Optical module packaging control system

Abstract

The invention discloses an optical module packaging control system. The system is characterized by comprising a sensor module; the data acquisition module comprises a data acquisition unit and a data transmission unit; the central processing module comprises a data analysis unit and a state monitoring unit; an optimization feedback module; the user interface comprises a visual monitoring panel and a remote control unit; and the data storage module is used for storing all sensor data and early warning information in a database and supporting subsequent fault analysis and performance evaluation. Sensor data is deeply analyzed through a data analysis algorithm, the optimization degree in the current packaging process is judged, the system can dynamically respond to changes of various environment variables in the packaging process through real-time parameter adjustment, key packaging parameters are automatically optimized, and the packaging efficiency is improved. The quality problem occurring in the packaging process can be effectively reduced, and the precision of the packaging process is improved, so that the high quality of the optical module is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module packaging, and in particular to an optical module packaging control system. Background Art

[0002] With the continuous development of information technology, optical communication technology, as the core technology of high-speed data transmission, has been widely used in data centers, optical fiber communication networks and various high-speed data exchange systems. As a key component in the optical communication system, the optical module is responsible for converting electrical signals into optical signals or converting optical signals into electrical signals. Therefore, its packaging quality directly affects the performance and stability of the optical module.

[0003] During the optical module packaging process, multiple factors such as environmental conditions such as temperature, humidity, pressure, and external forces applied during the packaging process have a significant impact on the quality of the final packaging. In order to achieve efficient and accurate optical module packaging, how to monitor various parameters in the packaging process in real time, analyze data and make optimization adjustments has become the key to improving packaging yield and production efficiency. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention provides an optical module packaging control system, including:

[0007] Sensor module: collects various types of information through sensors;

[0008] Data acquisition module: includes data acquisition unit and data transmission unit, collects data through various sensors, performs preliminary processing, and transmits data through data transmission interface;

[0009] Central processing module: including data analysis unit and status monitoring unit, which analyzes sensor data through data analysis algorithm and judges the current optimization degree;

[0010] Optimization feedback module: adjust the packaging parameters according to the analysis results;

[0011] User interface: including visual monitoring panel and remote control unit;

[0012] Data storage module: stores all sensor data and warning information in the database to support subsequent fault analysis and performance evaluation.

[0013] As a preferred solution of the optical module packaging control system described in the present invention, the data analysis algorithm is specifically as follows:

[0014]

[0015] Where: F(x) represents the analysis result, reflecting the optimization degree of the packaging process; t0, t f The time range for analysis, start time and end time; -λt is the decay function, which simulates the decay of the parameter over time, λ is the decay constant, which reflects the rate of change of the parameter; S(t) is the sum of all monitored parameters; I TH is the sum of temperature and humidity within a given time range.

[0016] As a preferred solution of the optical module packaging control system described in the present invention, the specific algorithm of S(t) is as follows:

[0017]

[0018] Where: P i (t) is the real-time measurement value of the i-th parameter; R i (t) is the performance response value of the i-th parameter; D i (t) is the fluctuation of the i-th parameter; k i It is the adjustment coefficient of a specific parameter, which is used to control the influence on each parameter.

[0019] As a preferred solution of the optical module packaging control system described in the present invention, wherein: TH The specific algorithm is as follows:

[0020]

[0021] Where: t0 and t f is the time range of the analysis, the start time and the end time; T(t) is the temperature measurement value at time t; H(t) is the humidity measurement value at time t.

[0022] As a preferred solution of the optical module packaging control system described in the present invention, the specific value range of F(x) is as follows:

[0023] F(x)≤0.1F max :The packaging efficiency is extremely low, and the parameters and processes need to be optimized;

[0024] 0.1F max <F(x)≤0.4Fmax : The packaging efficiency is low and some key parameters need to be adjusted;

[0025] 0.4F max <F(x)≤0.7F max : The packaging efficiency is medium, but there is room for optimization;

[0026] 0.7F max <F(x)≤0.9F max : High packaging efficiency and stable state;

[0027] F(x)>0.9F max :The packaging efficiency is extremely high and the production yield is optimal.

[0028] As a preferred solution of the optical module packaging control system of the present invention, the packaging state adjustment rule is as follows:

[0029] The packaging efficiency is extremely low: reset the parameters, especially those directly related to packaging quality and time, and inspect and repair the equipment;

[0030] Low packaging efficiency: Strengthen the monitoring and adjustment of environmental conditions, gradually adjust key parameters, and confirm the optimization effect through real-time feedback;

[0031] Medium packaging efficiency: Enhance the stability of the environment and make subtle adjustments to related parameters to ensure that they are always maintained at the optimal level;

[0032] High packaging efficiency: maintain current parameters, avoid unnecessary adjustments, and ensure stability;

[0033] The packaging efficiency is extremely high: continue to track data feedback to ensure that the current optimization effect remains stable.

[0034] As a preferred solution of the optical module packaging control system described in the present invention, the visual monitoring panel provides a graphical display of real-time data, displays the status of each sensor, historical data trends, and allows operators to manually adjust and set through the interface to view the system status.

[0035] In a second aspect, an embodiment of the present invention further provides an optical module packaging control method, comprising the following steps:

[0036] Sensor selection and layout: Select appropriate sensors and place them at key locations of packaging equipment to ensure comprehensive monitoring of all parameters;

[0037] Data collection and transmission: record sensor data in real time and transmit the data through the data transmission interface;

[0038] Data analysis: The collected data is analyzed by data analysis algorithms, and the current optimization degree is judged based on the analysis results;

[0039] Optimization feedback: According to the data analysis results, the packaging parameters are automatically adjusted to optimize the packaging process;

[0040] Monitoring status display: Displays real-time data and trend charts of various monitoring parameters, allowing operators to grasp the packaging status in a timely manner.

[0041] In a third aspect, an embodiment of the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein: when the computer program is executed by the processor, an optical module packaging control system as described in the first aspect of the present invention is executed.

[0042] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, an optical module packaging control system as described in the first aspect of the present invention is executed.

[0043] Beneficial effects of the present invention:

[0044] The present invention conducts in-depth analysis of sensor data through data analysis algorithms to determine the degree of optimization in the current packaging process. Through real-time parameter adjustment, the system can dynamically respond to changes in various environmental variables during the packaging process and automatically optimize key packaging parameters. This can effectively reduce quality problems that occur during the packaging process and improve the accuracy of the packaging process, thereby ensuring the high quality of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0046] Figure 1 This is a system architecture diagram of an optical module packaging control system proposed by the present invention;

[0047] Figure 2 This is a specific value range division diagram for a data analysis algorithm in an optical module packaging control system;

[0048] Figure 3 The present invention provides a method flow chart of an optical module packaging control method. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0050] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0051] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0052] Reference Figure 1-3 The present invention provides an optical module packaging control system, comprising:

[0053] Sensor module: collects various information through sensors, including temperature sensors, humidity sensors, pressure sensors, light intensity sensors, vibration sensors, etc.

[0054] Data acquisition module: includes data acquisition unit and data transmission unit, collects data through various sensors, performs preliminary processing, and transmits data through data transmission interface;

[0055] Central processing module: including data analysis unit and status monitoring unit, which analyzes sensor data through data analysis algorithm and judges the current optimization degree;

[0056] Optimization feedback module: adjust the packaging parameters according to the analysis results;

[0057] User interface: including visual monitoring panel and remote control unit;

[0058] Data storage module: stores all sensor data and warning information in the database to support subsequent fault analysis and performance evaluation.

[0059] The data analysis algorithm is as follows:

[0060]

[0061] Where: F(x) represents the analysis result, reflecting the optimization degree of the packaging process; t0, t f The time range for analysis, start time and end time; -λtis the decay function, which simulates the decay of the parameter over time, λ is the decay constant, which reflects the rate of change of the parameter; S(t) is the sum of all monitored parameters, which reflects the overall performance at time t; I TH The sum of temperature and humidity over a given time frame, providing a basis for normalization.

[0062] Furthermore, the specific algorithm of S(t) is as follows:

[0063]

[0064] Where: P i (t) is the real-time measurement value of the i-th parameter; R i (t) is the performance response value of the i-th parameter; D i (t) is the fluctuation of the i-th parameter; k i It is the adjustment coefficient of a specific parameter, which is used to control the influence on each parameter.

[0065] Furthermore, I TH The specific algorithm is as follows:

[0066]

[0067] Where: t0 and t f is the time range of the analysis, the start time and the end time; T(t) is the temperature measurement value at time t; H(t) is the humidity measurement value at time t.

[0068] Furthermore, the specific range of F(x) is as follows:

[0069] F(x)≤0.1F max :The packaging efficiency is extremely low, and the parameters and processes need to be optimized;

[0070] 0.1F max <F(x)≤0.4F max : The packaging efficiency is low and some key parameters need to be adjusted;

[0071] 0.4F max <F(x)≤0.7F max : The packaging efficiency is medium, but there is room for optimization;

[0072] 0.7F max <F(x)≤0.9F max : High packaging efficiency and stable state;

[0073] F(x)>0.9F max :The packaging efficiency is extremely high and the production yield is optimal. By calculating F(x) in real time, the packaging status is judged and adjusted according to its value range.

[0074] Furthermore, the encapsulation status adjustment rules are as follows:

[0075] The packaging efficiency is extremely low: reset the parameters, especially those directly related to packaging quality and time, and inspect and repair the equipment;

[0076] Low packaging efficiency: Strengthen the monitoring and adjustment of environmental conditions, gradually adjust key parameters, and confirm the optimization effect through real-time feedback;

[0077] Medium packaging efficiency: Enhance the stability of the environment and make subtle adjustments to related parameters to ensure that they are always maintained at the optimal level;

[0078] High packaging efficiency: maintain current parameters, avoid unnecessary adjustments, and ensure stability;

[0079] The packaging efficiency is extremely high: continue to track data feedback to ensure that the current optimization effect is sustained and stable. The key indicators in the packaging process include temperature, humidity, pressure, light intensity, etc. Among them, temperature is an important factor affecting the packaging process of optical modules. Too high or too low may cause material deformation or poor packaging; humidity control is crucial to packaging quality, especially when using moisture-sensitive materials. Humidity fluctuations may cause unstable material performance; for operations that require pressure during the packaging process, the pressure range must be strictly controlled. Excessive or insufficient pressure will affect the packaging effect; monitoring the light intensity during the packaging process can reflect the performance of the optical module and must be guaranteed to be within the specified range.

[0080] Furthermore, the visual monitoring panel provides a graphical display of real-time data, showing the status of each sensor and historical data trends, and allows operators to make manual adjustments and settings through the interface and view the system status, making it easier for staff to view and operate the system status more intuitively.

[0081] This embodiment also provides an optical module packaging control method, including the following steps:

[0082] Sensor selection and layout: Select appropriate sensors and place them in key locations of packaging equipment to ensure comprehensive monitoring of various parameters, including temperature, humidity, pressure, time, light intensity, etc.

[0083] Data collection and transmission: record sensor data in real time and transmit the data through the data transmission interface;

[0084] Data analysis: The collected data is analyzed by data analysis algorithms, and the current optimization degree is judged based on the analysis results;

[0085] Optimization feedback: According to the data analysis results, the packaging parameters are automatically adjusted to optimize the packaging process;

[0086] Monitoring status display: Displays real-time data and trend charts of various monitoring parameters, allowing operators to grasp the packaging status in a timely manner.

[0087] This embodiment also provides a computer device, which is applicable to a case of an optical module packaging control system, including: a memory and a processor; the memory is used to store computer executable instructions, and the processor is used to execute computer executable instructions to implement an optical module packaging control system as proposed in the above embodiment.

[0088] The computer device may be a terminal, and the computer device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, an operator network, NFC (near field communication) or other technologies. The display screen of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device may be a touch layer covering the display screen, or a key, trackball or touchpad provided on the housing of the computer device, or an external keyboard, touchpad or mouse, etc.

[0089] This embodiment also provides a storage medium on which a computer program is stored. When the program is executed by a processor, an optical module packaging control system as proposed in the above embodiment is implemented; the storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (Static Random Access Memory, referred to as SRAM), electrically erasable programmable read-only memory (Electrically Erasable Programmable Read-Only Memory, referred to as EEPROM), erasable programmable read-only memory (Erasable Programmable Read Only Memory, referred to as EPROM), programmable read-only memory (Programmable Red-Only Memory, referred to as PROM), read-only memory (Read-Only Memory, referred to as ROM), magnetic storage, flash memory, magnetic disk or optical disk.

[0090] In summary, the present invention uses a data analysis algorithm to conduct in-depth analysis of sensor data to determine the degree of optimization in the current packaging process. Through real-time parameter adjustment, the system can dynamically respond to changes in various environmental variables during the packaging process and automatically optimize key packaging parameters. It can effectively reduce quality problems that occur during the packaging process and improve the accuracy of the packaging process, thereby ensuring the high quality of the optical module.

[0091] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An optical module packaging control system, characterized in that: include: Sensor module: collects various information through sensors; Data acquisition module: includes data acquisition unit and data transmission unit, collects data through various sensors, performs preliminary processing, and transmits data through data transmission interface; Central processing module: including data analysis unit and status monitoring unit, which analyzes sensor data through data analysis algorithm and judges the current optimization degree; Optimization feedback module: adjust the packaging parameters according to the analysis results; User interface: including visual monitoring panel and remote control unit; Data storage module: stores all sensor data and warning information in the database to support subsequent fault analysis and performance evaluation.

2. The optical module packaging control system according to claim 1, characterized in that: The data analysis algorithm is as follows: Where: F(x) represents the analysis result, reflecting the optimization degree of the packaging process; t0, t f The time range for analysis, start time and end time; -λt is the decay function, which simulates the decay of the parameter over time, λ is the decay constant, which reflects the rate of change of the parameter; S(t) is the sum of all monitored parameters; I TH is the sum of temperature and humidity within a given time range.

3. The optical module packaging control system according to claim 2, characterized in that: The specific algorithm of S(t) is as follows: Where: P i (t) is the real-time measurement value of the i-th parameter; R i (t) is the performance response value of the i-th parameter; D i (t) is the fluctuation of the i-th parameter; k i It is the adjustment coefficient of a specific parameter, which is used to control the influence on each parameter.

4. The optical module packaging control system according to claim 3, characterized in that: I TH The specific algorithm is as follows: Where: t0 and t f is the time range of the analysis, the start time and the end time; T(t) is the temperature measurement value at time t; H(t) is the humidity measurement value at time t.

5. The optical module packaging control system according to claim 4, characterized in that: The specific value range of F(x) is as follows: F(x)≤0.1F max :The packaging efficiency is extremely low, and the parameters and processes need to be optimized; 0.1F max <F(x)≤0.4F max : The packaging efficiency is low and some key parameters need to be adjusted; 0.4F max <F(x)≤0.7F max : The packaging efficiency is medium, but there is room for optimization; 0.7F max <F(x)≤0.9F max : High packaging efficiency and stable state; F(x)>0.9F max :The packaging efficiency is extremely high and the production yield is optimal.

6. The optical module packaging control system according to claim 5, characterized in that: The encapsulation status adjustment rules are as follows: The packaging efficiency is extremely low: reset the parameters, especially those directly related to packaging quality and time, and inspect and repair the equipment; Low packaging efficiency: Strengthen the monitoring and adjustment of environmental conditions, gradually adjust key parameters, and confirm the optimization effect through real-time feedback; Medium packaging efficiency: Enhance the stability of the environment and make subtle adjustments to related parameters to ensure that they are always maintained at the optimal level; High packaging efficiency: maintain current parameters, avoid unnecessary adjustments, and ensure stability; The packaging efficiency is extremely high: continue to track data feedback to ensure that the current optimization effect remains stable.

7. The optical module packaging control system according to claim 6, characterized in that: The visual monitoring panel provides a graphical display of real-time data, displays the status of each sensor, historical data trends, and allows operators to manually adjust and set through the interface and view the system status.

8. An optical module packaging control method, based on an optical module packaging control system according to any one of claims 1 to 7, characterized in that: The steps include: Sensor selection and layout: Select appropriate sensors and place them at key locations of packaging equipment to ensure comprehensive monitoring of all parameters; Data collection and transmission: record sensor data in real time and transmit the data through the data transmission interface; Data analysis: The collected data is analyzed by data analysis algorithms, and the current optimization degree is judged based on the analysis results; Optimization feedback: According to the data analysis results, the packaging parameters are automatically adjusted to optimize the packaging process; Monitoring status display: Displays real-time data and trend charts of various monitoring parameters, allowing operators to grasp the packaging status in a timely manner.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the optical module packaging control system according to any one of claims 1 to 7 is executed.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, an optical module packaging control system as described in any one of claims 1-7 is implemented.

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