Continuous cleaning production line

Abstract

The invention provides a continuous cleaning production line which comprises an initial inspection area used for conducting preliminary inspection on to-be-cleaned parts so as to record the to-be-cleaned parts meeting set requirements; the rough cleaning area is located at the downstream of the initial inspection area so as to carry out primary cleaning on the to-be-cleaned component conveyed to the rough cleaning area from the initial inspection area, and an initial finished product is obtained; the fine cleaning area is located at the downstream of the rough cleaning area and is used for carrying out secondary cleaning on the initial finished product so as to carry out secondary cleaning on dirt attached to the initial finished product, and a finished product is obtained; the post-processing area is located at the downstream of the fine cleaning area and used for packaging and delivering finished products; the problem that in the prior art, cleaning efficiency is reduced due to cleaning at different stations is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a continuous cleaning production line. Background Art

[0002] In the cleaning process of parts related to semiconductor production equipment, traditional precision cleaning methods usually adopt a multi-station decentralized cleaning process. In this process, parts need to be transferred between multiple independent stations, including pretreatment, chemical cleaning, intermediate inspection, drying, post-processing and other steps. Among them, each station is operated independently, and manual or semi-automatic equipment is required to transfer parts, which not only increases the complexity of operation, but also leads to reduced cleaning efficiency and potential contamination risks during the cleaning process. In addition, switching between multiple stations also means higher water and energy consumption, as well as longer cleaning cycles. These factors together limit the application of traditional cleaning methods under high-precision and high-efficiency cleaning requirements.

[0003] With the rapid development of semiconductor technology, the requirements for the cleaning quality of parts are increasing day by day. The traditional dispersed cleaning process can no longer meet the needs of modern semiconductor manufacturing. Especially for the cleaning of precision parts, a more stringent cleaning environment and more sophisticated cleaning steps are required to ensure the removal of tiny oil stains and particles on the surface of parts to achieve the high cleanliness standards required for semiconductor manufacturing. Summary of the invention

[0004] The main purpose of the present invention is to provide a continuous cleaning production line to solve the problems of reduced cleaning efficiency caused by separate station cleaning in the prior art.

[0005] In order to achieve the above object, according to one aspect of the present invention, a continuous cleaning production line is provided, comprising:

[0006] The initial inspection area is used to conduct a preliminary inspection of the parts to be cleaned, so as to record the parts to be cleaned that meet the set requirements;

[0007] A rough washing area, which is located downstream of the initial inspection area, is used to wash the parts to be cleaned that are transported from the initial inspection area to the rough washing area to obtain an initial finished product;

[0008] The fine washing area is located downstream of the rough washing area to perform secondary washing on the initial finished product to perform secondary washing on the dirt attached to the initial finished product to obtain the finished product;

[0009] Post-processing area: The post-processing area is located downstream of the fine washing area to package and ship the finished products.

[0010] Further, the initial inspection area includes:

[0011] Appearance inspection room: the appearance inspection room is used to screen the parts to be cleaned, so as to select the parts to be cleaned that meet the set requirements;

[0012] The warehouse registration room is located downstream of the appearance inspection room. A detection component is provided in the warehouse registration room to record the number of parts to be cleaned that meet the set requirements when receiving the parts to be cleaned that meet the set requirements.

[0013] Further, the rough wash zone includes:

[0014] A chemical cleaning area, in which a cleaning component is provided to chemically clean the parts to be cleaned so as to preliminarily remove dirt on the parts to be cleaned;

[0015] A primary inspection area, which is located downstream of the chemical cleaning area to perform a primary inspection on the parts to be cleaned after cleaning in the chemical cleaning area to obtain an initial finished product;

[0016] The first storage area is located downstream of the primary inspection area to store initial finished products.

[0017] Further, the cleaning component includes:

[0018] A cleaning machine, wherein cleaning liquid is stored in the cleaning machine for cleaning the parts to be cleaned;

[0019] A soaking box, in which a cleaning solution is stored, for soaking the parts to be cleaned after being cleaned by the self-cleaning machine;

[0020] A rinsing box, in which rinsing liquid is stored, for rinsing the parts to be cleaned after being soaked in the soaking box;

[0021] A first rinser for rinsing the parts to be cleaned after rinsing in the rinse tank;

[0022] The air-drying parts are used to dry the parts to be cleaned after being rinsed by the first rinser, so as to preliminarily remove the dirt on the parts to be cleaned.

[0023] Furthermore, the first-level inspection area includes:

[0024] The first air shower door is used to spray liquid on the initial finished product to remove dust attached to the initial finished product;

[0025] The bearing component is used to bear the components to be dusted after being cleaned by the first air shower door, so that the first dust removal component arranged on one side of the bearing component can perform dust removal operation on the components to be dusted.

[0026] Furthermore, the first storage area includes:

[0027] Temporary storage racks are used to temporarily store initial finished products;

[0028] The second dust removal component is arranged at one side of the temporary storage rack to perform dust removal operation on the initial finished products on the temporary storage rack.

[0029] Further, the fine washing area includes:

[0030] The primary cleaning area is used to clean the initial finished product to obtain a primary cleaning product;

[0031] The secondary cleaning area is located downstream of the primary cleaning area to clean the primary cleaning product to obtain a finished product.

[0032] Furthermore, the primary cleaning area includes:

[0033] The second air shower door, the first cleaning tank, the second rinser and the dust-free oven are arranged in sequence along the cleaning direction of the continuous cleaning production line to spray, clean, rinse and dry the finished product in sequence to obtain the original primary cleaning product;

[0034] The primary cleaning area also includes:

[0035] The third dust removal component is used to remove dust from the original primary cleaning product to obtain a primary cleaning product.

[0036] Further, the secondary cleaning area includes:

[0037] The second cleaning tank, the third rinser, the third air dryer and the vacuum oven are arranged in sequence along the transport direction of the continuous cleaning production line to perform dust removal, cleaning, rinsing, air drying and vacuum drying on the first-level cleaning products;

[0038] The secondary cleaning area also includes:

[0039] The fourth dust removal component is used to remove dust from the first-level cleaning product after being dried in the vacuum oven to obtain a finished product.

[0040] Further, the post-processing area includes:

[0041] The packaging area includes a darkroom, an inspection table, a vacuum packaging machine, and a fourth air shower door arranged in sequence to package the finished products;

[0042] The post-processing area also includes:

[0043] The fifth dust removal component is used to remove dust from the packaged finished products so as to transport them to the shipping area;

[0044] Among them, a detection component is installed in the darkroom to detect whether there are defects on the finished product, and a dust particle counter is installed on the inspection table to detect the amount of dust or dust on the finished product; a finished product storage rack is provided in the shipping area to store the finished products after being packaged by the packaging area.

[0045] By applying the technical solution of the present invention, the automated cleaning process greatly shortens the cleaning cycle, improves production efficiency, and reduces labor costs; through multi-stage cleaning and precision testing, it ensures that the surface cleanliness of the cleaned parts meets the high standards required for semiconductor manufacturing, significantly reducing the equipment failure rate caused by contaminants.

[0046] The rationally designed cleaning process reduces the consumption of chemical solvents and water. At the same time, it reduces energy consumption by reducing unnecessary workstation switching, reflecting the concept of environmental protection and energy saving.

[0047] Each area of ​​the production line has a clear division of labor and is interconnected. The cleaning parameters and processes can be flexibly adjusted according to the characteristics and cleaning requirements of different parts, which improves the adaptability of the production line.

[0048] In summary, the present invention provides an efficient, environmentally friendly, and highly adaptable precision cleaning production line, which provides an advanced solution for the precision cleaning of parts and components related to semiconductor production equipment, effectively improves the cleaning quality and efficiency, reduces production costs, and shortens the impact of regional supply on the cleaning needs of precision parts, bringing significant technological progress to the semiconductor manufacturing industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0050] Figure 1 A schematic diagram of the process of a continuous cleaning production line according to an embodiment of the present application is shown.

[0051] The above drawings include the following reference numerals:

[0052] 1. Initial inspection area; 101. Appearance inspection room; 102. Warehouse registration room;

[0053] 2. Rough washing area; 201. Chemical washing area; 2011. Washing machine; 2012. Soaking box; 2013. Rinsing box; 2014. First washing machine; 202. Primary inspection area; 2021. First air shower door; 2022. Carrying component; 2023. First dust removal component; 203. First storage area; 2031. Temporary storage rack; 2032. Second dust removal component;

[0054] 3. Fine cleaning area; 301. Primary cleaning area; 3011. Second air shower door; 3012. First cleaning tank; 3013. Second rinser; 3014. Dust-free oven; 3015. Third dust removal component; 302. Secondary cleaning area; 3021. Second cleaning tank; 3022. Third rinser; 3023. Vacuum oven; 3024. Fourth dust removal component;

[0055] 4. Post-processing area; 401. Packaging area; 4011. Darkroom; 4012. Inspection table; 4013. Vacuum packaging machine; 4014. Fourth air shower door; 4015. Fifth dust removal component; 402. Shipping area. DETAILED DESCRIPTION

[0056] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0057] In the cleaning process of parts related to semiconductor production equipment, traditional precision cleaning methods usually adopt a multi-station decentralized cleaning process. In this process, parts need to be transferred between multiple independent stations, including pretreatment, chemical cleaning, intermediate inspection, drying, post-processing and other steps. Among them, each station is operated independently, and manual or semi-automatic equipment is required to transfer parts, which not only increases the complexity of operation, but also leads to reduced cleaning efficiency and potential contamination risks during the cleaning process. In addition, switching between multiple stations also means higher water and energy consumption, as well as longer cleaning cycles. These factors together limit the application of traditional cleaning methods under high-precision and high-efficiency cleaning requirements.

[0058] With the rapid development of semiconductor technology, the requirements for the cleaning quality of parts are increasing day by day. The traditional dispersed cleaning process can no longer meet the needs of modern semiconductor manufacturing. Especially for the cleaning of precision parts, a more stringent cleaning environment and more sophisticated cleaning steps are required to ensure the removal of tiny oil stains and particles on the surface of parts to achieve the high cleanliness standards required for semiconductor manufacturing.

[0059] The main purpose of the present invention is to provide a continuous cleaning production line to solve the problems of reduced cleaning efficiency caused by separate station cleaning in the prior art.

[0060] The continuous cleaning production line provided in this application includes:

[0061] Initial inspection area 1 is used to conduct preliminary inspection on the parts to be cleaned, so as to record the parts to be cleaned that meet the set requirements;

[0062] Rough washing zone 2, which is located downstream of the initial inspection zone 1, to wash the parts to be cleaned transported from the initial inspection zone 1 to the rough washing zone 2 to obtain an initial finished product;

[0063] Fine washing zone 3, which is located downstream of rough washing zone 2, is used to perform secondary washing on the initial finished product, to perform secondary washing on the dirt attached to the initial finished product, so as to obtain the finished product;

[0064] Post-processing zone 4 is located downstream of fine washing zone 3 to package and ship the finished products.

[0065] like Figure 1 As shown in the figure, the automated cleaning process greatly shortens the cleaning cycle, improves production efficiency and reduces labor costs; through multi-stage cleaning and precision inspection, it ensures that the surface cleanliness of the cleaned parts meets the high standards required for semiconductor manufacturing, significantly reducing the equipment failure rate caused by contaminants.

[0066] The rationally designed cleaning process reduces the consumption of chemical solvents and water. At the same time, it reduces energy consumption by reducing unnecessary workstation switching, reflecting the concept of environmental protection and energy saving.

[0067] Each area of ​​the production line has a clear division of labor and is interconnected. The cleaning parameters and processes can be flexibly adjusted according to the characteristics and cleaning requirements of different parts, which improves the adaptability of the production line.

[0068] In summary, the present invention provides an efficient, environmentally friendly, and highly adaptable precision cleaning production line, which provides an advanced solution for the precision cleaning of parts and components related to semiconductor production equipment, effectively improves the cleaning quality and efficiency, reduces production costs, and shortens the impact of regional supply on the cleaning needs of precision parts, bringing significant technological progress to the semiconductor manufacturing industry.

[0069] Further, the initial inspection area 1 includes: an appearance inspection room 101, which is used to screen the parts to be cleaned to screen out the parts to be cleaned that meet the set requirements;

[0070] The warehouse registration room 102 is located downstream of the appearance inspection room 101. A detection component is provided in the warehouse registration room 102 to record the number of the parts to be cleaned that meet the set requirements when receiving the parts to be cleaned that meet the set requirements.

[0071] The initial inspection area 1 is further subdivided into an appearance inspection room 101 and an incoming registration room 102, forming a more refined management and inspection process.

[0072] Appearance Inspection Room 101: This appearance inspection room 101 is equipped with high-precision visual inspection equipment and manual inspection stations for preliminary inspection and screening of parts to be cleaned. The visual inspection equipment can quickly identify defects on the surface of parts, such as scratches, pits, contamination points, etc., to ensure that only parts with surface conditions that meet the set requirements can enter the subsequent cleaning process, avoiding the impact of low-quality parts on cleaning efficiency and cost. Parts that pass the appearance inspection will be sent to the storage registration room 102 through the conveying system.

[0073] The warehouse registration room 102 is located downstream of the appearance inspection room 101. Its key function is to record the number of parts to be cleaned that have passed the appearance inspection, as well as detailed information about the parts, such as model, batch, etc. The warehouse registration room 102 is equipped with an electronic registration system and inspection components, which automatically identify and register the information of each component through barcode or RFID technology, ensuring the accuracy and real-time nature of the data, and facilitating subsequent tracking management and quality control.

[0074] By subdividing the initial inspection area 1 into the appearance inspection room 101 and the storage registration room 102, the present invention realizes efficient screening and accurate recording of the parts to be cleaned, and significantly improves the management efficiency and cleaning quality of the production line.

[0075] The automated visual inspection equipment in Appearance Inspection Room 101 can quickly and accurately identify unqualified parts, avoiding the subjectivity and time consumption of manual inspection, and greatly improving screening efficiency and accuracy.

[0076] The electronic system of the storage registration room 102 can automatically record the information of the parts that have passed the screening, providing accurate data support for the subsequent cleaning process, and also facilitating the traceability and management of the finished products after cleaning.

[0077] By strictly screening and recording before cleaning, the present invention can ensure that cleaning resources (such as chemical solvents, ultrapure water, etc.) are reasonably utilized, avoid ineffective cleaning of parts that do not meet the requirements, reduce production costs, and improve resource utilization.

[0078] The meticulous management process of the initial inspection area 1 lays a solid foundation for quality control of the entire cleaning production line, ensuring that only qualified parts can enter the subsequent precision cleaning process, thereby improving the quality and reliability of the final product.

[0079] In summary, by subdividing the initial inspection area 1 into the appearance inspection room 101 and the warehouse registration room 102, the present invention realizes efficient preprocessing of parts related to semiconductor production equipment, which not only improves the automation level and management efficiency of the production line, but also effectively controls production costs, improves product quality, and provides a strong guarantee for the optimization of the precision cleaning production line.

[0080] Further, the rough cleaning area 2 includes: a chemical cleaning area 201, in which a cleaning component is provided to chemically clean the parts to be cleaned to preliminarily remove dirt on the parts to be cleaned;

[0081] The primary inspection area 202 is located downstream of the chemical cleaning area 201 to perform a primary inspection on the parts to be cleaned after being cleaned in the chemical cleaning area 201 to obtain an initial finished product;

[0082] The first storage area 203 is located downstream of the primary inspection area 202 to store initial finished products.

[0083] Specifically, the rough cleaning area 2 is further subdivided into a chemical cleaning area 201, a primary inspection area 202 and a first storage area 203, forming a complete preliminary cleaning and inspection process.

[0084] The chemical cleaning area 201 is equipped with a variety of chemical cleaning equipment and cleaning components, such as high-pressure pre-cleaning machines, chemical solution immersion tanks, etc., which are used to preliminarily remove dirt such as oil and particles on the parts to be cleaned. The cleaning components select appropriate chemical solvents according to the material and type of pollutants of the parts, and achieve preliminary decontamination effects through immersion, spraying, etc. The parts after chemical cleaning will be sent to the primary inspection area 202.

[0085] The first-level inspection area 202 is set after the chemical cleaning area 201, and is mainly used to check whether the parts after preliminary cleaning meet the predetermined cleaning standards. The inspection area is equipped with professional testing equipment and manual inspection stations to detect residual stains and damage on the surface of the parts. Through the first-level inspection, it is ensured that only parts with surface cleanliness that meet the requirements can continue to enter the fine cleaning area, avoiding unnecessary waste of resources.

[0086] The first storage area 203 is located downstream of the primary inspection area 202 and is used to store the initial finished products that have passed the primary inspection. The storage area maintains appropriate temperature and humidity conditions and is equipped with dust and anti-static facilities to ensure that the cleaned parts will not be contaminated again during the temporary storage process and maintain their clean state. The temporary storage racks in the storage area can be designed according to the size and type of the parts to achieve efficient and orderly storage.

[0087] The high-efficiency cleaning components of the chemical cleaning area 201 can quickly remove oil stains and particulate matter on the surface of the components, providing a good foundation for subsequent precision cleaning and ensuring the initial effect of component cleaning.

[0088] The setting of the first-level inspection area 202 realizes strict quality control of the components after preliminary cleaning, ensuring that only components that meet the requirements of surface cleanliness and integrity can enter the next process, which significantly improves the yield and quality level of the production line.

[0089] Reasonable planning of the first storage area 203 and control of storage conditions ensure that the cleaned parts can be stored safely and orderly, avoid secondary contamination or damage caused by improper storage, and ensure the cleanliness and quality of the parts from rough washing to fine washing.

[0090] By performing preliminary cleaning and strict inspection in the rough cleaning area 2, the present invention realizes the effective utilization of cleaning resources, avoids repeated cleaning of unqualified parts, reduces production costs, and improves overall production efficiency.

[0091] The chemical cleaning area 201 uses environmentally friendly chemical solvents and treatment processes to reduce pollution to the environment and comply with the green production concept.

[0092] In summary, by subdividing the rough cleaning area 2 into the chemical cleaning area 201, the primary inspection area 202 and the first storage area 203, the present invention realizes efficient preliminary cleaning and inspection of the parts related to the semiconductor production equipment, which not only improves the cleaning quality, but also optimizes the production process, realizes resource conservation and environmental friendliness. This refined operation process provides a reliable guarantee for the subsequent fine cleaning and ultra-fine cleaning, ensuring the efficient operation of the entire cleaning production line and the high quality of the finished product.

[0093] Furthermore, the cleaning component includes: a cleaning machine 2011, in which a cleaning liquid is stored to clean the parts to be cleaned;

[0094] A soaking box 2012, in which a cleaning solution is stored, for soaking the parts to be cleaned after being cleaned by the self-cleaning machine 2011;

[0095] A rinsing tank 2013, wherein a rinsing liquid is stored in the rinsing tank 2013 to rinse the parts to be cleaned after being soaked in the soaking tank 2012;

[0096] A first rinser 2014, for rinsing the parts to be cleaned after being rinsed in the rinse tank 2013;

[0097] Air-drying parts: The air-drying parts are used to dry the parts to be cleaned after being rinsed by the first rinser 2014, so as to preliminarily remove dirt on the parts to be cleaned.

[0098] Specifically, the cleaning machine 2011 uses a special cleaning fluid for preliminary decontamination. Through the synergistic effect of mechanical force and chemical reaction, it effectively removes oil and impurities on the surface of components, laying the foundation for subsequent refined cleaning.

[0099] The immersion box 2012 further dissolves and removes stubborn stains through long-term immersion in chemical solutions, ensuring that the cleaning effect penetrates into the tiny gaps and uneven surfaces of the parts to achieve deep cleaning.

[0100] The rinsing box 2013 uses rinsing liquid for rinsing, which is designed to remove chemicals that may remain during the chemical cleaning process, avoid the impact of chemical residues on subsequent processes or equipment performance, and ensure the chemical compatibility and safety of components.

[0101] The first rinser 2014 uses ultrapure water or specific rinse media to finely rinse the rinsed parts, further removing tiny particles and chemical residues to improve the cleanliness of the parts.

[0102] Air-dried parts use high-temperature drying or nitrogen purging to quickly remove moisture from the surface of the parts, avoid the formation of residues during the evaporation of moisture, and prevent oxidation or corrosion of the parts, ensuring the quality and speed of drying.

[0103] The combination of multi-stage cleaning and drying significantly improves the overall cleanliness of components, especially for high-precision, high-demand semiconductor equipment-related components. This deep cleaning can significantly reduce surface contaminants and improve equipment reliability and performance.

[0104] By optimizing the chemical cleaning and rinsing processes, the consumption of chemical solvents and water resources is reduced, the production cost is lowered, and the concept of environmental protection and resource conservation is embodied.

[0105] The automated design of the cleaning components can realize a continuous and rapid cleaning process, improve the overall cleaning efficiency, shorten the production cycle, and meet the semiconductor manufacturing industry's demand for high-efficiency and high-precision cleaning.

[0106] In summary, the present invention realizes a complete chemical cleaning process from preliminary decontamination to deep cleaning, chemical residue removal, fine rinsing and rapid drying by subdividing the cleaning components in the chemical cleaning area 201, which not only improves the cleaning efficiency, but also significantly improves the cleaning quality, provides an advanced solution for the precision cleaning of semiconductor equipment related parts, and further optimizes the performance of the entire precision cleaning production line.

[0107] Furthermore, the primary inspection area 202 includes: a first air shower door 2021, which is used to spray liquid on the initial finished product to remove dust attached to the initial finished product;

[0108] The bearing component 2022 is used to bear the components to be dusted after being cleaned by the first air shower door 2021, so that the first dust removal component 2023 arranged on one side of the bearing component 2022 can perform dust removal operation on the components to be dusted.

[0109] Specifically, by arranging the first air shower door 2021 and the combination of the bearing component 2022 and the first dust removal component 2023 in the primary inspection area 202, further dust removal and inspection of the components after preliminary cleaning are achieved. The specific technical effects are as follows:

[0110] The first air shower door 2021 uses high-speed air flow spraying, which can not only remove loose dust on the surface of the components, but also further remove residual particles and chemical residues through the use of spray liquid, ensuring that the components have reached a high degree of cleanliness before entering the fine cleaning area.

[0111] The design of the first air shower door 2021 can prevent external dust and pollutants from entering the clean room, maintain the cleanliness of the primary inspection area, and provide good environmental conditions for subsequent inspection and storage.

[0112] The design of the bearing component 2022 can automatically receive and transport the components cleaned by the first air shower door 2021, thereby reducing manual operations, improving the automation level of inspection preparation, and speeding up the inspection process.

[0113] The first dust removal component 2023 and the bearing component 2022 are used together to accurately remove dust from the component. Usually, the first dust removal component 2023 can be an electrostatic dust removal, a filter dust removal or a vacuum cleaner, etc. The most suitable dust removal method is selected according to the characteristics and cleanliness requirements of the component to effectively remove the tiny particles on the surface of the component.

[0114] Through the combination of air shower dust removal and precise inspection, it can be ensured that only parts with surface cleanliness reaching a certain standard can proceed to the next stage of cleaning, effectively controlling the quality of the production line and avoiding the impact of unqualified parts on subsequent processes.

[0115] In summary, the present invention not only further improves the cleanliness of the components, but also optimizes the inspection process, improves production efficiency and quality control level, realizes resource conservation and environmental protection, and enhances the safety of semiconductor equipment production by arranging the first air shower door 2021, the supporting component 2022 and the first dust removal component 2023 in the primary inspection area 202.

[0116] Further, the first storage area 203 includes: a temporary storage rack 2031 for temporarily storing the initial finished product;

[0117] The second dust removal component 2032 is disposed at one side of the temporary storage rack 2031 to perform dust removal on the initial finished product on the temporary storage rack 2031 .

[0118] Specifically, the temporary storage rack 2031 is designed as a multi-layer structure, which can be flexibly adjusted according to the size and type of the initial finished product. Each layer of the temporary storage rack 2031 is equipped with anti-static and dust-proof protection measures to ensure that the cleaned parts will not be secondary contaminated during storage. The temporary storage rack 2031 is also equipped with an intelligent handling system, which can automatically transport the initial finished products that have passed the first-level inspection from the exit of the first air shower door 2021 to the temporary storage rack, realizing efficient and orderly storage.

[0119] The second dust removal component 2032 is located on one side of the temporary storage rack 2031, and its main function is to remove dust from the initial finished product before it is placed on the temporary storage rack 2031. The second dust removal component 2032 can be an electrostatic precipitator, a high-efficiency filter or a dust suction device, which can effectively capture and remove tiny particles remaining in the air and on the surface of the components to ensure that the cleanliness of the components is not affected by the temporary storage environment. In addition, the design of the second dust removal component 2032 takes into account the automatic connection with the temporary storage rack 2031, so that the dust removal operation can be automatically completed during the transportation process without additional manual intervention.

[0120] By arranging the temporary storage rack 2031 and the second dust removal component 2032 in the first storage area 203, the present invention achieves a series of significant technical effects:

[0121] The intelligent handling system of temporary storage rack 2031 can quickly and accurately move the initial finished products that have passed the first-level inspection to the storage location, improving storage efficiency and space utilization, and ensuring the continuity and high efficiency of the production line.

[0122] The anti-static and dust-proof design of the temporary storage rack 2031 and the use of the second dust removal component 2032 provide continuous protection for the initial finished product, prevent secondary contamination and electrostatic damage caused by environmental factors during the storage process, and ensure the cleanliness and quality of the components.

[0123] Through the secondary dust removal operation, the present invention further ensures the surface cleanliness of the components after cleaning, meets the strict requirements of semiconductor equipment manufacturing for high-precision cleaning, and improves the yield and quality level of the entire production line.

[0124] The automated design of the temporary storage rack 2031 and the second dust removal component 2032 reduces the need for manual operation, lowers the error rate of operation, and improves the automation and intelligence level of the production line.

[0125] The design of the temporary storage rack 2031 and the second dust removal component 2032 takes energy saving and environmental protection into consideration, and realizes effective utilization of resources and reduces the impact on the environment by optimizing dust removal efficiency and reducing unnecessary energy consumption.

[0126] In summary, by arranging the temporary storage rack 2031 and the second dust removal component 2032 in the first storage area 203, the present invention not only improves the storage efficiency and protection effect, but also further improves the cleanliness of the components after cleaning, realizes the automation and intelligence of the production line, reduces production costs, improves production safety and environmental protection performance, and provides an efficient and reliable solution for the precision cleaning of components related to semiconductor equipment.

[0127] Further, the fine washing area 3 includes: a primary washing area 301, the primary washing area 301 is used to wash the initial finished product to obtain a primary washing product;

[0128] The secondary cleaning zone 302 is located downstream of the primary cleaning zone 301 to clean the primary cleaning product to obtain a finished product.

[0129] Further, the primary cleaning area 301 includes: a second air shower door 3011, a first cleaning tank 3012, a second rinser 3013 and a dust-free oven 3014 arranged in sequence along the cleaning direction of the continuous cleaning production line, so as to spray, clean, rinse and dry the finished product in sequence to obtain the original primary cleaning product;

[0130] The primary cleaning area 301 also includes:

[0131] The third dust removal component 3015 is used to remove dust from the original primary cleaning product to obtain a primary cleaning product.

[0132] Further, the secondary cleaning area 302 includes:

[0133] The second cleaning tank 3021, the third rinser 3022, the third air dryer and the vacuum oven 3023 are arranged in sequence along the transport direction of the continuous cleaning production line to perform dust removal, cleaning, rinsing, air drying and vacuum drying on the primary cleaning products;

[0134] The secondary cleaning area 302 also includes:

[0135] The fourth dust removal component 3024 is used to remove dust from the primary cleaning product after being dried in the vacuum oven 3023 to obtain a finished product.

[0136] Specifically, the second air shower door 3011: At the entrance of the primary cleaning area 301, the second air shower door 3011 uses high-speed airflow to spray the incoming initial finished product to remove dust and loose impurities on its surface, providing pretreatment for subsequent deep cleaning.

[0137] First cleaning tank 3012: The pre-treated parts will be sent to the first cleaning tank 3012, which contains a specially formulated cleaning solution. The surface of the parts will be deeply cleaned by ultrasonic and immersion methods to remove oil, particles and other stubborn pollutants. Subsequently, they will be finely rinsed with ultrapure water in the second rinser 3013 to thoroughly remove chemical residues and tiny particles to ensure the cleanliness of the surface of the parts.

[0138] Dust-free oven 3014: The washed parts enter the dust-free oven 3014, where nitrogen purging and high-temperature drying are used to efficiently remove moisture while maintaining a dust-free environment in the oven to prevent secondary contamination.

[0139] The third dust removal component 3015: After the dust-free oven 3014, the third dust removal component 3015 uses electrostatic dust removal or high-efficiency filtration technology to perform final dust removal on the dried parts to ensure that there is no dust residue on the surface to obtain a first-level cleaning product.

[0140] Second cleaning tank 3021: In the secondary cleaning area 302, the parts to be cleaned will enter the second cleaning tank 3021, which is used to deeply remove pollutants that may not be completely removed in the primary cleaning, providing a more refined cleaning effect.

[0141] The parts cleaned in the second cleaning tank 3021 are rinsed again in the third rinser 3022, and the residues are completely removed using a cleaning medium such as ultrapure water, in preparation for the subsequent drying step.

[0142] Third air dryer: The rinsed parts are initially air dried in the third air dryer, where high-speed airflow is used to remove most of the surface moisture and reduce the drying time in the vacuum oven.

[0143] The air-dried parts enter the vacuum oven 3023 for final drying treatment. The vacuum environment and high temperature heating can not only dry them quickly, but also prevent the particles in the air from reattaching, thus ensuring the high cleanliness of the parts.

[0144] Fourth dust removal component 3024: After the vacuum oven 3023, the fourth dust removal component 3024 ensures that there is no impurity residue on the surface of the components after secondary cleaning and drying. Through efficient dust removal technology, the final product, i.e., semiconductor equipment-related components with high cleanliness, is obtained.

[0145] Through double cleaning and multi-stage flushing of the primary cleaning area 301 and the secondary cleaning area 302, the present invention can deeply clean semiconductor equipment components, remove various pollutants including microscopic particles, and ensure high cleanliness of their surfaces.

[0146] The use of dust-free oven 3014 and vacuum oven 3023, combined with nitrogen purging and high-speed airflow drying, significantly improves drying efficiency and prevents secondary pollution. The third dust removal component 3015 and the fourth dust removal component 3024 are set to ensure that the components can reach the expected cleanliness standard after each step of cleaning.

[0147] The setting of the continuous cleaning production line realizes automation and continuous production, reduces manual intervention, improves cleaning efficiency, shortens production cycle, and enhances the stability and reliability of the production line.

[0148] The combination of multi-stage cleaning and strict dust removal greatly improves the quality and reliability of finished products, reduces the generation of defective products, and ensures the high precision and high performance of semiconductor equipment related components.

[0149] In summary, the present invention provides a comprehensive, efficient and environmentally friendly solution for the precision cleaning of semiconductor equipment related parts by setting up a detailed, multi-level cleaning and dust removal process in the fine cleaning area 3, which not only improves the cleaning effect, but also optimizes the production process, improves the quality of the finished product, and meets the strict requirements of the semiconductor industry for high-precision cleaning.

[0150] Further, the post-processing zone 4 includes:

[0151] The packaging area 401 includes a darkroom 4011, an inspection table 4012, a vacuum packaging machine 4013, and a fourth air shower door 4014, which are arranged in sequence to package the finished products;

[0152] Post-processing zone 4 also includes:

[0153] The fifth dust removal component 4015 is used to remove dust from the packaged finished products so as to transport them to the shipping area 402;

[0154] Among them, a detection component is provided in the darkroom 4011 to detect whether there are defects on the finished product, and a dust particle counter is provided on the inspection table 4012 to detect the amount of dust or dust on the finished product; a finished product storage rack is provided in the shipping area 402 for storing the finished products packaged by the packaging area 401.

[0155] Specifically, darkroom 4011: Darkroom 4011 is an area in a low-light environment, which is equipped with special inspection equipment, such as high-resolution cameras and lighting systems, for checking whether there are any minor defects on the surface of the finished product under low-light conditions, such as scratches, oxidation, deformation, etc., to ensure that the appearance of the finished product meets the quality standards.

[0156] Inspection table 4012 is equipped with a dust particle counter, a high-precision instrument that can detect and count the amount of dust or tiny particles attached to the surface of the finished product, ensuring that the cleanliness of the finished product meets the strict requirements of semiconductor equipment manufacturing.

[0157] Before packaging, the finished products will be packaged by vacuum packaging machine 4013, using vacuum technology to remove the air in the packaging bag to prevent the finished products from being affected by environmental factors such as oxidation and humidity during transportation and storage, thereby protecting the cleanliness and quality of the finished products.

[0158] A fourth air shower door 4014 is provided at the exit of the packaging area 401 to clean the surface of the packaged finished product using high-speed airflow to prevent external dust and impurities from adhering to the finished product before it leaves the warehouse, thereby ensuring that the finished product remains highly clean when it leaves the warehouse.

[0159] After the fourth air shower door 4014 , the fifth dust removal component 4015 uses electrostatic dust removal, high-efficiency filtration and other technologies to perform final dust removal on the packaged finished products to ensure that there is no residual dust on the surface of the finished products before they are transported to the shipping area 402 .

[0160] The finished product storage racks are used to store the finished products packaged by the packaging area 401. These storage racks are also designed to be dust-proof and anti-static clean environments to ensure that the finished products are not contaminated during the storage process before shipment and maintain their high quality.

[0161] The dust particle counters in the darkroom 4011 and on the inspection table 4012 can conduct strict quality inspections on the finished products to ensure that each finished product meets the high-precision requirements of semiconductor equipment manufacturing in terms of appearance and cleanliness.

[0162] The use of vacuum packaging machine 4013 not only protects the cleanliness of the finished product, but also reduces the physical damage and chemical changes of the finished product during transportation and storage, and extends the storage period of the finished product.

[0163] The provision of the fourth air shower door 4014 and the fifth dust removal component 4015 enables the finished product to be cleaned again before shipment, ensuring that the cleanliness of the surface of the finished product is not affected by any external factors and meets the shipment standards.

[0164] The entire post-processing area 4 improves the efficiency and accuracy of finished product processing and reduces manual operation errors and time waste through continuous automated equipment and processes such as darkroom testing, vacuum packaging and air shower dust removal.

[0165] The design of darkroom 4011 and clean room, the use of vacuum packaging and air shower dust removal reflect the strict control of the production environment by the present invention, reduce the pollution to the environment and comply with the principle of green manufacturing.

[0166] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0167] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0168] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0169] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0170] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0171] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A continuous cleaning production line, characterized in that: include: An initial inspection area (1) is used to perform a preliminary inspection on the parts to be cleaned, so as to record the parts to be cleaned that meet the set requirements; A rough washing zone (2), the rough washing zone being located downstream of the initial inspection zone (1) to perform a cleaning operation on the parts to be cleaned which are transported from the initial inspection zone (1) to the rough washing zone (2) to obtain an initial finished product; A fine washing zone (3), the fine washing zone (3) being located downstream of the rough washing zone (2) for performing a secondary washing on the initial finished product and performing a secondary washing on the dirt attached to the initial finished product to obtain a finished product; A post-processing zone (4) is located downstream of the fine washing zone (3) to package and ship the finished product.

2. The continuous cleaning production line according to claim 1, characterized in that: The initial inspection area (1) comprises: An appearance inspection room (101), the appearance inspection room (101) is used to screen the parts to be cleaned, so as to screen out the parts to be cleaned that meet the set requirements; An incoming registration room (102), the incoming registration room (102) is located downstream of the appearance inspection room (101), and a detection component is provided in the incoming registration room (102) to record the number of the parts to be cleaned that meet the set requirements when receiving the parts to be cleaned that meet the set requirements.

3. The continuous cleaning production line according to claim 1, characterized in that: The rough washing zone (2) comprises: A chemical cleaning area (201), wherein a cleaning component is provided in the chemical cleaning area (201) for chemically cleaning the parts to be cleaned, so as to preliminarily remove dirt on the parts to be cleaned; A primary inspection area (202), the primary inspection area (202) being located downstream of the chemical cleaning area (201) to perform a primary inspection on the parts to be cleaned after being cleaned in the chemical cleaning area (201) to obtain an initial finished product; A first storage area (203), wherein the first storage area (203) is located downstream of the primary inspection area (202) to store the initial finished product.

4. The continuous cleaning production line according to claim 3, characterized in that: The cleaning component comprises: A cleaning machine (2011), wherein a cleaning liquid is stored in the cleaning machine (2011) for cleaning the parts to be cleaned; a soaking box (2012), wherein a cleaning solution is stored in the soaking box (2012) for soaking the parts to be cleaned after being cleaned by the cleaning machine (2011); a rinsing box (2013), wherein a rinsing liquid is stored in the rinsing box (2013) for rinsing the parts to be cleaned after being soaked in the soaking box (2012); A first rinser (2014) for rinsing the parts to be cleaned after being rinsed in the rinse tank (2013); An air-drying component is used to dry the components to be cleaned after being rinsed by the first rinser (2014) so ​​as to preliminarily remove dirt on the components to be cleaned.

5. The continuous cleaning production line according to claim 3, characterized in that: The primary inspection area (202) includes: A first air shower door (221), the first air shower door (221) being used to spray a spray liquid onto the initial finished product to remove dust attached to the initial finished product; A bearing component (2022), the bearing component (2022) being used to bear the component to be dusted after being cleaned by the first air shower door (2021), so that a first dust removal component (2023) arranged on one side of the bearing component (2022) can perform a dust removal operation on the component to be dusted.

6. The continuous cleaning production line according to claim 3, characterized in that: The first storage area (203) comprises: A temporary storage rack (2031) for temporarily storing the initial finished product; A second dust removal component (2032), wherein the second dust removal component (2032) is disposed on one side of the temporary storage rack (2031) to perform dust removal operations on the initial finished product on the temporary storage rack (2031).

7. The continuous cleaning production line according to claim 1, characterized in that: The fine washing zone (3) comprises: A primary cleaning area (301), the primary cleaning area (301) is used to clean the initial finished product to obtain a primary cleaning product; A secondary cleaning zone (302), the secondary cleaning zone (302) is located downstream of the primary cleaning zone (301) to clean the primary cleaning product to obtain the finished product.

8. The continuous cleaning production line according to claim 7, characterized in that: The primary cleaning area (301) comprises: A second air shower door (3011), a first cleaning tank (3012), a second rinser (3013) and a dust-free oven (3014) are sequentially arranged along the cleaning direction of the continuous cleaning production line to spray, clean, rinse and dry the finished product in sequence to obtain an original primary cleaning product; The primary cleaning area (301) also includes: The third dust removal component (3015) is used to remove dust from the original primary cleaning product to obtain the primary cleaning product.

9. The continuous cleaning production line according to claim 7, characterized in that: The secondary cleaning area (302) includes: A second cleaning tank (3021), a third rinser (3022), a third air dryer and a vacuum oven (3023) are sequentially arranged along the transport direction of the continuous cleaning production line to perform dust removal, cleaning, rinsing, air drying and vacuum drying on the primary cleaning product; The secondary cleaning area (302) also includes: The fourth dust removal component (3024) is used to remove dust from the primary cleaning product after being dried in the vacuum oven (3023) to obtain the finished product.

10. The continuous cleaning production line according to claim 1, characterized in that: The post-processing zone (4) comprises: A packaging area (401), wherein the packaging area (401) includes a darkroom (4011), an inspection table (4012), a vacuum packaging machine (4013), and a fourth air shower door (4014) arranged in sequence, so as to package the finished product; The post-processing zone (4) also includes: a fifth dust removal component (4015), the fifth dust removal component (4015) being used to remove dust from the packaged finished product so as to transport it to the shipping area (402); The darkroom (4011) is provided with a detection component to detect whether there are defects on the finished product, and the inspection table (4012) is provided with a dust particle counter to detect the amount of dust or dirt on the finished product; the shipping area (402) is provided with a finished product storage rack for storing the finished products packaged by the packaging area (401).

Images