A self-bonding sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material

Abstract

The application discloses a self-bonding sheet for bonding EPDM thermal insulation layer and carbon fiber composite material, and belongs to the technical field of advanced polymer material science and technology. A high-performance latent curing solvent-free adhesive is coated on an EPDM thermal insulation layer, pre-cured by temperature rising, and then covered with a release film to form a self-bonding sheet. The high-performance latent curing solvent-free adhesive comprises the following components in percentage by weight: 34-71% of epoxy-terminated modified hydroxyl glue, 24-58% of epoxy resin, 3.5-6.4% of a curing agent, and 0.4-0.9% of a vulcanizing agent. Compared with the adhesive widely used in the current aerospace industry in China, the high-performance latent curing solvent-free adhesive has high bonding force and latent curing solvent-free characteristics, does not need to be prepared on site, and only needs to be coated on the EPDM thermal insulation layer, pre-cured by temperature rising, and then covered with a release film to form a self-bonding sheet, so that the self-bonding sheet is convenient to store in large quantities.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of advanced polymer material science and technology, and particularly relates to a self-adhesive sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material. BACKGROUND

[0002] At present, the development of China's aerospace field is rapid, and the technical strength is significantly improved. The manned space "three-step" strategy is successfully implemented, and major projects such as Shenzhou series spacecraft launch and space station construction are completed. Private enterprises have broken through the manufacturing technology of carrier rockets and satellites, promoted the rapid development of the commercial aerospace market, formed a complete industrial chain covering raw materials to operation services, and the market scale of aviation equipment and commercial aerospace has continued to expand.

[0003] With the increasing demand for solid rocket, ethylene propylene diene rubber (EPDM) as the core material of the rocket engine thermal insulation layer has advantages. The main chain is a saturated hydrocarbon structure, and the side chain contains a small amount of double bonds, which has excellent heat resistance and aging resistance, and low cost, which can effectively protect the engine shell from high temperature gas erosion. However, it is difficult to bond the material with the engine shell made of carbon fiber composite material. The adhesive widely used in China's aerospace industry can meet the high bonding force required between the EPDM thermal insulation layer and the solid rocket engine shell, but the adhesive needs to use a large amount of solvent when used, and cannot be made into a self-adhesive sheet. There are problems such as poor production environment, serious pollution, and inability to mass production. Therefore, it is of great significance to develop a high-performance latent curing solvent-free adhesive that can meet the high bonding force required between the EPDM thermal insulation layer and the carbon fiber composite material, has the characteristics of latent curing and solvent-free, can be made into a self-adhesive sheet, realizes mass production, and can be safely stored, which helps the development of China's aerospace industry. SUMMARY

[0004] The purpose of the present application is to provide a self-adhesive sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material, which can solve the problem that the adhesive widely used in China's aerospace industry needs to use a large amount of solvent before use, and cannot be made into a self-adhesive sheet, and has problems such as poor production environment, serious pollution, and inability to mass production.

[0005] Technical scheme: In order to solve the above technical problems, according to one aspect of the present application, more specifically, a self-adhesive sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material, a high-performance latent curing solvent-free adhesive is coated on the EPDM thermal insulation layer, and then a release film is covered to form a self-adhesive sheet;

[0006] The high-performance latent curing solvent-free adhesive comprises the following components by weight percentage: epoxy-terminated modified HTPB 34-71%, epoxy resin 24-58%, curing agent 3.5-6.4%, and vulcanizing agent 0.4-0.9%;

[0007] The epoxy-terminated modified HTPB comprises the following components by weight percentage: isophorone diisocyanate (IPDI) 13.2%, HTPB (HTPB) 59.5%, and epoxy resin 26.7%, and catalyst 0.6%.

[0008] Further, the curing agent is one of ground into powder form dicyandiamide, adipic acid dihydrazide; the vulcanizing agent is one of ground into powder form sulfur, TT vulcanizing agent; and the catalyst is one of dibutyltin dilaurate, triphenyl bismuth.

[0009] Further, the molecular weight of the HTPB (HTPB) is one of 2000 g / mol, 3000 g / mol, 4000 g / mol.

[0010] According to another aspect of the present application, a method for bonding an EPDM thermal insulation layer and a carbon fiber composite material is provided, which is implemented based on the components of the above-described self-bonding sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material, and specifically comprises the following steps:

[0011] S1, synthesizing an epoxy-terminated modified HTPB: using isophorone diisocyanate (IPDI), HTPB (HTPB), epoxy resin, and catalyst to prepare the epoxy-terminated modified HTPB;

[0012] S2, preparing a high-performance latent curing solvent-free adhesive: mixing the epoxy-terminated modified HTPB, epoxy resin, curing agent, and vulcanizing agent to prepare the high-performance latent curing solvent-free adhesive;

[0013] S3, making a self-bonding sheet: applying the high-performance latent curing solvent-free adhesive to the EPDM thermal insulation layer to pre-cure after temperature rising, and then covering a release film to form the self-bonding sheet;

[0014] S4, using the self-bonding sheet: tearing the release film on the surface to attach the EPDM thermal insulation layer to the carbon fiber composite material, hot pressing and vulcanizing to complete the bonding.

[0015] Further, in the step S1, the method for synthesizing the epoxy-terminated modified HTPB is:

[0016] ① 111 g of isophorone diisocyanate (IPDI) and 5 g of catalyst are weighed and added into a three-necked flask;

[0017] ii. Take 500g of butyl hydroxyl glue (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0018] iii. Slowly drop butyl hydroxyl glue (HTPB) into a three-necked flask containing isophorone diisocyanate (IPDI) and a catalyst through the dropping funnel at 60°C;

[0019] iv. When the dropping of butyl hydroxyl glue (HTPB) is completed, raise the reaction temperature to 80°C and maintain the reaction at this temperature for 2-3 hours;

[0020] v. When the reaction in step iv is completed, add an appropriate amount of epoxy resin to the three-necked flask and react at 80°C for 2-3 hours.

[0021] Further, in step S2, the preparation method of the high-performance latent curing solvent-free adhesive is that the epoxy-capped modified butyl hydroxyl glue 34-71%, the epoxy resin 24-58%, the curing agent 3.5-6.4%, and the vulcanizing agent 0.4-0.9% are fully mixed in a grinder to obtain the high-performance latent curing solvent-free adhesive.

[0022] Further, in step S3, the pre-curing method is heating at 100°C for 30 minutes.

[0023] Further, in step S4, the conditions of the hot-pressing vulcanization process are temperature 140-160°C, pressure 0.5-1Mpa, and time 1-3 hours.

[0024] Beneficial effects: the adhesive widely used in China's aerospace industry at present, although it can meet the high adhesion required between the EPDM thermal insulation layer and the solid rocket engine shell, but the adhesive needs to use a large amount of solvent present and present, and cannot be made into self-adhesive sheet, and has problems of poor production environment, serious pollution, and cannot be produced on a large scale. The high-performance latent curing solvent-free adhesive of the present application is a modified hydroxyl-terminated polybutadiene (HTPB) prepared from hydroxyl-terminated polybutadiene (HTPB), isophorone diisocyanate (IPDI) and epoxy resin as raw materials and reacted in a specific proportion. The epoxy-terminated modified HTPB prepared by low molecular weight HTPB is most conducive to improving the adhesion of the adhesive. Although the addition of solvent increases the synthesis time, it can avoid the problem of adhesion reduction caused by the volatilization of residual solvent during vulcanization process, thereby significantly improving the adhesion, and the addition of solvent can avoid the pollution of the environment caused by the volatilization of solvent during hot pressing vulcanization, thereby making the high-performance latent curing adhesive more green and environmentally friendly. The most beneficial curing agent for improving the adhesion performance is one of dicyandiamide and adipic acid dihydrazide, and the vulcanizing agent is one of sulfur and TT vulcanizing agent, and the ratio of the curing agent, the vulcanizing agent and the epoxy resin main agent is determined, and the average peel strength can reach 4kN / m. At the same time, compared with the adhesive widely used in China's aerospace industry at present, the high-performance latent curing solvent-free adhesive has high adhesion and latent curing solvent-free characteristics, and does not need to be present and present, only needs to be coated on the EPDM thermal insulation layer, and after pre-curing by heating, a self-adhesive sheet is formed by covering a release film, which is convenient for large storage. When used, the release film on the surface is torn off, the EPDM thermal insulation layer is attached to the carbon fiber composite material, hot pressing vulcanization is carried out, and adhesion is completed, so it has important significance and helps the development of China's aerospace industry.

[0025] Table 1 is a peel strength record table of carbon fiber composite material with different content ratios of epoxy resin main agent and epoxy-terminated modified HTPB.

[0026] Table 1 is a peel strength record table of carbon fiber composite material with different content ratios of epoxy resin main agent and epoxy-terminated modified HTPB.

[0027] DETAILED DESCRIPTION

[0028] In order to make the technical scheme of the present application clearer, the present application will be further described in detail below in combination with Table 1 and specific examples.

[0029] Example 1

[0030] First step, synthesis of epoxy-terminated modified HTPB: isophorone diisocyanate (IPDI), hydroxyl-terminated polybutadiene (HTPB), epoxy resin (E-51) and dibutyltin dilaurate are used to prepare epoxy-terminated modified HTPB, which specifically includes the following steps:

[0031] ① Take isophorone diisocyanate (IPDI) 111 g and dibutyl tin dilaurate 5 g into a three-necked flask;

[0032] ② Take 500 g of butyl hydroxyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0033] ③ Slowly drop butyl hydroxyl rubber (HTPB) into the three-necked flask containing isophorone diisocyanate (IPDI) and dibutyl tin dilaurate through the dropping funnel at 60°C;

[0034] ④ After the completion of the dropping of butyl hydroxyl rubber (HTPB), the reaction temperature is raised to 80°C, and the reaction is maintained at this temperature for 2-3 hours;

[0035] ⑤ After the completion of the reaction in step ④, 225 g of epoxy resin (E-51) is further added to the three-necked flask, and the reaction is carried out at 80°C for 2-3 hours.

[0036] Second step, preparation of high-performance latent curing solvent-free adhesive: the preparation method of the high-performance latent curing solvent-free adhesive is that epoxy-terminated modified butyl hydroxyl rubber 600 g, epoxy resin (E-51) 200 g, dicyandiamide 29.6 g, and sulfur 7.3 g are uniformly mixed in a grinder to obtain the high-performance latent curing solvent-free adhesive.

[0037] Third step, making self-adhesive sheet: the high-performance latent curing solvent-free adhesive is coated on the EPDM thermal insulation layer, pre-cured at 100°C for 30 minutes, and then covered with a release film to form a self-adhesive sheet.

[0038] Fourth step, use of self-adhesive sheet: when used, the EPDM thermal insulation layer is attached to the carbon fiber composite material by tearing off the surface covering release film, and the hot pressing vulcanization process is carried out under the conditions of temperature 140°C, pressure 0.5 MPa, and time 1 hour.

[0039] The average peel strength of the high-performance latent curing adhesive prepared according to this step is 87 N.

[0040] Example 2

[0041] First step, synthesis of epoxy-terminated modified butyl hydroxyl rubber: epoxy-terminated modified butyl hydroxyl rubber is prepared using isophorone diisocyanate (IPDI), butyl hydroxyl rubber (HTPB), epoxy resin (E-51), and triphenyl bismuth, which specifically includes the following steps:

[0042] ① Take isophorone diisocyanate (IPDI) 111 g and triphenyl bismuth 5 g into a three-necked flask;

[0043] ② Take 500 g of butyl hydroxyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0044] ③ At 60°C, slowly drop hydroxyl-terminated polybutadiene (HTPB) into the three-necked flask containing isophorone diisocyanate (IPDI) and triphenyl bismuth through a dropping funnel;

[0045] ④ After the dropping of hydroxyl-terminated polybutadiene (HTPB) is completed, the reaction temperature is raised to 80°C, and the reaction is maintained at this temperature for 2-3 hours;

[0046] ⑤ After the reaction in step ④ is completed, 225 g of epoxy resin (E-51) is further added to the three-necked flask, and the reaction is maintained at 80°C for 2-3 hours.

[0047] Second step, preparation of high-performance latent curing solvent-free adhesive: the preparation method of the high-performance latent curing solvent-free adhesive is that epoxy-terminated modified hydroxyl-terminated polybutadiene 600 g, epoxy resin (E-51) 400 g, adipic acid dihydrazide 49.6 g, and TT vulcanizing agent 7.3 g are uniformly mixed in a grinder to obtain the high-performance latent curing solvent-free adhesive.

[0048] Third step, making self-adhesive sheet: the high-performance latent curing solvent-free adhesive is coated on the EPDM thermal insulation layer, pre-cured at 100°C for 30 minutes, and then covered with a release film to form a self-adhesive sheet.

[0049] Fourth step, use of self-adhesive sheet: when used, the EPDM thermal insulation layer is attached to the carbon fiber composite material by tearing off the surface covering release film, and the hot pressing vulcanization process conditions are: temperature 145°C, pressure 0.6 MPa, and time 1.5 hours.

[0050] The average peel strength of the high-performance latent curing adhesive prepared according to this step is 89 N.

[0051] Example 3

[0052] First step, synthesis of epoxy-terminated modified hydroxyl-terminated polybutadiene: epoxy-terminated modified hydroxyl-terminated polybutadiene is prepared using isophorone diisocyanate (IPDI), hydroxyl-terminated polybutadiene (HTPB), epoxy resin (E-51), and dibutyltin dilaurate, specifically including the following steps:

[0053] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of dibutyltin dilaurate into a three-necked flask;

[0054] ② Weigh 500 g of hydroxyl-terminated polybutadiene (HTPB) with a molecular weight of 2000 into a dropping funnel;

[0055] ③ At 60°C, slowly drop hydroxyl-terminated polybutadiene (HTPB) into the three-necked flask containing isophorone diisocyanate (IPDI) and dibutyltin dilaurate through a dropping funnel;

[0056] IV. When the dropping of the HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0057] V. When the reaction in step IV is completed, 225 g of the epoxy resin (E-51) is added to the three-necked flask and the reaction is carried out at 80°C for 2-3 hours.

[0058] Second step, preparation of the high-performance latent-cured solvent-free adhesive: the high-performance latent-cured solvent-free adhesive is prepared by mixing the epoxy-capped modified HTPB 600 g, the epoxy resin (E-51) 600 g, the dicyandiamide 69.6 g, and the sulfur 7.3 g in a grinder.

[0059] Third step, preparation of the self-adhesive sheet: the high-performance latent-cured solvent-free adhesive is coated on the EPDM thermal insulation layer, pre-cured at 100°C for 30 minutes, and then covered with a release film to form a self-adhesive sheet.

[0060] Fourth step, use of the self-adhesive sheet: when used, the EPDM thermal insulation layer is attached to the carbon fiber composite material by tearing the release film on the surface, and the hot pressing vulcanization process is carried out at a temperature of 150°C and a pressure of 0.7 MPa for 2 hours.

[0061] The average peel strength of the high-performance latent-cured adhesive prepared according to this step is 92 N.

[0062] Example 4

[0063] First step, synthesis of the epoxy-capped modified HTPB: the epoxy-capped modified HTPB is prepared using isophorone diisocyanate (IPDI), HTPB, epoxy resin (E-51), and triphenyl bismuth, specifically including the following steps:

[0064] I. 111 g of isophorone diisocyanate (IPDI) and 5 g of triphenyl bismuth are weighed into a three-necked flask;

[0065] II. 500 g of HTPB with a molecular weight of 2000 is weighed into a dropping funnel;

[0066] III. The HTPB is slowly dropped into the three-necked flask containing the isophorone diisocyanate (IPDI) and triphenyl bismuth through the dropping funnel at 60°C;

[0067] IV. When the dropping of the HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0068] V. When the reaction in step IV is completed, 225 g of the epoxy resin (E-51) is added to the three-necked flask and the reaction is carried out at 80°C for 2-3 hours.

[0069] Second step, preparation of high performance latent curing solventless adhesive: the preparation method of high performance latent curing solventless adhesive is that epoxy terminated modified HTPB 600g, epoxy resin (E-51) 800g, dicyandiamide 89.6g and sulfur 7.3g are fully mixed in a grinder to obtain high performance latent curing solventless adhesive.

[0070] Third step, making self-adhesive sheet: the high performance latent curing solventless adhesive is coated on the EPDM thermal insulation layer, pre-cured at 100℃ for 30 minutes, and then covered with a release film to form a self-adhesive sheet.

[0071] Fourth step, use of self-adhesive sheet: when used, the EPDM thermal insulation layer is attached to the carbon fiber composite material by tearing the surface covering release film, and the hot press vulcanization process conditions are: temperature 150℃, pressure 0.7Mpa, 2 hours.

[0072] The average peel strength of the high performance latent curing adhesive prepared according to this step is 100N.

[0073] Example 5

[0074] First step, synthesis of epoxy terminated modified HTPB: using isophorone diisocyanate (IPDI), HTPB, epoxy resin (E-51) and dibutyl tin dilaurate to prepare epoxy terminated modified HTPB, which includes the following steps:

[0075] ① Weigh isophorone diisocyanate (IPDI) 111g and dibutyl tin dilaurate 5g into a three-necked flask;

[0076] ② Weigh 500g of HTPB with a molecular weight of 2000 into a dropping funnel;

[0077] ③ Under the condition of 60℃, slowly drop HTPB (HTPB) into the three-necked flask containing isophorone diisocyanate (IPDI) and dibutyl tin dilaurate through the dropping funnel;

[0078] ④ When the dropping of HTPB (HTPB) is completed, the reaction temperature is raised to 80℃, and the reaction is maintained at this temperature for 2-3 hours;

[0079] ⑤ When the reaction in step ④ is completed, add 225g of epoxy resin (E-51) to the three-necked flask, and react at 80℃ for 2-3 hours.

[0080] Second step, preparation of high performance latent curing solventless adhesive: the preparation method of high performance latent curing solventless adhesive is that epoxy terminated modified HTPB 600g, epoxy resin (E-51) 1000g, adipic acid dihydrazide 109.6g and TT vulcanizing agent 7.3g are fully mixed in a grinder to obtain the high performance latent curing solventless adhesive.

[0081] Third step, making self-adhesive sheet: the high performance latent curing solventless adhesive is coated on the EPDM thermal insulation layer, pre-cured at 100℃ for 30 minutes, and then covered with a release film to form a self-adhesive sheet.

[0082] Fourth step, use of self-adhesive sheet: when used, the EPDM thermal insulation layer is attached to the carbon fiber composite material by tearing the surface covering release film, and the hot pressing vulcanization process conditions are: temperature 160℃, pressure 1Mpa, 3 hours.

[0083] The average peel strength of the high performance latent curing adhesive prepared according to this step is 94N.

[0084] Example 6

[0085] First step, synthesis of epoxy terminated modified HTPB: an epoxy terminated modified HTPB is prepared using isophorone diisocyanate (IPDI), HTPB, epoxy resin (E-51) and triphenyl bismuth, which specifically includes the following steps:

[0086] ①isophorone diisocyanate (IPDI) 111g and triphenyl bismuth 5g are weighed and added to a three-necked flask;

[0087] ②500g of HTPB with a molecular weight of 4000 is weighed and placed in a dropping funnel;

[0088] ③HTPB is slowly dropped into the three-necked flask containing isophorone diisocyanate (IPDI) and triphenyl bismuth through the dropping funnel under the condition of 60℃;

[0089] ④After the completion of the dropping of HTPB, the reaction temperature is raised to 80℃, and the reaction is maintained at this temperature for 2-3 hours;

[0090] ⑤After the completion of the reaction in step ④, 225g of epoxy resin (E-51) is further added to the three-necked flask, and the reaction is carried out at 80℃ for 2-3 hours.

[0091] Second step, preparation of high performance latent curing solventless adhesive: the preparation method of high performance latent curing solventless adhesive is that epoxy terminated modified HTPB 600g, epoxy resin (E-51) 800g, dicyandiamide 89.6g and sulfur 7.3g are fully mixed in a grinder to obtain the high performance latent curing solventless adhesive.

[0092] Third step, making self-adhesive sheet: coating high performance latent curing solvent-free adhesive on EPDM thermal insulation layer, pre-curing at 100℃ for 30 minutes, then covering release film to form self-adhesive sheet.

[0093] Fourth step, using self-adhesive sheet: when using, tearing the surface covered release film to paste EPDM thermal insulation layer on carbon fiber composite material, the condition of hot press vulcanization process is: temperature 160℃, pressure 1Mpa, 3 hours.

[0094] The average peel strength of high performance latent curing adhesive prepared according to this step is 82N.

[0095] The above described embodiments only express several embodiments of the present application, the description is more specific and detailed, but it cannot be understood as the limitation of the patent scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A self-bonding sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material, characterized by, The high-performance latent curing solvent-free adhesive is coated on the EPDM thermal insulation layer, pre-cured by temperature rising, and then covered with a release film to form a self-adhesive sheet; The high-performance latent curing solvent-free adhesive comprises the following components by weight percentage: epoxy-terminated modified hydroxyl-terminated polybutadiene 34-71%, epoxy resin 24-58%, curing agent 3.5-6.4%, and vulcanizing agent 0.4-0.9%; The epoxy-terminated modified hydroxyl-terminated polybutadiene comprises the following components by weight percentage: isophorone diisocyanate (IPDI) 13.2%, hydroxyl-terminated polybutadiene (HTPB) 59.5%, and epoxy resin 26.7%, and catalyst 0.6%.

2. A self-adhesive sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material according to claim 1, characterized in that: The curing agent is one of ground powder dicyandiamide and adipic acid dihydrazide; the vulcanizing agent is one of ground powder sulfur and TT vulcanizing agent; and the catalyst is one of dibutyltin dilaurate and triphenyl bismuth.

3. A self-adhesive sheet for bonding an EPDM thermal insulation layer and a carbon fiber composite material according to claim 1, characterized in that: The hydroxyl-terminated polybutadiene (HTPB) has one of 2000 g / mol, 3000 g / mol, and 4000 g / mol molecular weight.

4. A method of bonding an EPDM thermal insulation layer to a carbon fiber composite material, characterized by: The method is based on the components in the self-adhesive sheet for bonding the EPDM thermal insulation layer and the carbon fiber composite material according to any one of claims 1-3, and specifically comprises the following steps: S1, synthesizing epoxy-terminated modified hydroxyl-terminated polybutadiene: using isophorone diisocyanate (IPDI), hydroxyl-terminated polybutadiene (HTPB), epoxy resin, and catalyst to prepare the epoxy-terminated modified hydroxyl-terminated polybutadiene; S2, preparing high-performance latent curing solvent-free adhesive: mixing the epoxy-terminated modified hydroxyl-terminated polybutadiene, epoxy resin, curing agent, and vulcanizing agent to prepare the high-performance latent curing solvent-free adhesive; S3, making self-adhesive sheet: coating the high-performance latent curing solvent-free adhesive on the EPDM thermal insulation layer, pre-curing by temperature rising, and then covering with a release film to form the self-adhesive sheet; S4, using the self-adhesive sheet: tearing the surface covering release film to bond the EPDM thermal insulation layer on the carbon fiber composite material, hot pressing vulcanization, and completing the bonding.

5. A method of bonding an EPDM thermal insulation layer to a carbon fibre composite material according to claim 4, characterised in that: In the step S1, the method for synthesizing the epoxy-terminated modified hydroxyl-terminated polybutadiene is as follows: ① 111 g of isophorone diisocyanate (IPDI) and 5 g of catalyst are weighed and added into a three-necked flask; ② 500 g of hydroxyl-terminated polybutadiene (HTPB) with 2000 g / mol molecular weight is weighed and placed in a dropping funnel; ③ The hydroxyl-terminated polybutadiene (HTPB) is slowly dropped into the three-necked flask containing the isophorone diisocyanate (IPDI) and catalyst through the dropping funnel under the condition of 60℃; ④ After the dropping of the hydroxyl-terminated polybutadiene (HTPB) is completed, the reaction temperature is raised to 80℃, and the reaction is maintained at this temperature for 2-3 hours; ⑤ After the reaction in the step ④ is completed, an appropriate amount of epoxy resin is added into the three-necked flask, and the reaction is carried out at 80℃ for 2-3 hours.

6. A method of bonding an EPDM thermal insulation layer to a carbon fibre composite material according to claim 5, characterised in that: In the step S2, the method for preparing the high-performance latent curing solvent-free adhesive is that the epoxy-terminated modified hydroxyl-terminated polybutadiene 34-71%, the epoxy resin 24-58%, the curing agent 3.5-6.4%, and the vulcanizing agent 0.4-0.9% are mixed uniformly in a grinder to prepare the high-performance latent curing solvent-free adhesive.

7. A method of bonding an EPDM thermal insulation layer to a carbon fiber composite material according to claim 5, characterized in that: In the step S3, the pre-curing method is heating at 100℃ for 30 minutes.

8. A high performance latent curing solvent-free adhesive for bonding EPDM thermal insulation layer and carbon fiber composite material according to claim 5, characterized in that: In the step S4, the heat pressing vulcanization process is under the conditions of temperature 140-160℃, pressure 0.5-1Mpa, and time 1-3 hours.

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