Light emitting diode

Abstract

The invention relates to the technical field of light-emitting diodes, in particular to a light-emitting diode which comprises a base, a PN node and a package, the PN node is arranged on the base, the package adheres to the base, a mounting cavity is formed between the package and the base, the PN node is located in the mounting cavity, a storage cavity is formed in the base, and the storage cavity is communicated with the PN node. A storage cavity is formed in the base, liquid silica gel is poured into the storage cavity, the liquid silica gel is solidified when encountering oxygen, an annular groove is formed in the side wall of the base, and the annular groove communicates with the storage cavity. The liquid silica gel is poured into the base, the pressurizing assembly with the push plate is arranged in the base, when the base and the packaging connection glue layer fall off, the extrusion assembly extrudes the internal liquid silica gel to enter the delamination gap, and when the liquid silica gel makes contact with air, the cracking gap can be filled up, so that the sealing performance of the packaging connection glue layer is improved. Therefore, the sealing performance of the light-emitting diode is ensured, and the service life of the light-emitting diode is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of light emitting diodes, in particular to a light emitting diode. Background Art

[0002] Light-emitting diodes release energy and emit light through the PN junction, allowing electrons and holes to recombine and emit light. They can efficiently convert electrical energy into light energy. Therefore, they have a wide range of uses in modern society, such as lighting, flat-panel displays, and medical devices.

[0003] When the PN junction contacts water vapor, it will cause the PN junction to short-circuit and be damaged. Therefore, in order to protect the PN junction, the outside of the light-emitting diode is usually encapsulated with epoxy resin to prevent the PN junction from contacting with water vapor. The encapsulation is connected to the base on which the PN junction is installed by gluing. Since the thermal expansion coefficients of the base and the encapsulation adhesive are different, when the package undergoes a temperature cycle, the interface between the base and the encapsulation adhesive will induce stress, thereby causing a gap between the package and the base, thereby causing the sealing of the package to fail, and the entry of water vapor can cause damage to the light-emitting diode. In order to solve this problem, the invention patent with application number CN201610095898.4 provides a light-emitting diode package and a carrier board. The light-emitting diode package has multiple grooves that cross the chip seat to provide a mechanical connection to strengthen the combination between the base and the encapsulation material and reduce the possibility of delamination that may occur between the chip seat and the insulating layer. However, in a vibration environment, such as a car driving, a spotlight swinging, etc., the encapsulation adhesive layer is still prone to delamination in the severe vibration environment, thereby affecting the service life of the light-emitting diode.

[0004] Therefore, in order to prevent the delamination of the packaging adhesive layer from affecting the service life of the light emitting diode, a light emitting diode is proposed. Summary of the invention

[0005] The object of the present invention is to provide a light emitting diode. In order to prevent the delamination of the packaging glue layer from affecting the service life of the light emitting diode, liquid silicone is poured into the inside of the base, and a pressurizing component with a push plate is arranged inside the base. When the glue layer connecting the base and the packaging is peeled off, the extrusion component squeezes the internal liquid silicone into the delamination gap. When the liquid silicone contacts the air, the crack gap can be filled, thereby ensuring the sealing of the light emitting diode and improving the service life of the light emitting diode.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A light emitting diode comprises a base, a PN node and a package, wherein the installation is on the base, the PN node is arranged on the base, the package is glued to the base, a mounting cavity is formed between the package and the base, the PN node is located inside the mounting cavity, a storage cavity is arranged inside the base, liquid silicone is poured inside the storage cavity, the liquid silicone is liquid silicone that solidifies when encountering oxygen, an annular groove is provided on the side wall of the base, the annular groove is communicated with the storage cavity, the package blocks the annular groove, two inlets and outlets that are communicated with the isolation cavity are provided on the base, the inlets and outlets are both sealed by threads, an extrusion component is provided inside the base, the extrusion component is used to squeeze the liquid silicone into the gap between the package and the base.

[0008] Fixing the base by gluing can avoid a gap between the base and the package, thereby ensuring the sealing of the package, and pouring liquid silicone inside the base, and setting a pressurizing component inside. When the glue layer connecting the base and the package falls off, the extrusion component squeezes the internal liquid silicone into the delamination gap. When the liquid silicone comes into contact with the air, it can fill the crack gap, thereby ensuring the sealing of the light-emitting diode and improving the service life of the light-emitting diode. Liquid silicone is not easy to deteriorate, so it is not easy to decompose in a high temperature environment, thereby more effectively improving the service life of the light-emitting diode. The setting of liquid silicone can increase the heat exchange rate inside the light-emitting diode, improve the heat dissipation effect of the light-emitting diode, and effectively improve the service life of the light-emitting diode.

[0009] Preferably, the extrusion assembly includes a film arranged inside the storage cavity, the film divides the storage cavity into an isolation cavity and a power cavity, the liquid silicone is arranged inside the isolation cavity, a push plate is slidably installed inside the power cavity, the push plate is in contact with the film, a spring is connected between the push plate and the base, and the direction of the spring elastic force is toward the film.

[0010] Liquid silicone is poured through the inlet. After continuous pouring, the pressure inside the isolation cavity increases, which can push the push plate to move, so that the spring is compressed. That is, when the adhesive layer connecting the base and the package falls off, the push plate squeezes the film, and the liquid silicone inside the isolation cavity is counted into the crack gap. After the liquid silicone flows out and contacts the air, the crack gap can be filled, thereby ensuring the sealing of the package and increasing the service life of the light-emitting diode.

[0011] Preferably, a spiral groove is provided inside the storage cavity, a telescopic rod is installed on the base plate, the movable end of the telescopic rod is connected to the push plate for unidirectional rotation, the number of turns of the spiral groove is 1, and reset grooves are connected at both ends of the spiral groove. An arc-shaped portion is provided on the upper wall of the connection between the spiral groove and the reset groove, a slider is provided on the push plate, the slider is embedded in the spiral groove, and the rotation direction of the push plate is the same as the spiral direction of the spiral groove.

[0012] During use, the light-emitting diode may be in a vibrating environment, which may cause the push plate to vibrate, aggravate the vibration of the diode, accelerate the shedding of the encapsulation glue layer, and may also cause the package to rupture. The movement of the push plate will cause the internal liquid silicone to swing, so that negative pressure is generated inside the isolation cavity and air is sucked in, thereby causing the internally stored silicone to solidify. For this purpose, a spiral groove is provided, and the push plate is unidirectionally rotatably connected to the telescopic rod. When the spring pushes the push plate to move downward, the push plate can rotate. At this time, the slider slides along the spiral groove, and when the push plate moves upward, the push plate cannot rotate in the opposite direction. At this time, the slider restricts the push plate from moving upward, thereby avoiding the push plate from vibrating synchronously due to vibration when the light-emitting diode works in a vibrating environment, thereby effectively improving the service life of the light-emitting diode. The reset groove is set, when the push plate moves to the bottom, the slider can move along the reset groove to the top of the spiral groove, thereby avoiding the situation where silicone cannot be poured, and the arc portion is set, when the push plate moves to the top, the slider can be staggered from the reset groove by the guiding effect, thereby avoiding the slider entering the reset groove when the push plate moves downward and causing the limit effect to be lost.

[0013] Preferably, a plurality of radial limit blocks are evenly arranged on the side wall in the horizontal direction of the spiral groove, a plurality of axial limit blocks are evenly arranged on the side wall in the vertical direction of the spiral groove, the slider is divided into a telescopic part and a limit part, the telescopic part is connected to the push plate, the limit part is located at the end of the telescopic part, the telescopic part adopts a memory alloy, the width of the axial limit block and the radial limit block in the radial direction are both equal to half the width of the spiral groove, the width of the limit part is a, the length of the slider is l, the depth of the spiral groove is L, and the l min <L / +a, wherein L / +a<l max <L, the width of the spiral groove located at the axial limit block is 0.5-1mm smaller than the diameter of the limit portion.

[0014] It takes a certain amount of time for liquid silicone to solidify, and the continuous squeezing of the film by the push plate will cause the liquid silicone to continue to flow out, causing the liquid silicone to solidify at the crack gap, so that the internal liquid silicone can only fill the gap once. Through the radial limit block and the axial limit block inside the spiral groove, when the encapsulation glue layer falls off in the heating state of the light-emitting diode operation, the extension of the slider will be restricted by the radial limit part, and when the encapsulation glue layer falls off in the cooling state of the light-emitting diode, the contraction of the slider will be restricted by the axial limit block. Therefore, when the liquid silicone is squeezed into the crack gap in the heating state and the cooling state, the push plate will be stuck when moving the set distance, so as to avoid the continuous outflow of liquid silicone, thereby ensuring that the liquid silicone inside the crack gap has sufficient curing time, so that the internal liquid silicone can fill the gap multiple times, effectively improving the service life of the light-emitting diode.

[0015] Preferably, both the base and the package are provided with a limiting groove, the cross-section of the limiting groove is semicircular, a rubber ring is provided inside the limiting groove, the side of the rubber ring facing the installation cavity is flat, and a gap is provided between the bottom of the package and the base, and the width of the gap is 0.5-1mm.

[0016] The setting of the rubber ring can fix the package during the initial gluing package, making the package installation more convenient. The side of the rubber ring facing the installation cavity is flat. When the glue overflows into the installation cavity, the flat part can store the overflow liquid silicone to prevent the liquid silicone from overflowing to the PN node and affecting the normal operation of the light-emitting diode. The rubber ring can squeeze the package and the base to reduce the gap there, thereby preventing too much liquid silicone from flowing into the installation cavity. The rubber ring can achieve a positioning effect to generate a gap between the package and the base, and the gap width is small. Relying on the surface tension of the liquid, the liquid silicone can be gathered in the gap and will not flow out, that is, the filling effect of the crack gap is effectively improved, and the liquid silicone is prevented from overflowing to the external circuit and affecting the normal use of the light-emitting diode.

[0017] Preferably, the film is provided with a plurality of stirring blades inside the isolation cavity, the stirring blades are made of flexible material, and the center of gravity of the stirring blades is located at the end of the heat fan blades, and a groove is provided on the base, and the stirring blades are sunk into the groove.

[0018] By setting the stirring plate and locating the center of gravity of the stirring plate at the end of the heat fan plate, the stirring plate can vibrate in a vibrating environment, thereby improving the fluidity of the internal liquid silicone, facilitating heat exchange, and improving the heat dissipation speed of the light-emitting diode. The setting of the groove prevents the stirring plate from interfering with the resetting of the push plate, and can also increase the heat dissipation area of ​​the base and improve the heat dissipation speed of the light-emitting diode.

[0019] Preferably, the bottom of the groove is in an inverted cone shape, and the inlet and the outlet are respectively connected to the bottom of the two grooves with the largest distance.

[0020] The inlet and outlet are respectively connected to the bottom of the two grooves with the largest distance between them. When liquid silicone is injected, the internal gas can be pushed along one side of the base to the other side, so as to avoid residual air inside the isolation cavity, which causes the internal liquid silicone to solidify and unable to fill the gap. The bottom of the groove is an inverted cone shape, which can concentrate the gas and further improve the discharge effect of the liquid silicone.

[0021] Preferably, an air intake channel is provided on the base, and the air intake channel is connected to the power chamber.

[0022] An air inlet channel is provided on the base to prevent the installation cavity from being unable to exhaust air and inject liquid silicone.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. By pouring liquid silicone inside the base and setting a pressurizing component with a push plate inside the base, when the adhesive layer connecting the base and the package falls off, the extrusion component squeezes the internal liquid silicone into the delamination gap. When the liquid silicone comes into contact with the air, it can fill the crack gap, thereby ensuring the sealing of the light-emitting diode and improving the service life of the light-emitting diode.

[0025] 2. By building a spiral groove inside the base and setting a slider on the push plate, the push plate can move downward by relying on the unidirectional rotation of the push plate. When the push plate does not move below the spiral groove, it cannot move upward, thereby avoiding vibration of the push plate, thereby avoiding the problem of accelerated shedding of the packaging glue layer, packaging rupture, and inhalation of air leading to siliconeization of the internal liquid due to the vibration of the push plate.

[0026] 3. Through the radial limit block and axial limit block inside the spiral groove, when the liquid silicone is squeezed into the crack gap in the heating state and the cooling state, the push plate will be stuck when it moves the set distance, so as to prevent the liquid silicone from continuously flowing out, thereby ensuring that the liquid silicone inside the crack gap has sufficient curing time, so that the internal liquid silicone can fill the gap multiple times, effectively improving the service life of the light-emitting diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 for Figure 1 Sectional view at AA in the middle;

[0029] Figure 3 It is a cross-sectional view of the internal structure of the present invention;

[0030] Figure 4 for Figure 3 A partial enlarged view of point B in the middle;

[0031] Figure 5 It is a cross-sectional view of the internal structure of the base of the present invention;

[0032] Figure 6 This is a schematic diagram of the state in which the push plate of the present invention moves to the bottom of the spiral groove;

[0033] Figure 7 It is a schematic diagram of the state in which the slider of the present invention contacts the radial limit block when the temperature is greater than 40°C;

[0034] Figure 8 This is a schematic diagram of the state in which the sliding block of the present invention is in contact with the axial limit block at a temperature less than 40°C.

[0035] In the figure: 1. base; 2. PN node; 3. package; 4. installation cavity; 5. storage cavity; 51. isolation cavity; 52. power cavity; 6. ring groove; 7. extrusion assembly; 71. film; 72. push plate; 73. spring; 8. spiral groove; 81. arc-shaped portion; 9. telescopic rod; 10. reset groove; 11. slider; 111. telescopic portion; 112. limit portion; 12. radial limit block; 13. axial limit block; 14. limit groove; 15. rubber ring; 16. gap; 17. stirring plate; 18. groove; 19. air inlet channel; 20. inlet; 21. outlet. DETAILED DESCRIPTION

[0036] See also Figures 1 to 8 The present invention provides a light emitting diode, and the technical solution is as follows:

[0037] A light emitting diode comprises a base 1 and a package 3, wherein the package 3 is glued to the base 1, and an installation cavity 4 is formed between the base 1 and the package 3. The base 1 is provided with a PN junction 2 inside the installation cavity 4, a storage cavity 5 is provided inside the base 1, a ring groove 6 communicating with the storage cavity 5 is provided on the side wall of the base 1, the package 3 shields the ring groove 6, an inlet 20 and an outlet 21 are provided at the lower part of the storage cavity 5, the inlet 20 and the outlet 21 are sealed by threads, and an extrusion component 7 is provided inside the storage cavity; during installation, a glue layer is applied to the edge of the package 3, and the package 3 is sleeved on the base 1, and after the glue layer is solidified, liquid silicone is injected into the base 1 through the inlet 20, and the liquid silicone is injected into the base 1 through the inlet 20, and the liquid silicone is injected into the base 1 through the outlet 21. When liquid silicone overflows from port 21, threaded seal can be used to seal port 21, and then liquid silicone is continuously injected. When liquid silicone overflows from inlet 20, inlet 20 can be sealed to complete the injection of liquid silicone. When the adhesive layer connecting base 1 and package 3 falls off, extrusion assembly 7 squeezes the internal liquid silicone into the delamination gap. When liquid silicone contacts air, the crack gap can be filled, thereby ensuring the sealing of light-emitting diode and improving the service life of light-emitting diode. Liquid silicone adopts silicone adhesive, which can withstand high temperature of 300°C, so its chemical property is stable, and the light-emitting diode has the highest working temperature. The temperature is usually less than 100°C, so the silicone adhesive is not easy to decompose, and the setting of liquid silicone can improve the heat exchange rate inside the light-emitting diode, improve the heat dissipation effect of the light-emitting diode, and effectively improve the service life of the light-emitting diode; the extrusion component 7 includes a film 71 arranged inside the storage cavity 5, and the film 71 divides the storage cavity 5 into an isolation cavity 51 and a power cavity 52. ​​The liquid silicone is arranged inside the isolation cavity 51, and a push plate 72 is slidably installed inside the power cavity 52. ​​The push plate 72 is in contact with the film 71, and a spring 73 is connected between the push plate 72 and the base 1, and the elastic direction of the spring 73 is toward the film 71; when the liquid silicone is poured, the liquid squeezes the push plate 71, and the push plate 72 is pressed against the film 71. The push plate 72 compresses the spring 73. When a gap is generated between the package 3 and the base 1, the spring 73 pushes the push plate 72 to squeeze the film 71, thereby squeezing the liquid silicone to flow to the cracked gap, thereby filling the gap. The liquid silicone begins to solidify after contacting with the air, thereby ensuring the sealing of the package 3 and improving the service life of the light-emitting diode; an air intake channel 19 is provided on the base 1, and the air intake channel 19 is connected to the power chamber 52; when the liquid silicone is extruded or injected, the internal space of the storage chamber 5 will change. In order to prevent the storage chamber 5 from being affected by the pressure change and affecting the extrusion or injection of the liquid silicone, the air intake through the air intake channel 19 can avoid the pressure change inside the storage chamber 5.

[0038] A spiral groove 8 is provided inside the storage cavity 5, and a telescopic rod 9 is installed on the base plate. The movable end of the telescopic rod 9 is connected to the push plate 72 for unidirectional rotation. A slider 11 is provided on the push plate 72, and the slider 11 is embedded in the spiral groove 8. The rotation direction of the push plate 72 is the same as the spiral direction of the spiral groove 8; when the push plate 72 moves downward, the slider 11 slides along the spiral groove 8 and causes the push plate 72 to rotate along the reset groove 10, while the push plate 72 cannot rotate in the opposite direction. At this time, when the push plate 72 moves upward, it will be limited by the slider 11, thereby limiting the upward movement of the push plate 72, thereby preventing the push plate 72 from vibrating synchronously due to vibration when the light-emitting diode works in a vibrating environment, thereby preventing the vibration from accelerating The problem of the glue layer of the package 3 falling off and causing the package 3 to rupture can be solved, and the isolation chamber 51 can be prevented from sucking in air in a negative pressure state, causing the liquid silicone in the isolation chamber 51 to solidify and affect the service life of the light-emitting diode. The number of turns of the spiral groove 8 is 1, so that both ends of the spiral groove 8 are on the same vertical plane. The reset groove 10 connects the two ends, so that the reset groove 10 is in a vertical state, so that when the push plate 72 moves to the bottom of the spiral groove 8, the slider 11 can move along the reset groove 10 to the top of the spiral groove 8, and the perfusion of the liquid silicone will not be affected at this time. The upper wall of the connection between the spiral groove 8 and the reset groove 10 is provided with an arc portion 81, which can be When the push plate 72 moves to the top, the slider 11 is staggered from the reset groove 10 by relying on the guiding effect of the arc-shaped portion 81, so as to prevent the slider 11 from entering the reset groove 10 and losing the limiting effect when the push plate 72 moves downward; a plurality of radial limit blocks 12 are evenly arranged on the horizontal side wall of the spiral groove 8, and a plurality of axial limit blocks 13 are evenly arranged on the vertical side wall of the spiral groove 8. The slider 11 is divided into a telescopic portion 111 and a limiting portion 112. The telescopic portion 111 is connected to the push plate 72, and the limiting portion 112 is located at the end of the telescopic portion 111. The telescopic portion 111 adopts a memory alloy, and the transformation temperature of the memory alloy is 40°C; the radial limit block 12 and the axial limit block 1 The width in the radial direction (radial direction is the radial direction of the spiral groove 8) is 2mm, the depth of the slide groove is L=4mm, the depth of the slide groove at the radial limit block 12 is 2mm, the depth of the slide groove at the axial limit block 13 is 2mm, the width of the slide groove is set to 4mm, the width of the axial limit block 13 along the axial direction (axial direction is the axial direction of the spiral groove 8) is 1mm, the width of the slide groove at the axial limit block 13 is 3mm, the diameter of the limit portion 112 is 3.5mm, the width of the limit portion 112 a=0.8mm, the diameter of the telescopic portion 111 is 2mm, the heated length is 3mm, the cooled length is 1mm, and the minimum length of the slider 11 is l min =1.8, the maximum length of the slider 11 is l max=3.8; when the glue layer of the package 3 cracks and the temperature is lower than 40°C, the telescopic portion 111 contracts. At this time, the limiting portion 112 can pass through the position of the radial limiting block 12, but cannot pass through the position of the axial limiting block 13. When the temperature is higher than 40°C, the telescopic portion 111 extends. At this time, the limiting portion 112 can pass through the position of the axial limiting block 13, but cannot pass through the position of the radial limiting block 12. Since the axial limiting block 13 and the radial limiting block 12 are evenly arranged on the spiral groove 8 and are spaced apart respectively, when the temperature is higher than 40°C or lower than 40°C, the push plate 72 will be stuck by the axial limiting block 13 or the radial limiting block 12 after moving the set distance inside the spiral, thereby preventing the push plate 72 from continuously squeezing out the liquid silicone and ensuring that the liquid silicone inside the crack gap has sufficient curing time, so that the internal liquid silicone can fill the gap multiple times, effectively improving the service life of the light-emitting diode.

[0039] A limiting groove 14 is provided on both the base 1 and the package 3. The cross section of the limiting groove 14 is semicircular, and a rubber ring 15 is provided inside the limiting groove 14. The setting of the rubber ring 15 can fix the package 3 when the package 3 is initially glued, making the installation of the package 3 more convenient. The rubber ring 15 is flat on the side facing the installation cavity 4. When the glue overflows into the installation cavity 4, the flat part can store the overflow liquid silicone to prevent the liquid silicone from overflowing to the PN node 2 and affecting the normal operation of the light-emitting diode. The rubber ring 15 can squeeze the package 3 and the base 1 to reduce the gap there, thereby preventing too much liquid silicone from flowing into the installation cavity 4. A gap 16 is provided between the bottom of the package 3 and the base 1. The width of the gap 16 is 1 mm. The width of the gap 16 is small. Relying on the surface tension of the liquid, the liquid silicone can be gathered in the gap 16 and will not flow out, that is, the filling effect of the crack gap is effectively improved, and the liquid silicone is prevented from overflowing to the external circuit and affecting the normal use of the light-emitting diode.

[0040] The film 71 is located inside the isolation cavity 51 and is provided with a plurality of stirring blades 17. The stirring blades 17 are made of a flexible material, and the center of gravity of the stirring blades 17 is located at the end of the fan heat plate. A groove 18 is provided on the base 1, and the stirring blades 17 are sunk into the groove 18. By setting the stirring blades 17 and the center of gravity of the stirring blades 17 being located at the end of the fan heat plate, the stirring blades 17 can vibrate in a vibrating environment, thereby improving the fluidity of the internal liquid silicone, facilitating heat exchange, and improving the heat dissipation speed of the light-emitting diode. The setting of the groove 18 can prevent the stirring blades 17 from interfering with the reset of the push plate 72, and can also improve the base. 1, improve the heat dissipation speed of the light-emitting diode, the bottom of the groove 18 is an inverted cone shape, the inlet 20 and the outlet 21 are respectively connected to the bottom of the two grooves 18 with the largest distance; the inlet 20 and the outlet 21 are respectively connected to the bottom of the two grooves 18 with the largest distance, and when the liquid silicone is injected, the internal gas can be pushed from one side of the base 1 to the other side, so as to avoid the residual air in the isolation cavity 51, causing the internal liquid silicone to solidify and unable to fill the gap, and the bottom of the groove 18 is an inverted cone shape, which can concentrate the gas and further improve the discharge effect of the liquid silicone.

[0041] Working principle: During installation, apply a layer of glue to the edge of the package 3, and set the package 3 on the base 1. When the rubber ring 15 is inserted into the limit groove 14 of the package 3, the initial fixation of the package 3 is completed. At this time, a gap 16 is formed between the package 3 and the base 1. After the glue layer is solidified, liquid silicone is injected into the base 1 through the inlet 20. During the pouring, the base 1 is facing upward. When the liquid silicone is injected, the gas can be located at the top and pushed into the groove 18 by the liquid silicone, so that the gas is discharged from the inlet 20 and the outlet 21. When the outlet 21 overflows with liquid silicone, the gas is discharged from the inlet 20 and the outlet 21. At this time, the threaded seal outlet 21 can be used to seal the outlet 21, and then the liquid silicone is continuously injected. During the injection process, the internal pressure of the isolation chamber 51 increases. At this time, the pusher 71 is pushed to move along the reset groove 10. When the push plate 72 moves to the arc portion 81, the arc portion 81 guides the push plate 72 to rotate. When the slider 11 moves to the highest point of the push plate 72, the push plate 72 cannot continue to move. At this time, the spring 73 is compressed, and the internal pressure of the isolation chamber 51 continues to increase, causing the liquid silicone to overflow from the inlet 20. At this time, the inlet 20 can be sealed, thereby completing the injection of the liquid silicone.

[0042] When the adhesive layer of the base 1 falls off, a gap is generated, and the spring 73 squeezes the internal push plate 72 to make the slider 11 slide along the guide groove. At this time, the push plate 72 rotates and moves downward to squeeze the liquid silicone out. When the temperature is lower than 40°C, the telescopic part 111 contracts, and the limiting part 112 is stuck by the axial limiting block 13 and cannot move, thereby avoiding the continuous extrusion of the liquid silicone. When the temperature is higher than 40°C, the telescopic part 111 extends, and the limiting part 112 is stuck by the radial limiting block 12 and cannot move, thereby avoiding Continuous extrusion of liquid silicone; when the rubber layer of the base 1 falls off at a temperature lower than 40°C and the limiting portion 112 is stuck by the axial limiting block 13, or when the rubber layer of the base 1 falls off at a temperature higher than 40°C and the limiting portion 112 is stuck by the radial limiting block 12, the push plate 72 cannot move at this time, and the liquid silicone overflows slowly to avoid the problem of liquid silicone being unable to solidify due to the flow of liquid silicone. At this time, when the temperature rises or drops, the slider 11 can contact to limit the movement, thereby ensuring the constant amount of liquid silicone extrusion.

[0043] A specific embodiment of the present invention is described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above described embodiment. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments without departing from the principles and ideas of the present invention should still fall within the scope of protection of the present invention.

Claims

1. A light emitting diode, characterized in that: The invention comprises a base (1), a PN node (2), and a package (3), wherein the package (3) is mounted on the base (1), the PN node (2) is arranged on the base (1), the package (3) is glued to the base (1), a mounting cavity (4) is formed between the package (3) and the base (1), the PN node (2) is located inside the mounting cavity (4), a storage cavity (5) is provided inside the base (1), and liquid silicone is poured into the storage cavity, wherein the liquid silicone is liquid silicone that solidifies when exposed to oxygen, The side wall of the base (1) is provided with an annular groove (6), the annular groove (6) is communicated with the storage cavity (5), the package (3) blocks the annular groove (6), the base (1) is provided with two inlets (20) and an outlet (21) communicated with the isolation cavity (51), the inlet (20) and the outlet (21) are both threadedly sealed, and an extrusion component (7) is provided inside the base (1), the extrusion component (7) is used to squeeze liquid silicone into the gap between the package (3) and the base (1).

2. A light emitting diode according to claim 1, characterized in that: The extrusion assembly (7) includes a film (71) arranged inside the storage chamber (5), and the film (71) divides the storage chamber (5) into an isolation chamber (51) and a power chamber (52). The liquid silicone is arranged inside the isolation chamber (51), and a push plate (72) is slidably installed inside the power chamber (52). The push plate (72) is in contact with the film (71), and a spring (73) is connected between the push plate (72) and the base (1), and the elastic force direction of the spring (73) is toward the film (71).

3. A light emitting diode according to claim 2, characterized in that: A spiral groove (8) is provided inside the storage cavity (5), a telescopic rod (9) is installed on the base plate, the movable end of the telescopic rod (9) is connected to the push plate (72) for one-way rotation, the spiral groove (8) has 1 turn, the two ends of the spiral groove (8) are connected to the reset groove (10), an arc portion (81) is provided on the upper wall of the connection between the spiral groove (8) and the reset groove (10), a slider (11) is provided on the push plate (72), the slider (11) is embedded in the spiral groove (8), and the rotation direction of the push plate (72) is the same as the spiral direction of the spiral groove (8).

4. A light emitting diode according to claim 3, characterized in that: A plurality of radial limit blocks (12) are evenly arranged on the side wall of the spiral groove (8) in the horizontal direction, and a plurality of axial limit blocks (13) are evenly arranged on the side wall of the spiral groove (8) in the vertical direction. The slider (11) is divided into a telescopic part (111) and a limit part (112). The telescopic part (111) is connected to the push plate (72). The limit part (112) is located at the end of the telescopic part (111). The telescopic part (111) is made of memory alloy. The width of the axial limit block (13) and the radial limit block (12) in the radial direction is equal to half the width of the spiral groove (8). The width of the limit part (112) is a, the length of the slider (11) is l, the depth of the spiral groove (8) is L, and the l min <L / 2+a, wherein L / 2+a<l max <L, the width of the spiral groove (8) located at the axial limit block (13) is 0.5-1 mm smaller than the diameter of the limit portion (112).

5. A light emitting diode according to claim 2, characterized in that: The base (1) and the package (3) are both provided with a limiting groove (14), the cross section of the limiting groove (14) is semicircular, a rubber ring (15) is provided inside the limiting groove (14), and the side of the rubber ring (15) facing the installation cavity (4) is flat, and a gap (16) is provided between the bottom of the package (3) and the base (1), and the width of the gap (16) is 0.5-1 mm.

6. A light emitting diode according to claim 2, characterized in that: The film (71) is located inside the isolation cavity (51) and is provided with a plurality of stirring blades (17). The stirring blades (17) are made of a flexible material, and the center of gravity of the stirring blades (17) is located at the end of the heat fan. A groove (18) is provided on the base (1), and the stirring blades (17) are sunk into the groove (18).

7. A light emitting diode according to claim 6, characterized in that: The bottom of the groove (18) is in an inverted cone shape, and the inlet (20) and the outlet (21) are respectively connected to the bottom of the two grooves (18) with the largest distance between them.

8. The light emitting diode according to claim 2, characterized in that: An air intake channel (19) is provided on the base (1), and the air intake channel (19) is in communication with the power chamber (52).

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