A compact compound vacuum pump

Abstract

The present invention relates to the technical field of particle accelerators, and in particular to a compact compound vacuum pump. The compact compound vacuum pump provided in an embodiment of the present invention includes a sputtering ion pump and a titanium wire assembly. The sputtering ion pump includes a pump housing having a cavity and a first interface and a second interface connected to the cavity. The first interface is used to connect to a cavity to be evacuated; the titanium wire assembly is connected to the second interface of the pump housing, and the titanium wire of the titanium wire assembly is deposited in the cavity by sublimation to form a first titanium film with an adsorption effect. The compact compound vacuum pump provided in an embodiment of the present invention effectively reduces the occupation of installation space while ensuring that an extremely high vacuum can be obtained, thereby facilitating the arrangement of other components.

Description

Technical Field

[0001] The present invention relates to the technical field of particle accelerators, and in particular to a compact composite vacuum pump. Background Art

[0002] The beam in a particle accelerator can collide with residual gas in the vacuum pipe, causing losses. Therefore, the vacuum pipe must maintain a certain vacuum level to meet beam lifetime requirements. Heavier ions require higher vacuum levels during acceleration. For very heavy ions like U, achieving even higher vacuum levels is essential to provide the foundation and guarantee for high-precision physics experiments.

[0003] The primary residual gas in an ultra-high vacuum is hydrogen, along with a small amount of inert gas. The traditional approach to achieving ultra-high vacuum is to use a combination of a sputtering ion pump and a titanium sublimation pump, followed by vacuum baking to achieve an ultra-high vacuum. Titanium sublimation pumps have a high pumping speed and are primarily used to pump hydrogen, while sputtering ion pumps have a low pumping speed and are primarily used to remove small amounts of inert gas. Due to the different suction mechanisms and selective suction characteristics of sputtering ion pumps and titanium sublimation pumps, ultra-high vacuum cannot be achieved using only one of them. Therefore, a common approach is to use a combination of the two. The trend in particle accelerators is toward increasing miniaturization, and the combined use of sputtering ion pumps and titanium sublimation pumps requires a significant amount of installation space, making it inconvenient to arrange other components. Summary of the Invention

[0004] The present invention provides a compact compound vacuum pump, which effectively reduces the occupation of installation space while ensuring that extremely high vacuum can be obtained, and facilitates the arrangement of other components.

[0005] In the first aspect, an embodiment of the present invention provides a compact compound vacuum pump, comprising: a sputtering ion pump, comprising a pump housing, the pump housing having a cavity and a first interface and a second interface connected to the cavity, the first interface being used to connect to a cavity to be evacuated; a titanium wire assembly connected to the second interface of the pump housing, the titanium wire of the titanium wire assembly being deposited in the cavity by sublimation to form a first titanium film with adsorption effect.

[0006] In one possible implementation, the sputtering ion pump also includes: a high-voltage head, which is arranged on the pump housing and electrically connected to the controller for providing high voltage for the sputtering ion pump; a magnet assembly, which is arranged in the cavity and is used to form a magnetic field in the cavity to maintain Penning discharge, so that gas molecules collide with the rotating electron cloud to generate ions; an anode assembly and a cathode titanium plate, which are arranged in the cavity and electrically connected to the high-voltage head, and an electric field is formed between the anode assembly and the cathode titanium plate, so that ions bombard the cathode titanium plate and generate sputtered titanium atoms, and the sputtered titanium atoms form a second titanium film with adsorption effect on the anode assembly and the cathode titanium plate.

[0007] In one possible implementation, a partition is provided in the cavity of the pump casing, which divides the cavity into a first chamber and a second chamber, and a connecting port connecting the first chamber and the second chamber is provided on the partition; the titanium wire assembly is provided in the first chamber, for forming a first titanium film in the first chamber; the magnet assembly, the anode assembly and the cathode titanium plate are provided in the second chamber.

[0008] In one possible implementation, a frame-shaped enclosure is provided in the second chamber, which divides the second chamber into an inner chamber and an outer chamber. The inner chamber is connected to the first interface and the connecting port. The magnet assembly is provided in the outer chamber and is used to form a magnetic field in the inner chamber. The anode assembly and the cathode titanium plate are located in the inner chamber.

[0009] In a possible implementation, the inner cavity includes a central channel located between the first chamber and the first interface and an installation area arranged around the central channel, and the anode assembly and the cathode titanium plate are arranged in the installation area.

[0010] In one possible implementation, the anode assembly includes a plurality of stainless steel cylinders arranged in a matrix.

[0011] In a possible implementation, the titanium wire assembly includes: a mounting flange connected to the second interface; an insulating bracket connected to the mounting flange; and a titanium wire disposed on the insulating bracket.

[0012] In a possible implementation, a third interface is provided on the pump housing, and the compound vacuum pump further includes a monitoring component connected to the third interface, and the monitoring component is used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

[0013] In one possible implementation, the monitoring component includes a vacuum gauge and / or a mass spectrometer.

[0014] In a possible implementation, a fourth interface is provided on the pump housing, and the compound vacuum pump further includes a molecular pump unit connected to the fourth interface.

[0015] The compact composite vacuum pump provided by this invention expands the functionality of a titanium sublimation pump by installing a titanium filament assembly on the pump housing of a sputtering ion pump. Heating the titanium filament assembly causes the titanium filament to sublime and deposit within the cavity, forming a first titanium film with an adsorbent effect. This first titanium film then generates an aspirating effect to extract reactive gases. The sputtering ion pump has a low pumping speed and is used to extract reactive gases and a small amount of inert gas. This pump combines the functions of a sputtering ion pump and a titanium sublimation pump, ensuring extremely high vacuum while effectively reducing installation space and facilitating the arrangement of other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of a composite vacuum pump provided by the present invention.

[0018] Figure 2 It is a schematic diagram of the planar structure of a composite vacuum pump provided by the present invention.

[0019] Figure 3 yes Figure 2 The cross-sectional structure diagram of the compound vacuum pump along the AA direction is shown.

[0020] Figure 4 It is a schematic structural diagram of a composite vacuum pump provided by the present invention from a top view.

[0021] Figure 5 yes Figure 4 The cross-sectional structure diagram of the compound vacuum pump along the BB direction is shown.

[0022] Figure 6 It is a schematic diagram of the cross-sectional structure of the second chamber of a composite vacuum pump provided by the present invention.

[0023] Figure 7 It is a structural schematic diagram of a titanium wire assembly provided by the present invention.

[0024] Figure 8 It is a structural schematic diagram of another compound vacuum pump provided by an embodiment of the present invention.

[0025] Figure 9 This is a schematic diagram of the structure of another composite vacuum pump provided by an embodiment of the present invention.

[0026] Reference numerals:

[0027] 1. Sputtering ion pump; 11. Pump housing; 111. First interface; 112. Second interface; 113. First chamber; 114. Second chamber; 1141. Inner chamber; 1142. Outer chamber; 115. Third interface; 116. Fourth interface; 12. High-voltage head; 13. Magnet assembly; 14. Anode assembly; 15. Cathode titanium plate; 16. Separator; 161. Connecting port; 17. Frame enclosure;

[0028] 2. Titanium wire assembly; 21. Mounting flange; 22. Insulation bracket; 23. Titanium wire;

[0029] 3. Monitoring components; 4. Molecular pump unit. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0031] The following combination Figure 1-9 A compact composite vacuum pump provided by an embodiment of the present invention includes: a sputtering ion pump 1 and a titanium wire assembly 2, wherein:

[0032] The sputtering ion pump 1 comprises a pump housing 11 , which has a cavity and a first interface 111 and a second interface 112 communicating with the cavity. The first interface 111 is used for connecting to a cavity to be evacuated.

[0033] The titanium wire assembly 2 is connected to the second interface 112 of the pump housing 11 , and the titanium wire 23 of the titanium wire assembly 2 is deposited in the cavity by sublimation to form a first titanium film with an adsorption effect.

[0034] In the present invention, a titanium wire assembly 2 is installed on the pump housing 11 of the sputtering ion pump 1 to expand the function of the titanium sublimation pump. The titanium wire assembly 2 is heated to allow the titanium wire 23 to sublime and deposit in the cavity to form a first titanium film with an adsorption effect. The first titanium film generates an air absorption effect to extract the active gas. The sputtering ion pump 1 has a low pumping speed and is used to extract the active gas and a small amount of inert gas. It has the functions of the sputtering ion pump 1 and the titanium sublimation pump at the same time, which can ensure that an extremely high vacuum can be obtained, and can effectively reduce the occupation of the installation space, facilitating the arrangement of other components.

[0035] Specifically, the first interface 111 is a first flange, which is connected to the vacuum chamber to be evacuated through the first flange and is used to perform vacuum operations on the vacuum chamber; the second interface 112 is a second flange, which is used to connect and fix the titanium wire assembly 2 to the pump housing 11 through the second flange, and fix the titanium wire assembly 2 in the cavity of the pump housing 11 to realize the expansion of the function of the titanium sublimation pump based on the sputtering ion pump 1.

[0036] The composite vacuum pump proposed in this embodiment organically integrates the titanium sublimation pump and the sputtering ion pump 1. By installing the titanium wire assembly 2 on the second interface 112 of the pump housing 11, the two vacuum pumps can share the same cavity. In practical applications, when the composite vacuum pump is applied to the vacuum system of a particle accelerator, compared with the traditional solution of separately setting the titanium sublimation pump and the sputtering ion pump 1, this solution significantly reduces the installation space of the vacuum pump group. Taking a small accelerator as an example, its vacuum piping system needs to arrange a large number of physical experimental elements in a limited space. The structural design of this composite pump can reserve more installation space for other elements. During specific operation, the first titanium film produced by the sublimation of the titanium wire 23 mainly absorbs hydrogen, while the second titanium film produced by the sputtering ion pump 1 extracts inert gas by burying. The two suction mechanisms work together to achieve a better ultimate vacuum degree than using either pump alone. For example, in a device for accelerating uranium ions, this composite pump can increase the vacuum degree of the cavity to 2х10 -10 Pa level, meeting the stringent vacuum requirements for heavy ion acceleration. In addition, all functions of this compound pump can be achieved by simply connecting it to the chamber through a flange, greatly simplifying the installation difficulty of the vacuum system.

[0037] In some embodiments, the sputtering ion pump 1 also includes: a high-voltage head 12, which is arranged on the pump housing and is electrically connected to the controller for providing high voltage for the sputtering ion pump 1; a magnet assembly 13, which is arranged in the cavity and is used to form a magnetic field in the cavity to maintain Penning discharge, so that gas molecules collide with the rotating electron cloud to generate ions; an anode assembly 14 and a cathode titanium plate 15, which are arranged in the cavity and electrically connected to the high-voltage head 12, and an electric field is formed between the anode assembly 14 and the cathode titanium plate 15, so that ions bombard the cathode titanium plate 15 and generate sputtered titanium atoms, which form a second titanium film with adsorption effect on the anode assembly 14 and the cathode titanium plate 15.

[0038] Specifically, the high-voltage head 12 is provided on the first flange, and is used to provide high voltage to the ion pump during operation. Many electrons rotate in the form of a wheel rolling line close to the anode assembly 14 under the constraint of the magnetic field, forming an electron cloud. The gas molecules collide with the rotating electrons and are ionized to produce ions. Under the action of the electric field, the ions fly toward and bombard the cathode titanium plate 15, producing two effects, sputtering titanium and knocking out secondary electrons. The sputtered titanium atoms are deposited on the anode assembly 14 and the cathode titanium plate 15, forming a fresh second titanium film to maintain the suction capacity of the vacuum pump. The sputtering ion pump 1 continuously performs this process during operation. In addition to the chemical adsorption of the fresh titanium film, its exhaust also continuously produces a new titanium film to bury the surface for exhaust.

[0039] The specific structural components and operating principle of the sputtering ion pump 1 are detailed in the embodiments of the present invention. During operation, the high-voltage head 12 provides the required high voltage to the anode assembly 14 and the cathode titanium plate 15. The magnetic field generated by the magnet assembly 13 causes electrons to move in a spiral trajectory near the anode assembly 14, forming a high-density electron cloud. When residual gas molecules collide with the electron cloud, they are ionized. The resulting gas ions are accelerated by the electric field between the anode assembly 14 and the cathode titanium plate 15 and bombard the cathode titanium plate 15. This structural design enables the sputtered titanium atoms generated by the bombardment of the cathode titanium plate 15 to efficiently deposit on the surface of the anode assembly 14, forming a fresh, active secondary titanium film. For example, when ionized argon gas bombards the cathode titanium plate 15, the continuously sputtered new titanium atoms bury the argon ions, achieving efficient extraction of the inert gas. Another advantage of this structure is that the secondary electrons generated during the bombardment process sustain the discharge, enabling continuous and stable pump operation. Furthermore, this structural design makes the magnetic field more uniform, increasing the density of the electron cloud and thereby improving the ionization efficiency of gas molecules.

[0040] In some embodiments, a partition 16 is provided in the cavity of the pump housing 11, and the partition 16 divides the cavity into a first chamber 113 and a second chamber 114. A connecting port 161 connecting the first chamber 113 and the second chamber 114 is provided on the partition 16; the titanium wire assembly 2 is provided in the first chamber 113, for forming a first titanium film in the first chamber 113; the magnet assembly 13, the anode assembly 14 and the cathode titanium plate 15 are provided in the second chamber 114, for forming a second titanium film in the second chamber 114.

[0041] In the present invention, by providing a partition 16 in the cavity of the pump housing 11 and dividing the cavity into a first chamber 113 and a second chamber 114, the ion sputtering pump forms a second titanium film in the second chamber 114 for air absorption, and the titanium wire assembly 2 forms a first titanium film in the first chamber 113 for air absorption, which can effectively avoid interference between the ion sputtering pump and the titanium wire assembly 2. The second titanium film formed in the second chamber 114 can remain fresh, not only having the chemical adsorption of the fresh titanium film, but also continuously generating new titanium films to bury the surface for air absorption. At the same time, the titanium film sublimated in the first chamber 113 is concentrated on the inner wall of the first chamber 113, ensuring a rapid air absorption effect. The first chamber 113 and the second chamber 114 are connected by a connecting port 161, so that they can jointly perform vacuuming operations for the same vacuum chamber to be evacuated.

[0042] In this embodiment, a partition 16 is provided within the cavity of the pump housing 11, dividing the cavity into two independent upper and lower chambers connected by a connecting port 161, thereby forming a unique dual-chamber structure. This design has multiple advantages in practical applications: First, the first chamber 113 is specifically used for the sublimation of the titanium filament 23, so that the titanium atoms produced by sublimation are primarily deposited on the inner wall of this chamber, forming a large-area first titanium film. Due to the larger space of this chamber, the titanium film is more evenly distributed, significantly improving the adsorption efficiency of hydrogen. Second, the Penning discharge process of the sputtering ion pump 1 is carried out in the second chamber 114, and the titanium atoms produced by sputtering are primarily deposited in this chamber to form the second titanium film. This partitioning design increases the surface area of ​​the titanium film deposited in the first chamber, improves the pumping efficiency, and achieves the optimal adsorption effect. Third, the provision of the connecting port 161 not only ensures sufficient exchange of gases between the two chambers, but also prevents the high temperature during the sublimation of the titanium filament 23 from adversely affecting the components in the second chamber 114. For example, in actual operation, hydrogen can freely enter the first chamber 113 through the connecting port 161 and be adsorbed by the titanium film, while the second chamber 114 concentrates on processing the inert gas, forming an efficient division of labor and cooperation mechanism.

[0043] In some embodiments, a frame-shaped enclosure 17 is provided in the second chamber 114, and the frame-shaped enclosure 17 divides the second chamber 114 into an inner chamber 1141 and an outer chamber 1142. The inner chamber 1141 is connected to the first interface 111 and the connecting port 161. The magnet assembly 13 is provided in the outer chamber 1142 and is used to form a magnetic field in the inner chamber 1141. The anode assembly 14 and the cathode titanium plate 15 are located in the inner chamber 1141.

[0044] In the present invention, a frame-shaped enclosure 17 is provided in the second chamber 114 for further separation, so that the magnet assembly 13 is located in the outer chamber 1142, while the anode assembly 14 and the cathode titanium plate 15 are located in the inner chamber 1141. This structural design greatly optimizes the working efficiency of the compound pump. First, the provision of the frame-shaped enclosure 17 makes the magnetic field lines more concentrated, the magnetic induction intensity is improved, and it is conducive to the formation of a higher density electron cloud. Second, the inner chamber 1141 is directly connected to the first interface 111 and the connecting port 161, forming the main movement channel for gas molecules. This design of the gas flow path requires residual gas molecules to pass through the inner chamber 1141 to reach the first chamber 113, increasing the probability of collision between gas molecules and the electron cloud and improving the ionization efficiency. Thirdly, since the magnet assembly 13 is located in the outer chamber 1142, the influence of the high temperature generated during the discharge process on the magnet performance can be effectively avoided, thereby extending the service life of the magnet. In practical applications, for example, when the compound pump is used in the bend of a particle accelerator, this structural design enables the pump to maintain optimal working condition within a limited space.

[0045] In some embodiments, the inner cavity 1141 includes a central channel between the first chamber 113 and the first interface 111 and an installation area disposed around the central channel, and the anode assembly and the cathode titanium plate 15 are disposed in the installation area.

[0046] In the present invention, the movement path of the gas molecules is further optimized by setting the layout of the central channel and the installation area in the inner cavity 1141. The central channel is located between the first chamber 113 and the first interface 111, forming the main flow path of the gas molecules. The surrounding installation areas are used to install the anode assembly 14 and the cathode titanium plate 15, so that these key working components are arranged around the central channel. This structural design has significant advantages: first, when passing through the central channel, the gas molecules must pass through the area surrounded by the anode assembly 14 and the cathode titanium plate 15, which greatly increases the probability of the gas molecules being ionized and adsorbed. Secondly, this layout enables the plasma formed by Penning discharge to be evenly distributed around the central channel, thereby improving the ionization efficiency. Thirdly, since the anode assembly 14 and the cathode titanium plate 15 are concentrated in the installation area, it is easy to control and maintain. In practical applications, this structural design enables the compound pump to achieve maximum pumping efficiency in a smaller space.

[0047] Specifically, there are four installation areas, which are arranged on both sides of the central channel, that is, two installation areas are arranged on the left side of the central channel and two installation areas are arranged on the right side. The installation areas are groove-shaped, and the anode assembly 14 and the cathode titanium plate 15 are installed in the installation areas, which can make full use of the space in the pump casing 11 and further reduce its volume while ensuring the pumping effect.

[0048] In some embodiments, anode assembly 14 includes a plurality of stainless steel cylinders arranged in a matrix.

[0049] The present invention stipulates that the anode assembly 14 adopts multiple stainless steel cylinders arranged in a matrix. This structural design has many advantages in application: First, the matrix arrangement of multiple stainless steel cylinders increases the effective surface area of ​​the anode and provides more locations for titanium film deposition. Secondly, the cylindrical shape is conducive to the spiral motion of electrons near its inner wall, which extends the movement path of electrons and improves the ionization efficiency. Thirdly, stainless steel has good electrical conductivity and corrosion resistance, which ensures the long-term stable operation of the anode assembly 14. In practical applications, for example, when a compound pump is used in an ultra-high vacuum system, this anode structure can provide a greater pumping rate and effectively reduce the ultimate vacuum degree of the system.

[0050] like Figure 7 As shown, in some embodiments, the titanium wire assembly 2 includes: a mounting flange 21 connected to the second interface 112 ; an insulating bracket 22 connected to the mounting flange 21 ; and a titanium wire 23 disposed on the insulating bracket 22 .

[0051] The present invention defines in detail the structural composition of the titanium wire assembly 2. The titanium wire 23 is fixed to the second interface 112 via the mounting flange 21 and the insulating bracket 22. This structural design ensures the reliable operation of the titanium wire assembly 2. First, the special mounting flange 21 facilitates the installation and replacement of the titanium wire assembly 2. Secondly, the insulating bracket 22 not only plays a mechanical supporting role, but also realizes the electrical insulation of the titanium wire 23, avoiding the risk of leakage. In practical applications, this structure makes the sublimation process of the titanium wire 23 safer and more controllable. For example, during vacuum baking, the structure can ensure that the titanium wire assembly 2 works stably without being deformed by high temperature.

[0052] Specifically, the insulating bracket 22 includes a support rod, ceramic insulating blocks disposed at both ends of the support rod, and a grounding rod connected to the ceramic insulating blocks. The support rod is used to secure the titanium wire 23, while the ceramic insulating blocks insulate the titanium wire 23 from the ground. After sublimation, the titanium wire 23 is coated with a titanium film on the inner wall of the first chamber 113 to generate an adsorption effect for gas extraction. The grounding rod is used for grounding and is made of oxygen-free copper.

[0053] like Figure 8 As shown, in some embodiments, a third interface 115 is provided on the pump housing 11, and the compound vacuum pump further includes a monitoring component 3 connected to the third interface 115, and the monitoring component 3 is used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

[0054] In the present invention, the integration of the vacuum monitoring function is achieved by providing a third interface 115 on the pump housing 11 to connect the monitoring component 3. This design has significant advantages over traditional solutions: First, the monitoring component 3 is directly installed on the compound pump, saving space for separately setting up a vacuum gauge. Second, local monitoring improves measurement accuracy and can more accurately reflect the vacuum state of the cavity. Third, the monitoring results can be used to timely adjust the working parameters of the compound pump and optimize the pumping effect. In practical applications, such as during the operation of the accelerator, this design facilitates real-time monitoring of vacuum changes and timely detection of possible vacuum leaks.

[0055] Specifically, third interface 115 is a third flange, and monitoring component 3 can be a vacuum gauge or mass spectrometer to monitor the cavity vacuum level or analyze gas composition ratios. Using a compound pump to monitor vacuum or analyze gas composition at multiple points along a beamline facilitates overall assessment of the beamline vacuum level and facilitates identification of leaks during vacuum leak detection.

[0056] like Figure 9 As shown, in some embodiments, a fourth interface 116 is provided on the pump housing 11 , and the compound vacuum pump further includes a molecular pump unit 4 connected to the fourth interface 116 .

[0057] In the present invention, by providing a fourth interface 116 on the pump housing 11 to connect the molecular pump unit 4, the compound pump is equipped with the ability to independently perform rough pumping. This design makes the compound pump a complete vacuum acquisition system: first, the molecular pump unit 4 can pump the system from atmospheric pressure to the required working pressure without the need for an additional rough pumping system. Secondly, this integrated design reduces pipeline connections and reduces the risk of leakage. Thirdly, all vacuum operations can be completed by connecting to the cavity through a main interface, which greatly improves the ease of use. In practical applications, such as when conducting vacuum experiments in a laboratory, this design makes the construction and operation of the vacuum system easier.

[0058] The composite vacuum pump expands the function of the titanium sublimation pump by installing a titanium wire assembly 2 on the pump housing 11 of the sputtering ion pump 1. By heating the titanium wire assembly 2, the titanium wire 23 is sublimated and deposited in the cavity to form a first titanium film with an adsorption effect. The first titanium film generates an air absorption effect for extracting active gases. The sputtering ion pump 1 has a low pumping speed and is used to extract active gases and a small amount of inert gases. It has the functions of the sputtering ion pump 1 and the titanium sublimation pump at the same time, which can ensure that extremely high vacuum can be obtained, and can effectively reduce the installation space occupied, facilitating the arrangement of other components.

[0059] The present invention applies a compound vacuum pump to particle accelerators, demonstrating its practical application value in high-tech fields. In particle accelerators, high vacuum levels are directly related to the acceleration effect. The compound pump of the present invention not only provides the required extremely high vacuum levels, but its compact design also enables the miniaturization of accelerators. For example, in the new generation of high-current heavy ion accelerators, the use of this compound pump not only ensures vacuum performance but also leaves ample space for other physical experimental components.

[0060] The method of using the compound vacuum pump provided in the embodiment of the present invention is as follows:

[0061] Step 1: Connect the compound pump to the chamber to be evacuated through the first port, and connect the molecular pump unit to the other ports of the chamber. Start the molecular pump unit and start the sputtering ion pump when the vacuum degree of the chamber reaches E-4Pa.

[0062] Step 2: Baking the heating jacket wrapped around the vacuum chamber to remove the large amount of water vapor adsorbed on the inner wall of the pipe. The baking temperature is 250℃ and the holding time is 48 hours.

[0063] Step 3: After the insulation is completed, cool the system down to 190°C to sublime the titanium wire assembly, and then close the all-metal valve between the molecular pump unit and the cavity.

[0064] Step 4: After the system temperature continues to drop to room temperature, the titanium wire assembly 4 is sublimated again.

[0065] Step 5: After the compound vacuum pump operation is completed, observe the ultimate vacuum of the cavity.

[0066] Another method of using the compound vacuum pump provided by an embodiment of the present invention is as follows:

[0067] Step 1: Connect the compound pump to the vacuum chamber through the first port. Install a full-metal angle valve through the fourth port and connect the molecular pump unit to the valve. Open the valve, start the molecular pump unit, and perform a rough pumping operation. When the chamber vacuum reaches E-4 Pa, start the sputtering ion pump. After the sputtering ion pump has been operating normally for 5 hours, start the vacuum gauge.

[0068] Step 2: Baking the heating jacket wrapped around the vacuum chamber to remove the large amount of water vapor adsorbed on the inner wall of the pipe. The baking temperature is 250℃ and the holding time is 48 hours.

[0069] Step 3: After the insulation is completed, cool the system down to 190°C to sublime the titanium wire assembly, and then close the all-metal valve between the molecular pump unit and the cavity.

[0070] Step 4: After the system temperature continues to drop to room temperature, the titanium wire assembly 4 is sublimated again.

[0071] Step 5: After the compound vacuum pump operation is completed, observe the ultimate vacuum of the cavity.

[0072] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A compact compound vacuum pump, characterized in that: include: A sputtering ion pump (1) comprises a pump housing (11), the pump housing (11) having a cavity and a first interface (111) and a second interface (112) in communication with the cavity, the first interface (111) being used for connecting to a cavity to be evacuated; A titanium wire assembly (2) is connected to the second interface (112) of the pump housing (11), and the titanium wire (23) of the titanium wire assembly (2) is deposited in the cavity by sublimation to form a first titanium film with an adsorption effect; The sputtering ion pump (1) further comprises: A high-voltage head (12) is provided on the pump housing (11), and the high-voltage head (12) is electrically connected to a controller and is used to provide high voltage for the sputtering ion pump (1); A magnet assembly (13) is disposed in the cavity and is used to form a magnetic field in the cavity that maintains Penning discharge, so that gas molecules collide with the rotating electron cloud to generate ions; An anode assembly (14) and a cathode titanium plate (15) are arranged in the cavity and electrically connected to the high-voltage head (12); an electric field is formed between the anode assembly (14) and the cathode titanium plate (15), so that the ions bombard the cathode titanium plate (15) and generate sputtered titanium atoms, and the sputtered titanium atoms form a second titanium film with an adsorption effect on the anode assembly (14) and the cathode titanium plate (15); A partition (16) is provided in the cavity of the pump housing (11), and the partition (16) divides the cavity into a first chamber (113) and a second chamber (114). The partition (16) is provided with a communication port (161) for connecting the first chamber (113) and the second chamber (114); the titanium wire assembly (2) is provided in the first chamber (113) for forming the first titanium film in the first chamber (113); the magnet assembly (13), the anode assembly (14) and the cathode titanium plate (15) are provided in the second chamber (114).

2. The compact compound vacuum pump according to claim 1, characterized in that A frame-shaped enclosure (17) is provided in the second chamber (114), and the frame-shaped enclosure (17) divides the second chamber (114) into an inner chamber (1141) and an outer chamber (1142), wherein the inner chamber (1141) is connected to the first interface (111) and the connecting port (161), the magnet assembly (13) is provided in the outer chamber (1142) and is used to form the magnetic field in the inner chamber (1141), and the anode assembly (14) and the cathode titanium plate (15) are located in the inner chamber (1141).

3. The compact compound vacuum pump according to claim 2, characterized in that: The inner cavity (1141) comprises a central channel located between the first chamber (113) and the first interface (111), and an installation area arranged around the central channel, and the anode assembly and the cathode titanium plate (15) are arranged in the installation area.

4. The compact compound vacuum pump according to any one of claims 1 to 3, characterized in that: The anode assembly (14) comprises a plurality of stainless steel cylinders arranged in a matrix.

5. The compact compound vacuum pump according to claim 1, characterized in that: The titanium wire assembly (2) comprises: A mounting flange (21) connected to the second interface (112); an insulating bracket (22) connected to the mounting flange (21); The titanium wire (23) is arranged on the insulating bracket (22).

6. The compact compound vacuum pump according to claim 1, characterized in that A third interface (115) is provided on the pump housing (11), and the compound vacuum pump further comprises a monitoring component (3) connected to the third interface (115), wherein the monitoring component (3) is used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

7. The compact compound vacuum pump according to claim 6, characterized in that The monitoring component (3) includes a vacuum gauge and / or a mass spectrometer.

8. The compact compound vacuum pump according to claim 1, characterized in that: A fourth interface (116) is provided on the pump housing (11), and the compound vacuum pump further comprises a molecular pump unit (4) in communication with the fourth interface (116).

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