A texturing agent composition and a texturing solution

Abstract

The present disclosure relates to a texturing agent composition and a texturing solution, the texturing agent composition comprising, based on the total weight, 0.001-20 wt% of a nucleating agent, 0.00001-10 wt% of a dispersing agent, 0.001-20 wt% of a corrosion inhibitor, 0.001-20 wt% of a surfactant, 0.001-10 wt% of an alkaline substance, and water. The texturing agent composition of the present disclosure, by compounding various auxiliary agents, exerts a synergistic effect, so that the prepared texturing solution can achieve efficient texturing of silicon wafers, the silicon wafers after texturing have a low weight loss rate and high stability, and can meet the process requirements in the production and manufacturing process of solar cells, including but not limited to heterojunction solar cells.

Description

Technical Field

[0001] This disclosure relates to texturing agent compositions and texturing solutions, which are mainly used in the production and manufacturing processes of solar cells, including but not limited to heterojunction cells, and belong to the field of solar cell manufacturing. Background Technology

[0002] Crystalline silicon solar cells are a type of solar cell that uses silicon as its substrate material. Due to their mature technology and high conversion efficiency, they dominate commercial applications. Heterojunction with Intrinsic Thin-layer (HJT) solar cells are a new type of high-efficiency solar cell based on N-type silicon wafers, attracting significant attention due to their superior photoelectric conversion efficiency and future cost-effectiveness.

[0003] Monocrystalline silicon, a common substrate material for solar cells, undergoes texturing on its surface. This not only reduces surface reflectivity but also allows light to enter the cell at an angle, increasing the optical path and effectively improving the cell's photoelectric conversion efficiency. The trend towards thinner silicon wafers is becoming a significant force driving the development of crystalline silicon solar cells. However, this process also presents new technological challenges, such as increased processing difficulty and a higher risk of breakage. Thinner silicon wafers place higher demands on the texturing process, requiring the control of wafer weight loss during texturing while ensuring the quality of the textured surface, thereby reducing the risk of wafer breakage in subsequent processes.

[0004] Given the texturing requirements for matching silicon wafer thinning, there is an urgent need in the field to develop texturing agent compositions and texturing solutions that can achieve efficient texturing of silicon wafers, and produce silicon wafers with low weight reduction and high stability after texturing. Summary of the Invention

[0005] This disclosure provides a texturing composition comprising the following components based on the total weight of the texturing composition:

[0006] Nucleating agent 0.001-20 wt%,

[0007] Dispersant 0.00001-10wt%,

[0008] Corrosion inhibitor 0.001-20wt%,

[0009] Surfactant 0.001-20wt%,

[0010] Alkaline substances 0.001-10 wt%.

[0011] water;

[0012] Wherein, the sum of the weight percentages of each component in the texturing agent composition is 100 wt%;

[0013] The nucleating agent is an aminopolysaccharide polymer;

[0014] The dispersant is one or more of the following: aromatic cyclic formaldehyde condensates, pyrrolidone cyclic substances, and polyethyleneimine substances;

[0015] The corrosion inhibitor is one or more of polymeric polyols and polyethers;

[0016] The surfactant is an ethoxylated surfactant.

[0017] In one embodiment, the aminopolysaccharide polymer is selected from one or more of chondroitin sulfate, keratin sulfate, hyaluronic acid, chitosan and its derivatives; the chitosan derivative is selected from one or more of carboxymethyl chitosan, N,N-dicarboxymethyl chitosan, hydroxypropyl chitosan and carboxyethyl chitosan.

[0018] In one embodiment, the aminopolysaccharide polymer is selected from one or more of chondroitin sulfate, keratin sulfate, and hyaluronic acid.

[0019] In one embodiment, the aromatic ring formaldehyde condensate is an aromatic sulfonic acid formaldehyde condensate or an aromatic sulfonate formaldehyde condensate, preferably selected from one or more of naphthalene sulfonic acid formaldehyde condensate, benzyl naphthalene sulfonic acid formaldehyde condensate, and sodium methyl naphthalene sulfonate formaldehyde condensate.

[0020] The pyrrolidone cyclic substance is selected from one or more of N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, and polyvinylpyrrolidone;

[0021] The polyethyleneimine material is selected from one or more of branched polyethyleneimine and linear polyethyleneimine.

[0022] In one embodiment, the dispersant is a pyrrolidone cyclic substance, preferably selected from one or more of N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, and polyvinylpyrrolidone.

[0023] In one embodiment, the corrosion inhibitor is a polyether, preferably selected from one or more of fatty alcohol polyoxyethylene ether, aromatic alcohol polyoxyethylene ether, amide polyoxyalkylene ether, fatty amine polyoxyethylene ether, and polyethanolamine polyoxyethylene ether.

[0024] In one embodiment, the surfactant is selected from one or more of fatty acid methyl ester ethoxylates, fatty alcohol ethoxylates, ethoxylated castor oil, and polyethyleneimine ethoxylates.

[0025] In one embodiment, the alkaline substance is selected from one or more of sodium hydroxide, potassium hydroxide, ammonia, calcium hydroxide, sodium carbonate, sodium hypochlorite, sodium sulfite, and sodium metabisulfite.

[0026] In one embodiment, the nucleating agent comprises 0.001-15 wt%, preferably 0.002-10 wt%, more preferably 0.002-8 wt%, based on the total weight of the texturing agent composition; and / or

[0027] Based on the total weight of the texturing agent composition, the dispersant accounts for 0.00001-8 wt%, preferably 0.00001-5 wt%, more preferably 0.00002-4 wt%; and / or

[0028] Based on the total weight of the texturing agent composition, the corrosion inhibitor accounts for 0.001-15 wt%, preferably 0.001-10 wt%, more preferably 0.002-5 wt%; and / or

[0029] Based on the total weight of the texturing agent composition, the surfactant comprises 0.001-15 wt%, preferably 0.005-15 wt%, more preferably 0.01-10 wt%, and / or

[0030] Based on the total weight of the texturing agent composition, the alkaline substance accounts for 0.001-8 wt%, preferably 0.002-8 wt%, and more preferably 0.01-5 wt%.

[0031] This disclosure also provides a texturing solution comprising the texturing agent composition described above. In one embodiment, the amount of the texturing agent composition is 0.05-1.5 wt% based on the total weight of the texturing solution.

[0032] The texturing agent composition disclosed herein, through the compounding of multiple additives, exerts a synergistic effect, enabling the texturing solution to achieve efficient texturing of silicon wafers. It can complete pyramidal nucleation within about 390 seconds and rapidly form a textured surface on the silicon surface, resulting in a highly pyramidal textured surface structure with excellent uniformity, which greatly enhances the performance of HJT cells. On the other hand, the silicon wafers after texturing have a low weight reduction rate and high weight reduction stability, thereby reducing the risk of silicon wafer breakage in subsequent processes. Attached Figure Description

[0033] Figure 1 SEM images of the texturing surface of silicon wafers after texturing, obtained by texturing the texturing solution formed by the texturing agent composition of Example 2;

[0034] Figure 2 SEM image of the texturing surface of a silicon wafer after texturing, obtained when the texturing solution formed by the texturing agent composition of Comparative Example 1 is used for texturing.

[0035] Figure 3SEM images of the texturing surface of silicon wafers after texturing, obtained when the texturing solution formed by the texturing agent composition of Comparative Example 2 is used for texturing.

[0036] Figure 4 SEM images of the texturing surface of silicon wafers after texturing, obtained when the texturing solution formed by the texturing agent composition of Comparative Example 3 is used for texturing.

[0037] Figure 5 The image shows a SEM image of the texturized surface of a silicon wafer after texturing, obtained when the texturing solution formed by the texturing agent composition of Comparative Example 4 is used for texturing. Detailed Implementation

[0038] The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. Through these descriptions, the features and advantages of the present disclosure will become clearer and more apparent.

[0039] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments. Although various aspects of embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated otherwise.

[0040] Furthermore, the technical features involved in the different embodiments of this disclosure described below can be combined with each other as long as they do not conflict with each other.

[0041] This disclosure provides a texturing composition comprising the following components based on the total weight of the texturing composition:

[0042] Nucleating agent 0.001-20 wt%,

[0043] Dispersant 0.00001-10wt%,

[0044] Corrosion inhibitor 0.001-20wt%,

[0045] Surfactant 0.001-20wt%,

[0046] Alkaline substances 0.001-10 wt%.

[0047] water;

[0048] Wherein, the sum of the weight percentages of each component in the texturing agent composition is 100 wt%;

[0049] The nucleating agent is an aminopolysaccharide polymer;

[0050] The dispersant is one or more of the following: aromatic cyclic formaldehyde condensates, pyrrolidone cyclic substances, and polyethyleneimine substances;

[0051] The corrosion inhibitor is one or more of polymeric polyols and polyethers;

[0052] The surfactant is an ethoxylated surfactant.

[0053] This disclosure also relates to a texturing solution comprising the texturing agent composition described above. The texturing agent composition can be prepared by mixing the components in a specific ratio based on this texturing agent composition; and by dissolving an alkaline substance in water, and then adding a certain amount of the texturing agent composition to the alkaline solution in a specific ratio, the texturing solution can be obtained. In one embodiment, the amount of the texturing agent composition is 0.05-1.5 wt% based on the total weight of the texturing solution.

[0054] The following further describes the texturing agent composition and the various components of the texturing solution. It should be noted that the descriptions of the texturing agent composition also apply to the texturing solution, and vice versa.

[0055] The texturing agent composition disclosed herein includes a nucleating agent. In this disclosure, the nucleating agent is an aminopolysaccharide polymer. The aminopolysaccharide polymer refers to a class of polysaccharide molecules in which monosaccharide units are bonded together via amino groups (-NH).

[0056] In one embodiment, the aminopolysaccharide polymer used in this disclosure is selected from one or more of chondroitin sulfate, keratin sulfate, hyaluronic acid, chitosan, and their derivatives. The chitosan derivative used in this disclosure may be selected from one or more of carboxymethyl chitosan, N,N-dicarboxymethyl chitosan, hydroxypropyl chitosan, and carboxyethyl chitosan.

[0057] Preferably, the nucleating agent used in this disclosure is selected from one or more of chondroitin sulfate, keratin sulfate, and hyaluronic acid.

[0058] The texturing composition disclosed herein includes a dispersant, which may be one or more of aromatic cyclic formaldehyde condensates, pyrrolidone cyclic substances, and polyethyleneimine substances.

[0059] In one embodiment, the dispersant is an aromatic ring formaldehyde condensate. An aromatic ring formaldehyde condensate is a substance formed by the condensation reaction of an aromatic aldehyde (such as benzaldehyde) with other compounds, such as alcohols like methanol, or by the condensation reaction of an aromatic compound with an active hydrogen atom on its aromatic ring (such as naphthalenesulfonic acid and its salts, and substituted naphthalenesulfonic acid and its salts) with formaldehyde. This aromatic ring formaldehyde condensate may contain multiple aromatic rings or heteroaromatic rings. In one embodiment, the dispersant may be an aromatic sulfonic acid formaldehyde condensate or an aromatic sulfonate formaldehyde condensate. The aromatic sulfonic acid compound and its salts may be naphthalenesulfonic acid, benzylnaphthalenesulfonic acid, methylnaphthalenesulfonic acid, and their salts, such as sodium salts, potassium salts, etc. These aromatic sulfonic acid compounds and their salts have an active hydrogen atom on their aromatic rings and can undergo a condensation reaction with formaldehyde in the presence of an acid or base to obtain the corresponding condensate. In one embodiment, the aromatic ring formaldehyde condensate is selected from one or more of naphthalenesulfonic acid formaldehyde condensates, benzylnaphthalenesulfonic acid formaldehyde condensates, and sodium methylnaphthalenesulfonate formaldehyde condensates. These substances are commercially available. For example, naphthalenesulfonic acid formaldehyde condensate can be purchased from Shanghai Xiaoyan Technology Co., Ltd., benzyl naphthalenesulfonic acid formaldehyde condensate can be purchased from Shenzhen Shengyan Technology Co., Ltd., and sodium methyl naphthalenesulfonate formaldehyde condensate can be purchased from Shandong Wenhe New Materials Co., Ltd. (trade name: Dispersant MF). 。

[0060] In one embodiment, the dispersant is a pyrrolidone cyclic substance. A pyrrolidone cyclic substance refers to a substance containing a pyrrolidone ring, such as one or more selected from N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, and polyvinylpyrrolidone.

[0061] In one embodiment, the dispersant is a polyethyleneimine-based substance. In one embodiment, the polyethyleneimine-based substance may be selected from one or more of branched polyethyleneimine and linear polyethyleneimine.

[0062] In one embodiment, the dispersant is a pyrrolidone cyclic substance, preferably selected from one or more of N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, and polyvinylpyrrolidone.

[0063] The texturing agent composition disclosed herein includes a corrosion inhibitor, which may be one or more of a polymeric polyol and a polyether. The polymeric polyol may be polyethylene glycol, polypropylene glycol, etc.

[0064] In one embodiment, the corrosion inhibitor is a polyether, preferably selected from one or more of fatty alcohol polyoxyethylene ethers, aromatic alcohol polyoxyethylene ethers, amide polyoxyalkylene ethers, fatty amine polyoxyethylene ethers, and polyethanolamine polyoxyethylene ethers. Fatty alcohol polyoxyethylene ethers are a class of ethers that can be formed by the condensation of polyethylene glycol (PEG) and fatty alcohols, and can be represented by the following general formula: RO(CH2CH2O).n H, where n is the degree of polymerization, which can be an integer from 3 to 20; R can be saturated or unsaturated C2~C2. 18 hydrocarbon groups (e.g., C6-C6) 18 The hydrocarbon group (the group containing the hydrocarbon chain) can be either a straight-chain hydrocarbon group or a branched hydrocarbon group. For example, fatty alcohol polyoxyethylene ethers can be purchased under the trade name C12-15 fatty alcohol polyoxyethylene ether from Changzhou Junxin Plastics Co., Ltd. Fatty amine polyoxyethylene ethers can be represented by the following general formula: RN(CH2CH2O) n H, where n is the degree of polymerization, which can be an integer from 2 to 20; R can be saturated or unsaturated C2~C2. 18 hydrocarbon groups (e.g., C6-C6) 18 The hydrocarbon group can be a straight-chain hydrocarbon group or a branched hydrocarbon group. For example, aliphatic amine polyoxyethylene ether can be purchased from Haian Petrochemical Plant in Jiangsu Province under the trade names dodecylamine polyoxyethylene ether or octadecylamine polyoxyethylene ether. Other polyethers are also known in the art and can be obtained through commercial channels, and will not be described in detail here.

[0065] The texturing agent composition disclosed herein comprises a surfactant, which is an ethoxylated surfactant, selected from one or more of fatty acid methyl ester ethoxylated, fatty alcohol ethoxylated, ethoxylated castor oil, and polyethyleneimine ethoxylated. These ethoxylated surfactants are known in the art and are commercially available, and will not be described further here.

[0066] The texturing agent composition disclosed herein contains an alkaline substance, which may be selected from one or more of, for example, sodium hydroxide, potassium hydroxide, ammonia, calcium hydroxide, sodium carbonate, sodium hypochlorite, sodium sulfite, and sodium metabisulfite.

[0067] In one embodiment, based on the total weight of the texturing agent composition, the nucleating agent accounts for 0.001%-20 wt%, preferably 0.001-15 wt%, more preferably 0.002-10 wt%, and even more preferably 0.002-8 wt%; and / or

[0068] Based on the total weight of the texturing agent composition, the dispersant comprises 0.00001-10 wt%, preferably 0.00001-8 wt%, more preferably 0.00001-5 wt%, and even more preferably 0.00002-4 wt%; and / or

[0069] Based on the total weight of the texturing agent composition, the corrosion inhibitor comprises 0.001-20 wt%, preferably 0.001-15 wt%, more preferably 0.001-10 wt%, and even more preferably 0.002-5 wt%; and / or

[0070] Based on the total weight of the texturing agent composition, the surfactant comprises 0.001-20 wt%, preferably 0.001-15 wt%, more preferably 0.005-15 wt%, and even more preferably 0.01-10 wt%; and / or

[0071] Based on the total weight of the texturing agent composition, the alkaline substance accounts for 0.001-10 wt%, preferably 0.001-8 wt%, more preferably 0.002-8 wt%, and even more preferably 0.01-5 wt%.

[0072] In one embodiment, the texturing agent composition disclosed herein may comprise the following components:

[0073] Hyaluronic acid,

[0074] Pyrrolidone cyclic compounds,

[0075] Polyether,

[0076] Ethoxylated surfactants,

[0077] alkaline substances, and

[0078] water,

[0079] Based on the total weight of the texturing solution, hyaluronic acid accounts for 0.001%-20wt%, pyrrolidone cyclic substances account for 0.00001-10wt%, polyether accounts for 0.001%-20wt%, ethoxylated surfactants account for 0.001-20wt%, and alkaline substances account for 0.001-10wt%; and the sum of the weight percentages of all components of the texturing solution is 100wt%.

[0080] In one embodiment, based on the total weight of the composition, hyaluronic acid accounts for 0.001%-20 wt%, preferably 0.001-15 wt%, more preferably 0.002-10 wt%; and / or

[0081] Based on the total weight of the texturing agent composition, the pyrrolidone cyclic substances account for 0.00001-10 wt%, preferably 0.00001-8 wt%, more preferably 0.00002-4 wt%; and / or

[0082] Based on the total weight of the texturing agent composition, the polyether accounts for 0.001-20 wt%, preferably 0.001-10 wt%, more preferably 0.002-5 wt%; and / or

[0083] Based on the total weight of the texturing agent composition, the ethoxylated surfactant accounts for 0.001-20 wt%, preferably 0.005-15 wt%, more preferably 0.01-10 wt%; and / or

[0084] Based on the total weight of the texturing agent composition, the alkaline substance accounts for 0.001-8 wt%, preferably 0.002-8 wt%, and more preferably 0.01-5 wt%.

[0085] Texturing, a crucial step in photovoltaic cell manufacturing, creates a fine, textured surface on silicon wafers to enhance light scattering and absorption, thereby improving the photoelectric conversion efficiency of the cells. For thinner silicon wafers, texturing demands are even higher, requiring minimal weight reduction, high stability in weight reduction, and high-quality texturing to minimize the risk of wafer breakage in subsequent processes. Minimal weight reduction in texturing refers to ensuring the quality of the textured surface while minimizing the weight loss of the silicon wafer during the texturing process.

[0086] As demonstrated by the embodiments of this disclosure, the texturing agent composition of this disclosure, through the compounding of multiple additives, exerts a synergistic effect, enabling the texturing solution to achieve efficient texturing of silicon wafers. It can complete pyramidal nucleation within about 390 seconds and quickly form a textured surface on the silicon surface, resulting in a highly pyramidal textured surface structure with excellent uniformity, which greatly enhances the performance of HJT cells. On the other hand, the silicon wafers after texturing have a low weight reduction rate and high weight reduction stability, thereby reducing the risk of silicon wafer breakage in subsequent processes.

[0087] Using aminopolysaccharide polymers as nucleating agents, adsorption occurs on the silicon wafer surface, altering the texturing rate and providing conditions for pyramid nucleation. This allows for the rapid formation of a pyramidal textured surface on the silicon wafer, which is then uniformly processed in subsequent texturing steps.

[0088] A dispersant system composed of aromatic ring formaldehyde condensates, pyrrolidone rings, and polyethyleneimines is used. This system has multiple electron centers and a strong passivation and nucleation effect, which promotes the formation of a uniform and continuous pyramid structure. At the same time, the hydrophobicity of the aromatic rings, together with the aminopolysaccharide polymer, maintains the smooth surface of the large pyramid, which is beneficial to the stability of the diffusion resistance.

[0089] By compounding polymeric polyols and / or polyether corrosion inhibitors, they can be combined with amino polysaccharide polymers, aromatic cyclic formaldehyde condensates, and pyrrolidone cyclic compounds through molecular chain adsorption, promoting rapid and uniform growth of the texturing surface during the texturing process, preventing excessive reaction, forming a uniform texturing structure, reducing weight loss, and improving the battery yield.

[0090] The use of surfactants, especially ethoxylated surfactants, can significantly reduce the interfacial tension between the silicon wafer surface and the solvent, promoting the formation of a smooth surface on the silicon wafer. Combined with nucleating agents such as aminopolysaccharide polymers, this reduces the weight of the silicon wafer, thereby increasing the yield.

[0091] Aminopolysaccharide polymers, acting as pyramid nucleating agents, provide essential active sites in the etching reaction, promoting its progress. The addition of dispersants significantly enhances the dispersibility of the etching solution on the silicon wafer surface, optimizing the etching effect. Etching inhibitors prevent excessive edge corrosion rates during wafer thinning, which could lead to excessively thin edges and wafer breakage. Ethoxylated surfactants provide surface wettability, increasing the hydrophilicity of the silicon wafer. Alkaline substances remove the mechanically damaged layer during wet etching by reacting with the surface silica to generate soluble compounds.

[0092] This disclosure provides a texturing solution comprising the texturing additive composition of this disclosure. The texturing solution further comprises an alkaline substance and water. In one embodiment, the alkaline substance includes an alkali, a metal oxide that dissolves in water to become an alkali, and a salt that hydrolyzes to become alkaline. The alkali can be, for example, an inorganic alkali and / or an organic alkali; preferably, the inorganic alkali is KOH, NaOH, ammonia, and / or calcium hydroxide, and the organic alkali is tetramethylguanidine and / or tetraethylammonium hydroxide. The metal oxide that dissolves in water to become an alkali can be, for example, sodium oxide, potassium oxide, and / or calcium oxide. The salt that hydrolyzes to become alkaline can be, for example, a weak acid salt of sodium or potassium, such as sodium carbonate, sodium hypochlorite, sodium sulfite, and sodium metabisulfite, as well as potassium carbonate, potassium hypochlorite, potassium sulfite, and potassium metabisulfite. The alkaline substance may be the same as or different from the alkaline substance contained in the texturing agent composition; however, the alkaline substance typically used to formulate the texturing solution is the same as the alkaline substance contained in the texturing agent composition.

[0093] In one embodiment, the amount of the texturing additive composition is 0.05-1.50 wt%, based on the total weight of the texturing solution; the amount of the alkaline substance is 0.5-5.5 wt%, based on the total weight of the texturing solution.

[0094] The texturing solution can be prepared as follows: In a texturing tank, a certain mass of alkaline substance is dissolved in ultrapure water to prepare an alkaline solution with a mass concentration of 0.5-5.5 wt%; then the texturing additive composition disclosed herein is added to the prepared alkaline solution, the content of the texturing additive composition being 0.05-1.5 wt% (based on the total weight of the texturing solution), and stirred evenly to obtain the texturing solution.

[0095] When using this texturing solution for texturing, the cleaned silicon wafers can be immersed in the solution at 75-82°C. The required texturing time is less than 500 seconds, and can be as short as 360 seconds, resulting in thinned, texturized silicon wafers. In contrast, the average texturing time for existing HJT solar cell texturing solutions is around 500 seconds. Using this texturing additive composition can reduce texturing time, improve production efficiency, reduce weight, and lower the manufacturing cost of HJT solar cells.

[0096] The inventors of this disclosure have discovered that the texturing agent composition contains specific types of nucleating agents, dispersants, corrosion inhibitors, and surfactants. When formulated into a texturing solution for silicon wafer texturing, these components work synergistically during the texturing process, resulting in excellent texturing performance and low weight loss of the silicon wafer after texturing, effectively reducing the risk of wafer breakage in subsequent processes. More importantly, the resulting texturing solution exhibits good weight loss stability; even with extended texturing time, the weight loss of the silicon wafer remains highly stable, indicating that extending the etching time will not severely damage the silicon wafer, significantly reducing the harshness of the texturing operation. By optimizing the additive combination, the texturing agent composition of this disclosure, when formulated into a texturing solution for silicon wafer texturing, promotes the nucleation, growth, and uniform dispersion of pyramids on the silicon wafer, achieving advantages such as low weight loss, high efficiency, and uniform texturing surface, which is beneficial for subsequent diffusion processes.

[0097] This disclosure also relates to a texturing method and the resulting texturized silicon wafer. Specifically, the texturing method includes immersing the cleaned silicon wafer to be texturized (e.g., N-type monocrystalline silicon or P-type monocrystalline silicon) in the texturing solution described in this disclosure, performing the texturing operation at 75-82°C, and the texturing time can be within 500 seconds, with a minimum of 360 seconds.

[0098] In addition, this disclosure also relates to a solar cell (particularly a monocrystalline silicon HJT cell) comprising the texturized silicon wafer described above.

[0099] Examples and Comparative Examples

[0100] The texturing solution used for monocrystalline silicon wafers is prepared as follows:

[0101] (1) Preparation of texturing agent composition: Weigh the corresponding substances according to Table 1-1 to Table 1-3, stir each component evenly, and filter through 500-mesh nylon filter cloth to remove particles to obtain silicon wafer texturing agent composition.

[0102] (2) Preparation of texturing solution: In the texturing tank, a certain mass of potassium hydroxide is dissolved in ultrapure water to prepare an alkaline solution with a mass concentration of 4wt%. Then, the texturing additive composition prepared in (1) is added to the prepared alkaline solution. The content of the texturing additive composition is 0.45wt% (based on the total weight of the texturing solution). After bubbling and stirring evenly, the texturing solution is obtained.

[0103] The process of making down:

[0104] The cleaned silicon wafers were immersed in texturing solution and etched at 80°C for 390 seconds. The texturized silicon wafers were then rinsed with deionized water, and the surface of the silicon wafers was dried with high-purity nitrogen gas to remove the deionized water.

[0105] Next, the weight reduction rate, average reflectivity, five-point reflectivity deviation, and average textured surface size of the silicon wafer were measured:

[0106] Weight reduction rate = (Original silicon wafer weight - Texturized silicon wafer weight) / Original silicon wafer weight

[0107] Reflectivity and the five-point reflectivity deviation range were obtained using a D8 reflectometer. The average textured surface size was obtained using a field emission scanning electron microscope (Zeiss Gemini SEM 500). The weight loss rate was calculated by weighing the silicon wafer before and after texturing using an electronic balance. A large deviation in the five-point reflectivity indicates poor uniformity in the appearance of the texturized silicon wafer. Combined with the SEM images, this confirms the uniformity of the pyramid distribution.

[0108] Confirmation of silicon wafer texturing stability: The cleaned silicon wafers were immersed in the texturing solution and etched at 80°C for 600 seconds. The texturized wafers were then rinsed with deionized water and dried with high-purity nitrogen. The weight loss rate after 600 seconds of etching was measured and compared with that after 390 seconds of etching.

[0109] The results are shown in Tables 2-1 to 2-3.

[0110] The raw materials used in the examples and comparative examples can be obtained through commercial channels, as detailed below.

[0111] nucleating agent

[0112] A1: Chondroitin sulfate, purchased from Shanghai Yuanye Biotechnology Co., Ltd., analytical grade standard;

[0113] A2: Hyaluronic acid, purchased from Shanghai Maclean Biochemical Technology Co., Ltd., molecular weight 100,000-200,000;

[0114] A3: Keratin sulfate, purchased from Jinan Glecon Biotechnology Co., Ltd., purity >90%;

[0115] A4: Carboxymethyl chitosan, purchased from Shanghai Yuanye Biotechnology Co., Ltd., with a carboxylation degree ≥80%;

[0116] NA: Sodium carboxymethyl cellulose, purchased from Shanghai Maclean Biochemical Technology Co., Ltd., with a viscosity of 600-3000 mPa·s;

[0117] dispersant

[0118] B1: N-methyl-2-pyrrolidone, purchased from Shanghai Maclean Biochemical Technology Co., Ltd.;

[0119] B2: Naphthalenesulfonic acid formaldehyde condensate, purchased from Shanghai Xiaoyan Technology Co., Ltd.;

[0120] B3: Polyethyleneimine, purchased from Guangdong Wengjiang Chemical Reagent Co., Ltd., molecular weight 600-100000;

[0121] B4: Polyvinylpyrrolidone, purchased from Guangdong Yuemei Chemical Co., Ltd., PVPK10-120;

[0122] NB: Fatty acid ethylene oxide, purchased from Shandong Wanhua Tianhe New Materials Co., Ltd., with a molecular weight of 3000-5000;

[0123] Corrosion inhibitor:

[0124] C1: Fatty amine polyoxyethylene ether, purchased from Hubei Xinmingtai Chemical Co., Ltd.;

[0125] C2: Fatty alcohol polyoxyethylene ether, purchased from Nantong Deyi Chemical Co., Ltd.;

[0126] C3: Polyethylene glycol, purchased from Shanghai Maclean Biochemical Technology Co., Ltd., PEG-200-800;

[0127] NC: Pentylene glycol, purchased from Shanghai Maclean Biochemical Technology Co., Ltd.;

[0128] surfactants

[0129] D1: Fatty acid methyl ester ethoxylate, purchased from Shanghai Maclean Biochemical Technology Co., Ltd., with a purity of ≥70%;

[0130] D2: Fatty alcohol ethoxylate, purchased from Guangdong Wengjiang Chemical Reagent Co., Ltd.;

[0131] D3: Ethoxylated castor oil, purchased from Hubei Xinhongli Chemical Co., Ltd.;

[0132] ND: Alkyl glucosamide, purchased from Shaanxi Cuikang Pharmaceutical Technology Co., Ltd.

[0133] Table 1-1

[0134] Example 1 A1, 10g B1, 0.2g C1, 5g D1,1g KOH, 15g 2kg Example 2 A2, 10g B1, 0.2g C1, 5g D1,1g KOH, 15g 2kg Example 3 A3, 10g B1, 0.2g C1, 5g D1,1g KOH, 15g 2kg Example 4 A4, 10g B1, 0.2g C1, 5g D1,1g KOH, 15g 2kg Comparative Example 1 NA, 10g B1, 0.2g C1, 5g D1,1g KOH, 15g 2kg

[0135] Table 1-2

[0136] Example 5 A2, 10g B2, 0.05g C1, 5g D1,1g KOH, 15g 2kg Example 6 A2, 10g B3, 0.1g C1, 5g D1,1g KOH, 15g 2kg Comparative Example 2 A2, 10g NB, 0.1g C1, 5g D1,1g KOH, 15g 2kg Example 7 A2, 10g B1, 0.2g C2, 10g D1,1g KOH, 15g 2kg Example 8 A2, 10g B1, 0.2g C3, 100g D1,1g KOH, 15g 2kg Comparative Example 3 A2, 10g B1, 0.2g NC, 50g D1,1g KOH, 15g 2kg Example 9 A2, 10g B1, 0.2g C1, 5g D2, 1g KOH, 15g 2kg Example 10 A2, 10g B1, 0.2g C1, 5g D3, 0.2g KOH, 15g 2kg Comparative Example 4 A2, 10g B1, 0.2g C1, 5g ND, 0.05g KOH, 15g 2kg

[0137] Table 1-3

[0138]

[0139] Table 2-1

[0140]

[0141] Table 2-2

[0142]

[0143] Table 2-3

[0144] Example 13 7.45 8.60 Example 14 7.76 8.90 Example 15 8.27 9.45 Example 16 7.86 8.99 Example 17 7.49 8.71 Example 18 7.97 9.21 Example 19 8.11 9.32 Example 20 8.24 9.51

[0145] Figure 1 The image shows a SEM image of the texturized surface of a silicon wafer after texturing, obtained by texturing with the texturing liquid formed using the texturing agent composition of Example 2. It can be seen that the pyramid size distribution on the silicon wafer surface is uniform and completely covers the silicon wafer, indicating excellent texturing effect. Figure 2-5 The SEM images of the texturing surface of silicon wafers obtained by texturing with the texturing liquid formed by the texturing agent compositions of Comparative Examples 1-4 are shown. It can be seen that the silicon wafer surface is not completely covered with pyramids, and the texturing effect is not good.

[0146] The test results in Tables 2-1 to 2-3 show that the texturing agent composition disclosed in this invention results in a low weight loss rate (less than 9%) when etching for 390s on monocrystalline silicon wafers, which can effectively reduce the risk of wafer breakage in subsequent processes. The weight loss rate remains low (less than 10%) even after 600s, indicating high weight loss stability. This shows that even if the etching time is extended, the silicon wafer will not be severely damaged, and the harshness of the texturing operation can be significantly reduced. At the same time, the SEM images show good uniformity of pyramid distribution and uniformity of texturing appearance, which is conducive to the application of texturing on thin monocrystalline silicon wafers.

[0147] The present disclosure has been described above with reference to preferred embodiments; however, these embodiments are merely exemplary and illustrative. Various substitutions and modifications can be made to the present disclosure based on these embodiments, all of which fall within the protection scope of the present disclosure.

Claims

1. A texturing composition comprising the following components based on the total weight of the texturing composition: Nucleating agent 0.025-1.465 wt%. Dispersant 0.00246-0.73149 wt%. Corrosion inhibitor 0.005-4.703 wt%. Surfactant 0.005-0.737 wt%. Alkaline substances: 0.705-0.982 wt%. water; in, The sum of the weight percentages of the components in the fabrication composition is 100 wt%. The nucleating agent is an aminopolysaccharide polymer, which is selected from one or more of chondroitin sulfate, keratin sulfate, hyaluronic acid, chitosan and its derivatives. The dispersant is one or more of aromatic cyclic formaldehyde condensates, pyrrolidone cyclic substances, and polyethyleneimine substances. The aromatic cyclic formaldehyde condensates are aromatic sulfonic acid formaldehyde condensates or aromatic sulfonate formaldehyde condensates. The pyrrolidone cyclic substances are selected from one or more of N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone, and polyvinylpyrrolidone. The polyethyleneimine substances are selected from one or more of branched polyethyleneimine and linear polyethyleneimine. The corrosion inhibitor is one or more of polymeric polyols and polyethers, wherein the polymeric polyol is polyethylene glycol or polypropylene glycol, and the polyether is selected from one or more of fatty alcohol polyoxyethylene ether, aromatic alcohol polyoxyethylene ether, amide polyoxyalkylene ether, fatty amine polyoxyethylene ether, and polyethanolamine polyoxyethylene ether. The surfactant is an ethoxylated surfactant, wherein the ethoxylated surfactant is selected from one or more of fatty acid methyl ester ethoxylated, fatty alcohol ethoxylated, ethoxylated castor oil, and polyethyleneimine ethoxylated. The alkaline substance is selected from one or more of sodium hydroxide, potassium hydroxide, ammonia, calcium hydroxide, sodium carbonate, sodium hypochlorite, sodium sulfite, and sodium metabisulfite.

2. The texturing agent composition according to claim 1, wherein, The chitosan derivative is selected from carboxymethyl chitosan, N , N -One or more of dicarboxymethyl chitosan, hydroxypropyl chitosan, and carboxyethyl chitosan.

3. The texturing agent composition according to claim 1, wherein, The aminopolysaccharide polymer is selected from one or more of chondroitin sulfate, keratin sulfate, and hyaluronic acid.

4. The texturing agent composition according to claim 1, wherein, The aromatic ring formaldehyde condensate is selected from one or more of naphthalenesulfonic acid formaldehyde condensate, benzyl naphthalenesulfonic acid formaldehyde condensate, and sodium methyl naphthalenesulfonate formaldehyde condensate.

5. The texturing agent composition according to claim 1, wherein, The dispersant is one or more of pyrrolidone cyclic substances.

6. The texturing agent composition according to claim 1, wherein, The corrosion inhibitor is one or more polyethers.

7. A texturing solution comprising the texturing agent composition according to any one of claims 1-6.

8. The texturing solution according to claim 7, wherein, Based on the total weight of the texturing solution, the amount of the texturing agent composition is 0.05-1.5 wt%.

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