Airborne electronic module sealing case and composite heat dissipation method thereof

Abstract

The invention discloses an airborne electronic module sealing case and a composite heat dissipation method thereof. The sealed case comprises a mounting frame, an upper fan cover, a lower mounting frame, a front cold plate, a rear cold plate, a left side plate and a right side plate which are mutually connected to form a sealed case body, and a plurality of electronic modules are arranged in the sealed case body; the pipeline assembly and the front cooling plate are sequentially communicated from the left side to the right side of the rear cooling plate, from the right side to the left side to form a liquid cooling case channel, are sequentially communicated from the rear cooling plate, the electronic module and the front cooling plate to form a liquid cooling module channel, and are sequentially communicated from the lower ends to the upper ends of the front cooling plate and the rear cooling plate to the fan cover to form an air cooling channel. According to the composite heat dissipation method, the airborne electronic module sealing case is adopted. The method has the beneficial effects that two working modes of normal liquid supply and liquid cut-off are considered; the heat dissipation efficiency is high; the structure is compact and the weight is light; the environment adaptability is high.

Description

Technical Field

[0001] The present application belongs to the technical field of heat dissipation of airborne electronic equipment, and specifically relates to a sealed chassis for an airborne electronic module and a composite heat dissipation method thereof. Background Art

[0002] As the environment in which airborne electronic equipment is used becomes increasingly harsh, its development trend towards high efficiency, compactness, and lightweight becomes more and more obvious. The total power consumption and heat flux density of LRM modules and chassis are increasing, resulting in the continuous improvement of the weight, function, performance, and anti-corrosion index of current airborne electronic equipment. Therefore, efficient heat dissipation technology and environmental protection technology have become one of the key technologies affecting the reliability of airborne electronic equipment. At present, the heat dissipation methods of integrated electronic equipment are mainly divided into two categories: liquid cooling and air cooling. Liquid cooling and air cooling can be divided into two types according to the mode of action: through-type and conduction. Through-type liquid cooling is to directly introduce the coolant into the interior of the electronic module to take away the heat of the device; while conduction liquid cooling is to first transfer the heat of the electronic module to the chassis cold plate, and then the coolant in the chassis cold plate takes it away, that is, the coolant does not enter the interior of the electronic module. Through-type air cooling uses cold air to blow directly onto the outer surface of the module to take away the heat from the components inside the electronic module; conduction air cooling is that the electronic module transfers heat to the chassis cold plate through the cold plate ribs, and then the heat is discharged by the cooling air acting on the chassis cold plate. The chassis cold plate only serves as a carrier for the heat dissipation of the electronic module.

[0003] Different heat dissipation technologies have certain advantages in different application scenarios, but the scenarios that electronic equipment currently needs to deal with are complex. Electronic equipment is required to have excellent functions and performance to meet various working conditions such as combat readiness and emergency, and to be resistant to harsh environments such as salt spray, mold, humidity, dust, rain, etc. Therefore, a single heat dissipation method is no longer sufficient for the current stage of airborne electronic equipment applications with high integration, light weight, high heat consumption and strong corrosion resistance. Summary of the invention

[0004] The purpose of this application is to provide a sealed chassis for airborne electronic modules and a composite heat dissipation method thereof, which improves the safety, reliability and environmental adaptability of electronic equipment modules and chassis through the coupling of multiple heat dissipation technologies, has excellent anti-corrosion ability and heat dissipation efficiency, and solves the problem that the conventional single heat dissipation method in the field of heat dissipation of airborne electronic equipment cannot meet the application and high reliability of multiple scenarios.

[0005] The purpose of this application is achieved through the following technical solutions:

[0006] A sealed chassis for airborne electronic modules comprises an installation frame, an upper fan cover, a lower installation frame, a front cold plate, a rear cold plate, a left plate and a right plate which are connected to each other to form a sealed box body, wherein a plurality of electronic modules are arranged in the sealed box body; a liquid cooling chassis channel is formed along the left side to the right side of the rear cold plate, a pipeline assembly, and the right side to the left side of the front cold plate; a liquid cooling module channel is formed along the rear cold plate, the electronic module and the front cold plate; and an air cooling channel is formed along the lower end to the upper end of the front cold plate and the rear cold plate respectively to the fan cover.

[0007] Furthermore, the joint surfaces of the fan cover, mounting frame, front cold plate, rear cold plate, left plate and right plate connected to each other are provided with sealing strips, the bottom opening end of the mounting frame is connected with a bottom cover plate, an electrical interconnection functional area is provided in the mounting frame, and a sealing strip is provided on the connecting plane of the bottom opening end of the mounting frame.

[0008] Furthermore, a reinforcing plate is provided between the front cold plate and the rear cold plate, and a fan electrical connector socket is provided on the reinforcing plate.

[0009] Furthermore, the fan hood includes a fan hood cover plate and a fan hood mouth frame, the fan hood cover plate is arranged at the top opening end of the fan hood mouth frame, a number of fans located in the fan hood mouth frame are arranged on the fan hood cover plate, recessed fan hood handles are arranged on the left and right sides of the fan hood mouth frame, fan hood drainage inlets opposite to the air cooling channel are arranged on the front and rear sides of the fan hood mouth frame, a fan electrical connector plug is arranged on the bottom plate of the fan hood mouth frame, and the fan electrical connector socket is electrically connected to the fan electrical connector plug.

[0010] Furthermore, the front cold plate and the rear cold plate are divided into three layers of inner, middle and outer structures, the outer layer is an air cooling channel, the middle layer is a liquid cooling chassis channel, and the inner layer is provided with a module slot, and the electronic module is inserted into the module slot.

[0011] Furthermore, a liquid cooling outlet connector is provided on the left side of the front cold plate, a liquid cooling inlet connector is provided on the left side of the rear cold plate, a pipeline assembly is provided between the liquid cooling port on the right side of the front cold plate and the liquid cooling port on the right side of the rear cold plate, and a plurality of cold plate flow channels are provided in the front cold plate and the rear cold plate.

[0012] Furthermore, the outer bottom of the front cold plate and the rear cold plate are provided with an air cooling inlet, the top of the front cold plate and the rear cold plate are provided with an air cooling outlet, the front cold plate and the rear cold plate are provided with a cold plate air duct, the cold plate air duct is connected between the air cooling inlet and the air cooling outlet, and the cold plate air duct is provided with heat dissipation teeth.

[0013] Furthermore, the front cold plate and the rear cold plate are provided with liquid cooling adapter blocks, the liquid cooling adapter blocks are connected to the liquid cooling chassis channel, and the liquid cooling adapter blocks are provided with a plurality of module liquid cooling connectors, and the module liquid cooling connectors are relatively connected to the electronic modules.

[0014] A composite heat dissipation method for an airborne electronic module sealed chassis adopts the above-mentioned airborne electronic module sealed chassis: when an external liquid cooling source is in a normal liquid supply working state, on the one hand, the cooling liquid flows through the inside of the electronic module to circulate and discharge the heat of the electronic module in a through-liquid cooling and heat dissipation manner; on the other hand, the cooling liquid circulates and discharges the heat transferred from the electronic module to the cold plate in a conductive liquid cooling and heat dissipation manner; when the external liquid cooling source is in an emergency liquid cut-off working state, the cooling air circulates and discharges the heat transferred from the electronic module to the cold plate in a conductive air cooling and heat dissipation manner.

[0015] Furthermore, when the external liquid cooling source is in a normal liquid supply working state, when the internal temperature of the module is high, air cooling and liquid cooling are performed simultaneously.

[0016] Beneficial effects of this application:

[0017] (1) Taking into account both normal liquid supply and liquid cut-off working modes. This application adopts a three-layer cold plate design with a replaceable liquid cooling adapter block, so that the chassis's heat-conducting carrier has both liquid cooling channels and air cooling channels. Under normal liquid supply conditions, the two liquid cooling heat dissipation methods of direct penetration and indirect conduction can be used to meet the full power and full load operation of the chassis, ensuring that the functions and performance of the chassis operate normally and stably; in the event of an emergency liquid cut-off, the indirect conduction air cooling heat dissipation method can be used to meet the emergency working state of the chassis, ensuring that the basic emergency functions of the chassis operate normally without being disconnected, thereby ensuring flight safety.

[0018] (2) High heat dissipation efficiency. This application can not only perform liquid cooling or air cooling separately, but also reduce the heat dissipation energy consumption of the chassis as much as possible while meeting the heat dissipation requirements; when the heat dissipation efficiency needs to be increased, liquid cooling and air cooling can be performed simultaneously, and the combined operation has a better heat dissipation effect.

[0019] (3) Compact structure and light weight. The present application can reasonably select a liquid cooling adapter block according to the heat consumption of the LRM module. For LRM modules with high heat consumption and complete functions, liquid cooling is selected. For LRM modules with general heat consumption and basic functions, conductive liquid cooling is selected. This makes the chassis more compact and lighter in weight while meeting the heat dissipation requirements, thus meeting the requirements for miniaturization and lightweight of airborne electronic equipment.

[0020] (4) Strong environmental adaptability. The present application places the cooling fan on the top of the chassis. The entire cooling channel is located outside the two cold plates of the chassis, extending from the bottom to the top to completely cover the heat-conducting carrier of the chassis. The joint surfaces of each component structure of the chassis are provided with sealing strips, thereby ensuring the sealing of the inside of the chassis and ensuring that the external environment does not directly contact the LRM module and electronic components inside the chassis. It has good waterproof, dustproof, salt spray and corrosion resistance, which improves the environmental adaptability and reliability of airborne electronic equipment.

[0021] The aforementioned main scheme of the present application and its further options can be freely combined to form multiple schemes, all of which are schemes that can be adopted and claimed for protection in the present application; and in the present application, (non-conflicting options) can also be freely combined with each other and with other options. After understanding the scheme of the present application, those skilled in the art can understand that there are many combinations based on the prior art and common knowledge, all of which are technical schemes to be protected by the present application, and they are not exhaustively listed here. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the axial side of this application.

[0023] Figure 2 This is the explosion diagram of this application.

[0024] Figure 3 This is a schematic diagram of the liquid cooling heat dissipation flow field of the chassis in this application.

[0025] Figure 4 This is a schematic diagram of the fan cover explosion for this application.

[0026] Figure 5 This is a partial cutaway schematic diagram of the fan cover of this application.

[0027] Figure 6 This is a schematic diagram of the air-cooled heat dissipation flow field of the chassis in this application.

[0028] Figure 7 This is a schematic diagram of the cold plate axis side before this application.

[0029] Figure 8 This is a partial cross-sectional schematic diagram of the front cold plate of this application.

[0030] In the figure: fan cover -1, installation frame -2, front cold plate -3, rear cold plate -4, left plate -5, right plate -6, pipeline assembly -7, reinforcement plate -8, bottom cover plate -9, electronic module -10, fan cover cover plate -101, fan cover frame -102, fan cover handle -103, fan -104, fan cover drainage inlet -105, fan electrical connector plug -106, sealing groove -107, liquid cooling outlet connector -301, air cooling inlet -302, air cooling outlet -303, cold plate air duct -304, cold plate flow channel -305, liquid cooling adapter block -306, module liquid cooling connector -307, module slot -308, heat dissipation tooth -309, liquid cooling inlet connector -401. DETAILED DESCRIPTION

[0031] The following non-limiting examples are provided to illustrate the present application.

[0032] Example 1

[0033] refer to Figures 1 to 8As shown, an airborne electronic module sealed chassis includes a fan cover 1, a mounting frame 2, a front cold plate 3, a rear cold plate 4, a left side plate 5, a right side plate 6, a pipeline assembly 7, a reinforcement plate 8, a bottom cover plate 9 and an electronic module 10 (LRM module).

[0034] The upper fan cover 1, the lower mounting frame 2, the front cold plate 3, the rear cold plate 4, the left side plate 5 and the right side plate 6 are interconnected to form a sealed box body with a rectangular structure, which can be fixed by screws. A plurality of electronic modules 10 are arranged in the sealed box body.

[0035] Along the left side to the right side of the rear cold plate 4, the pipeline assembly 7, and the right side to the left side of the front cold plate 3 are connected in sequence to form a liquid-cooled chassis channel, and the liquid-cooled chassis channel realizes conductive liquid-cooled heat dissipation. Along the rear cold plate 4, the electronic module 10 to the front cold plate 3 are connected in sequence to form a liquid-cooled module channel, and the liquid-cooled module channel realizes through-type liquid-cooled heat dissipation. Along the lower end to the upper end of the front cold plate 3 and the rear cold plate 4, they converge to the fan cover 1 and are connected in sequence to form an air-cooled channel, and the air-cooled channel realizes conductive air-cooled heat dissipation. Therefore, the chassis of the present application has multiple operating modes to meet multi-scenario applications.

[0036] The joint surfaces where the fan cover 1, the mounting frame 2, the front cold plate 3, the rear cold plate 4, the left side plate 5 and the right side plate 6 are connected to each other are provided with sealing strips, which seal the joint surfaces at the joints to ensure that the joint gaps of the chassis have good waterproof sealing properties and can cope with the harsh environmental conditions in the airborne platform.

[0037] The bottom open end of the installation frame 2 is embedded with a bottom cover plate 9 by screws, and an electrical interconnection functional area is provided in the installation frame 2, that is, all wiring harnesses and printed circuit board components inside the chassis are sealed inside. A sealing strip is provided on the connecting plane of the bottom open end of the installation frame 2 to seal the installation frame 2 and the bottom cover plate 9 to ensure the sealing of the installation frame 2 itself.

[0038] The front cold plate 3 and the rear cold plate 4 are placed symmetrically, and a reinforcing plate 8 is provided between the middle of the front cold plate 3 and the middle of the rear cold plate 4. A floating fan electrical connector socket is provided on the top of the reinforcing plate 8, which not only improves the rigidity and strength of the cold plate and makes the chassis have better vibration resistance, but also is paired with the fan electrical connector plug 106 on the bottom plate of the fan cover frame 102, so that the chassis fan cover 1 also has a quick blind plug function.

[0039] The fan cover 1 is a concave structure with an open top, including a fan cover plate 101, a fan cover frame 102, a fan cover handle 103, a fan 104, a fan cover drainage air inlet 105, a fan electrical connector plug 106 and a sealing groove 107. The fan cover plate 101 is fixed to the top open end of the fan cover frame 102 by screws, and a plurality of fans 104 located in the fan cover frame 102 are arranged side by side on the fan cover plate 101. A blind plug fan electrical connector plug 106 is provided on the bottom plate of the fan cover frame 102, and the fan electrical connector socket is electrically connected to the fan electrical connector plug 106.

[0040] The left and right sides of the fan cover frame 102 are provided with recessed fan cover handles 103, which are not only convenient for holding the fan cover 1 for quick lifting and installation operations, but also provide a gripping point for the chassis, without the need for additional handles, saving space and making the chassis structure more compact. The front and rear sides of the fan cover frame 102 are provided with sealing grooves 107 and a fan cover drainage air inlet 105 opposite to the air cooling channel, to ensure the waterproof performance of the fan cover 1 and the chassis installation surface, and to ensure that when the working water vapor of the fan passes through the fan cover drainage air inlet 105, the installation gap will not cause liquid to penetrate into the box due to the siphon phenomenon.

[0041] The front cold plate 3 and the rear cold plate 4 have the same structural form. The front cold plate 3 and the rear cold plate 4 are divided into three layers: inner, middle and outer. The outer layer is an air cooling channel, the middle layer is a liquid cooling chassis channel, and the inner layer is provided with a module slot 308. The electronic module 10 is inserted into the module slot 308 to fix the LRM module. At the same time, the slot structure transfers the heat of the LRM module to the cold plate carrier.

[0042] A liquid cooling outlet connector 301 is provided on the left side of the front cold plate 3, and a liquid cooling inlet connector 401 is provided on the left side of the rear cold plate 4, for connecting an external liquid cooling liquid supply device. A pipe assembly 7 is provided between the liquid cooling port on the right side of the front cold plate 3 and the liquid cooling port on the right side of the rear cold plate 4, and the pipe assembly 7 is located at the right side plate 6 to achieve a connection transition.

[0043] A plurality of cold plate flow channels 305 are provided in the front cold plate 3 and the rear cold plate 4. The cold plate flow channels 305 are connected between the liquid cooling connector and the liquid cooling port, that is, the middle layer is provided with cold plate flow channels 305 that pass through the liquid cooling ports on both sides of the cold plate, thereby forming a sealed chassis with circulating liquid cooling. The middle layer cold plate flow channels 305 can be set in series or in parallel according to the flow resistance requirements of the chassis.

[0044] The external coolant enters from the liquid cooling inlet connector 401 of the rear cold plate 4, circulates in the cold plate flow channel 305 inside the rear cold plate 4, and then enters the cold plate flow channel 305 inside the front cold plate 3 through the pipe assembly 7 to circulate, thereby forming a complete circulating liquid-cooled sealed chassis.

[0045] The front cold plate 3 and the rear cold plate 4 are provided with replaceable liquid cooling adapter blocks 306, which are connected to the liquid cooling chassis channel. The liquid cooling adapter blocks 306 can be reasonably selected for connector pairing according to the heat consumption of the LRM module. The liquid cooling adapter blocks 306 are provided with a plurality of module liquid cooling connectors 307, which are relatively connected to the electronic module 10. The through-liquid cooling heat dissipation method can be selected for the LRM module with high heat consumption, and the conduction liquid cooling heat dissipation method can be selected for the LRM module with average heat consumption.

[0046] The coolant in the cold plate is introduced into the LRM module for internal circulation through the module liquid cooling connector 307, and the heat inside the module with high heat consumption is directly taken out by liquid cooling, so that the chassis can meet the heat dissipation requirements while the equipment structure size is more compact and the weight is lighter.

[0047] The outer bottom of the front cold plate 3 and the rear cold plate 4 are both provided with a plurality of air cooling inlets 302, the top of the front cold plate 3 and the rear cold plate 4 are both provided with a plurality of air cooling outlets 303, and the front cold plate 3 and the rear cold plate 4 are both provided with a plurality of cold plate air ducts 304, which are connected between the air cooling inlets 302 and the air cooling outlets 303, that is, the air cooling inlets at the bottom of the outer side and the air cooling outlets at the top vertical surface form a cold plate air duct 304 that is connected from top to bottom. The cold plate air duct 304 is provided with heat dissipation teeth 309, which increases the heat dissipation area of ​​the front cold plate 3 and improves the heat dissipation efficiency.

[0048] Example 2

[0049] refer to Figures 1 to 8 As shown, a composite heat dissipation method for an airborne electronic module sealed chassis adopts the airborne electronic module sealed chassis of Example 1, and the sealed chassis can cope with different working conditions. A plurality of electronic modules 10 (LRM modules) with different functions, different heat consumption and different heat dissipation methods are installed in the module slots of the sealed chassis cold plate.

[0050] When the external liquid cooling source is in normal liquid supply working state, on the one hand, the cooling liquid flows through the inside of the electronic module 10, and circulates and discharges the heat of the electronic module 10 in the form of liquid cooling heat dissipation. Specifically, the cooling liquid flows through the rear cold plate 4, the liquid cooling adapter block 306, and the module liquid cooling connector 307 after entering the electronic module 10, and then flows through the module liquid cooling connector 307, the liquid cooling adapter block 306, and the front cold plate 3 before being discharged. On the other hand, the cooling liquid circulates and discharges the heat transferred from the electronic module 10 to the cold plate in the form of liquid cooling heat dissipation. Specifically, the cooling liquid flows through the cold plate flow channel 305 of the rear cold plate 4, the pipeline assembly 7, and the cold plate flow channel 305 of the front cold plate 3 after entering the cold plate, and finally is discharged. The LRM module transfers the heat to the cold plate through the ribs of the module slot 308.

[0051] When the external liquid cooling source is in emergency liquid-off working state, the cooling air circulates and discharges the heat transferred from the electronic module 10 to the cold plate in a conductive air-cooling heat dissipation manner. Specifically, the cooling air flows through the cold plate air duct 304 of the front cold plate 3 and the rear cold plate 4 after entering, and then enters the fan cover 1 from the front and rear sides of the fan cover 1 under the wind pressure of the fan 104 and is discharged from the top. The LRM module transfers the heat to the cold plate through the ribs of the module slot 308.

[0052] The electronic components inside the chassis are not exposed to external airflow, which not only ensures the normal and stable operation of the chassis' functions and performance under normal liquid supply, but also ensures the normal operation of the chassis' basic emergency functions without disconnection or loss in the event of liquid failure. At the same time, it has excellent waterproof and corrosion resistance.

[0053] The sealed chassis can reasonably arrange the LRM module positions corresponding to the through-liquid cooling and conduction liquid cooling according to the functions and heat consumption of the LRM modules, and select the appropriate replaceable liquid cooling adapter block for connection. When the external liquid cooling source is in normal liquid supply working state, when the internal temperature of the module is high, air cooling and liquid cooling are performed at the same time, and the heat dissipation efficiency of the chassis is further improved through this composite heat dissipation method.

[0054] The aforementioned basic examples and their further selected examples can be freely combined to form multiple embodiments, all of which are embodiments that can be adopted and claimed for protection in this application. In the scheme of this application, each selected example can be arbitrarily combined with any other basic examples and selected examples.

[0055] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A sealed chassis for an airborne electronic module, comprising a mounting frame (2), characterized in that: The upper fan cover (1), the lower installation frame (2), the front cold plate (3), the rear cold plate (4), the left side plate (5) and the right side plate (6) are interconnected to form a sealed box, and a plurality of electronic modules (10) are arranged in the sealed box; the left side to the right side of the rear cold plate (4), the pipeline assembly (7), and the right side to the left side of the front cold plate (3) are connected in sequence to form a liquid cooling chassis channel; the rear cold plate (4), the electronic module (10) and the front cold plate (3) are connected in sequence to form a liquid cooling module channel; and the lower end to the upper end of the front cold plate (3) and the rear cold plate (4) are connected to the fan cover (1) in sequence to form an air cooling channel.

2. The sealed chassis for airborne electronic modules according to claim 1, characterized in that: The joint surfaces of the fan cover (1), the mounting frame (2), the front cold plate (3), the rear cold plate (4), the left side plate (5) and the right side plate (6) connected to each other are provided with sealing strips, the bottom open end of the mounting frame (2) is connected with a bottom cover plate (9), an electrical interconnection functional area is provided in the mounting frame (2), and a sealing strip is provided on the connecting plane of the bottom open end of the mounting frame (2).

3. The sealed chassis for airborne electronic modules according to claim 1, characterized in that: A reinforcing plate (8) is provided between the front cold plate (3) and the rear cold plate (4), and a fan electrical connector socket is provided on the reinforcing plate (8).

4. The sealed chassis for airborne electronic modules according to claim 1 or 3, characterized in that: The fan cover (1) comprises a fan cover plate (101) and a fan cover frame (102); the fan cover plate (101) is arranged at the top open end of the fan cover frame (102); a plurality of fans (104) located in the fan cover frame (102) are arranged on the fan cover plate (101); recessed fan cover handles (103) are arranged on the left and right sides of the fan cover frame (102); fan cover drainage air inlets (105) opposite to the air cooling channel are arranged on the front and rear sides of the fan cover frame (102); a fan electrical connector plug (106) is arranged on the bottom plate of the fan cover frame (102); and the fan electrical connector socket is electrically connected to the fan electrical connector plug (106).

5. The sealed chassis for airborne electronic modules according to claim 1, characterized in that: The front cold plate (3) and the rear cold plate (4) are divided into three layers of inner, middle and outer structures. The outer layer is an air cooling channel, the middle layer is a liquid cooling chassis channel, and the inner layer is provided with a module slot (308). The electronic module (10) is inserted into the module slot (308).

6. The sealed chassis for airborne electronic modules according to claim 1 or 5, characterized in that: A liquid cooling outlet connector (301) is provided on the left side of the front cold plate (3), a liquid cooling inlet connector (401) is provided on the left side of the rear cold plate (4), a pipeline assembly (7) is provided between the liquid cooling port on the right side of the front cold plate (3) and the liquid cooling port on the right side of the rear cold plate (4), and a plurality of cold plate flow channels (305) are provided in both the front cold plate (3) and the rear cold plate (4).

7. The sealed chassis for airborne electronic modules according to claim 1 or 5, characterized in that: The outer bottom of the front cold plate (3) and the rear cold plate (4) are both provided with an air cooling inlet (302), the top of the front cold plate (3) and the rear cold plate (4) are both provided with an air cooling outlet (303), the front cold plate (3) and the rear cold plate (4) are both provided with a cold plate air duct (304), the cold plate air duct (304) is connected between the air cooling inlet (302) and the air cooling outlet (303), and the cold plate air duct (304) is provided with a heat dissipation tooth (309).

8. The sealed chassis for airborne electronic modules according to claim 1 or 5, characterized in that: The front cold plate (3) and the rear cold plate (4) are provided with a liquid cooling adapter block (306), the liquid cooling adapter block (306) is connected to the liquid cooling chassis channel, and the liquid cooling adapter block (306) is provided with a plurality of module liquid cooling connectors (307), and the module liquid cooling connectors (307) are relatively connected to the electronic module (10).

9. A composite heat dissipation method for a sealed chassis of an airborne electronic module, characterized in that: The airborne electronic module sealed chassis according to any one of claims 1 to 8 is adopted: When the external liquid cooling source is in a normal liquid supply working state, on the one hand, the cooling liquid flows through the inside of the electronic module (10) to circulate and discharge the heat of the electronic module (10) in a liquid cooling heat dissipation manner; on the other hand, the cooling liquid transfers the heat from the electronic module (10) to the cold plate in a liquid cooling heat dissipation manner to circulate and discharge the heat; When the external liquid cooling source is in an emergency liquid cut-off working state, the cooling air circulates and discharges the heat transferred from the electronic module (10) to the cold plate in a conductive air cooling and heat dissipation manner.

10. The composite heat dissipation method of the sealed chassis of the airborne electronic module according to claim 9, characterized in that: When the external liquid cooling source is in normal liquid supply working state, when the internal temperature of the module is high, the heat dissipation is carried out by air cooling and liquid cooling at the same time.

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