Photosensitive component, camera module and manufacturing method thereof

Abstract

The invention discloses a photosensitive component, a camera module and a manufacturing method thereof. The invention relates to a photosensitive component, a camera module and a manufacturing method thereof. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component arranged on the circuit board, and a molding body integrally formed on the circuit board. The molding body is provided with at least one open groove which is formed in the molding body in a concave mode, and the open groove is located on the outer side of the photosensitive chip. In this way, the stress of the molding body acting on the photosensitive chip is reduced by arranging the slot on the molding body, so that the deformation quantity of the photosensitive chip caused by the stress is effectively reduced.

Description

[0001] This application is a divisional application of the Chinese invention patent application with application number 2019107090514 and the invention name “Photosensitive component, camera module and manufacturing method thereof”, which was filed on August 1, 2019. Technical Field

[0002] The present application relates to the field of camera modules, and in particular to photosensitive components, camera modules and methods for manufacturing the same. Background Art

[0003] In order to adapt to the development trend of miniaturization and thinning of electronic equipment, the size of camera modules has gradually decreased. In line with this, the packaging process of camera modules has also gradually evolved from the traditional COB (Chip on Board) process to the molding process.

[0004] Figure 1 The figure shows a schematic diagram of the structure of an existing camera module prepared based on a molding process. Figure 1 As shown, the camera module is prepared by the MOC (Molding on Chip) molding process, which includes a photosensitive component and an optical lens 1P maintained in the photosensitive path of the photosensitive component. The photosensitive component includes a circuit board 2P, a photosensitive chip 3P and a molded body 4P, wherein the molded body 4P is integrally formed on the circuit board 2P to integrally cover at least a portion of the circuit board 2P and at least a portion of the non-photosensitive area of ​​the photosensitive chip 3P. However, the molding packaging process also raises some new technical problems, such as the deformation of the photosensitive chip due to excessive stress, resulting in poor imaging quality.

[0005] Therefore, an improved molding packaging process and a structural solution for a camera module are needed. Summary of the invention

[0006] The main purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, which can effectively reduce the bending amount of the photosensitive chip due to stress to improve the imaging quality of the camera molding.

[0007] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the stress exerted by the molded body on the photosensitive chip is reduced by arranging grooves on the molded body, so as to effectively reduce the deformation of the photosensitive chip due to stress.

[0008] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the groove is recessed in the mold body and the groove is formed on the outside of the photosensitive chip. In this way, the stress transfer chain formed by the mold body and the photosensitive chip is cut off, or the stress transmitted on the stress transfer chain formed by the mold body and the photosensitive chip is reduced.

[0009] Another object of the present application is to provide a camera module and a photosensitive component and a manufacturing method thereof, wherein the groove divides the molded body into a first molded part and a second molded part, so that compared with the existing molding process, the volume of the molded part covering the photosensitive chip is reduced, so that under the same shrinkage rate, the shrinkage of the molded part covering the photosensitive chip is reduced. Therefore, the stress generated by the molded part is also reduced accordingly, so as to reduce the bending amount of the photosensitive chip.

[0010] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the groove arrangement increases the overall exposed surface area of ​​the molded body so that the stress generated by the molded body can be relatively more distributed to the outer surface of the molded body, thereby relatively reducing the stress exerted by the molded body on the photosensitive chip.

[0011] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the groove arrangement increases the overall exposed surface area of ​​the molded body, which is beneficial to improving the heat dissipation performance of the photosensitive component.

[0012] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the groove provides a heat dissipation channel, and the heat generated by the photosensitive component during operation can be dissipated through the heat dissipation channel.

[0013] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein the groove can provide a glue overflow space to accommodate overflowing glue when the optical lens is mounted on the photosensitive component and / or the filter element is mounted on the mold body or the filter element bracket.

[0014] Another object of the present application is to provide a camera module and a photosensitive component and a method for manufacturing the same, wherein, in one embodiment of the present application, a filter element holder is preset on the circuit board and is integrally combined with the first molded part and the second molded part of the molded body after molding, wherein the filter element holder can not only be used to install the filter element, but also prevent the stress generated by the second molded part from being transmitted to the photosensitive chip, and maintain the shape of the first molded part to ensure that the internal stress generated by the first molded part is not sufficient to excessively change the shape of the photosensitive chip.

[0015] Other advantages and features of the present application will become apparent from the following description, and may be achieved by the means and combinations particularly pointed out in the claims.

[0016] To achieve at least one of the above purposes or advantages, the present application provides a photosensitive component, which includes:

[0017] Circuit board;

[0018] A photosensitive chip electrically connected to the circuit board;

[0019] At least one electronic component disposed on the circuit board; and

[0020] A molded body integrally formed on the circuit board, wherein the molded body has at least one groove recessed therein, and the groove is located outside the photosensitive chip.

[0021] In the photosensitive assembly according to the present application, the molded body includes a first molded part and a second molded part divided by the groove, and the first molded part covers at least a part of the circuit board and at least a part of the non-photosensitive area of ​​the photosensitive chip.

[0022] In the photosensitive component according to the present application, the depth of the groove is greater than or equal to 30% of the height of the molded body.

[0023] In the photosensitive assembly according to the present application, the groove is formed through the molded body to expose the corresponding area of ​​the circuit board.

[0024] In the photosensitive component according to the present application, the first molded part and the second molded part are connected by a molded channel.

[0025] In the photosensitive component according to the present application, the at least one groove includes a first groove and a second groove, the first groove and the second groove are symmetrically arranged relative to the center line of the photosensitive chip, wherein the molding channel is formed between the first groove and the second groove during the molding process.

[0026] In the photosensitive component according to the present application, the groove is a closed ring groove surrounding the first molded part to divide the molded body into the first molded part and the second molded part which are independent of each other.

[0027] In the photosensitive component according to the present application, the first molded part and the second molded part are formed by two molding processes.

[0028] In the photosensitive component according to the present application, the photosensitive component further includes a filter element holder disposed in the groove, wherein the filter element holder is configured to install a filter element thereon.

[0029] In the photosensitive component according to the present application, the photosensitive component further includes a filter element holder arranged in the groove, wherein the filter element holder is configured to install the filter element thereon.

[0030] In the photosensitive component according to the present application, the filter element holder has a channel running through it, wherein the filter element holder is preset on the circuit board and is integrally combined with the first molded part and the second molded part of the molded body after the molded body is integrally formed.

[0031] In the photosensitive component according to the present application, the photosensitive component further includes a side wrapping glue that wraps the side of the photosensitive chip.

[0032] In the photosensitive assembly according to the present application, the side encapsulation is used to cover at least a portion of the leads for electrically connecting the photosensitive chip and the circuit board.

[0033] According to another aspect of the present application, the present application also provides a camera module, which includes:

[0034] Optical lenses; and

[0035] The photosensitive component as described above, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

[0036] According to another aspect of the present application, the present application also provides a method for manufacturing a photosensitive component, which comprises the steps of:

[0037] A circuit board is provided, wherein at least one electronic component and at least one photosensitive chip are electrically connected to the circuit board;

[0038] The circuit board is accommodated in a molding space formed by the upper mold and the lower mold of the molding mold when the molding mold is closed, wherein the molding mold includes a protrusion;

[0039] forming a molded body in the molding space; and

[0040] The upper mold and the lower mold of the molding mold are separated to form a groove recessed in the molded body at a position corresponding to the protrusion.

[0041] In the method for manufacturing the photosensitive component according to the present application, the process of forming the molded body includes:

[0042] Placing the circuit board in the lower mold of the molding mold;

[0043] The upper mold and the lower mold of the molding mold are molded together, wherein the upper mold includes a mold body and a first protrusion and a second protrusion extending downwardly from the mold body at intervals, wherein when the upper mold and the lower mold are molded together, the first protrusion of the upper mold is attached to the circuit board, and the second protrusion of the upper mold is attached to the non-photosensitive area of ​​the photosensitive chip, so as to form a second molding space between the first protrusion and the mold body, and to form a first molding space between the second protrusion and the first protrusion, wherein the first protrusion further has a molding channel connecting the first molding space and the second molding space;

[0044] Filling the first molding space and the second molding space with molding material, so that after the molding material is solidified, a first molding part is formed in the first molding space, and a second molding part is formed in the second molding space, and the second molding part and the second molding part are connected through the molding channel; and

[0045] The upper mold and the lower mold are separated to form the groove at a position corresponding to the first protrusion.

[0046] In the method for manufacturing the photosensitive component according to the present application, the process of forming the molded body includes:

[0047] Applying a molding material to the circuit board;

[0048] Placing the circuit board in the lower mold of the molding mold;

[0049] The upper mold and the lower mold of the molding mold are molded together, wherein the upper mold includes a mold body and a first protrusion extending downwardly from the mold body at a distance, wherein when the upper mold and the lower mold are molded together, the first protrusion of the upper mold is attached to the circuit board to form a first molding space between the first protrusion and the mold body, wherein the molding material is located in the first molding space;

[0050] forming a first molded part in the first molding space by a molding process;

[0051] Separating the upper mold and the lower mold;

[0052] Applying a molding material to the circuit board;

[0053] The lower mold of the molding mold is molded together with the second upper mold, wherein the second upper mold includes a second mold body and a second protrusion extending downwardly from the second mold body at a distance, wherein when the second upper mold and the lower mold are molded together, the second protrusion of the second upper mold is attached to the circuit board to form a second molding space between the second protrusion and the second mold body, wherein the molding material is located in the second molding space;

[0054] forming a second molded part in the second molding space by a molding process;

[0055] The upper mold and the lower mold are separated to form the groove recessed in the molded body at a corresponding position of the second protrusion.

[0056] In the method for manufacturing the photosensitive component according to the present application, before forming the molded body, the method further comprises:

[0057] At least one filter element holder is preset on the circuit board, and the filter element holder has a channel running through it, so as to integrally combine the filter element holder with the first molded part and the second molded part of the molded body after the molded body is integrally formed.

[0058] In the method for manufacturing a photosensitive component according to the present application, the circuit board is implemented as a circuit board panel.

[0059] According to another aspect of the present application, the present application also provides a method for manufacturing a camera module, comprising:

[0060] According to the method for manufacturing a photosensitive component as described above, a molded body is formed, wherein the molded body has a groove concavely formed therein, wherein the groove divides the molded body into a first molded portion and a second molded portion; and

[0061] An optical lens is mounted on the second molded portion of the molded body.

[0062] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0063] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0065] Figure 1 The figure shows a schematic structural diagram of an existing camera module prepared based on a molding process.

[0066] Figure 2 The diagram shows a schematic diagram of deformation of a photosensitive chip due to stress in a photosensitive component prepared based on an existing molding process.

[0067] Figure 3 A schematic diagram of a camera module according to an embodiment of the present application is illustrated.

[0068] Figure 4 A schematic diagram of the photosensitive component of the camera module according to an embodiment of the present application is illustrated.

[0069] Figure 5 Another schematic diagram of the photosensitive component according to an embodiment of the present application is illustrated.

[0070] Fig. 6A and Figure 6B A schematic diagram of a modified implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0071] Fig. 7A and Figure 7B A schematic diagram of a modified implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0072] Fig. 8A and Figure 8B A schematic diagram of a modified implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0073] Fig. 9A and Fig. 9B A schematic diagram of a photosensitive component according to another embodiment of the present application is illustrated.

[0074] Fig.10 A schematic diagram illustrating another variant implementation of the photosensitive component according to an embodiment of the present application is shown.

[0075] Fig.11 A schematic diagram illustrating another variant implementation of the photosensitive component according to an embodiment of the present application is shown.

[0076] Fig.12 A schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application is illustrated.

[0077] Fig.13 A schematic diagram of a photosensitive component according to yet another embodiment of the present application is illustrated.

[0078] Fig.14 A schematic diagram of another variant implementation according to the embodiment of the present application is illustrated.

[0079] Fig.15 A schematic diagram of a photosensitive component manufacturing process according to an embodiment of the present application is illustrated.

[0080] Fig.16A and Fig. 16B A schematic diagram of a photosensitive component manufacturing process according to another embodiment of the present application is illustrated.

[0081] Fig.17 The figure illustrates a schematic diagram of a photosensitive component manufacturing process according to another embodiment of the present application. DETAILED DESCRIPTION

[0082] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described here.

[0083] Application Overview

[0084] As mentioned above, although the camera module can be made smaller in size through molding processes such as MOC (Molding on Chip), the molding packaging process also raises some new technical problems.

[0085] Specifically, in the molded camera module, the combination of the circuit board 2P and the molded body 4P and the combination of the molded body 4P and the photosensitive chip 3P are rigid combinations, and the combination strength of the two is relatively high, and they need to be removed by destructive methods. Relatively speaking, the photosensitive chip 3P is combined with the circuit board 2P by glue, which is a flexible combination. In addition, the thermal expansion coefficients of the circuit board 2P, the molded body 4P and the photosensitive chip 3P are different. Those skilled in the art should know that the ambient temperature changes greatly in the molding process (the molding of the molding material requires the temperature to be raised to more than 150 degrees) and the frequency of conversion is high, resulting in different degrees of expansion and contraction of the photosensitive chip 3P, the circuit board 2P and the molded body 4P. In addition, the expansion and contraction speeds of the circuit board 2P, the molded body 4P and the photosensitive chip 3P are also inconsistent. These phenomena result in the minimum shrinkage of the final photosensitive chip 3P.

[0086] Since the connection between the circuit board 2P and the mold body 4P, and the connection between the mold body 4P and the photosensitive chip 3P are rigid connections, stress will be generated between the circuit board 2P and the mold body 4P, and between the photosensitive chip 3P and the mold body 4P. In addition, since the shrinkage degree of the photosensitive chip 3P is the smallest, the stress will be concentrated on the photosensitive chip 3P, causing the photosensitive chip 3P to undergo a large deformation. The deformation effect is as follows: Figure 2 It is worth mentioning that Figure 2 The deformation effect shown is exaggerated, only to show the direction and characteristics of the deformation, and does not represent the specific deformation size. The bent photosensitive chip 3P will have a significant impact on the image quality, which is reflected in the performance of the camera module: the field curvature of the camera module is too large, the center of the image is normal but the edge effect is poor.

[0087] Meanwhile, the imaging assembly formed by the molding process also has defects such as poor heat dissipation performance.

[0088] In view of the above technical problems, the basic concept of the present application is to reduce the stress exerted by the mold body on the photosensitive chip by providing grooves on the mold body, so as to effectively reduce the deformation of the photosensitive chip due to stress.

[0089] Based on this, the present application proposes a photosensitive component, which includes: a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component arranged on the circuit board, and a molded body integrally formed on the circuit board, wherein the molded body has at least one groove formed therein in a concave manner, and the groove is located outside the photosensitive chip. In this way, by providing the groove on the molded body, the stress of the molded body on the photosensitive chip is reduced, so as to effectively reduce the deformation of the photosensitive chip due to the stress.

[0090] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0091] Exemplary camera module

[0092] like Figure 3 - Figure 5 As shown, a camera module according to an embodiment of the present application is described, wherein the camera module includes an optical lens 10 and a photosensitive component 20, and the optical lens 10 is maintained in the photosensitive path of the photosensitive component 20, so that the light collected by the optical lens 10 can be imaged in the photosensitive component 20 along the photosensitive path. It should be noted that Figure 3The camera module shown is a fixed-focus camera module. Of course, those skilled in the art should know that the camera module involved in the present application can also be implemented as a dynamic-focus camera module, that is, the camera module also includes a driving element (for example, a motor) disposed between the optical lens 10 and the photosensitive component 20, so as to carry the optical lens 10 along the photosensitive path through the driving element to change the distance between the optical lens 10 and the photosensitive component 20.

[0093] like Figure 4 As shown, in the embodiment of the present application, the photosensitive assembly 20 includes a circuit board 21, a photosensitive chip 22, at least one electronic component 23 and a molded body 24. The photosensitive chip 22 is electrically connected to the circuit board 21. The at least one electronic component 23 is arranged around the photosensitive chip 22 and is electrically connected to the circuit board 21. The molded body 24 is integrally formed on the circuit board 21 through a molding process to cover at least a portion of the circuit board 21. In particular, in the embodiment of the present application, the molded body 24 is provided with a groove 240 recessed therein, so as to reduce the stress exerted by the molded body 24 on the photosensitive chip 22 through the groove 240, thereby effectively reducing the deformation of the photosensitive chip 22 due to stress.

[0094] Specifically, in an embodiment of the present application, the at least one electronic component 23 can be mounted on the upper surface of the circuit board 21 by surface mounting technology (Surface Mounting Technology). Usually, the at least one electronic component 23 is mounted on the surrounding area of ​​the photosensitive chip 22. Alternatively, the at least one electronic component 23 can also be pre-buried in the circuit board 21 to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the installation process of the at least one electronic component 23 is not limited by the present application. At the same time, in an embodiment of the present application, the type of the at least one electronic component 23 is not limited by the present application, and includes but is not limited to capacitors, inductors, transistors, thyristors, resistors, etc.

[0095] like Figure 4As shown, in the embodiment of the present application, the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized through the lead 25. Specifically, in the embodiment of the present application, each of the leads 25 extends between the photosensitive chip 22 and the circuit board 21 in a curved manner, so as to electrically connect the photosensitive chip 22 to the circuit board 21 through the lead 25, so that the circuit board 21 can power the photosensitive chip 22 based on the lead 25, and the photosensitive chip 22 can transmit the collected signal based on the lead 25. It is worth mentioning that the type of the lead 25 is not limited to the present application. For example, the lead 25 can be a gold wire, a silver wire, or a copper wire. In addition, the lead 25 can be installed between the circuit board 21 and the photosensitive chip 22 through the "gold wire" process to achieve electrical connection between the two.

[0096] Specifically, the "gold wire punching" process is generally divided into two types: "positive gold wire punching" process and "reverse gold wire punching" process. The "positive gold wire punching" process refers to the process of laying out the lead 25, first forming one end of the lead 25 on the conductive end of the circuit board 21, then extending the lead 25 in a curved manner, and finally forming the other end of the lead 25 on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. The "reverse gold wire punching" process refers to the process of laying out the lead 25, first forming one end of the lead 25 on the conductive end of the photosensitive chip 22, then extending the lead 25 in a curved manner, and finally forming the other end of the lead 25 on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the upward protrusion of the lead 25 formed by the "reverse gold wire punching" process is relative to the height of the upward protrusion of the lead 25 formed by the "forward gold wire punching" process. Therefore, preferably, in this specific implementation, the "reverse gold wire punching" process is used to form the lead 25.

[0097] Of course, those skilled in the art should know that in other examples of the present application, the photosensitive chip 22 and the circuit board 21 can be connected in other ways, such as back-connection, which is not limited to the present application.

[0098] like Figure 4As shown, in the embodiment of the present application, the molded body 24 is integrally formed on the circuit board 21 to integrally cover at least a portion of the circuit board 21, at least a portion of the non-photosensitive area of ​​the photosensitive chip 22, and at least a portion of the at least one electronic component 23. In particular, in the embodiment of the present application, the molded body 24 has at least one groove 240 formed concavely therein. From the perspective of the layout position, the groove 240 is located on the outside of the photosensitive chip 22. By setting such a position, the groove 240 can effectively reduce the stress of the molded body 24 acting on the photosensitive chip 22, so as to effectively reduce the deformation amount of the photosensitive chip 22 due to the stress.

[0099] Specifically, since the combination of the circuit board 21 and the mold body 24, and the combination of the mold body 24 and the photosensitive chip 22 are rigid combinations, while the combination of the photosensitive chip 22 and the circuit board 21 is flexible, and the circuit board 21, the mold body 24 and the photosensitive chip 22 have different thermal expansion coefficients, stress will be generated between the circuit board 21 and the mold body 24, and between the photosensitive chip 22 and the mold body 24. Moreover, since the shrinkage degree of the photosensitive chip 22 is the smallest, the stress will act concentratedly on the photosensitive chip 22. Accordingly, by providing the longitudinal groove 240 on the outside of the photosensitive chip 22 (or between the photosensitive chip 22 and the mold body 24), the amount of stress transferred between the mold body 24 and the photosensitive chip 22 can be reduced. Intuitively speaking, if Figure 4 As shown, by providing a longitudinal groove 240 on the mold body 24 , the thickness of the molded portion of the mold body 24 for transferring stress is reduced, so as to reduce the stress exerted by the mold body 24 on the photosensitive chip 22 .

[0100] From the perspective of the stress transfer path, the groove 240 provided between the photosensitive chip 22 and the mold body 24 is equivalent to "cutting a knife" on the stress transfer chain between the mold body 24 and the photosensitive chip 22 to destroy the stress transfer chain. More specifically, the formation position of the groove 240 can be provided between the electronic component 23 and the lead 25, or between the electronic component 23 and the electronic component 23, or on the outside of the electronic component 23, which is not limited by the present application. Preferably, in the embodiment of the present application, the formation position of the groove 240 is provided between the electronic component 23 and the lead 25.

[0101] It should be understood that the ability of the groove 240 to reduce the stress of the mold body 24 on the photosensitive chip 22 is related to the depth of the groove 240. Specifically, as the depth of the groove 240 increases, the ability of the groove 240 to reduce the stress of the mold body 24 on the photosensitive chip 22 becomes stronger. In particular, in some examples of the present application, the depth of the groove 240 is greater than or equal to 30% of the height of the mold body 24, such as Fig. 6A and Figure 6B Here, the height of the molded body 24 refers to the height of the molded body 24 at the location where the groove 240 is set, wherein it should be understood that the height of the molded body 24 at different locations may be different due to the shape configuration of the molded body 24. Preferably, the depth of the groove 240 is greater than or equal to half of the height of the molded body 24.

[0102] More preferably, in the embodiment of the present application, the depth of the groove 240 is equal to the height of the mold body 24. That is to say, preferably, the groove 240 is a through groove formed through the mold body 24 to expose the corresponding area of ​​the circuit board 21. It should be understood that when the groove 240 is a through groove that penetrates the mold body 24, the stress transfer chain between the mold body 24 and the photosensitive chip 22 is completely cut off by the groove 240, so that the stress of the mold body 24 acting on the photosensitive chip 22 is reduced to the greatest extent. It is worth mentioning that in the embodiment of the present application, the width of the groove 240 can also be increased as much as possible without excessively damaging the overall structural strength of the mold body 24, so as to enhance the ability of the groove 240 to reduce the stress of the mold body 24 acting on the photosensitive chip 22.

[0103] like Figure 3-5 As shown, when the groove 240 is formed in the mold body 24, the mold body 24 is divided into a first mold part 241 and a second mold part 242 with the groove 240 as the boundary, wherein the first mold part 241 covers at least a portion of the circuit board 21 and at least a portion of the non-photosensitive area of ​​the photosensitive chip 22, and the second mold part 242 covers at least a portion of the at least one electronic component 23 and at least a portion of the circuit board 21.

[0104] It is worth mentioning that in the embodiment of the present application, since the groove 240 divides the mold body 24 into a first mold part 241 and a second mold part 242, the volume of the mold part covering the photosensitive chip 22 is reduced compared to the existing molding process, so that under the same shrinkage rate, the shrinkage of the mold part covering the photosensitive chip 22 is reduced, so that the stress generated by the mold part is also reduced accordingly, so as to reduce the bending amount of the photosensitive chip 22. In particular, in the embodiment of the present application, the volume of the first mold part 241 can be smaller than that of the second mold part 242, so as to reduce the stress of the mold body 24 acting on the photosensitive chip 22.

[0105] In particular, if Figure 5 As shown, in the embodiment of the present application, the first molded part 241 and the second molded part 242 of the molded body 24 are connected via a molded channel 243. Specifically, Figure 5 As shown, in the embodiment of the present application, the at least one groove 240 includes a first groove 2401 and a second groove 2402, wherein the first groove 2401 and the second groove 2402 are respectively formed through the mold body 24. In particular, the first groove 2401 and the second groove 2402 surround the first molded portion 241 and are joined at the molded channel 243. That is, in the embodiment of the present application, the molded channel 243 is formed between the first groove 2401 and the second groove 2402, so that after the molded body 24 is molded, the molded body 24 is divided into the first molded portion 241 and the second molded portion 242 through the first groove 2401 and the second groove 2402, and the first molded portion 241 and the second molded portion 242 are connected through the molded channel 243. Preferably, in the embodiment of the present application, the first slot 2401 and the second slot 2402 are symmetrically arranged relative to the center line of the photosensitive chip 22, and the first slot 2401 and the second slot 2402 have Of course, in other examples of the embodiments of the present application, the first slot 2401 and the second slot 2402 may also be arranged in an asymmetrical manner, or, when the first slot 2401 and the second slot 2402 are arranged in a symmetrical manner, the first slot 2401 and the second slot 2402 may be implemented in other shapes, such as an "I" shape, which is not limited to the present application.

[0106] It is worth mentioning that in other examples of the present application, the at least one groove 240 may also include a greater number of grooves 240 (for example, also including a third groove 2403 ) or only include a first groove 2401 surrounding the first molded part 241 , which is not limited to the present application.

[0107] Fig. 7A and Figure 7B FIG. 2 is a schematic diagram showing a modified implementation of the photosensitive component 20 according to an embodiment of the present application. Fig. 7A and Figure 7B As shown, in this variant embodiment, the first molded portion 241 and the second molded portion 242 of the molded body 24 are connected by a molded channel 243. In particular, in this variant embodiment, the height of the molded channel 243 is lower than the first molded portion 241 and the second molded portion 242, so as to form a third groove 2403 between the molded channel 243, the first molded portion 241 and the second molded portion 242. That is, in this variant embodiment, the groove 240 not only includes the first groove 2401 and the second groove 2402 running through the molded body 24, but also includes the third groove 2403 formed by the molded body 24 channel and the first molded portion 241 and the second molded portion 242. It should be understood that Fig. 7A and Figure 7B The first molded portion 241 and the second molded portion 242 of the molded body 24 shown can be formed by a one-time molding process, wherein the molding channel 243 is provided just to achieve this process purpose.

[0108] Fig. 8A and Figure 8B FIG. 2 is a schematic diagram showing a modified implementation of the photosensitive component 20 according to an embodiment of the present application. Fig. 8A and Figure 8B As shown, in this variant embodiment, the first molded portion 241 and the second molded portion 242 of the molded body 24 are connected by a molded channel 243. In particular, in this variant embodiment, the molded body 24 includes only one molded channel 243, and the height of the molded channel 243 may be lower than or equal to the height of the first molded portion 241 and the second molded portion 242. Figure 8B As shown, in the embodiment of the present application, the slot 240 has Font. It should be understandable. Fig. 8A and Figure 8B The first molded portion 241 and the second molded portion 242 of the molded body 24 shown can be formed by a one-time molding process, wherein the molding channel 243 is provided just to achieve this process purpose.

[0109] Fig. 9A and Fig. 9B FIG. 2 is a schematic diagram of a photosensitive component 20 according to another embodiment of the present application. Fig. 9A and 9B As shown, compared to Figure 4 In the photosensitive component 20 shown in the schematic diagram, in the embodiment of the present application, the groove 240A is a closed ring groove that completely surrounds the first molded part 241A. That is to say, in the embodiment of the present application, the first molded part 241A and the second molded part 242A of the molded body 24A are divided into two independent molded parts by the groove 240A. That is to say, in the embodiment of the present application, the groove 240A can completely cut off the connection between the first molded part 241A and the second molded part 242A, so that the stress generated by the second molded part 242A will not be transferred to the first molded part 241A, and then will not be transferred to the photosensitive chip 22A. In particular, in the embodiment of the present application, the first molded part 241A and the second molded part 242 are formed by two molding processes. That is to say, in the embodiment of the present application, the first molded part 241A and the second molded part 242A are molded separately in batches, and Figure 4 The molded body 24 shown in the figure can be formed by a one-shot molding process. This part of the content will be introduced in more detail in the subsequent preparation process of the photosensitive component 20A, and is omitted here.

[0110] In order to prevent the photosensitive chip 22 from being impacted by the injected molding material during the molding process and causing positional displacement, in some examples of the embodiments of the present application, the photosensitive component 20 further includes a side encapsulation 28 that wraps the side of the photosensitive chip 22 and at least a portion of the lead 25, which is used to prevent the position of the photosensitive chip 22 from being displaced during the molding process. The effect is as follows: Fig.10 It should be understood that the side encapsulation 28 can not only prevent the position of the photosensitive chip 22 from shifting, but also effectively reduce the stress generated by the mold body 24 from being transmitted to the photosensitive chip 22, and at the same time, can also prevent the lead 25 from being impacted by the molding material and collapsing.

[0111] Furthermore, if Figure 4As shown, in the embodiment of the present application, the photosensitive component 20 also includes a filter element 26 maintained in the photosensitive path of the photosensitive chip 22, wherein the filter element 26 corresponds to at least the photosensitive area of ​​the photosensitive chip 22, and is used to filter the light entering the photosensitive chip 22 to improve the imaging quality. In particular, in the embodiment of the present application, the filter element 26 is mounted on the first molded part 241 of the molded body 24 to be maintained in the photosensitive path of the photosensitive chip 22. It is worth mentioning that when the slot 240 is provided between the electronic component 23 and the lead 25, the slot 240 is adjacent to the first molded part 241, so that when the filter element 26 is mounted on the first molded part 241, the overflowed glue can be accommodated in the slot 240 to prevent the excess glue from contaminating other components (especially the photosensitive chip 22). That is to say, in the embodiment of the present application, the slot 240 also serves as an overflowing glue slot. It should be understood that in order to better guide the flow of glue, in some examples of the embodiments of the present application, a guide groove connected to the groove 240 can be further formed in a recessed manner on the upper surface of the first molded part 241 to guide excess glue to flow toward the groove 240.

[0112] In some examples of the embodiments of the present application, Fig.11 As shown, the first molded part 241 further includes a mounting platform 260 formed concavely on the upper surface of the first molded part 241, and the mounting platform 260 is configured to mount the filter element 26 thereon. It should be understood that, compared with directly mounting the filter element 26 on the upper surface of the first molded part 241, mounting the filter element 26 on the mounting platform 260 is conducive to reducing the size of the filter element 26, so as to reduce the cost of the filter element 26. Moreover, such a mounting method can also shorten the distance between the filter element 26 and the photosensitive chip 22, so that the overall thickness of the photosensitive component 20 can be reduced. It is worth mentioning that in the embodiment of the present application, the inner side surface of the first molded part 241 can be perpendicular to the photosensitive chip 22 or inclined to the photosensitive chip 22, wherein the inner side surface set in different ways corresponds to the parameter configuration of different protrusions of the molding mold 90, which is not limited by the present application.

[0113] Those skilled in the art should know that in the embodiment of the present application, the filter element 26 can be implemented as different types, including but not limited to the filter element 26 can be implemented as an infrared cut-off filter, a full-spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 26 is implemented as a combination of an infrared cut-off filter and a full-spectrum filter, that is, the infrared cut-off filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive chip 22, so that when used in an environment with sufficient light such as daytime, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive chip 22 to filter the infrared rays in the light reflected by the object entering the photosensitive chip 22 through the infrared cut-off filter, and when used in an environment with dark light such as night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive chip 22 to allow the infrared rays in the light reflected by the object entering the photosensitive chip 22 to be partially transparent.

[0114] Fig.12 FIG. 2 is a schematic diagram showing another variant implementation of the photosensitive component 20 according to an embodiment of the present application. Fig.12 As shown, in this variant embodiment, the photosensitive component 20 further includes a filter element bracket 27, wherein the filter element bracket 27 is disposed in the slot 240 and is configured to mount the filter element 26 thereon. Specifically, in this variant embodiment, the filter element bracket 27 includes a bracket body and a support arm extending inwardly from the bracket body, wherein the support arm forms a through hole corresponding to at least the photosensitive area of ​​the photosensitive chip 22. Accordingly, when the filter element 26 is mounted on the support arm, the filter element 26 covers the through hole so that the light is filtered by the filter element 26 before reaching the photosensitive chip 22 through the through hole, so as to improve the imaging quality. It should be understood that through the support arm of the filter element bracket 27, the size of the filter element 26 can be further reduced, so that the cost of the filter element 26 can be further reduced. It is worth mentioning that in other examples of the embodiments of the present application, the filter element 26 can also be maintained in the light sensing path of the photosensitive chip 22 in other ways. For example, the filter element 26 can be directly stacked on the photosensitive chip 22 and participate in the molding process, so that the first molded part 241 of the molded body 24 after molding covers a part of the filter element 26 and at least a part of the circuit board 21. For another example, the filter element 26 can also be supported in the optical lens 10, or formed on the surface of the lens in the optical lens 10 in the form of a coating. This is not limited to the present application.

[0115] Fig.13FIG. 2 is a schematic diagram of a photosensitive component 20 according to another embodiment of the present application. Fig.13 As shown, in the embodiment of the present application, the filter element holder 27B is integrated between the first molded part 241B and the second molded part 242B of the molded body 24B. Specifically, in the embodiment of the present application, before the molding process is performed, the filter element holder 27B is arranged on the circuit board 21B, and the filter element holder 27B has a channel (not shown in the figure) running through it, wherein the channel is configured to allow the molding material to flow through. Specifically, the channel can be arranged at the bottom of the filter element holder 27B, or formed through the side wall of the filter element holder 27B. Accordingly, after the molding material is injected into the molding mold 90B and the molded body 24B is formed, the filter element holder 27B is integrated between the first molded part 241B and the second molded part 242B of the molded body 24B. How the filter element 26B is combined between the first molded part 241B and the second molded part 242B, and how the molded body 24B is molded will be further introduced in the subsequent manufacturing process of the photosensitive component 20B, and will not be elaborated here.

[0116] Preferably, in this embodiment of the present application, the filter element holder 27B is made of a material with high rigidity (for example, metal, PMMA, ceramic, ABS resin, etc.), so that the filter element holder 27B has a high structural strength. It can be observed that after the mold body 24B is integrally formed, the inner side surface of the filter element holder 27B is wrapped and combined with the first mold part 241B, and the outer side surface of the filter element 26B is integrally combined with the second mold part 242B. In this way, the filter element holder 27B can play a role in maintaining the shape of the first mold part 241B, thereby ensuring that the internal stress generated by the first mold part 241B is not sufficient to excessively change the shape of the photosensitive chip 22B. Furthermore, since the filter element holder 27B is disposed between the first molded part 241B and the second molded part 242B, the stress generated by the second molded part 242B can be isolated by the filter element holder 27B, so that the stress generated by the second molded part 242B cannot affect the photosensitive chip 22B located on the inner side of the filter element holder 27B.

[0117] That is to say, in the embodiment of the present application, the filter element bracket 27B which is integrally combined with the first molded part 241B and the second molded part 242B of the mold body 24B can not only be used to install the filter element 26B thereon, but also prevent the stress generated by the second molded part 242B from affecting the photosensitive chip 22B, and maintain the shape of the first molded part 241B to ensure that the internal stress generated by the first molded part 241B is not sufficient to excessively change the shape of the photosensitive chip 22B.

[0118] It is worth mentioning that Figure 3 - Fig.13 As shown, the arrangement of the groove 240 can not only reduce the stress of the mold body 24 acting on the photosensitive chip 22, but also increase the overall exposed surface area of ​​the mold body 24, so that the stress generated by the mold body 24 can be relatively more distributed to the outer surface of the mold body 24, so as to relatively reduce the stress of the mold body 24 acting on the photosensitive chip 22. It should be understood that the arrangement of the groove 240 increases the overall exposed surface area of ​​the mold body 24, and the groove 240 provides a heat dissipation channel, so that the heat generated by the photosensitive component 20 during operation can be dissipated through the heat dissipation channel, which is beneficial to improve the heat dissipation performance of the photosensitive component 20. It is also worth mentioning that in the embodiment of the present application, in consideration of the stress influence of the mold body 24, the groove 240 with a certain depth is opened on the mold body, and as the depth of the groove 240 increases, the heat dissipation area of ​​the heat dissipation channel is also continuously increased, thereby enhancing the heat dissipation performance of the photosensitive component 20. In particular, as mentioned above, in the embodiment of the present application, the depth of the groove 240 is greater than or equal to 30% of the height of the molded body 24 .

[0119] It is also worth mentioning that the molded body 24 of the embodiment of the present application can also be formed by a molding process, wherein the molding material includes but is not limited to powdered, gel-like epoxy resin, etc., which is not limited to the present application.

[0120] Fig.14 Another variant embodiment of the photosensitive component 20 according to the embodiment of the present application is shown in FIG. Fig.14As shown, in this variant embodiment, the photosensitive component 20 further includes a reinforcing plate disposed on the lower surface of the circuit board 21, so as to strengthen the structural strength of the circuit board 21 through the reinforcing plate. The reason is that when the slot 240 is opened on the mold body 24, the structural strength of a part of the circuit board 21 (the exposed area) is weakened, and the reinforcing plate can prevent the circuit board 21 from being deformed or even broken. Preferably, the reinforcing plate is made of a material with high rigidity, such as metal, ceramic, ABS resin, etc.

[0121] In summary, the camera module and its photosensitive component based on the embodiment of the present application are explained, which reduce the stress exerted by the molded body on the photosensitive chip by opening grooves on the molded body to prevent the photosensitive chip from excessively deforming due to large stress, thereby improving the imaging quality of the camera module.

[0122] Schematic diagram of the photosensitive component manufacturing process

[0123] Fig.15 The schematic diagram of the manufacturing process of the photosensitive component 20 according to the embodiment of the present application is illustrated, wherein: Fig.15 The photosensitive component 20 manufacturing process shown in the figure is used to manufacture Figure 4 The photosensitive component 20 shown in the figure is an example.

[0124] like Fig.15 As shown, the manufacturing process first includes: providing a circuit board panel 210, and electrically connecting at least one electronic component 23 and at least one photosensitive chip 22 to a preset position of the circuit board 21 panel.

[0125] Furthermore, the circuit board panel 210 is placed in a molding die 90, wherein the molding die 90 includes an upper die 91 and a matching lower die 92. Specifically, in this example of the present application, the circuit board panel 210 is placed in the lower die 92 of the molding die 90, and then the upper die 91 and the lower die 92 are molded together, so that the circuit board panel 210 is accommodated in the molding space defined by the upper die 91 and the lower die 92.

[0126] In particular, in the embodiment of the present application, the upper mold 91 includes a mold body 911 and a first protrusion 912 and a second protrusion 913 extending downwardly from the mold body 911 at intervals, wherein the cross-section of the first protrusion 912 and the second protrusion 913 has a closed ring shape, for example, a "mouth" shape. When the upper mold 91 and the lower mold 92 are molded together, the first protrusion 912 of the upper mold 91 is attached to the circuit board panel 210 and the second protrusion 913 of the upper mold 91 is attached to the photosensitive chip 22. Specifically, the position where the first protrusion 912 is attached to the circuit board panel 210 is set between the lead 25 and the electronic component 23, and the position where the second protrusion 913 is attached to the photosensitive chip 22 is set in the non-photosensitive area of ​​the photosensitive chip 22, so that a second molding space 915 is formed between the first protrusion 912 and the mold body 911, and a first molding space 914 is formed between the second protrusion 913 and the first protrusion 912. Further, in this example of the present application, a molding channel (not shown in the figure) is also provided on the first protrusion 912, which is used to connect the first molding space 914 and the second molding space 915.

[0127] In this way, after the molding material is injected into the molding space, the molding material gradually fills the second molding space 915 along the preset flow path and then fills the first molding space 914 along the molding channel (not shown in the figure). Then, after curing, the first molding part 241 is formed in the first molding space 914, and the second molding part 242 is formed in the second molding space 915, wherein the first molding part 241 covers at least a part of the circuit board 21 and at least a part of the non-photosensitive area of ​​the photosensitive chip 22, and the second molding part 242 covers at least a part of the at least one electronic component 23 and at least a part of the circuit board 21. Moreover, the second molding part 242 and the second molding part 242 are connected through the molding channel (not shown in the figure). Then, the groove 240 is formed at the position corresponding to the first protrusion 912, that is, the groove 240 penetrating the mold body 24 is formed in the first molding part 241 and the second molding part 242.

[0128] After obtaining the photosensitive component assembly, the photosensitive component assembly is cut to obtain a plurality of monomeric photosensitive components 20. Further, the filter element 26 is assembled on the photosensitive component 20 to obtain the following Figure 4 The photosensitive component 20 is shown.

[0129] It is worth mentioning that in the embodiments of the present application, Fig. 6A and Figure 6B , Fig. 7Aand Figure 7B , Fig. 8A and Figure 8B , Fig.10 , Fig.11 , Fig.12 and Fig.14 The manufacturing process of the photosensitive component 20 is shown in FIG. Figure 4 The manufacturing process shown is similar, and those skilled in the art should be based on Fig. 6A and Figure 6B , Fig. 7A and Figure 7B , Fig. 8A and Figure 8B , Fig.10 , Fig.11 , Fig.12 and Fig.14 The structural diagram of the photosensitive component 20 shown in the figure can easily infer its manufacturing process, so it will not be repeated here.

[0130] Fig.16A and Fig. 16B The schematic diagram of the manufacturing process of the photosensitive component 20 according to the embodiment of the present application is illustrated, wherein: Fig.16A and Fig. 16B The photosensitive component 20 manufacturing process shown in FIG. Fig. 9A and Fig. 9B The photosensitive component 20A shown in the figure is an example. It is worth mentioning that the molded body 24A of the embodiment of the present application is formed by a molding process, wherein the molding material 900A includes but is not limited to powdered, gelatinous or granular epoxy resin, etc., which is not limited to the present application.

[0131] like Fig.16A and Fig. 16B As shown, the manufacturing process first includes: providing a circuit board panel 210A, and electrically connecting at least one electronic component 23A and at least one photosensitive chip 22A to a preset position of the circuit board panel 210A. Further, applying the molding material 900A to the preset position of the circuit board panel 210A.

[0132] Furthermore, the circuit board panel 210A is placed in a molding die 90A, wherein the molding die 90A includes an upper die 91A and a lower die 92A matched therewith. Specifically, in this example of the present application, the circuit board panel 210A is placed in the lower die 92A of the molding die 90A, and then the upper die 91A and the lower die 92A are molded together, so that the circuit board panel 210A is accommodated in the molding space defined by the upper die 91A and the lower die 92A.

[0133] In particular, in the embodiment of the present application, the upper mold 91A includes a mold body 911A and a first protrusion 912A extending downward from the mold body 911A at intervals, and the cross section of the first protrusion 912A is a closed ring, for example, a "mouth" shape. When the upper mold 91A and the lower mold 92A are molded together, the first protrusion 912A of the upper mold 91A is attached to the non-photosensitive area of ​​the photosensitive chip 22A, so as to seal at least the photosensitive area of ​​the photosensitive chip 22A through the first protrusion 912A and form a first molding space 914A between the first protrusion 912A and the mold body 911A, wherein the molding material 900A is accommodated in the first molding space 914A.

[0134] In this way, after the molding material 900A is solidified, the first molding part 241A is formed in the first molding space 914A, wherein the first molding part 241A covers at least a portion of the circuit board 21A and at least a portion of the non-photosensitive area of ​​the photosensitive chip 22A.

[0135] Then, the upper mold 91A is replaced with a second upper mold 91'A, wherein the second upper mold 91'A includes a second mold body 911'A and a second protrusion 913'A extending downward from the second mold body 911'A. Then, the molding material 900A is applied to a preset position of the circuit board panel 210A. Then, when the second upper mold 91'A and the lower mold 92A are molded together, the second protrusion 913'A of the second upper mold 91'A is attached to the circuit board panel 210A, and more specifically, the position attached to the circuit board panel 210 is set between the lead 25A and the electronic component 23A, so that a second molding space 915'A is formed between the second protrusion 913'A and the second mold body 911'A, wherein the molding material 900A is accommodated in the second molding space 915'A.

[0136] In this way, after the molding material is solidified, the second molding part 242A is formed in the second molding space 915'A, wherein the second molding part 242A covers at least a portion of the at least one electronic component 23A and at least a portion of the circuit board 21A. Furthermore, the groove 240A is formed at a position corresponding to the second protrusion 913A, that is, the groove 240A penetrating the molding body 24A is formed in the first molding part 241A and the second molding part 242A.

[0137] It should be understood that in the present application example, in order to prepare the photosensitive component 20A as shown in FIG. 7 , two molding processes need to be performed and different upper molds 91A need to be replaced in two different molding processes.

[0138] After obtaining the photosensitive component assembly, the photosensitive component assembly is cut to obtain a plurality of individual photosensitive components 20A. Further, the filter element 26A is assembled on the photosensitive component 20A to obtain the following: Fig. 9A and Fig. 9B The photosensitive component 20A is shown.

[0139] Fig.17 The schematic diagram of the manufacturing process of the photosensitive component 20 according to the embodiment of the present application is illustrated, wherein: Fig.17 The photosensitive component 20 manufacturing process shown in FIG. Fig.13 The photosensitive component 20 is an example.

[0140] like Fig.17 As shown, the manufacturing process first includes: providing a circuit board panel 210B, and electrically connecting at least one electronic component 23B and at least one photosensitive chip 22B to a preset position of the circuit board panel 210B.

[0141] Furthermore, the filter element holder 27B having a channel (not shown in the figure) is arranged on the circuit board assembly 210B. Specifically, the filter element holder 27B is arranged on the filter element 26B assembly at a position outside the photosensitive chip 22B, or between the lead 25B and the electronic component 23B.

[0142] Furthermore, the circuit board panel 210B is placed in a molding die 90B, wherein the molding die 90B includes an upper die 91B and a lower die 92B matched therewith. Specifically, in this example of the present application, the circuit board panel 210B is placed in the lower die 92B of the molding die 90B, and then the upper die 91B and the lower die 92B are molded together, so that the circuit board panel 210B is accommodated in the molding space defined by the upper die 91B and the lower die 92B.

[0143] In particular, in the embodiment of the present application, the upper mold 91B includes a mold body 911B and a first protrusion 912B and a second protrusion 913B extending downwardly from the mold body 911B at intervals, wherein the cross-section of the first protrusion 912B and the second protrusion 913B has a closed ring shape, for example, a "mouth" shape. When the upper mold 91B and the lower mold 92B are molded together, the first protrusion 912B of the upper mold 91B is attached to the filter element bracket 27B and the second protrusion 913B of the upper mold 91B is attached to the non-photosensitive area of ​​the photosensitive chip 22B, so as to form a second molding space 915B between the first protrusion 912B and the mold body 911B, and a first molding space 914B is formed between the second protrusion 913B and the first protrusion 912B, wherein the first molding space 914 and the second molding space 915B are connected through the channel (not shown in the figure) provided on the filter element bracket 27B.

[0144] Thus, after the molding material is injected into the molding space, the molding material gradually fills the second molding space 915B along the preset flow path and then fills the first molding space 914B along the channel. Furthermore, after curing, the first molding part 241B is formed in the first molding space 914B, the second molding part 242B is formed in the second molding space 915B, and the filter element 26B integrally combined with the second molding part 242B is formed between the second molding part 242B and the second molding part 242B, wherein the first molding part 241B covers at least a portion of the circuit board 21B and at least a portion of the non-photosensitive area of ​​the photosensitive chip 22B, and the second molding part 242B covers at least a portion of the at least one electronic component 23B and at least a portion of the circuit board 21B.

[0145] After obtaining the photosensitive component assembly, the photosensitive component assembly is cut to obtain a plurality of monomeric photosensitive components 20B. Further, the filter element 26B is assembled on the photosensitive component 20B to obtain the following: Fig.13 The photosensitive component 20B is shown.

[0146] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A photosensitive component, characterized in that: include: Circuit board; A photosensitive chip electrically connected to the circuit board; a molded body integrally formed with the circuit board, wherein the molded body has at least one groove recessed therein; and At least one electronic component disposed on the circuit board; Wherein, with the groove as the boundary, the molded body is divided into a first molded part and a second molded part, the first molded part covers at least a part of the circuit board and at least a part of the non-photosensitive area of ​​the photosensitive chip, and the groove is located on the outside of the photosensitive chip to reduce the stress of the molded body on the photosensitive chip through the groove; wherein, the groove is longitudinal.

2. The photosensitive component according to claim 1, wherein: The second molded portion covers at least a portion of the at least one electronic component and at least a portion of the circuit board.

3. The photosensitive component according to claim 1, wherein: The depth of the groove is greater than or equal to 30% of the height of the molded body.

4. The photosensitive component according to claim 1, wherein: The slot is formed through the molded body to expose a corresponding area of ​​the circuit board.

5. The photosensitive component according to claim 4, wherein: The first molded portion and the second molded portion are connected via a molded channel.

6. The photosensitive component according to claim 5, wherein: The at least one groove includes a first groove and a second groove, wherein the first groove and the second groove are symmetrically arranged relative to the photosensitive chip, wherein the molding channel is formed between the first groove and the second groove during the molding process.

7. The photosensitive component according to claim 4, wherein: The groove is a closed annular groove surrounding the first molded part, so as to divide the molded body into the first molded part and the second molded part which are independent of each other.

8. The photosensitive component according to claim 7, wherein: The first molded portion and the second molded portion are formed by a two-molding process.

9. The photosensitive assembly according to claim 1, further comprising a filter element holder disposed in the slot, wherein: The filter element holder is configured to mount a filter element thereon.

10. The photosensitive assembly according to claim 4, further comprising a filter element holder disposed in the slot, wherein: The filter element holder is configured to mount a filter element thereon.

11. The photosensitive component according to claim 10, wherein: The filter element holder has a channel running through it, wherein the filter element holder is preset on the circuit board and is integrally combined with the first molded part and the second molded part of the molded body after the molded body is integrally formed.

12. The photosensitive assembly according to claim 1 further comprises a side encapsulation adhesive that wraps the side of the photosensitive chip and at least part of the leads for electrically connecting the photosensitive chip and the circuit board.

13. A camera module, characterized in that: include: Optical lens; A photosensitive component as described in any one of claims 1-12, wherein the optical lens is maintained in the photosensitive path of the photosensitive component.

14. A method for manufacturing a photosensitive component, characterized in that: include: A circuit board is provided, wherein at least one electronic component and at least one photosensitive chip are electrically connected to the circuit board; The circuit board is accommodated in a molding space formed by the upper mold and the lower mold of the molding mold when the molding mold is closed, wherein the molding mold includes a protrusion; forming a molded body in the molding space; and Separating the upper mold and the lower mold of the molding mold to form a groove recessed in the molded body at a position corresponding to the protrusion; With the groove as the boundary, the molded body is divided into a first molded part and a second molded part, the first molded part covers at least a part of the circuit board and at least a part of the non-photosensitive area of ​​the photosensitive chip, and the groove is located on the outside of the photosensitive chip to reduce the stress of the molded body on the photosensitive chip through the groove; wherein the groove is longitudinal.

15. The method for manufacturing a photosensitive component according to claim 14, wherein: The process of forming the molded body comprises: Placing the circuit board in the lower mold of the molding mold; The upper mold and the lower mold of the molding mold are molded together, wherein the upper mold includes a mold body and a first protrusion and a second protrusion extending downwardly from the mold body at intervals, wherein when the upper mold and the lower mold are molded together, the first protrusion of the upper mold is attached to the circuit board, and the second protrusion of the upper mold is attached to the non-photosensitive area of ​​the photosensitive chip, so as to form a second molding space between the first protrusion and the mold body, and to form a first molding space between the second protrusion and the first protrusion, wherein the first protrusion further has a molding channel connecting the first molding space and the second molding space; Filling the first molding space and the second molding space with molding material, so that after the molding material is solidified, a first molding part is formed in the first molding space, and a second molding part is formed in the second molding space, and the second molding part and the second molding part are connected through the molding channel; and The upper mold and the lower mold are separated to form the groove at a position corresponding to the first protrusion.

16. The method for manufacturing a photosensitive component according to claim 14, wherein: The process of forming the molded body comprises: Applying a molding material to the circuit board; Placing the circuit board in the lower mold of the molding mold; The upper mold and the lower mold of the molding mold are molded together, wherein the upper mold includes a mold body and a first protrusion extending downwardly from the mold body at a distance, wherein when the upper mold and the lower mold are molded together, the first protrusion of the upper mold is attached to the circuit board to form a first molding space between the first protrusion and the mold body, wherein the molding material is located in the first molding space; forming a first molded part in the first molding space by a molding process; Separating the upper mold and the lower mold; Applying a molding material to the circuit board; The lower mold of the molding mold is molded together with the second upper mold, wherein the second upper mold includes a second mold body and a second protrusion extending downwardly from the second mold body at a distance, wherein when the second upper mold and the lower mold are molded together, the second protrusion of the second upper mold is attached to the circuit board to form a second molding space between the second protrusion and the second mold body, wherein the molding material is located in the second molding space; forming a second molded part in the second molding space by a molding process; The upper mold and the lower mold are separated to form the groove recessed in the molded body at a corresponding position of the second protrusion.

17. The method for manufacturing a photosensitive component according to claim 14, before forming the molded body, the method further comprises: At least one filter element holder is preset on the circuit board, and the filter element holder has a channel running through it, so as to integrally combine the filter element holder with the first molded part and the second molded part of the molded body after the molded body is integrally formed.

18. The method for manufacturing a photosensitive component according to any one of claims 14 to 17, wherein: The circuit board is implemented as a circuit board panel.

19. A method for manufacturing a camera module, characterized in that: include: The method for manufacturing a photosensitive component according to any one of claims 14 to 18, forming a molded body, wherein the molded body has a groove recessedly formed therein, wherein the groove divides the molded body into a first molded portion and a second molded portion; and An optical lens is mounted on the second molded portion of the molded body.

Images