Server and server heat dissipation device

Abstract

The invention discloses a server and a server heat dissipation device, and relates to the technical field of terminal equipment, the server heat dissipation device comprises an air outlet pipe, the air outlet pipe is movably arranged in the server, the side wall of the air outlet pipe is provided with a first air inlet and a first air outlet, and the first air outlet faces a to-be-cooled part in the server; the cooling air inlet structure is fixed in the server, and the cooling air inlet structure comprises an air inlet pipe and a cooling mechanism arranged in the air inlet pipe; and the movable connecting mechanism is rotatably connected between the air inlet pipe and the first air inlet, and is used for introducing the cooled gas into the air outlet pipe through the movable connecting mechanism when the air outlet pipe moves. According to the server heat dissipation device provided by the invention, the air outlet pipe is movably arranged, and the heat dissipation area of the cooling gas is expanded in the moving process of the air outlet pipe, so that the cooling gas can be uniformly blown to each position on the part to be subjected to heat dissipation, and the heat dissipation effect of the server is improved.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to a server and a server cooling device. Background Art

[0002] With the rapid development of information technology, servers, as core devices for data storage and processing, have been continuously improving in performance and power consumption. When servers are running under long-term high-load conditions, they will generate a lot of heat. If the heat cannot be dissipated in time, the internal temperature of the server will rise, affecting the stability and service life of the server. Therefore, how to effectively dissipate heat from the server has become an urgent problem to be solved.

[0003] Traditional server cooling methods mostly use fans to remove the heat inside the server and discharge it outside the server. However, this method has problems such as uneven heat dissipation, high noise, and high energy consumption. Especially when the internal layout of the server is complex and the heat dissipation requirements are uneven, traditional fan cooling methods often cannot meet the requirements. Summary of the invention

[0004] The present application provides a server and a server cooling device to at least solve the problems of uneven heat dissipation, high noise and high energy consumption in the traditional server cooling method in the related art.

[0005] The present application provides a server heat dissipation device, comprising:

[0006] An air outlet duct, the air outlet duct is movably arranged in the server, and a first air inlet and a first air outlet are arranged on a side wall of the air outlet duct, and the first air outlet faces a component to be cooled in the server;

[0007] A cooling air inlet structure, wherein the cooling air inlet structure is fixed in the server and comprises an air inlet pipe and a cooling mechanism arranged in the air inlet pipe;

[0008] A movable connecting mechanism is rotatably connected between the air inlet pipe and the first air inlet, and is used to pass the cooled gas into the air outlet pipe through the movable connecting mechanism when the air outlet pipe moves.

[0009] The cooling mechanism of the server heat dissipation device provided by the present application cools the air passing through the air inlet pipe to generate cooling gas, and the cooling gas is transported to the air outlet pipe through the movable connection mechanism, and blown out from the first air outlet of the air outlet pipe, directly blowing to the heat dissipation components inside the server to cool and dissipate the heat. The air outlet pipe is movably arranged, and the heat dissipation area of ​​the cooling gas is expanded during the movement of the air outlet pipe, so that the cooling gas can be evenly blown to each position on the heat dissipation component, thereby improving the heat dissipation effect of the server. At the same time, the heat dissipation device does not use a fan, has low noise and low energy consumption.

[0010] In some embodiments, the air inlet pipe includes a first air inlet duct, a first cold air duct and a first hot air duct connected to the first air inlet duct, the cooling mechanism is arranged in the first air inlet duct, the first cold air duct is connected to the movable connection mechanism, and the first hot air duct is used to exhaust gas;

[0011] The cooling mechanism includes an air pump and a vortex tube cooler. The air pump is used to pass external air into the first air inlet duct. The vortex tube cooler separates the passing gas into cooling gas and high-temperature gas. The cooling gas is passed into the first cold air duct, and the high-temperature gas is passed into the first hot air duct.

[0012] The vortex tube cooler uses compressed air to expand and accelerate after entering a special nozzle, forming a high-speed rotating vortex. In the vortex tube, the airflow separates due to the conservation of angular momentum, the central airflow speed slows down and the temperature decreases, forming cooling gas; the peripheral airflow speed decreases and the temperature increases, forming high-temperature gas. The cooling gas is introduced into the first cold air duct, and then into the air outlet duct through the mobile connection mechanism, and finally blown to the heat dissipation component, while the high-temperature gas enters the first hot air duct for other purposes or is directly discharged from the server. The vortex tube cooler has a significant cooling effect and can reduce the temperature of compressed air by more than ten degrees Celsius or more. It does not require refrigerant and only relies on compressed air to work, which is energy-saving and environmentally friendly. At the same time, the vortex tube cooler has a simple structure, no moving parts, easy maintenance, and high reliability.

[0013] In some embodiments, the first air inlet duct and the first hot air duct are coaxially arranged and parallel to the moving direction of the air outlet duct, and the first cold air duct is arranged perpendicular to the first air inlet duct, so as to optimize the spatial layout of the heat dissipation device and the airflow path of the cooling gas.

[0014] In some embodiments, a filter mechanism is further included, the filter mechanism including a sleeve shaft tube, a filter material and an air pump, the sleeve shaft tube is connected to the air outlet of the first hot air duct, the filter material and the air pump are both arranged in the sleeve shaft tube. The filter mechanism is used to filter the discharged high-temperature gas to reduce environmental pollution.

[0015] In some embodiments, a sliding mechanism is provided in the server, the air outlet pipe is connected to the sliding mechanism, and the air outlet pipe is arranged vertically and moves in a horizontal direction. The setting of the sliding mechanism can realize the horizontal movement of the air outlet pipe in the server, thereby improving the heat dissipation effect.

[0016] In some embodiments, the movable connection mechanism includes at least two drainage tubes, and two adjacent drainage tubes are rotationally connected and communicated. The two drainage tubes are rotationally connected and communicated, which can realize the horizontal movement of the air outlet pipe on the one hand, avoiding the restriction of the fixed connection on the air outlet pipe, and can also realize the drainage of cooling gas, and drain the cooling gas formed by the air inlet pipe into the air outlet pipe.

[0017] In some embodiments, the drainage tube includes a first drainage main pipe and two first drainage branch pipes, the two first drainage branch pipes are respectively connected to both ends of the first drainage main pipe and are arranged perpendicular to the first drainage main pipe, and the two first drainage branch pipes are arranged parallel to each other;

[0018] At least two of the drainage tubes are arranged in sequence along the axial direction of the first drainage main tube, and the two adjacent drainage tubes are rotatably connected and communicated through a first drainage branch tube on each of them; the two drainage tubes at both ends are rotatably connected to the first air inlet and the cooling air inlet mechanism through the first drainage branch tube respectively.

[0019] In some embodiments, an exhaust mechanism is further included, the exhaust mechanism including an exhaust pipe and a one-way sheet arranged in the exhaust pipe, one end of the exhaust pipe is inserted into the server, and the other end is located outside the server, the one-way sheet is used to limit the airflow direction in the exhaust pipe, and is used to exhaust the excess gas in the server to the outside to maintain the air pressure balance inside the server.

[0020] In some embodiments, a heat sink is also included, and the heat sink is arranged on the component to be cooled, and cooperates with the cooling gas to cool the component to be cooled, thereby improving the cooling effect.

[0021] The present application also provides a server, comprising the server heat dissipation device as described in any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1A front view of a server heat dissipation device provided in an embodiment of the present application;

[0024] Figure 2 for Figure 1 A partial enlarged view of point A;

[0025] Figure 3 A schematic diagram of the internal structure of a server heat dissipation device provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the connection structure between the mobile connection mechanism and the cooling air inlet structure provided in an embodiment of the present application;

[0027] Figure 5 A left view of a server heat dissipation device provided in an embodiment of the present application;

[0028] Figure 6 A three-dimensional view of a server heat dissipation device provided in an embodiment of the present application.

[0029] The above drawings include the following reference numerals:

[0030] 1. Server; 2. Air outlet duct; 3. Sliding mechanism; 4. Exhaust pipe; 41. Trumpet-shaped one-way plate; 5. Mobile connecting mechanism; 51. Drainage pipe; 52. Sleeve; 511. First drainage main duct; 512. First drainage branch duct; 6. Air inlet duct; 61. First air inlet duct; 611; Second air inlet; 62. First hot air duct; 621. Second air outlet; 623. Third air outlet; 63. First cold air duct; 7. Sleeve shaft tube; 8. Filter cotton; 9. Filter net; 10. Limiting ring; 11. Air pump; 12. Vortex tube cooler. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0034] like Figures 1 to 6 As shown, an embodiment of the present application provides a server heat dissipation device for dissipating heat from heating elements inside a server 1 .

[0035] Specifically, in some embodiments of the present application, the server heat dissipation device includes:

[0036] The air outlet duct 2 is movably arranged inside the server 1, and a first air inlet and a first air outlet 21 are arranged on the side wall of the air outlet duct 2, and the first air outlet 21 faces the components to be cooled in the server 1. The components to be cooled are generally structures such as memory and motherboard. The first air outlet 21 is arranged toward the components to be cooled, so that the cooling gas can be directly blown to the components to be cooled, and the cooling gas can be directly cooled by the components to be cooled. The air outlet duct 2 is movably arranged, which increases the coverage of the cooling gas.

[0037] A cooling air inlet structure is fixed in the server 1 and includes an air inlet pipe 6 and a cooling mechanism disposed in the air inlet pipe 6; the cooling mechanism is used to cool the gas in the air inlet pipe 6 to generate cooling gas, and provide cooling gas for the air outlet pipe 2;

[0038] The movable connecting mechanism 5 is rotatably connected between the air inlet pipe 6 and the first air inlet, and is used for allowing the cooled gas to pass through the movable connecting mechanism 5 and enter the air outlet pipe 2 when the air outlet pipe 2 moves.

[0039] The air outlet pipe 2 is movable, and the air inlet pipe 6 is fixed. In order to achieve the connection between the two without affecting the movement of the air outlet pipe 2, a movable connection mechanism 5 is provided, which can pass the cooling gas in the air inlet pipe 6 into the air outlet pipe 2 without restricting the movement of the air outlet pipe 2. Specifically, the movable connection mechanism 5 can adopt a corrugated pipe, a hose or other structure that can be telescopically deformed with the movement of the air outlet pipe 2.

[0040] The cooling mechanism of the server heat dissipation device provided in the present application cools the air passing through the air inlet pipe 6 to generate cooling gas, and the cooling gas is transported to the air outlet pipe 2 through the movable connection mechanism 5, and blown out from the first air outlet 21 of the air outlet pipe 2, directly blowing to the heat dissipation components inside the server 1 to cool and dissipate the heat. The air outlet pipe 2 is movably arranged, and the heat dissipation area of ​​the cooling gas is expanded during the movement of the air outlet pipe 2, so that the cooling gas can be evenly blown to each position on the heat dissipation component, thereby improving the heat dissipation effect of the server 1. At the same time, the heat dissipation device does not use a fan, has low noise, and low energy consumption.

[0041] like Figure 4 As shown, in some embodiments of the present application, the air inlet duct 6 includes a first air inlet duct 61, a first cold air duct 63 and a first hot air duct 62, the first air inlet duct 61 is connected to the first cold air duct 63 and the first hot air duct 62 respectively, the cooling mechanism is arranged in the first air inlet duct 61, the first cold air duct 63 is connected to the movable connecting mechanism 5, and the first hot air duct 62 is used to exhaust gas.

[0042] The cooling mechanism includes an air pump 11 and a vortex tube cooler 12. The air pump 11 is used to pass external air into the first air inlet duct 61. The vortex tube cooler 12 cools the passing gas to generate cooling gas and high-temperature gas. The cooling gas is passed into the first cold air duct 63, and the high-temperature gas is passed into the first hot air duct 62.

[0043] The vortex tube cooler 12 uses compressed air to expand and accelerate after entering a special nozzle to form a high-speed rotating vortex. In the vortex tube, the airflow is separated due to the conservation of angular momentum, the central airflow speed slows down and the temperature decreases, forming cooling gas; the peripheral airflow speed decreases and the temperature increases, forming high-temperature gas. By designing different outlets, the cooling gas can be introduced into the first cold air channel and the high-temperature gas can be introduced into the first hot air channel. The cooling gas is introduced into the first cold air duct 63, and then into the air outlet 2 through the mobile connecting mechanism 5, and finally blows to the heat dissipation component, while the high-temperature gas enters the first hot air duct 62 for other purposes or is directly discharged from the server 1. The vortex tube cooler 12 has a significant cooling effect and can reduce the temperature of the compressed air by more than ten degrees Celsius or more. It does not require refrigerant, only relies on compressed air to work, and is energy-saving and environmentally friendly. At the same time, the vortex tube cooler 12 has a simple structure, no moving parts, easy maintenance, and high reliability.

[0044] During operation, the vortex tube cooler 12 is inflated through the operation of the charging pump 11, and the generated cooling gas is passed into the movable connecting mechanism 5 through the first cold air duct 63, and finally enters the air outlet 2, and is blown onto the heat dissipation component through the first air outlet 21, so as to directly dissipate the heat of the heat dissipation component.

[0045] In some embodiments of the present application, the first air inlet duct 61 and the first hot air duct 62 are coaxially arranged and parallel to the moving direction of the air outlet duct 2, and the first cold air duct 63 is arranged perpendicular to the first air inlet duct 61. This design optimizes the spatial layout of the heat dissipation device and the airflow path of the cooling gas.

[0046] Exemplarily, in some embodiments of the present application, the first air inlet duct 61 and the first hot air duct 62 are one duct, both ends of the duct are open, one end is the second air inlet 611, and the other end is the second air outlet 621, a third air outlet 623 is provided on the side wall of the duct, and the first cold air duct 63 is connected to the third air outlet 623. The portion between the second air inlet 611 and the third air outlet 623 is the first air inlet duct 6, which is used for air intake, and the portion between the third air outlet 623 and the second air outlet 621 is the first hot air duct 62. The air pump 11 and the vortex tube cooler 12 are both arranged in the first air inlet duct 61, and the cooling gas outlet in the vortex tube cooler faces the third air outlet 623, so that the cooling gas can enter the first cold air duct 63, and the high-temperature gas outlet faces the second air outlet 621, so that the high-temperature gas enters the first hot air duct 62.

[0047] like Figure 2 As shown, in some embodiments of the present application, the server heat dissipation device further includes a filtering mechanism, which includes a sleeve shaft tube 7, a filter material, and an air pump, the sleeve shaft tube 7 is connected to the air outlet of the first hot air duct 62, and the filter material and the air pump are both arranged in the sleeve shaft tube 7. The air pump is provided to discharge the high-temperature gas in the first hot air duct 62 and the sleeve shaft tube 7, and the filter material is provided to effectively prevent dust from entering and keep the inside of the server 1 clean.

[0048] Specifically, in some embodiments of the present application, the filter material includes filter cotton 8 and filter screen 9. The filter cotton 8 is arranged inside the sleeve shaft tube 7. The filter screen 9 cover is arranged at the outlet of the sleeve shaft tube 7 and is fixed by a limiting ring 10. The first hot air duct 62 is sleeved by the sleeve shaft tube, and the filter screen 9 is fixed by the limiting ring 10. The filter screen 9 and the filter cotton 8 are used for filtering. At the same time, the heat in the sleeve shaft tube and the first hot air duct 62 is discharged by a vacuum pump, thereby reducing environmental pollution.

[0049] Illustratively, in some embodiments, a duct consisting of a first air inlet duct 61 and a first hot air duct 62 is horizontally inserted in the server 1, and a second air inlet 611 and a second air outlet 621 can be arranged outside the server 1, so that the intake air comes from the environment outside the server 1, and the high-temperature gas is also directly discharged to the outside of the server 1 to avoid affecting the internal environment of the server 1.

[0050] In some embodiments of the present application, a sliding mechanism 3 is provided in the server 1, and the air outlet pipe 2 is connected to the sliding mechanism 3; and the air outlet pipe 2 is arranged vertically and moves in the horizontal direction. The setting of the sliding mechanism 3 can realize the horizontal movement of the air outlet pipe 2, thereby expanding the heat dissipation range of the cooling gas and improving the heat dissipation effect.

[0051] Specifically, the sliding mechanism 3 includes a screw module, the air outlet duct 2 is vertically arranged, and the two ends of the air outlet duct 2 along the axial direction are closed, and only the first air inlet and the first air outlet 21 are opened on the side wall. The number and setting position of the first air outlet 21 are determined according to the specific position of the heat dissipation component. The air outlet duct 2 is connected to the moving end of the screw module, and the air outlet duct 2 is driven to move horizontally through the movement of the cylinder module.

[0052] The number of lead screw modules may be one group or more groups, depending on the internal space of the server 1 and the requirements for structural stability.

[0053] Exemplarily, in some embodiments of the present application, the heat dissipation device is arranged in the server 1 and is located in the rear space of the server 1. There are two groups of screw modules, which are respectively arranged at the upper and lower ends of the server 1, and the screw modules are arranged in the left and right directions. The air outlet duct 2 is arranged vertically, and the upper and lower ends of the air outlet duct 2 are respectively connected to the movable ends of the two groups of screw modules. The first air inlet faces the rear side of the server 1, and the first air outlet 21 faces the front side of the server 1. There are multiple first air outlets 21, which are arranged at intervals in the upper and lower directions. The air outlet duct 2 is located at the front side of the screw module, that is, the side close to the memory of the server 1, and the mobile connection mechanism 5 and the air inlet duct 6 are sequentially arranged at the rear side of the screw module.

[0054] Of course, the heat dissipation device can also be arranged on the left side or the right side of the server 1, and can be adjusted according to actual heat dissipation requirements.

[0055] like Figure 3 and Figure 4 As shown, in some embodiments of the present application, the movable connection mechanism 5 includes at least two drainage pipes 51, and two adjacent drainage pipes 51 are rotationally connected and communicated. At least two drainage pipes 51 are rotationally connected and communicated, which can realize the unrestricted movement of the air outlet pipe 2 in the horizontal direction on the one hand, and can also realize the drainage of the cooling gas, and drain the cooling gas formed by the air inlet pipe 6 into the air outlet pipe 2 on the other hand.

[0056] In some embodiments of the present application, the drainage pipe 51 includes a first drainage main pipe 511 and two first drainage branch pipes 512, the two first drainage branch pipes 512 are respectively connected to the two ends of the first drainage main pipe 511 and are arranged perpendicular to the first drainage main pipe 511, and the two first drainage branch pipes 512 are arranged parallel to each other; at least two drainage pipes 51 are arranged in sequence along the axial direction of the first drainage main pipe 511, and the two adjacent drainage pipes 51 are rotatably connected and communicated through a first drainage branch pipe 512 on each of them, and the two drainage pipes 51 at the two ends are rotatably connected to the first air inlet and the cooling air inlet mechanism through the first drainage branch pipes 512 respectively.

[0057] Specifically, the embodiment of the present application takes two drainage tubes 51 as an example to illustrate the working principle of the movable connection mechanism 5, and the case of multiple drainage tubes 51 can be deduced by analogy.

[0058] When the two drainage pipes 51 are located in the same horizontal plane, the two drainage pipes 51 are sequentially arranged along the axial direction of the first drainage main pipe 511, and the two are arranged in parallel instead of in a straight line. One of the first drainage branch pipes 512 of one of the drainage pipes 51 is rotatably connected to the first air inlet through a bearing, and the other first drainage branch pipe 512 of the drainage pipe 51 is directly opposite to one of the first drainage branch pipes 512 of the other drainage pipe 51 and is rotatably connected through a sleeve 52 or a bearing, and the other first drainage main pipe of the other drainage pipe 51 is rotatably connected to the outlet of the first cold air duct 63.

[0059] The two drainage pipes 51 are arranged in this way so that the outlet of the first cold air duct 63 and the first air inlet are at the same height, and the moving range of the air outlet pipe 2 is related to the length of the first drainage main pipe 511.

[0060] In the embodiment of the present application, bearing sealing blocks are arranged between adjacent drainage pipes 51, between the drainage pipe 51 and the first air inlet, and between the drainage pipe 51 and the first cold air duct 63, so as to achieve the sealing effect at the two pipe joints and prevent the cooling gas from leaking. A one-way exhaust annular rubber ring is arranged on the air inlet pipe 6 to improve the diversion effect, thereby improving the sealing and stability of the overall device.

[0061] In some embodiments of the present application, the server heat dissipation device also includes an exhaust mechanism, which includes an exhaust pipe 4 and a one-way plate arranged in the exhaust pipe 4, one end of the exhaust pipe 4 is inserted into the server 1, and the other end is located outside the server 1, and the one-way plate is used to limit the airflow direction in the exhaust pipe 4, and is used to discharge excess gas in the server 1 to the outside to maintain the air pressure balance inside the server 1.

[0062] Specifically, the exhaust mechanism is arranged at the top of the server 1, and the one-way plate adopts a trumpet-shaped one-way plate 41. By arranging the number, direction and position of the trumpet-shaped one-way plate 41, one-way exhaust in the exhaust pipe 4 is achieved, and the direction of the airflow is controlled to flow from the inside to the outside.

[0063] In some embodiments of the present application, a heat sink (not shown in the figure) is also included. The heat sink is arranged on the component to be cooled. The low temperature of the heat sink absorbs the heat generated by the device, and the heat sink is quickly cooled after absorption.

[0064] For example, in some embodiments of the present application, the heat sink is made of graphene thermal interface material, which has ultra-high thermal conductivity, excellent mechanical strength and high temperature stability, and can significantly improve the heat conduction efficiency. The heat sink and the cooling gas work together to dissipate heat from the heat dissipation component, further improving the heat dissipation effect.

[0065] In some embodiments of the present application, a temperature sensor is provided in the server 1, and the temperature in the server 1 is detected by the temperature sensor. A flow sensor is provided in the air outlet 2, and the flow sensor is used to detect the flow of cooling gas. The controller controls the flow of cooling gas according to the temperature in the server 1 detected by the temperature sensor, thereby ensuring the heat dissipation effect.

[0066] Furthermore, an embodiment of the present application also provides a server 1, including the heat dissipation device in the above embodiment, which is arranged inside the server 1 to dissipate heat from heat-prone components such as the CPU, memory, and motherboard in the server 1, thereby improving the operating stability of the server 1, reducing the failure rate, and extending the service life of the server 1.

[0067] The above is a detailed introduction to a server and a server cooling device provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server heat dissipation device, characterized in that: include: An air outlet duct, the air outlet duct is movably arranged in the server, and a first air inlet and a first air outlet are arranged on a side wall of the air outlet duct, and the first air outlet faces a component to be cooled in the server; A cooling air inlet structure, wherein the cooling air inlet structure is fixed in the server and comprises an air inlet pipe and a cooling mechanism arranged in the air inlet pipe; A movable connecting mechanism is rotatably connected between the air inlet pipe and the first air inlet, and is used to pass the cooled gas into the air outlet pipe through the movable connecting mechanism when the air outlet pipe moves.

2. The server heat dissipation device according to claim 1, characterized in that: The air inlet pipe includes a first air inlet duct and a first cold air duct and a first hot air duct connected to the first air inlet duct, the cooling mechanism is arranged in the first air inlet duct, the first cold air duct is connected to the movable connection mechanism, and the first hot air duct is used to exhaust gas; The cooling mechanism includes an air pump and a vortex tube cooler. The air pump is used to pass external air into the first air inlet duct. The vortex tube cooler separates the air into cooling gas and high-temperature gas. The cooling gas is passed into the first cold air duct, and the high-temperature gas is passed into the first hot air duct.

3. The server heat dissipation device according to claim 2, characterized in that: The first air inlet duct and the first hot air duct are coaxially arranged and are both parallel to the moving direction of the air outlet duct, and the first cold air duct is perpendicular to the first air inlet duct.

4. The server heat dissipation device according to claim 2, characterized in that: It also includes a filtering mechanism, which includes a sleeve shaft tube, a filter material and an air pump. The sleeve shaft tube is connected to the air outlet of the first hot air duct, and the filter material and the air pump are both arranged in the sleeve shaft tube.

5. The server heat dissipation device according to claim 1, characterized in that: A sliding mechanism is provided in the server, and the air outlet pipe is connected to the sliding mechanism; and the air outlet pipe is vertically arranged and moves in a horizontal direction.

6. The server heat dissipation device according to claim 1, characterized in that: The movable connection mechanism comprises at least two drainage tubes, and two adjacent drainage tubes are rotationally connected and communicated with each other.

7. The server heat dissipation device according to claim 6, characterized in that: The drainage pipe comprises a first drainage main pipe and two first drainage branch pipes, the two first drainage branch pipes are respectively connected to both ends of the first drainage main pipe and are arranged perpendicular to the first drainage main pipe, and the two first drainage branch pipes are arranged parallel to each other; At least two of the drainage tubes are arranged in sequence along the axial direction of the first drainage main tube, and the two adjacent drainage tubes are rotatably connected and communicated through one of the first drainage branch tubes on each of them; the two drainage tubes at both ends are rotatably connected to the first air inlet and the cooling air inlet mechanism through the first drainage branch tubes respectively.

8. The server heat dissipation device according to claim 1, characterized in that: It also includes an exhaust mechanism, which includes an exhaust pipe and a one-way plate arranged in the exhaust pipe. One end of the exhaust pipe is inserted into the server, and the other end is located outside the server. The one-way plate is used to limit the airflow direction in the exhaust pipe.

9. The server heat dissipation device according to claim 1, characterized in that: It also includes a heat sink, which is arranged on the component to be cooled.

10. A server, characterized in that: It comprises the server heat dissipation device as described in any one of claims 1 to 9.

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