A display module manufacturing method and device, display device, and electronic device

Abstract

Embodiments of the present specification relate to a display module manufacturing method and device, a display device, and an electronic device. The display module manufacturing method comprises: manufacturing a display circuit on a front body of a substrate; obtaining a metal wire driving circuit film and connecting the metal wire driving circuit film to a back surface of the substrate by means of attachment; manufacturing a slope of the back surface of the substrate and a top edge of a step surface by means of printing at a position of the back surface of the substrate close to the metal wire driving circuit film compared to a step surface; and manufacturing a plurality of interconnection lines by means of printing to achieve connection between the display circuit and the metal wire driving circuit film by winding from the front surface of the substrate to the back surface of the substrate through a side surface of the substrate and climbing the slope obliquely to obtain a display module. The display module manufacturing method disclosed in the embodiments of the present specification can reduce the production cost of the display module and increase the production yield of the display module.

Description

TECHNICAL FIELD

[0001] Embodiments of the present specification relate to the technical field of printing, and in particular to a display module manufacturing method and device, display equipment, and electronic equipment. BACKGROUND

[0002] In the field of display module manufacturing, the current technology generally adopts a side edge line connection method. This is because, to some extent, this connection method can achieve efficient signal transmission and better module integration. Specifically, side edge line connection can reduce space occupation, improve the compactness of the display module, and also help to improve the uniformity and stability of the display effect.

[0003] However, the existing display module manufacturing process has certain limitations. Currently, the circuit fabrication on the front and back surfaces of the substrate is usually completed through exposure development and laser etching technology. In the side edge connection part, vapor deposition and laser etching methods are used. Although this process can achieve circuit connection, it has high cost and a complex process flow. More importantly, the adverse effects of the post-process often pass to the front-end process, resulting in a decrease in overall yield and an increase in cost and efficiency.

[0004] In view of the above problems, there is an urgent need for a new display module manufacturing method. SUMMARY

[0005] The embodiments of the present specification provide a display module manufacturing method and device, display equipment, and electronic equipment, which can reduce the production cost of the display module and increase the production yield of the display module, especially when preparing a display module with a small interconnection line spacing, which can reduce the production cost of the display module and increase the production yield of the display module.

[0006] The technical scheme is as follows:

[0007] In a first aspect, the embodiments of the present specification provide a display module manufacturing method, comprising:

[0008] Fabricating a display circuit on the front surface body of the substrate;

[0009] Obtaining a metal wire driving circuit film and connecting the metal wire driving circuit film to the back surface of the substrate by an attaching method;

[0010] Fabricating a slope on the back surface of the substrate and close to the top edge of the gap surface and the back surface of the metal wire driving circuit film by a printing method;

[0011] The display module is manufactured by printing a plurality of interconnection lines which are connected between the display circuit and the metal wire driving circuit film by winding from the front surface of the substrate to the back surface of the substrate and climbing the slope obliquely.

[0012] As a preferred solution, the display circuit is manufactured on the front surface of the substrate, comprising:

[0013] The display circuit is manufactured on the front surface of the substrate by exposure and development and laser etching.

[0014] As a preferred solution, the climbing angle of the plurality of interconnection lines is equal when climbing the slope obliquely.

[0015] Before the metal wire driving circuit film is connected to the back surface of the substrate by the attaching method, further comprising:

[0016] The display circuit position of the display circuit on the front surface of the substrate is obtained.

[0017] The slope inclination angle design value and the interconnection line oblique climbing angle design value are obtained.

[0018] The metal wire driving circuit film is connected to the back surface of the substrate by the attaching method, comprising:

[0019] The height of the discontinuous surface is obtained.

[0020] Based on the slope inclination angle design value, the interconnection line oblique climbing angle design value and the height of the discontinuous surface, the attachment offset is obtained.

[0021] Based on the display circuit position of the display circuit on the front surface of the substrate and the attachment offset, the metal wire driving circuit film attachment position of the metal wire driving circuit film on the back surface of the substrate is obtained.

[0022] Based on the metal wire driving circuit film attachment position of the metal wire driving circuit film on the back surface of the substrate, the metal wire driving circuit film is connected to the back surface of the substrate by the attaching method.

[0023] As a preferred solution, the attachment offset is obtained based on the slope inclination angle design value, the interconnection line oblique climbing angle design value and the height of the discontinuous surface, comprising:

[0024] Based on the slope inclination angle design value and the height of the discontinuous surface, the climbing distance required for climbing from the bottom of the slope to the top of the slope along the slope inclination direction is obtained.

[0025] Based on the interconnection line oblique climbing angle design value and the climbing distance required for climbing from the bottom of the slope to the top of the slope along the slope inclination direction, the attachment offset is obtained.

[0026] As a preferred solution, the obtaining the slope inclination angle design value and the interconnection line slope climbing angle design value comprises:

[0027] The viscosity of the printing material and the line spacing design parameter between the interconnection lines are obtained.

[0028] Based on the viscosity of the printing material and the line spacing design parameter between the interconnection lines, the slope inclination angle design value and the interconnection line slope climbing angle design value are obtained.

[0029] As a preferred solution, the printing the slope on the back surface of the substrate and close to the metal wire driving circuit film to connect the top end edge of the stepped surface and the slope on the back surface of the substrate comprises:

[0030] Based on the display circuit position on the front surface of the substrate, the slope manufacturing position parameter of the slope on the back surface of the substrate is obtained.

[0031] Based on the slope manufacturing position parameter of the slope on the back surface of the substrate and the slope inclination angle design value, the printing the slope on the back surface of the substrate and close to the metal wire driving circuit film to connect the top end edge of the stepped surface and the slope on the back surface of the substrate.

[0032] As a preferred solution, when the printing the plurality of interconnection lines that are connected between the display circuit and the metal wire driving circuit film by winding from the front surface of the substrate to the back surface of the substrate through the side surface of the substrate and by climbing the slope in a slope manner, the interconnection line slope climbing angle design value is used for the printing.

[0033] In a second aspect, the embodiments of the present specification provide a display module manufacturing device based on the display module manufacturing method in the first aspect of the above embodiments, comprising:

[0034] The first manufacturing module is configured to manufacture the display circuit on the front surface body of the substrate.

[0035] The attaching module is configured to connect the obtained metal wire driving circuit film to the back surface of the substrate by attaching.

[0036] The second manufacturing module is configured to print the slope on the back surface of the substrate and close to the metal wire driving circuit film to connect the top end edge of the stepped surface and the slope on the back surface of the substrate.

[0037] The second manufacturing module is further configured to print the plurality of interconnection lines that are connected between the display circuit and the metal wire driving circuit film by winding from the front surface of the substrate to the back surface of the substrate through the side surface of the substrate and by climbing the slope in a slope manner, so as to manufacture the display module.

[0038] In a third aspect, the embodiments of the present specification provide a display device, comprising a display module manufactured by the display module manufacturing method in the first aspect of the embodiments.

[0039] In a fourth aspect, the embodiments of the present specification provide an electronic device, comprising a processor and a memory; the processor is connected with the memory; the memory is used for storing executable program codes; the processor runs programs corresponding to the executable program codes by reading the executable program codes stored in the memory, so as to execute the steps in the first aspect of the embodiments.

[0040] In a fifth aspect, the embodiments of the present specification provide a computer storage medium, which stores a plurality of instructions, and the instructions are suitable for being loaded by a processor and executing the steps in the first aspect of the embodiments.

[0041] The technical solutions provided by some embodiments of the present specification have at least the following beneficial effects:

[0042] By adopting the method of attaching the metal wire driving circuit film to manufacture the required circuit on the back of the substrate, and by printing a plurality of interconnection lines to realize the connection between the display circuit and the metal wire driving circuit film through the side of the substrate from the front of the substrate to the back of the substrate, a display module is manufactured, thereby reducing the manufacturing cost of the display module. Further, since the required circuit is manufactured on the back of the substrate by attaching the metal wire driving circuit film, there is a step difference between the metal wire driving circuit film and the back of the substrate. If the interconnection lines are directly printed to climb through the step difference, the printed lines are prone to accumulate and expand, and even collapse due to the too large slope of the step difference, thereby reducing the production yield of the display module, and the negative impact of this situation is particularly obvious in the manufacturing process of the display module with smaller interconnection line spacing. Therefore, in the display module manufacturing method provided by the embodiments of the present specification, a slope connecting the top edge of the step difference and the back of the substrate is manufactured by printing on the back of the substrate and close to the position of the step difference between the metal wire driving circuit film and the back of the substrate. The interconnection lines realize the connection between the display circuit and the metal wire driving circuit film by climbing the slope in a slanting manner, avoiding the situation of printed line accumulation and expansion, and even collapse due to the too large slope of the step difference, thereby providing the possibility of manufacturing display modules with smaller interconnection line spacing.

[0043] Since the front circuit of the display module is often more complex, containing tiny feature sizes and precise patterns. And exposure development and laser etching are precise patterning processes that can be used to create very fine lines and spaces to meet the requirements of high-density integrated circuits. Therefore, the display circuit is still made on the front body of the substrate through the methods of exposure development and laser etching. For the circuit on the back of the display module for driving the display circuit which has less precision requirements, the display module manufacturing method provided in the embodiments of the present specification is completed by attaching the metal wire driving circuit film. And for the lines used to connect the display circuit and the metal wire driving circuit film, the display module manufacturing method provided in the embodiments of the present specification is realized by printing the lines. Further, on the basis of ensuring the precision of the display module product, the production cost is reduced.

[0044] It can be understood that if the printed length of the interconnection line is shorter, the setting position of the metal wire driving circuit film on the back of the substrate needs to be set based on the position of the display circuit on the front of the substrate. In the display module manufacturing method provided in the embodiments of the present specification, since the interconnection line adopts the inclined climbing way, the interconnection line has a certain degree of deviation compared with the original connection path. Therefore, in the display module manufacturing method provided in the embodiments of the present specification, the attachment position of the metal wire driving circuit film on the back of the substrate not only needs to be based on the position of the display circuit on the front of the substrate, but also needs to be based on the deviation amount of the interconnection line due to the inclined climbing. And in order to ensure the consistency of the deviation of all interconnection lines, the inclined climbing angle of the inclined climbing of the plurality of interconnection lines on the slope is also limited to be equal.

[0045] It can be understood that the viscosity of the printing material will affect the shape retention ability of the line on the slope. The line spacing design parameters between the interconnection lines are different, and the shape retention ability requirements of the printed line are different. Therefore, in the display module manufacturing method provided in the embodiments of the present specification, based on the viscosity of the printing material and the line spacing design parameters between the interconnection lines, the inclined angle design value of the slope and the inclined climbing angle design value of the interconnection line are obtained to avoid the phenomenon of accumulation expansion or collapse of the printed line on the slope. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0047] Figure 1 It is a flowchart of a display module manufacturing method provided in the embodiments of the present specification.

[0048] Figure 2 is a schematic diagram of a printing route of an interconnection line on the back of a substrate in a display module manufacturing method provided by an embodiment of the present specification.

[0049] Figure 3 is a structural schematic diagram of different shapes of slopes in a display module manufacturing method provided by an embodiment of the present specification.

[0050] Figure 4 is a flowchart of connecting a metal wire driving circuit film to the back of a substrate by an attaching method in an embodiment of the present specification.

[0051] Figure 5 is a flowchart of obtaining an attaching offset in an embodiment of the present specification.

[0052] Figure 6 is a structural schematic diagram of an electronic device provided by an embodiment of the present specification.

[0053] In the figure: 1, slope; 2, metal wire driving circuit film; 3, substrate; 4, stepped surface; 600, electronic device; 601, processor; 602, communication bus; 603, user interface; 604, network interface; 605, memory. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present specification will be described clearly and completely below with reference to the drawings in the embodiments of the present specification.

[0055] The terms “first”, “second”, “third”, and the like in the specification and claims of the present specification and the above drawings are used to distinguish different objects, and are not used to describe a specific order. In addition, the terms “include” and “have” and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed or can optionally include other steps or units inherent to the process, method, product, or device.

[0056] The following description provides examples and does not limit the scope, applicability, or examples set forth in the claims. Changes can be made to the functions and arrangements of described elements without departing from the scope of the present specification. Various examples can appropriately omit, replace, or add various processes or components. For example, the described methods can be performed in a different order from the described order, and various steps can be added, omitted, or combined. In addition, features described with respect to some examples can be combined into other examples.

[0057] Reference is made toFigure 1 As shown, Figure 1 A flowchart of a display module manufacturing method is provided in the embodiments of the present application, and the display module manufacturing method can at least include:

[0058] In step 102, a display circuit is made on the front surface of the substrate 3 (Note: Figure 1 The substrate 3 is not shown in the figure, and it can be understood that Figure 1 All the structures in the figure are arranged on the back surface of the substrate 3);

[0059] In step 104, a metal wire driving circuit film 2 (such as FPC, PI, etc.) is obtained, and the metal wire driving circuit film 2 is connected to the back surface of the substrate 3 by means of attachment;

[0060] In step 106, a slope 1 is made by printing on the back surface of the substrate 3 and close to the position of the step surface 4 on the back surface of the substrate 3 compared with the metal wire driving circuit film 2, which connects the top edge of the step surface 4 and the back surface of the substrate 3;

[0061] In step 108, a plurality of interconnection lines are made by printing, which are connected between the display circuit and the metal wire driving circuit film 2 by winding from the front surface of the substrate 3 to the back surface of the substrate 3 through the side surface of the substrate 3 and climbing the slope 1 on the slope 1, so as to obtain a display module.

[0062] The display module manufacturing method provided by the embodiments of the present application makes the required circuit on the back surface of the substrate 3 by means of attaching the metal wire driving circuit film 2, and makes a plurality of interconnection lines connected between the display circuit and the metal wire driving circuit film 2 by winding from the front surface of the substrate 3 to the back surface of the substrate 3 through the side surface of the substrate 3 and climbing the slope 1 on the slope 1 by printing, so as to obtain a display module, thereby reducing the manufacturing cost of the display module; further, since the required circuit is made on the back surface of the substrate 3 by means of attaching the metal wire driving circuit film 2, there is a step surface 4 on the back surface of the substrate 3 compared with the metal wire driving circuit film 2, if the interconnection lines are directly printed and climbed through the step surface 4, the printing lines are prone to accumulate and expand and collapse due to the too large slope of the step surface 4, thereby reducing the production yield of the display module, and the negative impact of this situation is particularly obvious in the manufacturing process of the display module with smaller interconnection line spacing; therefore, in the display module manufacturing method provided by the embodiments of the present application, the slope 1 is made by printing on the back surface of the substrate 3 and close to the position of the step surface 4 on the back surface of the substrate 3 compared with the metal wire driving circuit film 2, which connects the top edge of the step surface 4 and the back surface of the substrate 3, and the interconnection lines are connected between the display circuit and the metal wire driving circuit film 2 by climbing the slope 1, thereby avoiding the situation that the printing lines accumulate and expand and collapse due to the too large slope of the step surface 4, and thereby providing the possibility of manufacturing the display module with smaller interconnection line spacing.

[0063] As shown in Figure 2 , the slope 1 can take different shapes, including a ramp-shaped slope 1, an arc-shaped slope 1, all of which can achieve the above technical effects. However, it should be noted that in the following embodiments of the present specification, if the slope inclination angle and the oblique climbing angle of the interconnection line are mentioned, it means that a ramp-shaped slope 1 is adopted, that is, Figure 2 the slope shape shown in Figure 2 .

[0064] As shown in Figure 3 , the slope 1 can take different shapes, including a ramp-shaped slope 1, an arc-shaped slope 1, all of which can achieve the above technical effects. However, it should be noted that in the following embodiments of the present specification, if the slope inclination angle and the oblique climbing angle of the interconnection line are mentioned, it means that a ramp-shaped slope 1 is adopted, that is, Figure 2 the slope shape shown in .

[0065] In an embodiment of the present specification, the display circuit is made on the front body of the substrate 3, including:

[0066] The display circuit is made on the front body of the substrate 3 by exposure and development and laser etching.

[0067] Since the front circuit of the display module is often more complex, it contains small feature sizes and accurate patterns. Exposure and development and laser etching are accurate patterning processes that can be used to make very small lines and pitches to meet the requirements of high-density integrated circuits. Therefore, the display circuit is still made on the front body of the substrate 3 by exposure and development and laser etching. For the circuit on the back of the display module for driving the display circuit, the display module manufacturing method provided in the embodiment of the present specification is used to complete the manufacturing by attaching the metal wire driving circuit film 2. For the line used to connect the display circuit and the metal wire driving circuit film 2, the display module manufacturing method provided in the embodiment of the present specification is used to realize the manufacturing by printing the line. Further, on the basis of ensuring the accuracy of the display module product, the production cost is reduced.

[0068] In an embodiment of the present specification, the oblique climbing angles of the plurality of interconnection lines are equal when they are obliquely climbing on the slope 1.

[0069] Before the metal wire driving circuit film 2 is connected to the back of the substrate 3 by the attaching method, it further includes:

[0070] Obtaining the display circuit position of the display circuit on the front of the substrate 3;

[0071] Obtaining the design value of the slope 1 inclination angle (the slope 1 inclination angle is the angle between the slope 1 and the horizontal plane) and the design value of the oblique climbing angle of the interconnection line (the oblique climbing angle is the angle between the direction of the interconnection line and the inclination direction of the slope 1);

[0072] Referring to Figure 4 As shown in the figure, the metal wire driving circuit film 2 is connected to the reverse side of the substrate 3 by the attaching method, and includes:

[0073] Step 402, obtaining the height of the stepped surface 4;

[0074] Step 404, obtaining the attachment offset based on the design value of the slope inclination angle, the design value of the oblique climbing angle of the interconnection line, and the height of the stepped surface;

[0075] Step 406, obtaining the attachment position of the metal wire driving circuit film 2 on the reverse side of the substrate 3 based on the display circuit position on the front side of the substrate 3 and the attachment offset;

[0076] Step 408, connecting the metal wire driving circuit film 2 to the reverse side of the substrate by the attaching method based on the attachment position of the metal wire driving circuit film 2 on the reverse side of the substrate 3.

[0077] It can be understood that if the printing length of the interconnection line is shorter, the setting position of the metal wire driving circuit film 2 on the reverse side of the substrate 3 needs to be set based on the position of the display circuit on the front side of the substrate 3. In the display module manufacturing method provided in the embodiment of the present application, since the interconnection line adopts the oblique climbing method, the interconnection line has a certain degree of offset compared to the original connection path. Therefore, in the display module manufacturing method provided in the embodiment of the present application, the attachment position of the metal wire driving circuit film 2 on the reverse side of the substrate 3 needs to be based not only on the position of the display circuit on the front side of the substrate 3, but also on the offset of the interconnection line due to the oblique climbing. In order to ensure the consistency of the offset of all interconnection lines, the oblique climbing angle of the multiple interconnection lines when climbing obliquely on the slope 1 is also limited to be equal.

[0078] Referring to Figure 5 As shown in the figure, in one embodiment of the present application, the attachment offset is obtained based on the design value of the slope inclination angle, the design value of the oblique climbing angle of the interconnection line, and the height of the stepped surface, and includes:

[0079] Step 502, obtaining the climbing distance required for climbing from the bottom of the slope to the top of the slope along the inclination direction of the slope based on the design value of the slope inclination angle and the height of the stepped surface;

[0080] Step 504, based on the interconnection line inclined ramp angle design value, the required climbing distance from the bottom of the ramp to the top of the ramp along the inclined direction of the ramp, the attachment offset is obtained.

[0081] It can be understood that the climbing distance X = △h / sinα, where α represents the slope inclination angle, and △h represents the height of the step surface.

[0082] The attachment offset ΔL = X*tanβ, where β represents the inclined ramping angle of the interconnection line on the slope 1.

[0083] In an embodiment of the present specification, the slope inclination angle design value and the inclined ramping angle design value of the interconnection line include:

[0084] The viscosity of the printing material and the line spacing design parameter between the interconnection lines are obtained.

[0085] Based on the viscosity of the printing material and the line spacing design parameter between the interconnection lines, the slope inclination angle design value and the inclined ramping angle design value of the interconnection line are obtained.

[0086] It can be understood that the viscosity of the printing material will affect the shape retention ability of the line on the slope, and the line spacing design parameter between the interconnection lines is different, and the shape retention ability of the printed line is different. Therefore, the display module manufacturing method provided in the embodiments of the present specification obtains the slope inclination angle design value and the inclined ramping angle design value of the interconnection line based on the viscosity of the printing material and the line spacing design parameter between the interconnection lines, so as to avoid the phenomenon of accumulation expansion or collapse of the printed line on the slope 1.

[0087] Specifically, a parameter design table can be obtained in advance, and the parameter design table has a plurality of design parameter groups, each design parameter group has corresponding printing material viscosity parameters, line spacing design parameters, slope inclination angle parameters, and inclined ramping angle parameters of the interconnection line. The parameter design in any design parameter group can avoid the phenomenon of accumulation expansion or collapse of the printed line on the slope 1 or can avoid the situation that the line spacing design parameter cannot be realized due to the phenomenon of accumulation expansion or collapse of the printed line on the slope 1. A plurality of design parameter groups can be obtained through a plurality of experiments in advance.

[0088] Therefore, in the embodiments of the present specification, the step of manufacturing the connection step surface 4 top edge and the slope 1 on the back of the substrate 3 close to the metal wire driving circuit film 2 on the back of the substrate 3 by printing includes:

[0089] Based on the display circuit position of the display circuit on the front of the substrate 3, the slope 1 manufacturing position parameter on the back of the substrate 3 is obtained.

[0090] Based on the slope manufacturing position parameter of the slope 1 on the back surface of the substrate 3 and the design value of the slope inclination angle, the top edge of the step 4 and the slope 1 on the back surface of the substrate 3 are manufactured by printing at the position close to the step 4 on the back surface of the substrate 3 compared with the metal wire driving circuit film 2 on the back surface of the substrate 3.

[0091] When the plurality of interconnection lines connecting the display circuit and the metal wire driving circuit film 2 are manufactured by printing from the front surface of the substrate 3 to the back surface of the substrate 3 and by climbing the slope 2 in a slanting way, the interconnection lines are manufactured based on the design value of the slanting climbing angle.

[0092] In one embodiment of the present specification, tan β ≤ 2, wherein β represents the slanting climbing angle of the interconnection lines climbing the slope 1 in a slanting way.

[0093] It can be understood that the slanting climbing angle cannot be too large, and too large will cause the printed line material to collapse.

[0094] In one embodiment of the present specification, 5 ≥ tan α ≥ 1 / 5, wherein α represents the slope inclination angle.

[0095] It can be understood that the slope inclination angle cannot be too small or too large, and too large will cause the printed line material to expand or collapse, and too small will cause the volume of the slope 1 to be too large.

[0096] In one embodiment of the present specification, the slope inclination angle is larger than the slanting climbing angle of the interconnection lines climbing the slope 1 in a slanting way.

[0097] It can be understood that the slope inclination angle is larger than the slanting climbing angle of the interconnection lines, which can further avoid the printed line material to expand or collapse.

[0098] That is, the slanting climbing angle and the slope inclination angle are limited accordingly to avoid the printed line to expand or collapse on the slope 1 and to avoid the volume of the slope 1 to be too large.

[0099] The above describes specific embodiments of the present specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order other than the order in which they are recited and still achieve desirable results. In addition, the processes depicted in the figures do not necessarily require the particular order shown, or sequential order, to achieve the desired results. In certain implementations, multitasking and parallel processing can be advantageous.

[0100] The display module manufacturing device is manufactured based on the display module manufacturing method in the above embodiment, and has the following characteristics.

[0101] The first manufacturing module is configured to manufacture the display circuit on the front surface of the substrate 3.

[0102] The attaching module is configured to attach the obtained metal wire driving circuit film 2 to the back surface of the substrate 3 by an attaching method.

[0103] The second manufacturing module is configured to manufacture the slope 1 on the back surface of the substrate 3 and close to the top edge of the step surface 4 and the back surface of the substrate 3 by a printing method.

[0104] The second manufacturing module is further configured to manufacture a plurality of interconnection lines by a printing method, so as to realize the connection between the display circuit and the metal wire driving circuit film 2, and to obtain the display module.

[0105] The display device includes the display module manufactured by the display module manufacturing method in the above embodiment. The display device can be, but is not limited to, a display screen or a mobile phone or an iPad with a display screen.

[0106] Please refer to Figure 6 The electronic device 600 provided by the embodiment of the present application is shown in a structural schematic diagram of an electronic device.

[0107] As Figure 6 shown, the electronic device 600 can include at least one processor 601, at least one network interface 604, a user interface 603, a memory 605, and at least one communication bus 602.

[0108] The communication bus 602 can be used to realize the connection and communication of the above-mentioned components.

[0109] The user interface 603 can include a key, and the optional user interface can further include a standard wired interface and a wireless interface.

[0110] The network interface 604 can include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, etc.

[0111] The processor 601 can include one or more processing cores. The processor 601 connects various parts within the entire electronic device 600 by various interfaces and lines, executes various functions of the electronic device 600 and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 605, and calling data stored in the memory 605. Optionally, the processor 601 can be implemented in at least one hardware form of a DSP, an FPGA, and a PLC. The processor 601 can integrate one or a combination of a CPU, a GPU, and a modem. Among them, the CPU mainly processes operating systems, user interfaces, and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; and the modem is used for processing wireless communication. It can be understood that the above-mentioned modem can also not be integrated into the processor 601, but can be realized by a separate chip.

[0112] The memory 605 can include a RAM and can also include a ROM. Optionally, the memory 605 includes a non-transitory computer readable medium. The memory 605 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 605 can include a program storage area and a data storage area, wherein the program storage area can store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area can store data involved in the above-mentioned various method embodiments, etc. The memory 605 can also be at least one storage device located away from the aforementioned processor 601. The memory 605 as a computer storage medium can include an operating system, a network communication module, a user interface module, and a display module manufacturing application. The processor 601 can be used to call the display module manufacturing application stored in the memory 605, and execute the steps of the display module manufacturing method mentioned in the above-mentioned embodiments.

[0113] The embodiments of the present specification also provide a computer readable storage medium, which stores instructions, when running on a computer or a processor, causes the computer or the processor to execute the steps of one or more of the above-mentioned display module manufacturing method embodiments. The above-mentioned constituent modules of the electronic device, if realized in the form of a software function unit and sold or used as an independent product, can be stored in the computer readable storage medium.

[0114] In the above embodiments, all or part of the methods can be implemented by software, hardware, firmware, or any combination thereof. When implemented by software, all or part of the methods can be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the specification are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in or transmitted by a computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center through a wired (such as a coaxial cable, an optical fiber, a digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) manner. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that includes one or more available media sets. The available media can be a magnetic medium (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a digital versatile disc (DVD)), or a semiconductor medium (such as a solid state disk (SSD)), etc.

[0115] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by a computer program instructing related hardware, which can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiments. The storage medium includes ROM, RAM, magnetic or optical disks, and various program code storage media. In the case of no conflict, the technical features in the embodiments and the embodiments can be combined arbitrarily.

[0116] The above-described embodiments are merely described as the preferred embodiments of the specification, and do not limit the scope of the specification. Without departing from the design spirit of the specification, various modifications and improvements of the technical solutions of the specification made by a person of ordinary skill in the art should fall within the protection scope determined by the claims of the specification.

Claims

1. A method for manufacturing a display module, characterized in that, include: The display circuit is fabricated on the front side of the substrate. A metal wire driving circuit film is obtained and attached to the reverse side of a substrate by an adhesive method. A slope connecting the top edge of the discontinuity surface and the back of the substrate is created on the reverse side of the substrate and at the position of the discontinuity surface of the metal wire driving circuit film relative to the reverse side of the substrate by printing. A display module is manufactured by printing multiple interconnect lines that run from the front to the back of the substrate along the side of the substrate and climb the slope to connect the display circuit and the metal wire drive circuit film. When multiple interconnected lines climb a slope, the angle of incline is equal. Before attaching the metal wire driving circuit film to the reverse side of the substrate by bonding, the method further includes: Obtain the position of the display circuit on the front side of the substrate; Obtain the design values ​​for the slope inclination angle and the design values ​​for the slope ramp angle of the interconnecting lines; The method of attaching the metal wire driving circuit film to the reverse side of the substrate by means of bonding includes: Obtain the height of the fault surface; The attachment offset is obtained based on the design values ​​of the slope inclination angle, the design values ​​of the slope climbing angle of the interconnection line, and the height of the discontinuity surface. Based on the position and attachment offset of the display circuit on the front side of the substrate, the attachment position of the metal wire driving circuit film on the back side of the substrate is obtained. Based on the attachment position of the metal wire driving circuit film on the reverse side of the substrate, the metal wire driving circuit film is attached to the reverse side of the substrate by an attachment method.

2. The method for manufacturing a display module according to claim 1, characterized in that, The fabrication of the display circuit on the front side of the substrate includes: Display circuits are fabricated on the front side of a substrate using exposure development and laser etching methods.

3. The method for manufacturing a display module according to claim 1, characterized in that, The method of obtaining the attachment offset based on the design value of the slope inclination angle, the design value of the inclined ramp angle of the interconnecting line, and the height of the discontinuity surface includes: Based on the design value of the slope inclination angle and the height of the discontinuity surface, the required climbing distance from the bottom of the slope to the top of the slope along the slope inclination direction is obtained. The attachment offset is obtained based on the design value of the inclined ramp angle of the interconnection line and the required climbing distance from the bottom of the ramp to the top of the ramp along the slope direction.

4. The method for manufacturing a display module according to claim 1, characterized in that, The process of obtaining the design values ​​for the slope inclination angle and the design values ​​for the inclined ramp angle of the interconnecting lines includes: Obtain the viscosity of the printing material and the design parameters for the line spacing between interconnect lines; Based on the viscosity of the printing material and the design parameters of the line spacing between interconnects, the design values ​​of the slope inclination angle and the slope climbing angle of the interconnects are obtained.

5. A method for manufacturing a display module according to claim 4, characterized in that, The step of creating a slope connecting the top edge of the break surface and the back surface of the substrate by printing on the reverse side of the substrate and at the break surface position of the metal wire driving circuit film relative to the reverse side of the substrate includes: Based on the position of the display circuit on the front side of the substrate, the slope fabrication position parameters on the back side of the substrate are obtained. Based on the slope fabrication location parameters and slope tilt angle design values ​​on the reverse side of the substrate, a slope connecting the top edge of the discontinuity surface and the reverse side of the substrate is fabricated on the reverse side of the substrate and close to the position of the metal wire driving circuit film relative to the discontinuity surface on the reverse side of the substrate by printing.

6. A method for manufacturing a display module according to claim 4, characterized in that, When fabricating multiple interconnect lines by printing, which run from the front side of the substrate to the back side and climb the slope to connect the display circuit and the metal wire driving circuit film, the fabrication is based on the design value of the slope angle of the interconnect lines.

7. A display module manufacturing apparatus, based on the display module manufacturing method according to any one of claims 1 to 6, characterized in that, include: The first manufacturing module is used to manufacture display circuits on the front side of the substrate. The attachment module is used to attach the obtained metal wire driving circuit film to the back of the substrate by an attachment method. The second manufacturing module is used to create a slope connecting the top edge of the discontinuity surface and the back of the substrate by printing on the reverse side of the substrate and at the position of the discontinuity surface of the metal wire driving circuit film relative to the reverse side of the substrate. The second manufacturing module is also used to manufacture multiple interconnect lines by printing, which run from the front side of the substrate to the back side of the substrate and climb the slope to connect the display circuit and the metal wire driving circuit film, so as to manufacture the display module.

8. A display device, characterized in that, The display device includes a display module manufactured by a display module manufacturing method as described in any one of claims 1 to 6.

9. An electronic device, characterized in that, Including the processor and memory; The processor is connected to the memory; The memory is used to store executable program code; The processor runs a program corresponding to the executable program code stored in the memory to perform the method as described in any one of claims 1 to 6.

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