Antenna structure and preparation method thereof

Abstract

The invention relates to an antenna structure and a preparation method thereof. The antenna structure comprises a flexible radiation layer; the flexible grounding layer is arranged opposite to the flexible radiation layer; the compressible dielectric layer is located between the flexible radiation layer and the flexible grounding layer, the conductive side of the flexible radiation layer is far away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is far away from the compressible dielectric layer; the SMA connector comprises a base and a first connecting part which are connected with each other, the base is located on the side, away from the compressible dielectric layer, of the flexible grounding layer, and the first connecting part is electrically connected with the flexible radiation layer and the flexible grounding layer. The antenna structure composed of the flexible radiation layer, the grounding layer and the compressible dielectric layer can be freely bent and compressed to deform.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to an antenna structure and a method for preparing the same. Background Art

[0002] As the front end of signal transmission and reception, the antenna is an indispensable component of wireless communication and detection systems. The performance of the antenna plays a decisive role in the overall performance of the communication system. High-performance antennas can not only relax the system requirements but also improve the performance of the entire system. The rapid development and widespread application of wireless communication technology have put forward higher requirements on the technical performance of antennas. Due to the antenna's demand for frequency band bandwidth, the profile height of the antenna must meet certain thickness requirements. However, high-profile antennas are difficult to bend and deform, which is not conducive to storage and surface conformity, increasing the difficulty of using antennas. Summary of the invention

[0003] In response to the above technical problems, the present application provides an antenna structure and a preparation method thereof, which can be freely bent and compressed.

[0004] In order to solve the above technical problems, the present application provides an antenna structure in a first aspect, including:

[0005] Flexible radiation layer;

[0006] A flexible grounding layer, arranged opposite to the flexible radiation layer;

[0007] A compressible dielectric layer is located between the flexible radiation layer and the flexible ground layer, wherein the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible ground layer is away from the compressible dielectric layer;

[0008] The SMA connector comprises a base and a first connecting portion which are connected to each other. The base is located on a side of the flexible grounding layer away from the compressible medium layer. The first connecting portion electrically connects the flexible radiation layer and the flexible grounding layer.

[0009] In one embodiment, the antenna structure further includes at least one second connecting portion, wherein the second connecting portion electrically connects the flexible radiation layer and the flexible ground layer.

[0010] In one embodiment, the first connecting portion and / or the second connecting portion is flexible.

[0011] In one embodiment, the first connection portion and the second connection portion are made of a flexible metal wire and / or a flexible printed circuit board.

[0012] In one embodiment, the first connecting portion and the second connecting portion penetrate the compressible medium layer.

[0013] In one embodiment, the compressible medium layer is made of a porous material.

[0014] In one embodiment, the porosity of the porous material is greater than or equal to 95%.

[0015] In one implementation, the cross-sectional height of the antenna structure is 0.01 to 0.2 times the wavelength.

[0016] In a second aspect, the present application also provides a method for preparing an antenna structure, comprising the following steps:

[0017] Providing a flexible radiation layer, a flexible grounding layer and a compressible dielectric layer;

[0018] Adhere the flexible radiation layer, the compressible dielectric layer and the flexible grounding layer in sequence, wherein the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer;

[0019] The flexible radiation layer and the flexible ground layer are electrically connected via a first connecting portion of an SMA connector;

[0020] A base of an SMA connector is installed on a side of the flexible ground layer away from the compressible dielectric layer;

[0021] The base and the first connecting portion are connected to obtain an antenna structure.

[0022] In one embodiment, before the step of sequentially bonding the flexible radiation layer, the flexible ground layer and the compressible flexible ground layer, the method further includes:

[0023] Coating adhesive on the first film layer of the flexible radiation layer and the second film layer of the flexible ground layer respectively;

[0024] The compressible medium layer is made of a porous material, the adhesive has a dielectric constant less than or equal to 4, and a viscosity of 600 to 1500 Pas.

[0025] The antenna structure and preparation method of the present application include a flexible radiation layer; a flexible grounding layer, which is arranged opposite to the flexible radiation layer; a compressible dielectric layer, which is located between the flexible radiation layer and the flexible grounding layer, the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer; an SMA connector, including a base and a first connecting part connected to each other, the base is located on the side of the flexible grounding layer away from the compressible dielectric layer, and the first connecting part electrically connects the flexible radiation layer and the flexible grounding layer. The present application uses an antenna structure composed of a flexible radiation layer, a grounding layer and a compressible dielectric layer, which can be freely bent and compressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of an antenna structure according to an embodiment of the present application;

[0027] Figure 2 is a schematic structural diagram of an SMA connector according to an embodiment of the present application;

[0028] Figure 3 is a structural schematic diagram of another SMA connector according to an embodiment of the present application;

[0029] Figure 4 It is a flow chart of a method for preparing an antenna structure according to an embodiment of the present application.

[0030] Explanation of the reference numerals: 10 - flexible radiation layer; 20 - flexible grounding layer; 30 - compressible dielectric layer; 40 - SMA connector; 41 - first connecting portion; 411 - metal wire; 412 - flexible coating; 42 - base; 50 - second connecting portion. DETAILED DESCRIPTION

[0031] The following is an explanation of the implementation of the present application by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0032] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may be used and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0033] Although the terms first, second, etc. are used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element.

[0034] Furthermore, as used in this article, the singular forms "one", "an" and "the" are intended to include plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0035] Traditional antennas require a certain profile height to increase the antenna bandwidth, but a larger profile height makes it difficult to bend the antenna and render it inflexible, which increases the difficulty of the antenna in curved surface conformity and large-diameter storage applications. In order to solve the problems of the prior art, an embodiment of the present invention proposes an antenna structure. Figure 1 is a schematic diagram of an antenna structure according to an embodiment of the present application. Figure 1 As shown, the antenna structure of the embodiment of the present application includes a flexible radiation layer 10; a flexible grounding layer 20, which is arranged opposite to the flexible radiation layer 10; a compressible dielectric layer 30, which is located between the flexible radiation layer 10 and the flexible grounding layer 20, the conductive side of the flexible radiation layer 10 is away from the compressible dielectric layer 30, and the conductive side of the flexible grounding layer 20 is away from the compressible dielectric layer 30; an SMA connector 40, including a base 42 and a first connecting portion 41 connected to each other, the base 42 is located on the side of the flexible grounding layer 20 away from the compressible dielectric layer 30, and the first connecting portion 41 electrically connects the flexible radiation layer 10 and the flexible grounding layer 20.

[0036] The antenna structure of the embodiment of the present application is composed of a flexible radiation layer 10, a flexible ground layer 20, a compressible dielectric layer 30 and an SMA connector 40. Among them, the compressible dielectric layer 30 is made of a porous material, such as a polymer aerogel, a sponge, etc. Preferably, the porosity of the porous material used to make the compressible dielectric layer 30 is greater than or equal to 95%. In this way, the antenna structure can achieve a good longitudinal profile telescopic function. The profile height of the compressible dielectric layer is not less than 0.01 times the wavelength. Preferably, the profile height is 0.01 to 0.2 times the wavelength to ensure that the antenna structure has a certain bandwidth and has a low profile characteristic.

[0037] The flexible radiation layer 10 and the flexible grounding layer 20 are both made of a patterned metal-plated film material, such as a copper-clad PI film (Polyimide Film). Preferably, the copper foil thickness in the copper-clad PI film is 9 to 18 μm, and the PI film thickness is 12.5 to 100 μm, and the FPC process or laser cutting process is used for preparation. It should be noted that the FPC (Flexible Printed Circuit) process, the full name of which is the flexible printed circuit board process, is a technology that uses optical imaging pattern transfer and etching process methods to form a conductor circuit pattern on a flexible substrate surface.

[0038] The flexible radiation layer 10 and the flexible grounding layer 20 are bonded on both sides of the compressible dielectric layer 30 by a polymer adhesive. The adhesive includes but is not limited to silicone adhesive, epoxy resin adhesive, polyurethane adhesive and polyvinyl acetate adhesive. Preferably, the dielectric constant of the adhesive does not exceed 4.0, the viscosity is 600-1500Pas, and it is cured at room temperature for 24 hours, or heated for 6-24 hours, and the heating temperature is 60℃-120℃. The viscosity value range is 600-1500Pas. In this way, it can avoid that the adhesive is difficult to flow and expand due to excessive viscosity, and it can also avoid that the adhesive flows into the gaps in the compressible dielectric layer 30 due to too low viscosity, affecting the compression rate of the antenna structure.

[0039] The compressible dielectric layer 30 in the antenna structure is located between the flexible radiation layer 10 and the flexible ground layer 20, the conductive side of the flexible radiation layer 10 is away from the compressible dielectric layer 30, and the conductive side of the flexible ground layer 20 is away from the compressible dielectric layer 30. In other words, the conductive metal layers of the flexible radiation layer 10 and the flexible ground layer 20 are both facing the side away from the compressible dielectric layer 30. The flexible radiation layer 10 and the flexible ground layer 20 are electrically connected through an SMA connector.

[0040] Figure 2 It is a schematic diagram of the structure of an SMA connector according to an embodiment of the present application. Figure 3 FIG. 1 is a schematic diagram of the structure of another SMA connector according to an embodiment of the present application. Figure 2 and Figure 3As shown, the SMA connector 40 includes a base 42 and a first connecting portion 41 that are interconnected. The base 42 is located on the side of the flexible grounding layer 20 away from the compressible dielectric layer 30, and the first connecting portion 41 is electrically connected to the flexible radiating layer 10 and the flexible grounding layer 20. That is to say, the SMA connector 40 electrically interconnects the flexible radiating layer 10 and the flexible grounding layer 20 in the antenna structure to feed the antenna. The SMA connector (SubMiniature version A connector) is a common radio frequency (RF) connector used to connect radio frequency equipment, antennas and cables. It is a standard connector type in the field of satellite television and communications, used to transmit high-frequency signals, and is generally used in a frequency range from DC (direct current) to 18GHz. The traditional SMA has a hard metal rod that can directly interconnect the flexible radiating layer 10 with the flexible grounding layer 20, but the metal rod of the SMA is a hard metal and cannot achieve flexible bending and compression. The SMA connector of this embodiment uses a welding process to interconnect the flexible first connecting portion 41 with the base 42 to form a flexible SMA connector 40.

[0041] like Figure 2 As shown, the material of the first connecting portion 41 in the SMA connector 40 is a flexible metal wire. The flexible metal wire is made of conductive metal materials such as copper, silver, titanium, gold, platinum, aluminum, stainless steel, etc., and its diameter is ≤1mm, showing a certain degree of flexibility. Figure 3 As shown, the material of the first connecting part 41 in the SMA connector 40 is a flexible circuit board, including a metal wire 411 and a flexible coating 412. The flexible circuit board is a highly reliable printed circuit board with excellent flexibility made of polyimide or polyester film as a substrate, and the surface layer and the inner layer of the double-sided and multi-layer circuit board are electrically connected through metallized holes. Preferably, the flexible circuit board is a patterned PI copper-clad board, wherein the copper foil thickness is 9 to 18 μm, and the PI film thickness is 12.5 to 100 μm. It is prepared by FPC technology or laser cutting technology and has the characteristics of good bending resistance. The SMA connector formed in this way is flexible and can be deformed synchronously when the antenna structure is bent or compressed.

[0042] In one embodiment, the antenna structure further includes at least one second connecting portion 50 , and the second connecting portion 50 is electrically connected to the flexible radiation layer 10 and the flexible ground layer 20 .

[0043] The antenna structure of the embodiment of the present application further includes one or more flexible second connection parts 50. The second connection part 50 has the same structural form as the first connection part 41, but has different functions. The second connection part 50 is used to realize the electrical interconnection between the flexible radiation layer 10 and the flexible grounding layer 20, and the first connection part 41 realizes the electrical interconnection between the flexible radiation layer 10 and the flexible grounding layer 20, and is also used to form an SMA connector.

[0044] The material of the second connecting portion 50 is a flexible metal wire and / or a flexible circuit board. The flexible metal wire is made of conductive metal materials such as copper, silver, titanium, gold, platinum, aluminum, stainless steel, etc., with a diameter of ≤1mm and exhibits a certain degree of flexibility. The flexible circuit board is a patterned PI copper-clad board, wherein the copper foil thickness is 9 to 18μm and the PI film thickness is 12.5 to 100μm. Within a certain numerical range, as the number of the second connecting portions 50 increases, the cross-sectional height of the antenna structure can be reduced.

[0045] The first connection part 41 and the second connection part 50 both penetrate the compressible dielectric layer 30 and are respectively welded on the flexible radiation layer 10 and the flexible grounding layer 20 through a soldering process to interconnect the flexible radiation layer 10 and the flexible grounding layer 20, thereby achieving overall flexibility, bendability and compressibility of the antenna structure.

[0046] The flexible antenna structure provided in the embodiment of the present application aims to solve the problem that high-profile antennas are difficult to bend. A porous polymer material is used to reduce the modulus of the dielectric layer, improve the flexibility of the thick dielectric layer, and a flexible interconnection structure is used to achieve flexible interconnection between the antenna layers. Although the assembled antenna is relatively thick, it is both compressible and bendable, and has good softness. The antenna structure of the embodiment of the present application is thin, flexible, easy to conform to the platform, can be stored, and is easy to unfold. It is widely used in the fields of structural integration conformal and spatially deployable antennas.

[0047] The antenna structure of the present application includes: a flexible radiation layer; a flexible grounding layer, which is arranged opposite to the flexible radiation layer; a compressible dielectric layer, which is located between the flexible radiation layer and the flexible grounding layer, the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer; an SMA connector, including a base and a first connecting part connected to each other, the base is located on the side of the flexible grounding layer away from the compressible dielectric layer, and the first connecting part electrically connects the flexible radiation layer and the flexible grounding layer. The present application uses an antenna structure composed of a flexible radiation layer, a grounding layer and a compressible dielectric layer, which can be freely bent and compressed.

[0048] Second embodiment

[0049] Figure 4 FIG. 1 is a flow chart of a method for preparing an antenna structure according to an embodiment of the present application. Figure 4 As shown, the embodiment of the present application also proposes a method for preparing an antenna structure, comprising the following steps:

[0050] S201: Provide a flexible radiation layer, a flexible grounding layer and a compressible dielectric layer.

[0051] Among them, the material of the compressible dielectric layer is a porous material, such as polymer aerogel, sponge, etc. Preferably, the porosity of the porous material used to make the compressible dielectric layer is greater than or equal to 95%. Specifically, the compressible dielectric layer of the required dielectric constant, as well as its thickness and shape are determined according to the design requirements of the antenna structure. The porous material is processed by a laser cutting process to form the required thickness, shape and vias of the compressible dielectric layer. In this way, the antenna structure can achieve good longitudinal profile telescopic function. The profile height of the compressible dielectric layer is not less than 0.01 times the wavelength. Preferably, the profile height is 0.01 to 0.2 times the wavelength to ensure that the antenna structure has a certain bandwidth and has a low profile characteristic.

[0052] The flexible radiation layer and the flexible grounding layer are both made of a patterned metal-plated film material, such as a copper-clad PI film (Polyimide Film). Specifically, the PI copper-clad laminate is used as the raw material, and the required radiation layer and grounding layer are prepared by an FPC process or a laser cutting process. The copper foil thickness of the selected PI copper-clad laminate is any thickness of 9 to 18 μm, and the PI film thickness is any thickness of 12.5 μm to 100 μm.

[0053] S202: bonding the flexible radiation layer, the compressible dielectric layer and the flexible grounding layer in sequence, with the conductive side of the flexible radiation layer away from the compressible dielectric layer, and the conductive side of the flexible grounding layer away from the compressible dielectric layer.

[0054] The flexible radiation layer and the flexible grounding layer are bonded on both sides of the compressible dielectric layer by a polymer adhesive. The compressible dielectric layer in the antenna structure is located between the flexible radiation layer and the flexible grounding layer, the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer.

[0055] In one embodiment, before the step of sequentially bonding the flexible radiation layer, the flexible ground layer, and the compressible flexible ground layer, the method further includes:

[0056] Adhesive is applied to the first film layer of the flexible radiation layer and the second film layer of the flexible ground layer respectively;

[0057] The compressible medium layer is made of porous material, the dielectric constant of the adhesive is less than or equal to 4, and the viscosity is 600-1500 Pas.

[0058] Here, the adhesive includes but is not limited to silicone adhesive, epoxy resin adhesive, polyurethane adhesive and polyvinyl acetate adhesive, etc. After the adhesive is applied, it is cured at room temperature for 24 hours, or heated for 6 to 24 hours, and the heating temperature is 60°C to 120°C.

[0059] S203: electrically connecting the flexible radiation layer and the flexible grounding layer through the first connecting portion of the SMA connector.

[0060] The material of the first connection part can be a flexible metal wire. The flexible metal wire is made of conductive metal materials such as copper, silver, titanium, gold, platinum, aluminum, stainless steel, etc., with a diameter of ≤1mm and exhibiting a certain degree of flexibility. The material of the first connection part can also be a flexible circuit board, a metal wire and a flexible coating.

[0061] S204: Install a base of the SMA connector on a side of the flexible ground layer away from the compressible dielectric layer.

[0062] S205: Connect the base and the first connecting part to obtain an antenna structure.

[0063] Here, a flexible interconnected FPC circuit is prepared by using an FPC or laser cutting process, or a metal wire of a certain diameter is directly selected, and the second connecting part is welded to the base to form a flexible SMA connector.

[0064] Next, at least one second connection part is formed. The flexible radiation layer, the flexible ground layer, the compressible dielectric layer, the second connection part, and the SMA connector are assembled, wherein the PI film surface of the flexible radiation layer and the flexible ground layer is coated with an adhesive and cured for 24 hours, or cured at 60°C to 120°C for 6 to 24 hours. Finally, the second connection part, the SMA connector, the flexible radiation layer, the compressible dielectric layer, and the flexible ground layer are welded to form an antenna structure.

[0065] After testing, the antenna was compressed by more than 50% in the cross-sectional height direction and bent by more than 90° in the horizontal direction.

[0066] The preparation method of the antenna structure provided in the present application uses a binder with a certain viscosity. The viscosity of the binder can change the fluidity of the binder, preventing the binder from flowing into the dielectric layer formed by the porous material, thereby destroying the porous structure, changing the flexibility and dielectric properties of the dielectric layer, and affecting the antenna performance. The viscosity of the binder provided by the present invention is 600-1500pas. If the viscosity is low, it is easy to penetrate into the dielectric layer. If the viscosity is high, it is not conducive to the flow of the binder and affects the uniformity of bonding.

[0067] The method for preparing the antenna structure of the embodiment of the present application comprises providing a flexible radiation layer, a flexible grounding layer and a compressible dielectric layer; sequentially bonding the flexible radiation layer, the compressible dielectric layer and the flexible grounding layer, wherein the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer; electrically connecting the flexible radiation layer and the flexible grounding layer through the first connecting portion of the SMA connector; installing the base of the SMA connector on the side of the flexible grounding layer away from the compressible dielectric layer; and connecting the base and the first connecting portion to obtain the antenna structure. In this way, the antenna structure prepared in the embodiment of the present application can be freely bent and compressed.

[0068] Third embodiment

[0069] Using PI copper clad laminate as raw material and FPC process, the required flexible radiation layer, flexible grounding layer, first connection part and second connection part are prepared. The thickness of PI is 12.5μm and the thickness of copper foil is 9μm. Silicone adhesive is coated on the surface of PI film, and the viscosity of the adhesive is 600pas. According to the design requirements of the antenna structure, PI aerogel is selected as the antenna dielectric layer, and the required shape and vias are prepared by laser cutting process. The first connection part is welded to the SMA base to prepare a flexible SMA connector, and the flexible radiation layer, flexible grounding layer, compressible dielectric layer, second connection part and flexible SMA connector are spliced ​​and assembled, and cured at room temperature for 24 hours. The second connection part and the two ends of the flexible SMA connector are welded to the flexible radiation layer and the flexible grounding layer respectively to prepare the antenna structure. After testing, the compression amount of the antenna structure of this embodiment is 80%, and the bending angle in the horizontal direction is 150°.

[0070] Fourth embodiment

[0071] Using PI copper clad laminate as raw material, the FPC process is adopted to prepare the required flexible radiation layer and flexible grounding layer. The thickness of PI is 100μm and the thickness of copper foil is 18μm. Epoxy adhesive is applied on the surface of PI film, and the bonding viscosity is 1500pas. According to the antenna design requirements, sponge is selected as the compressible dielectric layer, and the required shape and vias are prepared by laser cutting process. Copper wire is used as the first connecting part and the second connecting part, with a diameter of 0.5mm. The first connecting part is welded to the SMA base to prepare a flexible SMA connector, and the flexible radiation layer, flexible grounding layer, compressible dielectric layer, second connecting part and flexible SMA connector are spliced ​​and assembled, and cured at 120℃ for 6 hours. The second connecting part and the two ends of the flexible SMA connector are welded to the flexible radiation layer and the flexible grounding layer respectively to prepare the required antenna structure. After testing, the compression amount of the antenna structure of this embodiment is 50%, and the bending angle in the horizontal direction is 90°.

[0072] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. An antenna structure, characterized in that: include: Flexible radiation layer; A flexible grounding layer, arranged opposite to the flexible radiation layer; A compressible dielectric layer is located between the flexible radiation layer and the flexible ground layer, wherein the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible ground layer is away from the compressible dielectric layer; The SMA connector comprises a base and a first connecting portion which are connected to each other. The base is located on a side of the flexible grounding layer away from the compressible medium layer. The first connecting portion electrically connects the flexible radiation layer and the flexible grounding layer.

2. The antenna structure according to claim 1, characterized in that: The antenna structure further includes at least one second connecting portion, wherein the second connecting portion electrically connects the flexible radiation layer and the flexible ground layer.

3. The antenna structure according to claim 1 or 2, characterized in that: The first connecting portion and / or the second connecting portion are flexible.

4. The antenna structure according to claim 3, characterized in that: The first connection part and the second connection part are made of flexible metal wire and / or flexible circuit board.

5. The antenna structure according to claim 4, characterized in that: The first connecting portion and the second connecting portion penetrate the compressible medium layer.

6. The antenna structure according to claim 1, characterized in that: The compressible medium layer is made of porous material.

7. The antenna structure according to claim 6, characterized in that: The porosity of the porous material is greater than or equal to 95%.

8. The antenna structure according to claim 1, characterized in that: The cross-sectional height of the antenna structure is 0.01 to 0.2 times of the wavelength.

9. A method for preparing an antenna structure, characterized in that: The following steps are involved: Providing a flexible radiation layer, a flexible grounding layer and a compressible dielectric layer; Adhere the flexible radiation layer, the compressible dielectric layer and the flexible grounding layer in sequence, wherein the conductive side of the flexible radiation layer is away from the compressible dielectric layer, and the conductive side of the flexible grounding layer is away from the compressible dielectric layer; The flexible radiation layer and the flexible ground layer are electrically connected via a first connection portion of an SMA connector; A base of an SMA connector is installed on a side of the flexible ground layer away from the compressible dielectric layer; The base and the first connecting portion are connected to obtain an antenna structure.

10. The method according to claim 9, characterized in that Before the step of sequentially bonding the flexible radiation layer, the flexible ground layer and the compressible flexible ground layer, the method further includes: Coating adhesive on the first film layer of the flexible radiation layer and the second film layer of the flexible ground layer respectively; The compressible medium layer is made of a porous material, the adhesive has a dielectric constant less than or equal to 4, and a viscosity of 600 to 1500 Pas.

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