Non-uniform power chip liquid cooling device and design method thereof

Abstract

The invention discloses a non-uniform power chip liquid cooling device and a design method thereof, and belongs to the technical field of micro-electronic thermal management, the non-uniform power chip liquid cooling device comprises a micro-pin fin bottom plate, micro-pin fins are arranged on the upper surface of the micro-pin fin bottom plate, the micro-pin fin bottom plate is divided into a low heat flow area and a hot spot area, a jet flow cavity frame plate is arranged above the micro-pin fin bottom plate, and the jet flow cavity frame plate is connected with the micro-pin fin bottom plate. A distributed impact jet flow plate is arranged above the jet flow cavity frame plate, jet flow holes and a liquid outlet are formed in the distributed impact jet flow plate, and a jet flow cavity is formed by taking the distributed impact jet flow plate as a top plate, the micro pin fin bottom plate as a bottom plate and the jet flow cavity frame plate as an outer frame. According to the liquid cooling device for the non-uniform power chip and the design method of the liquid cooling device, the heat management problem of the large-area, high-heat-flow and non-uniform heat power consumption chip can be effectively solved, targeted heat dissipation is carried out on a high-heat-flow and high-heat-point area, heat stress caused by local temperature difference of the chip is eliminated, and the service life and the packaging life of the chip are guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of microelectronic thermal management, and in particular relates to a non-uniform power chip liquid cooling device and a design method thereof. Background Art

[0002] With the advancement of information technology, chips have begun to develop in the direction of large area, high power, and non-uniform heat dissipation, posing severe challenges to thermal management. With the introduction of the concept of large and small cores and the advancement of complex packaging processes, chip heating has gradually become non-uniform. This is due to the uneven power of chips with different functions in different regions on the one hand, and the hot spots caused by extremely high heat flow in local areas on the other. Microchannel liquid cooling can solve the problem of heat dissipation of high-power chips, but traditional straight microchannels have high flow resistance and poor temperature uniformity when facing large-area power chips due to the integrity of their own flow. When faced with non-uniform thermal power consumption and local hot spots, the severe temperature non-uniformity of the overall chip is aggravated, which further causes huge thermal stress, and ultimately reduces the life of the packaging structure and even the chip itself.

[0003] At present, non-uniform heat dissipation and local hot spots make it difficult for traditional heat dissipation technology to meet the needs. In order to improve the heat dissipation efficiency of chips and extend their service life, it is necessary to develop new microchannel liquid cooling technology to optimize the flow structure, reduce flow resistance, and improve temperature uniformity in response to the problem of non-uniform thermal power consumption. At the same time, attention should be paid to the impact of thermal stress on the packaging structure and the chip itself, and effective measures should be taken to reduce thermal stress and ensure the reliability and stability of the chip. Summary of the invention

[0004] The purpose of the present invention is to provide a non-uniform power chip liquid cooling device and a design method thereof, which can effectively solve the thermal management problem of large-area, high heat flux, and non-uniform thermal power consumption chips, dissipate heat in a targeted manner in high heat flux and high hot spot areas, eliminate thermal stress caused by local temperature differences in the chip, and ensure the service life of the chip and the packaging life.

[0005] To achieve the above-mentioned objectives, the present invention provides a non-uniform power chip liquid cooling device, comprising a micro-pin fin base plate, the upper surface of the micro-pin fin base plate is provided with micro-pin fins, the micro-pin fin base plate is divided into a low heat flux area and a hot spot area, a jet cavity frame plate is provided above the micro-pin fin base plate, a distributed impact jet plate is provided above the jet cavity frame plate, the distributed impact jet plate is provided with jet holes and liquid outlets, the distributed impact jet plate is used as the top plate, the micro-pin fin base plate is used as the bottom plate, and the jet cavity frame plate is used as the outer frame to form a jet cavity.

[0006] Preferably, the microneedle fin width is 200 microns to 600 microns, and the spacing w is pin 200 microns - 600 microns.

[0007] Preferably, the internal height of the jet cavity ranges from 0.5 mm to 2 mm.

[0008] Preferably, the diameter of the jet hole is 0.5 mm-2 mm, and the diameter of the liquid outlet is 1 mm-2 mm.

[0009] A method for designing a non-uniform power chip liquid cooling device comprises the following steps:

[0010] S1. By measuring the chip size, chip hot spot area and chip high heat area, the number, diameter and single hole flow of the jet holes are determined, and the basic model of the distributed jet heat sink of the corresponding size is completed;

[0011] S2. Determine the Reynolds number distribution Re of the radiator jet hole and the chip power consumption distribution q, and set the initial micro-needle fin height distribution h pin,0 and the initial jet cavity height distribution h jet,0 ;

[0012] S3. Obtain the optimal jet cavity height distribution h based on the non-uniform thermal field-non-uniform jet cavity height matching algorithm jet ;

[0013] S4. Obtain the optimal microneedle wing height distribution h with local increase based on the hotspot-microneedle wing height matching algorithm pin 、The height distribution of pin fins in low heat flux area h pin,avg And the pin fin height distribution h in the hot spot area pin,hot .

[0014] Preferably, in the non-uniform thermal field-non-uniform jet cavity height matching algorithm, the initial micro-needle fin height distribution h jet,0,(x,y) is the initial jet cavity height h jet,0,(x,y) The initial microneedle wing height distribution is 0.5-0.9 times pin,0,(x,y) The jet cavity height distribution h remains unchanged during iteration. jet Should always be greater than the initial microneedle fin height distribution h pin,0,(x,y) .

[0015] Preferably, in the hotspot-micro-needle fin height matching algorithm, the low heat flux area needle fin height h pin,avg is an equal value distribution, and the microneedle wing height distribution h during the iteration process pin,0,(x,y) Less than the minimum height h of the jet cavity jet,min .

[0016] Preferably, the optimization algorithm used in the non-uniform thermal field-non-uniform jet cavity height matching algorithm and the hot spot-microneedle fin height matching algorithm includes a GA-Pareto algorithm.

[0017] Preferably, the non-uniform thermal field-non-uniform jet cavity height matching algorithm comprises the following steps:

[0018] S301, input chip power consumption distribution q, radiator jet hole Reynolds number distribution Re, bottom plate pin fin height distribution h pin,0 ;

[0019] S302, initializing the jet cavity height distribution h jet,0 ;

[0020] S303, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h jet(x,y) ,q (x,y) )Determine T max 、s T , T avg And use this as the three optimization objective functions, where the subscript (x, y) represents the local function size, T (x,y) Indicates the temperature of the bottom plate at (x, y); T max Indicates the maximum value of the bottom plate temperature distribution; T avg Represents the average value of the bottom plate temperature distribution; s T represents the uniformity temperature variance coefficient;

[0021] S304, optimizing the objective function using the GA-Pareto algorithm;

[0022] S305, obtaining the optimal jet cavity height distribution h jet .

[0023] Preferably, the hotspot-microneedle fin height matching algorithm comprises the following steps:

[0024] S401, input chip hotspot distribution q bot , radiator jet hole Reynolds number distribution Re, optimal jet cavity height distribution h jet ;

[0025] S402, initializing the base plate pin fin height distribution h pin,0 ;

[0026] S403, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h (x,y) ,q hot(x,y) )Determine T hot and T avg , and set T hot -T avg is the objective function, where T hot Indicates the temperature corresponding to the hot spot area;

[0027] S404, optimizing the objective function using the GA-Pareto algorithm;

[0028] S405, obtaining the base plate pin-fin height distribution h for the hot spot pin,hot .

[0029] Therefore, the present invention adopts the above-mentioned non-uniform power chip liquid cooling device and its design method. Compared with the prior art, the present invention has the following significant beneficial effects:

[0030] (1) The present invention uses a distributed jet liquid cooling method to allow the incoming liquid to be evenly and vertically sprayed onto the radiator bottom plate with a microstructure through a liquid separation plate, thereby improving the overall heat exchange effect;

[0031] (2) The present invention specifically designs the jet cavity height for different heat flow areas of non-uniform heat sources, thereby maintaining good regional temperature uniformity;

[0032] (3) The introduction of the micro-needle fins proposed in the present invention effectively enhances the overall heat transfer effect. The height of the micro-needle fins is designed according to the corresponding design criteria for the local hot spot area, which effectively eliminates the influence of the local hot spot;

[0033] (4) The heat sink design method proposed in the present invention is targeted at non-uniform thermal power chips. Through quantitative design criteria, the chip temperature uniformity and high-temperature area can be controlled within a certain range, thereby achieving thermal management of large-area high heat flux and high-hot spot chips.

[0034] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is an exploded disassembly diagram of a liquid cooling device for a non-uniform power chip of the present invention;

[0036] Figure 2 The figure is a diagram illustrating the flow of cooling liquid and a partial cross-sectional diagram of a liquid cooling device for a non-uniform power chip according to the present invention, wherein Figure 2 (a) is a schematic diagram of the distributed impact jet plate structure and flow description. Figure 2 (b) is the AA cross-section view, Figure 2 (c) BB cross-section, Figure 2 (d) is the CC cross-section, and the arrow indicates the flow direction;

[0037] Figure 3 It is a schematic diagram of a liquid cooling device for a non-uniform power chip of the present invention with a micro-needle fin base plate and non-uniform height micro-needle fins (micro-needle fins in low heat flow areas and micro-needle fins in hot spot areas);

[0038] Figure 4 It is a schematic diagram of the thermal field and hot spots of an example chip of a liquid cooling device for a non-uniform power chip of the present invention;

[0039] Figure 5 It is a flow chart of a design method of a liquid cooling device for a non-uniform power chip of the present invention;

[0040] Figure 6 It is a flow chart of a non-uniform thermal field-non-uniform jet cavity height matching algorithm in a design method of a liquid cooling device for a non-uniform power chip of the present invention;

[0041] Figure 7 It is a flow chart of a hotspot-micro-pin fin height matching algorithm in a design method of a liquid cooling device for a non-uniform power chip of the present invention.

[0042] Reference numerals

[0043] 1. Microneedle fin base plate; 101. Microneedle fin in low heat flux area; 102. Microneedle fin in hot spot area; 2. Jet cavity frame plate; 201. Jet cavity; 3. Distributed impact jet plate; 301. Jet hole; 302. Liquid outlet; 4. Example chip; 401. Uniform heat flux area; 402. Hot spot area and high heat flux area. DETAILED DESCRIPTION

[0044] The technical solution of the present invention is further described below through the accompanying drawings and embodiments.

[0045] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the usual meanings understood by persons with ordinary skills in the field to which the present invention belongs. The words "include" or "comprise" and the like used in the present invention mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0046] Embodiment 1

[0047] like Figure 1 As shown, the present invention provides a non-uniform power chip liquid cooling device, comprising a micro-pin fin base plate 1, a micro-pin fin is arranged on the upper surface of the micro-pin fin base plate 1, the micro-pin fin width is 200 microns-600 microns, and the spacing w pinThe thickness of the jet cavity frame plate 2 is 200 microns to 600 microns. A jet cavity frame plate 2 is arranged above the micro-needle fin bottom plate 1, and a distributed impact jet plate 3 is arranged above the jet cavity frame plate 2. The above three-layer structure is bonded together. The distributed impact jet plate 3 is used as the top plate, the micro-needle fin bottom plate 1 is used as the bottom plate, and the jet cavity frame plate 2 is used as the outer frame to form a jet cavity 201. The jet cavity 201 has different heights due to the thickness change of the distributed impact jet plate 3, and the size of the height will affect the local heat dissipation capacity of the radiator. The internal height range of the jet cavity 201 is 0.5 mm to 2 mm.

[0048] like Figure 2-3 As shown, the distributed impact jet plate 3 is provided with a jet hole 301, the diameter of the jet hole 301 is 0.5 mm-2 mm, and the distributed impact jet plate 3 is also provided with a liquid outlet 302, and the diameter of the liquid outlet 302 is 1 mm-2 mm. The cooling liquid enters in the form of a distributed jet, and quickly returns and is discharged after impacting the micro-needle fin base plate 1. Specifically, the cooling liquid enters the jet cavity 201 through the jet hole 301 on the distributed impact jet plate 3, and then quickly rebounds after impacting the micro-needle fin base plate 1 with non-uniform micro-needle fins (micro-needle fins 101 in the low heat flow area and micro-needle fins 102 in the hot spot area), and flows out through the liquid outlet 302 on the distributed impact jet plate 3.

[0049] The distributed impact jet plate 3 is designed for different areas of the chip. By changing the thickness of the distributed impact jet plate 3 in different areas, the height at which the cooling liquid impact jet reaches the micro-pin fin bottom plate 1 is changed, thereby ultimately changing the heat exchange effect of the radiator in this area.

[0050] like Figure 4 As shown, there are different heating areas in the example chip 4, namely, uniform heat flow area 401 and hot spot area and high heat flow area 402. The micro-needle fin base plate 1 adjusts the height of the micro-needle fins in the local area according to the hot spot area and high heat flow area 402 of the example chip 4, and takes away more heat from the corresponding area through the higher micro-needle fins, thereby achieving the purpose of reducing the temperature of the hot spot area and high heat flow area 402, and effectively eliminating the influence of the local hot spot. The cooling liquid includes water, dielectric material and refrigerant.

[0051] In order to achieve good temperature uniformity of the entire chip, it is necessary to use the non-uniform thermal field-non-uniform jet cavity height matching algorithm and the hotspot-non-uniform height matching algorithm to determine the thickness of the distributed impact jet plate 3 and the height of the microneedle fin based on parameters such as chip size, chip power consumption, local hot spots of the chip and the corresponding distributed jet flow rate, so as to meet the thermal management requirements of chips with larger area, higher power density and non-uniform heat generation.

[0052] like Figure 5 As shown, a design method for a non-uniform power chip liquid cooling device includes the following steps:

[0053] S1. By measuring the chip size, chip hot spot area and chip high heat area, the number, diameter and single hole flow of the jet holes are determined, and the basic model of the distributed jet heat sink of the corresponding size is completed;

[0054] S2. Determine the Reynolds number distribution Re of the radiator jet hole and the chip power consumption distribution q, and set the initial micro-needle fin height distribution h pin,0 and the initial jet cavity height distribution h jet,0 ;

[0055] S3. Obtain the optimal jet cavity height distribution h based on the non-uniform thermal field-non-uniform jet cavity height matching algorithm jet ,like Figure 6 As shown, the non-uniform thermal field-non-uniform jet cavity height matching algorithm adopted by the present invention comprises the following steps:

[0056] S301, input chip power consumption distribution q, radiator jet hole Reynolds number distribution Re, bottom plate pin fin height distribution h pin,0 ;

[0057] S302, initializing the jet cavity height distribution h jet,0 ;

[0058] S303, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h jet(x,y) ,q (x,y) )Determine T max 、s T , T avg And use this as the three optimization objective functions; the subscript (x, y) represents the local function size, T (x,y) Indicates the temperature of the bottom plate at (x, y); T max Indicates the maximum value of the bottom plate temperature distribution; T avg Represents the average value of the bottom plate temperature distribution; s T represents the uniformity temperature variance coefficient;

[0059] S304, optimizing the objective function using the GA-Pareto algorithm;

[0060] S305, obtaining the optimal jet cavity height distribution h jet .

[0061] In the non-uniform thermal field-non-uniform jet cavity height matching algorithm, the initial micro-needle wing height distribution is assumed to be h jet,0,(x,y) , is the initial jet cavity height distribution h jet,0,(x,y) 0.5-0.9 times of the initial microneedle wing height distribution h pin,0,(x,y)The jet cavity height distribution h remains unchanged during iteration. jet Should always be greater than the initial microneedle fin height distribution h pin,0,(x,y) .

[0062] S4. Obtain the optimal microneedle wing height distribution h with local increase based on the hotspot-microneedle wing height matching algorithm pin 、The height distribution of pin fins in low heat flux area h pin,avg And the pin fin height distribution h in the hot spot area pin,hot ,like Figure 7 As shown, the hotspot-microneedle fin height matching algorithm adopted by the present invention comprises the following steps:

[0063] S401, input chip hotspot distribution q bot , radiator jet hole Reynolds number distribution Re, optimal jet cavity height distribution h jet ;

[0064] S402, initializing the base plate pin fin height distribution h pin,0 ;

[0065] S403, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h (x,y) ,q hot(x,y) )Determine T bot and T avg , and set T bot -T avg is the objective function; where T hot Indicates the temperature corresponding to the hot spot area;

[0066] S404, optimizing the objective function using the GA-Pareto algorithm;

[0067] S405, obtaining the base plate pin-fin height distribution h for the hot spot pin,hot .

[0068] In the hotspot-micro-needle fin height matching algorithm, the pin fin height h in the low heat flux area is pin,avg is an equal value distribution, and the microneedle wing height distribution h during the iteration process pin,0,(x,y) Less than the minimum height h of the jet cavity jet,min .

[0069] The optimization iterative algorithms in the non-uniform thermal field-non-uniform jet cavity height matching algorithm and the hot spot-microneedle fin height matching algorithm include optimization algorithms such as the GA-Pareto algorithm, which aim to determine the optimal solution through the objective function.

[0070] It is worth noting that the contents not elaborated in detail in the present invention are all prior art and are well known to those skilled in the art.

[0071] Therefore, the present invention adopts the above-mentioned non-uniform power chip liquid cooling device and its design method, which can effectively solve the thermal management problem of large-area, high heat flux, and non-uniform thermal power consumption chips, dissipate heat in a targeted manner in high heat flux and high hot spot areas, eliminate the thermal stress caused by local temperature differences in the chip, and ensure the service life of the chip and the packaging life.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A non-uniform power chip liquid cooling device, characterized in that: It includes a micro-needle fin base plate, the upper surface of which is provided with micro-needle fins, the micro-needle fin base plate is divided into a low heat flow area and a hot spot area, a jet cavity frame plate is provided above the micro-needle fin base plate, a distributed impact jet plate is provided above the jet cavity frame plate, the distributed impact jet plate is provided with jet holes and a liquid outlet, the distributed impact jet plate is used as the top plate, the micro-needle fin base plate is used as the bottom plate, and the jet cavity frame plate is used as the outer frame to form a jet cavity.

2. A design method for a non-uniform power chip liquid cooling device, characterized in that: The following steps are involved: S1. Determine the number, diameter and flow rate of jet holes by measuring chip size, chip hot spot area and chip high heat area, and complete the basic model of distributed jet heat sink of corresponding size; S2. Determine the Reynolds number distribution Re of the radiator jet hole and the chip power consumption distribution q, and set the initial micro-needle fin height distribution h pin,0 and the initial jet cavity height distribution h jet,0 ; S3. Obtain the optimal jet cavity height distribution h based on the non-uniform thermal field-non-uniform jet cavity height matching algorithm jet ; S4. Obtain the optimal microneedle wing height distribution h with local increase based on the hotspot-microneedle wing height matching algorithm pin 、The height distribution of pin fins in low heat flux area h pin,avg And the pin fin height distribution h in the hot spot area pin,hot .

3. The design method of a non-uniform power chip liquid cooling device according to claim 2, characterized in that: In the non-uniform thermal field-non-uniform jet cavity height matching algorithm, the initial micro-needle wing height distribution h jet,0,(x,y) is the initial jet cavity height h jet,0,(x,y) The initial microneedle wing height distribution is 0.5-0.9 times pin,0,(x,y) The jet cavity height distribution h remains unchanged during iteration. jet Should always be greater than the initial microneedle fin height distribution h pin,0,(x,y) .

4. The design method of a non-uniform power chip liquid cooling device according to claim 3, characterized in that: In the hotspot-micro-needle fin height matching algorithm, the low heat flux area needle fin height h pin,avg is an equal value distribution, and the microneedle wing height distribution h during the iteration process pin,0,(x,y) Less than the minimum height h of the jet cavity jet,min .

5. The design method of a non-uniform power chip liquid cooling device according to claim 4, characterized in that: The optimization algorithms used in the non-uniform thermal field-non-uniform jet cavity height matching algorithm and the hot spot-microneedle fin height matching algorithm include the GA-Pareto algorithm.

6. The method for designing a non-uniform power chip liquid cooling device according to claim 5, characterized in that: The non-uniform thermal field-non-uniform jet cavity height matching algorithm comprises the following steps: S301, input chip power consumption distribution q, radiator jet hole Reynolds number distribution Re, bottom plate pin fin height distribution h pin,0 ; S302, initializing the jet cavity height distribution h jet,0 ; S303, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h jet(x,y) ,q (x,y) )Determine T max 、s T , T avg And use this as the three optimization objective functions, where the subscript (x, y) represents the local function size, T (x,y) Indicates the temperature of the bottom plate at (x, y); T max Indicates the maximum value of the bottom plate temperature distribution; T avg Represents the average value of the bottom plate temperature distribution; s T represents the uniformity temperature variance coefficient; S304, optimizing the objective function using the GA-Pareto algorithm; S305, obtaining the optimal jet cavity height distribution h jet .

7. The method for designing a non-uniform power chip liquid cooling device according to claim 6, characterized in that: The hotspot-microneedle fin height matching algorithm comprises the following steps: S401, input chip hotspot distribution q bot , radiator jet hole Reynolds number distribution Re, optimal jet cavity height distribution h jet ; S402, initializing the base plate pin fin height distribution h pin,0 ; S403, according to T (x,y) =f(h pin(x,y) ,Re (x,y) ,h (x,y) ,q hot(x,y) )Determine T hot and T avg , and set T hot -T avg is the objective function, where T hot Indicates the temperature corresponding to the hot spot area; S404, optimizing the objective function using the GA-Pareto algorithm; S405, obtaining the base plate pin-fin height distribution h for the hot spot pin,hot .

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