Focus determination method, focusing device, equipment and storage medium
Patent Information
- Application Number
- CN202510363372.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2025-05-13
Smart Images
Figure CN119973345A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser engraving, and in particular to a focus determination method, a focusing device, equipment and a storage medium. Background Art
[0002] Before the laser processing equipment performs laser processing, it is necessary to determine the focus of the laser component in the laser processing equipment to improve the quality of laser processing.
[0003] Currently, users can use high-precision cameras to directly measure the focus of laser components. For example, by moving the high-precision camera to find the point with the thinnest spot in the laser component, the focus can be determined. Alternatively, users can use plastic sheets or aluminum oxide sheets as auxiliary materials to control the laser head of the laser processing equipment to move from top to bottom, perform laser engraving on the auxiliary materials, and determine that the position with a smaller marking diameter is the focus of the laser component. However, these methods of determining the focus have problems such as high cost and long time to determine the focus. Summary of the invention In view of the above, the embodiments of the present application provide a focus determination method, a focusing device, an equipment and a storage medium to solve the problems of high cost and long focus determination time existing in the focus determination method of existing laser processing equipment.
[0004] A first aspect of the present application provides a focus determination method, which is applied to a focusing device, wherein the focusing device is used to determine the focus of a laser assembly, the focusing device includes a debugging target surface and a focusing base, the laser assembly is used to emit a first laser to the debugging target surface fixedly connected to the focusing base, and form at least one debugging line on the debugging target surface; the focus determination method includes: driving the debugging target surface to move in a direction close to or away from the focusing base, so that a line between a first center point and a second center point is parallel to an extension direction of the focusing base, and the distance between the first center point and the second center point is equal to a preset debugging distance, wherein: The first center point is the center point of the debugging target surface, and the second center point is the center point of the laser assembly; the divergence angle of the first laser emitted by the laser assembly is adjusted multiple times, and the laser assembly is controlled to make the first lasers with different divergence angles fall on the debugging positions preset in the debugging target surface, so as to obtain multiple debugging lines, wherein one divergence angle corresponds to one debugging line; the lines among the multiple debugging lines that coincide with the center point of the debugging target surface and are centrally symmetrical with respect to the center point of the debugging target surface are taken as target lines; the focus of the target line processed by the laser assembly on the debugging target surface using laser is taken as the target focus.
[0005] Compared with the related art, the embodiments of the present application have at least the following advantages: When it is necessary to determine the focus of the laser assembly, first, drive the debugging target surface to move in a direction close to or away from the focusing base, so that the line between the first center point and the second center point is parallel to the focusing base, and the distance between the first center point and the second center point is equal to the preset debugging distance, so that the line processed by the first laser on the debugging target surface can be located at the preset debugging position as much as possible. Then, adjust the divergence angle of the first laser emitted by the laser assembly for multiple times, and control the first laser emitted by the laser assembly based on the divergence angle to fall on the debugging position each time, and obtain multiple debugging lines. Finally, when the laser assembly laser processes the target line on the debugging target surface, the focus of the laser assembly is used as the target focus. In this way, the user only needs to adjust the divergence angle of the first laser emitted by the laser assembly, and determine the target line from the multiple debugging lines processed by the laser to obtain the focus of the laser assembly, without the need to use an expensive high-precision camera or accurately control the laser head to move from top to bottom to determine the focus.
[0006] In some possible implementations, the laser assembly includes a field lens, which is used to focus the first laser on the debugging target surface; driving the debugging target surface to move in a direction close to or away from the focusing base so that the line between the first center point and the second center point is parallel to the extension direction of the focusing base, and the distance between the first center point and the second center point is equal to a preset debugging distance, includes: driving the debugging target surface to move in a direction at a preset angle to the focusing base, so that the line between the center point of the field lens and the second center point is parallel to the extension direction of the focusing base, and the distance between the center point of the field lens and the second center point is equal to the debugging distance.
[0007] In some possible implementations, the laser assembly also includes a beam expander, which is used to change the diameter of the first laser; the multiple adjustment of the divergence angle of the first laser emitted by the laser assembly, and the control of the laser assembly to make the first lasers with different divergence angles fall on the debugging position preset in the debugging target surface to obtain the plurality of debugging lines, includes: multiple adjustment of the position of the beam expander to change the divergence angle of the first laser; control the field lens to make the first laser after the divergence angle is changed fall on the debugging position to obtain the plurality of debugging lines.
[0008] The second aspect of the present application discloses a focus determination method, which is applied to laser processing equipment. The laser processing equipment includes a laser component and a carrying platform. The laser component is used to emit a second laser to the carrying platform. The focus of the laser component is obtained by the focus determination method as described above; the focus determination method includes: when it is necessary to redetermine the target focus, determining the lifting range of the laser component based on the debugging distance; controlling the laser component to move up and down relative to the carrying platform multiple times so that the distance between the laser component and the carrying platform is within the lifting range, and laser processing multiple correction patterns on the carrying platform, wherein the multiple correction patterns are the same; based on the position data of the multiple correction patterns, redetermining the new target focus.
[0009] Compared with the related art, the embodiments of the present application have at least the following advantages: After the laser processing equipment has been used for a period of time, some parts may be damaged. For example, if one or more of the laser, galvanometer, field lens and beam expander in the laser assembly is damaged, and then there is a need to replace the parts, the target focus of the laser assembly needs to be re-determined. The laser assembly is controlled to move multiple times within the lifting range, and multiple correction patterns are laser processed on the carrier platform, and a more accurate new target focus is obtained based on the first position data of the first correction pattern and the second position data of the last correction pattern. The focus determination method in this embodiment only moves the laser assembly to calculate the accurate target focus by laser processing multiple correction patterns on the carrier platform. This focus determination method has the advantages of simple operation, no need for additional components, low cost, and high accuracy.
[0010] In some possible implementations, the new target focus is re-determined based on the position data of the multiple correction figures, including: acquiring first position data and second position data, the first position data being the position data of the first correction figure laser-processed by the laser assembly on the carrier platform, and the second position data being the position data of the last correction figure laser-processed on the carrier platform; and determining the new target focus based on the average of the first position data and the second position data.
[0011] The third aspect of the present application discloses a focusing device, which includes a first controller, a debugging target surface, a first driving member and a focusing base. The debugging target surface and the first driving member are provided at one end of the focusing base, and a laser assembly is provided at the other end. The first driving member is used to drive the debugging target surface to move in a direction close to or away from the focusing base. The laser assembly is used to emit a first laser to the debugging target surface and form at least one debugging line on the debugging target surface. The first controller is communicatively connected to the laser assembly and the first driving member. The first controller is used to execute the focus determination method described in the first aspect.
[0012] In some possible implementations, the focusing device further includes a screw rod, one end of which is fixedly connected to the focusing base, and the other end of which is movably connected to the first driving member, and there is a preset angle between the screw rod and the focusing base.
[0013] The fourth aspect of the present application discloses a laser processing device, which includes a laser component, a second driving component, a carrying platform and a second controller. The laser component and the carrying platform are arranged relative to each other and at a distance. The second driving component is used to drive the laser component to move toward or away from the carrying platform. The second controller communicates with the laser component and the second driving component. The second controller is used to execute the focus determination method described in the second aspect.
[0014] The fifth aspect of the present application discloses an electronic device, which includes a memory and a processor, wherein the processor is communicatively connected to the memory, and the processor is used to execute the focus determination method as described in the first aspect or execute the focus determination method as described in the second aspect.
[0015] The sixth aspect of the present application discloses a computer storage medium, comprising computer instructions. When the computer instructions are executed on an electronic device, the electronic device executes the focus determination method as described in the first aspect or executes the focus determination method as described in the second aspect.
[0016] It can be understood that the focus device of the third aspect provided above corresponds to the method of the first aspect, the laser processing equipment of the fourth aspect corresponds to the method of the second aspect, the electronic equipment of the fifth aspect corresponds to the methods of the first and second aspects, and the computer storage medium of the sixth aspect also corresponds to the methods of the first and second aspects. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A simplified structural diagram of a focusing device provided in one embodiment of the present application.
[0018] Figure 2 A flowchart of the steps of a focus determination method provided in one embodiment of the present application.
[0019] Figure 3 for Figure 1 The focusing device in Figure 2 Schematic diagram of multiple debugging lines processed by laser using the focus determination method in FIG.
[0020] Figure 4 A simplified structural diagram of a laser processing device provided in one embodiment of the present application.
[0021] Figure 5 Another flowchart of a focus determination method provided in an embodiment of the present application.
[0022] Figure 6 for Figure 4 Schematic diagram of the distribution of multiple correction patterns processed by the laser processing equipment in the figure.
[0023] Figure 7 This is an intentional distribution of Gaussian spot focusing provided in one embodiment of the present application.
[0024] Figure 8 A schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application.
[0025] Main component symbols Carrying substrate, 1; focusing base, 2; laser assembly, 3; first driving member, 4; lead screw, 5; second driving member, 6; carrying platform, 7; laser, 31; galvanometer, 32; field lens, 33; beam expander, 34; debugging target surface, P; preset angle, a.
[0026] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0027] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the implementation methods of the present application and the features in the implementation methods can be combined with each other without conflict.
[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present application. The described implementations are only part of the implementations of the present application, rather than all the implementations.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0030] It should be further noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0031] In this application, "at least one" means one or more, and "more" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.
[0032] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.
[0033] Before the laser processing equipment performs laser processing, it is necessary to determine the focus of the laser component in the laser processing equipment to improve the quality of laser processing.
[0034] Currently, users can use high-precision cameras to directly measure the focus of laser components. For example, by moving the high-precision camera to find the point with the thinnest spot in the laser component, the focus can be determined. Alternatively, users can use plastic sheets or aluminum oxide sheets as auxiliary materials to control the laser head of the laser processing equipment to move from top to bottom, perform laser engraving on the auxiliary materials, and determine that the position with a smaller marking diameter is the focus of the laser component. However, these methods of determining the focus have problems such as high cost and long time to determine the focus.
[0035] To facilitate understanding, some illustrations of concepts related to the embodiments of the present application are given by way of example for reference.
[0036] Laser processing equipment includes laser components, which include lasers, beam expanders, field mirrors and galvanometers. Among them, the laser is the core component for generating laser beams and provides energy sources for laser processing. Common ones include semiconductor lasers, etc. The beam expander will expand the diameter of the laser beam emitted by the laser and reduce its divergence angle, so that the laser beam can be transmitted in a more collimated and uniform state in the subsequent propagation, providing better beam quality for subsequent optical path adjustment and processing operations. The laser beam after beam expansion then reaches the galvanometer. The galvanometer changes the propagation direction of the laser beam by rapid swinging, so that it can be quickly scanned in a two-dimensional plane, thereby controlling the movement trajectory of the laser beam on the surface of the processed material and realizing the processing of various complex patterns or shapes. The laser beam scanned by the galvanometer finally reaches the field mirror. The main function of the field mirror is to focus the laser beam on a specific working plane, so that the laser can form a uniformly sized focused light spot on this plane within the entire scanning range, ensuring the consistency and accuracy of the processing effect.
[0037] In order to solve the problems of high cost and long time of focus determination in the existing focus determination method, the present application proposes a focus determination method. The focus determination method is applied to a focusing device, which is used to determine the focus of a laser component. Please refer to Figure 1 The focusing device includes a debugging target surface P and a focusing base 2, wherein the debugging target surface P and a laser assembly 3 are respectively located at opposite ends of the focusing base 2, and the debugging target surface P and the laser assembly 3 are arranged at intervals, and the laser assembly 3 is used to emit a first laser to the debugging target surface P, and form at least one debugging line on the debugging target surface P. In this embodiment, the debugging target surface P is a partial surface of a carrier substrate 1, and the carrier substrate 1 is in a strip shape, and the carrier substrate 1 can be moved in a direction close to or away from the focusing base 2. And the material of the carrier substrate 1 can be a steel product. In other embodiments, the carrier substrate 1 can also be other materials, and the present application does not limit the specific material of the carrier substrate 1.
[0038] Specifically, the focusing device further includes a first controller (not shown) and a first driving member 4, the debugging target surface P and the first driving member 4 are located at one end of the focusing base 2, and the laser assembly 3 is located at the other end of the focusing base 2. The first driving member 4 is used to drive the debugging target surface P to move toward or away from the focusing base 2, and the moving direction of the debugging target surface P is at a preset angle to the focusing base 2. In this embodiment, the first driving member 4 can be a motor, and the preset angle can be 30° or 45°, but the present application does not limit the specific value of the preset angle. In other embodiments, the preset angle can also be 35°, 40° or 50°, etc.
[0039] The laser assembly 3 is used to emit a first laser to the debugging target surface P, and form at least one debugging line on the debugging target surface P. The first controller is connected to the laser assembly 3 and the first driving member 4 in communication. The first controller is used to execute the following steps: Figure 2 The focus determination method shown.
[0040] In this embodiment, the first controller may include one or more processing units, for example, the first controller may include an application processor (AP), a modem, a graphics processing unit (GPU), an image signal processor (ISP), a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or may be integrated into one or more first controllers.
[0041] In some embodiments, the focusing device further comprises a screw rod 5, one end of which is fixedly connected to the focusing base 2, and the other end of which is movably connected to the first driving member 4, and a preset angle is formed between the screw rod 5 and the focusing base 2 (ie, Figure 1 Angle a).
[0042] Please refer to Figure 2 , is a flowchart of the steps of a focus determination method provided in an embodiment of the present application. The focus determination method comprises the following steps: Step 101: driving the debugging target surface to move toward or away from the focusing base, so that the line between the first center point and the second center point is parallel to the extension direction of the focusing base, and the distance between the first center point and the second center point is equal to a preset debugging distance.
[0043] In some embodiments, the first center point is the center point of the debugging target surface P, and the second center point is the center point of the laser assembly 3. Specifically, the second center point is the center point of the emission port of the laser assembly 3 that emits the first laser.
[0044] In this embodiment, the first controller in the focusing device drives the debugging target surface P to move in a direction at an angle a with the focusing base 2, so that the line between the center point of the field lens and the second center point is parallel to the focusing base 2, and the distance between the center point of the field lens and the second center point is equal to the debugging distance. The debugging distance can be set according to the distance between the laser assembly 3 and the carrier platform 7 in the actual laser processing equipment, and the present application does not limit the specific value of the debugging distance.
[0045] For example, the debugging distance can be 160mm, 162mm, 165mm or 169mm, etc.
[0046] It should be noted that, in this embodiment, the adjustment target surface P is controlled to move in the direction of the angle a with the adjustment base 2, so that the energy distribution of the laser beam emitted by the laser assembly 3 on the adjustment target surface P can be more uniform. That is, for a laser beam with Gaussian distribution, the center energy is high and the edge energy is low when it is vertically incident. The inclined adjustment target surface P can change the projection area of the laser beam on the adjustment target surface P, making the energy distribution more uniform, which is helpful to obtain more consistent line width, color depth or material modification effect when laser processing graphics, and improve the uniformity and consistency of graphics.
[0047] Step 102: The divergence angle of the first laser emitted by the laser assembly is adjusted multiple times, and the laser assembly is controlled to make the first lasers with different divergence angles fall on the debugging positions preset in the debugging target surface, so as to obtain multiple debugging lines.
[0048] In some embodiments, one divergence angle corresponds to one debugging line. That is to say, after adjusting the divergence angle of the first laser emitted by the laser component 3 for the first time (recorded as the first divergence angle), the laser component 3 is controlled to make the first laser corresponding to the first divergence angle fall on the debugging position in the debugging target surface P, and the laser component 3 is controlled to laser process a debugging line on the debugging target surface P. Then, after adjusting the divergence angle of the first laser emitted by the laser component 3 for the second time (recorded as the second divergence angle), the laser component 3 is controlled to make the first laser corresponding to the second divergence angle fall on the debugging position in the debugging target surface P, and the laser component 3 is controlled to laser process another debugging line on the debugging target surface P... In this way, the laser component 3 can be controlled to laser process multiple debugging lines on the debugging target surface P.
[0049] In this embodiment, the multiple debugging lines laser-processed by the laser assembly 3 on the debugging target surface P are parallel to each other. The divergence angle of the first laser can be changed by adjusting the position of the beam expander in the laser assembly 3. Then the control scene is controlled to make the first laser after the divergence angle is changed fall on the debugging position in the debugging target surface P, and multiple debugging lines are obtained. Among them, the lengths of the multiple debugging lines can be the same or different.
[0050] Specifically, after the laser assembly 3 laser processes the first debugging line on the debugging target surface P, the carrier substrate 1 is controlled to move away from the focusing base 2. Then, the laser assembly 3 is controlled to laser process the second debugging line on the debugging target surface P. In this way, multiple debugging lines can be laser processed on the carrier substrate 1.
[0051] It should be noted that, in this embodiment, laser processing of debugging lines on the debugging target surface P is used as an example for explanation, but it does not mean that only debugging lines can be laser processed. In other embodiments, the laser assembly 3 can also be controlled to laser process graphics of other shapes on the debugging target surface P, and this application does not limit this.
[0052] It should also be noted that the multiple debugging lines may be parallel to each other or not. In this embodiment, the laser assembly 3 is controlled to laser process multiple parallel debugging lines on the debugging target surface P in order to quickly determine the target focus later.
[0053] It should also be noted that the debugging position of the debugging target surface P can be the center point of the debugging target surface P, or the debugging position of the debugging target surface P can also be other points except the center point of the debugging target surface P. The present application does not limit this. The debugging position of the debugging target surface P is set according to the actual laser processing requirements, as long as the debugging position is any point within the debugging target surface P.
[0054] Step 103: Among the multiple debugging lines, a line that coincides with the center point of the debugging target surface and is centrosymmetric with respect to the center point of the debugging target surface is taken as a target line.
[0055] In this embodiment, please refer to Figure 3 , Figure 3 There are multiple debugging lines in the image, namely, line 1 to line 5. Since the center point of line 4 coincides with the center point of the debugging target surface P, and line 4 is symmetrical relative to the center point of the debugging target surface P, line 4 is used as the target line.
[0056] Step 104: Use the laser assembly to process the focus of the target line on the debugging target surface using the laser as the target focus.
[0057] In this embodiment, the focus of the line 4 processed by the laser assembly 3 on the debugging target surface P by laser is used as the target focus.
[0058] Compared with the related art, the embodiments of the present application have at least the following advantages: In the case where the focus of the laser assembly needs to be determined, the laser assembly is placed at one end of the focusing base opposite to the debugging target surface, and at the same time, the debugging target surface is spaced from the laser assembly so that the debugging target surface can receive the first laser emitted by the laser assembly. First, the debugging target surface is driven to move in a direction with a preset angle to the focusing base so that the line between the first center point and the second center point is parallel to the focusing base, and the distance between the first center point and the second center point is equal to the preset debugging distance, so that the line processed by the first laser on the debugging target surface can be located at the preset debugging position as much as possible. Then, the divergence angle of the first laser emitted by the laser assembly is adjusted multiple times so that each time the first laser emitted by the laser assembly based on the divergence angle falls on the debugging position, and multiple debugging lines are obtained. Finally, when the laser assembly laser processes the target line on the debugging target surface, the focus of the laser assembly is used as the target focus. In this way, the user only needs to adjust the divergence angle of the first laser emitted by the laser assembly and determine the target line from the multiple debugging lines processed by the laser to obtain the focus of the laser assembly, without the need to use an expensive high-precision camera or accurately control the laser head to move from top to bottom to determine the focus.
[0059] Another embodiment of the present application also provides a focus determination method, which is applied to Figure 4 The laser processing equipment shown in the figure, wherein the laser processing equipment can be a laser engraving machine, and can also be other equipment that uses laser for processing. The laser processing equipment includes the laser component 3 as described above, the second driving member 6, the carrying platform 7 and the second controller (not shown in the figure), the laser component 3 and the carrying platform 7 are arranged oppositely and spaced apart, the second driving member 6 is used to drive the laser component 3 to move in a direction close to or away from the carrying platform 7, the second controller is connected to the laser component 3 and the second driving member 6 in communication, and the second controller is used to execute as follows Figure 5 The focus determination method shown.
[0060] In this embodiment, the second driving member 6 may be a motor, and the second controller may include one or more processing units, for example, the second controller may include an application processor (AP), a modem, a graphics processing unit (GPU), an image signal processor (ISP), a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units may be independent devices or integrated in one or more second controllers.
[0061] Please refer to Figure 5 , is another step flow chart of a focus determination method provided in an embodiment of the present application. The method comprises the following steps: Step 201: When it is necessary to redefine the target focus, determine the lifting range of the laser assembly based on the debugging distance.
[0062] In this embodiment, after the laser processing equipment has been used for a period of time, some parts may be damaged. For example, if one or more of the laser 31, the galvanometer 32, the field lens 33 and the beam expander 34 in the laser assembly 3 are replaced, the target focus of the laser assembly 3 needs to be re-determined.
[0063] In this embodiment, the difference between the debugging distance and the preset step length is used as one end point of the lifting range, and the sum of the debugging distance and the preset step length is used as the other end point of the lifting range. For example, when the debugging distance is 169 mm and the preset step length is 5 mm, the lifting range is 164 mm-174 mm. The preset step length can be set according to the driving step length of the second driving member 6, and the present application does not limit the specific value of the preset step length.
[0064] Step 202: Control the laser assembly to move up and down relative to the carrier platform multiple times so that the distance between the laser assembly and the carrier platform is within the lifting range, and laser process multiple correction patterns on the carrier platform, wherein the multiple correction patterns are the same.
[0065] In this embodiment, the laser assembly 3 is controlled by the second driving member 6 to move multiple times within the lifting range, and a plurality of cross patterns are processed by laser on the carrying platform 7, such as Figure 6 As shown, 10 cross patterns are processed by laser in the carrying platform 7.
[0066] It should be noted that multiple correction graphs can be Figure 6 The correction patterns may not be in the same row, or they may all be in the same row, or the correction patterns may be in three rows or more than three rows, which is not limited in the present application, as long as the correction patterns are arranged according to the preset arrangement rules.
[0067] The preset arrangement rule in this embodiment means that there are multiple rows of grids in the supporting platform 7, and the laser processing equipment uses a grid in a row as the starting point to laser process a cross pattern (recorded as the first pattern), and then laser processes another cross pattern (recorded as the second image) to the adjacent grid in the same row to the right of the grid where the first pattern is located... After the grids to the right of the grid where the first pattern is located in the row are laser processed with cross patterns, the cross pattern is laser processed to the next row.
[0068] In other embodiments, the correction figure may also be a square or a diamond, and the present application does not limit the specific shape of the correction figure.
[0069] Step 203: re-determine a new target focus based on the position data of the plurality of correction patterns.
[0070] See also Figure 7 , Figure 7 is a distribution diagram of Gaussian spot focusing. It can be seen from the figure that the spot energy and the debugging distance are symmetrical relative to the central focus. Therefore, the first position data of the first correction pattern laser processed by the laser assembly 3 on the carrier platform 7 and the second position data of the last correction pattern can be obtained. Based on the mean of the first position data and the second position data, a new target focus is determined. In this embodiment, the data obtained by rounding the mean of the first position data and the second position data is used as the new target focus, so that the new target focus obtained is more accurate.
[0071] Compared with the related art, the embodiments of the present application have at least the following advantages: After the laser processing equipment has been used for a period of time, if some of its components are damaged. For example, if one or more of the laser, galvanometer, field lens and beam expander in the laser assembly is damaged, and then there is a need to replace the components, the target focus of the laser assembly needs to be re-determined. The laser assembly is controlled by the second driving member to move multiple times within the lifting range, and multiple correction patterns are laser processed on the carrying platform, and a more accurate new target focus is obtained based on the first position data of the first correction pattern and the second position data of the last correction pattern. The focus determination method in this embodiment only controls the second driving member to move the laser assembly, so as to calculate the accurate target focus by laser processing multiple correction patterns on the carrying platform. This focus determination method has the advantages of simple operation, no need for additional components, low cost, and high accuracy.
[0072] Please refer to Figure 8 , is a schematic diagram of the hardware structure of the electronic device 1000 provided in the embodiment of the present application. Figure 8 As shown, the electronic device 1000 may include a processor 1001 and a memory 1002. The memory 1002 is used to store one or more computer programs 1003. The one or more computer programs 1003 are configured to be executed by the processor 1001. The one or more computer programs 1003 include instructions, and the above instructions can be used to implement the above method in the electronic device 1000.
[0073] It is understandable that the structure shown in this embodiment does not constitute a specific limitation on the electronic device 1000. In other embodiments, the electronic device 1000 may include more or fewer components than shown, or combine or separate some components, or arrange the components differently.
[0074] The processor 1001 may include one or more processing units, for example, the processor 1001 may include an application processor (AP), a modem, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors.
[0075] The processor 1001 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 1001 is a cache memory. The memory may store instructions or data that the processor 1001 has just used or circulated. If the processor 1001 needs to use the instruction or data again, it may be directly called from the memory. This avoids repeated access, reduces the waiting time of the processor 1001, and thus improves the efficiency of the system.
[0076] In some embodiments, the processor 1001 may include one or more interfaces. The interface may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a SIM interface, and / or a USB interface, etc.
[0077] In some embodiments, memory 1002 may include high-speed random access memory and may also include non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.
[0078] This embodiment further provides a computer-readable storage medium, in which computer instructions are stored. When the instructions are executed on an electronic device, the electronic device executes the above-mentioned related method steps to implement the method in the above-mentioned embodiment.
[0079] Among them, the electronic device and computer storage medium provided in this embodiment are used to execute the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here.
[0080] In practical applications, the above functions can be distributed to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.
[0081] In several embodiments provided in the present application, the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are schematic. For example, the division of the modules or units is a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.
[0082] The unit described as a separate component may or may not be physically separated, and the component shown as a unit may be one physical unit or multiple physical units, that is, it may be located in one place or distributed in multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
[0083] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.
[0084] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent molded object, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software molded object, which is stored in a storage medium, including several instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), disk or optical disk and other media that can store program codes.
[0085] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application.
Claims
1. A focus determination method, applied to a focusing device, wherein the focusing device is used to determine the focus of a laser component, characterized in that: The focusing device comprises a debugging target surface and a focusing base, and the laser assembly is used to emit a first laser to the debugging target surface fixedly connected to the focusing base, and form at least one debugging line on the debugging target surface; The focus determination method comprises: Drive the debugging target surface to move in a direction close to or away from the focusing base, so that the line between the first center point and the second center point is parallel to the extension direction of the focusing base, and the distance between the first center point and the second center point is equal to a preset debugging distance, wherein the first center point is the center point of the debugging target surface, and the second center point is the center point of the laser assembly; Adjusting the divergence angle of the first laser emitted by the laser assembly for multiple times, and controlling the laser assembly to make the first lasers with different divergence angles fall on the debugging positions preset in the debugging target surface, so as to obtain a plurality of debugging lines, wherein one divergence angle corresponds to one debugging line; Among the plurality of debugging lines, a line that coincides with the center point of the debugging target surface and is centrosymmetric with respect to the center point of the debugging target surface is used as a target line; The laser assembly is used to laser process the focus of the target line on the debugging target surface as the target focus.
2. The focus determination method according to claim 1, characterized in that: The laser assembly includes a field lens, and the field lens is used to focus the first laser on the debugging target surface; the driving of the debugging target surface to move in a direction close to or away from the focusing base, so that the line between the first center point and the second center point is parallel to the extension direction of the focusing base, and the distance between the first center point and the second center point is equal to a preset debugging distance, includes: The debugging target surface is driven to move in a direction at a preset angle to the focusing base, so that a line between the center point of the field lens and the second center point is parallel to an extension direction of the focusing base, and a distance between the center point of the field lens and the second center point is equal to the debugging distance.
3. The focus determination method according to claim 2, characterized in that: The laser assembly further includes a beam expander, which is used to change the diameter of the first laser. The divergence angle of the first laser emitted by the laser assembly is adjusted multiple times, and the laser assembly is controlled to make the first lasers with different divergence angles fall on the debugging positions preset in the debugging target surface to obtain multiple debugging lines, including: Adjusting the position of the beam expander multiple times to change the divergence angle of the first laser; The field mirror is controlled to make the first laser light after the divergence angle is changed fall on the debugging position, so as to obtain a plurality of debugging lines.
4. A focus determination method, characterized in that: Applied to laser processing equipment, the laser processing equipment comprises a laser component and a carrying platform, the laser component is used to emit a second laser to the carrying platform, and the focus of the laser component is obtained by the focus determination method according to any one of claims 1 to 3; The focus determination method comprises: In the case where the target focus needs to be re-determined, determining the lifting range of the laser assembly based on the debugging distance; Controlling the laser assembly to move up and down relative to the carrying platform multiple times so that the distance between the laser assembly and the carrying platform is within the lifting range, and laser processing a plurality of correction patterns on the carrying platform, wherein the plurality of correction patterns are the same; Based on the position data of the plurality of correction patterns, the new target focus is re-determined.
5. The focus determination method according to claim 4, characterized in that: The re-determining the new target focus based on the position data of the plurality of correction patterns comprises: Acquire first position data and second position data, wherein the first position data is position data of the first correction pattern laser-processed by the laser assembly on the carrier platform, and the second position data is position data of the last correction pattern laser-processed on the carrier platform; A new target focus is determined based on an average of the first position data and the second position data.
6. A focusing device, characterized in that: The focusing device includes a first controller, a debugging target surface, a first driving member and a focusing base. The debugging target surface and the first driving member are provided at one end of the focusing base, and a laser assembly is provided at the other end. The first driving member is used to drive the debugging target surface to move toward or away from the focusing base. The laser assembly is used to emit a first laser to the debugging target surface and form at least one debugging line on the debugging target surface. The first controller is communicatively connected to the laser assembly and the first driving member. The first controller is used to execute the focus determination method as described in any one of claims 1 to 3.
7. The focusing device according to claim 6, characterized in that: The focusing device further comprises a screw rod, one end of which is fixedly connected to the focusing base, and the other end of which is movably connected to the first driving member, and the screw rod and the focusing base form the preset angle.
8. A laser processing device, characterized in that: The laser processing equipment includes a laser component, a second driving component, a carrying platform and a second controller. The laser component and the carrying platform are arranged opposite to each other and at a distance. The second driving component is used to drive the laser component to move toward or away from the carrying platform. The second controller is communicatively connected between the laser component and the second driving component. The second controller is used to execute the focus determination method as described in any one of claims 4 to 5.
9. An electronic device, characterized in that: The electronic device includes a memory and a processor, the processor is communicatively connected to the memory, and the processor is used to execute the focus determination method according to any one of claims 1 to 3 or execute the focus determination method according to any one of claims 4 to 5.
10. A computer storage medium, characterized in that: The invention comprises computer instructions, which, when executed on an electronic device, enable the electronic device to execute the focus determination method according to any one of claims 1 to 3 or the focus determination method according to any one of claims 4 to 5.