Temperature measurement method and electronic device supporting same

Abstract

A wearable device according to an embodiment disclosed in this document may include: a housing having a first surface, a second surface, and a side surface; the display is arranged on the first surface; the contact component is at least partially exposed to the second surface; a temperature sensing element, a specified parameter value of which is changed by an object in contact with the contact member; a biometric sensor; a memory and a processor. The processor may supply a constant current or a constant voltage to the temperature sensing element using the biometric sensor. The processor may use the biometric sensor to measure the parameter value of the temperature sensing element that varies by the constant current or the constant voltage. The processor may determine a temperature of an object in contact with the contact member based on the measured parameter value. Other embodiments understood by the specification are possible.

Description

Technical Field

[0001] Embodiments disclosed in this document relate to methods of measuring temperature and electronic devices supporting the methods. Background Art

[0002] Wearable devices such as smart watches or smart rings are being launched. Wearable devices can perform various health care related functions such as electrocardiogram measurement, blood pressure measurement, and body temperature measurement.

[0003] As a method of measuring body temperature by an electronic device, 1) an IR sensing method (non-contact method) for measuring radiant heat and 2) a method of measuring the temperature of a thermal equilibrium state after heat conduction are used. The wearable device can be worn to maintain a contact state on the user's skin, so contact-type temperature sensing can be used.

[0004] The contact type temperature sensing method may use a thermoelectric conversion element. For example, the thermoelectric conversion element may be a resistance temperature detector (RTD) sensor. The RTD sensor has the characteristics of low price and high temperature measurement accuracy.

[0005] PT100 is a resistance temperature detector and uses high-purity platinum (PT) with the largest temperature characteristic change. Compared with the existing thermistor method, PT100 enables accurate temperature measurement and is widely used in systems for high-performance temperature control. Summary of the invention

[0006] Technical Solution

[0007] According to an embodiment, a wearable device may include: a housing having a first surface, a second surface, and a side surface; a display, the display being disposed on the first surface; a contact component, the contact component being at least partially exposed to the second surface; a temperature sensing element, a specified parameter value of the temperature sensing element being changed by an object in contact with the contact component; a biometric sensor; a memory; and a processor. The processor may use the biometric sensor to supply a constant current or a constant voltage to the temperature sensing element. The processor may use the biometric sensor to measure the parameter value of the temperature sensing element changed by the constant current or the constant voltage. The processor may determine the temperature of the object in contact with the contact component based on the measured parameter value.

[0008] The temperature measurement method according to the embodiment can be performed by a wearable device including a temperature sensing element. The temperature measurement method may include: using a biometric sensor of the wearable device to supply a constant current or a constant voltage to the temperature sensing element; using the biometric sensor to measure a parameter value of the temperature sensing element changed by the constant current or the constant voltage; and determining the temperature of the object based on the parameter value. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] Figure 2 A block diagram of a wearable device according to an embodiment is shown.

[0011] Figure 3 is a flow chart showing a temperature measurement method according to an embodiment.

[0012] Figure 4 A wearable device in the form of a smart watch according to an embodiment is shown.

[0013] Figure 5 Using the AFE of an electrocardiogram sensor to drive a temperature sensing element is shown according to an embodiment.

[0014] Figure 6 Simulation results of driving a temperature sensing element using an AFE of an electrocardiogram sensor according to an embodiment are shown.

[0015] Figure 7 The use of a BIA sensor to drive a temperature sensing element according to an embodiment is shown.

[0016] Figure 8 The use of a PPG sensor to drive a temperature sensing element according to an embodiment is shown.

[0017] Fig. 9 is an example diagram of temperature measurement and notification display according to an embodiment.

[0018] Fig.10 A wearable device in the form of a smart ring according to an embodiment is shown.

[0019] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar constituent elements. DETAILED DESCRIPTION

[0020] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to specific embodiments, and should be interpreted as including various modifications, equivalents and / or alternatives of the embodiments of the present disclosure. With respect to the description of the accompanying drawings, similar reference numerals may be used to refer to similar elements.

[0021] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0022] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0023] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence model is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0024] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0025] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0026] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0027] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0028] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0029] The audio module 170 can convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled.

[0030] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0031] The interface 177 may support one or more specific protocols that will be used to couple the electronic device 101 to an external electronic device (e.g., electronic device 102) (e.g., wired) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0032] The connection end 178 may include a connector, wherein the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module 179 may convert the electric signal into mechanical stimulation (eg, vibration or movement) or electric stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

[0034] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0035] The power management module 188 may manage power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0038] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0039] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, the radiating element being formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

[0040] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0041] At least some of the above components can be coupled to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0042] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0043] Figure 2 A block diagram of a wearable device according to an embodiment is shown.

[0044] refer to Figure 2 , the wearable device 201 (e.g., Figure 1 The electronic device 101 may include a processor 210 (eg, Figure 1 processor 120), memory 220 (e.g., Figure 1 Memory 130), display 230 (e.g., Figure 1 display module 160), biometric sensor 240 (e.g., Figure 1sensor module 176), temperature sensing element (or temperature sensor) 250 and contact component 255.

[0045] The processor 210 may perform various operations related to driving of the wearable device 201. According to an embodiment, the processor 210 may use the temperature sensing element 250 to measure the temperature of the object in contact with the contact part 255. The processor 210 may power the temperature sensing element 250 through the analog front end (AFE) of the biometric sensor 240 and measure a changed parameter of the temperature sensing element 250. The processor 210 may determine the temperature based on the measured value of the parameter.

[0046] The memory 220 may store various data related to the driving of the wearable device 201. According to an embodiment, the memory 220 may store a matching table that associates and stores the characteristics of the temperature sensing element 250 with the temperature. The processor 210 may determine the temperature of the object in contact with the contact part 255 by referring to the changed parameter value of the temperature sensing element 250 and the matching table.

[0047] The display 230 may display content such as an image or text. For example, the display 230 may display the temperature of an object measured by the temperature sensing element 250, or may display a notification related to temperature measurement. According to an embodiment, when the wearable device 201 is a smart ring, the display 230 may be omitted or simplified.

[0048] The biometric sensor 240 may acquire biometric information of the user. The biometric sensor 240 may be one of an electrocardiogram (ECG) sensor, a bioelectrical impedance analysis (BIA) sensor, or a photoplethysmography (PPG) sensor. According to an embodiment, the biometric sensor 240 may include a power supply unit 241 and a measuring unit 242. The power supply unit 241 and the measuring unit 242 may constitute an analog front end (AFE) of the biometric sensor 240.

[0049] According to an embodiment, the power supply unit 241 may supply power for driving the biometric sensor 240. In addition, the power supply unit 241 may supply power for driving the temperature sensing element 250. For example, the power supply unit 241 may supply a constant current or a constant voltage.

[0050] According to an embodiment, the measuring unit (or measuring circuit unit) 242 may measure data according to the driving of the biometric sensor 240. In addition, the measuring unit 242 may be used to measure a change in a parameter related to the temperature measurement of the temperature sensing element 250. For example, the measuring unit 242 may be an instrumentation amplifier (IA) or a transimpedance amplifier (TIA).

[0051] The temperature sensing element (or thermoelectric conversion element) 250 may be used to sense the temperature of an object in contact with the contact member 255. The temperature sensing element 250 may receive power from the power supply unit 241 of the biometric sensor 240. For example, the temperature sensing element 250 may receive a current of a specified value from a current source inside the biometric sensor 240. When the resistance value of the temperature sensing element 250 changes due to the current flowing through the temperature sensing element 250, the resistance value of the temperature sensing element 250 may be measured by the measurement unit 242 of the biometric sensor 240.

[0052] According to an embodiment, the temperature sensing element 250 may be a PT100. The resistance value of the PT100 may increase in proportion to the temperature. The PT100 may have a temperature-resistance table pre-stored in the memory 220, and may not include a separate calibration operation. The processor 210 may use the temperature-resistance table to determine the temperature that matches the measured resistance value.

[0053] When the user wears the wearable device 201, the contact part 255 can contact the user's skin. For example, in the case of a smart watch, the contact part 255 can be a part of the back cover. For another example, in the case of a smart ring, the contact part 255 can be a part of the inner surface of the shell.

[0054] The contact member 255 may be implemented by a material having a thermal conductivity suitable for measuring the skin temperature. For example, the contact member 255 may be made of glass.

[0055] Figure 3 is a flow chart showing a temperature measurement method according to an embodiment.

[0056] refer to Figure 2 and Figure 3 In operation 261, the processor 210 may detect whether the user is wearing the wearable device 201. For example, the processor 210 may sense whether the user is wearing the wearable device 201 using a sensor module such as a proximity sensor and a contact sensor.

[0057] In operation 263, the processor 210 may supply power to the temperature sensing element 250 through the power supply unit 241 of the biometric sensor 240. For example, the processor 210 may cause a current of a specified value to flow from a current source inside the biometric sensor 240 to the temperature sensing element 250.

[0058] In operation 265 , the processor 210 may measure a parameter value (eg, a resistance value) that changes according to the temperature of the temperature sensing element 250 through the measuring unit 242 inside the biometric sensor 240 .

[0059] In operation 267, the processor 210 may determine the temperature of the object based on the parameter value (e.g., resistance value). For example, a temperature-resistance table of the temperature sensing element 1050 may be pre-stored in the memory 220. The processor 210 may use the temperature-resistance table to determine the temperature that matches the measured resistance value.

[0060] In operation 269, the processor 210 may display the measured temperature on the display 230. The processor 210 may display a notification to the user in a state before the temperature measurement is completed, and may display the measured temperature when the temperature measurement is completed (see Fig. 9 ).

[0061] Figure 4 A wearable device in the form of a smart watch according to an embodiment is shown. In the following, the discussion will focus on the case where the wearable device is a smart watch, but is not limited thereto.

[0062] refer to Figure 4 , the wearable device 301 (e.g., Figure 1 The electronic device 101 or Figure 2 The wearable device 201 may be a smart watch. The wearable device 301 may include a housing 305, a display 310, a back cover 308, and a fastening component 380.

[0063] The housing 305 may form the appearance of the wearable device 301. The housing 305 may include a first surface (front surface) on which the display 310 is provided, a second surface (rear surface) coupled to the rear cover 308, and a side surface between the first surface and the second surface.

[0064] The display 310 may be exposed through the first surface of the housing 305. The display 310 may display an image or text, and may receive a user input through a touch sensing circuit.

[0065] The back cover (or back surface plate) 308 may form at least a portion of the second surface of the housing 305. The back cover 308 may be implemented using, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS)).

[0066] According to an embodiment, the back cover 308 may include a contact member (or sensor window) 308a (eg, Figure 2 The contact part 308a may be a part that contacts the wrist when the user wears the wearable device 301. The contact part 308a may be disposed at the center of the back cover 308.

[0067] According to an embodiment, the temperature sensing element 350 (eg, Figure 2The temperature sensing element 250 may be mounted on the inner surface of the rear cover 308. For example, the temperature sensing element 350 may be a PT100. When power is supplied to the PT100, the resistance value may vary depending on the temperature.

[0068] According to an embodiment, the temperature sensing element 350 may receive power through a separate biometric sensor inside the wearable device 301. In addition, a parameter value (e.g., a resistance value) that changes according to the temperature of the temperature sensing element 350 may be measured by a measurement circuit inside the biometric sensor. For example, the first terminal 351 and the second terminal 352 of the temperature sensing element 350 may be connected to the biometric sensor inside the wearable device 301. Figures 5 to 10 Additional information is provided regarding the connection between the temperature sensing element 350 and the biometric sensor.

[0069] The fastening member 380 may be coupled to the housing 305 to secure the wearable device 301 to a part of the user's body (eg, a wrist). The fastening member 380 may be implemented with materials such as woven fabric, leather, rubber, urethane, or metal.

[0070] Figure 5 Using the AFE of an electrocardiogram sensor to drive a temperature sensing element is shown according to an embodiment.

[0071] refer to Figure 4 and Figure 5 , the temperature sensing element 350 may be driven using an analog front end (AFE) of the electrocardiogram (ECG) sensor 320 , and a temperature-related parameter value (eg, resistance value) may be measured in the temperature sensing element 350 .

[0072] The electrocardiogram sensor 320 may include first to third electrodes 321 a to 321 c , an internal current source 322 , and a measurement circuit (eg, an instrumentation amplifier (IA) or a differential amplifier) ​​325 .

[0073] The first electrode 321a may be a terminal that contacts a hand different from the hand that wears the wearable device 301. For example, the first electrode 321a may be provided toward a side surface or a front surface (a surface facing the display) of the housing 305.

[0074] The second electrode 321b and the third electrode 321c may be terminals that respectively contact the user's skin when the user wears the wearable device 201. The first end 351 of the temperature sensing element 350 may be connected to the second electrode 321b, and the second end 352 of the temperature sensing element 350 may be connected to the third electrode 321c.

[0075] The internal current source 322 may be installed to detect the on / off of a lead of the electrocardiogram sensor 320. In addition, the internal current source 322 may flow a current of a specified value to the temperature sensing element 350.

[0076] The measurement circuit 325 can measure the voltage across the two ends of the temperature sensing element 350 and output the resistance value of the temperature sensing element 350. For example, the measurement circuit 325 can be an instrumentation amplifier (IA). The first input terminal 325a of the measurement circuit 325 can be connected to the first end 351 of the temperature sensing element 350, and the second input terminal 325b of the measurement circuit 325 can be connected to the second end 352 of the temperature sensing element 350. The output terminal 325c of the measurement circuit 325 can output the resistance value of the temperature sensing element 350.

[0077] When the measurement circuit 325 measures the resistance value of the temperature sensing element 350 , the switches 326 and 327 inside the electrocardiogram sensor 320 may allow the measurement circuit 325 to operate separately from surrounding elements inside the electrocardiogram sensor 320 .

[0078] Figure 6 Simulation results of using the AFE of an electrocardiogram sensor to drive a temperature sensing element according to an embodiment are shown. Figure 6 These are examples and are not limiting.

[0079] refer to Figures 4 to 6 , a current of a specified value may flow to the temperature sensing element 350 through the internal current source 322 of the electrocardiogram sensor 320. The measurement circuit 325 of the electrocardiogram sensor 320 may measure the voltage across the temperature sensing element 350 to measure the resistance value of the temperature sensing element 350.

[0080] The first graph 601 shows the output value of the measurement circuit 325 according to the set value of the internal current source 322 of the electrocardiogram sensor 320 and the resistance, and an actual resistor is installed instead of the temperature sensing element 350. In a fixed current source, the resistance and the output value can have a linear relationship proportional to each other. Thus, it can be confirmed that when the temperature sensing element 350 is installed and the AFE of the electrocardiogram sensor 320 is powered and the resistance value is measured, normal temperature measurement can be performed.

[0081] The second graph 602 and the third graph 603 are graphs when the current value provided from the current source changes. Although there are some saturated sections, they can generally have linear characteristics, so normal temperature measurement can be performed. The temperature sensing element 350 can operate in a non-saturated section and can be used for temperature measurement.

[0082] Figure 7The use of a BIA sensor to drive a temperature sensing element according to an embodiment is shown.

[0083] refer to Figure 4 and Figure 7 , the temperature sensing element 350 may be driven using an analog front end (AFE) of a bioelectrical impedance analysis (BIA) sensor 330 , and a temperature-related parameter value (eg, resistance value) may be measured.

[0084] The AFE of the bioelectrical impedance analysis (BIA) sensor 330 may include an internal current source 332 and a measurement circuit (eg, an instrumentation amplifier (IA)) 335 .

[0085] Each of the first end 351 of the temperature sensing element 350 and the second end 352 of the temperature sensing element 350 may be connected to the internal current source 332. The internal current source 332 may allow a current of a designated value to flow to the temperature sensing element 350.

[0086] The third terminal 353 and the fourth terminal 354 of the temperature sensing element 350 may be connected to the measurement circuit 335. The third terminal 353 may be a point between the first terminal 351 and the temperature sensing element 350. The fourth terminal 354 may be a point between the second terminal 352 and the temperature sensing element 350.

[0087] The measurement circuit 335 can measure the voltage across the temperature sensing element 350 and output the resistance value of the temperature sensing element 350. For example, the measurement circuit 335 can be an instrumentation amplifier (IA). The first input terminal 335a of the measurement circuit 335 can be connected to the third terminal 353 of the temperature sensing element 350, and the second input terminal 335b of the measurement circuit 335 can be connected to the fourth terminal 354 of the temperature sensing element 350. The output terminal 335c of the measurement circuit 335 can output the resistance value of the temperature sensing element 350.

[0088] and Figure 5 In contrast, when the AFE of the BIA sensor 330 is used, the measurement resulting from the resistance component of the conductive wire may be reduced, thereby achieving relatively accurate temperature measurement.

[0089] According to an embodiment, the bioelectrical impedance analysis (BIA) sensor 330 may include a plurality of switches. The plurality of switches may separate the temperature sensing element 350 from the BIA 330 when the BIA 330 measures bioimpedance.

[0090] Figure 8 The use of a PPG gyroscope to drive a temperature sensing element is shown according to an embodiment.

[0091] refer to Figure 4 and Figure 8, the temperature sensing element 350 may be driven using an analog front end (AFE) of a photoplethysmography (PPG) sensor 340 , and a temperature-related parameter value (eg, resistance value) may be measured.

[0092] The AFE of the photoplethysmography (PPG) sensor 340 may include a measurement circuit (eg, a transimpedance amplifier (TIA)) 345 .

[0093] A first terminal 351 of the temperature sensing element 350 may be connected to a constant voltage VDD. According to an embodiment, the constant voltage VDD may be provided from the AFE of the PPG sensor 340. A second terminal 352 of the temperature sensing element 350 may be connected to an input terminal of the measurement circuit 345.

[0094] The measurement circuit 345 can measure the current flowing through the temperature sensing element 350. For example, the measurement circuit 345 can be a transimpedance amplifier (TIA). The processor 210 can calculate the resistance value of the temperature sensing element 350 by operating the temperature sensing element 350 in a current measurement mode that keeps the output voltage of the measurement circuit 345 constant.

[0095] According to an embodiment, the PPG sensor 340 may include a plurality of switches. When the PPG sensor 340 measures blood flow, the plurality of switches may separate the temperature sensing element 350 from the PPG sensor 340.

[0096] Fig. 9 is an example diagram of temperature measurement and notification display according to an embodiment. Fig. 9 It is exemplary and not limited thereto.

[0097] refer to Figure 2 , Figure 4 and Fig. 9 , the contact part 355 connected to the temperature sensing element 350 can be implemented using various materials. For example, when it is implemented using a first material having a large thermal conductivity (e.g., Cu element), the time required to reach the safe state temperature Ts will be relatively fast (first curve graph 910). On the other hand, when it is implemented using a second material having a lower thermal conductivity than the first material (e.g., glass), the time required to reach the safe state temperature Ts will be relatively long (second curve graph 920).

[0098] The processor 120 may output various notifications until the user wears the wearable device 201 and becomes in a state where temperature measurement can be performed.

[0099] For example, in the initial state 901 of the second graph 920, the processor 210 may display the first notification 901a. The first notification 901a may be a notification that causes the user to wait until a point where the wearable device is stable after wearing the wearable device.

[0100] In the temperature rising state 902 of the second graph 920, the processor 210 may display a second notification 902a. The second notification 902a may be a notification for the user to wait until the temperature is measured. For example, when the distribution of the resistance value of the temperature measuring device 350 is greater than or equal to the reference value, the processor 210 may determine it as the temperature rising state 902.

[0101] In the stable state 903 of the second graph 920, the processor 210 may display a third notification 903a. The third notification 903a may be a notification indicating the measured temperature to the user. The third notification 903a may be a notification showing the measured temperature to the user. The stable state 903 may be a state in which the distribution of the resistance value of the temperature measuring device 350 is less than (or less than or equal to) the reference value.

[0102] When the temperature measurement is inaccurate in the initial state 901 or the temperature rising state 902, the processor 210 may calculate the temperature value in the stable state 903 where the distribution of the resistance values ​​is less than (or less than or equal to) the reference value. In the stable state 903, the processor 120 may determine the temperature value based on the average value of the resistance values ​​for several seconds or tens of seconds.

[0103] According to an embodiment, the processor 120 may calculate the temperature by reflecting the characteristics of the temperature rising curve in the temperature rising state 902 before the stable state 903. For example, in the temperature rising state 902, the processor 120 may estimate the temperature of the stable state 903 by using the temperatures measured at two different time points (e.g., several seconds) and a fitting curve of the pre-calculated temperature rising curve, and display the temperature.

[0104] Fig.10 A wearable device in the form of a smart ring according to an embodiment is shown.

[0105] refer to Fig.10 , the wearable device 1001 (e.g., Figure 1 The electronic device 101 or Figure 2 The wearable device 201) may be a smart ring. The wearable device 1001 may include various components such as a processor, a battery, and a wireless communication module located inside the housing 1005. In addition, the wearable device 1001 may include a biometric sensor 1030 and a temperature sensor 1050 located inside the housing 1005. The biometric sensor 1030 and the temperature sensor 1050 may be disposed adjacent to each other. The biometric sensor 1030 and the temperature sensor 1050 may include terminals or contact parts exposed to the inner surface of the housing 1005 to contact the user's body. According to an embodiment, when the wearable device 1001 is worn, the contact parts may be set to correspond to between the fingers.

[0106] The temperature sensing element 1050 may receive power through the biometric sensor 1030. In addition, a parameter value (eg, resistance value) that changes according to the temperature of the temperature sensing element 1050 may be measured by a measurement circuit inside the biometric sensor 1030.

[0107] A wearable device according to an embodiment may include: a housing including a first surface, a second surface, and a side surface; a display disposed on the first surface; a contact component at least partially exposed to the second surface; a temperature sensing element, a specified parameter value of which is changed by an object in contact with the contact component; a biometric sensor; a memory; and a processor. The processor may use the biometric sensor to provide a constant current or a constant voltage to the temperature sensing element. The processor may use the biometric sensor to measure the parameter value of the temperature sensing element changed by the constant current or the constant voltage. The processor may determine the temperature of the object in contact with the contact component based on the parameter value.

[0108] According to an embodiment, the biometric sensor may be an electrocardiogram (ECG) sensor or a bioelectrical impedance analysis (BIA) sensor.

[0109] According to an embodiment, the biometric sensor may include a power supply unit and a measuring unit. The power supply unit may supply a constant current to the temperature sensing element. The measuring unit may measure a resistance value of the temperature sensing element. The processor may determine the resistance value as a parameter value.

[0110] According to an embodiment, the first end and the second end of the temperature sensing element may be connected to the power supply unit.

[0111] According to an embodiment, a third end and a fourth end of the temperature sensing element may be connected to the measuring unit. The third end may be between the temperature sensing element and the first end, and the fourth end may be between the temperature sensing element and the second end.

[0112] According to an embodiment, the measuring unit may be implemented using an instrumentation amplifier (IA) or a differential amplifier.

[0113] According to an embodiment, the biometric sensor may be a photoplethysmography (PPG) sensor.

[0114] According to an embodiment, the biometric sensor may include a power supply unit and a measuring unit. The power supply unit may supply a constant voltage to the temperature sensing element. The measuring unit may measure a resistance value of the temperature sensing element. The processor may determine the resistance value as a parameter value.

[0115] According to an embodiment, a first end of the temperature sensing element may be connected to the power supply unit, and a second end of the temperature sensing element may be connected to the measurement unit.

[0116] According to an embodiment, the measuring unit may be implemented using a transimpedance amplifier (TIA).

[0117] According to an embodiment, the wearable device may further include a sensor module. The processor may be configured to detect whether the user is wearing the wearable device through the sensor module, and drive the temperature sensing element when the user wears the wearable device.

[0118] According to an embodiment, the temperature sensing element may be a thermoelectric conversion element.

[0119] According to an embodiment, the memory may store a matching table of parameter values ​​and temperature values, and the processor may determine the temperature by referring to the matching table.

[0120] According to an embodiment, when the distribution of the parameter values ​​is less than or equal to the specified reference value, the processor may determine the temperature by averaging the parameter values ​​acquired multiple times within a specified time.

[0121] According to an embodiment, the wearable device may further include a display. When the distribution of the parameter value is less than or equal to the specified reference value, the processor may display a specified notification through the display.

[0122] According to an embodiment, the contact member may be implemented with a material having a specified thermal conductivity or higher.

[0123] According to an embodiment, the contact member may be made of glass.

[0124] The temperature measurement method according to the embodiment can be performed by a wearable device including a temperature sensing element. The temperature measurement method may include an operation of providing a constant current or a constant voltage to the temperature sensing element using a biometric sensor of the wearable device; an operation of measuring a parameter value of the temperature sensing element that is changed by the constant current or the constant voltage using the biometric sensor; and an operation of determining the temperature of the object based on the parameter value.

[0125] According to an embodiment, the biometric sensor may be one of an electrocardiogram (ECG) sensor, a bioelectrical impedance analysis (BIA) sensor, or a photoplethysmography (PPG) sensor.

[0126] According to an embodiment, the operation of determining the temperature of the object may include an operation of determining the temperature by referring to a matching table pre-stored in a memory of the wearable device.

[0127] A temperature measurement circuit using a thermoelectric conversion element (e.g., PT 100) may be configured with an impedance measurement circuit configured to apply current and measure voltage. In order to implement a temperature sensor using a thermoelectric conversion element, it may be necessary to include a circuit for supplying power and a circuit or component for measuring resistance. Since wearable devices lack internal mounting space, it is necessary to reduce the space for implementing a temperature sensor.

[0128] The wearable device according to the embodiments disclosed in this document can use the analog front end (AFE) of the biometric sensor to operate the temperature sensing element. In addition, the electronic device can use the analog front end (AFE) of the biometric sensor to measure the temperature-related parameter value of the temperature sensing element. Thus, a wider internal installation space of the wearable device can be ensured.

[0129] A wearable device according to the embodiments disclosed in this document may not perform a separate calibration process using a temperature sensing element having a clear relationship between a resistance value and a temperature value.

[0130] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0131] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0132] The various embodiments described herein may be implemented as software (e.g., program #40) including one or more instructions stored in a storage medium (e.g., internal memory #36 or external memory #38) that can be read by a machine (e.g., electronic device #01). For example, under the control of a processor, a processor (e.g., processor #20) of the machine (e.g., electronic device #01) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0133] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0134] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. A wearable device, comprising: a housing having a first surface, a second surface and a side surface; a display, the display being disposed on the first surface; a contact member, the contact member being at least partially exposed to the second surface; a temperature sensing element in which a parameter value specified by an object contacted by the contact member changes; Biometric sensors; Memory; as well as a processor, the processor controlling the temperature sensing element, Wherein, the processor: Using the biometric sensor to supply a constant current or a constant voltage to the temperature sensing element, using the biometric sensor to measure the parameter value of the temperature sensing element changed by the constant current or the constant voltage, and A temperature of an object in contact with the contact member is determined based on the measured parameter value.

2. The wearable device according to claim 1, wherein: The biometric sensor is an electrocardiogram (ECG) sensor or a bioelectrical impedance analysis (BIA) sensor.

3. The wearable device according to claim 2, wherein: The biometric sensor includes a power supply unit and a measurement unit, The power supply unit supplies the constant current to the temperature sensing element, The measuring unit measures the resistance value of the temperature sensing element, and The processor determines the resistance value as the parameter value.

4. The wearable device according to claim 3, wherein: A first end and a second end of the temperature sensing element are connected to the power supply unit.

5. The wearable device according to claim 4, wherein: The third terminal and the fourth terminal of the temperature sensing element are connected to the measuring unit, The third end is located between the temperature sensing element and the first end, and The fourth end is located between the temperature sensing element and the second end.

6. The wearable device according to claim 3, wherein: The measuring unit is implemented using an instrumentation amplifier (IA) or a differential amplifier.

7. The wearable device according to claim 1, wherein: The biometric sensor is a photoplethysmography (PPG) sensor.

8. The wearable device according to claim 7, wherein: The biometric sensor includes a power supply unit and a measurement unit, The power supply unit supplies the constant voltage to the temperature sensing element, The measuring unit measures the resistance value of the temperature sensing element, and The processor determines the resistance value as the parameter value.

9. The wearable device according to claim 3, wherein: A first end of the temperature sensing element is connected to the power supply unit, and A second end of the temperature sensing element is connected to the measuring unit.

10. The wearable device according to claim 8, wherein: The measuring unit is implemented using a transimpedance amplifier (TIA).

11. The wearable device according to claim 1, further comprising: Sensor module, Wherein, the processor: sensing, by means of the sensor module, whether the user is wearing the wearable device, and When the user wears the wearable device, the temperature sensing element is driven.

12. The wearable device according to claim 1, wherein: The temperature sensing element is a thermoelectric conversion element.

13. The wearable device according to claim 1, wherein: The memory stores a matching table of the parameter value and the temperature value, and The processor determines the temperature by referring to the matching table.

14. The wearable device according to claim 1, wherein: When the distribution of the parameter values ​​is less than or equal to a specified reference value, the processor determines the temperature by averaging the parameter values ​​acquired multiple times within a specified time.

15. A method of measuring temperature performed by a wearable device comprising a temperature sensing element, the method comprising: an operation of supplying a constant current or a constant voltage to the temperature sensing element using a biometric sensor of the wearable device; An operation of using the biometric sensor to measure a parameter value of the temperature sensing element changed by the constant current or the constant voltage; as well as The operation of determining the temperature of the object based on the measured parameter value.

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