Ultrahigh vacuum isolation transmission valve for semiconductor CVD (Chemical Vapor Deposition) equipment

Through the movement of the cylinder system driving the valve plate and the translation sub-plate, the problems of large space occupied by complex transmission components in the prior art are solved, and efficient installation and maintenance of vacuum isolation transmission valves are achieved.

CN119982990AActive Publication Date: 2025-05-13DIJING SEMICON TECH (SUZHOU CO LTD
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Patent Information

Application Number
CN202510475617.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-16
Publication Date
2025-05-13
Estimated Expiration
2045-04-16

AI Technical Summary

Technical Problem

The existing ultra-high vacuum isolation transmission valves require complex transmission components when realizing L-shaped movement of the valve plate, resulting in large installation space, complex maintenance and high cost.

Method used

The cylinder system is used to drive the vertical lifting and translational movement of the valve plate main body and the translational sub-plate, and the tight movement of the translational sub-plate is achieved through the expansion and contraction of the airbag, avoiding complex mechanical transmission mechanisms.

Benefits of technology

It effectively saves installation space, reduces clearance and wear during mechanical transmission, reduces maintenance costs and component replacement frequency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an ultrahigh vacuum isolation transmission valve for semiconductor CVD equipment, and relates to the technical field of vacuum isolation transmission valves, the ultrahigh vacuum isolation transmission valve comprises a valve body and a valve plate assembly, the surface of the valve body is provided with a valve port, and the valve plate assembly is arranged at the bottom of the valve body; the valve plate assembly comprises an air cylinder body, an air inlet port, a hollow piston rod, an electronic valve, a valve plate body, an air bag and a translation auxiliary plate, the air inlet port is formed in the bottom of the air cylinder body, the electronic valve is embedded in the bottom of the hollow piston rod, and the air bag is embedded in the side face of the valve plate body. According to the ultrahigh vacuum isolation transmission valve for the semiconductor CVD equipment, complex transmission parts are not needed, the installation space can be effectively saved, the ultrahigh vacuum isolation transmission valve is particularly suitable for occasions with compact space, the influence of gaps, abrasion and other factors on motion precision in the mechanical transmission process is reduced, the overall structure is relatively simple, friction and abrasion between mechanical parts are reduced, and the service life of the transmission valve is prolonged. And the frequency of replacement caused by damage of parts is reduced.
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Description

Technical Field

[0001] The present invention relates to the technical field of vacuum isolation transfer valves, in particular to an ultra-high vacuum isolation transfer valve for semiconductor CVD equipment. Background Art

[0002] The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment is a key part used in the semiconductor manufacturing process to achieve chamber pressure conversion and isolation sealing when transferring wafers between adjacent chambers. It is mainly composed of a valve body, a driving mechanism and a valve plate. The movement of the valve plate is achieved through the driving mechanism to control the opening and closing of the channels between chambers.

[0003] In order to prevent friction between the valve plate and the inner wall of the valve body during actual use, the existing ultra-high vacuum isolation transmission valve needs to be connected to the drive mechanism through transmission components such as connecting rods, cams, and gears to make the valve plate move in an L-shaped manner by first lifting and lowering and then translating, thereby ensuring that the channel is fully closed while preventing friction between the valve plate and the inner wall of the valve body. However, since the L-shaped movement of the valve plate requires the cooperation of transmission components such as connecting rods, cams, and gears to be driven, it requires a certain installation space, has a long maintenance process, and has high maintenance costs. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides an ultra-high vacuum isolation transfer valve for semiconductor CVD equipment, which solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical scheme: an ultra-high vacuum isolation transfer valve for semiconductor CVD equipment, comprising a valve body and a valve plate assembly, the surface of the valve body is provided with a valve port, the valve plate assembly is arranged at the bottom of the valve body, the valve plate assembly comprises a cylinder body, an air inlet port, a hollow piston rod, an electronic valve, a valve plate body, an air bag and a translation sub-plate, the bottom of the cylinder body is provided with an air inlet port, and the top of the cylinder body is penetrated by a hollow piston rod, the bottom of the hollow piston rod is embedded with an electronic valve, and the top of the hollow piston rod is fixed with a valve plate body, the side of the valve plate body is embedded with an air bag, and the side of the air bag is connected to the translation sub-plate.

[0006] Furthermore, the translation sub-plate is slidably connected to the valve plate body, and a vulcanized sealing member is provided on the outer side surface of the translation sub-plate.

[0007] Furthermore, the interior of the valve plate body is a hollow structure, and the airbag is connected to the hollow piston rod through the valve plate body.

[0008] Furthermore, an exhaust hose is provided at the bottom of the hollow piston rod on one side of the electronic valve, and the end of the exhaust hose is connected to a three-way valve.

[0009] Furthermore, the top of the three-way valve is a first port connected to the exhaust hose, the side of the three-way valve is a second port, and the bottom of the three-way valve is a third port.

[0010] Furthermore, an exhaust port is provided at one side of the air inlet port at the bottom of the cylinder body, and the exhaust port is connected to the third port of the three-way valve.

[0011] Furthermore, a rubber buffer rod is fixed to the bottom of the inner wall of the cylinder, and the bottom height of the rubber buffer rod is higher than the top height of the three-way valve.

[0012] Furthermore, the ultra-high vacuum isolation transfer valve includes the following use steps: Step 1: inject gas into the cylinder body through the air inlet port, so that the hollow piston rod carries the valve plate body and the translation sub-plate upward to the channel closing position, and then continue to inject gas into the cylinder body, and at the same time the electronic valve is opened, so that excess gas passes through the hollow piston rod and the valve plate body and enters the airbag. The airbag swells and pushes the translation sub-plate to translate to fit closely with the inner wall of the valve body. At this time, the translation sub-plate closes the valve port so that the channel between the chambers is closed; Step 2: When the passage between the chambers needs to be opened, the first port and the third port of the three-way valve are opened first, and the second port is temporarily closed, so that the gas in the airbag passes through the valve plate body, the hollow piston rod, the exhaust hose, the first port, the third port and is discharged from the exhaust port. At this time, the translation sub-plate shrinks and moves back, and then the second port is opened, so that the inside of the cylinder body passes through the third port and is discharged from the exhaust port, thereby achieving the goal of the translation sub-plate retracting first and then the valve plate body carrying it down.

[0013] The present invention provides an ultra-high vacuum isolation transfer valve for semiconductor CVD equipment, which has the following beneficial effects: 1. Compared with the existing method that requires multiple cylinders or complex connecting rods, cams and other mechanisms to achieve the L-shaped movement of the valve plate, the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment does not require complex transmission components, can effectively save installation space, and is particularly suitable for compact spaces. Compared with some existing methods that rely on mechanical transmission, it reduces the impact of factors such as clearance and wear during the mechanical transmission process on the motion accuracy. In addition, the overall structure is relatively simple. Since there is no complex mechanical transmission mechanism, the friction and wear between mechanical components are reduced, and the frequency of replacement due to component damage is reduced.

[0014] 2. The semiconductor CVD equipment uses an ultra-high vacuum isolation transfer valve. When it is necessary to open the channel between the chambers, the three-way valve is controlled to open its first port and the third port first, so that the gas inside the airbag is discharged first and contracts, thereby driving the translation sub-plate to contract and move back, and then the second port is opened to allow the hollow piston rod to carry the valve plate body and the translation sub-plate downward, thereby avoiding the translation sub-plate from remaining in an extended state and causing friction with the inner wall of the valve body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the valve body structure of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention; Figure 2 This is a schematic diagram of the structure of the valve plate main body and the translation sub-plate of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention after assembly; Figure 3 It is a schematic diagram of the structure of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention after the valve plate main body and the translation sub-plate are separated; Figure 4 It is a schematic diagram of the back structure of the translation sub-plate of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention; Figure 5 It is a schematic diagram of the internal structure of the cylinder body of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention; Figure 6 It is a schematic diagram of the bottom structure of the cylinder body of the ultra-high vacuum isolation transfer valve for semiconductor CVD equipment of the present invention.

[0016] In the figure: 1. valve body; 2. valve port; 3. valve plate assembly; 301. cylinder body; 302. air inlet port; 303. hollow piston rod; 304. electronic valve; 305. valve plate body; 306. air bag; 307. translation sub-plate; 4. exhaust hose; 5. three-way valve; 6. exhaust port; 7. rubber buffer rod. DETAILED DESCRIPTION

[0017] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0018] like Figure 1-Figure 6As shown, the present invention provides a technical solution: an ultra-high vacuum isolation transfer valve for semiconductor CVD equipment, comprising a valve body 1 and a valve plate assembly 3, wherein a valve port 2 is provided on the surface of the valve body 1, and the valve plate assembly 3 is arranged at the bottom of the valve body 1, and the valve plate assembly 3 comprises a cylinder body 301, an air inlet port 302, a hollow piston rod 303, an electronic valve 304, a valve plate body 305, an air bag 306 and a translation sub-plate 307, wherein an air inlet port 302 is provided at the bottom of the cylinder body 301, and a hollow piston rod 303 is penetrated at the top of the cylinder body 301 03, an electronic valve 304 is embedded in the bottom of the hollow piston rod 303, and a valve plate body 305 is fixed on the top of the hollow piston rod 303, an airbag 306 is embedded in the side of the valve plate body 305, and a translation sub-plate 307 is connected to the side of the airbag 306, the translation sub-plate 307 is slidably connected to the valve plate body 305, and a vulcanized seal is provided on the outer side of the translation sub-plate 307, the interior of the valve plate body 305 is a hollow structure, and the airbag 306 is connected to the hollow piston rod 303 through the valve plate body 305; The specific operation is as follows: gas is injected into the cylinder body 301 through the air inlet port 302. At this time, the electronic valve 304 is closed, so that the hollow piston rod 303 carries the valve plate body 305 and the translation sub-plate 307 to move upward to the channel closing position, and then gas is continuously injected into the cylinder body 301. At the same time, the electronic valve 304 is opened, so that excess gas passes through the hollow piston rod 303 and the valve plate body 305 and then enters the airbag 306. The airbag 306 is bulged to push the translation sub-plate 307 to translate to be close to the inner wall of the valve body 1. At this time, the translation sub-plate 307 closes the valve port 2 so that the channel between the chambers can be closed, wherein a pressure sensor is arranged inside the cylinder body 301, and when the electronic valve 304 is opened, the gas injection power is adjusted based on the real-time gas pressure inside the cylinder body 301 to ensure that the valve plate body 305 is always in the closed position, and prevent the valve plate body 305 from decreasing in height due to insufficient gas pressure inside the cylinder body 301 caused by gas flowing into the airbag 306, and the side of the translation sub-plate 307 is equipped with a vulcanized seal to reduce the generation and production of particles; Based on the above description, the present invention integrates the drive for vertical lifting of the valve plate main body 305 and translation of the translation sub-plate 307 into the cylinder system, and the valve plate main body 305 is vertically raised by injecting gas into the cylinder body 301, and then the electronic valve 304 is opened to allow the subsequent excess gas injected to enter the airbag 306 to expand it, thereby pushing the translation sub-plate 307 to close the valve port 2 so that the channel between the chambers can be closed. Compared with the existing method that requires multiple cylinders or complex connecting rods, cams and other mechanisms to achieve L-shaped movement of the valve plate, this method does not require complex transmission components and can effectively save installation space. It is particularly suitable for occasions with compact space. Compared with some existing methods that rely on mechanical transmission, it reduces the influence of factors such as clearance and wear in the mechanical transmission process on the movement accuracy, and the overall structure is relatively simple. Because there is no complex mechanical transmission mechanism, the friction and wear between mechanical components are reduced, and the frequency of replacement due to component damage is reduced.

[0019] like Figure 1-Figure 6 As shown, an exhaust hose 4 is provided at the bottom of the hollow piston rod 303 on one side of the electronic valve 304, and a three-way valve 5 is connected to the end of the exhaust hose 4, the top of the three-way valve 5 is a first port connected to the exhaust hose 4, and the side of the three-way valve 5 is a second port, and the bottom of the three-way valve 5 is a third port, and an exhaust port 6 is provided at the bottom of the cylinder body 301 on one side of the air inlet port 302, and the exhaust port 6 is connected to the third port of the three-way valve 5, and a rubber buffer rod 7 is fixed to the bottom of the inner wall of the cylinder body 301, and the bottom height of the rubber buffer rod 7 is higher than the top height of the three-way valve 5; The specific operation is as follows: when the valve plate body 305 and the translation sub-plate 307 need to be lowered to open the passage between the chambers, the first port and the third port of the three-way valve 5 are opened first, and the second port is temporarily closed, and the electronic valve 304 is closed, so that the gas in the airbag 306 passes through the valve plate body 305, the hollow piston rod 303, the exhaust hose 4, the first port, the third port and then is discharged from the exhaust port 6, and the translation sub-plate 307 is retracted and moved back; Then the second port is opened, so that the inside of the cylinder body 301 passes through the third port and is discharged from the exhaust port 6. Therefore, when the valve plate body 305 and the translation sub-plate 307 need to be lowered, the translation sub-plate 307 is first retracted and then the valve plate body 305 carries it to descend, thereby avoiding the translation sub-plate 307 from remaining in an extended state to descend and causing friction between the translation sub-plate 307 and the inner wall of the valve body 1; When the gas inside the cylinder body 301 is discharged, the hollow piston rod 303 is lowered, and the rubber buffer rod 7 can limit the lowering height of the hollow piston rod 303 to prevent the hollow piston rod 303 from excessively lowering and pressing the three-way valve 5; Based on the above description, when the channel between the chambers needs to be opened, the present invention controls the three-way valve 5 to open its first port and the third port first, so that the gas inside the airbag 306 is discharged first and contracts, thereby driving the translation sub-plate 307 to contract and move back, and then opening the second port to allow the hollow piston rod 303 to carry the valve plate body 305 and the translation sub-plate 307 to descend, thereby avoiding the translation sub-plate 307 from remaining in an extended state to descend and generating friction with the inner wall of the valve body 1.

[0020] In summary, the semiconductor CVD device uses an ultra-high vacuum isolation transfer valve. When in use, first, gas is injected into the cylinder body 301 through the air inlet port 302. At this time, the electronic valve 304 is closed, so that the hollow piston rod 303 carries the valve plate body 305 and the translation sub-plate 307 to move upward to the channel closing position, and then gas is continuously injected into the cylinder body 301. At the same time, the electronic valve 304 is opened, so that the excess gas passes through the hollow piston rod 303 and the valve plate body 305 and then enters the airbag 306. The airbag 306 Therefore, the bulging pushes the translation sub-plate 307 to translate so as to be in close contact with the inner wall of the valve body 1. At this time, the translation sub-plate 307 closes the valve port 2 so that the passage between the chambers is closed. A pressure sensor is arranged inside the cylinder body 301. When the electronic valve 304 is opened, the gas injection power is adjusted based on the real-time gas pressure inside the cylinder body 301 to ensure that the valve plate body 305 is always in the closed position, so as to prevent the valve plate body 305 from falling in height due to insufficient gas pressure inside the cylinder body 301 caused by gas flowing into the airbag 306. When the valve plate body 305 and the translation sub-plate 307 need to be lowered to open the passage between the chambers, the first port and the third port of the three-way valve 5 are opened first, while the second port is temporarily closed, and the electronic valve 304 is closed, so that the gas in the airbag 306 passes through the valve plate body 305, the hollow piston rod 303, the exhaust hose 4, the first port, the third port and then is discharged from the exhaust port 6. At this time, the translation sub-plate 307 is retracted and moved back; Then the second port is opened, so that the inside of the cylinder body 301 passes through the third port and is discharged from the exhaust port 6. Therefore, when the valve plate main body 305 and the translation sub-plate 307 need to descend, the translation sub-plate 307 retracts first and then the valve plate main body 305 carries it down, thereby avoiding the translation sub-plate 307 from remaining in an extended state while descending and generating friction between the translation sub-plate 307 and the inner wall of the valve body 1.

[0021] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An ultra-high vacuum isolation transfer valve for semiconductor CVD equipment, comprising a valve body (1) and a valve plate assembly (3), characterized in that: The valve body (1) has a valve port (2) formed on its surface. The valve plate assembly (3) is arranged at the bottom of the valve body (1). The valve plate assembly (3) comprises a cylinder body (301), an air inlet port (302), a hollow piston rod (303), an electronic valve (304), a valve plate body (305), an air bag (306) and a translation sub-plate (307). The bottom of the cylinder body (301) is provided with an air inlet port (302), and the top of the cylinder body (301) is penetrated by a hollow piston rod (303). The bottom of the hollow piston rod (303) is embedded with an electronic valve (304), and the top of the hollow piston rod (303) is fixed with a valve plate body (305). The side of the valve plate body (305) is embedded with an air bag (306), and the side of the air bag (306) is connected to the translation sub-plate (307).

2. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 1, characterized in that: The translation sub-plate (307) is slidably connected to the valve plate main body (305), and a vulcanized sealing member is provided on the outer side surface of the translation sub-plate (307).

3. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 1, characterized in that: The interior of the valve plate body (305) is a hollow structure, and the airbag (306) is connected to the hollow piston rod (303) through the valve plate body (305).

4. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 1, characterized in that: An exhaust hose (4) is provided at the bottom of the hollow piston rod (303) on one side of the electronic valve (304), and a three-way valve (5) is connected to the end of the exhaust hose (4).

5. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 4, characterized in that: The top of the three-way valve (5) is a first port connected to the exhaust hose (4), the side of the three-way valve (5) is a second port, and the bottom of the three-way valve (5) is a third port.

6. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 5, characterized in that: An exhaust port (6) is provided at the bottom of the cylinder body (301) on one side of the air inlet port (302), and the exhaust port (6) is connected to the third port of the three-way valve (5).

7. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to claim 6, characterized in that: A rubber buffer rod (7) is fixed to the bottom of the inner wall of the cylinder body (301), and the bottom height of the rubber buffer rod (7) is higher than the top height of the three-way valve (5).

8. The ultra-high vacuum isolation transfer valve for semiconductor CVD equipment according to any one of claims 1 to 7, characterized in that: The ultra-high vacuum isolation transfer valve includes the following steps: Step 1: injecting gas into the cylinder body (301) through the air inlet port (302), so that the hollow piston rod (303) carries the valve plate body (305) and the translation sub-plate (307) to move upward to the channel closing position, and then continuously injecting gas into the cylinder body (301), while the electronic valve (304) is opened, so that excess gas passes through the hollow piston rod (303) and the valve plate body (305) and enters the airbag (306), and the airbag (306) swells and pushes the translation sub-plate (307) to translate so as to be in close contact with the inner wall of the valve body (1). At this time, the translation sub-plate (307) closes the valve port (2) so that the channel between the chambers is closed; Step 2: When it is necessary to open the passage between the chambers, the first port and the third port of the three-way valve (5) are opened first, while the second port is temporarily closed, so that the gas in the airbag (306) passes through the valve plate body (305), the hollow piston rod (303), the exhaust hose (4), the first port, the third port, and is discharged outward from the exhaust port (6). At this time, the translation sub-plate (307) shrinks and moves back, and then the second port is opened, so that the inside of the cylinder body (301) passes through the third port and is discharged outward from the exhaust port (6), thereby achieving the translation sub-plate (307) first retracting and then the valve plate body (305) carrying it down.

Citation Information

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