Epoxy resin composition and application thereof in wide-row SOT23 packaging

Abstract

The invention relates to the technical field of electronic packaging, in particular to an epoxy resin composition and application thereof in wide-row SOT23 packaging. The epoxy resin composition comprises the following raw materials: 3-20 parts of an epoxy resin base material, 2-12 parts of a cross-linking agent, 45-110 parts of a molding agent and 0.02-4 parts of a catalyst. The low-viscosity and high-toughness resin is added, so that the flowability of the epoxy plastic packaging material is remarkably improved. The improvement enables the material to be more easily filled in a mold in the packaging process, reduces the occurrence of a wire punching phenomenon, improves the packaging quality and the production efficiency, and is especially suitable for wide-row SOT23 (such as 27 rows) packaging. Meanwhile, the epoxy plastic packaging material designed by the invention can pass strict examination of a moisture sensitivity level MSL1, ensures the stability and reliability of a product in a humid environment, and meets the requirements of the market on high-performance and high-reliability electronic products.

Description

Technical Field

[0001] The invention relates to the technical field of electronic packaging, and in particular to an epoxy resin composition and application thereof in wide-row SOT23 packaging. Background Art

[0002] In recent years, wide-row SOT23 packaging (especially high-density arrangements such as 27 rows) has gradually emerged in the semiconductor packaging and testing industry and has become increasingly popular with packaging and testing factories. This packaging form is highly respected mainly because it can significantly improve production efficiency. The wide-row design allows more pins to be accommodated in the same packaging area, thereby simplifying the packaging process, shortening the production cycle, and ultimately achieving a leap in production capacity. At the same time, the wide-row SOT23 package can also effectively reduce the packaging cost, which is of great significance for improving the market competitiveness of products.

[0003] However, with the widespread application of wide-row SOT23 packaging technology, the quality requirements of plastic-encapsulated products in packaging and testing plants have become increasingly stringent. Among them, the moisture sensitivity level (MSL) assessment has become an important consideration. The MSL level reflects the sensitivity of the packaging material to moisture. MSL1 is a lower level, but it requires that the plastic-encapsulated product must be able to withstand a certain degree of moisture without performance degradation. This requires that the epoxy molding material must not only have excellent fluidity to ensure that the mold can be fully filled and the chip can be tightly wrapped during the packaging process, but also have reliable anti-delamination capabilities to prevent delamination or cracking inside the material in a humid environment.

[0004] In order to meet these stringent requirements, the research and development and production process of epoxy molding materials must be continuously upgraded. Chinese patent application CN114685938A discloses an epoxy resin composition for electronic packaging and a preparation method thereof, which uses a suitable ratio of the weight of spherical aluminum oxide with a particle size range of 1-55 μm and the weight of spherical aluminum oxide with a particle size range of less than 1 μm to improve the mechanical properties of the product, and at the same time adds a certain amount of boron nitride to increase the thermal conductivity of the product and improve the thermal conductivity of the product. However, its bending modulus reaches more than 20,000 MPa and its fluidity is limited. Chinese patent application CN116855211A discloses a low-viscosity, low-dielectric-constant bottom filling glue and its preparation method and application, which uses an epoxy resin including at least bisphenol F diglycidyl ether and an alkoxyphenyl triepoxy monomer with three epoxy functional groups to reasonably match, on the basis of low viscosity and good fluidity, it also has a low dielectric constant and good heat resistance. However, the moisture resistance of the glue material still needs to be improved.

[0005] In summary, the existing technologies have not simultaneously improved the fluidity and moisture resistance of epoxy resin compositions, and there is an urgent need to provide an epoxy resin composition with good fluidity, moisture resistance, stability and reliability to meet the use requirements of electronic packaging (especially wide-row SOT23) parts. Summary of the invention

[0006] The popularity of wide-row SOT23 packaging technology has put forward higher requirements for epoxy molding materials. The present invention provides a high-fluidity epoxy resin composition and a preparation method thereof for use in wide-row SOT23 packaging. The fluidity and anti-delamination ability of the packaging material are improved by adding a low-viscosity, high-toughness resin to the epoxy resin composition, thereby solving the punching and delamination problems of the device during the molding process and meeting the wide-row SOT23 packaging requirements.

[0007] The first aspect of the present invention provides an epoxy resin composition. The raw materials of the epoxy resin composition include, by weight: 3-20 parts of epoxy resin base material, 2-12 parts of crosslinking agent, 45-110 parts of plasticizer and 0.02-4 parts of catalyst.

[0008] Preferably, in parts by weight, the raw materials of the epoxy resin composition include: 4-15 parts of epoxy resin base material, 1-6 parts of cross-linking agent, 80-95 parts of plasticizer and 0.1-1 part of catalyst.

[0009] In some preferred embodiments, the raw materials of the epoxy resin composition further include, by weight: 0-15 parts of auxiliary agents, excluding endpoint values; more preferably 0-3 parts.

[0010] The present invention can select the type of auxiliary agent according to actual needs. The auxiliary agent can be listed as coupling agent, colorant, lubricant, toughening agent, stress modifier, flame retardant, lubricant, antistatic agent, ultraviolet absorber and the like.

[0011] Preferably, the auxiliary agent includes a coupling agent, a colorant, a lubricant or a combination of one or more thereof.

[0012] More preferably, the auxiliary agent includes a coupling agent, a colorant and a lubricant in a mass ratio of 1:(1.1-1.7):(1.1-1.7).

[0013] In some preferred embodiments, the epoxy resin composition satisfies one or more of the following conditions A to E:

[0014] A spiral flow length is 30-65 inches, and the test condition is curing at 175°C for 90 seconds;

[0015] B gelation time is 20-45 seconds, and the test condition is 175°C;

[0016] C viscosity is 4-12Pa.s, and the test condition is 175℃;

[0017] D water absorption (PCT, 24h) is less than 1%;

[0018] E flexural modulus is 1200 MPa or less.

[0019] More preferably, the epoxy resin composition satisfies at least two of the following conditions A to E:

[0020] A spiral flow length is 35-60 inches, and the test condition is curing for 90 seconds at 175°C;

[0021] B gelation time is 22-40 seconds, and the test condition is 175°C;

[0022] C viscosity is 5-10Pa.s, and the test condition is 175℃;

[0023] D water absorption (PCT, 24h) is 0.2-0.4%;

[0024] E bending modulus is 600-1000MPa.

[0025] More preferably, the epoxy resin composition at least satisfies conditions C and E; more preferably, the epoxy resin composition satisfies conditions A to E simultaneously.

[0026] In some preferred embodiments, the structural formula of the epoxy resin base material is a combination of one or more compounds shown in the following formula I and formula II;

[0027] Formula I:

[0028] Formula II:

[0029] Wherein, in formula I, n is selected from 1 or 2.

[0030] More preferably, the epoxy resin base material comprises at least the compound of formula II.

[0031] Further preferably, the epoxy resin base material comprises a compound of formula I and formula II in a mass ratio of (1.5-3):1.

[0032] The compounds represented by Formula I and Formula II can be commercially available, including but not limited to the following sources.

[0033] Formula I: Supplier: Changchun Artificial Resin Factory, product model: CNE-195LL.

[0034] Formula II: Supplier: Mitsubishi Chemical Corporation, product model: jER YX4000.

[0035] In some preferred embodiments, the cross-linking agent includes a phenolic resin, and the structural formula of the phenolic resin is a combination of one or more compounds shown in the following formula III and formula IV;

[0036] Formula III:

[0037] Formula IV:

[0038] Wherein, n in Formula III and Formula IV is independently selected from 1 or 2.

[0039] More preferably, the cross-linking agent comprises a compound of formula III and formula IV in a mass ratio of (0.5-2):1; further preferably 1:1.

[0040] The compounds represented by Formula III and Formula IV can be commercially available, including but not limited to the following sources.

[0041] Formula III: Supplier: Shandong Shengquan New Materials Co., Ltd., product model PF8011.

[0042] Formula IV: Supplier: Hunan Jiashengde Material Technology Co., Ltd., product model: BPNH9781S.

[0043] In some preferred embodiments, the mass ratio of the epoxy resin base material to the cross-linking agent is 1:(0.4-0.9).

[0044] In some preferred embodiments, the plasticizer includes at least one of silicon dioxide and aluminum oxide.

[0045] Preferably, the silica comprises a combination of one or more of angular silica, spherical silica, fibrous silica, and film-like silica; more preferably, it is angular silica or spherical silica; and further preferably, it is spherical silica.

[0046] Preferably, the silicon dioxide may also include crystalline silicon dioxide, and the crystalline silicon dioxide may be exemplified by α-quartz, β-quartz, tridymite, cristobalite, and the like.

[0047] In order to improve the filling effect of the plasticizer in the epoxy resin composition, it is more preferred that the particle size D50 value of the spherical silica is 10-50 μm and the specific surface area is 1-10 m 2 / g.

[0048] More preferably, the maximum particle size of the spherical silica is 60-100 μm, preferably 75 μm.

[0049] Most preferably, the maximum particle size of the spherical silica is 75 μm, the particle size D50 value is 20 μm, and the specific surface area is 2.5 m 2 / g; the spherical silica can be commercially available, for example, Jiangsu Lianrui New Materials Co., Ltd.

[0050] More preferably, the particle size D50 of the spherical silica is 15-30 μm, and the specific surface area is 2-5 m 2 / g.

[0051] In some preferred embodiments, the mass ratio of the epoxy resin base material to the plasticizer is (5-10): (80-92).

[0052] In some preferred embodiments, the catalyst comprises a combination of one or more of imidazole compounds, triphenylphosphine, and triphenylphosphine-benzoquinone adducts; more preferably, the catalyst comprises a combination of one or more of triphenylphosphine, and triphenylphosphine-benzoquinone adducts; most preferably, the catalyst comprises triphenylphosphine-benzoquinone adducts.

[0053] In some preferred embodiments, the catalyst is added in an amount of 0.1-0.5 wt % in the epoxy resin composition.

[0054] Examples of the coupling agent include 3-(glycidyloxypropyl)trimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, and vinyltrimethoxysilane.

[0055] Preferably, the coupling agent includes one or more of 3-(glycidyloxypropyl)trimethoxysilane, 3-mercaptopropyltrimethoxysilane and 3-aminopropyltrimethoxysilane.

[0056] More preferably, the coupling agent includes 3-(glycidyloxypropyl)trimethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-aminopropyltrimethoxysilane in a mass ratio of 1:(0.5-1.5):(0.5-1.5).

[0057] In some preferred embodiments, the lubricant includes at least one of natural wax and synthetic wax; the natural wax can be listed as carnauba wax, candelilla wax, wood wax, beeswax, paraffin and its derivatives, etc.; the synthetic wax can be listed as polyethylene wax, polypropylene wax, polyester wax, polyurethane wax, etc.

[0058] In order to avoid friction and damage to the surface of the product by the mold, the lubricant is preferably a natural wax, and more preferably carnauba wax. The selection of carnauba wax can reduce fluid resistance, contribute to the uniformity and density of the internal structure of the product, and thus improve the intrinsic quality of the product.

[0059] The present invention does not impose any particular limitation on the colorant, for example, carbon black.

[0060] A second aspect of the present invention provides a method for preparing an epoxy resin composition, the preparation steps of the epoxy resin composition comprising:

[0061] Step 1: crush the epoxy resin and the cross-linking agent respectively, pack and seal them for standby use;

[0062] Step 2: Mix the raw materials except the epoxy resin and the cross-linking agent, then add the crushed epoxy resin and the cross-linking agent to mix the materials;

[0063] Step 3: Mixing and extruding the materials obtained in step 2, and cooling them to obtain an epoxy resin composition product.

[0064] In some preferred embodiments, the epoxy resin composition is prepared under low temperature and low humidity production conditions.

[0065] In some preferred embodiments, the preparation steps of the epoxy resin composition include:

[0066] Step 1: crush the epoxy resin and the cross-linking agent respectively, seal them in subpackages, and store them at low temperature for later use;

[0067] Step 2: Add the plasticizer, catalyst and auxiliary agent into a high-speed mixer in batches and mix them, then add the crushed epoxy resin and cross-linking agent to mix the materials;

[0068] Step 3: Transfer the material obtained in step 2 to an extruder for mixing and extrusion, and then crush it after cooling to obtain an epoxy resin composition product.

[0069] Preferably, the product obtained in step three is sealed and stored at low temperature; more preferably, the low temperature is below 5°C.

[0070] Preferably, the resin is crushed in step 1 using a resin crusher at an operating temperature below 25°C, more preferably 10-20°C, and most preferably 15°C.

[0071] Preferably, the operating temperature of step 2 is below 25°C, more preferably 10-20°C, most preferably 15°C.

[0072] Preferably, the environmental humidity of steps 1 to 3 is below 50% RH; more preferably 40% RH.

[0073] In some embodiments, the extruder comprises a single-screw extruder or a twin-screw extruder; preferably, the extruder is a twin-screw extruder.

[0074] Preferably, the extrusion temperature is 95-115°C, more preferably 100°C.

[0075] A third aspect of the present invention provides an application of an epoxy resin composition, wherein the epoxy resin composition is applied to the field of electronic packaging, and is particularly suitable for wide-row SOT23 packaging.

[0076] SOT (Small Outline Transistor) is a surface mount package, usually used for small-outline transistors with 5 or less pins. The wide-row SOT23 refers to a wider arrangement based on the SOT23 package to accommodate the needs of more pins or larger components. SOT23 is a small surface mount package with a relatively small size, suitable for application scenarios that need to save space. The size standard of this package is unified in the industry to ensure that components produced by different manufacturers can be used interchangeably. The wide-row SOT23 package is widely used in various electronic devices due to its small size, large number of pins, and excellent performance. For example, in consumer electronic products such as smartphones, tablets, and digital cameras, components in the wide-row SOT23 package play an important role. In addition, in the fields of automotive electronics, industrial control, etc., the wide-row SOT23 package has also been widely used.

[0077] With the widespread application of wide-row SOT23 packaging technology, the quality requirements of packaging and testing plants for plastic-encapsulated products are becoming increasingly stringent. Among them, the moisture sensitivity level (MSL) assessment has become an important consideration. The MSL level reflects the sensitivity of the packaging material to moisture, and the wide-row SOT23 package has a large number of pins and a complex structure, which puts higher requirements on the fluidity and anti-delamination ability of the epoxy plastic encapsulation material. In this context, the epoxy plastic encapsulation material needs to have good fluidity on the one hand to ensure that the mold can be fully filled and the chip can be tightly wrapped during the packaging process to avoid the generation of gaps or bubbles. At the same time, the epoxy plastic encapsulation material also needs to have anti-delamination ability to prevent delamination or cracking inside the material in a humid environment, thereby ensuring the stability and reliability of the packaged product. The present invention can obtain an epoxy resin composition that meets the requirements of wide-row SOT23 packaging through the formula and preparation method of the above-mentioned epoxy composition.

[0078] Beneficial effects:

[0079] The present invention provides a high-fluidity epoxy resin composition and its application in a wide-row SOT23 package, which has the following advantages:

[0080] (1) The present invention significantly improves the fluidity of epoxy molding materials by adding low-viscosity, high-toughness resin. This improvement makes it easier for the material to fill the mold during the packaging process, reduces the occurrence of wire punching, and thus improves packaging quality and production efficiency.

[0081] (2) As electronic products become increasingly miniaturized and complex, the performance requirements for packaging materials are becoming increasingly higher. The epoxy plastic packaging material designed by the present invention can pass the strict assessment of moisture sensitivity level MSL1, ensuring the stability and reliability of the product in a humid environment. This breakthrough provides a material basis for downstream manufacturers to provide higher quality packaging materials, meeting the market demand for high-performance, high-reliability electronic products.

[0082] (3) The epoxy molding material of the present invention performs well in client applications, especially in terms of anti-punching and anti-delamination. Thanks to the enhanced material fluidity and improved anti-delamination ability, the occurrence of punching and delamination problems can be significantly reduced when using the material of the present invention to encapsulate devices, thereby improving the overall performance of the product and user satisfaction.

[0083] (4) The viscosity (175°C) of the epoxy resin composition prepared by the present invention is as low as below 10Pa.s, and the flexural modulus (260°C) is as low as below 1000MPa, which can well meet the application of wide-row SOT23 packaging and meet the market's urgent demand for high-efficiency, low-cost packaging solutions.

[0084] (5) The enhanced fluidity of the epoxy resin composition of the present invention also helps to reduce energy consumption and costs in the packaging process, thus having significant economic benefits. DETAILED DESCRIPTION

[0085] Note: Unless otherwise specified, the raw materials used in the present invention are all commercially available.

[0086] Example

[0087] Example 1-2

[0088] Examples 1-2 respectively provide an epoxy resin composition, a preparation method thereof, and an application thereof in a wide-row SOT23 package.

[0089] The formula of the epoxy resin composition is shown in Table 1; the values ​​in Table 1 are the amounts of raw materials added, in parts by weight.

[0090] Table 1 Formula of epoxy resin composition of Example 1-2

[0091]

[0092]

[0093] Note: / in Table 1 means not added.

[0094] The sources of the raw materials in Table 1 are as follows.

[0095] Formula I: Originated from Changchun Artificial Resin Factory, product model CNE-195LL.

[0096] Formula II: Originated from Mitsubishi Chemical Corporation, product model jER YX4000.

[0097] Formula III: Originated from Shandong Shengquan New Materials Co., Ltd., product model PF8011.

[0098] Formula IV: Originated from Hunan Jiashengde Material Technology Co., Ltd., product model BPNH9781S.

[0099] Spherical silica: maximum particle size is 75μm, particle size D50 value is 20μm, specific surface area is 2.5m 2 / g; Sourced from Jiangsu Lianrui New Materials Co., Ltd.

[0100] Triphenylphosphine-benzoquinone adduct: specifically triphenylphosphine-1,4-benzoquinone adduct, CAS number is 5405-63-0.

[0101] Carnauba wax: Supplier: NIKKO FINE Co., Ltd., product model: Nikko carnauba.

[0102] Carbon black: Supplier: Mitsubishi Chemical Corporation, product model: MA600.

[0103] The preparation steps of the epoxy resin composition include:

[0104] Step 1: Use a resin crusher to crush the epoxy resin and curing agent separately, and control the operating temperature to 15°C; then pack and seal them, and store them at low temperature for later use;

[0105] Step 2: Add inorganic filler, catalyst, coupling agent, release agent and colorant in batches into a high-speed mixer and mix them. The operating temperature is controlled at 15° C. Then add the crushed epoxy resin and curing agent and mix them.

[0106] Step 3: Transfer the material obtained in step 2 to a twin-screw extruder, mix and extrude at 100° C., and crush after cooling to obtain an epoxy resin composition product, which is sealed and stored at low temperature (below 5° C.) for later use.

[0107] The ambient humidity during the operation of steps 1 to 3 is 40% RH.

[0108] Comparative Example

[0109] The sample comes from Jiangsu Huahai Chengke New Materials Co., Ltd., product model EMG-400.

[0110] Performance Testing Methods

[0111] With reference to the GB / T 40564-2021 method, the gelation time, spiral flow length, viscosity, water absorption and bending modulus of the epoxy resin composition prepared in Example 1-2 and the comparative example sample were tested. The test results are shown in Table 2.

[0112] Among them, the test conditions for spiral flow length are curing at 175°C for 90 seconds, the test conditions for gelation time are 175°C, the test conditions for viscosity are 175°C, tested by capillary rheometer, the water absorption rate is tested after PCT (high pressure cooking aging test) treatment for 24 hours, the test conditions are 121°C, 100% RH, and the test conditions for flexural modulus are 260°C.

[0113] Performance Test Results

[0114] The test results of the epoxy resin composition prepared in Example 1-2 are shown in Table 2.

[0115] Table 2 Performance test results of epoxy resin compositions of Examples 1-2 and Comparative Examples

[0116] Example 1 Example 2 Comparative Example Gel time (sec) 30 33 30 Spiral flow length (inch) 40 49 45 Viscosity(Pa.s) 10.6 7.2 9.6 Water absorption (%) 0.40 0.33 0.36 Flexural modulus (MPa) 2100 950 1006

[0117] As can be seen from Table 2, the present invention can significantly improve the viscosity and modulus of the epoxy resin molding compound by introducing a specific epoxy resin base material (Formula II) and a specific curing agent (Formula IV) into the formula of the epoxy resin composition; as can be seen from the test results of Example 2, its performance results are better than those of the comparative example, which helps to improve the anti-punching and anti-delamination capabilities of the epoxy resin composition applied to the client parts. When the epoxy resin base material (Formula II) and the specific curing agent (Formula IV) are not added, the performance of the obtained epoxy resin composition is significantly deteriorated and cannot meet the use requirements of the wide-row SOT23 package.

Claims

1. An epoxy resin composition, characterized in that The raw materials of the epoxy resin composition include, by weight: 3-20 parts of epoxy resin base material, 2-12 parts of cross-linking agent, 45-110 parts of plasticizer and 0.02-4 parts of catalyst.

2. The epoxy resin composition according to claim 1, characterized in that The epoxy resin composition satisfies one or more of the following conditions A to E: A spiral flow length is 30-65 inches, and the test condition is curing at 175°C for 90 seconds; B gelation time is 20-45 seconds, and the test condition is 175°C; C viscosity is 4-12Pa.s, and the test condition is 175℃; D water absorption rate is less than 1%; E flexural modulus is 1200 MPa or less.

3. The epoxy resin composition according to claim 1, characterized in that The structural formula of the epoxy resin base material is a combination of one or more compounds shown in the following formula I and formula II; Formula I: Formula II: Wherein, in formula I, n is selected from 1 or 2.

4. The epoxy resin composition according to claim 3, characterized in that The cross-linking agent includes a phenolic resin, and the structural formula of the phenolic resin is a combination of one or more compounds shown in the following formula III and formula IV; Formula III: Formula IV: Wherein, n in Formula III and Formula IV is independently selected from 1 or 2.

5. The epoxy resin composition according to claim 4, characterized in that The raw materials of the epoxy resin composition also include: 0-15 parts of auxiliary agent, excluding the endpoint value; The auxiliary agents include coupling agent, colorant and lubricant, and the mass ratio is 1:(1.1-1.7):(1.1-1.7).

6. The epoxy resin composition according to claim 5, characterized in that The lubricant includes carnauba wax.

7. The epoxy resin composition according to claim 6, characterized in that The coupling agent includes 3-(glycidyloxypropyl)trimethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-aminopropyltrimethoxysilane in a mass ratio of 1:(0.5-1.5):(0.5-1.5).

8. The epoxy resin composition according to claim 7, characterized in that The epoxy resin composition satisfies at least two of the following conditions A to E: A spiral flow length is 35-60 inches, and the test condition is curing at 175°C for 90 seconds; B gelation time is 22-40 seconds, and the test condition is 175°C; C viscosity is 5-10Pa.s, and the test condition is 175℃; D water absorption rate is 0.2-0.4%; E bending modulus is 600-1000MPa.

9. A method for preparing the epoxy resin composition according to any one of claims 1 to 8, characterized in that: The preparation steps of the epoxy resin composition include: Step 1: crush the epoxy resin and the cross-linking agent respectively, pack and seal them for standby use; Step 2: Mix the raw materials except the epoxy resin and the cross-linking agent, then add the crushed epoxy resin and the cross-linking agent to mix the materials; Step 3: kneading the materials obtained in step 2, and then extruding and cooling to obtain an epoxy resin composition product; the operating conditions of step 1 are: temperature below 25° C. and humidity below 50% RH.

10. Use of the epoxy resin composition according to any one of claims 1 to 8 in a wide row SOT23 package.

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