Fan control method and device and electronic equipment

Abstract

The invention discloses a fan control method and device and electronic equipment. The method comprises the steps that a target board card corresponding to a target fan in the frame type equipment is determined; acquiring a current temperature and an expected temperature range of the target board card; determining an adjacent slot position state of the target board card; and controlling the rotating speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot position state. According to the invention, the technical problems of poor heat dissipation effect and serious fan loss of frame-type equipment are solved.

Description

Technical Field

[0001] The present invention relates to the field of control, and in particular to a fan control method, device and electronic equipment. Background Art

[0002] As the performance of frame-type equipment improves, the number of boards in the frame-type equipment increases, the power consumption increases, and the heat dissipation demand increases accordingly. In order to dissipate the heat of the boards in the frame-type equipment, multiple fans are used to form a fan module. However, in the prior art, the fan speed is simply adjusted according to the temperature of the board corresponding to the fan, which has poor heat dissipation effect and serious fan loss.

[0003] To address the above-mentioned problems, no effective solution has been proposed yet. Summary of the invention

[0004] The embodiments of the present invention provide a fan control method, device and electronic device to at least solve the technical problem that the frame-type device has poor heat dissipation effect and serious fan loss.

[0005] According to one aspect of an embodiment of the present invention, a fan control method is provided, including: determining a target board corresponding to a target fan in a frame device; obtaining a current temperature and an expected temperature range of the target board; determining an adjacent slot status of the target board; and controlling a rotation speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot status.

[0006] Optionally, determining a target board corresponding to a target fan in a frame-type device includes: determining a slot status corresponding to the target fan; and determining the target board based on the slot status.

[0007] Optionally, determining the target board based on the slot status includes: when the slot status is that there is one board in the slot corresponding to the target fan, determining the board as the target board; when the slot status is that there are multiple boards in the slot corresponding to the target fan, determining a board with the highest current temperature among the multiple boards as the target board.

[0008] Optionally, controlling the rotational speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot status includes: when the adjacent slot status is that there is no false panel in the adjacent slot of the target board, controlling the rotational speed of the target fan based on the current temperature and the expected temperature range; and / or, when the adjacent slot status is that there is a false panel in the adjacent slot of the target board, controlling the rotational speed of the target fan based on the current temperature, the expected temperature range and the proximity of the false panel to the target board.

[0009] Optionally, when the adjacent slot status is that there is no false panel in the adjacent slot of the target board, the rotational speed of the target fan is controlled based on the current temperature and the expected temperature range, including at least one of the following: when the current temperature is within the expected temperature range, controlling the rotational speed of the target fan to remain unchanged; when the current temperature is lower than the expected temperature range, reducing the rotational speed of the target fan; when the current temperature exceeds the expected temperature range, increasing the rotational speed of the target fan.

[0010] Optionally, when the adjacent slot status is that there is a fake panel in the adjacent slot of the target board, the rotation speed of the target fan is controlled based on the current temperature, the expected temperature range and the proximity of the fake panel to the target board, including: determining the adjacent fake panel of the target board based on the proximity of the fake panel to the target board; and controlling the rotation speed of the target fan based on the current temperature, the expected temperature range and the adjacent fake panel.

[0011] Optionally, determining the adjacent false panel of the target board card based on the proximity between the false panel and the target board card includes: when the proximity is that a predetermined number of adjacent slots on one side of the target board card are all false panels, determining the predetermined number of false panels as the adjacent false panels; and / or when the proximity is that a board card and false panels exist in a predetermined number of adjacent slots on one side of the target board card, determining the false panel between the nearest board card and the target board card as the adjacent false panel, wherein the nearest board card is the board card that is closest to the target board card in the predetermined number of adjacent slots.

[0012] Optionally, controlling the rotational speed of the target fan based on the current temperature, the expected temperature range and the adjacent false panel includes: determining the stable temperature of the target board under the current operating conditions based on the current temperature, the first rotational speed of the target fan and the second rotational speed of the fan corresponding to the adjacent false panel; and controlling the rotational speed of the target fan based on the expected temperature range and the stable temperature.

[0013] Optionally, determining the stable temperature of the target board under the current operating condition based on the current temperature, the first rotational speed of the target fan and the second rotational speed of the fan corresponding to the adjacent false panel includes: determining the power consumption of the target board based on the board type of the target board; determining the current air flow speed flowing through the target board based on the first rotational speed and the second rotational speed; determining the convection heat transfer coefficient of the current air based on the current air flow speed and the air inlet cross-sectional area corresponding to the target board; determining the stable temperature of the target board under the current operating condition based on the power consumption, the convection heat transfer coefficient, the current temperature, the corresponding air inlet air temperature and the air outlet air temperature of the target board.

[0014] Optionally, controlling the rotational speed of the target fan based on the expected temperature range and the stable temperature includes at least one of the following: controlling the rotational speed of the target fan to remain unchanged when the stable temperature is within the expected temperature range; reducing the rotational speed of the target fan when the stable temperature is lower than the expected temperature range; and increasing the rotational speed of the target fan when the stable temperature exceeds the expected temperature range.

[0015] According to another aspect of the present invention, a fan control device is provided, comprising: a first determination module, used to determine a target board corresponding to a target fan in a frame device; an acquisition module, used to obtain a current temperature and an expected temperature range of the target board; a second determination module, used to determine an adjacent slot status of the target board; and a control module, used to control the rotation speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot status.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored executable program, wherein when the executable program is run, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned fan control methods.

[0017] According to another aspect of the present invention, an electronic device is provided, comprising: a memory storing an executable program; and a processor for running the program, wherein the program executes any one of the above-mentioned fan control methods when running.

[0018] According to another aspect of the present invention, a computer program product is provided, comprising a computer program, wherein when the computer program is executed by a processor, the steps of any one of the fan control methods are implemented.

[0019] In the embodiment of the present invention, on the basis of considering the current temperature and expected temperature range of the target board, the influence of the adjacent slots of the target board on the heat dissipation of the target board is also considered. By combining the heat dissipation requirements of the target board and the status of the adjacent slots, the purpose of accurately controlling the fan speed is achieved, thereby achieving the technical effect of reducing the fan speed and improving the heat dissipation efficiency of the equipment, thereby solving the technical problem of poor heat dissipation effect and serious fan loss of frame-type equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 is a flow chart of a fan control method according to an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of a frame-type device intelligent fan speed control strategy according to an optional implementation mode of the present invention;

[0023] Figure 3 is a schematic diagram of one fan module corresponding to one slot according to an optional implementation manner of the present invention;

[0024] Figure 4 is a schematic diagram of one fan module corresponding to multiple slots according to an optional implementation manner of the present invention;

[0025] Figure 5 is a schematic diagram of a case where adjacent slots of an in-place board have boards in place according to an optional implementation mode of the present invention;

[0026] Figure 6 is a schematic diagram of a case where both adjacent slots are dummy panels according to an optional implementation mode of the present invention;

[0027] Figure 7 is a schematic diagram of a case where not all adjacent slots are dummy panels according to an optional implementation mode of the present invention;

[0028] Figure 8 is a structural block diagram of a fan control device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] First, some nouns or terms that appear in the description of the embodiments of the present application are subject to the following explanations:

[0032] Frame equipment: also known as frame equipment or rack-mount equipment, refers to electronic equipment designed to be installed in a standard rack or cabinet. This type of equipment is usually used in data centers, telecommunications rooms, large computer networks and high-performance computing environments, and is favored for its stable structure, easy management, easy expansion and maintenance.

[0033] Board: refers to a standardized module used to achieve specific functions. It can be inserted into the dedicated slot of the frame device. By inserting it into the dedicated slot, it is electrically connected to the mainboard or other modules of the frame device, thereby expanding the function of the frame device or improving its performance. The board has a hot-swappable design, which allows the board to be replaced or upgraded without shutting down the device, improving the maintainability and scalability of the device. The standardized design of the board makes the products of different brands and manufacturers compatible with each other, increasing the flexibility and practicality of the frame device.

[0034] Dummy panels: Also known as filler panels or empty slot panels, they play an important role in computers, communication equipment and other electronic systems, especially in modular devices such as servers, switches and routers. Dummy panels are mainly used in empty slots of equipment to maintain the thermal management, structural stability and safety of the equipment. When there is no functional card installed in the equipment slot, the air flow inside the equipment will be affected, which may cause short circuit or uneven air flow distribution, affecting the heat dissipation efficiency of the equipment. Dummy panels can fill the empty slots, help maintain the air flow path inside the equipment, and ensure that the air flow passes smoothly through the entire system, thereby optimizing the heat dissipation effect. In multi-slot frame-type equipment, the board and the dummy panel jointly support the frame of the equipment to maintain its structural stability and integrity. The installation of dummy panels can prevent the deformation of the equipment frame due to empty slots, ensuring the strength and durability of the equipment. Dummy panels can also play a role in physical protection, preventing dust and foreign matter from entering the equipment and reducing potential damage to internal components. At the same time, it also prevents operators from accidentally touching the live parts inside the equipment, improving operational safety.

[0035] With the improvement of frame equipment performance and the diversification of product functions, the number of boards in the frame has increased, and the number of components and power consumption of the boards have increased dramatically, resulting in large heat dissipation impedance, high heat flux density, and poor heat dissipation density of frame equipment, which seriously affects equipment performance. In response to the above problems, frame equipment often uses multiple fans to form a fan module to dissipate heat from the boards in the frame. When adjusting the fan module, the speed is adjusted according to the type and number of boards, or only a few fixed fan speeds are used to cope with different heat dissipation scenarios, resulting in poor heat dissipation effect. When some boards are not in place, the fan also runs at a high speed, which not only makes a lot of noise, but also increases fan loss and reduces fan life.

[0036] In the related art, for frame-type equipment that includes multiple boards, slots for fixing the boards, and fan modules corresponding to the slots, the fan speed regulation strategy adopted is: when no board is in place, the fan stops; when a board is detected to be in place, the type of board is first determined, and different fan regulation programs are used according to the different types of boards. Then, the number of boards, working status and monitoring point temperature are counted, and the corresponding fan regulation program is automatically called to make the fan reach the expected fan speed, thereby meeting the heat dissipation requirements of the board.

[0037] However, frame-type equipment contains multiple boards, which can be combined in multiple ways, involving multiple working scenarios. The air ducts in the frame are complex, and the fan speed control strategy used in the relevant technology has the following problems: one fan module will affect the heat dissipation of multiple boards, but the relevant technology does not consider the impact between boards. When one adjacent slot has a board and the other has no board, the fan corresponding to the slot with the board has a high speed, and the fan corresponding to the slot without the board does not rotate. The fan module losses of the two are different, affecting the fan life and reliability of the fan module. The equipment does not have a false panel detection function, and the fan speed control strategy of the relevant technology does not distinguish between the presence or absence of false panels. The presence or absence of false panels and the number of false panels have different effects on the heat dissipation of adjacent boards.

[0038] In order to solve this technical problem, according to an embodiment of the present invention, an embodiment of a fan control method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0039] Figure 1 is a flow chart of a fan control method according to an embodiment of the present invention. Figure 1 As shown, the method comprises the following steps:

[0040] Step S102, determining a target board corresponding to a target fan in a frame-type device.

[0041] As an optional embodiment, the execution subject of the method of this embodiment can be multiple subjects, for example, a control board or control system that can be used for fan control. Among them, the control board can be a main control unit board or a microprocessor board of a frame device, which integrates processing, storage and communication resources and is responsible for the internal management and control of the frame device. The control system can be a more complex architecture, which can include multiple control boards, sensor networks, communication protocols and central management software. When applied to a control board, fan control can be easily implemented. When applied to a control system, the rich computing resources of the control system can be called to achieve precise thermal management of the frame device.

[0042] As an optional embodiment, when determining the target board corresponding to the target fan in the frame device, multiple methods can be used. For example, by establishing a dynamic heat map inside the device, the temperature distribution inside the frame device can be more accurately understood, so as to identify which areas need more cooling and determine the target board. For another example, the heat demand of the board can be identified in real time, and the fan speed can be dynamically adjusted according to the actual heat load of the board. The method of identifying the heat demand of the board in real time is both direct and accurate. It can quickly determine the target board corresponding to the target fan, and can also accurately locate the board that currently needs the most heat dissipation. Before identifying the heat demand of the board in real time, the slot status corresponding to the target fan can be determined first; then based on the slot status, the target board is determined. The target fan may correspond to one or more slots, and the status of the one or more slots also has multiple situations. There may be a board, or there may be no board replaced by a fake panel. By determining whether there is a board in one or more slots corresponding to the target fan, the target board corresponding to the target fan can be determined, that is, which board is used to regulate the target fan. Therefore, when the target fan is controlled, it is controlled based on the board that is most urgently considered. In this way, not only can the temperature of the board that needs the most consideration be controlled, but the normal operation of other boards can also be effectively guaranteed.

[0043] As an optional embodiment, when determining the target board based on the slot status, a variety of methods can be used. For example, the board with the highest current temperature among the boards corresponding to the target fan can be determined as the target board. The method of determining directly based on the current temperature is relatively direct, but it does not take into account the different requirements of different boards for stable working conditions, so the determined target board may not be the board that needs the most heat dissipation. For another example, when the slot status is that there is a board in the slot corresponding to the target fan, the board is determined to be the target board; when the slot status is that there are multiple boards in the slot corresponding to the target fan, the board with the highest current temperature among the multiple boards is determined to be the target board. For example, when reading the current temperature of a board, first determine whether the temperature is within the expected temperature range. If it is within the expected temperature range, it means that the current wind speed meets the board's heat dissipation requirements, and the temperature difference is no longer considered. If it is not within the expected temperature range, the current temperature and the upper and lower limits of the expected temperature range need to be used to make a difference. If both temperature differences are positive, it means that the current temperature is greater than the expected temperature range, and the fan speed needs to be increased to reduce the board component temperature. If both temperature differences are negative, it means that the current temperature is less than the expected temperature range, and the fan speed needs to be reduced to increase the component temperature and reduce fan loss. When there are multiple boards in the slot corresponding to the target fan, the board with the highest current temperature among the multiple boards is determined as the target board, and the current temperature of the target board is used as the basis for adjusting the speed of the target fan. By determining the board with the highest current temperature among the multiple boards as the target board, the board with the most urgent heat dissipation requirements can be processed first. This method can effectively avoid overheating of the board and ensure stable operation of the equipment. In addition, when there are no boards in the slot corresponding to the fan and all are fake panels, in order to avoid energy waste, the speed of the fan can be directly adjusted to the set minimum speed.

[0044] Step S104, obtaining the current temperature and expected temperature range of the target board.

[0045] As an optional embodiment, when obtaining the current temperature and expected temperature range of the target board, multiple methods can be used. For example, by using temperature sensor monitoring, installing temperature sensors on each board or near key heat sources, continuously measuring and reporting temperature data to the control board or control system, the operating temperature of the board can be instantly understood, and data support can be provided for the dynamic adjustment of the fan speed. For another example, the smart board can be self-reported, and the temperature monitoring function built into the smart board can be used to directly report the temperature data to the control board or control system through a specific communication protocol, which can provide more detailed monitoring information, including the temperature of each component on the board, which helps to achieve more refined heat dissipation management. By obtaining the current temperature and expected temperature range of the target board, the temperature of the target board can be monitored in real time, ensuring that the fan control strategy matches the actual heat demand of the target board, ensuring that the board runs within a safe operating temperature range (i.e., the above-mentioned expected temperature range), preventing equipment failure caused by overheating, and achieving efficient heat dissipation while avoiding waste of resources and increased noise.

[0046] Step S106, determining the adjacent slot status of the target board.

[0047] As an optional embodiment, the state of the adjacent slots of the target board can be determined. The state of the two adjacent slots closest to the target board can be determined, or the state of several slots adjacent to the target board can be determined. The adjacent slots will affect the heat dissipation of the target board, and the degree of influence decreases as the distance from the target board increases. The state of the adjacent slots can be that there is a board in place or that there is a fake panel in place. Different adjacent slot states have different degrees of influence on the target board. Understanding the state of the adjacent slots helps to evaluate the heat dissipation environment of the target board, especially when the internal space of the frame device is limited and the airflow is unevenly distributed, so that the fan speed can be adjusted more accurately to optimize the heat dissipation effect.

[0048] Step S108, controlling the rotation speed of the target fan based on the current temperature, the expected temperature range, and the state of the adjacent slots.

[0049] As an optional embodiment, when the speed of the target fan is controlled based on the current temperature, the expected temperature range and the adjacent slot state, the speed of the target fan can be controlled in different ways according to different adjacent slot states. When the adjacent slot state is that there is no dummy panel in the adjacent slot of the target board, the speed of the target fan is controlled based on the current temperature and the expected temperature range; and / or, when the adjacent slot state is that there is a dummy panel in the adjacent slot of the target board, the speed of the target fan is controlled based on the current temperature, the expected temperature range and the proximity of the dummy panel to the target board. Since the dummy panel has a large wind resistance to the airflow, the wind at the air inlet is prevented from flowing through the dummy panel, and the wind flowing to the dummy panel flows to the adjacent slot. There are a large number of electronic components in the board, and the device layout will optimize the wind resistance and facilitate the heat dissipation of the device. Therefore, the dummy panel in the adjacent slot has a more obvious impact on the target board than the board. By distinguishing the presence of the dummy panel in the adjacent slot and considering the impact of the dummy panel on the airflow, the heat dissipation strategy can be optimized, especially in the scenario where there are a large number of idle slots inside the frame device and these slots are filled with dummy panels.

[0050] As an optional embodiment, when the adjacent slot state is that there is no dummy panel in the adjacent slot of the target board, the speed of the target fan is controlled based on the current temperature and the expected temperature range, including at least one of the following: when the current temperature is within the expected temperature range, the speed of the target fan is controlled to remain unchanged; when the current temperature is lower than the expected temperature range, the speed of the target fan is reduced; when the current temperature exceeds the expected temperature range, the speed of the target fan is increased. When the adjacent slot state is that there is no dummy panel in the adjacent slot of the target board, that is, when there is no influence of the dummy panel, the target fan can be directly regulated according to the current temperature of the target panel and the expected temperature range, which can meet the thermal demand of the target fan, make the temperature of the target board fluctuate within a safe range, ensure the stable operation of the target board, and at the same time minimize unnecessary fan energy consumption and reduce fan noise.

[0051] As an optional embodiment, when the adjacent slot state is that a dummy panel exists in the adjacent slot of the target board, based on the current temperature, the expected temperature range and the proximity of the dummy panel to the target board, when controlling the rotation speed of the target fan, the proximity of the dummy panel to the target board can be distinguished first. For example, based on the proximity of the dummy panel to the target board, the adjacent dummy panel of the target board is determined; based on the current temperature, the expected temperature range and the adjacent dummy panel, the rotation speed of the target fan is controlled. Since not all dummy panels will have a great impact on the target board when the adjacent slot state is that a dummy panel exists in the adjacent slot of the target board, by determining the adjacent dummy panel of the target board, the dummy panel with a greater impact on the target board can be found out, and only the thermal requirements of the dummy panel with a greater impact and the target board are considered, which can simplify the calculation, speed up the fan response speed, and accurately control the fan to provide a suitable working environment for the target board.

[0052] As an optional embodiment, when determining the adjacent dummy panel of the target board based on the proximity of the dummy panel to the target board, a variety of methods can be used. For example, the adjacent dummy panel can be determined based on the distance between the dummy panel and the target board. For another example, whether there are other boards between the dummy panel and the target board can be considered based on the distance between the dummy panel and the target board. Other boards will greatly weaken the impact of the dummy panel on the target board, so considering whether there are other boards between the dummy panel and the target board based on the distance between the dummy panel and the target board can further simplify the processing process of fan control and achieve a more efficient and stable heat dissipation effect.

[0053] Specifically, in the case where the adjacent situation is a side of the target board, a predetermined number of adjacent slots are all dummy panels, and a predetermined number of dummy panels are determined as adjacent dummy panels; in the case where the adjacent situation is a side of the target board, a predetermined number of adjacent slots have both boards and dummy panels, and the dummy panel between the nearest board and the target board is determined as the adjacent dummy panel. Among them, the predetermined number of adjacent slots limits the distance from the target board, and when the predetermined number of adjacent slots have both boards and dummy panels, the dummy panel between the nearest board and the target board is selected, avoiding the situation where there are other boards between the dummy panel and the target board, thereby accurately evaluating the specific impact of the dummy panel on the heat dissipation of the target board, and accurately controlling the fan speed. For example, the frame device has 6 slots, 3 fans, and 1 fan corresponds to 2 slots. The 6 slot states are: slot 1 is a dummy panel, slot 2 is a dummy panel, slot 3 is a target board, slot 4 is a dummy panel, slot 5 is a board, and slot 6 is a dummy panel. For the target board in slot 3, the proximity of the dummy panels in the three adjacent slots on the upper side and the three adjacent slots on the lower side to the target board is determined respectively. Among them, there are only two adjacent slots on the upper side, and both are dummy panels. It can be determined that the dummy panels in slots 1 and 2 are both adjacent dummy panels. There are three adjacent slots on the lower side, with both boards and dummy panels. The nearest board is the board in slot 5. The dummy panel between the nearest board and the target board is the dummy panel in slot 4. It can be determined that the dummy panel in slot 4 is also an adjacent dummy panel.

[0054] As an optional embodiment, when controlling the speed of the target fan based on the current temperature, the expected temperature range and the adjacent dummy panels, the influence of the adjacent dummy panels on the airflow velocity and thermal resistance flowing through the target board is considered, and different adjacent dummy panels may correspond to different fan speeds. The stable temperature of the target board under the current working condition can be determined based on the current temperature, the first speed of the target fan and the second speed of the fan corresponding to the adjacent dummy panels; the speed of the target fan is controlled based on the expected temperature range and the stable temperature. The stable temperature of the target board under the current heat dissipation strategy can be dynamically calculated based on the current temperature, the first speed of the target fan and the second speed of the fan corresponding to the adjacent dummy panels. Compared with the current temperature alone, it can better reflect the actual thermal state of the target board and the performance of the heat dissipation system over a period of time. Therefore, the control strategy of the target fan determined based on the expected temperature range and the stable temperature can also be more accurate, which is more effective in alleviating the thermal state of the target board.

[0055] As an optional embodiment, when determining the stable temperature of the target board under the current working conditions based on the current temperature, the first speed of the target fan and the second speed of the fan corresponding to the adjacent false panel, a variety of methods can be used. For example, the thermodynamic principle can be used to calculate using a thermodynamic model. For another example, an empirical formula can be established through experimental data to obtain the stable temperature. The stable temperature calculated using the thermodynamic model is more reliable because it is directly calculated. It is simpler and faster to obtain the stable temperature by establishing an empirical formula through experimental data, but it depends on the accuracy of the experiment and the applicability of the empirical formula, and is limited by the coverage of the experimental conditions. Therefore, using a thermodynamic model for calculation is a better implementation method.

[0056] When using the thermodynamic model for calculation, the specific calculation process can use a variety of formulas. For example, based on the board type of the target board, determine the power consumption of the target board; based on the first speed and the second speed, determine the current air flow speed flowing through the target board; based on the current air flow speed and the cross-sectional area of ​​the air inlet corresponding to the target board, determine the convective heat transfer coefficient of the current air; based on the power consumption, convective heat transfer coefficient, current temperature, the corresponding air inlet air temperature and the air outlet air temperature of the target board, determine the stable temperature of the target board under the current working conditions. Among them, the power consumption of the board affects its heat dissipation requirements. The higher the power consumption of the board, the greater the heat dissipation requirements. The current air flow speed affects its heat dissipation efficiency. The greater the current air flow speed, the higher the heat dissipation efficiency. When determining the convective heat transfer coefficient of the current air based on the current airflow velocity and the cross-sectional area of ​​the air inlet corresponding to the target board, a variety of methods can be used. For example, the air inlet airflow rate can be determined based on the current airflow velocity and the cross-sectional area of ​​the air inlet corresponding to the target board. After that, the convective heat transfer coefficient of the current air can be determined based on the current airflow velocity and the air inlet airflow rate. The convective heat transfer coefficient can evaluate the heat dissipation of the target board. Comprehensively considering the power consumption of the board, the current airflow velocity, the convective heat transfer coefficient, and the temperature of the inlet and outlet can more accurately evaluate the stable temperature of the board under the current working conditions, which is beneficial to the long-term operation and performance maintenance of the board.

[0057] As an optional embodiment, based on the expected temperature range and the stable temperature, the speed of the target fan is controlled, including at least one of the following: when the stable temperature is within the expected temperature range, the speed of the target fan is controlled to remain unchanged; when the stable temperature is lower than the expected temperature range, the speed of the target fan is reduced; when the stable temperature exceeds the expected temperature range, the speed of the target fan is increased. By controlling the speed of the target fan through the expected temperature range and the stable temperature, the operating environment temperature of the target board can be stabilized, and the temperature of the target board itself can fluctuate within a safe range. At the same time, when the target board does not need strong heat dissipation, the fan speed is reduced to avoid the fan always maintaining high-intensity work, which not only wastes energy but also shortens the service life.

[0058] Through the above steps, by paying attention to whether there are dummy panels in the adjacent slots and considering the impact of the adjacent dummy panels on the temperature of the target board, the fan can be accurately controlled to match the fan speed with the current temperature and expected temperature range of the corresponding board, ensuring that the board is in a suitable operating environment. The fan speed is adjusted in time according to the board's temperature requirements, which can improve the heat dissipation efficiency of the frame device while increasing the fan life, ensuring that the fan module can operate reliably for a long time.

[0059] In combination with the above embodiments and optional embodiments, an optional implementation is provided. In this optional implementation, a frame-type device intelligent fan speed control strategy is proposed. Frame-type equipment usually includes multiple slots and multiple fan modules. A fan module can correspond to one or more slots and dissipate heat for the boards in the slots. Multiple fan modules constitute a fan module. Multiple slots can be used to insert various types of boards, such as control boards, business boards, power boards, etc., and can also be used to insert false panels. The false panels can avoid drawing air from the empty slots when there are no boards in the slots, causing sudden changes in the air ducts in the frame, affecting the heat dissipation of the boards in the frame. For the boards in place in the slots, whether there are false panels in the adjacent slots and the number of false panels will have different effects on the heat dissipation effect of the boards in place. Therefore, it is necessary to adjust the speed of the fan modules corresponding to the boards in place according to the presence of the false panels. Figure 2 is a schematic diagram of a frame-type device intelligent fan speed control strategy according to an optional implementation mode of the present invention, such as Figure 2 As shown, the method includes the following processing:

[0060] S1, the control board detects the presence of boards and dummy panels, counts the number of boards and dummy panels in place, and the types of boards, and determines the in-place board (ie, target board) corresponding to the fan module (ie, the target fan referred to above) based on the above information.

[0061] When a fan module corresponds to a slot, the speed of the fan module is adjusted directly based on the temperature of the board in the corresponding slot. Figure 3 is a schematic diagram of one fan module corresponding to one slot according to an optional implementation mode of the present invention, such as Figure 3 shown.

[0062] When a fan module corresponds to multiple slots, the fan speed is adjusted based on the temperature of the board at the temperature bottleneck point. For example, if a fan module corresponds to slots 1, 2, and 3, and the temperature of the board in slot 2 is the bottleneck point, the speed of the fan module is adjusted based on the temperature of the board in slot 2. Figure 4 is a schematic diagram of one fan module corresponding to multiple slots according to an optional implementation mode of the present invention, such as Figure 4 shown.

[0063] According to the correspondence between different fan modules and slots, it can be determined which in-place board (ie corresponding to the above-mentioned target board) is the reference for fan module speed regulation, and the fan speed is controlled according to the in-place board.

[0064] S2, the control board determines whether there is a board or a dummy panel in the adjacent slot of the board in place, and adopts different speed regulation strategies to regulate the speed of the fan module corresponding to the board according to the board in place status and dummy panel in the adjacent slot of the board in place.

[0065] 1) There are cards in place in the adjacent slots of the in-place cards.

[0066] Figure 5 is a schematic diagram of a board in place in adjacent slots according to an optional implementation mode of the present invention, such as Figure 5 As shown. In the case where there are boards in the adjacent slots of the in-place board, control strategy 1 is adopted: the control board detects the types of the in-place board and the adjacent boards, the temperature of the components of each board, the temperature of the air inlet and outlet, and the current fan speed, and determines whether the temperature of the components of the current in-place board meets the requirements. If the temperature is high, call the corresponding fan control program to increase the fan speed to dissipate heat for the in-place board; if the temperature is low, the fan speed is high, the noise is loud, and the fan resources are wasted. Call the corresponding fan control program to reduce the fan speed to dissipate heat for the in-place board, which not only meets the heat dissipation requirements of the board, but also takes into account the need to fully utilize fan resources.

[0067] 2) There are filler panels in the adjacent slots of the in-place boards. There are two situations: one fan module corresponds to one slot and one fan module corresponds to multiple slots.

[0068] In the first case, one fan module corresponds to one slot. The second control strategy is: the control board detects the presence of the dummy panel, and the fan module speed of the corresponding slot is adjusted to the lowest speed; the number of dummy panels in place is counted, and the number of dummy panels will affect the wind speed of the board in place, and then the fan speed of the current board in place is adjusted according to the fan speed of the current board. speed The fan speed corresponding to the adjacent filler panel is Fan fake-1…n , the current air flow velocity V flowing through the board is obtained as shown in the following formula:

[0069] V=f1(Fan speed ,Fan fake-1…n )

[0070] The board corresponds to the air inlet cross-sectional area of ​​A area-in , at this time the air inlet flow rate G is:

[0071] G=V*A area-in

[0072] At this time, the air dynamic viscosity is μ and the air specific heat is C p , air thermal conductivity is K, air density is ρ, Reynolds number is Re, Nusselt number is Nu, Prandtl number is Pr, and the convective heat transfer coefficient h is obtained as:

[0073] h=f2(V,G,C p ,K,Re,Nu,ρ,Pr)

[0074] The control panel is based on the current air inlet temperature T air-in , outlet air temperature T air-out , convection heat transfer coefficient h, power consumption P of the board in place and temperature T of the board in place chip Calculate the stable temperature of the board in place under the current working conditions:

[0075] T chip-stable =f3(T air-in ,T air-out ,h,P,T chip )

[0076] When T chip-stable Meet the expected temperature range T of the chip under current working conditions chip-expect When T chip-stable <T chip-expect When the fan speed is too high, the noise is too loud, and the fan resources are wasted. speed , and recalculate according to the calculation formula, at the new fan speed Fan speed Under this condition, the heat dissipation requirements of the chip on the board can be met; when T chip-stable >T chip-expect When the fan speed is increased, the calculation formula is recalculated. speed Under this condition, the heat dissipation requirements of the existing boards can be met.

[0077] In the second case, a fan module corresponds to multiple slots. The fan speed is regulated based on the temperature of the board at the temperature bottleneck point. For example, a fan module corresponds to three slots 1, 2, and 3. The temperature of the board in slot 2 is the bottleneck point. The fan speed is regulated based on the temperature of the board in slot 2. At this time, there are two situations based on the speed regulation of the false panels: the slots corresponding to the adjacent fan modules are all false panels and the slots corresponding to the adjacent fan modules are not all false panels. The control strategy is as follows:

[0078] When the corresponding slots of adjacent fan modules are all filled with filler panels, control strategy 3 is used. Figure 6 is a schematic diagram of an optional implementation mode of the present invention in which adjacent slots are all dummy panels, such as Figure 6The control board detects the presence of the filler panel, adjusts the fan module speed of the corresponding slot to the minimum speed, and counts the number of filler panels on both sides. The fan module corresponding to the board in place will use the board temperature at the temperature bottleneck point as the basis for fan speed adjustment, and will not adjust to the minimum speed. speed The fan speed corresponding to the adjacent filler panel is Fan fake-1…n , the current air velocity V flowing through the board is obtained as

[0079] V=f2(Fan speed ,Fan fake-1…n )

[0080] According to the corresponding formula, the air flow rate G, convection heat transfer coefficient h and T are calculated. chip-stable . T chip-stable With T chip-expect Make a comparison and adjust the fan speed according to the comparison result to meet the heat dissipation requirements of the board in place.

[0081] When the corresponding slots of adjacent fan modules are not all filled with filler panels, control strategy 4 is used. Figure 7 is a schematic diagram of an adjacent slot not all being dummy panels according to an optional implementation mode of the present invention, such as Figure 7 As shown. The control board detects the presence of false panels. The speed of the fan modules of the adjacent non-false panels is adjusted to the lowest speed based on the board at the temperature bottleneck point. The fan modules of the false panels are all adjusted to the lowest speed, and the number of false panels on both sides is counted. The fan modules corresponding to the boards in place will use the board temperature at the temperature bottleneck point as the basis for fan speed adjustment and will not be adjusted to the lowest speed. According to the fan speed corresponding to the current boards in place, speed The fan speed corresponding to the adjacent filler panel is Fan fake-1…n , the current air velocity V flowing through the board is obtained as

[0082] V=f2(Fan speed ,Fan fake-1…n )

[0083] According to the corresponding formula, the air flow rate G, convection heat transfer coefficient h and T are calculated. chip-stable . T chip-stable With T chip-expect Make a comparison and adjust the fan speed according to the comparison result to meet the heat dissipation requirements of the board in place.

[0084] Through the intelligent fan speed control strategy, that is, distinguishing whether there is a false panel in the adjacent slot of the in-place board and adjusting the speed of the in-place board according to the presence of the board in the adjacent slot, the fan speed can be reduced, the noise can be reduced, the heat dissipation efficiency of the equipment can be improved, the loss difference between different fan modules can be reduced, the fan life can be extended, and the fan module can be guaranteed to operate reliably for a long time.

[0085] According to an embodiment of the present invention, a fan control device is provided. Figure 8 is a structural block diagram of a fan control device according to an embodiment of the present invention. Figure 8 As shown, the device includes: a first determination module 802, an acquisition module 804, a second determination module 806, and a control module 808. The device is described below.

[0086] The first determination module 802 is used to determine the target board corresponding to the target fan in the frame device; the acquisition module 804 is connected to the above-mentioned first determination module 802, and is used to obtain the current temperature and expected temperature range of the target board; the second determination module 806 is connected to the above-mentioned first determination module 802, and is used to determine the adjacent slot status of the target board; the control module 808 is connected to the above-mentioned acquisition module 804 and the second determination module 806, and is used to control the rotation speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot status.

[0087] It should be noted here that the above-mentioned first determination module 802, acquisition module 804, second determination module 806, and control module 808 correspond to steps S102 to S108 in the embodiment, and the instances and application scenarios implemented by the multiple modules are the same as the corresponding steps, but are not limited to the contents disclosed in the above-mentioned embodiments.

[0088] As an optional embodiment, the first determination module 802 includes: a first determination unit and a second determination unit. The first determination unit is used to determine the slot status corresponding to the target fan; the second determination unit is connected to the first determination unit and is used to determine the target board based on the slot status.

[0089] As an optional embodiment, the second determination unit includes: a first determination subunit and a second determination subunit. The first determination subunit determines that a board is a target board when the slot state is that there is a board in the slot corresponding to the target fan; the second determination subunit is connected to the first determination subunit and is used to determine that a board with the highest current temperature among the multiple boards is the target board when the slot state is that there are multiple boards in the slot corresponding to the target fan.

[0090] As an optional embodiment, the control module 808 includes: a first control unit and a second control unit. The first control unit is used to control the speed of the target fan based on the current temperature and the expected temperature range when the adjacent slot state is that there is no dummy panel in the adjacent slot of the target board; the second control unit is connected to the first control unit and is used to control the speed of the target fan based on the current temperature, the expected temperature range and the proximity of the dummy panel to the target board when the adjacent slot state is that there is a dummy panel in the adjacent slot of the target board.

[0091] As an optional embodiment, the first control unit includes at least one of the following: a first control subunit, a second control subunit, and a third control subunit. The first control subunit is used to control the rotation speed of the target fan to remain unchanged when the current temperature is within the expected temperature range; the second control subunit is used to reduce the rotation speed of the target fan when the current temperature is lower than the expected temperature range; and the third control subunit is used to increase the rotation speed of the target fan when the current temperature exceeds the expected temperature range.

[0092] As an optional embodiment, the second control unit includes: a third determining subunit and a fourth controlling subunit. The third determining subunit is used to determine the adjacent dummy panel of the target board based on the proximity of the dummy panel to the target board; the fourth controlling subunit is connected to the third determining subunit and is used to control the speed of the target fan based on the current temperature, the expected temperature range and the adjacent dummy panel.

[0093] As an optional embodiment, the second determination sub-unit includes: a first determination sub-unit and a second determination sub-unit. The first determination sub-unit is used to determine a predetermined number of dummy panels as adjacent dummy panels when the adjacent situation is that a predetermined number of adjacent slots on one side of the target board are all dummy panels; the second determination sub-unit is used to determine a dummy panel between the nearest board and the target board as an adjacent dummy panel when the adjacent situation is that a predetermined number of adjacent slots on one side of the target board both have boards and dummy panels, wherein the nearest board is the board that is closest to the target board in the predetermined number of adjacent slots.

[0094] As an optional embodiment, the fourth control sub-unit includes: a third determination sub-unit and a first control sub-unit. The third determination sub-unit is used to determine the stable temperature of the target board under the current working condition based on the current temperature, the first rotation speed of the target fan and the second rotation speed of the fan corresponding to the adjacent dummy panel; the first control sub-unit is connected to the third determination sub-unit and is used to control the rotation speed of the target fan based on the expected temperature range and the stable temperature.

[0095] As an optional embodiment, the above-mentioned third determination sub-subunit includes: determining the power consumption of the target board based on the board type of the target board; determining the current air flow speed flowing through the target board based on the first rotation speed and the second rotation speed; determining the current convective heat transfer coefficient of the air based on the current air flow speed and the air inlet cross-sectional area corresponding to the target board; determining the stable temperature of the target board under the current working conditions based on the power consumption, the convective heat transfer coefficient, the current temperature, the corresponding air inlet air temperature and the air outlet air temperature of the target board.

[0096] As an optional embodiment, the above-mentioned first control sub-subunit includes at least one of the following: for controlling the speed of the target fan to remain unchanged when the stable temperature is within the expected temperature range; for reducing the speed of the target fan when the stable temperature is lower than the expected temperature range; for increasing the speed of the target fan when the stable temperature exceeds the expected temperature range.

[0097] According to an embodiment of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium includes a stored executable program, wherein when the executable program runs, the device where the computer-readable storage medium is located is controlled to execute any one of the above-mentioned fan control methods.

[0098] According to an embodiment of the present invention, an electronic device is provided, comprising: a memory storing an executable program; and a processor for running the program, wherein any one of the above-mentioned fan control methods is executed when the program is running.

[0099] According to an embodiment of the present invention, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps of any one of the above methods are implemented.

[0100] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0101] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0102] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0103] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0104] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0105] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

[0106] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A fan control method, characterized in that: include: Determine the target board corresponding to the target fan in the chassis device; Obtaining the current temperature and expected temperature range of the target board; Determining the adjacent slot status of the target board; The rotation speed of the target fan is controlled based on the current temperature, the expected temperature range, and the adjacent slot status.

2. The method according to claim 1, characterized in that The step of determining a target board corresponding to a target fan in a frame-type device includes: Determine the slot status corresponding to the target fan; The target board is determined based on the slot status.

3. The method according to claim 2, characterized in that The step of determining the target board based on the slot status includes: When the slot status indicates that there is a board in the slot corresponding to the target fan, determining that the board is the target board; When the slot status indicates that there are multiple boards in the slot corresponding to the target fan, a board with the highest current temperature among the multiple boards is determined as the target board.

4. The method according to claim 1, characterized in that The controlling the rotation speed of the target fan based on the current temperature, the expected temperature range, and the adjacent slot status includes: When the adjacent slot status is that there is no dummy panel in the adjacent slot of the target board, based on the current temperature and the expected temperature range, controlling the rotation speed of the target fan; and / or, When the adjacent slot status is that a dummy panel exists in the adjacent slot of the target board, the rotation speed of the target fan is controlled based on the current temperature, the expected temperature range, and proximity between the dummy panel and the target board.

5. The method according to claim 4, characterized in that When the adjacent slot status is that there is no dummy panel in the adjacent slot of the target board, controlling the rotation speed of the target fan based on the current temperature and the expected temperature range includes at least one of the following: When the current temperature is within the expected temperature range, controlling the rotation speed of the target fan to remain unchanged; When the current temperature is lower than the expected temperature range, reducing the rotation speed of the target fan; When the current temperature exceeds the expected temperature range, the rotation speed of the target fan is increased.

6. The method according to claim 4, characterized in that When the adjacent slot status is that a dummy panel exists in the adjacent slot of the target board, based on the current temperature, the expected temperature range, and the proximity between the dummy panel and the target board, controlling the rotation speed of the target fan includes: Determining an adjacent dummy panel of the target board based on the proximity of the dummy panel to the target board; The rotation speed of the target fan is controlled based on the current temperature, the expected temperature range, and the adjacent dummy panels.

7. The method according to claim 6, characterized in that The step of determining the adjacent dummy panel of the target board based on the proximity between the dummy panel and the target board includes: In the adjacent situation, when a predetermined number of adjacent slots on one side of the target board are all dummy panels, determining the predetermined number of dummy panels as the adjacent dummy panels; and / or, When the adjacent situation is that there are both boards and dummy panels in a predetermined number of adjacent slots on one side of the target board, the dummy panel between the nearest board and the target board is determined to be the adjacent dummy panel, wherein the nearest board is the board that is closest to the target board in the predetermined number of adjacent slots.

8. The method according to claim 6, characterized in that The controlling the rotation speed of the target fan based on the current temperature, the expected temperature range, and the adjacent dummy panel includes: Determine a stable temperature of the target board under the current working condition based on the current temperature, the first rotation speed of the target fan and the second rotation speed of the fan corresponding to the adjacent dummy panel; Based on the expected temperature range and the stable temperature, a rotation speed of the target fan is controlled.

9. The method according to claim 8, characterized in that The step of determining the stable temperature of the target board under the current working condition based on the current temperature, the first rotation speed of the target fan, and the second rotation speed of the fan corresponding to the adjacent dummy panel includes: Determining the power consumption of the target board based on the board type of the target board; Determining a current air flow speed flowing through the target board based on the first rotation speed and the second rotation speed; Determining the convective heat transfer coefficient of the current air based on the current air flow velocity and the air inlet cross-sectional area corresponding to the target board; The stable temperature of the target board under the current working condition is determined based on the power consumption, the convection heat transfer coefficient, the current temperature, and the corresponding inlet air temperature and outlet air temperature of the target board.

10. The method according to claim 8, characterized in that The controlling the rotation speed of the target fan based on the expected temperature range and the stable temperature comprises at least one of the following: When the stable temperature is within the expected temperature range, controlling the rotation speed of the target fan to remain unchanged; When the stable temperature is lower than the expected temperature range, the rotation speed of the target fan is reduced; when the stable temperature exceeds the expected temperature range, the rotation speed of the target fan is increased.

11. A fan control device, characterized in that: include: A first determination module is used to determine a target board corresponding to a target fan in a frame-type device; An acquisition module, used for acquiring the current temperature and expected temperature range of the target board; A second determination module is used to determine the adjacent slot status of the target board; A control module is used to control the rotation speed of the target fan based on the current temperature, the expected temperature range and the adjacent slot status.

12. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored executable program, wherein when the executable program is executed, the device where the computer-readable storage medium is located is controlled to execute the fan control method according to any one of claims 1 to 10.

13. An electronic device, characterized in that: include: A memory storing an executable program; A processor is used to run the program, wherein the fan control method according to any one of claims 1 to 10 is executed when the program is run.

14. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 10 are implemented.

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