Display device and manufacturing method thereof

Abstract

The invention relates to a display device and a manufacturing method thereof. A display device according to an embodiment of the present invention includes a display panel, and a first resin layer and a second resin layer provided on a rear surface of the display panel, the first resin layer being provided so as to overlap a side surface of the display panel, the second resin layer being provided so as to overlap a driving portion of the display panel, the first resin layer and the second resin layer contain different substances from each other.

Description

Technical Field

[0001] The present disclosure relates to a display device and a method for manufacturing the same. Background Art

[0002] Electronic devices such as smartphones, tablets, laptops, and smart TVs have been developed. Such electronic devices have display devices to provide information. In addition to display devices, electronic devices also include various electronic modules.

[0003] The electronic device may include a display device with a portion bent in order to achieve smooth edges and corners. The bent portion of such a display device may be less resistant to external impact and may require a separate reinforcement material. Summary of the invention

[0004] Issues to be resolved

[0005] The embodiment is to provide a display device with increased strength and improved heat release characteristics and a method for manufacturing the same.

[0006] Solution to the problem

[0007] According to one embodiment, a display device includes: a display panel, a first resin layer and a second resin layer arranged on the back side of the display panel, the first resin layer is arranged to overlap with the side surface of the display panel, the second resin layer is arranged to overlap with the driving part of the display panel, and the first resin layer and the second resin layer contain different substances from each other.

[0008] The Young's modulus of the first resin layer may be 0.1 MPa to 1 Gpa.

[0009] The first resin layer may include a thermosetting resin or a UV curable resin.

[0010] The first resin layer may include one or more of acrylic resin, epoxy resin, silicone resin, and combinations thereof.

[0011] The display panel includes a bent portion, and the first resin layer may be disposed to overlap the bent portion.

[0012] The second resin layer may include a conductive polymer resin.

[0013] The second resin layer may include a conductive layer having an electrical conductivity of 100 S / cm 2 The above polymers.

[0014] The second resin layer may include one or more compounds represented by the following Chemical Formulas 1 to 5.

[0015] [Chemical formula 1]

[0016]

[0017] [Chemical formula 2]

[0018]

[0019] [Chemical formula 3]

[0020]

[0021] [Chemical formula 4]

[0022]

[0023] [Chemical formula 5]

[0024]

[0025] In the above Chemical Formulae 1 to 5, n may be 10 to 10,000.

[0026] The second resin layer may contain a thermally conductive filler.

[0027] The content of the thermally conductive filler may be 0.01 vol % to 95 vol % relative to the volume of the entire second resin layer.

[0028] A third resin layer overlapped with the display panel may be further included.

[0029] The third resin layer may include one or more of a thermosetting resin, a UV curable resin, a conductive polymer resin, and a combination thereof.

[0030] A fourth resin layer overlapped with the display panel may be further included.

[0031] According to another embodiment, a manufacturing method of a display device includes the following steps: a step of preparing a casting mold including a first space and a second space separated from each other; a step of setting the casting mold on the back side of a display panel; and a step of filling the first space with a first resin and filling the second space with a second resin having physical properties different from those of the first resin, wherein the first space of the casting mold is arranged to overlap with a side surface of the display panel, and the second space of the casting mold is arranged to overlap with a driving portion of the display panel.

[0032] The first resin may include a thermosetting resin or a UV curable resin.

[0033] The second resin may include a conductive polymer resin.

[0034] The casting mold further includes a third space, and the third space of the casting mold may be arranged to overlap with the display panel.

[0035] The method further includes a step of filling the third space of the mold with a third resin, wherein the third resin may include one or more of a thermosetting resin, a UV curable resin, a conductive polymer resin, and a combination thereof.

[0036] The casting mold includes openings provided in the first space and the second space, respectively. In the step of filling the first space with the first resin and the second space with the second resin having different physical properties from the first resin, the openings may be filled with the first resin and the second resin.

[0037] The step of removing the mold is further included. In the step of removing the mold, the first resin and the second resin filled in the opening can be removed by shearing.

[0038] Effects of the Invention

[0039] According to the embodiment, a display device having increased strength and improved heat release characteristics and a method for manufacturing the same are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 The back side of a display device according to an embodiment is illustrated.

[0041] Figure 2 It is a diagram that Figure 1 A cross section of the display device cut along line II'.

[0042] Figure 3 Another embodiment of the present invention is shown in FIG. Figure 1 Same area.

[0043] Figure 4 Another embodiment of the present invention is shown in FIG. Figure 1 Same area.

[0044] Figure 5 Another embodiment of the present invention is shown in FIG. Figure 1 Same area.

[0045] Figure 6 The casting mold according to this embodiment is illustrated.

[0046] Figure 7 The front side of the mold is shown.

[0047] Figures 8 to 10 A method for manufacturing the display device according to the present embodiment is illustrated. DETAILED DESCRIPTION

[0048] Hereinafter, multiple embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described here.

[0049] In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

[0050] In addition, for the sake of convenience, the size and thickness of each structure shown in the drawings are arbitrarily shown, and therefore, the present invention is not necessarily limited to the drawings. In order to clearly describe each layer and region in the drawings, the thickness is enlarged and shown. In addition, for the sake of convenience, the thickness of some layers and regions in the drawings is exaggerated and shown.

[0051] In addition, when a layer, film, region, plate, or other part is indicated to be "on" another part, it does not only refer to the case where it is "directly above" another part, but also refers to the case where there is another part in between. Conversely, when a part is indicated to be "directly above" another part, it refers to the case where there is no other part in between. In addition, "on" a part that serves as a reference means being located above or below the part that serves as the reference, and does not necessarily mean being "on" in the direction opposite to gravity.

[0052] Furthermore, throughout the specification, when it is stated that a certain part “includes / comprises” a certain constituent element, unless there is a particular description to the contrary, it means that other constituent elements may be further included, rather than excluding other constituent elements.

[0053] In addition, throughout the specification, when "on a plane" is indicated, it means when the target portion is viewed from above, and when "on a cross section" is indicated, it means when a cross section obtained by vertically cutting the target portion is viewed from the side.

[0054] Figure 1 The back side of a display device according to an embodiment is illustrated. Figure 2 Yes Figure 1 The cross section of the display device is shown along line II'.

[0055] refer to Figure 1 , the display device according to the present embodiment includes a cover window CW, a display panel DP and a driving part IC. Figure 1 The figure shows the back side of the non-display surface of the display device. Figure 1The display device according to the present embodiment includes a first resin layer 310 provided to overlap with the curved portion of the display panel DP, a second resin layer 320 provided to overlap with the driving unit IC, and a third resin layer 330 provided to overlap with the display panel DP. Although it will be described separately later, the display device according to the present embodiment is characterized in that resin layers having different properties from each other are provided on the back of the display panel DP to meet the required physical properties in each region. That is, the first resin layer 310, the second resin layer 320, and the third resin layer 330 contain different resins from each other, and the materials and physical properties may be different.

[0056] Also refer to Figure 1 and Figure 2 , the first resin layer 310 may cover the curved portion of the display panel DP. The curved portion of the display panel DP is poor in anti-collision. Therefore, a structure for strength protection of the curved portion is required in the corresponding area. In this regard, the Young's modulus of the first resin layer 310 of this embodiment may be 0.1Mpa to 1Gpa.

[0057] The first resin layer 310 may include a thermosetting resin or a UV curable resin. Or it may include a dual curing resin that can be cured by both heat and UV. As an example, the first resin layer 310 may include acrylic, epoxy, silicone resins and combinations thereof. Acrylic resins may include monomers, oligomers, and free radical photoinitiators. When UV is irradiated, the photoinitiator generates free radicals, thereby forming an acrylic network. Epoxy resins may include monomers, oligomers, cationic photoinitiators and catalysts. Cationic photoinitiators generate cations when UV is irradiated, and can form a network through epoxy ring opening reaction. Silicone resins may include monomers, oligomers, catalysts, and inhibitors. When UV is irradiated, the coordination bonds connected to the catalyst are disintegrated, and the catalyst is activated, and then the reaction can be completed.

[0058] When the first resin layer 310 includes an acrylic resin, the acrylic light curing may be performed in the first step and the acrylic heat curing may be performed in the second step.

[0059] The first resin layer 310 may include both acrylic resin and epoxy resin. In this case, the acrylic resin may include monomers, oligomers, and free radical photoinitiators, and the epoxy resin may include monomers, oligomers, anionic photoinitiators, catalysts, and inhibitors. In this case, the acrylic photocuring may be completed in the first time, and the epoxy thermal curing may be completed in the second time. In the first curing, when UV irradiated, the photoinitiator generates free radicals to form an acrylic network, and in the second curing, the anionic thermal initiator contained in the epoxy resin generates anions in the thermal curing process, and a network may be formed through the epoxy ring-opening reaction.

[0060] The first resin layer 310 may include both acrylic resin and polyurethane resin. In this case, the acrylic resin may include monomers, oligomers, and free radical photoinitiators, and the polyurethane resin may include isocyanate and a catalyst. In this case, the acrylic light curing may be completed in the first time, and the polyurethane moisture curing may be completed in the second time. In the first curing, when UV is irradiated, the photoinitiator may generate free radicals to form an acrylic network, and in the second curing, the isocyanate reacts with OH in moisture in the air to form a polyurethane network.

[0061] When the first resin layer 310 includes an organic silicon resin, the catalyst activation process may be completed in the first step and the thermal curing process may be completed in the second step. In the first step of the catalyst activation process, when UV irradiation is applied, the coordination bond connected to the catalyst is disintegrated, and the catalyst is activated, and the reactivity increases, but the reaction may be inhibited by an inhibitor. In the subsequent second thermal curing process, due to the activated catalyst, the reaction rate of the hydrosilylation reaction between the organic silicon resins increases, and an organic silicon network may be formed.

[0062] like Figure 1 and Figure 2 As shown, the first resin layer 310 may be disposed to cover the curved portion of the display panel DP. That is, the first resin layer 310 may cover the side of the display panel DP.

[0063] The second resin layer 320 may be arranged to overlap with the driving unit IC. The second resin layer 320 may protect the driving unit, prevent heat generation, and shield electromagnetic waves. Therefore, the second resin layer 320 may include a conductive polymer resin having high electrical conductivity. Specifically, the second resin layer 320 may include a conductive polymer resin having a conductivity of 100 S / cm 2 That is, unlike the first resin layer 310 which is required to have high strength, the second resin layer 320 which overlaps with the driving part is required to prevent heat generation and shield electromagnetic waves, and therefore may contain a substance different from the first resin layer 310 .

[0064] Specifically, the second resin layer 320 may include a conductive polymer resin having a structure of a resin monomer such as pyrrole, furan, thiophene, PEDOS, aniline, acetylene, and paraphenylene, which exhibits high conductivity after polymerization. As an example, it may include one or more polymers of polypyrrole, polyfuran, polythiophene, PEDOS, and polyaniline. That is, the second resin layer 320 may include one or more polymers represented by the following chemical formulas 1 to 5.

[0065] [Chemical formula 1]

[0066]

[0067] [Chemical formula 2]

[0068]

[0069] [Chemical formula 3]

[0070]

[0071] [Chemical formula 4]

[0072]

[0073] [Chemical formula 5]

[0074]

[0075] In the above Chemical Formulae 1 to 5, n may be 10 to 10,000.

[0076] In addition, the second resin layer 320 may further include a thermally conductive filler. The thermally conductive filler may include metal or conductive particles. As an example, the thermally conductive filler may include Cu or Al, but is not limited thereto. The shape of the thermally conductive filler may be various. As an example, the shape of the thermally conductive filler may be rod-shaped, needle-shaped, or round. The heat release and radiation pathways are further ensured by the thermally conductive filler, and the heat release characteristics may be improved.

[0077] The content of the thermally conductive filler may be 0.01 vol% to 95 vol% relative to the entire volume of the entire second resin layer 320. When the content of the thermally conductive filler is less than 0.01 vol%, sufficient heat release characteristics may not be achieved, and when the content of the thermally conductive filler is greater than 95 vol%, the shape of the second resin layer 320 may not be maintained.

[0078] The third resin layer 330 may be disposed overlapping the display panel DP. The third resin layer 330 may be disposed overlapping a majority of the display panel DP, and may have the functions of absorbing the impact applied to the display panel on the rear surface, releasing heat, and shielding electromagnetic waves. Therefore, the third resin layer 330 may contain one or more of the substances of the first resin layer 310 and the substances of the second resin layer 320.

[0079] The third resin layer 330 may include a thermosetting resin or a UV curable resin. Alternatively, the third resin layer 330 may include a dual curable resin that can be cured by both heat and UV. In addition, the third resin layer 330 may include a resin having an electrical conductivity of 100 S / cm 2 That is, the third resin layer 330 may include both thermosetting or UV curable resin and conductive polymer resin. However, this is only an example, and the third resin layer may include only thermosetting or UV curable resin, or only conductive polymer resin.

[0080] exist Figure 1 and Figure 2 The first resin layer 310, the second resin layer 320 and the third resin layer 330 are illustrated simultaneously, but in another embodiment, only a portion of the first resin layer 310, the second resin layer 320 and the third resin layer 330 may be included, or a fourth resin layer 340 or a fifth resin layer 350 may be further included.

[0081] Figure 3 Another embodiment is shown in FIG. Figure 1 Same area. Figure 3 The display device according to the present embodiment includes a first resin layer 310 and a second resin layer 320, but does not include a third resin layer 330. Figure 1 Detailed description of the same components will be omitted.

[0082] Figure 4 Another embodiment is shown in FIG. Figure 1 Same area. Figure 4 The display device according to the present embodiment includes a first resin layer 310 and a third resin layer 330, but does not include a second resin layer 320. Figure 1 Detailed description of the same components will be omitted.

[0083] Figure 5 Another embodiment is shown in FIG. Figure 1 Same area. Figure 5 The display device according to this embodiment further includes a fourth resin layer 340 and a fifth resin layer 350. Figure 1The detailed description of the same components is omitted. Figure 5 The display device according to this embodiment further includes a fourth resin layer 340 and a fifth resin layer 350. The display panel DP may require different physical properties for different regions, so a plurality of resin layers having different physical properties may be disposed on the back of the display panel DP.

[0084] Then, the manufacturing method of the display device according to the present embodiment is described below. The manufacturing method of the display device according to the present embodiment includes the following steps: preparing a casting mold including a first space and a second space separated from each other; placing the casting mold on the back of the display panel; and filling the first space with a first resin and the second space with a second resin having different physical properties from the first resin.

[0085] At this time, the mold may include a first space 210 arranged to overlap with the curved portion of the display panel DP, a second space 220 arranged to overlap with the driving unit IC, and a third space 230 arranged to overlap with the display panel DP. Alternatively, the mold may include only a portion of the first space 210, the second space 220, and the third space 230. Figure 6 The casting mold 200 according to this embodiment is shown in FIG. Figure 6 The mold 200 includes an opening 250 for injecting resin. The opening 250 may be provided in the first space 210, the second space 220, and the third space 230, respectively. Figure 6 Only one opening 250 is shown in FIG. Figure 7 The opening 250 may include an injection opening 251 and a discharge opening 252. That is, each space may include two or more openings 250.

[0086] Figure 7 The front side of the mold is shown. Figure 7 The first space 210, the second space 220 and the third space 230 of the mold 200 may include an injection opening 251 and a discharge opening 252, respectively. In each of the first space 210, the second space 220 and the third space 230, resin is injected through the injection opening 251, and when the resin is filled, excess resin can be discharged through the discharge opening 252.

[0087] Figures 8 to 10 A method for manufacturing the display device according to the present embodiment is illustrated.

[0088] refer to Figure 8 , the mold 200 may be disposed on the rear surface of the display panel DP.

[0089] Then, refer to Fig. 9, respectively fill the first space 210, the second space 220 and the third space 230 of the mold 200 with resin. At this time, the composition and physical properties of the resin filled in the first space 210, the second space 220 and the third space 230 are the same as those described above, so they are omitted. The specific description of the same components is omitted. Through such a process, the first resin layer 310, the second resin layer 320 and the third resin layer 330 as described above are formed.

[0090] Then, refer to Fig.10 , the mold 200 is removed. At this time, in the process of removing the mold, traces of the opening 250 may be left on the surfaces of the same first resin layer 310, the second resin layer 320 and the third resin layer 330. That is, the first resin layer 310, the second resin layer 320 and the third resin layer 330 are respectively formed to fill the first space 210, the second space 220, the third space 230 and the opening 250 in the mold 200. Therefore, in the process of removing the mold 200, it is required to shear the resin layer filled in the opening 250, and traces of the resin layer filling the opening 250 being sheared may be left on the surfaces of the first resin layer 310, the second resin layer 320 and the third resin layer 330.

[0091] As described above, the display device according to this embodiment is provided with resin layers having different physical properties according to the regions of the display device. In the past, there were the following problems due to the different characteristics required by the regions of the display device: individual existing materials were difficult to remove and integrate, the process unit price increased, and sufficient characteristics could not be met. However, the display device according to this embodiment is provided with resin layers having different physical properties according to the regions of the display device, and the required physical properties are met according to different regions, which can replace the previous materials and reduce the process cost. In addition, according to the manufacturing method of this embodiment, a plurality of spaces are formed in one casting mold, a plurality of resin layers can be formed at one time, and the manufacturing process is simple. In addition, the thickness, area, and composition of the resin layer can be freely changed according to each space, and the process has a high degree of freedom, and can be appropriately deformed according to the characteristics of the display device.

[0092] The embodiments of the present invention are described in detail above, but the scope of protection claimed by the present invention is not limited thereto. Various modifications and improvements made by those skilled in the art using the basic concepts of the present invention defined in the claims of this application also fall within the scope of protection claimed by the present invention.

Claims

1. A display device, comprising: Display panel, and A first resin layer and a second resin layer are provided on the back of the display panel, The first resin layer is arranged to overlap with a side surface of the display panel, The second resin layer is arranged to overlap with the driving unit of the display panel, The first resin layer and the second resin layer include substances different from each other.

2. The display device according to claim 1, wherein: The Young's modulus of the first resin layer is 0.1 MPa to 1 Gpa.

3. The display device according to claim 1, wherein: The first resin layer includes a thermosetting resin or a UV curable resin.

4. The display device according to claim 1, wherein: The first resin layer includes one or more of an acrylic resin, an epoxy resin, a silicone resin, and a combination thereof.

5. The display device according to claim 1, wherein: The display panel includes a curved portion, The first resin layer is provided so as to overlap with the bent portion.

6. The display device according to claim 1, wherein: The second resin layer includes a conductive polymer resin.

7. The display device according to claim 1, wherein: The second resin layer comprises a conductive layer having an electrical conductivity of 100 S / cm 2 The above polymers.

8. The display device according to claim 1, wherein: The second resin layer includes one or more compounds represented by the following Chemical Formulas 1 to 5: [Chemical formula 1] [Chemical formula 2] [Chemical formula 3] [Chemical formula 4] [Chemical formula 5] In the chemical formulae 1 to 5, n is 10 to 10,000.

9. The display device according to claim 1, wherein: The second resin layer contains a thermally conductive filler.

10. The display device according to claim 9, wherein: The content of the thermally conductive filler is 0.01 vol % to 95 vol % relative to the volume of the entire second resin layer.

11. The display device according to claim 1, wherein: The device further includes a third resin layer arranged to overlap with the display panel.

12. The display device according to claim 11, wherein: The third resin layer includes one or more of a thermosetting resin, a UV curable resin, a conductive polymer resin, and a combination thereof.

13. The display device according to claim 11, wherein: The device further includes a fourth resin layer arranged to overlap with the display panel.

14. A method for manufacturing a display device, comprising the following steps: a step of preparing a casting mold including a first space and a second space separated from each other; The step of placing the mold on the back of the display panel; as well as a step of filling the first space with a first resin and filling the second space with a second resin having physical properties different from those of the first resin, The first space of the mold is arranged to overlap with a side surface of the display panel. The second space of the mold is provided to overlap with a driving unit of the display panel.

15. The method for manufacturing a display device according to claim 14, wherein: The first resin includes a thermosetting resin or a UV curable resin.

16. The method for manufacturing a display device according to claim 14, wherein: The second resin includes a conductive polymer resin.

17. The method for manufacturing a display device according to claim 14, wherein: The casting mold further comprises a third space, The third space of the mold is disposed to overlap with the display panel.

18. The method for manufacturing a display device according to claim 17, wherein: The method further comprises the step of filling the third space of the mold with a third resin, The third resin includes one or more of a thermosetting resin, a UV curable resin, a conductive polymer resin, and a combination thereof.

19. The method for manufacturing a display device according to claim 14, wherein: The casting mold includes openings respectively disposed in the first space and the second space, In the step of filling the first space with a first resin and filling the second space with a second resin having a physical property different from that of the first resin, the opening is filled with the first resin and the second resin.

20. The method for manufacturing a display device according to claim 19, wherein: Also includes the step of removing the mold, In the step of removing the mold, The first resin and the second resin filled in the opening are removed by shearing.

Images