Display device and electronic device including the same

Abstract

A display device and an electronic device including the same are provided. The display device includes: a display panel including a first surface and a second surface opposite to the first surface; and a cover film including a first portion disposed on the first surface of the display panel, a second portion covering a side surface of the display panel, the side surface being disposed between the first surface and the second surface, and at least a portion of the second portion being bent, and a third portion disposed on the second surface of the display panel. The cover film includes a first insulating cover layer, a conductive cover layer disposed on the first insulating cover layer, and a second insulating cover layer disposed on the conductive cover layer. The second insulating cap layer includes an opening exposing the conductive cap layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0156659 filed in the Korean Intellectual Property Office on November 13, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device and an electronic device including the display device, and more particularly, to a display device having a cover film. Background Art

[0004] The display device may include a plurality of conductive structures. In the event that an electrostatic discharge (ESD) phenomenon occurs near the conductive structures, the conductive structures may be damaged, thereby reducing the reliability of the electrical signals.

[0005] Therefore, methods of eliminating ESD have been explored. Summary of the invention

[0006] A display device includes: a display panel including a first surface and a second surface opposite to the first surface; and a covering film including a first portion disposed on the first surface of the display panel, a second portion covering a side surface of the display panel, and a third portion disposed on the second surface of the display panel, the side surface being disposed between the first surface and the second surface, and at least a portion of the second portion being bent. The covering film includes a first insulating covering layer, a conductive covering layer disposed on the first insulating covering layer, and a second insulating covering layer disposed on the conductive covering layer. The second insulating covering layer includes an opening exposing the conductive covering layer.

[0007] The conductive cover layer may form an electrostatic discharge (ESD) path to dissipate ESD along the opening.

[0008] The opening may be formed in the first portion of the cover film, and may not exist in each of the second portion of the cover film and the third portion of the cover film.

[0009] The opening may include a plurality of openings.

[0010] The plurality of openings may be arranged in a matrix structure with respect to a first direction and a second direction different from the first direction.

[0011] A plurality of openings may be sequentially arranged in a given direction.

[0012] The plurality of openings may include a first opening and a second opening. The size of the first opening may be greater than the size of the second opening.

[0013] The first opening may include a first side opening and a first intermediate opening between the first side openings. The first side opening and the first intermediate opening may be adjacent to each other in a given direction. The size of each of the first side openings may be greater than the size of the first intermediate opening.

[0014] The second opening may include a plurality of second openings. The plurality of second openings may be arranged in a matrix structure with respect to the first direction and a second direction different from the first direction.

[0015] The opening may comprise only a single opening.

[0016] The opening may have a shape extending mainly in a given direction.

[0017] The first insulating cover layer may have a first thickness. The second insulating cover layer may have a second thickness that is smaller than the first thickness.

[0018] The display device may include a display area and a non-display area surrounding at least a portion of the display area. The display device may further include a sensor layer, which is disposed on the display panel and includes a sensing electrode and a sensing line electrically connected to the sensing electrode. The sensing line may be disposed in the non-display area.

[0019] The opening may be adjacent to the sensing line.

[0020] The display device may further include a polarization layer disposed on the sensor layer. In a plan view, the sensing line and the polarization layer may overlap each other.

[0021] The display panel may include pixels. The display device may further include a driving circuit component configured to drive the pixels. The sensing line may be provided between the display area and the driving circuit component.

[0022] The first portion of the cover film may cover the driving circuit component.

[0023] The display device may further include: a circuit substrate disposed on a second surface of the display panel; and a curved film including at least a first portion disposed on the pixel circuit layer of the display panel and at least a second portion disposed on the circuit substrate. The second portion of the cover film may cover a portion of the curved film. The third portion of the cover film may cover another portion of the curved film and the circuit substrate.

[0024] The display device may be a windowless structure.

[0025] A windowless display device includes: a display panel including a first surface and a second surface opposite to the first surface; a sensor layer disposed on the display panel and including a sensing electrode and a sensing line electrically connected to the sensing electrode; a polarization layer disposed on the sensor layer; and a cover film, at least a portion of which is disposed on the display panel. The cover film includes a first insulating cover layer, a conductive cover layer disposed on the first insulating cover layer, and a second insulating cover layer disposed on the conductive cover layer. The second insulating cover layer includes an opening exposing the conductive cover layer. The opening includes a plurality of openings. At least some of the plurality of openings are sequentially formed in a direction in which the sensing line extends.

[0026] An electronic device includes: a processor configured to provide input image data; a display device configured to display an image based on the input image data, the display device including a sub-pixel region; and a power supply configured to supply power to the display device. The display device includes: a display panel including a first surface and a second surface opposite to the first surface; and a covering film including a first portion disposed on the first surface of the display panel, a second portion covering a side surface of the display panel, and a third portion disposed on the second surface of the display panel, the side surface being disposed between the first surface and the second surface, and at least a portion of the second portion being bent. The covering film includes a first insulating covering layer, a conductive covering layer disposed on the first insulating covering layer, and a second insulating covering layer disposed on the conductive covering layer. The second insulating covering layer includes an opening exposing the conductive covering layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] A more complete understanding of the present disclosure and its many attendant aspects will be readily obtained by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a schematic plan view illustrating a display device according to an embodiment of the present disclosure,

[0029] Figure 2 is a schematic cross-sectional view illustrating a display device according to an embodiment of the present disclosure,

[0030] Figure 3 It is along Figure 1 A schematic cross-sectional view taken along line AA' of

[0031] Figure 4 is a schematic perspective view illustrating a display device according to an embodiment of the present disclosure,

[0032] Figure 5 is a schematic cross-sectional view illustrating a cover film according to an embodiment of the present disclosure, and

[0033] Figures 6 to 9 are schematic diagrams each illustrating a cover film according to an embodiment of the present disclosure.

[0034] Fig.10 is a schematic block diagram illustrating an electronic device including a display device according to an embodiment.

[0035] Fig.11 It is a diagram of Fig.10 A schematic diagram of an example in which the electronic device is implemented as a smart phone.

[0036] Fig.12 It is a diagram of Fig.10 1 is a schematic diagram of an example in which the electronic device 1000 is implemented as a tablet computer. DETAILED DESCRIPTION

[0037] Since the present disclosure allows various changes and multiple embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. However, the present disclosure is not necessarily limited to a specific mode of practice, and it should be understood that all changes, equivalents and substitutes that do not depart from the spirit and technical scope of the present disclosure are included in the present disclosure.

[0038] It will be understood that although the terms "first", "second", etc. can be used to describe various elements in this article, these elements are not necessarily limited by these terms. These terms are used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, the first element discussed below can be referred to as the second element. Similarly, the second element can also be referred to as the first element. In the present disclosure, the singular form is also intended to include the plural form, unless the context clearly indicates otherwise.

[0039] It will be further understood that when used in the present disclosure, the terms "comprise", "include", "have", etc., specify the presence of the stated features, wholes, steps, operations, elements, parts and / or combinations thereof, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or combinations thereof. In addition, in the case where a first part such as a layer, film, region or plate is disposed on a second part, the first part may not only be directly on the second part, but also a third part may be between them. In addition, when expressing that a first part such as a layer, film, region or plate is formed on a second part, the surface of the second part on which the first part is formed is not necessarily limited to the upper surface of the second part, but may include other surfaces such as the side surface or lower surface of the second part. On the contrary, in the case where a first part such as a layer, film, region or plate is below the second part, the first part may not only be directly below the second part, but also a third part may be between them.

[0040] Various embodiments of the present disclosure relate to a display device and an electronic device including the same. Hereinafter, a display device and an electronic device including the same according to embodiments will be described with reference to the accompanying drawings.

[0041] Figure 1 is a schematic plan view illustrating a display device DD according to an embodiment of the present disclosure.

[0042] refer to Figure 1 The display device DD may include a substrate layer and a pixel PXL disposed on the substrate layer. The display device DD may further include a driving circuit component COG, a line and a pad. In an embodiment of the present disclosure, the line may include a sensing line TMP. The pad may include a sensing pad PAD_S.

[0043] The display device DD (or substrate layer) may include a display area DA and a non-display area NDA. The non-display area NDA may refer to an area other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA.

[0044] The base layer may form a base surface of the display device DD. The base layer may be a rigid or flexible substrate or film. For example, the base layer may include glass. Alternatively, the base layer may include silicon. As a further alternative example, the base layer may include polyimide. However, the present disclosure is not necessarily limited to the aforementioned examples.

[0045] The display area DA may refer to an area in which the pixels PXL are disposed. The non-display area NDA may refer to an area in which the pixels PXL are not disposed. Driving circuit components COG, lines, and pads connected to the pixels PXL of the display area DA may be disposed in the non-display area NDA.

[0046] According to an embodiment of the present disclosure, the pixel PXL (or sub-pixel SPX) may be arranged in stripes or Arrangement structures and the like are arranged, but the present disclosure is not necessarily limited thereto. is an arrangement of light emitting areas used in a display device manufactured by Samsung. Various embodiments may be applied to the present disclosure.

[0047] According to an embodiment of the present disclosure, each pixel PXL (or sub-pixel SPX) may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may be a sub-pixel. At least one first sub-pixel SPX1, at least one second sub-pixel SPX2, and at least one third sub-pixel SPX3 may form a pixel unit that may emit light of various colors.

[0048] Each of the first subpixel SPX1 , the second subpixel SPX2 , and the third subpixel SPX3 may emit light of a single color.

[0049] For example, the first sub-pixel SPX1 may be a red pixel configured to emit red light (e.g., a first color light), the second sub-pixel SPX2 may be a green pixel configured to emit green light (e.g., a second color light), and the third sub-pixel SPX3 may be a blue pixel configured to emit blue light (e.g., a third color light). The red pixel may provide light in a wavelength range of 600nm to 750nm. The green pixel may provide light in a wavelength range of 480nm to 560nm. The blue pixel may provide light in a wavelength range of 370nm to 460nm.

[0050] According to an embodiment of the present disclosure, the number of second subpixels SPX2 may be greater than the number of first subpixels SPX1 or the number of third subpixels SPX3. The colors, types and / or numbers of the first subpixels SPX1, second subpixels SPX2 and third subpixels SPX3 forming each pixel unit are not necessarily limited to specific examples.

[0051] The driving circuit part COG may be disposed at the side S of the display area DA. The driving circuit part COG may be disposed in the non-display area NDA, and may be placed outside the sensing line TMP.

[0052] The driving circuit part COG may include a scan driver, a data driver, and a sensor driver (e.g., a touch driver). The scan driver may be configured to supply a scan signal to the pixel PXL. The data driver may be configured to supply a data signal to the pixel PXL. In an embodiment of the present disclosure, each pixel PXL may be electrically connected to the driving circuit part COG, and may emit light based on an electrical signal provided from the driving circuit part COG.

[0053] At least a portion of the sensing line TMP may be placed at the side S of the display area DA. The sensing line TMP may be disposed in the non-display area NDA and may be disposed between the display area DA and the driving circuit part COG. The sensing line TMP may extend from the non-display area NDA in the first direction DR1. Therefore, the sensing line TMP may be adjacent to the driving circuit part COG and may be adjacent to the edge of the display device DD.

[0054] The sensing line TMP may include a conductive material and may be electrically connected to a sensing electrode SP (refer to FIG. Figure 3). The sensing electrode SP may be configured to obtain information about a touch input from a user. The information about the touch input may include an electrical signal based on a touch provided from the user. For example, the sensing electrode SP may include a first sensing electrode and a second sensing electrode, and may operate in a mutual capacitance manner or in a self-capacitance manner. The sensing electrode SP may be disposed in an area to form a touch active area. On a plane, the touch active area may overlap with the display area DA. In this specification, the term "plane" may refer to a plane extending in a first direction DR1 and a second direction DR2.

[0055] The sensing line TMP may be electrically connected to the sensing pad PAD_S. The sensing pad PAD_S may be electrically connected to the sensor driver. Therefore, the sensor driver and the sensing electrode SP may be electrically connected to each other through the sensing pad PAD_S and the sensing line TMP. The sensor driver may supply a sensing drive signal to the sensing electrode SP. The sensing electrode SP may supply a sensing signal to the sensor driver.

[0056] Figure 2 is a schematic cross-sectional view illustrating a display device DD according to an embodiment of the present disclosure.

[0057] refer to Figure 2 , the display device DD may include a display panel DP, a lower layer LWL, a sensor layer SEL and an upper layer UPL.

[0058] The display panel DP may be configured to emit light. The display panel DP may include a pixel circuit layer PCL and a display layer DL. The display panel DP may include a first surface S1 forming a front surface and a second surface S2 forming a rear surface opposite to the first surface S1.

[0059] The pixel circuit layer PCL may be a layer including a pixel circuit configured to drive the pixel PXL. The pixel circuit layer PCL may include a backplane layer. For example, the pixel circuit layer PCL may include a substrate layer and a pixel circuit disposed on the substrate layer. The pixel circuit layer PCL may include a conductive layer and an insulating layer. The conductive layer may form a pixel circuit. The pixel circuit may include a pixel circuit configured to drive a sub-pixel SPX or a light-emitting element LD (refer to Figure 3 ) circuit elements.

[0060] The display layer DL may be disposed on the pixel circuit layer PCL. The display layer DL may include a light emitting element LD. Each light emitting element LD may include an inorganic light emitting diode including an inorganic material, or may include an organic light emitting diode including an organic material. However, the present disclosure is not necessarily limited to a specific example.

[0061] The lower layer LWL may be disposed on the second surface S2 of the display panel DP. The lower layer LWL may form a circuit substrate PCB (refer to Figure 3 ) is disposed on a substrate. In an embodiment of the present disclosure, the lower layer LWL may include various materials. For example, the lower layer LWL may include a heat dissipation layer. However, the present disclosure is not necessarily limited to the aforementioned examples.

[0062] The sensor layer SEL may be disposed on the first surface S1 of the display panel DP. The sensor layer SEL may be configured to acquire information about a touch input from a user. The sensor layer SEL may include a sensing electrode SP and a sensing line TMP.

[0063] The upper layer UPL may be disposed on the sensor layer SEL. The upper layer UPL may form an outer layer of the display device DD with respect to a direction in which light is emitted (eg, in the third direction DR3). For example, the upper layer UPL may include a polarization layer POL (reference Figure 3 ). The polarization layer POL may include materials having various polarization properties. For example, the polarization layer POL may include a phase delay layer and may also include a wire grid polarization layer.

[0064] In an embodiment of the present disclosure, the upper layer UPL may not include a window structure. Therefore, the display device DD may be implemented as a windowless display device. In an embodiment of the present disclosure, since the window structure is excluded, the display device DD may achieve a light weight characteristic, and the reliability of the information about the emitted light may be further enhanced.

[0065] In a conventional display device, a window structure is used as an electrostatic discharge (ESD) path, and as a result, in the case where the display device DD is implemented as a windowless display device, there may be an increased risk of ESD damaging the sensing line TMP. However, in an embodiment of the present disclosure, the display device DD may include an ESD protection structure, resulting in a reduced risk of ESD damage. In this regard, reference will be made to Figure 3 and the following figures explain the details.

[0066] Figure 3 It is along Figure 1 A schematic cross-sectional view taken along line AA'. Figure 3 The cross-sectional structure of the components adjacent to the side S of the display area DA is schematically illustrated. Figure 3 Components of the display device DD disposed on the display area DA and the non-display area NDA are illustrated.

[0067] refer to Figure 3 , the driving circuit component COG may be disposed in the non-display area NDA and on the pixel circuit layer PCL. In an embodiment of the present disclosure, the driving circuit component COG may be disposed in the same layer as the display layer DL.

[0068] The display layer DL may include the light emitting element LD disposed in the display area DA, and may further include an encapsulation layer ENC covering the light emitting element LD. The encapsulation layer ENC may be continuously disposed in the display area DA and the non-display area NDA.

[0069] The sensor layer SEL may be disposed on a portion of the display layer DL. The sensing line TMP may be adjacent to an edge of the sensor layer SEL. For example, the sensing line TMP may be adjacent to the cover film COP.

[0070] In a plan view, the polarization layer POL may overlap with the sensor layer SEL. In an embodiment of the present disclosure, in a plan view, the polarization layer POL may overlap with the sensing line TMP. However, the present disclosure is not necessarily limited to the foregoing example. In an embodiment of the present disclosure, the polarization layer POL may not overlap with the sensing line TMP.

[0071] According to an embodiment of the present disclosure, the display device DD may further include a curved film COF, a circuit substrate PCB, and a cover film COP.

[0072] At least a portion of the curved film COF may be bent. A portion of the curved film COF may be disposed on the pixel circuit layer PCL, and another portion of the curved film COF may be disposed on the circuit substrate PCB. In an embodiment of the present disclosure, the curved film COF may be electrically connected to at least some conductive structures (e.g., wires or pads, etc.) of the display panel DP, and may be electrically connected to the circuit substrate PCB. In an embodiment of the present disclosure, the curved film COF may be a chip on film.

[0073] The circuit substrate PCB may be disposed on the lower layer LWL. The circuit substrate PCB may be fixed on the lower layer LWL by a first support structure SUP1. The circuit substrate PCB may include a flexible circuit substrate. The circuit substrate PCB may be configured to control the overall operation of the display device DD. The second support structure SUP2 may be disposed between the circuit substrate PCB and the cover film COP.

[0074] The cover film COP may cover the side surface SID of the display panel DP, the cover film COP may cover the driving circuit part COG, may cover the bending film COF, and may cover the circuit substrate PCB.

[0075] In an embodiment of the present disclosure, at least a portion of the cover film COP may be bent. For example, the cover film COP may include a first portion A1 (or a first region), a second portion A2 (or a second region), and a third portion A3 (or a third region).

[0076] The first portion A1 of the cover film COP may be disposed on the first surface S1 of the display panel DP. The first portion A1 may extend in the non-display area NDA and may cover a portion of the curved film COF and the driving circuit component COG. In an embodiment of the present disclosure, in a plan view, the first portion A1 may not overlap with either the sensing line TMP or the polarization layer POL.

[0077] The second portion A2 of the cover film COP may be bent. The second portion A2 may cover the side surface SID of the display panel DP and a portion of the bending film COF.

[0078] The third portion A3 of the cover film COP may be disposed on the second surface S2 of the display panel DP. At least a portion of the third portion A3 may extend in the non-display area NDA. Another portion of the third portion A3 may extend in the display area DA. The third portion A3 may cover another portion of the circuit substrate PCB and the curved film COF.

[0079] As described above, the sensing line TMP may be substantially disposed on the peripheral portion. Therefore, in the event of ESD, there may be a risk that the electrical signal supplied to the sensing line TMP is disturbed due to the ESD. In this case, the sensing signal may be damaged, resulting in a touch defect on the display device DD.

[0080] However, in the embodiment of the present disclosure, the cover film COP can form an ESD path ESD_P capable of reducing the ESD risk. Figures 4 to 9 Describe further details.

[0081] Figure 4 is a schematic perspective view illustrating a display device according to an embodiment of the present disclosure. Figure 5 is a schematic cross-sectional view illustrating a cover film COP according to an embodiment of the present disclosure. Figures 6 to 9 are schematic diagrams each illustrating a cover film COP according to an embodiment of the present disclosure. Figure 6 and Figure 7 A cover film COP according to another embodiment is schematically illustrated. Figure 8 and Fig. 9 A cover film COP according to another embodiment is schematically illustrated.

[0082] refer to Figure 4 and Figure 5 The cover film COP may include a multi-layer structure forming the ESD path ESD_P. For example, the cover film COP may include a first insulating cover layer NCL1, a conductive cover layer CL, and a second insulating cover layer NCL2.

[0083] The first insulating cover layer NCL1 may be disposed on the first surface S1 of the display layer DL. In an embodiment of the present disclosure, the first insulating cover layer NCL1 may be adjacent to the sensing line TMP in a planar direction. The first insulating cover layer NCL1 may form a lower part of the cover film COP.

[0084] The first insulating cover layer NCL1 may include an insulating material. For example, the first insulating cover layer NCL1 may include an organic material or an inorganic material. The first insulating cover layer NCL1 may include polyethylene terephthalate, polyimide, polycarbonate, polyethylene, polypropylene, polysulfone, polymethyl methacrylate, triacetyl cellulose and / or cycloolefin polymer. However, the present disclosure is not necessarily limited to the foregoing examples.

[0085] The conductive cover layer CL may be disposed between the first insulating cover layer NCL1 and the second insulating cover layer NCL2. The conductive cover layer CL may form an intermediate member of the cover film COP.

[0086] The conductive cover layer CL may include a conductive material. For example, the conductive cover layer CL may include gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and / or platinum (Pt). However, the present disclosure is not necessarily limited to the foregoing examples.

[0087] The conductive cover layer CL may form an ESD path ESD_P. For example, the conductive cover layer CL may be exposed in the opening OP, and ESD may be applied to the conductive cover layer CL through the opening OP. The ESD provided to the conductive cover layer CL may propagate through the conductive cover layer CL and then be released to the outside. Alternatively, in an embodiment of the present disclosure, the conductive cover layer CL may be electrically connected to a grounding component provided in the display device DD, thereby allowing the ESD to propagate to the grounding component through the conductive cover layer CL, thereby reducing the ESD.

[0088] Specifically, the ESD path ESD_P may be directed toward a region where the sensing line TMP is not disposed. Therefore, the risk of ESD with respect to the sensing line TMP may be reduced.

[0089] The second insulating cover layer NCL2 may be disposed on the conductive cover layer CL. In an embodiment of the present disclosure, the second insulating cover layer NCL2 may be adjacent to the polarization layer POL in a plane direction. The second insulating cover layer NCL2 may form an upper part of the cover film COP.

[0090] The second insulating cover layer NCL2 may include an insulating material. For example, the second insulating cover layer NCL1 may include an organic material or an inorganic material. The second insulating cover layer NCL2 may include polyethylene terephthalate, polyimide, polycarbonate, polyethylene, polypropylene, polysulfone, polymethyl methacrylate, triacetyl cellulose and / or cycloolefin polymer. However, the present disclosure is not necessarily limited to the foregoing examples.

[0091] The second insulating cover layer NCL2 may form (or include) an opening OP. The opening OP may expose the conductive cover layer CL. As described above, the opening OP may expose the conductive cover layer CL, thereby defining a path along which ESD may be applied.

[0092] The opening OP may include a single opening OP, or may include a plurality of openings OP.

[0093] As described above, the cover film COP may include the first portion A1, the second portion A2, and the third portion A3. The opening OP may be formed in the first portion A1. The opening OP may not be formed in the second portion A2 and the third portion A3.

[0094] In an embodiment of the present disclosure, the openings OP may be arranged in a grid structure. For example, the openings OP may be arranged in a matrix structure in the first direction DR1 and the second direction DR2. Therefore, the ESD path ESD_P may include a plurality of paths, so that ESD may be effectively reduced.

[0095] In an embodiment of the present disclosure, the opening OP may be formed adjacent to one side (or edge) of the cover film COP facing the sensing line TMP and the polarization layer POL. For example, the opening OP may include a plurality of openings OP. The openings OP may be formed sequentially in the first direction DR1 and distributed around the edge of the cover film COP.

[0096] In an embodiment of the present disclosure, the first insulating cover layer NCL1 may have a first thickness T1. The second insulating cover layer NCL2 may have a second thickness T2. The second thickness T2 may be less than the first thickness T1. The layer in which the opening OP is formed may be manufactured to have a thickness smaller than that of the layer in which the opening OP is not formed, thereby resulting in increased process convenience.

[0097] Reference Figure 6 and Figure 7 An example of the structure of the opening OP is described. Figure 6 and Figure 7 A first portion A1 of the cover film COP is illustrated.

[0098] In the embodiment of the present disclosure, the opening OP may include openings OP having different sizes. For example, the opening OP may include a first opening OP1 and a second opening OP2 smaller than the first opening OP1.

[0099] The first opening OP1 may have a relatively large opening structure and may be disposed between the sensing line TMP and the second opening OP2. Therefore, the first opening OP1 formed adjacent to the sensing line TMP may have a substantially large size. As a result, the sensing line TMP may be more effectively protected from ESD.

[0100] The first opening OP1 may include first openings OP1 sequentially arranged in a direction in which the sensing line TMP extends (e.g., in the first direction DR1). Therefore, the first opening OP1 having a substantially large size may cover one side of the sensing line TMP, and an entrance portion of the ESD path ESD_P may be accurately defined in a region adjacent to the sensing line TMP.

[0101] In an embodiment of the present disclosure, the first opening OP1 may include first openings OP1 having different sizes. For example, the first opening OP1 may include a first side opening OP1_S and a first middle opening OP1_M.

[0102] In an embodiment of the present disclosure, the first middle opening OP1_M may be located between the first side openings OP1_S formed at opposite sides of the cover film COP with respect to the first direction DR1. The first side openings OP1_S may be larger than the first middle openings OP1_M.

[0103] ESD may occur on the opposite side of the cover film COP with respect to the first direction DR1. In the embodiment of the present disclosure, in the region where ESD occurrence is feared, the size of the first opening OP1 may be formed larger, and the ESD risk may be more effectively prevented.

[0104] The plurality of second openings OP2 may be arranged in a grid structure. For example, the second openings OP2 may be arranged in a matrix structure in the first direction DR1 and the second direction DR2. The second openings OP2 may have the same size. However, the present disclosure is not necessarily limited to the foregoing examples. The second openings OP2 may include second openings OP2 having different sizes.

[0105] Reference Figure 8 and Fig. 9 An example of the structure of the opening OP is described. Figure 8 and Fig. 9 A first portion A1 of the cover film COP is illustrated.

[0106] In an embodiment of the present disclosure, the opening OP may have a shape extending in a given direction (eg, the first direction DR1 ).

[0107] The opening OP may extend in the same direction as the direction in which the sensing line TMP extends. In a plan view, the opening OP may have a shape that extends mainly in the first direction DR1. For example, the opening OP may have a rectangular shape whose long sides extend in the first direction DR1. Therefore, the ESD path ESD_P defined by the opening OP may accurately cover the sensing line TMP, so that the sensing line TMP may be effectively protected from ESD.

[0108] Hereinafter, an electronic device 1000 including a display device DD according to an embodiment will be described.

[0109] Fig.10 is a schematic block diagram illustrating an electronic device 1000 including a display device according to an embodiment. Fig.11 It is a diagram of Fig.10 1 is a schematic diagram of an example in which the electronic device 1000 is implemented as a smart phone. Fig.12 It is a diagram of Fig.10 1 is a schematic diagram of an example in which the electronic device 1000 is implemented as a tablet computer.

[0110] refer to Figures 10 to 12 , the electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output (I / O) device 1040, a power supply 1050, and a display device 1060. The display device 1060 may be Figure 1 The electronic device 1000 may further include various ports for communicating with a video card, a sound card, a memory card, a USB device or other systems. Fig.11 As shown in FIG. 1 , the electronic device 1000 may be implemented as a smart phone. Fig.12 As illustrated in FIG. 1 , the electronic device 1000 may be implemented as a tablet computer. However, the foregoing examples are illustrative, and the electronic device 1000 is not necessarily limited to the foregoing examples. For example, the electronic device 1000 may be implemented as a cellular phone, a video phone, a smart tablet, a smart watch, a navigation device for a vehicle, a computer monitor, a laptop computer, or a head-mounted display device, etc.

[0111] The processor 1010 may perform a specific calculation or task. In an embodiment, the processor 1010 may be a microprocessor, a central processing unit, or an application processor, etc. The processor 1010 may be connected to other components via an address bus, a control bus, and a data bus, etc. In an embodiment, the processor 1010 may be connected to an expansion bus such as a peripheral component interconnect (PCI) bus. In an embodiment, the processor 1010 may provide input image data to the display device 1060. Therefore, the display device 1060 may display an image based on the input image data provided from the processor 1010.

[0112] The memory device 1020 may store data required to perform operations of the electronic device 1000. For example, the memory device 1020 may include a nonvolatile memory device such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM) device, and a ferroelectric random access memory (FRAM) device, and / or a volatile memory device such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a mobile DRAM device, etc.

[0113] The storage device 1030 may include a solid state drive (SSD), a hard disk drive (HDD), or a CD-ROM, etc.

[0114] The I / O device 1040 may include input devices such as a keyboard, a keypad, a touch pad, a touch screen, and a mouse, and output devices such as a speaker and a printer. In an embodiment, the display device 1060 may be included in the I / O device 1040.

[0115] The power supply 1050 may supply power required to perform operations of the electronic device 1000. For example, the power supply 1050 may be a power management integrated circuit (PMIC). In an embodiment, the power supply 1050 may supply power to the display device 1060.

[0116] The display device 1060 may display images corresponding to visual information of the electronic device 1000. The display device 1060 may be connected to other components through a bus or other communication links.

[0117] Although various embodiments have been described above, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the present disclosure.

Claims

1. A display device, comprising: A display panel comprising a first surface and a second surface opposite to the first surface; as well as a covering film, comprising a first portion disposed on the first surface of the display panel, a second portion covering a side surface of the display panel, and a third portion disposed on the second surface of the display panel, wherein the side surface is disposed between the first surface and the second surface, and at least a portion of the second portion is bent, The covering film includes a first insulating covering layer, a conductive covering layer disposed on the first insulating covering layer, and a second insulating covering layer disposed on the conductive covering layer, and The second insulating cover layer includes an opening exposing the conductive cover layer.

2. The display device according to claim 1, wherein: The conductive cover layer forms an electrostatic discharge path to eliminate electrostatic discharge along the opening.

3. The display device according to claim 1, wherein: The opening is formed in the first portion of the cover film, and does not exist in each of the second portion of the cover film and the third portion of the cover film.

4. The display device according to claim 1, wherein: The opening includes a plurality of openings.

5. The display device according to claim 4, wherein: The plurality of openings are arranged in a matrix structure with respect to a first direction and a second direction different from the first direction.

6. The display device according to claim 4, wherein: The plurality of openings are sequentially arranged in a given direction.

7. The display device according to claim 4, in, The plurality of openings include at least a first opening and a second opening, and Wherein, the size of the first opening is larger than the size of the second opening.

8. The display device according to claim 7, in, The first opening includes first side openings and a first middle opening between the first side openings, wherein the first side opening and the first middle opening are adjacent to each other in a given direction, and Wherein, a size of each of the first side openings is larger than a size of the first middle opening.

9. The display device according to claim 8, in, The second opening includes a plurality of second openings, and The plurality of second openings are arranged in a matrix structure relative to a first direction and a second direction different from the first direction.

10. The display device according to claim 1, wherein: The opening comprises only a single opening.

11. The display device according to claim 10, wherein: The opening has a shape extending in a given direction.

12. The display device according to claim 1, in, The first insulating cover layer has a first thickness, and The second insulating cover layer has a second thickness that is smaller than the first thickness.

13. The display device according to claim 1, comprising a display area and a non-display area surrounding at least a part of the display area, in, The display device further includes a sensor layer, which is disposed on the display panel and includes a sensing electrode and a sensing line electrically connected to the sensing electrode, and Wherein, the sensing line is arranged in the non-display area.

14. The display device according to claim 13, wherein: The opening is adjacent to the sensing line.

15. The display device according to claim 13, further comprising a polarization layer disposed on the sensor layer, in, In a plan view, the sensing line and the polarization layer overlap each other.

16. The display device according to claim 13, in, The display panel includes pixels, The display device further comprises a driving circuit component configured to drive the pixel, and Wherein, the sensing line is arranged between the display area and the driving circuit component.

17. The display device according to claim 16, wherein: The first portion of the cover film covers the drive circuit component.

18. The display device according to claim 1, further comprising: A circuit substrate, disposed on the second surface of the display panel; as well as a curved film, comprising at least a first portion disposed on the pixel circuit layer of the display panel and at least a second portion disposed on the circuit substrate, wherein the second portion of the cover film covers a portion of the curved film, and The third portion of the cover film covers another portion of the bending film and the circuit substrate.

19. The display device according to any one of claims 1 to 18, wherein: The display device is a windowless structure.

20. A windowless display device, comprising: A display panel comprising a first surface and a second surface opposite to the first surface; a sensor layer, disposed on the display panel and comprising a sensing electrode and a sensing line electrically connected to the sensing electrode; a polarization layer, disposed on the sensor layer; as well as a cover film, at least a portion of which is disposed on the display panel, The covering film includes a first insulating covering layer, a conductive covering layer disposed on the first insulating covering layer, and a second insulating covering layer disposed on the conductive covering layer. wherein the second insulating cover layer comprises an opening exposing the conductive cover layer, wherein the opening comprises a plurality of openings, and At least some of the plurality of openings are sequentially formed in a direction in which the sensing line extends.

21. An electronic device comprising: a processor configured to provide input image data; A display device configured to display an image based on the input image data, the display device comprising a sub-pixel region; as well as a power supply configured to supply power to the display device, Wherein, the display device comprises: A display panel comprising a first surface and a second surface opposite to the first surface; and a covering film, comprising a first portion disposed on the first surface of the display panel, a second portion covering a side surface of the display panel, and a third portion disposed on the second surface of the display panel, wherein the side surface is disposed between the first surface and the second surface, and at least a portion of the second portion is bent, The covering film includes a first insulating covering layer, a conductive covering layer disposed on the first insulating covering layer, and a second insulating covering layer disposed on the conductive covering layer, and The second insulating cover layer includes an opening exposing the conductive cover layer.

Images