Ultrasonic transduction device and ultrasonic probe using same

Abstract

The invention provides an ultrasonic transducer and an ultrasonic probe using the same. The ultrasonic transducer comprises a substrate, an ultrasonic oscillation unit, a grounding signal line, a direct-current voltage signal line and an alternating-current voltage signal line. The substrate includes an active device region and a wiring region around the active device region. The ultrasonic oscillation unit comprises a first electrode layer, a second electrode layer, a third electrode layer and a cavity, the first electrode layer is located on the first side of the cavity, and the second electrode layer and the third electrode layer are located on the second side of the cavity and are opposite to the first side. The grounding signal line is arranged in the wiring area and is electrically connected with the first electrode layer. The DC voltage signal line is arranged in the wiring area and is electrically connected with the second electrode layer. The AC voltage signal line is arranged in the wiring area and is electrically connected with the third electrode layer. The grounding signal line and the DC voltage signal line have electrical connection areas with different horizontal heights in the wiring area.

Description

Technical Field

[0001] The invention relates to a transducer device, in particular to an ultrasonic transducer device and an ultrasonic probe using the same. Background Art

[0002] As medical technology advances with each passing day, ultrasound detection technology is becoming more and more mature. Generally speaking, ultrasound detection uses a probe that emits ultrasound signals to emit ultrasound signals below the skin. In addition, the probe uses the reflected ultrasound signals to determine the shape and position of objects that are invisible to the naked eye below the skin for various medical purposes.

[0003] In order to improve the ultrasonic signal and image quality, the peripheral circuit of the ultrasonic transducer device needs to be modified so that the driving circuit is integrated into the peripheral circuit of the ultrasonic transducer device.

[0004] Therefore, it is necessary to design a new type of ultrasonic transducer and an ultrasonic probe using the same to overcome the above-mentioned defects. Summary of the invention

[0005] The object of the present invention is to provide an ultrasonic transducer device and an ultrasonic probe using the same, which can improve the performance of the ultrasonic transducer device and reduce the size.

[0006] To achieve the above-mentioned object, the present invention provides an ultrasonic transducer device, comprising: a substrate, comprising an active component area and a wiring area, wherein the wiring area is located around the active component area; an ultrasonic oscillation unit, arranged on the active component area, wherein the ultrasonic oscillation unit comprises a first electrode layer, a second electrode layer, a third electrode layer and a cavity, wherein the first electrode layer is located on a first side of the cavity, and the second electrode layer and the third electrode layer are located on a second side of the cavity, wherein the first side is opposite to the second side; a ground signal line, arranged in the wiring area, wherein the ground signal line is electrically connected to the first electrode layer; a direct current voltage signal line, arranged in the wiring area, wherein the direct current voltage signal line is electrically connected to the second electrode layer; and an alternating current voltage signal line, arranged in the wiring area, wherein the alternating current voltage signal line is electrically connected to the third electrode layer, wherein the ground signal line and the direct current voltage signal line have electrical connection areas of different levels in the wiring area.

[0007] Preferably, the active component area includes a first side connection area and a second side connection area, the ground signal line and the DC voltage signal line are arranged in the first side connection area and electrically connected to at least a portion of the ultrasonic oscillation unit, the AC voltage signal line is arranged in the second side connection area and electrically connected to at least a portion of the ultrasonic oscillation unit, and the first side connection area is different from the second side connection area.

[0008] Preferably, the active component area includes a plurality of the ultrasonic oscillation units, the plurality of ultrasonic oscillation units are arranged in one dimension to form a transducer unit, and the plurality of the transducer units are arranged side by side along a first direction, and the electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are arranged on any side or two opposite sides of the wiring area along the first direction.

[0009] Preferably, the AC voltage signal line is disposed on any one side or two opposite sides of the wiring area along a second direction perpendicular to the first direction.

[0010] Preferably, the AC voltage signal line is disposed on a first side of the wiring area along the second direction, and the ground signal line further includes an electrical connection area disposed on a second side of the wiring area along the second direction, and the first side is opposite to the second side.

[0011] Preferably, the electrical connection area of ​​the DC voltage signal line has a first level, and the electrical connection area of ​​the ground signal line has a second level, and the second level is higher than the first level.

[0012] Preferably, the electrical connection region of the ground signal line crosses over the electrical connection region of the DC voltage signal line in a second direction perpendicular to the first direction.

[0013] Preferably, the electrical connection area of ​​the ground signal line has a first level, and the electrical connection area of ​​the DC voltage signal line has a second level, and the second level is higher than the first level.

[0014] Preferably, the electrical connection region of the DC voltage signal line crosses over the electrical connection region of the ground signal line in a second direction perpendicular to the first direction.

[0015] Preferably, the first electrode layer has electrical connection areas with the same level in the active device area.

[0016] Preferably, the second electrode layer and the third electrode layer have electrical connection areas with different levels in the active device region.

[0017] Preferably, the second electrode layer and the third electrode layer have electrical connection regions with the same level in the active device region.

[0018] Preferably, the active component area includes a plurality of the ultrasonic oscillation units, the plurality of ultrasonic oscillation units are arranged in two dimensions and along a first direction and a second direction, the first direction is perpendicular to the second direction, and the electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are arranged on either side or opposite sides of the wiring area along the first direction and the second direction.

[0019] Preferably, the AC voltage signal line is disposed on either side or both opposite sides of the wiring area along the first direction and the second direction, and the electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are respectively located on adjacent sides of the AC voltage signal line.

[0020] Preferably, the second electrode layer is driven by a direct current voltage to be recessed toward the cavity relative to the first electrode layer, so that the first electrode layer and the second electrode layer are relatively close to each other.

[0021] Preferably, the third electrode layer is driven by an alternating voltage or an external sound pressure to vibrate relative to the first electrode layer.

[0022] The present invention also provides an ultrasonic probe, comprising: a handheld housing having a first end and a second end; and

[0023] The ultrasonic transducer device is arranged at the first end or the second end of the handheld shell, and the ultrasonic transducer device includes: a substrate, including an active component area and a wiring area, and the wiring area is located around the active component area; an ultrasonic oscillation unit is arranged on the active component area, and the ultrasonic oscillation unit includes a first electrode layer, a second electrode layer, a third electrode layer and a cavity, the first electrode layer is located on a first side of the cavity, the second electrode layer and the third electrode layer are located on a second side of the cavity, and the first side is opposite to the second side; a ground signal line is arranged in the wiring area, and the ground signal line is electrically connected to the first electrode layer; a direct current voltage signal line is arranged in the wiring area, and the direct current voltage signal line is electrically connected to the second electrode layer; and an alternating current voltage signal line is arranged in the wiring area, and the alternating current voltage signal line is electrically connected to the third electrode layer, wherein the second electrode layer and the third electrode layer have electrical connection areas with different or same levels in the active component area.

[0024] Preferably, the second electrode layer is driven by a direct current voltage to be recessed toward the cavity relative to the first electrode layer, so that the first electrode layer and the second electrode layer are relatively close to each other.

[0025] Compared with the prior art, an ultrasonic transducer device and an ultrasonic probe using the same are provided in an embodiment of the present invention. The ultrasonic transducer device is provided with a ground signal line, a DC voltage signal line and an AC voltage signal line on a wiring area (peripheral circuit area) so that a driving circuit is integrated into the peripheral circuit of the ultrasonic transducer device, thereby achieving the purpose of reducing the volume. In this way, there is no need to use an additional printed circuit board to connect the peripheral circuit of the ultrasonic transducer device, so as to reduce the wiring requirements, which is helpful to improve the performance of the patch type ultrasonic transducer device. At the same time, different electrical connection methods are provided for the requirements of designing and routing of various electrical signal circuits required by different ultrasonic transducers, which can further reduce the volume of the device and achieve the purpose of miniaturization and portability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1A and Figure 1B Schematic cross-sectional views of an ultrasonic transducer device according to an embodiment of the present invention are respectively shown.

[0027] Figure 2A A top view of an ultrasonic transducer device according to an embodiment of the present invention is shown.

[0028] Figure 2B FIG. 4 is a top view of an ultrasonic transducer device according to another embodiment of the present invention.

[0029] Figure 2C FIG. 4 is a top view of an ultrasonic transducer device according to another embodiment of the present invention.

[0030] Figure 2D and Figure 2E FIG. 4 shows a top view of an ultrasonic transducer device according to another embodiment of the present invention.

[0031] Figure 3A A top view of an ultrasonic transducer device according to an embodiment of the present invention is shown.

[0032] Figure 3B FIG. 4 is a top view of an ultrasonic transducer device according to another embodiment of the present invention.

[0033] Figure 4 FIG. 4 is a cross-sectional schematic diagram of an ultrasonic transducer device according to another embodiment of the present invention.

[0034] FIG. 5A to FIG. 5D FIG. 4 shows a top view of an ultrasonic transducer device according to another embodiment of the present invention.

[0035] Figure 6 A schematic diagram of an ultrasonic probe according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0036] In order to provide a further understanding of the purpose, structure, features and functions of the present invention, the following detailed description is given in conjunction with the embodiments.

[0037] Please refer to Figure 1A and Figure 1B, which respectively illustrate partial cross-sectional schematic diagrams of an ultrasonic transducer device 100 according to an embodiment of the present invention, and only illustrate a single ultrasonic oscillator unit 109. The ultrasonic transducer device 100 of this embodiment is, for example, a transducer formed by a plurality of capacitive micro-machined ultrasonic transducers (CMUTs), and includes a substrate 110 and an ultrasonic oscillator unit 109. The ultrasonic oscillator unit 109 is disposed on the substrate 110, and includes a first electrode layer 112, a first insulating layer 113, a second insulating layer 114, a second electrode layer 115, a third insulating layer 116, a third electrode layer 117, and a cavity 122 located between the first insulating layer 113 and the second insulating layer 114. In addition, the ultrasonic oscillator unit 109 can also be called an ultrasonic oscillator.

[0038] In one embodiment, the first electrode layer 112 and the first insulating layer 113 are located on the first side 122a (e.g., the lower side) of the cavity 122, and the second insulating layer 114, the second electrode layer 115, the third insulating layer 116, and the third electrode layer 117 are located on the second side 122b (e.g., the upper side) of the cavity 122, and the first side 122a is opposite to the second side 122b. The first electrode layer 112 can be used to receive a ground voltage, the second electrode layer 115 can be used to receive a direct current voltage DC, and the third electrode layer 117 can be used to receive an alternating current voltage AC. Alternatively, in another embodiment, the second electrode layer 115 can be used to receive an alternating current voltage AC, and the third electrode layer 117 can be used to receive a direct current voltage DC. For example, the second electrode layer 115 can be driven by the direct current voltage DC relative to the first electrode layer 112 and recessed toward the first electrode layer 112, so that the first insulating layer 113 and the second insulating layer 114 are relatively close. Alternatively, the third electrode layer 117 can be driven by the alternating voltage AC or external sound pressure to vibrate relative to the first electrode layer 112, thereby generating an ultrasonic signal. The pulse period of the alternating voltage AC can determine the vibration frequency of the output ultrasonic signal to generate ultrasonic signals of different frequencies.

[0039] Although in Figure 1A and Figure 1B Only a single ultrasonic oscillation unit 109 is shown, but it is conceivable that the ultrasonic oscillation units 109 can be arranged in a one-dimensional array or a two-dimensional array to form the transducer unit 107. For example, a plurality of ultrasonic oscillation units 109 can extend along the X-axis direction and be electrically connected to each other to form a one-dimensional array of transducer units 107, or a plurality of ultrasonic oscillation units 109 can extend along a perpendicular first direction (X-axis) and a second direction (Y-axis) and be electrically connected to each other to form a two-dimensional array of transducer units 107. See Figure 2AA plurality of ultrasonic oscillation units 109 are arranged one-dimensionally along the X-axis direction to form a transducer unit 107. Each transducer unit 107 can receive an AC voltage signal to vibrate or receive a DC voltage signal to maintain the film layer at a recessed position. In addition, each transducer unit 107 can also receive an external sound pressure signal (such as an ultrasonic signal) to vibrate.

[0040] Please refer to Figure 1A and Figure 1B The substrate 110 may be a semiconductor wafer or a glass substrate. The first electrode layer 112, the first insulating layer 113, the second insulating layer 114, the second electrode layer 115, the third insulating layer 116, and the third electrode layer 117 are formed on the substrate 110, for example, through a micro-electromechanical or semiconductor process. The semiconductor process includes a thin film deposition process, a lithography process, an etching process, and a cleaning process, wherein the thin film deposition process includes sequentially depositing a plurality of film layers on the substrate 110, the lithography process includes defining the pattern and shape of each film layer through a photoresist layer, so that each film layer is stacked at a predetermined position, the etching process includes removing excess film layers to form a cavity 122 in the film layer or forming a groove, and the cleaning process includes removing the photoresist layer, etching solution, and other solvents.

[0041] In one embodiment, the first electrode layer 112, the first insulating layer 113, the second insulating layer 114, the second electrode layer 115, the third insulating layer 116, and the third electrode layer 117 are stacked in order from bottom to top. The first electrode layer 112 is formed on the substrate 110, the first insulating layer 113 covers the first electrode layer 112, the second insulating layer 114 covers the first insulating layer 113, and there is a cavity 122 between the first insulating layer 113 and the second insulating layer 114, so that the first insulating layer 113 and the second insulating layer 114 are separated by a distance D at the cavity 122. The cavity 122 is, for example, a sacrificial layer pre-formed between the first insulating layer 113 and the second insulating layer 114. After the structure stacking is completed, the sacrificial layer is etched with an etching solution to form the cavity 122 between the first insulating layer 113 and the second insulating layer 114. Subsequently, the second electrode layer 115 is formed on the second insulating layer 114. Next, the third insulating layer 116 covers the second electrode layer 115, and the third electrode layer 117 covers the third insulating layer 116. In addition, in one embodiment, the ultrasonic oscillation unit 109 further includes an upper insulating layer 120 disposed on the second electrode layer 115 to protect the second electrode layer 115. The upper insulating layer 120, the first insulating layer 113 and the second insulating layer 114 can be made of the same or different materials. The above-mentioned insulating layer can be formed of silicon oxide (such as SiO2), nitride (such as SiN), oxynitride or any other suitable dielectric insulating material. Please refer to Figure 1BIn the above embodiment, the first electrode layer 112 can be directly connected in series with the first electrode layers 112 of multiple ultrasonic oscillation units 109 when the first electrode layer 112 is prepared for the purpose of process convenience or electrical performance.

[0042] Please refer to Figure 1A , Figure 1B and Figures 2A to 2E ,in Figures 2A to 2E Schematic top views of an ultrasonic transducer device 101 according to an embodiment of the present invention are shown respectively. The substrate 110 includes an active device region 105 and a wiring region 106, and the wiring region 106 is located around the active device region 105. The active device region 105 includes a plurality of ultrasonic oscillating units 109, and these ultrasonic oscillating units 109 are arranged in one dimension in the X-axis direction to form a transducer unit 107, and the plurality of transducer units 107 are arranged side by side along the Y-axis direction. In addition, the wiring area 106 includes a ground signal line 131, a DC voltage signal line 132, and an AC voltage signal line 133, wherein the ground signal line 131 is electrically connected to the first electrode layer 112 (see FIG. 1 ) of each ultrasonic oscillation unit 109, the DC voltage signal line 132 is electrically connected to the second electrode layer 115 (see FIG. 1 ) of each ultrasonic oscillation unit 109, and the AC voltage signal line 133 is electrically connected to the third electrode layer 117 (see FIG. 1 ) of the ultrasonic oscillation unit 109 in each transducer unit 107.

[0043] like Figures 2A to 2C As shown, the active device region 105 includes a first side connection region 105a and a second side connection region 105b. The first side connection region 105a is different from the second side connection region 105b. The ground signal line 131 and the DC voltage signal line 132 are disposed in the first side connection region 105a, and the AC voltage signal line 133 is disposed in the second side connection region 105b. Figures 2A to 2C In the embodiment, the first side connection area 105a is, for example, located at any one side or two opposite sides of the active device area 105, and the second side connection area 105b is, for example, located at any one side or two opposite sides of the active device area 105. For example, the two ground signal lines 131 and the two DC voltage signal lines 132 located at the two sides are respectively electrically connected to the corresponding at least one part of these ultrasonic oscillation units 109. In addition, the multiple AC voltage signal lines 133 located at the other two sides are respectively electrically connected to the corresponding at least one part of these ultrasonic oscillation units 109. The AC voltage signal lines 133 can be unidirectional input or multidirectional input, and the AC voltage signal lines 133 can be staggered or aligned.

[0044] In addition, Figures 2A to 2CIn the wiring area 106, the ground signal line 131 and the DC voltage signal line 132 have electrical connection areas with different levels. For example, from a top view, the ground signal line 131 and the DC voltage signal line 132 have different levels in the wiring area 106 in the overlapping area 134 due to electrical isolation. In addition, in the non-overlapping area, the ground signal line 131 and the DC voltage signal line 132 may have different levels in the wiring area 106, or may have the same level, as long as the two are electrically isolated.

[0045] exist Figure 2A and Figure 2C In the embodiment, the ground signal line 131 and the DC voltage signal line 132 are disposed on any one side or two opposite sides of the wiring area 106 along the Y-axis direction, and the electrical connection area of ​​the ground signal line 131 and the electrical connection area of ​​the DC voltage signal line 132 have at least an overlapping area 134 in the vertical direction (Z-axis). For example, the electrical connection area 132a of the DC voltage signal line 132 has a first horizontal height H1 (as shown in FIG. 1 ), and the electrical connection area 131a of the ground signal line 131 has a second horizontal height H2 (as shown in FIG. 1 ), and the second horizontal height H2 is higher than the first horizontal height H1, so that the electrical connection area of ​​the ground signal line 131 can cross over the electrical connection area of ​​the DC voltage signal line 132 and be isolated from each other by the first insulating layer. In addition, the AC voltage signal line 133 is disposed on any one side or two opposite sides of the wiring area 106 along the Y-axis direction perpendicular to the X-axis direction. In one embodiment, the AC voltage signal line 133 does not overlap with the projections of the ground signal line 131 and the DC voltage signal line 132 in the vertical direction (Z axis).

[0046] exist Figure 2B In the embodiment, the ground signal line 131 and the DC voltage signal line 132 are disposed on any one side or two opposite sides of the wiring area 106 along the Y-axis direction, and the projections of the electrical connection area 131a of the ground signal line 131 and the electrical connection area 132a of the DC voltage signal line 132 in the vertical direction (Z-axis) have at least one overlapping area 134. For example, the electrical connection area of ​​the ground signal line 131 has a first horizontal height H1, and the electrical connection area of ​​the DC voltage signal line 132 has a second horizontal height H2, and the second horizontal height H2 is higher than the first horizontal height H1, so that the electrical connection area of ​​the DC voltage signal line 132 can cross over the electrical connection area of ​​the ground signal line 131 and be isolated from each other by the first insulating layer 113. In addition, the AC voltage signal line 133 is disposed on any one side or two opposite sides of the wiring area 106 along the X-axis direction. In one embodiment, the AC voltage signal line 133 does not overlap with the projections of the ground signal line 131 and the DC voltage signal line 132 in the vertical direction (Z axis).

[0047] Please refer to Figure 2D, the electrical connection area 131a of the ground signal line 131 is higher than the electrical connection area 132a of the DC voltage signal line 132 in the overlapping area 134, and the extension directions (along the X-axis direction) of the ground signal line 131 and the DC voltage signal line 132 are opposite. Figure 2E , the electrical connection area 132a of the DC voltage signal line 132 is higher than the electrical connection area 131a of the ground signal line 131 in the overlapping area 134, and the DC voltage signal line 132 and the ground signal line 131 extend in opposite directions (along the X-axis direction). However, the DC voltage signal line 132 and the ground signal line 131 may extend in the same direction, and the present invention is not limited thereto.

[0048] In addition, please refer to Figure 3A and Figure 3B , which respectively illustrate a top view of an ultrasonic transducer device 102 according to an embodiment of the present invention. The difference is that the AC voltage signal line 133 is disposed on the first side S1 of the wiring area 106 along the X-axis direction, and is only located on a single side. Figure 3A In addition to being disposed on two opposite sides of the wiring area 106 along the Y-axis direction, the ground signal line 131 also includes an electrical connection area 131b disposed on the second side S2 of the wiring area 106 along the X-axis direction. The first side S1 is opposite to the second side S2, and the ground signal line 131 can also extend from the first side S1. In addition, the DC voltage signal line 132 can also extend from the first side S1. Figure 3B In the embodiment, the AC voltage signal line 133, the ground signal line 131 and the DC voltage signal line 132 can all be extended from a single side (the first side S1). However, in another embodiment, the AC voltage signal line 133, the ground signal line 131 and the DC voltage signal line 132 can all be extended from both sides (the first side S1 and the second side S2) to meet the requirements of various electrical signal line designs required by different ultrasonic transducer devices 102.

[0049] In one embodiment, the ground signal line 131 can be formed on the substrate 110 with the same material as the first electrode layer 122 in FIG. 1, and the desired patterns can be formed separately through the patterned film layer. The ground signal line 131 and the first electrode layer 122 at different levels can be electrically connected to each other through the conductive vias. Similarly, the DC voltage signal line 132 and the second electrode layer 115 at different levels can also be electrically connected to each other through the conductive vias.

[0050] In addition, the first electrode layer 112 in FIG. 1 has electrical connection areas at the same level in the active device area 105, the second electrode layer 115 has electrical connection areas at the same level in the active device area 105, and the third electrode layer 117 has electrical connection areas at different levels in the active device area 105. In addition, the second electrode layer 115 and the third electrode layer 117 have electrical connection areas at different levels in the active device area 105. However, in another embodiment, the second electrode layer 115 and the third electrode layer 117 have electrical connection areas at the same level in the active device area 105, for example, Figure 4 shown.

[0051] Please refer to Figure 4 , which is a schematic cross-sectional view of an ultrasonic transducer device 103 according to another embodiment of the present invention. In this embodiment, the ultrasonic oscillation unit 109 includes a first electrode layer 112, a first insulating layer 113, a second insulating layer 114, a second electrode layer 115, a third electrode layer 117, and a cavity 122 located between the first insulating layer 113 and the second insulating layer 114. The second electrode layer 115 and the third electrode layer 117 are formed on the second insulating layer 114, and the second electrode layer 115 and the third electrode layer 117 have electrical connection areas 115a and 117a of the same level in the active device area 105 (see FIG. 2A). The second electrode layer 115 and the third electrode layer 117 are electrically insulated from each other, wherein the second electrode layer 115 is located in the central area, and the third electrode layer 117 is located in the peripheral area of ​​the second electrode layer 115, or the third electrode layer 117 is located in the central area, and the second electrode layer 115 is located in the peripheral area of ​​the third electrode layer 117. In one embodiment, the third electrode layer 117 may extend along the X-axis direction and be electrically connected to the AC voltage signal line 133 (see Figure 2A ), and the second electrode layer 115 can extend along the Y-axis direction and be electrically connected to the DC voltage signal line 132 (refer to Figure 2A ), but the present invention is not limited thereto.

[0052] Please refer to FIG. 5A to FIG. 5D, which respectively illustrate a top view of an ultrasonic transducer device 104 according to another embodiment of the present invention. In this embodiment, the active component area 105 includes a plurality of ultrasonic oscillation units 109, and these ultrasonic oscillation units 109 are arranged in two dimensions, for example, M*N, where M is the number of rows and N is the number of columns. These ultrasonic oscillation units 109 are arranged along the X-axis direction and the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction. In addition, a plurality of first AC voltage signal lines 133a are arranged along the X-axis direction on any side or two opposite sides of the active component area 105, and a plurality of second AC voltage signal lines 133b are arranged along the Y-axis direction on any side or two opposite sides of the active component area 105, and the first AC voltage signal line 133 and the second AC voltage signal line 133 correspondingly intersect on these ultrasonic oscillation units 109 arranged in two dimensions, so as to input AC voltage to each ultrasonic oscillation unit 109 accordingly. The first AC voltage signal line 133 a and the second AC voltage signal line 133 b can be unidirectional input or multidirectional input.

[0053] In addition, the electrical connection area of ​​the ground signal line 131 and the electrical connection area of ​​the DC voltage signal line 132 are disposed on any side, two opposite sides, or two adjacent sides of the wiring area 106 along the X-axis direction and the Y-axis direction. Figure 5A In FIG. 1 , the ground signal line 131 and the DC voltage signal line 132 are not adjacent to each other and are arranged in four corners of the wiring area 106 . Figure 5B , the ground signal line 131 and the DC voltage signal line 132 are arranged on two adjacent sides of the wiring area 106, so that the electrical connection area of ​​the ground signal line 131 and the electrical connection area of ​​the DC voltage signal line 132 are respectively located on one adjacent side of the first AC voltage signal line 133a and the second AC voltage signal line 133b. The electrical connection area of ​​the ground signal line 131 and the electrical connection area of ​​the DC voltage signal line 132 can have different levels or the same level.

[0054] exist Figure 5C In the embodiment, the ground signal line 131 and the DC voltage signal line 132 are disposed on two adjacent sides of the wiring area 106, and the ground signal line 131 is disposed in a corner area of ​​the wiring area 106. Figure 5D In the figure, the ground signal line 131 is arranged at two adjacent sides of the wiring area 106, and the DC voltage signal line 132 is arranged at two corner areas of the wiring area 106, wherein the projections of the electrical connection area of ​​the ground signal line 131 and the electrical connection area of ​​the DC voltage signal line 132 in the vertical direction (Z axis) have an overlapping area 134 and are electrically isolated.

[0055] Please refer to Figure 6, which illustrates a schematic diagram of an ultrasonic probe 200 according to an embodiment of the present invention. The ultrasonic probe 200 includes a handheld housing 202, an acoustic lens 204, and an ultrasonic transducer 206. The handheld housing 202 has a first end (front end 201) and a second end (rear end 203). The acoustic lens 204 is disposed at the first end or the second end. The ultrasonic transducer 206 is disposed in the handheld housing 202 and is configured on a side of the handheld housing 202 close to the acoustic lens 204. In this embodiment, when a user uses the ultrasonic probe 200 to contact the user's skin, the ultrasonic probe 200 can focus the beam through the acoustic lens 204 at the front end 201 of the handheld housing 202 to transmit or receive ultrasonic signals, and the ultrasonic transducer 206 can transmit the acoustic signal back to the ultrasonic device via the signal transmission line 208 to process the beam of ultrasonic imaging. For detailed description of the ultrasonic transducer 206 , please refer to the ultrasonic transducer 100 - 104 of the above-mentioned embodiments, which will not be described in detail here.

[0056] In summary, the present invention provides an ultrasonic transducer device and an ultrasonic probe using the same. The ultrasonic transducer device includes a substrate, an ultrasonic oscillation unit, a ground signal line, a DC voltage signal line and an AC power signal line. The substrate includes an active component area and a wiring area, and the wiring area is located around the active component area; the ultrasonic oscillation unit is arranged on the active component area, and the ultrasonic oscillation unit includes a first electrode layer, a second electrode layer, a third electrode layer and a cavity, the first electrode layer is located on a first side of the cavity, the second electrode layer and the third electrode layer are located on a second side of the cavity, and the first side is opposite to the second side; the ground signal line is arranged in the wiring area, and the ground signal line is electrically connected to the first electrode layer; the DC voltage signal line is arranged in the wiring area, and the DC voltage signal line is electrically connected to the second electrode layer; and the AC voltage signal line is arranged in the wiring area, and the AC voltage signal line is electrically connected to the third electrode layer, wherein the ground signal line and the DC voltage signal line have electrical connection areas with different levels in the wiring area. The ultrasonic transducer device is provided with a ground signal line, a DC voltage signal line and an AC voltage signal line on the wiring area (peripheral circuit area) so that the driving circuit is integrated into the peripheral circuit of the ultrasonic transducer device, thereby achieving the purpose of reducing the volume. In this way, there is no need to use an additional printed circuit board to connect the peripheral circuit of the ultrasonic transducer device, so as to reduce the wiring requirements, which is helpful to improve the performance of the patch type ultrasonic transducer device. At the same time, according to the requirements of designing the routing of various electrical signal circuits required by different ultrasonic transducers, different electrical connection methods are provided, which can further reduce the volume of the device and achieve the purpose of miniaturization and portability of the device.

[0057] Although the present invention is described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify the preferred embodiments of the present invention and should not be construed as limiting the present invention. In order to clearly describe the required components, the proportions in the schematic drawings do not represent the proportional relationship of the actual components.

[0058] The present invention has been described by the above-mentioned relevant embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, changes and modifications made without departing from the spirit and scope of the present invention are all within the scope of patent protection of the present invention.

Claims

1. An ultrasonic transducer device, characterized in that: include: A substrate, comprising an active component region and a wiring region, wherein the wiring region is located around the active component region; An ultrasonic oscillation unit is disposed on the active component region, and includes a first electrode layer, a second electrode layer, a third electrode layer, and a cavity, wherein the first electrode layer is located on a first side of the cavity, the second electrode layer and the third electrode layer are located on a second side of the cavity, and the first side is opposite to the second side; A ground signal line is disposed in the wiring area, and the ground signal line is electrically connected to the first electrode layer; A DC voltage signal line is disposed in the wiring area, and the DC voltage signal line is electrically connected to the second electrode layer; and An AC voltage signal line is disposed in the wiring area, and the AC voltage signal line is electrically connected to the third electrode layer; The ground signal line and the DC voltage signal line have electrical connection areas with different levels in the wiring area.

2. The ultrasonic transducer device according to claim 1, characterized in that: The active component area includes a first side connection area and a second side connection area. The ground signal line and the DC voltage signal line are arranged in the first side connection area and are electrically connected to at least part of the ultrasonic oscillation unit. The AC voltage signal line is arranged in the second side connection area and is electrically connected to at least part of the ultrasonic oscillation unit. The first side connection area is different from the second side connection area.

3. The ultrasonic transducer device according to claim 1, characterized in that: The active component area includes a plurality of ultrasonic oscillation units, which are arranged in one dimension to form a transducer unit, and the plurality of transducer units are arranged side by side along a first direction. The electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are arranged on any one side or two opposite sides of the wiring area along the first direction.

4. The ultrasonic transducer device according to claim 3, characterized in that: The AC voltage signal line is arranged on any one side or two opposite sides of the wiring area along a second direction perpendicular to the first direction.

5. The ultrasonic transducer device according to claim 4, characterized in that: The AC voltage signal line is disposed on a first side of the wiring area along the second direction. The ground signal line further includes an electrical connection area disposed on a second side of the wiring area along the second direction. The first side is opposite to the second side.

6. The ultrasonic transducer device according to claim 3, characterized in that: The electrical connection area of ​​the DC voltage signal line has a first level height, and the electrical connection area of ​​the ground signal line has a second level height, and the second level height is higher than the first level height.

7. The ultrasonic transducer device according to claim 3, characterized in that: The electrical connection area of ​​the ground signal line has a first level height, and the electrical connection area of ​​the DC voltage signal line has a second level height, and the second level height is higher than the first level height.

8. The ultrasonic transducer device according to claim 1, characterized in that: The first electrode layer has electrical connection areas with the same level in the active component area.

9. The ultrasonic transducer device according to claim 1, characterized in that: The second electrode layer and the third electrode layer have electrical connection areas with different or same levels in the active device region.

10. The ultrasonic transducer device according to claim 1, characterized in that: The active component area includes a plurality of ultrasonic oscillation units, which are arranged in two dimensions and along a first direction and a second direction, wherein the first direction is perpendicular to the second direction, and the electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are arranged on any one side or two opposite sides of the wiring area along the first direction and the second direction.

11. The ultrasonic transducer device according to claim 10, characterized in that: The AC voltage signal line is disposed on any one side or two opposite sides of the wiring area along the first direction and the second direction, and the electrical connection area of ​​the ground signal line and the electrical connection area of ​​the DC voltage signal line are respectively located on adjacent sides of the AC voltage signal line.

12. The ultrasonic transducer device according to claim 1, characterized in that: The second electrode layer is driven by a direct current voltage to be recessed toward the cavity relative to the first electrode layer, so that the first electrode layer and the second electrode layer are relatively close to each other.

13. The ultrasonic transducer device according to claim 1, characterized in that: The third electrode layer is driven by an alternating voltage or an external sound pressure to generate vibration relative to the first electrode layer.

14. An ultrasonic probe, characterized in that: include: A handheld housing having a first end and a second end; as well as An ultrasonic transducer is disposed at the first end or the second end of the handheld housing, and the ultrasonic transducer comprises: A substrate, comprising an active component region and a wiring region, wherein the wiring region is located around the active component region; An ultrasonic oscillation unit is disposed on the active component region, and includes a first electrode layer, a second electrode layer, a third electrode layer, and a cavity, wherein the first electrode layer is located on a first side of the cavity, the second electrode layer and the third electrode layer are located on a second side of the cavity, and the first side is opposite to the second side; A ground signal line is disposed in the wiring area, and the ground signal line is electrically connected to the first electrode layer; A DC voltage signal line is disposed in the wiring area, and the DC voltage signal line is electrically connected to the second electrode layer; and An AC voltage signal line is disposed in the wiring area, and the AC voltage signal line is electrically connected to the third electrode layer; The second electrode layer and the third electrode layer have electrical connection areas with different or same levels in the active device area.

15. The ultrasonic probe according to claim 14, characterized in that: The second electrode layer is driven by a direct current voltage to be recessed toward the cavity relative to the first electrode layer, so that the first electrode layer and the second electrode layer are relatively close to each other.

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