Intelligent dressing based on environmental backscattering, preparation method and use method

Abstract

The invention discloses an intelligent dressing based on environmental backscattering, a preparation method and a use method. The intelligent dressing comprises an intelligent flexible dressing, a sensor group arranged on the flexible dressing, an energy collection unit and a control unit, the intelligent flexible dressing comprises a flexible isolation layer and a patch layer which are stacked from top to bottom, the intelligent flexible dressing further comprises annular antibacterial collagen-based composite sponge, a through hole is formed in the middle of the patch layer, the antibacterial collagen-based composite sponge is embedded in the through hole, and the antibacterial collagen-based composite sponge is embedded in the through hole. And the sensor group is embedded in the center of the annular antibacterial collagen-based composite sponge. Through the energy acquisition circuit, an environment radio frequency signal is converted into electric energy, passive power supply is realized, so that the reliability of equipment is improved, the use experience of a patient is improved, and the defect that real-time quantitative data acquisition and space and distance limitation cannot be met at the same time in the prior art is overcome. And the reliability and stability of the equipment are improved according to the practical situations of multiple requirements of equipment miniaturization, electric energy storage and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of smart dressings, and in particular to a smart dressing based on environmental backscattering, a preparation method and a use method. Background Art

[0002] In 2023, the global medical dressing market will be worth US$9.13 billion, and the Chinese medical dressing market will also show a rapid growth trend. According to BMI Research and Zhiyan Consulting data, from 2019 to 2023, the domestic medical dressing market size will be 7.312 billion yuan, 8.795 billion yuan, 9.233 billion yuan, 10.886 billion yuan, and 12.371 billion yuan, respectively. As the global population aging trend intensifies, the number of patients with chronic diseases continues to increase, and the demand for medical dressings has also increased. Due to the decline in physical function, the elderly have a slower wound healing rate, and they need higher-quality medical dressings to accelerate wound healing and reduce complications. However, for traditional dressings, the wound is covered by the dressing and cannot be observed in real time. It needs to be replaced many times to check the wound condition, and it is easy to cause infection and discomfort to the patient.

[0003] Therefore, a series of smart dressing products have emerged. There are three main types of smart dressings: the first is to use the color characteristics of the material at different pH values ​​to monitor wound changes. This method cannot quantitatively analyze the wound condition; the second is to use near-field communication (NFC) technology to bring the NFC-enabled device close to the smart dressing, and quickly exchange the data collected by the sensor through contact within a very short distance. This method cannot monitor the wound condition in real time and change the dressing in time; the third is to use short-range wireless communication technology, such as Bluetooth, WLAN, ZigBee and LoRa, to achieve real-time monitoring and on-demand treatment of the wound, but it cannot avoid the contradiction between power consumption, battery capacity and volume. When the power consumption is constant, the battery capacity increases. Although it can be used for a long time, the volume and weight also increase. The patient's feeling of use is poor and the dressing is easy to fall off. If the battery capacity is reduced by reducing the volume and weight, it needs to be charged in time when used. There is still a problem of poor patient feeling of use, and forgetting to charge will delay the treatment effect. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent dressing based on environmental backscattering, a preparation method and a use method, which can solve the problem of delayed treatment caused by poor patient experience due to the contradiction between the power consumption, capacity and volume of the existing dressing battery.

[0005] The technical solution adopted by the present invention is: A smart dressing based on environmental backscattering, comprising a smart flexible dressing, a sensor group placed on the flexible dressing for collecting the state of a wound microenvironment, an energy collection unit for collecting environmental radio frequency signals, and a control unit; the smart flexible dressing comprises a flexible isolation layer and a patch layer, which are stacked from top to bottom, and further comprises an annular antibacterial collagen-based composite sponge, a through hole is provided in the middle of the patch layer, the antibacterial collagen-based composite sponge is embedded in the through hole, and the sensor group is embedded in the center of the annular antibacterial collagen-based composite sponge; the energy collection unit comprises a radio frequency-to-direct current energy conversion chip, a voltage stabilizing rectifier circuit, and a patch antenna, the output end of the patch antenna is connected to the input end of the radio frequency-to-direct current energy conversion chip, the output end of the radio frequency-to-direct current energy conversion chip is connected to the sensor group through the voltage stabilizing rectifier circuit for power supply, and the output end of the sensor group is connected to the input end of the control unit.

[0006] It also includes a communication unit and a remote monitoring terminal, wherein the communication unit is used to connect the control unit and the remote monitoring terminal for communication.

[0007] The sensor group includes a temperature and humidity sensor and a pH sensor.

[0008] The radio frequency-to-direct current energy conversion chip U1 adopts a P1110B radio frequency-to-direct current energy conversion chip.

[0009] The voltage stabilizing and rectifying circuit is composed of an XC6206P302MR chip U2, a voltage monitor and peripheral circuits.

[0010] The control unit is composed of a power level conversion chip U3 of ADG902, a STM32F103CBT6 control chip U4 and peripheral circuits thereof.

[0011] Pin 2 and pin 4 of the RF-DC energy conversion chip U1 are connected in parallel and then grounded, pin 3 of the RF-DC energy conversion chip U1 is connected to the antenna EU11, pin 7 of the RF-DC energy conversion chip U1 is connected to capacitor CU21, capacitor CU22, one end of the supercapacitor CU23 and pin 1 of the chip U2, and then grounded, pin 10 of the RF-DC energy conversion chip U1 is connected to the positive electrode of capacitor CU20, the negative electrode of capacitor CU20 is connected to one end of the Zener diode ZU21 and the Zener diode ZU22, the other end of the Zener diode ZU21 is grounded, and the other end of the Zener diode ZU22 is connected to capacitor CU2 1 is connected to the other end of capacitor CU22 and pin 3 of chip U2, pin 1 of chip U2 is connected to capacitor CU21, capacitor CU22, one end of super capacitor CU23 and pin 7 of RF-DC energy conversion chip U1, and then grounded; pin 2 of chip U2 is connected to the other end of super capacitor CU23, one end of voltage monitor and the output end of DC voltage Vcc, the other end of voltage monitor is grounded, pin 3 of chip U2 is connected to capacitor CU21, the other end of capacitor CU22 and the other end of Zener diode ZU22, the voltage monitor outputs electric energy when the voltage meets 4.5V, and the power-on reset voltage is 0.5V.

[0012] Pin 1 of the power level conversion chip U3 is connected to Vcc, pin 2 of the power level conversion chip U3 is connected to the CT signal, pin 3 of the power level conversion chip U3 is grounded, pin 4 of the power level conversion chip U3 is connected to one end of the resistor RU31, the other end of the resistor RU31 is grounded, pin 5, pin 6 and pin 7 of the power level conversion chip U3 are grounded, and pin 8 of the power level conversion chip U3 is connected to the antenna Ant; pin 1 and pin 48 of the control chip U4 are connected to Vcc and one end of the capacitor CU41, the other end of the capacitor CU41 is grounded, pin 2 of the control chip U4 is connected to the CT signal, pin 5 of the control chip U4 is connected to one end of the resistor RU42, the capacitor CU48, and the crystal oscillator YU41 The other end of the capacitor CU48 is grounded, the pin 6 of the control chip U4 is connected to one end of the capacitor CU47 and the other end of the resistor RU42 and the crystal oscillator YU41, the other end of the capacitor CU47 is grounded, the pin 7 of the control chip U4 is connected to one end of the capacitor CU46 and the resistor RU41, the other end of the capacitor CU46 is grounded, the other end of the resistor RU41 is connected to Vcc, the pin 8 of the control chip U4 is grounded, the pin 20 of the control chip U4 is grounded, the pin 23 of the control chip U4 is grounded, the pin 24 of the control chip U4 is connected to one end of the capacitor CU45, the other end of the capacitor CU45 is grounded, the pin 26 of the control chip U4 is connected to DTUCTS, and the pin 27 of the control chip U4 is connected to DTU RTS, pin 28 of control chip U4 is connected to DTU DTR, pin 30 of control chip U4 is connected to DTU TX, pin 31 of control chip U4 is connected to DTU RX, pin 35 of control chip U4 is grounded, pin 36 of control chip U4 is connected to Vcc and one end of capacitor CU44, and the other end of capacitor CU44 is grounded; pin 41 of control chip U4 is connected to one end of capacitor CU43, and the other end of capacitor CU43 is grounded; pin 43 of control chip U4 is connected to one end of capacitor CU42, and the other end of capacitor CU42 is grounded, and pin 47 of control chip U4 is grounded.

[0013] The preparation method of the intelligent dressing based on environmental backscattering comprises the following steps: Step 1: Use a hole puncher to cut a circular hole in the center of the antibacterial collagen-based composite sponge that is the same size as the temperature and humidity sensor and the pH sensor, and then use a hole puncher to cut a circular hole in the center of the patch layer that is the same size as the antibacterial collagen-based composite sponge; Step 2: embed the temperature and humidity sensor and the pH sensor into the antibacterial collagen-based composite sponge patch layer from the inside to the outside; Step 3: Use hot-press bonding technology to bond the flexible isolation layer to the temperature and humidity sensor, pH sensor, antibacterial collagen-based composite sponge and patch layer.

[0014] The method for using the intelligent dressing based on the environmental backscattering comprises the following steps: Step A: Applying the smart dressing based on ambient backscattering to the patient’s wound; Step B: The energy collection unit collects the RF signal in the environment through the patch antenna in real time, and converts and stores the RF signal into DC power for powering the load; Step C: Determine whether the electric energy storage reaches the output voltage condition through the voltage monitor, that is, when the condition of 4.5V is met, the stored electric energy is output through the voltage output terminal VOUT to supply power to each functional unit and enter the next step, otherwise continue to wait until the output voltage condition is met; Step D: After the temperature and humidity sensor and the pH sensor are powered on and started, the collected wound temperature, humidity and pH information are sent to the control unit; Step E: After the control unit receives the wound temperature, humidity and pH information sent by the temperature and humidity sensor and the pH sensor, the control chip U4 outputs the position information instruction from the control unit to the communication unit through the DTU TX on the pin 30; Step F: The communication unit uses the SIM card chip U6 to complete the communication between the communication unit and the monitoring communication terminal processing unit, receiving the wound temperature, humidity and pH information; Step G: The monitoring communication terminal processing unit displays and alarms the received wound temperature, humidity and pH data in real time: The acquired temperature, humidity and pH value data can be displayed in real time through the monitoring communication terminal. When the alarm threshold set by the monitoring communication terminal processing unit is exceeded, the monitoring communication terminal sends an alarm signal to prompt medical staff or patients to change dressings, check the wound condition, and take timely measures.

[0015] Beneficial effects of the present invention: The present invention converts the ambient radio frequency signal into electrical energy through the energy collection circuit to realize passive power supply, thereby improving the reliability of the equipment and the patient's experience, making up for the fact that the existing technical means cannot simultaneously meet the limitations of real-time quantitative data collection, and are not limited by space and distance, equipment miniaturization and power storage. Intelligent dressings based on environmental backscattering avoid tedious manpower input such as power supply or battery replacement, and improve the reliability and stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of the present invention.

[0018] Figure 2 It is a schematic diagram of the split structure of the present invention.

[0019] Figure 3 This is a schematic diagram of the energy collection control and monitoring communication unit of the present invention.

[0020] Figure 4 The schematic diagram of the circuit of the energy collection unit of the present invention.

[0021] Figure 5 The schematic diagram of the circuit of the control unit of the present invention is shown in FIG.

[0022] Figure 6 The schematic diagram of the circuit of the communication unit of the present invention is shown in FIG. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] like Figure 1 As shown, the present invention includes an intelligent flexible dressing, a sensor group 12 for collecting the wound microenvironment state arranged on the flexible dressing, an energy collection unit 22 for collecting environmental radio frequency signals, and a control unit 24; the radio frequency signal can be generated by a radio frequency signal in space, or by a radio frequency signal source 4 arranged nearby, and is specifically arranged according to actual needs; the intelligent flexible dressing 1 includes a flexible isolation layer 11 and a patch layer 14, which are stacked from top to bottom, and also includes a ring-shaped antibacterial collagen-based composite sponge 13, a through hole is arranged in the middle of the patch layer 14, the antibacterial collagen-based composite sponge 13 is embedded in the through hole, and the sensor group is embedded in the center of the ring-shaped antibacterial collagen-based composite sponge 13; the energy collection unit includes a radio frequency-to-direct current energy conversion chip, a voltage-stabilizing rectifier circuit and a patch antenna 3, the output end of the patch antenna is connected to the input end of the radio frequency-to-direct current energy conversion chip, the output end of the radio frequency-to-direct current energy conversion chip is connected to the sensor group through the voltage-stabilizing rectifier circuit for power supply, and the output end of the sensor group is connected to the input end of the control unit.

[0025] The present application sets up an energy collection control and monitoring communication unit to collect radio frequency signals in the environment and convert them into electrical energy to power the dressing, thereby realizing data monitoring of the wound by the dressing, thereby realizing passive intelligent monitoring and avoiding the adverse effects of dressing use due to excessive or insufficient power supply.

[0026] It also includes a communication unit 25 and a remote monitoring terminal 5, wherein the communication unit is used to connect the control unit and the remote monitoring terminal 5 for communication. Through the setting of the communication unit and the monitoring terminal, remote data real-time monitoring and alarm can be realized, forming a dressing monitoring system, making the monitoring and use of the dressing more convenient and quick.

[0027] The sensor group 12 includes a temperature and humidity sensor and a pH sensor. By providing a temperature and humidity sensor and a pH sensor, it is possible to better realize the accurate quantification of the changes in the wound, which is convenient for later analysis. In actual use, the signal output end of the intelligent flexible dressing 1 is connected to the signal input end of the energy collection control and monitoring communication unit 2, the signal output end of the energy collection control and monitoring communication unit 2 is connected to the signal input end of the patch antenna 3, the signal output end of the patch antenna 3 is connected to the signal input end of the energy collection control and monitoring communication unit 2, the signal output end of the patch antenna 3 is connected to the signal input end of the RF signal source 4, the signal output end of the RF signal source 4 is connected to the signal input end of the patch antenna 3, and the signal output end of the RF signal source 4 is connected to the signal input end of the remote monitoring terminal 5. Figure 2 As shown, the intelligent flexible dressing 1 is designed to be stacked from top to bottom, including a flexible isolation layer 11, a temperature and humidity sensor and a pH sensor 12, an antibacterial collagen-based composite sponge 13 and a patch layer 14 in sequence.

[0028] like Figure 3 As shown, the signal output end of the radio frequency signal 21 is connected to the signal input end of the energy collection unit 22, the signal output end of the energy collection unit 22 is connected to the signal input end of the temperature and humidity sensor and the pH sensor 23, the signal input end of the control unit 24 and the signal input end of the communication unit 25, the signal output end of the temperature and humidity sensor and the pH sensor 23 is connected to the input end of the control unit 24, the output end of the control unit 24 is connected to the input end of the communication unit 25, and the output end of the communication unit 25 is connected to the signal input end of the remote monitoring terminal processing unit 26.

[0029] The antenna EU11 of the energy collection unit 22 has a center frequency of 539 MHz and an impedance of 50 Ω. The RF-DC energy conversion is implemented by the RF-DC energy conversion chip U1, which uses the P1110B RF-DC energy conversion chip of Powercast. The antenna EU11 is connected to the RF-DC energy conversion chip U1 after impedance matching, and its load impedance is 50 Ω.

[0030] like Figure 4 As shown: the energy collection unit 22 includes a voltage stabilizing chip U2, capacitors CU20, CU21, CU22, voltage stabilizing diodes ZU21 and ZU22, and a voltage monitor to form a voltage stabilizing rectifier circuit. The voltage stabilizing chip U2 model is XC6206P302MR, the capacitance of capacitor CU20 is 1µF, the capacitance of capacitor CU21 is 1µF, the capacitance of capacitor CU22 is 10µF, capacitor CU23 selects a supercapacitor F750G228MRC with a small leakage current and its capacity is 1mF, the parameter of the voltage stabilizing diode ZU21 is 3.3V, the parameter of the voltage stabilizing diode ZU22 is 3.6V, the voltage monitor outputs electric energy when the voltage meets the 4.5V voltage, and the power-on reset voltage is 0.5V.

[0031] The energy collection unit 22 includes a radio frequency-to-direct current energy conversion chip U1 and a chip U2, wherein pins 2 and 4 of the radio frequency-to-direct current energy conversion chip U1 are connected in parallel and then grounded, pin 3 of the radio frequency-to-direct current energy conversion chip U1 is connected to the antenna EU11, pin 7 of the radio frequency-to-direct current energy conversion chip U1 is connected to one end of capacitor CU21, capacitor CU22, super capacitor CU23 and pin 1 of chip U2, and then grounded, pin 10 of the radio frequency-to-direct current energy conversion chip U1 is connected to the positive electrode of capacitor CU20, the negative electrode of capacitor CU20 is connected to one end of Zener diode ZU21 and Zener diode ZU22, the other end of Zener diode ZU21 is grounded, the other end of Zener diode ZU22 is connected to the other end of capacitor CU21 and capacitor CU22 and pin 3 of chip U2, pin 1 of chip U2 is connected to one end of capacitor CU21, capacitor CU22, super capacitor CU23 and pin 7 of radio frequency-to-direct current energy conversion chip U1, and then grounded; Pin 2 of chip U2 is connected to the other end of supercapacitor CU23, one end of the voltage monitor, and the output end of DC voltage Vcc. The other end of the voltage monitor is grounded. Pin 3 of chip U2 is connected to capacitor CU21, the other end of capacitor CU22, and the other end of Zener diode ZU22.

[0032] The voltage stabilizing and rectifying circuit is composed of an XC6206P302MR chip U2, a voltage monitor and peripheral circuits.

[0033] The control unit is composed of a power level conversion chip U3 of ADG902, a STM32F103CBT6 control chip U4 and peripheral circuits thereof.

[0034] like Figure 5As shown: the control unit 24 is composed of power level conversion chips U3, U4 and peripheral circuits such as resistors RU31, resistors RU41, resistors RU42, capacitors CU41, capacitors CU42, capacitors CU43, capacitors CU44, capacitors CU45, capacitors CU46, capacitors CU47, capacitors CU48, and crystal oscillator YU41; the power level conversion chip U3 uses a power level conversion chip model ADG902, and the resistance of resistor RU31 is 4.7kΩ; the control chip U4 uses STM's STM32 F103CBT6 is used as the control chip. The resistance of resistor RU41 is 10kΩ, the resistance of resistor RU42 is 1mΩ, the capacitance of capacitor CU41 is 0.1µF, the capacitance of capacitor CU42 is 0.1µF, the capacitance of capacitor CU43 is 0.1µF, the capacitance of capacitor CU44 is 0.1µF, the capacitance of capacitor CU45 is 0.1µF, the capacitance of capacitor CU46 is 0.1µF, the capacitance of capacitor CU47 is 20pF, the capacitance of capacitor CU48 is 20pF, and the frequency of crystal oscillator YU41 is 8MHz.

[0035] The control unit 24 includes a power level conversion chip U3 and a control chip U4, wherein pin 1 of the power level conversion chip U3 is connected to Vcc, pin 2 of the power level conversion chip U3 is connected to a CT signal, pin 3 of the power level conversion chip U3 is grounded, pin 4 of the power level conversion chip U3 is connected to one end of a resistor RU31, the other end of the resistor RU31 is grounded, pins 5, 6 and 7 of the power level conversion chip U3 are grounded, and pin 8 of the power level conversion chip U3 is connected to an antenna Ant; Pin 1 and pin 48 of the control chip U4 are connected to Vcc and one end of the capacitor CU41, and the other end of the capacitor CU41 is grounded. Pin 2 of the control chip U4 is connected to the CT signal. Pin 5 of the control chip U4 is connected to resistor RU42, capacitor CU48, and one end of the crystal oscillator YU41, and the other end of the capacitor CU48 is grounded. Pin 6 of the control chip U4 is connected to one end of the capacitor CU47 and the other end of the resistor RU42 and the crystal oscillator YU41, and the other end of the capacitor CU47 is grounded. Pin 7 of the control chip U4 is connected to one end of the capacitor CU46 and the resistor RU41, and the other end of the capacitor CU46 is grounded. The other end of the resistor RU41 is connected to Vcc. Pin 8 of the control chip U4 is grounded. Pin 20 of the control chip U4 is grounded. Pin 23 of the control chip U4 is grounded. Pin 24 of the control chip U4 is connected to one end of the capacitor CU45, and the other end of the capacitor CU45 is grounded. Pin 26 of the control chip U4 is connected to DTU CTS, and pin 27 of the control chip U4 is connected to DTU RTS, pin 28 of control chip U4 is connected to DTU DTR, pin 30 of control chip U4 is connected to DTU TX, pin 31 of control chip U4 is connected to DTU RX, pin 35 of control chip U4 is grounded, pin 36 of control chip U4 is connected to Vcc and one end of capacitor CU44, and the other end of capacitor CU44 is grounded; pin 41 of control chip U4 is connected to one end of capacitor CU43, and the other end of capacitor CU43 is grounded; pin 43 of control chip U4 is connected to one end of capacitor CU42, and the other end of capacitor CU42 is grounded, and pin 47 of control chip U4 is grounded.

[0036] like Figure 6As shown: the communication unit 25 is composed of chips U5, U6 and peripheral circuits such as resistor RU51, capacitor CU51, capacitor CU52, resistor RU61, resistor RU62, resistor RU63, capacitor CU61, capacitor CU62, capacitor CU63, capacitor CU64, antenna EU51, etc.; chip U5 adopts GPS / GPRS two-in-one SIM900A produced by SIMCom as signal communication chip, wherein the GPS module supports global positioning and is responsible for obtaining GPS signals, and the GPRS module is responsible for transmitting the data obtained by the temperature and humidity sensor and the pH sensor to the remote monitoring terminal processing unit 26, thereby realizing real-time monitoring of the patient's wound condition. If the threshold is exceeded, the remote monitoring terminal 5 will send an alarm signal to prompt medical staff or patients to change dressings, check the wound condition, and take timely measures. The resistance of resistor RU51 is 10kΩ, the capacitance of capacitor CU51 is 4.7µF, and the capacitance of capacitor CU52 is 0.1µF; the chip U6 uses a SIM card chip of model SIM-F, which is used to place the SIM card to realize communication with the remote monitoring terminal processing unit 26, the resistance of resistor RU61 is 22Ω, the resistance of resistor RU62 is 22Ω, the resistance of resistor RU63 is 22Ω, the capacitance of capacitor CU61 is 0.1µF, the capacitance of capacitor CU62 is 33pF, and the capacitance of capacitor CU63 is 33pF. The antenna selected is antenna EU51 with a center frequency of 915MHz, and the impedance of the antenna is 60Ω.

[0037] The communication unit 25 includes a chip U5 and a chip U6, wherein the pin 3 of the chip U5 is connected to the DTU DTR, the pin 7 of the chip U5 is connected to the DTU CTS, the pin 8 of the chip U5 is connected to the DTU RTS, the pin 9 of the chip U5 is connected to the DTU RX, and the pin 10 of the chip U5 is connected to the DTU TX, pin 16 of chip U5 is connected to one end of resistor RU51 and capacitor CU52, the other end of resistor RU51 is connected to Vcc, the other end of capacitor CU52 is grounded, pin 17 of chip U5 is grounded, pin 18 of chip U5 is connected to one end of capacitor CU51 and then grounded, pin 26 of chip U5 is connected to the other end of capacitor CU51, pin 29 of chip U5 is grounded, pin 30 of chip U5 is connected to SIMVCC, pin 31 of chip U5 is connected to SIMDATA, pin 32 of chip U5 is connected to SIMCLK, pin 33 of chip U5 is connected to SIMRST, pin 39, pin 45 and pin 46 of chip U5 are grounded, pin 53 and pin 54 of chip U5 are grounded, pin 55, pin 56 and pin 57 of chip U5 are connected to Vcc, pin 58 and pin 59 of chip U5 are grounded, pin 60 of chip U5 is connected to antenna EU51, pin 61, pin 62, pin 63, pin 64 and pin 65 of chip U5 are grounded; Pin 1 of chip U6 is connected to SIMVCC and one end of capacitor CU61, and the other end of capacitor CU61 is grounded. Pin 2 of chip U6 is connected to one end of resistor RU61, and the other end of resistor RU61 is connected to SIMRST and one end of capacitor CU62, and the other end of capacitor CU62 is grounded. Pin 3 of chip U6 is connected to one end of resistor RU62, and the other end of resistor RU62 is connected to SIMCLK and one end of capacitor CU63, and the other end of capacitor CU63 is grounded. Pin 4 of chip U6 is connected to one end of resistor RU63, and the other end of resistor RU63 is connected to SIMDATA and one end of capacitor CU64, and the other end of capacitor CU64 is grounded. Pin 6 of chip U6 is grounded.

[0038] The preparation method of the intelligent dressing based on environmental backscattering comprises the following steps: Step 1: Use a hole puncher to cut a circular hole in the center of the antibacterial collagen-based composite sponge 13 that is the same size as the temperature and humidity sensor and the pH sensor 12, and then use a hole puncher to cut a circular hole in the center of the patch layer 14 that is the same size as the antibacterial collagen-based composite sponge 13; Step 2: embed the temperature and humidity sensor and the pH sensor 12 into the antibacterial collagen-based composite sponge 13 and the patch layer 14 from the inside to the outside; Step 3: Use hot pressing bonding technology to bond the flexible isolation layer 11 to the temperature and humidity sensor and pH sensor 12, the antibacterial collagen-based composite sponge 13 and the patch layer 14. By adopting the above-mentioned preparation method, the embedded setting of the present application not only reduces the thickness of the dressing, but also ensures the technical effect of the radio frequency signal collection and conversion described in the present application under the premise of air permeability, thus meeting the actual needs of passive monitoring.

[0039] The method for using the intelligent dressing based on the environmental backscattering comprises the following steps: Step A: Applying the smart dressing based on ambient backscattering to the patient’s wound; Step B: The energy collection unit collects the RF signal in the environment through the patch antenna in real time, and converts and stores the RF signal into DC power for powering the load; Step C: Determine whether the electric energy storage reaches the output voltage condition through the voltage monitor, that is, when the condition of 4.5V is met, the stored electric energy is output through the voltage output terminal VOUT to supply power to each functional unit and enter the next step, otherwise continue to wait until the output voltage condition is met; Step D: After the temperature and humidity sensor and the pH sensor are powered on and started, the collected wound temperature, humidity and pH information are sent to the control unit; Step E: After the control unit receives the wound temperature, humidity and pH information sent by the temperature and humidity sensor and the pH sensor, the control chip U4 outputs the position information instruction from the control unit to the communication unit through the DTU TX on the pin 30; Step F: The communication unit connects the received wound temperature, humidity and pH information to the pins of the SIM card chip U6 through pins 30, 31, 32 and 33, completing the communication between the communication unit and the monitoring communication terminal processing unit; Step G: The monitoring communication terminal processing unit displays and alarms the received wound temperature, humidity and pH data in real time: The acquired temperature, humidity and pH value data can be displayed in real time through the monitoring communication terminal. When the alarm threshold set by the monitoring communication terminal processing unit is exceeded, the monitoring communication terminal sends an alarm signal to prompt medical staff or patients to change dressings, check the wound condition, and take timely measures.

[0040] The above method is a brief introduction to the actual working principle of the dressing. The specific process is as follows: The radio frequency signal 21 emitted by the radio frequency signal source 4 in the surrounding environment is used as an energy source, which is collected by the energy collection unit 22 and converted into electrical energy for storage to achieve the function of powering the load. At present, the distributed energy that can be collected and utilized mainly includes thermal energy, solar energy, and radio frequency signals, and radio frequency energy collection is only one type of energy collection. Radio frequency sources include but are not limited to base stations, TV towers, etc. around the environment, and the radio frequency source is not limited to one, and there can be multiple radio frequency sources.

[0041] In the energy collection unit 22, the antenna EU11 converts the induced electromagnetic energy or magnetic field energy into electric energy that can be used internally through the RF-DC energy conversion chip U1, and stores the converted electric energy through the voltage stabilizing chip U2, voltage stabilizing diode ZU21, voltage stabilizing diode ZU22, capacitor CU20, capacitors CU21 and CU22, super capacitor CU23 with small leakage current, and voltage monitor to form a voltage stabilizing rectifier circuit to achieve the purpose of powering the load. The specific implementation process is as follows: 1) Antenna induction energy. The RF signal source antenna EU11 in the environment absorbs electromagnetic waves through electromagnetic induction, thereby converting energy and finally presenting it in the form of voltage or current.

[0042] 2) Preprocessing during energy transmission. Since the components of environmental electromagnetic waves are very complex, in order to prevent noise signals of other frequencies from adversely affecting the passive wireless communication system, a matching filter circuit needs to be added to filter out unnecessary signals. In the environmental backscattering system, the antenna and the load should be conjugate matched, that is, assuming the antenna impedance, then the load impedance), where is the antenna resistance, is the antenna reactance, and the superscript * indicates the conjugate match. jis an imaginary unit. In actual circuits, Figure 5 If the CT is always set to a high level state, the antenna of the energy collection unit 22 and the load impedance are always in a matching state, so that the ambient energy is absorbed by the antenna of the receiver.

[0043] 3) Rectification and storage. The RF AC signal received from the antenna cannot power the passive environmental backscattering device and must be rectified to achieve the conversion from AC to DC. Figure 4 As shown, the RF signal collected from the environment is pre-processed and then rectified by a rectifier composed of a capacitor CU20, a voltage stabilizing diode ZU21, and a voltage stabilizing diode ZU22. The rectified electric energy is then stored in the capacitor CU23 through a voltage stabilizing circuit composed of a voltage stabilizing chip U2, capacitors CU21 and CU22, and a super capacitor CU23 with a small leakage current. The voltage monitor is used to determine whether the output voltage condition is met. When the condition of 4.5V is met, the stored electric energy is output through the voltage output terminal VOUT to power each functional unit.

[0044] In the control unit 24 and the communication unit 25, the power level conversion chip U3 is used for the level conversion of the serial port, the control chip U4 is used as a micro control unit, and the signal communication chip U5 is used to receive GPS signals and GPRS communication. The SIM card chip U6 is used for communication between the communication unit and the remote monitoring terminal processing unit. To achieve the purpose of communication between the control unit and the communication unit communication interface. The specific implementation process is as follows: 1) The temperature and humidity sensor and pH sensor send the collected wound temperature, humidity and pH information to the control unit.

[0045] 2) The control unit sends instructions to the communication unit. After the control chip U4 receives the wound temperature, humidity and pH information sent by the temperature and humidity sensor and the pH sensor, the control chip U4 outputs the position information instruction from the control unit to the communication unit through the DTU TX on pin 30.

[0046] 3) The communication unit sends the information to the remote monitoring terminal through the remote monitoring terminal processing unit. The signal communication chip U5 connects the received wound temperature, humidity and pH information to the pins of the SIM card chip U6 through pins 30, 31, 32 and 33 to complete the communication between the communication unit and the remote monitoring terminal processing unit.

[0047] 4) The remote monitoring terminal processing unit controls the real-time display and alarm of the temperature, humidity and pH data of the wound on the remote monitoring terminal. The acquired temperature, humidity and pH value data can be displayed in real time through the remote monitoring terminal. When the alarm threshold set by the remote monitoring terminal processing unit is exceeded, the remote monitoring terminal sends an alarm signal to prompt medical staff or patients to change dressings, check the wound condition, and take timely measures. This realizes a complete closed loop of the collection of wound temperature, humidity and pH information, real-time transmission, real-time display and alarm.

[0048] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or are inherent to these processes, methods, products or apparatuses.

[0049] Note that the above are only preferred embodiments of the present invention and the principles of the application technology. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the specific embodiments described herein, and may include more other effective embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A smart dressing based on environmental backscattering, characterized in that: It includes an intelligent flexible dressing, a sensor group for collecting the wound microenvironment status arranged on the flexible dressing, an energy collection unit for collecting environmental radio frequency signals, and a control unit; the flexible isolation layer and the patch layer of the intelligent flexible dressing are stacked from top to bottom, and also include an annular antibacterial collagen-based composite sponge, a through hole is arranged in the middle of the patch layer, the antibacterial collagen-based composite sponge is embedded in the through hole, and the sensor group is embedded in the center of the annular antibacterial collagen-based composite sponge; the energy collection unit includes a radio frequency-to-direct current energy conversion chip, a voltage-stabilizing rectifier circuit and a patch antenna, the output end of the patch antenna is connected to the input end of the radio frequency-to-direct current energy conversion chip, the output end of the radio frequency-to-direct current energy conversion chip is connected to the sensor group through the voltage-stabilizing rectifier circuit for power supply, and the output end of the sensor group is connected to the input end of the control unit.

2. The intelligent dressing based on environmental backscattering according to claim 1, characterized in that: It also includes a communication unit and a remote monitoring terminal, wherein the communication unit is used to connect the control unit and the remote monitoring terminal for communication.

3. The intelligent dressing based on environmental backscattering according to claim 1, characterized in that: The sensor group includes a temperature and humidity sensor and a pH sensor.

4. A smart dressing based on environmental backscattering according to any one of claims 1 to 3, characterized in that: The radio frequency-to-direct current energy conversion chip U1 adopts a P1110B radio frequency-to-direct current energy conversion chip.

5. The intelligent dressing based on environmental backscattering according to claim 4, characterized in that: The voltage stabilizing and rectifying circuit is composed of a chip U2, a voltage monitor and a peripheral circuit, and the chip U2 adopts XC6206P302MR.

6. The intelligent dressing based on environmental backscattering according to claim 5, characterized in that: The control unit is composed of a power level conversion chip U3 of ADG902, a control chip U4 and peripheral circuits thereof, and the control chip U4 adopts STM32F103CBT6.

7. The intelligent dressing based on environmental backscattering according to claim 6, characterized in that: Pin 2 and pin 4 of the RF-DC energy conversion chip U1 are connected in parallel and then grounded, pin 3 of the RF-DC energy conversion chip U1 is connected to the antenna EU11, pin 7 of the RF-DC energy conversion chip U1 is connected to capacitor CU21, capacitor CU22, one end of the supercapacitor CU23 and pin 1 of the chip U2, and then grounded, pin 10 of the RF-DC energy conversion chip U1 is connected to the positive electrode of capacitor CU20, the negative electrode of capacitor CU20 is connected to one end of the Zener diode ZU21 and the Zener diode ZU22, the other end of the Zener diode ZU21 is grounded, and the other end of the Zener diode ZU22 is connected to capacitor CU2 1 is connected to the other end of capacitor CU22 and pin 3 of chip U2, pin 1 of chip U2 is connected to capacitor CU21, capacitor CU22, one end of super capacitor CU23 and pin 7 of RF-DC energy conversion chip U1, and then grounded; pin 2 of chip U2 is connected to the other end of super capacitor CU23, one end of voltage monitor and the output end of DC voltage Vcc, the other end of voltage monitor is grounded, pin 3 of chip U2 is connected to capacitor CU21, the other end of capacitor CU22 and the other end of Zener diode ZU22, the voltage monitor outputs electric energy when the voltage meets 4.5V, and the power-on reset voltage is 0.5V.

8. The intelligent dressing based on environmental backscattering according to claim 6, characterized in that: Pin 1 of the power level conversion chip U3 is connected to Vcc, pin 2 of the power level conversion chip U3 is connected to the CT signal, pin 3 of the power level conversion chip U3 is grounded, pin 4 of the power level conversion chip U3 is connected to one end of the resistor RU31, the other end of the resistor RU31 is grounded, pin 5, pin 6 and pin 7 of the power level conversion chip U3 are grounded, and pin 8 of the power level conversion chip U3 is connected to the antenna Ant; pin 1 and pin 48 of the control chip U4 are connected to Vcc and one end of the capacitor CU41, the other end of the capacitor CU41 is grounded, pin 2 of the control chip U4 is connected to the CT signal, pin 5 of the control chip U4 is connected to the resistor RU42 and the capacitor CU4 8. One end of the crystal oscillator YU41 is connected, and the other end of the capacitor CU48 is grounded. The pin 6 of the control chip U4 is connected to one end of the capacitor CU47 and the resistor RU42 and the other end of the crystal oscillator YU41. The other end of the capacitor CU47 is grounded. The pin 7 of the control chip U4 is connected to one end of the capacitor CU46 and the resistor RU41. The other end of the capacitor CU46 is grounded. The other end of the resistor RU41 is connected to Vcc. The pin 8 of the control chip U4 is grounded. The pin 20 of the control chip U4 is grounded. The pin 23 of the control chip U4 is grounded. The pin 24 of the control chip U4 is connected to one end of the capacitor CU45. The other end of the capacitor CU45 is grounded. The pin 26 of the control chip U4 is connected to DTU CTS, pin 27 of control chip U4 is connected to DTU RTS, pin 28 of control chip U4 is connected to DTU DTR, pin 30 of control chip U4 is connected to DTUTX, pin 31 of control chip U4 is connected to DTU RX, pin 35 of control chip U4 is grounded, pin 36 of control chip U4 is connected to Vcc and one end of capacitor CU44, and the other end of capacitor CU44 is grounded; pin 41 of control chip U4 is connected to one end of capacitor CU43, and the other end of capacitor CU43 is grounded; pin 43 of control chip U4 is connected to one end of capacitor CU42, and the other end of capacitor CU42 is grounded, and pin 47 of control chip U4 is grounded.

9. The method for preparing the environmental backscattering smart dressing according to claim 1, characterized in that: The steps include: Step 1: Use a hole puncher to cut a circular hole in the center of the antibacterial collagen-based composite sponge that is the same size as the temperature and humidity sensor and the pH sensor, and then use a hole puncher to cut a circular hole in the center of the patch layer that is the same size as the antibacterial collagen-based composite sponge; Step 2: embed the temperature and humidity sensor and the pH sensor into the antibacterial collagen-based composite sponge patch layer from the inside to the outside; Step 3: Use hot-press bonding technology to bond the flexible isolation layer to the temperature and humidity sensor, pH sensor, antibacterial collagen-based composite sponge and patch layer.

10. The method for using the intelligent dressing based on environmental backscattering according to claim 6, characterized in that: The steps include: Step A: Applying the smart dressing based on ambient backscattering to the patient’s wound; Step B: The energy collection unit collects the RF signal in the environment through the patch antenna in real time, and converts and stores the RF signal into DC power for powering the load; Step C: Determine whether the electric energy storage reaches the output voltage condition through the voltage monitor, that is, when the condition of 4.5V is met, the stored electric energy is output through the voltage output terminal VOUT to supply power to each functional unit and enter the next step, otherwise continue to wait until the output voltage condition is met; Step D: After the temperature and humidity sensor and the pH sensor are powered on and started, the collected wound temperature, humidity and pH information are sent to the control unit; Step E: After the control unit receives the wound temperature, humidity and pH information sent by the temperature and humidity sensor and the pH sensor, the control chip U4 outputs the position information instruction from the control unit to the communication unit through the DTU TX on the pin 30; Step F: The communication unit uses the SIM card chip U6 to complete the communication between the communication unit and the monitoring communication terminal processing unit, receiving the wound temperature, humidity and pH information; Step G: The monitoring communication terminal processing unit displays and alarms the received wound temperature, humidity and pH data in real time: The acquired temperature, humidity and pH value data can be displayed in real time through the monitoring communication terminal. When the alarm threshold set by the monitoring communication terminal processing unit is exceeded, the monitoring communication terminal sends an alarm signal to prompt medical staff or patients to change dressings, check the wound condition, and take timely measures.

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