Low-power-consumption transistor heat dissipation structure based on two-dimensional material

Abstract

The invention discloses a low-power-consumption transistor heat dissipation structure based on a two-dimensional material, and relates to the technical field of transistors, the low-power-consumption transistor heat dissipation structure comprises a mounting assembly and a pressing assembly, and the pressing assembly comprises a heat dissipation pressing sheet; according to the low-power-consumption transistor heat dissipation structure based on the two-dimensional material, heat is absorbed through the multiple heat dissipation pipes at the same time, heat dissipation can be rapidly achieved, the multiple heat dissipation pipes are sleeved with the multiple layers of heat dissipation plates, the heat dissipation plates can rapidly absorb heat on the outer surfaces of the heat dissipation pipes, heat dissipation is accelerated, and the heat dissipation efficiency is improved by starting the semiconductor chilling plate and the servo motor. Meanwhile, cold air generated by the semiconductor chilling plate and heat conducted by the heat dissipation pipes and the heat dissipation plates are dissipated outwards, heat dissipation is conducted in multiple modes at the same time, the heat dissipation speed is much higher than that of traditional metal heat dissipation, and filling pipes and flowing areas in the heat dissipation pipes can be continuously gasified and liquefied, so that heat is continuously and rapidly conducted outwards.

Description

Technical Field

[0001] The present invention relates to the field of transistor technology, and in particular to a low-power transistor heat dissipation structure based on two-dimensional materials. Background Art

[0002] Transistors are solid semiconductor devices similar to valves that are used to amplify, control and generate electrical signals. Two-dimensional materials refer to materials in which electrons can only move freely at the nanoscale in two dimensions. They have a thickness of a single atom or several atomic layers, and their structure is like an infinitely extended plane. Typical two-dimensional materials include graphene, boron nitride, molybdenum disulfide, etc. With the rapid development of electronic technology, transistors, as core components of modern electronic products, their performance and power consumption have become key research directions. In the process of constantly pursuing higher integration and faster computing speeds, the power consumption problem of transistors has become increasingly prominent. The large amount of heat generated has seriously affected the performance stability and service life of the transistor, and also limited the further miniaturization and high performance development of electronic equipment.

[0003] In the prior art, for example, Chinese patent number: CN218730912U discloses a transistor heat dissipation structure, which relates to the field of transistor technology. The present application includes a substrate, a cooling plate and a base both arranged thereon, two mounting holes are constructed on the substrate, two sliding rods are slidably penetrated on the cooling plate, a limit plate is arranged at one end of the sliding rod, and a hemispherical block slidably matched with the mounting hole is arranged at the other end, a return spring sleeved on the sliding rod is arranged on the opposite side of the limit plate and the cooling plate, and two locking members are arranged on the substrate.

[0004] When a transistor is working, it will generate heat due to the passage of current. If the heat cannot be dissipated in time, the temperature of the transistor will rise, which will affect its performance and reliability. Traditional transistor heat dissipation structures are usually based on materials such as metal heat sinks or thermal grease. However, metal heat sinks or thermal greases have gradually exposed many limitations when dealing with the heat dissipation needs of high-power density transistors. On the one hand, the heat dissipation efficiency of metal heat sinks is limited, and it is difficult to quickly and effectively dissipate the heat generated by the transistor, resulting in excessively high local temperatures, affecting the normal operation of the transistor. On the other hand, the thermal conductivity of thermal grease is relatively low, and problems such as drying up and aging may occur during long-term use, thereby reducing the heat dissipation effect.

[0005] Therefore, we proposed a low-power transistor heat dissipation structure based on two-dimensional materials to solve the problems raised above. Summary of the invention

[0006] The purpose of the present invention is to provide a low-power transistor heat dissipation structure based on two-dimensional materials to solve the problem of poor heat dissipation effect of existing metal heat sinks or thermal grease in heat dissipation proposed in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-power transistor heat dissipation structure based on two-dimensional materials, including a mounting component and a pressing component, the pressing component including a heat dissipation pressing plate, and the heat dissipation pressing plate is made of two-dimensional material and has elasticity, which is used to improve thermal conductivity, a heat dissipation component is arranged on the top of the heat dissipation pressing plate, the heat dissipation component includes a plurality of heat dissipation pipes, the plurality of heat dissipation pipes are evenly divided into two groups, the two groups of heat dissipation pipes are symmetrically arranged, the outer snap-fit ​​sleeves of the plurality of heat dissipation pipes are provided with a plurality of heat dissipation plates, the arrangement of the plurality of heat dissipation plates is densely and sparsely arranged, the plurality of heat dissipation plates are all made of graphene, which are used to quickly conduct heat, the outer side of each heat dissipation plate is fixedly connected with a closed ring near each adjacent heat dissipation plate, the inner wall of each heat dissipation pipe is provided with a filling tube, and the material used for the filling tube is a composite liquid-absorbing core composed of a combination of multiple materials, the interior of each filling tube is provided with a flow area, and the inner wall of each filling tube They are all fixedly connected with a reinforced mesh tube, and the reinforced mesh tube is used to enhance the bonding strength between the liquid absorption core and the inner wall of the filling tube; by tightly clamping the heat dissipation pressing plate to the transistor body, the heat generated by the transistor body will be absorbed by the heat dissipation pressing plate, and the heat concentrated inside the fixed grooves opened on both sides of the heat dissipation pressing plate will be transferred to the heat dissipation tube with good thermal conductivity, and the heat is absorbed by multiple heat dissipation tubes at the same time, so the heat dissipation can be achieved quickly, and a multi-layer heat dissipation plate is set on the multiple heat dissipation tubes, and the heat dissipation plate can quickly absorb the heat from the outer surface of the heat dissipation tube, thereby accelerating the heat dissipation, and by starting the semiconductor refrigeration plate and the servo motor, the cold air generated by the semiconductor refrigeration plate and the heat conducted by the multiple heat dissipation tubes and the heat dissipation plate are simultaneously dissipated outward, and multiple methods are used to dissipate heat at the same time, and the heat dissipation speed is much faster than that of traditional metal heat dissipation, wherein the filling tube and the flow area inside the heat dissipation tube will continuously vaporize and liquefy, thereby continuously and rapidly conducting heat outward, and the reinforced mesh tube can strengthen the connection between the filling tube and the heat dissipation tube shell.

[0008] Preferably, the mounting assembly includes a fixed base plate, and two fixed corner frames are fixedly connected to the top of the fixed base plate near one side, and the inner walls of the two fixed corner frames are fixedly connected to limiting blocks near the top.

[0009] Preferably, a fixed frame is fixedly connected to the top of the fixed base plate near the other side, a protective plate is fixedly connected to the top of the fixed frame, and the protective plate is used for dust prevention, an elastic positioning strip is fixedly connected to the inner wall of the fixed frame, and the elastic positioning strip is made of insulating elastic material.

[0010] Preferably, a fixing spring is arranged between the inner wall of the elastic positioning strip and the inner wall of the fixing frame, and the fixing spring is used to elastically support the elastic positioning strip, and the outer surface of the elastic positioning strip is fixedly connected to the limiting strip near the top.

[0011] Preferably, a transistor body is arranged between the inner wall of the fixing frame and the inner walls of the two fixing corner frames, and the limiting strip and the two limiting blocks are used to limit the position of the transistor body.

[0012] Preferably, both sides of the heat dissipation pressing plate are provided with fixing grooves, and the fixing grooves are used to improve the heat dissipation effect. The top of the fixed bottom plate is fixedly connected with a fixing bolt, and the heat dissipation pressing plate is movably sleeved on the outside of the fixing bolt, and the external thread of the fixing bolt is connected with a nut; the side of the transistor body where the transistor end is not installed is contacted with the elastic positioning bar, and the elastic positioning bar is gently pushed toward the fixing frame. When pushed, the elastic positioning bar will be deformed, and the side of the transistor body where the transistor end is installed is pressed so that this side is stuck in the two limit blocks, and the transistor is released at this time. The body tube body is installed, and the position of the transistor body is adjusted. The outward side of the transistor body is limited by a limit strip and two limit blocks, which can ensure that the transistor body will not automatically pop out and fall. When the pressure on the transistor body is released, the elastic positioning strip with automatic rebound effect will rebound under its own elastic action, and then the rebound force acts on the surface of the transistor body, thereby completing the clamping of the transistor body. Through the rebound effect of the fixed spring, the rebound performance of the elastic positioning strip can be strengthened, so that the installation of the transistor body can be more stable.

[0013] Preferably, the bottom ends of the two groups of heat dissipation tubes are respectively fixedly connected to the inner walls of the two fixing grooves, and the plurality of heat dissipation tubes are used to dissipate the heat generated by the transistor body.

[0014] Preferably, four reinforcing plates are fixedly connected to the outer surfaces of one side of the plurality of heat dissipation plates, and semiconductor refrigeration plates are arranged between the outer surfaces of the four reinforcing plates, and the semiconductor refrigeration plates are used to produce cold air to enhance the heat dissipation performance.

[0015] Preferably, four support plates are fixedly connected to the outer surfaces of the other sides of the plurality of heat dissipation plates, a mounting frame is fixedly connected to the outer surfaces of the four support plates, and a connecting plate is fixedly connected to the inner wall of the mounting frame.

[0016] Preferably, a servo motor is arranged in the middle of the outer surface of the connecting plate, the output shaft of the servo motor is fixedly connected to a fan blade, a cover plate is fixedly connected to one side of the connecting plate, a heat dissipation mesh plate is fixedly connected to one side of the mounting frame, and the heat dissipation mesh plate is used to protect the fan blade; the heat dissipation pressing plate is made of a two-dimensional material, and two-dimensional boron nitride is selected, which has high thermal conductivity and can quickly conduct heat away. At the same time, it has good insulation performance, which can avoid short circuits between the transistor body and other components, and can improve the safety and stability of the equipment. The two-dimensional boron nitride is not easily corroded, and can ensure the stable performance of the heat dissipation pressing plate during long-term use. The heat dissipation plate made of graphene has good flexibility and can be added It can be designed into various shapes and sizes according to different heat dissipation requirements. Graphene is a two-dimensional crystal material with a large specific surface area. It can fully contact the heat source to form a good heat conduction interface, reduce thermal resistance, and improve the heat dissipation effect. The heat absorbed inside the fixed groove is dissipated through the heat pipe. When one end of the heat pipe contacts the heat source inside the fixed groove, the coolant inside it will vaporize when it encounters heat. The vaporization process will quickly absorb a large amount of heat. After that, the steam flows to the other end under the action of air pressure and condenses into liquid. This process will release the heat at the other end, and so on. The cycle can quickly transfer the heat generated by the transistor body to the heat sink, thereby achieving the effect of rapid heat dissipation.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. When the present invention is in use, the heat generated by the transistor body is absorbed by the heat dissipation pressing plate by tightly clamping the transistor body, and the heat concentrated in the fixed grooves on both sides of the heat dissipation pressing plate is transferred to the heat dissipation pipe with good thermal conductivity. The heat is absorbed by multiple heat dissipation pipes at the same time, so the heat dissipation can be achieved quickly. A multi-layer heat dissipation plate is set on the multiple heat dissipation pipes, and the heat dissipation plate can quickly absorb the heat on the outer surface of the heat dissipation pipe, thereby accelerating the heat dissipation. By starting the semiconductor refrigeration plate and the servo motor, the cold air generated by the semiconductor refrigeration plate and the heat conducted by the multiple heat dissipation pipes and the heat dissipation plate are simultaneously dissipated outward, and the heat is dissipated in multiple ways at the same time. The heat dissipation speed is much faster than that of traditional metal heat dissipation. Among them, the filling tube and the flow area inside the heat dissipation pipe will continuously vaporize and liquefy, thereby continuously and rapidly conducting heat outward. Strengthening the network management can strengthen the connection between the filling tube and the heat dissipation pipe shell.

[0019] 2. When the present invention is in use, the side of the transistor body where the transistor end is not installed is contacted with the elastic positioning bar, and the elastic positioning bar is gently pushed toward the fixed frame. The elastic positioning bar will be deformed when pushed, and the side of the transistor body where the transistor end is installed is pressed so that this side is stuck inside the two limit blocks. At this time, the installation of the transistor body is released and the position of the transistor body is adjusted. The outward side of the transistor body is limited by a limit bar and two limit blocks, which can ensure that the transistor body will not automatically pop out and fall. When the pressure on the transistor body is released, the elastic positioning bar with an automatic rebound effect will rebound under its own elastic action, and then the rebound force acts on the surface of the transistor body, thereby completing the clamping of the transistor body. The rebound performance of the elastic positioning bar can be enhanced through the rebound action of the fixed spring, so that the installation of the transistor body can be more stable.

[0020] 3. In the present invention, when in use, the heat dissipation pressing sheet is made of a two-dimensional material, and the selected material is two-dimensional boron nitride, which has high thermal conductivity and can quickly conduct heat away. At the same time, it has good insulation performance, can avoid short circuits between the transistor body and other components, can improve the safety and stability of the equipment, and two-dimensional boron nitride is not easily corroded, which can ensure the stable performance of the heat dissipation pressing sheet during long-term use. The heat dissipation plate made of graphene has good flexibility and processability, and can be designed into various shapes and sizes according to different heat dissipation requirements. Graphene is a two-dimensional crystal material with a large specific surface area, which can fully contact with the heat source to form a good heat conduction interface, reduce thermal resistance, and improve the heat dissipation effect. The heat absorbed by the fixed groove is dissipated through the heat dissipation pipe. When one end of the heat dissipation pipe contacts the heat source inside the fixed groove, the coolant inside it will vaporize when heated, and the vaporization process will quickly absorb a large amount of heat. After that, the steam flows to the other end under the action of air pressure and condenses into liquid. This process will release the heat at the other end, and the cycle is repeated in this way, so that the heat generated by the transistor body can be quickly conducted to the heat dissipation plate, thereby achieving the effect of rapid heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A first-perspective stereoscopic image of a low-power transistor heat dissipation structure based on two-dimensional materials according to the present invention;

[0022] Figure 2 A second-view stereoscopic image of a low-power transistor heat dissipation structure based on two-dimensional materials according to the present invention;

[0023] Figure 3 A partial three-dimensional diagram of a pressing component of a low-power transistor heat dissipation structure based on two-dimensional materials of the present invention;

[0024] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0025] Figure 5 A partial three-dimensional diagram of the mounting components of the low-power transistor heat dissipation structure based on two-dimensional materials of the present invention;

[0026] Figure 6 A partial three-dimensional diagram of a heat dissipation component of a low-power transistor heat dissipation structure based on two-dimensional materials of the present invention;

[0027] Figure 7 For the present invention Figure 6 Enlarged view of point B in the middle;

[0028] Figure 8 It is a three-dimensional diagram of the heat dissipation component structure of the low-power transistor heat dissipation structure based on two-dimensional materials of the present invention;

[0029] Fig. 9 A partially cutaway stereoscopic view of a heat sink of a low-power transistor heat sink structure based on two-dimensional materials according to the present invention;

[0030] Fig.10 This is a stereoscopic view from another perspective of the heat dissipation plate portion of the low-power transistor heat dissipation structure based on two-dimensional materials of the present invention.

[0031] In the figure:

[0032] 1. Installation assembly; 101. Fixed bottom plate; 102. Fixed frame; 103. Limiting strip; 104. Elastic positioning strip; 105. Protective plate; 106. Fixed spring; 107. Fixed angle frame; 108. Limiting block; 2. Heat dissipation assembly; 201. Heat dissipation pipe; 202. Heat dissipation plate; 203. Support plate; 204. Installation frame; 205. Reinforcement plate; 206. Semiconductor refrigeration sheet; 207. Closed ring; 208. Heat dissipation mesh plate; 209. Connecting plate; 210. Servo motor; 211. Fan blade; 212. Cover plate; 213. Filling tube; 214. Flow area; 215. Reinforcement mesh tube; 3. Pressing assembly; 301. Heat dissipation pressing sheet; 302. Fixed groove; 303. Fixing bolt; 4. Transistor body. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1: Reference Figure 1-Figure 10As shown, the present invention provides a technical solution: a low-power transistor heat dissipation structure based on two-dimensional materials, including a mounting component 1 and a pressing component 3, the pressing component 3 includes a heat dissipation pressing sheet 301, and the heat dissipation pressing sheet 301 is made of a two-dimensional material and has elasticity, which is used to improve thermal conductivity, a heat dissipation component 2 is arranged on the top of the heat dissipation pressing sheet 301, the heat dissipation component 2 includes a plurality of heat dissipation pipes 201, the plurality of heat dissipation pipes 201 are evenly divided into two groups, the two groups of heat dissipation pipes 201 are symmetrically arranged, the outer clamping sleeves of the plurality of heat dissipation pipes 201 are provided with a plurality of heat dissipation plates 202, the arrangement of the plurality of heat dissipation plates 202 is densely and sparsely arranged, and the plurality of heat dissipation plates 202 are arranged in a densely and sparsely arranged manner. Each heat sink 202 is made of graphene, which is used for rapid heat conduction. A closed ring 207 is fixedly connected to the outside of each heat sink 202 near each adjacent heat sink 202. A filling tube 213 is arranged on the inner wall of each heat pipe 201, and the material used for the filling tube 213 is a composite liquid wick composed of a variety of materials. A flow area 214 is provided inside each filling tube 213. A reinforcing mesh tube 215 is fixedly connected to the inner wall of each filling tube 213, and the reinforcing mesh tube 215 is used to enhance the bonding strength between the liquid wick and the inner wall of the filling tube 213. Both sides of the heat dissipation pressing plate 301 are provided with There is a fixing groove 302, and the fixing groove 302 is used to improve the heat dissipation effect. The top of the fixed bottom plate 101 is fixedly connected with a fixing bolt 303. The heat dissipation pressing plate 301 is movably sleeved on the outside of the fixing bolt 303. The external thread of the fixing bolt 303 is connected with a nut. The bottom ends of the two groups of heat dissipation pipes 201 are respectively fixedly connected to the inner walls of the two fixing grooves 302. The multiple heat dissipation pipes 201 are used to dissipate the heat generated by the transistor body 4. Four reinforcing plates 205 are fixedly connected to the outer surface of one side of the multiple heat dissipation plates 202. A semiconductor cooling plate 206 is arranged between the outer surfaces of the four reinforcing plates 205, and the semiconductor The refrigeration plate 206 is used to make cold air to enhance the heat dissipation performance. The other side outer surface of the multiple heat sinks 202 is fixedly connected to four support plates 203, the outer surfaces of the four support plates 203 are fixedly connected to the mounting frame 204, the inner wall of the mounting frame 204 is fixedly connected to a connecting plate 209, a servo motor 210 is arranged in the middle of the outer surface of the connecting plate 209, the output shaft of the servo motor 210 is fixedly connected to the fan blade 211, one side of the connecting plate 209 is fixedly connected to a cover plate 212, one side of the mounting frame 204 is fixedly connected to a heat dissipation mesh plate 208, and the heat dissipation mesh plate 208 is used to protect the fan blade 211.

[0035] In this embodiment, when in use, the heat dissipation pressing sheet 301 is sleeved on the outside of the fixing bolt 303, and one end of the heat dissipation pressing sheet 301 is pressed on the surface of the transistor body 4. After the position is determined, the nut is threadedly sleeved on the outside of the fixing bolt 303, and the nut is tightened, so as to complete the installation of the heat dissipation pressing sheet 301, so that the heat dissipation pressing sheet 301 tightly clamps the transistor body 4, and the heat generated by the transistor body 4 will be absorbed by the heat dissipation pressing sheet 301, and the heat concentrated in the fixing grooves 302 opened on both sides of the heat dissipation pressing sheet 301 will be transferred to the heat dissipation pipe 201 with good thermal conductivity. Multiple heat dissipation pipes 201 absorb heat at the same time, so that heat dissipation can be quickly achieved. Multiple layers of heat dissipation plates 202 are sleeved on the multiple heat dissipation pipes 201, and the heat dissipation plates 202 can The heat is absorbed quickly, which accelerates the heat dissipation. By starting the semiconductor refrigeration sheet 206 and the servo motor 210, on the one hand, the cold air generated by the semiconductor refrigeration sheet 206 enters the gaps between the multiple heat sinks 202, and on the other hand, the output shaft of the servo motor 210 rotates, thereby driving the fan blades 211 to rotate. The rotation of the fan blades 211 forms a suction force, which will simultaneously dissipate the cold air generated by the semiconductor refrigeration sheet 206 and the heat conducted by the multiple heat pipes 201 and the heat sink 202 to the outside. Multiple methods dissipate heat at the same time, and the heat dissipation speed is much faster than traditional metal heat dissipation. Among them, the filling tube 213 and the flow area 214 inside the heat pipe 201 will continuously vaporize and liquefy, thereby continuously and rapidly conducting heat to the outside. The strengthening of the network pipe 215 can strengthen the connection between the filling tube 213 and the outer shell of the heat pipe 201.

[0036] Embodiment 2: Figure 1-Figure 10 As shown, the mounting assembly 1 includes a fixed base plate 101, two fixed corner frames 107 are fixedly connected to the top of the fixed base plate 101 near one side, and the inner walls of the two fixed corner frames 107 are fixedly connected to the limit blocks 108 near the top. A fixed frame 102 is fixedly connected to the top of the fixed base plate 101 near the other side, and a protective plate 105 is fixedly connected to the top of the fixed frame 102, and the protective plate 105 is used for dust prevention. The inner wall of the fixed frame 102 is fixedly connected to an elastic positioning strip 104, and the elastic positioning strip 104 is fixedly connected to the inner wall of the fixed frame 102. The positioning strip 104 is made of insulating elastic material, and a fixing spring 106 is arranged between the inner wall of the elastic positioning strip 104 and the inner wall of the fixed frame 102, and the fixing spring 106 is used to elastically support the elastic positioning strip 104. The outer surface of the elastic positioning strip 104 is fixedly connected to the limiting strip 103 near the top, and the transistor body 4 is arranged between the inner wall of the fixed frame 102 and the inner walls of the two fixed corner frames 107. The limiting strip 103 and the two limiting blocks 108 are used to limit the position of the transistor body 4.

[0037] In this embodiment, when in use, the transistor body 4 is first placed on the surface of the fixed base plate 101, specifically between two fixed corner frames 107 and a fixed frame 102, and the installation steps are as follows: the first step is to contact the side of the transistor body 4 where the transistor end is not installed with the elastic positioning strip 104, and gently push the elastic positioning strip 104 toward the fixed frame 102. When pushed, the elastic positioning strip 104 will be deformed. The second step is to press the side of the transistor body 4 where the transistor end is installed, so that this side is stuck inside the two limit blocks 108. At this time, the installation of the transistor body 4 is released, and the transistor body is fixed. The position of the transistor body 4 is adjusted. After the adjustment, the outward side of the transistor body 4 is limited by a limit strip 103 and two limit blocks 108, which can ensure that the transistor body 4 will not automatically pop out and fall. In the third step, when the pressure on the transistor body 4 is released, the elastic positioning strip 104 with an automatic rebound effect will rebound under its own elastic action, and then the rebound force acts on the surface of the transistor body 4, thereby completing the clamping of the transistor body 4. Through the rebound effect of the fixed spring 106, the rebound performance of the elastic positioning strip 104 can be strengthened, so that the installation of the transistor body 4 can be more stable.

[0038] Embodiment three: Figure 1-Figure 10 As shown, both sides of the heat dissipation pressing plate 301 are provided with fixing grooves 302, and the fixing grooves 302 are used to improve the heat dissipation effect. The top of the fixed bottom plate 101 is fixedly connected with a fixing bolt 303. The heat dissipation pressing plate 301 is movably sleeved on the outside of the fixing bolt 303. The external thread of the fixing bolt 303 is connected with a nut. The bottom ends of the two groups of heat dissipation pipes 201 are respectively fixedly connected to the inner walls of the two fixing grooves 302. The multiple heat dissipation pipes 201 are used to dissipate the heat generated by the transistor body 4. Four reinforcing plates 205 are fixedly connected to the outer surface of one side of the multiple heat dissipation plates 202. A semiconductor cooling sheet is arranged between the outer surfaces of the four reinforcing plates 205. 206, and the semiconductor refrigeration sheet 206 is used to make cold air to enhance the heat dissipation performance, the other side outer surface of the plurality of heat sinks 202 is fixedly connected with four support plates 203, the outer surfaces of the four support plates 203 are fixedly connected with the mounting frame 204, the inner wall of the mounting frame 204 is fixedly connected with a connecting plate 209, a servo motor 210 is arranged in the middle of the outer surface of the connecting plate 209, the output shaft of the servo motor 210 is fixedly connected with a fan blade 211, one side of the connecting plate 209 is fixedly connected with a cover plate 212, one side of the mounting frame 204 is fixedly connected with a heat dissipation mesh plate 208, and the heat dissipation mesh plate 208 is used to protect the fan blade 211.

[0039] In this embodiment, when in use, the heat sink 301 is made of a two-dimensional material, and two-dimensional boron nitride is selected, which replaces the traditional metal, has high thermal conductivity, can quickly conduct heat away, and has good insulation performance, can avoid short circuits between the transistor body 4 and other components, can improve the safety and stability of the equipment, two-dimensional boron nitride is not easy to corrode, can ensure the stability of the performance of the heat sink 301 during long-term use, the heat sink 202 made of graphene has good flexibility and processability, and can be designed into various shapes and sizes according to different heat dissipation requirements. Graphene is a two-dimensional crystalline material, which has a large specific surface area and can fully contact with the heat source to form a good heat sink. The conduction interface reduces thermal resistance and improves the heat dissipation effect. The heat absorbed inside the fixed groove 302 is dissipated through the heat dissipation pipe 201. The outer layer of the heat dissipation pipe 201 is made of copper and the inside is vacuum. The filling tube 213 inside is a rough contact surface. There is a coolant inside for heat transfer. When one end of the heat dissipation pipe 201 contacts the heat source inside the fixed groove 302, the coolant inside will vaporize when it encounters heat. The vaporization process will quickly absorb a large amount of heat. After that, the steam flows to the other end under the action of air pressure and condenses into liquid. This process will release the heat at the other end. This cycle is repeated, so that the heat generated by the transistor body 4 can be quickly conducted to the heat sink 202, thereby achieving the effect of rapid heat dissipation.

[0040] The method of use and working principle of the device: When in use, first place the transistor body 4 on the surface of the fixed base plate 101, specifically between two fixed corner frames 107 and a fixed frame 102, and the installation steps are as follows: the first step is to contact the side of the transistor body 4 where the transistor end is not installed with the elastic positioning strip 104, and gently push the elastic positioning strip 104 toward the fixed frame 102. When pushed, the elastic positioning strip 104 will be deformed. The second step is to press the side of the transistor body 4 where the transistor end is installed so that this side is stuck inside the two limit blocks 108. At this time, release the installation of the transistor body 4 and adjust the position of the transistor body 4. After the adjustment is completed, the side of the transistor body 4 facing outward is The transistor body 4 is limited by a limit strip 103 and two limit blocks 108, which can ensure that the transistor body 4 will not automatically pop out and fall. In the third step, when the pressure on the transistor body 4 is released, the elastic positioning strip 104 with an automatic rebound effect will rebound under its own elastic action, and then the rebound force acts on the surface of the transistor body 4, thereby completing the clamping of the transistor body 4. The rebound effect of the fixing spring 106 can enhance the rebound performance of the elastic positioning strip 104. When in use, the heat dissipation pressing sheet 301 is sleeved on the outside of the fixing bolt 303, and one end of the heat dissipation pressing sheet 301 is pressed on the surface of the transistor body 4. After determining the position, the nut is threadedly sleeved on the outside of the fixing bolt 303, and the nut is tightened. , thereby completing the installation of the heat sink pressing plate 301, so that the heat sink pressing plate 301 tightly clamps the transistor body 4, the heat generated by the transistor body 4 will be absorbed by the heat sink pressing plate 301, and the heat concentrated inside the fixing grooves 302 opened on both sides of the heat sink pressing plate 301 will be transferred to the heat pipe 201 with good thermal conductivity. A multi-layer heat sink plate 202 is set on the multiple heat pipes 201, and the heat sink plate 202 can quickly absorb the heat on the outer surface of the heat pipe 201. By starting the semiconductor cooling plate 206 and the servo motor 210, on the one hand, the cold air generated by the semiconductor cooling plate 206 enters the gaps between the multiple heat sink plates 202, and on the other hand, the output shaft of the servo motor 210 rotates, thereby driving the fan blades 211 to rotate, and the rotation of the fan blades 211 forms The suction force will simultaneously dissipate the cold air generated by the semiconductor refrigeration sheet 206 and the heat conducted by the multiple heat pipes 201 and the heat sink 202. Among them, the filling tube 213 and the flow area 214 inside the heat pipe 201 will continuously vaporize and liquefy, thereby continuously and rapidly conducting heat outward. The strengthening network tube 215 can strengthen the connection between the filling tube 213 and the heat pipe 201 shell. When in use, the heat dissipation pressing sheet 301 is made of a two-dimensional material, and the two-dimensional boron nitride is selected to replace the traditional metal. It has high thermal conductivity and can quickly conduct heat out. At the same time, it has good insulation performance, which can avoid short circuits between the transistor body 4 and other components, and can improve the safety and stability of the equipment. The two-dimensional boron nitride is not easy to be corroded.The performance of the heat sink 301 can be guaranteed to be stable during long-term use. The heat sink 202 made of graphene has good flexibility and processability, and can be designed into various shapes and sizes according to different heat dissipation requirements. Graphene is a two-dimensional crystal material with a large specific surface area, which can fully contact with the heat source to form a good heat conduction interface, reduce thermal resistance, and improve the heat dissipation effect. The heat absorbed inside the fixed groove 302 is dissipated through the heat pipe 201. The outer layer of the heat pipe 201 is made of copper, and the inside is vacuum. The filling pipe 213 inside is a rough contact surface, and there is a coolant for heat transfer inside. When one end of the heat pipe 201 contacts the heat source inside the fixed groove 302, the coolant inside it will vaporize when it encounters heat. The vaporization process will quickly absorb a large amount of heat. After that, the steam flows to the other end under the action of air pressure and condenses into liquid. This process will release the heat at the other end, and the cycle is repeated in this way, so that the heat generated by the transistor body 4 can be quickly transferred to the heat sink 202.

[0041] The wiring diagram of the semiconductor cooling plate 206 and the servo motor 210 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use, so the control method and wiring layout of the semiconductor cooling plate 206 and the servo motor 210 will not be explained in detail.

[0042] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A low-power transistor heat dissipation structure based on two-dimensional materials, comprising a mounting component (1) and a pressing component (3), wherein the pressing component (3) comprises a heat dissipation pressing sheet (301), and the heat dissipation pressing sheet (301) is made of two-dimensional material and has elasticity, and is used to improve thermal conductivity, and a heat dissipation component (2) is arranged on the top of the heat dissipation pressing sheet (301), characterized in that: The heat dissipation component (2) comprises a plurality of heat dissipation tubes (201), the plurality of heat dissipation tubes (201) are evenly divided into two groups, the two groups of heat dissipation tubes (201) are symmetrically arranged, the outer parts of the plurality of heat dissipation tubes (201) are provided with a plurality of heat dissipation plates (202) in a locking sleeve, the plurality of heat dissipation plates (202) are arranged in a dense and sparse arrangement, the plurality of heat dissipation plates (202) are all made of graphene, which is used for rapid heat conduction, and the outer part of each heat dissipation plate (202) is close to each adjacent heat dissipation plate ( 202) are fixedly connected with a closed ring (207), the inner wall of each heat dissipation tube (201) is provided with a filling tube (213), and the material used for the filling tube (213) is a composite liquid-absorbing core composed of a plurality of materials, a flow area (214) is opened inside each filling tube (213), and the inner wall of each filling tube (213) is fixedly connected with a reinforcing mesh tube (215), and the reinforcing mesh tube (215) is used to enhance the bonding strength between the liquid-absorbing core and the inner wall of the filling tube (213).

2. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 1, characterized in that: The mounting assembly (1) comprises a fixed base plate (101), the top of the fixed base plate (101) being fixedly connected to two fixed corner frames (107) near one side, and the inner walls of the two fixed corner frames (107) being fixedly connected to limiting blocks (108) near the top.

3. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 2, characterized in that: A fixed frame (102) is fixedly connected to the top of the fixed base plate (101) near the other side, a protective plate (105) is fixedly connected to the top of the fixed frame (102), and the protective plate (105) is used for dust prevention, and an elastic positioning strip (104) is fixedly connected to the inner wall of the fixed frame (102), and the elastic positioning strip (104) is made of an insulating elastic material.

4. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 3, characterized in that: A fixing spring (106) is arranged between the inner wall of the elastic positioning strip (104) and the inner wall of the fixing frame (102), and the fixing spring (106) is used to elastically support the elastic positioning strip (104), and the outer surface of the elastic positioning strip (104) is fixedly connected to the limiting strip (103) near the top.

5. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 4, characterized in that: A transistor body (4) is arranged between the inner wall of the fixed frame (102) and the inner walls of the two fixed corner frames (107), and the limit strip (103) and the two limit blocks (108) are used to limit the position of the transistor body (4).

6. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 5, characterized in that: Both sides of the heat dissipation pressing plate (301) are provided with fixing grooves (302), and the fixing grooves (302) are used to improve the heat dissipation effect. The top of the fixed base plate (101) is fixedly connected with a fixing bolt (303), the heat dissipation pressing plate (301) is movably sleeved on the outside of the fixing bolt (303), and the outside of the fixing bolt (303) is threadedly connected with a nut.

7. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 6, characterized in that: The bottom ends of the two groups of heat dissipation tubes (201) are respectively fixedly connected to the inner walls of the two fixing grooves (302), and the plurality of heat dissipation tubes (201) are used to dissipate heat generated by the transistor body (4).

8. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 7, characterized in that: Four reinforcing plates (205) are fixedly connected to the outer surfaces of one side of the plurality of heat dissipation plates (202), and semiconductor cooling plates (206) are arranged between the outer surfaces of the four reinforcing plates (205), and the semiconductor cooling plates (206) are used to produce cold air to enhance heat dissipation performance.

9. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 8, characterized in that: Four support plates (203) are fixedly connected to the outer surfaces of the other sides of the plurality of heat dissipation plates (202), a mounting frame (204) is fixedly connected to the outer surfaces of the four support plates (203), and a connecting plate (209) is fixedly connected to the inner wall of the mounting frame (204).

10. The low-power transistor heat dissipation structure based on two-dimensional materials according to claim 9, characterized in that: A servo motor (210) is arranged in the middle of the outer surface of the connecting plate (209); the output shaft of the servo motor (210) is fixedly connected to a fan blade (211); a cover plate (212) is fixedly connected to one side of the connecting plate (209); a heat dissipation mesh plate (208) is fixedly connected to one side of the installation frame (204); and the heat dissipation mesh plate (208) is used to protect the fan blade (211).

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