Anti-peeping panel, manufacturing method thereof and anti-peeping display device

Abstract

The invention discloses a peep-proof panel, a manufacturing method of the peep-proof panel and a peep-proof display device. The peep-proof panel comprises a first substrate structure, a second substrate structure, a liquid crystal layer and frame glue. The second substrate structure and the first substrate structure are oppositely arranged, the first substrate structure is provided with a first stress adjusting layer, and the second substrate structure is provided with a second stress adjusting layer. The liquid crystal layer is arranged between the first substrate structure and the second substrate structure. The frame glue is arranged between the first substrate structure and the second substrate structure and surrounds the liquid crystal layer. One of the first stress adjusting layer and the second stress adjusting layer has tensile stress, and the other one of the first stress adjusting layer and the second stress adjusting layer has compressive stress. The peep-proof display device comprises a display panel and a peep-proof panel arranged on the light inlet side or the light outlet side of the display panel. The peep-proof panel can be prevented from being cracked or fractured in the manufacturing process of the peep-proof panel.

Description

Technical Field

[0001] The present invention relates to anti-peeping technology, and in particular to an anti-peeping panel and a manufacturing method thereof, and an anti-peeping display device. Background Art

[0002] Most display devices today have a wide viewing angle display effect, but in certain scenarios, such as when processing confidential information or personal privacy information, the displayed confidential information may be viewed by others due to the wide viewing angle effect of the display device, resulting in the risk of information leakage. To avoid the above risks, an anti-peeping panel can be set on the display device to reduce the viewing angle of the display device, thereby achieving an anti-peeping effect. However, in the production of the anti-peeping panel, the tensile force may exceed the deformation resistance of the component, resulting in cracks or even breakage, resulting in the failure of the production of the anti-peeping panel. Summary of the invention

[0003] The object of the present invention is to provide an anti-peeping panel and a manufacturing method thereof and an anti-peeping display device, which have special stress characteristic designs such as compressive stress and tensile stress to avoid cracks or breaks in the manufacturing process.

[0004] According to the above purpose, the present invention proposes an anti-peep panel, which includes a first substrate structure, a second substrate structure, a liquid crystal layer and a sealant. The first substrate structure includes a first flexible substrate, a first stress adjustment layer and a first light-transmitting conductive layer. The second substrate structure is arranged opposite to the first substrate structure and includes a second flexible substrate, a second stress adjustment layer and a second light-transmitting conductive layer. The liquid crystal layer is arranged between the first substrate structure and the second substrate structure, wherein the first stress adjustment layer and the first light-transmitting conductive layer are arranged between the first flexible substrate and the liquid crystal layer, and the second stress adjustment layer and the second light-transmitting conductive layer are arranged between the second flexible substrate and the liquid crystal layer. The sealant is arranged between the first substrate structure and the second substrate structure and surrounds the liquid crystal layer. The stress of one of the first stress adjustment layer and the second stress adjustment layer is a tensile stress, and the stress of the other of the first stress adjustment layer and the second stress adjustment layer is a compressive stress.

[0005] According to an embodiment of the present invention, the absolute value of the tensile stress is 0.5 to 2 times the absolute value of the compressive stress.

[0006] According to another embodiment of the present invention, the material of the first stress adjustment layer and the second stress adjustment layer includes at least one of silicon nitride and silicon oxide.

[0007] According to another embodiment of the present invention, a process parameter for forming the first stress adjustment layer is different from a process parameter for forming the second stress adjustment layer.

[0008] According to another embodiment of the present invention, the first stress adjustment layer is formed via a first chemical vapor deposition process, and the second stress adjustment layer is formed via a second chemical vapor deposition process, wherein a gas mixing ratio of the first chemical vapor deposition process is different from a gas mixing ratio of the second chemical vapor deposition process, a radio frequency power of the first chemical vapor deposition process is different from a radio frequency power of the second chemical vapor deposition process, or a deposition rate of the first chemical vapor deposition process is different from a deposition rate of the second chemical vapor deposition process.

[0009] According to another embodiment of the present invention, the materials of the first flexible substrate and the second flexible substrate include polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, or a combination thereof.

[0010] According to another embodiment of the present invention, the stress value of the first light-transmitting conductive layer and the stress value of the second light-transmitting conductive layer are not 0, the sum of the stress of the first stress adjustment layer and the stress of the first electrode layer is the first stress sum, the sum of the stress of the second stress adjustment layer and the stress of the second light-transmitting conductive layer is the second stress sum, and one of the first stress sum and the second stress sum is greater than 0 and less than 0, respectively.

[0011] According to another embodiment of the present invention, the material of the first light-transmitting conductive layer and the second light-transmitting conductive layer includes indium tin oxide or indium zinc oxide.

[0012] According to the above objective, the present invention further provides an anti-peeping display device, which comprises the anti-peeping panel and a display panel, wherein the anti-peeping panel is disposed on a light incident side or a light emitting side of the display panel.

[0013] According to the above purpose, the present invention provides a method for manufacturing a privacy panel, which includes forming a first substrate structure on a first carrier, the first substrate structure including a first flexible substrate, a first stress adjustment layer and a first light-transmitting conductive layer; forming a second substrate structure on a second carrier, the second substrate structure including a second flexible substrate, a second stress adjustment layer and a second light-transmitting conductive layer; assembling the first substrate structure and the second substrate structure through a sealant, wherein the sealant is disposed between the first substrate structure and the second substrate structure, a liquid crystal layer is disposed in a space formed by the first substrate structure, the second substrate structure and the sealant, the first stress adjustment layer and the first light-transmitting conductive layer are disposed between the first flexible substrate and the liquid crystal layer, and the second stress adjustment layer and the second light-transmitting conductive layer are disposed between the second flexible substrate and the liquid crystal layer; and removing the first carrier and the second carrier. The stress of one of the first stress adjustment layer and the second stress adjustment layer is a tensile stress, and the stress of the other of the first stress adjustment layer and the second stress adjustment layer is a compressive stress.

[0014] According to another embodiment of the present invention, after the first carrier and the second carrier are removed, the first flexible substrate and the second flexible substrate are bent in the same direction.

[0015] The beneficial effect of the present invention is at least that, by designing special stress characteristics such as compressive stress and tensile stress for the anti-peeping panel, cracks or breaks in the production of the anti-peeping panel and the anti-peeping display device can be avoided, thereby effectively improving the production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] For a more complete understanding of the embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a partial cross-sectional schematic diagram of the anti-peep panel according to the first embodiment of the present invention;

[0018] Figure 2A for Figure 1 A plan view of the first flexible substrate and the first electrode layer;

[0019] Figure 2B for Figure 1 a plan view of a second flexible substrate and a second electrode layer;

[0020] Figure 2C for Figure 1 Plan view of the middle frame glue;

[0021] Figure 3 for Figure 1 A top view of the middle privacy panel;

[0022] Figure 4A and Figure 4B Along Figure 3 Schematic cross-sectional views of different cutting lines;

[0023] Figure 5 is a partial cross-sectional schematic diagram of an anti-peep panel according to a second embodiment of the present invention;

[0024] Figure 6 Shown to form Figure 1 a method for forming a first substrate structure;

[0025] Figure 7 Shown to form Figure 1 Method for forming a second substrate structure;

[0026] Figure 8 Show pair group Figure 3 The method of the first substrate structure in FIG. 1 and the second substrate structure in FIG. 4 ;

[0027] Fig. 9 Shown to form Figure 1 Method for privacy panel;

[0028] Fig.10 This is an example in which both the first stress adjustment layer and the second stress adjustment layer have compressive stress;

[0029] Fig.11 An example in which the first stress adjustment layer and the second stress adjustment layer have compressive stress and tensile stress, respectively;

[0030] Fig.12 An example in which the first stress adjustment layer and the second stress adjustment layer have tensile stress and compressive stress, respectively;

[0031] Fig.13 The relationship between the RF power of the plasma assisted chemical vapor deposition process and the stress characteristics of the component is shown;

[0032] Fig.14 is a schematic diagram of an anti-peeping display device according to a third embodiment of the present invention;

[0033] Fig.15 FIG. 4 is a schematic diagram of an anti-peeping display device according to a fourth embodiment of the present invention.

[0034]

Explanation of symbols

[0035] 10,20: Anti-peeping display device

[0036] 100,100': Privacy panel

[0037] 100A: Active area

[0038] 100B: Surrounding area

[0039] 110: first substrate structure

[0040] 111: first flexible substrate

[0041] 112: first stress adjustment layer

[0042] 113, 113': first light-transmitting conductive layer

[0043] 113A: First anti-peeping electrode

[0044] 113B: Connecting electrodes

[0045] 113C: First connection pad

[0046] 113D: Second connection pad

[0047] 113E: Connecting cable

[0048] 114: First alignment film

[0049] 120: Second substrate structure

[0050] 121: second flexible substrate

[0051] 122: Second stress adjustment layer

[0052] 123: second light-transmitting conductive layer

[0053] 123A: Second anti-peeping electrode

[0054] 123R: Notch

[0055] 124: Second alignment film

[0056] 125: Light shielding layer

[0057] 130: Liquid crystal layer

[0058] 140, 140': Frame glue

[0059] 140A: Conductive particles

[0060] C1, C2: Carrier board

[0061] S1: first voltage signal

[0062] S2: Second voltage signal

[0063] VA1: First person viewing angle

[0064] VA2: Second viewing angle range DETAILED DESCRIPTION

[0065] The following is a detailed discussion of the embodiments of the present disclosure. However, it is understood that the embodiments provide many applicable concepts that can be implemented in a variety of specific contexts. The embodiments discussed and disclosed are for illustration only and are not intended to limit the scope of the present disclosure.

[0066] The terms used in this article are only for describing specific embodiments and are not intended to limit the scope of the patent application. Unless otherwise limited, the singular forms of "a", "an" or "the" may also be used to represent plural forms.

[0067] It is to be understood that, although the terms “first”, “second”, etc. may be used herein to describe various features, these terms should not limit these features. These terms are only used to distinguish one feature from another.

[0068] The use of spatially relative terms is intended to describe different orientations of an element when in use or operation and is not limited to the orientation depicted in the drawings. The element may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptions used herein may be interpreted in the same manner.

[0069] For the sake of simplicity and clarity, the present invention may repeatedly use component symbols and / or letters in various embodiments, but this does not mean that there is a causal relationship between the various embodiments and / or configurations discussed. In addition, for the sake of simplicity and clarity of technical features, the elements in the drawings are not drawn to scale, and the size of each element can be arbitrarily increased or reduced.

[0070] Figure 1 FIG. 1 is a partial cross-sectional diagram of the anti-peep panel 100 of the first embodiment of the present invention. The anti-peep panel 100 may be disposed above or below the display panel (see the following description). Fig.14 and Fig.15The anti-peeping panel 100 can be switched between the sharing mode and the anti-peeping mode, and the viewing angle of the anti-peeping mode is smaller than that of the sharing mode. Therefore, in the sharing mode, viewers at a specific viewing angle (for example, viewers at the side of the display panel) can view the image of the display panel and / or recognize the information in the image, but in the anti-peeping mode, the anti-peeping panel 100 makes it difficult for viewers at the above-mentioned specific viewing angle to view the image of the display panel and / or recognize the information in the image. The privacy panel 100 includes a first substrate structure 110, a second substrate structure 120, a liquid crystal layer 130 and a sealant 140, wherein the first substrate structure 110 and the second substrate structure 120 are arranged opposite to each other, the liquid crystal layer 130 is arranged between the first substrate structure 110 and the second substrate structure 120, and the sealant 140 is arranged between the first substrate structure 110 and the second substrate structure 120 and surrounds the liquid crystal layer 130, so that the first substrate structure 110, the second substrate structure 120, the liquid crystal layer 130 and the sealant 140 form a liquid crystal box. In the present invention, the privacy panel 100 is a flexible privacy panel, and the first substrate structure 110 and the second substrate structure 120 are flexible substrate structures, so the privacy panel 100, the first substrate structure 110 and the second substrate structure 120 can also be respectively referred to as a flexible privacy panel 100, a first flexible substrate structure 110 and a second flexible substrate structure 120.

[0071] The first substrate structure 110 includes a first flexible substrate 111, a first stress adjustment layer 112, a first light-transmitting conductive layer 113, and a first alignment film 114. The first stress adjustment layer 112, the first light-transmitting conductive layer 113, and the first alignment film 114 are located on the surface of the first flexible substrate 111 facing the second substrate structure 120, and are sequentially disposed on the first flexible substrate 111 in a direction (i.e., direction D3) toward the second substrate structure 120, wherein the first alignment film 114 is disposed between the first light-transmitting conductive layer 113 and the liquid crystal layer 130. The second substrate structure 120 includes a second flexible substrate 121, a second stress adjustment layer 122, a second light-transmitting conductive layer 123, and a second alignment film 124. The second stress adjustment layer 122, the second light-transmitting conductive layer 123 and the second alignment film 124 are located on the surface of the second flexible substrate 121 facing the first substrate structure 110, and are sequentially arranged on the second flexible substrate 121 in a direction toward the first substrate structure 110 (i.e., a direction opposite to the direction D3), wherein the second alignment film 124 is arranged between the second light-transmitting conductive layer 123 and the liquid crystal layer 130.

[0072] The materials of the first flexible substrate 111 and the second flexible substrate 121 may include, for example, polyimide (PI), triacetyl cellulose (TAC), polyethylene terephthalate (PET), polycarbonate (PC), polymethylmethacrylate (PMMA), combinations thereof, and / or other suitable materials.

[0073] The first stress adjustment layer 112 and the second stress adjustment layer 122 have tensile stress and compressive stress, or compressive stress and tensile stress, respectively. That is, one of the first stress adjustment layer 112 and the second stress adjustment layer 122 has tensile stress and compressive stress, respectively. For the reason why one of the first stress adjustment layer 112 and the second stress adjustment layer 122 has tensile stress and compressive stress, respectively, please refer to the following. Figures 8 to 12 In the present embodiment, the first stress adjustment layer 112 and the second stress adjustment layer 122 may be insulating layers. The materials of the first stress adjustment layer 112 and the second stress adjustment layer 122 may include, for example, silicon nitride, silicon oxide, silicon oxynitride, a combination of the above and / or other suitable dielectrics. The tensile stress of the first stress adjustment layer 112 and the compressive stress of the second stress adjustment layer 122 (or the compressive stress of the first stress adjustment layer 112 and the tensile stress of the second stress adjustment layer 122) can be determined by adjusting the process parameters of the plasma enhanced chemical vapor deposition (PECVD) or other suitable deposition processes used to form the first stress adjustment layer 112 and the second stress adjustment layer 122. In some examples, the material of the first stress adjustment layer 112 is the same as the material of the second stress adjustment layer 122 (for example, both are silicon oxide or both are silicon nitride), and the process parameters for forming the first stress adjustment layer 112 are different from the process parameters for forming the second stress adjustment layer 122, so as to adjust the stress of one of the first stress adjustment layer 112 and the other of the second stress adjustment layer 122 to tensile stress and compressive stress, respectively.

[0074] The anti-peeping panel 100 has an active area 100A and a peripheral area 100B. The first light-transmitting conductive layer 113 includes a first anti-peeping electrode 113A and a connecting electrode 113B, wherein at least a portion of the first anti-peeping electrode 113A is located in the active area 100A, and the connecting electrode 113B is located in the peripheral area 100B. The second light-transmitting conductive layer 123 includes a second anti-peeping electrode 123A, and a portion and the remaining portion of the second anti-peeping electrode 123A are respectively located in the active area 100A and the peripheral area 100B. The first anti-peeping electrode 113A of the first light-transmitting conductive layer 113 and the second anti-peeping electrode 123A of the second light-transmitting conductive layer 123 can be used as electrodes for driving the liquid crystal layer 130. By controlling the voltage difference between the first anti-peeping electrode 113A and the second anti-peeping electrode 123A, the electric field between the first anti-peeping electrode 113A and the second anti-peeping electrode 123A can be adjusted, so that the liquid crystal molecules in the liquid crystal layer 130 rotate accordingly, thereby reducing the amount of light emitted at a specific angle and causing the anti-peeping panel 100 to enter the anti-peeping mode. For example, when at least one of the first anti-peeping electrode 113A and the second anti-peeping electrode 123A is floating, or when the voltage difference between the first anti-peeping electrode 113A and the second anti-peeping electrode 123A is 0, the anti-peeping panel 100 enters the sharing mode; and when the absolute value of the voltage difference between the first anti-peeping electrode 113A and the second anti-peeping electrode 123A is greater than a specific value, the anti-peeping panel 100 enters the anti-peeping mode. The first light-transmitting conductive layer 113 and the second light-transmitting conductive layer 123 may include a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), antimony tin oxide (ATO), fluorine tin oxide (FTO), tin oxide, zinc oxide, graphene or other suitable transparent conductive materials, but are not limited thereto. In other embodiments, at least one of the first light-transmitting conductive layer 113 and the second light-transmitting conductive layer 123 may include a metal mesh.

[0075] The first alignment film 114 and the second alignment film 124 both have a predetermined alignment direction, so that the liquid crystal molecules in the liquid crystal layer 130 are arranged at a predetermined tilt angle. Depending on the type and driving method of the liquid crystal molecules, the alignment directions of the first alignment film 114 and the second alignment film 124 may be parallel or non-parallel, or the first alignment film 114 and the second alignment film 124 may both have multiple alignment directions, but are not limited thereto. The material of the first alignment film 114 and the second alignment film 124 may include polyimide and / or other suitable materials. The liquid crystal molecules in the liquid crystal layer 130 may be, for example, nematic liquid crystal molecules, smectic liquid crystal molecules, cholesterol liquid crystal molecules, or other suitable liquid crystal molecules.

[0076] The sealant 140 is located in the peripheral area 100B and is used to bond the first substrate structure 110 and the second substrate structure 120, and the liquid crystal layer 130 is located in the space formed by the first substrate structure 110, the second substrate structure 120 and the sealant 140. In this embodiment, the sealant 140 is a conductive sealant, which may include conductive particles 140A. Figure 1 As shown, the connecting electrode 113B of the first light-transmitting conductive layer 113, the frame glue 140 and the second anti-peeping electrode 123A of the second light-transmitting conductive layer 123 overlap with each other in the direction D3, and the frame glue 140 includes conductive particles 140A, so the voltage signal can be transmitted to the second anti-peeping electrode 123A of the second substrate structure 120 via the connecting electrode 113B of the first substrate structure 110 and the conductive particles 140A in the frame glue 140.

[0077] In some examples, the privacy panel 100 may further include a spacer (not shown), which is disposed between the first flexible substrate 111 and the second flexible substrate 121 and located in the liquid crystal layer 130, and is used to control the thickness and uniformity of the privacy panel 100. The material of the spacer may be glass fiber, photoresist (such as photosensitive resin) and / or other suitable materials, but is not limited thereto. The spacer may have a columnar shape, a spherical shape, a combination of the above and / or other suitable shapes.

[0078] In addition, in some examples, the anti-peep panel 100 may further include a light shielding layer 125, which is disposed in the peripheral area 100B of the anti-peep panel 100 to prevent the peripheral area 100B of the anti-peep panel 100 from being transparent. The material of the light shielding layer 125 may include, for example, black resin, chrome or chromium oxide, or other opaque materials. In the present embodiment, the light shielding layer 125 is disposed in the second substrate structure 120, but is not limited thereto. In addition, in some embodiments, the anti-peep panel 100 may not include the light shielding layer 125 (for example, other elements of the anti-peep display device are used to shield the peripheral area 100B of the anti-peep panel 100).

[0079] Figure 2A FIG. 1 is a plan view of the first flexible substrate 111 and the first light-transmitting conductive layer 113 of the first substrate structure 110 . Figure 2B FIG. 1 is a plan view of the sealant 140 in the privacy panel 100 . Figure 2C 1 is a plan view of the second flexible substrate 121 and the second light-transmitting conductive layer 123 of the second substrate structure 120 . Figure 3 is a schematic top view of the anti-peep panel 100. The above-mentioned plan view and top view refer to schematic views of the first flexible substrate 111, the first light-transmitting conductive layer 113, the second flexible substrate 121, the second light-transmitting conductive layer 123, the frame glue 140 and the anti-peep panel 100 on the plane formed by the directions D1 and D2, as viewed from the direction D3. Figure 4A and Figure 4BAlong Figure 3 Schematic diagram of the cross-section of the A-A' cutting line and the B-B' cutting line. In order to make the drawings simple, Figure 4A and Figure 4B Omit the illustration such as Figure 1 The light shielding layer 125 is shown. In addition, Figure 1 Can be along Figure 3 Schematic cross-sectional view of the C-C' cutting line.

[0080] To keep the figures simple, Figure 2A Only the first flexible substrate 111 and the first light-transmissive conductive layer 113 in the first substrate structure 110 are shown, while the first stress adjustment layer 112 and the first alignment film 114 in the first substrate structure 110 are omitted. Figure 2A As shown, the first light-transmitting conductive layer 113 is located on the first flexible substrate 111 and includes a first anti-peeping electrode 113A, a connecting electrode 113B, a first connecting pad 113C, a second connecting pad 113D and a connecting line 113E, wherein at least a portion of the first anti-peeping electrode 113A is located in the active area 100A ( Figure 2A In the example of a part of the first anti-peeping electrode 113A and the rest of the first anti-peeping electrode 113A being located in the active area 100A and the peripheral area 100B, respectively, the connecting electrode 113B, the first connecting pad 113C, the second connecting pad 113D and the connecting line 113E are located in the peripheral area 100B, and the two ends of the connecting line 113E are connected to the first anti-peeping electrode 113A and the first connecting pad 113C, respectively. The connecting electrode 113B surrounds the first anti-peeping electrode 113A and is connected to the second connecting pad 113D. The first anti-peeping electrode 113A and the connecting electrode 113B are electrically insulated from each other.

[0081] like Figure 2B As shown, the sealant 140 is located in the peripheral area 100B and surrounds the active area 100A. In this embodiment, the sealant 140 is a conductive sealant, which includes: Figure 1 Conductive particles 140A.

[0082] Figure 2C Only the second flexible substrate 121 and the second light-transmitting conductive layer 123 in the second substrate structure 120 are shown, while the second stress adjustment layer 122, the second alignment film 124 and the light shielding layer 125 in the second substrate structure 120 are omitted. Figure 2BAs shown, the second light-transmissive conductive layer 123 is located on the second flexible substrate 121 and includes a second anti-peeping electrode 123A, and the second anti-peeping electrode 123A extends from the active area 100A to the peripheral area 100B (i.e., a portion and the remaining portion of the second anti-peeping electrode 123A are respectively located in the active area 100A and the peripheral area 100B). In addition, in the direction D2, the length of the first flexible substrate 111 is greater than the length of the second flexible substrate 121, so that the first substrate structure 110 and the second substrate structure 120 are assembled through the sealant 140 to form a Figure 3 After the anti-peep panel 100 is shown, the first connection pad 113C and the second connection pad 113D are not covered by the second flexible substrate 121 (eg, Figure 3 As shown), a circuit board or a chip (not shown) can electrically connect the first connection pad 113C and the second connection pad 113D.

[0083] like Figure 3 and Figure 4A As shown, the circuit board or chip (not shown) can transmit the first voltage signal S1 to the first connection pad 113C, and the first voltage signal S1 is transmitted to the first anti-peeping electrode 113A via the connection line 113E. Figure 2A , Figure 2C , Figure 3 and Figure 4A As shown, the second anti-peeping electrode 123A has a notch 123R, which corresponds to the connection line 113E in the first light-transmitting conductive layer 113 (ie, the first substrate structure 110 and the second substrate structure 120 are assembled via the sealant 140 to form a Figure 3 In the illustrated privacy panel 100, the notch 123R overlaps with the connecting line 113E in the direction D3 to prevent the connecting line 113E from being electrically connected to the second privacy electrode 123A in the second light-transmitting conductive layer 123 via the conductive particles 140A in the sealant 140, thereby preventing the second privacy electrode 123A in the second light-transmitting conductive layer 123 from being short-circuited with the first privacy electrode 113A in the first light-transmitting conductive layer 113.

[0084] like Figure 3 and Figure 4BAs shown, after the first substrate structure 110 and the second substrate structure 120 are assembled to form the anti-peeping panel 100 via the sealant 140, the sealant 140 overlaps with the second anti-peeping electrode 123A in the second light-transmitting conductive layer 123 and the connecting electrode 113B in the first light-transmitting conductive layer 113 in the top-view direction (i.e., direction D3) of the anti-peeping panel 100, so that the connecting electrode 113B is electrically connected to the second anti-peeping electrode 123A in the second light-transmitting conductive layer 123 via the conductive particles 140A in the sealant 140, so that the circuit board or chip (not shown) can transmit the second voltage signal S2 to the second connecting pad 113D, and the second voltage signal S2 is transmitted to the second anti-peeping electrode 123A via the connecting electrode 113B and the conductive particles 140A in the sealant 140.

[0085] like Figure 4A and Figure 4B As shown, the first voltage signal S1 is transmitted to the first anti-peeping electrode 113A via the first connecting pad 113C and the connecting line 113E, and the second voltage signal S2 is transmitted to the second anti-peeping electrode 123A via the second connecting pad 113D, the connecting electrode 113B and the conductive particles 140A in the frame glue 140, so as to form an electric field between the first anti-peeping electrode 113A and the second anti-peeping electrode 123A, so that the liquid crystal molecules in the liquid crystal layer 130 are rotated due to the action of the electric field.

[0086] It should be noted that the patterns of the first light-transmitting conductive layer 113, the sealant 140 and the second light-transmitting conductive layer 123 of this embodiment are not Figure 2A , Figure 2B and Figure 2C The present invention is limited to the plan view of the first light-transmitting conductive layer 113, the sealant 140 and the second light-transmitting conductive layer 123. In addition, the present invention does not limit the planar shape of the anti-peeping panel 100, and the anti-peeping panel 100 can be rectangular or non-rectangular.

[0087] Figure 5 FIG. 1 is a partial cross-sectional diagram of a privacy protection panel 100 ′ according to a second embodiment of the present invention. Figure 5 Privacy panel 100' with Figure 1 The difference of the privacy panel 100 is that Figure 5 In the anti-peep panel 100', the first light-transmitting conductive layer 113' does not include the connecting electrode 113B of the first embodiment, and the second anti-peep electrode 123A of the second light-transmitting conductive layer 123 can be electrically connected to the connecting pad (not shown) of the first substrate structure 110' via a conductive adhesive (not shown), so that the voltage signal can be transmitted to the second anti-peep electrode 123A of the second light-transmitting conductive layer 123 via the connecting pad of the first substrate structure 110' and the conductive adhesive, so the frame glue 140' of this embodiment can be a non-conductive frame glue. The other elements of the anti-peep panel 100' are the same as those of the anti-peep panel 100, so please refer to the previous paragraph for the relevant description, which will not be repeated here.

[0088] Next, we will Figures 6 to 9 Example Figure 1 A method for manufacturing an anti-peep panel 100. Figure 6 The method of forming the first substrate structure 110 is shown. First, a carrier C1 (or may be referred to as the first carrier C1) is provided, and the first substrate structure 110 is formed on the carrier C1 (i.e., a first flexible substrate 111, a first stress adjustment layer 112, a first light-transmitting conductive layer 113, and a first alignment film 114 are sequentially arranged on the carrier C1). The carrier C1 may be a rigid substrate, such as a glass substrate or other suitable substrate. The carrier C1 may be used to carry the first flexible substrate 111, so as to sequentially perform a process of forming the first stress adjustment layer 112, the first light-transmitting conductive layer 113, and the first alignment film 114 on the first flexible substrate 111. In the present embodiment, the first flexible substrate 111 may be formed on the carrier C1 by a coating process, a deposition process, or other suitable process; or the first flexible substrate 111 may be arranged on the carrier C1 via an adhesive layer (such as a thermally degradable adhesive, a UV adhesive, or other suitable adhesive layer). The first stress adjustment layer 112 can be formed by, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD) or other suitable deposition processes, and the first light-transmitting conductive layer 113 can be formed by, for example, physical vapor deposition, evaporation, sputtering and / or other suitable deposition methods. The first alignment film 114 can be formed by coating polyimide or other suitable materials. Then, the coated first alignment film 114 is subjected to a friction process to form grooves arranged in a specific direction in the first alignment film 114. However, the method of aligning the first alignment film 114 in the present invention is not limited to this.

[0089] Figure 7The method of forming the second substrate structure 120 is shown. First, a carrier C2 (or may be referred to as a second carrier C2) is provided, and the second substrate structure 120 is formed on the carrier C2 (i.e., a second flexible substrate 121, a second stress adjustment layer 122, a second light-transmitting conductive layer 123, and a second alignment film 124 are sequentially arranged on the carrier C2). The carrier C2 may be a rigid substrate, such as a glass substrate or other suitable substrate. The carrier C2 may be used to carry the second flexible substrate 121, so as to sequentially perform the process of forming the second stress adjustment layer 122, the second light-transmitting conductive layer 123, and the second alignment film 124 on the second flexible substrate 121. The second flexible substrate 121 is disposed on the carrier C2 in a manner similar to the manner in which the first flexible substrate 111 is disposed on the carrier C1, and the second flexible substrate 121, the second stress adjustment layer 122, the second light-transmitting conductive layer 123, and the second alignment film 124 are formed in a manner similar to the manner in which the first flexible substrate 111, the first stress adjustment layer 112, the first light-transmitting conductive layer 113, and the first alignment film 114 are formed, and are not further described herein.

[0090] In addition, if Figure 7 As shown, a light shielding layer 125 may be further formed on the second flexible substrate 121. The light shielding layer 125 may be formed by, for example, coating, developing, etching and / or other suitable methods.

[0091] Figure 8 A method for assembling the first substrate structure 110 and the second substrate structure 120 to bond with each other is shown. For example, first, a sealant 140 is formed on one of the first substrate structure 110 and the second substrate structure 120, and liquid crystal molecules are injected into the area surrounded by the sealant 140 to form a liquid crystal layer 130. Then, the first substrate structure 110 and the second substrate structure 120 are assembled with each other so that the first substrate structure 110 and the second substrate structure 120 are assembled by the sealant 140 to form an anti-peep panel 100, wherein the liquid crystal layer 130 of the anti-peep panel 100 is located in the space formed by the first substrate structure 110, the second substrate structure 120 and the sealant 140, but is not limited thereto. In other embodiments, the sealant 140 formed on one of the first substrate structure 110 and the second substrate structure 120 has an opening, and the liquid crystal layer 130 is formed by injecting liquid crystal into the area surrounded by the sealant 140 through the opening after the first substrate structure 110 and the second substrate structure 120 are assembled by the sealant 140, and then sealing the opening of the sealant 140 to form the anti-peep panel 100.

[0092] like Fig. 9 As shown, after the first substrate structure 110 and the second substrate structure 120 are assembled by the sealant 140, the carriers C1 and C2 are removed to form a Figure 1The anti-peep panel 100 shown. The method of removing the carriers C1 and C2 may be, for example but not limited to, laser stripping, mechanical stripping, thermal dissociation, UV light stripping, a combination of the above and / or other suitable methods, so as to strip the carrier C1 from the surface of the first flexible substrate 111 facing away from the second substrate structure 120 (i.e., separate the carrier C1 from the first flexible substrate 111), and strip the carrier C2 from the surface of the second flexible substrate 121 facing away from the first substrate structure 110 (i.e., separate the carrier C2 from the second flexible substrate 121), so as to form a Figure 1 The privacy panel 100 is shown.

[0093] Figure 5 The method for making the anti-peep panel 100' is similar to Figure 1 The manufacturing method of the anti-peep panel 100 is not described in detail.

[0094] Since both the first flexible substrate 111 and the second flexible substrate 121 are flexible substrates, after removing the carriers C1 and C2, the first flexible substrate 111 and the second flexible substrate 121 may bend in opposite directions due to the stress of the film layer formed on the first flexible substrate 111 and the stress of the film layer formed on the second flexible substrate 121, and the sealant 140 may be subjected to the pulling force in opposite directions and crack or even break, causing the liquid crystal in the liquid crystal layer 130 to flow out, resulting in the failure of the production of the anti-peep panel 100. For example, if Fig.10 As shown, if both the first stress adjustment layer 112 and the second stress adjustment layer 122 have compressive stress characteristics, after removing the carriers C1 and C2, the first flexible substrate 111 and the first stress adjustment layer 112 bend downward (i.e., bend in the opposite direction of direction D3), and the second flexible substrate 121 and the second stress adjustment layer 122 bend upward (i.e., bend in the direction D3), so that the sealant 140 is simultaneously subjected to tension in opposite directions (i.e., the opposite direction of direction D3 and direction D3) from the first substrate structure 110 and the second substrate structure 120. If the tension in the opposite direction exceeds the deformation resistance of the sealant 140, the sealant 140 will be cracked or even broken.

[0095] In view of this, the present invention proposes adjusting the stress characteristics of the first stress adjustment layer 112 and the second stress adjustment layer 122 to prevent the sealant 140 from being subjected to tension in opposite directions and causing cracks or even breakage. Fig.11 and Fig.12 1 and 2 are different examples in which the first stress adjustment layer 112 and the second stress adjustment layer 122 have different stress characteristics. Fig.11In the embodiment, the first stress adjustment layer 112 and the second stress adjustment layer 122 have compressive stress characteristics and tensile stress characteristics, respectively. Therefore, after removing the carriers C1 and C2, the first flexible substrate 111 and the first stress adjustment layer 112 bend downward, and the second flexible substrate 121 and the second stress adjustment layer 122 also bend downward, so that the sealant 140 is simultaneously subjected to the pulling force and pushing force in the same direction (i.e., the opposite direction of the direction D3) from the first substrate structure 110 and the second substrate structure 120, respectively, to avoid the following problems: Fig.10 The sealant 140 is simultaneously subjected to pulling forces in opposite directions, causing cracks or breaks in the sealant 140. Fig.12 In the embodiment, the first stress adjustment layer 112 and the second stress adjustment layer 122 have tensile stress characteristics and compressive stress characteristics respectively, and after the carriers C1 and C2 are removed, the first flexible substrate 111 and the first stress adjustment layer 112 are bent upward, and the second flexible substrate 121 and the second stress adjustment layer 122 are also bent upward, so that the sealant 140 is simultaneously subjected to the push and pull in the same direction (i.e., direction D3) from the first substrate structure 110 and the second substrate structure 120 respectively. In summary, by Fig.11 and Fig.12 As shown in FIG. 1 , one of the first stress adjustment layer 112 and the second stress adjustment layer 122 has a compressive stress and the other has a tensile stress, respectively. After removing the carriers C1 and C2, the first flexible substrate 111 and the second flexible substrate 121 are bent in the same direction to avoid the following Fig.10 The sealant 140 is simultaneously subjected to pulling forces in opposite directions, causing cracks or breakage in the sealant 140 .

[0096] In the present embodiment, one of the first stress adjustment layer 112 and the second stress adjustment layer 122 has compressive stress and tensile stress respectively, and the absolute value of the stress of the first stress adjustment layer 112 is preferably 0.5 to 2 times the absolute value of the stress of the second stress adjustment layer 122, so that the curling degree of the first substrate structure 110 and the second substrate structure 120 will not differ too much, so as to avoid making the anti-peep panel 100 difficult to manufacture, but not limited to this. For example, if the tensile stress of the first stress adjustment layer 112 is 200 megapascals (MPa), the compressive stress of the second stress adjustment layer 122 can be -100 MPa to -400 MPa.

[0097] The stress characteristics of the first stress adjustment layer 112 and the second stress adjustment layer 122 can be determined by using different materials and / or different process parameters. For example, the first stress adjustment layer 112 and the second stress adjustment layer 122 can include the same material (for example, the first stress adjustment layer 112 and the second stress adjustment layer 122 are both silicon nitride SiNx), and the first stress adjustment layer 112 and the second stress adjustment layer 122 can both be formed by a chemical vapor deposition process (for example, plasma-assisted chemical vapor deposition), but the process parameters of the chemical vapor deposition process used to form the first stress adjustment layer 112 (hereinafter referred to as the first chemical vapor deposition process) are different from the process parameters of the chemical vapor deposition process used to form the second stress adjustment layer 122 (hereinafter referred to as the second chemical vapor deposition process). The process parameters may include a gas mixing ratio, a radio frequency power, a deposition rate, and / or other parameters that may affect the stress characteristics of the formed element. The gas mixing ratio, RF power and / or deposition rate of the first chemical vapor deposition process may be different from the gas mixing ratio, RF power and / or deposition rate of the second chemical vapor deposition process, respectively, so that the first stress adjustment layer 112 and the second stress adjustment layer 122 have different stress characteristics, for example Fig.11 The first stress adjustment layer 112 and the second stress adjustment layer 122 shown in the figure have compressive stress and tensile stress respectively, or Fig.12 The first stress adjustment layer 112 and the second stress adjustment layer 122 shown have tensile stress and compressive stress, respectively. For example, the first stress adjustment layer 112 can be formed using a first chemical vapor deposition process, which has a compressive stress of -199.8 MPa, and the second stress adjustment layer 122 can be formed using a second chemical vapor deposition process, which has a tensile stress of 211.6 MPa.

[0098] Fig.13 The relationship between the radio frequency power and the stress characteristics of the film layer formed by the plasma-assisted chemical vapor deposition process is shown, wherein the film layer is a silicon nitride (SiNx) layer or a silicon oxide (SiOx) layer. Fig.13 As shown in FIG. 1 , in some examples, the stress value corresponding to the power value W0 is 0, the stress characteristic of the film layer formed by the RF power greater than the power value W0 is compressive stress, and the stress characteristic of the film layer formed by the RF power less than the power value W0 is tensile stress, and the greater the difference between the RF power and the power value W0, the greater the absolute value of the compressive stress (or tensile stress) corresponding to the RF power. Therefore, according to Fig.13 As shown in the relationship between the RF power and the stress characteristics of the film layer, the first stress adjustment layer 112 and the second stress adjustment layer 122 can respectively select corresponding RF powers so that one of the first stress adjustment layer 112 and the other of the second stress adjustment layer 122 has compressive stress and tensile stress, respectively.

[0099] Further, as mentioned above, the absolute value of the stress of the first stress adjustment layer 112 is preferably 0.5 to 2 times the absolute value of the stress of the second stress adjustment layer 122. Therefore, by adjusting the gas mixing ratio, RF power and / or deposition rate of the first chemical vapor deposition process and the second chemical vapor deposition process, the absolute value of the tensile stress (or compressive stress) of the first stress adjustment layer 112 is 0.5 to 2 times the absolute value of the compressive stress (or tensile stress) of the second stress adjustment layer 122. For example, according to Fig.13 As shown in the figure, the relationship between the RF power and the stress characteristics of the film layer, the first stress adjustment layer 112 and the second stress adjustment layer 122 can respectively select corresponding RF powers so that one of the first stress adjustment layer 112 and the second stress adjustment layer 122 has compressive stress and tensile stress respectively, and the absolute value of the stress of the first stress adjustment layer 112 is 0.5 to 2 times the absolute value of the stress of the second stress adjustment layer 122.

[0100] In some embodiments, the first light-transmitting conductive layer 113 and the second light-transmitting conductive layer 123 also have stress characteristics (compressive stress or tensile stress). In these embodiments, in order to prevent the sealant 140 from being subjected to tension in opposite directions at the same time and causing cracks or breaks in the sealant 140 after the carriers C1 and C2 are removed, in addition to the first light-transmitting conductive layer 113 and the second light-transmitting conductive layer 123 having compressive stress or tensile stress respectively, the sum of the stresses of the first stress adjustment layer 112 and the first light-transmitting conductive layer 113 is one of the compressive stress and the tensile stress, and the sum of the stresses of the second stress adjustment layer 122 and the second light-transmitting conductive layer 123 is the other of the compressive stress and the tensile stress, so that after the carriers C1 and C2 are removed, the first flexible substrate 111 and the second flexible substrate 121 are bent in the same direction. In addition, the absolute value of the sum of stresses (e.g., compressive stress or tensile stress) of the first stress adjustment layer 112 and the first light-transmitting conductive layer 113 is preferably 0.5 to 2 times the absolute value of the sum of stresses (e.g., tensile stress or compressive stress) of the second stress adjustment layer 122 and the second light-transmitting conductive layer 123. For example, if the compressive stress of the first stress adjustment layer 112 is -200 MPa, and the tensile stresses of the first light-transmitting conductive layer 113 and the second light-transmitting conductive layer 123 are both 50 MPa (the sum of stresses of the first stress adjustment layer 112 and the first light-transmitting conductive layer 113 is -150 MPa), the tensile stress of the second stress adjustment layer 122 may be 25 MPa to 250 MPa, so that the sum of stresses of the second stress adjustment layer 122 and the second light-transmitting conductive layer 123 is 75 MPa to 300 MPa. In summary, in this embodiment, the sum of stresses of the first stress adjustment layer 112 and the first light-transmitting conductive layer 113 is the first stress sum, the sum of stresses of the second stress adjustment layer 122 and the second light-transmitting conductive layer 123 is the second stress sum, one of the first stress sum and the second stress sum is greater than 0 and less than 0, respectively, and the absolute value of the first stress sum is preferably 0.5 to 2 times the absolute value of the second stress sum.

[0101] Fig.14Schematic diagram of an anti-peeping display device 10 according to a third embodiment of the present invention. The anti-peeping display device 10 comprises an anti-peeping panel 100, a display panel 200 and a backlight module 300, wherein the anti-peeping panel 100 is disposed on the light-emitting side of the display panel 200, and the backlight module 300 is disposed on the light-incident side of the display panel 200 to serve as a light source for the display panel 200. The anti-peeping panel 100 is used to provide an anti-peeping function. In other embodiments, the anti-peeping panel 100 is replaced by an anti-peeping panel 100'. The display panel 200 can be various types of liquid crystal display panels, such as twisted nematic (TN) liquid crystal display panels, vertical alignment (VA) liquid crystal display panels, in-plane switching (IPS) liquid crystal display panels, fringe field switching (FFS) liquid crystal display panels or other suitable types of liquid crystal display panels, or for example, electrophoretic display panels and electronic paper, but not limited thereto. In other embodiments, the anti-peeping display device 10 does not have a backlight module 300, and the display panel 200 is a self-luminous display panel, such as an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED) display panel, a micro LED display panel, a quantum dot LED (QDLED) or other suitable display panels. The backlight module 300 can be. The backlight module 150 can be, for example, a direct type backlight module, an edge lit backlight module or other types of backlight modules, and its light-emitting element can be a light-emitting diode, a cold cathode fluorescent lamp (CCFL) or other suitable elements.

[0102] The anti-peeping display device 10 may have a normal display state and an anti-peeping display state. In the normal display state, the anti-peeping function of the anti-peeping panel 100 is turned off (i.e., the anti-peeping panel 100 is in sharing mode), so that the anti-peeping display device 10 has a first viewing angle range VA1, and the user can view the anti-peeping display device 10 within the first viewing angle range VA1. In the anti-peeping display state, the anti-peeping function of the anti-peeping panel 100 is turned on (i.e., the anti-peeping panel 100 is in anti-peeping mode), so that the anti-peeping display device 10 has a second viewing angle range VA2 smaller than the first viewing angle range VA1, and the user can view the anti-peeping display device 10 within the second viewing angle range VA2. In this way, after the anti-peeping function is turned on, users at certain specific angles (for example, within the first viewing angle range VA1 but outside the second viewing angle range VA2) will not be able to see or will have difficulty in clearly seeing the display screen of the anti-peeping display device 10.

[0103] Fig.15 Schematic diagram of an anti-peeping display device 20 according to a fourth embodiment of the present invention. Similar to the anti-peeping display device 10, the anti-peeping display device 20 includes an anti-peeping panel 100, a display panel 200 and a backlight module 300. In other embodiments, the anti-peeping panel 100 is replaced by an anti-peeping panel 100'. The difference between the anti-peeping display devices 10 and 20 is that in the anti-peeping display device 20, the backlight module 300 is arranged on the light incident side of the anti-peeping panel 100 (i.e., the bottom surface of the first flexible substrate 111), and the display panel 200 is arranged on the light emitting side of the anti-peeping panel 100 (i.e., the top surface of the second flexible substrate 121), that is, the anti-peeping panel 100 is arranged on the light incident side of the display panel 200. The backlight module 300 also serves as the light source of the display panel 200, and the anti-peeping panel 100 is also used to provide an anti-peeping function. Please refer to the previous paragraphs for the description of the anti-peeping panel 100, the display panel 200 and the backlight module 300, which will not be repeated here. Fig.14 and Fig.15 The example is taken that any one of the first viewing angle range VA1 and the second viewing angle range VA2 is symmetrical to the direction D3, but the present invention is not limited thereto. For example, the second viewing angle range VA2 may be asymmetrical to the direction D3 (for example, the second viewing angle range VA2 is biased toward Fig.14 and Fig.15 left or right of direction D3).

[0104] In summary, the present invention can avoid the occurrence of cracks or breaks in the production of the anti-peeping panel and the anti-peeping display device, thereby effectively improving the production yield, by designing special stress characteristics such as compressive stress and tensile stress for the anti-peeping panel.

[0105] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the attached claims.

Claims

1. A privacy panel, characterized in that: Include: A first substrate structure, comprising a first flexible substrate, a first stress adjustment layer and a first light-transmitting conductive layer; a second substrate structure, comprising a second flexible substrate, a second stress adjustment layer and a second light-transmissive conductive layer, wherein the second substrate structure and the first substrate structure are arranged opposite to each other; a liquid crystal layer disposed between the first substrate structure and the second substrate structure, wherein the first stress adjustment layer and the first light-transmitting conductive layer are disposed between the first flexible substrate and the liquid crystal layer, and the second stress adjustment layer and the second light-transmitting conductive layer are disposed between the second flexible substrate and the liquid crystal layer; as well as A frame glue is disposed between the first substrate structure and the second substrate structure and surrounds the liquid crystal layer; The stress of one of the first stress adjustment layer and the second stress adjustment layer is tensile stress, and the stress of the other of the first stress adjustment layer and the second stress adjustment layer is compressive stress.

2. The privacy panel according to claim 1, wherein: The absolute value of the tensile stress is 0.5 to 2 times the absolute value of the compressive stress.

3. The privacy panel according to claim 1, wherein: The material of the first stress adjustment layer and the second stress adjustment layer includes at least one of silicon nitride and silicon oxide.

4. The privacy panel according to claim 1, wherein: Process parameters for forming the first stress adjustment layer are different from process parameters for forming the second stress adjustment layer.

5. The privacy panel according to claim 4, wherein: The first stress adjustment layer is formed via a first chemical vapor deposition process, and the second stress adjustment layer is formed via a second chemical vapor deposition process, wherein a gas mixing ratio of the first chemical vapor deposition process is different from a gas mixing ratio of the second chemical vapor deposition process, a radio frequency power of the first chemical vapor deposition process is different from a radio frequency power of the second chemical vapor deposition process, or a deposition rate of the first chemical vapor deposition process is different from a deposition rate of the second chemical vapor deposition process.

6. The privacy panel according to claim 1, wherein: The materials of the first flexible substrate and the second flexible substrate include polyimide, cellulose triacetate, polyethylene terephthalate, polycarbonate, polymethyl methacrylate or a combination thereof.

7. The privacy panel according to claim 1, wherein: The stress value of the first light-transmitting conductive layer and the stress value of the second light-transmitting conductive layer are not 0, the sum of the stress of the first stress adjustment layer and the stress of the first electrode layer is the first stress sum, the sum of the stress of the second stress adjustment layer and the stress of the second light-transmitting conductive layer is the second stress sum, and one of the first stress sum and the second stress sum is greater than 0 and less than 0, respectively.

8. The privacy panel according to claim 1, wherein: The material of the first light-transmitting conductive layer and the second light-transmitting conductive layer includes indium tin oxide or indium zinc oxide.

9. An anti-peeping display device, characterized in that: Include: The privacy panel as claimed in claim 1; and a display panel; The anti-peep panel is arranged on the light incident side or the light emitting side of the display panel.

10. A method for manufacturing an anti-peep panel, characterized in that: Include: A first substrate structure is formed on a first carrier, wherein the first substrate structure includes a first flexible substrate, a first stress adjustment layer and a first light-transmissive conductive layer; Forming a second substrate structure on a second carrier, wherein the second substrate structure includes a second flexible substrate, a second stress adjustment layer and a second light-transmissive conductive layer; The first substrate structure and the second substrate structure are assembled by a sealant, wherein the sealant is disposed between the first substrate structure and the second substrate structure, a liquid crystal layer is disposed in a space formed by the first substrate structure, the second substrate structure and the sealant, the first stress adjustment layer and the first light-transmitting conductive layer are disposed between the first flexible substrate and the liquid crystal layer, and the second stress adjustment layer and the second light-transmitting conductive layer are disposed between the second flexible substrate and the liquid crystal layer; as well as removing the first carrier board and the second carrier board; The stress of one of the first stress adjustment layer and the second stress adjustment layer is tensile stress, and the stress of the other of the first stress adjustment layer and the second stress adjustment layer is compressive stress.

11. The method according to claim 10, characterized in that: After the first carrier plate and the second carrier plate are removed, the first flexible substrate and the second flexible substrate are bent in the same direction.

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