Displacement measuring system

Abstract

The invention discloses a displacement measurement system. The device comprises a laser, an integrated chip and a control module, the integrated chip comprises an optical waveguide structure, a beam splitting module and an optical signal modulation module; the laser is used for emitting a detection beam to the optical waveguide structure; the beam splitting module is arranged in the optical waveguide structure and on a propagation path of the detection light beam; the optical signal modulation module is arranged in the optical waveguide structure and on a propagation path of the reference light beam; the control module is in communication connection with the optical signal modulation module. According to the technical scheme, the optical waveguide structure, the beam splitting module and the optical signal modulation module are arranged in the integrated chip, the detection light beam enters the integrated chip for optical signal processing, then the control module is matched, a low-cost and small-sized displacement measurement system is formed, meanwhile, due to the fact that optical transmission is conducted in the optical waveguide structure, the measurement accuracy is improved, and the measurement precision is improved. And the reliability and the precision of the displacement measurement system are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of interference measurement, and in particular to a displacement measurement system. Background Art

[0002] Current laser interferometer displacement measurement systems are all composed of discrete optical components, including beam splitters, couplers, gratings, balanced detectors and other components. The systems are generally complex in structure, large in size and high in cost, which limits the large-scale promotion of laser interferometers. Summary of the invention

[0003] The invention provides a displacement measurement system to solve the problems of complex structure and large volume of the laser interference displacement measurement system in the prior art.

[0004] According to the technical solution of the present invention, a displacement measurement system is provided, comprising: a laser, an integrated chip and a control module;

[0005] The integrated chip includes an optical waveguide structure, a beam splitting module and an optical signal modulation module;

[0006] The laser is used to emit a detection beam to the optical waveguide structure; the beam splitting module is arranged in the optical waveguide structure and on the propagation path of the detection beam, and is used to split the detection beam into a signal beam and a reference beam, and output the signal beam to the object to be measured, and output the reference beam to the optical signal modulation module;

[0007] The optical signal modulation module is arranged in the optical waveguide structure and on the propagation path of the reference beam, and is used to receive the reference beam and the signal beam reflected by the object to be measured and modulate them into a first modulation signal and a second modulation signal;

[0008] The control module is in communication connection with the optical signal modulation module, and is used for receiving the first modulation signal and the second modulation signal and determining the displacement parameter of the object to be measured.

[0009] Optionally, the displacement measurement system further comprises a circuit board;

[0010] The laser, the integrated chip and the control module are arranged on a circuit board, and the control module is connected with the optical signal modulation module through the circuit board.

[0011] Optionally, the displacement measurement system further includes a heat sink structure;

[0012] The heat sink structure is arranged between the laser and the circuit board, and is used for transferring the heat of the laser to the circuit board.

[0013] Optionally, the integrated chip includes a substrate; and the control module is arranged on the substrate.

[0014] Optionally, the optical signal modulation module includes a demodulator and a balanced detector arranged in the optical waveguide structure;

[0015] The demodulator is used to receive the reference beam and generate a first sub-reference beam, a second sub-reference beam, a third sub-reference beam and a fourth sub-reference beam; wherein the first sub-reference beam, the second sub-reference beam, the third sub-reference beam and the fourth sub-reference beam have different phases and the same power;

[0016] It is also used to receive the signal beam reflected by the object to be measured and generate a first sub-signal beam, a second sub-signal beam, a third sub-signal beam and a fourth sub-signal beam; wherein the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam have the same phase and the same power;

[0017] The balanced detector is used to receive the first sub-reference beam, the second sub-reference beam, the third sub-reference beam, the fourth sub-reference beam, the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam and modulate them into a first modulation signal and a second modulation signal.

[0018] Optionally, the displacement measurement system further includes a lens coupling module;

[0019] The lens coupling module is arranged between the laser and the integrated chip, and includes a collimating lens, an isolator and a focusing lens;

[0020] The collimating lens, the isolator and the focusing lens are arranged in sequence on the propagation path of the detection light.

[0021] Optionally, the displacement measurement system further includes a lens;

[0022] The lens is arranged between the beam splitting module and the object to be measured and on the propagation path of the signal light beam, and is used for receiving the signal light beam and focusing the signal light beam onto the object to be measured.

[0023] Optionally, the control module includes a cross-group amplifier, an analog-to-digital converter, and a control unit;

[0024] The cross-group amplifier is respectively connected to the optical signal modulation module and the analog-to-digital converter for communication, and is used for receiving and amplifying the first modulation signal and the second modulation signal and then outputting them to the analog-to-digital converter;

[0025] The analog-to-digital converter is communicatively connected with the control unit, and is used for receiving the amplified first modulation signal and the second modulation signal and converting them into the first digital signal and the second digital signal and outputting them to the control unit;

[0026] The control unit is used to determine the displacement parameter of the object to be measured according to the first digital signal and the second digital signal.

[0027] Optionally, the displacement measurement system further includes a data transmission module;

[0028] The data transmission module is in communication connection with the control module, and is used for receiving the displacement parameters of the object to be measured and outputting them to the terminal.

[0029] Optionally, the integrated chip is a silicon photonic chip.

[0030] The technical solution of the present invention, by arranging an optical waveguide structure, a beam splitting module and an optical signal modulation module in an integrated chip, allows the detection light beam to be incident on the integrated chip for optical signal processing, and then cooperates with the control module to form a low-cost and miniaturized displacement measurement system. At the same time, since the light transmission is all in the optical waveguide structure, the reliability and accuracy of the displacement measurement system are improved.

[0031] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 is a schematic diagram of detecting a first angle of a first displacement measurement system provided according to an embodiment of the present invention;

[0034] Figure 2 is a schematic diagram of a first angle detection of a second displacement measurement system provided according to an embodiment of the present invention;

[0035] Figure 3 is a schematic diagram of second angle detection of the first displacement measurement system provided by an embodiment of the present invention;

[0036] Figure 4 is a schematic diagram of a working process of a control unit provided according to an embodiment of the present invention;

[0037] Figure 5 is a schematic diagram of a third angle detection of the first displacement measurement system provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0040] Figure 1 is a schematic diagram of detecting a first angle of a first displacement measurement system provided according to an embodiment of the present invention, Figure 2 2 is a schematic diagram of a first angle detection of a second displacement measurement system provided according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the displacement measurement system includes: a laser 1, an integrated chip 2 and a control module 3;

[0041] The integrated chip 2 includes an optical waveguide structure, a beam splitting module 22 and an optical signal modulation module 23;

[0042] The laser 1 is used to emit a detection beam a to the optical waveguide structure; the beam splitting module 22 is arranged in the optical waveguide structure and on the propagation path of the detection beam a, and is used to split the detection beam a into a signal beam c and a reference beam b, and output the signal beam c to the object to be measured 4, and output the reference beam b to the optical signal modulation module 23;

[0043] The optical signal modulation module 23 is arranged in the optical waveguide structure and on the propagation path of the reference beam b, and is used to receive the reference beam b and the signal beam c reflected by the object to be measured 4 and modulate them into a first modulation signal and a second modulation signal;

[0044] The control module 3 is in communication with the optical signal modulation module 23, and is used to receive the first modulation signal and the second modulation signal and determine the displacement parameter of the object to be measured 4. Figure 1 and Figure 2 The optical waveguide structure is not shown.)

[0045] Among them, the laser 1 can be used to emit a detection light beam a to the object to be measured 4. The type of laser 1 can be a narrow linewidth laser. The light beam emitted by the narrow linewidth laser has the advantages of small optical linewidth and low intensity noise. Since the wavelength is used as a reference measurement in the laser interferometer measurement process, the line width of the detection light beam a affects the accuracy of the laser. By using a narrow linewidth laser, the measurement accuracy of the displacement measurement system can be improved.

[0046] Among them, the integrated chip 2 can be an integrated circuit chip, which can combine electronic devices and optical devices and use photonic technology to realize data transmission and processing. In some embodiments, the integrated chip 2 is a silicon photonic chip. The silicon photonic chip has low-cost, high-speed optical communication technology. By etching an optical waveguide structure in the silicon photonic chip, the detection beam a is constrained in the micron-scale optical waveguide structure and the detection beam a is propagated along the path of the optical waveguide structure. This transmission method has extremely low transmission loss and improves the reliability of the detection beam a.

[0047] The integrated chip 2 further includes a beam splitting module 22 and an optical signal modulation module 23. The beam splitting module 22 can be used to split the detection beam a into a signal beam c and a reference beam b. The signal beam c is incident on the object to be measured 4. The optical signal modulation module 23 is used to mix the reference beam b and the signal beam c reflected by the object to be measured 4 and convert them into a first modulation signal and a second modulation signal after interference and output. The control module 3 receives the first modulation signal and the second modulation signal output by the optical signal modulation module 23 and calculates the displacement parameter of the object to be measured 4. The displacement measurement system in the embodiment of the present invention uses the principle of laser homodyne interferometry to split the laser beam and then make the signal beam c incident on the object to be measured 4 and then enter the optical processing system after being reflected by the object to be measured 4. The reference beam b after the beam splitting remains in the optical processing system and is sent to the mixer with the reflected signal beam c for mixing and interference before output. The power of the output optical signal is detected and the phase difference is determined according to the power of the optical signal, so that the displacement parameter of the object to be measured 4 proportional to the phase difference can be obtained.

[0048] It can be understood that the laser interferometer in the prior art is composed of discrete optical elements, and is provided with discrete beam splitters, couplers, gratings, balanced detectors and other components, which makes the laser interferometer large in size, high in cost and complex in structure. The displacement measurement system in the embodiment of the present invention is provided with an optical waveguide structure in the integrated chip 2, and integrates a beam splitting module 22 and an optical signal modulation module 23 at the same time. The beam splitting module 22 and the optical signal modulation module 23 are arranged in the optical waveguide structure. The beam splitting module 22 and the optical signal modulation module 23 can also be formed according to the waveguide process. By making the detection light beam a incident on the optical waveguide structure, the optical processing system is integrated in the integrated chip 2, and then cooperates with the control module 3 to form a low-cost and miniaturized displacement measurement system. At the same time, since the light transmission is all in the optical waveguide structure, the reliability and accuracy of the displacement measurement system are improved.

[0049] Specifically, a laser 1, an integrated chip 2 and a control module 3 are arranged in the displacement measurement system; the integrated chip 2 includes an optical waveguide structure, a beam splitting module 22 and an optical signal modulation module 23; the laser 1 emits a detection beam a to the optical waveguide structure of the integrated chip 2 and transmits it along the optical waveguide structure to the beam splitting module 22, the beam splitting module 22 splits the detection beam a into a signal beam c and a reference beam b, the signal beam c is emitted along the optical waveguide structure and incident on an object to be measured 4 outside the integrated chip 2, the object to be measured 4 reflects the signal beam c, the reflected signal beam c returns to the optical waveguide structure through the original path, and is incident on the optical signal modulation module 23 together with the reference beam b, the optical signal modulation module 23 performs frequency mixing interference and outputs a first modulation signal and a second modulation signal, the control module 3 receives the first modulation signal and the second modulation signal and calculates the displacement parameter.

[0050] The technical solution of the embodiment of the present invention is to set an optical waveguide structure, a beam splitting module and an optical signal modulation module in the integrated chip, so that the detection light beam is incident on the integrated chip to process the optical signal, and then cooperate with the control module to form a low-cost and miniaturized displacement measurement system. At the same time, since the light transmission is all in the optical waveguide structure, the reliability and accuracy of the displacement measurement system are improved.

[0051] Optional, Figure 3 is a schematic diagram of a second angle detection of a first displacement measurement system provided according to an embodiment of the present invention, combined with Figure 1 and Figure 3 As shown, the displacement measurement system further includes a circuit board 5;

[0052] The laser 1 , the integrated chip 2 and the control module 3 are arranged on a circuit board 5 , and the control module 3 is connected to the optical signal modulation module 23 through the circuit board 5 .

[0053] Among them, the laser 1, the integrated chip 2 and the control module 3 are arranged on the circuit board 5. The circuit board 5 can provide power for the laser 1 and control the working state of the laser 1. The control module 3 can be connected to the optical signal modulation module 23 through the signal routing on the circuit board 5. The laser 1, the integrated chip 2 and the control module 3 can be arranged on the circuit board 5 to ensure the normal operation of the displacement measurement system. The space occupied by the laser 1, the integrated chip 2 and the control module 3 on the circuit board 5 can also be reduced through the arrangement method to improve the integration of the displacement measurement system.

[0054] It can be understood that the laser 1, the integrated chip 2 and the control module 3 are integrated on the circuit board 5, and the laser 1 and the integrated chip 2 are packaged in the form of chip on board (COB), so as to ensure the normal operation of the displacement measurement system while further improving the integration of the laser 1, the integrated chip 2 and the control module 3.

[0055] Optional, continue to refer to Figure 1 and Figure 3 As shown, the displacement measurement system further includes a heat sink structure 10;

[0056] The heat sink structure 10 is disposed between the laser 1 and the circuit board 5 , and is used to transfer the heat of the laser 1 to the circuit board 5 .

[0057] The heat sink structure 10 may be a heat transfer structure mounted on the laser 1, the temperature of which does not change with the change of the heat energy transferred to it, and the heat generated by the laser 1 during operation may be transferred to the circuit board 5 for heat dissipation. In some embodiments, the circuit board 5 also includes a heat dissipation structure to conduct the heat of the heat sink to prevent the heat from accumulating on the circuit board 5 and affecting the normal operation of the circuit board 5.

[0058] In some embodiments, a heat sink structure 10 may be provided between the silicon photonic chip and the circuit board 5 and between the control module 3 and the circuit board 5 to improve the heat dissipation efficiency of the displacement measurement system.

[0059] The technical solution of the embodiment of the present invention is to set a heat sink structure between the laser and the circuit board so that the heat generated during the operation of the laser is transferred to the circuit board for heat dissipation, thereby ensuring the normal operation of the displacement measurement system and improving the reliability of the displacement measurement system.

[0060] Optional, continue to refer to Figure 2 As shown, the integrated chip 2 includes a substrate 20 ; the control module 3 is arranged on the substrate 20 .

[0061] The dust collecting chip includes a substrate 20, which may be a silicon substrate 20, and an optical waveguide structure is formed by etching in the silicon substrate 20. The control module 3 is arranged on the substrate 20, and the control module 3 is connected to the optical signal modulation module 23 through the wiring on the substrate 20. In this way, the control module 3 is chip-level packaged on the substrate 20, so that the integrated chip 2 and the control module 3 are an integrated structure, which further improves the integration of the displacement measurement system.

[0062] The technical solution of the embodiment of the present invention is to package the control module on the substrate of the integrated chip so that the control module and the integrated chip are integrated, thereby further improving the integration of the displacement measurement system.

[0063] Optional, continue to refer to Figure 1 As shown, the optical signal modulation module 23 includes a demodulator 231 and a balanced detector 232 arranged in an optical waveguide structure;

[0064] The demodulator 231 is used to receive the reference beam b and generate a first sub-reference beam, a second sub-reference beam, a third sub-reference beam and a fourth sub-reference beam; wherein the first sub-reference beam, the second sub-reference beam, the third sub-reference beam and the fourth sub-reference beam have different phases and the same power;

[0065] It is also used to receive the signal beam c reflected by the object to be measured 4 and generate a first sub-signal beam, a second sub-signal beam, a third sub-signal beam and a fourth sub-signal beam; wherein the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam have the same phase and the same power;

[0066] The balanced detector 232 is used to receive the first sub-reference beam, the second sub-reference beam, the third sub-reference beam, the fourth sub-reference beam, the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam and modulate them into a first modulation signal and a second modulation signal.

[0067] The demodulator 231 can be used as a device for phase shifting the reflected signal beam c and the reference beam b. Specifically, the reflected reference beam b is received, and the reference beam b is phase shifted by 90°, 180° and 270° to form four beams with the same power together with the original reference beam b, which are: the first sub-reference beam The second reference beam The third sub-reference beam and the fourth reference beam Split the signal beam c into four beams with the same phase and power

[0068] The first signal beam The second signal beam The third signal beam and the fourth signal beam The first sub-reference beam and the first sub-signal beam, the second sub-reference beam and the second sub-signal beam, the third sub-reference beam and the third sub-signal beam, and the fourth sub-reference beam and the fourth sub-signal beam are interfered with each other respectively. l is the reference beam b, E s is the signal beam c, A is the amplitude of the reference beam b, B is the amplitude of the signal beam c, ω is the angular frequency of the detection beam a, and t is the time.

[0069] The balanced detector 232 can be used to convert the interfered optical signal into an electrical signal to obtain a first photocurrent signal

[0070]

[0071] The second photocurrent signal

[0072]

[0073] The third photocurrent signal

[0074]

[0075] and the fourth photocurrent signal

[0076]

[0077] And output the difference between the first photocurrent signal and the second photocurrent signal, that is, the first modulation signal Output the difference between the third photocurrent signal and the fourth photocurrent signal, that is, the second modulation signal It can be understood that the first modulation signal is an I signal, which has eliminated the DC component by difference and left the AC component, and the second modulation signal is a Q signal, which has eliminated the DC component by difference and left the AC component. is the phase difference of the signal light relative to the reference light, |(E s +E l )| 2 is the corresponding optical power.

[0078] The technical solution of the embodiment of the present invention, by setting a demodulator and a balanced detector in the optical signal modulation module, allows the signal light beam and the reference light beam to be mixed and interfered by the demodulator and the balanced detector and output in the form of optical power, thereby detecting the phase difference in the optical power and obtaining the displacement parameter, thereby ensuring the normal operation of the displacement measurement system.

[0079] Optional, continue to refer to Figure 3 As shown, the displacement measurement system further includes a lens coupling module 6;

[0080] The lens coupling module 6 is arranged between the laser 1 and the integrated chip 2, and includes a collimating lens 61, an isolator 62 and a focusing lens 63;

[0081] The collimating lens 61, the isolator 62 and the focusing lens 63 are sequentially arranged on the propagation path of the detection light.

[0082] Among them, a collimating lens 61, an isolator 62 and a focusing lens 63 are sequentially arranged on the optical path of the detection beam a between the laser 1 and the integrated chip 2. The collimating lens 61 can be used to adjust the detection beam a to be collimated and incident on the isolator 62; the isolator 62 can prevent the detection beam a incident on the focusing lens 63 from being reflected back into the collimating lens 61, thereby ensuring the transmission quality of the detection beam a and improving the accuracy of the displacement measurement system; the focusing lens 63 can focus the detection beam a into the integrated chip 2. The end face of the integrated chip 2 can be arranged at the focus of the focusing lens 63 to ensure the transmission effect of the light.

[0083] In some embodiments, the end surface of the integrated chip 2 also includes a coupler (not shown in the figure), which receives the detection beam a and couples it into the integrated chip 2, and converts it into the optical waveguide structure through the spot converter. In some embodiments, the beam splitting module 22 includes a modulator and a beam splitting unit, and the modulator adjusts the splitting ratio of the beam splitting unit, sends one reference beam b into the reference optical waveguide structure, and sends another signal beam c into the signal optical waveguide. The signal beam c is then output from the integrated chip 2 through another spot converter, and is collimated by the collimating lens 61 and then emitted to the object to be measured 4. The object to be measured 4 reflects the signal beam c, and part of the reflected signal beam c is focused from the original output collimating lens 61 and then coupled back to the integrated chip 2.

[0084] The technical solution of the embodiment of the present invention ensures the quality of the detection light beam incident on the integrated chip by setting a lens coupling module in the displacement measurement system, and improves the accuracy of the displacement measurement system.

[0085] Optional, continue to refer to Figure 1 As shown, the displacement measurement system further includes a lens 7;

[0086] The lens 7 is disposed between the beam splitting module 22 and the object to be measured 4 and on the propagation path of the signal light beam c, and is used for receiving the signal light beam c and focusing the signal light beam c onto the object to be measured 4 .

[0087] The lens 7 may include a focusing lens to focus the signal light beam c. The object to be measured 4 may be placed at the focus of the lens 7, so that the signal light beam c is incident from the lens 7 to the object to be measured 4, thereby ensuring the quality of light beam propagation. At the same time, the signal light beam c reflected by the object to be measured 4 is transmitted to the integrated chip 2 through the lens 7, thereby playing the role of integrating the light beam.

[0088] It can be understood that the lens 7 is arranged outside the integrated chip 2 to adapt to the position of the object 4 to be measured.

[0089] The technical solution of the embodiment of the present invention is to set a lens in the displacement measurement system, set the lens on the propagation path of the signal light beam, integrate the signal light beam into the object to be measured and integrate the reflected signal light beam into the integrated chip, thereby ensuring the quality of signal light beam transmission and improving the accuracy of the displacement measurement system.

[0090] Optional, continue to refer to Figure 1 As shown, the control module 3 includes a cross-group amplifier 31, an analog-to-digital converter 32 and a control unit 33;

[0091] The cross-group amplifier 31 is respectively connected to the optical signal modulation module 23 and the analog-to-digital converter 32 for communication, and is used for receiving and amplifying the first modulation signal and the second modulation signal and then outputting them to the analog-to-digital converter 32;

[0092] The analog-to-digital converter 32 is connected to the control unit 33 for receiving the amplified first modulation signal and the second modulation signal and converting them into the first digital signal and the second digital signal and outputting them to the control unit 33;

[0093] The control unit 33 is used to determine the displacement parameter of the object to be measured 4 according to the first digital signal and the second digital signal.

[0094] Among them, the cross-group amplifier 31 can be used to receive the first modulated signal and the second modulated signal and proportionally amplify them into the first voltage signal and the second voltage signal and input them into the analog-to-digital converter 32. The analog-to-digital converter 32 can convert the first voltage signal and the second voltage signal into the first digital signal and the second digital signal and output them to the control unit 33 so that the control unit 33 can calculate and process them.

[0095] Figure 4 is a schematic diagram of a work flow of a control unit provided according to an embodiment of the present invention, such as Figure 4 As shown, the control unit 33 first removes the DC component of the first digital signal and the second digital signal, leaving only the AC component, and then performs digital filtering and calculates the value of arctan2(Q / I). Since the result range of arctan2 is -π~π, in order to obtain continuous displacement data, the calculation result needs to be periodically extended. The calculation method is that when the difference between the current value and the calculation result of the previous sampling data is greater than π, the current value is reduced by 2π; when the difference between the current value and the calculation result of the previous sampling data is less than -π, the current value is increased by 2π; finally, the obtained phase value is output as the result, and the displacement parameter is determined by the corresponding relationship between the phase value and the displacement.

[0096] The technical solution of the embodiment of the present invention ensures the normal operation of the displacement measurement system by setting a cross-group amplifier, an analog-to-digital converter and a control unit in the control module, using the cross-group amplifier and the analog-to-digital converter to process the first modulation signal and the second modulation signal, and using the control unit to calculate the displacement parameters of the object to be measured.

[0097] Optional, Figure 5 is a schematic diagram of a third angle detection of the first displacement measurement system provided according to an embodiment of the present invention, and further reference is made to Figure 1 and Figure 5 As shown, the displacement measurement system further includes a data transmission module 8;

[0098] The data transmission module 8 is in communication connection with the control module 3 , and is used for receiving the displacement parameters of the object to be measured 4 and outputting them to the terminal.

[0099] Among them, the data transmission module 8 can also be set on the circuit board 5, and the circuit board 5 is connected to the control module 3 through communication, so that the displacement parameters calculated by the control module 3 can be transmitted to the terminal device, which can be a mobile phone, computer or other host computer, so that the user can obtain the displacement parameters and ensure the normal operation of the displacement measurement system.

[0100] In some embodiments, the displacement measurement system further includes a power supply module 9, which can be electrically connected to the laser 1 and the integrated chip 2 via the circuit board 5 for power supply.

[0101] The technical solution of the embodiment of the present invention is to set an optical waveguide structure, a beam splitting module and an optical signal modulation module in the integrated chip, so that the detection light beam is incident on the integrated chip to process the optical signal, and then cooperate with the control module to form a low-cost and miniaturized displacement measurement system. At the same time, since the light transmission is all in the optical waveguide structure, the reliability and accuracy of the displacement measurement system are improved.

[0102] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A displacement measurement system, characterized in that: include: Lasers, integrated chips and control modules; The integrated chip includes an optical waveguide structure, a beam splitting module and an optical signal modulation module; The laser is used to emit a detection beam to the optical waveguide structure; the beam splitting module is arranged in the optical waveguide structure and on the propagation path of the detection beam, and is used to split the detection beam into a signal beam and a reference beam, and output the signal beam to the object to be measured, and output the reference beam to the optical signal modulation module; The optical signal modulation module is arranged in the optical waveguide structure and on the propagation path of the reference light beam, and is used to receive the reference light beam and the signal light beam reflected by the object to be measured and modulate them into a first modulation signal and a second modulation signal; The control module is in communication with the optical signal modulation module, and is configured to receive the first modulation signal and the second modulation signal and determine a displacement parameter of the object to be measured.

2. The displacement measurement system according to claim 1, characterized in that: The displacement measurement system also includes a circuit board; The laser, the integrated chip and the control module are arranged on the circuit board, and the control module is connected with the optical signal modulation module through the circuit board.

3. The displacement measurement system according to claim 2, characterized in that: The displacement measurement system also includes a heat sink structure; The heat sink structure is arranged between the laser and the circuit board, and is used for transferring the heat of the laser to the circuit board.

4. The displacement measurement system according to claim 1, characterized in that: The integrated chip includes a substrate; the control module is arranged on the substrate.

5. The displacement measurement system according to claim 1, characterized in that: The optical signal modulation module includes a demodulator and a balanced detector arranged in the optical waveguide structure; The demodulator is used to receive the reference beam and generate a first sub-reference beam, a second sub-reference beam, a third sub-reference beam and a fourth sub-reference beam; wherein the first sub-reference beam, the second sub-reference beam, the third sub-reference beam and the fourth sub-reference beam have different phases and the same power; It is also used to receive the signal beam reflected by the object to be measured and generate a first sub-signal beam, a second sub-signal beam, a third sub-signal beam and a fourth sub-signal beam; wherein the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam have the same phase and the same power; The balanced detector is used to receive the first sub-reference beam, the second sub-reference beam, the third sub-reference beam, the fourth sub-reference beam, the first sub-signal beam, the second sub-signal beam, the third sub-signal beam and the fourth sub-signal beam and modulate them into the first modulation signal and the second modulation signal.

6. The displacement measurement system according to claim 5, characterized in that: The displacement measurement system also includes a lens coupling module; The lens coupling module is arranged between the laser and the integrated chip, and includes a collimating lens, an isolator and a focusing lens; The collimating lens, the isolator and the focusing lens are sequentially arranged on a propagation path of the detection light.

7. The displacement measurement system according to claim 1, characterized in that: The displacement measurement system also includes a lens; The lens is disposed between the beam splitting module and the object to be measured and on the propagation path of the signal light beam, and is used for receiving the signal light beam and focusing the signal light beam onto the object to be measured.

8. The displacement measurement system according to claim 1, characterized in that: The control module includes a cross-group amplifier, an analog-to-digital converter, and a control unit; The cross-group amplifier is respectively connected to the optical signal modulation module and the analog-to-digital converter for communication, and is used for receiving and amplifying the first modulation signal and the second modulation signal and then outputting them to the analog-to-digital converter; The analog-to-digital converter is communicatively connected with the control unit, and is used for receiving the amplified first modulation signal and the second modulation signal and converting them into a first digital signal and a second digital signal and outputting them to the control unit; The control unit is used to determine the displacement parameter of the object to be measured according to the first digital signal and the second digital signal.

9. The displacement measurement system according to claim 1, characterized in that: The displacement measurement system also includes a data transmission module; The data transmission module is in communication with the control module and is used to receive the displacement parameters of the object to be measured and output them to the terminal.

10. The displacement measurement system according to claim 1, characterized in that: The integrated chip is a silicon photonic chip.

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