Power supply defect reason analysis method, device and equipment and readable storage medium

Abstract

The invention discloses a power supply defect reason analysis method, device and equipment and a readable storage medium, and the method comprises the steps: obtaining defect test data corresponding to a power supply when a power supply test is not passed; according to the model information of the power supply, obtaining various bad reasons bound with the model information and power supply test data associated with the various bad reasons in a preset database; determining a bad reason data set corresponding to the power supply based on various bad reasons and the power supply test data associated with the various bad reasons; and according to the bad test data and the bad reason data set, determining a target bad reason corresponding to the power supply. By automatically comparing the bad test data corresponding to the power supply with the bad reason data set, the target bad reason corresponding to the power supply is determined, the situation that related testers manually analyze the bad reason that the power supply cannot pass the test usually takes a long time is avoided, and then the power supply bad reason analysis efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of data analysis technology, and in particular to a method, apparatus, device and readable storage medium for analyzing the cause of a poor power supply. Background Art

[0002] To ensure power supply compliance, it's often necessary to test the power supply. If the power supply fails the test, testers must manually compile the test data and analyze the cause of the failure based on the data. However, manually analyzing the cause of the failure often takes a long time, resulting in inefficient analysis. Summary of the Invention

[0003] The embodiments of the present application provide a method, apparatus, device, and readable storage medium for analyzing the causes of power failure, which can improve the efficiency of analyzing the causes of power failure.

[0004] In a first aspect, an embodiment of the present application provides a method for analyzing causes of poor power supply, the method comprising:

[0005] When the power supply test fails, obtaining the bad test data corresponding to the power supply;

[0006] According to the model information of the power supply, various failure reasons bound to the model information and power supply test data associated with the various failure reasons are obtained from a preset database;

[0007] Determine a failure cause data set corresponding to the power supply based on various failure causes and power supply test data associated with the various failure causes;

[0008] A target failure cause corresponding to the power supply is determined according to the failure test data and the failure cause data set.

[0009] Optionally, determining a target failure cause corresponding to the power supply according to the failure data and the failure cause data set includes:

[0010] Comparing the bad test data with each of the power supply test data in the bad cause data set to obtain a first similarity set;

[0011] Determine the largest first similarity in the first similarity set as a first target similarity;

[0012] A target failure cause corresponding to the power supply is determined in the failure cause data set, where the target failure cause is a failure cause associated with the power supply test data corresponding to the first target similarity.

[0013] Optionally, determining a target failure cause corresponding to the power supply according to the failure data and the failure cause data set includes:

[0014] Collecting target test environment information corresponding to the bad test data;

[0015] According to the failure test data and the target test environment information, a target failure cause corresponding to the power supply is determined in the failure cause data set.

[0016] Optionally, the failure cause data set further includes test environment information associated with various failure causes, and determining a target failure cause corresponding to the power supply in the failure cause data set based on the failure test data and the target test environment information includes:

[0017] Comparing the bad test data with each of the power supply test data in the bad cause data set to obtain a second similarity set;

[0018] Adding the failure cause corresponding to each second similarity greater than a preset similarity threshold in the second similarity set to the reference failure cause set;

[0019] Comparing the target test environment information with the test environment information associated with each failure cause in the reference failure cause set to obtain a third similarity set;

[0020] Based on the third similarity set, a target failure cause corresponding to the power supply is determined in the reference failure cause set.

[0021] Optionally, the test environment information includes test conditions, load conditions, and environmental interference, and the target test environment information includes target test conditions, target load conditions, and target environmental interference; and the third similarity set is obtained by comparing each of the test environment information in the bad cause data set of the target test environment information, including:

[0022] For each piece of test environment information, determining a first reference similarity based on the test condition and the target test condition, determining a second reference similarity based on the load condition and the target load condition, and determining a third reference similarity based on the environmental interference and the target environmental interference;

[0023] Calculating a third similarity corresponding to the test environment information based on a preset weight, the first reference similarity, the second reference similarity, and the third reference similarity;

[0024] Until the third similarity corresponding to each piece of the test environment information is calculated, a third similarity set is obtained.

[0025] Optionally, determining a target failure cause corresponding to the power supply in the reference failure cause set based on the third similarity set includes:

[0026] Comparing each third similarity in the third similarity set to determine a third target similarity, where the third target similarity is the largest third similarity in the third similarity set;

[0027] In the reference failure cause set, a failure cause associated with the test environment information corresponding to the third target similarity is selected and determined as a target failure cause corresponding to the power supply.

[0028] Optionally, after determining the target failure cause corresponding to the power supply, the method further includes:

[0029] Determining a maintenance suggestion corresponding to the target failure cause according to the target failure cause corresponding to the power supply and a preset maintenance suggestion database;

[0030] The maintenance suggestion is displayed.

[0031] In a second aspect, an embodiment of the present application provides a device for analyzing causes of poor power supply, comprising:

[0032] A first acquiring unit, configured to acquire bad test data corresponding to the power supply when the power supply test fails;

[0033] A second acquiring unit is configured to acquire, from a preset database, various failure causes bound to the model information and power supply test data associated with the various failure causes according to the model information of the power supply;

[0034] A first determining unit is configured to determine a failure cause data set corresponding to the power supply based on various failure causes and power supply test data associated with the various failure causes;

[0035] The second determining unit is configured to determine a target failure cause corresponding to the power supply according to the failure test data and the failure cause data set.

[0036] In a third aspect, an embodiment of the present application further provides an electronic device, comprising a memory storing a computer program; a processor loading the computer program from the memory to execute any one of the power supply failure cause analysis methods provided in the embodiments of the present application.

[0037] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. The computer program is suitable for loading by a processor to execute any power supply failure cause analysis method provided in the embodiment of the present application.

[0038] In a fifth aspect, an embodiment of the present application further provides a computer program product, including a computer program, which, when executed by a processor, implements any one of the methods for analyzing the cause of poor power supply provided in the embodiments of the present application.

[0039] The solution of the embodiment of the present application is to obtain the bad test data corresponding to the power supply when the power supply fails the test; obtain various bad causes bound to the model information and the power supply test data associated with the various bad causes from a preset database based on the model information of the power supply; determine the bad cause data set corresponding to the power supply based on the various bad causes and the power supply test data associated with the various bad causes; and determine the target bad cause corresponding to the power supply based on the bad test data and the bad cause data set. By automatically comparing the bad test data corresponding to the power supply with the bad cause data set to determine the target bad cause corresponding to the power supply, the time required for manual analysis of the bad cause of the power supply failure to pass the test by relevant test personnel is avoided, thereby improving the efficiency of the power supply bad cause analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 This is a flowchart of a first embodiment of a method for analyzing causes of poor power supply provided by this application;

[0042] Figure 2 This is a flow chart of a second embodiment of the method for analyzing the cause of a poor power supply provided by the present application;

[0043] Figure 3 This is a flowchart of a third embodiment of the method for analyzing the cause of a poor power supply provided by the present application;

[0044] Figure 4 This is a flowchart of a fourth embodiment of the method for analyzing causes of poor power supply provided by the present application;

[0045] Figure 5 This is a schematic diagram of the structure of a device for analyzing the cause of a poor power supply provided by the present application;

[0046] Figure 6 It is a structural diagram of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. At the same time, in the description of the embodiments of the present application, the terms "first", "second", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0048] Embodiments of the present application provide a method, apparatus, device, and readable storage medium for analyzing causes of poor power supply.

[0049] Specifically, the embodiments of the present application will be described from the perspective of a poor power supply cause analysis device, that is, the poor power supply cause analysis method of the embodiments of the present application can be performed by a poor power supply cause analysis device; the poor power supply cause analysis device can be a smart terminal, a PC terminal, a mobile terminal, and other devices.

[0050] The following is a detailed description of each embodiment in conjunction with the accompanying drawings. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments. Although a logical order is shown in the flowcharts, in some cases, the steps shown or described may be performed in an order different from that shown in the drawings.

[0051] Please refer to Figure 1 , a first embodiment of the method for analyzing the cause of a poor power supply is proposed, and the method in the first embodiment includes:

[0052] Step 101: When a power supply test fails, obtain the bad test data corresponding to the power supply.

[0053] In this step, the power supply failure cause analysis device receives a test report corresponding to the power supply. If the test report determines that the power supply test failed, the device then retrieves the corresponding power supply failure test data from the test report. Specifically, after the power supply test is completed, the test device organizes the test data, generates a test report corresponding to the power supply, and sends the test report to the power supply failure cause analysis device. Upon receiving the test report, the device determines whether the power supply test passed based on the test report. If the test is determined to have passed, the device stores the test report. If the test is determined to have failed, the device retrieves the corresponding power supply failure test data from the test report.

[0054] Exemplarily, the bad test data includes: one or more of: output voltage and current accuracy data, load regulation rate data, no-load regulation rate data, ripple data, noise data, temperature coefficient data, protection function data, transient response test data, efficiency test data, load effect test data, long-term stability test data, frequency response test data, parallel stability data, load balancing data, mutual interference test data, and parallel switch characteristic test data.

[0055] Step 102: According to the model information of the power supply, various failure reasons bound to the model information and power supply test data associated with the various failure reasons are obtained from a preset database.

[0056] In this step, after determining the corresponding power supply, the power supply failure cause analysis device obtains the model information corresponding to the power supply. Based on the model information, it retrieves various failure causes and power supply test data associated with the failure causes from a preset database. It should be noted that the database of the power supply failure cause analysis device pre-stores various failure causes and power supply test data associated with each power supply model. The various failure causes and power supply test data associated with the various failure causes are obtained based on historical test analysis and are used to indicate which failure causes correspond to which failure power supply test data obtained during testing.

[0057] Step 103 : determining a failure cause data set corresponding to the power supply based on various failure causes and power supply test data associated with the various failure causes.

[0058] In this step, the power supply failure cause analysis device extracts various failure causes and power supply test data associated with various failure causes bound to the preset database and model information, binds each failure cause and the power supply test data associated with each failure cause, and obtains the failure cause data set corresponding to the power supply.

[0059] Step 104 : determining a target failure cause corresponding to the power supply according to the failure test data and the failure cause data set.

[0060] In this step, the power supply failure cause analysis device determines the target failure cause corresponding to the power supply based on the failure test data and the failure cause dataset. Specifically, the power supply failure cause analysis device compares the failure test data corresponding to the power supply with the test data for each power supply in the failure cause dataset to determine the target failure cause corresponding to the power supply.

[0061] Furthermore, the power supply failure cause analysis device can first analyze the data type of the failure test data corresponding to the power supply, then extract power supply test data of the same data type from the failure cause data set based on the data type, and then compare the failure test data corresponding to the power supply with the test data of each power supply to determine the target failure cause corresponding to the power supply. Preliminary screening of the power supply test data in the failure cause data set based on data type can reduce unnecessary comparison operations, thereby helping to improve the efficiency of power supply failure cause analysis.

[0062] Furthermore, if the power supply failure cause analysis device determines that there are multiple corresponding failure test data for the power supply, the above operation is performed for each failure test data to ensure that every possible failure cause of the power supply is not missed.

[0063] In some implementations, step 104 may include steps 1041 to 1043, specifically:

[0064] Step 1041 : Compare the failure test data with each power supply test data in the failure cause data set to obtain a first similarity set.

[0065] In this step, the power failure cause analysis device compares the failure test data corresponding to the power supply with each power supply test data in the failure cause data set to obtain a first similarity set.

[0066] Optionally, the power failure cause analysis device calculates the difference between the failure test data and each power supply test data respectively, and determines the first similarity between the failure test data and each power supply test data according to the difference and a preset mapping relationship between the difference and the similarity.

[0067] Optionally, the power failure cause analysis device pre-stores an analysis model that has been trained in advance and can analyze the similarity between the failure test data and the power supply test data. The power failure cause analysis device first binds the failure test data with each power supply test data to obtain an analysis data group, then inputs each analysis data group into the analysis model to obtain a similarity corresponding to each analysis data group. This similarity is the first similarity between the failure test data and the power supply test data in the analysis data group. Once the comparison between the failure test data and all power supply test data in the failure cause data set is complete, the power failure cause analysis device obtains a first similarity set.

[0068] Step 1042: determining the largest first similarity in the first similarity set as a first target similarity;

[0069] In this step, the power failure cause analysis device compares each first similarity in the first similarity set and determines the largest first similarity as the first target similarity.

[0070] Step 1043 : determining a target failure cause corresponding to the power supply in the failure cause data set, where the target failure cause is a failure cause associated with the power supply test data corresponding to the first target similarity.

[0071] In this step, the power supply failure cause analysis device determines a target failure cause corresponding to the power supply in the failure cause data set. The target failure cause is the failure cause associated with the power supply test data corresponding to the first target similarity. It will be understood that each first similarity in the first similarity set is associated with a corresponding failure cause. Therefore, when the first target similarity is determined in the first similarity set, the target failure cause corresponding to the power supply is also determined.

[0072] The power supply failure cause analysis device of this embodiment obtains failure test data corresponding to the power supply when the power supply fails the test; obtains various failure causes and power supply test data associated with the various failure causes from a preset database based on the model information of the power supply; determines a failure cause data set corresponding to the power supply based on the various failure causes and the power supply test data associated with the various failure causes; and determines a target failure cause corresponding to the power supply based on the failure test data and the failure cause data set. By automatically comparing the failure test data corresponding to the power supply with the failure cause data set to determine the target failure cause corresponding to the power supply, the time-consuming manual analysis of the failure cause of the power supply failure by relevant test personnel is avoided, thereby improving the efficiency of power supply failure cause analysis.

[0073] Please refer to Figure 2 A second embodiment of the method for analyzing the cause of a power failure is proposed. The difference between the second embodiment and the first embodiment is that determining the target failure cause corresponding to the power supply based on the failure data and the failure cause data set includes:

[0074] Step 201: Collect target test environment information corresponding to the bad test data.

[0075] In this step, the power supply failure cause analysis device collects target test environment information corresponding to the failure test data. Specifically, the power supply failure cause analysis device receives a test report corresponding to the power supply. If the test report determines that the power supply test has failed, the device obtains the failure test data corresponding to the power supply from the test report. Simultaneously, the device obtains the target test environment information corresponding to the failure test data from the test report.

[0076] It should be noted that the target test environment information is used to indicate the test environment when the power supply obtains bad test data during the test process.

[0077] Step 202 : determining a target failure cause corresponding to the power supply in the failure cause data set according to the failure test data and the target test environment information.

[0078] In this step, the power supply failure cause analysis device determines a reference failure cause set based on the failure test data and the power supply test data associated with each failure cause in the failure cause data set, and then determines the target failure cause corresponding to the power supply based on the target test environment information and the test environment information associated with each failure cause in the reference failure cause set.

[0079] It should be noted that the database of the power supply failure cause analysis device pre-stores various failure causes corresponding to each power supply model, along with associated power supply test data and test environment information. These failure causes and associated power supply test data and test environment information are obtained based on historical test analysis. Therefore, the reference failure cause set also includes the failure causes and associated test environment information.

[0080] It is understandable that due to different test environments, the test results obtained from the power supply test will also be different. The poor cause of the power supply may be caused by the test environment. Therefore, when analyzing the poor cause of the power supply, considering the power supply test data and the test environment information at the same time can avoid the omission of the poor cause and help improve the accuracy of the analysis of the poor cause of the power supply.

[0081] In some implementations, the failure cause data set also includes test environment information associated with various failure causes. Step 202 may include steps 2021 to 2024, specifically:

[0082] Step 2021 : Compare the bad test data with each of the power supply test data in the bad cause data set to obtain a second similarity set.

[0083] In this step, the power failure cause analysis device compares the failure test data with each power test data in the failure cause data set to obtain a second similarity set.

[0084] Optionally, the power failure cause analysis device calculates the difference between the failure test data and each power supply test data respectively, and determines the second similarity between the failure test data and each power supply test data according to the difference and a preset mapping relationship between the difference and the similarity.

[0085] Optionally, the power failure cause analysis device pre-stores an analysis model that has been trained in advance and can analyze the similarity between the failure test data and the power supply test data. The power failure cause analysis device first binds the failure test data with each power supply test data to obtain an analysis data group, then inputs each analysis data group into the analysis model to obtain a similarity corresponding to each analysis data group. This similarity is the second similarity between the failure test data and the power supply test data in the analysis data group. Once the comparison between the failure test data and all power supply test data in the failure cause data set is complete, the power failure cause analysis device obtains a second similarity set.

[0086] Step 2022: Add the failure cause corresponding to each second similarity greater than a preset similarity threshold in the second similarity set to the reference failure cause set.

[0087] In this step, after obtaining the second similarity set, the power supply failure cause analysis device compares each second similarity in the second similarity set with the preset similarity threshold, and adds the failure cause corresponding to each second similarity in the second similarity set that is greater than the preset similarity threshold to the reference failure cause set.

[0088] Step 2023 : Compare the target test environment information with the test environment information associated with each failure cause in the reference failure cause set to obtain a third similarity set.

[0089] In this step, the power failure cause analysis device obtains the test environment information associated with each failure cause in the reference failure cause set, compares the target test environment information with the test environment information associated with each failure cause in the reference failure cause set, and obtains a third similarity set.

[0090] Exemplarily, the power supply failure cause analysis device extracts numerical features from the test environment information and the target test environment information, and then calculates the difference between the numerical features corresponding to the target test environment information and the numerical features corresponding to the test environment information. The difference can be expressed by Euclidean distance, Manhattan distance, cosine similarity, Pearson correlation coefficient, etc., and then determines the third similarity between the target test environment information and the test environment information associated with each failure cause in the reference failure cause set based on the difference, and then obtains a third similarity set.

[0091] Step 2024: Determine a target failure cause corresponding to the power supply in the reference failure cause set based on the third similarity set.

[0092] In this step, the power failure cause analysis device determines a target failure cause corresponding to the power supply in the reference failure cause set based on the third similarity set.

[0093] In some implementations, step 2024 may include steps 20241 to 20242, specifically:

[0094] Furthermore, determining the target failure cause corresponding to the power supply in the reference failure cause set based on the third similarity set includes:

[0095] Step 20241 : Compare each third similarity in the third similarity set to determine a third target similarity, where the third target similarity is the largest third similarity in the third similarity set.

[0096] Step 20242: From the reference failure cause set, select the failure cause associated with the test environment information corresponding to the third target similarity and determine it as the target failure cause corresponding to the power supply.

[0097] In steps 20241 and 20242, the power supply failure cause analysis device compares each third similarity in the third similarity set and determines the largest third similarity in the third similarity set as the third similarity. The power supply failure cause analysis device selects, from the reference failure cause set, the failure cause associated with the test environment information corresponding to the third target similarity and determines it as the target failure cause corresponding to the power supply. It will be understood that each third similarity in the third similarity set is associated with a corresponding failure cause, and when the third target similarity is determined in the third similarity set, the target failure cause corresponding to the power supply is also determined.

[0098] The power failure cause analysis device in this embodiment collects target test environment information corresponding to the failure test data; based on the failure test data and the target test environment information, it determines the target failure cause corresponding to the power supply in the failure cause data set. By considering both the power supply test data and the test environment information when analyzing the cause of the power failure, it is possible to avoid missing any failure causes, thereby improving the accuracy of the power failure cause analysis.

[0099] Please refer to Figure 3 A third embodiment of the method for analyzing the cause of a poor power supply is proposed. The third embodiment differs from the first to second embodiments in that the test environment information includes test conditions, load conditions, and environmental interference, and the target test environment information includes target test conditions, target load conditions, and target environmental interference; and each piece of test environment information in the poor cause data set of the target test environment information is compared to obtain a third similarity set, including:

[0100] Step 301: For each test environment information, determine a first reference similarity based on the test condition and the target test condition, determine a second reference similarity based on the load condition and the target load condition, and determine a third reference similarity based on the environmental interference and the target environmental interference.

[0101] In this step, each test environment information includes test conditions, load conditions and environmental interference, and the target test environment information corresponding to the poor test data includes target test conditions, target load conditions and target environmental interference; the power supply poor cause analysis device selects the test environment information corresponding to each reference poor cause in the reference poor cause set in turn, and for the test environment information, compares the test conditions in the test environment information with the target test conditions in the target test environment information to determine the first reference similarity, compares the load conditions in the test environment information with the target load conditions in the target test environment information to determine the second reference similarity, and compares the environmental interference in the test environment information with the target environmental interference in the target test environment information to determine the third reference similarity.

[0102] It should be noted that test conditions usually refer to the parameters and standards set when conducting power supply tests. Among them, parameters may include input voltage range, frequency, temperature, humidity, and test time; the input voltage range refers to the normal operating voltage range and the voltage range for overvoltage testing used during the test; the frequency refers to the frequency of the input AC power during the power supply test, such as 50Hz or 60Hz. Temperature refers to the temperature of the test environment. It is usually necessary to test at different temperatures to ensure the reliability of the power supply under various environmental conditions. Humidity refers to the relative humidity conditions of the test environment. In particular, for some sensitive power supply equipment, humidity may affect its performance; the test time refers to the duration of each test item during the test process. Long-term testing can be used to evaluate the stability and durability of the power supply. Standards may include international or national standards such as IEC, UL, and ANSI.

[0103] It should be noted that load conditions refer to the characteristics of the load to which the power supply is connected during the test. Load characteristics may include load type, load power, load variation, load connection method, power factor, etc. Load types may include linear loads and non-linear loads. Linear loads may include resistive loads, which have simpler characteristics; non-linear loads may include motors, inverters, switching power supplies, etc., which may generate harmonics. Load power refers to different load power levels, which may include rated power, overload, and underload states. Load variation refers to changes that may occur in the load during the test, simulating load fluctuations in actual use. Load connection methods may include series connection or parallel connection, and different connection methods may affect the output characteristics of the power supply. Power factor refers to the fact that in the case of AC load, the power factor will affect the actual power output of the power supply.

[0104] It should be noted that environmental interference refers to external factors that may affect the power supply test results. Environmental interference can include electromagnetic interference (EMI), radio frequency interference (RFI), temperature fluctuations, vibration and shock, power grid fluctuations, and connection quality. Electromagnetic interference (EMI) refers to interference from other electrical equipment, which may affect the stability and output performance of the power supply. Radio frequency interference (RFI) refers to interference from high-frequency signals, which may affect the normal operation of sensitive electronic equipment. Temperature fluctuations refer to changes in the temperature of the external environment, which may affect the performance of the power supply. Vibration and shock refer to external mechanical vibrations and shocks that may affect the physical structure and performance of the equipment. Power grid fluctuations refer to fluctuations in the power supply's input grid (such as transient overvoltages and transient fluctuations), which may affect the power supply's output. Connection quality refers to the quality of the test cables and connectors; poor contact can lead to inaccurate measurements.

[0105] In some embodiments, the power supply failure cause analysis device inputs the test conditions in the test environment information and the target test conditions in the target test environment information into a pre-created analysis model, and the analysis model can output a first reference similarity; inputs the load conditions in the test environment information and the target load conditions in the target test environment information into the pre-created analysis model, and the analysis model can output a second reference similarity; inputs the environmental interference in the test environment information and the target environmental interference in the target test environment information into the pre-created analysis model, and the analysis model can output a third reference similarity.

[0106] Step 302: Calculate a third similarity corresponding to the test environment information based on a preset weight, the first reference similarity, the second reference similarity, and the third reference similarity;

[0107] In this step, after determining the first, second, and third reference similarities, the power failure cause analysis device calculates a third similarity corresponding to the test environment information based on the preset weights, the first, second, and third reference similarities. Specifically, the calculation formula is: third similarity = A * first reference similarity + B * second reference similarity + C * third reference similarity, where A is the preset weight corresponding to the test condition, B is the preset weight corresponding to the load condition, and C is the preset weight corresponding to the environmental interference, and A + B + C = 1.

[0108] Step 303 , until the third similarity corresponding to each piece of the test environment information is calculated, and a third similarity set is obtained.

[0109] In this step, the power failure cause analysis device calculates the third similarity between the test environment information corresponding to each reference failure cause in the reference failure cause set and the target test environment information in the above manner to obtain a third similarity set.

[0110] The power failure cause analysis device in this embodiment determines, for each test environment information, a first reference similarity based on the test conditions and the target test conditions, a second reference similarity based on the load conditions and the target load conditions, and a third reference similarity based on the environmental interference and the target environmental interference; based on the preset weight, the first reference similarity, the second reference similarity, and the third reference similarity, the third similarity corresponding to the test environment information is calculated, until the third similarity corresponding to each test environment information is calculated, thereby obtaining a third similarity set. By separately calculating the similarity between the test environment information and each sub-information contained in the target test environment information, and then calculating the third similarity corresponding to the test environment information and the target test environment information based on the similarity between each sub-information and the preset weight, the relationships between the various sub-information can be comprehensively considered, so that the third similarity corresponding to the obtained test environment information and the target test environment information is more accurate, thereby helping to improve the accuracy of the subsequent determination of the cause of the power failure.

[0111] Please refer to Figure 4 A fourth embodiment of the method for analyzing the cause of a power failure is proposed. The fourth embodiment differs from the first to third embodiments in that, after determining the target failure cause corresponding to the power supply, the method includes:

[0112] Step 401 : determining a maintenance suggestion corresponding to the target failure cause of the power supply according to the target failure cause and a preset maintenance suggestion database.

[0113] Step 402: Display the maintenance suggestion.

[0114] In steps 401 to 402, the power supply failure cause analysis device selects the failure cause associated with the test environment information corresponding to the third target similarity from the reference failure cause set and determines it as the target failure cause corresponding to the power supply. Then, based on the target failure cause corresponding to the power supply, the device queries and obtains the maintenance suggestion corresponding to the target failure cause in the preset maintenance suggestion database and displays the maintenance suggestion.

[0115] The power supply failure cause analysis device of this embodiment queries and obtains the maintenance suggestions corresponding to the target failure cause in a preset maintenance suggestion database according to the target failure cause corresponding to the power supply, and displays the maintenance suggestions. It can quickly locate the maintenance suggestions corresponding to the power supply failure cause, so that relevant personnel can quickly repair the power supply and improve maintenance efficiency.

[0116] like Figure 5 As shown, this embodiment further provides a device for analyzing causes of poor power supply, which may include:

[0117] The first acquiring unit 1001 is configured to acquire bad test data corresponding to the power supply when the power supply test fails;

[0118] The second acquiring unit 1002 is configured to acquire, from a preset database, various failure reasons bound to the model information and power supply test data associated with the various failure reasons, based on the model information of the power supply;

[0119] A first determining unit 1003 is configured to determine a failure cause data set corresponding to the power supply based on various failure causes and power supply test data associated with the various failure causes;

[0120] The second determining unit 1004 is configured to determine a target failure cause corresponding to the power supply according to the failure test data and the failure cause data set.

[0121] In an optional example, the second determining unit is further configured to:

[0122] Comparing the bad test data with each of the power supply test data in the bad cause data set to obtain a first similarity set;

[0123] Determine the largest first similarity in the first similarity set as a first target similarity;

[0124] A target failure cause corresponding to the power supply is determined in the failure cause data set, where the target failure cause is a failure cause associated with the power supply test data corresponding to the first target similarity.

[0125] In an optional example, the second determining unit is further configured to:

[0126] Collecting target test environment information corresponding to the bad test data;

[0127] According to the failure test data and the target test environment information, a target failure cause corresponding to the power supply is determined in the failure cause data set.

[0128] In an optional example, the second determining unit is further configured to:

[0129] Comparing the bad test data with each of the power supply test data in the bad cause data set to obtain a second similarity set;

[0130] Adding the failure cause corresponding to each second similarity greater than a preset similarity threshold in the second similarity set to the reference failure cause set;

[0131] Comparing the target test environment information with the test environment information associated with each failure cause in the reference failure cause set to obtain a third similarity set;

[0132] Based on the third similarity set, a target failure cause corresponding to the power supply is determined in the reference failure cause set.

[0133] In an optional example, the second determining unit is further configured to:

[0134] For each piece of test environment information, determining a first reference similarity based on the test condition and the target test condition, determining a second reference similarity based on the load condition and the target load condition, and determining a third reference similarity based on the environmental interference and the target environmental interference;

[0135] Calculating a third similarity corresponding to the test environment information based on a preset weight, the first reference similarity, the second reference similarity, and the third reference similarity;

[0136] Until the third similarity corresponding to each piece of the test environment information is calculated, a third similarity set is obtained.

[0137] In an optional example, the second determining unit is further configured to:

[0138] Comparing each third similarity in the third similarity set to determine a third target similarity, where the third target similarity is the largest third similarity in the third similarity set;

[0139] In the reference failure cause set, a failure cause associated with the test environment information corresponding to the third target similarity is selected and determined as a target failure cause corresponding to the power supply.

[0140] In an optional example, the device for analyzing causes of poor power supply further includes a display unit, which is configured to:

[0141] Determining a maintenance suggestion corresponding to the target failure cause according to the target failure cause corresponding to the power supply and a preset maintenance suggestion database;

[0142] The maintenance suggestion is displayed.

[0143] According to the solution of this embodiment, when a power supply fails a test, failure test data corresponding to the power supply is obtained; based on the model information of the power supply, various failure causes and power supply test data associated with the model information are obtained from a preset database; based on the various failure causes and the power supply test data associated with the various failure causes, a failure cause dataset corresponding to the power supply is determined; and based on the failure test data and the failure cause dataset, a target failure cause corresponding to the power supply is determined. By automatically comparing the failure test data corresponding to the power supply with the failure cause dataset to determine the target failure cause corresponding to the power supply, the time-consuming manual analysis of the failure cause of a power supply failure by relevant test personnel is avoided, thereby improving the efficiency of power supply failure cause analysis.

[0144] Accordingly, the embodiment of the present application further provides an electronic device, such as Figure 6 As shown, Figure 6 Schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 1100 includes a processor 1101 having one or more processing cores, a memory 1102 having one or more computer-readable storage media, and a computer program stored in the memory 1102 and executable on the processor. The processor 1101 is electrically connected to the memory 1102. Those skilled in the art will appreciate that the electronic device structure shown in the figure does not constitute a limitation of the electronic device, and may include more or fewer components than shown, or combine certain components, or arrange the components differently.

[0145] The processor 1101 is the control center of the electronic device 1100. It connects the various parts of the entire electronic device 1100 using various interfaces and lines. By running or loading software programs and / or units stored in the memory 1102 and calling data stored in the memory 1102, it executes various functions of the electronic device 1100 and processes data, thereby monitoring the entire electronic device 1100. The processor 1101 can be a processor CPU, a graphics processor GPU, a network processor (NP), etc., and can implement or execute the various methods, steps, and logic blocks disclosed in the embodiments of this application.

[0146] In an embodiment of the present application, the processor 1101 in the electronic device 1100 will load the instructions corresponding to the processes of one or more applications into the memory 1102 in accordance with the following steps, and the processor 1101 will run the applications stored in the memory 1102 to implement various functions. For specific implementation, please refer to the previous embodiments and will not be repeated here.

[0147] Optional, such as Figure 6 As shown, the electronic device 1100 further includes: a touch screen 1103, a radio frequency circuit 1104, an audio circuit 1105, an input unit 1106, and a power supply 1107. Among them, the processor 1101 is electrically connected to the touch screen 1103, the radio frequency circuit 1104, the audio circuit 1105, the input unit 1106, and the power supply 1107 respectively. Those skilled in the art will understand that Figure 6 The electronic device structure shown in the figure does not constitute a limitation to the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0148] The touch display screen 1103 can be used to display a graphical user interface and receive user actions on the operation instructions generated by the graphical user interface. The touch display screen 1103 may include a display panel and a touch panel. Among them, the display panel can be used to display the information input by the user or the information provided to the user and various graphical user interfaces of the electronic device, and these graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof. Optionally, a liquid crystal display (LCD), an organic light emitting diode (OLED, Organic Light-Emitting Diode) and the like can be used to configure the display panel. The touch panel can be used to collect the user's touch operations on or near it (such as the user uses any suitable object or accessory such as a finger, a stylus on the touch panel or near the touch panel) and generate corresponding operation instructions, and the operation instructions execute corresponding programs. Optionally, the touch panel may include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch direction, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into the touch point coordinates, and then sends it to the processor 1101, and can receive the command sent by the processor 1101 and execute it. The touch panel can cover the display panel. When the touch panel detects a touch operation on or near it, it is transmitted to the processor 1101 to determine the type of touch event. Then the processor 1101 provides a corresponding visual output on the display panel according to the type of touch event. In an embodiment of the present application, the touch panel and the display panel can be integrated into the touch display screen 1103 to realize the input and output functions. However, in some embodiments, the touch panel and the touch panel can be used as two independent components to realize the input and output functions. That is, the touch display screen 1103 can also be used as part of the input unit 1106 to realize the input function.

[0149] The radio frequency circuit 1104 may be used to transmit and receive radio frequency signals, so as to establish wireless communication with a network device or other electronic devices through wireless communication, and to transmit and receive signals with the network device or other electronic devices.

[0150] The audio circuit 1105 can be used to provide an audio interface between the user and the electronic device through a speaker and microphone. The audio circuit 1105 can convert the received audio data into an electrical signal and transmit it to the speaker, which then converts it into a sound signal for output. On the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 1105 and converted into audio data. The audio data is then output to the processor 1101 for processing, and then sent to another electronic device through the radio frequency circuit 1104, or the audio data is output to the memory 1102 for further processing. The audio circuit 1105 may also include an earphone jack to provide communication between external headphones and the electronic device.

[0151] The input unit 1106 may be configured to receive input digital, character information, or user feature information (such as fingerprint, iris, or facial information), and to generate keyboard, mouse, joystick, optical, or trackball signal input related to user settings and function control.

[0152] Power supply 1107 is used to supply power to various components of electronic device 1100. Optionally, power supply 1107 can be logically connected to processor 1101 via a power management device, thereby enabling the power management device to manage charging, discharging, and power consumption. Power supply 1107 can also include one or more DC or AC power supplies, recharging devices, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0153] although Figure 6 Not shown, the electronic device 1100 may further include a camera, a sensor, a wireless fidelity module, a Bluetooth module, etc., which will not be described in detail here.

[0154] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0155] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be accomplished by instructions, or by controlling related hardware through instructions. The instructions may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0156] To this end, embodiments of the present application provide a computer-readable storage medium storing multiple computer programs. These computer programs can be loaded by a processor to execute any of the methods for analyzing the cause of a poor power supply provided in the embodiments of the present application. The computer programs can execute the methods for analyzing the cause of a poor power supply. Specific implementations can be found in the previous embodiments and will not be further described here.

[0157] The computer-readable storage medium may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0158] Since the computer program stored in the computer-readable storage medium can execute any of the power supply failure cause analysis methods provided in the embodiments of the present application, the beneficial effects that can be achieved by any of the power supply failure cause analysis methods provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0159] According to one aspect of the present application, a computer program product or computer program is also provided, the computer program product or computer program including computer instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the electronic device to perform the methods provided in various optional implementations of the above embodiments.

[0160] In the above-mentioned embodiments of the power failure cause analysis device, computer-readable storage medium, electronic device, and computer program product, the descriptions of each embodiment have different focuses. For parts not described in detail in a particular embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art will clearly understand that, for the sake of convenience and brevity of description, the specific working processes and beneficial effects of the above-described power failure cause analysis device, computer-readable storage medium, computer program product, electronic device, and their corresponding units can be referred to the description of the power failure cause analysis method in the above-mentioned embodiments, and the details will not be repeated here.

[0161] The above is a detailed introduction to a method, device, equipment, readable storage medium and computer program product for analyzing the cause of poor power supply provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for analyzing the cause of a poor power supply, characterized in that: The method comprises: When the power supply test fails, obtaining bad test data corresponding to the power supply; According to the model information of the power supply, various failure reasons bound to the model information and power supply test data associated with the various failure reasons are acquired in a preset database; Determine a data set of bad causes corresponding to the power supply based on various bad causes and power supply test data associated with the various bad causes; A target failure cause corresponding to the power supply is determined according to the failure test data and the failure cause data set.

2. The method according to claim 1, characterized in that Determining the target failure cause corresponding to the power supply according to the failure data and the failure cause data set includes: Compare the bad test data with each of the power supply test data in the bad cause data set to obtain a first similarity set; Determine the largest first similarity in the first similarity set as a first target similarity; A target bad cause corresponding to the power supply is determined in the bad cause data set, where the target bad cause is a bad cause associated with the power supply test data corresponding to the first target similarity.

3. The method according to claim 1, characterized in that Determining the target failure cause corresponding to the power supply according to the failure data and the failure cause data set includes: Collecting target test environment information corresponding to the bad test data; According to the bad test data and the target test environment information, a target bad cause corresponding to the power supply is determined in the bad cause data set.

4. The method according to claim 3, characterized in that The bad cause data set also includes test environment information associated with various bad causes, and determining the target bad cause corresponding to the power supply in the bad cause data set according to the bad test data and the target test environment information includes: Compare the bad test data with each of the power supply test data in the bad cause data set to obtain a second similarity set; Adding the failure cause corresponding to each second similarity greater than a preset similarity threshold in the second similarity set to the reference failure cause set; Compare the test environment information associated with each bad cause in the reference bad cause set of the target test environment information to obtain a third similarity set; Based on the third similarity set, a target failure cause corresponding to the power source is determined in the reference failure cause set.

5. The method according to claim 4, characterized in that The test environment information includes test conditions, load conditions and environmental interference, and the target test environment information includes target test conditions, target load conditions and target environmental interference; The step of comparing each of the test environment information in the bad cause data set of the target test environment information to obtain a third similarity set includes: For each of the test environment information, determine a first reference similarity based on the test condition and the target test condition, determine a second reference similarity based on the load condition and the target load condition, and determine a third reference similarity based on the environmental interference and the target environmental interference; Calculating a third similarity corresponding to the test environment information based on a preset weight, the first reference similarity, the second reference similarity, and the third reference similarity; Until the third similarity corresponding to each of the test environment information is calculated, a third similarity set is obtained.

6. The method according to claim 4, characterized in that The determining, based on the third similarity set, a target failure cause corresponding to the power supply in the reference failure cause set includes: Compare each third similarity in the third similarity set to determine a third target similarity, wherein the third target similarity is the largest third similarity in the third similarity set; In the reference failure cause set, a failure cause associated with the test environment information corresponding to the third target similarity is selected and determined as a target failure cause corresponding to the power supply.

7. The method according to any one of claims 1 to 6, characterized in that: After determining the target failure cause corresponding to the power supply, the method further includes: Determining a maintenance suggestion corresponding to the target failure cause according to the target failure cause corresponding to the power supply and a preset maintenance suggestion database; The maintenance suggestion is displayed.

8. A device for analyzing the causes of poor power supply, characterized in that: The device for analyzing the cause of poor power supply comprises: A first acquisition unit, used for acquiring bad test data corresponding to the power supply when the power supply test fails; A second acquisition unit is used to acquire various fault reasons bound to the model information and power supply test data associated with the various fault reasons from a preset database according to the model information of the power supply; A first determining unit, configured to determine a bad cause data set corresponding to the power supply based on various bad causes and power supply test data associated with the various bad causes; The second determining unit is used to determine a target failure cause corresponding to the power supply according to the failure test data and the failure cause data set.

9. An electronic device, characterized in that: It comprises a processor and a memory, wherein the memory stores a plurality of computer programs; the processor loads the computer program from the memory to execute the method for analyzing the cause of poor power supply as claimed in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a plurality of computer programs, and the computer programs are suitable for being loaded by a processor to execute the method for analyzing causes of poor power supply according to any one of claims 1 to 7.

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