Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are provided. The display device includes: a substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; a light emitting layer on the first electrode and the pixel defining layer; a second electrode on the light emitting layer; an encapsulation layer on the second electrode; an adhesive layer on the encapsulation layer; a reinforcing layer on the adhesive layer; and a functional layer on the enhancement layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0154043 filed in the Korean Intellectual Property Office on November 9, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments relate to a display device, and more particularly, to a display device capable of improving adhesion between a reinforcement layer and a functional layer and a method of manufacturing the display device. Background Art

[0004] Various electronic devices that provide multimedia, such as televisions, mobile phones, navigation systems, computer monitors, and game consoles, are being developed. The electronic devices include display panels that display images. Various portable electronic devices, such as mobile phones and tablet computers, have recently been developed. Display devices that work with the portable electronic devices are being developed. Summary of the invention

[0005] The embodiment provides a display device capable of improving adhesion between a reinforcement layer and a functional layer, and a method of manufacturing the display device.

[0006] However, the embodiments are not limited to those set forth herein.The above and other embodiments will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the detailed description of the present disclosure given below.

[0007] According to an embodiment, a display device may include: a substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; a light-emitting layer on the first electrode and the pixel defining layer; a second electrode on the light-emitting layer; an encapsulation layer on the second electrode; an adhesive layer on the encapsulation layer; a reinforcement layer on the adhesive layer; and a functional layer on the reinforcement layer.

[0008] In embodiments, the interface between the reinforcement layer and the functional layer may be substantially planar.

[0009] In an embodiment, the adhesive layer, the reinforcing layer, and the functional layer may have the same size as each other in a plan view.

[0010] In an embodiment, a side surface of the adhesive layer, a side surface of the reinforcement layer, and a side surface of the functional layer may overlap with each other.

[0011] In an embodiment, a side surface of the adhesive layer, a side surface of the reinforcing layer, and a side surface of the functional layer are aligned on the same line.

[0012] In an embodiment, a side surface of the reinforcement layer may include a carbonized region.

[0013] In an embodiment, the reinforcement layer may be formed of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

[0014] In an embodiment, the functional layer may include a polarizer.

[0015] In an embodiment, the adhesive layer may include a pressure sensitive adhesive.

[0016] In an embodiment, the display device may further include an intermediate plate connected to the pad area of ​​the substrate.

[0017] In an embodiment, the display device may further include a circuit board connected to the middle board.

[0018] In an embodiment, the display device may further include a protection layer disposed on a lower portion of the substrate.

[0019] In an embodiment, the display device may further include a display driver arranged in the pad region of the substrate.

[0020] According to an embodiment, a method for manufacturing a display device may include: forming a base module layer, the forming the base module layer includes placing a base reinforcement layer on a base functional layer and placing a base adhesive layer on the base reinforcement layer; forming a module layer including a functional layer, an reinforcement layer, and an adhesive layer by cutting the base module layer including the base functional layer, the base reinforcement layer, and the base adhesive layer along a scribing line; and placing the module layer on an encapsulation layer of a substrate. Here, the encapsulation layer of the substrate may refer to an encapsulation layer arranged on the substrate.

[0021] In an embodiment, forming the module layer may include cutting the base module layer by irradiating a laser beam to the base module layer along a scribing line.

[0022] In an embodiment, cutting the base module layer may include cutting the base adhesive layer, the base reinforcement layer, and the base functional layer by irradiating a laser beam to the base adhesive layer, the base reinforcement layer, and the base functional layer along a scribing line.

[0023] In an embodiment, placing the module layer on the encapsulation layer of the substrate may include attaching an adhesive layer of the module layer to the encapsulation layer.

[0024] In an embodiment, the reinforcement layer is formed of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

[0025] In an embodiment, the functional layer may include a polarizer.

[0026] In an embodiment, the adhesive layer may include a pressure sensitive adhesive.

[0027] In an embodiment, placing the base reinforcement layer on the base functional layer may include: continuously applying a raw material of the base reinforcement layer from one edge portion of the base functional layer to another edge portion of the base functional layer.

[0028] According to the display device and the manufacturing method of the embodiment, since the ridge shape and the slope shape of the reinforcement layer are formed in the portion discarded from the base module layer after the cutting process, the ridge shape and the slope shape are not formed in the module layer separated from the base module layer after the cutting process. Accordingly, the reinforcement layer of the module layer can have a flat surface. Therefore, the adhesive force between the functional layer and the reinforcement layer can be improved.

[0029] According to the method of manufacturing a display device of the embodiment, since a plurality of module layers can be manufactured from a base module layer, the display device can be manufactured faster than a process of independently forming an adhesive layer, a reinforcement layer, and a functional layer for each encapsulation layer.

[0030] The effects of the present disclosure are not limited to the above-described effects, and other effects not described herein will become apparent to those skilled in the art through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0032] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment;

[0033] Figure 2 It is a schematic plan view of the basic functional layer;

[0034] Figure 3 It is arranged in Figure 2 A schematic plan view of a base enhancement layer on a base functional layer;

[0035] Figure 4 It is arranged in Figure 3 A schematic plan view of a base adhesive layer on a base reinforcement layer;

[0036] Figure 5 is along Figure 4 A schematic cross-sectional view taken along line II';

[0037] Figure 6 Is used to explain about Figure 5 Schematic diagram of the cutting process of the basic module layer;

[0038] Figure 7 is from Figure 6 A schematic plan view of any one of the module layers separated from the base module layer;

[0039] Figure 8 is along Figure 7 A schematic cross-sectional view taken along line II-II';

[0040] Fig. 9 is used to describe Figure 8 A schematic cross-sectional view of a process of bonding a module layer to an encapsulation layer of a substrate;

[0041] Fig.10 It is a graphic Fig. 9 A schematic cross-sectional view of a state where a module layer and a packaging layer are bonded;

[0042] Fig.11 is along Figure 3 A schematic cross-sectional view taken along line III-III'; and

[0043] Fig.12 is along Figure 3 A schematic cross-sectional view taken along line IV-IV'. DETAILED DESCRIPTION

[0044] In the following description, for the purpose of illustration, many specific details are set forth to provide a comprehensive understanding of various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable words for non-limiting examples of the device or method disclosed herein. However, it is apparent that various embodiments can be practiced without these specific details or in the case of one or more equivalent arrangements. Here, various embodiments do not have to be exclusive, nor do they have to limit the present disclosure. For example, the specific shape, configuration and characteristics of an embodiment can be used for another embodiment or implemented in another embodiment.

[0045] Unless otherwise specified, the embodiments shown will be understood to provide features of the present invention. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments, etc. (hereinafter, individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the scope of the present invention.

[0046] The use of cross hatching and / or shadows in the accompanying drawings is generally provided to make the boundaries between adjacent elements clear. Thus, unless otherwise specified, the presence or absence of cross hatching or shadows does not express or indicate any preference or requirement for a particular material, material properties, size, ratio, commonality between the elements shown and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the accompanying drawings, the size and relative size of the elements may be exaggerated for clarity and / or for descriptive purposes. When the embodiment can be implemented differently, the specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. Moreover, similar reference numerals represent similar elements.

[0047] When an element or layer is referred to as being "on", "connected to" or "coupled to" another element or layer, the element may be directly on, directly connected to or coupled to, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly" "on", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connection" may refer to a physical connection, an electrical connection and / or a fluid connection with or without an intervening element. In addition, the axis of the first direction DR1, the axis of the second direction DR2 and the axis of the third direction DR3 are not limited to the three axes of a rectangular coordinate system (such as the X-axis, the Y-axis and the Z-axis) and may be interpreted in a broader sense. For example, the axis of the first direction DR1, the axis of the second direction DR2 and the axis of the third direction DR3 may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of A and B" may be understood to mean only A, only B, or any combination of A and B. Moreover, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0048] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, the first element discussed below can be referred to as the second element without departing from the teachings of the present disclosure.

[0049] For descriptive purposes, spatially relative terms such as "below," "below," "below," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein and thereby describe the relationship of one element to another element (or elements) as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to cover different orientations of the device when in use, in operation, and / or when manufactured. For example, if the device in the accompanying drawings is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented "above" the other elements or features. Thus, the term "below" is capable of covering both above and below orientations. In addition, the device may be oriented otherwise (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0050] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms of "a", "an" and "the" are intended to also include plural forms unless the context clearly indicates otherwise. In addition, when used in this specification, the terms "comprises", "comprising", "includes" and / or "including" illustrate the existence of stated features, integral bodies, steps, operations, elements, components and / or their groups, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or their groups. It should also be noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and are not used as terms of degree, and as such, are used to take into account the inherent deviations of measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0051] Various embodiments are described herein with reference to cross-sectional illustrations and / or exploded illustrations that are schematic illustrations of embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations resulting from, for example, manufacturing techniques and / or tolerances will be anticipated. Therefore, the embodiments disclosed herein should not necessarily be interpreted as being limited to the shapes of the specific illustrated zones, but will include deviations in shapes resulting from, for example, manufacturing. In this way, the zones shown in the accompanying drawings may actually be schematic, and the shapes of these zones may not reflect the actual shapes of the zones of the device, and as such, are not necessarily intended to be limiting.

[0052] As is customary in the art, some embodiments are described and illustrated in the accompanying drawings from the perspective of functional blocks, units and / or modules. It will be appreciated by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits (such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connectors and the like that can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques). In the case where blocks, units and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and they can be optionally driven by firmware and / or software. It is also contemplated that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and associated circuits) that perform other functions. Moreover, each block, unit and / or module of some embodiments can be physically separated into two or more interactive and discrete blocks, units and / or modules without departing from the scope of the present invention. Furthermore, the blocks, units and / or modules of some embodiments may be physically combined into more complex blocks, units and / or modules without departing from the scope of the invention.

[0053] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 is a schematic cross-sectional view of a display device according to an embodiment.

[0055] like Figure 1 As shown in , the display device according to the embodiment may include a display panel 100, a display driver 200, an intermediate board 600, a circuit board 300, and a functional layer POL.

[0056] The display panel 100 may include a substrate SUB, a light emitting element layer EMTL, an encapsulation layer ENC, an adhesive layer PSA, and a reinforcement layer CPL arranged along a third direction DR3. For example, the display panel 100 may further include a transistor layer (e.g., a thin film transistor layer) arranged between the substrate SUB and the light emitting element layer EMTL, a touch sensing unit arranged on the encapsulation layer ENC, and a color filter layer on the touch sensing unit. For example, the touch sensing unit and the color filter layer may be arranged between the encapsulation layer ENC and the adhesive layer PSA. For example, the touch sensing unit may be arranged between the encapsulation layer ENC and the color filter layer, and the color filter layer may be arranged between the touch sensing unit and the adhesive layer PSA.

[0057] The protective layer 400 may be arranged on the lower portion of the display panel 100. For example, the protective layer 400 may be arranged under the substrate SUB. For example, the protective layer 400 may be arranged on the opposite side of the functional layer POL (for example, the protective layer 400 may be arranged opposite to the functional layer POL). The display panel 100 may be arranged between the protective layer 400 and the functional layer POL. The protective layer 400 may prevent external light from entering the display panel 100. For example, the protective layer 400 may prevent an external impact from being transmitted to the lower portion of the display panel 100. The protective layer 400 may have a film form.

[0058] The substrate SUB may be disposed on the protective layer 400. The substrate SUB may be a flexible substrate that is bendable, foldable, rollable, etc. For example, the substrate SUB may include a polymer resin such as polyimide (PI). However, the embodiment is not limited thereto. As another example, the substrate SUB may include a glass material or a metal material.

[0059] The transistor layer may be arranged on the substrate SUB. The transistor layer may include a thin film transistor of a pixel circuit of a pixel. The transistor layer may further include a gate line, a data line, a power line, a gate control line, a fan-out line connecting a display driver and a data line, and a lead connecting a display driver and a pad unit. Each of the transistors may include a semiconductor region, a source electrode, a drain electrode, and a gate electrode. For example, in the case where a gate driver is formed in one side of a non-display area of ​​the display panel 100, the gate driver may include a thin film transistor.

[0060] The transistor layer may be arranged in a display region and a non-display region of the substrate SUB (e.g., in a plan view). The thin film transistor, gate line, data line, and power line of each pixel of the thin film transistor layer may be arranged in the display region (e.g., in a plan view). The gate control line and fan-out line of the transistor layer may be arranged in the non-display region (e.g., in a plan view).

[0061] The light emitting element layer EMTL may be arranged on the thin film transistor layer. The light emitting element layer EMTL may include a light emitting element ED that emits light by sequentially stacking a first electrode AND, a light emitting layer EL, and a second electrode CAT, and a pixel defining layer PDL that defines a pixel. The light emitting element ED of the light emitting element layer EMTL may be arranged in a display area of ​​the substrate SUB (e.g., in a plan view). According to an embodiment, the pixel defining layer PDL may further include a spacer SPC protruding from the top (or upper surface) of the pixel defining layer PDL in a third direction DR3. The pixel defining layer PDL and the spacer SPC may be integral with each other. The spacer SPC may support a mask (e.g., a fine metal mask) for forming the light emitting layer EL.

[0062] For example, the light-emitting layer EL may be an organic light-emitting layer EL including an organic material. The light-emitting layer EL may include a hole transport layer, an organic light-emitting layer, and an electron transport layer. When the first electrode AND receives a certain voltage (e.g., a data voltage) through the thin film transistor of the thin film transistor layer and the second electrode CAT receives a common voltage (e.g., a cathode voltage), holes and electrons may move to the organic light-emitting layer EL through the hole transport layer and the electron transport layer, respectively, and may be combined with each other in the organic light-emitting layer EL to emit light. For example, the first electrode AND may be an anode electrode, and the second electrode CAT may be a cathode electrode, but the embodiment is not limited thereto.

[0063] As another example, the light emitting element ED may include a quantum dot light emitting diode including a quantum dot light emitting layer EL, an inorganic light emitting diode including an inorganic semiconductor, or a micro light emitting diode.

[0064] The encapsulation layer ENC may cover the top surface (or upper surface) and side surfaces of the light emitting element layer EMTL and protect the light emitting element layer EMTL. The encapsulation layer ENC may include at least one inorganic layer and at least one organic layer for encapsulating the light emitting element layer EMTL.

[0065] The touch sensing unit may be arranged on the encapsulation layer ENC. The touch sensing unit may include a touch electrode for detecting a user's touch in a capacitive manner and a touch line connecting the touch electrode and the touch driver. For example, the touch sensing unit may sense the user's touch using a mutual capacitance method or a self-capacitance method.

[0066] The adhesive layer PSA may be arranged on the encapsulation layer ENC. For example, the adhesive layer PSA may be arranged on the touch sensing unit to overlap with the encapsulation layer ENC in the third direction DR3. The adhesive layer PSA may include, for example, a pressure-sensitive adhesive such as an optically transparent adhesive.

[0067] The reinforcement layer CPL may be arranged on the adhesive layer PSA. For example, the reinforcement layer CPL may be arranged between the adhesive layer PSA and the functional layer POL. The reinforcement layer CPL may contact the adhesive layer PSA and the functional layer POL. The reinforcement layer CPL may, for example, protect the display panel 100 from external impact. The reinforcement layer CPL may, for example, be formed of a material including an optically transparent resin having high strength and flexibility characteristics. In an embodiment, the reinforcement layer CPL may be formed of a material including at least one of epoxy resin and urethane.

[0068] According to an embodiment, the interface between the reinforcement layer CPL and the functional layer POL may be substantially flat. For example, the upper surface S3 of the reinforcement layer CPL may be substantially flat.

[0069] According to an embodiment, the adhesive layer PSA, the reinforcement layer CPL, and the functional layer POL may form a module layer MDL. For example, the module layer MDL may be arranged on the encapsulation layer ENC of the display panel 100, and the module layer MDL may include the adhesive layer PSA, the reinforcement layer CPL, and the functional layer POL sequentially stacked along the third direction DR3. For example, the adhesive layer PSA, the reinforcement layer CPL, and the functional layer POL of the module layer MDL may be ( Figure 5 The basic module layers BMDL including the basic adhesive layer BPSA, the basic reinforcement layer BCPL and the basic functional layer BPOL are manufactured in units of units through cutting.

[0070] In a plan view, the adhesive layer PSA, the reinforcement layer CPL, and the functional layer POL may have the same size. For example, when the functional layer POL is viewed from the reverse direction of the third direction DR3 (hereinafter, the third reverse direction), the area of ​​the adhesive layer PSA, the area of ​​the reinforcement layer CPL, and the area of ​​the functional layer POL may be the same as each other. For example, the area of ​​each corresponding layer (e.g., the adhesive layer PSA, the reinforcement layer CPL, or the functional layer POL) may be a value obtained by multiplying the size of the corresponding layer (e.g., the adhesive layer PSA, the reinforcement layer CPL, or the functional layer POL) in the first direction DR1 and the size in the second direction DR2.

[0071] One side of the adhesive layer PSA, one side of the reinforcement layer CPL, and one side of the functional layer POL may overlap each other. For example, an edge portion (or end portion) of the adhesive layer PSA, an edge portion (or end portion) of the reinforcement layer CPL, and an edge portion (or end portion) of the functional layer POL may overlap each other.

[0072] The side of the adhesive layer PSA, the side of the reinforcement layer CPL, and the side of the functional layer POL may be arranged on the same line. For example, the edge portion (or end) of the adhesive layer PSA, the edge portion (or end) of the reinforcement layer CPL, and the edge portion (or end) of the functional layer POL may be arranged along an imaginary straight line. Accordingly, the edge portion (or end) of the adhesive layer PSA, the edge portion (or end) of the reinforcement layer CPL, and the edge portion (or end) of the functional layer POL may be arranged to overlap in the third direction DR3.

[0073] At least a portion of the module layer MDL may include a carbonized region. For example, at least one side of the adhesive layer PSA, the reinforcement layer CPL, and the functional layer POL of the module layer MDL may include a carbonized region. In an embodiment, at least one of the first side S1 of the module layer MDL (e.g., at least one of the first side of the adhesive layer PSA, the first side of the reinforcement layer CPL, and the first side of the functional layer POL) and the second side S2 of the module layer MDL (e.g., at least one of the second side of the adhesive layer PSA, the second side of the reinforcement layer CPL, and the second side of the functional layer POL) may include a carbonized region. The carbonized region may be a blackened region. The first side S1 of the module layer MDL may be arranged adjacent to the display driver 200, and the second side S2 of the module layer MDL may be arranged on the opposite side of the first side S1 in the second direction DR2 (e.g., the second side S2 of the module layer MDL may be arranged as the opposite side of the first side S1 in the second direction DR2).

[0074] According to an embodiment, at least one of the other sides adjacent to the first side S1 of the module layer MDL and connected to the first side S1 in the first direction DR1 and / or the second direction DR2 may have the carbonized region described above. For example, in a plan view, the module layer MDL may have a square shape including four sides (e.g., the first side S1, the second side S2, the third side, and the fourth side), and at least one of the third side and the fourth side may have a carbonized region. For example, the third side may be arranged between a portion of the first side S1 and a portion of the second side S2, and connected to the portion of the first side S1 and the portion of the second side S2. For example, the fourth side may be arranged between another portion of the first side S1 and another portion of the second side S2, and connected to the other portion of the first side S1 and the other portion of the second side S2. The fourth side of the module layer MDL may be positioned opposite to the third side in the first direction DR1.

[0075] The display driver 200 may output a signal and a voltage for driving the display panel 100. The display driver 200 may supply a data voltage to a data line. The display driver 200 may supply a power voltage to a power line and supply a gate control signal to a gate driver. The display driver 200 may be formed by an integrated circuit (IC) and may be mounted on the display panel 100 using a chip on glass (COG) method, a chip on plastic (COP) method, or an ultrasonic welding method. For example, the display driver 200 may be arranged in a non-display area of ​​the substrate SUB (e.g., in a plan view). As an example, the display driver 200 may be arranged in a pad area 900 (or mounting area) of a non-display area (e.g., in a plan view).

[0076] The intermediate plate 600 may physically and electrically connect the substrate SUB of the display panel 100 and the circuit board 300 to each other. For example, one side of the intermediate plate 600 may be physically and electrically connected to the pad area 900 of the display panel 100, and the other side of the intermediate plate 600 may be physically and electrically connected to the circuit board 300. The intermediate plate 600 may be bent into a U shape.

[0077] The side of the intermediate plate 600 may be connected to the substrate SUB through a first conductive adhesive member. For example, the side of the intermediate plate 600 may be connected to the pad electrode 700 arranged in the pad area 900 of the substrate SUB through the first conductive adhesive member. The pad electrode 700 of the substrate SUB may also be connected to the display driver 200 described above. Accordingly, the intermediate plate 600 and the display driver 200 may be electrically connected to each other. For example, the first conductive adhesive member may be an anisotropic conductive film (ACF).

[0078] In an embodiment, the middle board 600 may be a flexible printed circuit board, a rigid printed circuit board, or a flexible film such as a chip on film.

[0079] The other side of the middle plate 600 may be connected to the circuit board 300 by a second conductive adhesive member. For example, the other side of the middle plate 600 may be connected to the circuit board 300 by a second conductive adhesive member. Accordingly, the circuit board 300, the middle plate 600, and the display driver 200 may be electrically connected to each other. For example, the second conductive adhesive member may be an anisotropic conductive film (ACF).

[0080] In an embodiment, the circuit board 300 may be a flexible printed circuit board, a rigid printed circuit board, or a flexible film such as a chip on film.

[0081] The circuit board 300 may be arranged under the protective layer 400. For example, circuit components such as a touch driver and a power supply unit may be arranged on the circuit board 300. For example, the touch driver and the power supply unit may be mounted on the circuit board 300. The circuit components of the circuit board 300 (for example, at least one of the touch driver and the power supply unit) may be electrically connected to the display driver 200 and the display panel 100 on the substrate SUB through the circuit board 300 and the intermediate board 600.

[0082] The touch driver may be electrically connected to the touch sensing unit of the display panel 100. The touch driver may supply a touch drive signal to the touch electrode of the touch sensing unit, and may sense the amount of change in capacitance between the touch electrodes. For example, the touch drive signal may be a pulse signal having a certain frequency. The touch driver may calculate whether an input is made and the input coordinates based on the amount of change in capacitance between the touch electrodes. The touch driver may be formed by an integrated circuit (IC).

[0083] The power supply unit may supply a power voltage to the display driver 200 and the display panel 100. The power supply unit may generate a driving voltage supplied to a driving voltage line, generate an initialization voltage supplied to an initialization voltage line, and generate a common voltage supplied to a second electrode CAT common to the light emitting elements ED of the pixel. For example, the driving voltage may be a high potential voltage for driving the light emitting element ED, and the common voltage may be a low potential voltage for driving the light emitting element ED.

[0084] In the following, reference Figures 2 to 10 A method of manufacturing a display device according to an embodiment will be described as follows.

[0085] Figure 2 is a schematic plan view of the base functional layer BPOL. Figure 3 It is arranged in Figure 2 Schematic plan view of a base enhancement layer BCPL on a base functional layer BPOL. Figure 4 It is arranged in Figure 3 Schematic plan view of a base bonding layer BPSA on a base reinforcement layer BCPL. Figure 5 is along Figure 4 A schematic cross-sectional view taken along line II'. Figure 6 Is used to explain about Figure 5 Schematic diagram of the cutting process of the basic module layer BMDL. Figure 7 is from Figure 6 A schematic plan view of any one of the module layers MDL separated by a base module layer BMDL. Figure 8 is along Figure 7 A schematic cross-sectional view taken along line II-II'. Fig. 9 is used to describe Figure 8 Schematic cross-sectional view of a process of a method of bonding a module layer MDL to an encapsulation layer ENC of a substrate (the encapsulation layer ENC of the substrate may refer to an encapsulation layer ENC arranged on a substrate SUB). Fig.10 It is a graphic Fig. 9 A schematic cross-sectional view of a state where the module layer MDL and the encapsulation layer ENC are bonded.

[0086] like Figure 2 As shown in , a base functional layer BPOL may be prepared. The base functional layer BPOL and the above-described functional layer POL may be made of the same material as each other.

[0087] like Figure 3As shown in , the base enhancement layer BCPL can be arranged on the base functional layer BPOL. For example, the base enhancement layer BCPL can be arranged on the entire surface of the base functional layer BPOL. In an embodiment for this, first, the raw material of the base enhancement layer BCPL (for example, a material including at least one of an optically transparent resin, an epoxy resin, and urethane) can be applied to the base functional layer BPOL, and a curing process on the raw material can be performed to form the base enhancement layer BCPL. For example, the curing process may include at least one of an ultraviolet curing process, such as irradiating ultraviolet rays to the raw material of the base enhancement layer BCPL, and a thermal curing process, such as heating the raw material. The base enhancement layer BCPL and the enhancement layer CPL described above may be made of the same material as each other.

[0088] like Figure 4 As shown in , the base adhesive layer BPSA may be disposed on the base reinforcement layer BCPL. The base adhesive layer BPSA and the above-described adhesive layer PSA may be made of the same material as each other.

[0089] like Figure 5 As shown in FIG. 1 , a basic module layer BMDL including a basic function layer BPOL, a basic enhancement layer BCPL, and a basic adhesive layer BPSA sequentially stacked along a third reverse direction based on the basic function layer BPOL may be manufactured.

[0090] Afterwards, if Figure 6 As shown in , the basic module layer BMDL may be cut along the scribing lines SCL. Accordingly, the basic function layer BPOL, the basic enhancement layer BCPL, and the basic adhesive layer BPSA of the basic module layer BMDL may be cut along the scribing lines SCL described above.

[0091] The module layer MDL can be provided from the basic module layer BMDL in units through a cutting process. Figure 6 In the example shown in , nine module levels MDL can be provided from a single basic module level BMDL. Figure 7 and Figure 8 The figure shows an example of a module layer MDL among nine module layer MDLs separated from a basic module layer BMDL. Figure 7 and Figure 8 As shown in , the module layer MDL may include a functional layer POL separated from a base functional layer BPOL, an enhancement layer CPL separated from a base enhancement layer BCPL, and an adhesive layer PSA separated from a base adhesive layer BPSA.

[0092] In an embodiment, the base module layer BMDL may be cut by a wheel or a laser beam during the cutting process. In the case of cutting the base module layer BMDL by a laser beam, at least a portion of the cut surface of the module layer MDL cut along the scribing line SCL may be carbonized. For example, at least a portion of the cut surface of the module layer MDL may each have a carbonized area (or a blackened area). For example, Figure 8 As shown in the figure, the first side S1 of the module layer MDL (for example, at least one of the first side of the functional layer POL, the first side of the reinforcement layer CPL, and the first side of the adhesive layer PSA) and the second side S2 of the module layer MDL (for example, at least one of the second side of the functional layer POL, the second side of the reinforcement layer CPL, and the second side of the adhesive layer PSA) may have a carbonized area (or a blackened area).

[0093] like Fig. 9 As shown in , the module layer MDL described above may be arranged on a substrate SUB including an encapsulation layer ENC. For example, the module layer MDL may be arranged on the encapsulation layer ENC. For example, the module layer MDL may be arranged on the encapsulation layer ENC such that the adhesive layer PSA of the module layer MDL may contact the encapsulation layer ENC. Fig.10 As shown in , the module layer MDL and the encapsulation layer ENC may be bonded to each other.

[0094] like Figure 1 As shown in , the display driver 200 may be disposed on the pad region 900 of the display panel 100 .

[0095] like Figure 1 As shown in , the protection layer 400 may be disposed on a lower surface of the display panel 100 (eg, a lower surface of the substrate SUB).

[0096] like Figure 1 As shown in , one side of the middle board 600 may be connected to the pad area 900 , and the circuit board 300 may be connected to the other side of the middle board 600 .

[0097] like Figure 1 As shown in , the middle plate 600 may be bent so that the circuit board 300 and the protection layer 400 may face each other.

[0098] When the upper surface of the reinforcement layer CPL (for example, the side of the reinforcement layer CPL facing the functional layer POL) is flattened, the adhesion between the reinforcement layer CPL and the functional layer POL can be improved. Accordingly, since the adhesion between the reinforcement layer CPL and the functional layer POL is improved, the problem of separation of the functional layer POL and the reinforcement layer CPL can be solved or prevented. For example, referring to Fig.11 and Fig.12A principle that the reinforcement layer CPL (eg, the upper surface S3 of the reinforcement layer CPL) of the display panel 100 according to the embodiment may be flattened will be described in detail as follows.

[0099] Fig.11 is along Figure 3 A schematic cross-sectional view taken along line III-III' of Fig.12 is along Figure 3 A cross-sectional view taken along line IV-IV'.

[0100] According to the method of manufacturing a display device according to an embodiment, since a cutting process (eg, Figure 6 ), so the non-flat portion of the base enhancement layer BCPL may be formed at the edge portion of the base enhancement layer BCPL. More specific details will be given as follows.

[0101] The raw material of the base reinforcement layer BCPL may be applied on the base functional layer BPOL by a slit coating method. For example, the slit coating device may discharge the raw material through a nozzle while moving from one edge portion of the base functional layer BPOL to another edge portion of the base functional layer BPOL positioned on the opposite side of the one edge portion (e.g., positioned opposite to the one edge portion), thereby continuously applying the raw material to the entire surface of the base functional layer BPOL. For example, due to the characteristics of the slit coating device, the raw material first and last discharged from the nozzle of the slit coating device may protrude from the edge portion of the base functional layer BPOL more than other portions in the third reverse direction, or may be more recessed from the edge portion of the base functional layer BPOL in the third direction DR3 than other portions, as shown in FIG. Fig.11 Area A or Fig.12 For example, since the nozzle of the slit coating device is positioned at one edge portion of the base functional layer BPOL at the initial discharge of the slit coating device, and the nozzle of the slit coating device is positioned at another edge portion of the base functional layer BPOL at the final discharge of the slit coating device, the edge portion of the base enhancement layer BCPL may have Fig.11 The ridge shape shown in area A or Fig.12 The slope shape shown in area B.

[0102] However, since the ridge shape and the slope shape described above are formed in the portion discarded from the base module layer BMDL (or the base enhancement layer BCPL) after the cutting process, the ridge shape and the slope shape may not be formed in the module layer MDL (or the enhancement layer CPL) separated from the base module layer BMDL (or the base enhancement layer BCPL). For example, the enhancement layer CPL of the module layer MDL may have a flat surface. For example, the upper surface S3 of the enhancement layer CPL of the module layer MDL may have a flat surface. Therefore, according to the display device of the embodiment, the adhesion between the functional layer POL and the enhancement layer CPL can be improved. According to the method of manufacturing a display device according to the embodiment, since the module layer MDL can be manufactured from the base module layer BMDL, the display device can be manufactured at a faster time compared to the process of independently forming the adhesive layer PSA, the enhancement layer CPL, and the functional layer POL for each encapsulation layer ENC.

[0103] In the case of performing a process of separately forming the reinforcement layer CPL for each encapsulation layer ENC, due to the characteristics of the slit coating device described above, one edge portion and another edge portion of the adhesive layer PSA may become uneven. Accordingly, in the case of such a manufacturing method, not only is the efficiency low, but also the adhesion between the reinforcement layer CPL and the functional layer POL is weakened, which may cause a problem of separation of the functional layer POL from the reinforcement layer CPL.

[0104] According to an embodiment, the base enhancement layer BCPL (or enhancement layer CPL) described above may be formed in the form of a film. For example, a base enhancement film (or enhancement film) may be used instead of the base enhancement layer BCPL (or enhancement layer CPL). Figure 4 and Figure 5 The basic module layer BMDL shown in the figure can be provided in a pre-manufactured form. For example, the basic module layer BMDL can be provided in a form in which the basic functional layer BPOL, the basic enhancement layer BCPL and the basic bonding layer BPSA are integrated. The basic module layer BMDL can be separated into the module layer MDL by the cutting process described above, and then bonded to the encapsulation layer ENC.

[0105] At the end of the detailed description, it will be appreciated by those skilled in the art that many variations and modifications may be made to the embodiments without departing substantially from the principles, spirit and scope of the present disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. A display device, comprising: substrate; a first electrode on the substrate; a pixel defining layer on the first electrode; a light emitting layer on the first electrode and the pixel defining layer; a second electrode on the light-emitting layer; an encapsulation layer on the second electrode; an adhesive layer on the encapsulation layer; a reinforcing layer on the adhesive layer; as well as A functional layer on the enhancement layer.

2. The display device according to claim 1, wherein: The interface between the reinforcement layer and the functional layer is flat.

3. The display device according to claim 1, wherein: In a plan view, the adhesive layer, the reinforcing layer, and the functional layer have the same size as one another.

4. The display device according to claim 3, wherein: A side surface of the adhesive layer, a side surface of the reinforcement layer, and a side surface of the functional layer overlap with each other.

5. The display device according to claim 4, wherein: The side surface of the adhesive layer, the side surface of the reinforcement layer, and the side surface of the functional layer are aligned on the same line.

6. The display device according to claim 1, wherein: The side surface of the reinforcement layer includes a carbonized area.

7. The display device according to claim 1, wherein: The reinforcement layer is formed of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

8. The display device according to claim 1, wherein: The functional layer includes a polarizer.

9. The display device according to claim 1, wherein: The adhesive layer includes a pressure sensitive adhesive.

10. The display device according to claim 1, further comprising: Connect to the pad area of ​​the substrate to the middle plate.

11. The display device according to claim 10, further comprising: A circuit board connected to the midplane.

12. The display device according to claim 1, further comprising: A protective layer is disposed on a lower portion of the substrate.

13. The display device according to claim 1, further comprising: A display driver is disposed in a pad region of the substrate.

14. A method for manufacturing a display device, the method comprising: Forming a basic module layer, forming the basic module layer includes: placing a base enhancement layer on the base functional layer; and placing a base adhesive layer on the base reinforcement layer; forming a module layer including a functional layer, a reinforcement layer, and an adhesive layer by cutting the basic module layer including the basic functional layer, the basic reinforcement layer, and the basic adhesive layer along a scribing line; and The module layer is placed on the encapsulation layer of the substrate.

15. The method according to claim 14, wherein: The forming of the module layer includes cutting the base module layer by irradiating a laser beam to the base module layer along the scribing line.

16. The method according to claim 15, wherein: Cutting the base module layer includes cutting the base adhesive layer, the base reinforcement layer, and the base functional layer by irradiating the laser beam to the base adhesive layer, the base reinforcement layer, and the base functional layer along the scribing line.

17. The method according to claim 14, wherein: Placing the module layer on the encapsulation layer of the substrate includes attaching the adhesive layer of the module layer to the encapsulation layer.

18. The method according to claim 14, wherein: The reinforcement layer is formed of a material including at least one of an optically transparent resin, an epoxy resin, and urethane.

19. The method according to claim 14, wherein: The functional layer includes a polarizer.

20. The method according to claim 14, wherein: The adhesive layer includes a pressure sensitive adhesive.

21. The method according to claim 14, wherein: Placing the base reinforcing layer on the base functional layer includes: continuously applying a raw material of the base reinforcing layer from one edge portion of the base functional layer to another edge portion of the base functional layer.

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