Configuration method

Abstract

The invention discloses a configuration method, and relates to the field of control, and the method comprises the steps: configuring a first heat dissipation mode or a second heat dissipation mode as a heat dissipation mode of electronic equipment, each heat dissipation mode comprises different control tables, each control table comprises switchable operation parameters, and the operation parameters represent the heat dissipation capability of the heat dissipation mode, the operation parameters in different control tables maintain different target durations every time the operation parameters are switched, the lower limit values in the operation parameters in all the control tables are different, the first target duration is larger than the second target duration, and the lower limit value of any operation parameter in the first control table is smaller than the lower limit value of any operation parameter in the second control table.

Description

Technical Field

[0001] The present application relates to the field of control, and in particular to a configuration method. Background Art

[0002] When electronic equipment is in operation, its components generate heat, causing the internal temperature of the electronic equipment to rise. Fans are generally used to cool the electronic equipment.

[0003] In the related art, in order to avoid the huge noise generated during the fan rotation process, the board end temperature is used to control the fan speed. Moreover, in order to improve the problem of sudden increase in noise caused by the increase in fan speed, multiple fan speed adjustments are set when the fan speed is increased. The speeds of adjacent fans are increased in turn, and the delay time of the fan adjustment is controlled after each adjustment of the fan speed to reduce the problem of too fast jumping between different speeds.

[0004] However, when there is a sudden high power demand, the component responds to the sudden high power, and the fan suddenly increases its speed following the sudden high power. The fan speed is positively correlated with the noise it generates. When the fan suddenly increases its speed, the noise generated suddenly increases, resulting in a poor user experience. Summary of the invention

[0005] The first aspect of the present application provides a configuration method, comprising:

[0006] Configure a first heat dissipation mode or a second heat dissipation mode as a heat dissipation mode of the electronic device, wherein the first heat dissipation mode includes a first control table, and the second heat dissipation mode includes a second control table;

[0007] The first control table includes N first operating parameters that are switchable and different from each other, wherein N is greater than 1, and each switch of the N first operating parameters maintains a first target duration, and the lower limit value of each of the N first operating parameters is a first value,

[0008] The second control table includes M second operating parameters that are switchable and different from each other, wherein M is greater than 1, and each switch of the M second operating parameters maintains a second target duration, and the lower limit value of each second operating parameter in the M second operating parameters is a second value, and M is the same as or different from N, and the first operating parameter and the second operating parameter characterize the heat dissipation capacity of the heat dissipation mode;

[0009] The first target duration is greater than the second target duration, and any one of the first values ​​in the first control table is less than any one of the second values ​​in the second control table.

[0010] In a possible implementation, configuring the first heat dissipation mode or the second heat dissipation mode as a heat dissipation mode of the electronic device includes:

[0011] Based on the target information satisfying the first condition, the heat dissipation module is controlled to operate in the first heat dissipation mode, or

[0012] Based on the target information satisfying the second condition, the heat dissipation module is controlled to operate in the second heat dissipation mode, the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition, and the target information can represent the heat dissipation requirement of the target device in the electronic device.

[0013] In a possible implementation, controlling the heat dissipation module to operate in the first heat dissipation mode based on the target information satisfying the first condition includes:

[0014] Determine the current operation mode of the electronic device; in different operation modes, the load supported by the electronic device is different, the first target durations corresponding to different operation modes are different, and the first target duration corresponding to the operation mode is negatively correlated with the load supported by the electronic device;

[0015] Based on the target information satisfying a first condition, determining a first heat dissipation mode corresponding to the current operating mode;

[0016] Obtain a first control table corresponding to a first heat dissipation mode of the current operation mode;

[0017] The operating parameters of the heat dissipation module are switched based on the first operating parameters in the first control table, and the first target duration is maintained after each switching.

[0018] In a possible implementation, it includes:

[0019] Based on the target information, determining a change in the target information within a preset time period, wherein the target information is more consistent with the heat dissipation requirement of the target device than any operating information is consistent with the heat dissipation requirement of the target device;

[0020] Based on the change satisfying the triggering condition of the first heat dissipation mode, determining that the target information satisfies the first condition, or

[0021] Based on the change satisfying the triggering condition of the second heat dissipation mode, it is determined that the target information satisfies the second condition, and the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition.

[0022] In a possible implementation, it includes:

[0023] Obtaining multiple operation information of a target device in an electronic device;

[0024] The target information is determined based on a combination of at least two of the multiple pieces of operating information, different operating information determines different target information, and the target information can characterize the heat dissipation requirements of the target device; the target information is used to control the operation of the heat dissipation module in the electronic device.

[0025] In a possible implementation, it includes:

[0026] Obtaining operation information of a target device in at least two operation scenarios;

[0027] Determining at least one relevant information of the target device based on the operation information of the target device;

[0028] Determine changes in relevant information of the target device between a first operating scenario and a second operating scenario, where a heat dissipation requirement of the first operating scenario is different from a heat dissipation requirement of the second operating scenario;

[0029] Based on the fact that a change in any relevant information between the first operation scenario and the second operation scenario is greater than a set change amount, the any relevant information is determined to be target information.

[0030] In a possible implementation, determining, based on the at least two pieces of operation information, changes in the target information within a preset time period includes:

[0031] determining a temperature difference based on a target device temperature and a board end temperature of a circuit board, wherein the target device is arranged on the circuit board, and the operation information includes the target device temperature and the board end temperature;

[0032] Determine how the temperature difference changes over a preset time period.

[0033] In a possible implementation, it includes:

[0034] In the process of controlling the heat dissipation module to operate in the first heat dissipation mode, based on the specific operating parameter of the target device being greater than a set threshold, real-time statistics are collected on the duration of the specific operating parameter being greater than the set threshold;

[0035] If the duration is longer than the first set duration, adjusting the operating parameters of the heat dissipation module based on the specific operating parameters;

[0036] If the duration is not greater than the first set duration, responding to the specific operating parameter is prohibited.

[0037] In a possible implementation, adjusting the operating parameters of the heat dissipation module based on the specific operating parameters includes:

[0038] Based on the duration of switching to any first operating parameter reaching the first target duration, based on the specific operating parameter, the step of obtaining the operating information of the target device in the electronic device is triggered.

[0039] In a possible implementation, it includes:

[0040] receiving a switching instruction;

[0041] Based on the switching instruction indicating switching to the first heat dissipation mode, controlling the heat dissipation module of the electronic device to operate in the first heat dissipation mode;

[0042] Based on the switching instruction representation switching to the second heat dissipation mode, the heat dissipation module of the electronic device is controlled to operate in the second heat dissipation mode, and the load supported by the electronic device in the second heat dissipation mode is higher than the load supported in the first heat dissipation mode.

[0043] A second aspect of the present application provides a configuration device, for:

[0044] Configure a first heat dissipation mode or a second heat dissipation mode as a heat dissipation mode of the electronic device, wherein the first heat dissipation mode includes a first control table, and the second heat dissipation mode includes a second control table;

[0045] The first control table includes N first operating parameters that are switchable and different from each other, wherein N is greater than 1, each switch of the N first operating parameters maintains a first target duration, and the lower limit value of each of the N first operating parameters is a first value,

[0046] The second control table includes M second operating parameters that are switchable and different from each other, wherein M is greater than 1, and each switch of the M second operating parameters maintains a second target duration, and the lower limit value of each second operating parameter in the M second operating parameters is a second value, and M is the same as or different from N, and the first operating parameter and the second operating parameter characterize the heat dissipation capacity of the heat dissipation mode;

[0047] The first target duration is greater than the second target duration, and any one of the first values ​​in the first control table is less than any one of the second values ​​in the second control table.

[0048] A third aspect of the present application provides a computer program product, comprising computer-readable instructions. When the computer-readable instructions are executed on an electronic device, the electronic device implements the configuration method of the first aspect or any implementation manner of the first aspect.

[0049] A fourth aspect of the present application provides an electronic device, comprising at least one processor and a memory connected to the processor, wherein:

[0050] The memory is used to store computer programs;

[0051] The processor is used to execute the computer program so that the electronic device can implement the configuration method of the above-mentioned first aspect or any implementation manner of the first aspect.

[0052] A fifth aspect of the present application provides a computer storage medium, which carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can be configured according to the first aspect or any implementation method of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0054] Figure 1 It is a schematic diagram of the structure of an electronic device of a configuration method provided in an embodiment of the present application;

[0055] Figure 2 It is a schematic diagram of a process of controlling a heat dissipation module based on target information provided by an embodiment of the present application;

[0056] Figure 3 It is a flow chart of controlling the heat dissipation module to operate in the first heat dissipation mode based on the operation information satisfying the first condition provided by an embodiment of the present application;

[0057] Figure 4 It is a flowchart of a process of determining whether target information satisfies the first condition or the second condition provided in an embodiment of the present application;

[0058] Figure 5 It is a schematic diagram of a process for determining target information based on operation information of a target device in an electronic device provided by an embodiment of the present application;

[0059] Figure 6 It is a flowchart of analyzing multiple pieces of operation information in different operation scenarios in advance and selecting target information provided by an embodiment of the present application;

[0060] Figure 7 It is a curve diagram of the combination of operation information and target information of two operation scenarios provided in an embodiment of the present application;

[0061] Figure 8 It is a curve diagram of the combination of operation information and target information of two operation scenarios provided in the embodiment of the present application and the corresponding operation parameters;

[0062] Fig. 9It is a flowchart of analyzing target information and determining changes in the target information within a preset time period provided by an embodiment of the present application;

[0063] Fig.10 is another structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0064] Fig.11 is a curve diagram of operation information and target information in an application scenario provided by an embodiment of the present application;

[0065] Fig.12 It is a flow chart of determining a response method to a sudden high power consumption heat dissipation demand when a heat dissipation module is operating in a first heat dissipation mode, provided by an embodiment of the present application;

[0066] Fig.13 is a schematic diagram of a flow chart of switching an operating mode of an electronic device provided in an embodiment of the present application;

[0067] Fig.14 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0068] The following describes the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation method section of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0069] The embodiments of the present application are described below in conjunction with the accompanying drawings. Those skilled in the art will appreciate that, with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0070] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and need not be used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is only to describe the distinction mode adopted by the objects of the same attributes when describing in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0071] An embodiment of the present application provides a configuration method, which can be applied to an electronic device. The electronic device includes a heat dissipation module, and the heat dissipation module is used to dissipate heat for the electronic device.

[0072] Figure 1It is a schematic diagram of the structure of an electronic device of a configuration method provided in an embodiment of the present application, including a target device 101, a heat dissipation module 102 and a functional module 103. The target device 101 may be a device to be cooled, the heat dissipation module 102 may be a structure for cooling the target device, and the functional module 103 may be a module to which the configuration method provided in an embodiment of the present application is applied. The configuration method performed by the functional module is described in detail below.

[0073] The configuration method includes:

[0074] The first heat dissipation mode or the second heat dissipation mode may be configured as a heat dissipation mode of the electronic device, the first heat dissipation mode includes a first control table, and the second heat dissipation mode includes a second control table;

[0075] The first control table includes N first operating parameters that are switchable and different from each other, where N is greater than 1, and each switch of the N first operating parameters maintains a first target duration, and the lower limit value of each of the N first operating parameters is a first value,

[0076] The second control table includes M second operating parameters that are switchable and different from each other, where M is greater than 1, the M second operating parameters are switched to maintain a second target duration each time, the lower limit value of each second operating parameter in the M second operating parameters is a second value, M is the same as or different from N, and the first operating parameter and the second operating parameter characterize the heat dissipation capacity of the heat dissipation mode;

[0077] The first target duration may be greater than the second target duration, and any first value in the first control table may be less than any second value in the second control table.

[0078] In a possible implementation, the first heat dissipation mode or the second heat dissipation mode may be configured to dissipate heat for the electronic device in response to a switching instruction of the heat dissipation mode of the electronic device.

[0079] In a possible implementation, the heat dissipation mode of the electronic device may be automatically switched to improve the heat dissipation efficiency of the electronic device.

[0080] The heat dissipation mode of the electronic device can be configured as a first heat dissipation mode or a second heat dissipation mode, and each heat dissipation mode includes a corresponding control table, and the control tables of different heat dissipation modes are different.

[0081] Among them, under different operating parameters, when the electronic device uses different operating parameters for heat dissipation, the noise generated is different. Generally, the larger the value of the operating parameter, the greater the noise generated.

[0082] As an example, the heat dissipation module of the electronic device uses a fan, and the operating parameter is the fan speed. The higher the fan speed, the greater the noise generated, and the lower the fan speed, the lower the noise generated.

[0083] Among them, the first control table includes N first operating parameters that are different from each other, and the N first operating parameters can be arranged in a set order, and the set order can be in an ascending order. Accordingly, in the process of heat dissipation of the electronic device using the first heat dissipation mode, the first operating parameters in the first control table can be switched in sequence, and the first operating parameters are maintained for the first target duration each time they are switched.

[0084] Among them, the first control table set for the first heat dissipation mode includes a plurality of first operating parameters, and the first operating parameters are parameters for controlling the operation of the heat dissipation module in the first heat dissipation mode.

[0085] As an example, when the heat dissipation module is a fan, the first operating parameter may be the fan speed. When the heat dissipation module includes multiple fans, the first operating parameter may include the speed of each of the multiple fans.

[0086] The first control table includes N switchable first operating parameters that are different from each other, and the N first operating parameters that are different from each other can be arranged in a set order.

[0087] In a possible implementation, the setting order may be from small to large.

[0088] Each of the first operating parameters may include a plurality of values, each value corresponds to a structure in the heat dissipation module, and the operation is controlled by using the corresponding value for the structure.

[0089] As an example, when the heat dissipation module includes two fans, the first operating parameter may include the rotation speed of each fan, and the rotation speeds of the two fans may be different.

[0090] The first operating parameter maintains the first target duration each time it is switched, and after the heat dissipation module adopts the first operating parameter to switch, the first target duration is maintained unchanged.

[0091] In a possible implementation, the first target duration may be added to the first control table.

[0092] Wherein, when the heat dissipation module adopts the first heat dissipation mode, the first operating parameters in the first control table may be used to control the operating parameters of the heat dissipation module to switch.

[0093] As an example, the speed of each fan in Table 1 may be used to switch the speed of the corresponding fan, and the set first target duration may be maintained after each switch.

[0094] Among them, maintaining the first target time length means not switching the fan speed within the first target time length, and switching is performed after the first target time length ends. The switch is the operating parameter value of the next step in the first control table, and can also be switching the cooling mode, which is not limited in this application.

[0095] Table 1 below shows a control table of a first heat dissipation mode. The heat dissipation module includes two fans (Fan 1 and Fan 2). The first control table includes control speeds of the two fans.

[0096] Table 1

[0097]

[0098] Among them, in Table 1, when the heat dissipation module is controlled to enter the first operation mode, the fan speed can be controlled and switched according to the step sequence in Table 1 above.

[0099] As an example, when entering the first operating mode, the fan speed can be controlled starting from step n (n is any one of 1 to 9), and the fan speed can be controlled in sequence from step n, step n+1, step n+1... to gradually increase the speed corresponding to each step.

[0100] Among them, in the first control table, the lower limit of the speed of fan 1 is 1600 rpm, and the lower limit of the speed of fan 2 is 1700 rpm.

[0101] Correspondingly, in the first heat dissipation mode, the first target duration can be a longer duration, such as 8 seconds, 10 seconds, etc.

[0102] Among them, in the switching of the heat dissipation module, after fan 1 is switched from 1900 (rpm) to 2200 (rpm), fan 2 is switched from 2000 (rpm) to 2200 (rpm), and then maintained unchanged for 8 seconds. After 8 seconds, the fan speed is increased again, fan 1 is switched from 2200 (rpm) to 2300 (rpm), fan 2 is switched from 2200 (rpm) to 2400 (rpm), and so on. Each time the switching of the first operating parameter is completed, the first target duration is maintained.

[0103] A second control table is set for the second heat dissipation mode, and the second control table includes a plurality of second operating parameters, which are parameters for controlling the operation of the heat dissipation module in the second heat dissipation mode.

[0104] As an example, when the heat dissipation module is a fan, the second operating parameter may be a fan speed. When the heat dissipation module includes multiple fans, the second operating parameter includes a speed of each of the multiple fans.

[0105] The second control table includes M second operating parameters that are switchable and different from each other, and the M second operating parameters that are different from each other can be arranged in a set order.

[0106] In a possible implementation, the setting order may be from small to large.

[0107] Each of the second operating parameters may include a plurality of values, each value corresponds to a structure in the heat dissipation module, and the operation is controlled by using the corresponding value for the structure.

[0108] As an example, the heat dissipation module may include two fans, and the second operating parameter includes the rotational speed of each fan, and the rotational speeds of the two fans may be different.

[0109] The second operating parameter maintains the second target duration each time it is switched, and after the heat dissipation module adopts the second operating parameter switching, the second target duration can be maintained unchanged.

[0110] In a possible implementation, the second target duration may be added to the second control table.

[0111] Each first value in the first control table is smaller than the second value in the second control table.

[0112] Wherein, when the heat dissipation module adopts the second heat dissipation mode, the second operating parameters in the second control table may be used to control the operating parameters of the heat dissipation module to switch.

[0113] Table 2 below shows a control table of the second heat dissipation mode. The heat dissipation module includes two fans (Fan 1 and Fan 2), and the second control table includes control speeds of the two fans.

[0114] Table 2

[0115]

[0116] Among them, in Table 2, when the heat dissipation module is controlled to enter the second operation mode, the fan speed can be controlled and switched according to the step sequence in Table 2 above.

[0117] Among them, in the first control table, the lower limit of the speed of fan 1 is 1600 rpm, and the lower limit of the speed of fan 2 is 1700 rpm; in the second control table, the lower limit of the speed of fan 1 is 2500 rpm, and the lower limit of the speed of fan 2 is 2300 rpm.

[0118] As an example, the fan speeds in Table 2 may be used to switch the fan speeds, and the set second target time duration may be maintained after each switch.

[0119] Among them, maintaining the second target time length means not switching the fan speed within the second target time length, and switching is performed after the second target time length ends. The switch is the operating parameter value of the next step in the second control table, and can also be switching the cooling mode, which is not limited in this application.

[0120] Correspondingly, in the second heat dissipation mode, the second target duration can be a shorter duration, such as 4 seconds, 5 seconds, etc.

[0121] Among them, in the switching of the heat dissipation module, after fan 1 is switched from 2500 (rpm) to 2800 (rpm), fan 2 is switched from 2300 (rpm) to 2600 (rpm), and then maintained unchanged for 5 seconds. After 5 seconds, the fan speed is increased again, fan 1 is switched from 2800 (rpm) to 3100 (rpm), fan 2 is switched from 2600 (rpm) to 2900 (rpm), and so on. Each time the switching of the second operating parameters is completed, the second target duration is maintained.

[0122] Among them, two different heat dissipation modes, namely a first heat dissipation mode and a second heat dissipation mode, are set for the heat dissipation module of the electronic device. Any first value in the first control table of the first heat dissipation mode is smaller than any second value in the second control table. The sizes of the first value and the second value correspond to the heat dissipation capacity of the heat dissipation mode. The heat dissipation capacity of the first heat dissipation mode is smaller than the heat dissipation capacity of the second heat dissipation mode, and the first target duration of the first heat dissipation mode is greater than the second target duration of the second heat dissipation mode.

[0123] Since the heat dissipation module has a smaller heat dissipation capacity in the first heat dissipation mode, and correspondingly, the value of its operating parameter is smaller. Therefore, the sound generated during the heat dissipation process is smaller, and the overall noise of the electronic device can be kept low. By setting a longer target time, once there is a sudden demand for heat dissipation with high power consumption, the heat dissipation module maintains the first target time after switching the first operating parameter, and no longer switches the operating parameter within the first target time. Then, the heat dissipation module may not switch the operating parameter for the sudden demand for heat dissipation with high power consumption that lasts for a shorter period of time (shorter than the first target time). Therefore, for the heat dissipation module in the first heat dissipation mode, it can respond to the sudden demand for heat dissipation with high power consumption with a lower probability, maintain the noise of the electronic device at a lower volume, and make the electronic device quieter during use.

[0124] Since the heat dissipation capacity of the heat dissipation module is greater in the second heat dissipation mode, and correspondingly, the value of its operating parameter is greater, therefore, the sound generated during the heat dissipation process is louder, but the performance of the target device is better, and the performance of the electronic device can be maintained in a better state. By setting a shorter target time, once there is a sudden demand for heat dissipation with high power consumption, the heat dissipation module will maintain the second target time after switching the second operating parameters, and will no longer switch the operating parameters within the second target time. Then, the heat dissipation module can respond to the sudden demand for heat dissipation with high power consumption of a shorter duration (shorter than the first target time and longer than the second target time) in a timely manner by switching the operating parameters. Therefore, for the heat dissipation module in the second heat dissipation mode, it can respond to the sudden demand for heat dissipation with high power consumption more quickly, so that the performance of the electronic device is maintained in a better state.

[0125] In this embodiment, the first heat dissipation mode or the second heat dissipation mode is configured as the heat dissipation mode of the electronic device. Different control tables are set for different heat dissipation modes. The first control table for the first heat dissipation mode includes N mutually different first operating parameters that can be switched, and the N first operating parameters maintain the first target time each time they are switched, and the lower limit value of each first operating parameter in the N first operating parameters is the first value; the second control table for the second heat dissipation mode includes M mutually different second operating parameters that can be switched, and the M second operating parameters maintain the second target time each time they are switched. The lower limit value of each second operating parameter among the M second operating parameters is a second value, M and N are the same or different positive integers, the first target duration is greater than the second target duration, any first value in the first control table is less than any second value in the second control table, and the first operating parameter with a lower lower limit value and a longer maintenance time are set in the first heat dissipation mode. When the heat dissipation module is in the first heat dissipation mode, the heat dissipation demand for responding to sudden high power consumption can be minimized, and the electronic device is quieter; when the second operating parameter with a higher lower limit value and a shorter maintenance time are set in the second heat dissipation mode, the heat dissipation module can quickly respond to sudden high power consumption heat dissipation demand when in the second heat dissipation mode, and the performance of the electronic device is maintained at a better level.

[0126] In a possible implementation, when the target information is determined, the heat dissipation module of the electronic device can be controlled to adopt one of the two heat dissipation modes for heat dissipation based on the target information. The specific implementation process is as follows Figure 2 shown.

[0127] Figure 2 It is a flow chart of controlling the heat dissipation module based on target information provided in an embodiment of the present application, which may include steps 201 to 202, and these steps are described in detail below.

[0128] 201. Based on the target information satisfying the first condition, the heat dissipation module may be controlled to operate in a first heat dissipation mode;

[0129] 202. Based on the target information satisfying the second condition, the heat dissipation module may be controlled to operate in a second heat dissipation mode. The heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition. The target information may represent the heat dissipation requirement of the target device in the electronic device.

[0130] The first condition and the second condition are preset, and the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition.

[0131] Among them, the first condition and the second condition correspond to different heat dissipation requirements. Accordingly, the first heat dissipation mode may be a heat dissipation capacity that can meet the heat dissipation requirement corresponding to the first condition, and the second heat dissipation mode may be a heat dissipation capacity that can meet the heat dissipation requirement corresponding to the second condition.

[0132] Among them, it can be judged whether the target information satisfies the first condition and the second condition first and second conditions, and the first and second conditions can be mutually exclusive conditions. If the target information satisfies the first condition, it can be determined that it does not satisfy the second condition; conversely, if the target information does not satisfy the first condition, it can be determined that it satisfies the second condition.

[0133] Among them, the operation information combination based on at least two of the multiple operation information determines that the target information meets the first condition, indicating that the heat dissipation demand of the target device during operation meets the first condition, and the heat dissipation demand of the target device is relatively small. Accordingly, the heat dissipation module can be controlled to operate in the first heat dissipation mode; when the determined target information meets the second condition, it indicates that the heat dissipation demand of the target device during operation meets the second condition, and the heat dissipation demand of the target device is relatively large. Accordingly, the heat dissipation module can be controlled to operate in the second heat dissipation mode.

[0134] In a possible implementation, the first condition and the second condition may be determined by setting a threshold value. When the target information is less than the set threshold value, it is determined that the first condition is met; when the target information is not less than the set threshold value, it is determined that the second condition is met.

[0135] In a possible implementation, in order to achieve more detailed control, more conditions can be set to be able to divide the heat dissipation requirements of the target device more finely. Accordingly, the heat dissipation module sets more corresponding heat dissipation modes to match the corresponding heat dissipation capabilities for various heat dissipation requirements.

[0136] In this embodiment, the first condition and the second condition represent that the target device has different heat dissipation requirements, determine the conditions (the first condition or the second condition) satisfied by the target information, and control the heat dissipation module to operate in different heat dissipation modes in response to different conditions, so that the heat dissipation mode corresponding to the heat dissipation requirement of the target device is adopted for heat dissipation, thereby achieving more accurate temperature control of the target device and improving the performance of the electronic device.

[0137] In a possible implementation, two heat dissipation modes can be controlled to be executed in the operation mode based on the operation mode of the electronic device. The specific implementation process is as follows Figure 3 shown.

[0138] Figure 3 The embodiment of the present application provides a flow chart of controlling the heat dissipation module to operate in the first heat dissipation mode based on the operation information satisfying the first condition, which may include steps 301 to 304, and these steps are described in detail below.

[0139] 301. Determine a current operation mode of the electronic device; in different operation modes, the load supported by the electronic device is different, and the first target durations corresponding to the different operation modes are different. The first target duration corresponding to the operation mode may be negatively correlated with the load supported by the electronic device;

[0140] The electronic device has different operating modes, and the loads supported by the electronic device are different in different operating modes.

[0141] The load supported by the electronic device is different, and the target duration in the control table corresponding to the corresponding operation mode is different, and the target duration may be negatively correlated with the load supported by the electronic device.

[0142] Among them, when the operating mode of the electronic device supports a lower load, the corresponding first target duration is longer, and when the operating mode of the electronic device supports a higher load, the corresponding first target duration is shorter.

[0143] Among them, since the operating mode of the electronic device supports a lower load, its load and noise are balanced and the noise can be reduced as much as possible. Therefore, in order to minimize its response to the sudden high power consumption heat dissipation demand to maintain the low-noise state, the first target duration corresponding to the first heat dissipation mode corresponding to the lower load adopts a longer time.

[0144] Among them, when the operation mode of the electronic device supports a higher load, it gives priority to performance. Although the first heat dissipation mode is adopted, it tries to maintain better performance relative to the operation mode supporting a lower load. Therefore, in order for it to quickly respond to sudden high-power heat dissipation requirements to maintain better performance. Compared with the first target duration corresponding to the first heat dissipation mode corresponding to the lower load, the first target duration corresponding to the first heat dissipation mode corresponding to the higher load can be a shorter time.

[0145] As an example, when the electronic device is in the first operating mode supporting low load, the first target duration is 10 seconds; and when the electronic device is in the second operating mode supporting high load, the first target duration is 8 seconds.

[0146] 302. Based on the target information satisfying the first condition, a first heat dissipation mode corresponding to the current operation mode may be determined;

[0147] Wherein, when the target information satisfies the first condition, the first heat dissipation mode corresponding to the current operating mode of the electronic device can be determined.

[0148] Wherein, when the current operation mode of the electronic device is a first operation mode supporting low power consumption, a first heat dissipation mode corresponding to the first operation mode may be determined.

[0149] Wherein, when the current operating mode of the electronic device is the second operating mode supporting high power consumption, the first heat dissipation mode corresponding to the second operating mode may be determined.

[0150] In a possible implementation, the same first condition may be used for judgment in different operation modes of the electronic device.

[0151] In one possible implementation, pre-use Figure 8 The process shown in , for different operating modes of the electronic device, determines the first condition and the second condition corresponding to the target information.

[0152] As an example, the first condition may be less than or equal to a preset threshold, and the second condition may be greater than a preset threshold.

[0153] 303. Obtain a first control table included in a first heat dissipation mode corresponding to the current operation mode.

[0154] After the first heat dissipation mode corresponding to the current operation mode is determined, a first control table included in the first heat dissipation mode corresponding to the current operation mode may be obtained.

[0155] The first control table includes a plurality of first operating parameters, and each switching of the first operating parameters maintains a first target duration.

[0156] In a possible implementation, the first control tables included in the first heat dissipation modes corresponding to different operation modes may be different.

[0157] As an example, in an operating mode that supports a lower load, the first control table may include a smaller portion of operating parameters, such as using steps 1-7 or steps 1-5 in Table 1, to support a lower lower limit value of the speed; and in an operating mode that supports a higher load, the first control table may include a larger portion of operating parameters, such as using steps 6-10 or steps 3-10 in Table 1, to support a higher lower limit value of the speed.

[0158] In a possible implementation, similar to obtaining the first control table included in the first heat dissipation mode, after determining the current operating mode of the electronic device, the second control table included in the second heat dissipation mode can be determined based on the operating information satisfying the second condition, which is not described in detail in this application.

[0159] Of course, since the purpose of the heat dissipation module adopts the second heat dissipation mode is to increase the heat dissipation to maintain the higher performance of the target device, in order to be able to quickly respond to sudden high-power heat dissipation requirements, the second duration of the two heat dissipation modes supporting low load and supporting high load can be set to be the same or different.

[0160] As an example, when the electronic device is in the first operating mode supporting a low load, the second target duration is 5 seconds; and when the electronic device is in the second operating mode supporting a high load, the second target duration is 4 seconds.

[0161] As an example, the electronic device is in a first operation mode supporting a low load and in a second operation mode supporting a high load, and the second target durations can both be 5 seconds.

[0162] In this embodiment, the current operation mode of the electronic device is determined; in different operation modes, the load supported by the electronic device is different, the first target durations corresponding to different operation modes are different, and the first target durations corresponding to the operation modes are negatively correlated with the load supported by the electronic device; based on the target information satisfying the first condition, the first heat dissipation mode corresponding to the current operation mode is determined; and the first control table included in the first heat dissipation mode corresponding to the current operation mode is obtained. For different operation modes of the electronic device, two different heat dissipation modes are set to more finely control the operation of the heat dissipation mode for the operation modes of the electronic device with different loads, so as to achieve accurate control of the heat dissipation of the target device.

[0163] In a possible implementation, it is possible to determine which condition is met based on the specific situation of the target information. The specific implementation process is as follows: Figure 4 shown.

[0164] Figure 4 It is a flowchart of the process of determining whether the target information meets the first condition or the second condition provided in an embodiment of the present application, which may include steps 401 to 403, and these steps are described in detail below.

[0165] 401. Based on the target information, it can be determined that the target information changes within a preset time period, and the fit between the target information and the heat dissipation requirement of the target device is higher than the fit between any operation information and the heat dissipation requirement of the target device;

[0166] The target information is analyzed and processed according to a preset time period to obtain changes in the target information.

[0167] The change may be that two different trends occur, and the two trends are continuous within the preset time period.

[0168] As an example, the target information can be calculated based on the values ​​of at least two pieces of operating information. The change can be that the value of the target information changes from a stable value to a gradual increase, or the value of the target information changes from a gradual increase to a gradual decrease and maintains a stable value, etc.

[0169] Among them, during the operation of the target device, changes in various operating information are affected by the heat dissipation requirements of the target device, and the degree of fit between the target information and the heat dissipation requirements of the target device is higher than the degree of fit between any operating information and the heat dissipation requirements of the target device. Therefore, using this target information, the heat dissipation requirements of the target device can be accurately determined, providing an accurate basis for the subsequent accurate selection of the heat dissipation mode.

[0170] The change of the target information is affected by the heat dissipation demand of the target device. Therefore, the change of the heat dissipation demand of the target device within the preset time period can be determined by using the change of the target information within the preset time period.

[0171] As an example, the target information can be determined by the target device temperature and the target device load. For example, the target information can be the ratio of the load value to the temperature value. When the current temperature of the target device is high but its load is also high, the value of the target information remains stable. When the current temperature of the target device is high but its load is reduced, the value of the target information becomes smaller. When the load of the target device is high, its heat dissipation demand is also high. When its load is reduced, even if its temperature is high, the ratio of the two becomes smaller, which is consistent with the lower heat dissipation demand of the target device. The heat dissipation demand can be determined by the change of the target information determined by the target device temperature and load. If only the temperature of the target device is used for judgment, when the load is reduced, because its temperature is maintained at a high temperature, it is impossible to accurately judge that the heat dissipation demand of the target device has begun to decrease; if only the load of the target device is used for judgment, when its load is reduced, if the temperature is still maintained at a high temperature, it is impossible to accurately judge whether the heat dissipation demand of the target device is still maintained at a high level and whether the heat dissipation demand is gradually reduced.

[0172] As an example, the target information can be determined by the target device temperature and the onboard temperature. For example, the target information can be the difference between the target device temperature and the onboard temperature. The change in the target information determined by the target device temperature and the onboard temperature can be used to determine the heat dissipation requirement. The difference can be used to determine the temperature difference between the circuit board temperature of the target device and the target device. Based on the difference, it can be determined whether the target device has a rapidly increasing temperature rise, so as to determine the change in the heat dissipation requirement of the target device within the preset time period. The implementation process is described in the subsequent embodiments.

[0173] 402. Based on the change condition satisfying the trigger condition of the first heat dissipation mode, it can be determined that the target information satisfies the first condition;

[0174] 403. Based on the change situation satisfying the triggering condition of the second heat dissipation mode, a second condition of the target information may be determined, and the heat dissipation requirement of the second condition may be greater than the heat dissipation requirement of the first condition.

[0175] The triggering condition of the first heat dissipation mode and the triggering condition of the second heat dissipation mode are preset.

[0176] Among them, the heat dissipation capacity of the first heat dissipation mode is relatively low, so its triggering condition can be set at a relatively low value; the heat dissipation capacity of the second heat dissipation mode is relatively high, so its triggering condition can be set at a relatively high value.

[0177] In one possible implementation, the trigger condition of the first heat dissipation mode may be that the change of the target information changes from a high-low change trend to maintaining a stable state, and the trigger condition of the second heat dissipation mode may be that the change of the target information changes from a stable state to a high-low change trend.

[0178] As an example, the trigger condition of the first cooling mode may be that the value of the target information is within a set range, such as less than a set threshold; the trigger condition of the second cooling mode may be that the value of the target information is not within the set range, such as not less than a set threshold.

[0179] Among them, if the change of the target information meets the trigger condition of the first heat dissipation mode, it indicates that the heat dissipation demand of the target device is low, and the first heat dissipation mode with lower heat dissipation capability can be adopted. If the change of the target information meets the trigger condition of the second heat dissipation mode, it indicates that the heat dissipation demand of the target device is high, and the second heat dissipation mode with higher heat dissipation capability can be adopted.

[0180] In this embodiment, based on the target information determined by using at least two pieces of operation information, the change of the target information within a preset time period is determined. If the change meets the trigger condition of the first heat dissipation mode, it is determined that the target information meets the first condition, and the heat dissipation module is controlled to operate in the first heat dissipation mode; if the change meets the trigger condition of the second heat dissipation mode, it is determined that the target information meets the second condition, and the heat dissipation module is controlled to operate in the second heat dissipation mode. Since the change of the target information of the target device reflects that the heat dissipation demand of the target device has changed, the change of the target information can be used to accurately determine its heat dissipation demand, and the corresponding heat dissipation mode is selected according to the heat dissipation demand, thereby realizing accurate selection of the heat dissipation mode.

[0181] In a possible implementation, the target information may be determined based on the operation information of the target device in the electronic device. The specific implementation process is as follows: Figure 5 shown.

[0182] Figure 5 It is a flowchart of determining target information based on the operating information of the target device in the electronic device provided by an embodiment of the present application, which may include steps 501 to 502, and these steps are described in detail below.

[0183] 501. Obtain multiple operation information of a target device in an electronic device;

[0184] During the operation of the electronic device, a target device may be detected to obtain multiple pieces of operation information of the target device.

[0185] The operation information may include various parameters used during the operation of the target device, various parameters generated, and parameters affected by the operation of the target device.

[0186] As an example, when the target device is an on-chip chip, the operating information of the target device may include chip temperature, chip current, chip power consumption, board temperature, board current, etc. The specific type of the operating information can be set according to actual conditions and is not limited in this application.

[0187] As an example, when the target device is an independent component, the operation information of the target device may include the independent component temperature, independent component current, independent component ambient temperature, etc. The specific type of the operation information can be set according to actual conditions and is not limited in this application.

[0188] Among them, various types of operation information to be obtained can be predetermined, and obtained according to a set detection cycle during the operation of the target device.

[0189] 502. Determine target information based on a combination of at least two pieces of operation information among the multiple pieces of operation information. Different operation information may determine different target information. The target information may represent the heat dissipation requirement of the target device. The target information may be used to control the operation of a heat dissipation module in the electronic device.

[0190] Among them, from the multiple pieces of operation information obtained, the multiple pieces of operation information can be combined to determine the target information using the operation information in the combination, and the operation information that can be combined can include two or more pieces of operation information.

[0191] The combined operation information may be processed to determine the target information, and different combinations of operation information may determine different target information.

[0192] As an example, when the target device is an on-chip chip, the operating information of the target device may include chip temperature, chip current, chip power consumption, board temperature, board current, etc., and the chip temperature and chip current may be used to determine target information, or the chip temperature and board temperature may be used to determine target information, or the chip load and board temperature may be used to determine target information, or the chip temperature, chip current, chip power consumption, board temperature may be used to determine target information, etc.

[0193] The target information is determined by each piece of operation information in the operation information combination, and may be target information obtained by calculating the operation information using a specific calculation method.

[0194] As an example, the specific calculation method may be one or a combination of two or more mathematical calculation methods such as addition, subtraction, multiplication and division.

[0195] Among them, the operating information combination corresponding to the target information can be predetermined. When the operating information is obtained, the specific item operating information corresponding to the operating information combination can be obtained, and the operating information combination can be directly used for processing to determine the target information. There is no need to obtain the operating information of the remaining items, nor is there any need to calculate the operating information of the remaining items, so as to reduce the data processing burden.

[0196] As an example, the onboard temperature and chip temperature can be predetermined as specific items of operating information for determining the target information. In the process of obtaining multiple items of operating information to determine the target information, there is no need to obtain the remaining chip current and chip power consumption, and these two items do not need to be involved in the calculation, thereby reducing the data processing burden.

[0197] As an example, the chip power consumption and onboard temperature can also be predetermined as another specific item of operating information for determining the target information. In the process of obtaining multiple items of operating information to determine the target information, there is no need to obtain the remaining chip current and chip temperature, and these two items do not need to be involved in the calculation, thereby reducing the data processing burden.

[0198] However, the present application does not specifically limit the type of specific item of operation information, that is, those skilled in the art can adjust the type of specific item of technical information according to actual conditions.

[0199] refer to Figure 1 In an electronic device, the functional module 103 can obtain multiple pieces of operating information of a target device, determine the target information, and use the target information to control the heat dissipation module 102, and the heat dissipation module 102 can dissipate heat for the target device according to the control of the functional module. The target information can be determined by combining two or more pieces of operating information in the operating information combination, combining the characteristics of the multiple operating information. Since individual operating information can only characterize the state of its corresponding collection position, and the target information combines the characteristics of multiple operating information, it is a heat dissipation requirement determined from multiple dimensions. Compared with the heat dissipation requirement analysis of a single dimension, the multi-dimensional analysis has higher accuracy and is more in line with the heat dissipation requirements of the current target device.

[0200] In this embodiment, multiple pieces of operation information of a target device in an electronic device are obtained, and the target information is determined by combining at least two pieces of operation information from the multiple pieces of operation information. The target information can characterize the heat dissipation demand of the target device, and the target information is used to control the operation of the heat dissipation module in the electronic device. Different target information is determined by different operation information. By using multiple pieces of operation information to determine the target information, and the target information can characterize the heat dissipation demand of the target device, it is achieved that the target information is determined by using multiple pieces of operation information. The target information integrates the characteristics of each piece of operation information in the combination of operation information. The determined target information can better reflect the heat dissipation demand of the target device during operation than the single operation information. Therefore, the operation of the heat dissipation module can be controlled more accurately by using the target information. Moreover, the first target duration is greater than the second target duration. In the process of heat dissipation using two heat dissipation modes, once a sudden high power consumption heat dissipation demand occurs, the response to the sudden high power consumption heat dissipation demand can be minimized, and the electronic device is quieter.

[0201] In a possible implementation, before obtaining multiple pieces of operation information of a target device in an electronic device, multiple pieces of operation information in different operation scenarios may be analyzed in advance to select target information. The specific implementation process is as follows: Figure 6 shown.

[0202] Figure 6 It is a flowchart of analyzing multiple pieces of operation information in different operation scenarios in advance and selecting target information provided by an embodiment of the present application, which may include steps 601 to 604, and these steps are described in detail below.

[0203] 601. In at least two operation scenarios, multiple pieces of operation information of the target device can be obtained;

[0204] Among the at least two operating scenarios, heating conditions of the target device in each operating scenario are different.

[0205] Among them, when the control electronic device operates in each operation scenario, it can obtain multiple operation information of the target device, and the multiple operation information can characterize the operation status of the target device in the corresponding operation scenario and the heat dissipation requirements of the target device.

[0206] Among them, each operation information can represent the heat dissipation requirement of the target device in the corresponding operation scenario. However, different operation information has different degrees of fit with the heat dissipation requirement of the target device. Therefore, the combination of operation information that can reflect the best fit can be determined.

[0207] Among them, the operating scenarios may include movie watching scenes, office scenes, game scenes, big data reasoning scenes, etc.

[0208] 602. Based on the multiple pieces of operation information of the target device, at least one relevant information of the target device may be determined;

[0209] The multiple pieces of operation information are combined to obtain multiple operation information combinations.

[0210] In a possible implementation, the multiple pieces of operation information may be combined in pairs. If the operation information is item A, then (A-1) combinations of operation information are obtained.

[0211] In a possible implementation, the multiple pieces of operation information may be combined into more items, and the multiple pieces of operation information may be combined to obtain an operation information combination.

[0212] In a possible implementation, the multiple pieces of operation information may be combined in pairs in sequence, and the multiple pieces of operation information may be combined in more items to obtain multiple combinations of operation information.

[0213] In a possible implementation, each piece of operation information in each combination of operation information may be processed in at least one processing manner to obtain at least one piece of relevant information of the target device.

[0214] The processing method may be a mathematical calculation, and the value of each operation information in any combination of operation information may be mathematically calculated to obtain the value of the corresponding related information.

[0215] As an example, the processing method can be any method of addition, subtraction, multiplication and division, or a combination of addition, subtraction, multiplication and division. Of course, it can also be other calculation methods, which are not limited in this application.

[0216] By processing each piece of operation information in each operation information combination, a processing result can be obtained as relevant information of the target device.

[0217] Among them, from the multiple pieces of operation information obtained, an operation information combination is first determined, and the operation information combination includes two or more items of operation information.

[0218] Among them, each item of operation information in the operation information combination is processed to determine the target information, and different operation information combinations can determine different target information.

[0219] As an example, when the target device is an on-chip chip, the operating information of the target device may include chip temperature, chip current, chip power consumption, board temperature, and board current. The chip temperature and chip current may be used to determine target information, or the chip temperature and board temperature may be used to determine target information, or the chip load and board temperature may be used to determine target information, or the chip temperature, chip current, chip power consumption, and board temperature may be used to determine target information.

[0220] The target information is determined by each piece of operation information in the operation information combination, and may be target information obtained by calculating the operation information in a specific calculation method, and the target information incorporates each piece of operation information in the operation information combination.

[0221] Among them, the operation information combination corresponding to the target information can be predetermined. When the operation information is obtained, the specific item operation information corresponding to the operation information combination can be obtained, and the operation information combination can be directly used for processing to determine the target information, so as to reduce the data processing burden.

[0222] 603. Determine changes in relevant information of the target device between a first operating scenario and a second operating scenario, where a heat dissipation requirement of the first operating scenario is different from a heat dissipation requirement of the second operating scenario;

[0223] For two operation scenarios with different heat dissipation requirements, changes in relevant information of the target device in the two operation scenarios may be determined.

[0224] The change of the relevant information in the two operation scenarios may be related to the sensitivity of the relevant information to the influence of the heat dissipation demand.

[0225] Among them, the change of the relevant information in the two operating scenarios, if the change of the relevant information in the two operating scenarios is different, the change in one is larger, and the change in the other operating scenario is smaller or even unchanged, it can be represented that the sensitivity of the relevant information to the heat dissipation demand in the two operating scenarios is different.

[0226] Among them, if the relevant information is different in an operating scenario with a large heat dissipation demand and in an operating scenario with a small heat dissipation demand, for example, it increases in an operating scenario with a large heat dissipation demand and remains stable in an operating scenario with a small heat dissipation demand, then the relevant information can be used to determine that a change in the operating scenario has occurred, and the change in the operating scenario has brought about a change in the heat dissipation demand of the target device.

[0227] Among them, if the relevant information is the same in an operating scenario with a large heat dissipation demand and in an operating scenario with a small heat dissipation demand, for example, they are synchronized in the operating scenario with a large heat dissipation demand and in the operating scenario with a small heat dissipation demand, such as both maintaining stability, or increasing or decreasing synchronously, then the change in heat dissipation demand cannot be determined through the relevant information.

[0228] The first operation scene and the second operation scene may select scenes with different heat dissipation requirements. For example, the heat dissipation requirement of the first operation scene is large, and the heat dissipation requirement of the second operation scene is small.

[0229] For example, the heat dissipation demand is low in scenes such as movie watching and office scenes; while the heat dissipation demand of the target device is high in scenes such as game scenes and big data reasoning scenes.

[0230] 604. Based on the fact that a change in any relevant information between the first operation scenario and the second operation scenario is greater than a set change amount, determine that the any relevant information is target information.

[0231] Among them, the set change amount is a value that can distinguish two different situations. If the change is greater than the set change amount, it can be determined that the relevant information has changed significantly in the two operating scenarios; if the change is not greater than the set change amount, it can be determined that the relevant information has changed slightly in the two operating scenarios.

[0232] Among them, if the change of certain relevant information between the first operating scenario and the second operating scenario is greater than the set change amount, it can be indicated that the difference between the two operating scenarios is large, and the relevant information can be used to distinguish the different heat dissipation requirements of the two operating scenarios; otherwise, the relevant information cannot distinguish the different heat dissipation requirements of the two operating scenarios.

[0233] Figure 7 1 is a curve diagram of the operation information combination and target information of two operation scenes provided in the embodiment of the present application. The operation scenes can be a movie watching scene and a rendering scene respectively. The operation information combination can be a combination of CPU temperature and board temperature, and the target information can be the temperature difference between the CPU temperature and the board temperature. Figure 7 In the CPU temperature curve 701, the board temperature curve 702 and the target information curve 703, the horizontal axis represents time (in seconds) and the vertical axis represents temperature (in °C). In the viewing scene, the temperature difference is stably maintained below 15 °C. In the rendering scene, the temperature difference is stabilized at more than 15 °C after 15 seconds.

[0234] Figure 8 It is a curve diagram of the operation information combination and target information of two operation scenes provided in the embodiment of the present application and the corresponding operation parameters. The operation scenes are respectively the movie watching scene and the rendering scene. The operation information combination is respectively the CPU temperature and the board temperature, and the target information is the temperature difference between the CPU temperature and the board temperature. Figure 8 In the figure, CPU temperature curve 801, board temperature curve 802, target information curve 803 and fan speed curve 804, the horizontal axis represents time (in seconds), and the vertical axis represents temperature (in °C). In the viewing scene, the temperature difference is stably maintained below 15 °C, and the fan speed is maintained at around 2100 rpm. In the rendering scene, the temperature difference is stabilized at more than 15 °C after 15 seconds, and the fan speed is maintained at 1400 rpm before 15 seconds, and gradually increases to around 4000 rpm after 15 seconds.

[0235] In this embodiment, multiple operation information of the target device is obtained in multiple operation scenarios; based on the multiple operation information, at least two operation information combinations are determined; each operation information in each operation information combination is processed in at least one processing method to obtain at least one relevant information of the target device; the change of each relevant information in the first operation scenario and the second operation scenario with different heat dissipation requirements is determined; based on the change of any relevant information in the first operation scenario and the second operation scenario being greater than the set change amount, the any relevant information is determined to be the target information. By comparing the change of each relevant information in two different heat dissipation requirements, the relevant information greater than the set change amount is determined as the target information that characterizes the different heat dissipation requirements of the target device, and the determined target information is consistent with the heat dissipation requirements of the target device, thereby improving the accuracy of the subsequent use of the target information to determine the heat dissipation mode of the heat dissipation module.

[0236] In a possible implementation, the target information is determined by the temperature difference between the target device temperature and the board end temperature to determine the change of the target information. The specific implementation process is as follows: Fig. 9 shown.

[0237] Fig. 9 It is a flowchart of analyzing target information and determining changes in target information within a preset time period provided by an embodiment of the present application, which may include steps 901 to 902, and these steps are described in detail below.

[0238] 901. A temperature difference may be determined based on a target device temperature and a board end temperature of a circuit board, wherein the target device is disposed on the circuit board, and the operation information includes the target device temperature and the board end temperature;

[0239] The target device may be a chip or other device disposed on a circuit board.

[0240] A plurality of temperature sensors may be arranged on the circuit board, wherein the temperature sensor arranged close to the target device is used to measure the temperature of the target device, and the temperature sensor arranged far from the target device can measure the board end temperature of the circuit board.

[0241] When the target device is in operation, the target device dissipates heat, and the temperature of other locations on the circuit board is affected by the heat dissipation of the target device. The detected temperature of the temperature sensor far from the target device also increases accordingly.

[0242] Wherein, when the target device is running, the temperature of the target device and the board end temperature of the circuit board are monitored to determine the temperature difference between the two.

[0243] The temperature difference may be the difference between the target device temperature and the board end temperature, or the absolute value of the difference.

[0244] Among them, the temperature difference can represent the temperature difference between the target device and the board end. When the temperature difference between the two remains stable, it represents that the heat dissipation of the target device is stable and its heat dissipation demand is low; when the temperature difference between the two becomes larger, it represents that the heat dissipation of the target device increases and its heat dissipation demand increases.

[0245] Fig.10 It is another structural schematic diagram of an electronic device provided in an embodiment of the present application. The information determination method can be applied to the electronic device. The electronic device may include: a target device 1001, a heat dissipation module 1002 and a functional module 1003. The target device 1001 may be set on a circuit board 1004, and temperature sensors 1005 and 1006 may also be set on the circuit board. The target device 1001 may be a device to be cooled, the target heat dissipation module 1002 may be a structure for cooling the target device, and the functional module 1003 may be a module to which the configuration method provided in an embodiment of the present application is applied. Among them, the temperature sensor 1005 may be set close to the target device 1001, and its detected temperature is used as the target device temperature; the temperature sensor 1006 may be set far away from the target device 1002, and its detected temperature is used as the board end temperature.

[0246] In a specific implementation, the target device temperature and the board end temperature can be obtained in real time, and the temperature difference between the target device temperature and the board end temperature obtained in real time is calculated.

[0247] 902. Determine a change in the temperature difference within a preset time period.

[0248] The real-time temperature difference determined for the target device temperature and the board end temperature can be used to determine the overall temperature condition on the circuit board, and the temperature condition corresponds to the heat dissipation requirement of the target device.

[0249] If the temperature difference remains stable within a preset time, it means that the heat generated and the heat dissipated by the target device are balanced, and its heat dissipation requirement is small; if the temperature difference gradually increases, it means that the heat generated and the heat dissipated by the target device are not balanced, the heat generated by the target device cannot be dissipated, and its heat dissipation requirement is large, and the heat dissipation module needs to provide greater heat dissipation capacity. Therefore, the heat dissipation requirement can be determined by using the change of the temperature difference, and then the heat dissipation module is selected to use the heat dissipation mode that matches the heat dissipation requirement to accurately control the heat dissipation according to the operation of the target device.

[0250] Correspondingly, if the temperature difference remains stable within the preset time, the heat dissipation demand is low, and the heat dissipation module can be controlled to adopt the first heat dissipation mode to dissipate heat to the target device with a lower heat dissipation capacity. If the temperature difference switches from maintaining stability to gradually increasing within the preset time, it means that the heat dissipation demand of the target device changes from a small one to a large one, and the heat dissipation module can be controlled to switch to the second heat dissipation mode to dissipate heat to the target device with a higher heat dissipation capacity.

[0251] In one possible implementation, a threshold can be set. If the temperature difference changes from less than the set threshold to greater than the set threshold within a preset time period, it can be determined that the change meets the trigger condition of the second cooling mode; otherwise, it can be determined that the trigger condition of the first cooling mode is met.

[0252] As an example, the threshold value may be 15°C (degrees Celsius), the stability may be within the preset temperature threshold value, such as less than or equal to 15°C; the gradually increasing temperature difference may be outside the preset temperature threshold value, such as greater than 15°C. Of course, the threshold value may also be other values, which are not limited in this application.

[0253] Fig.11 The following is a curve diagram of operating information and target information in an application scenario provided by an embodiment of the present application. In this scenario, the target device may be a CPU (central processing unit). The operating information includes the CPU temperature and the board temperature. The target information is the difference between the CPU temperature and the board temperature. Fig.11 In the CPU temperature curve 1101, the board temperature curve 1102 and the target information curve 1103, the horizontal axis represents time (in seconds) and the vertical axis represents temperature (in °C). The CPU temperature is maintained at 50 °C from 0 to 12 seconds, and rises rapidly after 12 seconds, rising to about 98 °C at about 44 seconds and maintaining for a period of time; the board temperature is maintained at 40 °C from 0 to 18 seconds, and gradually rises after 18 seconds, and maintains at 60 °C at about 48 seconds. The board temperature lags behind the CPU temperature change and is lower than the CPU temperature. When the CPU temperature and the board temperature are both maintained at stable values, the difference between the two remains stable, and the difference is stable below 15 °C; when the CPU temperature rises rapidly, it can follow the CPU temperature change. Since the board temperature does not quickly follow the CPU temperature rise, the change of the target information is less than the CPU temperature change, and the difference is stable above 15 °C. It can be determined that the difference is more in line with the CPU's heat dissipation requirements.

[0254] In this embodiment, the target device is set on the circuit board, and the operation information includes the target device temperature and the board end temperature. Based on the target device temperature and the board end temperature of the circuit board, the temperature difference is determined; and the change of the temperature difference within a preset time period is determined. By determining the temperature difference between the target device temperature and the board end temperature on the circuit board, the heat dissipation required by the target device can be determined. When the temperature difference is small, its heat dissipation demand is small. If the temperature difference is large, its heat dissipation demand is large. Therefore, using the change of the temperature difference, its heat dissipation demand can be determined, and then the heat dissipation module is selected to adopt a heat dissipation mode that matches the heat dissipation demand, so as to achieve accurate control of heat dissipation according to the operation of the target device.

[0255] In a possible implementation, when the heat dissipation module is operating in the first heat dissipation mode, the response method for the sudden high power consumption heat dissipation demand is determined in combination with the first target duration. The specific implementation process is as follows Fig.12 shown.

[0256] Fig.12 This is a flow chart of determining a response method to sudden high power consumption heat dissipation requirements when the heat dissipation module is operating in the first heat dissipation mode, provided in an embodiment of the present application. It may include steps 1201 to 1203, and these steps are described in detail below.

[0257] 1201. In a process of controlling the heat dissipation module to operate in the first heat dissipation mode, based on the specific operating parameter of the target device being greater than a set threshold, real-time statistics are collected on the duration of the specific operating parameter being greater than the set threshold;

[0258] In the process of controlling the heat dissipation module to operate in the first heat dissipation mode, the specific operating parameters of the target device can continue to be detected, and the specific operating parameters can also represent the heat dissipation requirements of the target device.

[0259] In a possible implementation, since a larger load causes a more serious heat generation of the target device and a greater heat dissipation requirement thereof, the specific operating parameter may be the load of the target device.

[0260] In a possible implementation, since the larger the current, the more serious the heat generated by the target device and the greater its heat dissipation requirement, the specific operating parameter may also be the current of the target device.

[0261] If it is detected that the specific operating parameter of the target device is greater than a set threshold, it indicates that the target device has a sudden high-power heat dissipation demand.

[0262] Among them, when the electronic device is in the first heat dissipation mode, the load of the target device is very low, and the heat dissipation module needs to adopt a lower first operating parameter to achieve a better heat dissipation effect for the target device. However, in the event of a sudden high-power heat dissipation demand, the operating parameters of the heat dissipation module need to be increased in response to the sudden high-power heat dissipation demand, resulting in increased noise of the electronic device. Therefore, it can be judged whether the sudden high-power heat dissipation demand needs to be responded to.

[0263] In a possible implementation, the set threshold is a boundary value used to distinguish high load and low load of the target device. When the load of the target device is greater than the set threshold, it is determined that the target device is highly loaded; otherwise, the target device is under low load.

[0264] The specific value of the set threshold can be set according to actual conditions and is not limited in this application.

[0265] Among them, if the specific operating parameter of the target device is greater than the set threshold, it can be determined that the target device has a sudden high-power heat dissipation demand, and the duration of the specific operating parameter being greater than the set threshold is counted to use the duration to determine whether the sudden high-power heat dissipation demand needs to be responded to.

[0266] Among them, the judgment is made based on the first target duration set in the first heat dissipation mode. When the duration is greater than the first target duration, it can be determined that the sudden high-power heat dissipation demand lasts for a long time and requires a response; otherwise, it can be determined that the sudden high-power heat dissipation demand lasts for a short time and does not require a response.

[0267] 1202. If the duration is longer than the first set duration, the operating parameters of the heat dissipation module may be adjusted based on the specific operating parameters;

[0268] Among them, when the duration of the specific operating parameter is greater than the set threshold, and greater than the first target duration, it can be determined that the duration of the specific operating parameter is long, exceeding the first target duration maintained each time the first operating parameter is switched.

[0269] Among them, the duration of the specific operating parameter is relatively long, and the heat dissipation effect of the current first heat dissipation parameter of the first heat dissipation mode is relatively poor, which will affect the performance of the target device, and it is necessary to respond to the specific operating parameter.

[0270] The method of responding to the specific operating parameter may be to adjust the operating parameter of the heat dissipation module according to the specific operating parameter.

[0271] In one possible implementation, the operating parameters of the heat dissipation module are adjusted based on specific operating parameters. Based on the specific operating parameter being greater than a set threshold, an operating parameter higher than the first operating parameter currently used is selected. The selected operating parameter may match the specific operating parameter, so as to utilize the selected operating parameter to switch the operating parameter of the heat dissipation module and improve the heat dissipation capacity of the heat dissipation module.

[0272] In a possible implementation, if the duration of switching to any first operating parameter reaches a first target duration, based on the specific operating parameter, a step of obtaining operating information of a target device in the electronic device is triggered.

[0273] When the duration of maintaining the first operating parameter reaches the first target duration, the specific operating parameter is used to trigger the determination of target information, so as to control the switching of the heat dissipation mode based on the target information.

[0274] As an example, the specific operating parameter is the load of the target device, and the duration that the load is greater than the set load threshold is longer than the first target duration corresponding to the current first cooling mode, triggering the process of re-determining the cooling mode of the cooling module, obtaining various operating information of the target device, determining the target information, and then judging whether the target information meets the second condition, so as to determine whether to control the cooling module to operate in the second cooling mode, so as to improve the cooling capacity of the cooling module.

[0275] As an example, the specific operating parameter is the current of the target device, and the duration that the current is greater than the set current threshold is greater than the first target duration corresponding to the current first cooling mode, triggering the process of re-determining the cooling mode of the cooling module, obtaining various operating information of the target device, determining the target information, and then judging whether the target information meets the second condition, so as to determine whether to control the cooling module to operate in the second cooling mode, so as to improve the cooling capacity of the cooling module.

[0276] 1203. If the duration is not greater than the first set duration, responding to the specific operating parameter may be prohibited.

[0277] In which, when the duration of the specific operating parameter being greater than the set threshold is not greater than the first target duration, it can be determined that the duration of the specific operating parameter is short.

[0278] Among them, the duration of this specific operating parameter is relatively short, which can indicate that the duration of the sudden high-power heat dissipation demand of the target device is relatively short. The heat dissipation module adopts the current first heat dissipation mode to dissipate the heat generated by the sudden high power. Compared with higher operating parameters, although the heat dissipation effect of the first heat dissipation parameter currently adopted by the first heat dissipation mode is worse, the heat dissipation effect can be achieved. Therefore, it does not respond to this specific operating parameter, and the noise during the operation of the electronic device is relatively small and remains quiet.

[0279] In a possible implementation, the specific operating parameter may be ignored to prohibit responding to the specific operating parameter.

[0280] Similarly, in a possible implementation, when the heat dissipation module is operating in the second heat dissipation mode, a specific operating parameter is greater than a set threshold value. Similar to the operation in the first heat dissipation mode, the duration of the specific operating parameter being greater than the set threshold value can also be counted in real time. If the duration is greater than the second target duration, the operating parameter of the heat dissipation module is adjusted based on the specific operating parameter. The adjustment process may be to select an operating parameter higher than the currently used second operating parameter. The selected operating parameter may be matched with the specific operating parameter, so as to use the selected operating parameter to switch the operating parameter of the heat dissipation module and improve the heat dissipation capacity of the heat dissipation module. If the duration is not greater than the second target duration, responding to the specific operating parameter is prohibited.

[0281] In this embodiment, in the process of controlling the heat dissipation module to operate in the first heat dissipation mode, based on the specific operating parameter of the target device being greater than the set threshold, the duration of the specific operating parameter being greater than the set threshold is counted in real time; if the duration is greater than the first target duration, the operating parameter of the heat dissipation module is adjusted based on the specific operating parameter; if the duration is not greater than the first target duration, responding to the specific operating parameter is prohibited. By determining that a sudden high-power heat dissipation demand occurs when the specific operating parameter of the target device is greater than the set threshold during the operation of the heat dissipation module in the first heat dissipation mode, determining whether the sudden high-power heat dissipation demand needs to be responded to using its duration, and not responding to it when it lasts for a short time, it is possible to minimize the response to the sudden high-power heat dissipation demand, reduce the noise of the electronic device, and make the electronic device quieter; and respond to the sudden high-power heat dissipation demand only when it lasts for a long time to maintain the performance of the electronic device.

[0282] In a possible implementation, the electronic device may adopt a plurality of manually switchable operating modes, each of which includes the two aforementioned heat dissipation modes. The specific implementation process is as follows: Fig.13 shown.

[0283] Fig.13It is a flowchart of switching the operating mode of an electronic device provided in an embodiment of the present application, which may include steps 1301 to 1303, and these steps are described in detail below.

[0284] 1301. Receive a switching instruction;

[0285] Among them, the electronic device has multiple operating modes, and correspondingly, the heat dissipation module in the electronic device has corresponding operating parameters for the multiple operating modes. Each operating mode can also be subdivided into the above-mentioned two heat dissipation modes.

[0286] The switching of various operation modes can be achieved by the user performing a switching operation.

[0287] In a possible implementation, the operating mode can be switched by using a shortcut key, such as using the Fn+Q key combination to switch the operating mode; the operating mode can also be switched by selecting a target operating mode through a switching interface.

[0288] Among them, the heat dissipation module has multiple operating modes, and different operating modes support different loads. By switching the operating modes, the heat dissipation module of the electronic device can be controlled to dissipate heat using the heat dissipation modes under different operating modes.

[0289] 1302. Based on the switching instruction indicating switching to the first heat dissipation mode, the heat dissipation module of the electronic device may be controlled to operate in the first heat dissipation mode;

[0290] If the switching instruction indicates switching to the first operating mode, the heat dissipation module of the electronic device can be controlled to operate in the first operating mode, specifically, to operate in one of the two heat dissipation modes in the first operating mode.

[0291] Among them, after switching to the first operating mode, the target information is determined based on the multiple information of the target device obtained, and the heat dissipation module can be controlled to adopt the first heat dissipation mode / second heat dissipation mode based on the target information satisfying the first condition / second condition.

[0292] The method of selecting the first heat dissipation mode in the first operating mode can refer to the aforementioned Fig.12 Based on the operation information satisfying the first condition, a first control table included in the first cooling mode is obtained.

[0293] Correspondingly, the method of selecting the second heat dissipation mode in the first operating mode may refer to the method of selecting the first heat dissipation mode, which will not be described in detail in this embodiment.

[0294] 1303. Based on the switching instruction representation, the second heat dissipation mode is switched to. The heat dissipation module of the electronic device can be controlled to operate in the second heat dissipation mode. The load supported by the electronic device in the second heat dissipation mode is higher than the load supported in the first heat dissipation mode.

[0295] If the switching instruction indicates switching to the second operating mode, the heat dissipation module of the electronic device can be controlled to operate in the second operating mode, specifically, to operate in one of the two heat dissipation modes in the second operating mode.

[0296] Among them, after switching to the second operating mode, the target information is determined based on the multiple information of the target device obtained, and the heat dissipation module can be controlled to adopt the first heat dissipation mode / second heat dissipation mode based on the target information satisfying the first condition / second condition.

[0297] The manner of selecting the first heat dissipation mode in the second operation mode may refer to the above-mentioned embodiment in which the first control table included in the first heat dissipation mode is obtained based on the operation information satisfying the first condition.

[0298] Correspondingly, the method of selecting the second heat dissipation mode in the second operating mode can refer to the method of selecting the first heat dissipation mode, which will not be described in detail in this embodiment.

[0299] In this embodiment, a switching instruction is received; based on the switching instruction, the first operating mode is switched to, and the heat dissipation module of the electronic device is controlled to operate in the first operating mode; based on the switching instruction, the second operating mode is switched to, and the heat dissipation module of the electronic device is controlled to operate in the second operating mode, and the load supported by the electronic device in the second operating mode is higher than the load supported in the first operating mode. The switching operation is performed for different operating modes of the electronic device, and after receiving the switching instruction, the target switching operating mode is determined to control the heat dissipation module of the electronic device to operate in the corresponding operating mode, and the heat dissipation mode is selected in the operating mode, so as to perform more detailed control on the heat dissipation module, thereby realizing accurate control of the heat dissipation of the target device.

[0300] A configuration method provided in an embodiment of the present application is introduced above, and a device for executing the above configuration method will be introduced below.

[0301] An embodiment of the present application provides a configuration device structure, the configuration device is used to configure a first heat dissipation mode or a second heat dissipation mode as a heat dissipation mode of an electronic device, the first heat dissipation mode includes a first control table, and the second heat dissipation mode includes a second control table;

[0302] The first control table includes N first operating parameters that are switchable and different from each other, N is greater than 1, the N first operating parameters are switched to maintain a first target duration each time, and the lower limit value of each first operating parameter in the N first operating parameters is a first value,

[0303] The second control table includes M second operating parameters that are switchable and different from each other, M is greater than 1, the M second operating parameters are switched to maintain a second target duration each time, the lower limit value of each second operating parameter in the M second operating parameters is a second value, M is the same as or different from N, and the first operating parameter and the second operating parameter characterize the heat dissipation capacity of the heat dissipation mode;

[0304] The first target duration is greater than the second target duration, and any first value in the first control table is less than any second value in the second control table.

[0305] In a possible implementation, the configuration device includes:

[0306] a first control module, configured to control the heat dissipation module to operate in a first heat dissipation mode based on the target information satisfying a first condition, or

[0307] The second control module is used to control the heat dissipation module to operate in a second heat dissipation mode based on the target information satisfying a second condition, and the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition.

[0308] In a possible implementation, based on the target information satisfying the first condition, controlling the heat dissipation module to operate in the first heat dissipation mode includes:

[0309] A first determination module is used to determine a current operation mode of the electronic device; in different operation modes, the load supported by the electronic device is different, the first target durations corresponding to the different operation modes are different, and the first target duration corresponding to the operation mode is negatively correlated with the load supported by the electronic device;

[0310] A second determination module, configured to determine a first heat dissipation mode corresponding to the current operation mode based on the target information satisfying the first condition;

[0311] A first obtaining module, used for obtaining a first control table corresponding to a first heat dissipation mode of a current operation mode;

[0312] The switching module is used to switch the operating parameters of the heat dissipation module based on the first operating parameters in the first control table, and maintain the first target duration after each switching.

[0313] In a possible implementation, it includes:

[0314] a third determination module, configured to determine, based on the target information, a change in the target information within a preset time period, the target information being determined based on at least part of the at least two pieces of operation information, and the fit between the target information and the heat dissipation requirement of the target device being higher than the fit between any of the operation information and the heat dissipation requirement of the target device;

[0315] The fourth determination module is used to determine that the operating parameters meet the first condition based on whether the change situation meets the trigger condition of the first heat dissipation mode, and control the heat dissipation module to operate in the first heat dissipation mode; or to determine that the target information meets the second condition based on whether the change situation meets the trigger condition of the second heat dissipation mode, and the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition.

[0316] In a possible implementation, it includes:

[0317] A second obtaining module is used to obtain multiple operation information of a target device in the electronic device;

[0318] The fifth determination module is used to determine target information based on a combination of at least two pieces of operation information among multiple pieces of operation information. Different operation information determines different target information, and the target information can characterize the heat dissipation requirements of the target device; the target information is used to control the operation of the heat dissipation module in the electronic device.

[0319] In a possible implementation, it includes:

[0320] A third obtaining module is used to obtain the operation information of the target device in at least two operation scenarios;

[0321] A sixth determining module, configured to determine at least one relevant information of the target device based on the operation information of the target device;

[0322] A seventh determination module is used to determine the change of each relevant information of the target device between the first operation scene and the second operation scene, and the heat dissipation requirement of the first operation scene is different from the heat dissipation requirement of the second operation scene;

[0323] An eighth determination module is configured to determine that any relevant information is target information based on the fact that a change in any relevant information between the first operation scenario and the second operation scenario is greater than a set change amount.

[0324] In a possible implementation, the fourth determining module includes:

[0325] A first determining unit, configured to determine a temperature difference based on a target device temperature and a board end temperature of the circuit board, wherein the target device is disposed on the circuit board, and the operation information includes the target device temperature and the board end temperature;

[0326] The second determining unit is used to determine the change of the temperature difference within a preset time period.

[0327] In a possible implementation, it includes:

[0328] A statistics module, used for, in the process of controlling the heat dissipation module to operate in the first heat dissipation mode, based on the specific operation parameter of the target device being greater than the set threshold, real-time statistics of the duration of the specific operation parameter being greater than the set threshold;

[0329] An adjustment module, configured to adjust the operating parameters of the heat dissipation module based on specific operating parameters if the duration is longer than a first set duration;

[0330] The prohibition module is used to prohibit responding to specific operating parameters if the duration is not greater than a first set duration.

[0331] In a possible implementation, the adjustment module is specifically configured to:

[0332] Based on the duration of switching to any first operating parameter reaching the first target duration, based on the specific operating parameter, the step of obtaining the operating information of the target device in the electronic device is triggered.

[0333] In a possible implementation, it includes:

[0334] A receiving module, used for receiving a switching instruction;

[0335] A third control module, used to switch to the first heat dissipation mode based on the switching instruction representation, and control the heat dissipation module of the electronic device to operate in the first heat dissipation mode;

[0336] The fourth control module is used to switch to the second cooling mode based on the switching instruction representation, control the cooling module of the electronic device to operate in the second cooling mode, and the load supported by the electronic device in the second cooling mode is higher than the load supported in the first cooling mode.

[0337] It should be noted that for the functional explanation of each component structure in a configuration device provided in this embodiment, please refer to the explanation in the aforementioned method embodiment, which will not be repeated in this embodiment.

[0338] In this embodiment, the configuration device configures the first heat dissipation mode or the second heat dissipation mode as the heat dissipation mode of the electronic device, and sets different control tables for different heat dissipation modes. The first control table for the first heat dissipation mode includes N mutually different first operating parameters that can be switched, and the N first operating parameters maintain the first target time each time they are switched, and the lower limit value of each first operating parameter in the N first operating parameters is the first value; the second control table for the second heat dissipation mode includes M mutually different second operating parameters that can be switched, and the M second operating parameters maintain the second target time each time they are switched. The lower limit value of each second operating parameter among the M second operating parameters is a second value, M and N are the same or different positive integers, the first target duration is greater than the second target duration, any first value in the first control table is less than any second value in the second control table, and the first operating parameter with a lower lower limit value and a longer maintenance time are set in the first heat dissipation mode. When the heat dissipation module is in the first heat dissipation mode, the heat dissipation demand for responding to sudden high power consumption can be minimized, and the electronic device is quieter; when the second operating parameter with a higher lower limit value and a shorter maintenance time are set in the second heat dissipation mode, the heat dissipation module can quickly respond to sudden high power consumption heat dissipation demand when in the second heat dissipation mode, and the performance of the electronic device is maintained at a better level.

[0339] The present application also provides an electronic device in an embodiment. Fig.14 As shown, it shows a schematic diagram of the structure of an electronic device suitable for implementing the configuration method in the embodiment of the present application. The electronic device in the embodiment of the present application may include but is not limited to fixed terminals such as mobile phones, laptops, PDAs (personal digital assistants), PADs (tablet computers), desktop computers, etc. Fig.14 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0340] like Fig.14 As shown, the electronic device may include a processing device (e.g., a central processing unit, a graphics processing unit, etc.) 1401, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1402 or a program loaded from a storage device 1408 to a random access memory (RAM) 1403. When the electronic device is powered on, various programs and data required for the operation of the electronic device are also stored in the RAM 1403. The processing device 1401, the ROM 1402, and the RAM 1403 are connected to each other via a bus 1404. An input / output (I / O) interface 1405 is also connected to the bus 1404.

[0341] Typically, the following devices may be connected to the I / O interface 1405: an input device 1406 including, for example, a touch screen, a touch pad, a keyboard, a mouse, a camera, a microphone, an accelerometer, a gyroscope, etc.; an output device 1407 including, for example, a liquid crystal display (LCD), a speaker, a vibrator, etc.; a storage device 1408 including, for example, a memory card, a hard disk, etc.; and a communication device 1409. The communication device 1409 may allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. Although Fig.14 An electronic device having various devices is shown, but it should be understood that it is not required to implement or possess all the devices shown. More or fewer devices may be implemented or possessed instead.

[0342] An embodiment of the present application also provides a computer program product including computer-readable instructions. When the computer-readable instructions are executed on an electronic device, the electronic device implements any configuration method provided in the embodiment of the present application.

[0343] A computer-readable storage medium is also provided in an embodiment of the present application. The storage medium carries one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement any configuration method provided in the embodiment of the present application.

[0344] It should also be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the device embodiments provided by the present application, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.

[0345] Through the description of the above implementation mode, the technicians in the field can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course, it can also be implemented by special hardware including special integrated circuits, special CPUs, special memories, special components, etc. In general, all functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be various, such as analog circuits, digital circuits or special circuits. However, for the present application, software program implementation is a better implementation mode in more cases. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer floppy disk, a U disk, a mobile hard disk, a ROM, a RAM, a disk or an optical disk, etc., including a number of instructions to enable a computer device (which can be a personal computer, a training device, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0346] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0347] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a training device, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, training device, or data center. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device, a data center, etc. that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)), etc.

Claims

1. A configuration method, comprising: Configure a first heat dissipation mode or a second heat dissipation mode as a heat dissipation mode of the electronic device, wherein the first heat dissipation mode includes a first control table, and the second heat dissipation mode includes a second control table; The first control table includes N first operating parameters that are switchable and different from each other, wherein N is greater than 1, and each switch of the N first operating parameters maintains a first target duration, and the lower limit value of each of the N first operating parameters is a first value, The second control table includes M second operating parameters that are switchable and different from each other, wherein M is greater than 1, and each switch of the M second operating parameters maintains a second target duration, and the lower limit value of each second operating parameter in the M second operating parameters is a second value, and M is the same as or different from N, and the first operating parameter and the second operating parameter characterize the heat dissipation capacity of the heat dissipation mode; The first target duration is greater than the second target duration, and any one of the first values ​​in the first control table is less than any one of the second values ​​in the second control table.

2. The configuration method according to claim 1, wherein configuring the first heat dissipation mode or the second heat dissipation mode as a heat dissipation mode of the electronic device comprises: Based on the target information satisfying the first condition, the heat dissipation module is controlled to operate in the first heat dissipation mode, or Based on the target information satisfying the second condition, the heat dissipation module is controlled to operate in the second heat dissipation mode, the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition, and the target information can represent the heat dissipation requirement of the target device in the electronic device.

3. The configuration method according to claim 2, wherein the step of controlling the heat dissipation module to operate in the first heat dissipation mode based on the target information satisfying the first condition comprises: determining a current operating mode of the electronic device; In different operation modes, the load supported by the electronic device is different, the first target durations corresponding to the different operation modes are different, and the first target duration corresponding to the operation mode is negatively correlated with the load supported by the electronic device; Based on the target information satisfying a first condition, determining a first heat dissipation mode corresponding to the current operating mode; Obtain a first control table corresponding to a first heat dissipation mode of the current operation mode; The operating parameters of the heat dissipation module are switched based on the first operating parameters in the first control table, and the first target duration is maintained after each switching.

4. The configuration method according to claim 2, comprising: Based on the target information, determining a change in the target information within a preset time period, wherein the target information is more consistent with the heat dissipation requirement of the target device than any operating information is consistent with the heat dissipation requirement of the target device; Based on the change satisfying the triggering condition of the first heat dissipation mode, determining that the target information satisfies the first condition, or Based on the change satisfying the triggering condition of the second heat dissipation mode, it is determined that the target information satisfies the second condition, and the heat dissipation requirement of the second condition is greater than the heat dissipation requirement of the first condition.

5. The configuration method according to any one of claims 1 to 4, comprising: Obtaining multiple operation information of a target device in an electronic device; The target information is determined based on a combination of at least two of the multiple pieces of operating information, different operating information determines different target information, and the target information can characterize the heat dissipation requirements of the target device; the target information is used to control the operation of the heat dissipation module in the electronic device.

6. The configuration method according to any one of claims 1 to 4, comprising: Obtaining operation information of a target device in at least two operation scenarios; Determining at least one relevant information of the target device based on the operation information of the target device; Determine changes in relevant information of the target device between a first operating scenario and a second operating scenario, where a heat dissipation requirement of the first operating scenario is different from a heat dissipation requirement of the second operating scenario; Based on the fact that a change in any relevant information between the first operation scenario and the second operation scenario is greater than a set change amount, the any relevant information is determined to be target information.

7. The configuration method according to claim 5, wherein determining the change of the target information within a preset time period based on the at least two pieces of operation information comprises: determining a temperature difference based on a target device temperature and a board end temperature of a circuit board, wherein the target device is arranged on the circuit board, and the operation information includes the target device temperature and the board end temperature; Determine how the temperature difference changes over a preset time period.

8. The configuration method according to claim 2, comprising: In the process of controlling the heat dissipation module to operate in the first heat dissipation mode, based on the specific operating parameter of the target device being greater than a set threshold, real-time statistics are collected on the duration of the specific operating parameter being greater than the set threshold; If the duration is longer than the first set duration, adjusting the operating parameters of the heat dissipation module based on the specific operating parameters; If the duration is not greater than the first set duration, responding to the specific operating parameter is prohibited.

9. The configuration method according to claim 4, wherein adjusting the operating parameters of the heat dissipation module based on the specific operating parameters comprises: Based on the duration of switching to any first operating parameter reaching the first target duration, based on the specific operating parameter, the step of obtaining the operating information of the target device in the electronic device is triggered.

10. The configuration method according to claim 1, comprising: receiving a switching instruction; Based on the switching instruction indicating switching to the first heat dissipation mode, controlling the heat dissipation module of the electronic device to operate in the first heat dissipation mode; Based on the switching instruction representation switching to the second heat dissipation mode, the heat dissipation module of the electronic device is controlled to operate in the second heat dissipation mode, and the load supported by the electronic device in the second heat dissipation mode is higher than the load supported in the first heat dissipation mode.

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