Preparation method of whole frame board and packaging structure

Abstract

The invention discloses a manufacturing method of a whole frame board and a packaging structure, the whole frame board comprises a connecting rib structure, a plurality of frame units and a surrounding frame structure, and the connecting rib structure comprises a plurality of first connecting ribs and a plurality of second connecting ribs; the enclosure frame structure is arranged on the outer side of the connecting rib structure; the enclosure frame structure is provided with cutting marks corresponding to the first connecting ribs and the second connecting ribs, the cutting marks comprise a first mark groove and a second mark groove, and the first mark groove is used for determining a first cutting track for executing first cutting operation by cutting equipment; the second identification groove is used for the cutting equipment to determine a second cutting track for executing second cutting operation on the cutting channel formed after the first cutting operation is completed; the second identification groove is arranged to be a strip-shaped groove extending in the width direction of the corresponding first connecting rib or the second connecting rib, and the two ends of the second identification groove both exceed the first identification groove in the width direction. According to the invention, the extended copper material can be prevented from covering the remaining area of the second identification groove when the cutter cuts the copper material.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a method for preparing a frame whole board and a packaging structure. Background Art

[0002] The incoming frame board (usually also called lead frame) includes multiple frame units arranged in an array. After the chips and leads are connected to each frame unit and the frame board is molded, the molded frame board can be cut to separate multiple package structures. For example, for QFN package (Quad Flat No-leads Package, square flat leadless package) required lead frame, it is necessary to first use a half-cut process to remove part of the material on the cutting path (including copper material and molding material) of the entire frame board after molding, and then use a full-cut process to cut off the remaining material. In order to ensure that the tool does not deviate during the half-cut and full-cut processes, the entire board is also provided with a half-cut mark and a full-cut mark on the cutting path, wherein the half-cut mark is used to assist the cutting equipment in locating the half-cut cutting track, and the full-cut mark is used to assist the cutting equipment in locating the full-cut cutting track. Then, due to the good ductility of copper material, the copper material cut in the half-cut process will extend and cover the full-cut mark, resulting in the inability of the cutting equipment to recognize and cause deviation during the full-cut process, which in turn causes the pins of the frame unit after cutting to be unable to be separated and cause a short-circuit failure of the package structure. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a frame whole plate, which can prevent the second cutting mark from being covered by the extended copper material, thereby preventing the second cutting operation from being deflected.

[0004] The invention also provides a method for preparing the packaging structure.

[0005] The frame plate according to the first embodiment of the present invention comprises: A connecting rib structure, comprising a plurality of first connecting ribs and a plurality of second connecting ribs, wherein the first connecting ribs extend along a first direction and are spaced apart along a second direction, the second connecting ribs extend along the second direction and are spaced apart along the first direction, the plurality of first connecting ribs and the plurality of second connecting ribs define a plurality of product areas, and the first direction is perpendicular to the second direction; A plurality of the frame units are respectively arranged in each of the product areas and connected to the first connecting ribs and the second connecting ribs defining the corresponding product areas; A frame structure, arranged around the outer side of the connecting rib structure and connected to the outermost first connecting rib and the second connecting rib; Wherein, the frame structure is provided with cutting marks corresponding to each of the first connecting bars and each of the second connecting bars, and the cutting marks include a first marking groove and a second marking groove, the first marking groove is used for the cutting device to determine a first cutting trajectory, and the first cutting trajectory is a cutting trajectory of the cutting device performing a first cutting operation on the corresponding first connecting bar or the second connecting bar, and the second marking groove is used for the cutting device to determine a second cutting trajectory, and the second cutting trajectory is a cutting trajectory of the cutting device performing a second cutting operation on the cutting path formed after completing the first cutting operation; The second identification groove is configured as a strip groove extending along the width direction of the corresponding first connecting rib or the second connecting rib, and both ends of the second identification groove exceed the first identification groove along the width direction.

[0006] The frame whole plate according to the first embodiment of the present invention has at least the following beneficial effects: It can prevent the extended copper material from covering the retained area of ​​the second identification groove when the tool cuts the copper material, facilitate the cutting device to determine the second cutting trajectory through the image of the retained area of ​​the second identification groove, and avoid the cutting device from being skewed during the second cutting operation, thereby ensuring the cutting quality.

[0007] In other embodiments of the present invention, the first identification groove penetrates the frame structure along the thickness direction of the entire frame plate, and / or the second identification groove penetrates the frame structure along the thickness direction of the entire frame plate.

[0008] In other embodiments of the present invention, the first identification groove is configured as a strip groove extending along the length direction of the corresponding first connecting rib or the second connecting rib, and one end of the first identification groove is connected to the second identification groove.

[0009] In other embodiments of the present invention, the first identification groove is configured as a strip groove extending along the length direction of the corresponding first connecting rib or the second connecting rib, and at least one end of the first identification groove is configured as a semicircular first groove segment, and the center of the first groove segment passes through the center line of the corresponding first connecting rib or the second connecting rib; And / or, at least one end of the second identification groove is configured as a semicircular second groove segment.

[0010] In other embodiments of the present invention, both ends of the second identification groove extend beyond the first identification groove by the same length along the width direction.

[0011] In other embodiments of the present invention, the frame structure is further provided with weakening grooves corresponding to each of the first connecting ribs and / or each of the second connecting ribs.

[0012] In other embodiments of the present invention, the weakened groove is arranged on a side of the cutting mark away from the product area, and the weakened groove passes through the frame structure along the thickness direction of the entire frame plate.

[0013] In other embodiments of the present invention, the weakened groove is configured as a strip groove extending along the length direction of the first connecting rib or the second connecting rib, and the weakened groove is disposed on a side of the cutting mark away from the product area; Wherein, along the length direction, the length of the weakened groove is defined as a first dimension, the minimum distance between the cutting mark corresponding to the same first connecting rib or the second connecting rib and the nearest side of the frame structure is defined as a second dimension, and the ratio of the first dimension to the second dimension is greater than or equal to 0.4; Alternatively, along the length direction, the length of the weakened groove is greater than or equal to 2.5 mm.

[0014] In other embodiments of the present invention, the ratio of the first size to the second size is less than or equal to 0.5; Alternatively, the length of the weakened groove is less than or equal to 3.5 mm.

[0015] In other embodiments of the present invention, the weakened groove is configured as a strip groove extending along the length direction of the corresponding first connecting rib or the second connecting rib, and the weakened groove is arranged on the side of the cutting mark facing the product area, and the end of the weakened groove away from the cutting mark extends to the corresponding first connecting rib or the second connecting rib, and the depth of the weakened groove is less than the thickness of the frame structure.

[0016] In other embodiments of the present invention, along the length direction of the first connecting bar or the second connecting bar, the minimum distance between the end of the weakened groove facing the cutting mark and the nearest pin connected to the first connecting bar or the second connecting bar is defined as a third dimension, and the minimum distance between the end of the weakened groove away from the cutting mark and the nearest pin connected to the first connecting bar or the second connecting bar is defined as a fourth dimension, and the ratio of the third dimension to the fourth dimension is greater than or equal to 2.

[0017] In other embodiments of the present invention, the frame structure is further provided with a first weakening groove and a second weakening groove corresponding to each of the first connecting ribs and / or each of the second connecting ribs, the first weakening groove is provided on the side of the cutting mark away from the product area, the second weakening groove is provided on the side of the cutting mark facing the product area, the first weakening groove penetrates the frame structure along the thickness direction of the entire frame plate, and the depth of the second weakening groove is less than the thickness of the frame structure.

[0018] In other embodiments of the present invention, the frame whole plate further includes a first supporting structure connected to the first connecting rib and / or the second connecting rib; The total thickness of the first supporting structure and the first connecting rib is equal to the total thickness of the surrounding frame structure, and / or the total thickness of the first supporting structure and the second connecting rib is equal to the total thickness of the surrounding frame structure.

[0019] In other embodiments of the present invention, the first supporting structure is disposed at the intersection of the first connecting rib and the second connecting rib.

[0020] In other embodiments of the present invention, the frame unit includes a chip platform and a third connecting rib, the chip platform is used to carry the chip, and the chip platform is connected to the corresponding connecting rib structure through the third connecting rib; Wherein, the frame unit further includes a second supporting structure connected to the third connecting rib, and the total thickness of the second supporting structure and the third connecting rib is equal to the total thickness of the surrounding frame structure.

[0021] A method for preparing a package structure according to a second embodiment of the present invention comprises the following steps: Preparing the frame whole board; Connecting chips and leads on each of the frame units of the frame whole board; Performing a molding operation on the entire frame board connected with the chip and the lead wires to form a molding layer covering the chip and the lead wires; Performing the first cutting operation on the frame whole plate after the molding operation to form cutting lanes; Performing electroplating operation on the frame whole plate after completing the first cutting operation; The second cutting operation is performed on the frame whole plate after the electroplating operation to separate a plurality of packaging structures.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A top view of the entire frame plate in an embodiment of the present invention; Figure 2 for Figure 1 A three-dimensional schematic diagram of a local area of ​​the middle frame whole plate; Figure 3 for Figure 1 A front view of a partial area of ​​the entire middle frame plate; Figure 4for Figure 1 A magnified schematic diagram of the middle A area; Figure 5 for Figure 2 A three-dimensional schematic diagram of a local area after molding; Figure 6 for Figure 5 A three-dimensional schematic diagram of a local area after the first cutting operation is completed; Figure 7 for Figure 6 A magnified schematic diagram of the middle B area; Figure 8 It is a partial schematic diagram of two packaging structures formed after the second cutting operation is completed according to the correct second cutting trajectory; Fig. 9 is a partial schematic diagram of two packaging structures formed after the second cutting operation is completed according to the deflected second cutting track; Fig.10 for Figure 1 The whole middle frame panel shows a front view of the local area including the cutting mark and the weakened groove; Fig.11 It is a cross-sectional view of the entire frame plate, and the cutting plane passes through the weakened groove and cutting mark corresponding to the same connecting reinforcement.

[0024] Reference numerals: Frame whole board 10, mold sealing layer 20; Connecting rib structure 100, product area 101, first connecting rib 110, second connecting rib 120; Frame unit 200, chip platform 210, third connecting rib 220, second supporting structure 230, pin 240; The frame structure 300, the cutting mark 301, the first cutting mark 301a, the second cutting mark 301b, the first marking groove 310, the first groove section 311, the second marking groove 320, the second groove section 321, the first weakened groove 330, and the second weakened groove 340; A first support structure 400; Residual copper layer a. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0029] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0030] Reference Figure 1 , shows a front view of a frame plate 10 in an embodiment of the present invention. As shown in the figure, the frame plate 10 is made of a metal material such as copper, and includes a rib structure 100, a plurality of frame units 200 and a surrounding frame structure 300. In some specific embodiments, the rib structure 100, the plurality of frame units 200 and the surrounding frame structure 300 are connected as an integral structure. For example, the aforementioned structure can be formed by etching the entire copper plate to remove part of the material. It should be noted that the frame plate 10 is also generally referred to as a lead frame.

[0031] The connecting rib structure 100 is formed into a mesh structure, defining a plurality of product areas 101. Specifically, the connecting rib structure 100 includes a plurality of first connecting ribs 110 and a plurality of second connecting ribs 120. The first connecting ribs 110 extend along a first direction, and the plurality of first connecting ribs 110 are spaced apart along a second direction. The second connecting ribs 120 extend along a second direction, and the plurality of second connecting ribs 120 are spaced apart along the first direction. The plurality of first connecting ribs 110 and the plurality of second connecting ribs 120 jointly define a plurality of product areas 101. The first direction is perpendicular to the second direction. For example, the first direction is Figure 1 The up and down directions in the second direction are Figure 1 The left and right direction in .

[0032] A plurality of frame units 200 are located in the corresponding product area 101 and connected to the connecting rib structure 100 . Specifically, the frame units 200 are respectively connected to the first connecting rib 110 and the second connecting rib 120 surrounding and forming the corresponding product area 101 .

[0033] The frame structure 300 is disposed on the outside of the connecting rib structure 100 and is connected to the outermost first connecting rib 110 and the second connecting rib 120 , thereby playing a supporting and reinforcing role.

[0034] Reference Figures 2 to 4 , Figure 2 and Figure 3 The three-dimensional schematic diagram and the front view of a local area of ​​the frame whole plate 10 are respectively shown. Figure 4 A partial view from the side of the frame panel 10 is shown, wherein: Figure 2 , Figure 3 The local area shown includes four frame units 200 arranged in a rectangular array and corresponding first connecting ribs 110 and second connecting ribs 120, and Figure 2 , Figure 3 The back structure of the frame whole board 10 is shown. As shown in the figure, the lead frame 200 includes a chip platform 210 and a pin 240. The chip platform 210 is used to connect the chip. For example, the chip platform 210 is welded to the chip by reflow soldering or the like, and the pin 240 is used to weld to an external device, thereby achieving fixation and electrical connection between the external device and the packaging structure prepared by the frame whole board 10. Figure 2 , Figure 3 In the illustrated embodiment, the pins 240 are directly connected to the corresponding first connecting ribs 110 or the second connecting ribs 120 , and the chip platform 210 is connected to the corresponding first connecting ribs 110 and / or the second connecting ribs 120 through the third connecting ribs 220 .

[0035] like Figure 2As shown, it can be seen that there are multiple through areas in the frame whole board 10, and these through areas make there be gaps between adjacent pins 240, between the pins 240 and the chip platform 210, and between the chip platform 210 except the third connecting rib 220 and the connecting rib structure 100. In addition, as Figure 4 As shown, it can be seen that the thickness of the rib structure 100 is less than the thickness of the chip platform 210 and the pin 240 of the frame unit 200. Specifically, when the frame whole board 10 is placed with the front side facing up, the front side of the rib structure 100 is flush with the front side of the chip platform 210 and the pin 240, and the back side of the rib structure 100 is higher than the back side of the chip platform 210 and the pin 240. It should be noted that in this embodiment, the back side of the chip platform 210 and the pin 240 of each frame unit 200 is part of the back side of the frame whole board 10.

[0036] To facilitate understanding of the present invention, a method for preparing a packaging structure is first introduced in combination with the above structure, which includes the following steps: Step 1. Prepare the aforementioned frame whole board 10, chip and leads; Step 2. Connect the chip on each frame unit 200 of the frame whole board 10. For example, first apply solder paste on the front side of the chip platform 210 of the frame unit 200 through a tinning device, then transfer the chip to the front side of the chip platform 210, and realize the welding between the chip and the chip platform 210 through a reflow soldering process; after the chip welding is completed, connect the lead between the chip and the pin 240.

[0037] Step 3. Perform a molding operation on the frame board 10 connected with the chip to form a molding layer 20 covering the chip. It should be noted that on the front side of the frame board 10, the molding layer 20 completely covers the chip, and on the back side of the frame board 10, the chip platform 210 and the pins 240 are flush with the molding layer 20, so that the back side of the chip platform 210 and the pins 240 can be exposed from the molding layer 20 for welding with external devices. In addition, the molding layer 20 will also fill the concave structure on the back side of the frame board 10. The frame board 10 after molding is as shown in FIG. Figure 5 ( Figure 5 The back structure of the entire frame plate 10 is also shown. It can be seen that the aforementioned through area has been filled with the molding layer 20, and the rib structure 100 has also been covered by the molding layer 20.

[0038] Step 4. Perform a first cutting operation on the frame whole plate 10 after the mold sealing operation to form a cutting path. Specifically, the cutting device performs the first cutting operation from the back of the frame whole plate 10, and the cutting depth is less than the total thickness of the frame whole plate 10. The cutting position corresponds to each first connecting rib 110 and the second connecting rib 120. The frame whole plate 10 after cutting is as follows: Figure 6 , Figure 7As shown, it can be seen that the mold sealing layer 20 above the first connecting ribs 110 and the second connecting ribs 120 has been removed, thereby exposing the first connecting ribs 110 and the second connecting ribs 120, and a portion of the mold sealing layer 20 filled in the through area on the cutting path has also been removed.

[0039] Step 5. Electroplating is performed on the frame plate 10 that has completed the first cutting operation, so as to form an electroplating layer on the surface of the frame plate 10 exposed from the molding layer 20, thereby protecting the copper layer and improving the welding performance.

[0040] Step 6. Perform a second cutting operation on the frame whole plate 10 after the electroplating operation to separate multiple packaging structures. Specifically, the second cutting operation has the same cutting track as the first cutting operation, the cutting depth is greater than the first cutting operation, but the cutting width is less than the first cutting operation. After the cutting is completed, the first connecting rib 110 and the second connecting rib 120 have been completely removed, thereby obtaining multiple separated packaging structures.

[0041] As mentioned above, in the process of preparing the packaging structure using the frame whole board 10 of the present embodiment, it is necessary to perform the first cutting operation and the second cutting operation through the cutting equipment. In order to ensure that the tool of the cutting equipment can cut along the set trajectory, a cutting mark is usually provided on the frame whole board 10. Corresponding to different cutting operations, the cutting mark is specifically divided into a first cutting mark and a second cutting mark, both of which are usually grooves. After the frame whole board 10 is molded, the first cutting mark and the second cutting mark will also be filled with molding materials. The molding material and the surrounding copper layer have obvious differences in color, so it can be recognized by the camera on the cutting equipment. The specific references (such as edge lines, center of circles) on the identified image can assist the controller of the cutting equipment to generate the correct cutting trajectory. Since copper has good ductility, the copper material cut off by the tool will not fall off, but extend to both sides of the tool. Due to the limitation of the shooting range of the camera mechanism, the first cutting mark and the second cutting mark need to be set close to each other. Therefore, when the tool passes through the second cutting mark, the extended copper material will cover the mold material in the second cutting mark, causing the camera mechanism to be unable to obtain a clear image, and then causing the controller to be unable to generate the correct cutting trajectory, causing the second cutting operation to be skewed, resulting in the inability to separate some pins 240 and causing a short circuit in the molded structure. Figure 8 As shown, Figure 8 The following is a partial schematic diagram of two package structures formed after the second cutting operation is completed. The second cutting operation is performed according to the correct cutting trajectory. At this time, the corresponding first connecting rib 110 or second connecting rib 120 has been completely removed, and each pin 240 is separated by the mold sealing layer 20. Fig. 9 As shown, Figure 8It is also a partial schematic diagram of the two packaging structures formed after completing the second cutting operation. The cutting track of the second cutting operation is offset. At this time, the corresponding first connecting rib 110 or the second connecting rib 120 is not completely removed. For example, there is still a residual copper layer a between the two rightmost pins 240, so that the molded structure has the risk of short circuit.

[0042] Based on the above problems, refer to Figure 1 , Fig.10 The frame structure 300 of this embodiment is provided with a cutting mark 301 corresponding to each first connecting rib 110 and each second connecting rib 120. The cutting mark includes a first marking groove 310 and a second marking groove 320 ( Fig.10 The dotted lines roughly distinguish the range of the first identification groove 310 and the second identification groove 320), the first identification groove 310 is used for the cutting device to determine the first cutting trajectory, which is the cutting trajectory of the cutting device performing the first cutting operation on the corresponding first connecting rib 110 or the second connecting rib 120, and the second identification groove 320 is used for the cutting device to determine the second cutting trajectory, which is the cutting trajectory of the cutting device performing the second cutting operation on the cutting path formed after the first cutting operation is completed. The identification function of the first identification groove 310 and the second identification groove 320 can be understood with reference to the above content, that is, the camera mechanism of the cutting device recognizes the images of the first identification groove 310 and the second identification groove 320 by the color difference between the molding material filled in the first identification groove 310 and the second identification groove 320 and the surrounding copper material, and generates a cutting trajectory based on the reference on the image. Exemplarily, Fig.10 Two cutting marks 301 and a first connecting rib 110 and a second connecting rib 120 are shown. For easy distinction, the two cutting marks 301 are named the first cutting mark 301a and the second cutting mark 301b, respectively. The first cutting mark 301a is used for the cutting device to determine the first cutting trajectory and the second cutting trajectory of the first connecting rib 110, and the second cutting mark 301b is used for the cutting device to determine the first cutting trajectory and the second cutting trajectory of the second connecting rib 120.

[0043] In this embodiment, the second identification groove 320 is configured as a strip groove extending along the width direction of the corresponding first connecting rib 110 or the second connecting rib 120. Specifically, when a second identification groove 320 is used to identify the second cutting trajectory of the first connecting rib 110, it will extend along the width direction of the first connecting rib 110. When a second identification groove 320 is used to identify the second cutting trajectory of the second connecting rib 120, it will extend along the width direction of the second connecting rib 120. Exemplarily, the second identification groove 320 of the first cutting mark 301a extends along the width direction of the first connecting rib 110 (for example, Fig.10The second marking groove 320 of the second cutting mark 301b extends along the width direction of the second connecting rib 120 (for example Fig.10 In addition, both ends of the second identification groove 320 of the present embodiment extend beyond the first identification groove 310 along the aforementioned width direction, so that when the tool performs the first cutting operation with the first cutting trajectory determined by the first identification groove 310, the middle area of ​​the second identification groove 320 will be destroyed, but its two ends will remain, so that it can be recognized by the camera mechanism. Exemplarily, the total length of the second identification groove 320 is greater than the cutting width of the tool when performing the first cutting operation.

[0044] Based on the above settings, the tool can pass through the second identification groove 320 when performing the first cutting operation. Since the second identification groove 320 is filled with molding material, the tool is actually mainly or entirely cutting the molding material when passing through the second identification groove 320. Compared with copper material, the molding material will not extend and will separate as the tool rotates after removal. Therefore, it will not cover the retention area of ​​the second identification groove 320, so that the controller of the cutting equipment can determine the second cutting trajectory through the image of the retention area of ​​the second identification groove 320.

[0045] It should be noted that this embodiment does not limit the shape of the first identification groove 310, which can be a strip groove similar to the second identification groove 320, or a circular groove; in addition, the first identification groove 310 can be connected to the second identification groove 320, or it can be an independent groove from the second identification groove 320.

[0046] On the basis of the foregoing embodiments, in some embodiments of the present invention, the first identification groove 310 is configured as a strip groove extending along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120. Specifically, when a first identification groove 310 is used to identify the first cutting trajectory of the first connecting rib 110, it will extend along the length direction of the first connecting rib 110. When a first identification groove 310 is used to identify the first cutting trajectory of the second connecting rib 120, it will extend along the length direction of the second connecting rib 120. Exemplarily, the first identification groove 310 of the first cutting mark 301a extends along the length direction of the first connecting rib 110 (for example, Fig.10 The first marking groove 310 of the second cutting mark 301b extends along the length direction of the second connecting rib 120 (eg Fig.10The tool will pass through the first identification groove 310 when performing the first cutting operation. The first identification groove 310 is filled with a molding material. The molding material is easier to cut than copper material, so the wear of the tool can be reduced. In this embodiment, the first identification groove 310 is set as a strip groove. On the basis of a certain cutting length of the first cutting operation, the length of the tool cutting the molding material can be increased, and the length of the tool cutting the copper material can be reduced, which helps to reduce tool wear, and further can reduce the time for adjusting the tool height and replacing the tool due to tool wear, thereby improving cutting efficiency.

[0047] When the first identification groove 310 is set as a strip groove, refer to Fig.10 , at least one end of the first identification groove 310 is set as a semicircular first groove section 311, and the center of the first groove section 311 passes through the center line of the corresponding first connecting rib 110 or second connecting rib 120. In this embodiment, the controller can use the center of the first groove section 311 as a reference to determine the first cutting trajectory, for example, so that the first cutting trajectory passes through the center of the first groove section 311. Exemplarily, one end of the first identification groove 310 away from the second identification groove 320 is set as a semicircular first groove section 311. For the first identification groove 310 of the first cutting mark 301a, the first groove section 311 at its end passes through the center line of the first connecting rib 110, and for the first identification groove 310 of the second cutting mark 301b, the first groove section 311 at its end passes through the center line of the second connecting rib 120.

[0048] In other embodiments, the controller may also determine the first cutting trajectory based on the two side edges of the first slot segment 311 as a reference, for example, making the first cutting trajectory parallel to the side edges and equidistant from the two side edges.

[0049] In other embodiments, the first identification groove 310 may also be set as a circular groove, and the controller may determine the first cutting trajectory using the center of the first identification groove 310 as a reference.

[0050] When the first identification groove 310 is set as a strip groove, refer to Fig.10 One end of the first identification groove 310 is connected to the second identification groove 320, so that the first identification groove 310 and the second identification groove 320 together form a roughly T-shaped groove. In this way, when the tool passes through the cutting mark 301, it is mainly or entirely cutting the molding material, which helps to further reduce tool wear.

[0051] On the basis of the above-mentioned embodiments, in some embodiments of the present invention, at least one end of the second identification groove 320 is set as a semicircular second groove section 321, and the second groove section 321 is set outside the cutting path formed by the first cutting operation, so that it can be retained after the first cutting operation is completed. In this embodiment, the controller can use the center of the second groove section 321 as a reference to determine the second cutting trajectory. Exemplarily, both ends of the second identification groove 320 are set as semicircular second groove sections 321, and the controller can determine the second cutting trajectory based on the center of the second groove sections 321 at both ends, for example, so that the second cutting trajectory passes through the midpoint of the line connecting the centers of the second groove sections 321 at both ends.

[0052] Based on the foregoing embodiments, in some embodiments of the present invention, both ends of the second identification groove 320 extend beyond the first identification groove 310 by an equal length in the width direction. Exemplarily, the second identification groove 320 is a symmetrical structure with the center line of the first identification groove 310 as the axis of symmetry, thereby facilitating the controller to determine the second cutting trajectory based on the two ends of the second identification groove 320.

[0053] Based on the foregoing embodiments, in some embodiments of the present invention, reference is made to Fig.11 , the first identification groove 310 penetrates the frame structure 300 along the thickness direction of the frame whole plate 10, and in other embodiments, the second identification groove 320 penetrates the frame structure 300 along the thickness direction of the frame whole plate 10. As mentioned above, on the one hand, the first cutting operation and the second cutting operation are both performed from the back side of the frame whole plate 10, so the first identification groove 310 and the second identification groove 320 must at least form an opening on the back side of the frame whole plate 10, so that the camera mechanism can distinguish the cutting mark 301 from the surrounding copper layer when shooting the back side of the frame whole plate 10; on the other hand, the chip located on the front side of the frame whole plate 10 needs to be covered by the molding layer 20, and the back side of the pins 240 and the chip platform 210 needs to be exposed from the molding layer 20, so when performing the molding operation, the back side of the frame whole plate 10 needs to be attached to the lower mold to prevent the molding material from entering, that is, the molding material cannot directly enter the first identification groove 310 and the second identification groove 320 from the back side of the frame whole plate 10. Based on this, this embodiment sets the first identification groove 310 and / or the second identification groove 320 as a through groove, which can facilitate the molding material to flow into the first identification groove 310 and the second identification groove 320 from the front side of the frame whole board 10 and be exposed on the back side of the frame whole board 10.

[0054] In addition, by setting the first identification groove 310 and / or the second identification groove 320 as a through groove, the first identification groove 310 and / or the second identification groove 320 can be completely filled with molding material after molding. When the tool passes through the first identification groove 310 and / or the second identification groove 320, it only needs to cut the molding material and will not cut the copper material, which can further reduce the wear of the tool.

[0055] On the basis of the above-mentioned embodiments, in some embodiments of the present invention, the frame structure 300 is further provided with weakened grooves corresponding to each first connecting rib 110 and / or each second connecting rib 120. It should be noted that the weakened grooves corresponding to the first connecting rib 110 or the second connecting rib 120 here refer to the weakened grooves being provided on the cutting track of the first connecting rib 110 or the second connecting rib 120, that is, the tool will pass through the weakened grooves when performing the cutting operation of the corresponding first connecting rib 110 or the second connecting rib 120. After the frame structure 300 is molded, the weakened grooves will be filled with molded material. As mentioned above, the wear of the tool when cutting the molded material is less than the wear of the tool when cutting the copper material. When the cutting length is constant, the longer the cutting distance of the molded material is, the shorter the cutting distance of the copper material is. In this embodiment, by providing the weakened grooves on the frame structure 300, the wear of the tool can be further reduced, and at the same time, the connection between the frame unit 200 and the connecting rib structure 100 will not be affected.

[0056] When the frame structure 300 is provided with a weakened groove, in some embodiments of the present invention, Fig.10 The weakening groove is arranged on the side of the cutting mark 301 away from the product area 101, and the weakening groove penetrates the frame structure 300 along the thickness direction of the frame whole plate 10. For the convenience of description, such a weakening groove is named as the first weakening groove 330. For example, Fig.10 A first weakened groove 330 is provided corresponding to the first connecting rib 110 , and the first weakened groove 330 is provided at the lower side of the first connecting rib 110 .

[0057] When the frame structure 300 is provided with the first weakened groove 330, in some embodiments of the present invention, referring to Fig.11 The first weakened groove 330 penetrates the frame structure 300 along the thickness direction of the frame whole plate 10. As mentioned above, this embodiment enables the tool to only cut the mold sealing material and not the copper material when passing through the first weakened groove 330, thereby helping to reduce tool wear. It should be noted that since the first weakened groove 330 is set in the area where the frame structure 300 is not connected to the rib structure 100, the first weakened groove 330 that is set through will not damage the integrity of the rib structure 100.

[0058] When the frame structure 300 is provided with the first weakened groove 330, in some embodiments of the present invention, referring to Fig.10 The first weakened groove 330 is configured as a strip groove extending along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120. For example, the first weakened groove 330 extends along the length direction of the first connecting rib 110 (for example Fig.10 The vertical direction of the

[0059] Along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120, the length of the first weakened groove 330 is defined as the first dimension L1, corresponding to the cutting mark 301 of the same first connecting rib 110 or the second connecting rib 120 and the nearest side of the frame structure 300 ( Fig.10 The side closest to the first cutting mark 301a is indicated by the straight line at the bottom. Fig.10 The distance between the nearest side edge and the first cutting mark 301a is only for illustration and does not represent the actual distance) is the second dimension L2, and the ratio of the first dimension L1 to the second dimension L2 is greater than or equal to 0.4. By limiting the above relationship, it can be ensured that the first weakened groove 330 has a sufficient length, which is beneficial to reduce tool wear.

[0060] It should be noted that the minimum distance between the cutting mark 301 and the nearest side of the frame structure 300 is calculated from the nearest end of the cutting mark 301 toward the side. Fig.10 For example, the second identification groove 320 is closer to the nearest side edge of the frame structure 300 than the first identification groove 310 , and the minimum distance between the lower edge of the second identification groove 320 and the nearest side edge is calculated.

[0061] In some specific embodiments, the ratio of the first size to the second size is less than or equal to 0.5. By limiting the above relationship, it is possible to avoid the first weakened groove 330 being too long to affect the strength of the frame structure 300 .

[0062] In other embodiments, along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120, the length of the first weakened groove 330 is defined as a first dimension L1, and the first dimension L1 is greater than or equal to 2.5 mm. By limiting the above relationship, it can be ensured that the first weakened groove 330 has a sufficient length, which is beneficial to reducing tool wear.

[0063] In some specific embodiments, the first dimension L1 is less than or equal to 3.5 mm. By limiting the above relationship, it is possible to avoid the first weakened groove 330 being too long to affect the strength of the frame structure 300 .

[0064] When the frame structure 300 is provided with a weakened groove, in some embodiments of the present invention, Fig.10 The weakened groove is arranged on the side of the cutting mark 301 facing the product area 101. For the convenience of description, such a weakened groove is named as a second weakened groove 340. For example, Fig.10 A second weakened groove 340 is provided corresponding to the first connecting rib 110 , and the second weakened groove 340 is provided between the first connecting rib 110 and the cutting mark 301 .

[0065] In this embodiment, the second weakened groove 340 is configured as a strip groove extending along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120, and the end of the second weakened groove 340 away from the cutting mark 301 extends to the corresponding first connecting rib 110 or the second connecting rib 120. For example, Fig.10 The second weakened groove 340 in the embodiment is a strip groove corresponding to the first connecting rib 110, and the second weakened groove 340 extends from the upper end of the cutting mark 301 to the lower end of the first connecting rib 110 (it can also be considered as the lower end of the intersection of the first connecting rib 110 and the second connecting rib 120). In addition, the difference between the second weakened groove 340 in this embodiment and the first weakened groove 330 in the aforementioned embodiment is that: the first weakened groove 330 runs through the frame structure 300, and the depth of the second weakened groove 340 is less than the thickness of the frame structure 300, so that the corresponding first connecting rib 110 or the second connecting rib 120 can be connected to the frame structure 300 through the copper material at the second weakened groove 340, that is, this embodiment can not only play the effect of reducing tool wear, but also ensure the connection strength between the corresponding first connecting rib 110 or the second connecting rib 120 and the frame structure 300.

[0066] When the frame structure 300 is provided with the second weakened groove 340, in some embodiments of the present invention, Fig.10 , along the length direction of the corresponding first connecting rib 110 or the second connecting rib 120, the minimum distance between the end of the second weakened groove 340 facing the cutting mark 301 and the nearest pin 240 connected to the corresponding first connecting rib 110 or the second connecting rib 120 is defined as the third dimension L3, the minimum distance between the end of the second weakened groove 340 away from the cutting mark 301 (that is, the end extending to the corresponding first connecting rib 110 or the second connecting rib 120) and the nearest pin 240 connected to the corresponding first connecting rib 110 or the second connecting rib 120 is defined as the fourth dimension L4, and the ratio of the third dimension L3 to the fourth dimension L4 is greater than or equal to 2. By limiting the above relationship, it can be ensured that the second weakened groove 340 has a sufficient length, which is beneficial to reducing tool wear.

[0067] by Fig.10 Taking the second weakened groove 340 corresponding to the first connecting rib 110 as an example, the first connecting rib 110 is connected to a plurality of pins 240 spaced apart in the up-and-down directions, and the second weakened groove 340 is located below the first connecting rib 110. The pin 240 located at the bottom is the pin 240 closest to the second weakened groove 340. On this basis, the third dimension L3 refers to the minimum distance between the lower end of the second weakened groove 340 and the bottom pin 240, and the fourth dimension L4 refers to the minimum distance between the upper end of the second weakened groove 340 and the bottom pin 240.

[0068] In other embodiments, the frame structure 300 is provided with a first weakening groove 330 and a second weakening groove 340 corresponding to each first connecting rib 110 and / or each second connecting rib 120. The first weakening groove 330 is provided on the side of the cutting mark 301 away from the product area 101, and the second weakening groove 340 is provided on the side of the cutting mark 301 facing the product area 101. The first weakening groove 330 penetrates the frame structure 300 along the thickness direction of the frame whole plate 10, and the depth of the second weakening groove 340 is less than the thickness of the frame structure 300. The first weakening groove 330 and the second weakening groove 340 of this embodiment can be understood with reference to the aforementioned embodiments.

[0069] Based on the foregoing embodiments, in some embodiments of the present invention, reference is made to Figure 2 , Fig.10 The frame whole board 10 further includes a first support structure 400 connected to the first connecting rib 110 and / or the second connecting rib 120, the total thickness of the first support structure 400 and the first connecting rib 110 is equal to the total thickness of the surrounding frame structure 300, and / or, the total thickness of the first support structure 400 and the second connecting rib 120 is equal to the total thickness of the surrounding frame structure 300. As mentioned above, the thickness of the connecting rib structure 100 is less than the thickness of the chip platform 210 and the pin 240, and the front of the connecting rib structure 100 is flush with the front of the chip platform 210 and the front of the pin 240. When the frame whole board 10 is placed with the front side facing up and the back side facing down for the tinning device to apply solder paste, the back of the connecting rib structure 100 will not be able to contact the support surface and will be in a suspended state. The tinning device includes a tinning head and a supporting device. When the tinning device performs a tinning operation on the chip platform 210 of a frame unit 200, the supporting device needs to be pressed on the first connecting rib 110 and / or the second connecting rib 120 connected to the frame unit 200. Taking the first connecting rib 110 as an example, since it is in a suspended state, it will produce a downward concave deformation at the compressed position after being pressurized, thereby causing the frame unit 200 connected to the compressed position to warp up. In the subsequent molding process, the back side of the warped and deformed frame unit 200 cannot maintain a good fit with the lower mold, and the molding material will enter the gap between the two, thereby covering the welding surface on the back side of the frame unit 200 (such as the back side of the chip platform 210 and the pin 240), affecting the electrical connection performance between the packaging structure and external devices. By disposing the first supporting structure 400 on the first connecting rib 110 and / or the second connecting rib 120, the present embodiment can support the first connecting rib 110 and / or the second connecting rib 120, thereby preventing the first connecting rib 110 and / or the second connecting rib 120 from being compressed and deformed during the tinning operation, thereby avoiding the problem of the molding material covering the welding surface of the frame unit 200 due to the deformation of the frame unit 200.

[0070] It should be noted that the first supporting structure 400 can be set according to the pressure-bearing position of the first connecting rib 110 and / or the second connecting rib 120, so as to directly support the supporting device of the tinning device. Exemplarily, the first supporting structure 400 is set at the intersection of the first connecting rib 110 and the second connecting rib 120.

[0071] In other embodiments, referring to Figure 2 , Figure 3 , Fig.10 The frame unit 200 includes a chip platform 210 and a third connecting rib 220. The chip platform 210 is used to carry the chip. The chip platform 210 is connected to the corresponding connecting rib structure 100 through the third connecting rib 220. Exemplarily, the chip platform 210 is only connected to the corresponding first connecting rib 110 and / or second connecting rib 120 through the third connecting rib 220. When the first connecting rib 110 and the second connecting rib 120 are removed by a cutting operation, the chip platform 210 and the pin 240 will not be connected through the connecting rib.

[0072] In this embodiment, the frame unit 200 also includes a second support structure 230 connected to the third connecting rib 220. The total thickness of the second support structure 230 and the third connecting rib 220 is equal to the total thickness of the frame structure 300. The second support structure 230 can play the same supporting function as the first support structure 400. In addition, unlike the first support structure 400, the first support structure 400 will be removed during the cutting operation, while the second support structure 230 can be retained as part of the packaging structure, and the second support structure 230 of this embodiment can be exposed from the molding layer 20, thereby increasing the welding position between the packaging structure and external devices.

[0073] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. The whole frame is characterized by: include: A connecting rib structure, comprising a plurality of first connecting ribs and a plurality of second connecting ribs, wherein the first connecting ribs extend along a first direction and are spaced apart along a second direction, the second connecting ribs extend along the second direction and are spaced apart along the first direction, the plurality of first connecting ribs and the plurality of second connecting ribs define a plurality of product areas, and the first direction is perpendicular to the second direction; A plurality of the frame units are respectively arranged in each of the product areas and connected to the first connecting ribs and the second connecting ribs defining the corresponding product areas; A frame structure, arranged around the outer side of the connecting rib structure and connected to the outermost first connecting rib and the second connecting rib; Wherein, the frame structure is provided with cutting marks corresponding to each of the first connecting bars and each of the second connecting bars, and the cutting marks include a first marking groove and a second marking groove, the first marking groove is used for the cutting device to determine a first cutting trajectory, and the first cutting trajectory is a cutting trajectory of the cutting device performing a first cutting operation on the corresponding first connecting bar or the second connecting bar, and the second marking groove is used for the cutting device to determine a second cutting trajectory, and the second cutting trajectory is a cutting trajectory of the cutting device performing a second cutting operation on the cutting path formed after completing the first cutting operation; The second identification groove is configured as a strip groove extending along the width direction of the corresponding first connecting rib or the second connecting rib, and both ends of the second identification groove exceed the first identification groove along the width direction.

2. The frame whole plate according to claim 1, characterized in that: The first identification groove penetrates the surrounding frame structure along the thickness direction of the entire frame plate, and / or the second identification groove penetrates the surrounding frame structure along the thickness direction of the entire frame plate.

3. The frame whole plate according to claim 1, characterized in that: The first identification groove is configured as a strip groove extending along the length direction of the first connecting rib or the second connecting rib, and one end of the first identification groove is connected to the second identification groove.

4. The frame whole plate according to claim 1, characterized in that: The first identification groove is configured as a strip groove extending along the length direction of the corresponding first connecting rib or the second connecting rib, and at least one end of the first identification groove is configured as a semicircular first groove segment, and the center of the first groove segment passes through the center line of the corresponding first connecting rib or the second connecting rib; And / or, at least one end of the second identification groove is configured as a semicircular second groove segment.

5. The frame whole plate according to claim 1, characterized in that: The lengths of both ends of the second identification groove exceeding the first identification groove along the width direction are equal.

6. The frame whole plate according to claim 1, characterized in that: The frame structure is further provided with weakening grooves corresponding to each of the first connecting ribs and / or each of the second connecting ribs.

7. The frame whole plate according to claim 6, characterized in that: The weakened groove is arranged on a side of the cutting mark away from the product area, and the weakened groove penetrates the surrounding frame structure along the thickness direction of the entire frame plate.

8. The frame whole plate according to claim 6, characterized in that: The weakened groove is configured as a strip groove extending along the length direction of the first connecting rib or the second connecting rib, and the weakened groove is configured on a side of the cutting mark away from the product area; Wherein, along the length direction, the length of the weakened groove is defined as a first dimension, the minimum distance between the cutting mark corresponding to the same first connecting rib or the second connecting rib and the nearest side of the frame structure is defined as a second dimension, and the ratio of the first dimension to the second dimension is greater than or equal to 0.4; Alternatively, along the length direction, the length of the weakened groove is greater than or equal to 2.5 mm.

9. The frame whole plate according to claim 8, characterized in that: A ratio of the first size to the second size is less than or equal to 0.5; Alternatively, the length of the weakened groove is less than or equal to 3.5 mm.

10. The frame whole plate according to claim 6, characterized in that: The weakened groove is configured as a strip groove extending along the length direction of the corresponding first connecting rib or the second connecting rib, and the weakened groove is configured on the side of the cutting mark facing the product area, and the end of the weakened groove away from the cutting mark extends to the corresponding first connecting rib or the second connecting rib, and the depth of the weakened groove is less than the thickness of the frame structure.

11. The frame whole plate according to claim 10, characterized in that: Along the length direction of the first connecting bar or the second connecting bar, the minimum distance between the end of the weakened groove facing the cutting mark and the nearest pin connected to the first connecting bar or the second connecting bar is defined as a third dimension, and the minimum distance between the end of the weakened groove away from the cutting mark and the nearest pin connected to the first connecting bar or the second connecting bar is defined as a fourth dimension, and the ratio of the third dimension to the fourth dimension is greater than or equal to 2.

12. The frame whole plate according to claim 1, characterized in that: The frame structure is further provided with a first weakening groove and a second weakening groove corresponding to each of the first connecting ribs and / or each of the second connecting ribs. The first weakening groove is provided on the side of the cutting mark away from the product area, and the second weakening groove is provided on the side of the cutting mark facing the product area. The first weakening groove penetrates the frame structure along the thickness direction of the entire frame plate, and the depth of the second weakening groove is less than the thickness of the frame structure.

13. The frame whole plate according to claim 1, characterized in that: The frame whole plate also includes a first supporting structure connected to the first connecting rib and / or the second connecting rib; The total thickness of the first supporting structure and the first connecting rib is equal to the total thickness of the surrounding frame structure, and / or the total thickness of the first supporting structure and the second connecting rib is equal to the total thickness of the surrounding frame structure.

14. The frame whole plate according to claim 13, characterized in that: The first supporting structure is arranged at the intersection of the first connecting rib and the second connecting rib.

15. The frame whole plate according to claim 1, characterized in that: The frame unit includes a chip platform and a third connecting rib, the chip platform is used to carry the chip, and the chip platform is connected to the corresponding connecting rib structure through the third connecting rib; Wherein, the frame unit further includes a second supporting structure connected to the third connecting rib, and the total thickness of the second supporting structure and the third connecting rib is equal to the total thickness of the surrounding frame structure.

16. A method for preparing a packaging structure, characterized in that: The following steps are involved: Preparing a frame panel as claimed in any one of claims 1 to 15; Connecting chips and leads on each of the frame units of the frame whole board; Performing a molding operation on the entire frame board connected with the chip and the lead wires to form a molding layer covering the chip and the lead wires; Performing the first cutting operation on the frame whole plate after the molding operation to form cutting lanes; Performing electroplating operation on the frame whole plate after completing the first cutting operation; The second cutting operation is performed on the frame whole plate after the electroplating operation to separate a plurality of packaging structures.

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