Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are disclosed. The display device may include a display panel that may include a first area having a display area, a second area spaced apart from the first area, and a bendable third area between the first area and the second area; a panel bottom cover coupled to a lower surface of the display panel in the first area; a support film coupled to a lower surface of the display panel in the second area; and a bonding layer to bond the support film to the lower surface of the display panel, in which a gap between the panel bottom cover and the support film may be disposed in the third region.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0156810 filed in the Korean Intellectual Property Office on November 13, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0004] As the information society develops, the demand for display devices for displaying images is increasing in various forms. For example, display devices are applied to various electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart TVs.

[0005] As a display device, various types of display devices such as a liquid crystal display (LCD) and an organic light emitting display (OLED) can be used. Among them, an OLED displays an image using an organic light emitting element that generates light by recombination of electrons and holes. The OLED includes a plurality of transistors that provide a driving current to the organic light emitting element.

[0006] Recently, various attempts have been made to minimize the thickness of display devices in order to make them lighter. Summary of the invention

[0007] Aspects of the present disclosure provide a display device capable of reducing thickness and manufacturing cost, and a method of manufacturing the display device.

[0008] However, aspects of the present disclosure are not limited to those described herein. The above and other aspects of the present disclosure will become more apparent to those skilled in the art to which the present disclosure belongs by referring to the detailed description of the present disclosure given below.

[0009] According to one aspect of the present disclosure, a display device is provided, which may include: a display panel, which may include a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a panel bottom cover, which is bonded to the lower surface of the display panel in the first area; a supporting film, which is bonded to the lower surface of the display panel in the second area; and a bonding layer, which bonds the supporting film to the lower surface of the display panel, wherein a gap may be set between the panel bottom cover and the supporting film in the third area.

[0010] In one embodiment, the panel bottom cover may include: a heat dissipation member coupled to the lower surface of the display panel in the first area and used to dissipate heat from the display panel; a first adhesive member coupling the heat dissipation member to the display panel; and a second adhesive member located at the lower surface of the heat dissipation member and used to fix the bending position of the display panel when the display panel can be bent.

[0011] In one embodiment, the heat dissipation member may include: a metal layer; and a plating layer disposed on at least one of an upper surface and a lower surface of the metal layer.

[0012] In one embodiment, the first adhesive member may bond the heat dissipation member to the lower surface of the display panel and include a light absorbing material to absorb light irradiated from the outside.

[0013] In an embodiment, the support film may include a burr pattern protruding downward from a lower surface of the support film along an inner surface around the gap.

[0014] In one embodiment, an angle formed by a connection surface connecting an inner surface of the bonding layer and an inner surface of the supporting film and the lower surface of the display panel may be about 70 degrees or less.

[0015] In one embodiment, the bonding layer may include a photo-peelable adhesive, and the bonding layer may have an adhesive strength of about 100 gf / inch or less after irradiation.

[0016] In one embodiment, the supporting film may include at least one of polyethylene terephthalate (PET), polycarbonate (PC) and polymethyl methacrylate (PMMA), and the bonding layer may include at least one of polyester acrylate resin, unsaturated polyester resin, polyurethane acrylate resin, epoxy acrylate resin, epoxy resin, polyether acrylate resin and polythiol acrylate resin.

[0017] In one embodiment, the display device may further include: a driving chip disposed in the second region of the display panel and located on an upper surface of the display panel.

[0018] In one embodiment, the display device may further include: a flexible printed circuit board electrically connected to the driving chip in the second region; and a substrate cover layer disposed on a lower surface of the flexible printed circuit board.

[0019] In one embodiment, the flexible printed circuit board may have an end portion bonded to a distal portion of the display panel in the second region, and the substrate covering layer may be located on the lower surface of the flexible printed circuit board at the distal portion of the display panel and may contact a side surface of the display panel in the second region, a side surface of the bonding layer, and a side surface of the supporting film.

[0020] In one embodiment, the substrate cover layer may further include: a covering portion extending from the lower surface of the substrate cover layer toward the side surface of the support film in contact with the substrate cover layer and covering a portion of the lower surface of the support film.

[0021] In one embodiment, the display device may further include: a protection layer disposed on at least one of the upper surface and the lower surface of the display panel in the third region.

[0022] According to another aspect of the present disclosure, a display device may be provided, which may include: a display panel, including a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a supporting film bonded to the lower surface of the display panel in the second area; a bonding layer bonding the supporting film to the lower surface of the display panel in the second area; a flexible printed circuit board having an end bonded to a distal portion of the display panel in the second area; and a substrate covering layer disposed on the lower surface of the flexible printed circuit board.

[0023] In one embodiment, the substrate cover layer may further include: a covering portion extending from the lower surface of the substrate cover layer toward a side surface of the support film in contact with the substrate cover layer and covering a portion of the lower surface of the support film.

[0024] In one embodiment, the display device may further include: a panel bottom cover disposed in the first region of the display panel and coupled to the lower surface of the display panel.

[0025] In one embodiment, the panel bottom cover may include: a heat dissipation member, which is bonded to the lower surface of the display panel in the first area and is used to dissipate heat from the display panel; a first adhesive member, which is arranged between the heat dissipation member and the lower surface of the display panel and bonds the heat dissipation member to the lower surface of the display panel; and a second adhesive member, which is located at the lower surface of the heat dissipation member and is used to fix the bending position of the display panel when the display panel is bent, and the third area may include a gap, which may be a separation space formed between the supporting film and the heat dissipation member, and the supporting film may include a burr pattern, which protrudes downward from the lower surface of the supporting film along the inner surface around the gap.

[0026] In one embodiment, the display device may further include: a driving chip disposed in the second region of the display panel and located on an upper surface of the display panel.

[0027] In one embodiment, the display device may further include: a protection layer disposed on at least one of the upper surface and the lower surface of the display panel and disposed in the third region.

[0028] According to another aspect of the present disclosure, a method for manufacturing a display device is provided, the method may include: preparing a display panel provided with a supporting film layer and a light-peelable bonding body layer, the display panel including a first area including a display area, a second area spaced apart from the first area, and a bendable third area between the first area and the second area and including a gap, the supporting film layer being arranged on the entire lower surface of the display panel in the first area to the third area, the light-peelable bonding body layer being used to bond the supporting film layer to the display panel; forming a light-peelable bonding body layer between the light-peelable bonding body layer and the supporting film layer at a boundary virtual line between the second area and the third area forming a cutting virtual line; selectively irradiating light to the first area and the third area where the photo-peelable bonding body layer and the supporting film layer are formed with the cutting virtual line; forming the photo-peelable bonding body layer into a bonding layer in the second area and forming the supporting film layer into a supporting film in the second area by peeling and removing the photo-peelable bonding body layer and the supporting film layer in the first area and the third area irradiated with the light; and forming a panel bottom cover in the first area at a position spaced apart from the bonding layer and the supporting film in the second area, the gap being arranged between the panel bottom cover and each of the bonding layer and the supporting film.

[0029] In one embodiment, in the step of forming the cutting virtual line, the cutting virtual line may be formed by cutting the photo-peelable bonding body layer and the supporting film layer together through laser processing.

[0030] In one embodiment, in the step of forming the cutting virtual line, a burr pattern protruding from the supporting film layer may be formed in a cutting virtual line region where the cutting virtual line is to be formed.

[0031] In one embodiment, in the step of forming the cutting virtual line, a cutting surface may be formed in each of the photo-peelable bonding body layer and the supporting film layer, and an inclination angle between the cutting surface and the lower surface of the display panel may be about 70 degrees or less.

[0032] In one embodiment, in the step of irradiating light, a mask including light-transmitting portions corresponding to the first and third regions and a light-blocking portion corresponding to the second region may be provided based on the cutting virtual line.

[0033] In one embodiment, in the step of irradiating light, the adhesive strength of the photo-peelable bonding body layer may be reduced to about 100 gf / inch or less after irradiating light.

[0034] In one embodiment, the step of forming a panel bottom cover may include forming a heat dissipation component located on the lower surface of the display panel in the first area and dissipating heat of the display panel, forming a first adhesive component located between the lower surface of the display panel and the heat dissipation component and connecting the heat dissipation component, and forming a second adhesive component located on the lower surface of the heat dissipation component in the first area.

[0035] In an embodiment, the method may further include forming a protection layer on at least one of an upper surface and a lower surface of the display panel in the third region.

[0036] In an embodiment, the method may further include forming a driving chip, the driving chip being disposed in the second region of the display panel and located on an upper surface of the display panel.

[0037] In one embodiment, the method may further include: forming a flexible printed circuit board electrically connected to the driving chip and having an end portion coupled to a distal portion of the display panel in the second region. The method may further include forming a substrate cover layer located on a lower surface of the flexible printed circuit board and in contact with a side surface of the display panel in the second region, a side surface of the bonding layer, and a side surface of the supporting film.

[0038] In one embodiment, in the step of forming the substrate cover layer, a cover portion may be formed that extends from the lower surface of the substrate cover layer toward a side of the support film contacting one side of the substrate cover layer and covers a portion of the lower surface of the support film.

[0039] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0040] According to the present embodiment, a display device capable of reducing thickness and manufacturing cost and a method of manufacturing the display device are provided.

[0041] Specifically, when the component corresponding to the supporting film is disposed in the first region, an environmental reliability problem may occur when the display panel is bent or folded. However, in the present disclosure, since the component corresponding to the supporting film is not disposed in the first region, the environmental reliability problem can be solved.

[0042] When the component corresponding to the supporting film is located in the first region, the overall thickness may increase because the stacking structure increases in the first region which is the display region. However, according to the present disclosure, the supporting film is provided in the second region which is the non-display region, and the component corresponding to the supporting film is not provided in the first region which is the display region. Therefore, the stacking structure can be reduced in the first region which is the display region, thereby reducing the overall thickness of the display device.

[0043] In addition, since a member corresponding to the supporting film is not disposed in the first region, the stacking structure can be reduced in the first region which is the display region, thereby reducing manufacturing costs.

[0044] According to the present disclosure, the component corresponding to the support film is not arranged in the first area, but the support film is located on the lower surface of the display panel at a position corresponding to the driving chip in the second area. Therefore, the display panel can be protected in the second area, and the problems of cracks and driving chip defects can be solved.

[0045] In addition, since the panel bottom cover is located in the first region, the display panel can be stably supported in the second region.

[0046] In addition, the cover portion is formed adjacent to the support film in the second region to seal a portion of the lower surface of the support film. Therefore, moisture can be prevented from penetrating into the flexible printed circuit board and the driving chip connected to the flexible printed circuit board, thereby preventing corrosion due to moisture.

[0047] In addition, during the manufacturing process, the support film layer can be bonded and then peeled off by the photo-peelable bonding body layer whose bonding strength is reduced due to light irradiation. Therefore, the photo-peelable bonding body layer and the support film layer will not remain to cause defects or damage to the peeling surface. Accordingly, the defect rate can be reduced, and problems such as tearing during the peeling process can be suppressed.

[0048] However, the effects of the present disclosure may not be limited to the effects set forth herein. The above and other effects of the present disclosure will become more apparent to those skilled in the art to which the present disclosure belongs by referring to the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] These and / or other aspects will become apparent and more readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0050] Figure 1 is a perspective view of a display device according to an embodiment;

[0051] Figure 2 for Figure 1 A plan view of a display device illustrated in FIG.

[0052] Figure 3 for Figure 1 A rear view of the display device illustrated in FIG.

[0053] Figure 4 for Figure 3 a rear view of a display panel in a display device;

[0054] Figure 5 is a schematic cross-sectional view schematically illustrating the structure of a display panel;

[0055] Figure 6 for Figure 5 A schematic enlarged cross-sectional view of a stacked structure of a display panel;

[0056] Figure 7 For along Figure 2 and Figure 3 A schematic cross-sectional view taken along line X1-X1';

[0057] Figure 8 for Figure 7 A magnified image of a first region;

[0058] Fig. 9 for Figure 7 an enlarged view of a boundary area between the second area and the third area;

[0059] Fig.10 for Figure 7 An enlarged view of the second area and the flexible printed circuit board bonding area;

[0060] Fig.11 In a bent state Figure 7 A schematic cross-sectional view of a display device;

[0061] Fig.12 is a flow chart illustrating a method of manufacturing a display device according to the present disclosure;

[0062] Fig.13 is a perspective view of a mother substrate for a display device;

[0063] Fig.14for Fig.13 A rear view of a mother substrate for a display device illustrated in FIG.

[0064] Figures 15 to 20 For specific description in Fig.12 Schematic cross-sectional view of a process of forming a support film, a bonding layer, and a panel bottom cover during a manufacturing process of . DETAILED DESCRIPTION

[0065] In the following description, for the purpose of illustration, many specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words, which are non-limiting examples of the devices or methods disclosed herein. However, it is apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, various embodiments do not have to be exclusive, nor do they have to limit the present disclosure. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment.

[0066] Unless otherwise specified, the illustrated embodiments should be understood to provide features of the present disclosure. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") can be combined, separated, interchanged and / or rearranged in other ways without departing from the concept of the present invention.

[0067] The use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the illustrated elements, and / or any other features, attributes, characteristics, etc. of the elements, unless explicitly stated. Further, in the drawings, the size (e.g., relative size) of the elements may be magnified for clarity and / or descriptive purposes. When an embodiment may be implemented differently, a specific process sequence may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously or in an order opposite to the order described. Moreover, the same reference numerals and / or reference characters represent the same elements.

[0068] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to another element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without intervening elements. Further, the x-axis, y-axis, and z-axis are not limited to the three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

[0069] For the purpose of this disclosure, "at least one of A and B" may be interpreted as only A, only B, or any combination of A and B. Moreover, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0070] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0071] Spatially relative terms such as "below," "below," "below," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein for descriptive purposes, and are thereby used to describe the relationship of one element to another element as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figure is flipped, an element described as being "below" or "beneath" other elements or features would then be oriented as being "above" the other elements or features. Thus, the term "below" may encompass both above and below. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0072] The term used herein is for the purpose of describing a particular embodiment, and is not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular form "one" and "described" are also intended to include plural forms. In addition, the term "including" and / or "comprising" when used in this specification specifies the existence of stated features, integers, steps, operations, elements, parts and / or its group, but does not exclude the existence or addition of one or more other features, integers, steps, operations, elements, parts and / or its group. It should also be noted that, as used herein, the term "substantially", "about" and other similar terms are used as approximate terms and are not used as degree terms, and so, for considering the inherent deviation of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0073] Various embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic diagrams of embodiments and / or intermediate structures. As such, variations in the shapes of the figures resulting from, for example, manufacturing techniques and / or tolerances are expected. Therefore, the embodiments disclosed herein should not necessarily be interpreted as being limited to the shapes of the specifically illustrated regions, but should include shape deviations resulting from, for example, manufacturing. In this manner, the regions illustrated in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and as such, are not necessarily intended to be limiting.

[0074] According to the convention in the art, some embodiments are described and illustrated in the accompanying drawings according to functional blocks, units and / or modules. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, storage elements, wiring connectors, etc. that can be formed using semiconductor-type manufacturing technology or other manufacturing technology. In the case of implementing blocks, units and / or modules by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and can be optionally driven by firmware and / or software. It is also envisioned that each block, unit and / or module can be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and processors (e.g., one or more programmed microprocessors and related circuits) for performing other functions. Moreover, without departing from the scope of the inventive concept, each block, unit and / or module of some embodiments can be physically separated into two or more interacting and discrete blocks, units and / or modules. Further, without departing from the scope of the inventive concept, the blocks, units and / or modules of some embodiments may be physically combined into more complex blocks, units and / or modules.

[0075] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0076] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0077] Figure 1 is a perspective view of a display device 1 according to an embodiment. Figure 2 for Figure 1 A plan view of the display device 1 illustrated in FIG. Figure 3 for Figure 1 2 is a rear view of the display device 1 illustrated in FIG. Figure 4 for Figure 3 FIG. 1 is a rear view of the display panel 100 in the display device 1. Here, Figures 1 to 4 The display device 1 before being bent or folded is shown.

[0078] The display device 1 can be applied to portable terminals and the like. Examples of portable terminals may include tablet personal computers, smart phones, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, and watch-type electronic devices. However, the present disclosure is not limited to a specific type of the display device 1. For example, in other embodiments of the present disclosure, the display device 1 can be used for small and medium-sized electronic equipment such as personal computers (e.g., notebook computers), car navigation devices, and cameras, as well as large electronic equipment such as televisions and outdoor billboards.

[0079] In one embodiment, the display device 1 may include a display panel 100 having a rectangular shape in a plan view.

[0080] The display panel 100 may have a rectangular shape in a plan view, and may include two short sides, two long sides, and a rectangular panel surface formed by the short sides and the long sides.

[0081] The display panel 100 may be exemplified as a rectangular planar shape, wherein each corner where the long side and the short side intersect may be a right angle. However, the present disclosure is not limited thereto. The corners of the display panel 100 may also be curved, and the planar shape of the display panel 100 may also be circular or other various shapes.

[0082] based on Figure 1In the state illustrated in FIG. 1 , the direction along which the short side of the display panel 100 extends will be described as the first direction x, the direction along which the long side of the display panel 100 extends will be described as the second direction y, and the direction perpendicular to the panel direction formed by the panel surface of the display panel 100 will be described as the third direction z. Unless otherwise defined below, in the specification, “above”, “top”, “upper surface” and “upper side” may refer to the direction in which the arrow of the third direction z points relative to the display panel 100, and “below”, “bottom”, “lower surface” and “lower side” refer to the direction opposite to the direction in which the arrow of the third direction z points relative to the display panel 100.

[0083] The display panel 100 may be a display panel including a self-luminous element. In one embodiment, the self-luminous element may include at least one of an organic light emitting diode, a quantum dot light emitting diode, an inorganic material-based micro light emitting diode (e.g., a micro LED), and an inorganic material-based nano light emitting diode (e.g., a nano LED). For ease of description, each element of the display panel 100 will be described in detail below using the case where the self-luminous element may be an organic light emitting element as an example.

[0084] In the case where the display panel 100 is divided based on image display, the display panel 100 may include a display area DA displaying an image and a non-display area NDA not displaying an image. The non-display area NDA may be located around the display area DA and may surround the display area DA.

[0085] In the case where the display panel 100 is divided based on the bendable area, the display panel 100 may include a first area A1, a second area A2, and a third area A3.

[0086] The display panel 100 may include a first area A1 including a display area DA, a second area A2 spaced apart from the first area A1, and a bendable third area A3 between the first area A1 and the second area A2.

[0087] A gap G, which may be a space between the first area A1 and the second area A2, may be formed in the third area A3, and the first area A1 and the second area A2 may be positioned to be spaced apart by the gap G of the third area A3.

[0088] The first area A1 may be foldable. For example, the first area A1 may be foldable upward or downward based on a folding axis FX extending in the first direction x.

[0089] If based on Figure 1 For illustration, the first area A1 may be folded in the direction pointed by the arrow of the third direction z (ie, the upward direction), or folded in the direction opposite to the direction pointed by the arrow of the third direction z (ie, the downward direction).

[0090] The panel bottom cover 300 may be located at a lower side of the display panel 100 in the first area A1.

[0091] The panel bottom cover 300 in the first area A1 may be coupled to the lower side of the display panel 100 at a position spaced apart from the second area A2 by a gap G. FIG.

[0092] The second area A2 may be a portion of the non-display area NDA.

[0093] The bonding layer 410 and the supporting film 400 may be located on the lower side of the display panel 100 in the second area A2.

[0094] The bonding layer 410 and the supporting film 400 in the second area A2 may be bonded to the lower side of the display panel 100 at a position spaced apart from the first area A1 by a gap G.

[0095] The gap G in the third area A3 may be located between the bonding layer 410 and the supporting film 400 in the second area A2 and the panel bottom cover 300 in the first area A1.

[0096] In the second area A2, the driving chip IC and the end area of ​​the flexible printed circuit board FPCB may be located on the upper side of the display panel 100. Here, the main circuit board MP may be electrically connected to the other end area of ​​the flexible printed circuit board FPCB. In one embodiment, the end area of ​​the flexible printed circuit board FPCB may be coupled to the distal portion of the display panel 100 in the second area A2.

[0097] The pads electrically connected to the driving chip IC and the pads electrically connected to the flexible printed circuit board FPCB may be located in the second area A2. The substrate cover layer 500 in contact with the display panel 100, the bonding layer 410 and the supporting film 400 may be located on the lower side of the flexible printed circuit board FPCB at the distal end portion of the display panel 100.

[0098] The driving chip IC and the flexible printed circuit board FPCB in the second area A2 may be located on the upper side of the display panel 100 at a position spaced apart from the first area A1.

[0099] The driver chip IC may include at least one of a driving device such as a data driver that transmits a data signal to a data line and a gate driver that transmits a gate signal to a gate line, and a signal controller that controls the operation of the data driver and / or the gate driver. The number of the driver chip ICs is not limited to the illustrated example.

[0100] The driver chip IC may be mounted on the display panel 100 using a chip on plastic method. The driver chip IC may be mounted on the display panel 100 using a pressurizing device. The driver chip IC may be mounted on the display panel 100 using an anisotropic conductive film. In one embodiment, the driver chip IC may be mounted on the display panel 100 using an ultrasonic bonding method without a separate anisotropic conductive film.

[0101] Ultrasonic bonding may be a method of bonding two metals by applying pressure and ultrasonic vibration. In the case where the driver chip IC is mounted on the display panel 100 using the ultrasonic bonding method, a process of applying pressure and ultrasonic vibration to the driver chip IC may be performed. However, the present disclosure is not limited to the above-described embodiments. In one embodiment, the driver chip IC may be mounted on a flexible printed circuit board FPCB in the form of a chip on film.

[0102] The flexible printed circuit board FPCB may be electrically connected to the second area A2 of the display panel 100. The flexible printed circuit board FPCB may be electrically connected to a pad provided on the display panel 100 through an anisotropic conductive film or the like. A process of connecting the flexible printed circuit board FPCB to the display panel 100 may include a process of applying pressure to the flexible printed circuit board FPCB.

[0103] The main circuit board MP may be electrically connected to the display panel 100 through the flexible printed circuit board FPCB, and may exchange signals with the driving chip IC. The main circuit board MP may provide image data, control signals, power supply voltage, etc. to the display panel 100 or the flexible printed circuit board FPCB. The main circuit board MP may include active components and passive components.

[0104] The third area A3 may also be another part of the non-display area NDA.

[0105] The third area A3 may be located between the first area A1 and the second area A2, and may include a gap G, which may be a separation space formed between the panel bottom cover 300 in the first area A1 and the supporting film 400 in the second area A2. Specifically, the gap G may be defined as a gap between the supporting film 400 and the heat dissipation member 330 of the panel bottom cover 300 (see, for example, Figure 7 ) which will be described later.

[0106] The gap G in the third area A3 may be formed in a direction intersecting the non-display area NDA in the first direction x, which may be a short side direction of the display panel 100 .

[0107] The display panel 100 may be bent in the third area A3 based on the bending axis BX extending in the first direction x, and the display panel 100 may be bent downward in the third area A3 based on the bending axis BX. Since a portion of the non-display area NDA of the display panel 100 may be bent toward the bottom of the display panel 100, the non-display area NDA of the display device 1 that may be visible from above may be reduced, and the frame width of the display device 1 may be reduced.

[0108] Figure 5 is a schematic cross-sectional view schematically illustrating the structure of a display panel. Figure 6 for Figure 5 Schematic enlarged cross-sectional view of the stacking structure of the display panel.

[0109] The display panel 100 may include a base substrate 110 , a driving layer 120 , an organic light emitting element layer 130 , and an encapsulation layer 140 .

[0110] The base substrate 110 provides the lower surface 101 of the display panel 100. The base substrate 110 may be a flexible substrate and may be made of a flexible polymer material. For example, the base substrate 110 may be made of a plastic having excellent heat resistance and durability such as polyvinyl ether phthalate, polyethylene naphthalate, polycarbonate, polyarylate, polyetherimide, polyethersulfone, polyimide, or a combination thereof. The case where the base substrate 110 includes polyimide will be described as an example below.

[0111] The driving layer 120 includes an element for providing a signal to the organic light emitting element layer 130. The driving layer 120 may include various signal lines, such as a scan line (not illustrated), a data line (not illustrated), a power line (not illustrated), and an emission line (not illustrated). The driving layer 120 may include a plurality of transistors and capacitors. The transistor may include a switching transistor (not illustrated) and a driving transistor Qd provided in each pixel (not illustrated).

[0112] exist Figure 6 , the driving transistor Qd of the driving layer 120 may be illustrated as an example. The driving transistor Qd includes an active layer 211 , a gate electrode 213 , a source electrode 215 , and a drain electrode 217 .

[0113] The active layer 211 may be disposed on the base substrate 110. The active layer 211 may include polycrystalline silicon. The active layer 211 may include single crystal silicon, low temperature polycrystalline silicon, amorphous silicon, or a combination thereof. However, the present disclosure is not limited thereto, and the active layer 211 may also include an oxide semiconductor.

[0114] The driving layer 120 may further include a first insulating layer 221 disposed on the active layer 211 , and the gate electrode 213 may be located on the first insulating layer 221 .

[0115] The first insulating layer 221 may insulate the active layer 211 and the gate electrode 213 from each other. The first insulating layer 221 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof. The first insulating layer 221 may be a single layer or a multilayer consisting of stacked layers of different materials.

[0116] The gate electrode 213 may be located on the first insulating layer 221 and may overlap the active layer 211. The gate electrode 213 may include gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (Mo), or a combination thereof.

[0117] The driving layer 120 may further include a second insulating layer 223 on the gate electrode 213 , and the source electrode 215 and the drain electrode 217 may be disposed on the second insulating layer 223 .

[0118] The second insulating layer 223 may include at least any one of the insulating materials exemplified in the description of the first insulating layer 221 .

[0119] The source electrode 215 and the drain electrode 217 may be electrically connected to the active layer 211 through contact holes CH1 and CH2 provided in the first and second insulating layers 221 and 223, respectively. The source electrode 215 and the drain electrode 217 may have a metal multilayer structure of, but not limited to, titanium (Ti) / aluminum (Al) / titanium (Ti).

[0120] The driving layer 120 may further include a protective layer 230 disposed on the source electrode 215 and the drain electrode 217. In some embodiments, the protective layer 230 may be a planarization layer. For example, the protective layer 230 may include an organic insulating material or an inorganic insulating material, or may be implemented as a composite of an organic insulating material and an inorganic insulating material.

[0121] Despite Figure 6 The structure of the switching transistor may not be illustrated, but the switching transistor (not illustrated) and the driving transistor Qd may have substantially the same structure or a similar structure. However, the present disclosure is not limited thereto, and the switching transistor (not illustrated) and the driving transistor Qd may also have different structures. For example, the active layer (not illustrated) of the switching transistor (not illustrated) and the active layer 211 of the driving transistor Qd may be made of different materials or may be provided on different layers.

[0122] The driving layer 120 may be located not only in the display area DA of the display panel 100 but also in the non-display area NDA of the display panel 100. A portion of the driving layer 120 that may be located in the non-display area NDA (e.g., portions located in the non-display area NDA of the first area A1, the second area A2, and the third area A3) may include a wiring and a pad portion electrically connected to the driving chip IC, and may further include a wiring and a pad portion electrically connected to the flexible printed circuit board FPCB.

[0123] The organic light emitting element layer 130 may include an organic light emitting element LD as a self-luminous element. The organic light emitting element LD may be provided as a top emission type and may emit light in a thickness direction of the display panel 100 or in a third direction z.

[0124] The organic light emitting element LD may include a first electrode AE, an organic layer OL, and a second electrode CE.

[0125] The first electrode AE ​​may be disposed on the protective layer 230. The first electrode AE ​​may be electrically connected to the drain electrode 217 through a contact hole CH3 formed in the protective layer 230. The first electrode AE ​​may be a pixel electrode or an anode. The first electrode AE ​​may be a transflective electrode or a reflective electrode. In the case where the organic light emitting element LD is provided as a top emission type, the first electrode AE ​​may be a reflective electrode. The first electrode AE ​​may include any one of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), and chromium (Cr), an alloy thereof, or a combination thereof.

[0126] The first electrode AE ​​may be a single layer made of metal oxide or metal or a multilayer structure having multiple layers. For example, the first electrode AE ​​may have a single layer structure of, but not limited to, indium tin oxide (ITO), silver (Ag), or a metal mixture (e.g., a mixture of Ag and Mg), indium tin oxide (ITO) / magnesium (Mg), or indium tin oxide (ITO) / magnesium fluoride (MgF 2 ) or a three-layer structure of indium tin oxide (ITO) / silver (Ag) / indium tin oxide (ITO).

[0127] The organic layer OL may include an organic emission layer (EML) made of a low molecular organic material or a high molecular organic material. The organic emission layer may emit light. In addition to the organic emission layer, the organic layer OL may optionally include a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0128] Holes and electrons respectively from the first electrode AE ​​and the second electrode CE may be injected into the organic emission layer inside the organic layer OL. The holes and electrons may be recombined in the organic emission layer to form excitons, and light may be emitted when the excitons drop from an excited state to a ground state.

[0129] The second electrode CE may be provided on the organic layer OL. The second electrode CE may be a common electrode or a cathode. The second electrode CE may be a transmissive electrode or a transflective electrode. In the case where the second electrode CE is a transflective electrode, it may include lithium (Li), calcium (Ca), aluminum (Al), magnesium (Mg), barium (Ba), silver (Ag), a compound thereof (e.g., lithium fluoride (LiF) or barium fluoride (BaF 2 )) or a mixture thereof (e.g., a mixture of Ag and Mg) or a material having a multilayer structure such as lithium fluoride (LiF) / calcium (Ca) or lithium fluoride (LiF) / aluminum (Al).

[0130] When the second electrode CE is a transmissive electrode, it may include a transparent metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), or may include molybdenum (Mo), titanium (Ti), silver (Ag), or a combination thereof.

[0131] The organic light emitting element layer 130 may further include a pixel defining layer PDL disposed on the protective layer 230. The pixel defining layer PDL may include an opening, and define an emission area LTA.

[0132] The encapsulation layer 140 may be disposed on the organic light emitting element layer 130. The encapsulation layer 140 may block the organic light emitting element layer 130 from external moisture and oxygen.

[0133] The encapsulation layer 140 may be formed as a thin film encapsulation layer and may include one or more organic layers and one or more inorganic layers. For example, the encapsulation layer 140 may include a first inorganic layer 141 on the second electrode CE, an organic layer 145 on the first inorganic layer 141, and a second inorganic layer 143 on the organic layer 145.

[0134] The first inorganic layer 141 may be disposed on the organic light emitting element LD and may prevent moisture, oxygen, etc. from penetrating into the organic light emitting element LD. In some embodiments, the first inorganic layer 141 may include an inorganic material, and the inorganic material may include, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiON x ) any one or more of ).

[0135] The organic layer 145 may be located on the first inorganic layer 141. The organic layer 145 may improve flatness. The organic layer 145 may include an organic material, and the organic material may include, for example, any one of epoxy, acrylate, urethane acrylate, and a combination thereof.

[0136] The second inorganic layer 143 may be located on the organic layer 145. The second inorganic layer 143 may perform substantially the same or similar role as the first inorganic layer 141, and may be made of substantially the same or similar material as the first inorganic layer 141. The second inorganic layer 143 may completely cover the organic layer 145. In some embodiments, the second inorganic layer 143 and the first inorganic layer 141 may contact each other outside the display area DA to form an inorganic-inorganic bond. In the case of forming an inorganic-inorganic bond, moisture can be effectively prevented from being introduced into the display device 1 from the outside of the display device 1.

[0137] Although each of the first inorganic layer 141, the organic layer 145, and the second inorganic layer 143 may be Figure 6 At least one of the first inorganic layer 141 , the organic layer 145 , and the second inorganic layer 143 may also be formed as a multi-layer structure.

[0138] The encapsulation layer 140 may not completely cover the non-display area NDA of the display panel 100. For example, the encapsulation layer 140 may not be located in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not be located in the second area A2 and the third area A3. The encapsulation layer 140 may be located in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not be located in the second area A2 and the third area A3. For ease of description, a case where the encapsulation layer 140 may be located in the display area DA of the display panel 100 and may not be located in a portion of the first area A1 between the third area A3 and the display area DA, and may not be located in the second area A2 and the third area A3 will be described as an example.

[0139] Figure 7 For along Figure 2 and Figure 3 , and a schematic cross-sectional view of the display panel 100 taken along line X1 - X1 ′, the panel bottom cover 300 , the supporting film 400 , and the substrate cover layer 500 may be located in the first area A1 and the second area A2 on the display panel 100 .

[0140] The polarizer 310 may be located on the upper surface 102 of the display panel 100 in the first area A1. Here, the polarizer 310 increases contrast by expressing a true black color, and may be located on the upper surface 102 of the display panel 100 to ensure outdoor visibility.

[0141] The panel bottom cover 300 in the first area A1 may be located on the lower surface 101 of the display panel 100 in the first area A1 , and may support the display panel 100 .

[0142] The panel bottom cover 300 may include an adhesive member (also called a first adhesive member) 320 attached to the lower surface 101 of the display panel 100, a heat dissipation member 330 for effectively dissipating heat from the display panel 100, and a bending adhesive member (also called a second adhesive member) 340 for fixing a bending position (or a bending shape or a bending state or a bending structure) of the display panel 100 when the display panel 100 is bent.

[0143] The adhesive member 320 may be disposed between the lower surface 101 of the display panel 100 and the heat dissipation member 330 to attach the heat dissipation member 330 to the lower surface 101 of the display panel 100 .

[0144] The adhesive member 320 may be an adhesive layer made of a pressure sensitive adhesive (PSA), and may attach the panel bottom cover 300 to the lower surface 101 of the display panel 100. For example, the adhesive member 320 may include, but is not limited to, an acrylic or silicone adhesive.

[0145] The adhesive member 320 may be formed as a pressure-sensitive adhesive layer containing a light absorbing material such as a black pigment or a black dye for absorbing light incident from the outside.

[0146] The heat dissipation member 330 may be bonded to the lower surface 101 of the display panel 100 by the adhesive member 320 , and may include a metal layer 331 and a plating layer 332 formed on at least one of the upper and lower surfaces of the metal layer 331 .

[0147] The metal layer 331 may be, but is not limited to, a thin film made of one or more metals selected from copper, nickel, ferrite, and silver having excellent thermal conductivity.

[0148] The coating 332 may be made of the same or different metals. Figure 7 The middle plating layer 332 may be formed on both the upper and lower surfaces of the metal layer 331 , but it may be formed only on one surface.

[0149] The heat dissipation member 330 may also be, but is not limited to, a composite layer including, for example, a first layer containing graphite or carbon nanotubes and a second layer made of a metal thin film such as copper, nickel, ferrite, silver, or a combination thereof that can shield electromagnetic waves and has excellent thermal conductivity.

[0150] In the case where the display panel 100 is bent, the bending adhesive member 340 fixes the bending position of the display panel 100. Because the support film 400 can be attached to the bending adhesive member 340 at the bending position, the position of the display panel 100 can be fixed. The bending adhesive member 340 may include, but is not limited to, acrylic or silicone adhesive. In one embodiment, the bending adhesive member 340 may be located at the lower surface of the heat dissipation member 330.

[0151] The panel bottom cover 300 may further include a buffer member (not illustrated). The buffer member may be located on the heat dissipation member 330 and the bending adhesive member 340. The buffer member (not illustrated) may be formed as a cushion layer to support the display panel 100 and prevent damage to the display panel 100 due to absorption of external impact. For example, the buffer member (not illustrated) may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, or a combination thereof, or may be made of an elastic material such as a sponge formed of foam molded rubber, a urethane material, an acrylic material, or a combination thereof.

[0152] The supporting film 400 in the second area A2 may be spaced apart from the heat dissipation member 330 of the panel bottom cover 300 by a gap G. The supporting film 400 and the heat dissipation member 330 spaced apart from each other may be disposed parallel to each other.

[0153] The supporting film 400 may be located on the lower surface 101 of the display panel 100 at a position corresponding to the driving chip IC in a vertical direction.

[0154] The support film 400 may be made of, for example, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA). The support film 400 may be most preferably made of polyethylene terephthalate (PET), but the present disclosure is not limited thereto.

[0155] The supporting film 400 may be made of a film having a high tensile modulus or a high light transmittance.

[0156] In the case where the supporting film 400 is made of a film having a high tensile modulus, it can support the flexible display panel 100 , protect the lower surface 101 of the display panel 100 , and prevent cracks from being formed during a process of mounting a driving chip IC.

[0157] In the case where the driver chip IC is mounted on the second area A2 of the display panel 100, pressure may be applied to the second area A2. Here, since the supporting film 400 disposed on the lower surface 101 of the display panel 100 corresponding to the second area A2 has a high tensile modulus, cracks may be prevented from being formed in the wiring of the non-display area NDA due to pressure applied during the process of mounting the driver chip IC.

[0158] In the case where the supporting film 400 is made of a film having high light transmittance, the light transmittance of the supporting film 400 may be, but is not limited to, about 80% or more.

[0159] In the case where the supporting film 400 is made of a film having high light transmittance, the driving chip IC may be mounted on the display panel 100 by high-voltage bonding in the second area A2 where the supporting film 400 is bonded. Whether the driving chip IC has been correctly mounted may be checked using an optical microscope or the like.

[0160] Here, since the light transmittance of the support film 400 located in the second area A2 where the driver chip IC can be mounted can be high, the mounting state of the driver chip IC can be inspected more smoothly. Accordingly, the problem of defects caused by compression of the driver chip IC can be solved.

[0161] In the case where the first area A1 is spaced apart from the second area A2, the display panel 100 may be folded along the folding axis FX. Here, if a component corresponding to the supporting film 400 is disposed in the foldable first area A1, a problem may arise in environmental reliability. Environmental reliability may refer to a characteristic that the display panel 100 is not damaged by maintaining a neutral plane for bending or folding the display panel 100 in a high temperature environment within a range of about 60 to about 85 degrees Celsius.

[0162] When the component corresponding to the supporting film 400 is disposed in the first area A1, an environmental reliability problem may occur when the display panel 100 is bent or folded. However, in the present disclosure, since the component corresponding to the supporting film 400 may not be disposed in the first area A1, the environmental reliability problem may be solved.

[0163] If the supporting film 400 is located in the first area A1, the overall thickness may increase because the stacking structure increases in the first area A1 which is the display area DA. However, according to the present disclosure, the supporting film 400 may be disposed in the second area A2 which may be the non-display area NDA, and a component corresponding to the supporting film 400 may not be disposed in the first area A1 which is the display area DA. Therefore, the stacking structure may be reduced in the first area A1 which is the display area DA, thereby reducing the overall thickness of the display device 1.

[0164] Since a component corresponding to the supporting film 400 may not be disposed in the first area A1, a stack structure may be reduced in the first area A1 which is the display area DA, thereby reducing manufacturing costs.

[0165] According to the present disclosure, the component corresponding to the supporting film 400 may not be disposed in the first area A1, but may be located on the lower surface 101 of the display panel 100 at a position corresponding to the driving chip IC in the second area A2. Therefore, the display panel 100 may be protected in the second area A2, and the problems of cracks and driving chip IC defects may be solved.

[0166] The bonding layer 410 in the second area A2 may bond the supporting film 400 to the lower surface 101 of the display panel 100 in the second area A2.

[0167] The bonding layer 410 may be disposed at a position spaced apart in a horizontal direction from the adhesive member 320 of the panel bottom cover 300. The bonding layer 410 and the adhesive member 320 spaced apart from each other may be disposed parallel to each other.

[0168] The bonding layer 410 may be located on the lower surface 101 of the display panel 100 at a position corresponding to the driving chip IC in a vertical direction.

[0169] The bonding layer 410 may be formed in a shape corresponding to the supporting film 400 and disposed between the lower surface 101 of the display panel 100 and the supporting film 400 to function to attach the supporting film 400 to the lower surface 101 of the display panel 100 in the second area A2.

[0170] The bonding layer 410 may have adhesiveness to which the support film 400 may be attached, and may be formed to have a high storage modulus.

[0171] The bonding layer 410 may include, for example, one or more of polyester acrylate resin, unsaturated polyester resin, polyurethane acrylate resin, epoxy acrylate resin, epoxy resin, polyether acrylate resin, and polythiol acrylate resin. In one embodiment, the bonding layer 410 may include a light-peelable adhesive. The bonding layer 410 may most preferably include an ultraviolet (UV) peelable adhesive, but the present disclosure is not limited thereto.

[0172] In the case where the bonding layer 410 is formed of an ultraviolet (UV) strippable adhesive, it is expected that the adhesive strength is reduced to about 100 gf / inch (about 180 degree stripping, speed of about 40 mm / sec) or less when exposed to ultraviolet irradiation, but the present disclosure is not limited thereto. Here, in the case where the bonding layer 410 is formed of an ultraviolet (UV) strippable adhesive and the adhesive strength is reduced to about 100 gf / inch (about 180 degree stripping, speed of about 40 mm / sec) or less after light irradiation, because stripping can easily occur during the manufacturing process, and the defect rate can be reduced by not leaving residue on the stripping surface or damaging the stripping surface, the process convenience can be improved.

[0173] In the case where the storage modulus of the bonding layer 410 is high, since the bonding layer 410 having the high storage modulus may be located in the second area A2 of the display panel 100 , cracks may be prevented from being formed due to pressure during a process of mounting a driving chip IC.

[0174] The substrate cover layer 500 may be disposed on the lower surface of the flexible printed circuit board FPCB to contact the bonding layer 410 , the supporting film 400 , and the display panel 100 in the second area A2 .

[0175] The substrate cover layer 500 may be formed of an organic material in various forms, and may include, for example, one or more of an acrylic resin and a urethane resin. However, the present disclosure is not limited thereto.

[0176] The third area A3 may be located between the second area A2 where the supporting film 400 and the bonding layer 410 are located and the first area A1 where the panel bottom cover 300 is located.

[0177] The third area A3 may be a bendable area, and in order to form a small radius of curvature, the third area A3 may include a gap G, which may be a separation space between the heat dissipation member 330 of the panel bottom cover 300 in the first area A1 and the supporting film 400 in the second area A2.

[0178] The lower surface 101 of the display panel 100 corresponding to the third area A3 may be exposed through the gap G, and a lower protective layer 600 b to be described later covering the lower surface 101 of the display panel 100 exposed through the gap G may be exposed.

[0179] In the third area A3, the upper protective layer 600a and the lower protective layer 600b may be respectively located on the upper surface 102 and the lower surface 101 of the display panel 100. Each of the protective layers 600a and 600b may be disposed at a position between the first area A1 and the second area A2.

[0180] The upper protective layer 600 a may be located between the polarizer 310 in the first area A1 and the driving chip IC in the second area A2 in a horizontal direction, and may be disposed on the upper surface 102 of the display panel 100 .

[0181] The upper protection layer 600 a may be located on the non-display area NDA of the display panel 100 as a neutral plane adjustment layer.

[0182] The neutral plane adjusting layer (or upper protective layer) 600a may overlap the bendable third area A3 of the non-display area NDA of the display panel 100. Although the neutral plane adjusting layer 600a may be formed only in the third area A3, a portion of the neutral plane adjusting layer 600a may also be formed to overlap the first area A1 and the second area A2.

[0183] The neutral plane adjusting layer 600 a may prevent cracks from being formed in the wiring in the driving layer 120 by alleviating stress applied to the driving layer 120 in the bendable third area A3 .

[0184] More specifically, the driving layer 120 may include wirings passing through the non-display area NDA of the first area A1 and the third area A3 , and elements in the driving layer 120 may be electrically connected to the driving chip IC through the wirings.

[0185] The neutral plane adjusting layer 600 a adjusts the position of the neutral plane to prevent tensile stress from acting on the wiring located in the third area A3 .

[0186] Here, the neutral plane refers to a plane on which neither compressive stress nor tensile stress acts when the third area A3 of the display panel 100 is bent. For example, when the third area A3 is bent, compressive stress acts on the inner side of the bent portion, and tensile stress acts on the outer side of the bent portion.

[0187] Therefore, from the inside of the curved portion toward the outside of the curved portion, the direction of stress gradually changes from the compressive direction to the tensile direction. At a certain critical point, there may be a transition point where neither the compressive stress nor the tensile stress acts, and this point becomes the neutral plane. If the position of the neutral plane can be adjusted by the neutral plane adjustment layer 600a, the compressive stress may not act on the wiring in the driving layer 120, thereby reducing the risk of crack formation.

[0188] The neutral plane adjustment layer 600a may be made of an organic material. The organic material may be, for example, a photosensitive organic material. For example, the neutral plane adjustment layer 600a may include one or more of an acrylic resin and a urethane resin.

[0189] Although the neutral plane adjusting layer 600a may be spaced apart from the driving chip IC in the figure, the present disclosure is not limited thereto. The neutral plane adjusting layer 600a may also extend to a portion where the driving chip IC may be disposed, and may cover a portion of the driving chip IC.

[0190] In this case, the connection reliability between the driving chip IC and the display panel 100 can be improved.

[0191] The lower protective layer 600 b may be located between the adhesive member 320 in the first area A1 and the bonding layer 410 in the second area A2 , and may be disposed on the lower surface 101 of the display panel 100 .

[0192] The lower protective layer 600b and the upper protective layer 600a may be made of the same material, and may include, for example, one or more of acrylic resin and urethane resin. The lower protective layer 600b may also be made of a material different from that of the upper protective layer 600a.

[0193] The lower protective layer 600b may support the lower surface 101 of the display panel 100 exposed by the gap G in the third area A3 and protect the lower surface 101 of the display panel 100. Although both the upper protective layer 600a and the lower protective layer 600b may be included in Figure 7 However, the present disclosure is not limited thereto, and the lower protective layer 600b may also be selectively formed.

[0194] Figure 8 for Figure 7 An enlarged view of the first area A1, Fig. 9 for Figure 7 an enlarged view of a boundary area between the second area A2 and the third area A3, and Fig.10 for Figure 7 An enlarged view of the second area A2 and the flexible printed circuit board bonding area.

[0195] Figure 8 The panel bottom cover 300 may include an inner surface 301 around the gap G, an upper surface 302 facing the display panel 100 , and a lower surface 303 opposite to the upper surface 302 .

[0196] The angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 101 of the display panel 100 may be a right angle. Figure 8 However, the shape of the panel bottom cover 300 is not limited to the rectangular shape.

[0197] Fig. 9 The supporting film 400 includes an inner surface 401 around the gap G, an upper surface 402 facing the bonding layer 410 , and a lower surface 403 opposite to the upper surface 402 .

[0198] The supporting film 400 may further include a burr pattern BU protruding downward from the lower surface 403 along the inner surface 401 around the gap G.

[0199] The burr pattern BU of the supporting film 400 may be formed during the manufacturing process in a process of irradiating the laser to the supporting film 400. Since a portion of the supporting film 400 may be melted by the heat energy of the laser, the burr pattern BU may be formed.

[0200] The burr pattern BU of the supporting film 400 may protrude downward from the lower surface 403 of the supporting film 400. The burr pattern BU may extend in the same direction as the gap G, for example, in the first direction x.

[0201] The bonding layer 410 may include an inner surface 411 around the gap G, an upper surface 412 facing the display panel 100 , and a lower surface 413 opposite to the upper surface 412 .

[0202] Here, the lower surface 413 of the bonding layer 410 may be in contact with the upper surface 402 of the supporting film 400 .

[0203] The tilt angle θ formed by connecting the lower surface 101 of the display panel 100 and the connecting surfaces of the inner surface 411 of the connecting layer 410 and the inner surface 401 of the supporting film 400 may be an acute angle. For example, the tilt angle θ may be in the range of about 0 degrees to about 70 degrees. However, the present disclosure is not limited thereto. For example, Fig. 9 The inclination angle θ in φ may be smaller than an angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 101 of the display panel 100 , but the present disclosure is not limited thereto.

[0204] Fig.10 The substrate covering layer 500 may include a covering layer side surface 501 contacting the respective side surfaces 401a, 411a and 103 of the supporting film 400, the bonding layer 410 and the display panel 100, a covering layer upper surface 502 contacting the lower surface of the flexible printed circuit board FPCB, and a covering layer lower surface 503 opposite to the covering layer upper surface 502.

[0205] The cover layer upper surface 502 supports the flexible printed circuit board FPCB from below the flexible printed circuit board FPCB, and the cover layer side surface 501 supports the supporting film 400 , the bonding layer 410 , and the respective side surfaces 401 a , 411 a , and 103 of the display panel 100 from the side.

[0206] like Fig.10 As illustrated in FIG. 4 , the substrate cover layer 500 may further include a cover portion 504 extending from the cover layer lower surface 503 toward the side surface 401 a of the support film 400 .

[0207] The covering portion 504 may be formed to cover, ie, seal a portion of the lower surface 403 of the supporting film 400. Therefore, moisture may be prevented from penetrating into the flexible printed circuit board FPCB and the driving chip IC electrically connected to the flexible printed circuit board FPCB, thereby preventing corrosion due to moisture.

[0208] Fig.11 In a bent state Figure 7 A schematic cross-sectional view of a display device, more specifically, a schematic cross-sectional view of a non-display area in a bent state.

[0209] Referring to the drawings, the display panel 100 of the display device 1 may be based on a bending axis BX (see FIG. 1 ) extending in the first direction x in the third area A3. Figure 1 ) is bent toward the bottom of the display panel 100.

[0210] Since the gap G overlapping the third area A3 may be defined between the panel bottom cover 300 and the supporting film 400, the display panel 100 may be more easily bent. Here, since the supporting film 400 may be coupled to the bending adhesive member 340 of the panel bottom cover 300, the bending position of the display panel 100 may be fixed by the bending adhesive member 340.

[0211] Depending on the position where the support film 400 can be attached to the bending adhesive member 340, the alignment state can be changed. For example, the display panel 100, the support film 400, and the bonding layer 410 can all be aligned in a row with the bending adhesive member 340 in the vertical direction. Fig.11 As illustrated in FIG. 4 , by moving the supporting film 400 to the right and fixing the supporting film 400 at the position, the display panel 100 , the supporting film 400 , and the bonding layer 410 may be fixed to form a step with the bending adhesive member 340 .

[0212] Since a portion of the non-display area NDA of the display panel 100 can be bent, the area of ​​the non-display area NDA of the display device 1 visible from the outside can be reduced, and the frame width of the display device 1 can be reduced. Since the neutral plane adjustment layer 600a overlapping the third area A3 can be located on the display panel 100, cracks can be prevented from being formed in the wiring of the display panel 100 in the third area A3 and the reliability of the display device 1 can be improved.

[0213] Now refer to Figures 12 to 20 A method of manufacturing the display device 1 according to the present disclosure is described.

[0214] like Figures 12 to 20 As illustrated in FIG. 1 , the manufacturing method of the display device 1 according to the present disclosure includes: preparing a display panel 100 including a light-peelable (or removable) bonding body layer 410 a and a supporting film layer 400 a (S110), forming a cutting virtual line (or cutting line) 650 on the light-peelable bonding body layer 410 a and the supporting film layer 400 a (S120), forming a polarizer 310 on the display panel 100 (S130), forming an upper protective layer 600 a on the display panel 100 (S140), installing a driving chip IC and forming a flexible printed circuit board FPCB (see, for example, FIG. 1 ) electrically connected to the driving chip IC and having an end portion connected to the distal portion of the display panel 100 in the second area A2. Figure 7 )(S150), on the flexible printed circuit board FPCB (see for example Figure 7 ) is formed on the lower surface of the substrate cover layer 500 (see, for example Figure 7)(S160), irradiating light to a portion of the photo-peelable bonding body layer 410a and the supporting film layer 400a (S170), peeling off the portions of the photo-peelable bonding body layer 410a and the supporting film layer 400a that can be irradiated with light to form a bonding layer 410 and a supporting film 400 in a non-light irradiated area (S180), and forming a panel bottom cover 300 spaced apart from the bonding layer 410 and the supporting film 400 (S190).

[0215] In preparing the display panel 100 (S110), a photo-peelable bonding body layer 410a including a photo-peelable adhesive may be formed on the entire lower surface 101 of the display panel 100, and a display panel 100 may be prepared in which a supporting film layer 400a may be attached to the entire lower surface of the photo-peelable bonding body layer 410a.

[0216] Here, the display panel 100 may be a display panel including a first area A1 including a display area DA, a second area A2 spaced apart from the first area A1, and a third area A3 between the first area A1 and the second area A2.

[0217] Reference Fig.13 and Fig.14 Preparation of the display panel 100 ( S110 ) is described.

[0218] The mother substrate 2000 may be formed, a photo-peelable bonding body layer 410a may be formed on a lower surface of the mother substrate 2000, and the photo-peelable bonding body layer 410a may be combined with the supporting film layer 400a in an original state to manufacture a mother substrate structure MS.

[0219] The mother substrate 2000 may include a plurality of display units 1000 and a dummy area other than the display units 1000. The plurality of display units 1000 may share one substrate, and the display units 1000 may be separated from the mother substrate 2000 to form the display panel 100 later. The cross-sectional stacking structure of each display unit 1000 may be the same as that of the mother substrate 2000. Figure 5 or Figure 6 The cross-sectional stacking structure of the display panel 100 illustrated in FIG. 1 is the same as that of the display panel 100. Each of the display units 1000 may include a first area A1, a second area A2, and a third area A3.

[0220] The dummy region may be disposed between the plurality of display units 1000. The dummy region may be disposed around the display units 1000 and surround each of the display units 1000. The dummy region may be a region that is finally removed during a manufacturing process.

[0221] The formation of the cutting dummy line 650 (S120) may form the cutting dummy line 650 in the supporting film layer 400a and the photo-peelable bonding body layer 410a. The cutting dummy line 650 may be formed as a boundary dummy line between the second area A2 and the third area A3 in the short side direction of the display panel 100.

[0222] Reference Figures 15 to 17 The forming of the cutting virtual line 650 (S120) is described. Fig.15 and Fig.16 For along Fig.14 Schematic cross-sectional view taken along line X2-X2'. Fig.15 The laser L1 may be irradiated to cut from the lower side of the supporting film layer 400a in the original state.

[0223] The laser light L1 may be irradiated in a first direction x which may be a short side direction of the display panel 100, so that a border virtual line between the second area A2 and the third area A3 may be formed as Fig.16 The cutting virtual line 650 is formed, and the photo-peelable bonding body layer 410a and the supporting film layer 400a can be cut together. Here, the laser L1 may be, but is not limited to, a CO laser having high energy efficiency. 2 laser.

[0224] In the cutting virtual line region 650a of the cutting virtual line 650 formed during the process of irradiating the laser L1, the burr pattern BU may be as follows. Fig.17 , as illustrated in , is formed on the cutting surface of the supporting film layer 400a in the original state. The burr pattern BU may be formed in the boundary between the third area A3 and the second area A2. The burr pattern BU may be formed as a portion of the supporting film layer 400a in the original state melted by the heat energy of the laser L1. In one embodiment, in the step of forming the cutting virtual line 650, a cutting surface may be formed in each of the photo-peelable bonding body layer 410a and the supporting film layer 400a, and the inclination angle between the cutting surface and the lower surface 101 of the display panel 100 may be about 70 degrees or less.

[0225] Thereafter, a portion corresponding to the dummy region may be removed from the mother substrate structure MS to replace the display unit 1000 with the mother substrate structure MS. Fig.14 The separated display unit 1000 may include the display panel 100, the photo-peelable bonding body layer 410a and the supporting film layer 400a.

[0226] In forming the polarizer 310 ( S130 ), the polarizer 310 may be formed on the upper surface 102 of the display panel 100 in the first area A1 .

[0227] In forming the upper protective layer 600a (S140), the upper protective layer 600a may be formed on the upper surface 102 of the display panel 100 in the third area A3. Although only the upper protective layer 600a may be formed in the drawing, an operation of forming a lower protective layer 600b on the lower surface 101 of the display panel 100 may be further included.

[0228] In forming the driving chip IC and the flexible printed circuit board FPCB (see for example Figure 7 ) (S150), the driver chip IC may be mounted on the upper surface 102 of the display panel 100 in the second area A2, and the flexible printed circuit board FPCB (see, for example Figure 7 ) may be coupled to the display panel 100.

[0229] When forming the substrate cover layer 500 (see for example Figure 7 )(S160), the substrate covering layer 500 (see for example Figure 7 ) can be formed on a flexible printed circuit board FPCB (see for example Figure 7 ) and with the side surface of the display panel 100 in the second area A2, the bonding layer 410 (see, for example Figure 7 ) and the side surface of the support film 400 (see, for example Figure 7 ) is in contact with the side surface of the substrate. Figure 7 ) may be disposed adjacently in the distal portion of the display panel 100. In one embodiment, when forming the substrate cover layer 500 (see, for example, Fig.10 ) step, a covering portion 504 may be formed (see, for example, Fig.10 ), covering portion 504 (see e.g. Fig.10 ) from the substrate cover layer 500 (see e.g. Fig.10 ) with its lower surface facing the support film 400 (see, for example Fig.10 ) with the substrate cover layer 500 (see for example Fig.10 ) extends to and covers the support film 400 (see, e.g. Fig.10 ) portion of the lower surface.

[0230] Irradiating light ( S170 ) may include placing a mask 700 on lower sides of the supporting film layer 400 a and the photo-peelable bonding body layer 410 a in which the cutting dummy line 650 may be formed, and irradiating light toward the mask 700 .

[0231] The mask 700 including the light-transmitting portion 701 corresponding to the first area A1 and the third area A3 and the light-blocking portion 702 corresponding to the second area A2 may be disposed based on the cutting virtual line 650 .

[0232] Light can be irradiated by dividing a portion of the photo-peelable combined main layer 410a and the supporting film layer 400a located in the first area A1 and the third area A3 into a light irradiation area through the light-transmitting portion 701, and dividing a portion of the photo-peelable combined main layer 410a and the supporting film layer 400a located in the second area A2 into a non-irradiation area shielded by the light-blocking portion 702.

[0233] Reference Fig.18 The irradiation light (S170) will be described.

[0234] A mask 700 through which light can selectively pass may be placed on the lower side of the supporting film layer 400 a on which the cutting virtual line 650 may be formed and light may be irradiated.

[0235] Partial areas of the photo-peelable combined main layer 410a and the supporting film layer 400a located in the first area A1 and the third area A3 may be light irradiation areas, and light may be irradiated through the light-transmitting portion 701 of the mask 700. Partial areas of the photo-peelable combined main layer 410a and the supporting film layer 400a located in the second area A2 may be non-irradiation areas shielded by the light-blocking portion 702, and light may not be irradiated. Here, the irradiation laser L1 may be irradiation of an ultraviolet laser.

[0236] Under ultraviolet light irradiation, the adhesive strength of the photo-peelable bonding body layer 410a may be weakened in the first and third areas A1 and A3 irradiated with light, and the adhesive strength of the photo-peelable bonding body layer 410a may be maintained in the second area A2 not irradiated with light.

[0237] For example, before ultraviolet light irradiation, the adhesive strength of the photo-peelable bonding body layer 410a may be about 250 gf / inch or more, but since the adhesive strength of the photo-peelable bonding body layer 410a is reduced to about 100 gf / inch (about 180 degree peeling, speed of about 40 mm / sec) or less after irradiation, the supporting film layer 400a in the light irradiation area can be easily removed. Accordingly, because the photo-peelable bonding body layer 410a and the supporting film layer 400a are not retained in the peeling area which may be the light irradiation area, they do not cause defects or leave damage to the peeling surface, thereby reducing the defect rate. Problems such as tearing during the peeling process can be suppressed. The adhesive strength may also be reduced to about 20 gf / inch or less, but the present disclosure may not be limited thereto.

[0238] Forming the bonding layer 410 and the supporting film 400 ( S180 ) includes peeling and removing a partial region of the photo-peelable bonding body layer 410 a and a partial region of the supporting film layer 400 a in the light irradiation region along the cutting virtual line 650 .

[0239] Since the light irradiated areas in the first area A1 and the third area A3 can be formed as the peeling area 800, and the non-irradiated area in the second area A2 can be formed as the bonding area 900, the bonding layer 410 and the supporting film 400 bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 can be formed on the lower surface 101 of the display panel 100 in the second area A2.

[0240] Reference Fig.19 The formation of the bonding layer 410 and the supporting film 400 (S180) is described.

[0241] A partial region of the photo-peelable bonding body layer 410 a and a partial region of the supporting film layer 400 a in the light irradiation region may be removed by peeling along the cutting virtual line 650 .

[0242] Since the light irradiation area can be formed as Fig.19 The peeling area 800 in the first area A1 and the third area A3, and the non-irradiation area may be formed as Fig. 20 The bonding area 900 in the second area A2, so the bonding layer 410 and the supporting film 400 bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 may be formed on the lower surface 101 of the display panel 100 in the second area A2.

[0243] Forming the panel bottom cover 300 (S190) may include forming the panel bottom cover 300 on the lower surface 101 of the display panel 100 at a position corresponding to the first area A1 of the peeling area 800. The panel bottom cover 300 may be formed at a position spaced apart from the bonding layer 410 and the supporting film 400 of the bonding area 900 through a third area A3 between the panel bottom cover 300 and each of the bonding layer 410 and the supporting film 400. In one embodiment, the step of forming the panel bottom cover 300 may include forming a heat dissipation member 330 located on the lower surface 101 of the display panel 100 in the first area A1 and dissipating heat of the display panel 100, forming an adhesive member 320 located between the lower surface 101 of the display panel 100 and the heat dissipation member 330 and coupling the heat dissipation member 330, and forming a bent adhesive member 340 on the lower surface 101 of the heat dissipation member 330 located in the first area A1.

[0244] Reference Fig. 20 The panel bottom cover 300 is described to be formed (S190).

[0245] The panel bottom cover 300 may be formed on the lower surface 101 of the display panel 100 at a position corresponding to the first area A1 of the peeling area 800. Fig. 20As illustrated in FIG. 1 , the panel bottom cover 300 may be formed at a position spaced apart from the bonding layer 410 and the supporting film 400 of the bonding area 900, and the third area A3 is between the panel bottom cover 300 and each of the supporting film 400 and the bonding layer 410. Through these processes, the display device 1 according to the present disclosure may be manufactured.

[0246] According to the manufacturing method of the present disclosure, a display device capable of reducing thickness and manufacturing cost can be provided.

[0247] In summarizing the detailed description, it will be appreciated by those skilled in the art that many changes and modifications may be made to the embodiments without departing substantially from the principles of the present disclosure. Therefore, the disclosed embodiments of the present disclosure may be used only in a general and descriptive sense and not for limiting purposes. Each component specifically shown in the embodiments of the present disclosure may be implemented by modification, and such modifications and differences associated with the present application should be interpreted as being included within the scope of the present disclosure as defined in the appended claims.

Claims

1. A display device, comprising: The display panel comprises a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a panel bottom cover coupled to a lower surface of the display panel in the first region; a supporting film bonded to the lower surface of the display panel in the second region; and a bonding layer, bonding the support film to the lower surface of the display panel, A gap is provided between the panel bottom cover and the supporting film in the third area.

2. The display device according to claim 1, wherein the panel bottom cover comprises: a heat dissipation member coupled to the lower surface of the display panel in the first region and configured to dissipate heat from the display panel; a first adhesive member to bond the heat dissipation member to the display panel; as well as The second adhesive member is located at the lower surface of the heat dissipation member and is used to fix the bending position of the display panel when the display panel is bent.

3. The display device according to claim 2, wherein the heat dissipation member comprises: Metal layer; as well as The plating layer is arranged on at least one of the upper surface and the lower surface of the metal layer. 4 . The display device according to claim 2 , wherein the first adhesive member bonds the heat dissipation member to the lower surface of the display panel and contains a light absorbing material for absorbing light irradiated from the outside. 5 . The display device of claim 1 , wherein the supporting film comprises a burr pattern protruding downward from a lower surface of the supporting film along an inner surface around the gap. 6 . The display device according to claim 1 , wherein an angle formed by a connection surface connecting an inner surface of the bonding layer and an inner surface of the supporting film and the lower surface of the display panel is 70 degrees or less.

7. The display device according to claim 1, wherein: The bonding layer comprises a photo-peelable adhesive, and The bonding layer has an adhesive strength of 100 gf / inch or less after irradiation.

8. The display device according to claim 1, wherein: The support film comprises at least one of polyethylene terephthalate, polycarbonate and polymethyl methacrylate, and The bonding layer comprises at least one of polyester acrylate resin, unsaturated polyester resin, polyurethane acrylate resin, epoxy acrylate resin, epoxy resin, polyether acrylate resin and polythiol acrylate resin.

9. The display device according to claim 1, further comprising: A driving chip is disposed in the second area of ​​the display panel and is located on an upper surface of the display panel.

10. The display device according to claim 9, further comprising: a flexible printed circuit board electrically connected to the driving chip in the second area; as well as The substrate cover layer is arranged on the lower surface of the flexible printed circuit board.

11. The display device according to claim 10, wherein: The flexible printed circuit board has an end portion coupled to a distal portion of the display panel in the second area, and The substrate cover layer is located on the lower surface of the flexible printed circuit board at the distal end portion of the display panel and contacts a side surface of the display panel in the second region, a side surface of the bonding layer, and a side surface of the supporting film.

12. The display device according to claim 11, wherein the substrate cover layer further comprises: A covering portion extends from a lower surface of the substrate cover layer toward the side surface of the support film in contact with the substrate cover layer and covers a portion of the lower surface of the support film.

13. The display device according to claim 1, further comprising: A protective layer is disposed on at least one of the upper surface and the lower surface of the display panel in the third region.

14. A display device, comprising: The display panel comprises a first area including a display area, a second area spaced apart from the first area, and a bendable third area located between the first area and the second area; a supporting film bonded to a lower surface of the display panel in the second region; a bonding layer bonding the support film to the lower surface of the display panel in the second region; a flexible printed circuit board having an end portion bonded to a distal portion of the display panel in the second region; as well as The substrate cover layer is arranged on the lower surface of the flexible printed circuit board.

15. The display device according to claim 14, wherein the substrate cover layer further comprises: A covering portion extends from a lower surface of the substrate cover layer toward a side surface of the support film in contact with the substrate cover layer and covers a portion of the lower surface of the support film.

16. The display device according to claim 14, further comprising: A panel bottom cover is disposed in the first region of the display panel and coupled to the lower surface of the display panel.

17. The display device according to claim 16, wherein: The panel bottom cover comprises: a heat dissipation member bonded to the lower surface of the display panel in the first region and configured to dissipate heat from the display panel, a first adhesive member disposed between the heat dissipation member and the lower surface of the display panel and bonding the heat dissipation member to the lower surface of the display panel, and a second adhesive member, located at a lower surface of the heat dissipation member and used to fix a bending position of the display panel when the display panel is bent, The third region includes a gap which is a separation space formed between the support film and the heat dissipation member, and The support film includes a burr pattern protruding downward from a lower surface of the support film along an inner surface around the gap.

18. The display device according to claim 17, further comprising: A driving chip is disposed in the second area of ​​the display panel and is located on an upper surface of the display panel.

19. The display device according to claim 18, further comprising: A protective layer is disposed on at least one of the upper surface and the lower surface of the display panel and is disposed in the third region.

20. A method for manufacturing a display device, the method comprising: A display panel provided with a supporting film layer and a light-peelable bonding body layer is prepared, wherein the display panel includes a first region including a display region, a second region spaced apart from the first region, and a bendable third region between the first region and the second region and including a gap, the supporting film layer being arranged on the entire lower surface of the display panel in the first region to the third region, and the light-peelable bonding body layer bonding the supporting film layer to the display panel; forming a cutting virtual line in the photo-peelable bonding body layer and the supporting film layer at a boundary virtual line between the second region and the third region; selectively irradiating light to the first region and the third region of the photo-peelable combining body layer and the supporting film layer in which the cutting virtual line is formed; forming the photopeelable bonding body layer as a bonding layer in the second region and the supporting film layer as a supporting film in the second region by peeling and removing the photopeelable bonding body layer and the supporting film layer in the first region and the third region irradiated with the light; as well as A panel bottom cover is formed in the first region at a position spaced apart from the bonding layer and the supporting film in the second region, and the gap is provided between the panel bottom cover and each of the bonding layer and the supporting film.

Images