Test apparatus, test device, and test method

Abstract

The present application relates to the technical field of testing equipment, and discloses a testing device, testing equipment and a testing method, the testing device is applied to testing equipment with a control device, the testing device comprises a mounting frame, a driving assembly, a force measuring assembly, a testing baffle and a displacement measuring assembly, the driving assembly is connected to the mounting frame; the force measuring assembly is connected to the driving end of the driving assembly, the testing baffle is connected to the force measuring assembly, the driving assembly is suitable for driving the testing baffle to approach or move away from the outer surface of a to-be-tested object through the force measuring assembly; the to-be-tested object is provided with a vacuum hole located on the outer surface and opposite to the testing baffle, for generating suction force on the testing baffle; the displacement measuring assembly is connected to the mounting frame; the force measuring assembly is used for measuring the force data of the testing baffle, and the displacement measuring assembly is used for measuring the displacement data of the testing baffle; the control device is configured to obtain the spacing data between the testing baffle and the outer surface according to the displacement data, so that the suction force of the vacuum hole can be tested and analyzed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of testing equipment, in particular to a testing device, a testing equipment and a testing method. BACKGROUND

[0002] In the production and testing process of semiconductors, semiconductor production or testing equipment usually uses a vacuum hole to adsorb and fix a semiconductor wafer (such as a wafer or other semiconductor wafer) to reduce damage and pollution to the semiconductor wafer. Different sizes of vacuum holes, different numbers of vacuum holes, the distance between the semiconductor wafer and the vacuum hole, and other factors all affect the adsorption and fixing effect of the vacuum hole on the semiconductor wafer.

[0003] At present, when designing a vacuum hole, it is usually designed according to the experience of R&D personnel, and it is easy to appear that the designed vacuum hole cannot meet the actual needs, so a testing device is needed to test and analyze the suction force of the vacuum hole. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a testing device capable of testing and analyzing the suction force of a vacuum hole.

[0005] The present application also provides a testing equipment having the above testing device, and a testing method applied to the testing equipment.

[0006] The testing device according to the first aspect of the present application is applied to a testing equipment, and the testing equipment comprises a control device in communication connection with the testing device. The testing device comprises a mounting frame, a driving assembly, a force measuring assembly, a test baffle and a displacement measuring assembly. The driving assembly is connected to the mounting frame. The force measuring assembly is connected to the driving end of the driving assembly. The test baffle is connected to the force measuring assembly. The driving assembly is adapted to drive the test baffle to approach or move away from the outer surface of a to-be-tested object through the force measuring assembly. The to-be-tested object is provided with a vacuum hole located on the outer surface. The vacuum hole and the test baffle are opposite to each other and used to generate a suction force on the test baffle. The displacement measuring assembly is connected to the mounting frame. The force measuring assembly is used to measure the force data of the test baffle, and the displacement measuring assembly is used to measure the displacement data of the test baffle. The control device is configured to obtain the spacing data between the test baffle and the outer surface according to the displacement data, and the spacing data and the force data are one-to-one corresponding.

[0007] According to the test device, the test baffle is driven to approach or move away from the outer surface of the object to be tested by the driving assembly, the airflow in the vacuum hole generates suction force on the test baffle, the force measuring assembly can measure the force data, the displacement measuring assembly can measure the displacement data of the test baffle, the control device can obtain the distance data between the test baffle and the outer surface according to the displacement data, and thus the one-to-one corresponding distance data and force data can be obtained, and the suction force of the vacuum hole corresponding to different distances between the test baffle and the vacuum hole can be obtained. Therefore, the researchers can refer to the distance data and the force data to design the vacuum hole on the semiconductor production or test equipment, such as the aperture, the number, the distance between the semiconductor wafer and the vacuum hole (i.e. the distance between the semiconductor wafer and the outer surface) of the vacuum hole on the semiconductor production or test equipment, and the like.

[0008] According to some embodiments of the present application, the force measuring assembly further comprises a bracket and a force sensor, the bracket is connected to the driving end of the driving assembly, and the force sensor is connected between the bracket and the test baffle; the driving assembly is adapted to drive the bracket to reciprocate, and the force sensor is used to measure the force of the test baffle.

[0009] According to some embodiments of the present application, the displacement measuring assembly comprises an optical displacement sensor and a reflector, and both the optical displacement sensor and the reflector are connected to the mounting frame; the reflector is located in the propagation path of the measuring light emitted by the optical displacement sensor, and is used to reflect the measuring light to the test baffle, and the measuring light reflected by the test baffle is reflected to the optical displacement sensor through the reflector; the optical displacement sensor is used to measure the displacement data of the test baffle according to the reflected measuring light.

[0010] According to some embodiments of the present application, the force measuring assembly further comprises a reflector, the reflector is connected to the test baffle and located in the propagation path of the measuring light, and is used to reflect the measuring light to the reflector.

[0011] According to some embodiments of the present application, the test device further comprises a position adjusting assembly, the position adjusting assembly is connected to the mounting frame, the optical displacement sensor is connected to the position adjusting assembly, and the position adjusting assembly is used to adjust the distance between the optical displacement sensor and the reflector.

[0012] According to some embodiments of the present application, the test device further comprises an aperture measuring assembly, the aperture measuring assembly is connected to the mounting frame, and is used to measure the aperture data of the vacuum hole.

[0013] According to some embodiments of the present application, the aperture measuring assembly comprises a camera assembly, the camera assembly is connected to the mounting frame, and the camera assembly, the reflector and the test baffle are sequentially distributed; the test baffle has a transparent part, the transparent part and the camera assembly are oppositely arranged; the reflector is a transparent structure; and the camera assembly is adapted to shoot the vacuum hole through the reflector and the transparent part to measure the aperture of the vacuum hole.

[0014] According to some embodiments of the present application, the distribution direction of the camera assembly, the reflecting member and the test flag is arranged at an angle with the distribution direction of the reflecting member and the optical displacement sensor.

[0015] The test device according to the second aspect of the embodiments of the present application comprises the control device and the test device in any of the above embodiments, the control device and the test device are communicatively connected, and the control device is configured to obtain spacing data between the test flag and the outer surface according to the displacement data, and draw a relationship diagram according to the spacing data and the force data.

[0016] The test method according to the third aspect of the embodiments of the present application is applied to the test device in the above embodiments, and the test method comprises: controlling the driving assembly to drive the test flag to move towards the outer surface of the object to be tested by a first preset displacement amount, the object to be tested is provided with a vacuum hole located on the outer surface, the vacuum hole is opposite to the test flag, and the vacuum hole is used to generate suction force on the test flag; when the test flag moves by a first preset displacement amount each time, corresponding first force data and first displacement data are obtained; when the test flag moves by a first preset displacement amount, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, the driving assembly is controlled to drive the test flag to move away from the outer surface by a second preset displacement amount; when the test flag moves by a second preset displacement amount each time, corresponding second force data and second displacement data are obtained; corresponding first spacing data between the test flag and the outer surface is obtained according to each first displacement data, and corresponding second spacing data between the test flag and the outer surface is obtained according to each second displacement data; a corresponding relationship diagram is drawn according to the first displacement data, the first force data, the second displacement data and the second force data; wherein the first force data and the second force data are obtained according to the force measurement assembly measuring the force of the test flag, and the first displacement data and the second displacement data are obtained according to the displacement measurement assembly measuring the displacement of the test flag.

[0017] Additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The present application will be further described below in combination with the drawings and embodiments, wherein:

[0019] Figure 1 The structure schematic diagram of the test device and the object to be tested provided by the embodiments of the present application is shown;

[0020] Figure 2 The structure schematic diagram of the test device and the object to be tested provided by the embodiments of the present application is shown; Figure 1 The structure schematic diagram of the test device and the object to be tested provided by the embodiments of the present application is shown;

[0021] Figure 3 The structure schematic diagram of the test device and the object to be tested provided by the embodiments of the present application is shown;Figure 1 Partial structural schematic diagram of another perspective of the to-be-tested object and the testing device;

[0022] Figure 4 A partial structural schematic diagram of the to-be-tested object and the testing device is shown. Figure 2 Partial structural schematic diagram of another perspective of the to-be-tested object and the testing device;

[0023] Figure 5 A flowchart of the testing method provided by the embodiment of the present application is shown.

[0024] Figure 6 A relationship curve provided by the embodiment of the present application is shown.

[0025] Figure 7 A schematic diagram of a force process of the testing stopper provided by the embodiment of the present application is shown.

[0026] Reference signs:

[0027] Testing device 100;

[0028] Mounting frame 110; first support plate 111; second support plate 113; third support plate 115;

[0029] Driving assembly 130; driving member 131; sliding block 133;

[0030] Force measurement assembly 150; support 151; first connecting portion 1511; second connecting portion 1513; force sensor 153; reflective sheet 155;

[0031] Testing stopper 170;

[0032] Displacement measurement assembly 190; optical displacement sensor 191; reflecting member 193; first limit switch 210; origin switch 230; second limit switch 250;

[0033] Position adjustment assembly 270; fixed block 271; adjustment block 273; adjustment rod 275; elastic member 279;

[0034] Aperture measurement assembly 290; camera assembly 291; camera 2911; lens 2913; light source 2915; housing 310;

[0035] To-be-tested object 500; outer surface 510; vacuum hole 530; first direction Y; second direction X. DETAILED DESCRIPTION

[0036] Embodiments of the present application are described below in the detailed description and illustrated in the accompanying drawings by using examples, which are exemplary only and not intended to restrict the present application. It should be noted that the same or similar components have the same reference numbers and symbols throughout the drawings and a repeated description is omitted.

[0037] In the description of the present application, if the orientation description such as up, down, front, back, left, right and the like is indicated, the orientation or position relationship is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and cannot be understood as a limitation on the present application.

[0038] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0039] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application according to the specific content of the technical scheme.

[0040] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0041] Please refer to Figure 1 The test equipment provided by the embodiment of the present application comprises a test device 100 and a control device, the control device is in communication connection with the test device 100, and is used for controlling the test device 100.

[0042] The test equipment can be used for testing the suction force of the vacuum hole 530.

[0043] The communication connection can refer to wireless communication connection, and can also refer to wired communication connection.

[0044] As an example, the control device can be a computer, a control panel, or other control device.

[0045] In some embodiments, the control device can include a controller and a display.

[0046] The controller can be used to control the testing device 100 and the display, and can be used to process various data.

[0047] The controller can be a single-chip microcomputer, ARM, MCU, or other control device.

[0048] The display can display test data, charts, and other information.

[0049] In some embodiments, the control device can also include a storage unit that can store data fed back by the testing device 100 and data, charts, and other information processed by the controller.

[0050] Please refer to Figures 2 to 4 In some embodiments, the testing device 100 includes a mounting bracket 110, a drive assembly 130, a force measurement assembly 150, a test baffle 170, and a displacement measurement assembly 190.

[0051] The mounting bracket 110 can be used to mount and support the drive assembly 130, the force measurement assembly 150, the test baffle 170, the displacement measurement assembly 190, and other structures.

[0052] The mounting bracket 110 can be fixed at a desired position, for example, the mounting bracket 110 can be fixed on a pre-set base, or the mounting bracket 110 can be fixed on a wall or other installation position, so as to stably measure the object 500 to be measured.

[0053] The drive assembly 130 is connected to the mounting bracket 110, the force measurement assembly 150 is connected to the drive end of the drive assembly 130, the test baffle 170 is connected to the force measurement assembly 150, and the drive assembly 130 is adapted to drive the test baffle 170 to approach or move away from the outer surface 510 of the object 500 to be measured through the force measurement assembly 150.

[0054] As an example, the drive assembly 130 can be an electric drive assembly 130, which can be communicatively connected with the control device, and the control device can control the drive assembly 130 to drive the force measurement assembly 150 to move along the first direction Y to approach or move away from the object 500 to be measured.

[0055] The object 500 to be measured is provided with a vacuum hole 530 located on the outer surface 510, and the vacuum hole 530 is opposite to the test baffle 170, and is used to generate suction force on the test baffle 170.

[0056] As an example, the object under test 500 is substantially in a plate structure, and the vacuum hole 530 can pass through the object under test 500. The object under test 500 can be placed on the support structure in advance, and the position of the object under test 500 can be adjusted so that the vacuum hole 530 and the test tab 170 located above the object under test 500 can be opposite. The test device 100 can extract the air flow in the vacuum hole 530 by the vacuum extraction device, so that the air flow in the vacuum hole 530 can generate suction force on the test tab 170, so that the test device 100 can measure the force of the test tab 170.

[0057] The force measurement assembly 150 is used to measure the force data of the test tab 170, and the force measurement assembly 150 can be in communication connection with the control device to transmit the force data to the control device for storage and analysis.

[0058] It can be understood that when the test tab 170 and the outer surface 510 are not in contact, the test tab 170 only bears the suction force from the vacuum hole 530, and the force data is only the suction force of the vacuum hole 530; when the test tab 170 and the outer surface 510 are in abutment, the test tab 170 bears the suction force of the vacuum hole 530 and the contact force of the object under test 500 at the same time, and the force data is the sum of the suction force of the vacuum hole 530 and the contact force of the object under test 500.

[0059] It should be noted that the direction of the suction force of the vacuum hole 530 and the contact force of the object under test 500 is opposite, when the suction force of the vacuum hole 530 on the test tab 170 is positive, the contact force of the object under test 500 on the test tab 170 can be negative, and when the test tab 170 bears the suction force of the vacuum hole 530 and the contact force of the object under test 500 at the same time, the force data measured by the force measurement assembly 150 is usually less than the force data measured by the force measurement assembly 150 when the test tab 170 only bears the suction force of the vacuum hole 530.

[0060] The displacement measurement assembly 190 is connected to the mounting bracket 110 and is used to measure the displacement data of the test tab 170, and the displacement data can correspond to the force data one by one.

[0061] As an example, when the displacement measurement assembly 190 measures the displacement data of the test tab 170, the displacement measurement assembly 190 can take the position where the displacement measurement assembly 190 is located as the origin to measure the distance of the test tab 170 relative to the origin as the displacement data.

[0062] It should be noted that as the test tab 170 moves, the position of the test tab 170 and the force it bears will change, and each displacement data can correspond to a force data.

[0063] The control device is configured to obtain spacing data between the test baffle 170 and the outer surface 510 according to the displacement data, and the spacing data and the force data correspond to each other, so that the spacing data between the test baffle 170 and the outer surface 510 and the corresponding force data can be obtained. By obtaining a plurality of sets of spacing data and corresponding force data, the researchers can analyze the data for measurement, so that the researchers can design the vacuum hole 530 on the semiconductor production or test equipment as a reference.

[0064] The semiconductor production or test equipment can be a probe station, so that the researchers can design the aperture, number, distance between the semiconductor wafer (such as a wafer or other semiconductor wafer) and the vacuum hole 530 (i.e. the distance between the semiconductor wafer and the outer surface 510) and the like of the vacuum hole 530 on the probe station.

[0065] The semiconductor production or test equipment can also be a mechanical hand for adsorbing a semiconductor wafer or other test or production equipment.

[0066] As an example, the control device can draw a plurality of sets of force data and spacing data into a relationship curve graph for storage, the horizontal coordinate of the relationship curve graph can be the spacing data, and the vertical coordinate can be the force data. The researchers can analyze the aperture, number, distance between the semiconductor wafer and the vacuum hole 530 and the like of the vacuum hole 530 on the semiconductor production or test equipment according to the relationship curve graph.

[0067] It should be noted that the size of the vacuum hole 530 on the object to be measured 500 can be measured by the test device 100 or manually measured in advance, so that the aperture, force data and spacing data of the vacuum hole 530 can be corresponded, so that the researchers can analyze the data for measurement.

[0068] In some embodiments, the mounting bracket 110 can include a first support plate 111, a second support plate 113 and a third support plate 115.

[0069] The first support plate 111 and the third support plate 115 are respectively connected to the two ends of the second support plate 113 and extend to the opposite sides of the second support plate 113. The second support plate 113 can be connected at an angle to the first support plate 111, and the third support plate 115 can be connected at an angle to the second support plate 113. For example, the second support plate 113 and the first support plate 111 can be connected perpendicularly, and the third support plate 115 and the second support plate 113 can be connected perpendicularly.

[0070] The test device 100 can be installed at a desired installation position through the first support plate 111.

[0071] The driving assembly 130 can include a driving member 131 connected to the third support plate 115 and a sliding block 133 slidably connected to the second support plate 113. The driving end of the driving member 131 can be drivingly connected to the sliding block 133 to drive the sliding block 133 to slide back and forth on the second support plate 113. The driving end of the driving member 131 can be a screw rod, a telescopic rod or other structure to drive the sliding block 133 to slide.

[0072] The sliding direction of the sliding block 133 can be the distribution direction of the first support plate 111 and the third support plate 115 on the second support plate 113. For example, the sliding block 133 can slide back and forth along the first direction Y.

[0073] The force measuring assembly 150 can be connected to the sliding block 133, so that the force measuring assembly 150 and the test direction can move synchronously along the first direction Y with the sliding block 133 to approach or move away from the test flake 170.

[0074] In some embodiments, the test device 100 can further include a first limit switch 210, an origin switch 230 and a second limit switch 250 distributed in sequence along the first direction Y. The first limit switch 210, the origin switch 230 and the second limit switch 250 are all connected to the mounting frame 110 and can be in communication connection with the driving assembly 130 or in communication connection with the control device.

[0075] The first limit switch 210 and the second limit switch 250 are used to limit the maximum displacement of the sliding block 133 along the first direction Y,

[0076] As an example, the sliding block 133 can be provided with a trigger portion 1331 which moves back and forth along the first direction Y with the sliding block 133 to trigger the first limit switch 210, the origin switch 230 and the second limit switch 250. When the trigger portion 1331 contacts or moves into the detection range of the first limit switch 210 and the second limit switch 250, a first trigger signal can be sent out. The driving assembly 130 or the control device receives the first trigger signal to control the sliding block 133 to stop moving or move reversely, which helps to limit the displacement of the sliding block 133 and avoid disengaging from the mounting frame 110.

[0077] The origin switch 230 can set a zero point position for the sliding block 133. When the trigger portion 1331 moves into the detection range of the origin switch 230, a second trigger signal can be sent out. When the driving assembly 130 or the control device receives the second trigger signal, it is determined that the sliding block 133 is at the zero point position, i.e. it is determined that the test flake 170 is at the zero point position, so as to facilitate subsequent driving control.

[0078] The first limit switch 210, the origin switch 230 and the second limit switch 250 can be photoelectric switches.

[0079] In some embodiments, the force measurement assembly 150 can further include a bracket 151 and a force sensor 153.

[0080] The bracket 151 can be connected to a driving end of the driving assembly 130, the force sensor 153 can be connected between the bracket 151 and the test flapper 170, and the driving assembly 130 can be adapted to drive the bracket 151 to move back and forth, and the force sensor 153 can move back and forth along with the bracket 151.

[0081] As an example, the bracket 151 can be connected to the slider 133 to move back and forth along the first direction Y synchronously with the slider 133.

[0082] The force sensor 153 can be used to measure the force of the test flapper 170 to obtain force data of the test flapper 170 and transmit the force data to the control device for storage and processing.

[0083] In some embodiments, the bracket 151 can include a first connecting portion 1511 and a second connecting portion 1513 connected at an angle, the first connecting portion 1511 can be connected to the driving end of the driving assembly 130, and the force sensor 153 can be connected to an end of the second connecting portion 1513 away from the first connecting portion 1511 and extend outward to form a cantilever beam structure.

[0084] The force sensor 153 can include a plurality of strain gauges, and the plurality of strain gauges can be connected to the second connecting portion 1513 and distributed on opposite sides of the second connecting portion 1513 along the moving direction.

[0085] When the test flapper 170 is forced, the second connecting portion 1513 is deformed, and the strain gauges are deformed synchronously, so that the force data of the test flapper 170 can be measured. The specific force measurement principle of the strain gauges can refer to the prior art, which will not be described here.

[0086] In some embodiments, the first connecting portion 1511 and the second connecting portion 1513 can be substantially perpendicular.

[0087] In some embodiments, the second connecting portion 1513 can be provided with a through hole, the through hole can pass through the second connecting portion 1513, and the axis direction of the through hole and the first direction Y are substantially perpendicular, so that the second connecting portion 1513 is more easily deformed.

[0088] The plurality of strain gauges can be distributed on opposite sides of the through hole along the radial direction and connected to the second connecting portion 1513, so as to bend up and down along the first direction Y with the second connecting portion 1513, thereby the force in two directions can be tested.

[0089] As an example, the through hole can include a first hole, a second hole and a third hole which are sequentially communicated along the radial direction, wherein the first hole and the third hole can be circular holes, and the second hole can be a rectangular hole. The number of strain gauges can be four, two strain gauges are connected to the opposite sides of the second connecting portion 1513 respectively, and the opposite two strain gauges are distributed on the opposite sides of the first hole along the radial direction, and the opposite two strain gauges can also be distributed on the opposite sides of the third hole along the radial direction. In this way, the second connecting portion 1513 has sufficient structural strength while being more easily deformed, which helps the strain gauges to more accurately measure the force data of the test vane 170.

[0090] In some embodiments, the displacement measurement assembly 190 can include an optical displacement sensor 191 and a reflector 193.

[0091] The optical displacement sensor 191 and the reflector 193 are both connected to the mounting bracket 110.

[0092] The reflector 193 can be located in the propagation path of the measurement light emitted by the optical displacement sensor 191, for reflecting the measurement light to the test vane 170, and the measurement light reflected by the test vane 170 is reflected to the optical displacement sensor 191 through the reflector 193. The optical displacement sensor 191 is used to measure the displacement data of the test vane 170 according to the reflected measurement light, so that the displacement data of the test vane 170 can be measured. The optical displacement sensor 191 can be in communication connection with the control device to transmit the displacement data to the control device for storage, and the control device can process and analyze the force data and the displacement data.

[0093] The reflector 193 can be spaced apart from the slider 133 to avoid interfering with the sliding of the slider 133.

[0094] The optical displacement sensor 191 can adopt a laser triangulation displacement sensor, a displacement sensor based on the principle of spectral confocal or other displacement sensors, and the specific working principle can refer to the prior art, which will not be described here.

[0095] Taking the displacement sensor based on the principle of spectral confocal as an example, the optical displacement sensor 191 can include an optical measurement head and a control device, the optical measurement head can be connected to the control device through an optical fiber, the control device can transmit measurement light to the optical measurement head through the optical fiber, the optical measurement head emits the measurement light to the reflector 193, and can receive the measurement light reflected by the test vane 170 to the reflector 193 and reflected by the reflector 193. The control device receives the reflected measurement light and processes and analyzes it to obtain the displacement data of the test vane 170, and the specific working principle can refer to the prior art, which will not be described here.

[0096] It should be noted that when measuring the displacement data of the test flag 170, there can be multiple ways to measure the displacement data of the test flag 170. Among them, the reflecting member 193 and the test flag 170 can be distributed along the first direction Y, the reflecting member 193 and the optical displacement sensor 191 can be distributed along the second direction X, the first direction Y and the second direction X are substantially perpendicular, the first direction Y is substantially vertical, and the second direction X is substantially horizontal.

[0097] As an example, the test device 100 can take the position of the optical displacement sensor 191 or the reflecting member 193 as the coordinate origin to measure the longitudinal coordinate value of the test flag 170 relative to the origin along the first direction Y, which can be the displacement data of the test flag 170.

[0098] As another example, the test device 100 can take the position of the test flag 170 when the displacement measurement assembly 190 keeps the measurement data unchanged, i.e., when the test flag 170 is attached to the outer surface 510 of the object 500 to be measured, as the coordinate origin to measure the longitudinal coordinate value of the test flag 170 relative to the coordinate origin along the first direction Y when the test flag 170 is in different positions, which can be the displacement data of the test flag 170.

[0099] In some embodiments, the force measurement assembly 150 can further include a reflecting sheet 155 connected to the test flag 170 and located in the propagation path of the measurement light, for reflecting the measurement light to the reflecting member 193, thereby reducing light loss and helping the optical displacement sensor 191 to more accurately measure the displacement data of the test flag 170.

[0100] The reflecting sheet 155 can be a metal film or other film layer that reflects light but does not transmit light.

[0101] In some embodiments, the reflecting sheet 155 is substantially annular, connected to the surface of the side of the test flag 170 facing the reflecting member 193, and surrounds the periphery of the test flag 170.

[0102] In some embodiments, the reflecting sheet 155 is substantially rectangular, connected to the surface of the side of the test flag 170 facing the reflecting member 193.

[0103] In some embodiments, the test device 100 can further include a position adjustment assembly 270 connected to the mounting bracket 110, and the optical displacement sensor 191 is connected to the position adjustment assembly 270, and the position adjustment assembly is used to adjust the distance between the optical displacement sensor 191 and the reflecting member 193, so that the position of the optical displacement sensor 191 relative to the reflecting member 193 can be flexibly adjusted, which helps to ensure that the optical displacement sensor 191 can more accurately measure the displacement data of the test flag 170.

[0104] The position adjusting assembly 270 can have various structural arrangements.

[0105] As an example, the position adjusting assembly 270 can include a fixed block 273, an adjusting block 271, an adjusting rod 275, and an elastic member 279. The fixed block 273 can be fixedly connected to the mounting frame 110, and the adjusting block 271 can be arranged at a distance from the fixed block 273 along the second direction X. The adjusting rod 275 can be threadedly connected to the adjusting block 271 and partially extend between the adjusting block 271 and the fixed block 273, and abut against the fixed block 273. The elastic member 279 can be connected between the fixed block 273 and the adjusting block 271 to pull the adjusting block 271 close to the fixed block 273. The adjusting rod 275 can also be a micrometer product, and the micrometer housing can be connected to the adjusting block 271, and the adjusting block 271 can be connected to the sliding block of the optical displacement sensor 191.

[0106] As another example, the position adjusting assembly 270 can include a fixed block 271, an adjusting block 273, an adjusting rod 275, and an elastic member 279. The fixed block 271 can be fixedly connected to the mounting frame 110, and the adjusting block 273 can be arranged at a distance from the fixed block 271 along the second direction X and movably connected to the mounting frame 110. The adjusting rod 275 can be threadedly connected to the adjusting block 273 and partially extend between the adjusting block 273 and the fixed block 271, and abut against the adjusting block 273. The elastic member 279 can be connected between the fixed block 271 and the adjusting block 273 to pull the adjusting block 273 close to the fixed block 271.

[0107] It can be understood that the adjusting rod 275 can be manually rotated or controlled to rotate by an electric mode.

[0108] The optical displacement sensor 191 can be connected to the adjusting block 273 and located on one side of the reflector 193 along the second direction X. The adjusting rod 275 can push the adjusting block 273 away from or close to the fixed block 271 when rotated, so as to adjust the distance between the optical displacement sensor 191 and the reflector 193. The elastic member 279 and the adjusting rod 275 can cooperate to position the adjusting block 273 at a desired position more stably, which helps the optical displacement sensor 191 to measure the displacement data of the test vane 170 more stably.

[0109] As another example, the position adjusting assembly 270 can have a screw rod structure. The adjusting block 273 can be connected to the screw rod, and the optical displacement sensor 191 can be connected to the adjusting block 273. The screw rod can drive the adjusting block 273 to move back and forth along the screw rod when rotated, so as to adjust the distance between the optical displacement sensor 191 and the reflector 193.

[0110] It should be noted that the position adjusting assembly 270 can also adopt other adjusting structures, and the above is only an example for the purpose of understanding.

[0111] In some embodiments, the testing device 100 can further comprise an aperture measuring assembly 290, which can be connected to the mounting frame 110, for measuring aperture data of the vacuum hole 530, so that the testing device 100 can measure the aperture of the vacuum hole 530, which helps the control device to directly analyze the aperture data, displacement data and force data, without the need for artificial measurement of the aperture of the vacuum hole 530 in advance, thereby reducing the possibility of recording or measurement errors and improving the accuracy of the testing device.

[0112] As an example, the aperture measuring assembly 290 can adopt a laser measuring instrument, an ultrasonic measuring instrument, an image measuring instrument or other devices that can measure the aperture.

[0113] In some embodiments, the aperture measuring assembly 290 can comprise a camera assembly 291, which can be connected to the mounting frame 110.

[0114] As an example, the camera assembly 291 can be connected to the third support plate 115. The camera assembly 291 can comprise a camera 2911, a lens 2913 and a light source 2915. The camera 2911 can be connected to the third support plate 115, and the lens 2913 can be connected to the camera 2911 and opposite to the reflector 193. The light source 2915 can be connected to one side of the lens 2913 along the second direction X to provide light for the camera 2911.

[0115] The camera assembly 291, the reflector 193 and the test sheet 170 can be sequentially distributed.

[0116] As an example, the camera assembly 291, the reflector 193 and the test sheet 170 can be sequentially distributed along the first direction Y.

[0117] The test sheet 170 can have a transparent part, which can be arranged opposite to the camera assembly 291. The reflector 193 can be a transparent structure, and the camera assembly 291 is adapted to shoot the vacuum hole 530 through the reflector 193 and the transparent part, so as to measure the aperture of the vacuum hole 530, thereby avoiding the reflector 193 from shielding the lens 2913, and helping to take clearer photos of the vacuum hole 530 for better measurement of the aperture of the vacuum hole 530.

[0118] As an example, the test sheet 170 can adopt a transparent structure, for example, the test sheet 170 can adopt transparent acrylic or other transparent materials.

[0119] It should be noted that the camera assembly 291 and the displacement measurement assembly can work in intervals to avoid the light source 2915 of the camera assembly 291 affecting the shooting effect of the camera assembly 291 or the light source 2915 of the camera assembly 291 affecting the measurement effect of the measurement light of the displacement measurement assembly.

[0120] In some embodiments, the camera assembly 291 can be in communication connection with the control device to transmit the pictures of the vacuum hole 530 to the control device, and the control device can perform picture analysis processing to obtain the aperture data of the vacuum hole 530.

[0121] In some embodiments, the distribution direction of the camera assembly 291, the test mask 170, and the reflector 193 is arranged at an angle with the distribution direction of the reflector 193 and the optical displacement sensor 191, and the reflector 193 is arranged between the optical displacement sensor 191 and the camera assembly 291, which helps to make the camera assembly 291 and the optical displacement assembly more compact, and helps to make the overall structure of the test device 100 more compact and reduce the volume of the test device 100.

[0122] As an example, the camera assembly 291, the reflector 193, and the test mask 170 can be distributed in sequence along a first direction Y, and the reflector 193 and the optical displacement sensor 191 can be distributed along a second direction X.

[0123] In some embodiments, the reflector 193 can be a semi-transparent semi-reflective prism, a light-transmitting mirror, or other devices that have both light-transmitting and reflecting effects.

[0124] As an example, the semi-transparent semi-reflective prism can include two triangular prisms connected in opposite inclined surfaces, and a semi-transparent semi-reflective film can be arranged on the inclined surface. The measurement light reflected by the optical displacement sensor 191 can be directed between the two triangular prisms and reflected by the semi-transparent semi-reflective film arranged on the inclined surface to the test mask 170, and the semi-transparent semi-reflective film can also reflect the measurement light reflected by the test mask 170 to the optical displacement sensor 191. The camera assembly 291 can shoot pictures of the vacuum hole 530 through the semi-transparent semi-reflective film and the transparent part of the test mask 170.

[0125] As another example, the light-transmitting mirror can be arranged obliquely between the camera assembly 291 and the test mask 170, and a metal film inclined toward the optical displacement sensor 191 and the test mask 170 can be arranged on the inclined surface, and the metal film has the effects of light transmission and reflection to reflect the measurement light reflected by the optical displacement sensor 191 to the test mask 170 and reflect the measurement light reflected by the test mask 170 to the optical displacement sensor 191. The camera assembly 291 can shoot pictures of the vacuum hole 530 through the metal film and the transparent part of the test mask 170.

[0126] In some embodiments, the testing device 100 can further include a housing 310 connected to the mounting frame 110 and provided with a receiving space. The reflecting member 193, the lens 2913 and the optical displacement sensor 191 are all arranged in the receiving space, so that the influence of ambient light on the measurement effect can be reduced.

[0127] The specific structure and working principle of the half-mirror and light-transmitting mirror can refer to the prior art, and the above is only an example for understanding.

[0128] Please refer to the accompanying drawings Figure 5 The embodiments of the present application also provide a testing method which can be applied to the testing device. The testing method includes steps S010, S020, S030, S040, S050 and S060.

[0129] Step S010: The control device controls the driving assembly to drive the test baffle to move towards the outer surface of the object to be tested by a first preset displacement amount.

[0130] The control device can control the driving assembly to move the force measuring assembly in the first direction, and each time the force measuring assembly moves by a first preset displacement amount to gradually approach the outer surface of the object (i.e. approach the vacuum hole). When the force measuring assembly moves, the test baffle moves synchronously.

[0131] It should be noted that in the embodiments of the present application, the movement of the test baffle towards the outer surface of the object to be tested can refer to the movement of the test baffle towards the vacuum hole on the outer surface of the object to be tested.

[0132] The first preset displacement amount can have various setting modes.

[0133] As an example, the first preset displacement amount can be a certain numerical value, for example, the first preset displacement amount can be 1mm, 2mm, 4mm or other numerical values. Taking the first preset displacement amount of 1mm as an example, the control device can control the driving assembly to drive the test baffle to move towards the outer surface of the object to be tested by 1mm each time, so as to gradually approach the outer surface of the object to be tested after multiple movements.

[0134] As another example, the driving assembly can be started step by step to drive the test baffle to gradually move, i.e. the driving assembly stops after running for a first preset time each time. The first preset time can be 1s, 2s, 5s or other time lengths. Taking the preset time of 1s as an example, the control device can control the driving assembly to stop after running for 1s each time, so as to drive the test baffle to gradually approach the outer surface of the object to be tested. It can be understood that at this time, the test baffle still moves by a first preset displacement amount each time.

[0135] In some embodiments, the testing device can further include a vacuum pumping device which can extract external airflow through the vacuum hole.

[0136] Before step S010, the test method can further include the following steps:

[0137] 1) Turn on the vacuum device, draw external air flow through the vacuum hole, and measure the vacuum value (air pressure value) and flow rate;

[0138] 2) Control the camera assembly to take picture data of the vacuum hole, and obtain aperture data of the vacuum hole according to the picture data.

[0139] Thus, the vacuum value and flow rate of the vacuum device can be obtained, and are matched with the aperture data of the tested vacuum hole. The control device can store the above data for subsequent corresponding analysis.

[0140] Step S020: When the test stopper moves a first preset displacement, corresponding first force data and first displacement data are obtained.

[0141] The first force data is obtained according to the force measurement assembly measuring the force of the test stopper, and the first displacement data is obtained according to the displacement measurement assembly measuring the displacement of the test stopper.

[0142] When the test stopper moves a first preset displacement, the driving assembly can stop driving to keep the test stopper at the current position, so as to leave measurement time for the force measurement assembly and the displacement measurement assembly to more accurately measure the first force data and the second displacement data, thereby improving the measurement accuracy.

[0143] As an example, when the test stopper moves a preset displacement, the test stopper is kept at the current position for a second preset time length, for example, the second preset time length can be 1s, 2s, 5s or other time lengths, which can be set according to requirements.

[0144] Step S030: When the test stopper moves a first preset displacement, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, the driving assembly is controlled to drive the test stopper to move away from the outer surface according to a second preset displacement.

[0145] In this way, it is helpful to avoid the test stopper continuously pressing the outer surface of the object to be tested, causing damage to the test stopper, the object to be tested or other structural parts, thereby improving the test safety and prolonging the service life of the test device.

[0146] Specifically, when the test baffle completely adheres to and abuts against the outer surface of the object to be tested and covers the vacuum hole, at this time the test baffle is still driven to move towards the object to be tested, the test baffle blocks the movement of the test baffle, and the first displacement data will remain unchanged. When the test baffle just adheres to the outer surface of the object to be tested and completely covers the vacuum hole, at this time the test baffle bears the maximum suction force from the vacuum hole, and the test baffle bears a smaller resistance force from the object to be tested, at this time the first force data reaches a maximum value, and the preset force threshold can be set as the maximum value of the first force data, which can be obtained through experiments.

[0147] It should be noted that the preset force threshold can also be set to be slightly smaller than the maximum value of the first force data, so as to improve the accuracy of the test and help reduce the test error.

[0148] Specifically, when the first displacement data remains unchanged, the driving assembly can still drive the test baffle to move in the direction of the object to be tested by a first preset displacement amount, at this time the resistance force applied by the object to be tested to the test baffle increases, and the first force data decreases from the maximum value. The preset force threshold can be designed as this value, so as to ensure that the force measurement data can measure more complete data of the force borne by the test baffle.

[0149] The preset force threshold can be obtained through experiments in advance.

[0150] Step S040: When the test baffle moves by a second preset displacement amount, corresponding second force data and second displacement data are obtained.

[0151] The second force data is obtained according to the force measurement component measuring the force borne by the test baffle, and the second displacement data is obtained according to the displacement measurement component measuring the displacement of the test baffle.

[0152] The measurement process of the second force data and the second displacement data is substantially the reverse process of the measurement of the first force data and the second displacement data in step S020, and the setting mode of the second preset displacement amount can refer to the setting mode of the first preset displacement amount in step S020, which will not be described herein.

[0153] The first preset displacement amount and the second preset displacement amount can be equal or not equal, which can be designed according to requirements.

[0154] It should be noted that the displacement measurement component can measure the first displacement data and the second displacement data with the origin of the inverse element or the optical displacement sensor, to obtain the first displacement data and the second displacement data of the test baffle.

[0155] As an example, the displacement optical sensor can measure the longitudinal coordinate value of the test flag relative to the origin along the first direction each time when the measurement is made with the origin of the reflector or the optical displacement sensor, so as to obtain the first displacement data and the second displacement data of the test flag.

[0156] Step S050: obtaining the corresponding first spacing data between the test flag and the outer surface according to each first displacement data, and obtaining the corresponding second spacing data between the test flag and the outer surface according to each second displacement data.

[0157] In this way, the force corresponding to each position of the test flag can be one-to-one corresponding, so as to facilitate subsequent analysis.

[0158] Specifically, taking the origin of the reflector or the optical displacement sensor as an example, when the test flag moves two first preset displacement amounts and the measured first force data of the force measuring assembly remains unchanged, it can be understood that the test flag abuts against the outer surface and completely covers the vacuum hole at this time, so that the maximum distance of the object to be measured along the first direction relative to the origin can be obtained. The difference between the maximum distance and the displacement data (the first displacement data and the second displacement data) can be the spacing between the test flag and the outer surface of the object to be measured, so that the spacing data (the first spacing data and the second spacing data) can be obtained.

[0159] Step S060: drawing the corresponding relationship diagram according to the first displacement data, the first force data, the second displacement data and the second force data.

[0160] Specifically, the relationship diagram can be a curve relationship diagram. As shown in Figure 6 , the first relationship curve W can be obtained according to the first displacement data and the first force data, and the first relationship curve P can be obtained according to the second displacement data and the second force data.

[0161] In this way, the suction force of the vacuum hole corresponding to the spacing between the test flag and the vacuum hole (the horizontal coordinate in Figure 6 , that is, the spacing data in the above embodiment) under vacuum holes of different sizes can be intuitively obtained according to the first relationship curve W and the first relationship curve P (the vertical coordinate in Figure 6 , that is, the force data in the above embodiment), which provides relevant information and basis for designing the vacuum holes on the semiconductor production or test equipment, and facilitates subsequent research and development personnel to better set the size, number and the like of the vacuum holes in the semiconductor production or test equipment.

[0162] As shown in Figure 6 and Figure 7 , taking the first relationship curve W as an example, the left segment of the dot a in Figure 6 corresponds to Figure 7Block diagram (section A) shows the test baffle approaching the vacuum hole (i.e., the outer surface). The suction force Fp from the vacuum hole gradually increases from 0. The closer the test baffle approaches the vacuum hole, the greater the increase in Fp. Due to the effect of Fp, the test baffle deforms, and so does the second connecting portion and the force sensor, allowing the value of Fp to be measured. Understandably, at this point, the first force data F1 measured by the force sensor equals Fp.

[0163] Section B Figure 6 Between point a and point b, corresponding to Figure 7 The block diagram (part B) in FIG. 1 shows that the end of the test baffle away from the second connecting portion abuts against the outer surface of the object to be tested, and the outer surface generates a resistance force Ft on the test baffle.

[0164] Since the test baffle is a cantilever beam structure, as the test baffle gradually moves toward the surface of the vacuum hole, the front end of the test baffle will first contact the outer surface of the object to be tested under the action of suction. At this time, the test baffle is subjected to a resistance force Ft generated by the outer surface. At this time, the first force data F1 measured by the force sensor is Fp + Ft. It should be noted that since the thrust Ft is a reaction force in the opposite direction of the suction force Fp, the thrust Ft is a negative value relative to the suction force Fp. Therefore, the suction value F1 measured by the force sensor decreases. At the same time, the front end of the test baffle will also generate a torque L*Ft. Under the action of the torque, the front end of the test baffle will produce a slight deformation in the opposite direction and upward. As the front end of the test baffle gradually contacts the surface of the vacuum hole, the direction of the resistance force Ft gradually shifts toward the second connecting part until it remains in the same direction as the direction of the suction force Fp.

[0165] Segment C Figure 6 Between the middle point b and the point d, corresponding to Figure 7 Block diagram (section C) shows the test barrier partially abutting the outer surface of the object under test, closing the vacuum hole. During this period, the force sensor measures a gradual increase in F1, at which point the torque L*Ft disappears. The first force data measured by the force sensor is now F1 = Fp + Ft, and F1 gradually approaches its maximum value.

[0166] D segment ( Figure 6 Between the middle point c and the point d, corresponding to Figure 7 The block diagram (part D) in FIG. 1 shows that the test baffle is completely attached to and against the outer surface of the object to be tested, and the test baffle completely closes the vacuum hole. At this time, the first force data F1 measured by the force sensor is equal to Fp+Ft.

[0167] At this time, the first displacement data of the test block stops changing, and the test block still moves towards the outer surface of the object under test as the driving assembly is driven, and the resistance Ft continues to increase. At this time, the first force F1 measured by the force sensor decreases, and after decreasing to a preset force threshold, the test block stops moving towards the side of the vacuum hole in the first direction. The control device controls the driving assembly to drive the test block to move away from the outer surface of the object under test in the first direction. That is, when the first displacement data remains unchanged and the first force data measured by the force sensor reaches the preset force threshold, the control device controls the driving assembly to drive the test block to move away from the outer surface of the object under test.

[0168] It should be noted that when the test block is separated from the vacuum hole and the vacuum hole is completely adsorbed, the force data F1 measured by the force sensor will change abruptly. This is because when the test block is separated from the vacuum hole, a negative pressure closed cavity is formed between the test block and the vacuum hole, so that a certain negative pressure state is maintained in the environment without constant negative pressure, so that the vacuum hole still maintains the suction force. When the suction force of the vacuum hole is cancelled, the original vacuum state needs to be broken to balance the pressure on both sides, so that the value of F1 will decrease significantly.

[0169] It can be understood that when the test block moves away from the outer surface of the object under test, the change of the curve can also refer to the above-mentioned A section, B section, C section and D section, which will not be described again.

[0170] After obtaining the relationship curve of the force data and the distance data, the required information can be obtained from the relationship curve, such as the maximum suction force value of the vacuum hole under the corresponding hole diameter (approximately Figure 6 The maximum suction force value can represent the maximum adsorption force of the vacuum hole of this size on the object under test, and the research and development personnel can design the vacuum hole on the semiconductor production or test equipment according to the maximum adsorption force.

[0171] In addition, the relationship curve also represents the relationship between the suction force (force data) of the vacuum hole and the height (i.e. distance data) between the test block and the vacuum hole. For some products, it is necessary to control the distance between the product and the vacuum hole, so that the vacuum hole is arranged at a distance from the product to avoid damaging the product when the vacuum hole and the product come into contact. At this time, the research and development personnel can obtain the corresponding suction force of the semiconductor wafer at different distances from the vacuum hole according to the relationship curve, so as to select a more optimal distance between the vacuum hole and the semiconductor wafer.

[0172] In addition, the researchers can also perform the above test on multiple vacuum holes to obtain a relationship curve of the vacuum holes according to different hole diameters, so as to design the size of the vacuum holes. For example, the hole diameter and the maximum suction force (the maximum first force data) of the vacuum hole can be established as a hole diameter and maximum suction force table as shown in the following table, so that the appropriate hole diameter can be selected according to the maximum suction force required by the product, and the maximum suction force that can be achieved by the vacuum hole can also be queried according to the hole diameter.

[0173] Number of holes Aperture Maximum absorption force 1 D(1) Fmax(1) 2 D(2) Fmax(2) 3 D(3) Fmax(3) ...... ...... ...... i D(i) Fmax(i)

[0174] It should be noted that if the required hole diameter of the vacuum hole is not reflected in the above table, the adjacent data is estimated to obtain the closest maximum suction force data. For example, the hole diameter D(x) of the vacuum hole is between D(j) and D(j+1), and the maximum suction force corresponding to the hole diameter D(x) can be estimated according to the following formula:

[0175]

[0176] In the test device 100, the test equipment and the test method provided by the embodiment of the application, the test baffle 170 is driven by the driving assembly 130 to approach or move away from the outer surface 510 of the object to be tested 500, the airflow in the vacuum hole 530 generates suction force on the test baffle 170, the force measurement assembly 150 can measure the force data, the displacement measurement assembly 150 can measure the displacement data of the test baffle 170, and the control device can obtain the spacing data between the test baffle 170 and the outer surface 510 according to the displacement data, so that the one-to-one corresponding spacing data and the force data can be obtained, and the suction force of the vacuum hole 530 corresponding to different distances between the test baffle 170 and the vacuum hole 530 can be obtained. Therefore, the researchers can use this as a reference to design the vacuum holes 530 on the semiconductor production or test equipment, such as the hole diameter, the number of the vacuum holes 530, the distance between the semiconductor wafer and the vacuum hole 530 (i.e. the distance between the semiconductor wafer and the outer surface 510), and the like.

[0177] The above embodiments of the application are described in detail in combination with the drawings, but the application is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the application. In addition, the embodiments of the application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A testing device, characterized in that: Applicable to a test device, the test device comprising a control device in communication with the test device, the test device comprising: Mounting rack; a drive assembly connected to the mounting frame; a force measurement assembly and a test baffle, wherein the force measurement assembly is connected to a driving end of the drive assembly, and the test baffle is connected to the force measurement assembly, wherein the drive assembly is adapted to drive the test baffle toward or away from an outer surface of an object to be measured via the force measurement assembly; the object to be measured is provided with a vacuum hole located on the outer surface, the vacuum hole being opposite to the test baffle and being configured to generate suction on the test baffle; a displacement measuring assembly connected to the mounting frame; An aperture measurement assembly, connected to the mounting frame, for measuring aperture data of the vacuum hole; The force measurement component is used to measure the force data of the test baffle, and the displacement measurement component is used to measure the displacement data of the test baffle; the control device is configured to obtain the distance data between the test baffle and the outer surface based on the displacement data, and the distance data and the force data correspond one-to-one to obtain the suction force of the vacuum hole corresponding to different distances between the test baffle and the vacuum hole.

2. The testing device according to claim 1, wherein: The force measurement assembly further includes a bracket and a force sensor, wherein the bracket is connected to the driving end of the driving assembly, and the force sensor is connected between the bracket and the test baffle; The driving assembly is adapted to drive the bracket to move back and forth, and the force sensor is adapted to measure the force applied to the test baffle.

3. The testing device according to claim 1, wherein: The displacement measurement assembly includes an optical displacement sensor and a reflector, and both the optical displacement sensor and the reflector are connected to the mounting frame; The reflector is located in a propagation path of the measuring light emitted by the optical displacement sensor, and is used to reflect the measuring light to the test patch. The measuring light reflected by the test patch is reflected by the reflector to the optical displacement sensor. The optical displacement sensor is used to measure the displacement data of the test patch according to the reflected measurement light.

4. The testing device according to claim 3, characterized in that The force measurement assembly further includes a reflector, which is connected to the test baffle and located in the propagation path of the measurement light, and is used to reflect the measurement light to the reflective member.

5. The testing device according to claim 3, characterized in that: The testing device also includes a position adjustment component, which is connected to the mounting bracket. The optical displacement sensor is connected to the position adjustment component, and the position adjustment component is used to adjust the distance between the optical displacement sensor and the reflector.

6. The testing device according to claim 3, characterized in that: The aperture measurement assembly includes a camera assembly, the camera assembly is connected to the mounting frame, and the camera assembly, the reflector and the test patch are distributed in sequence; The test shield has a transparent portion, and the transparent portion and the camera assembly are arranged opposite to each other; The reflective member is a transparent structure; The camera assembly is suitable for photographing the vacuum hole through the reflective element and the transparent portion to measure the aperture of the vacuum hole.

7. The testing device according to claim 6, characterized in that The distribution direction of the camera assembly, the reflector and the test patch is arranged at an angle to the distribution direction of the reflector and the optical displacement sensor.

8. A testing device, characterized in that: include: control devices; as well as According to the testing device according to any one of claims 1 to 7, the control device is communicatively connected to the testing device, and the control device is configured to obtain spacing data between the test baffle and the outer surface based on the displacement data, and to draw a relationship diagram based on the spacing data and the force data.

9. A testing method, characterized in that: Applied to the test device according to claim 8, the test method comprises: The control drive assembly drives the test baffle to move toward the outer surface of the object to be tested according to a first preset displacement through the force measurement assembly, wherein the object to be tested is provided with a vacuum hole located on the outer surface, the vacuum hole and the test baffle are opposite to each other and are used to generate suction force on the test baffle; When the test block moves by the first preset displacement, corresponding first force data and first displacement data are acquired; When the test blocking piece moves by the first preset displacement, if the first displacement data remains unchanged and the first force data reaches a preset force threshold, controlling the driving assembly to drive the test blocking piece to move according to a second preset displacement to move away from the outer surface; When the test block moves by the second preset displacement, corresponding second force data and second displacement data are acquired; Obtaining first distance data corresponding to the test patch and the outer surface according to each first displacement data, and obtaining second distance data corresponding to the test patch and the outer surface according to each second displacement data; Draw a corresponding relationship diagram according to the first displacement data, the first force data, the second displacement data, and the second force data; The first force data and the second force data are both obtained by measuring the force of the test baffle by the force measurement component, and the first displacement data and the second displacement data are both obtained by measuring the displacement of the test baffle by the displacement measurement component.

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