Uniform-temperature liquid cooling plate

Abstract

The invention provides a uniform-temperature liquid cooling plate which comprises a substrate, a plurality of strip-shaped grooves and two notches are formed in the upper surface of the substrate, the two ends of each strip-shaped groove are connected with the two notches respectively, and a side edge groove extending in the longitudinal direction is formed in one transverse side face of the substrate; the temperature equalizing plate is inserted into the side edge groove; the two connecting blocks are inserted into the notches respectively, pipe connectors are formed in the side portions, facing the base plate, of the connecting blocks, pipe connectors are formed on the sides, facing air, of the connecting blocks, cavities are formed in the connecting blocks, and the pipe connectors and the pipe connectors are both communicated with the cavities; the multiple copper pipes are embedded in the multiple strip-shaped grooves in a one-to-one correspondence mode and abut against the inner walls of the strip-shaped grooves, and the two ends of each copper pipe are connected with the pipe connectors of the two connecting blocks correspondingly; the liquid inlet hose and the liquid outlet hose are respectively connected with the pipe joints of the two connecting blocks. The uniform-temperature liquid cooling plate is easy and convenient to manufacture and good in sealing performance.

Description

Technical Field

[0001] The present invention relates to the field of chips, and in particular to a temperature-averaging liquid cooling plate. Background Art

[0002] The chip will generate heat during operation, and the radiator can effectively dissipate the heat of the chip to maintain the normal operation of the chip.

[0003] However, the existing radiator usually includes a bottom plate and a top plate, the bottom plate is cut to form a flow channel and a liquid inlet / outlet hole, the bottom plate is covered with a cover plate, and the gap between the cover plate and the bottom plate is welded. This processing is complicated, the process is cumbersome, and the welding area is large, which may cause leakage. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a temperature-uniform liquid cooling plate which is easy to manufacture and has good sealing performance.

[0005] In order to solve the above problems, the present invention provides a temperature-averaging liquid cooling plate, the temperature-averaging liquid cooling plate comprising:

[0006] A substrate, wherein a plurality of strip grooves and two notches are formed on the upper surface of the substrate, wherein the plurality of strip grooves extend in the transverse direction of the substrate and are spaced apart in the longitudinal direction, wherein the two notches are arranged at the edges of both ends of the substrate in the transverse direction and penetrate the substrate in the thickness direction, wherein the two ends of the strip groove are respectively connected to the two notches, and a side groove extending in the longitudinal direction is formed on one transverse side surface of the substrate, and the upper surface and / or the lower surface of the substrate is used for connecting a chip;

[0007] A temperature averaging plate, the temperature averaging plate is inserted into the side groove;

[0008] Two connection blocks, the two connection blocks are respectively inserted into the recesses, the connection blocks are formed with a pipe interface on the side facing the substrate, and a pipe joint is formed on the side facing the air, a chamber is formed inside the connection block, and the pipe interface and the pipe joint are both connected to the chamber;

[0009] A plurality of copper tubes, wherein the plurality of copper tubes are buried in the plurality of strip-shaped grooves one by one and abut against the inner walls of the strip-shaped grooves, and two ends of the copper tubes are respectively connected to the pipe interfaces of two connecting blocks;

[0010] The liquid inlet hose and the liquid outlet hose are respectively connected to the pipe joints of the two connecting blocks.

[0011] Furthermore, the bottom of the strip-shaped groove is connected to the bottom of the strip-shaped groove, and the copper tube is connected to the temperature homogenizing plate.

[0012] Furthermore, the temperature-averaging liquid cooling plate further comprises:

[0013] A thermal grease layer is filled in the strip groove and the side groove. The thermal grease layer is located in the gap between the substrate and the copper tube, in the gap between the copper tube and the temperature equalizing plate, and between the substrate and the temperature equalizing plate.

[0014] Furthermore, the substrate comprises:

[0015] A first area, in which the upper surface of the substrate is flush with the upper surface of the copper tube, the first area is used to connect the chip, and the temperature plate is located in the first area.

[0016] Furthermore, the substrate further comprises:

[0017] A second area, within the second area, the upper surface of the substrate is higher than the upper surface of the copper tube, and the thermal grease layer fills the strip-shaped groove.

[0018] Furthermore, a plurality of pads are formed on the lower surface of the substrate, a plurality of ejector pins are arranged on the pads to support the chip, and the pads are used to connect the chip through solder.

[0019] Furthermore, an annular groove is formed on the edge of the substrate adjacent to the pad, and the temperature-averaging liquid cooling plate further comprises:

[0020] A first solder resist ink layer, wherein the first solder resist ink layer is laid in the annular groove, and an upper surface of the first solder resist ink layer is not higher than an upper surface of the substrate;

[0021] The second solder resist ink layer is arranged around the edge of the first solder resist ink layer to form a closed pattern, and the upper surface of the second solder resist ink layer is not higher than the end of the ejector pin away from the substrate.

[0022] Furthermore, the substrate is a copper plate, an aluminum plate or a stainless steel plate.

[0023] Furthermore, the pipe joint is formed as a pagoda joint, and the temperature-averaging liquid cooling plate further comprises:

[0024] Two clamps are sleeved on one end of the liquid inlet hose and the liquid outlet hose adjacent to the connection block.

[0025] Furthermore, the temperature-averaging liquid cooling plate further comprises:

[0026] Two adapters, the two adapters are connected to the liquid inlet hose and the end of the liquid outlet hose away from the connecting block in a one-to-one correspondence, and the two adapters are used to detachably connect the liquid inlet end and the liquid outlet end of the cooling liquid providing device.

[0027] Due to the above technical solution, the present invention has the following beneficial effects:

[0028] According to the temperature-averaging liquid cold plate of the present invention, the coolant flows from the liquid inlet hose to the connecting block connected thereto, flows to a plurality of copper tubes through the pipe interface of the connecting block, flows into another connecting block, and finally flows out from the liquid outlet hose. During the flow of the coolant in the plurality of copper tubes, the plurality of copper tubes are cooled. The plurality of copper tubes are buried in the plurality of strip grooves of the substrate and abut against the inner wall of the strip grooves. The copper tubes can conduct heat to the substrate, and the thermal conductivity of copper is relatively high, so the substrate can be efficiently cooled. The upper surface and / or lower surface of the substrate are connected to the chip (chip, power device / module, etc.), so that the chip can be efficiently cooled. The coolant is mainly distributed in the liquid inlet hose, the two connecting blocks and the copper tube. Compared with the structure of the ordinary temperature-averaging liquid cold plate matched with the bottom plate and the cover plate, the manufacturing is relatively simple and the sealing is better, and the cost is relatively low. Moreover, the liquid inlet hose and the liquid outlet hose can be easily flexibly connected to the cooling liquid providing device. The temperature spreader can achieve large-area heat dissipation, thereby making up for the relative insufficiency of local cooling of multiple copper tubes and heat transfer of the substrate. The temperature spreader can quickly diffuse the heat of the chip and the low temperature of the copper tube to the same larger area, which can improve the heat dissipation efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a structural diagram of a temperature-averaging liquid cooling plate according to an embodiment of the present invention;

[0031] Figure 2 is a structural diagram of a substrate according to an embodiment of the present invention;

[0032] Figure 3 is a structural diagram of the back side of a temperature-averaging liquid cooling plate according to an embodiment of the present invention;

[0033] Figure 4 yes Figure 3 A magnified view of region A in FIG.

[0034] Figure 5 yes Figure 3 An enlarged view of the substrate in region A;

[0035] Figure 6 is a structural diagram of a connection block according to an embodiment of the present invention.

[0036] Reference numerals:

[0037] 100, substrate; 110, first area; 120, second area; 130, notch; 140, strip groove; 150, side groove; 160, pad; 170, annular groove; 210, copper tube; 220, thermal grease layer; 300, connecting block; 310, pipe interface; 320, pagoda joint; 410, liquid inlet hose; 420, adapter; 430, liquid outlet hose; 510, first solder resist ink layer; 520, second solder resist ink layer; 530, ejector pin; 600, clamp; 700, temperature equalizing plate. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0040] Next, a temperature-uniform liquid cooling plate according to an embodiment of the present invention is described.

[0041] like Figure 1 As shown in the figure, the temperature-averaging liquid cooling plate according to the embodiment of the present invention includes a base plate 100 , a temperature-averaging plate 700 , two connecting blocks 300 , a plurality of copper tubes 210 , a liquid inlet hose 410 and a liquid outlet hose 430 .

[0042] First, the substrate 100 is described. A plurality of strip grooves 140 and two notches 130 are formed on the upper surface of the substrate 100. The plurality of strip grooves 140 extend in the lateral direction of the substrate 100 and are spaced apart in the longitudinal direction. The two notches 130 are arranged at the edges of both ends of the lateral direction of the substrate 100 and penetrate the substrate 100 in the thickness direction. The two ends of the strip groove 140 are respectively connected to the two notches 130. A side groove 150 extending in the longitudinal direction is formed on one lateral side of the substrate 100. The upper surface and / or the lower surface of the substrate 100 is used to connect the chip.

[0043] like Figure 2As shown, the substrate 100 is formed into a rectangular parallelepiped (the shape of the substrate 100 is not limited here), and two strip grooves 140 (the number of the strip grooves 140 is not limited here), a side groove 150 and two notches 130 are formed on the substrate 100.

[0044] Optionally, the substrate 100 is a copper plate, an aluminum plate or a stainless steel plate. Thus, the substrate 100 can have a higher thermal conductivity.

[0045] Next, the temperature averaging plate 700 is described. The temperature averaging plate 700 is inserted into the side groove 150. The temperature averaging plate 700 belongs to the known technology and will not be described in detail here.

[0046] like Figure 1 As shown, the temperature plate 700 is inserted into the side groove 150. The temperature plate 700 can dissipate heat efficiently and quickly and evenly in a two-dimensional plane. The temperature plate 700 has a liquid cooling evaporation and condensation process, can dissipate heat quickly, and can quickly spread heat to a larger area, thereby improving the heat dissipation efficiency.

[0047] Next, the two connection blocks 300 are described. The two connection blocks 300 are respectively inserted into the recesses 130, the connection blocks 300 are formed with a pipe interface 310 on the side facing the substrate 100, and a pipe joint is formed on the side facing the air, a chamber is formed inside the connection block 300, and the pipe interface 310 and the pipe joint are both connected to the chamber.

[0048] like Figure 1 and Figure 6 As shown, two connection blocks 300 are inserted into two recesses 130 of the base plate 100. The pipe interface 310 of the connection block 300 faces the base plate 100, and the pipe joint thereof faces the air (away from the base plate 100).

[0049] Next, the multiple copper tubes 210, the liquid inlet hose 410 and the liquid outlet hose 430 are described. The multiple copper tubes 210 are buried in the multiple strip grooves 140 one by one and abut against the inner wall of the strip grooves 140, and the two ends of the copper tubes 210 are respectively connected to the pipe interfaces 310 of the two connection blocks 300. The liquid inlet hose 410 and the liquid outlet hose 430 are respectively connected to the pipe joints of the two connection blocks 300.

[0050] like Figure 1 As shown, two copper tubes 210 are embedded in two strip grooves 140, and the two ends of the copper tube 210 are respectively connected to the pipe interfaces 310 of the two connection blocks 300, and the liquid outlet hose 430 and the liquid inlet hose 410 are respectively connected to the pipe joints of the two connection blocks 300. The liquid inlet hose 410 and the liquid outlet hose 430 can be flexibly connected to the coolant supply device to avoid bending and damage of the commonly used hard tubes during connection or use.

[0051] In the above uniform temperature liquid cold plate, the coolant flows from the liquid inlet hose 410 to the connecting block 300 connected thereto, flows to the multiple copper tubes 210 through the pipe interface 310 of the connecting block 300, then flows into another connecting block 300, and finally flows out from the liquid outlet hose 430. During the flow of the coolant in the multiple copper tubes 210, the multiple copper tubes 210 are cooled. The multiple copper tubes 210 are buried in the multiple strip grooves 140 of the substrate 100 and abut against the inner wall of the strip grooves 140. The copper tubes 210 can conduct heat to the substrate 100, and the thermal conductivity of copper is relatively high, so the substrate 100 can be efficiently cooled. The upper surface and / or lower surface of the substrate 100 are connected to the chip (chip, power device / module, etc.), so that the chip can be efficiently cooled. The coolant is mainly distributed in the liquid inlet hose 410, the two connecting blocks 300 and the copper tubes 210. Compared with the structure of the ordinary uniform temperature liquid cold plate through the cooperation of the bottom plate and the cover plate, the production is relatively simple and the sealing is better, and the cost is low. Moreover, the liquid inlet hose 410 and the liquid outlet hose 430 can be flexibly connected to the cooling liquid supply device. The temperature plate 700 can achieve large-area heat dissipation, thereby making up for the relative lack of local cooling of multiple copper tubes 210 and heat transfer of the substrate 100. The temperature plate 700 can quickly diffuse the heat of the chip and the low temperature of the copper tube 210 to the same larger area, which can improve the heat dissipation efficiency of the chip.

[0052] Furthermore, the bottoms of the strip-shaped grooves 140 are connected to the bottoms of the strip-shaped grooves 140 , and the copper tube 210 is connected to the temperature homogenizing plate 700 .

[0053] like Figure 1 As shown, the bottom of the strip groove 140 is connected to the bottom of the strip groove 140, the copper tube 210 and the temperature equalizing plate 700 are directly connected, and the low temperature of the copper tube 210 can be directly transferred to the temperature equalizing plate 700. Compared with relying on the substrate 100 as the intermediate heat conduction medium (the copper tube 210 is connected to the substrate 100, and the substrate 100 is connected to the temperature equalizing plate 700), it can have a higher heat dissipation efficiency for the chip.

[0054] Furthermore, the temperature-averaging liquid cold plate further includes a thermal grease layer 220. The thermal grease layer 220 is filled in the strip groove 140 and the side groove 150, and the thermal grease layer 220 is located in the gap between the substrate 100 and the copper tube 210, in the gap between the copper tube 210 and the temperature-averaging plate 700, and between the substrate 100 and the temperature-averaging plate 700.

[0055] like Figure 1As shown, after the copper tube 210 is buried in the strip groove 140 and the temperature equalizing plate 700 is inserted into the side groove 150, thermal grease can be applied in the strip groove 140 and the side groove 150, and the thermal grease flows to the gap between the copper tube 210 and the strip groove 140, the gap between the copper tube 210 and the temperature equalizing plate 700, the gap between the temperature equalizing plate 700 and the side groove 150, and the surface of the copper tube 210, thereby reducing the contact thermal resistance and improving the cooling efficiency.

[0056] Further, the substrate 100 includes a first region 110 . In the first region 110 , the upper surface of the substrate 100 is flush with the upper surface of the copper tube 210 . The first region 110 is used to connect the chip, and the temperature plate 700 is located in the first region 110 .

[0057] like Figure 1 As shown, the middle of the substrate 100 forms a first region 110, in which the depth of the strip groove 140 is relatively shallow. After the copper tube 210 is buried in the strip groove 140, the copper tube 210 can be squeezed, so that the upper surface of the substrate 100 is flush with the upper surface of the copper tube 210, and the chip is directly connected to the upper surface of the copper tube 210. The copper tube 210 directly cools the chip, and the cooling efficiency is relatively high. Moreover, the first region 110 is also the region where the temperature plate 700 is distributed. The chip is arranged in this region, and the heat dissipation efficiency is also higher.

[0058] Furthermore, the substrate 100 further includes a second region 120 . In the second region 120 , the upper surface of the substrate 100 is higher than the upper surface of the copper tube 210 , and the thermal conductive silicone grease layer 220 fills the strip-shaped groove 140 .

[0059] As shown in FIG. 1 , the two lateral ends of the substrate 100 form a second region 120 (the upper surface of the substrate 100 in this region is not directly connected to the chip, but the lower surface of the substrate 100 can be connected to the chip). The depth of the strip groove 140 in this region is relatively deep. After the copper tube 210 is buried in the strip groove 140, the thermal grease of the copper tube 210 fills the strip groove 140 (the thermal grease layer 220 covers the upper surface of the copper tube 210), which can increase the contact area of ​​the thermal grease, improve cooling efficiency, and better protect the copper tube 210. The different settings of the first region 110 and the second region 120 of the substrate 100 meet the heat dissipation requirements of different regions.

[0060] In some embodiments of the present invention, a plurality of pads 160 are formed on the lower surface of the substrate 100 , and a plurality of ejector pins 530 are disposed on the pads 160 to support the chip. The pads 160 are used to connect the chip through solder.

[0061] like Figure 3As shown, a plurality of pads 160 are formed on the substrate 100, and ejector pins 530 are arranged on the pads 160. Solder can be applied on the pads 160 or on the back of the chip, and the chip is placed on the ejector pins 530 to achieve welding connection between the chip and the pads 160. The ejector pins 530 support the chip, so that there is space between the pads 160 and the chip to accommodate the solder, increase the uniformity of the solder distribution, and maintain a certain thickness of the solder.

[0062] Further, an annular groove is formed at the edge of the substrate 100 adjacent to the pad 160. The temperature-averaging liquid cold plate further includes a first solder resist ink layer 510 and a second solder resist ink layer 520. The first solder resist ink layer 510 is laid in the annular groove, and the upper surface of the first solder resist ink layer 510 is not higher than the upper surface of the substrate 100. The second solder resist ink layer 520 is arranged around the edge of the first solder resist ink layer 510 to form a closed pattern, and the upper surface of the second solder resist ink layer 520 is not higher than the end of the ejector pin 530 away from the substrate 100.

[0063] like Figure 3 , Figure 4 and Figure 5 As shown, an annular groove 170 is formed at the edge of the pad 160, and a first solder resist ink layer 510 is laid in the annular groove 170, and the upper surface of the first solder resist ink layer 510 is not higher than the upper surface of the substrate 100. The first solder resist ink layer 510 has poor wettability to solder (compared with the wettability of the pad 160 to solder, the first solder resist ink layer 510 has poor wettability to solder, which can prevent the solder from flowing to the first solder resist ink layer 510. The solder will shrink to the pad 160 area due to its own tension and the resistance of the first solder resist ink), which can reduce the flow of solder out of the pad 160. Moreover, the upper surface of the first solder resist ink layer 510 is not higher than the upper surface of the substrate 100, so that the ink of the first solder resist layer is all in the annular groove 170, which can avoid the situation where the solder resist ink layer overflows and contaminates the pad 160 and causes poor welding. The first solder resist ink layer 510 can be formed in the annular groove 170 by inkjet printing.

[0064] A second solder resist ink layer 520 with a closed image is arranged around the edge of the first solder resist layer, and the upper surface of the second solder resist ink layer 520 is not higher than the end of the ejector pin 530 away from the substrate 100. The second solder resist ink layer 520 forms a dam, and even if a small amount of solder flows out of the first solder resist ink layer 510, it is enclosed and blocked by the second solder resist ink layer 520 (the upper surface of the second solder resist ink layer 520 is higher than the upper surface of the pad 160, and has a higher blocking effect) and cannot flow out, thereby further reducing the flow of solder out of the pad 160, so that the solder has a predetermined height and increases the uniformity of the solder distribution. Moreover, even if the second solder resist ink layer 520 overflows, it overflows into the straight annular groove 170 and cannot overflow onto the pad 160, which can avoid the situation where the pad 160 is contaminated and causes poor welding. Moreover, a small amount of overflow of the second solder resist ink layer 520 will also form a slope on the outer wall side close to the annular groove 170 , thereby increasing the resistance to solder flow and significantly reducing the solder flowing out of the pad 160 .

[0065] In some embodiments of the present invention, the pipe joint is formed as a pagoda joint 320, and the temperature-averaging liquid cooling plate further includes two clamps 600. The two clamps 600 are sleeved on one end of the liquid inlet hose 410 and the liquid outlet hose 430 adjacent to the connection block 300.

[0066] like Figure 6 As shown, the pipe joint is formed as a pagoda joint 320. The pagoda joint 320 can be conveniently connected to the liquid inlet hose 410 and the liquid outlet hose 430 to reduce the risk of liquid leakage.

[0067] like Figure 1 As shown, one clamp 600 is sleeved on one end of the liquid inlet hose 410 adjacent to the connection block 300, and another clamp 600 is sleeved on one end of the liquid outlet hose 430 adjacent to the connection block 300. The clamp 600 can increase the tightness of the connection between the liquid inlet hose 410 and the pagoda connector 320, and increase the tightness of the connection between the liquid outlet hose 430 and the pagoda connector 320, thereby further reducing the risk of liquid leakage.

[0068] In some embodiments of the present invention, the temperature-averaging liquid cold plate further includes two adapters 420, which are respectively connected to the ends of the liquid inlet hose 410 and the liquid outlet hose 430 away from the connecting block 300, and the two adapters 420 are respectively used to detachably connect the liquid inlet end and the liquid outlet end of the cooling liquid providing device.

[0069] like Figure 1 As shown, two adapters 420 can facilitate detachable quick connection with the coolant supply device.

[0070] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature-uniform liquid cooling plate, characterized in that: The temperature-averaging liquid cooling plate comprises: A substrate, wherein a plurality of strip grooves and two notches are formed on the upper surface of the substrate, wherein the plurality of strip grooves extend in the transverse direction of the substrate and are spaced apart in the longitudinal direction, wherein the two notches are arranged at the edges of both ends of the substrate in the transverse direction and penetrate the substrate in the thickness direction, wherein the two ends of the strip groove are respectively connected to the two notches, and a side groove extending in the longitudinal direction is formed on one transverse side surface of the substrate, and the upper surface and / or the lower surface of the substrate is used for connecting a chip; A temperature averaging plate, the temperature averaging plate is inserted into the side groove; Two connection blocks, the two connection blocks are respectively inserted into the recesses, the connection blocks are formed with a pipe interface on the side facing the substrate, and a pipe joint is formed on the side facing the air, a chamber is formed inside the connection block, and the pipe interface and the pipe joint are both connected to the chamber; A plurality of copper tubes, wherein the plurality of copper tubes are buried in the plurality of strip-shaped grooves one by one and abut against the inner walls of the strip-shaped grooves, and two ends of the copper tubes are respectively connected to the pipe interfaces of two connecting blocks; The liquid inlet hose and the liquid outlet hose are respectively connected to the pipe joints of the two connecting blocks.

2. The temperature-uniform liquid cooling plate according to claim 1, characterized in that: The bottom of the strip-shaped groove is communicated with the bottom of the strip-shaped groove, and the copper tube is connected with the temperature homogenizing plate.

3. The temperature-uniform liquid cooling plate according to claim 2, characterized in that: The temperature-averaging liquid cooling plate further comprises: A thermal grease layer is filled in the strip groove and the side groove. The thermal grease layer is located in the gap between the substrate and the copper tube, in the gap between the copper tube and the temperature equalizing plate, and between the substrate and the temperature equalizing plate.

4. The temperature-uniform liquid cooling plate according to claim 3, characterized in that: The substrate comprises: A first area, in which the upper surface of the substrate is flush with the upper surface of the copper tube, the first area is used to connect the chip, and the temperature plate is located in the first area.

5. The temperature-uniform liquid cooling plate according to claim 4, characterized in that: The substrate further comprises: A second area, within the second area, the upper surface of the substrate is higher than the upper surface of the copper tube, and the thermal conductive silicone grease layer fills the strip-shaped groove.

6. The temperature-uniform liquid cold plate according to claim 1, characterized in that: A plurality of pads are formed on the lower surface of the substrate, and a plurality of ejector pins are arranged on the pads to support the chip. The pads are used to connect the chip through solder.

7. The temperature-uniform liquid cooling plate according to claim 6, characterized in that: An annular groove is formed on the edge of the substrate adjacent to the pad, and the temperature-averaging liquid cooling plate further includes: A first solder resist ink layer, wherein the first solder resist ink layer is laid in the annular groove, and an upper surface of the first solder resist ink layer is not higher than an upper surface of the substrate; The second solder resist ink layer is arranged around the edge of the first solder resist ink layer to form a closed pattern, and the upper surface of the second solder resist ink layer is not higher than the end of the ejector pin away from the substrate.

8. The temperature-uniform liquid cooling plate according to claim 1, characterized in that: The substrate is a copper plate, an aluminum plate or a stainless steel plate.

9. The temperature-uniform liquid cooling plate according to claim 1, characterized in that: The pipe joint is formed as a pagoda joint, and the temperature-averaging liquid cooling plate further comprises: Two clamps are sleeved on one end of the liquid inlet hose and the liquid outlet hose adjacent to the connection block.

10. The temperature-uniform liquid cooling plate according to claim 1, characterized in that: The temperature-averaging liquid cooling plate further comprises: Two adapters, the two adapters are connected to the liquid inlet hose and the end of the liquid outlet hose away from the connecting block in a one-to-one correspondence, and the two adapters are used to detachably connect the liquid inlet end and the liquid outlet end of the cooling liquid providing device.

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