Bearing device and semiconductor process chamber

Abstract

The invention discloses a bearing device and a semiconductor process chamber, and belongs to the technical field of semiconductor process equipment, the bearing device comprises a plurality of bearing boats which are stacked in sequence, each bearing boat comprises a plurality of boat pieces and a plurality of conductive structures, and in each bearing boat, each boat piece is provided with a plurality of conductive structures; one of the two adjacent boat pieces is an odd number of boat pieces, and the other one is an even number of boat pieces; all the odd-numbered boat pieces and all the even-numbered boat pieces in each bearing boat are electrically connected through the corresponding conductive structures respectively; and in two adjacent bearing boats, the conductive structure of the upper bearing boat is supported on the conductive structure of the lower bearing boat and is electrically connected with the conductive structure of the lower bearing boat. According to the scheme, the problems of relatively complex structure and relatively high manufacturing cost of the semiconductor process chamber caused by a bearing device in the background art can be solved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor process equipment, and specifically relates to a carrier device and a semiconductor process chamber. Background Art

[0002] Chemical vapor deposition equipment is a device that implements the chemical vapor deposition process and plays an important role in the semiconductor process. In the specific process, the semiconductor sheet is placed on a carrier boat and enters and exits the process space with the carrier boat. Taking the production of solar cells as an example, the silicon wafers (i.e. a specific semiconductor sheet) used to manufacture solar cells are placed on a carrier boat and then transported to the process space of the chemical vapor deposition equipment with the carrier boat to deposit a silicon nitride film layer. The silicon nitride film layer can reduce reflection, thereby achieving the purpose of improving the photoelectric conversion efficiency of solar cells.

[0003] In order to improve the process capacity, the chemical vapor deposition process involved in the related art increases the size of the carrier boat in the hope that each process can carry more semiconductor sheets, but the effect is limited. The related art also involves stacking carrier boats to increase the number of semiconductor sheets carried in each process, but the carrier device formed by stacking the carrier boats needs to be equipped with more RF power supplies to input RF, which will lead to a more complex structure of the semiconductor process chamber and a higher manufacturing cost. Summary of the invention

[0004] The embodiments of the present invention disclose a carrier device and a semiconductor process equipment to solve the problem that the carrier device in the background art may lead to a more complex structure and a higher cost of a semiconductor process chamber.

[0005] In order to solve the above technical problems, this application provides the following technical solutions: In a first aspect, an embodiment of the present invention discloses a carrying device, the carrying device comprising a plurality of carrying boats stacked in sequence, wherein each of the carrying boats comprises a plurality of boat sheets and a plurality of conductive structures, and in each of the carrying boats, one of two adjacent boat sheets is an odd-numbered boat sheet and the other is an even-numbered boat sheet; All the odd-numbered boat sheets and all the even-numbered boat sheets in each of the carrying boats are electrically connected through the corresponding conductive structures; In two adjacent carrying boats, the conductive structure of the upper carrying boat is supported on the conductive structure of the lower carrying boat and is electrically connected to the conductive structure of the lower carrying boat.

[0006] In a second aspect, an embodiment of the present invention discloses a semiconductor process chamber, which comprises a chamber body and the carrying device described in the first aspect, wherein the chamber body is provided with a process space, and the carrying device is arranged in the process space.

[0007] The carrying device disclosed in the embodiment of the present invention has the following technical effects: The multiple carrier boats included in the carrier device disclosed in the embodiment of the present invention can be electrically connected to each other through the conductive structure included in the carrier boats. This structure can make it possible for fewer carrier boats in the carrier device to be directly electrically connected to the RF power supply, without the need for each carrier boat to be directly electrically connected to the RF power supply, which means that the semiconductor process chamber does not need to be provided with a large number of electrical connection structures that are directly electrically connected to the carrier boats, nor does it need to be configured with a dedicated RF power supply for each carrier boat in the semiconductor process chamber, which can simplify the structure of the semiconductor process chamber. At the same time, the conductive structure of each carrier boat not only plays the function of electrically connecting all odd-numbered boat pieces or even-numbered boat pieces in the carrier boat in which it is located, but also plays the role of electrically connecting the carrier boat in which it is located with the adjacent carrier boat. In this case, the carrier device does not need to be specially configured with an electrical connection structure that electrically connects two adjacent carrier boats, which can simplify the structure of the carrier device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a partial structural schematic diagram of a semiconductor process chamber disclosed in an embodiment of the present invention; Figure 2 yes Figure 1 An enlarged schematic diagram of a part of the structure; Figure 3 yes Figure 1 Structural schematic diagrams of the structure shown at other viewing angles; Figure 4 It is a partial structural schematic diagram of a semiconductor process chamber disclosed in an embodiment of the present invention; Figures 5 to 8 They are partial structural schematic diagrams of the first sub-conductive structure including the supporting protrusions.

[0009] Description of reference numerals: 01-carrying device, 10-carrying boat, 11-boat sheet, 12-conductive structure, 121-supporting protrusion, 13-sheet groove, 14-first connection structure, 15-second connection structure, 101-odd boat sheet, 102-even boat sheet, 103-first sub-conductive structure, 104-second sub-conductive structure, 111-first boat ear, 112-second boat ear, 113-first electrical connection block, 114-second electrical connection block, 115-electrode plug-in hole, 1211-plug-in slot, 1212-plug-in protrusion, 02-chamber body, 021-process space, 022-electrode end. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0011] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0012] Please refer to Figures 1 to 8 The embodiment of the present invention discloses a carrier device 01. The disclosed carrier device 01 can be used as a part of a semiconductor process chamber and applied to the semiconductor process chamber. The semiconductor process chamber is a part of a semiconductor process equipment. The semiconductor process equipment can be a chemical vapor deposition equipment, etc.

[0013] The carrier device 01 disclosed in the embodiment of the present invention includes a plurality of carrier boats 10 stacked in sequence, and the plurality of carrier boats 10 may be two carrier boats 10, or more (more than two) carrier boats 10. The embodiment of the present invention does not limit the number of carrier boats 10 included in the carrier device 01. In the embodiment of the present invention, each carrier boat 10 includes a plurality of boat sheets 11 and a plurality of conductive structures 12.

[0014] In each carrier boat 10, one of the two adjacent boat sheets 11 is an odd-numbered boat sheet 101, and the other is an even-numbered boat sheet 102. All odd-numbered boat sheets 101 and all even-numbered boat sheets 102 in each carrier boat 10 are electrically connected through corresponding conductive structures 12, that is, in each carrier boat 10, all odd-numbered boat sheets 101 are electrically connected through corresponding conductive structures 12, so that all odd-numbered boat sheets 101 have the same potential, and all even-numbered boat sheets 102 are electrically connected through corresponding conductive structures 12, so that all even-numbered boat sheets 102 have the same potential. It should be noted that in each carrier boat 10, the odd-numbered boat sheets 101 are insulated and isolated from the even-numbered boat sheets 102, that is, the odd-numbered boat sheets 101 and the even-numbered boat sheets 102 are not electrically connected. Two adjacent boat sheets 11 are each provided with a sheet slot 13 facing the other, and the sheet slot 13 is used to place semiconductor sheets (such as silicon wafers) during semiconductor processing.

[0015] The semiconductor process chamber involved in the embodiment of the present invention includes a radio frequency power supply. The odd-numbered boat slices 101 are used to be electrically connected to an electrode terminal (for example, the first electrode terminal of the radio frequency power supply) 022 of the radio frequency power supply, and the even-numbered boat slices 102 are used to be electrically connected to another electrode terminal (for example, the second electrode terminal of the radio frequency power supply) 022 of the radio frequency power supply with a different potential. In this case, the two adjacent boat slices 11 in each carrier boat 10 have different potentials during the semiconductor process, so that the semiconductor sheet located between the two adjacent boat slices 11 can be placed in the electric field formed by the adjacent odd-numbered boat slices 101 and the even-numbered boat slices 102 to perform the semiconductor process. It should be noted that one of the first electrode terminal and the second electrode terminal is used for radio frequency positive input, and the other is used for radio frequency negative input.

[0016] In two adjacent carrier boats 10, the conductive structure 12 of the upper carrier boat 10 is supported on the conductive structure 12 of the lower carrier boat 10 and is electrically connected to the conductive structure 12 of the lower carrier boat 10. In this case, the odd-numbered boat pieces 101 or the even-numbered boat pieces 102 connected to the conductive structure 12 of the upper carrier boat 10 will be connected to the odd-numbered boat pieces 101 or the even-numbered boat pieces 102 of the lower carrier boat 10 through the conductive structure 12 of the lower carrier boat 10, so that the potentials of the two adjacent boat pieces 11 in the upper carrier boat 10 and the lower carrier boat 10 are different, so that the electrical connection of the two adjacent carrier boats 10 meets the semiconductor process conditions. By extension, this electrical connection structure between two adjacent carrier boats 10 can complete the electrical connection between all the carrier boats 10 in the carrier device 01. It is not difficult to see from this electrical connection method that the conductive structure 12 in each carrier boat 10 not only electrically connects all odd-numbered boat sheets 101 or all even-numbered boat sheets 102 in the carrier boat 10 , but also electrically connects two adjacent carrier boats 10 .

[0017] The multiple carrier boats 10 included in the carrier device 01 disclosed in the embodiment of the present invention can be electrically connected to each other through the conductive structure 12 included in the carrier boat 10. This structure can make it possible for fewer carrier boats 10 in the carrier device 01 to be directly electrically connected to the RF power supply, without the need for each carrier boat 10 to be directly electrically connected to the RF power supply, which means that the semiconductor process chamber does not need to be provided with a large number of electrical connection structures that are directly electrically connected to the carrier boat 10, nor does the semiconductor process chamber need to be equipped with a dedicated RF power supply for each carrier boat 10, which can simplify the structure of the semiconductor process chamber. At the same time, the conductive structure 12 of each carrier boat 10 not only plays the function of electrically connecting all odd-numbered boat slices 101 or even-numbered boat slices 102 in the carrier boat 10 in which it is located, but also plays the role of electrically connecting the carrier boat 10 in which it is located with the adjacent carrier boat 10. In this case, the carrier device 01 does not need to be specially equipped with an electrical connection structure that electrically connects two adjacent carrier boats 10, which can simplify the structure of the carrier device 01.

[0018] In a further technical solution, the conductive structure 12 of at least one of the two adjacent carrier boats 10 may include a support protrusion 121 protruding toward the other and supporting and cooperating with the conductive structure 12 of the other. The boat sheets 11 of the two adjacent carrier boats 10 may be separated by the support protrusion 121, that is, the support protrusion 121 protrudes from the boat sheet 11 of the carrier boat 10 where it is located, so that the boat sheets 11 of the two adjacent carrier boats 10 are not in contact with each other and a gap is formed, which may be referred to as a first gap. In the semiconductor process, since the process gas can flow between the two adjacent carrier boats 10 through the first gap, the semiconductor sheets in the carrier boat 10 above the first gap and the semiconductor sheets in the carrier boat 10 below the first gap can be more evenly coated, which is beneficial to improve the process uniformity.

[0019] It should be noted that there are multiple embodiments in which the conductive structure 12 of at least one of the two adjacent carrying boats 10 may include a support protrusion 121 that protrudes toward the other (i.e., protrudes in the stacking direction) and supports and cooperates with the conductive structure 12 of the other. In one embodiment, in the two adjacent carrying boats 10, the conductive structure 12 of the upper carrying boat 10 includes a support protrusion 121 that protrudes toward the lower carrying boat 10 and supports and cooperates with the conductive structure 12 of the lower carrying boat 10, while the conductive structure 12 of the lower carrying boat 10 does not form a support protrusion 121 that protrudes toward the upper carrying boat 10. In another embodiment, in the two adjacent carrying boats 10, the conductive structure 12 of the lower carrying boat 10 includes a support protrusion 121 that protrudes toward the upper carrying boat 10 and supports and cooperates with the conductive structure 12 of the upper carrying boat 10, while the conductive structure 12 of the upper carrying boat 10 does not form a support protrusion 121 that protrudes toward the lower carrying boat 10.

[0020] In another embodiment, in two adjacent carrying boats 10, the conductive structure 12 of the lower carrying boat 10 includes a supporting protrusion 121 protruding toward the upper carrying boat 10, and the conductive structure 12 of the upper carrying boat 10 includes a supporting protrusion 121 protruding toward the lower carrying boat 10, and the supporting protrusion 121 of the upper carrying boat 10 can be supported on the supporting protrusion 121 of the lower carrying boat 10, or, one of the supporting protrusion 121 of the upper carrying boat 10 and the supporting protrusion 121 of the lower carrying boat 10 can be supported on a portion of the other conductive structure 12 where the supporting protrusion 121 is not provided.

[0021] In other embodiments, the conductive structures 12 of two adjacent carrying boats 10 may not include the supporting protrusions 121, that is, the boat pieces 11 of two adjacent carrying boats 10 may also be in direct contact without being separated. In this case, the boat pieces 11 of the two adjacent carrying boats 10 are in corresponding contact with each other, and it is necessary to ensure that the potentials of the two adjacent boat pieces 11 in each carrying boat 10 are different. For example, the odd-numbered boat pieces 101 of the upper carrying boat 10 are in one-to-one contact with the odd-numbered boat pieces 101 of the lower carrying boat 10, and the even-numbered boat pieces 102 of the upper carrying boat 10 are in one-to-one contact with the even-numbered boat pieces 102 of the lower carrying boat 10. For another example, the odd-numbered boat pieces 101 of the upper carrying boat 10 are in one-to-one contact with the even-numbered boat pieces 102 of the lower carrying boat 10, and the even-numbered boat pieces 102 of the upper carrying boat 10 are in one-to-one contact with the odd-numbered boat pieces 101 of the lower carrying boat 10. Since the carrier device 01 of this structure does not separate two adjacent carrier boats 10, the flowability of process gas between the two adjacent carrier boats 10 is poor. However, since there is no first gap, the carrier device 01 of this structure is more compact and can reduce the occupied space.

[0022] In the embodiment where the boat pieces 11 of two adjacent carrier boats 10 are separated by support protrusions 121, there are various numbers and distribution modes of the support protrusions 121, which are not limited by the embodiment of the present invention. In one embodiment, the boat pieces 11 of two adjacent carrier boats 10 may be separated by at least one group of support protrusions 121. Each group of support protrusions 121 may include at least two support protrusions 121 spaced apart along the width direction of the carrier boat 10. In this structure, the support protrusions 121 included in each group of support protrusions 121 are spaced apart along the width direction of the carrier boat 10, so that the process gas can flow from the gap (which can be called the second gap) between each group of support protrusions 121 during the semiconductor process, which is beneficial to improve the uniformity of the process gas in the carrier device 01 and the uniformity of the process.

[0023] Of course, in other embodiments, all the support protrusions 121 included in each group of support protrusions 121 may not be arranged at intervals.

[0024] In an embodiment of the present invention, the boat pieces 11 of two adjacent carrying boats 10 may be separated by a group of supporting protrusions 121. In order to ensure the stability of the support, a group of supporting protrusions 121 may be supported between the middle parts of the boat pieces 11 of two adjacent carrying boats 10. In order to improve the stability of the support, the boat pieces 11 of two adjacent carrying boats 10 may be separated by multiple groups of supporting protrusions 121. In a further embodiment, the multiple groups of supporting protrusions 121 may be distributed at intervals in the length direction of the carrying boat 10. It should be noted that the direction in which the carrying device 01 enters and exits the semiconductor process chamber through the chamber port of the semiconductor process chamber can be considered as the length direction of the carrying boat 10. The arrangement direction of the boat pieces 11 in each carrying boat 10 can be considered as the width direction of the carrying boat 10, and the length direction of the carrying boat 10 is perpendicular to the width direction of the carrying boat 10, and is perpendicular to the stacking direction of the carrying boat 10.

[0025] As described above, each carrier boat 10 includes a conductive structure 12, odd-numbered boat pieces 101, and even-numbered boat pieces 102, and the odd-numbered boat pieces 101 are configured with corresponding conductive structures 12, and the even-numbered boat pieces 102 are also configured with corresponding conductive structures 12. In one embodiment, in two adjacent carrier boats 10, the conductive structure 12 electrically connecting all odd-numbered boat pieces 101 of the upper carrier boat 10 includes a supporting protrusion 121; and / or, in two adjacent carrier boats 10, the conductive structure 12 electrically connecting all even-numbered boat pieces 102 of the upper carrier boat 10 includes a supporting protrusion 121. In this case, the supporting protrusion 121 can also serve as the boat foot of the upper carrier boat 10.

[0026] That is, in one embodiment, in two adjacent carrying boats 10, the conductive structure 12 electrically connecting all odd-numbered boat sheets 101 of the upper carrying boat 10 may include a supporting protrusion 121, while the conductive structure 12 electrically connecting all even-numbered boat sheets 102 of the upper carrying boat 10 may not include the supporting protrusion 121. In this case, the odd-numbered boat sheets 101 of the upper carrying boat 10 of the two adjacent carrying boats 10 are electrically connected to a portion of the boat sheets (e.g., the odd-numbered boat sheets 101 of the lower carrying boat 10) 11, and the even-numbered boat sheets 102 of the upper carrying boat 10 are not electrically connected to another portion of the boat sheets (e.g., the even-numbered boat sheets 102 of the lower carrying boat 10) 11. In this case, the even-numbered boat sheets 102 of the upper carrying boat 10 and the other portion of the boat sheets 11 of the lower carrying boat 10 need to be connected to RF electrodes with the same potential.

[0027] In another embodiment, in two adjacent carrying boats 10, the conductive structure 12 electrically connecting all the even-numbered boat sheets 102 of the upper carrying boat 10 may include a supporting protrusion 121, while the conductive structure 12 electrically connecting all the odd-numbered boat sheets 101 of the upper carrying boat 10 may not include the supporting protrusion 121. In this case, the even-numbered boat sheets 102 of the upper carrying boat 10 of the two adjacent carrying boats 10 are electrically connected to a portion of the boat sheets (e.g., the even-numbered boat sheets 102 of the lower carrying boat 10) 11, and the odd-numbered boat sheets 101 of the upper carrying boat 10 are not electrically connected to another portion of the boat sheets (e.g., the odd-numbered boat sheets 101 of the lower carrying boat 10) 11. In this case, the odd-numbered boat sheets 101 of the upper carrying boat 10 and the other portion of the boat sheets 11 of the lower carrying boat 10 need to be connected to the RF electrodes with the same potential.

[0028] In another embodiment, in two adjacent carrier boats 10, the conductive structure 12 electrically connecting all odd-numbered boat pieces 101 of the upper carrier boat 10 includes a supporting protrusion 121, and the conductive structure 12 electrically connecting all even-numbered boat pieces 102 of the upper carrier boat 10 includes a supporting protrusion 121. In this case, the odd-numbered boat pieces 101 of the upper carrier boat 10 of the two adjacent carrier boats 10 are electrically connected to a portion of the boat pieces (e.g., the odd-numbered boat pieces 101 of the lower carrier boat 10) 11, and the even-numbered boat pieces 102 of the upper carrier boat 10 are electrically connected to another portion of the boat pieces (e.g., the even-numbered boat pieces 102 of the lower carrier boat 10) 11. In this case, only the odd-numbered boat pieces 101 and the even-numbered boat pieces 102 of any one of the two adjacent carrier boats 10 need to be connected to RF electrodes with different potentials, and this structure can minimize the number of RF power supplies configured in the semiconductor process chamber.

[0029] In order to improve the stacking stability, the support protrusion 121 may be provided with a plug-in protrusion 1212 protruding in the stacking direction of the carrier boat 10, and the conductive structure 12 supporting and cooperating with the support protrusion 121 is provided with a plug-in groove 1211, and the plug-in protrusion 1212 is plug-in-cooperated with the plug-in groove 1211. This structure enables two adjacent carrier boats 10 to be positioned and stacked through the plug-in cooperation between the plug-in protrusion 1212 and the plug-in groove 1211, thereby preventing the two adjacent carrier boats 10 from sliding sideways. Alternatively, the support protrusion 121 may be provided with a plug-in groove 1211, and the conductive structure 12 supporting and cooperating with the support protrusion 121 may include a plug-in protrusion 1212 protruding in the stacking direction of the carrier boat 10, and the plug-in protrusion 1212 is plug-in-cooperated with the plug-in groove 1211.

[0030] In order to further improve the stacking stability, there can be multiple insertion grooves 1211, and there can also be multiple insertion protrusions 1212, and multiple insertion protrusions 1212 can be inserted into multiple insertion grooves 1211 one by one. Of course, the positioning between two adjacent carrying boats 10 can be achieved by plugging and matching one insertion groove 1211 and one insertion protrusion 1212. The embodiment of the present invention does not limit the number of insertion protrusions 1212 and insertion grooves 1211 between two adjacent carrying boats 10.

[0031] In the embodiment of the present invention, the plug-in groove 1211 is adapted to the shape of the plug-in protrusion 1212, and the embodiment of the present invention does not limit the specific shapes of the plug-in groove 1211 and the plug-in protrusion 1212. In one embodiment, the plug-in groove 1211 may be a through groove that runs through the length direction of the carrying boat 10. In another embodiment, the plug-in groove 1211 may be a closed groove formed by connecting a plurality of groove inner walls end to end to form a groove opening. If the plug-in groove 1211 is a closed groove, the plug-in protrusion 1212 can be restricted in more directions, so that better positioning can be achieved with the plug-in protrusion 1212, which is conducive to further improving the stability of stacking two adjacent carrying boats 10.

[0032] In the same carrier boat 10, there may be multiple structures of the conductive structure 12 connecting all the odd-numbered boat sheets 101 and the conductive structure 12 connecting all the even-numbered boat sheets 102. For example, in the same carrier boat 10, the conductive structure 12 connecting all the odd-numbered boat sheets 101 may be located at the first end of the carrier boat 10, and the conductive structure 12 connecting all the odd-numbered boat sheets 101 protrudes from the top and bottom of the boat sheet 11 at both ends in the stacking direction to form support protrusions 121. The conductive structure 12 connecting all the even-numbered boat sheets 102 may be located at the second end of the carrier boat 10, and the conductive structure 12 connecting all the even-numbered boat sheets 102 protrudes from the top and bottom of the boat sheet 11 at both ends in the stacking direction to form support protrusions 121.

[0033] It should be noted that, in this article, the first end of the carrying boat 10 and the second end of the carrying boat 10 are respectively two ends of the carrying boat 10 distributed in the length direction thereof.

[0034] The embodiment of the present invention discloses a conductive structure 12 of a specific structure. The disclosed conductive structure 12 may include a first sub-conductive structure 103 and a second sub-conductive structure 104 .

[0035] In the conductive structure 12 connecting the odd-numbered boat pieces 101, the first sub-conductive structure 103 electrically connects all the odd-numbered boat pieces 101 in the carrier boat 10 at the bottom of the first end of the carrier boat 10, and the second sub-conductive structure 104 electrically connects all the odd-numbered boat pieces 101 in the carrier boat 10 at the top of the second end of the carrier boat 10. The conductive structure 12 of this structure can make all the odd-numbered boat pieces 101 in the carrier boat 10 electrically connected at multiple locations, thereby improving the stability of the electrical connection of all the odd-numbered boat pieces 101 in the carrier boat 10.

[0036] In the conductive structure 12 connecting the even-numbered boat pieces 102, the first sub-conductive structure 103 electrically connects all the even-numbered boat pieces 102 at the bottom of the second end of the carrier boat 10, and the second sub-conductive structure 104 electrically connects all the even-numbered boat pieces 102 at the top of the first end of the carrier boat 10. Similarly, the conductive structure 12 of this structure can make all the even-numbered boat pieces 102 in the carrier boat 10 electrically connected through multiple locations, thereby improving the stability of the electrical connection of all the even-numbered boat pieces 102 in the carrier boat 10.

[0037] In two adjacent carrying boats 10, the first sub-conductive structure 103 of the upper carrying boat 10 is supported on the second sub-conductive structure 104 of the lower carrying boat 10, and is electrically connected to the second sub-conductive structure 104 of the lower carrying boat 10. For example, the first sub-conductive structure 103 connected to the odd-numbered boat pieces 101 of the upper carrying boat 10 is electrically connected to the second sub-conductive structure 104 connected to the odd-numbered boat pieces 101 of the lower carrying boat 10, and the first sub-conductive structure 103 electrically connected to the even-numbered boat pieces 102 of the upper carrying boat 10 is electrically connected to the second sub-conductive structure 104 electrically connected to the even-numbered boat pieces 102 of the lower carrying boat 10.

[0038] In a further embodiment, in the conductive structure 12 connecting the odd-numbered boat pieces 101, the first sub-conductive structure 103 and the second sub-conductive structure 104 can be respectively connected at two diagonals of the odd-numbered boat pieces 101; in the conductive structure 12 connecting the even-numbered boat pieces 102, the first sub-conductive structure 103 and the second sub-conductive structure 104 can be respectively connected at two diagonals of the even-numbered boat pieces 102.

[0039] Since one of the two adjacent boat pieces 11 in each carrier boat 10 is an odd-numbered boat piece 101 and the other is an even-numbered boat piece 102, and the potentials of the odd-numbered boat piece 101 and the even-numbered boat piece 102 are different during the semiconductor process, the conductive structure 12 electrically connected to the odd-numbered boat piece 101 needs to be insulated from the even-numbered boat piece 102 in the same carrier boat 10. Similarly, the conductive structure 12 electrically connected to the even-numbered boat piece 102 needs to be insulated from the odd-numbered boat piece 101 in the same carrier boat 10. In order to provide insulation, in a further embodiment, the bottom of the odd-numbered boat pieces 101 located at the first end of the carrying boat 10 and the bottom of the even-numbered boat pieces 102 located at the second end of the carrying boat 10 are both electrically connected to a first boat ear 111 protruding along the length direction (of the carrying boat 10), and the top of the even-numbered boat pieces 102 located at the first end of the carrying boat 10 and the top of the odd-numbered boat pieces 101 located at the second end of the carrying boat 10 are both electrically connected to a second boat ear 112 protruding along the length direction (of the carrying boat 10). The first boat ear 111 is electrically connected to the corresponding first sub-conductive structure 103, and the second boat ear 112 is electrically connected to the corresponding second sub-conductive structure 104.

[0040] In this embodiment, the provision of the first boat ear 111 and the second boat ear 112 can easily prevent the conductive structure 12 electrically connected to the odd-numbered boat sheet 101 from contacting the even-numbered boat sheet 102, thereby achieving the purpose of insulation, and can also easily prevent the conductive structure 12 electrically connected to the even-numbered boat sheet 102 from contacting the odd-numbered boat sheet 101, thereby achieving the purpose of insulation.

[0041] In the embodiment of the present invention, the structures of the first sub-conductive structure 103 and the second sub-conductive structure 104 can be various. In one embodiment, the first sub-conductive structure 103 is a conductive base of an integral structure, and the conductive base can extend multiple fins to be electrically connected to all odd-numbered boats 101 or even-numbered boats 102 respectively, and all odd-numbered boats 101 or even-numbered boats 102 electrically connected to the conductive base can be supported on the conductive base. Similarly, the structure of the second sub-conductive structure 104 can be the same as that of the first sub-conductive structure 103.

[0042] In another embodiment, the first sub-conductive structure 103 may include a plurality of first electrical connection blocks 113 distributed in a row and respectively clamped between the first boat ears 111 corresponding to the odd-numbered boat sheets 101 or between the first boat ears 111 corresponding to the even-numbered boat sheets 102. Two adjacent odd-numbered boat sheets 101 may be electrically connected via a corresponding first electrical connection block 113 located between the first boat ears 111 of the odd-numbered boat sheets 101, and two adjacent even-numbered boat sheets 102 may be electrically connected via a corresponding first electrical connection block 113 located between the first boat ears 111 of the even-numbered boat sheets 102. Similarly, the second sub-conductive structure 104 may include a plurality of second electrical connection blocks 114 distributed in a row and respectively clamped between the second boat ears 112 corresponding to the odd-numbered boat pieces 101 or between the second boat ears 112 corresponding to the even-numbered boat pieces 102. Two adjacent odd-numbered boat pieces 101 may be electrically connected through a corresponding second electrical connection block 114 located between the second boat ears 112 of the two adjacent odd-numbered boat pieces 101, and two adjacent even-numbered boat pieces 102 may be electrically connected through a corresponding second electrical connection block 114 located between the second boat ears 112 of the two adjacent even-numbered boat pieces 102. It should be noted that the embodiments of the present invention do not limit the specific structures of the first sub-conductive structure 103 and the second sub-conductive structure 104.

[0043] The load-bearing boat 10 disclosed in the embodiment of the present invention may further include at least one first connection structure 14, which is used to fix all the boat pieces 11 in the load-bearing boat 10 together and ensure the insulation of two adjacent boat pieces 11. In one embodiment, the first connection structure 14 may include a first bolt, a first nut, and a plurality of insulating isolation blocks (e.g., ceramic blocks), and two adjacent boat pieces 11 in the load-bearing boat 10 may be insulated and isolated by an insulating isolation block, and the first bolt passes through all the boat pieces 11 and the insulating isolation blocks in the load-bearing boat 10 and is threadedly locked with the first nut, so that all the boat pieces 11 and all the insulating isolation blocks in the load-bearing boat 10 are fixed between the first nut and the nut of the first bolt.

[0044] In order to improve the stability of fastening, each carrying boat 10 may include a plurality of first connection structures 14, which are distributed at different positions of the carrying boat 10, so as to perform fastening at multiple parts of the carrying boat 10. Under the fastening of the first connection structures 14, a plurality of first electrical connection blocks 113 are clamped and fixed between the first boat ears 111, and a plurality of second electrical connection blocks 114 are clamped and fixed between the second boat ears 112.

[0045] In order to prevent the first electrical connection block 113 from falling off, and also to prevent the second electrical connection block 114 from falling off, the carrying boat 10 disclosed in the embodiment of the present invention may also include a plurality of second connection structures 15, and each first sub-conductive structure 103 and each second sub-conductive structure 104 may be configured with at least one second connection structure 15. The second connection structure 15 may include a second bolt and a second nut, and the second bolt passes through all the first boat ears 111 and the first electrical connection block 113 or the second boat ears 112 and the second electrical connection block 114, and is threadedly fixed with the second nut, so that all the first boat ears 111 and the first electrical connection block 113 are fastened between the nut cap of the corresponding second bolt and the second nut, and all the second boat ears 112 and the second electrical connection block 114 are fastened between the nut cap of the corresponding second bolt and the second nut. This structure can prevent the first electrical connection block 113 or the second electrical connection block 114 from falling off because the second bolt can pass through the first electrical connection block 113 or the second electrical connection block 114. At the same time, this method can enable the conductive structure 12 to be more stably connected to the odd-numbered boat pieces 101 or the even-numbered boat pieces 102 , so that the conductive structure 12 can more stably achieve conductive support cooperation between two adjacent carrying boats 10 .

[0046] In two adjacent carrying boats 10, in order to facilitate supporting and conducting with the upper carrying boat 10, in an optional solution, the top edge of the second boat ear 112 in the lower carrying boat 10 can be flush with the top edges of the odd-numbered boat pieces 101 and the even-numbered boat pieces 102 in the carrying boat 10 in which it is located. This structure can make the second sub-conductive structure 104 located on the top of the lower carrying boat 10 closer to the upper carrying boat 10, so as to easily achieve supporting and conducting cooperation with the first sub-conductive structure 103 of the upper carrying boat 10.

[0047] In a further embodiment, in two adjacent carrying boats 10, the second electrical connection block 114 in the lower carrying boat 10 may be no lower than the top edges of the odd-numbered boat sheets 101 and the even-numbered boat sheets 102 of the lower carrying boat 10, so that the second sub-conductive structure 104 is closer to the upper carrying boat 10, thereby making it easier to achieve supporting conductive cooperation with the first sub-conductive structure 103 of the upper carrying boat 10.

[0048] There are many ways to connect the carrier boat 10 to the RF power supply. In the carrier device 01 disclosed in the embodiment of the present invention, the conductive structure 12 of each carrier boat 10 can be provided with an electrode plugging hole 115 so as to be plugged with an electrode end with different potentials of the RF power supply. In the embodiment where the conductive structure 12 includes a first sub-conductive structure 103 and a second sub-conductive structure 104, the first sub-conductive structure 103 and the second sub-conductive structure 104 located at the first end or the second end of the carrier boat 10 are both provided with an electrode plugging hole 115.

[0049] In the embodiment of the present invention, two adjacent carrier boats 10 are electrically connected through the conductive structure 12, so that at least one electrode terminal of the RF power supply can be configured less for the semiconductor process equipment. In two adjacent carrier boats 10, the conductive structure 12 of each carrier boat 10 can have two electrode plugging holes 115, one of the two electrode plugging holes 115 is a positive electrode plugging hole for RF positive electrode input, and the other is a negative electrode plugging hole for RF negative electrode input. The two electrode plugging holes 115 are respectively plugged and electrically connected to the first electrode terminal and the second electrode terminal of the RF power supply. In the case where the conductive structure 12 includes the first sub-conductive structure 103 and the second sub-conductive structure 104, the first sub-conductive structure 103 and the second sub-conductive structure 104 located at the first end or the second end of the carrier boat 10 are both provided with electrode plugging holes 115.

[0050] In two adjacent carrying boats 10, the odd-numbered boat pieces 101 of the upper carrying boat 10 are electrically connected to the conductive structure 12 of a portion of the boat pieces (e.g., the odd-numbered boat pieces 101 of the lower carrying boat 10) 11 electrically connected to the lower carrying boat 10 through the corresponding conductive structure 12, and the even-numbered boat pieces 102 of the upper carrying boat 10 are electrically connected to the conductive structure 12 of another portion of the boat pieces (e.g., the lower carrying boat 10) 11 electrically connected to the lower carrying boat 10 through the corresponding conductive structure 12. In this case, among all the positive and negative electrode plug-in holes in the carrying device 01, the entire carrying device 01 can be connected to the RF power supply by connecting the electrode ends corresponding to the RF power supply through one positive and one negative electrode plug-in hole, respectively.

[0051] Among all the positive and negative electrode plugging holes in the carrier device 01, at least two positive electrode plugging holes or at least two negative electrode plugging holes are respectively connected to the electrode ends corresponding to the RF power supply, so that the potential at various locations of the carrier boat 10 can be more balanced.

[0052] As described above, the conductive structure 12 of at least one of the two adjacent carrying boats 10 may include a support protrusion 121 protruding toward the other and supportingly cooperating with the other conductive structure 12. In the case where the conductive structure 12 includes the first sub-conductive structure 103 and the second sub-conductive structure 104, at least one of the first sub-conductive structure 103 and the second sub-conductive structure 104 includes the support protrusion 121.

[0053] In the embodiment where the first sub-conductive structure 103 includes the supporting protrusion 121 and the first sub-conductive structure 103 includes a plurality of first electrical connection blocks 113, at least two of the plurality of first electrical connection blocks 113 may protrude in the stacking direction and jointly form the supporting protrusion 121. In order to reduce the assembly of fragmentary components, the plurality of first electrical connection blocks 113 jointly forming the supporting protrusion 121 may be an integrated structure.

[0054] Similarly, in the embodiment where the second sub-conductive structure 104 includes the supporting protrusion 121 and the second sub-conductive structure 104 includes a plurality of second electrical connection blocks 114, at least two of the plurality of second electrical connection blocks 114 may protrude in the stacking direction and jointly form the supporting protrusion 121. Similarly, in order to reduce the assembly of fragmentary parts, the plurality of second electrical connection blocks 114 jointly forming the supporting protrusion 121 may also be an integrated structure.

[0055] Based on the carrier device 01 disclosed in the embodiment of the present invention, the embodiment of the present invention discloses a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body 02 and the carrier device 01 described in the above embodiment. The chamber body 02 is provided with a process space 021, and the carrier device 01 is arranged in the process space 021.

[0056] When the process space 021 is opened, the carrier 01 can enter and exit the process space 021. Before the semiconductor process, the carrier 01 loaded with semiconductor wafers (such as silicon wafers) enters the process space 021. After the semiconductor process, the carrier 01 loaded with semiconductor wafers is removed from the process space 021.

[0057] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0058] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A carrying device, characterized in that: Comprising a plurality of supporting boats (10) stacked in sequence, wherein each of the supporting boats (10) comprises a plurality of boat sheets (11) and a plurality of conductive structures (12), and in each of the supporting boats (10), one of two adjacent boat sheets (11) is an odd-numbered boat sheet (101) and the other is an even-numbered boat sheet (102); All the odd-numbered boat pieces (101) and all the even-numbered boat pieces (102) in each of the carrying boats (10) are electrically connected via corresponding conductive structures (12); In two adjacent carrying boats (10), the conductive structure (12) of the upper carrying boat (10) is supported on the conductive structure (12) of the lower carrying boat (10), and is electrically connected to the conductive structure (12) of the lower carrying boat (10).

2. The carrying device according to claim 1, characterized in that: The conductive structure (12) of at least one of the two adjacent carrying boats (10) comprises a support protrusion (121) protruding toward the other and supporting and cooperating with the conductive structure (12) of the other; the boat pieces (11) of the two adjacent carrying boats (10) are spaced apart by the support protrusion (121).

3. The carrying device according to claim 2, characterized in that: The boat pieces (11) of two adjacent carrying boats (10) are spaced apart by at least one group of supporting protrusions (121); wherein: Each group of the supporting protrusions (121) comprises at least two supporting protrusions (121) spaced apart and distributed along the width direction of the carrying boat (10).

4. The carrying device according to claim 2, characterized in that: In two adjacent carrier boats (10), the conductive structure (12) electrically connected to all the odd-numbered boat pieces (101) of the upper carrier boat (10) includes the supporting protrusion (121); and / or, in two adjacent carrier boats (10), the conductive structure (12) electrically connected to all the even-numbered boat pieces (102) of the upper carrier boat (10) includes the supporting protrusion (121).

5. The carrying device according to claim 2, characterized in that: The supporting protrusion (121) is provided between the first ends of the boat pieces (11) of two adjacent carrying boats (10), and the supporting protrusion (121) is provided between the second ends of the boat pieces (11) of two adjacent carrying boats (10); the first end of the boat piece (11) and the second end of the boat piece (11) are two ends of the boat piece (11) distributed along the length direction of the carrying boat (10).

6. The carrying device according to claim 2, characterized in that: The support protrusion (121) is provided with a plug-in protrusion (1212) protruding in the stacking direction of the carrying boat (10), the conductive structure (12) supported and matched with the support protrusion (121) is provided with a plug-in slot (1211), and the plug-in protrusion (1212) is plug-fitted with the plug-in slot (1211).

7. The carrying device according to claim 6, characterized in that: There are a plurality of the plugging slots (1211), and there are a plurality of the plugging protrusions (1212), and the plurality of the plugging protrusions (1212) are plugged into the plurality of the plugging slots (1211) in a one-to-one correspondence.

8. The carrying device according to claim 6, characterized in that: The plug-in slot (1211) is a through slot that runs through the length direction of the carrying boat (10); or, the plug-in slot (1211) is a closed slot formed by connecting a plurality of slot inner walls end to end to form a slot opening.

9. The carrying device according to claim 1, characterized in that: The conductive structure (12) comprises a first sub-conductive structure (103) and a second sub-conductive structure (104); wherein: In the conductive structure (12) connecting the odd-numbered boat sheets (101), the first sub-conductive structure (103) is electrically connected to all the odd-numbered boat sheets (101) at the bottom of the first end of the carrier boat (10), and the second sub-conductive structure (104) is electrically connected to all the odd-numbered boat sheets (101) at the top of the second end of the carrier boat (10); in the conductive structure (12) connecting the even-numbered boat sheets (102), the first sub-conductive structure (103) is electrically connected to all the even-numbered boat sheets (102) at the bottom of the second end of the carrier boat (10), and the second sub-conductive structure (104) is electrically connected to all the even-numbered boat sheets (102) at the top of the first end of the carrier boat (10); The first end of the carrying boat (10) and the second end of the carrying boat (10) are two ends of the carrying boat (10) distributed along the length direction thereof; in two adjacent carrying boats (10), the first sub-conductive structure (103) of the upper carrying boat (10) is supported on the second sub-conductive structure (104) of the lower carrying boat (10), and is electrically connected to the second sub-conductive structure (104) of the lower carrying boat (10).

10. The carrying device according to claim 9, characterized in that: The bottom of the odd-numbered boat piece (101) located at the first end of the carrying boat (10) and the bottom of the even-numbered boat piece (102) located at the second end of the carrying boat (10) are both electrically connected to a first boat ear (111) protruding along the length direction; the top of the odd-numbered boat piece (101) located at the first end of the carrying boat (10) and the top of the even-numbered boat piece (102) located at the second end of the carrying boat (10) are both electrically connected to a second boat ear (112) protruding along the length direction; The first boat ear (111) is electrically connected to the corresponding first sub-conductive structure (103), and the second boat ear (112) is electrically connected to the corresponding second sub-conductive structure (104).

11. The carrying device according to claim 10, characterized in that: In two adjacent carrying boats (10), the top edge of the second boat ear (112) in the lower carrying boat (10) is flush with the top edges of the odd-numbered boat pieces (101) and the even-numbered boat pieces (102).

12. The carrying device according to claim 11, characterized in that: The second sub-conductive structure (104) comprises a plurality of second electrical connection blocks (114) distributed in a row and respectively clamped between the second boat ears (112) corresponding to the odd-numbered boat pieces (101) or between the second boat ears (112) corresponding to the even-numbered boat pieces (102); in two adjacent carrying boats (10), the second electrical connection block (114) in the lower carrying boat (10) is not lower than the top edges of the odd-numbered boat pieces (101) and the even-numbered boat pieces (102) of the lower carrying boat (10).

13. The carrying device according to claim 9, characterized in that: In each of the carrying boats (10), the first sub-conductive structure (103) and the second sub-conductive structure (104) located at the first end or the second end of the carrying boat (10) are both provided with electrode plugging holes (115).

14. A semiconductor process chamber, characterized in that: It comprises a chamber body (02) and a carrying device (01) according to any one of claims 1 to 13, wherein the chamber body (02) is provided with a process space (021), and the carrying device (01) is arranged in the process space (021).

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