On-chip integrated device test structure, test system and test method

Abstract

The invention relates to an on-chip integrated device test structure, test system and test method, the on-chip integrated device test structure comprises an optical coupling incidence first port and an optical coupling incidence second port, and the optical coupling incidence first port and the optical coupling incidence second port have different working wavelength ranges; the beam combiner is connected to the optical coupling incidence first port and the optical coupling incidence second port, and the beam combiner is connected with a device to be tested; the beam splitter is connected with the device to be tested; the first optical coupling emergent port and the second optical coupling emergent port are connected to the beam splitter. The first optical coupling emergent port and the second optical coupling emergent port are connected to the beam splitter. The performance of the to-be-tested device in different working wavelength ranges can be tested, the test efficiency is improved, the test time is saved, meanwhile, the problem that the same to-be-tested device needs repeated layout for different wavelength ranges can be effectively avoided, the chip tape-out layout area is greatly saved, and the chip tape-out cost is saved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to an on-chip integrated device test structure, a test system and a test method. Background Art

[0002] Silicon-based optoelectronic integrated chips integrate various functional devices such as light sources, modulators, waveguides, couplers, detectors, filters, and CMOS (Complementary Metal-Oxide-Semiconductor) circuits, and are the result of the joint efforts of optoelectronics and microelectronics. With the development of many emerging industries such as network communications, artificial intelligence, quantum information, national defense and military industry, aerospace, biomedicine, and intelligent sensing, the diversity and performance indicators of on-chip integrated devices in silicon-based optoelectronic integrated chips have been put forward more diversified and higher requirements.

[0003] The testing of on-chip integrated devices plays an important role in the research and development, selection and mass production of devices for multiple application scenarios. Compared with traditional chip testing, wafer testing can greatly shorten the test cycle and improve test efficiency, and plays a key role in chip research and development and mass production. At present, there are two main coupling devices for silicon photonic chips, end couplers and grating couplers. Grating couplers have become the first choice for wafer-level testing due to their flexible placement and large alignment tolerance. In related technologies, when performing grating coupling tests, due to the bandwidth limitations of grating couplers, it is usually only possible to test the performance of a certain device in a smaller operating wavelength range. If the performance of devices in other operating wavelength ranges needs to be tested, the test structure needs to be replicated and replaced with a grating coupler of the corresponding operating wavelength to match it. However, this method will greatly waste chip area and increase research and development costs. At the same time, it will also lead to low test efficiency and increase test costs.

[0004] Therefore, it is necessary to design a new on-chip integrated device test structure to overcome the above problems. Summary of the invention

[0005] The present application provides an on-chip integrated device test structure, a test system and a test method, which can solve the technical problems of increased R&D costs and low test efficiency in related technologies.

[0006] In a first aspect, an embodiment of the present application provides an on-chip integrated device test structure, which includes:

[0007] A light coupling incident first port and a light coupling incident second port, wherein the light coupling incident first port and the light coupling incident second port have different operating wavelength ranges;

[0008] A beam combiner, the beam combiner is connected to the first light coupling incident port and the second light coupling incident port, and the beam combiner is connected to a device under test;

[0009] A beam splitter, the beam splitter is connected to the device under test;

[0010] A first light coupling output port and a second light coupling output port are provided, and both the first light coupling output port and the second light coupling output port are connected to the beam splitter.

[0011] In combination with the first aspect, in one embodiment, the operating wavelength range of the first optical coupling incident port and the second optical coupling incident port is C, L, S, O or E band; the operating wavelength range of the first optical coupling output port and the second optical coupling output port is C, L, S, O or E band.

[0012] In combination with the first aspect, in one implementation, the operating wavelength range of the light coupling incident first port is the same as the operating wavelength range of the light coupling output first port; the operating wavelength range of the light coupling incident second port is the same as the operating wavelength range of the light coupling output second port.

[0013] In combination with the first aspect, in one implementation, the light coupling incident first port and the light coupling output first port both include one or more grating couplers.

[0014] In combination with the first aspect, in one implementation, the grating coupler is of a converging type, a straight waveguide type, a metasurface type or a photonic crystal type.

[0015] In combination with the first aspect, in one implementation, the device under test is an active device or a passive device.

[0016] In a second aspect, an embodiment of the present application provides an on-chip integrated device testing system, which includes: the above-mentioned on-chip integrated device testing structure, wherein one side of the on-chip integrated device testing structure is connected to a light source, and the other side is connected to an optical power meter.

[0017] In combination with the second aspect, in one embodiment, the on-chip integrated device test system also includes a first switching optical switch and a second switching optical switch; the light source includes a first port light source and a second port light source, and the first port light source and the second port light source are connected to one side of the on-chip integrated device test structure through the first switching optical switch; the optical power meter includes a first port optical power meter and a second port optical power meter, and the first port optical power meter and the second port optical power meter are connected to the other side of the on-chip integrated device test structure through the second switching optical switch.

[0018] In a third aspect, an embodiment of the present application provides a method for testing the above-mentioned on-chip integrated device test structure, which comprises the following steps:

[0019] Passing light to the first optical coupling incident port;

[0020] Move the input coupling optical fiber to above the first optical coupling input port, move the output coupling optical fiber to above the first optical coupling output port, and test the performance of the device under test;

[0021] Passing light to the second optical coupling incident port;

[0022] The incident coupling optical fiber is moved to above the second optical coupling incident port, the output coupling optical fiber is moved to above the second optical coupling output port, and the performance of the device under test is tested.

[0023] In combination with the third aspect, in one implementation, the step of passing light to the light coupling incident first port includes:

[0024] The first switching optical switch located on one side of the on-chip integrated device test structure is adjusted to connect the first port light source with the light coupling incident first port; and the second switching optical switch located on the other side of the on-chip integrated device test structure is adjusted to connect the first port optical power meter with the light coupling output first port.

[0025] The beneficial effects brought by the technical solution provided in the embodiments of the present application include:

[0026] By setting the first optical coupling incident port and the second optical coupling incident port with different working wavelength ranges, the performance of the device under test in different working wavelength ranges can be tested, the test efficiency is improved, and the test time is saved. At the same time, it can effectively avoid the problem of repeated layout of the same device under test for different wavelength ranges, greatly saving the chip flow layout area, saving the chip flow cost, and solving the technical problems of increasing R&D costs and low test efficiency in related technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 A schematic diagram of an on-chip integrated device test structure provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of an on-chip integrated device testing system provided in an embodiment of the present application;

[0030] Figure 3 A flow chart of a testing method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The embodiments of the present application provide an on-chip integrated device test structure, a test system and a test method, which can solve the technical problems of increased R&D costs and low test efficiency in related technologies.

[0033] See also Figure 1 As shown, an on-chip integrated device test structure provided by an embodiment of the present application may include: a first optical coupling incident port and a second optical coupling incident port, the operating wavelength range of the first optical coupling incident port and the second optical coupling incident port are different; a beam combiner, the beam combiner is connected to the first optical coupling incident port and the second optical coupling incident port, and the beam combiner is connected to a device under test; a beam splitter, the beam splitter is connected to the device under test; a first optical coupling output port and a second optical coupling output port, the first optical coupling output port and the second optical coupling output port are both connected to the beam splitter.

[0034] In this embodiment, the beam combiner is preferably a wide-spectrum structure, which can simultaneously support the operating wavelength ranges of the optically coupled incident first port and the optically coupled incident second port; the beam splitter is also a wide-spectrum structure, which simultaneously supports the operating wavelength ranges of the optically coupled incident first port and the optically coupled incident second port. The operating wavelength range of the optically coupled output first port is preferably the same as the operating wavelength range of the optically coupled incident first port, and the operating wavelength range of the optically coupled output second port is preferably the same as the operating wavelength range of the optically coupled incident second port, and the operating wavelength ranges of the optically coupled output first port and the optically coupled output second port are different. In this embodiment, the optically coupled incident first port, the optically coupled incident second port, the beam combiner, the device to be tested, the beam splitter, and the optically coupled output first port and the optically coupled output second port are all connected by optical waveguides. And the number of optically coupled incident ports and optically coupled output ports can be accumulated according to the wavelength range required for the test, so as to realize the testing of more working wavelengths on an on-chip integrated device. For example, the present embodiment lists a first optical coupling incident port and a second optical coupling incident port, and a third optical coupling incident port and a fourth optical coupling incident port, etc. may also be added; and the present embodiment lists a first optical coupling output port and a second optical coupling output port, and a third optical coupling output port and a fourth optical coupling output port, etc. may also be added.

[0035] In this embodiment, the light coupling incident first port and the light coupling incident second port are connected by a beam combiner, so that the light from the light coupling incident first port and the light coupling incident second port can be emitted to the device under test through the beam combiner, and the light coupling output first port and the light coupling output second port are connected by a beam splitter, so that the light from the device under test can reach the light coupling output first port and the light coupling output second port; by setting the light coupling incident first port and the light coupling incident second port with different working wavelength ranges, when the wavelength range of the device under test to be tested is within the working wavelength range of the light coupling incident first port, the light can be transmitted to the device under test through the light coupling incident first port. light; when the wavelength range of the device under test that needs to be tested is within the working wavelength range of the second optical coupling incident port, light can be passed to the device under test through the second optical coupling incident port. Therefore, one test structure can be used to test the performance of the device under test in different working wavelength ranges. When testing the performance in different working wavelength ranges, there is no need to re-duplicate the test structure, which can improve the test efficiency and save test time. At the same time, it can effectively avoid the problem of repeated layout of the same device under test for different wavelength ranges, greatly saving the chip flow layout area, saving more than 2 times the cost of chip flow, and solving the technical problems of increasing R&D costs and low test efficiency in related technologies.

[0036] Furthermore, in one embodiment, the operating wavelength range of the optical coupling incident first port and the optical coupling incident second port may be C, L, S, O or E band; the operating wavelength range of the optical coupling output first port and the optical coupling output second port may be C, L, S, O or E band. That is, in this embodiment, for the optical coupling incident first port, its operating wavelength may be set to C band, L band, S band, O band or E band, or other bands; the same is true for the optical coupling incident second port, its operating wavelength may also be set to C band, L band, S band, O band or E band, or other bands, as long as the operating wavelength ranges of the optical coupling incident first port and the optical coupling incident second port are different, so that the optical coupling incident first port may be used to test the operating wavelength of one range, and the optical coupling incident second port may be used to test the operating wavelength of another range. The same is true for the optically coupled first output port and the optically coupled second output port, and various wavelengths can be selected. The operating wavelength ranges of the optically coupled first output port and the optically coupled first input port can be completely the same, or can be different, as long as the optically coupled first output port and the optically coupled first input port have the same operating wavelength. In this embodiment, the operating wavelength ranges of the optically coupled first output port and the optically coupled first input port are preferably set to be the same; and the operating wavelength ranges of the optically coupled second output port and the optically coupled second input port are also set to be the same.

[0037] Further, preferably, in this embodiment, the operating wavelength range of the optical coupling incident first port is the same as that of the optical coupling output first port; the operating wavelength range of the optical coupling incident second port is the same as that of the optical coupling output second port. The operating wavelength ranges of the optical coupling incident first port and the optical coupling output first port are set to be the same, so that any light within the operating wavelength range of the optical coupling incident first port can be emitted through the optical coupling output first port, and any light within the operating wavelength range of the optical coupling incident second port can be emitted through the optical coupling output second port, and there will be no situation where light within the operating wavelength range of the optical coupling incident first port cannot be emitted through the optical coupling output first port.

[0038] Furthermore, in some embodiments, the optical coupling incident first port and the optical coupling output first port both include one or more grating couplers. In this embodiment, the optical coupling incident first port can be a grating coupler with an operating wavelength range of C, L, S, O or E band, or it can be 2 or n grating couplers; the optical coupling output first port can be a grating coupler with an operating wavelength range of C, L, S, O or E band, or it can be 2 or n grating couplers. The number of grating couplers in the optical coupling incident first port and the optical coupling output first port can be equal or unequal. At the same time, in this embodiment, the optical coupling incident first port is preferably set to a grating coupler; the number of grating couplers in the optical coupling output first port is determined according to the number of optical output ports of the device to be tested.

[0039] Similarly, the light coupling incident second port and the light coupling output second port may also include one or more grating couplers. It is also preferred that the light coupling incident second port is set as a grating coupler, and the number of grating couplers in the light coupling output second port is determined according to the number of light output ports of the device under test.

[0040] Furthermore, in one embodiment, the grating coupler is of a converging type, a straight waveguide type, a metasurface type, or a photonic crystal type. In this embodiment, the grating coupler in the first port where light is coupled to be incident can be of a converging type, a straight waveguide type, a metasurface type, or a photonic crystal type, etc.; the grating coupler in the first port where light is coupled to be emitted can also be of a converging type, a straight waveguide type, a metasurface type, or a photonic crystal type, etc.; the grating coupler in the second port where light is coupled to be incident can be of a converging type, a straight waveguide type, a metasurface type, or a photonic crystal type, etc.; the grating coupler in the second port where light is coupled to be emitted can also be of a converging type, a straight waveguide type, a metasurface type, or a photonic crystal type, etc.

[0041] Of course, in other embodiments, other types of grating couplers may also be selected, which is not limited here.

[0042] Furthermore, in one embodiment, the device under test may be an active device or a passive device. The passive devices mainly include: optical waveguides, optical couplers, optical combiners, optical beam splitters, polarization beam splitters, polarization rotators, mixers, thermal phase shifters, filters, etc.; the active devices mainly include: electro-optic modulators, photodetectors, optical attenuators, lasers, etc.

[0043] An embodiment of the present application further provides an on-chip integrated device testing system, which may include: the above-mentioned on-chip integrated device testing structure, wherein one side of the on-chip integrated device testing structure is connected to a light source, and the other side is connected to an optical power meter.

[0044] The on-chip integrated device test structure in this embodiment can adopt the on-chip integrated device test structure provided in any of the above embodiments and realize the corresponding functions, which will not be described in detail here. The light emitted by the light source can be irradiated to the first optical coupling incident port in the on-chip integrated device test structure, and can also be irradiated to the second optical coupling incident port in the on-chip integrated device test structure; the optical power meter can receive the light emitted from the first optical coupling output port, and can also receive the light emitted from the second optical coupling output port.

[0045] Further, in one embodiment, see Figure 2 As shown, the on-chip integrated device test system also includes a first switching optical switch and a second switching optical switch; the light source includes a first port light source and a second port light source, and the first port light source and the second port light source are connected to one side of the on-chip integrated device test structure through the first switching optical switch; the optical power meter includes a first port optical power meter and a second port optical power meter, and the first port optical power meter and the second port optical power meter are connected to the other side of the on-chip integrated device test structure through the second switching optical switch.

[0046] This embodiment sets two light sources for the optical coupling incident first port and the optical coupling incident second port, namely the first port light source and the second port light source. The first port light source is consistent with the working wavelength range of the optical coupling incident first port, and the second port light source is consistent with the working wavelength range of the optical coupling incident second port, so that the first port light source and the second port light source with different working wavelength ranges can meet the working scenarios of multiple bands required by this embodiment. And by setting the first switching optical switch, wavelength switching can be performed, that is, the first switching optical switch can be switched to the first port light source to connect with the optical coupling incident first port, and the first switching optical switch can also be switched to the second port light source to connect with the optical coupling incident second port.

[0047] As for the optical power meter, this embodiment also sets two, namely the first port optical power meter and the second port optical power meter. The working wavelength range of the first port optical power meter can be the same as the working wavelength range of the optical coupling incident first port, or it can be larger than the working wavelength range of the optical coupling incident first port; the working wavelength range of the second port optical power meter can be the same as the working wavelength range of the optical coupling incident second port, or it can be larger than the working wavelength range of the optical coupling incident second port. By setting the second switching switch, the optical power meter can be switched, that is, the first port optical power meter can be switched to be connected with the optical coupling output first port through the second switching optical switch, and the second port optical power meter can be switched to be connected with the optical coupling output second port through the second switching optical switch.

[0048] In actual testing, there is a one-to-one calibration problem between light sources and optical power meters in different working wavelength ranges. The measurement results will be more accurate after calibration. Therefore, in this embodiment, two light sources and two optical power meters are set to achieve a better one-to-one pairing solution.

[0049] Of course, in other embodiments, an ultra-wide spectrum light source or multiple specific band scanning laser light sources may be provided, and light sources may be provided for multiple optical coupling incident ports. Since the wavelength range that an optical power meter can detect is wider than the working wavelength range of a light source, in other embodiments, an optical power meter may be used to connect to the optical coupling output first port and the optical coupling output second port.

[0050] See also Figure 3 As shown, the embodiment of the present application also provides a testing method for the above-mentioned on-chip integrated device testing structure, which includes the following steps:

[0051] S1: Pass light to the first optical coupling input port.

[0052] S2: Move the input coupling fiber to above the first optical coupling input port, move the output coupling fiber to above the first optical coupling output port, and test the performance of the device under test.

[0053] In step S2, the incident coupling optical fiber of the test bench is moved to above the grating coupler of the first optical coupling incident port, and the output coupling optical fiber of the test bench is moved to a position above the grating coupler of the first optical coupling output port, and then the optical coupling test is performed; then the performance of the device under test within the wavelength range of the grating coupler of the first optical coupling incident port is tested.

[0054] S3: Pass light to the second optical coupling input port.

[0055] S4: Move the incident coupling optical fiber to above the second optical coupling incident port, move the output coupling optical fiber to above the second optical coupling output port, and test the performance of the device under test.

[0056] In step S4, the incident coupling fiber of the test bench is moved to above the grating coupler of the second optical coupling incident port, and the output coupling fiber of the test bench is moved to a position above the grating coupler of the second optical coupling output port, and then the optical coupling test is performed; and then the performance of the device under test within the wavelength range of the grating coupler of the second optical coupling incident port is tested.

[0057] After step S4, the incident coupling fiber and the outgoing coupling fiber of the test bench are moved to a safe position to complete the test. If the on-chip integrated device test structure also includes a third optical coupling incident port and a third optical coupling outgoing port, after step S4, the same actions as steps S3 and S3 can be followed to pass light to the third optical coupling incident port and test the performance of the device under test. Similarly, if there is a fourth optical coupling incident port and a fourth optical coupling outgoing port, the test is also performed according to the same steps, which will not be repeated here.

[0058] Further, see Figure 2 As shown, the light passing to the optically coupled incident first port may include: adjusting the first switching optical switch located on one side of the on-chip integrated device test structure to connect the first port light source to the optically coupled incident first port; and adjusting the second switching optical switch located on the other side of the on-chip integrated device test structure to connect the first port optical power meter to the optically coupled output first port. By adjusting the first switching optical switch and the second switching optical switch, the output light of the light source is adjusted to be consistent with the working wavelength range of the optically coupled incident first port, and the wavelength range of the light received by the optical power meter is also adjusted to be consistent with the working wavelength range of the optically coupled incident first port, so that it can pass and work normally. That is, the first port light source and the first port optical power meter are both adjusted to be connected to the optically coupled incident first port.

[0059] Similarly, in step S3, passing light to the optically coupled incident second port may include: adjusting the first switching optical switch located on one side of the on-chip integrated device test structure so that the second port light source is connected to the optically coupled incident second port; and adjusting the second switching optical switch located on the other side of the on-chip integrated device test structure so that the second port optical power meter is connected to the optically coupled output second port. By adjusting the first switching optical switch and the second switching optical switch, the output light of the light source is adjusted to be consistent with the working wavelength range of the optically coupled incident second port, and the wavelength range of the light received by the optical power meter is also adjusted to be consistent with the working wavelength range of the optically coupled incident second port, so that it can work normally. That is, the second port light source and the second port optical power meter are both adjusted to be connected to the optically coupled incident second port.

[0060] The present application designs a multi-working wavelength on-chip integrated device test structure, test system and test method. Through the multi-working wavelength on-chip integrated device test structure, the performance of the device under test under different working wavelength ranges can be tested, the test efficiency can be improved, and the test time can be saved. At the same time, the test structure effectively avoids the problem of repeated layout of the same device under test for different wavelength ranges, greatly saves the chip flow layout area, and saves more than 2 times the chip flow cost. The test structure, test system and test method of the present application are simple, and solve the problems of low test efficiency and high repeatability of layout flow caused by the limitation of working wavelengths in the performance test of on-chip integrated devices, especially when the device is tested at the wafer level, saving the cost of device research and development and product development, and meeting the device selection requirements for multiple application scenarios.

[0061] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0062] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0063] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. An on-chip integrated device test structure, characterized in that: It includes: A light coupling incident first port and a light coupling incident second port, wherein the light coupling incident first port and the light coupling incident second port have different operating wavelength ranges; A beam combiner, the beam combiner is connected to the first light coupling incident port and the second light coupling incident port, and the beam combiner is connected to a device under test; A beam splitter, the beam splitter is connected to the device under test; A first light coupling output port and a second light coupling output port are provided, and both the first light coupling output port and the second light coupling output port are connected to the beam splitter.

2. The on-chip integrated device test structure according to claim 1, characterized in that: The operating wavelength range of the light coupling incident first port and the light coupling incident second port is C, L, S, O or E band; The operating wavelength range of the first light coupling output port and the second light coupling output port is C, L, S, O or E band.

3. The on-chip integrated device test structure according to claim 1, characterized in that: The operating wavelength range of the light coupling incident first port and the light coupling output first port is the same; The operating wavelength range of the light coupling incident second port and the light coupling output second port is the same.

4. The on-chip integrated device test structure according to claim 1, characterized in that: The first light coupling incident port and the first light coupling output port both include one or more grating couplers.

5. The on-chip integrated device test structure as claimed in claim 4, characterized in that: The grating coupler is of a converging type, a straight waveguide type, a metasurface type or a photonic crystal type.

6. The on-chip integrated device test structure according to claim 1, characterized in that: The device under test is an active device or a passive device.

7. An on-chip integrated device testing system, characterized in that: It includes: The on-chip integrated device test structure as described in any one of claims 1 to 6, wherein one side of the on-chip integrated device test structure is connected to a light source, and the other side of the on-chip integrated device test structure is connected to an optical power meter.

8. The integrated device on chip test system as claimed in claim 7, characterized in that: The on-chip integrated device testing system further includes a first switching optical switch and a second switching optical switch; The light source comprises a first port light source and a second port light source, wherein the first port light source and the second port light source are connected to one side of the on-chip integrated device test structure through the first switching optical switch; The optical power meter includes a first-port optical power meter and a second-port optical power meter, and the first-port optical power meter and the second-port optical power meter are connected to the other side of the on-chip integrated device test structure through the second switching optical switch.

9. A method for testing an on-chip integrated device test structure as claimed in claim 1, characterized in that: It includes the following steps: Passing light to the first optical coupling incident port; Move the input coupling optical fiber to above the first optical coupling input port, move the output coupling optical fiber to above the first optical coupling output port, and test the performance of the device under test; Passing light to the second optical coupling incident port; The incident coupling optical fiber is moved to above the second optical coupling incident port, the output coupling optical fiber is moved to above the second optical coupling output port, and the performance of the device under test is tested.

10. The testing method according to claim 9, characterized in that: The step of passing light to the first light coupling incident port comprises: The first switching optical switch located on one side of the on-chip integrated device test structure is adjusted to connect the first port light source with the light coupling incident first port; and the second switching optical switch located on the other side of the on-chip integrated device test structure is adjusted to connect the first port optical power meter with the light coupling output first port.

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