Batch surface mounting device for PCB (Printed Circuit Board) processing and surface mounting method thereof

Abstract

The invention relates to the field of electronic component processing, in particular to a batch surface mounting device for PCB processing and a surface mounting method thereof, and the batch surface mounting device comprises a plurality of adjusting seats and a plurality of adsorption seats; the multiple adjusting seats are arranged at intervals in the linear direction, the adjusting seats are located over the conveying equipment, each adjusting seat is provided with a second driving shaft, the axis direction of the second driving shafts is the same as the width direction of the conveying equipment, and the second driving shafts are used for changing the positions of the adjusting seats; the multiple adsorption seats are installed at the bottom ends of the multiple adjusting seats respectively, lifting rods are arranged between the adsorption seats and the adjusting seats and used for driving the adsorption seats to move in the longitudinal direction, air pipes are arranged on the surfaces of the adsorption seats and the adjusting seats, one ends of the air pipes are connected with the bottom ends of the adsorption seats, and the other ends of the air pipes are connected with pneumatic equipment. The plurality of adjusting seats and the adsorption seats are started at the same time to perform surface mounting on the PCB, and the surface mounting mode can perform large-batch surface mounting operation on the electric elements, so that the time-saving and efficiency-increasing effects are better.

Description

Technical Field

[0001] The present invention relates to the field of electronic component processing, and in particular to a batch patch device and a patch method for PCB board processing. Background Art

[0002] PCB, also known as printed circuit board, is an important electronic component. Because it is made by electronic printing, it is also called "printed" circuit board. The main function of printed circuit board is to connect various electronic components through circuits, play the role of conduction and transmission, and is a key electronic interconnection part of electronic products. Almost every electronic device on the market cannot do without printed circuit boards.

[0003] The placement machine is used in the production line after the dispensing machine or screen printer. It is a device that accurately places surface mount components on the PCB pads by moving the placement head.

[0004] Currently, there are two types of PCB mounting: manual and fully automatic. However, both manual and fully automatic mounting equipment have slow mounting speeds and cannot perform synchronous mounting on multiple PCB boards at the same time. Summary of the invention

[0005] Based on this, it is necessary to provide a batch patch device and a patch method for PCB board processing to address the above technical problems, which can perform large-scale patch operations on electrical components and achieve better time-saving and efficiency-enhancing effects.

[0006] The present invention provides a batch patch device for PCB board processing, the device comprising: A plurality of adjustment seats are arranged at intervals along a linear direction, the adjustment seats are located directly above the conveying device, each of the adjustment seats is provided with a second drive shaft, the axial direction of the second drive shaft is the same as the width direction of the conveying device, and the second drive shaft is used to change the position of the adjustment seat; Multiple adsorption seats are respectively installed at the bottom ends of the multiple adjustment seats, a lifting rod is arranged between the adsorption seat and the adjustment seat, and the lifting rod is used to drive the adsorption seat to move longitudinally, and air pipes are arranged on the surfaces of the adsorption seat and the adjustment seat, one end of the air pipe is connected to the bottom end of the adsorption seat, and the other end of the air pipe is connected to the pneumatic device.

[0007] In one embodiment, the conveying equipment includes a first fixed frame, a first driving shaft and a conveyor belt; two first fixed frames are arranged opposite to each other, two first driving shafts are distributed at intervals along the length direction of the first fixed frames and are installed on the two first fixed frames, and the two ends of the conveyor belt are respectively mounted on the two first driving shafts.

[0008] In one embodiment, a second fixing frame is provided on one side of the first fixing frame, the second fixing frame includes a positioning plate and a fixing tube, the two positioning plates are arranged opposite to each other up and down, the two fixing tubes are arranged at intervals and are located between the two positioning plates, the ends of the fixing tubes pass through the positioning plates, a third fixing frame is installed on the second fixing frame, the third fixing frame is inserted into the fixing tube, and the second drive shaft is installed on the third fixing frame.

[0009] In one embodiment, the third fixing frame includes a first folding plate and a second folding plate; the two first folding plates are respectively located above the two second fixing frames, one end of the first folding plate is vertically arranged, the other end of the first folding plate is bent to fit the positioning plate, the second folding plate is located directly above the two first folding plates, both side ends of the second folding plate are bent to connect with the top ends of the two first folding plates, a first mounting hole is opened on the surface of the second folding plate, and a through opening is opened at the top end of the second folding plate.

[0010] In one embodiment, the adjustment seat includes a first fixed plate, a side plate and a fixed block; the top of the first fixed plate is lower than the top of the side plate, the two side plates are respectively fixed on both sides of the first fixed plate, the fixed block is fixed to the bottom end of the first fixed plate, the top of the fixed block is a plane, the bottom end of the fixed block is set as an arc surface, a threaded hole is opened at the end of the fixed block for transmission connection with the second drive shaft, and an installation cavity is formed between the fixed block and the side plate.

[0011] In one embodiment, the adsorption seat includes a clamping block and a second fixed plate; a limiting groove is provided at the top of the clamping block, and the bottom surface of the limiting groove is set as an arc surface for fitting the fixed block, the clamping block is clamped in the installation cavity, and the second fixed plate is fixed to the bottom end of the clamping block, and a plurality of ventilation grooves are provided at the bottom end of the second fixed plate.

[0012] In one embodiment, a second mounting hole is provided at the connection between the first fixing plate and the side plate, one end of the second mounting hole vertically penetrates to the highest point of the top of the mounting cavity, the other end of the second mounting hole is bent upward and faces directly above the first fixing plate, the lifting end of the lifting rod is installed in the second mounting hole facing downward, and the other end of the lifting rod is bent and clamped in the second mounting hole.

[0013] In one embodiment, a plurality of through holes are provided on the side surface of the side panel, and the plurality of through holes are horizontally spaced apart, and the through holes are located above the first fixing plate. A through groove is provided on the bottom end of the side panel, and a third mounting hole is provided on the side end of the clamping block, and one end of the third mounting hole is perpendicular to the side surface of the clamping block, and the other end of the third mounting hole vertically penetrates into the ventilation groove.

[0014] In one embodiment, the air pipe includes a first bent portion, a straight pipe portion, a second bent portion and a connecting pipe portion; one end of the first bent portion is plugged and fixed in the third mounting hole, the other end of the first bent portion faces a direction away from the side of the clamping block, the second bent portion is installed in the through hole, one end of the second bent portion is bent downward and connected to the first bent portion through the straight pipe portion, there is a gap between the straight pipe portion and the side of the clamping block, the other end of the second bent portion is bent upward and connected to the pneumatic equipment through the connecting pipe portion.

[0015] The present invention further provides a batch patch method for PCB board processing, which is applied to the batch patch device for PCB board processing described in any of the above embodiments, and the method comprises: The electrical components and PCB boards to be attached are placed on the conveying device in sequence, so that the conveying device drives the electrical components and PCB boards to move to the bottom of the adjustment seat; The adjustment seat is controlled by the second driving shaft to move left and right, and the adsorption seat is controlled by the lifting rod to move up and down, so that the bottom end of the adsorption seat can be attached to the surface of the electrical component to be attached; After the adsorption seat adsorbs the electrical component, it will move to the bottom of the PCB board for patching.

[0016] The above-mentioned batch patch device and patch method for PCB board processing are used to sequentially place the electrical components and PCB boards to be attached on the conveying equipment, so that the conveying equipment drives the electrical components and PCB boards to move to the bottom of the adjustment seat. The adjustment seat is moved left and right under the control of the second drive shaft, and the adsorption seat is moved up and down under the control of the lifting rod, so that the bottom end of the adsorption seat can be attached to the surface of the electrical component to be attached. At this time, the adsorption seat adsorbs the electrical component, and the conveying equipment stops conveying during the adsorption process. When the adsorption seat completes adsorption of the electrical component, the conveying equipment continues to convey and moves the PCB board to the bottom of the adjustment seat. At this time, multiple adjustment seats and adsorption seats are started at the same time to perform patch operations on the PCB board. This patch method can perform large-scale patch operations on electrical components, and the time-saving and efficiency-increasing effects are better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the three-dimensional structure of the patch device provided by the present invention; Figure 2 A schematic diagram of a partially disassembled structure of a patch device provided by the present invention; Figure 3 A schematic diagram of the structure of the conveying equipment provided by the present invention; Figure 4 A schematic diagram of the structure of the adjustment seat provided by the present invention; Figure 5 A schematic diagram of the structure of the adsorption seat provided by the present invention; Figure 6 A schematic diagram of the structure of the trachea provided by the present invention.

[0019] Reference numerals: 100, conveying device; 110, first fixed frame; 120, first driving shaft; 130, conveyor belt; 210, second fixed frame; 211, positioning plate; 212, fixing pipe; 220, third fixed frame; 221, fixing rod; 222, first folding plate; 2221, first mounting hole; 223, second folding plate; 2231, through-hole; 230, second driving shaft; 300, adjusting seat; 310, first fixed plate; 320, side plate; 321, through hole; 322, through groove; 330, fixed block; 331, threaded hole; 340, mounting cavity; 350, second mounting hole; 400, adsorption seat; 410, clamping block; 411, limiting groove; 420, second fixing plate; 421, ventilation groove; 430, third mounting hole; 500, lifting rod; 600, air pipe; 610, first bending portion; 620, straight pipe portion; 630, second bending portion; 640, connecting pipe portion. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Combine the following Figures 1 to 6The present invention describes a batch chip placement device and a chip placement method for PCB board processing.

[0022] like Figure 1 and Figure 2 As shown, in one embodiment, a batch patch device for PCB board processing includes a plurality of adjustment seats 300 and a plurality of adsorption seats 400; the plurality of adjustment seats 300 are arranged at intervals along a linear direction, the adjustment seats 300 are located directly above the conveying device 100, and each adjustment seat 300 is provided with a second drive shaft 230, the axial direction of the second drive shaft 230 is the same as the width direction of the conveying device 100, and the second drive shaft 230 is used to change the position of the adjustment seat 300; the plurality of adsorption seats 400 are respectively installed at the bottom ends of the plurality of adjustment seats 300, and a lifting rod 500 is provided between the adsorption seat 400 and the adjustment seat 300, and the lifting rod 500 is used to drive the adsorption seat 400 to move in the longitudinal direction, and an air pipe 600 is provided on the surface of the adsorption seat 400 and the adjustment seat 300, one end of the air pipe 600 is connected to the bottom end of the adsorption seat 400, and the other end of the air pipe 600 is connected to the pneumatic device.

[0023] The above-mentioned batch patch device for PCB board processing, when in use, arranges the electrical components and PCB boards to be attached in sequence on the conveying device 100, so that the conveying device 100 drives the electrical components and PCB boards to move to the bottom of the adjustment seat 300, and the adjustment seat 300 is moved left and right under the control of the second drive shaft 230, and the adsorption seat 400 is moved up and down under the control of the lifting rod 500, so that the bottom end of the adsorption seat 400 can be attached to the surface of the electrical component to be attached. At this time, the adsorption seat 400 adsorbs the electrical component, and the conveying device 100 stops conveying during the adsorption process. When the adsorption seat 400 completes the adsorption of the electrical component, the conveying device 100 continues to convey and moves the PCB board to the bottom of the adjustment seat 300. At this time, multiple adjustment seats 300 and adsorption seats 400 are started at the same time to perform patch operations on the PCB board. This patch method can perform large-scale patch operations on electrical components, and the time-saving and efficiency-increasing effects are better.

[0024] like Figure 3 As shown, in one embodiment, the conveying device 100 includes a first fixed frame 110, a first driving shaft 120 and a conveyor belt 130; the two first fixed frames 110 are arranged opposite to each other, the two first driving shafts 120 are spaced apart along the length direction of the first fixed frames 110 and are installed on the two first fixed frames 110, and the two ends of the conveyor belt 130 are respectively mounted on the two first driving shafts 120.

[0025] Specifically, a second fixing frame 210 is arranged on one side of the first fixing frame 110, and the second fixing frame 210 includes a positioning plate 211 and a fixing tube 212. The two positioning plates 211 are arranged opposite to each other up and down, and the two fixing tubes 212 are arranged at intervals and are located between the two positioning plates 211. The end of the fixing tube 212 passes through the positioning plate 211. A third fixing frame 220 is installed on the second fixing frame 210, and the third fixing frame 220 is inserted into the fixing tube 212. The second drive shaft 230 is installed on the third fixing frame 220.

[0026] Among them, the third fixing frame 220 includes a first folding plate 222 and a second folding plate 223; the two first folding plates 222 are respectively located above the two second fixing frames 210, and a fixing rod 221 is installed at the bottom end of the first folding plate 222, and the fixing rod 221 is inserted into the fixing tube 212. One end of the first folding plate 222 is vertically arranged, and the other end of the first folding plate 222 is bent to fit the positioning plate 211. The second folding plate 223 is located directly above the two first folding plates 222, and the two side ends of the second folding plate 223 are bent to connect with the top ends of the two first folding plates 222. A first mounting hole 2221 is opened on the surface of the second folding plate 223, and a through opening 2231 is opened at the top end of the second folding plate 223.

[0027] like Figure 4 As shown, in one embodiment, the adjustment seat 300 includes a first fixed plate 310, a side plate 320 and a fixed block 330; the top of the first fixed plate 310 is lower than the top of the side plate 320, and the two side plates 320 are respectively fixed on both sides of the first fixed plate 310, and the fixed block 330 is fixed to the bottom end of the first fixed plate 310, the top of the fixed block 330 is a plane, and the bottom end of the fixed block 330 is set as an arc surface, and a threaded hole 331 is opened at the end of the fixed block 330 for transmission connection with the second drive shaft 230, and an installation cavity 340 is formed between the fixed block 330 and the side plate 320.

[0028] Specifically, the top end of the side plate 320 abuts against the inner top surface of the second folding plate 223 , and the width between the two side plates 320 is the same as the width of the through hole 2231 . The air pipe 600 passes through the through hole 2231 after passing through the adsorption seat 400 and the adjustment seat 300 .

[0029] like Figure 5 As shown, in one embodiment, the adsorption seat 400 includes a clamping block 410 and a second fixing plate 420; a limiting groove 411 is provided at the top of the clamping block 410, and the bottom surface of the limiting groove 411 is set as an arc surface for fitting the fixing block 330, the clamping block 410 is clamped in the installation cavity 340, and the second fixing plate 420 is fixed at the bottom end of the clamping block 410, and a plurality of ventilation grooves 421 are provided at the bottom end of the second fixing plate 420.

[0030] Specifically, when the clamping block 410 is completely clamped in the installation cavity 340 , the top end of the second fixing plate 420 fits with the bottom end of the side plate 320 , forming a complete rectangular structure therebetween.

[0031] In one embodiment, a second mounting hole 350 is opened at the connection between the first fixing plate 310 and the side plate 320, and one end of the second mounting hole 350 vertically penetrates to the highest point of the top of the mounting cavity 340, and the other end of the second mounting hole 350 is bent upward and faces directly above the first fixing plate 310. The lifting end of the lifting rod 500 is installed in the second mounting hole 350 facing downward, and the other end of the lifting rod 500 is bent and clamped in the second mounting hole 350.

[0032] Furthermore, a plurality of through holes 321 are provided on the side of the side panel 320, and the plurality of through holes 321 are horizontally spaced apart. The through holes 321 are located above the first fixed plate 310, a through groove 322 is provided at the bottom end of the side panel 320, and a third mounting hole 430 is provided at the side end of the clamping block 410, and one end of the third mounting hole 430 is perpendicular to the side of the clamping block 410, and the other end of the third mounting hole 430 is vertically connected to the ventilation groove 421.

[0033] like Figure 6 As shown, in one embodiment, the air pipe 600 includes a first bend portion 610, a straight pipe portion 620, a second bend portion 630 and a connecting pipe portion 640; one end of the first bend portion 610 is plugged and fixed in the third mounting hole 430, the other end of the first bend portion 610 faces a direction away from the side of the clamping block 410, the second bend portion 630 is installed in the through hole 321, one end of the second bend portion 630 is bent downward and connected to the first bend portion 610 through the straight pipe portion 620, there is a gap between the straight pipe portion 620 and the side of the clamping block 410, the other end of the second bend portion 630 is bent upward and connected to the pneumatic equipment through the connecting pipe portion 640.

[0034] Specifically, since there is a gap between the straight tube portion 620 and the side of the clamping block 410, and the distance between the adjustment seat 300 and the adsorption seat 400 will change, when the distance between the adjustment seat 300 and the adsorption seat 400 increases, the two ends of the straight tube portion 620 will be pulled toward the through hole 321 and the third mounting hole 430 respectively, and the main body of the straight tube portion 620 will approach the side of the clamping block 410.

[0035] In one embodiment, a batch patch method for PCB board processing is applied to a batch patch device for PCB board processing in any of the above embodiments, comprising the following steps: The electrical components and PCB boards to be attached are placed on the conveying device in sequence, so that the conveying device drives the electrical components and PCB boards to move below the adjustment seat.

[0036] The adjustment seat is moved left and right under the control of the second driving shaft, and the adsorption seat is moved up and down under the control of the lifting rod, so that the bottom end of the adsorption seat can be attached to the surface of the electrical component to be attached.

[0037] After the adsorption seat adsorbs the electrical component, it will move to the bottom of the PCB board for patching.

[0038] The above-mentioned batch patch method for PCB board processing, when in use, the electrical components and PCB boards to be attached are placed on the conveying equipment in sequence, so that the conveying equipment drives the electrical components and PCB boards to move to the bottom of the adjustment seat, the adjustment seat is moved left and right under the control of the second drive shaft, and the adsorption seat is moved up and down under the control of the lifting rod, so that the bottom end of the adsorption seat can be attached to the surface of the electrical component to be attached, at this time the adsorption seat adsorbs the electrical component, and the conveying equipment stops conveying during the adsorption process, when the adsorption seat completes the adsorption of the electrical component, the conveying equipment continues to convey and moves the PCB board to the bottom of the adjustment seat, at this time multiple adjustment seats and adsorption seats are started at the same time, and the PCB board is patched, this patch method can perform large-scale patch operations on electrical components, and the time-saving and efficiency-increasing effects are better.

[0039] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A batch patch device for PCB board processing, characterized in that: The device comprises: A plurality of adjustment seats are arranged at intervals along a linear direction, the adjustment seats are located directly above the conveying device, each of the adjustment seats is provided with a second drive shaft, the axial direction of the second drive shaft is the same as the width direction of the conveying device, and the second drive shaft is used to change the position of the adjustment seat; Multiple adsorption seats are respectively installed at the bottom ends of the multiple adjustment seats, a lifting rod is arranged between the adsorption seat and the adjustment seat, and the lifting rod is used to drive the adsorption seat to move longitudinally, and air pipes are arranged on the surfaces of the adsorption seat and the adjustment seat, one end of the air pipe is connected to the bottom end of the adsorption seat, and the other end of the air pipe is connected to the pneumatic device.

2. The batch patch device for PCB board processing according to claim 1, characterized in that: The conveying equipment includes a first fixed frame, a first driving shaft and a conveyor belt; two first fixed frames are arranged opposite to each other, two first driving shafts are distributed at intervals along the length direction of the first fixed frames and are installed on the two first fixed frames, and both ends of the conveyor belt are respectively mounted on the two first driving shafts.

3. The batch patch device for PCB board processing according to claim 2 is characterized in that: A second fixing frame is arranged on one side of the first fixing frame, and the second fixing frame includes a positioning plate and a fixing tube, the two positioning plates are arranged opposite to each other up and down, the two fixing tubes are arranged at intervals and are located between the two positioning plates, and the ends of the fixing tubes pass through the positioning plates. A third fixing frame is installed on the second fixing frame, and the third fixing frame is inserted into the fixing tube, and the second driving shaft is installed on the third fixing frame.

4. The batch placement device for PCB board processing according to claim 3 is characterized in that: The third fixing frame includes a first folding plate and a second folding plate; the two first folding plates are respectively located above the two second fixing frames, one end of the first folding plate is vertically arranged, the other end of the first folding plate is bent to fit the positioning plate, the second folding plate is located directly above the two first folding plates, both side ends of the second folding plate are bent to connect with the top ends of the two first folding plates, a first mounting hole is opened on the surface of the second folding plate, and a through opening is opened at the top end of the second folding plate.

5. The batch placement device for PCB board processing according to claim 1 is characterized in that: The adjustment seat includes a first fixing plate, a side plate and a fixing block; the top of the first fixing plate is lower than the top of the side plate, the two side plates are respectively fixed on both sides of the first fixing plate, the fixing block is fixed to the bottom end of the first fixing plate, the top of the fixing block is a plane, the bottom end of the fixing block is set as an arc surface, a threaded hole is opened at the end of the fixing block for transmission connection with the second drive shaft, and an installation cavity is formed between the fixing block and the side plate.

6. The batch placement device for PCB board processing according to claim 5 is characterized in that: The adsorption seat includes a clamping block and a second fixed plate; a limiting groove is provided at the top of the clamping block, and the bottom surface of the limiting groove is set as an arc surface for fitting the fixed block; the clamping block is clamped in the installation cavity, and the second fixed plate is fixed to the bottom end of the clamping block, and a plurality of ventilation grooves are provided at the bottom end of the second fixed plate.

7. The batch placement device for PCB board processing according to claim 6 is characterized in that: A second mounting hole is provided at the connection between the first fixing plate and the side plate, one end of the second mounting hole vertically penetrates to the highest point of the top of the mounting cavity, the other end of the second mounting hole is bent upward and faces directly above the first fixing plate, the lifting end of the lifting rod is installed in the second mounting hole facing downward, and the other end of the lifting rod is bent and clamped in the second mounting hole.

8. The batch placement device for PCB board processing according to claim 6, characterized in that: A plurality of through holes are provided on the side surface of the side plate, and the plurality of through holes are horizontally spaced and arranged above the first fixing plate. A through groove is provided on the bottom end of the side plate, and a third mounting hole is provided on the side end of the clamping block, and one end of the third mounting hole is perpendicular to the side surface of the clamping block, and the other end of the third mounting hole vertically penetrates the ventilation groove.

9. The batch placement device for PCB board processing according to claim 8, characterized in that: The air pipe includes a first bent portion, a straight pipe portion, a second bent portion and a connecting pipe portion; one end of the first bent portion is inserted and fixed in the third mounting hole, the other end of the first bent portion faces a direction away from the side of the clamping block, the second bent portion is installed in the through hole, one end of the second bent portion is bent downward and connected to the first bent portion through the straight pipe portion, there is a gap between the straight pipe portion and the side of the clamping block, the other end of the second bent portion is bent upward and connected to the pneumatic equipment through the connecting pipe portion.

10. A batch patch method for PCB board processing, applied to the batch patch device for PCB board processing as claimed in any one of claims 1 to 9, characterized in that: The method comprises: The electrical components and PCB boards to be attached are placed on the conveying device in sequence, so that the conveying device drives the electrical components and PCB boards to move to the bottom of the adjustment seat; The adjustment seat is controlled by the second driving shaft to move left and right, and the adsorption seat is controlled by the lifting rod to move up and down, so that the bottom end of the adsorption seat can be attached to the surface of the electrical component to be attached; After the adsorption seat adsorbs the electrical component, it will move to the bottom of the PCB board for patching.

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