Silicon optical device and disassembly-free maintenance method

Abstract

The invention discloses a silicon optical device, which comprises a silicon optical chip, and the silicon optical chip comprises a one-to-eight incident optical waveguide, and a first one-to-four incident optical waveguide and a second one-to-four incident optical waveguide which are respectively arranged at the two sides of the one-to-eight incident optical waveguide; a first converging lens, a first isolator, a first collimating lens and a first laser are sequentially arranged at an inlet of the one-divided-eight-incident optical waveguide from the near to the distant, and a first turning prism is arranged between the first isolator and the first converging lens. A second converging lens is arranged between the first turning prism and the first one-to-four incident waveguide; and a third converging lens, a second isolator, a second collimating lens and a second laser are sequentially arranged at an inlet of the second one-to-four incident optical waveguide from near to far, so that disassembly-free maintenance can be realized.

Description

Technical Field

[0001] The invention belongs to the technical field of optical fiber communication, and in particular relates to a silicon optical device and a maintenance method. Background Art

[0002] In order to reduce material costs, current optical modules such as DR4 / DR8 often choose to use as few high-power lasers as possible as light sources, such as using only one high-power laser. However, the actual materials (lasers) may have the following problems: some lasers may not have enough power, or the divergence angle is too large, resulting in insufficient coupling efficiency, or some silicon photonic chip materials have too large insertion loss, which will result in failure to meet the final device light output requirements. These cannot be confirmed before coupling. After the coupling is completed, it is found that the light output requirements cannot be met, but the patch has been completed at this time, so the laser or silicon photonic chip needs to be repaired. Only after the repair is qualified can it be shipped out of the factory.

[0003] In practice, it is impossible to confirm whether it is the laser or the silicon photonic chip that is unqualified, so the laser is usually repaired first. If the insertion loss of the silicon photonic chip is too large, or even the power of the newly attached laser cannot meet the requirements, it will not be able to pass the repair in one go, and multiple repairs will be required, which will cause waste of materials and labor, and increase costs significantly. Moreover, when repairing and disassembling components, especially when repairing multiple times, it may cause hidden damage to other components, or there may be potential reliability risks when the subsequent devices are used due to incomplete cleaning of glue residues.

[0004] In the relevant documents, a silicon photonic chip and an 800G DR8 LPO silicon photonic optical engine and a coupling method are disclosed, which involve a silicon photonic chip having eight output waveguides, two 1-to-4 input waveguides and one 1-to-8 input waveguide, and the spacing between the 1-to-8 input waveguide and one of the 1-to-4 input waveguides is 82um. The 800GDR8 LPO silicon photonic optical engine coupling method is to fix the silicon photonic chip on a tungsten copper base; fix a eutectic ceramic heat sink with a laser chip on the tungsten copper base; place a polarization-independent optical isolator to couple the laser chip into the 1-to-8 input waveguide; determine whether the optical power meets the 1-to-8 requirement, if yes, end, if not, enter the next process; flip the polarization-independent optical isolator to couple the light of the laser chip into the 1-to-4 input waveguide A; fix another eutectic ceramic heat sink with a laser chip on the tungsten copper base to couple the light of the laser chip into the 1-to-4 input waveguide B. Save material costs to the maximum extent and optimize production capacity.

[0005] When coupling, this type of silicon photonic chip first determines the optical power and then fixes components such as the collimating lens. This will make it difficult to implement in practice due to inaccurate optical power judgment.

[0006] Therefore, how to utilize optical devices that do not meet the light output requirements and make them meet the light output requirements without disassembling the components has become a problem that optical device manufacturers need to solve. Summary of the invention

[0007] The object of the present invention is to provide a silicon photonic device and a disassembly-free maintenance method to solve at least one of the above-mentioned technical problems.

[0008] To achieve the above object, the technical solution adopted by the present invention is:

[0009] A silicon photonic device, comprising:

[0010] A silicon photonic chip, the silicon photonic chip comprising a one-to-eight input optical waveguide and a first one-to-four input optical waveguide and a second one-to-four input optical waveguide respectively arranged on both sides of the one-to-eight input optical waveguide;

[0011] The entrance of the one-to-eight-input optical waveguide is provided with a first converging lens, a first isolator, a first collimating lens and a first laser in sequence from near to far.

[0012] A first turning prism is provided between the first isolator and the first converging lens, and a second converging lens is provided between the first turning prism and the first one-split four-input optical waveguide to turn the light emitted by the first laser to the second converging lens and couple it to the first one-split four-input optical waveguide;

[0013] A third converging lens, a second isolator, a second collimating lens and a second laser are sequentially arranged at the entrance of the second one-to-four-input optical waveguide from near to far, and the light emitted by the second laser passes through the second collimating lens, the second isolator and the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide.

[0014] The present invention can change the path of the light emitted by the first laser by setting the first turning prism, so that the light emitted by the first laser is directed to the second converging lens. The second converging lens can converge the emitted light and couple it to the first one-divide-four-input optical waveguide.

[0015] In the prior art, the optical power of the silicon optical device may be insufficient because the power of the first laser is insufficient or insertion loss occurs in the one-to-eight-input optical waveguide.

[0016] The present invention arranges a first turning prism between a first isolator and a first converging lens, and arranges a second converging lens between the first turning prism and a first one-to-four input optical waveguide, so as to couple a first laser to the first one-to-four input optical waveguide, and the first laser switches from coupling with the one-to-eight input optical waveguide to coupling with the first one-to-four input optical waveguide, and the light emitted by the first laser changes from one-to-eight to one-to-four, so that the optical power of four output optical waveguides corresponding to the first one-to-four input optical waveguide can be greatly improved, thereby meeting the demand for optical power, and can even greatly exceed the minimum requirement for optical power, so that the silicon optical device can have a longer service life even after experiencing optical attenuation; by arranging a third converging lens, a second isolator, a second collimating lens and a second laser, the second laser is coupled to the second one-to-four input optical waveguide, so that the optical power of the four output optical waveguides corresponding to the second one-to-four input optical waveguide can also meet the requirement, and under the joint action of the first laser and the second laser, the optical power of the eight output optical waveguides can meet the requirement, so that the optical power of the entire silicon optical chip meets the requirement.

[0017] Furthermore, the first turning prism is connected to the first isolator via a positioning member, and the positioning member is provided to facilitate positioning of the first turning prism, thereby speeding up the installation of the first turning prism and improving the accuracy of the installation position of the first turning prism.

[0018] Furthermore, the positioning member includes a sleeve, and a notch is formed on the outer wall of the sleeve so that the sleeve can be coaxially sleeved on the first isolator. The first turning prism is fixedly connected to one end of the sleeve, and the connection between the first turning prism and the first isolator can be achieved through the set sleeve.

[0019] Furthermore, the first laser and the second laser are both adhered to the base, and the first laser and the second laser are fixed by the base, and the base can also dissipate heat for the first laser and the second laser.

[0020] Furthermore, a cover body is provided above the first laser and the second laser, and the cover body is connected to the first laser and the second laser through a heat conductor. The provided cover body is used to protect the first laser and the second laser, and the provided heat conductor is used to conduct the heat generated by the first laser and the second laser to the cover body, which is beneficial to the heat dissipation of the first laser and the second laser.

[0021] Further, the heat conducting member includes a heat conducting sheet and an elastic portion, one end of the elastic portion is fixed to the heat conducting sheet, and the other end is fixed to the cover body, so that the first laser and the second laser are in contact with the corresponding heat conducting sheets, and an insulating heat conducting medium is coated between the first laser and the second laser and the corresponding heat conducting sheets, the elastic portion is used to connect the heat conducting sheet to the cover body, and when the cover body is covered on the first laser and the second laser, the heat conducting sheet can be pressed against the corresponding first laser and the second laser, the heat conducting sheet is used to transfer the heat on the first laser and the second laser to the elastic portion, and then to the cover body, and the cover body is used to achieve heat dissipation, the heat conducting sheet can increase the contact area between the heat conducting member and the first laser and the second laser, which is beneficial to heat dissipation and the connection between the heat conducting member and the first laser and the second laser, and the insulating heat conducting medium is used to fill the gap between the heat conducting sheet and the first laser and the second laser, which is beneficial to heat conduction.

[0022] Furthermore, the focal length of the second converging lens is greater than that of the first converging lens, so that the second converging lens can be arranged offset from the first converging lens, which can reasonably utilize the space and can install the second converging lens in a smaller space.

[0023] Furthermore, the focal length of the third converging lens is greater than that of the first converging lens, so that the third converging lens can be arranged in a staggered manner with the first converging lens, which can reasonably utilize the space and can install the third converging lens in a smaller space.

[0024] Furthermore, a second turning prism is provided between the second isolator and the third converging lens. The light emitted by the second laser passes through the second collimating lens, the second isolator, the second turning prism, and the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide. By setting the second turning prism, the light emitted by the second laser can be refracted, which is convenient for adjusting the position of the second laser. For example, when the distance between the second one-to-four-input optical waveguide and the one-to-eight-input optical waveguide is relatively close, the distance between the second laser and the first laser can be adjusted by setting the second turning prism so that the second laser can be installed.

[0025] The present invention also provides a disassembly-free maintenance method, based on the above silicon photonic device, comprising the following steps:

[0026] S1, fixing the first turning prism between the first isolator and the first converging lens to refract the light emitted by the first laser into the first one-split four-input optical waveguide;

[0027] S2, fixing the second converging lens between the first turning prism and the first one-split four-input optical waveguide to couple the light emitted by the first laser with the first one-split four-input optical waveguide;

[0028] S3. The third converging lens, the second isolator, the second collimating lens and the second laser are arranged at the second one-to-four-input optical waveguide, and the light emitted by the second laser passes through the second collimating lens, the second isolator and the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide.

[0029] The present invention arranges a first turning prism between the first converging lens and the first isolator of the existing silicon optical device, cooperates with the second converging lens, refracts the light of the first laser and couples it to the first one-to-four-input optical waveguide, and then arranges the second laser and couples it to the second one-to-four-input optical waveguide, so that the silicon optical device can be repaired without disassembly, that is, the silicon optical chip, the first converging lens, the first isolator, the first collimating lens and the first laser can be repaired without disassembling, and the existing silicon optical device with insufficient optical power due to insufficient power of the first laser or insertion loss in the one-to-eight-input optical waveguide can be utilized.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] (1) The present invention provides a first turning prism between the first isolator and the first converging lens, and provides a second converging lens between the first turning prism and the first one-to-four input optical waveguide, so as to couple the first laser to the first one-to-four input optical waveguide. The first laser switches from coupling with the one-to-eight input optical waveguide to coupling with the first one-to-four input optical waveguide, and the light emitted by the first laser changes from one-to-eight to one-to-four, so that the optical power of the four output optical waveguides corresponding to the first one-to-four input optical waveguide can be greatly improved, thereby meeting the optical power requirement, and can even greatly exceed the minimum optical power requirement, so that the silicon optical device can have a longer service life even if it experiences optical attenuation; by providing a third converging lens, a second isolator, a second collimating lens and a second laser, the second laser is coupled to the second one-to-four input optical waveguide, so that the optical power of the four output optical waveguides corresponding to the second one-to-four input optical waveguide can also meet the requirement. Under the joint action of the first laser and the second laser, the optical power of the eight output optical waveguides can meet the requirement, so that the optical power of the entire silicon optical chip meets the requirement.

[0032] (2) The present invention sets a first turning prism between the first converging lens and the first isolator of the existing silicon optical device, cooperates with the second converging lens, refracts the light of the first laser and couples it to the first one-to-four-input optical waveguide, and then sets a second laser and couples it to the second one-to-four-input optical waveguide. This can achieve non-disassembly maintenance of the silicon optical device, that is, maintenance can be completed without disassembling the silicon optical chip, the first converging lens, the first isolator, the first collimating lens and the first laser, and the existing silicon optical device with insufficient optical power due to insufficient power of the first laser or insertion loss in the one-to-eight-input optical waveguide can be utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the structure of a silicon optical device in the prior art;

[0034] Figure 2 This is a schematic diagram of the structure of a silicon optical device in this embodiment;

[0035] Figure 3 is a positional relationship diagram of the first turning prism, the positioning member and the first isolator in this embodiment;

[0036] Figure 4 is a positional relationship diagram among the cover body, the heat conducting member and the first laser in this embodiment;

[0037] In the figure: 1. silicon photonic chip; 101. one-to-eight-input optical waveguide; 102. first one-to-four-input optical waveguide; 103. second one-to-four-input optical waveguide; 2. first converging lens; 3. first isolator; 4. first collimating lens; 5. first laser; 6. first turning prism; 7. second converging lens; 8. third converging lens; 9. second isolator; 10. second collimating lens; 11. second laser; 12. positioning member; 13. base; 14. cover; 15. heat conducting member; 1501. heat conducting sheet; 1502. elastic part; 16. second turning prism; 17. light output waveguide; 18. optical fiber array; 19. insulating heat conducting medium. DETAILED DESCRIPTION

[0038] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] like Figure 1As shown, in the prior art, a silicon photonic device includes a silicon photonic chip 1, which includes a one-to-eight-input optical waveguide 101 and a first one-to-four-input optical waveguide 102 and a second one-to-four-input optical waveguide 103 respectively arranged on both sides of the one-to-eight-input optical waveguide 101; a first converging lens 2, a first isolator 3, a first collimating lens 4 and a first laser 5 are arranged at the entrance of the one-to-eight-input optical waveguide 101 in sequence from near to far. This silicon photonic device is only provided with one first laser 5. If the first laser 5 has a virtual mark, it may cause the optical power of the silicon photonic device to be insufficient. If the one-to-eight-input optical waveguide 101 has insertion loss, it is also easy to cause insufficient optical power.

[0040] like Figure 2 As shown, this embodiment provides a silicon optical device, including:

[0041] A silicon photonic chip 1, comprising a one-to-eight input optical waveguide 101 and a first one-to-four input optical waveguide 102 and a second one-to-four input optical waveguide 103 respectively arranged on both sides of the one-to-eight input optical waveguide 101;

[0042] The entrance of the one-to-eight-input optical waveguide 101 is provided with a first converging lens 2, a first isolator 3, a first collimating lens 4 and a first laser 5 in sequence from near to far;

[0043] A first turning prism 6 is provided between the first isolator 3 and the first converging lens 2, and a second converging lens 7 is provided between the first turning prism 6 and the first one-split four-input optical waveguide 102 to turn the light emitted by the first laser 5 to the second converging lens 7 and couple it to the first one-split four-input optical waveguide 102;

[0044] At the entrance of the second one-to-four-input optical waveguide 103, a third converging lens 8, a second isolator 9, a second collimating lens 10 and a second laser 11 are sequentially arranged from near to far. The light emitted by the second laser 11 passes through the second collimating lens 10, the second isolator 9, the third converging lens 8 in sequence and is coupled to the second one-to-four-input optical waveguide 103.

[0045] In this embodiment, the silicon photonic chip 1 also includes eight output waveguides 17, and the eight output waveguides 17 and the one-to-eight input waveguide 101, the first one-to-four input waveguide 102 and the second one-to-four input waveguide 103 are arranged on the same side of the silicon photonic chip 1, the eight output waveguides 17 are connected to the one-to-eight input waveguide 101, four of the eight output waveguides 17 are also connected to the first one-to-four input waveguide 102, and the other four output waveguides 17 are connected to the second one-to-four input waveguide 103, and the eight output waveguides 17 are also coupled to the optical fiber array 18.

[0046] In this embodiment, the first laser 5 and the second laser 11 are both attached to the base 13 , and the base 13 is used to fix the first laser 5 and the second laser 11 . The base 13 can also dissipate heat for the first laser 5 and the second laser 11 .

[0047] In this embodiment, the silicon photonic chip 1, the first converging lens 2, the first isolator 3, the first collimating lens 4, the first laser 5, the first turning prism 6, the second converging lens 7, the third converging lens 8, the second isolator 9, the second collimating lens 10 and the second laser 11 are also pasted on the base 13. Specifically, the silicon photonic chip 1, the first converging lens 2, the first isolator 3, the first collimating lens 4, the first laser 5, the first turning prism 6, the second converging lens 7, the third converging lens 8, the second isolator 9, the second collimating lens 10 and the second laser 11 are all pasted on the base 13 by glue, and the glue is cured by irradiating ultraviolet rays.

[0048] In this embodiment, the base 13 may be a tungsten copper base 13 , and the tungsten copper base 13 can be used to dissipate heat for the first laser 5 and the second laser 11 .

[0049] In this embodiment, a glass sheet may be further disposed between the first laser 5 and the second laser 11 and the base 13 .

[0050] Since two lasers (the first laser 5 and the second laser 11) are provided in this embodiment, the two lasers generate a large amount of heat. In order to dissipate heat better, in this embodiment, as shown in FIG. Figure 4 As shown, a cover 14 is provided above the first laser 5 and the second laser 11. Figure 1 and Figure 2 The base 13 and the cover 14 are not shown in the figure. The cover 14 is connected to the first laser 5 and the second laser 11 through the heat conductor 15. The cover 14 is used to protect the first laser 5 and the second laser 11. The heat conductor 15 is used to conduct the heat generated by the first laser 5 and the second laser 11 to the cover 14, which is beneficial to the heat dissipation of the first laser 5 and the second laser 11.

[0051] In this embodiment, the cover 14 can cover the entire base 13 , and the cover 14 can also be made of metal.

[0052] The present invention can change the path of the light emitted by the first laser 5 by setting the first turning prism 6, so that the light emitted by the first laser 5 is directed to the second converging lens 7. The second converging lens 7 can converge the emitted light and couple it to the first one-to-four-input optical waveguide 102.

[0053] In the prior art, the optical power of the silicon optical device may be insufficient because the power of the first laser 5 is insufficient or insertion loss occurs in the one-to-eight-input optical waveguide 101 .

[0054] The present invention arranges a first turning prism 6 between the first isolator 3 and the first converging lens 2, and arranges a second converging lens 7 between the first turning prism 6 and the first one-to-four input optical waveguide 102, so as to couple the first laser 5 to the first one-to-four input optical waveguide 102, and the first laser 5 switches from coupling with the one-to-eight input optical waveguide 101 to coupling with the first one-to-four input optical waveguide 102, and the light emitted by the first laser 5 changes from one-to-eight to one-to-four, so that the optical power of the four output optical waveguides 17 corresponding to the first one-to-four input optical waveguide 102 can be greatly improved, thereby meeting the demand for optical power, and can even greatly exceed the minimum requirement for optical power, so that the silicon optical device can have a longer service life even after experiencing optical attenuation; by arranging a third converging lens 8, a second isolator 9, a second collimating lens 10 and a second laser 11, The second laser 11 is coupled to the second one-to-four input optical waveguide 103, so that the optical power of the four output optical waveguides 17 corresponding to the second one-to-four input optical waveguide 103 can also meet the requirements. Under the joint action of the first laser 5 and the second laser 11, the optical power of the eight output optical waveguides 17 can meet the requirements, thereby making the optical power of the entire silicon photonic chip 1 meet the requirements; the silicon photonic device proposed in this embodiment can be obtained on the basis of the silicon photonic device in the prior art. By adding components, the silicon photonic device in the prior art that has insufficient optical power due to insufficient power of the first laser 5 or insertion loss in the one-to-eight input optical waveguide 101 can be utilized to achieve disassembly-free maintenance. In this embodiment, disassembly-free means that the silicon photonic chip 1, the first converging lens 2, the first isolator 3, the first collimating lens 4 and the first laser 5 do not need to be disassembled.

[0055] Furthermore, if Figure 3 As shown, the first turning prism 6 is connected to the first isolator 3 via a positioning member 12. The positioning member 12 is provided to facilitate positioning of the first turning prism 6, thereby accelerating the installation speed of the first turning prism 6 and improving the accuracy of the installation position of the first turning prism 6.

[0056] Furthermore, the positioning member 12 includes a sleeve, and a notch is provided on the outer peripheral wall of the sleeve so that the sleeve can be coaxially sleeved on the first isolator 3. The first turning prism 6 is fixedly connected to one end of the sleeve. The connection between the first turning prism 6 and the first isolator 3 can be achieved through the set sleeve. Because the first isolator 3 is fixed to the base 13, a notch needs to be provided on the sleeve to avoid the first isolator 3.

[0057] Furthermore, the heat conducting member 15 includes a heat conducting sheet 1501 and an elastic portion 1502, one end of the elastic portion 1502 is fixed to the heat conducting sheet 1501, and the other end is fixed to the cover body 14, so that the first laser 5 and the second laser 11 are in contact with the corresponding heat conducting sheet 1501, and an insulating heat conducting medium 19 is applied between the first laser 5 and the second laser 11 and the corresponding heat conducting sheet 1501. The elastic portion 1502 is used to connect the heat conducting sheet 1501 to the cover body 14, and when the cover body 14 is covered on the first laser 5 and the second laser 11, the heat conducting sheet 1501 can be pressed against the corresponding first laser 5 and the second laser 11. The heat conductive sheet 1501 is used to transfer the heat on the first laser 5 and the second laser 11 to the elastic part 1502, and then to the cover 14, and the cover 14 is used to achieve heat dissipation. The heat conductive sheet 1501 can increase the contact area between the heat conductive member 15 and the first laser 5 and the second laser 11, which is beneficial to heat dissipation and the connection between the heat conductive member 15 and the first laser 5 and the second laser 11. The insulating heat conductive medium 19 is used to fill the gap between the heat conductive sheet 1501 and the first laser 5 and the second laser 11, which is beneficial to heat conduction. In this embodiment, the insulating heat conductive medium 19 can be an insulating heat conductive silicone grease.

[0058] In this embodiment, the elastic portion 1502 may be a spring sheet. When the cover 14 is covered on the base 13 , the heat conducting sheet 1501 may be pressed against the first laser 5 and the second laser 11 through the spring sheet.

[0059] Furthermore, the focal length of the second converging lens 7 is greater than that of the first converging lens 2, so that the second converging lens 7 can be offset from the first converging lens 2, which can reasonably utilize the space and can install the second converging lens 7 in a smaller space.

[0060] Furthermore, the focal length of the third converging lens 8 is greater than that of the first converging lens 2, so that the third converging lens 8 can be offset from the first converging lens 2, which can reasonably utilize the space and can install the third converging lens 8 in a smaller space.

[0061] Furthermore, a second turning prism 16 is provided between the second isolator 9 and the third converging lens 8. The light emitted by the second laser 11 passes through the second collimating lens 10, the second isolator 9, the second turning prism 16, and the third converging lens 8 in sequence and is coupled to the second one-to-four-input optical waveguide 103. By providing the second turning prism 16, the light emitted by the second laser 11 can be refracted, so that the position of the second laser 11 can be adjusted. For example, when the distance between the second one-to-four-input optical waveguide 103 and the one-to-eight-input optical waveguide 101 is relatively close, the distance between the second laser 11 and the first laser 5 can be adjusted by providing the second turning prism 16 so that the second laser 11 can be installed.

[0062] This embodiment also provides a maintenance method without disassembly, based on the above silicon photonic device, comprising the following steps:

[0063] S1, fixing the first turning prism 6 between the first isolator 3 and the first converging lens 2 to refract the light emitted by the first laser 5 to the first one-split-four-input optical waveguide 102;

[0064] S2, fixing the second converging lens 7 between the first turning prism 6 and the first one-split-four-input optical waveguide 102 to couple the light emitted by the first laser 5 with the first one-split-four-input optical waveguide 102;

[0065] S3. A third converging lens 8, a second isolator 9, a second collimating lens 10 and a second laser 11 are arranged at the second one-to-four-input optical waveguide 103. The light emitted by the second laser 11 passes through the second collimating lens 10, the second isolator 9, the third converging lens 8 in sequence and is coupled to the second one-to-four-input optical waveguide 103.

[0066] The present invention sets a first turning prism 6 between the first converging lens 2 and the first isolator 3 of the existing silicon optical device, cooperates with the second converging lens 7, refracts the light of the first laser 5 and couples it to the first one-to-four-input optical waveguide 102, and then sets the second laser 11 and couples it to the second one-to-four-input optical waveguide 103, so that the silicon optical device can be repaired without disassembly, that is, the silicon optical chip 1, the first converging lens 2, the first isolator 3, the first collimating lens 4 and the first laser 5 can be repaired without disassembling, and the existing silicon optical device with insufficient optical power due to insufficient power of the first laser 5 or insertion loss in the one-to-eight-input optical waveguide 101 can be utilized.

[0067] It should be noted that although the present invention is disclosed as above by specific embodiments, the above embodiments are not intended to limit the present invention. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A silicon photonic device, comprising: A silicon photonic chip, the silicon photonic chip comprising a one-to-eight input optical waveguide and a first one-to-four input optical waveguide and a second one-to-four input optical waveguide respectively arranged on both sides of the one-to-eight input optical waveguide; The entrance of the one-to-eight-input optical waveguide is provided with a first converging lens, a first isolator, a first collimating lens and a first laser in sequence from near to far, and is characterized in that: A first turning prism is provided between the first isolator and the first converging lens, and a second converging lens is provided between the first turning prism and the first one-split four-input optical waveguide to turn the light emitted by the first laser to the second converging lens and couple it to the first one-split four-input optical waveguide; A third converging lens, a second isolator, a second collimating lens and a second laser are sequentially arranged at the entrance of the second one-to-four-input optical waveguide from near to far, and the light emitted by the second laser passes through the second collimating lens, the second isolator and the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide.

2. A silicon optical device according to claim 1, characterized in that: The first turning prism is connected to the first isolator through a positioning member.

3. A silicon optical device as claimed in claim 2, characterized in that: The positioning member comprises a sleeve, and a notch is formed on the outer peripheral wall of the sleeve so that the sleeve can be coaxially sleeved on the first isolator, and the first turning prism is fixedly connected to one end of the sleeve.

4. A silicon optical device according to claim 1, characterized in that: The first laser and the second laser are both adhered to the base.

5. A silicon optical device according to claim 1, characterized in that: A cover body is provided above the first laser and the second laser, and the cover body is connected to the first laser and the second laser through a heat conducting member.

6. A silicon optical device as claimed in claim 5, characterized in that: The heat-conducting component includes a heat-conducting sheet and an elastic part, one end of the elastic part is fixed to the heat-conducting sheet, and the other end is fixed to the cover body, so that the first laser and the second laser are in contact with the corresponding heat-conducting sheet, and an insulating heat-conducting medium is coated between the first laser and the second laser and the corresponding heat-conducting sheet.

7. A silicon optical device according to claim 1, characterized in that: The focal length of the second converging lens is greater than the focal length of the first converging lens.

8. The silicon optical device according to claim 1, characterized in that: The focal length of the third converging lens is greater than the focal length of the first converging lens.

9. A silicon optical device according to claim 1, characterized in that: A second turning prism is provided between the second isolator and the third converging lens. The light emitted by the second laser passes through the second collimating lens, the second isolator, the second turning prism, the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide.

10. A maintenance method without disassembly, based on the silicon photonic device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, fixing the first turning prism between the first isolator and the first converging lens to refract the light emitted by the first laser into the first one-split four-input optical waveguide; S2, fixing the second converging lens between the first turning prism and the first one-split four-input optical waveguide to couple the light emitted by the first laser with the first one-split four-input optical waveguide; S3. The third converging lens, the second isolator, the second collimating lens and the second laser are arranged at the second one-to-four-input optical waveguide, and the light emitted by the second laser passes through the second collimating lens, the second isolator and the third converging lens in sequence and is coupled to the second one-to-four-input optical waveguide.

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