the socket of the device under test: electrical energy, one or more control signals, a measurement signal, or a plurality of signals.

[0009] At an angle of at least 15 degrees (relative to the surface of the carrier structure), the first outer surface is no longer substantially parallel to the surface of the carrier structure, which means that the surface normal of the first outer surface is tilted (i.e. slanted) relative to the plane of the carrier structure. As a result, the main lobe direction of an antenna or antenna structure arranged on or in the first outer surface (which is typically substantially orthogonal to the first outer surface of the device under test) is typically also tilted relative to the plane of the carrier structure.

[0010] It has been found that this design in turn helps to reduce the adverse effects of the carrier structure on the antenna characteristics (eg, radiation pattern, impedance) of the antenna or antenna structure arranged on or in the first outer surface of the device under test.

[0011] Furthermore, it has been recognized that by having an inclined first outer surface of the device under test, it is generally possible to place a test antenna in a position offset from a position directly above the device under test (i.e., directly above the device under test in a direction perpendicular to the surface of the carrier structure), the test antenna transmitting a signal to be received at an antenna or antenna structure arranged on or in the first outer surface of the device under test, and / or the test antenna receiving a signal transmitted by an antenna or antenna structure arranged on or in the first outer surface of the device under test. Thus, the test antenna can be positioned so as to allow efficient insertion of the device under test in a "straight" direction (e.g., along a path substantially perpendicular to the surface of the carrier structure). This facilitates handling of the device under test because, in some cases, the test antenna does not need to be moved for inserting the device under test into a socket of the device under test and / or removing the device under test from a socket of the device under test.

[0012] Additionally, it has been recognized that an angle of inclination of at least 15 degrees of the first outer surface of the angled (e.g., L-shaped) device under test (which generally corresponds to the same angle of inclination of the first surface of the device under test receptacle that abuts the first inner surface of the device under test) allows (or facilitates) gravity-assisted insertion and / or automatic alignment of the device under test in the receptacle of the device under test. It has been recognized that the angle of inclination of the surface of the receptacle of the device under test (which corresponds to the inclination of the first outer surface of the device under test) allows the device under test to smoothly, gravity-assisted "slide" into the receptacle of the device under test.

[0013] In summary, the first outer surface is at least partially angled away from the carrier structure (e.g. tilted relative to the surface of the carrier structure). Since the device under test is angled, the second outer surface arranged beyond the angle is also at least partially angled away from the carrier structure (e.g. tilted relative to the surface of the carrier structure). Therefore, the electromagnetic field received and / or emitted by any outer surface (or more precisely, by an antenna or antenna structure arranged on or in the respective outer surface) is also at least partially angled away from the carrier structure (e.g. the respective main lobe is tilted relative to the surface of the carrier structure). Therefore, interference caused by the carrier structure is reduced.

[0014] According to an embodiment, the socket of the device under test is configured to position the angled device under test so that the second outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees relative to a surface (e.g., a main surface) of a carrier structure (e.g., a PCB test fixture or a carrier board).

[0015] Since the device under test is angled, and the first outer surface and the second outer surface are both inclined at least 15 degrees relative to the surface of the carrier structure, the angled device under test is arranged within a limited angular range, wherein the first outer surface and the second outer surface are both away from the carrier structure. Typically, the main lobe of the antenna or antenna structure arranged on or in the outer surface of the device under test is also inclined relative to the surface of the carrier structure, thereby achieving low interference and allowing the corresponding test antenna to be advantageously placed for wirelessly testing the device under test. In addition, this orientation allows for an increased probability of automatic alignment of the device under test when the device under test is placed into the socket of the device under test. With this design of the test arrangement, the first outer surface and the second outer surface are angled, so that the path of transmission and / or reception (e.g., the corresponding main lobe direction of the antenna or antenna structure arranged on or in the outer surface of the device under test) may not be arranged perpendicular to the surface of the carrier structure. Therefore, structures related to the transmission path (e.g., antennas, antenna structures, mirrors or shielding devices) may not necessarily be placed above the device under test (or directly above the device under test), facilitating the installation (insertion) and removal (removal) of the device under test.

[0016] According to an embodiment, the test socket comprises (at least) two supporting surfaces to support two inner surfaces of the angled device under test, wherein both supporting surfaces are inclined at least 15 degrees relative to a surface (e.g. a main surface) of a carrier structure (e.g. a PCB test fixture or a carrier board).

[0017] It is recognized that an angled device under test may have two inner surfaces that are generally parallel (or nearly parallel) to the two outer surfaces. Thus, abutment of the inner surfaces of the angled device under test with the two support surfaces results in an inclination of the outer surfaces that is at least similar to the inclination of the support surfaces. Thus, the support surfaces may achieve an orientation of the first outer surface and the second outer surface that may be beneficial as described above (e.g., at least partially away from carrier structures that may cause interference).

[0018] According to an embodiment, the test arrangement comprises a support structure arranged on a surface of a carrier structure and comprising a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure is located). The support structure can be configured to carry (e.g., directly, or through one or more layers located in between) a socket of a device under test. The cross-section can have the shape of a right triangle (i.e., having a 90 degree angle), wherein the right angle can be arranged at an inner edge of the device under test.

[0019] The triangular cross section forms (at least) two support surfaces which can abut against the inner surface of the angled surface of the device under test. Thus, the triangular cross section can define the orientation of the outer surface of the device under test. In addition, the use of a support structure with a triangular cross section allows the use of a simple (or traditional) socket of the device under test. This allows a more cost-effective implementation. In particular, the size of the socket of the device under test itself can be kept reasonably small, since the tilting is achieved by the support structure.

[0020] According to an embodiment, the test arrangement comprises a flexible or film or elastic planar conductive structure (e.g. a flexible or elastic printed circuit board), which can be arranged to establish a connection between a surface of a carrier structure and a surface of a socket of a device under test which is inclined relative to the surface of the carrier structure.

[0021] A flexible or film or elastic planar conductive structure can establish an electrical connection between a carrier structure and a socket of a device under test while being able to adapt to the shape of the surface of the socket of the device under test. The planar structure reduces the changes to the surface structure of the socket of the device under test. For example, a flexible or film or elastic planar conductive structure allows the electrical connection to be adapted to the inclination of the socket of the device under test or the inclination of the supporting structure. For example, a flexible or film or elastic planar conductive structure can conform to the surface of the carrier structure and can, for example, include a bend at the transition from the surface of the supporting structure to the surface of the supporting structure. The use of such a flexible or film or elastic planar conductive structure can reduce the complexity of implementation while providing a reliable electrical connection.

[0022] According to an embodiment, the flexible or thin film or elastic planar conductive structure is electrically coupled to the surface of the carrier structure and comprises at least one bend to align with the lower surface of the socket of the device under test.

[0023] The bend allows the flexible or film-like or elastic planar conductive structure to adapt to the transition in surface angle between the carrier structure and the socket of the device under test.

[0024] According to an embodiment, the flexible or thin film or elastic planar conductive structure (at least partially) extends on the surface of the support structure. The support structure can be arranged on the surface of the carrier structure and can include a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure is located). The support structure can be arranged to carry (e.g., directly, or through one or more intermediate layers) a socket of a device under test. The flexible or thin film or elastic planar conductive structure can be partially arranged between the support structure and the socket of the device under test.

[0025] The flexible or film or elastic planar conductive structure may adapt to the shape of the triangular cross-section and may be able to achieve electrical contact between the support structure and the socket of the device under test (and optionally, with the device under test when the device under test is coupled to the socket of the device under test). The flexible or film or elastic planar conductive structure may (at least partially) adapt to the shape (or surface orientation) of the support structure, which may, for example, define the orientation of the device under test when supporting the socket of the device under test.

[0026] According to an embodiment, the socket of the device under test includes one or more coaxial spring probes (for example, one or more coaxial spring probes extend from a lower surface of the socket of the device under test to an upper surface of the socket of the device under test, the lower surface contacts a PCB test fixture or a carrier board or a support structure or a flexible or film or elastic plane conductive structure, and the upper surface contacts a second inner surface of the angled device under test) to establish an electrical connection with the angled device under test (wherein, for example, a first end of the coaxial spring probe can contact a pad on the PCB test fixture or on the carrier board or on the support structure or on the flexible or film or elastic plane conductive structure, and wherein, for example, a second end of the coaxial spring probe can contact a pad on the angled device under test or with a connector of the angled device under test).

[0027] Spring probes are typically compressible, allowing the socket of the device under test to establish electrical contact with the device under test when the device under test is coupled to the socket of the device under test (e.g., when the device under test is pushed into the socket of the device under test by an operator / push member). Coaxial springs can achieve high-frequency connection to the socket of the device under test.

[0028] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g., a single aperture antenna, such as a dual-polarized or circularly polarized antenna), which is configured to receive signals radiated by a first outer surface of an angled device under test and / or to transmit signals to be received at the first outer surface of the angled device.

[0029] The first antenna or antenna structure allows for air testing of a device under test comprising one or more antennas or antenna structures on at least one outer surface. For example, the reception and / or transmission characteristics of one or more antennas or antenna structures on the first outer surface or the second outer surface of the device under test can be evaluated. However, one or more other characteristics of the device under test can also be determined alternatively or additionally. Due to the orientation of the first outer surface of the device under test (e.g., the tilt or tilt angle or tilted orientation relative to the surface of the carrier structure) and / or the orientation of the second outer surface of the device under test (e.g., the tilt or tilt angle or tilted orientation relative to the surface of the carrier structure), interference with the carrier structure is reduced during (air) testing. In addition, such an orientation may allow the first antenna or antenna structure to not need to be arranged directly above the device under test, which may facilitate the insertion and / or removal of the device under test.

[0030] According to an embodiment, the test arrangement includes a first antenna or antenna structure (e.g. a single-aperture antenna, such as a dual-polarized or circularly polarized antenna), wherein an aperture of the first antenna or antenna structure is arranged to maintain a certain distance from a first outer surface of the angled device under test (e.g. having a pusher made of a low dielectric constant material or an electromagnetically transparent material between the first antenna or antenna structure and the first outer surface), such that (at least when the second antenna or antenna structure is placed in an operating position) a surface normal of the first outer surface of the angled device under test extends through the aperture of the first antenna or antenna structure.

[0031] By arranging the surface normal of the first outer surface to pass through the aperture of the first antenna or antenna structure (e.g. by appropriately aligning the first surface of the socket of the device under test abutting the first inner surface of the device under test), the reception and / or transmission of the first antenna or antenna structure can be improved (or in other words, good electromagnetic coupling between the antenna or antenna structure on the first outer surface of the device under test and the first antenna can be achieved). The spacing can facilitate the insertion and / or removal of angled devices under test. The pusher can optionally improve the fixation of the device under test in the socket of the device under test and also help to establish repeatable spacing.

[0032] According to an embodiment, the antenna aperture of the first antenna or the antenna structure is tilted relative to the carrier structure, eg relative to a surface or a main surface of the carrier structure.

[0033] This tilt can improve the wireless (electromagnetic) coupling between the antenna aperture and the antenna or antenna structure arranged on or in the first outer surface (which is also tilted). In addition, the tilt of the antenna aperture can allow the first antenna or antenna structure to be spaced laterally offset (e.g., parallel to the surface of the carrier structure) from the area directly above the center of the socket of the device under test, which can facilitate the insertion and / or removal of the device under test (e.g., even without moving the first antenna or antenna structure).

[0034] According to an embodiment, the antenna aperture of the first antenna or antenna structure is parallel to the first outer surface of the angled device under test.

[0035] The parallel arrangement of the antenna aperture and the first outer surface may improve the transmission between the antenna aperture and an antenna or antenna structure arranged on or in the first outer surface.

[0036] According to an embodiment, the first antenna or antenna structure is mounted to have a fixed position relative to the socket of the device under test.

[0037] This fixed position allows repeated coupling and testing of multiple angled devices under test, so that multiple angled devices under test have the same or similar geometric relationship with the first antenna or antenna structure. Therefore, the accuracy and repeatability of the test can be improved. In addition, by using a fixed position of the first antenna or antenna structure relative to the socket of the device under test, the complexity of the structure can be kept low. Moreover, by the fixed position of the first antenna or antenna structure, high-speed testing can be achieved.

[0038] According to an embodiment, the first antenna or antenna structure is mechanically coupled (e.g., attached) to an arm of an operator (the arm of the operator is configured to insert an angled device under test into a socket of the device under test, and / or for pushing the device under test into the socket of the device under test) such that the first antenna or antenna structure is movable.

[0039] A removable first antenna or antenna structure may allow easy access (e.g. for insertion and / or removal) to a socket of the device under test. Furthermore, a removable first antenna or antenna structure may allow adjustment of the position and / or orientation of the first antenna or antenna structure relative to the inclined first outer surface (e.g. when using sockets with different tilt angles, or in order to test the test angle dependency of transmission and / or reception of the device under test). Moreover, by making the first antenna or antenna structure removable, the first antenna or antenna structure may be mechanically coupled to a pusher that pushes the device under test into the test socket. Thus, the pusher (which may be located between the aperture of the first antenna or antenna structure and the device under test) may precisely adjust the positional relationship between the first outer surface of the device under test and the first antenna or antenna structure.

[0040] According to an embodiment, when the operator places the first antenna or antenna structure in an operating position (or equivalently, when the operator inserts the angled device under test into the socket of the device under test, or when the operator pushes the device under test into the socket of the device under test), the first antenna or antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection (for example, via a blind-mate (hollow) waveguide connection).

[0041] The signal source enables the first antenna or antenna structure to transmit a signal (e.g., received by the antenna array of the angled device under test) and / or the signal receiver allows evaluation of a signal received by the first antenna or antenna structure (e.g., transmitted by the antenna array of the angled device under test). Thus, use of the signal source and / or signal receiver facilitates testing of the angled device under test. The blind-mate microwave connection facilitates (e.g., manual and / or automatic) coupling of the signal source to the first antenna or antenna structure and coupling of the signal receiver to the first antenna or antenna structure. The blind-mate microwave connection may also allow at least partial removal of the first antenna or antenna structure, which may improve accessibility to a socket of the device under test.

[0042] According to an embodiment, the test arrangement includes a second antenna or antenna structure (e.g., a single-hole antenna, (such as a dual linearly polarized or circularly polarized antenna)), which is configured to (at least when the second antenna or antenna structure is placed in an operating position) (or equivalently, when an operator inserts the angled device under test into a test socket, or when an operator pushes the angled device under test into the test socket) receive signals radiated by an antenna or antenna structure arranged on or in a second outer surface of the angled device under test and / or transmit signals to be received by an antenna or antenna structure arranged on or in a second outer surface of the angled device under test.

[0043] The second antenna or antenna structure allows testing of the antenna structure on or in the second exterior surface and / or allows wireless testing of one or more other components of the device under test.The second antenna or antenna structure benefits from orientation of the second exterior surface defined by the receptacle of the device under test.

[0044] The first antenna or antenna structure and the second antenna or antenna structure can test signals transmitted and / or received by the antennas or antenna structures arranged on the first outer surface and the second outer surface (e.g., simultaneously or sequentially) without having to recouple (or rearrange) the angled device under test in a different orientation (e.g., or a different socket of the device under test).

[0045] For example, the first antenna or antenna structure and the second antenna or antenna structure may be arranged such that the first antenna or antenna structure and the second antenna or antenna structure do not block insertion and / or removal of the device under test into and / or from the receptacle of the device under test.

[0046] According to an embodiment, the test arrangement comprises a second antenna or antenna structure (e.g. a single aperture antenna (e.g. dual linear polarization or circular polarization)), wherein the aperture of the second antenna or antenna structure is arranged at a distance from a second outer surface of the angled device under test (e.g. with a pusher made of a low dielectric constant material or an electromagnetically transparent material between the second antenna or antenna structure and the second outer surface), so that (at least when the second antenna or antenna structure is placed in an operating position) (or equivalently, when an operator inserts the angled device under test into a test socket, or when an operator pushes the device under test into the test socket) a surface normal of the second outer surface of the angled device under test (or equivalently, a surface normal of a second surface of the socket of the device under test abutting against a first inner surface of the device under test) extends through the aperture of the second antenna or antenna structure. The second (and / or first) outer surface may have a main lobe or be configured to transmit and / or receive (e.g., by beamforming) a main lobe in a direction perpendicular to the second (and / or first) outer surface.

[0047] In other words, one or more antennas or antenna structures may be arranged on or in a first outer surface of the device under test and / or on or in a second outer surface of the device under test, and one or more of these antennas or antenna structures may have a main lobe direction substantially perpendicular to the corresponding outer surface.

[0048] By arranging the surface normal of the second outer surface to pass through the aperture of the second antenna or antenna structure, a good reception of the signal emitted by the antenna or antenna structure arranged on or in the second outer surface on the side of the second antenna or antenna structure can be achieved. Alternatively or additionally, a good reception of the signal emitted by the second antenna or antenna structure on the side of the antenna or antenna structure arranged on or in the second surface can also be achieved in this way.

[0049] According to an embodiment, the aperture of the second antenna or antenna structure is tilted relative to the carrier structure (eg relative to a surface or a main surface of the carrier structure).

[0050] This tilting may improve electromagnetic coupling between the antenna aperture of the second antenna or antenna structure and an antenna or antenna structure arranged on or in the second outer surface (which is also tilted). In addition, the tilting of the antenna aperture of the second antenna or antenna structure may allow the second antenna or antenna structure to be spaced laterally offset (e.g., in a direction parallel to the surface of the carrier structure) relative to the socket of the device under test, which may facilitate insertion and / or removal of the device under test.

[0051] According to an embodiment, the antenna aperture of the second antenna or antenna structure is parallel to the second outer surface of the angled DUT (or, equivalently, parallel to the second surface of the DUT socket abutting the second inner surface of the DUT).

[0052] The parallel arrangement of the aperture of the second antenna or antenna structure and the second outer surface may improve the electromagnetic coupling between the antenna aperture and the second outer surface.

[0053] According to an embodiment, the second antenna or antenna structure is mounted to have a fixed position relative to the socket of the device under test.

[0054] This fixed position allows repeated coupling and testing of multiple angled DUTs, so that multiple angled DUTs have the same or similar geometric relationship with the second antenna or antenna structure. Therefore, the accuracy and repeatability of the test can be improved.

[0055] According to an embodiment, the second antenna or antenna structure is mechanically coupled (e.g., attached) to an arm of a manipulator (the arm of the manipulator is configured to insert the angled device under test into a receptacle of the device under test) such that the second antenna or antenna structure is movable.

[0056] The movable second antenna or antenna structure may allow for easier access to the socket of the device under test (e.g., for insertion and / or removal of the device under test). In addition, the movable second antenna or antenna structure may allow for adjustment of the position and / or orientation of the second antenna or antenna structure relative to the tilted second outer surface (e.g., when using sockets with different tilt angles, or in order to test the test angle dependency of transmission and / or reception of the device under test).

[0057] According to an embodiment, the first antenna or antenna structure and / or the second antenna or antenna structure is part of a pusher for pushing the angled device under test into the socket of the device under test. Alternatively, the first antenna or antenna structure and / or the second antenna or antenna structure can be configured to be movable together with a pusher for pushing the angled device under test into the socket of the device under test (wherein, for example, the pusher is arranged so that when the device under test is inserted into the socket of the device under test, the pusher or a portion of the pusher is located between the first antenna or antenna structure and the first outer surface of the angled device under test) (wherein, for example, the pusher is arranged so that when the device under test is inserted into the socket of the device under test, the pusher or a portion of the pusher is located between the second antenna or antenna structure and the second outer surface of the angled device under test).

[0058] Thus, for example, the first antenna or antenna structure and / or the second antenna or antenna structure are movable together with the pusher so that they can be moved (e.g., for easier coupling of an angled device under test to a socket of the device under test) or readjusted (e.g., their orientation). For example, if the pusher is configured to push the angled device under test into the socket of the device under test, the pusher can facilitate coupling and positioning of the second antenna or antenna structure during coupling of the angled device under test to the socket of the device under test. In the case where the first antenna or antenna structure and / or the second antenna or antenna structure are movable together with the pusher, the position of these components and therefore the test is repeatable because the positional relationship between the first antenna or antenna structure and / or the second antenna or antenna structure and the device under test can be well defined by the spacer (e.g., if the spacer directly abuts the outer surface of the device under test and the antenna apertures of the first antenna or antenna structure and the second antenna or antenna structure).

[0059] In accordance with an embodiment, the second antenna or antenna structure is configured to connect to a signal source and / or signal receiver via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection) when an operator places the second antenna or antenna structure in an operating position (or equivalently, when the operator inserts an angled device under test into a test socket, or when the operator pushes the device under test into the test socket).

[0060] The signal source enables a second antenna or antenna structure to transmit a signal (e.g., to be received by an antenna array of an angled device under test), and / or the signal receiver allows evaluation of a signal received by the second antenna or antenna structure (e.g., transmitted by an antenna array of an angled device under test). The use of both the signal source and the signal receiver thus facilitates testing of an angled device under test. The blind-mate microwave connection facilitates coupling (e.g., manually and / or automatically) between the signal source and the first antenna or antenna structure and / or coupling between the signal receiver and the second wire or antenna structure. The blind-mate microwave connection may also allow removal of portions of the second wire or antenna structure, which may improve accessibility to a socket of the device under test.

[0061] According to an embodiment, the test arrangement comprises a pusher for pushing the angled device under test into the test socket. The pusher may be configured such that when the pusher is in the pushing position, a first pushing surface is parallel to a first outer surface of the angled device under test, and when the pusher is in the pushing position, a second pushing surface is parallel to a second outer surface of the angled device under test.

[0062] Therefore, (for example, when the pusher is pressed against the carrier structure) the first push surface and the second push surface can abut (and push) the first outer surface and the second outer surface at the same time. Therefore, the pusher can apply a relatively uniformly distributed force to the device under test. In addition, the first push surface and the second push surface can fix the position and orientation of the device under test in a reliable manner.

[0063] According to an embodiment, the test arrangement includes a pushing member for pushing an angled device under test into a test socket, wherein the pushing member is configured such that when the pushing member is in a pushing position (for pushing the angled device under test into the socket of the device under test), a first pushing surface of the pushing member is inclined relative to a carrier structure (e.g., relative to a surface or a main surface of the carrier structure), and wherein the pushing member is configured such that when the pushing member is in a pushing position, a second pushing surface of the pushing member is inclined relative to the carrier structure (e.g., relative to a surface or a main surface of the carrier structure).

[0064] When the device under test is moved into the socket of the device under test, or when the device under test is located in the socket of the device under test, when the pusher abuts one or more inclined surfaces of the device under test, the inclined angles of the first push surface and the second push surface improve the alignment of the device under test.

[0065] According to an embodiment, the socket of the device under test includes an angled recess or an angled notch, which is configured to support and / or align the angled device under test. The angled recess may have a boundary, which surrounds at least a portion of the angled recess or the angled notch.

[0066] The angled recess or angled notch can improve the alignment of the device under test in the socket of the device under test. The alignment can be at least partially guided by the border of the angled recess. For example, the border can be configured to support a pusher (e.g., to reduce excessive force on the device under test). For example, the angled recess can be configured to support self-alignment of the device under test, such as by having a slightly inclined side surface.

[0067] According to an embodiment, the socket of the device under test is arranged so that the second inner surface of the angled device under test opposite to the second outer surface of the angled device under test (and / or the first inner surface of the angled device under test, the first inner surface opposite to the second outer surface of the angled device under test or opposite to the first outer surface of the device under test) is spaced from the carrier structure (e.g., a carrier board) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths at the lowest operating frequency of the angled device under test (e.g., at the lowest operating frequency of a packaged antenna module (AiP) included in or constituting the device under test), or at least 3 times the wavelength, or at least 4 times the wavelength (e.g. the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) (and such that, preferably, the edge of the first outer surface is spaced at least 10 mm, or at least 20 mm from the carrier, or at least 2 wavelengths, at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of the angled device under test, such as the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure).

[0068] It has been recognised that spacing between the inner surfaces of the device under test further reduces disturbances caused by the carrier structure in electromagnetic radiation emitted or received at the device under test.

[0069] According to an embodiment, the maximum socket height of the socket of the device under test (e.g., the height at which the inner edge of the angled device under test is located when the angled device under test is placed in the socket of the device under test) is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., the free space wavelength, or the wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test (e.g., the lowest operating frequency of a packaged antenna module (AiP) included in or constituting the device under test).

[0070] It has been recognized that the geometry of the socket of such a device under test, which geometry results in a distance between the device under test and the carrier structure, which results in sufficiently low interference with respect to electromagnetic radiation emitted or received at the device under test caused by the carrier structure.

[0071] According to an embodiment, the first antenna or antenna structure and the second antenna or antenna structure are arranged so that the angled device under test can be inserted into the socket of the device under test in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure without moving the first antenna and the second antenna. Alternatively or additionally, the first antenna or antenna structure and the second antenna or antenna structure can be arranged so that the angled device under test can be removed from the socket of the device under test in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure without moving the first antenna and the second antenna.

[0072] Inserting and / or removing the device under test without moving the first antenna structure and the second antenna structure improves the test efficiency and reliability for testing one or more devices under test. The implementation of this arrangement can be facilitated by at least the first outer surface of the device under test being tilted. Therefore, at least the first antenna or antenna structure can be laterally offset due to the tilted path (between the first antenna or antenna structure and the first outer surface of the device under test) for the transmission of electromagnetic signals.

[0073] According to an embodiment, the spacing between the first antenna or antenna structure and the second antenna or antenna structure is selected so that the angled device under test can be moved linearly (e.g., along a straight line) through this spacing, with the movement direction being perpendicular to the surface (e.g., main surface) of the carrier structure. Therefore, the insertion and removal of the device under test can be done very efficiently and quickly.

[0074] According to an embodiment, a test arrangement for performing over-the-air (OTA) testing of an angled (e.g., L-shaped) device under test (e.g., an L-shaped packaged antenna device under test) is provided. The test arrangement includes a carrier structure (e.g., a PCB test fixture or a load board) and a socket of the device under test coupled (e.g., directly coupled or coupled using an extender component and / or a PCB interposer between the carrier structure and the socket of the device under test) to the carrier structure (e.g., a PCB test fixture or a load board). The socket of the device under test is configured to establish electrical contact with an inner surface of the angled (e.g., L-shaped) device under test (e.g., an inner surface of the angled device under test opposite to a second outer surface of the angled device under test) or a connector arranged on the inner surface of the angled (e.g., L-shaped) device under test. The socket of the device under test is configured to position the angled device under test so that the first outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees relative to a surface (e.g., a main surface) relative to the carrier structure (e.g., a printed circuit board (PCB) test fixture or a load board). The socket of the device under test is configured to position the angled device under test so that the second outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees relative to a surface (e.g., a major surface) of a carrier structure (e.g., a PCB test fixture or a load board). This test arrangement includes similar advantages of the test arrangement discussed above. The test arrangement may be optionally supplemented by any of the features, functions, and details described herein, either alone or in combination. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The accompanying drawings are not necessarily drawn to scale, and emphasis is generally placed on illustrating the principles of the invention. In the following description, various embodiments of the invention will be described in conjunction with the following drawings, in which:

[0076] Figure 1 A schematic cross-sectional view showing an example of a test arrangement for over-the-air (OTA) testing of an angled device under test;

[0077] Figure 2A A schematic cross-sectional view of a first example of an angled device under test is shown;

[0078] Figure 2B A schematic cross-sectional view of a second example of an angled device under test is shown;

[0079] Figure 3 shows a perspective view of an angled device under test;

[0080] Figure 4 Shows Figure 3 Simulation results of far fields emitted by antenna elements of an antenna array on a first outer surface of the device under test depicted in;

[0081] Figure 5shows a perspective view of an angled device under test;

[0082] Figure 6 Shows Figure 5 Simulation results of far fields emitted by antenna elements of an antenna array on a first outer surface of the device under test depicted in;

[0083] Fig. 7A A perspective view showing an example of a device under test;

[0084] Figure 7B Shows Fig. 7A Different perspective views of the device under test depicted in;

[0085] Figure 8 A schematic cross-sectional view showing an example of a test arrangement for over-the-air (OTA) testing of an angled device under test;

[0086] Fig. 9 A perspective view showing an example of a socket of a device under test. DETAILED DESCRIPTION

[0087] In the following description, the same or equivalent elements or elements having the same or equivalent functions will be denoted by the same or equivalent reference numerals even if they appear in different drawings.

[0088] In the following description, a large amount of details are provided to more fully explain the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other cases, in order not to obscure the embodiments of the present invention, known structures and devices are shown in block diagram form rather than in detailed form. In addition, unless otherwise specified, the features of the different embodiments described herein can be selectively combined with each other.

[0089] Figure 1 A cross-sectional schematic diagram of an example of a test arrangement 100 for over-the-air (OTA) testing of an angled device under test 140 is shown.

[0090] The test arrangement 100 includes a carrier structure 110 and a socket 130 of a device under test coupled to the carrier structure 110. The socket 130 of the device under test is configured to be connected to an inner surface 142 of an angled device under test 140 or to a connector ( Figure 1 The socket 130 of the device under test is configured to position the angled device under test 140 such that the first outer surface of the angled device under test is inclined at a first angle 120 of at least 15 degrees relative to the surface 112 of the carrier structure 10 .

[0091] The carrier structure 110 may be (or include) a printed circuit board (PCB) test fixture or a load board. The carrier structure 110 may, for example, include an area having a flat surface. The socket 130 of the device under test may be arranged on top of the carrier structure 110 (e.g., on a flat surface), or may be coupled to the carrier structure 110 via one or more intermediate devices.

[0092] Figure 1 The test arrangement 100 shown in FIG. 1 can be used, for example, to test the angled device under test 140 by itself (e.g., without an antenna structure that detects electromagnetic radiation emitted by the angled device under test), or to test the angled device under test 140 in combination with one or more additional antennas. For example, the test arrangement 100 can be used to test power consumption of the device under test 140 or interference between antennas of the device under test 140. Alternatively, the test arrangement 100 can be configured to test one or more antenna structures of the device under test wirelessly.

[0093] Since the socket 130 of the device under test is configured to contact the inner surface 142 of the device under test, the outer surface of the device under test 140 is completely (or at least mostly) away from the socket 130 and the carrier 110 of the device under test. Therefore, the impact of the socket 130 and / or the carrier structure 110 of the device under test on the radiation emitted (and / or received) by the outer surface of the device under test 140 (and the testing thereof) is reduced. In addition, the first angle 120 of at least 15 degrees allows the first outer surface 144a and the second outer surface 144b to face away from the carrier structure 110. Therefore, the first outer surface 144a and the second outer surface 144b have improved accessibility from the top, such as for installation, attachment, and transmission and / or reception. When a force (e.g., gravity) perpendicular to the surface of the carrier structure 110 is applied to the device under test 140, the angle of inclination helps to align with the surface of the socket 130 of the device under test.

[0094] The angled device under test 140 may be (or include) an antenna in package (AiP) device. The angled device under test 140 may have an L-shape (eg, Figure 1), for example, the device under test can be a device having a first board 141a connected to a second board 141b, wherein the angle between the first board 141a and the second board 141b is at least substantially 90 degrees (e.g., within an error range of + / -15 degrees). The angled device under test 140 can include a first outer surface 144a (e.g., of the first board 141a) and a second outer surface 144b (e.g., of the second board 141b), wherein, for example, the angle between the first outer surface 144a and the second outer surface 144b is at least substantially 270 degrees (e.g., within an error range of + / -15 degrees). The inner surface 142 of the angled device under test 140 may include a first inner surface 142a (e.g., of the first plate 141a) and a second inner surface 142b (e.g., of the second plate 141b), wherein the angle between the first inner surface 142a and the second inner surface 142b is at least substantially 90 degrees (e.g., within a tolerance range of + / - 15 degrees). The first inner surface 142a and the first outer surface 144a may be arranged parallel to each other. The second inner surface 142b and the second outer surface 144b may be arranged parallel to each other.

[0095] Figure 2A A schematic cross-sectional view of a first example angled device under test 240 is shown, which may be an alternative to angled device under test 140 .

[0096] The device under test 240 includes a first plate 241a and a second plate 241b, the angle between which is 90 degrees (e.g., within a tolerance range of + / -15 degrees). The first plate 241a includes a first outer surface 244a and a first inner surface 242a, and the second plate 241b includes a second outer surface 244b and a second inner surface 242b.

[0097] exist Figure 2A In the example shown, the first outer surface 244a includes a first antenna array 246a, and the first antenna array 246a has four antenna elements. However, the first outer surface 244a may also (additionally or alternatively) include any other form of antenna (e.g., a single antenna and / or a circularly polarized antenna) and any number of antenna elements or antenna arrays. Alternatively, the second outer surface 244b may include the first antenna array 246a. The first antenna array 246a can be configured to receive and / or transmit electromagnetic radiation.

[0098] The device under test 240 may also include a connector 248, such as an array connector. Figure 2AIn the example shown, the (array) connector 248 is arranged on the second inner surface 242b. Alternatively, the (array) connector 248 can be arranged on the first inner surface 242a or (for example, in the case of multiple (array) connectors 248) on the first inner surface 242a and the second inner surface 242b. The (array) connector 248 is electrically connected to at least one antenna element (of all antenna elements) of the first antenna array 246a. Therefore, an electrical signal applied to the (array) connector 248 can cause the first antenna array 246a to emit electromagnetic radiation. Alternatively or additionally, the electromagnetic radiation received by the first antenna array 246a can generate an electrical signal at the (array) connector 248. The (array) connector 248 can be or include one or more solder balls. The (array) connector 248 can be configured to connect the device under test 140 (for example, a packaged antenna module) to a system (for example, a mobile phone or a socket 130 of the device under test) and can transmit signals such as power signals, digital signals, radio frequency (RF) signals or intermediate frequency (IF) signals.

[0099] The first antenna array 246a may be directly electrically connected to the (array) connector 248, or may be indirectly coupled to the (array) connector 248 using other electrical components therebetween. For example, these other electrical components may include at least one amplifier, filter, switch, resistor, capacitor, and integrated circuit. Figure 2A In the example shown, other electrical components include antenna circuit 249 (e.g., a silicon chip). Antenna circuit 249 can be configured to convert an intermediate frequency (IF) signal to a millimeter wave signal (e.g., a 5G frequency band, such as in the range of 24 GHz to 53 GHz) and / or vice versa. Alternatively or additionally, antenna circuit 249 can also be configured to (at least partially) control the beamforming of the first antenna array 246a.

[0100] Figure 2B FIG. 2 is a schematic cross-sectional view of a second example angled device under test 240a, which can replace the angled device under test 140. The second example angled device under test 240a is essentially the same as Figure 2A 244b, and thus like elements will be designated with like reference numerals, but further includes a second antenna array 246b on a second outer surface 244b. The second antenna array 246b may have similar (or identical) characteristics to the first antenna array 246a. The second antenna array 246b may also be electrically connected to at least one (array) connector 248 and an antenna circuit 249. Alternatively, the second antenna array 246b may be electrically connected to a separate (array) connector and / or a separate antenna circuit.

[0101] The device under test receptacle 130 may be configured to position the angled device under test 140 (e.g., angled device under test 240 or angled device under test 240a) such that a first outer surface 144a of the angled device under test 140 (e.g., first outer surface 244a) is spaced apart from or away from the surface 112 of the carrier structure 110. The device under test receptacle 130 may be configured to position the angled device under test 140 such that a surface normal 143a of the first outer surface 144a of the angled device under test 140 is tilted at an angle of at least 15 degrees relative to a surface normal of the surface 112 of the carrier structure 110. The device under test receptacle 130 may be configured to position the angled device under test 140 such that a surface normal 143b of a second outer surface 144b of the angled device under test 140 is tilted at an angle of at least 15 degrees relative to a surface normal of the surface 112 of the carrier structure 110.

[0102] The socket 130 of the device under test can be arranged so that, preferably, the edge of the first outer surface 144a and / or the second outer surface 144b is spaced from the carrier structure 110 by at least 10 mm or at least 20 mm or by the lowest operating frequency of the angled device under test, for example, at least 2 wavelengths, at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of an antenna in package (AiP) module constituting the device under test or included in the device under test, for example, a free space wavelength, or a wavelength in the medium between the first outer surface 844a and / or the second outer surface 844b of the angled device under test 840 and the carrier structure. The angled device under test 140 can operate within a frequency band of the 5G standard, for example, a bandwidth in the range of 24 GHz to 53 GHz (e.g., 5G Band 2). In this case, the lowest operating frequency can be 24 GHz with a wavelength of 12.5 mm. The space between the edge of the first outer surface 144a and / or the second outer surface 144b and the surface 112 of the carrier structure 110 may be 25 mm or greater (ie, twice 12.5 mm).

[0103] Figure 3 A perspective view of an angled device under test 340 is shown, which may be an alternative to angled device under test 140 .

[0104] The device under test 340 includes a first outer surface 344a having a first antenna array and a second outer surface 344b having a second antenna array, the first antenna array having four antenna elements and the second antenna array having four antenna elements. At least one antenna element may include at least one parasitic patch. Figure 3In the example shown, each antenna element comprises four parasitic patches. The first outer surface 344a comprises two central antenna elements 345a and 345b. There are no metallized surfaces in the vicinity of the device under test 340, which may replace the angled device under test 140.

[0105] Figure 4 Shows Figure 3 Depicted are simulation results of the far field emitted by an antenna element (e.g., one of the central antenna elements 345a, 345b) of the first outer surface 344a of the device under test 340. The far field shows significant lobes that are oriented perpendicular to the two central antenna elements 345a and 345b of the first outer surface 344a (however, when the device under test 340 is used in a system, such as in a system that provides a metallized backplane, the reverse radiation can be reduced or suppressed).

[0106] Figure 5 A perspective view of an angled device under test 540 is shown, which can replace the angled device under test 140. The device under test 540 includes a first outer surface 544a with a first antenna array having four antenna elements and a second outer surface 544b with a second antenna array having four antenna elements. The first outer surface 544a includes two central antenna elements 545a and 545b. There is a metal (e.g., copper) surface 550 at a distance of 2 mm from the first outer surface 544a.

[0107] Figure 6 Shows Figure 5 Simulation results of the far field emitted by the antenna elements (e.g., one of the central antenna elements 545a or 545b) of the first antenna array of the first outer surface 544a of the device under test 530 depicted in FIG (preferably considering the metal surface 551). Figure 4 Compared to the results depicted in , the far field shows less significant radiation from the antenna elements of the first antenna array oriented perpendicular to the first outer surface 544a. Instead, the intensity of the far field is more evenly distributed around the device under test 540, with separate main lobes in two directions that are different from the direction of the surface normal on the first outer surface 544a. The results indicate that nearby metallized surfaces can affect the far field emitted by the device under test 540, thereby reducing the accuracy and / or repeatability of the test. For example, the metallized surface can reduce the spatial selectivity of the beamforming antenna array, and / or change the direction of the main lobe.

[0108] Therefore, the angle (and optional spacing) between the first outer surface 144a and the surface 112 of the carrier structure 110 as described above can direct the electric field emitted and / or received by the first outer surface 144a (and optional second outer surface 144b) away from the carrier structure 110, thereby improving the accuracy and / or repeatability of the test.

[0109] Fig. 7A 1 shows a perspective view of an example of a device under test 740 that can replace the angled device under test 140. The device under test 740 includes a first inner surface 742a and a second inner surface 742b. Fig. 7A In the example shown, the device under test includes a first plate 741a and a second plate 741b, the first plate 741a having a first inner surface 742a, and the second plate 741b having a second inner surface 742b. The first plate 741a and the second plate 741b are mechanically (and optionally electrically) connected by a flexible conductive structure (e.g., three flexible printed circuits 747a, b, c). The first plate 741a and the second plate 741b are movable (e.g., bendable) relative to each other (e.g., to facilitate manufacturing assembly in the system). However, in some cases, the movability of the plate can facilitate coupling with the socket of the device under test. Alternatively, the first plate 741a and the second plate 741b can be fixedly arranged relative to each other.

[0110] The device under test 740 comprises a silicon chip 749 (or any other antenna circuit) and an (array) connector 748 on the second inner surface 742b. The silicon chip 749 can be electrically contacted indirectly via the (array) connector 748, or via the electrical contacts of the silicon chip 749 itself ( Fig. 7A The socket of the device under test described herein is configured to establish electrical contact with the inner surface of the device under test 740, for example, with the (array) connector 748 on the second inner surface 742b (for example, by forming a corresponding antenna structure).

[0111] Figure 7B Shows Fig. 7A Another perspective view of the device under test 740 depicted in . The device under test 740 includes a first outer surface 744a (on a first plate 741a) and a second outer surface 744b (on a second plate 741b). The first outer surface 744a and the second outer surface 744b are configured to emit and / or receive electromagnetic radiation (e.g., by forming corresponding antenna structures). To this end, antenna elements (e.g., antenna arrays) can be arranged at least partially on the first surface 744a and / or the second surface 744b, or can be arranged at least partially within the first plate 741a and / or the second plate 741b. In Figure 7BIn the example shown, the first outer surface 744a and the second outer surface 744b are configured to emit and / or receive electromagnetic radiation. Alternatively, only the first outer surface 744a or only the second outer surface 744b may be configured to emit and / or receive electromagnetic radiation.

[0112] like Figure 1 As shown, the second outer surface 144b forms a second angle 122 with the surface 112 of the carrier structure 110. The socket 130 of the device under test can be configured to position the angled device under test 130 so that the second outer surface 144b of the angled device under test 140 is inclined at a second angle 122 of at least 15 degrees relative to the surface 112 of the carrier structure 110.

[0113] For example, the first angle 120 can be (at least substantially) 15 degrees, 22.5 degrees, 30 degrees, 45 degrees, 60 degrees, 67.5 degrees or 75 degrees. Similarly, the second angle 122 can be (at least substantially) 15 degrees, 22.5 degrees, 30 degrees, 45 degrees, 60 degrees, 67.5 degrees or 75 degrees. The first inner surface 142a and the second inner surface 142b can form a right angle. In this case, the first angle 120 and the second angle 122 add up to 90 degrees. For example, the first angle 120 and the second angle 122 can be 15 degrees and 75 degrees, 22.5 degrees and 67.5 degrees, 30 degrees and 60 degrees, or 45 degrees and 45 degrees (i.e., an isosceles right triangle), respectively.

[0114] The socket 130 of the device under test may include (at least) two support surfaces 131a, b to support the two inner surfaces 142a, b of the angled device under test 140. The two support surfaces 131a, b may be arranged at least substantially right angles (i.e., 90 degrees). At least one of the two support surfaces 131a, b may form a recess in the socket 130 of the device under test. Both of the two support surfaces 131a, b may be inclined at least 15 degrees relative to the surface 112 (e.g., the main surface) of the carrier structure 110 (e.g., a PCB test fixture or a load board). For example, the two support surfaces 131a, b may be arranged at least substantially the same angle (e.g., 90 degrees) relative to each other as the two inner surfaces 142a, b. At least one of the two support surfaces 131a, b may be arranged at a first angle 120 and a second angle 122 (e.g., 15 degrees, 22.5 degrees, 30 degrees, 45 degrees, 60 degrees, 67.5 degrees, or 75 degrees, or vice versa), respectively.

[0115] Figure 8 A schematic cross-sectional view of an example of a test arrangement 800 for over-the-air testing of an angled device under test 840 is shown.

[0116] The test arrangement 800 includes a carrier structure 810 (which may be any carrier structure described herein) and a socket 830 of a device under test (which may be any socket of a device under test described herein).

[0117] exist Figure 8 In the example shown, the test arrangement 800 includes a support structure 860, which is arranged on a surface 812 of a carrier structure 810 and has a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure 810 is located). The support structure 860 can be configured to carry the socket 830 of the device under test (e.g., directly or through one or more layers therebetween). The support structure 860 may include an attachment feature configured to attach the support structure 860 to the carrier structure 810. The attachment feature may include at least one of an opening (e.g., for receiving a screw), a screw, a magnet, or a pin. The support structure 860 may be made of or include a dielectric material and / or a metal. The support structure 860 may include (e.g., internally) an electrical connector, for example, for establishing an electrical connection between the socket 830 of the device under test and the carrier structure 810 (and / or any other device).

[0118] like Figure 8 As shown, the test arrangement 800 may include a flexible or thin film or elastic planar conductor structure 862 (e.g., a flexible or elastic printed circuit board), the conductor structure 862 being arranged to establish a connection between a surface 812 of the carrier structure 810 and a surface of a socket 830 of the device under test (e.g., for transmitting an electrical signal to the socket 830 of the device under test), the surface of the socket 830 of the device under test being inclined relative to the surface 812 of the carrier structure 810. Figure 8 In the example shown, the planar conductor structure 862 covers both surfaces of the support structure 860. Alternatively, the planar conductor structure 862 may only cover (at least a portion of) one surface of the support structure 860. Further alternatively, the planar conductor structure 862 may also be arranged between the support structure 860 and the carrier structure 810.

[0119] like Figure 8 As shown, a flexible or thin film or elastic planar conductor structure 862 can be electrically coupled to the surface of the carrier structure 810 and include at least one bend to align with the lower surface of the socket 830 of the device under test. The flexible or thin film or elastic planar conductor structure 862 can extend (at least partially) on the surface of the support structure 860. The support structure 860 can be arranged on the surface 812 of the carrier structure 810 and can have a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure is located). This cross-section can have the shape of an (e.g., right-angled) isosceles triangle.

[0120] The support structure 860 can be configured to carry the socket 830 of the device under test (e.g., directly or through one or more layers therebetween). To this end, the support structure 860 can be attached (directly or indirectly) to the socket 830 of the device under test (e.g., for simpler operation) or detachable from the socket 830 of the device under test (e.g., for a combination of sockets for different devices under test). A flexible or film or elastic planar conductor structure 862 can be partially arranged between the support structure 860 and the socket 830 of the device under test. Other layers (e.g., at least one of a shock absorbing layer and / or a height adjustment layer) can be arranged between the planar conductor structure 862 and one of the socket 830 of the device under test and the support structure 860.

[0121] exist Figure 8 In the example shown, the device under test socket 830 includes one or more coaxial spring probes 832 to establish an electrical connection with the angled device under test 830 .

[0122] The coaxial spring probe 832 can, for example, extend from a lower surface of the socket 830 of the device under test, which can be in contact with a carrier structure 810 (e.g., a PCB test fixture or a load board), or in contact with a support structure 860, or in contact with a flexible or thin film or elastic planar conductor structure 862, to an upper surface of the socket 830 of the device under test, which contacts an inner surface 842 (e.g., a first and / or second inner surface) of an angled device under test 840.

[0123] The first end of the coaxial spring probe 832 can contact a pad on the carrier structure 810 (e.g., on a PCB test fixture or load board) or a pad on the support structure 860 or a pad on a flexible or thin film or elastic planar conductor structure 862. The second end of the coaxial spring probe can contact a pad on the angled device under test 840 or a connector of the angled device under test 840. One or both ends of the coaxial spring probe 832 are retractable. For example, when the device under test 840 is inserted into the socket 830 of the device under test, the first end of the coaxial probe 832 is retractable. Alternatively or additionally, when the socket 830 of the device under test is arranged on the support structure 860 and / or on the flexible or thin film or elastic planar conductor structure 862, the second end of the coaxial probe 832 is retractable.

[0124] The test arrangement 800 may include one or more antenna structures. For example, the test arrangement 800 may include a first antenna or antenna structure 850 (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to receive signals radiated from a first outer surface 844a of the angled device under test 840 and / or is configured to transmit signals to be received at the first outer surface 844a of the angled device under test 840.

[0125] The first antenna or antenna structure 850 may include an aperture, such as fed by a waveguide.

[0126] The aperture of the first antenna or antenna structure 850 can be arranged at a certain distance from the first outer surface 844a of the angled device under test 840, so that (at least when the second antenna or antenna structure is placed in the operating position) the surface normal of the first outer surface of the angled device under test extends through the aperture of the first antenna or antenna structure.

[0127] The distance from the first outer surface 844a can be achieved by using a pusher 854, the pusher 854 includes a low dielectric constant material or an electromagnetic transparent material, and the pusher 854 is arranged between the first antenna or antenna structure 850 and the first outer surface 844a. The pusher 854 can be arranged to push the device under test 840 into the socket 830 of the device under test. To this end, the pusher 854 can include an attachment element, which is configured to attach the pusher 854 (directly or indirectly) to the carrier structure 810.

[0128] The antenna aperture of the first antenna or antenna structure 850 can be tilted relative to the carrier structure 810 (e.g., relative to a surface or main surface 812 of the carrier structure 810). The antenna aperture can be tilted at least substantially at a first angle between the first outer surface 844a and the surface 812 of the carrier structure 810. The antenna aperture of the first antenna or antenna structure 850 can be arranged at least substantially parallel to the first outer surface 844a. Figure 8 In the example shown, the antenna aperture and first outer surface 844a of the first antenna or antenna structure 850 are tilted 45 degrees relative to the surface 812 of the carrier structure 810. Alternatively, the antenna aperture and first outer surface 844a of the first antenna or antenna structure 850 may be tilted at different angles.

[0129] The first antenna or antenna structure 850 may be mounted to have a fixed position relative to the socket 830 of the device under test. To this end, both the first antenna or antenna structure 850 and the socket 830 of the device under test may have a fixed position relative to the carrier structure 810. Alternatively, the first antenna or antenna structure 850 may have an adjustable position relative to the socket 830 of the device under test.

[0130] The first antenna or antenna structure 850 may be mechanically coupled (eg, attached) to an arm of an operator (eg, a pusher 854 ) such that the first antenna or antenna structure 850 is movable.

[0131] The manipulator's arm may be configured to insert the angled device under test 840 into the device under test receptacle 830 and / or to push the device under test 840 into the device under test receptacle 830 .

[0132] When the operator has placed the first antenna or antenna structure 850 in the operating position (or equivalently, when the operator has inserted the angled device under test 840 into the receptacle 830 of the device under test, or when the operator has pushed the device under test 840 into the receptacle 830 of the device under test), the first antenna or antenna structure 850 can be configured to connect to the first signal source and / or signal receiver 856a via a blind-mate microwave connection (e.g., a blind-mate waveguide connection).

[0133] exist Figure 8 In the example shown, the first antenna or antenna structure 850 includes (or is connected to) a first coaxial cable 853a, and the first coaxial cable 853a is connected (or can be connected) to a first signal source and / or a signal receiver 856a. However, other forms of electrical signal transmission may also be used. Alternatively or additionally, the first antenna or antenna structure 850 may be connected to any other device. The first coaxial cable 853a may extend through an opening. Alternatively, the coaxial cable 853a may not extend through any opening (e.g., extending on the same side as the socket 840 of the device under test and / or the first antenna or antenna structure 850).

[0134] like Figure 8 As shown, the test arrangement 800 may include a second antenna or antenna structure 852 (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)), which is configured to (at least when the second antenna or antenna structure 852 is in an operating position, or equivalently, when the operator has inserted the angled device under test 840 into the test socket 830, or when the operator pushes the device under test 840 into the test socket 830) receive signals radiated from the second outer surface 844b of the angled device under test 840, and / or transmit signals to be received at the second outer surface 844b of the angled device under test 840. The second antenna or antenna structure 852 may include an aperture, such as fed by a waveguide.

[0135] The aperture of the second antenna or antenna structure 852 can be arranged at a certain distance from the second outer surface 844b of the angled device under test 840 (for example, by a pushing member 854 between the second antenna or antenna structure 852 and the second outer surface 844b, the pushing member 854 comprising a low dielectric constant material or an electromagnetically transparent material) so that (at least when the second antenna or antenna structure 852 is in the operating position, or equivalently, when the operator inserts the angled device under test 840 into the test socket 830, or when the operator pushes the device under test 840 into the test socket 830) the surface normal of the second outer surface 844b of the angled device under test 840 extends through the aperture of the second antenna or antenna structure 852.

[0136] The distance from the second outer surface 844b can be achieved by using the pusher 854. The pusher 854 may include a low dielectric constant material or an electromagnetically transparent material, and the pusher 854 is arranged between the second antenna or antenna structure 852 and the second outer surface 844b. Figure 8 In the example shown, the test arrangement 800 includes a common pusher 854 for the first antenna or antenna structure 850 and the second antenna or antenna structure 852 (and the first outer surface 844a and the second outer surface 844b). Alternatively, a separate pusher may be provided for each of the first antenna structure 850 and the second antenna structure 852 (and / or the respective first outer surface 844a and the second outer surface 844b).

[0137] The antenna aperture of the second antenna or antenna structure 852 can be tilted relative to the carrier structure 810 (e.g., relative to a surface or a major surface of the carrier structure). The antenna aperture of the second antenna or antenna structure 852 can be tilted at least substantially a second angle between the second outer surface 844b and the surface 812 of the carrier structure 810. The antenna aperture of the second antenna or antenna structure 852 can be arranged at least substantially parallel to the second outer surface 844b. Figure 8 In the example shown, the antenna aperture and second outer surface 844b of the second antenna or antenna structure 852 are tilted 45 degrees relative to the surface 812 of the carrier structure 810. Alternatively, the antenna aperture and second outer surface 844b of the second antenna or antenna structure 852 may be tilted at different angles.

[0138] The second antenna or antenna structure 852 can be mounted to have a fixed position relative to the socket 830 of the device under test. To this end, the second antenna or antenna structure 852 and the socket 830 of the device under test can both have fixed positions relative to the carrier structure 810. Alternatively, the second antenna or antenna structure 852 can have an adjustable position relative to the socket 830 of the device under test.

[0139] The second antenna or antenna structure 852 can be mechanically coupled (e.g., attached) to an arm of the operator (e.g., in the form of a pusher 854) such that the second antenna or antenna structure is movable. The operator can be configured to insert the angled device under test 840 into the socket 830 of the device under test. The arm of the operator can be configured to insert the angled device under test 840 into the socket 830 of the device under test and / or push the device under test 840 into the socket 830 of the device under test.

[0140] The first antenna or antenna structure 850 and / or the second antenna or antenna structure 852 can be part of a pusher for pushing the angled device under test 840 into the socket 830 of the device under test. The first antenna or antenna structure 850 and / or the second antenna or antenna structure 852 can be configured to be movable with the pusher for pushing the angled device under test 840 into the socket of the device under test. For example, the pusher can be arranged so that when the device under test 840 is inserted into the socket 830 of the device under test, the pusher or a portion of the pusher is located between the first antenna or antenna structure 850 and the first outer surface 844a of the angled device under test 840. For example, the pusher can be arranged so that when the device under test 840 is inserted into the socket 830 of the device under test, the pusher or a portion of the pusher is located between the second antenna or antenna structure 852 and the second outer surface 844b of the angled device under test 840. The pusher may include one or more apertures connected to a waveguide for transmitting electromagnetic waves between the apertures and the first antenna or antenna structure 850 and the second antenna or antenna structure 852 .

[0141] When the operator has placed the second antenna or antenna structure 852 in the operating position (or equivalently, when the operator has inserted the angled device under test into the test socket, or when the operator has pushed the device under test into the test socket), the second antenna or antenna structure 852 can be configured to connect to a second signal source and / or signal receiver 856b via a blind-mate microwave connection (e.g., via a blind-mate waveguide connection).

[0142] It should be noted that Figure 8 The test arrangement 800 shown in FIG. 8 has two separate signal sources and / or signal receivers 856 a, b. However, the test arrangement 800 may also have a common (e.g., single) signal source and / or signal receiver that may be connected to the first antenna or antenna structure 950 and the second antenna or antenna structure 952 via separate or common electrical connections (e.g., coaxial cables).

[0143] The pusher 854 can be configured such that when the pusher is in the push position, the first push surface 855a is parallel to the first outer surface 844a of the angled device under test 840, and when the pusher is in the push position, the second push surface 855b is parallel to the second outer surface 844b of the angled device under test 840. Figure 8 In the example shown, the first outer surface 844a and the second outer surface 844b are arranged at right angles (i.e., 90 degrees) relative to each other, and the first push surface 855a and the second push surface 855b of the pusher 852 are also arranged at right angles relative to each other. At least one of the first push surface 855a and the second push surface 855b can be formed in a recess of the pusher 854, for example, to facilitate alignment between the pusher 854 and the device under test 840. The pusher 854 can have other recesses that are arranged to receive at least a portion of the socket 830 of the device under test when the pusher 854 pushes the device under test 840 into the socket 830 of the device under test.

[0144] The pusher 854 is arranged such that when the pusher 854 is in the pushing position, the first pushing surface 855a of the pusher 854 is inclined relative to the carrier structure 810. The pusher 854 is arranged such that when the pusher 854 is in the pushing position, the second pushing surface 855b of the pusher 854 is inclined relative to the carrier structure 810.

[0145] exist Figure 8 In the example shown, when coupled to the socket 830 of the device under test, the apertures of the first antenna or antenna structure 850 and the second antenna or antenna structure 852 are arranged to be parallel to the first outer surface 844a and the second outer surface 844b of the device under test 840. Therefore, the pusher 854 can have a first outer push surface 857a, which is parallel to the first push surface 855a, and the pusher 854 includes a second outer push surface 857b, which is parallel to the second push surface 855b.

[0146] However, the apertures of the first antenna or antenna structure 850 and the second antenna or antenna structure 852 can be arranged at different angles to the outer surfaces 844a, b. For example, the first outer surface 844a and the second outer surface 844b can be at angles of 40 degrees and 50 degrees, respectively, relative to the surface 812 of the carrier structure 810, while the apertures of the first antenna or antenna structure 850 and the second antenna or antenna structure 852 can be at an angle of 45 degrees relative to the surface 812 of the carrier structure 810. The pusher 854 can be configured to compensate for the angular difference between the apertures of the first antenna or antenna structure 850 and the second antenna or antenna structure 852 and the first outer surface 844a and the second outer surface 844b. For example, the first and second outer push surfaces 857a can be inclined 5 degrees relative to the first push surface 855a and the second push surface 855b. Alternatively or additionally, at least one of the first antenna or antenna structure 850 and the second antenna or antenna structure 852 can be configured to be adjustable in at least one of position and / or orientation.

[0147] The device under test receptacle 830 may include an angled recess or angled notch 834 configured to support and / or align an angled device under test 840. Figure 8 In the example shown, the angled recess or angled notch 834 has an L-shaped cross-section, for example, in the form of two plates arranged at a right angle. The angled recess or notch 834 may have one or two side walls (e.g., parallel to the cross-section of the angled recess or notch 834), for example, to reduce lateral movement of the device under test 840 within the socket 830 of the device under test. The angled recess or notch 834 may be defined by a step. Figure 8 In the example shown, the height of the step is substantially the same as the distance between the first inner surface of the device under test 840 and the first outer surface 844a. Thus, the first outer surface 844a is arranged to be flush with the step of the socket 830 of the device under test. Alternatively, the height of the step may be greater (e.g., to provide support for the pusher 846), or less (e.g., to not limit the pressure applied by the pusher 846 to the device under test 840). It should be noted that in Figure 8 In the embodiment, the first push surface 855a and the second push surface 855b are larger in size than the first outer surface 844a and the second outer surface 844b. Alternatively, the first push surface 855a and the second push surface 855b may be substantially the same in size as or smaller than the first outer surface 844a and the second outer surface 844b.

[0148] The device under test 840 may include a first inner surface 842a of the angled device under test 840 that is opposite to a first outer surface 844a of the angled device under test 840. The device under test 840 may include a second inner surface 842b of the angled device under test 840 that is opposite to a second outer surface 844b of the angled device under test 840. The device under test receptacle 830 may be arranged such that the first inner surface 842a and / or the second inner surface 842b of the angled device under test 840 are spaced from the carrier structure 810 (e.g., a load board) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelengths, or wavelengths in the medium between the first outer surface of the angled device under test and the carrier structure) at the lowest operating frequency of the angled device under test.

[0149] For example, the lowest operating frequency may be the lowest operating frequency of an antenna-in-package (AiP) module constituting or included in the angled device under test 840 .

[0150] The socket 830 of the device under test can be arranged so that, preferably, the edges of the first and / or second outer surfaces 844a, b are spaced from the load board by at least 10 mm, or at least 20 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of the angled device under test (for example, at the lowest operating frequency of a packaged antenna (AiP) module constituting or included in the device under test), such as the free space wavelength, or the wavelength in the medium between the first and / or second outer surfaces 844a, b of the angled device under test 840 and the carrier structure 810.

[0151] The socket 830 of the device under test can include a maximum socket height 836 (e.g., beyond the surface 812 of the carrier structure 810), which can be at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelengths, or wavelengths in the medium between two support surface edges of the socket 830 of the device under test and the carrier structure 810) at the lowest operating frequency of the angled device under test (e.g., at the lowest operating frequency of a package antenna (AiP) module that constitutes or is included in the device under test). The maximum socket height 836 can be a height beyond the carrier structure 810, where the inner edge of the angled device under test 840 is located when the angled device under test 840 is placed in the socket 830 of the device under test. The maximum socket height 836 can also be a height beyond the carrier structure 810, where the edge between the two support surfaces of the socket 830 of the device under test is located at the maximum socket height 836.

[0152] The first antenna or antenna structure 850 and the second antenna or antenna structure 852 can be arranged so that the angled device under test 840 can be inserted into the socket 830 of the device under test in a direction perpendicular to the surface 812 (e.g., the major surface) of the carrier structure 810 without moving the first and second antennas 850, 852. Alternatively or additionally, the first antenna or antenna structure 850 and the second antenna or antenna structure 852 can be arranged so that the angled device under test 840 can be removed from the socket 830 of the device under test in a direction perpendicular to the surface 812 (e.g., the major surface) of the carrier structure 810 without moving the first antenna or antenna structure 850 and the second antenna or antenna structure 852. The pusher 854 is sized so that when the device under test 840, the pusher 854 and the first and second antennas or antenna structures 850, 852 are in the operating position, the pusher 854 abuts against the device under test 840 and the first and second antennas or antenna structures 850, 852.

[0153] The spacing between the first antenna or antenna structure 850 and the second antenna or antenna structure 852 (e.g., in a direction parallel to the surface 812 of the carrier structure 810) can be selected so that an angled device under test can be moved through the spacing linearly (e.g., along a straight line) in a direction perpendicular to the surface (e.g., major surface) of the carrier structure. The spacing can be selected so that the antenna device 840 can be moved through the spacing without at least substantially rotating or with an angle of rotation so that the first or second outer surface (or inner surface) 844a, b is oriented at least substantially parallel to the surface 812 of the carrier structure 810. The spacing can be greater than 5%, 10%, or 20% of the width of the device under test 840, whether or not rotation is required.

[0154] Fig. 9 A perspective view of an example of a device under test receptacle 930 is shown, which may be used, for example, in any of the embodiments disclosed herein.

[0155] The socket 930 of the device under test can be configured to receive any device under test described herein and can be part of any test arrangement described herein. The socket 930 of the device under test can be configured to be coupled (e.g., inserted) to any support structure described herein (e.g., support structure 860), wherein optionally, other components such as a flexible or film or elastic planar conductor structure 862 can be at least partially arranged between the socket 930 of the device under test and the support structure.

[0156] The socket 930 of the device under test includes an angled recess or angled notch 960, which is configured to support and / or align the angled device under test. The angled recess or angled notch 960 includes a first abutment surface 962a and a second abutment surface 962b, the first abutment surface 962a is used to abut with a first inner surface of the device under test (e.g., the first inner surface 142a, 242a or 742a), and the second abutment surface 962b is used to abut with a second inner surface of the device under test (e.g., the second inner surface 142b, 242b or 742b). The first abutment surface 862a and the second abutment surface 962b can be arranged to be at an abutment surface angle, wherein the sum of the abutment surface angle (e.g., 270 degrees) and the angle between the first inner surface and the second inner surface of the device under test (e.g., 90 degrees) is at least substantially 360 degrees. For example, if the first inner surface and the second inner surface of the device under test may be arranged at an angle of 90 degrees, the abutment surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0157] Any surface of the socket 930 of the device under test can be configured to establish electrical contact with the inner surface of the device under test. For example, the first abutment surface 962a and / or the second abutment surface 962b can be configured to establish electrical contact with the inner surface of the device under test, and / or provide a ground plane for the antenna structure of the device under test. To this end, the first abutment surface 962a and / or the second abutment surface 962b may include or may be made of a conductive material (e.g., at least one of gold, copper, iron and nickel). Alternatively, the first abutment surface and / or the second abutment surface may include a dielectric (non-conductive) material (e.g., a wear-resistant material) or be made of a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first abutment surface 962a and / or the second abutment surface 962b may include one or more (local) socket connectors 965 (or other contact structures for contacting the device under test, such as conductive pads, spring pins, spring-loaded contacts, etc.). The socket connector 965 is arranged so that when the device under test is arranged in the socket 960 of the device under test, the connector 965 establishes an electrical connection with the inner surface of the device under test or its connector (eg, array connector 248, 748).

[0158] The socket 930 of the device under test includes a support body 964, which includes a main socket structure 964a and a leg socket structure 964b. Both the main socket structure 964a and the leg socket structure 964b have an outer shape of a cuboid (optionally with rounded edges), wherein at least two edges of the leg socket structure 964b are smaller (shorter) than two edges (e.g., corresponding edges) of the main socket structure 964a. The main socket structure 964a and the leg socket structure 964b can, for example, have the same height. The side surface 961 of the leg socket structure 964b is arranged to be flush with the side surface of the main socket structure 964a, while the other three side surfaces of the leg socket structure 964b are recessed relative to the other three (corresponding) side surfaces of the main socket structure 964a. Therefore, for example, the leg socket structure 964b can be received by an opening in the carrier structure (or an extension structure coupled to the carrier structure), so that, for example, the lateral movement of the socket 930 of the device under test is limited by the side surface of the leg socket structure 964b. However, a socket of the device under test may also be attached to the top of the extension structure, wherein the main socket structure 964a may be arranged on the top surface of the extension structure, wherein the leg socket structure 964b may be located near the side wall of the extension structure.

[0159] The socket 930 of the device under test may additionally or alternatively include one or more protrusions 966 extending from the support body 964 (e.g., from the main socket structure 964a) in a direction toward the carrier structure. The protrusion 966 may be or include a (e.g., cylindrical) shaft. The protrusion 966 may be received by a recess of the carrier structure. Alternatively or additionally, the socket 930 of the device under test may include one or more through holes for receiving attachment elements such as pins or screws.

[0160] exist Fig. 9 In the example shown, the angled recess or angled notch 960 extends into both the main socket structure 964a and the leg socket structure 964b. Alternatively, the angled recess or angled notch 960 may extend only into the main socket structure 964a.

[0161] The angled recess or angled notch 960 has corresponding side walls 968a, b at its two ends (the side walls 968a, b are Fig. 9 Only one of them is directly visible). The side walls 968a, b face each other and are arranged at least substantially parallel to each other (ignoring the optional taper). Fig. 9In the example shown, the side walls 968a, b are oriented vertically or at least substantially vertically relative to the first abutment surface 962a and the second abutment surface 962b. The side walls 968a, b can limit lateral movement of the device under test within the angled recess or angled notch 960, while still allowing the device under test to be smoothly and well-guided inserted into the angled recess or angled notch 860, and also allowing the device under test to be smoothly removed. Alternatively, the angled recess or angled notch 960 can include only one side wall or no side walls, for example, to increase flexibility with respect to positioning.

[0162] The angled recess or angled notch 960 may include at least one taper, for example, such that the cross-section (e.g., parallel to the first abutment surface 962a or the second abutment surface 962b) decreases in a direction from the outside toward the first or second abutment surface 962b. Fig. 9 In the example shown, the angled recess or angled notch 960 includes a first and a second taper. According to the first taper, the distance between the side walls 968a, b decreases toward the first abutment surface 962a. According to the second taper, the three side walls of the main socket structure 964a surrounding the second abutment surface 962b have a cross-section that decreases toward the second abutment surface 962b. The taper can have a self-centering function and facilitate the insertion of the device under test into the angled recess or angled notch 960.

[0163] The socket 930 of the device under test may have adjacent openings 969 that intersect the angled recess or angled notch 960. Fig. 9In the example shown, the socket 930 of the device under test includes four adjacent openings 969, which are arranged near the corners of the second abutment surface 962b. Alternatively, the socket 930 of the device under test can include any other number of adjacent openings 969 at any other position, which are located adjacent to the second abutment surface 962b (and / or the first abutment surface 962a). At least one of the adjacent openings 969 can be configured to receive a screw with a screw head, and when the device under test is inserted into the angled notch 960 and the screw is tightened, the screw head is configured to abut against the first or second surface of the exterior of the device under test. Therefore, the adjacent openings 969 can allow the device under test to be attached to the socket 930 of the device under test. Alternatively or additionally, at least one of the adjacent openings 969 can be configured to receive a gripping element (e.g., a clamping device or a user's finger) so that the gripping element can contact the device under test from the side (e.g., so as to insert the device under test into the socket of the device under test and / or remove the device under test from the socket 930 of the device under test). For example, the adjacent opening can be adapted to, for example, prevent the device under test from tilting when the device under test is inserted into the receptacle 930. However, the adjacent opening can also facilitate removal of the device under test from the receptacle 930.

[0164] Angled recess or angled notch 960 may include additional recesses or notches, for example, to conform to the shape of the device under test. Fig. 9 The angled recess or notch 960 shown includes a step 967 in the first abutment surface 962a. The step 967 may, for example, accommodate a structural feature of the first inner surface, or provide a support surface for the device under test, such as to create a space underneath (e.g., for gripping the device under test).

[0165] The socket 930 of the device under test may include a blind mate interface. Fig. 9 In the example shown, the main socket structure 964a includes two (blind) mating recesses 963a, b. Alternatively, the main socket structure 964a may include any other number of mating recesses. The mating recesses 963a, b are configured to receive a (blind) mating protrusion of a pusher or operator (e.g., operator 754). Alternatively or additionally, the main socket structure 964a may include one or more (blind) mating protrusions, for example, which are configured to be received by a (blind) mating recess of a pusher or operator (e.g., operator 754).

[0166] In summary, the socket 930 can receive an angled device under test and can establish an electrical connection with the angled device under test. The device under test can be positioned (aligned) within the angled recess or angled notch 960, making it possible to use the antenna structure or antenna on the two outer surfaces of the angled device under test to perform air testing on the device under test. The device under test is well aligned in the socket, and at the same time, the deformation of the radiation characteristics of the antenna or antenna structure of the device under test by the socket can be kept reasonably small. The socket can be easily attached to the carrier structure and can be used in any embodiment disclosed herein.

Claims

1. A test arrangement (100; 800) for performing an over-the-air transmission test on an angled device under test (140; 240; 340; 540; 740; 840), wherein the test arrangement comprises a carrier structure (110; 810); The test arrangement comprises a socket (130; 830) of a device under test, the socket of the device under test being coupled to the carrier structure (110; 810), wherein the socket (130; 830) of the device under test is configured to establish electrical contact with an inner surface (142a, 142b; 242a, 242b; 842a, 842b) of the angled device under test (140; 240; 340; 540; 740; 840) or with a connector arranged on the inner surface (142a, 142b; 242a, 242b; 842a, 842b) of the angled device under test (140; 240; 340; 540; 740; 840); wherein the socket (130; 830) of the device under test is configured to position the angled device under test (140; 240; 340; 540; 740; 840) The first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840) is tilted at least 15 degrees relative to the surface (112; 812) of the carrier structure (110; 810).

2. The test arrangement (100; 800) according to claim 1, wherein the socket (130; 830) of the device under test is configured to position the angled device under test (140; 240; 340; 540; 740; 840), The second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) is tilted at least 15 degrees relative to the surface of the carrier structure (110; 810).

3. The test arrangement (100; 800) according to claim 1 or 2, The test socket (130; 830) comprises two supporting surfaces (131a, b) for supporting two inner surfaces (142a, 142b; 242a, 242b; 842a, 842b) of an angled device under test (140; 240; 340; 540; 740; 840), The two support surfaces (131a, b) are both inclined at least 15 degrees relative to the surface (112; 812) of the carrier structure (110; 810).

4. The test arrangement (100; 800) according to one of claims 1 to 3, wherein the test arrangement comprises a support structure (860) arranged on a surface (112; 812) of the carrier structure (110; 810) and comprising a triangular cross-section; The support structure (860) is configured to support the socket (130; 830) of the device under test.

5. The test arrangement (100; 800) according to one of claims 1 to 4, The test arrangement comprises a flexible or thin film or elastic planar conductor structure (862), which is arranged to establish a connection between a surface (112; 812) of the carrier structure (110; 810) and a surface of a socket (130; 830) of the device under test, the surface of the socket (130; 830) of the device under test being inclined relative to the surface (112; 812) of the carrier structure (110; 810).

6. The test arrangement (100; 800) according to claim 5, The flexible or film or elastic planar conductor structure (862) is electrically coupled to the surface (112; 812) of the carrier structure (110; 810) and includes at least one bend to align with the lower surface of the socket (130; 830) of the device under test.

7. The test arrangement (100; 800) according to claim 5 or 6, wherein the flexible or film-like or elastic planar conductor structure (862) extends onto the surface of the support structure (860), wherein the support structure (860) is arranged on a surface (112; 812) of the carrier structure (110; 810) and comprises a triangular cross-section; wherein the support structure (860) is configured to carry the socket (130; 830) of the device under test; and The flexible or film-like or elastic planar conductor structure (862) is partially arranged between the support structure (860) and the socket (130; 830) of the device under test.

8. The test arrangement (100; 800) according to one of claims 1 to 7, The socket (130; 830) of the device under test includes one or more coaxial spring probes (832) to establish an electrical connection with the angled device under test (140; 240; 340; 540; 740; 840).

9. The test arrangement (100; 800) according to one of claims 1 to 8, The test arrangement comprises a first antenna or antenna structure (850), which is configured to receive a signal radiated by the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840) and / or is configured to transmit a signal to be received at the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840).

10. The test arrangement (100; 800) according to one of claims 1 to 9, The test arrangement comprises a first antenna or antenna structure (850), wherein an aperture of the first antenna or antenna structure (850) is arranged at a certain distance from the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840) so that a surface normal of the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840) extends through the aperture of the first antenna or antenna structure (850).

11. The test arrangement (100; 800) according to one of claims 8 to 10, The antenna aperture of the first antenna or antenna structure (850) is tilted relative to the carrier structure (110; 810).

12. The test arrangement according to one of claims 9 to 11, The antenna aperture of the first antenna or antenna structure (850) is parallel to the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840).

13. The test arrangement (100; 800) according to one of claims 9 to 12, The first antenna or antenna structure (850) is mounted to have a fixed position relative to the socket (130; 830) of the device under test.

14. The test arrangement (100; 800) according to one of claims 9 to 13, The first antenna or antenna structure (850) is mechanically coupled to an arm of an operator (854) such that the first antenna or antenna structure (850) is movable.

15. The test arrangement (100; 800) according to one of claims 9 to 14, Wherein when the operator (854) has placed the first antenna or antenna structure (850) in an operating position, the first antenna or antenna structure (850) is configured to be connected to a signal source and / or a signal receiver (856a) via a blind-mate microwave connection.

16. The test arrangement (100; 800) according to one of claims 1 to 15, The test arrangement comprises a second antenna or antenna structure (852), which is configured to receive a signal radiated by the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) and / or is configured to transmit a signal to be received at the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840).

17. The test arrangement (100; 800) according to one of claims 1 to 16, The test arrangement comprises a second antenna or antenna structure (852), the aperture of which is arranged at a certain distance from the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) so that a surface normal of the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) extends through the aperture of the second antenna or antenna structure (852).

18. The test arrangement (100; 800) according to one of claims 16 to 17, The antenna aperture of the second antenna or antenna structure (852) is tilted relative to the carrier structure (110; 810).

19. The test arrangement (100; 800) according to one of claims 16 to 18, The antenna aperture of the second antenna or antenna structure (852) is parallel to the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840).

20. The test arrangement (100; 800) according to one of claims 16 to 19, The second antenna or antenna structure (852) is mounted to have a fixed position relative to the socket (130; 830) of the device under test.

21. The test arrangement (100; 800) according to one of claims 16 to 20, Wherein the second antenna or antenna structure (852) is mechanically coupled to an arm of an operator (854) such that the second antenna or antenna structure (852) is movable.

22. The test arrangement (100; 800) according to one of claims 16 to 21, wherein the first antenna or antenna structure (850) and / or the second antenna or antenna structure (852) is part of a pusher (854) for pushing the angled device under test (140; 240; 340; 540; 740; 840) into a socket (130; 830) of the device under test, or The first antenna or antenna structure (850) and / or the second antenna or antenna structure (852) are configured to be movable together with a pushing member (854) for pushing the angled device under test (140; 240; 340; 540; 740; 840) into a socket (130; 830) of the device under test.

23. The test arrangement (100; 800) according to one of claims 16 to 22, Wherein when the operator (854) has placed the second antenna or antenna structure (852) in an operating position, the second antenna or antenna structure (852) is configured to be connected to a signal source and / or a signal receiver (856b) via a blind-mate microwave connection.

24. The test arrangement (100; 800) according to one of claims 1 to 23, The test arrangement comprises a pusher (854) for pushing the angled device under test (140; 240; 340; 540; 740; 840) into the test socket (130; 830), wherein the pushing member (854) is configured such that when the pushing member (854) is in a pushing position, the first pushing surface (855a) is parallel to the first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840), and The pushing member (854) is configured so that when the pushing member (854) is in the pushing position, the second pushing surface (855b) is parallel to the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test.

25. The test arrangement (100; 800) according to one of claims 1 to 24, The test arrangement comprises a pusher (854) for pushing the angled device under test (140; 240; 340; 540; 740; 840) into the test socket (130; 830), wherein the pushing member (854) is configured such that when the pushing member (854) is in the pushing position, the first pushing surface (855a) of the pushing member (854) is inclined relative to the carrier structure (110; 810), and The pushing member (854) is configured such that when the pushing member (854) is in the pushing position, the second pushing surface (855b) of the pushing member (854) is inclined relative to the carrier structure (110; 810).

26. The test arrangement (100; 800) according to one of claims 1 to 25, The socket (130; 830) of the device under test includes an angled recess or an angled notch (834), and the angled recess or angled notch (834) is configured to support and / or align the angled device under test (140; 240; 340; 540; 740; 840).

27. The test arrangement (100; 800) according to one of claims 1 to 26, The socket (130; 830) of the device under test is configured so that a second inner surface (142b; 242b; 842b) of the angled device under test (140; 240; 340; 540; 740; 840) opposite to the second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) is spaced from the carrier structure (110; 810) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of the angled device under test (140; 240; 340; 540; 740; 840).

28. The test arrangement (100; 800) according to one of claims 1 to 27, The socket (130; 830) of the device under test includes a maximum socket height (836), which is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths at the lowest operating frequency of the angled device under test (140; 240; 340; 540; 740; 840).

29. The test arrangement (100; 800) according to one of claims 1 to 28, wherein the first antenna or antenna structure (850) and the second antenna or antenna structure (852) are arranged so that the angled device under test (140; 240; 340; 540; 740; 840) can be inserted into the socket (130; 830) of the device under test in a direction perpendicular to the surface (112; 812) of the carrier structure (110; 810) without moving the first antenna or antenna structure and the second antenna or antenna structure, and / or The first antenna or antenna structure (850) and the second antenna or antenna structure (852) are arranged so that the angled device under test (140; 240; 340; 540; 740; 840) can be removed from the socket (130; 830) of the device under test in a direction perpendicular to the surface (112; 812) of the carrier structure (110; 810) without moving the first antenna or antenna structure (850) and the second antenna or antenna structure (852).

30. The test arrangement (100; 800) according to one of claims 1 to 29, The spacing between the first antenna or antenna structure (850) and the second antenna or antenna structure (852) is selected so that the angled device under test (140; 240; 340; 540; 740; 840) can move linearly through the spacing in a direction perpendicular to a surface (112; 812) of the carrier structure (110; 810).

31. A test arrangement (100; 800) for performing over-the-air transmission testing of an angled device under test (140; 240; 340; 540; 740; 840), wherein the test arrangement comprises a carrier structure (110; 810); The test arrangement comprises a socket (130; 830) of a device under test, the socket (130; 830) of the device under test being coupled to the carrier structure (110; 810), wherein the socket (130; 830) of the device under test is configured to establish electrical contact with an inner surface (142a, 142b; 242a, 242b; 842a, 842b) of the angled device under test (140; 240; 340; 540; 740; 840) or with a connector arranged on the inner surface (142a, 142b; 242a, 242b; 842a, 842b) of the angled device under test (140; 240; 340; 540; 740; 840), and wherein the socket (130; 830) of the device under test is configured to position the angled device under test (140; 240; 340; 540; 740; 840) causing a first outer surface (144a; 244a; 344a; 544a; 744a; 844a) of the angled device under test (140; 240; 340; 540; 740; 840) to be inclined at least 15 degrees relative to a surface (112; 812) of the carrier structure (110; 810), and The second outer surface (144b; 244b; 344b; 544b; 744b; 844b) of the angled device under test (140; 240; 340; 540; 740; 840) is tilted at least 15 degrees relative to the surface (112; 812) of the carrier structure (110; 810).

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