Electronic water pump active heat dissipation structure and method

Abstract

The invention relates to an electronic water pump active heat dissipation structure, and relates to the technical field of heat dissipation, the electronic water pump active heat dissipation structure comprises a motor, the motor is internally provided with a cooling cavity, a rotor is located in the cooling cavity, the electronic water pump active heat dissipation structure further comprises an installation cavity used for installing a circuit board, the cooling cavity communicates with the installation cavity, and the cooling cavity and the installation cavity are both used for being filled with cooling liquid; the circulating mechanism comprises a circulating part and a pipeline, one end of the pipeline is communicated with the cooling cavity and / or the mounting cavity, the other end of the pipeline is communicated with the cooling cavity and / or the mounting cavity, and the circulating part is used for enabling the cooling liquid to circularly flow. The LED lamp has the advantage of being good in heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation, and in particular to an active heat dissipation structure and method for an electronic water pump. Background Art

[0002] The primary heat sources for automotive electronic water pumps are the motor and the electronic water pump control board. Existing brushless water pump motors primarily rely on passive cooling, often with thermally conductive rubber attached to enhance passive cooling efficiency. Existing water pump control boards typically rely on passive heat conduction between the metal plate at the rear of the pump body and the air. Clearly, these passive cooling methods for the motor and electronic water pump control board are inefficient and ineffective, making them ineffective in addressing the problem of rapid temperature rise in the motor and water pump control board. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, one of the purposes of this application is to provide an active heat dissipation structure and method for an electronic water pump, which has the advantage of better heat dissipation effect.

[0004] The above-mentioned purpose of this application is achieved through the following technical solutions:

[0005] An active heat dissipation structure for an electronic water pump includes a motor, wherein a cooling chamber is provided in the motor, a rotor is located in the cooling chamber, and an installation chamber is further provided. The installation chamber is used to install a circuit board, the cooling chamber and the installation chamber are connected, and both the cooling chamber and the installation chamber are used to be filled with coolant. The motor also includes a circulation mechanism, the circulation mechanism includes a circulation member and a pipeline, one end of the pipeline is connected to the cooling chamber and / or the installation chamber, and the other end is connected to the cooling chamber and / or the installation chamber, and the circulation member is used to circulate the coolant.

[0006] In a preferred example, the present application can be further configured as follows: the circulation mechanism also includes a heat sink, which is installed on the pipeline and is used to dissipate heat from the coolant in the pipeline.

[0007] In a preferred example, the present application can be further configured as follows: along the axial direction of the motor, the circulation member is arranged between the cooling cavity and the installation cavity, and the circulation member includes an impeller, and the impeller is driven to rotate by the motor shaft of the motor.

[0008] In a preferred example, the present application can be further configured as follows: the circulating member includes a clutch, and the impeller and the motor shaft are connected via the clutch.

[0009] In a preferred example, the present application can be further configured as follows: the circulation part also includes a casing, the impeller is located in the casing and is rotatably connected to the casing, the inlet of the casing is concentrically arranged with the motor shaft and is connected with the installation cavity, the outlet of the casing is connected with the installation cavity through a pipe, the connection point between the outlet of the casing and the installation cavity is located on one side of the electric control board, and the connection point between the inlet of the casing and the installation cavity is located on the other side of the electric control board.

[0010] In a preferred example, the present application can be further configured as follows: the heat dissipation component includes a heat dissipation box and an auxiliary component, the pipeline is connected to the heat dissipation box, and the auxiliary component is installed on the heat dissipation box for auxiliary heat dissipation.

[0011] In a preferred example, the present application can be further configured as follows: the auxiliary parts include heat dissipation fins and / or cooling fins.

[0012] The present application also discloses an active heat dissipation method for an electronic water pump, comprising the following steps: a temperature measurement step, detecting the temperature of the coolant in the cooling chamber and the installation chamber; if any temperature does not meet the standard, performing a cooling step; in the cooling step, the circulation part is started to circulate the coolant.

[0013] In a preferred example, the present application can be further configured as follows: it also includes the following steps: an active heat dissipation step, which detects the temperature of the circulating coolant, and dissipates the heat of the coolant if it does not meet the standard.

[0014] This application has the following advantages:

[0015] Intelligent start and stop are performed according to the temperature of the motor and the electronic control board, which effectively increases the life of the motor and electronic water pump control board and the operating stability of the electronic automobile water pump system, while avoiding the invalid load of the motor and improving energy utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the cross-sectional structure of this application.

[0017] Figure numerals: 1, motor; 11, cooling chamber; 12, installation chamber; 2, circulation part; 21, impeller; 3, heat sink; 31, heat sink box; 32, auxiliary part. DETAILED DESCRIPTION

[0018] The present application is further described in detail below with reference to the accompanying drawings.

[0019] Reference Figure 1, is an electronic water pump active heat dissipation structure disclosed in this application, including a motor 1, a cooling chamber 11 is provided in the motor 1, the rotor is located in the cooling chamber 11, and a mounting chamber 12 is also provided on the motor 1, the mounting chamber 12 is used to install a circuit board, the cooling chamber 11 and the mounting chamber 12 are connected by a pipeline (not shown in the figure), and the cooling chamber 11 and the mounting chamber 12 are both used to fill coolant, and also includes a circulation mechanism, the circulation mechanism includes a circulation member 2, a heat sink 3 and a pipeline, one end of the pipeline is connected to the cooling chamber 11 and / or the mounting chamber 12, and the other end is connected to the cooling chamber 11 and / or the mounting chamber 12, and the circulation member 2 is used to circulate the coolant. Along the axial direction of the motor 1, the circulation member 2 is arranged between the cooling chamber 11 and the mounting chamber 12, and the circulation member 2 includes an impeller 21, and the impeller 21 is driven to rotate by the motor shaft of the motor 1. The coolant can be a perfluoroalkane (fluorinated liquid) with good chemical inertness and electrical insulation, or other liquids with good chemical inertness and electrical insulation. In other embodiments, other liquids may also be used. In this case, protective treatment can be performed on the components that need protection. For example, the circuit board can be sealed with potting glue.

[0020] Circulator 2 also includes a housing, with impeller 21 located within and rotatably connected to the housing. The housing inlet is concentrically arranged with the motor 1 axis and communicates with mounting cavity 12. The housing outlet communicates with mounting cavity 12 via a pipe. The connection between the housing outlet and mounting cavity 12 is located on one side of the electronic control board, while the connection between the housing inlet and mounting cavity 12 is located on the other side of the electronic control board. In another embodiment, the housing outlet communicates with cooling cavity 11 via a pipe.

[0021] The impeller 21 and the motor 1 shaft are connected via a clutch. In this embodiment, the clutch comprises two magnetic bodies: one mounted on the motor 1 shaft and the other mounted on the impeller 21 or on the shaft rotatably connected to the housing. At least one of the magnetic bodies is an electromagnet. In other embodiments, a ratchet clutch or hydraulic clutch may be employed. If desired, the motor shaft can be extended from the cooling chamber 11 and rotatably connected thereto to achieve improved power transmission.

[0022] The heat sink 3 includes a heat sink box 31 and an auxiliary component 32. The pipeline is connected to the heat sink 31. The auxiliary component 32 is installed on the heat sink 31 for auxiliary heat dissipation. The auxiliary component 32 includes heat dissipation fins and / or semiconductor refrigeration sheets.

[0023] The present application also discloses an active heat dissipation method for an electronic water pump, comprising the following steps: a calibration step, establishing a temperature standard, such as a standard temperature range of the coolant in the heat dissipation box 31, and a standard temperature range of the coolant in the pipeline; a temperature measurement step, detecting the temperature of the coolant in the cooling cavity 11 and the installation cavity 12. If any temperature does not meet the temperature standard, a cooling step is performed. In the cooling step, the circulation component 2 is started to circulate the coolant; an active heat dissipation step, detecting the temperature of the coolant in the circulating state (such as the coolant in the pipeline or the heat dissipation box 31). If it does not meet the corresponding temperature standard, the coolant is dissipated, for example, by auxiliary heat dissipation through semiconductor refrigeration plates.

[0024] This application dynamically adjusts the speed of the circulating impeller based on the temperature changes of the coolant in the cooling chamber 11 and the installation chamber 12 to optimize the heat dissipation efficiency. The algorithm example is as follows:

[0025]

[0026] Ncir is the speed of the circulating impeller, unit: r / min

[0027] Tcool is the current coolant temperature, unit: ℃

[0028] Tmin and Tmax are the safe temperature ranges of the coolant, unit: ℃

[0029] Nmax is the maximum speed of the circulating impeller, unit: r / min

[0030] α is the adjustment coefficient (usually 1-2 to adjust the response sensitivity)

[0031] When the coolant temperature rises, the impeller speed increases, accelerating the coolant circulation and thus improving the heat dissipation efficiency; when the temperature drops to the set range, the impeller speed gradually decreases to reduce energy consumption.

[0032] The circulating impeller is connected to the motor shaft through magnetic coupling, and the power is transmitted by non-rigid contact. Therefore, the impeller speed is affected by water resistance and its speed does not completely match the motor shaft speed. The relationship can be expressed as:

[0033]

[0034] Nmotor is the motor shaft speed, unit: r / min

[0035] k is the magnetic coupling efficiency coefficient (0 <k<1)

[0036] M is the magnetic driving torque, unit: N·m

[0037] Mmax is the magnetic limit driving torque, unit: N·m

[0038] Due to the presence of water resistance, the speed of the circulating impeller will lag behind the motor shaft speed and is not completely synchronized. As the magnetic force increases, the impeller speed gradually approaches the motor shaft speed, but there is still a certain difference due to the influence of water resistance.

[0039] This application adopts a clutch-type magnetic coupling method, which can dynamically adjust the magnetic strength according to the cooling requirements, and then adjust the impeller speed to achieve intelligent heat dissipation control.

[0040] The implementation principle of this embodiment is: the temperature of the motor 1 is monitored, and when the temperature is greater than a preset value, the coolant is actively cooled, thereby achieving the purpose of cooling the motor 1.

[0041] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An active heat dissipation structure for an electronic water pump, characterized in that: The motor (1) comprises a cooling chamber (11) provided therein, wherein a rotor is located in the cooling chamber (11), and further comprises an installation chamber (12), wherein the installation chamber (12) is used to install a circuit board, wherein the cooling chamber (11) and the installation chamber (12) are connected, wherein the cooling chamber (11) and the installation chamber (12) are both used to fill a cooling liquid, and further comprises a circulation mechanism, wherein the circulation mechanism comprises a circulation member (2) and a pipeline, wherein one end of the pipeline is connected to the cooling chamber (11) and / or the installation chamber (12), and the other end of the pipeline is connected to the cooling chamber (11) and / or the installation chamber (12), and wherein the circulation member (2) is used to circulate the cooling liquid.

2. The electronic water pump active heat dissipation structure according to claim 1, characterized in that: The circulation mechanism also includes a heat sink (3), which is installed on the pipeline and is used to dissipate heat from the coolant in the pipeline.

3. The electronic water pump active heat dissipation structure and method according to claim 2, characterized in that: Along the axial direction of the motor (1), the circulation member (2) is arranged between the cooling chamber (11) and the installation chamber (12); the circulation member (2) comprises an impeller (21); and the impeller (21) is driven to rotate by the motor (1) shaft of the motor (1).

4. The active heat dissipation structure of an electronic water pump according to claim 3, characterized in that: The circulation member (2) comprises a clutch, and the impeller (21) and the shaft of the motor (1) are connected via the clutch.

5. The electronic water pump active heat dissipation structure according to claim 4, characterized in that: The circulation member (2) also includes a casing, an impeller (21) is located in the casing and is rotatably connected to the casing, an inlet of the casing is coaxially arranged with the shaft of the motor (1) and is connected to the installation cavity (12), an outlet of the casing is connected to the installation cavity (12) through a pipeline, a connection point between the outlet of the casing and the installation cavity (12) is located on one side of the electric control board, and a connection point between the inlet of the casing and the installation cavity (12) is located on the other side of the electric control board.

6. The electronic water pump active heat dissipation structure according to claim 5, characterized in that: The heat dissipation element (3) comprises a heat dissipation box (31) and an auxiliary element (32); the pipeline is connected to the heat dissipation box (31); and the auxiliary element (32) is installed on the heat dissipation box (31) for auxiliary heat dissipation.

7. The electronic water pump active heat dissipation structure according to claim 6, characterized in that: The auxiliary component (32) includes heat dissipation fins and / or cooling fins.

8. An active heat dissipation method for an electronic water pump, characterized in that: The method comprises the following steps: a temperature measuring step, in which the temperature of the coolant in the cooling chamber (11) and the installation chamber (12) is detected; if any temperature does not meet the standard, a cooling step is performed; in the cooling step, a circulation part (2) is started to circulate the coolant.

9. The method for active heat dissipation of an electronic water pump according to claim 8, characterized in that: It also includes the following steps: an active heat dissipation step, in which the temperature of the circulating coolant is detected, and if it does not meet the standard, the coolant is cooled.

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