Heat dissipation structure for water cooling coil

Abstract

The invention discloses a heat dissipation structure for a water cooling coil, the device comprises a coil holder main body, upper water tank cover plates and lower water tank cover plates, the upper water tank cover plates comprise a first upper water tank cover plate and a second upper water tank cover plate, and the lower water tank cover plates comprise a first lower water tank cover plate and a second lower water tank cover plate. The first upper water tank cover plate and the second upper water tank cover plate are both located on the upper portion of the coil holder body, and the first lower water tank cover plate and the second lower water tank cover plate are both located on the lower portion of the coil holder body. According to the heat dissipation structure for the water cooling coil, in the installation process, copper pipes do not need to be wound, operation is safe and convenient, the heat dissipation area is increased in the structural design, the heat dissipation efficiency is high, and the heat dissipation structure is suitable for application and popularization.

Description

Technical Field

[0001] The invention discloses a heat dissipation structure for a water-cooling coil. Background Art

[0002] Conductive winding, also known as winding wire, is a device that uses electromagnetic principles to achieve the conversion of electrical energy and magnetic energy. It is specifically achieved by winding a wire made of conductive metal around a magnetic conductor. Since a lot of heat is generated when the wire or coil is energized, the conductive winding device needs to actively or passively dissipate heat. For example, an electric toy car can dissipate heat from the motor during movement, which is passive heat dissipation. Active heat dissipation is a common practice in industry, and is mainly achieved by convenient and reliable air cooling. However, the existing air-cooled heat dissipation method is difficult to cope with the situation where the coil is long and wound with several or even dozens of layers. Especially when the operating power is large, it is difficult for the internal coil to dissipate heat directly through air cooling, and the heat conduction efficiency is poor, which can easily damage the equipment. In the current existing technology, the heat dissipation method mainly uses water cooling, which uses water cooling to cool the heat generated when the coil is working, so as to achieve the purpose of heat dissipation.

[0003] In the prior art, there is a method of using a liquid-cooled copper tube to wrap around the outer surface of the coil for heat dissipation. The contact surface between the liquid-cooled copper tube and the coil is relatively small, and the heat dissipation effect will be reduced. There is also a method of arranging the liquid-cooled copper tube on the inner side of the coil. For example, Chinese utility model patent CN201920135305.1 discloses a heat dissipation structure for a coil, including a heat dissipation part, the heat dissipation part includes a liquid-cooled copper tube, and it is arranged on the inner side of the coil. The length of the liquid-cooled copper tube is greater than the length of the magnetic conductor, and the end of the liquid-cooled copper tube is also provided with an air-cooling device for cooling itself. It provides a heat dissipation structure dedicated to the conductive winding, makes full use of the existing liquid-cooled copper tube technology, and conducts the heat of the coil through the copper tube, and combines air-cooled heat dissipation to continuously cool down and maintain a stable temperature. It also connects the liquid-cooled copper tubes together through a fixing ring adapted to the actual shape of the conductive winding, which is convenient for disassembly and assembly, and does not need to be fixed separately. However, in the technical solution of the utility model, the liquid-cooled copper tube dissipates heat on the inner surface of the coil, and the internal heat is not efficiently transferred to the outside, resulting in a reduction in heat dissipation efficiency.

[0004] At present, the heat dissipation efficiency of copper tube winding is not high. If the temperature of the coil is too high, the insulation coating will fall off and age, affecting the use. If the temperature of the coil is too high, the resistance will increase, affecting the measured data. In addition, the high temperature may cause burns to the operators and maintenance personnel, posing certain safety hazards.

[0005] Based on the problems existing in the prior art, the purpose of the present invention is to provide a heat dissipation structure for water-cooled coils that does not require winding of copper tubes, is safe and convenient to operate, and has high heat dissipation efficiency. Summary of the invention

[0006] Based on the above purpose, the present invention first provides a heat dissipation structure for a water-cooled coil, comprising: a wire rack body, an upper water tank cover plate and a lower water tank cover plate, wherein The upper sink cover plate includes a first upper sink cover plate and a second upper sink cover plate, and the lower sink cover plate includes a first lower sink cover plate and a second lower sink cover plate. The first upper sink cover plate and the second upper sink cover plate are both located at the upper part of the wire rack body, and the first lower sink cover plate and the second lower sink cover plate are both located at the lower part of the wire rack body.

[0007] In a specific embodiment of the present invention, the front view of the wire rack body is an I-shaped structure, the interior of the wire rack body is a hollow structure, and the hollow structure constitutes a waterway.

[0008] In a specific embodiment of the present invention, the first upper sink cover plate and the second upper sink cover plate can be connected and sealed to the upper portion of the wire rack body by welding or other direct sealing methods such as waterproof glue, and the first lower sink cover plate and the second lower sink cover plate can also be connected to the lower portion of the wire rack body by welding or other direct sealing methods such as waterproof glue.

[0009] In another specific embodiment of the present invention, the first upper water tank cover plate and the second upper water tank cover plate can be connected and sealed with the upper part of the wire rack body by screws and sealing rings or other indirect sealing methods, and the first lower water tank cover plate and the second lower water tank cover plate can also be connected with the lower part of the wire rack body by screws and sealing rings or other indirect sealing methods.

[0010] In a specific embodiment of the present invention, the wire rack body and the sink cover are both made of metal.

[0011] In a preferred embodiment, the metal material may be copper, aluminum, or other metal materials.

[0012] In a specific embodiment of the present invention, a water inlet and a water outlet are provided on the wire rack body.

[0013] In a preferred embodiment, a water inlet adapter and a water outlet adapter are provided at the water inlet and the water outlet, respectively.

[0014] In a preferred embodiment, a water cooling adapter is further provided, and the water cooling adapter is sealed and connected to the wire rack body at the water inlet adapter and the water outlet adapter through rubber rings, respectively. The number of the rubber rings is 2.

[0015] In a preferred embodiment, water flows into the wire rack body through the water inlet and flows to the water outlet, and the water flows on the inner wall of the wire rack body to form an N-shaped loop.

[0016] The process of a specific embodiment of the heat dissipation structure for water-cooled coils of the present invention is as follows: The present invention designs a wire rack according to the size of the heat dissipation coil, and the material is copper, which is composed of a wire rack body, an upper water tank cover plate, and a lower water tank cover plate; The water flows downward through the water inlet of the wire rack body, then flows upward along the through holes on the inner wall, forming an N-shaped water flow structure on the inner wall of the wire rack body, and finally flows out through the water outlet to form a series circuit for heat dissipation.

[0017] The heat dissipation device of the present invention is welded in the manufacturing process by argon arc welding along the water tank cover plate or laser welding.

[0018] In order to facilitate operation, the present invention adopts an adapter as a connection at the water inlet and the water outlet respectively.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The technical solution of the present invention designs a wire rack according to the size of the heat dissipation coil. The material is all metal material, and copper or other materials with good thermal conductivity can be selected. In addition, an I-shaped wire rack body is adopted. Since no copper pipe extends from the water inlet and outlet, the copper pipe can be avoided from being entangled during the installation process. In addition, there is no need to entangle the copper pipe, so it has the characteristics of convenient installation. The wire rack body of the present invention is a hollow structure with a water tank inside. Water flows through the water inlet to the bottom of the wire rack body, and then flows to the top along the through hole of the inner wall, forming an N-shaped water flow structure on the inner wall of the wire rack body, and finally flows out through the water outlet to form a series circuit for heat dissipation. This heat dissipation method forms upper and lower surfaces and inner wall contact heat dissipation for the coil, increasing the heat dissipation area, and also avoiding the situation that when using copper tubes for heat conduction, it is impossible to ensure whether there is an air gap between the copper tube and the heat dissipation main bracket, thereby affecting the heat conduction effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation structure for water-cooled coils of the present invention; Figure 2 It is a front view of the heat dissipation structure for water-cooled coils of the present invention; Figure 3 It is a side view of the heat dissipation structure for water-cooled coils of the present invention; Figure 4 for Figure 3 View along direction B; Figure 5 Schematic diagram of water flow path; Figure 6 It is a specific application schematic diagram of the heat dissipation structure for water-cooled coils of the present invention; In the figure: 1-wire rack body, 2-first upper water tank cover, 3-second upper water tank cover, 4-first lower water tank cover, 5-second lower water tank cover, 6-water inlet, 7-water outlet, 8-water inlet adapter, 9-water outlet adapter, 10-coil, 11-water cooling adapter, 20-first upper wire rack body, 21-first vertical wire rack body, 22-second vertical wire rack body, 23-third vertical wire rack body, 30-second upper wire rack body, 40-first lower wire rack body, 50-second lower wire rack body. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with specific embodiments, and the advantages and features of the present invention will become clearer as the description proceeds. However, these embodiments are merely exemplary and do not constitute any limitation on the scope of protection defined by the claims of the present invention.

[0022] In conjunction with the accompanying drawings of the present invention, Figures 1 to 4 As shown, a heat dissipation structure for a water-cooled coil provided in the present invention comprises: a wire rack body 1, an upper water tank cover plate and a lower water tank cover plate, wherein The upper sink cover plate includes a first upper sink cover plate 2 and a second upper sink cover plate 3, and the lower sink cover plate includes a first lower sink cover plate 4 and a second lower sink cover plate 5. The first upper sink cover plate 2 and the second upper sink cover plate 3 are both located at the upper part of the wire rack body 1, and the first lower sink cover plate 4 and the second lower sink cover plate 5 are both located at the lower part of the wire rack body 1.

[0023] In a specific embodiment of the present invention, the wire frame body 1 is an I-shaped structure, and the interior of the wire frame body 1 is a hollow structure, and the hollow structure constitutes a waterway.

[0024] In a specific embodiment of the present invention, the first upper sink cover plate 2 and the second upper sink cover plate 3 can be connected and sealed to the upper portion of the wire rack body 1 by welding or other direct sealing methods such as waterproof glue, and the first lower sink cover plate 4 and the second lower sink cover plate 5 can also be connected to the lower portion of the wire rack body 1 by welding or other direct sealing methods such as waterproof glue.

[0025] In another specific embodiment of the present invention, the first upper water tank cover plate 2 and the second upper water tank cover plate 3 can be connected and sealed with the upper part of the wire rack body 1 by screws and sealing rings or other indirect sealing methods, and the first lower water tank cover plate 4 and the second lower water tank cover plate 5 can also be connected with the lower part of the wire rack body 1 by screws and sealing rings or other indirect sealing methods.

[0026] In a specific embodiment of the present invention, the wire rack body 1 and the sink cover are both made of metal.

[0027] In a preferred embodiment, the metal material may be copper, aluminum, or other metal materials.

[0028] In a specific embodiment of the present invention, a water inlet 6 and a water outlet 7 are provided on the wire rack body 1 .

[0029] In a preferred embodiment, a water inlet adapter 8 and a water outlet adapter 9 are provided at the water inlet 6 and the water outlet 7 respectively.

[0030] In a preferred embodiment, a water cooling adapter 11 is further provided, and the water cooling adapter 11 is sealed and connected to the wire rack body 1 at the water inlet adapter 8 and the water outlet adapter 9 through rubber rings, respectively. The number of the rubber rings is 2.

[0031] In a preferred embodiment, water flows into the wire rack body 1 through the water inlet 6 and flows to the water outlet 7 , and the water flows on the inner wall of the wire rack body 1 to form an N-shaped loop.

[0032] The process of a specific embodiment of the heat dissipation structure for water-cooled coils of the present invention is as follows: The present invention designs a wire rack according to the size of the heat dissipation coil. The material is copper and it is composed of a wire rack body 1 and an upper water tank cover plate and a lower water tank cover plate. The heat dissipation device of the present invention is welded in the manufacturing process by argon arc welding along the water tank cover plate or laser welding.

[0033] like Figure 5 As shown, for ease of operation, the present invention uses an adapter as a connection at the water inlet 6 and the water outlet 7. Water flows through the water inlet 6 to the bottom of the wire rack body 1, and then flows to the top along the through hole of the inner wall, forming an N-shaped water flow structure on the inner wall of the wire rack body 1, and finally flows out through the water outlet 7 to form a series circuit for heat dissipation. The process of the water flow path specifically includes the following steps: Step 1: water flows into the water inlet 6 through the water inlet adapter 8 and flows through the first upper wire rack main body 20 connected to the first upper water tank cover plate 2; Step 2: Water flows through the first vertical wire rack body 21 and downwardly enters the first lower wire rack body 40 connected to the first lower water tank cover plate 4; Step 3: Water flows through the second vertical wire rack body 22 and enters the second upper wire rack body 30 connected to the second upper water tank cover plate 3; Step 4: The water flows downward through the third vertical wire rack body 23 and enters the second lower wire rack body 50 connected to the second lower water tank cover plate 5; Step 5: Water flows through the second lower wire rack body 50 connected to the second lower water tank cover plate 5 and the second upper wire rack body 30 connected to the second upper water tank cover plate 3 through a plurality of vertical wire rack bodies to circulate up and down, forming an N-shaped loop; Step 6: The water finally flows through the water outlet 7 located on the second upper wire rack main body 30 connected to the second upper water tank cover plate 3 and flows out from the water outlet adapter 9.

[0034] like Figure 6 As shown, in the specific application process of the heat dissipation structure for water-cooled coils of the present invention, the water-cooling adapter 11 and the wire rack body 1 are sealed and connected at the water inlet adapter 8 and the water outlet adapter 9 respectively through two rubber rings. The heat dissipation method adopted forms upper and lower surfaces and inner wall contact heat dissipation for the coil 10, thereby increasing the heat dissipation area. At the same time, it also avoids the situation that when using copper tubes for heat conduction, it is impossible to ensure whether there is an air gap between the copper tubes and the heat dissipation main bracket, thereby affecting the heat conduction effect.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A heat dissipation structure for a water-cooled coil, characterized in that: The device comprises: a wire rack body, an upper water tank cover plate and a lower water tank cover plate, wherein The upper sink cover plate includes a first upper sink cover plate and a second upper sink cover plate, and the lower sink cover plate includes a first lower sink cover plate and a second lower sink cover plate. The first upper sink cover plate and the second upper sink cover plate are both located at the upper part of the wire rack body, and the first lower sink cover plate and the second lower sink cover plate are both located at the lower part of the wire rack body.

2. The heat dissipation structure for water-cooled coils according to claim 1, characterized in that: The wire rack body is an I-shaped structure, the interior of the wire rack body is a hollow structure, and the hollow structure constitutes a waterway.

3. The heat dissipation structure for water-cooled coils according to claim 1, characterized in that: The first upper water tank cover plate and the second upper water tank cover plate are connected to the upper part of the wire rack body by welding or waterproof glue, and the first lower water tank cover plate and the second lower water tank cover plate are connected to the lower part of the wire rack body by welding or waterproof glue.

4. The heat dissipation structure for water-cooled coils according to claim 1, characterized in that: The first upper water tank cover plate and the second upper water tank cover plate are fastened to the upper part of the wire rack body by screws and sealing rings, and the first lower water tank cover plate and the second lower water tank cover plate are fastened to the lower part of the wire rack body by screws and sealing rings.

5. According to the heat dissipation structure for water-cooled coils according to claim 1, the wire rack body and the water tank cover are both made of metal.

6. According to the heat dissipation structure for water-cooled coils according to claim 5, the metal material is copper or aluminum.

7. The heat dissipation structure for water-cooled coils according to claim 1, characterized in that: The wire rack body is provided with a water inlet and a water outlet.

8. The heat dissipation structure for water-cooled coils according to claim 7, characterized in that: A water inlet adapter and a water outlet adapter are respectively provided at the water inlet and the water outlet.

9. The heat dissipation structure for water-cooled coils according to claim 8, characterized in that: A water cooling adapter is also provided, and the water cooling adapter is sealed and connected to the wire rack body at the water inlet adapter and the water outlet adapter through rubber rings respectively.

10. The heat dissipation structure for water-cooled coils according to claim 7, characterized in that: The water flows into the wire rack body through the water inlet and flows to the water outlet, and the water flows on the inner wall of the wire rack body to form an N-shaped loop.

Images