Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus is provided with: a processing container in which a loading / unloading port for a substrate is provided, the processing container accommodating the substrate; a cover body for opening and closing the carrying-in and carrying-out opening; a shutter opening / closing part that moves the cover body; a substrate transfer unit that passes the substrate through the loading / unloading port while holding the substrate; a first on-off valve that opens and closes a first flow path that supplies a purge gas to the processing container; and a control unit. The control unit determines whether or not the substrate is carried in following the carrying-out of the substrate, and when the substrate is carried in following the carrying-out of the substrate, the control unit controls the substrate to be carried out after the carrying-out of the substrate. The substrate is loaded without switching the loading / unloading port from the open state to the closed state and without switching the first flow path from the closed state to the open state.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing device and a substrate processing method. Background Art

[0002] The substrate processing device described in Patent Document 1 dries the substrate by replacing the drying liquid contained on the substrate with a supercritical fluid. The substrate processing device comprises: a processing container that accommodates the substrate; and a supply line that supplies the supercritical fluid and the purge gas to the processing container. The processing container is provided with a substrate loading and unloading port. The loading and unloading port is opened and closed by a cover. The supply line is provided with an on-off valve that opens and closes the flow path of the supercritical fluid or the purge gas.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-81966 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] One embodiment of the present disclosure provides a technology for reducing the number of opening and closing operations of a substrate processing apparatus to increase the life of mechanical parts of the substrate processing apparatus.

[0008] Solutions for solving problems

[0009] A substrate processing apparatus according to one embodiment of the present disclosure includes: a processing container, in which a substrate loading / unloading port is provided, and the processing container accommodates the substrate; a cover body, which opens and closes the loading / unloading port; a gate opening and closing unit, which moves the cover body; a substrate conveying unit, which allows the substrate to pass through the loading / unloading port while holding the substrate; a first opening and closing valve, which opens and closes a first flow path for supplying a purge gas to the processing container; and a control unit. The control unit determines whether to carry in the substrate after carrying out the substrate, and if the substrate is carried in after carrying out the substrate, after carrying out the substrate, the substrate is carried in without switching the loading / unloading port from an open state to a closed state and without switching the first flow path from a closed state to an open state.

[0010] Effects of the Invention

[0011] According to one aspect of the present disclosure, the number of opening and closing operations of a substrate processing apparatus can be reduced, thereby increasing the life of mechanical parts of the substrate processing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1It is a perspective view showing a processing container of a substrate processing apparatus according to one embodiment.

[0013] Figure 2 This is a cross-sectional view showing an example of an open state of the loading / unloading port.

[0014] Figure 3 This is a cross-sectional view showing an example of a closed state of the loading / unloading port.

[0015] Figure 4 It is a diagram showing an example of a supply unit and a discharge unit.

[0016] Figure 5 This is a diagram showing an example of components of a control unit using functional blocks.

[0017] Figure 6 1 is a flowchart showing a substrate processing method according to one embodiment.

[0018] Figure 7 1 is a diagram showing an example of the state of the substrate processing apparatus immediately before step S101 , in step S104 , and in step S107 .

[0019] Figure 8 This is a diagram showing an example of the state of the substrate processing apparatus in steps S101 to S102 and S105.

[0020] Fig. 9 This is a diagram showing an example of the state of the substrate processing apparatus during the pressure increase in step S103.

[0021] Fig.10 This is a diagram showing an example of the state of the substrate processing apparatus during the flow in step S103.

[0022] Fig.11 This is a diagram showing an example of the state of the substrate processing apparatus during the pressure release in step S103.

[0023] Fig.12 (A) is a cross-sectional view showing an example of an open position of the valve body, Fig.12 (B) is a cross-sectional view showing an example of a closed position of the valve body. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in each of the drawings, the same or corresponding structures are marked with the same reference numerals, and the description is sometimes omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

[0025] Reference Figure 1 to Figure 3A substrate processing device 1 according to an embodiment is described below. The substrate processing device 1 dries the substrate W by replacing the drying liquid L contained on the substrate W with a supercritical fluid. The substrate W includes a semiconductor substrate such as a silicon wafer or a glass substrate. A supercritical fluid is a fluid that is placed at a temperature above the critical temperature and a pressure above the critical pressure, and is a fluid in a state where gas and liquid are not separated. If the drying liquid L is replaced with a supercritical fluid, the interface between the liquid and the gas can be suppressed from appearing in the concave-convex pattern of the substrate W. As a result, the occurrence of surface tension can be suppressed, and the collapse of the concave-convex pattern can be suppressed. The drying liquid L is, for example, an organic solvent such as IPA (Isopropyl Alcohol), and the supercritical fluid is, for example, CO 2 Furthermore, the present disclosure can also be applied to processes other than supercritical drying.

[0026] like Figure 2-Figure 3 As shown, the substrate processing apparatus 1 includes a processing container 20, a tray 22, a cover 24, and a gate opening and closing portion 26. The processing container 20 is a pressure-resistant container that can withstand a supercritical pressure or higher. The processing container 20 has a loading and unloading port 21 on its side. The substrate W is loaded into the processing container 20 through the loading and unloading port 21 in a state of containing a drying liquid L. After the substrate W is dried inside the processing container 20, it is unloaded to the outside of the processing container 20 through the loading and unloading port 21.

[0027] The tray 22 holds the substrate W containing the drying liquid in a horizontal position from below. The tray 22, for example, has a horizontal plate 221 and a plurality of pins 222 provided on the upper surface of the plate 221, and the substrate W is held in a horizontal position by the plurality of pins 222. The tray 22 holds the substrate W while allowing the substrate W to pass through the loading and unloading port 21. The tray 22 is an example of a substrate transport unit. In addition, the tray 22 may also be fixed inside the processing container 20, and the substrate transport unit may also be provided separately from the tray 22. The substrate transport unit may also have a transport arm that holds the substrate W and a drive unit that drives the transport arm.

[0028] The cover 24 opens and closes the loading / unloading port 21 of the processing container 20. A sealing member 25 is provided on the surface of the cover 24 facing the loading / unloading port 21 to prevent leakage of the fluid. The cover 24 is integrated with the tray 22, and the tray 22 is moved together with the cover 24. In addition, as described above, the tray 22 may be fixed inside the processing container 20, or only the cover 24 may be moved.

[0029] The gate opening and closing unit 26 opens and closes the loading and unloading port 21 by moving the cover 24. The gate opening and closing unit 26 moves the tray 22 together with the cover 24. When the gate opening and closing unit 26 closes the loading and unloading port 21 by moving the cover 24, the tray 22 is loaded into the processing container 20. When the gate opening and closing unit 26 opens the loading and unloading port 21 by moving the cover 24, the tray 22 is unloaded to the outside of the processing container 20.

[0030] like Figure 1 As shown in FIG. 1 , a supply port 27 and an exhaust port 28 are provided in the processing container 20. The supply port 27 is provided on the side of the processing container 20 opposite to the loading / unloading port 21, and the supply port 27 is connected to the supply line 41. The exhaust port 28 is provided below the loading / unloading port 21, and the exhaust port 28 is connected to the exhaust line 51. In addition, the number and position of the supply ports 27 and the number and position of the exhaust ports 28 are not particularly limited.

[0031] A supply header 31 and a discharge header 33 are provided inside the processing container 20. The supply header 31 is connected to the supply port 27 and has a plurality of supply ports opening toward the loading / unloading port 21 of the processing container 20. The discharge header 33 is connected to the discharge port 28 and has a plurality of discharge ports opening toward the supply header 31.

[0032] The substrate processing apparatus 1 includes a control unit 90. The control unit 90 is, for example, a computer, and includes a computing unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs for controlling various processes performed in the substrate processing apparatus 1. The control unit 90 controls the operation of the substrate processing apparatus 1 by causing the computing unit 91 to execute the programs stored in the storage unit 92.

[0033] Next, refer to Figure 4 An example of the supply unit 40 and the discharge unit 50 will be described below. Figure 4 TS represents a temperature sensor, and PS represents a pressure sensor. The supply unit 40 supplies various fluids from the outside to the inside of the processing container 20. The supply unit 40 has a supply line 41. The supply line 41 connects the fluid supply source and the processing container 20, and supplies the supercritical fluid to the processing container 20 from the fluid supply source.

[0034] The supply line 41 includes, for example, individual lines 41A and 41B and a common line 41C. The upstream ends of the individual lines 41A and 41B are connected to a fluid supply source, and the downstream ends of the individual lines 41A and 41B are connected to the upstream end of the common line 41C. The downstream end of the common line 41C is connected to the supply port 27 of the processing container 20.

[0035] The separate line 41A is used for the raw material of the supercritical fluid (e.g., liquid CO 2 ) is supplied. An on-off valve 42 and a throttle 43 are provided in the separate line 41A. The on-off valve 42 opens and closes the flow path of the separate line 41A. The flow path of the separate line 41A is equivalent to the second flow path, and the on-off valve 42 is equivalent to the second on-off valve. When the on-off valve 42 opens the flow path, the raw material of the supercritical fluid is supplied to the common line 41C, and is heated at the common line 41C, and is supplied to the inside of the processing container 20 in the form of gas or supercritical fluid. On the other hand, when the on-off valve 42 blocks the flow path, the supply of the raw material of the supercritical fluid to the common line 41C is stopped.

[0036] A separate line 41B is used for a purge gas (eg, N 2 The separate line 41B is provided with an on-off valve 44. The on-off valve 44 opens and closes the flow path of the separate line 41B. The flow path of the separate line 41B is equivalent to the first flow path, and the on-off valve 44 is equivalent to the first on-off valve. Sometimes the first flow path is described as a purge gas flow path. When the on-off valve 44 opens the purge gas flow path, the purge gas is supplied to the inside of the processing container 20 via the common line 41C. On the other hand, when the on-off valve 44 blocks the purge gas flow path, the supply of the purge gas to the common line 41C is stopped.

[0037] The common line 41C is used to supply various fluids to the processing container 20. A heater 45, an on-off valve 46, and a filter 47 are provided in sequence from the upstream side to the downstream side in the middle of the common line 41C. A branch line 48 is branched from the common line 41C between the heater 45 and the on-off valve 46. An on-off valve 49 is provided in the middle of the branch line 48.

[0038] When the pressure of the processing container 20 is released, the on-off valve 46 blocks the flow path of the common line 41C, and the on-off valve 49 opens the flow path of the branch line 48. Thus, the pressure of the heater 45 can be released independently of the pressure of the processing container 20. The gas cooled by the decompression of the heater 45 can be prevented from flowing into the processing container 20 via the filter 47, and thus the inflow of particles into the processing container 20 can be prevented.

[0039] The reason why the pressure of the heater 45 is released after processing the nth (n is an integer greater than or equal to 1)th substrate W is to process the (n+1)th substrate W under the same conditions as the first substrate W to reduce the variation in processing quality of the substrates W.

[0040] The discharge unit 50 discharges fluid from the interior of the processing container 20. The discharge unit 50 has a discharge line 51. The upstream end of the discharge line 51 is connected to the discharge port 28 of the processing container 20. In the middle of the discharge line 51, a flow meter 52, a back pressure valve 53, and an on-off valve 54 are sequentially provided from the upstream side to the downstream side.

[0041] The back pressure valve 53 maintains the pressure of the processing container 20 at a set pressure. The set pressure of the back pressure valve 53 can be changed appropriately. The on-off valve 54 opens and closes the flow path of the discharge line 51. When the on-off valve 54 opens the flow path, the pressure of the processing container 20 is maintained constant by the back pressure valve 53, while the fluid is discharged from the processing container 20.

[0042] A bypass line 55 is provided in the middle of the discharge line 51 to bypass the back pressure valve 53 and the on-off valve 54. An on-off valve 56 is provided in the middle of the bypass line 55. The on-off valve 56 opens and closes the flow path of the bypass line 55. When the on-off valve 56 opens the flow path, the fluid is discharged from the processing container 20, and the pressure of the processing container 20 is restored to the atmospheric pressure.

[0043] Next, refer to Figure 5 An example of the components of the control unit 90 will be described below. Figure 5 The functional blocks shown in the figure are conceptual and do not necessarily need to be physically configured as shown in the figure. All or part of each functional block can be functionally or physically dispersed and combined in arbitrary units. All or any part of each processing function performed in each functional block can be implemented by a program executed in the CPU, or can be implemented by hardware based on wired logic.

[0044] The control unit 90 includes, for example, a management unit 93, a determination unit 94, a gate opening and closing control unit 95, and an opening and closing valve control unit 96. The management unit 93 acquires information related to a processing plan for the substrate W and a processing recipe for the substrate W from, for example, a host computer, and manages the information. The processing plan includes the number of sheets to be processed and the processing period. The processing recipe includes processing conditions (for example, the order of processes, the time of each process, the temperature, pressure, or flow rate in each process, etc.).

[0045] The determination unit 94 determines whether to carry in a substrate W following the unloading of the substrate W based on the information acquired by the management unit 93. The gate opening and closing control unit 95 controls the opening and closing of the loading and unloading port 21 of the processing container 20 by controlling the gate opening and closing unit 26. The opening and closing valve control unit 96 controls the opening and closing of the opening and closing valves 42, 44, 46, 49, 54, and 56.

[0046] When the substrate W is carried in after the substrate W is carried out, the control unit 90 carries in the substrate W without switching the carry-in / carry-out port 21 from the open state to the closed state and without switching the purge gas flow path from the closed state to the open state after the substrate W is carried out, which will be described in detail later. When the substrate W is carried in after the substrate W is carried out, the control unit 90 carries in the substrate W in a desired state in which the switching operation is prohibited after the substrate W is carried out.

[0047] Next, refer to Figure 6 A substrate processing method according to one embodiment will be described. Figure 6 Steps S101 to S107 are performed under the control of the control unit 90. Step S101 and the processing after step S101 are started when the power of the substrate processing apparatus 1 is turned on, the startup of the substrate processing apparatus 1 is completed, and the management unit 93 obtains the processing plan of the substrate W.

[0048] exist Figure 7 An example of the state of the substrate processing apparatus 1 immediately before step S101 is shown in FIG. Figure 7 In FIG. 1 , the bold line indicates the flow of the fluid. The on-off valves 44, 46, 54, and 56 on the bold line open their respective flow paths, and the other on-off valves 42 and 49 block their respective flow paths. The supply unit 40 supplies the purge gas to the processing container 20, and the discharge unit 50 discharges the purge gas accumulated in the processing container 20.

[0049] The purge gas keeps the interior of the processing container 20 clean before processing of the substrate W is started (or during a break in processing of the substrate W). The purge gas is supplied to the processing container 20 and exhausted from the processing container 20 when the processing container 20 does not contain any substrate W. In addition, the purge gas may be supplied to the processing container 20 during the process of unloading the substrate W from the processing container 20 (for example, step S104).

[0050] In step S101, Figure 8 As shown, the on-off valve 44 blocks the purge gas flow path. The control unit 90 not only switches the on-off valve 44 from an open state to a closed state, but also switches the on-off valves 46, 54, and 56 from an open state to a closed state. The open state is a state in which the flow path is open, and the closed state is a state in which the flow path is blocked. All the on-off valves 42, 44, 46, 49, 54, and 56 block their respective flow paths. The supply unit 40 stops supplying the purge gas, and the exhaust unit 50 stops exhausting the purge gas. Afterwards, the control unit 90 preferably confirms that the pressure of the processing container 20 is below the threshold value through the pressure sensor PS.

[0051] In addition, in step S101, the gate opening and closing unit 26 opens the loading and unloading port 21 by moving the cover body 24. Since the supply unit 40 stops supplying the purge gas, it is possible to suppress the sealing member 25 from being blown away by the pressure of the processing container 20 when the gate opening and closing unit 26 opens the loading and unloading port 21. In addition, since the supply unit 40 stops supplying the purge gas, it is possible to suppress the high-temperature purge gas from flowing out through the loading and unloading port 21 even if the gate opening and closing unit 26 opens the loading and unloading port 21. Therefore, it is possible to suppress the substrate W waiting near the loading and unloading port 21 from being exposed to the high-temperature purge gas, and it is possible to suppress the substrate W from drying.

[0052] In step S102, the transport robot (not shown) places the substrate W on the tray 22, and the gate opening and closing unit 26 moves the cover 24 to carry the substrate W into the processing container 20, and closes the loading and unloading port 21. At this time, all the opening and closing valves 42, 44, 46, 49, 54, and 56 close their respective flow paths to prevent the backflow of the fluid. The tray 22 holds the substrate W horizontally inside the processing container 20 so that the liquid film of the drying liquid L faces upward.

[0053] In step S103, pressure increase, circulation, and pressure relief are performed in sequence. Pressure increase is a process of supplying a supercritical fluid to the processing container 20 through the supply unit 40 to increase the pressure of the processing container 20 to a set pressure above the critical pressure. Circulation is a process in which the supply unit 40 and the discharge unit 50 discharge the fluid accumulated in the processing container 20 while maintaining the pressure of the processing container 20 at a constant level. The discharged fluid contains not only the supercritical fluid but also the drying liquid L dissolved in the supercritical fluid. The drying liquid L disappears from the substrate W, and the substrate W is dried. Pressure relief is a process of reducing the pressure of the processing container 20 by discharging the fluid accumulated in the processing container 20 through the discharge unit 50.

[0054] exist Fig. 9 An example of the state of the substrate processing apparatus 1 during the pressure increase in step S103 is shown in FIG. Fig. 9 In FIG. 1 , the bold line indicates the flow of the fluid. The on-off valves 42 and 46 on the bold line open their respective flow paths, and the other on-off valves 44, 49, 54, and 56 block their respective flow paths. The supply unit 40 supplies the supercritical fluid to the processing container 20, and increases the pressure of the processing container 20 to a set pressure above the critical pressure. During this period, the discharge unit 50 does not discharge the fluid accumulated in the processing container 20.

[0055] exist Fig.10 An example of the state of the substrate processing apparatus 1 during the circulation of step S103 is shown in FIG. Fig.10 In FIG. 1 , the bold line indicates the flow of the fluid. The on-off valves 42, 46, and 54 on the bold line open their respective flow paths, and the other on-off valves 44, 49, and 56 block their respective flow paths. The supply unit 40 and the discharge unit 50 discharge the fluid accumulated in the processing container 20 while maintaining the pressure of the processing container 20 at a constant level. The discharged fluid includes not only the supercritical fluid but also the drying liquid L dissolved in the supercritical fluid. The drying liquid L disappears from the substrate W, and the substrate W is dried.

[0056] exist Fig.11 An example of the state of the substrate processing apparatus 1 during the pressure release in step S103 is shown in FIG. Fig.11In FIG. 1 , the bold line indicates the flow of the fluid. The on-off valves 49, 54, and 56 on the bold line open their respective flow paths, and the other on-off valves 42, 44, and 46 block their respective flow paths. The discharge unit 50 discharges the fluid accumulated in the processing container 20 to reduce the pressure of the processing container 20. Afterwards, the control unit 90 preferably confirms that the pressure of the processing container 20 is below the threshold value through the pressure sensor PS.

[0057] When the discharge unit 50 releases the pressure of the processing container 20, the on-off valve 46 blocks the flow path of the common line 41C, and the on-off valve 49 opens the flow path of the branch line 48. Thus, the pressure of the heater 45 can be released independently of the pressure of the processing container 20. The gas cooled by the decompression of the heater 45 can be prevented from flowing into the processing container 20 via the filter 47, and the inflow of particles into the processing container 20 can be prevented.

[0058] In step S104, the gate opening and closing unit 26 opens the loading and unloading port 21 by moving the cover 24, and unloads the substrate W from the processing container 20. Due to the unloading of the substrate W, a space having the same volume as the substrate W is generated inside the processing container 20. In order to prevent air from entering the space from the outside of the processing container 20, during the unloading of the substrate W, the same steps as immediately before step S101 are performed. Figure 7 As shown, the on-off valve 44 is opened to open the purge gas flow path.

[0059] The control unit 90 operates the on-off valve 44 to open the purge gas flow path to supply the purge gas to the processing container 20 while unloading the substrate W. Even if a space having the same volume as the substrate W is generated inside the processing container 20 due to the unloading of the substrate W, the space can be filled with the purge gas, thereby preventing air from entering the processing container 20 from the outside.

[0060] In step S105, since the unloading of the substrate W is completed, Figure 8 As shown, the on-off valve 44 blocks the purge gas flow path. It is possible to suppress the high-temperature purge gas from flowing out through the loading and unloading port 21. The control unit 90 not only switches the on-off valve 44 from an open state to a closed state, but also switches the on-off valves 46, 54, and 56 from an open state to a closed state. All the on-off valves 42, 44, 46, 49, 54, and 56 block their respective flow paths to prevent backflow of the fluid.

[0061] In step S106, the determination unit 94 determines whether to carry in a substrate W following the unloading of the substrate W. Specifically, the determination unit 94 determines whether the number of processed substrates W has reached the number of processed substrates in the processing plan, that is, whether there are any remaining substrates W to be processed. Hereinafter, the number of processed substrates in the processing plan may be described as the planned number of substrates.

[0062] If there are remaining substrates W to be processed (step S106 is "No"), the control unit 90 performs step S102 and the processing after step S102 again, and carries out the loading of substrates W. On the other hand, if the number of processed substrates W reaches the planned number and there are no remaining substrates W to be processed (step S106 is "Yes"), the control unit 90 performs step S107.

[0063] In step S107, the gate opening and closing unit 26 closes the loading and unloading port 21 by moving the cover 24, and Figure 7 The control unit 90 switches not only the on-off valve 44 from closed state to open state, but also the on-off valves 46, 54, 56 from closed state to open state. Thus, the state of the substrate processing apparatus 1 becomes the same as the state immediately before step S101.

[0064] The purge gas keeps the interior of the processing container 20 clean until the management unit 93 obtains the next processing plan. The purge gas is supplied to the processing container 20 and exhausted from the processing container 20 when the processing container 20 does not contain a substrate W. When the management unit 93 obtains the next processing plan, step S101 and the processes after step S101 are performed.

[0065] As described above, the control unit 90 of this embodiment skips step S107 and step S101 to perform the processing in and after step S102 when the (n+1)th substrate W is carried in after the nth substrate W is carried out (step S106 is "No"). In other words, the control unit 90 carries in the (n+1)th substrate W without switching the loading / unloading port 21 from the open state to the closed state and without switching the purge gas flow path from the closed state to the open state when the (n+1)th substrate W is carried in after the nth substrate W is carried out (step S106 is "No").

[0066] By skipping steps S107 and S101, the closing and opening of the loading and unloading port 21 can be skipped once, thereby reducing the number of opening and closing operations of the gate opening and closing portion 26, and improving the life of the gate opening and closing portion 26 and the sealing member 25. In addition, according to the present embodiment, by skipping steps S107 and S101, the switching of the on-off valves 44, 46, 54, and 56 from the closed state to the open state and from the open state to the closed state can be skipped once, thereby reducing the number of opening and closing operations of the on-off valves 44, 46, 54, and 56, and improving the life of the on-off valves 44, 46, 54, and 56. Furthermore, by skipping steps S107 and S101, the throughput can be improved.

[0067] In addition, the control unit 90 of this embodiment performs step S107 when the (n+1)th substrate W is carried in without carrying out the nth substrate W (step S106 is "yes"). In step S107, the carrying-in / out port 21 is closed and the purge gas flow path is opened. Thus, the inside of the processing container 20 can be kept in a clean state until the management unit 93 obtains the next processing plan.

[0068] Furthermore, the control unit 90 of the present embodiment carries out the n-th substrate W while supplying the purge gas to the processing container 20 by opening the purge gas flow path. Even if a space of the same volume as the substrate W is generated inside the processing container 20 due to the carrying out of the n-th substrate W, the space can be filled with the purge gas, thereby preventing air from entering the processing container 20 from the outside. In this case, the control unit 90 blocks the purge gas flow path after the n-th substrate W is carried out and before the (n+1)-th substrate W is carried in. The high-temperature purge gas can be prevented from flowing out through the carry-in / carry-out port 21. Therefore, the (n+1)-th substrate W waiting near the carry-in / carry-out port 21 can be prevented from being exposed to the high-temperature purge gas, thereby preventing the (n+1)-th substrate W from drying.

[0069] In addition, the control unit 90 of this embodiment determines whether to carry in the (n+1)th substrate W after carrying out the nth substrate W after closing the purge gas flow path (step S105) and before carrying in the next substrate W (step S102). By making the determination immediately before carrying in the (n+1)th substrate W, it is easy to cope with changes in the processing plan. In addition, the timing of the determination is not particularly limited.

[0070] Next, refer to Fig.12 An example of the structure of the on-off valve 44 is described. The on-off valve 44 has a first port 441, a second port 442, and a valve body 443. One of the first port 441 and the second port 442 (for example, the first port 441) is an inlet of a fluid (for example, a purge gas), and the other (for example, the second port 442) is an outlet of the fluid.

[0071] Valve body 443 is in the open position (refer to Fig.12 (A)) and closed position (refer to Fig.12 The open position is a position where the first port 441 is connected to the second port 442. The closed position is a position where the first port 441 is blocked from the second port 442. The valve body 443 is, for example, a diaphragm.

[0072] When the valve body 443 stops at the closed position, the surface 443b of the valve body 443 that receives the pressure of the second port 442 is larger than the surface 443a of the valve body 443 that receives the pressure of the first port 441. For example, the first port 441 and the second port 442 are provided in a concentric circle shape, the first port 441 is provided in a circular shape, and the second port 442 is provided in a circular ring shape so as to surround the first port 441.

[0073] The second port 442 is a port closer to the processing container 20 than the first port 441. The second port 442 applies a pressure equivalent to the pressure of the processing container 20 (e.g., a pressure above the critical pressure) to the valve body 443. On the other hand, the first port 441 applies a pressure of about atmospheric pressure (e.g., a pressure below 1 MPa) to the valve body 443.

[0074] As described above, the second port 442 is a port closer to the processing container 20 than the first port 441. Since the pressure of the processing container 20 is high pressure, the closing force that stops the valve body 443 in the closed position can be reduced by subjecting the valve body 443 to high pressure over a large area. As a result, damage to the valve body 443 can be suppressed, and the life of the valve body 443 can be extended. In addition, the content of the present disclosure can also be applied to the on-off valves 42, 46, 49, 54, and 56 other than the on-off valve 44.

[0075] The on-off valve 44 has an elastic body 444 that applies a force from the open position to the closed position to the valve body 443. The elastic body 444 applies a force from the open position to the closed position to the valve body 443 by its elastic restoring force. The elastic body 444 is, for example, a spring. The substrate processing apparatus 1 has a driving unit 60 that presses the valve body 443 against the force F of the elastic body 444.

[0076] The driving unit 60 presses the valve body 443 from the closed position toward the open position by air pressure, for example. The driving unit 60 includes one or more solenoid valves, etc., and can switch the air pressure supplied to the on-off valve 44 between a first set pressure P1 higher than the atmospheric pressure and a second set pressure P2 (P2>P1) higher than the first set pressure P1. In order to improve maintainability, the driving unit 60 can also switch the air pressure supplied to the on-off valve 44 to atmospheric pressure.

[0077] When the driving unit 60 supplies the air pressure of the second setting pressure P2 to the on-off valve 44, the valve body 443 moves from the closed position to the open position by the air pressure and stops at the open position. On the other hand, when the driving unit 60 supplies the air pressure of the first setting pressure P1 to the on-off valve 44, the valve body 443 moves from the open position to the closed position and stops at the closed position.

[0078] The control unit 90 presses the valve body 443 with the first set pressure P1 against the force F of the elastic body 444 while the valve body 443 is moved from the open position to the closed position by controlling the driving unit 60. Thus, the impact when the valve body 443 reaches the closed position can be mitigated, or the closing force that stops the valve body 443 at the closed position can be reduced. As a result, damage to the valve body 443 can be suppressed, thereby extending the life of the valve body 443. In addition, the content of the present disclosure can also be applied to the on-off valves 42, 46, 49, 54, and 56 other than the on-off valve 44.

[0079] The above describes the embodiments of the substrate processing device and the substrate processing method involved in the present disclosure, but the present disclosure is not limited to the above embodiments. Various changes, corrections, substitutions, additions, deletions and combinations can be made within the scope of the claims. These also belong to the technical scope of the present disclosure.

[0080] This application claims the priority of Japanese Patent Application No. 2022-167483 filed with the Japan Patent Office on October 19, 2022, and all the contents of Japanese Patent Application No. 2022-167483 are cited in this application.

[0081] Description of Reference Numerals

[0082] 1: substrate processing device; 20: processing container; 21: loading and unloading port; 22: tray (substrate conveying unit); 24: cover; 26: gate opening and closing unit; 44: opening and closing valve (first opening and closing valve); 90: control unit; W: substrate.

Claims

1. A substrate processing device, comprising: a processing container, wherein a substrate loading and unloading port is provided in the processing container, and the processing container accommodates the substrate; A cover body, which opens and closes the loading and unloading port; a gate opening and closing portion that moves the cover; a substrate conveying unit that holds the substrate and allows the substrate to pass through the loading / unloading port; a first opening and closing valve that opens and closes a first flow path for supplying a purge gas to the processing container; and Control Department, in, The control unit determines whether to move the substrate in subsequently to moving the substrate out. In the case where the substrate is moved in subsequently to moving the substrate out, after the substrate is moved out, the substrate is moved in without switching the load / unload port from an open state to a closed state and without switching the first flow path from a closed state to an open state.

2. The substrate processing apparatus according to claim 1, wherein: When the substrate is carried in without being carried out, the control unit closes the carrying-in / out port and opens the first flow path after the substrate is carried out.

3. The substrate processing apparatus according to claim 1, wherein: The control unit causes the substrate to be unloaded while the purge gas is supplied to the processing container by opening the first flow path, and closes the first flow path after the substrate is unloaded and before the substrate is loaded.

4. The substrate processing apparatus according to claim 3, wherein: The control unit determines whether to carry in the substrate after carrying out the substrate, after the first flow path is closed and before the substrate is carried in.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein: A second opening and closing valve is provided, the second opening and closing valve opens and closes a second flow path for supplying a supercritical fluid to the processing container, The supercritical fluid in the processing container is replaced with the drying liquid contained on the substrate.

6. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The first on-off valve has a valve body that moves between an open position and a closed position. The valve body connects the first port and the second port at the open position, and blocks the first port and the second port at the closed position. When the valve body stops at the closed position, a surface of the valve body that receives pressure from the second port is larger than a surface of the valve body that receives pressure from the first port. The second port is a port closer to the processing container than the first port.

7. The substrate processing apparatus according to any one of claims 1 to 4, wherein: The first on-off valve comprises: a valve body that moves between an open position and a closed position, wherein the valve body connects the first port and the second port at the open position and blocks the first port and the second port at the closed position; and an elastic body which applies a force to the valve body from the open position toward the closed position, The substrate processing device includes a driving unit, and the driving unit presses the valve body against the force of the elastic body. The control unit controls the driving unit to press the valve body against the restoring force of the elastic body while the valve body is moved from the open position to the closed position.

8. A substrate processing method, comprising: Open the loading and unloading port of the processing container; Loading a substrate into the processing container; The carrying in and carrying out port is blocked; supplying a fluid into the interior of the processing container; Opening the loading and unloading port; unloading the substrate from the interior of the processing container; and opening and closing a first flow path for supplying a purge gas to the processing container, the substrate processing method comprising: Determine whether to move the substrate in subsequently to moving the substrate out. In the case where the substrate is moved in subsequently to moving the substrate out, after the substrate is moved out, the substrate is moved in without switching the load / unload port from an open state to a closed state and without switching the first flow path from a closed state to an open state.

9. The substrate processing method according to claim 8, wherein: include: When the substrate is carried in without being carried out, the carrying-in / out port is closed and the first flow path is opened after the substrate is carried out.

10. The substrate processing method according to claim 8, wherein: include: The substrate is unloaded while the purge gas is supplied to the processing container by opening the first flow path, and the first flow path is closed after the substrate is unloaded and before the substrate is loaded.

11. The substrate processing method according to claim 10, wherein: include: After the first flow path is closed and before the substrate is carried in, it is determined whether the substrate is carried in following the unloading of the substrate.

12. The substrate processing method according to any one of claims 8 to 11, wherein: include: The supercritical fluid is supplied into the processing container to replace the drying liquid on the substrate with the supercritical fluid.

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