Solid state light emitting component

Abstract

The solid state light emitting component includes a novel lens structure arranged in contact with at least one solid state light emitter without an intermediate air gap to provide a desired combination of output characteristics and without the need for secondary optics. The lens structure includes an inclined or curved surface having an orientation configured to produce a total internal reflection (TIR) of the light emission toward the light exit surface. The non-Lambert lens structure is configured to produce focused output emissions or dispersed output emissions having a specified distribution within a range of angles. The unitary lens structure may include a recess in the shape of an inverted pyramid, inverted cone, or groove having a lowest point aligned with the emission center of the solid state emitter, with the walls configured to generate TIR.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 397,068, filed on August 11, 2022, the entire contents of which are hereby incorporated by reference herein. Technical Field

[0003] The subject matter herein relates to solid state light emitting devices including an integral lens structure disposed over one or more solid state light emitters (e.g., light emitting diodes (LEDs), optionally in combination with one or more light tubes), and methods of making such devices. Background Art

[0004] Solid-state lighting devices such as light emitting diodes (LEDs) are increasingly being used in both consumer and commercial applications. LEDs have been widely used in a variety of lighting environments, as well as for backlighting of liquid crystal displays and for providing sequential lighting LED displays. Lighting applications include automotive headlamps, road lights, stadium lights, lamps, flashlights, and a variety of indoor, outdoor, and special lighting environments. The desired characteristics of LED devices according to various end uses include high luminous efficacy, uniform color point over the lighting area, long life, wide color gamut, and compact size.

[0005] LEDs are solid-state devices that convert electrical energy into light, and typically include one or more active layers (or active regions) of semiconductor material arranged between oppositely doped n-type and p-type layers. When a bias is applied to the doped layers, holes and electrons are injected into the active layer or layers, where they are recombined to generate emission, such as visible or ultraviolet light emission. LED chips typically include an active region, which can be made of, for example, silicon carbide, gallium nitride, gallium phosphide, indium phosphide, aluminum nitride, gallium arsenide-based materials, and / or organic semiconductor materials. Photons generated by the active region are excited in all directions.

[0006] Fluorescent materials such as phosphors can be arranged in the light emission path of the LED emitter to convert part of the light into different wavelengths. LED packages have been developed that can provide mechanical support, electrical connections and sealing for LED emitters. Light emission emitted from the surface of the LED emitter usually interacts with the fluorescent material and various elements or surfaces of the LED package before emitting into the environment, thereby increasing the chance of light loss (e.g., due to internal absorption) and potential light emission non-uniformity. Therefore, it may be challenging to produce high-quality light with desired emission characteristics while providing high luminous efficiency. LED packages generally require secondary optics (e.g., lenses and / or reflectors, including metallized reflectors) to obtain the desired output beam characteristics because the light emitted from the primary optics of conventional LED packages is generally too wide and lacks long-distance intensity; however, secondary optics increase the size, cost and complexity of the lighting device and cause optical losses. Another limitation associated with LED lighting devices is long-term reliability, especially when their components exhibit different thermal expansion characteristics and are subjected to thermal loads in a large number of operating cycles.

[0007] The art continues to seek improved solid-state lighting devices and methods for making such devices having desirable lighting characteristics that overcome challenges associated with conventional lighting devices. Summary of the invention

[0008] The present disclosure relates in various aspects to solid-state light emitting components, including a novel lens structure (e.g., including at least one LED chip optionally combined with a fluorescent material on its outer surface) arranged in contact with one or more solid-state light emitters to provide a desired combination of output characteristics different from those provided by conventional components. In certain embodiments, the lens structure does not require a secondary optical device. In an embodiment including a monolithic lens structure, at least a first portion of the lens structure has a width that increases with distance away from the solid-state light emitter and includes an inclined or curved surface having an orientation configured to produce total internal reflection of at least a portion of the light emission toward one or more light exit surfaces of the component. In certain embodiments, a non-Lambertian monolithic lens structure is disposed above at least one solid-state light emitter with no intermediate air gap therebetween, and the lens structure is configured to produce any of the following: (a) a focused output emission having an intensity distribution within an angular range with a full width at half maximum (FWHM) value of less than 100; or a dispersed output emission having an intensity distribution within an angular range with a FWHM value greater than 130. In some embodiments, the overall lens structure includes a recessed portion in the shape of an inverted pyramid, an inverted cone, or a groove, having a lowest point aligned with an emission center of at least one solid-state light emitter, the recess being defined by one or more inclined walls, wherein an axis extends through the lowest point and the emission center, and wherein the one or more inclined walls are inclined away from the axis at an angle in a range of 40 to 44 degrees. In some embodiments, the lens structure includes: a light diffusing portion contacting an outer surface of at least one solid-state light emitter; and a composite refractive index portion disposed above the light diffusing portion, the composite refractive index portion including a first region having a first refractive index and a second region having a second refractive index different from the first refractive index, the first region covering less than the entire light diffusing portion.

[0009] In one aspect, the present disclosure relates to a solid-state light-emitting component, comprising: at least one solid-state light emitter configured to generate light emissions; and an integral lens structure arranged to contact the at least one solid-state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid-state light emitter; wherein at least a first portion of the integral lens structure proximate to the at least one solid-state light emitter has a width that increases with distance away from the at least one solid-state light emitter; and wherein at least a first portion of the integral lens structure comprises at least one inclined or curved surface having an orientation configured to produce total internal reflection of a portion of the light emissions originating from an emission center of the at least one solid-state light emitter, and configured to reflect light toward one or more light exit surfaces of the solid-state light-emitting component.

[0010] In certain embodiments, the at least one sloped or curved surface comprises a peripheral edge surface of at least a first portion of the overall lens structure.

[0011] In certain embodiments, the unitary lens structure defines a recess, and the at least one sloped or curved surface bounds at least a portion of the recess.

[0012] In some embodiments, the overall lens structure also includes a second portion having a width that decreases with distance away from at least one solid-state light emitter, wherein the first portion of the overall lens structure is arranged between the at least one solid-state light emitter and the second portion of the overall lens structure.

[0013] In certain embodiments, the second portion of the overall lens structure includes a proximal segment having a truncated pyramid shape (eg, having a square top view profile) and includes a distal segment having a dome shape (eg, having a circular top view profile).

[0014] In certain embodiments, the overall lens structure includes a third portion having a circular or square cross-sectional shape, wherein the third portion is disposed between the first portion and the second portion.

[0015] In some embodiments, the overall lens structure includes a material having a first refractive index, at least a first portion of the overall lens structure is defined by an outer lens surface, and the outer lens surface is defined by a material or space having a second refractive index, wherein the first refractive index exceeds the second refractive index by at least 0.4.

[0016] In certain embodiments, at least a first portion of the overall lens structure includes an inverted truncated pyramid shape (eg, having a square top-view profile) or an inverted truncated cone shape (eg, having a circular top-view profile).

[0017] In certain embodiments, the integral lens structure includes a concave portion having a shape of an inverted pyramid, an inverted cone, or a groove and having a lowest point aligned with an emission center of at least one solid state light emitter.

[0018] In certain embodiments, one or more light exit surfaces are arranged along side edges of the overall lens structure.

[0019] In certain embodiments, the solid state lighting component further comprises a secondary lens structure disposed in contact with the integral lens structure, wherein the integral lens structure is disposed between the at least one solid state light emitter and the secondary lens structure.

[0020] In some embodiments, the solid-state light-emitting component also includes a sub-support to which at least one solid-state light emitter is mounted, wherein the width of the overall lens structure is no greater than the width of the sub-support at a position where the overall lens structure is arranged to contact the at least one solid-state light emitter.

[0021] In some embodiments, at least one solid-state light emitter includes an LED chip and a fluorescent material layer arranged on the outer surface of the LED chip, wherein the side edge surface of the LED chip is free of fluorescent material, and the solid-state light-emitting component also includes: a sub-support, to which at least one solid-state light emitter is mounted; and a filling material layer, including a filling material and contacting the side edge surface of at least one solid-state light emitter, the filling material including white or light-reflecting particles dispersed in an adhesive; wherein a portion of the fluorescent material overlaps with a portion of the filling material layer.

[0022] In some embodiments, the fluorescent material layer, the filling material layer, and the overall lens structure are substantially matched in terms of coefficient of thermal expansion (CTE) such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer, and the lens material is within a range of less than 20%.

[0023] In certain embodiments, the unitary lens structure comprises silicone.

[0024] In another aspect, the present disclosure is directed to a solid state lighting component, comprising: at least one solid state light emitter configured to generate light emissions; and a non-Lambertian integral lens structure disposed in contact with the at least one solid state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid state light emitter, wherein the solid state lighting component is free of an air gap, the light emissions being transmitted through the air gap into the non-Lambertian integral lens structure; wherein the non-Lambertian integral lens structure is configured to shape the light emissions received from the at least one solid state light emitter to produce an output emission having one of the following characteristics (a) or (b): (a) focused output emission having an intensity distribution within an angular range having a full width at half maximum (FWHM) value of less than 100; or (b) dispersed output emission having an intensity distribution within an angular range having a FWHM value of greater than 130. In this context, FWHM refers to the difference between two values ​​of the independent variable at which the dependent variable is equal to half of its maximum value (to reiterate, it is the width of the spectral curve measured between those points on the y-axis that are half of the maximum amplitude).

[0025] In certain embodiments, the non-Lambertian integral lens structure is configured to shape light emissions received from at least one solid-state light emitter to produce a focused output emission having an intensity distribution within an angular range having a FWHM value within a range between 40 and 100.

[0026] In certain embodiments, the non-Lambertian integral lens structure is configured to shape light emissions received from at least one solid state light emitter to produce a dispersed output emission having an intensity distribution within an angular range having a FWHM value within a range between 130 and 200.

[0027] In certain embodiments, at least a first portion of a non-Lambertian integral lens structure proximate to at least one solid-state light emitter has a width that increases with distance away from the at least one solid-state light emitter; and at least a first portion of the non-Lambertian integral lens structure is defined by side edge surfaces having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid-state light emitter.

[0028] In certain embodiments, at least one solid-state light emitter is disposed within a cavity defined by an elevated reflector structure; at least a first portion of a non-Lambertian integral lens structure proximate the at least one solid-state light emitter has a width that increases with distance away from the at least one solid-state light emitter; and at least a first portion of the non-Lambertian integral lens structure is disposed in contact with a reflective wall of the elevated reflector structure defining the cavity.

[0029] In certain embodiments, the elevated reflector structure comprises light reflective particles suspended in a binder; the non-Lambertian integral lens structure comprises a lens material; and the elevated reflector structure and the lens material are substantially matched in terms of coefficient of thermal expansion (CTE) such that the CTE difference therebetween is within a range of less than 20%.

[0030] In some embodiments, the solid-state light-emitting component also includes a sub-support to which at least one solid-state light emitter is mounted, wherein the width of the non-Lambertian integral lens structure is no greater than the width of the sub-support at a position where the non-Lambertian integral lens structure is arranged to contact the at least one solid-state light emitter.

[0031] In some embodiments, at least one solid-state light emitter includes an LED chip and a fluorescent material layer arranged on the outer surface of the LED chip, wherein the side edge surface of the LED chip is free of fluorescent material, and the solid-state light-emitting component also includes: a sub-support, to which at least one solid-state light emitter is mounted; and a filling material layer, including a filling material and contacting the side edge surface of at least one solid-state light emitter, the filling material including white or light-reflecting particles dispersed in an adhesive; wherein a portion of the fluorescent material overlaps with a portion of the filling material layer.

[0032] In some embodiments, the fluorescent material layer, the filling material layer, and the non-Lambertian overall lens structure are substantially matched in terms of the coefficient of thermal expansion (CTE) such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer, and the lens material is within a range of less than 20%.

[0033] In certain embodiments, the non-Lambertian monolithic lens structure comprises silicone.

[0034] In another aspect, the present disclosure relates to a solid-state light-emitting component, comprising: at least one solid-state light emitter configured to generate light emissions, at least one solid-state light emitter having an emission center; and an integral lens structure arranged to contact the at least one solid-state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid-state light emitter; wherein the integral lens structure includes a recessed portion having a shape of an inverted pyramid, an inverted cone or a groove, having a lowest point aligned with the emission center, the recess being defined by one or more inclined walls, wherein an axis extends through the lowest point and the emission center, and wherein the one or more inclined walls are inclined away from the axis at an angle in the range of 40 degrees to 44 degrees.

[0035] In certain embodiments, the unitary lens structure includes one or more light exit surfaces along a side edge thereof, and wherein the one or more inclined walls are configured to reflect light toward the one or more light exit surfaces.

[0036] In certain embodiments, the unitary lens structure includes a material having a first refractive index, and wherein the recess is substantially filled with a material having a second refractive index that differs from the first refractive index by at least 0.4.

[0037] In certain embodiments, the material having the second refractive index includes air.

[0038] In certain embodiments, at least a first portion of the overall lens structure proximate to at least one solid-state light emitter has a width that increases with distance away from the at least one solid-state light emitter; and at least a first portion of the overall lens structure is defined by at least one inclined or curved surface side, the at least one inclined or curved surface having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid-state light emitter.

[0039] In certain embodiments, the overall lens structure defines a first lobe and a second lobe, and the recess is shaped like a groove disposed between the first lobe and the second lobe.

[0040] In certain embodiments, each of the first lobe and the second lobe includes a light emitting surface, and at least a portion of the light emitting surface has an outwardly curved or convex profile.

[0041] In some embodiments, the solid-state light-emitting component also includes a sub-support to which at least one solid-state light emitter is mounted, wherein the width of the overall lens structure is no greater than the width of the sub-support at a position where the overall lens structure is arranged to contact the solid-state light emitter.

[0042] In some embodiments, at least one solid-state light emitter includes an LED chip and a fluorescent material layer arranged on the outer surface of the LED chip, wherein the side edge surface of the LED chip is free of fluorescent material, and the solid-state light-emitting component also includes: a sub-support, to which at least one solid-state light emitter is mounted; and a filling material layer, including a filling material and contacting the side edge surface of at least one solid-state light emitter, the filling material including white or light-reflecting particles dispersed in an adhesive; wherein a portion of the fluorescent material overlaps with a portion of the filling material layer.

[0043] In some embodiments, the fluorescent material layer, the filling material layer, and the overall lens structure are substantially matched in terms of coefficient of thermal expansion (CTE) such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer, and the lens material is within a range of less than 20%.

[0044] In another aspect, the present disclosure relates to a solid-state light-emitting component, comprising: at least one solid-state light emitter, arranged on a sub-support and configured to generate light emissions, the at least one solid-state light emitter including an outer surface away from the sub-support; and a lens structure, arranged on the at least one solid-state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid-state light emitter, the lens structure comprising: a light diffusion portion, contacting the outer surface of the at least one solid-state light emitter; and a composite refractive index portion, arranged on the light diffusion portion, the composite refractive index portion including a first region having a first refractive index and a second region having a second refractive index different from the first refractive index, the first region covering less than the entire light diffusion portion.

[0045] In certain embodiments, a light diffusing portion of a lens includes a width that increases with distance from at least one solid-state light emitter and is bounded by at least one inclined or curved surface side having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of at least one solid-state light emitter and configured to reflect light toward one or more light exit surfaces of the lens structure.

[0046] In certain embodiments, the first region of the complex refractive index portion includes glass or sapphire.

[0047] In certain embodiments, the first region of the complex refractive index portion consists of air or at least one gas.

[0048] In some embodiments, the solid-state light emitting device also includes a sub-support to which at least one solid-state light emitter is mounted, wherein the width of the overall lens structure is no greater than the width of the sub-support at a position where the overall lens structure is arranged to contact the at least one solid-state light emitter.

[0049] In some embodiments, at least one solid-state light emitter includes an LED chip and a fluorescent material layer arranged on the outer surface of the LED chip, wherein the side edge surface of the LED chip is free of fluorescent material, and the solid-state light-emitting component also includes: a sub-support, to which at least one solid-state light emitter is mounted; and a filling material layer, including a filling material and contacting the side edge surface of at least one solid-state light emitter, the filling material including white or light-reflecting particles dispersed in an adhesive; wherein a portion of the fluorescent material overlaps with a portion of the filling material layer.

[0050] In certain embodiments, a light diffusing portion of a lens includes a width that increases with distance from at least one solid-state light emitter and is bounded by at least one inclined or curved surface side having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of at least one solid-state light emitter and configured to reflect light toward one or more light exit surfaces of the lens structure.

[0051] In certain embodiments, the first region of the complex refractive index portion includes glass or sapphire, or the first region of the complex refractive index portion consists of air or at least one gas.

[0052] In some embodiments, the solid-state light emitting device also includes a sub-support to which at least one solid-state light emitter is mounted, wherein the width of the overall lens structure is no greater than the width of the sub-support at a position where the overall lens structure is arranged to contact the at least one solid-state light emitter.

[0053] In some embodiments, at least one solid-state light emitter includes an LED chip and a fluorescent material layer arranged on the outer surface of the LED chip, wherein the side edge surface of the LED chip is free of fluorescent material, and the solid-state light-emitting component further includes: a sub-support, to which at least one solid-state light emitter is mounted; and a filling material layer, including a filling material and contacting the side edge surface of at least one solid-state light emitter, the filling material including white or light-reflecting particles dispersed in an adhesive; wherein a portion of the fluorescent material overlaps with a portion of the filling material layer.

[0054] In some embodiments, the fluorescent material layer, the filling material layer, and the light diffusing portion of the lens structure are substantially matched in terms of the coefficient of thermal expansion (CTE), so that the CTE difference between any two or more of the fluorescent material layer, the filling material layer, and the light diffusing portion is within a range of less than 20%.

[0055] In another aspect, any of the aforementioned aspects and / or the individual aspects and features described herein can be combined to achieve additional advantages. Unless otherwise indicated herein, any of the disclosed individual features and elements can be combined with one or more other disclosed features and elements.

[0056] Other aspects, features and embodiments of the present disclosure will be more fully apparent from the ensuing disclosure and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 is a simplified cross-sectional view of a first conventional solid-state light-emitting device, which includes an LED chip supported by a sub-support, wherein a fluorescent material layer covers the upper surface and the sub-support of the LED chip and covers the side surface of the LED chip, wherein a reflective material is arranged on a portion of the fluorescent material layer, and wherein superimposed arrows show a selected light beam emitted from the emission center of the LED chip.

[0058] Figure 2 is a simplified cross-sectional view of a second conventional solid-state light-emitting device, which includes an LED chip supported by a sub-support, wherein a fluorescent material layer covers the upper surface and side surfaces of the LED chip, and wherein a reflective material is arranged on the side surface portions of the sub-support and the fluorescent material layer.

[0059] FIG. 3A to FIG. 3F is a simplified cross-sectional view depicting steps in utilizing a sealing template in producing at least a portion of a solid-state light-emitting device (or subassembly) according to one embodiment, the device portion having a light-changing (e.g., fluorescent) material layer disposed over an upper surface of an LED chip supported by a sub-support, and over a portion of a first filling material layer contacting a side edge of the LED chip, wherein a second filling material layer contacts a side edge of the fluorescent material layer.

[0060] Figure 3G After forming a lens material having an outwardly curved shape on a portion of the fluorescent material layer and the second filling material layer, comprising Figure 3F A simplified cross-sectional view of a solid-state light emitting device showing a portion of the device.

[0061] FIG. 3H to FIG. 3I is a simplified cross-sectional diagram depicting the production process including Figure 3F Additional steps of the solid-state light emitting device of the device portion include forming a cavity disposed above the second filling material layer to define a raised reflector structure, and forming a lens material having an outwardly curved shape that contacts the fluorescent material layer and the walls of the raised reflector structure.

[0062] Figure 4is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, which includes an LED chip supported by a substrate, a first filling material contacting the side boundary of the LED chip, a fluorescent material layer contacting the upper surface of the LED chip and a portion of the first filling material, a cavity arranged above the first filling material layer to define an elevated reflector structure, and a lens material having a substantially hemispherical shape, the lens material contacting the wall of the elevated reflector structure and contacting the fluorescent material layer, suitable for producing focused light output emission.

[0063] Figure 5 is a simplified cross-sectional view of a portion of a solid state light emitting device similar to Figure 4 The solid state light emitting device shown in , but the lens material has a flat shape that is substantially aligned with the upper boundary of the raised reflector structure and is suitable for producing a dispersed light output emission.

[0064] Figure 6 is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting an upper surface of the substrate, at least one filling material contacting a side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens comprises a lower portion defined by a side edge having a width that increases as it moves away from the LED chip and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and wherein an upper portion of the lens has a substantially hemispherical shape.

[0065] Fig. 7A is a simplified cross-sectional view of a solid-state light emitting device according to one embodiment, the solid-state light emitting device being similar to Figure 6 The solid-state light emitting device shown in , but the upper part of the lens has a (flattened) part-spherical shape.

[0066] Figure 7B It shows that according to Fig. 7A A modeled ray trajectory diagram of a designed light beam pattern produced by a solid-state light emitting device.

[0067] Fig. 8AIt is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, which includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens includes a lower portion defined by a side edge, the side edge having a width that increases with the distance away from the LED chip and is configured to produce total internal reflection of light emission originating from the emission center of the LED chip, the lens includes an upper portion of the lens, the upper portion having a width that decreases with the distance to a small radius tip, and having a curved contour transition between the lower portion and the upper portion of the lens.

[0068] Figure 8B It shows that according to Fig. 8A A modeled ray trajectory diagram of a designed light beam pattern produced by a solid-state light emitting device.

[0069] Fig. 9A It is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device including an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens includes a lower portion defined by a side edge, the side edge having a width configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and the lens includes an upper portion of the lens, the upper portion having a width that decreases with distance away from the LED chip and terminates at a flat upper boundary, wherein a curved profile transition is provided at an interface between the upper portion and the lower portion of the lens.

[0070] Fig. 9B is shown similar to Fig. 9A A modeled ray trajectory diagram of a designed light beam pattern produced by a solid-state light emitting device.

[0071] Fig.10 This is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens comprises a lower portion defined by a side edge having a width configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and the lens comprises an upper portion of the lens having a width that decreases with a distance away from the LED chip, wherein a sharp boundary is provided between the upper portion and the lower portion of the lens.

[0072] Fig.11A It is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens comprises a lower portion defined by a side edge having a width configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and wherein an upper portion of the lens has a width that decreases as it moves away from the LED chip and terminates at a circular upper boundary, wherein the lower portion has a square profile (i.e., a top-down profile) when viewed from above, and the upper portion has a circular top-down profile with a transition from a square top profile to a circular top profile.

[0073] Fig. 11B Shows Fig.11A A solid-state light emitting device with a partial light-trace diagram superimposed thereon showing light beams emanating from three locations along the upper surface of the LED chip.

[0074] Fig.12 is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting an upper surface of the substrate, at least one filling material contacting a side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens has a width substantially greater than a width of the substrate, the lens comprises a lower portion defined by a side edge having a width that increases with a distance away from the LED chip and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and the lens comprises an upper portion having a substantially hemispherical shape.

[0075] Fig.13A This is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, which includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens is defined by a side edge having a width that increases as it moves away from the LED chip according to a curved profile and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and wherein an upper portion of the lens has a substantially hemispherical shape.

[0076] Fig. 13B is a partial ray trace diagram for an idealized lens similar to Fig.13A A solid-state light emitting device, but including a base with a continuous bend (rather than a truncated bend).

[0077] Fig.14A is a simplified cross-sectional view of a solid-state light emitting device according to an embodiment, the solid-state light emitting device is similar to Fig.13A The solid-state light emitting device shown in , further includes a constant width portion of the lens arranged at the distal end of the LED chip.

[0078] Fig. 14B is a partial ray trace diagram for an idealized lens similar to Fig.14A A solid-state light emitting device, but including a base with a continuous bend (rather than a truncated bend).

[0079] Fig.15 It is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens includes a first portion defined by a side edge near the LED chip, the side edge having a width that increases with the distance away from the LED chip according to a curved profile, and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, and the lens includes a second portion defined by a side edge away from the LED chip, the side edge having a width that increases with the distance away from the LED chip according to the curved profile, wherein the first lens portion and the second lens portion are partially or substantially hemispherical in shape.

[0080] Fig.16 It is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, which includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens defines a conical recess having a point close to the LED chip.

[0081] Fig.17A is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting an upper surface of the substrate, at least one filling material contacting a side boundary of the LED chip and the fluorescent material layer, and an integral lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens defines a central recessed shape of variable diameter therein, wherein the angled surface of the central recess is configured to produce total internal reflection of light to direct light emission to a side edge of the lens.

[0082] Fig. 17B It is shown by Fig.17A A modeled ray trajectory diagram of the pattern of a light beam produced when a solid-state light emitting device is positioned in an upward direction.

[0083] Fig.18A yes Fig.17A A cross-sectional view of a solid state light emitting device arranged within the cavity of a secondary reflector structure.

[0084] Fig.18B It is shown by Fig.18A Modeled ray trajectory diagram of the light beam pattern produced by the solid-state light emitting device and the secondary reflector structure.

[0085] Fig.19 is a modeled ray trace diagram showing the pattern of a light beam produced by a solid state light emitting device similar to Fig.17A A solid state light emitting device as shown in , but stretched in width and positioned in a downward direction.

[0086] Fig. 20 It is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, which includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens includes a first lobe and a second lobe defining a central groove, and each lobe has an outwardly curved light extraction surface.

[0087] Fig.21 is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device comprising an LED chip supported by a substrate, a fluorescent material layer contacting an upper surface of the substrate, at least one filling material contacting a side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, wherein the lens comprises a first portion defined by a side edge near the LED chip, the side edge having a width that increases with a distance away from the LED chip and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, wherein the lens comprises a second portion defined by a side edge away from the LED chip, the side edge having a constant width, and wherein an internal region (e.g., air) has a hemispherical shape and a refractive index different from that of the lens material arranged between the first portion and the second portion of the lens.

[0088] Fig.22AIt is a simplified cross-sectional view of a solid-state light-emitting device according to one embodiment, the solid-state light-emitting device includes an LED chip supported by a substrate, a fluorescent material layer contacting the upper surface of the substrate, at least one filling material contacting the side boundary of the LED chip and the fluorescent material layer, and an overall lens structure arranged to contact the fluorescent material layer and the at least one filling material, the lens includes a first portion defined by a side edge near the LED chip, the side edge having a width that increases as it moves away from the LED chip and is configured to produce total internal reflection of light emission originating from an emission center of the LED chip, the lens includes a second portion having a serrated side wall profile away from the LED chip, and the lens defines a central recess therein extending to a lowest point near the LED chip.

[0089] Fig. 22B It is shown by Fig.22A Ray trace diagram of the first modeling of a low-density pattern of light beams produced by a solid-state light emitting device.

[0090] Fig.23A Provides a Figure 5 Viewing angle (full width at half maximum) plots for multiple samples of a solid-state light-emitting device ("V9Flat") having a flat lens, a reflective cavity, an LED chip and a fluorescent material arrangement, and for multiple samples of a comparative device ("XPGB+") having a hemispherical lens arrangement deposited on a base structure including fluorescent material arranged on the side edge surface of the LED chip and between a sub-support and a reflective filling material (similar to FIG. 1 ).

[0091] Fig. 23B Provides Fig.23A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta).

[0092] Fig.23C Provides Fig.23A Bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid state light emitting device and a comparison device as a function of viewing angle (theta).

[0093] Fig.24A Provides a Fig.11A Viewing angle (full width at half maximum) graphs of multiple samples of a solid-state light-emitting device ("V29") and multiple samples of a comparison device ("XPGB+") having a similar lens arrangement but including a fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1).

[0094] Fig. 24B Provides Fig.24AThe average and standard deviation values ​​of the viewing angles of the same solid-state light-emitting device and the comparative device.

[0095] Fig.24C Provides Fig.24A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta).

[0096] Fig.24D Provides Fig.24A A bivariate fit of the relative intensity (dimensionless) of the same solid-state light emitting device and the comparison device as a function of viewing angle (theta), the bivariate fit being derived from Fig.24C Intensity data plotted in .

[0097] Fig.25A Provides a Fig. 7A Viewing angle (full width at half maximum) diagrams of multiple samples of a solid-state light-emitting device ("V41V40") having an outwardly curved lens and fluorescent material arrangement, and multiple samples for a comparative device ("XPGB+") having a similar lens arrangement but including fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1).

[0098] Fig.25B Provides Fig.25A The average and standard deviation values ​​of the viewing angles of the same solid-state light-emitting device and the comparative device.

[0099] Fig.25C Provides Fig.25A Bivariate fit of the luminous flux corrected by color point (CCx) for the same solid-state light emitting device and a comparison device.

[0100] Fig.25D Provides Fig.25A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta).

[0101] Fig.25E Provides Fig.25A A bivariate fit of the relative intensity (dimensionless) of the same solid-state light emitting device and the comparison device as a function of viewing angle (theta), the bivariate fit being derived from Fig.26D Intensity data plotted in .

[0102] Fig.25F Provides Fig.25A Bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid state light emitting device and a comparison device as a function of viewing angle (theta).

[0103] Fig.26A Provides a Fig.17A Viewing angle (full width at half maximum) graphs of multiple samples of a solid-state light-emitting device ("V24lnvCone") having a conical recess defined in an integral lens arranged above an LED chip and a fluorescent material arrangement, and multiple samples of a comparison device ("XPGB+") having a similar lens arrangement but including fluorescent material arranged on the side edge surface of the LED chip and between a sub-support and a reflective filling material (similar to FIG. 1).

[0104] Fig.26B Provides Fig.26A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta).

[0105] Fig.26C Provides Fig.26A Bivariate fit of the relative intensity (dimensionless) of the same solid-state light emitting device and a comparative device as a function of viewing angle (theta).

[0106] Fig.26D Provides Fig.26A Bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid state light emitting device and a comparison device as a function of viewing angle (theta).

[0107] Fig.27A Provides a Figure 4 Viewing angle (full width at half maximum) graphs for multiple samples of a solid-state light-emitting device ("V8Dome") having a hemispherical lens, a reflective cavity, an LED chip and a fluorescent material arrangement, and multiple samples of a comparative device ("XPGB+") having a hemispherical lens arrangement deposited on a base structure, the base structure including fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1).

[0108] Fig.27B Provides Fig.27A The average and standard deviation values ​​of the viewing angles of the same solid-state light-emitting device and the comparative device.

[0109] Fig.27C Provides Fig.27A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta).

[0110] Fig.27D Provides Fig.27A Bivariate fit of the relative intensity (dimensionless) of the same solid-state light emitting device and a comparative device as a function of viewing angle (theta).

[0111] Fig.27E Provides Fig.27A Bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid state light emitting device and a comparison device as a function of viewing angle (theta). DETAILED DESCRIPTION

[0112] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments, and illustrate the best mode for practicing these embodiments. After reading the following description with reference to the accompanying drawings, those skilled in the art will understand the concepts of the present disclosure, and will recognize the applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of the present disclosure and the appended claims.

[0113] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. As used herein, the term "and / or" includes any and all combinations of one or more associated listed items.

[0114] It will be understood that when an element such as a layer, a zone, or a substrate is referred to as being "on" or extending "on" another element, it may be directly on the other element, or extend directly onto the other element, or there may also be an intervening element. In contrast, when an element is referred to as being "directly on" another element or extending "directly" to another element, there are no intervening elements. Similarly, it will be understood that when an element such as a layer, a zone, or a substrate is referred to as being "on" another element or extending "on" another element, it may be directly on the other element or extend directly on the other element, or there may also be an intervening element. In contrast, when an element is referred to as being "directly on" another element or extending "directly on" another element, there are no intervening elements. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intervening element. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0115] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe the relationship of one element, layer or region to another element, layer or region as shown in the figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.

[0116] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that the terms "comprise", "comprising", "include", and / or "including" when used herein specify the presence of the described features, wholes, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts, and / or groups thereof.

[0117] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that the terms used herein should be interpreted as having the same meaning as they have in the context of this specification and in the relevant field, and will not be interpreted as idealized or overly formal meanings unless explicitly defined as such herein.

[0118] Embodiments are described herein with reference to schematic illustrations of embodiments of the present disclosure. Therefore, the actual size of layers and elements may be different, and due to, for example, manufacturing technology and / or tolerances, variations from the illustrated shape are expected. For example, a region shown or described as a square or rectangle may have circular or curved features, and a region shown as a straight line may have some irregularities. Therefore, the regions shown in the figures are schematic, and their shapes are not intended to illustrate the precise shape of the region of the device, and are not intended to limit the scope of the present disclosure. In addition, for illustrative purposes, the size of a structure or region may be exaggerated relative to other structures or regions, and the size of the structure or region is therefore provided to illustrate the general structure of the subject, and the size of the structure or region may or may not be drawn to scale. Common elements between figures may be illustrated herein using common element numbers, and may not be repeatedly described subsequently.

[0119] Before delving into the specific details of various aspects of the present disclosure, an overview of various elements that may be included in an exemplary LED of the present disclosure is provided for context. An LED chip typically includes an active LED structure or region that may have many different semiconductor layers arranged in different ways. The manufacture and operation of LEDs and their active structures are generally known in the art and are only briefly discussed herein. The layers of the active LED structure may be made using known processes, wherein a suitable process is the manufacture using metal organic chemical vapor deposition. The layers of the active LED structure may include many different layers, and typically include an active layer sandwiched between oppositely doped n-type and p-type epitaxial layers, all of which are continuously formed on a growth substrate. It should be understood that additional layers and elements may also be included in the active LED structure, including but not limited to buffer layers, nucleation layers, superlattice structures, undoped layers, cladding layers, contact layers, and current diffusion layers and light extraction layers and elements. The active layer may include a single quantum well, a multiple quantum well, a double heterostructure, or a superlattice structure.

[0120] Active LED structures can be made from different material systems, some of which are based on Group III nitride material systems. Group III nitrides refer to those semiconductor compounds formed between nitrogen (N) and elements in Group III of the periodic table, typically aluminum (Al), gallium (Ga), and indium (In). Gallium nitride (GaN) is a common binary compound. Group III nitrides also refer to ternary and quaternary compounds, such as aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), and aluminum indium gallium nitride (AlInGaN). For Group III nitrides, silicon (Si) is a common n-type dopant, and magnesium (Mg) is a common p-type dopant. Therefore, for Group III nitride-based material systems, the active layer, n-type layer, and p-type layer can include one or more layers of GaN, AlGaN, InGaN, and AlInGaN that are undoped or doped with Si or Mg. Other material systems include silicon carbide (SiC), organic semiconductor materials, and other III-V systems such as gallium phosphide (GaP), gallium arsenide (GaAs), indium phosphide (InP), and related compounds.

[0121] The active LED structure can be grown on a growth substrate, which can include many materials, such as sapphire, SiC, aluminum nitride (AlN), GaN, GaAs, glass, or silicon. SiC has certain advantages over other substrates, such as a closer lattice match to III-nitrides, and forms high-quality III-nitride films. SiC also has very high thermal conductivity, so that the total output power of III-nitride devices on SiC is not limited by the heat dissipation of the substrate. Sapphire is another common substrate for III-nitrides and also has certain advantages, including lower cost, mature manufacturing processes, and good light-transmitting optical properties.

[0122] Different embodiments of the active LED structure can emit light of different wavelengths depending on the composition of the active layer and the n-type and p-type layers. In some embodiments, the active LED structure emits blue light having a peak wavelength range of approximately 430 nanometers (nm) to 480 nm. In other embodiments, the active LED structure emits green light having a peak wavelength range of 500 nm to 570 nm. In other embodiments, the active LED structure emits red light having a peak wavelength range of 600 nm to 650 nm. In certain embodiments, the active LED structure can be configured to emit light outside the visible spectrum, including one or more portions of the ultraviolet (UV) spectrum.

[0123] The LED chip may also be covered with one or more fluorescent materials (also referred to herein as fluorophores) such as phosphors, so that at least some of the light from the LED chip is absorbed by the one or more fluorophores and converted into one or more different wavelength spectra according to the characteristic emission from the one or more fluorophores. In this regard, at least one fluorophore that receives at least a portion of the light generated by the LED source may re-emit light having a peak wavelength different from the LED source. The LED source and the one or more fluorophores may be selected so that their combined output forms light having one or more desired characteristics such as color, color point, intensity, spectral density, etc. In some embodiments, the aggregate emission of the LED chip, optionally combined with the one or more fluorophores, may be arranged to provide cool white light, neutral white light, or warm white light, such as within a color temperature range of 2500 Kelvin (K) to 10,000K. In some embodiments, fluorophores having cyan, green, amber, yellow, orange, and / or red peak wavelengths may be used. In some embodiments, the combination of the LED chip and the one or more fluorophores (e.g., phosphors) emits a substantially white light combination. The one or more phosphors may include yellow (eg, YAG:Ce), green (eg, LuAg:Ce), and red (eg, Ca i-x-y Sr x Eu yIn other embodiments, the LED chip and the corresponding fluorescent material can be configured to emit converted light mainly from the fluorescent material, so that the aggregate emission includes almost no perceptible emission corresponding to the LED chip itself.

[0124] Fluorescent materials as described herein may be or may include one or more of phosphors, scintillators, fluorescent inks, quantum dot materials, daylight strips, and the like. Fluorescent materials may be provided in any suitable manner, such as directly coated on one or more surfaces of an LED, dispersed in an encapsulation material configured to cover one or more LEDs, and / or coated on one or more optical or supporting elements (e.g., by powder coating, inkjet printing, etc.). In some embodiments, the fluorescent material may be down-converted or up-converted, and a combination of down-conversion materials and up-conversion materials may be provided. In some embodiments, a plurality of different (e.g., different in composition) fluorescent materials arranged to produce different peak wavelengths may be arranged to receive emission from one or more LED chips. One or more fluorescent materials may be arranged on one or more portions of an LED chip in various configurations. In some embodiments, one or more fluorescent materials may be arranged on or above one or more surfaces of an LED chip in a substantially uniform manner. In other embodiments, one or more fluorescent materials may be arranged on or above one or more surfaces of an LED chip in an inhomogeneous manner with respect to one or more of the material composition, concentration, and thickness. In some embodiments, the loading percentage of one or more fluorescent materials can vary on or between one or more outer surfaces of an LED chip. In some embodiments, one or more fluorescent materials can be patterned on portions of one or more surfaces of an LED chip to include one or more stripes, dots, curves, or polygonal shapes. In some embodiments, a variety of fluorescent materials can be arranged in different discrete regions or discrete layers on or above an LED chip.

[0125] As used herein, a layer or region may be considered "transparent" when at least 80% of the emitted radiation incident on a layer or region of a light emitting device is emitted through the layer or region. In addition, as used herein, a layer or region may be considered "reflective" or embodied as a "mirror" or "reflector" when at least 80% of the emitted radiation incident on a layer or region of an LED is reflected. In some embodiments, the emitted radiation includes visible light, such as blue and / or green LEDs with or without fluorescent materials. In other embodiments, the emitted radiation may include invisible light. For example, in the context of GaN-based blue and / or green LEDs, silver (Ag) may be considered a reflective material (e.g., at least 80% reflective). In the case of UVLEDs, appropriate materials may be selected to provide desired, and in some embodiments high, reflectivity and / or desired, and in some embodiments low absorptivity. In certain embodiments, a "light-transmitting" material may be configured to transmit at least 50% of the emitted radiation of a desired wavelength.

[0126] The LED package may include one or more elements, such as fluorescent materials and electrical contacts, which are provided with one or more LED chips on a support member, such as a sub-support or a lead frame. Suitable materials for the sub-support include, but are not limited to, ceramic materials, such as alumina or alumina, AlN, or organic insulators, such as polyimide (PI) and polyphthalamide (PPA). In other embodiments, the sub-support may include a printed circuit board (PCB), sapphire, Si, or any other suitable material. For PCB embodiments, different PCB types may be used, such as a standard FR-4 PCB, a metal core PCB, or any other type of PCB. In still other embodiments, the support structure may be embodied as a lead frame structure. The light-changing material may be arranged within the LED package to reflect or otherwise redirect light from one or more LED chips in a desired emission direction or pattern.

[0127] As used herein, "light-changing material" can include many different materials, including light-reflecting materials that reflect or redirect light, scattered light, light-absorbing materials that absorb light, fluorescent materials, and materials that act as thixotropic agents. As used herein, the term "light reflection" refers to materials or particles that reflect, refract, scatter, or otherwise redirect light. For light-reflecting materials, light-changing materials can include at least one of fused silica, fumed silica, titanium dioxide (TiO2), or metal particles suspended in an adhesive such as silicone or epoxy. In some aspects, particles can have a refractive index or refraction configured to refract light emission in a desired direction. In some aspects, light-reflecting particles can also be referred to as light-scattering particles. Depending on the desired viscosity before solidification, the weight ratio of light-reflecting particles or scattering particles to adhesive can include a range of about 0.15:1 to about 0.5:1, or in a range of about 0.5:1 to about 1:1, or in a range of about 1:1 to about 2:1. For light absorbing materials, the light changing material may include at least one of carbon, silicon or metal particles suspended in a binder such as silicone or epoxy. The light reflecting material and the light absorbing material may include nanoparticles. In some embodiments, the light changing material may include a substantially white color to reflect and redirect light. In other embodiments, the light changing material may include a generally opaque color such as black or gray for absorbing light and increasing contrast. In some embodiments, the light changing material includes both the light reflecting material and the light absorbing material suspended in a binder.

[0128] According to various embodiments, the solid-state light emitting device disclosed herein includes a lens structure arranged on a base portion or a subassembly, wherein the base portion or the subassembly includes at least one solid-state emitter mounted on a sub-support, wherein at least one filling material contacts the side edge of the at least one solid-state emitter. The at least one solid-state emitter may include an LED chip mounted on a sub-support, or may include an LED chip covered with a fluorescent material and mounted on a sub-support. In the latter case, the LED is mounted on a sub-support having a first surface, and a fluorescent material layer is applied over the entire outer surface of the at least one LED, which is away from (i.e., opposite to) the first surface, wherein the side edge of the at least one LED is free of fluorescent material, and at least one filling material layer contacts the side surface of the at least one LED (wherein the filling material layer may also contact the side boundary of the fluorescent material layer). In some embodiments, the base portion or the subassembly can be made by the following steps: applying a filling material layer to contact the side surface of at least one LED mounted on the sub-support, adhering a sealing template on or above the filling material, and applying a fluorescent material through a window defined in the sealing template to form a light-changing material layer on the at least one LED, and removing the sealing template from the filling material.

[0129] Previous templates used or tested by applicants (e.g., stencil templates, three-dimensional printed templates, etc.) have various disadvantages that limit their usefulness, such as allowing light-altering material to pass between the template and the underlying layer, or tending to cause the light-altering material to adhere to the template walls, resulting in poor control over the area of ​​the light-altering material remaining in the underlying layer. However, localized deposition of phosphor materials over LEDs arranged on a substrate without the use of a template is also difficult because surface effects (e.g., surface tension tends to cause meniscus formation) tend to prevent the phosphor mixture from covering the entire emitting area of ​​the LED (including its corners), and / or tend to form domed phosphor deposits that are non-uniform in thickness (i.e., thicker at the center of the LED chip than near its edges).

[0130] In some embodiments, the sealing template includes a carrier layer (e.g., a film) and an adhesive layer, which can be provided in the form of an adhesive tape. In some embodiments, the carrier layer is configured to transmit ultraviolet (UV) spectral emission, and the adhesive layer can include a UV release adhesive that exhibits a reduction or loss of viscosity when exposed to UV spectral emission. One or more windows can be defined in the sealing template by any suitable method, such as laser cutting, blade cutting, stamping, pressing, etc.

[0131] In some embodiments, a window-defining template can be applied to the lower layer by pressing with sufficient force to engage the adhesive layer with the lower layer (e.g., a window in the template is aligned with one or more LEDs supported by the lower layer). Thereafter, a fluorescent material can be applied through the window (e.g., by spraying, dispensing, jet pumping, or other deposition methods). In some embodiments, the sealing template can include a thickness substantially equal to the desired deposition thickness of the fluorescent material. Optionally, any excess thickness of the fluorescent material can be removed by dragging a skimming member (e.g., a silicone or rubber blade, such as a scraper) over the outer surface of the sealing template.

[0132] After depositing the fluorescent material, the template can be exposed to UV radiation so that the adhesive layer of the template exhibits reduced viscosity. Thereafter, the template can be removed from the underlying layer by pulling (e.g., from its edge) so that the fluorescent material previously deposited through the window in the template remains on the target surface after the template is removed. The ability to reduce the viscosity of the adhesive layer after the material deposition is completed enables the sealing template to be cleanly released from the underlying layer without leaving adhesive residue or causing accidental removal of fluorescent material that would otherwise be laterally adhered to the window edge of the sealing template. Providing fluorescent material only in the intended area helps to achieve a uniform color point over the entire emission area and can improve brightness levels and / or uniformity. In some embodiments, multiple layers of fluorescent material can be applied sequentially in the same (overlapping) or different (non-overlapping) areas, including through a single window of the sealing template or through different windows defined in a multi-window sealing template.

[0133] After forming a base portion or subassembly containing at least one solid-state light emitter, a lens may be formed or otherwise applied above the solid-state light emitter and any surrounding filler material layers after forming an elevated reflector structure on the base portion or subassembly. In some embodiments, the lens may be formed directly on the base portion or subassembly by molding, three-dimensional printing, jet pumping, localized dispensing, etc. In some embodiments, an elevated reflector structure defining a cavity may be formed above the base portion or subassembly, and at least a portion of the lens may be deposited into the cavity. In some embodiments, the lens may be prefabricated in one or more parts (e.g., by molding, cleaving, cutting, machining, or other fabrication methods) and applied together or separately to the base portion or subassembly with a suitable adhesive (e.g., an optical grade silicone adhesive). In some embodiments, a portion or all of the lens may include silicone and may be made by techniques such as molding. In some embodiments, a portion or all of the lens may include an amorphous or crystalline rigid material (e.g., glass, sapphire, etc.) and may be made by cleaving, cutting, or machining and then adhered to the underlying structure. In certain embodiments, at least a portion of a lens can be prefabricated, applied to an underlying base material or subassembly, and a molding step can then be performed to facilitate attachment and / or formation of any additional mold portions, wherein the foregoing method can be referred to as "pick and place and mold." In certain embodiments, at least a portion of a prefabricated lens can be applied to an underlying base portion or subassembly and then flooded (e.g., along at least a lower peripheral portion thereof) with silicone or silicone loaded with titanium dioxide or another reflective material, wherein the foregoing method can be referred to as "pick and place and flood." The "pick and place and flood" method beneficially avoids the formation of any mold flash and, therefore, can promote improved manufacturability.

[0134] In some embodiments, the lens is characterized as being unitary, meaning that it embodies a single continuous structure. In some embodiments, the integral lens is made as one component, while in some other embodiments, the integral lens can be made as multiple components that are connected (e.g., bonded or adhered) to each other. In some embodiments, the integral lens is a non-Lambertian lens. Lambertian lenses tend to diffuse or scatter light uniformly in all directions, rather than directing light in a specular direction. The apparent brightness or radiance of a Lambertian surface to an observer is the same regardless of the observer's viewing direction or viewing angle. In this regard, non-Lambertian lenses are used to direct light in a specular direction without diffusing light in all directions.

[0135] In certain embodiments, the lens comprises one or more surfaces (e.g., inclined or curved surfaces) having an orientation configured to produce total internal reflection of a portion of the light emission originating from the emission center of at least one solid-state light emitter of the solid-state light emitting component, and is configured to direct light toward one or more light exit surfaces of the solid-state light emitting component. TIR is an optical phenomenon in which a wave reaching an interface (or boundary) of a second medium from a first medium is not refracted into the second medium, but is completely reflected back into the first medium. TIR occurs when the second medium has a lower refractive index than the first medium and the wave is incident on the interface between the media at a sufficiently oblique angle (called the critical angle). As some examples, optical grade silicone and glass have a refractive index of about 1.5; air has a refractive index of about 1; and water has a refractive index of about 1.33. The first medium and the second medium can be independently selected from solids, liquids, and gases. For visible light, the critical angle from water incident into air is about 49°, from ordinary glass incident into air is about 42°, and from optical grade silicone incident into air is 41.8°. In certain embodiments, one or more surfaces of a lens configured to produce TIR of emissions from a solid state light emitter are bounded by air, or by a solid material having a refractive index different than that of the lens material.

[0136] In some embodiments, at least a first portion of the lens proximate to at least one solid-state light emitter has a width that increases with distance away from the solid-state light emitter. Such a portion of the lens can constitute a light diffusion region. In some embodiments, additional (e.g., second, third, etc.) portions of the lens that provide different light guiding or light shaping functions can be provided on the first portion (e.g., connected to the first portion).

[0137] In some embodiments, the sloped or curved surface of a lens configured to produce TIR of emissions from a solid state light emitter includes a peripheral edge surface of at least a first portion of the lens (ie, having a width that increases with distance from the solid state light emitter).

[0138] In some embodiments, the overall lens structure defines a recess, and an inclined or curved surface of a lens configured to produce TIR of an emission of a solid-state light emitter defines at least a portion of the recess or groove. In such embodiments, the inclined or curved surface of the lens can be configured to direct light emission toward one or more light exit surfaces disposed at a side edge (e.g., a side) of the lens structure. Although recesses of various shapes are within the scope of the present disclosure, in some embodiments, the recess can be shaped as an inverted pyramid, an inverted cone, or a groove (e.g., having a substantially V-shaped or U-shaped cross-section). The recess can be formed by any suitable method (such as molding, machining, water jet cutting, laser ablation, chemical treatment, etc.).

[0139] In some embodiments, the overall lens structure may include a first portion proximate to a solid-state light emitter, the first portion having a width that increases with distance away from the solid-state light emitter, and the overall lens structure further defines a recess, wherein a first inclined or curved surface configured to produce TIR of emission from the solid-state emitter may be disposed at a peripheral edge surface of the first portion, and a second inclined or curved surface configured to produce TIL of emission from the solid-state emitter may be arranged to define the recess.

[0140] In certain embodiments, the integral lens structure is arranged to be in physical contact with at least one solid state light emitter (e.g., a surface of an LED chip or a layer of fluorescent material coated on an LED chip, optionally separated by one or more layers of optically clear material). The foregoing features provide a basis for distinguishing secondary optics from conventional solid state devices, as such optics are typically not in direct contact with the solid state light emitters. In certain embodiments, the solid state light emitters are mounted to a submount, and the integral lens includes a width no greater than the width of the submount at the chip mounting area where the integral lens structure is arranged to be in contact with at least one solid state light emitter. This provides another basis for distinguishing conventional secondary optics, which are typically wider than the associated solid state light emitting component. In certain embodiments, the integral lens structure is substantially matched in coefficient of thermal expansion (CTE) to an underlying article (such as a fluorescent material layer and / or a filler material layer), such that the CTE difference between any two or more of the fluorescent material layer, the filler material layer, and the lens material is in the range of less than 20%. In certain embodiments, substantial CTE matching can be achieved by forming a lens material, a fluorescent material, and a filling material of the same base material (e.g., a binder material such as silicone, epoxy, or another polymer material), wherein the fluorescent material layer can have fluorescent particles dispersed in the binder material, the filling material can have reflective particles dispersed in the binder material, and the lens material can consist essentially of the binder material without light-altering particles). This CTE matching can enhance the reliability and useful life of high-intensity solid-state light-emitting devices. Substantial CTE matching between the lens material and the underlying layers provides another potential basis for differentiating traditional secondary optical devices.

[0141] To provide a background for the embodiments described herein, a conventional solid-state light emitting device will be described in conjunction with FIGS. 1 and 2 before describing the embodiments of the present disclosure in conjunction with the remaining figures.

[0142] 1 is a simplified cross-sectional view of a first conventional solid-state light emitting device 10 including an LED chip 16 supported by a submount 12, wherein a first phosphor layer portion 20 contacts a top or outer surface 18 of the LED chip 16, wherein a second phosphor layer portion 20A contacts a side edge surface 19 of the LED chip 16, and a third phosphor layer portion 20B contacts a portion of a first (upper) surface 14 of the submount 12 extending away from the LED chip 16. During fabrication of the device 10, phosphor material may be applied over the outer edge surface 18 and the side edge surface 19 of the LED chip 16 and the submount 12 before providing a reflective material 25. The submount 12, which may be embodied as a substrate, includes a second (lower) surface 13 opposite the first surface 14 contacting the LED chip 16. The reflective material 25 is disposed laterally adjacent to the LED chip 16 in contact with the second phosphor layer portion 20A and the third phosphor layer portion 20B. Although it should be understood that light is generally emitted from the LED chip 16 in all directions, three light beams (i.e., Bai, Ba2, and Bas) are shown in FIG1 as being emitted from the center point of the LED chip at low, medium, and high emission angles a1, a2, and a3, respectively. The light beam Bai having the low emission angle a1 may be wavelength converted in the third fluorescent layer portion 20B and captured between the sub-support 14 and the third fluorescent layer portion 20B without being emitted from the light emitting device 10. The light beam Ba2 having the medium emission angle a2 may be wavelength converted in the second fluorescent layer portion 20A and reflected by the reflective material 25 back to the LED 16 or reflected outwardly through the first fluorescent layer portion 20. The light beam Ba3 having the high emission angle a3 may be wavelength converted in the first fluorescent layer portion 20 and be emitted from the light emitting device 10, wherein the first light emitting layer portion 20 defines a light emitting surface of the device 10.

[0143] FIG2 is a simplified cross-sectional view of a second conventional solid-state light emitting device 11 including an LED chip 16 supported by a sub-mount 12, wherein a first fluorescent material layer portion 20 contacts a top or outer surface 18 of the LED chip 16, and wherein a second fluorescent layer portion 20A contacts a side edge surface 19 of the LED chip 16. The sub-mount 12 (which may be embodied as a substrate) includes a second (lower) surface 13 opposite to a first surface 14 of the sub-mount 12 that contacts the LED chip 16. A reflective material 25 is disposed laterally adjacent to the LED chip 16, contacting the second fluorescent layer portion 20A and a portion of the upper surface. The absence of fluorescent material between the sub-mount 12 and the reflective material 25 eliminates photon capture between the sub-mount 12 and the reflective material 2 (thereby improving the light emitting efficiency of the solid-state light emitting device 11 relative to the device 10 shown in FIG1), but the presence of the second fluorescent material portion 20A still results in suboptimal light emitting efficiency.

[0144] Unlike the conventional light emitting devices 10 and 11 described in conjunction with FIGS. 1 and 2 , the solid-state light emitting devices according to various embodiments of the present disclosure include a lens structure disposed on a base structure or subassembly including at least one solid-state light emitter, wherein, if a fluorescent material is present, such fluorescent material is deposited on the top surface of the LED chip, wherein the side surfaces of the LED chip contact the reflective material and are free of fluorescent material. This configuration can be achieved by applying the fluorescent material during the fabrication of the base structure using a sealing template before applying or forming the lens structure.

[0145] FIG. 3A to FIG. 3F is a simplified cross-sectional diagram depicting steps in utilizing a sealing template in producing at least a base or subassembly portion of a solid state light emitting device according to one embodiment.

[0146] Figure 3A An LED chip 16 is shown mounted on a first (upper) surface 14 of a submount 12, wherein the LED chip 16 has a top or outer surface 18 (disposed distally of the first surface 14 of the submount 12) and has a side edge surface 19. In some embodiments, the LED chip 16 can have a flip-chip configuration, wherein mounting the LED chip 16 to the first surface 14 of the submount can involve making electrical connections between anode and cathode contacts (not shown) of the LED chip 16 and contact pads (not shown) of the submount 12.

[0147] Figure 3B Shows Figure 3A The item after adding a filling material layer 30 over the sub-support 12 to contact the side edge surface 19 of the LED chip 16, wherein the top surface or outer surface 18 of the LED chip 16 remains exposed. In some embodiments, the filling material 30 includes a reflective material, such as white (e.g., titanium dioxide or TiO2) particles contained in a silicone adhesive. The filling material layer 30 can be applied by any suitable method, such as jet pumping, screen printing, dispensing, spraying, etc., optionally followed by a skimming step (e.g., using a rubber blade or scraper) to remove excess thickness of the filling material. In some embodiments, the filling material layer 30 includes a lower boundary 31 that contacts the sub-support 12 and includes an upper boundary 32 arranged at substantially the same height or level as the top surface 18 of the LED chip 16. In some embodiments, one or more secondary components (e.g., electrostatic discharge diodes) (not shown) that are lower in height than the LED chip 16 can also be supported by the sub-support 12 and can be encapsulated in the filling material layer 30. As Figure 3B As shown, in some embodiments, the upper boundary 32 of the fill material 30 can be substantially coplanar with the exposed outer surface 18 of the LED chip 16 to create a continuous planar surface.

[0148] Figure 3CThe sealing template 35 is added on the filling material layer 30. Figure 3B The sealing template 35 includes a carrier layer 36 and an adhesive layer 37. The sealing template 35 can be applied by pressing using a flat member and / or one or more rollers (not shown). The sealing template 35 defines a window 38 (e.g., a pre-cut window) that is larger than the LED chip 16 but is generally aligned with the LED chip, wherein the window 38 also overlaps the LED adjacent portion 32A of the filling material layer 30. In some embodiments, the carrier layer 36 includes a material that transmits UV spectrum emission, and the adhesive layer 37 includes a UV release adhesive material. The top surface or outer surface 18 of the LED chip 16 is exposed through the window 38 defined in the sealing template 35.

[0149] Figure 3D The top or outer surface 18 of the LED chip 16 is shown after applying (using a deposition device 39) a layer of fluorescent material 40 through the window defined in the template 35 to be deposited on the top or outer surface 18 of the LED chip 16. Figure 3C . As shown, the fluorescent material layer 40 is arranged over the entire outer surface 18 of the LED chip and also overlaps the top surface portion 32A adjacent to the LED of the filling material layer 30, so that the fluorescent material layer 40 is wider than the top surface or outer surface 18 of the LED chip 16. Providing a fluorescent material layer 40 that is wider than the top surface or outer surface 18 of the LED chip 16 ensures that any emitting portion of the LED chip 16 (including its upper corners) will not escape without interacting with the fluorescent material layer 40, thereby enhancing the uniformity of the color point of the emission produced over the emission area of ​​the solid-state light-emitting device. In some embodiments, the fluorescent material layer 40 includes a fluorescent material in a silicone adhesive (for example, an exemplary fluorescent material weight percentage is about 66%). Any suitable method can be used to apply the fluorescent material layer 40, such as spraying, dispensing, jet pumping, etc. Optionally, any excess thickness of the fluorescent material 40 can be removed by dragging a skimming member (not shown) on the carrier layer 36 of the sealing template 35. After applying the fluorescent material 40, such material may be cured and solidified, such as by heating, electromagnetic radiation, and / or other means.

[0150] Although only a single fluorescent material layer 40 is shown, it should be understood that multiple fluorescent material layers can be applied sequentially in the same (overlapping) or different (non-overlapping) areas, including through a single window of a sealing template or through different windows defined in a multi-window sealing template.

[0151] After (or during) the curing of the fluorescent material, UV emission from an external source (not shown) can impinge on the sealing template 35 to reduce the viscosity of the adhesive layer 37. Thereafter, the sealing template 35 can be removed (e.g., by mechanical pulling) from the filling material 30. Reducing the viscosity of the adhesive layer 37 before removing the sealing template 35 beneficially reduces the likelihood that adhesive residue will remain on the underlying filling material 30, and also reduces the likelihood that the fluorescent material 40 will remain laterally adhered to the boundaries of the window 38 defined in the sealing template 35, so that when the sealing template 35 is removed from the underlying filling material 30, portions of the fluorescent material 40 are not removed, and clean side edges 41 of the fluorescent material 40 are retained. Figure 3E Shown after removing the sealing template 35 Figure 3D , wherein the fluorescent material overlaps the entire top surface or outer surface 18 of the LED chip 16 and the LED adjacent top surface portion 32A of the filling material layer 30, while the remaining top surface portion 32B of the filling material layer 30 is exposed. As shown, the side edge surface 19 of the LED chip 16 is completely covered by the filling material 30, and there is no fluorescent material, and no fluorescent material is disposed between the filling material 30 and the sub-support 12.

[0152] Figure 3F Shows Figure 3EItem after adding a second filler material layer 45 to contact the side edge 41 of the fluorescent material 40 (which overlaps the outer surface 18 of the LED chip 16 and the LED adjacent top surface portion of the filler material layer 30) to contact the remaining top surface portion 32B of the filler material layer 30 to produce a solid state light emitting device portion or subassembly 50. In some embodiments, the second filler material layer 45 includes a reflective material (e.g., titanium dioxide in a silicone adhesive, wherein an exemplary titanium dioxide weight percentage is about 15%). In some embodiments, the second material layer 45 includes a height substantially the same as the height of the light changing material layer 40. In some embodiments, the second filler material layer 45 includes substantially the same composition as the (first) filler material layer 30. In some embodiments, the second filler material layer 45 and the filler material layer 30 both include a reflective material in an adhesive, wherein the filler material layers 30, 45 can have the same or different reflectivity values. In some embodiments, the second filler material layer 45 includes a reflective material and / or a scattering material in an adhesive (e.g., silicone), and the filler material layer 30 includes a reflective material in an adhesive (e.g., silicone). The second filler material layer 45 can be used to scatter and / or reflect light that escapes through the side boundaries 41 of the light-altering material layer 40, so that in some embodiments, a desired beam cutoff pattern and / or improved luminous efficiency can be provided. The solid-state light emitting subassembly 50 is suitable for forming a variety of solid-state light-emitting devices that include a lens in contact with a fluorescent material layer (with or without an optional clear layer in between), wherein such a lens can be optionally retained in a reflector cavity of various sizes and shapes.

[0153] Continue to refer Figure 3F In some embodiments, the sub-support 12 includes a ceramic material, the LED chip 16 includes a semiconductor material (e.g., a group III nitride material on a sapphire or silicon carbide substrate), and the remaining layers of the solid-state light-emitting subassembly 50 (including the filling material layer 30, the fluorescent material layer 40, and the second filling material layer 45) are substantially matched in terms of thermal expansion coefficient (CTE) characteristics, wherein the "substantially matching" of the CTE characteristics can be reflected as a CTE difference between the layers of less than 20%, less than 15%, less than 10%, less than 5%, or less than 2%. In some embodiments, the filling material layer 30, the fluorescent material layer 40, and the second filling material layer 45 can include the same binder (e.g., silica gel), which is loaded with particles of the same or different components and has the same or different concentrations. Optionally, in some embodiments, a clear (transparent) layer can be disposed on the second filling material layer 45 and the fluorescent material layer 40.

[0154] Figure 3G The lens material 55 is formed on the entire fluorescent material layer 40 and the second filling material layer 45. Figure 3FThe solid-state light-emitting component 51 of the solid-state light-emitting subassembly 50. The lens material 65 has an outwardly curved (convex, partially hemispherical) shape. In some embodiments, the lens material 55 can be formed by dispensing the material over the solid-state light-emitting component 50 (optionally dispensed into a cavity of a mold, not shown) and then by curing, and the lens material 55 includes silicone (or another material that is substantially CTE-matched with the filling material layer 30, the fluorescent material layer 40, and the second filling material layer 30).

[0155] Figure 3H Shows Figure 3F The solid-state light emitting subassembly 50 after forming an elevated reflector structure 52 above the second filler material layer 45. The elevated reflector structure 52 includes an inclined reflector wall 54 that defines a reflector cavity 53. In some embodiments, the elevated reflector structure 52 includes reflective particles (e.g., titanium dioxide) in a silicone adhesive. In some embodiments, a portion of the elevated reflector structure 52 can overlap with a peripheral portion of the light-changing material layer 40, preferably without overlapping with the LED chip 16.

[0156] Fig. 3I The reflector cavity 53 is shown after adding lens material 65 to contact the angled reflector wall 54. Figure 3H Items (i.e., solid-state light emitting subassembly 50 and elevated reflector structure 52) of the solid-state light emitting component 61. As shown, the lens material 65 is arranged to contact the fluorescent material 40 and the reflector wall 54, and the lens material 65 includes an outwardly curved (convex) outer surface 66, through which light is extracted (i.e., emitted) from the device 51. In some embodiments, the lens material 65 includes silicone. In some embodiments, the lens material 65 is substantially CTE matched with the elevated reflector structure 52, and optionally can be substantially CTE matched with the remaining device layers (i.e., the filling material layer 30, the fluorescent material layer 40, and the second filling material layer 45), wherein, in some embodiments, each of the aforementioned items can include silicone (whether or not loaded with particulate material).

[0157] Although the embodiments described above include filler materials that laterally bound a layer of light-altering (e.g., fluorescent) material, the present disclosure is not limited thereto. In some embodiments, a solid state light emitting component includes a light-altering material that is not laterally bounded by filler materials that contact side edges of the light-altering material.

[0158] Figure 4A solid-state light emitting component 71 is shown according to one embodiment, which includes a hemispherical lens structure 65 disposed above an LED chip 16 and a fluorescent material layer 40, and is suitable for producing a focused light output emission. The LED chip 16 is supported by a substrate 12, wherein a first fill material 30 contacts a side boundary 19 of the LED chip 16. The fluorescent material layer 40 includes a central portion 40A disposed in contact with the entire upper surface of the LED chip 16, and includes a peripheral portion 40B disposed in contact with a top surface portion 32A adjacent to the LED of the fill material layer 30, while the remaining top surface portion 32B of the fill material layer 30 is covered by an elevated reflector structure 72. The elevated reflector structure 72 defines an inclined reflector wall 74 that defines a reflector cavity 53 containing a portion of the lens material 65', and further defines an upper surface 73. In some embodiments, the inclined reflector wall 74 is inclined from the horizontal direction at an angle in the range of about 40 degrees to 44 degrees, or about 42 degrees. The central portion of the lens material 65' has an outwardly curved (convex and substantially hemispherical) surface 66', wherein the lens material 65' also includes a flat extension 64' that overlaps the upper surface 73 of the reflector structure 72. In some embodiments, the lens material 65' can be formed by molding over the reflector structure 72 and the fluorescent material layer 40, and can include silicone (or another material that is substantially CTE matched with the first filler material layer 30, the fluorescent material layer 40, and the reflector structure 72, wherein the foregoing items can also include silicone with particulate material incorporated therein). As shown, the side edges 41 of the fluorescent material layer 40 can be uncovered, or alternatively can be covered by a portion of the reflector structure 72.

[0159] Figure 5 A solid-state light emitting component 78 is shown, which is connected to Figure 4 The solid state light emitting component shown in is similar, but includes a lens material 67 completely contained within the cavity 53 of the raised reflector structure 52 and having a flat outer (i.e., light exit) surface 68 aligned with the upper surface 73 of the reflector structure 52, wherein the upper surface 73 is uncovered. Figure 5 The remaining items are combined with Figure 4 The items described are the same, making Figure 4 The remaining components are described by reference Figure 5 and will not be repeated. Figure 4 Compared with the device 71 shown in Figure 5 The solid state lighting component 78 is suitable for producing a diffuse light output emission having a larger viewing angle.

[0160] Figure 6A solid-state light emitting component 81 according to one embodiment is shown, which includes an integral lens structure 82 disposed on a base structure or subassembly 80. The base structure or subassembly 80 includes an LED chip 16 supported by a substrate 12, wherein a first filler material 30 contacts a side boundary 19 of the LED chip 16. The fluorescent material layer 40 includes a central portion 40A disposed in contact with the entire upper surface of the LED chip 16, and includes a peripheral portion 40B disposed in contact with a top surface portion 32A adjacent to the LED of the filler material layer 30. The second filler material 45 is disposed on the remaining portion 32B of the first filler material 30 and contacts the side boundary 41 of the fluorescent material layer 40. The fluorescent material layer 40 and the second filler material layer 45 provide a flat upper surface for receiving the integral lens structure 82. The integral lens structure 82 includes a first portion 83 and a second portion 84 joined at a transition portion 87. In some embodiments, the first portion 83 and the second portion 84 of the lens structure 82 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.). In some embodiments, the first portion 83 and the second portion 84 are adhered or otherwise fixed to each other at the transition portion 87. In some embodiments, the first portion 83 and the second portion 84 include substantially the same refractive index and can be formed of the same material (e.g., silicone, etc.). The first portion 83 of the lens structure 82 has a width that increases with the distance away from the LED chip 16 and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 83 of the lens structure is defined by a peripheral wall surface 85, which is configured to produce a total internal reflection (TIR) ​​of the emission generated by the emission center of the solid-state emitter (including the LED chip 16 and the fluorescent material layer 40). In some embodiments, the first portion 83 of the lens structure 82 includes a truncated cone shape (i.e., having a circular top view profile), but other shapes are also possible, such as a truncated pyramid shape (i.e., having a square top view profile). The second portion 84 of the lens structure 82 includes an external light extraction (or light exit) surface 86 having a substantially hemispherical shape. During operation of the light emitting component 81, emission generated by the LED chip 16 strikes the phosphor material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 83 of the lens structure 82. Any emission emanating from the emission center of the LED chip 16 and the phosphor material layer 40 (combined to embody a solid state light emitter) and incident on the peripheral wall surface 85 is reflected in a generally upward direction toward the second portion 84 of the lens structure 82 and exits through the hemispherical outer surface 86 to the surrounding environment.

[0161] Fig. 7A A solid-state light emitting component 91 is shown according to one embodiment, which is similar to Figure 6, but the second (upper) portion 94 of the overall lens structure 92 has a (flattened) part-spherical shape. Fig. 7A All components of the base structure or subassembly 80 are combined with Figure 6 The same items described are the same, incorporated by reference, and will not be described again. The overall lens structure 92 includes a first portion 93 and a second portion 94 joined at a transition portion 97. In some embodiments, the first portion 93 and the second portion 94 of the lens structure 92 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.), or adhered or otherwise fixed to each other at the transition portion 97. The first portion 93 of the lens structure 92 has a width that increases with the distance away from the LED chip 16, and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 93 of the lens structure is defined by a peripheral wall surface 95, which is configured to produce TIR of the emission generated by the emission center of the solid-state emitter (including the LED chip 16 and the fluorescent material layer 40). In some embodiments, the first portion 93 of the lens structure 92 includes a truncated cone shape, but other shapes are also possible, such as a truncated pyramid shape. The second portion 94 of the lens structure 92 includes an external light extraction (or light exit) surface 96 having a flat, partially hemispherical shape. During operation of the light emitting component 91, emission generated by the LED chip 16 strikes the phosphor material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 93 of the lens structure 92. Any emission emanating from the emission center of the LED chip 16 and the phosphor material layer 40 (combined to embody a solid state light emitter) and incident on the peripheral wall surface 95 is reflected in a generally upward direction toward the second portion 94 of the lens structure 92 and exits through the hemispherical outer surface 96 to the surrounding environment.

[0162] Figure 7B It shows that according to Fig. 7A A modeled ray trajectory diagram of the designed pattern of the light beam generated by the solid-state light emitting component 91.

[0163] Fig. 8A Shown include Figure 6 The solid-state lighting component 101 of the same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is hereby incorporated by reference. Fig. 8A107 . The overall lens structure 102 is disposed over a portion of the fluorescent material layer 40 and the second filling material layer 45 and includes a first portion 103 and a second portion 104 joined at a transition portion 107. In some embodiments, the first portion 103 and the second portion 104 of the lens structure 102 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.), or adhered or otherwise fixed to each other at the transition portion 107. In some embodiments, the transition portion 107 has a small radius curved profile 107A. The first portion 103 of the lens structure 102 has a width that increases with distance away from the LED chip 16 and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 103 of the lens structure is defined by a peripheral wall surface 105 that is configured to produce TIR of emission generated by an emission center of a solid state emitter (including the LED chip 16 and the fluorescent material layer 40). The second portion 104 of the lens structure 102 includes an inclined external light extraction (or light exit) surface 106 that terminates at a small radius terminal end 108. In certain embodiments, the first portion 103 and the second portion 104 of the lens structure 102 may include shapes independently selected from a truncated cone (having a circular top view profile), a truncated pyramid (having a square or rectangular top view profile), or other shapes (including shapes having an elliptical, other circular or trapezoidal top view profile). During operation of the light emitting component 101, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 103 of the lens structure 102. Any emission emitted from the emission center of the LED chip 16 and the fluorescent material layer 40 (in combination with embodying a solid state light emitter) and incident on the peripheral wall surface 105 is reflected in a generally upward direction toward the second portion 104 of the lens structure 102 and exits through the inclined external light extraction surface 106 to the surrounding environment.

[0164] Figure 8B It shows that according to Fig. 8A A modeled ray trajectory diagram of the designed pattern of the light beam produced by the solid-state light emitting device 101 .

[0165] Fig. 9A A solid-state light emitting component 111 according to one embodiment is shown. Fig. 8A The solid-state light emitting component shown in FIG. 1 is similar, but includes a second (upper) portion 114 of a lens structure having a frustoconical (eg, conical or pyramidal) shape, the central surface 119 of which may be substantially parallel to the sub-mount 12. The solid-state light emitting component 111 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig. 9A incorporated, and will not be repeated. The overall lens structure 112 is disposed over a portion of the fluorescent material layer 40 and the second filling material layer 45, and includes a first portion 113 and a second portion 114 joined at a transition portion 117. In some embodiments, the first portion 113 and the second portion 114 of the lens structure 112 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.), or adhered or otherwise fixed to each other at the transition portion 117. In some embodiments, the transition portion 117 has a small radius curved profile 117A. The first portion 113 of the lens structure 112 has a width that increases with distance away from the LED chip 16, and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 113 of the lens structure is defined by a peripheral wall surface 115, which is configured to produce TIR of the emission generated by the emission center of the solid state emitter (including the LED chip 16 and the fluorescent material layer 40). The second portion 114 of the lens structure 112 includes an inclined outer light extraction (or light exit) surface 116 that transitions (at a curved interface 118) to a central surface 119. In certain embodiments, the first portion 113 and the second portion 114 of the lens structure 112 may include shapes independently selected from a truncated cone, a truncated pyramid, or other shapes. During operation of the light emitting component 111, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 113 of the lens structure 112. Any emission emitted from the emission center of the LED chip 16 and the fluorescent material layer 40 (in combination with the embodiment of a solid state light emitter) and incident on the peripheral wall surface 115 is reflected in a generally upward direction toward the second portion 114 of the lens structure 112 and exits through the inclined outer light extraction surface 116 and the central surface 119 to the surrounding environment.

[0166] Fig. 9B is shown similar to Fig. 9A A modeled ray trajectory diagram of the designed pattern of the light beam generated by the solid-state light emitting device 11.

[0167] Fig.10 A solid-state light emitting component 121 according to one embodiment is shown. Fig. 8A The solid-state light emitting component shown in FIG. 1 is similar, but includes a sharp boundary between the first (lower) portion 123 and the second (upper) portion 124 of the overall lens structure 122. The solid-state light emitting component 121 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig. 9AThe overall lens structure 122 is disposed over the fluorescent material layer 40 and a portion of the second filling material layer 45, and includes a first portion 123 and a second portion 124 joined at a transition portion 127 having an acute angle profile 127A. In some embodiments, the first portion 123 and the second portion 124 of the lens structure 122 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.), or adhered or otherwise fixed to each other at the transition portion 127. The first portion 123 of the lens structure 122 has a width that increases with distance away from the LED chip 16, and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 123 of the lens structure is defined by a peripheral wall surface 125, which is configured to produce TIR of the emission generated by the emission center of the solid state emitter including the LED chip 16 and the fluorescent material layer 40. The second portion 124 of the lens structure 122 includes an inclined external light extraction (or light exit) surface 126. In certain embodiments, the first portion 123 and the second portion 124 of the lens structure 122 may include shapes independently selected from a truncated cone, a truncated pyramid, or other shapes. During operation of the light emitting component 121, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 123 of the lens structure 122. Any emission emitted from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on the peripheral wall surface 125 is reflected in a generally upward direction toward the second portion 124 of the lens structure 122 and exits to the surrounding environment through the inclined external light extraction surface 126.

[0168] Fig.11A A solid-state light emitting component 131 is shown according to one embodiment, which is similar to the previous embodiments, but includes an integral lens structure 132 having a truncated pyramid first (lower) portion 133 and having a second (upper) portion 134 that transitions from a truncated pyramid shape in its proximal segment 134A to a dome shape in its distal segment 134B. To reiterate, when viewed from above, the integral lens structure 132 has a profile that is square for the first portion 133 having the truncated pyramid shape and circular (or nearly circular) for the second portion 134 having the dome shape, with a transition from a square top-view profile to a circular top-view profile in between. The solid-state light emitting component 131 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.11AThe overall lens structure 132 is disposed over portions of the fluorescent material layer 40 and the second filling material layer 45 and includes a first portion 133 and a second portion 134 joined at a transition portion 137 that may have an acute transition profile 137A. In some embodiments, the first portion 133 and the second portion 134 of the lens structure 132 are integrally formed (e.g., by molding, cleaving, cutting, machining, etc.), or adhered or otherwise secured to each other at the transition portion 137. The first portion 133 of the lens structure 132 has a width that increases with distance away from the LED chip 16 (as part of an inverted truncated pyramid shape) and is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 133 of the lens structure is defined by a peripheral wall surface 135 that is configured to produce TIR of emission generated by an emission center of a solid state emitter that includes the LED chip 16 and the fluorescent material layer 40. The second portion 134 of the lens structure 132 includes an inclined outer light extraction (or light exit) surface 136 that transitions to a dome surface 138. During operation of the light emitting component 131, emission generated by the LED chip 16 strikes the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 133 of the lens structure 132. Any emission emanating from the emission center of the LED chip 16 and the fluorescent material layer 40 (combined to embody a solid state light emitter) and incident on the peripheral wall surface 135 is reflected in a generally upward direction toward the second portion 134 of the lens structure 132 and exits through the inclined outer light extraction surface 136 and the dome surface 138 to the surrounding environment.

[0169] Fig. 11B Shows Fig.11A A solid-state light emitting component 131 is superimposed with a partial light trajectory diagram showing light beams emitted from three locations along the upper surface of the LED chip 16 and emerging from the inclined surface 136 and the dome surface 138 of the second portion 134 of the lens structure 132.

[0170] In certain embodiments, the overall lens structure can have a lateral dimension (eg, width) that exceeds the width of the submount and corresponding base structure or subassembly. Fig.12A solid-state light emitting component 141 according to one embodiment is shown, which includes an integral lens structure 141 and its sub-mount 12, wherein the integral lens structure has a width that significantly exceeds the width of a base structure or sub-assembly 80". The extended length of the TIR structure allows more light to be guided by TIR; therefore, a tighter viewing angle can be obtained. The base structure or sub-assembly 80' includes an LED chip 16 supported by the sub-mount 12, wherein a first filling material 30 contacts the lateral side surfaces of the LED chip 16 and the surface of the sub-mount, wherein a fluorescent material layer 40 is arranged between the LED chip 16 and the first filling material 3 0, and the second filling material layer is arranged on the portion of the first filling material 30 and contacts the side boundary of the fluorescent material layer 40. The overall lens structure 142 is disposed on the fluorescent material layer 40 and the portion of the second filling material layer 45, and includes a first portion 143 and a second portion 144 connected at a transition portion 147 that may have an acute transition profile 147A. In some embodiments, the first portion 143 and the second portion 144 of the lens structure 142 are integrally formed (e.g., by molding, splitting, cutting, machining, etc.), or adhered to each other at the transition portion 147 or otherwise. The first portion 143 of the lens structure 142 has a width that increases with distance from the LED chip 16 and can be embodied in any suitable shape (e.g., a truncated cone, a truncated pyramid, etc.), wherein the first portion 143 of the lens structure 142 is arranged to contact the fluorescent material layer 40 and a portion of the second filling material layer 45. The first portion 143 of the lens structure is defined by a peripheral wall surface 145, which is configured to produce TIR of the emission generated by the emission center of the solid-state emitter containing the LED chip 16 and the fluorescent material layer 40. The second portion 144 of the lens structure 142 The light emitting component 141 has a convex shape with a hemispherical light extraction surface 146. During operation of the light emitting component 141, emission generated by the LED chip 16 strikes the phosphor material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the first portion 143 of the lens structure 142. Any emission emanating from the emission center of the LED chip 16 and the phosphor material layer 40 (combined to embody a solid state light emitter) and incident on the peripheral wall surface 145 is reflected in a generally upward direction toward the second portion 144 of the lens structure 142 and exits through the inclined hemispherical light extraction surface 136 to the surrounding environment.

[0171] In certain embodiments, the overall lens structure can include one or more curved surfaces configured to produce TIR to shape the output emission of the solid state lighting device. Fig.13AA solid-state light emitting component 151 is shown according to one embodiment, comprising an integral lens structure 152 disposed over a base portion or subassembly 80, the lens structure 152 having a curved surface 155 disposed along its lateral boundaries and configured to produce TIR of emission emanating from an emission center of a solid-state emitter comprising an LED chip 16 and a fluorescent material layer 40 of the base portion 80. The solid-state light emitting component 151 comprises Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.13A The lens structure 152 has a width that increases with distance away from the LED chip 16 and terminates at a flat light extraction surface 156, which can be parallel to the major surface of the sub-mount 12. During operation of the light-emitting component 151, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the lens structure 112. Any emission emanating from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on the peripheral wall surface 155 is reflected in a generally upward direction toward the flat light extraction surface 156, through which the light is emitted to the surrounding environment.

[0172] Fig. 13B is a partial ray trace diagram for an idealized overall lens 152', which is similar to Fig.13A The solid-state light emitting component is an integral lens 152 of the embodiment of the present invention, but includes a lower portion that is continuously curved (rather than a truncated curve). The simulated emission center 150 of the solid-state light emitter is superimposed on the lower portion of the idealized integral lens 152', with the dashed lines 159' 84 degrees apart, corresponding to a direct emission cone with a half angle of 42 degrees. All emissions from solid-state light emitters within the direct emission cone will be directly transmitted (without reflection) through the flat light extraction surface 156', while emissions outside the cone will be reflected by the curved peripheral wall surface 155 in a direction toward the flat light extraction surface 156'.

[0173] Fig.14A is a simplified cross-sectional view of a solid-state light emitting component 161 according to an embodiment, which is similar to Fig.13A The solid-state light emitting component shown in FIG. 1 includes an integral lens structure 162 having a first portion 163, and further includes a second portion 164 of the integral lens structure 162, the first portion having a curved surface 165 arranged along its side boundary and configured to generate TIR of emission, the second portion having a constant width and arranged at the distal end of the LED chip 16, thereby providing a narrower direct emission cone. The solid-state light emitting component 161 includes Figure 6The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.14A The second portion 164 of the lens structure has sidewalls 167 that are substantially perpendicular to the major surface of the submount 12 and terminates in a flat light extraction surface 166, which may be substantially parallel to the major surface of the submount 12. During operation of the light emitting component 161, emission generated by the LED chip 16 strikes the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the lens structure 162. Any emission emanating from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on the peripheral wall surface 165 is reflected in a generally upward direction toward the second lens portion 164 and the flat light extraction surface 166, through which the light is emitted to the surrounding environment.

[0174] Fig. 14B is a partial ray trace diagram for an idealized overall lens 162', which is similar to Fig.14A The solid-state light emitting component is an integral lens 162, but includes a lower portion that is continuously curved (rather than a truncated curve). The simulated emission center 160 of the solid-state light emitter is superimposed on the lower portion of the idealized integral lens 162', with the dashed lines 169' 84 degrees apart, corresponding to a direct emission cone with a half angle of 42 degrees. All emissions from solid-state light emitters within the direct emission cone will be directly transmitted (without reflection) through the flat light extraction surface 166', while emissions outside the cone will be reflected by the curved peripheral wall surface 165' and / or the flat light extraction surface 166' in a direction toward the flat light extraction surface 166'.

[0175] Fig.15 A solid-state light emitting component 171 is shown according to one embodiment, which is similar to the previous embodiments, but includes an integral lens structure 172 having a first (lower) portion 173 having a truncated hemispherical shape and a second (upper) portion 174 having a hemispherical shape, wherein the first portion 173 and the second portion 174 are joined at a transition 177 (e.g., by a clear adhesive or other means). The solid-state light emitting component 171 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.15The first portion 173 of the lens structure 172 has a curved surface 175 arranged along its side boundary and is configured to produce TIR of emission emanating from the emission center of the solid state emitter, which includes the LED chip 16 and the fluorescent material layer 40 of the base portion 80. During operation of the light-emitting component 171, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the lens structure 172. Any emission emanating from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on the curved peripheral wall surface 175 is reflected in a generally upward direction toward the second lens portion 174 and its curved light extraction surface 176, through which the light is emitted to the surrounding environment.

[0176] As previously described herein, solid state lighting components according to various embodiments may include an integral lens defining one or more recesses therein.

[0177] Fig.16 A solid state light emitting device according to one embodiment is shown, including an integral lens structure 182 having a recess 188 defined therein, wherein the recess 188 has at least one inclined wall 185 that tapers to a lowest point 188A near the fluorescent material 41 and the LED chip 16. In some embodiments, the recess 188 has a conical shape and is defined in a lens structure 182 having a square (or other rectangular) top profile, producing a curved upper peripheral edge 189 along an upper boundary of the lens structure 182, wherein a light exit surface 186 is arranged along a side edge of the lens structure 182. The inclined wall 185 is configured to produce TIR of emission emanating from an emission center of a solid state emitter including an LED chip 16 and a fluorescent material layer 40 of a base portion 80, and to reflect light laterally to the light exit surface 186 arranged along a side edge of the lens structure 182. The solid state light emitting component 181 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.16 During operation of the light emitting component 181, emission generated by the LED chip 16 impinges on the phosphor material layer 40 (where such emission is reflected by the fill material layers 30, 45), and is emitted into the lens structure 182. At least a portion of the emission emanating from the emission center of the LED chip 16 and the phosphor material layer 40 is reflected in a generally upward direction toward the inclined walls 185 defining the recess 188, and outwardly toward the light exit surface 186, through which the light exits to the surrounding environment.

[0178] Fig.17A Shows that according to similar Fig.16A solid-state light emitting device of one embodiment includes an integral lens structure 192 defining a recess bounded by its straight (rather than curved) upper edge 199. The recess 198 has at least one inclined wall 195 that tapers to a lowest point 198A near the fluorescent material 41 and the LED chip 16. In some embodiments, the recess 198 has a conical shape and is defined in a lens structure 192 having a circular top profile. In some embodiments, the recess 198 has an inverted pyramid shape and is defined in a lens structure 192 having a square top profile. Other recess and lens shapes may be selected. The inclined wall 195 is configured to produce TIR of emission emanating from an emission center of the solid-state emitter, which includes the LED chip 16 and the fluorescent material layer 40 of the base portion 80, and reflects light laterally to a light exit surface 196 arranged along a side edge of the lens structure 192. The solid-state light emitting component 191 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.17A During operation of the light emitting component 191, emission generated by the LED chip 16 strikes the fluorescent material layer 40 (where such emission is reflected by the filling material layers 30, 45) and is emitted into the lens structure 192. At least a portion of the emission emanating from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on at least one inclined wall surface 195 defining the recess 198 is reflected outwardly toward the light exit surface 196, through which the light exits to the surrounding environment.

[0179] Fig. 17B It is shown by Fig.17A A modeled ray trace diagram of the pattern of a light beam produced when the solid-state light emitting device 191 is positioned in an upward direction. As shown, most of the emission from the solid-state light emitting device 191 is projected in a lateral direction, with only a small portion of the emission being directed upward through the recess.

[0180] In certain embodiments, solid state lighting components as disclosed herein may be used in conjunction with secondary reflector structures to provide desired light shaping and / or light directing benefits.

[0181] Fig.18A yes Fig.17A1 is a cross-sectional view of a solid-state light emitting component 191 supported by a secondary reflector base 201 and disposed within a cavity 208 of a secondary reflector structure 200. The secondary reflector structure 200 includes an inclined wall 202 having a reflective inner surface 205, wherein the inclined wall 202 defines an inner diameter that generally increases with distance away from the secondary reflector base 201. The secondary reflector structure 200 is configured to redirect light generated by the solid-state light emitting component in a lateral direction in an upward direction (generally perpendicular to the secondary reflector base 201), such as Fig.18B As shown, this figure shows the Fig.18A Modeled ray trajectory diagram of the light beam pattern produced by the solid-state light emitting device and the secondary reflector structure.

[0182] The shape and relative proportions of the lens structure and any corresponding recesses of the light emitting component may affect the pattern of light emitted from the light emitting component. Fig.19 is a modeled ray trace diagram showing the pattern of the light beam produced by the solid state light emitting device 191A, which is similar to Fig.17A , but wherein the width of the solid-state light emitting device 191A is stretched (and positioned to emit light in a downward direction). Fig.19 and Fig. 17B When compared, it can be seen that stretching the lens structure in width modifies a greater proportion of the light projected in the lateral direction, with a different pattern of light being transmitted through the recesses defined in the lens structure of the solid state light emitting device 191A.

[0183] Fig. 20 A solid-state light emitting component 201 is shown according to one embodiment, the solid-state light emitting component including an integral lens structure 202 defining a recess 207 in the shape of a groove between two petals 202A, 202B forming an upper (or second) portion of the lens structure 202. The lower (or first) portion of the lens structure 202 is bounded by peripheral wall surfaces 205A, 205B configured to produce TIR of emission generated by an emission center of a solid-state emitter within a base structure or subassembly 80 of the solid-state light emitting component 201 including an LED chip 16 and a fluorescent material layer 40. The solid-state light emitting component 201 includes Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig. 20incorporated. The lower portion of the lens structure 201 has a width that increases with distance away from the LED chip 16. The groove-shaped recess 207 is bounded by inclined wall surfaces 204A, 204B that intersect at a lowest point 208 of the recess 207, wherein the inclined wall surfaces 204A, 204B can be configured to produce TIR of the emission generated by the emission center of the LED chip 16 and the fluorescent material layer 41. The distal portion 203A, 203B of each petal 202A, 202B is terminated by a light extraction surface 206A, 206B having an outwardly curved profile. During operation of the light-emitting component 201, the emission generated by the LED chip 16 impacts the fluorescent material layer 40 (wherein such emission is reflected by the filling material layers 30, 45) and is emitted into the lens structure 201. At least a portion of the emission emitted from the LED chip 16 and the fluorescent material layer 40 and incident on (A) the peripheral wall surfaces 205A, 205B and / or the inclined wall surfaces 204A, 204B is reflected outwardly toward the light extraction surfaces 206A, 206B of the petals 202A, 202B, through which the light is emitted to the surrounding environment.

[0184] In some embodiments, the overall lens structure of the light-emitting component may include a composite refractive index portion arranged above a light-diffusing portion, wherein the composite refractive index portion includes a first region having a first refractive index and a second region having a second refractive index different from the first refractive index, and the first region covers less than the entire light-diffusing portion.

[0185] Fig.21 A solid-state light emitting component 211 is shown according to one embodiment, comprising a lens structure (212, comprising at least lens components 212A, 212B), wherein a complex refractive index portion 214 (having a first region 220 and a second region 221 with a refractive index difference of at least 0.1, 0.2, 0.3, 0.4, 0.5 or some other threshold) is arranged on a light diffusing portion 213, which is arranged on a base structure or subassembly 80. The solid-state light emitting component 211 comprises Figure 6 The same base structure or subassembly 80 introduced in the present invention, wherein the previous description of all components of the base structure or subassembly 80 is repeated by reference. Fig.21The light diffusing portion 213 has a width that increases with distance away from the LED chip 16 and is bounded by at least one peripheral wall surface 215 that is configured to produce TIR of emission generated by an emission center of a solid state emitter including the LED chip 16 and the fluorescent material layer 40. The light diffusing portion 213 contacts the composite refractive index portion 214 at an inter-region interface 217, wherein the first region 220 of the composite refractive index portion 214 covers less than the entirety of the light diffusing portion 213. As shown, the composite refractive index portion 220 may have a flat surface 222 at the interface 217 (where the first region 220 and the second region 221 contact the light diffusing region 213), and a hemispherical (or other curved) surface 224 may be provided as an inter-region interface between the first region 220 and the second region 221. The second region 221 has a side surface 216 and an upper surface 218, wherein the aforementioned surfaces 216, 218 may be embodied as light extraction surfaces of the light emitting component 211. In some embodiments, the light diffusive portion 213 includes a first solid material, the second region 221 of the composite refractive index portion 214 includes a second solid material (which may be the same as or different from the first solid material), and the first region 220 of the composite refractive index portion 214 includes a gaseous, liquid, or solid material. In some embodiments, the first solid material and the second solid material include silica gel, and the first region 220 includes air. During operation of the light emitting component 211, the emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the filling material layers 30, 45) and is emitted into the light diffusive portion 213. At least a portion of the emission emitted from the emission center of the LED chip 16 and the fluorescent material layer 40 and incident on at least one peripheral wall surface 215 is reflected toward the composite refractive index portion 214. The central portion of the light reflected upward can enter the first refractive index region 220 and be refracted into the second refractive index region 221 through the inter-region interface 224, while the peripheral portion of the light reflected upward can directly enter the second refractive index region 221. The light passing through the second refractive index region 221 is emitted to the surrounding environment through the light extraction surfaces 216, 218.

[0186] Fig.22AA solid state lighting component 231 according to another embodiment is shown, wherein the overall lens structure 212 (composed of lens portions or petals 212A, 212B) defines a central recess 237, wherein each petal 212A, 212B has a proximal peripheral wall surface 235A, 235B, a distal peripheral light extraction surface 236A, 236B providing a sawtooth profile, and a curved intermediate wall surface 234A, 234B. Each proximal peripheral wall surface 235A, 235B can have a linear cross-sectional profile configured to produce TIR (e.g., in an upward direction) of emission generated by the emission center of the solid state emitter surrounding the LED chip 16 and the fluorescent material layer 40. Each curved intermediate wall surface 234A, 234B is configured to produce TIR (e.g., in a peripheral direction) of emission generated by the emission center of the LED chip 16 and the fluorescent material layer 40, and can also produce TIR of at least some emission reflected upward by the corresponding proximal peripheral wall surface 235A, 235B. The recess 237 is defined by the curved intermediate wall surfaces 234A, 234B and tapers to a nadir 238A proximate to the fluorescent material 40. In some embodiments, a lens material may be retained between the nadir 238A and the fluorescent material 40. A sharp or curved boundary 237A, 237B may be provided between the light extraction regions 236A, 236B and the curved intermediate wall surfaces 234A, 234B. During operation of the light emitting component 231, emission generated by the LED chip 16 impacts the fluorescent material layer 40 (where such emission is reflected by the fill material layers 30, 45) and is emitted into the lower portion of the petals 232A, 232B. The low angle portion of the emission emitted from the LED chip 16 and the fluorescent material layer 40 and incident on the proximal peripheral wall surfaces 235A, 235B may be reflected in a generally upward direction toward the light extraction regions 236A, 236B to be emitted to the surrounding environment. The high angle portion of the emission from the LED chip 16 and the fluorescent material layer 40 and the portion of light reflected by the proximal peripheral wall surfaces 235A, 235B (if any) are also reflected in a generally peripheral direction toward the light extraction regions 236A, 236B for exit to the surrounding environment.

[0187] Fig. 22B It is shown by Fig.22A A first modeled ray trace diagram of a low-density pattern of a selected light beam generated by a solid-state light emitting device. As shown, a low-angle portion of the emission emitted from the LED chip 16 and the fluorescent material layer 40 and incident on the proximal peripheral wall surfaces 235A, 235B is reflected in a generally upward direction toward the light extraction regions 236A, 236B to exit from the lighting component 231, while a high-angle portion of the emission emitted from the LED chip 16 and the fluorescent material layer 40 is reflected in a generally peripheral direction toward the light extraction regions 236A, 236B to exit from the lighting component 231.

[0188] Fig.23A Provides a Figure 5 Viewing angle (full width at half maximum) plots for multiple samples of a solid-state light emitting device ("V9Flat") having a planar lens, reflective cavity, LED chip, and phosphor material arrangement, and for multiple samples of a comparative device ("XPGB+") having a hemispherical lens arrangement deposited on a base structure including phosphor material arranged on the lateral edge surfaces of the LED chip and between the submount and the reflective fill material (similar to FIG. 1 ). As shown, the viewing angles of the corresponding device designs are similar.

[0189] Fig. 23B Provides Fig.23A Figure 1 shows a bivariate fit of the intensity (candela) of the same solid-state light emitting device and the comparative device as a function of viewing angle (theta). As shown, the intensity of the corresponding device designs is similar to the viewing angle value.

[0190] Fig.23C Provides Fig.23A Figure 2 shows a bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid-state light emitting device and the comparison device as a function of viewing angle (theta). As shown in the figure, the V9Plat design exhibits more uniform color characteristics with respect to viewing angle, because the color point of the XPGB+ design changes more with changes in viewing angle.

[0191] Fig.24A Provides a Fig.11A Viewing angle (full width at half maximum) graphs of multiple samples of a solid-state light-emitting device ("V29") and multiple samples of a comparison device ("XPGB+") having a similar lens arrangement but including a fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1). Fig. 24B Provides Fig.24A The viewing angle average and standard deviation of the device.

[0192] Fig.24A and Fig. 24BIt is shown that the V29 device (including a lens structure configured to provide TIR) has a significantly tighter viewing angle (with an average of about 72 versus about 119) relative to the comparative device. This difference in viewing angle is believed to be primarily due to the selected non-integral lens structure of the V29 device (which is non-Lambertian). Consistent with the above, in certain embodiments, the non-Lambertian integral lens structure of the solid-state lighting component (which may or may not provide TIR, depending on the embodiment) is configured to shape light emissions received from at least one solid-state light emitter to produce a focused output emission having an intensity distribution over an angular range with a FWHM value of less than 100, or less than 90, or less than 80, or less than 70, or less than 60, or between 40 and 100, or in the range of 45 and 95, or in the range of 50 to 90, or in the range of 55 to 85, or in the range of 60 to 90, or in the range of 60 to 80, or in the range of 65 to 80, or in a range with upper and lower limits of any of the foregoing values.

[0193] Fig.24C Provides Fig.24A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta). Fig.24D Provided based on Fig.24C The intensity data plotted in give a bivariate fit of the relative intensity (dimensionless) of the aforementioned device as a function of viewing angle (theta). Fig.24C The V29 device exhibits significantly greater peak intensity, while Fig.24C and Fig.24D It is shown that the V29 device exhibits a greater drop in intensity with changing viewing angle.

[0194] Fig.25A Provides a Fig. 7A Viewing angle (full width at half maximum) diagrams of multiple samples of a solid-state light-emitting device ("V41V40") having an outwardly curved lens and fluorescent material arrangement, and multiple samples for a comparative device ("XPGB+") having a similar lens arrangement but including fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1). Fig.25B Further provided is the Fig.25A The average and standard deviation values ​​of the viewing angles of the same solid-state light-emitting device and the comparative device. Fig.25A and Fig.25BThe V4140 device is shown to have a wider viewing angle relative to the comparative device (having an average of about 138 versus about 119). This difference in viewing angle is believed to be primarily due to the selected non-integral lens structure of the V4140 device (which is non-Lambertian). Consistent with the above, in certain embodiments, the non-Lambertian integral lens structure of the solid-state lighting component is configured to shape light emissions received from at least one solid-state light emitter to produce a focused output emission having an intensity distribution within an angular range with a FWHM value in the range of greater than 130, or greater than 135, or greater than 140, or greater than 150, or greater than 160, or greater than 170, or in the range of 130 to 200, or in the range of 140 to 200, or in the range of 150 to 200, or in the range of 130 to 190, or in the range of 140 to 190, or in the range of 150 to 190, or in the range of 130 to 180, or in the range of 140 to 180, or in the range of 150 to 180, or in a range with upper and lower limits of any of the foregoing values.

[0195] Fig.25C Provides Fig.25A A bivariate fit of the luminous flux corrected by color point (CCx) for the same solid state light emitting device and the comparative device shows that the luminous flux corrected by color point (CCx) values ​​for the V4140 device and the XPGB+ device are similar.

[0196] Fig.25D Provides Fig.25A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta). Fig.25E Provided based on Fig.26D The intensity data plotted in give a bivariate fit of the relative intensity (dimensionless) of the aforementioned device as a function of viewing angle (theta). Fig.25D shows that the V4140 device exhibits significantly greater peak intensity, while Fig.25D and Fig.25E It is shown that the V4140 device exhibits less intensity drop with changing viewing angle.

[0197] Fig.25F Provides Fig.25A Bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid state light emitting device and a comparison device as a function of viewing angle (theta). Fig.25F It is shown that the V4140 design exhibits more uniform color characteristics with respect to viewing angle, as the color point of the XPGB+ design changes more with changes in viewing angle.

[0198] although FIG. 25A to FIG. 25FData are provided for devices with larger viewing angles than the XPGB+ comparison device, but FIG. 26A to FIG. 26D Features of other devices having even higher viewing angle characteristics are also described in.

[0199] Fig.26A Provides a Fig.17A Viewing angle (full width at half maximum) graphs of multiple samples of a solid-state light-emitting device ("V24lnvCone") having a conical recess defined in an integral lens arranged above an LED chip and a fluorescent material arrangement, and multiple samples of a comparison device ("XPGB+") having a similar lens arrangement but including fluorescent material arranged on the side edge surface of the LED chip and between a sub-support and a reflective filling material (similar to FIG. 1 ). Fig.26A The V4140 device is shown to have a wider viewing angle relative to the comparative device (having an average of about 158 ​​versus about 119). This difference in viewing angle is believed to be primarily due to the selected non-integral lens structure of the V24lnvCone device (which is non-Lambertian).

[0200] Fig.26B Provides Fig.26A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta). Fig.26C A bivariate fit of the relative intensity (dimensionless) as a function of viewing angle (theta) for the aforementioned devices is provided. Fig.26B and Fig.26C A unique intensity distribution is shown having a local minimum at a viewing angle value of zero degrees, while the intensity (and relative intensity) rises to local peaks near 40 degrees and -40 degrees, respectively, and then decreases with increasing angular difference away from the local peaks.

[0201] Fig.26D Provides Fig.26A Figure 1 shows a bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid-state light emitting device and the comparative device as a function of viewing angle (theta). For viewing angle values ​​from about -50 to about 50 degrees, the color point between the V24lnvCone device and the XPGB+ comparative device is comparable, but for viewing angle values ​​outside this range, the color point of the V24lnvCone device is significantly better.

[0202] Fig.27A Provides a Figure 4Viewing angle (full width at half maximum) plots for multiple samples of a solid-state light emitting device ("V8Dome") having a hemispherical lens, a reflective cavity, an LED chip and a fluorescent material arrangement (i.e., including a lens structure that does not provide TIR), and multiple samples of a comparative device ("XPGB+") having a hemispherical lens arrangement deposited on a base structure, the base structure including fluorescent material arranged on the side edge surface of the LED chip and between the sub-support and the reflective filling material (similar to Figure 1). Fig.27B Provides Fig.27A Viewing angle mean and standard deviation values ​​for the devices characterized in . Fig.27A and Fig.27B It is shown that the V8 Dome device (including a lens structure configured to provide TIR) has a tighter viewing angle relative to the comparative device (having an average of about 85 versus about 119). This difference in viewing angle is believed to be primarily due to the selected non-integral lens structure of the V8 Dome device (which is non-Lambertian).

[0203] Fig.27C Provides Fig.27A Bivariate fit of the intensity (candela) of the same solid-state light emitting device and a comparison device as a function of viewing angle (theta). Fig.27D Provides Fig.27A Bivariate fit of the relative intensity (dimensionless) of the same solid-state light emitting device and a comparative device as a function of viewing angle (theta). Fig.27C The V8Dome device shows a significantly greater peak intensity, while Fig.27C and Fig.27D It is shown that the V8 Dome device exhibits a greater drop in intensity with changing viewing angle.

[0204] Fig.27E Provides Fig.27A A bivariate fit of the change in correlated color temperature (dCCT_c) of the same solid-state light-emitting device and the comparison device as a function of viewing angle (theta) shows that the change in CCT with viewing angle is comparable between the corresponding devices, but is slightly better for the XPGB+ device at higher viewing angles.

[0205] The embodiments disclosed herein may provide one or more of the following beneficial technical effects: enabling the production of compact solid-state light-emitting devices having a desired beam pattern (e.g., whether highly focused, highly dispersed, or having a novel shape or distribution) without necessarily requiring secondary optics; enabling the production of compact solid-state light-emitting devices that exhibit enhanced luminous efficiency and / or color point uniformity over the emission area; simplifying the production of solid-state light-emitting devices; and enhancing the reliability and service life of high-intensity solid-state light-emitting devices.

[0206] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered to be within the scope of the concepts disclosed herein and the appended claims.

Claims

1. A solid-state light-emitting component, comprising: at least one solid state light emitter configured to generate light emissions; as well as an integral lens structure disposed in contact with the at least one solid state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid state light emitter; wherein at least a first portion of the overall lens structure proximate to the at least one solid state light emitter has a width that increases with distance away from the at least one solid state light emitter; and Wherein, at least the first portion of the overall lens structure includes at least one inclined or curved surface, the at least one inclined or curved surface having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid-state light emitter, and the at least one inclined or curved surface is configured to reflect light toward one or more light exit surfaces of the solid-state light-emitting component.

2. The solid-state light emitting component according to claim 1, wherein: The at least one inclined or curved surface comprises a peripheral edge surface of the at least first portion of the integral lens structure.

3. The solid-state light emitting component according to claim 1, wherein: The unitary lens structure defines a recess, and the at least one inclined or curved surface bounds at least a portion of the recess.

4. The solid-state light emitting component according to claim 1, wherein: The overall lens structure also includes a second portion, the width of which decreases with the distance away from the at least one solid-state light emitter, wherein the first portion of the overall lens structure is arranged between the at least one solid-state light emitter and the second portion of the overall lens structure.

5. The solid-state light emitting component according to claim 4, wherein: The second portion of the integral lens structure includes a proximal segment having a truncated pyramid shape, and includes a distal segment having a dome shape.

6. The solid-state light emitting component according to claim 4, wherein: The overall lens structure includes a third portion having a circular or square cross-sectional shape, wherein the third portion is arranged between the first portion and the second portion.

7. The solid-state light emitting component according to claim 1, wherein: The overall lens structure includes a material having a first refractive index, and at least a first portion of the overall lens structure is defined by an outer lens surface, and the outer lens surface is defined by a material or space having a second refractive index, wherein the first refractive index exceeds the second refractive index by at least 0.

4.

8. The solid-state light emitting component according to claim 1, wherein: The at least first portion of the overall lens structure includes an inverted truncated pyramid shape or an inverted truncated circular cone shape.

9. The solid-state light emitting component according to claim 1, wherein: The integral lens structure includes a concave portion having a shape of an inverted pyramid, an inverted cone, or a groove, and the concave portion has a lowest point aligned with the emission center of the at least one solid-state light emitter.

10. The solid-state light-emitting component according to any one of claims 8 or 9, wherein: The one or more light exit surfaces are arranged along side edges of the overall lens structure.

11. The solid-state light emitting component according to claim 1, wherein: The solid state lighting component further comprises a secondary lens structure arranged in contact with the integral lens structure, wherein the integral lens structure is arranged between the at least one solid state light emitter and the secondary lens structure.

12. The solid state lighting component of claim 1, further comprising a submount to which the at least one solid state light emitter is mounted, wherein: The width of the integral lens structure is no greater than the width of the submount at a location where the integral lens structure is arranged in contact with the at least one solid state light emitter.

13. The solid-state light-emitting component according to any one of claims 1 to 9, wherein: The at least one solid state light emitter comprises an LED chip and a fluorescent material layer arranged on an outer surface of the LED chip, wherein a side edge surface of the LED chip is free of fluorescent material, and the solid state light emitting component further comprises: a submount to which the at least one solid state light emitter is mounted; and a fill material layer including a fill material and contacting a side edge surface of the at least one solid state light emitter, the fill material including white or light reflective particles dispersed in a binder; Wherein, a portion of the fluorescent material overlaps a portion of the filling material layer.

14. The solid-state light emitting component according to claim 13, wherein: The fluorescent material layer, the filling material layer and the overall lens structure are substantially matched in terms of coefficient of thermal expansion (CTE) such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer and the lens material is in a range of less than 20%.

15. The solid-state light-emitting component according to any one of claims 1 to 9, wherein: The overall lens structure includes silicone.

16. A solid-state light-emitting component, comprising: at least one solid state light emitter configured to generate light emissions; as well as a non-Lambertian integral lens structure disposed in contact with the at least one solid state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid state light emitter, wherein the solid state light emitting component is free of an air gap through which the light emissions are transmitted into the non-Lambertian integral lens structure; wherein the non-Lambertian integral lens structure is configured to shape light emissions received from the at least one solid-state light emitter to produce an output emission having one of the following characteristics (a) or (b): (a) focused output emission having an intensity distribution over an angular range with a full width at half maximum (FWHM) value of less than 100; or (b) Dispersed output emission with an intensity distribution over an angular range with a FWHM value greater than 130°.

17. The solid-state lighting component according to claim 16, wherein: The non-Lambertian integral lens structure is configured to shape light emissions received from the at least one solid state light emitter to produce a focused output emission having an intensity distribution within an angular range having a FWHM value within a range between 40 and 100.

18. The solid-state lighting component according to claim 16, wherein: The non-Lambertian integral lens structure is configured to shape light emissions received from the at least one solid state light emitter to produce a dispersed output emission having an intensity distribution within an angular range having a FWHM value within a range between 130 and 200 degrees.

19. The solid state lighting component of claim 16, wherein: at least a first portion of the non-Lambertian integral lens structure proximate the at least one solid state light emitter has a width that increases as it moves away from the at least one solid state light emitter; and The at least first portion of the non-Lambertian integral lens structure is defined by side edge surfaces having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid state light emitter.

20. The solid state lighting component of claim 16, wherein: The at least one solid state light emitter is disposed within a cavity defined by the elevated reflector structure; at least a first portion of the non-Lambertian integral lens structure proximate the at least one solid state light emitter has a width that increases with distance away from the at least one solid state light emitter; and The at least first portion of the non-Lambertian integral lens structure is arranged in contact with a reflective wall of the elevated reflector structure defining the cavity.

21. The solid state lighting component of claim 16, wherein: The raised reflector structure includes light reflective particles suspended in a binder; The non-Lambertian integral lens structure comprises a lens material; and The raised reflector structure and the lens material are substantially matched in coefficient of thermal expansion (CTE) such that a difference in CTE between the raised reflector structure and the lens material is in a range of less than 20%.

22. A solid state lighting component according to any one of claims 16 to 21, further comprising a sub-mount to which the at least one solid state light emitter is mounted, wherein: The width of the non-Lambertian integral lens structure is no greater than the width of the submount at a location where the non-Lambertian integral lens structure is arranged in contact with the at least one solid state light emitter.

23. The solid-state light emitting component according to any one of claims 16 to 21, wherein: The at least one solid state light emitter comprises an LED chip and a fluorescent material layer arranged on an outer surface of the LED chip, wherein a side edge surface of the LED chip is free of fluorescent material, and the solid state light emitting component further comprises: a submount to which the at least one solid state light emitter is mounted; and a fill material layer including a fill material and contacting a side edge surface of the at least one solid state light emitter, the fill material including white or light reflective particles dispersed in a binder; Wherein, a portion of the fluorescent material overlaps a portion of the filling material layer.

24. The solid-state lighting component of claim 23, wherein: The fluorescent material layer, the filling material layer and the non-Lambertian overall lens structure are substantially matched in terms of coefficient of thermal expansion (CTE) such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer and the lens material is in a range of less than 20%.

25. The solid-state light emitting component according to any one of claims 16 to 21, wherein: The non-Lambertian integral lens structure includes silicone.

26. A solid-state light-emitting component, comprising: at least one solid state light emitter configured to generate light emission, the at least one solid state having an emission center; as well as an integral lens structure disposed in contact with the at least one solid state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid state light emitter; The overall lens structure includes a recessed portion, the recessed portion is in the shape of an inverted pyramid, an inverted cone or a groove, the recessed portion has a lowest point aligned with the emission center, the recessed portion is defined by one or more inclined walls, wherein an axis extends through the lowest point and the emission center, and wherein the one or more inclined walls are inclined away from the axis at an angle in the range of 40 degrees to 44 degrees.

27. The solid-state lighting component of claim 26, wherein: The integral lens structure comprises one or more light exit surfaces along side edges of the integral lens, and wherein the one or more inclined walls are configured to reflect light towards the one or more light exit surfaces.

28. The solid-state lighting component of claim 26, wherein: The unitary lens structure comprises a material having a first refractive index, and wherein the recess is substantially filled with a material having a second refractive index that differs from the first refractive index by at least 0.

4.

29. The solid-state lighting component of claim 28, wherein: The material having the second refractive index includes air.

30. The solid state light emitting component according to any one of claims 26 to 29, wherein: at least a first portion of the overall lens structure proximate the at least one solid state light emitter has a width that increases as it moves away from the at least one solid state light emitter; and The at least a first portion of the overall lens structure is laterally bounded by at least one inclined or curved surface having an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid state light emitter.

31. The solid-state light emitting component according to any one of claims 26 to 29, wherein: The overall lens structure defines a first lobe and a second lobe, and the recess is shaped like a groove disposed between the first lobe and the second lobe.

32. The solid-state lighting component of claim 31, wherein: Each of the first lobe and the second lobe includes a light emitting surface, and at least a portion of the light emitting surface has an outwardly curved or convex profile.

33. A solid state lighting component according to any one of claims 26 to 29, further comprising a sub-mount to which the at least one solid state light emitter is mounted, wherein: The width of the integral lens structure is no greater than the width of the submount at a location where the integral lens structure is arranged in contact with the solid state light emitter.

34. A solid state light emitting component according to any one of claims 26 to 29, wherein: The at least one solid state light emitter comprises an LED chip and a fluorescent material layer arranged on an outer surface of the LED chip, wherein a side edge surface of the LED chip is free of fluorescent material, and the solid state light emitting component further comprises: a submount to which the at least one solid state light emitter is mounted; and a fill material layer including a fill material and contacting a side edge surface of the at least one solid state light emitter, the fill material including white or light reflective particles dispersed in a binder; Wherein, a portion of the fluorescent material overlaps a portion of the filling material layer.

35. The solid state lighting component of claim 34, wherein: The fluorescent material layer, the filling material layer and the overall lens structure are substantially matched in terms of coefficient of thermal expansion (CTE), such that the CTE difference between any two or more of the fluorescent material layer, the filling material layer and the lens material is in a range of less than 20%.

36. The solid-state light emitting component according to any one of claims 26 to 29, wherein: The overall lens structure includes silicone.

37. A solid-state light-emitting component, comprising: at least one solid state light emitter disposed over the submount and configured to generate light emissions, the at least one solid state light emitter comprising an outer surface distal from the submount; as well as a lens structure disposed over the at least one solid state light emitter and configured to receive at least a portion of the light emissions generated by the at least one solid state light emitter, the lens structure comprising: a light diffusing portion contacting the outer surface of the at least one solid state light emitter; as well as A complex refractive index portion is arranged on the light diffusion portion, the complex refractive index portion including a first region having a first refractive index and a second region having a second refractive index different from the first refractive index, the first region covering less than the entire light diffusion portion.

38. The solid state lighting component of claim 37, wherein: The light diffusing portion of the lens includes a width that increases with distance away from the at least one solid-state light emitter and is bounded by at least one inclined or curved surface side, wherein the at least one inclined or curved surface has an orientation configured to produce total internal reflection of a portion of light emission originating from an emission center of the at least one solid-state light emitter, and the at least one inclined or curved surface is configured to reflect light toward one or more light exit surfaces of the lens structure.

39. The solid state lighting component of claim 37, wherein: The first region of the complex refractive index portion includes glass or sapphire.

40. The solid state lighting component of claim 37, wherein: The first region of the complex refractive index portion consists of air or at least one gas.

41. A solid state lighting component according to any one of claims 37 to 40, further comprising a sub-mount to which the at least one solid state light emitter is mounted, wherein: The width of the integral lens structure is no greater than the width of the submount at a location where the integral lens structure is arranged in contact with the at least one solid state light emitter.

42. A solid state light emitting component according to any one of claims 37 to 40, wherein: The at least one solid state light emitter comprises an LED chip and a fluorescent material layer arranged on an outer surface of the LED chip, wherein a side edge surface of the LED chip is free of fluorescent material, and the solid state light emitting component further comprises: a submount to which the at least one solid state light emitter is mounted; and a fill material layer including a fill material and contacting a side edge surface of the at least one solid state light emitter, the fill material including white or light reflective particles dispersed in a binder; Wherein, a portion of the fluorescent material overlaps a portion of the filling material layer.

43. The solid state lighting component of claim 42, wherein: The fluorescent material layer, the filling material layer and the light diffusion part of the lens structure are substantially matched in terms of coefficient of thermal expansion CTE, so that the CTE difference between any two or more of the fluorescent material layer, the filling material layer and the light diffusion part is within a range of less than 20%.

44. A solid state light emitting component according to any one of claims 37 to 40, wherein: The light diffusing portion of the lens structure includes silicone.

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