Heat dissipation system

Abstract

The invention provides a heat dissipation system. The heat dissipation system comprises a shell, a keyboard module, a circuit board, a spacer and a first fan, the machine shell comprises a top and a bottom. The top includes at least one first opening. The keyboard module is arranged in the casing. The keyboard module comprises a thin film circuit board and a plurality of keys arranged on the thin film circuit board, and the keys are exposed from the top. The circuit board is arranged in the machine shell, and the circuit board is located below the thin film circuit board. The distance piece is arranged in the machine shell and located between the circuit board and the thin film circuit board. The spacer is used for defining a first gas flow space between the circuit board and the thin film circuit board. The first gas flowing space is communicated with the first opening of the machine shell. The first fan is arranged in the machine shell and corresponds to the first air flowing space. The first fan comprises a first air inlet communicated with the first air flowing space. The heat dissipation efficiency of the whole system can be greatly improved.

Description

Technical Field

[0001] The invention relates to a heat dissipation system, and in particular to a heat dissipation system for an electronic device. Background Art

[0002] As electronic devices become thinner and lighter and their performance continues to improve, the requirements for heat dissipation efficiency of electronic devices are also getting higher and higher. Take laptops as an example. Currently, most laptops on the market have heat dissipation air inlets designed at the bottom of the case. However, as the performance of the cooling fan becomes higher and higher, the air intake volume of the air inlet at the bottom of the case alone is not enough to meet the demand.

[0003] Therefore, how to solve the above problems has become the focus of relevant personnel in this field. Summary of the invention

[0004] One aspect of the present invention is to provide a heat dissipation system for an electronic device to solve the problems in the prior art.

[0005] The present invention relates to a heat dissipation system for an electronic device, wherein the heat dissipation system comprises a housing, a keyboard module, a circuit board, a spacer and a first fan. The housing comprises a top and a bottom opposite to each other, and the top comprises at least one first opening. The keyboard module is disposed in the housing. The keyboard module comprises a thin film circuit board and a plurality of keys disposed on the thin film circuit board, and the keys are exposed from the top. The circuit board is disposed in the housing, and the circuit board is located below the thin film circuit board of the keyboard module. The spacer is disposed in the housing and is located between the circuit board and the thin film circuit board, and the spacer is used to define a first gas flow space between the circuit board and the thin film circuit board. The first gas flow space is connected to the first opening of the housing. The first fan is disposed in the housing and corresponds to the first gas flow space, and the first fan comprises a first air inlet. The first air inlet is connected to the first gas flow space.

[0006] According to one or more embodiments of the present invention, the above-mentioned circuit board includes a first opening, a first fan is configured in the first opening and is located below the thin film circuit board, the first fan also includes a first top surface facing the thin film circuit board, a first air inlet is opened on the first top surface, a first gap is provided between the first top surface and the thin film circuit board, and the first gas flow space includes the first gap.

[0007] According to one or more embodiments of the present invention, the above-mentioned heat dissipation system also includes a second fan, the top of the casing also includes at least one second opening, the spacer is used to define a second gas flow space between the circuit board and the thin film circuit board, the second gas flow space is located on one side of the first gas flow space, the second gas flow space is connected to the second opening, the second fan is arranged in the casing and corresponds to the second gas flow space, the second fan includes a second air inlet, and the second air inlet is connected to the second gas flow space.

[0008] According to one or more embodiments of the present invention, the above-mentioned circuit board includes a second opening, the second fan is configured in the second opening and is located below the thin film circuit board, the second fan also includes a second top surface facing the thin film circuit board, the second air inlet is opened on the second top surface, and there is a second gap between the second top surface and the thin film circuit board, and the second gas flow space includes the second gap.

[0009] According to one or more embodiments of the present invention, the above-mentioned heat dissipation system also includes a third fan, the top of the casing also includes at least one third opening, the spacer is used to define a third gas flow space between the circuit board and the thin film circuit board, the third gas flow space is located on the other side opposite to the first gas flow space, the third gas flow space is connected to the third opening, the third fan is arranged in the casing and corresponds to the third gas flow space, the third fan includes a third air inlet, and the third air inlet is connected to the second gas flow space.

[0010] According to one or more embodiments of the present invention, the above-mentioned circuit board also includes a third opening, a third fan is configured in the third opening and is located below the thin film circuit board, the third fan also includes a third top surface facing the thin film circuit board, a third air inlet is opened on the third top surface, a third gap is provided between the third top surface and the thin film circuit board, and the third gas flow space includes the third gap.

[0011] According to one or more embodiments of the present invention, the top of the above-mentioned casing also includes at least one fourth opening and at least one fifth opening, the fourth opening is connected to the second gas flow space, and the fourth opening corresponds to the second air inlet of the second fan, and the fifth opening is connected to the third gas flow space, and the fifth opening corresponds to the third air inlet of the third fan.

[0012] According to one or more embodiments of the present invention, the top of the above-mentioned casing also includes a key configuration area, and the keys of the keyboard module are exposed from the key configuration area. The number of first openings is multiple, the number of second openings is multiple, the number of third openings is multiple, the number of fourth openings is multiple, and the number of fifth openings is multiple. The first openings are arranged along the first side of the key configuration area, the second openings are arranged along the second side of the key configuration area, the third openings are arranged along the third side of the key configuration area, the fourth openings and the fifth openings are respectively arranged along the fourth side of the key configuration area, and the first side is relative to the fourth side, and the second side is relative to the third side.

[0013] According to one or more embodiments of the present invention, the above-mentioned casing also includes multiple side portions, which are connected between the top and the bottom, and these side portions include a first side opening area, a second side opening area and a third side opening area, the first side opening area is connected to the first gas flow space, the second side opening area is connected to the second gas flow space, and the third side opening area is connected to the third gas flow space.

[0014] According to one or more embodiments of the present invention, the above-mentioned first fan also includes a first air outlet, the second fan also includes a second air outlet, and the third fan also includes a third air outlet. The first air outlet corresponds to the first side opening area, the second air outlet corresponds to the second side opening area, and the third air outlet corresponds to the third side opening area.

[0015] According to one or more embodiments of the present invention, the above-mentioned heat dissipation system also includes a first heat dissipation fin group, a second heat dissipation fin group and a third heat dissipation fin group. The first heat dissipation fin group is located between the first air outlet of the first fan and the first side opening area, the second heat dissipation fin group is located between the second air outlet of the second fan and the second side opening area, and the third heat dissipation fin group is located between the third air outlet of the third fan and the third side opening area.

[0016] According to one or more embodiments of the present invention, the electronic device includes a first heat source and a second heat source, and a first fan is located between the first heat source and the second heat source.

[0017] To summarize, the heat dissipation system of the embodiment of the present invention utilizes the opening design in the appearance and defines the first gas flow space, the second gas flow space and the third gas flow space between the film circuit board and the circuit board of the keyboard module through spacers. These gas flow spaces can ensure that the cold air passing through these first openings, these second openings and these third openings flows to the air inlet of the corresponding fan without dissipating to other areas, so that the efficiency of the fan to introduce cold air is greatly improved. When the efficiency of the fan to introduce cold air is improved, the heat dissipation efficiency of the overall system is greatly improved, and the use efficiency of the electronic device is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same figure numerals are used as much as possible to refer to similar or identical components of the embodiments, wherein:

[0019] Figure 1 FIG. 1 is a schematic top view of a heat dissipation system in one embodiment of the present invention.

[0020] Figure 2 It is a bottom view schematic diagram of a heat dissipation system in one embodiment of the present invention.

[0021] Figure 3 For along Figure 1 A schematic cross-sectional view of the AA line segment is shown.

[0022] Figure 4 For along Figure 1 A schematic cross-sectional view of line segment BB is shown.

[0023] Figure 5 For along Figure 1 Schematic cross-sectional view of the CC line segment shown.

[0024] Figure 6 For along Figure 1 Schematic cross-sectional view of the DD line segment shown.

[0025] Figure 7 For along Figure 1 Schematic cross-sectional view of the EE line segment shown.

[0026] Figure 8 To omit Figure 1 Schematic diagram of top view of some components.

[0027] Component number description

[0028] 1 Cooling system

[0029] 10. Housing

[0030] 11 Keyboard module

[0031] 12 Circuit Board

[0032] 13 Spacer

[0033] 14 First Fan

[0034] 15 Second Fan

[0035] 16 The Third Fan

[0036] 17 First heat sink fin group

[0037] 18 Second heat sink fin group

[0038] 19 Third heat sink fin group

[0039] 101 Top

[0040] 102 bottom

[0041] 103 Side

[0042] 111 Thin Film Circuit Board

[0043] 112 keys

[0044] 121 First Opening

[0045] 122 Second Opening

[0046] 123 The third opening

[0047] 140 First top surface

[0048] 141 First air inlet

[0049] 142 First air outlet

[0050] 150 Second top surface

[0051] 151 Second air inlet

[0052] 152 Second air outlet

[0053] 160 Third top surface

[0054] 161 Third air inlet

[0055] 162 Third air outlet

[0056] G1 First Gap

[0057] G2 Second gap

[0058] G3 Third Gap

[0059] H1 First Heat Source

[0060] H2 Second heat source

[0061] R Button configuration area

[0062] R1 First gas flow space

[0063] R2 Second gas flow space

[0064] R3 Third gas flow space

[0065] S1 First side

[0066] S2 Second side

[0067] S3 Third side

[0068] S4 Fourth side

[0069] T1 First opening

[0070] T2 Second opening

[0071] T3 Third opening

[0072] T4 Fourth opening

[0073] T5 Fifth opening

[0074] SH1 First side opening area

[0075] SH2 Second side opening area

[0076] SH3 Third side opening area

[0077] BH1 First bottom opening area

[0078] BH2 Second bottom opening area

[0079] BH3 Third bottom opening area DETAILED DESCRIPTION

[0080] The following will disclose multiple embodiments of the present invention through drawings. For the purpose of clear description, many practical details will be described together in the following description. However, those skilled in the art should understand that in some embodiments of the present invention, these practical details are not necessary and therefore do not limit the present invention. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings. In addition, for the convenience of readers, the sizes of the components in the drawings are not drawn according to the actual scale.

[0081] See also Figures 1 to 8 , Figure 1 FIG. 1 is a schematic top view of a heat dissipation system in one embodiment of the present invention. Figure 2 It is a bottom view schematic diagram of a heat dissipation system in one embodiment of the present invention. Figure 3 For along Figure 1 A schematic cross-sectional view of the AA line segment is shown. Figure 4 For along Figure 1 Schematic cross-sectional view of line segment BB shown. Figure 5 For along Figure 1 Schematic cross-section of the CC segment shown. Figure 6 For along Figure 1 Schematic cross-sectional view of the DD line segment shown. Figure 7 For along Figure 1 Schematic cross-section of the EE line segment shown. Figure 8 To omit Figure 1 Schematic diagram of top view of some components.

[0082] like Figure 1 and Figure 2 As shown, the heat dissipation system 1 of this embodiment is used for an electronic device. In this embodiment, the electronic device is, for example, a portable electronic device such as a notebook computer or a palmtop computer, but the present invention is not limited thereto. Taking a notebook computer as an example, the notebook computer includes a system end and a panel end connected to each other, and the heat dissipation system 1 of this embodiment is constructed on the system end of the notebook computer.

[0083] like Figures 1 to 8 As shown, the heat dissipation system 1 of this embodiment includes a housing 10, a keyboard module 11, a circuit board 12, a spacer 13 and a first fan 14. The housing 10 includes a top 101 and a bottom 102 opposite to each other. The top 101 of the housing 10 includes at least one first opening T1. The keyboard module 11 is disposed in the housing 10. The keyboard module 11 includes a thin film circuit board 111 and a plurality of keys 112 disposed on the thin film circuit board 111, and the keys 112 are exposed from the top 101 of the housing 10. The circuit board 12 is disposed in the housing 10, and the circuit board 12 is located below the thin film circuit board 111 of the keyboard module 11. The spacer 13 is disposed in the housing 10, and the spacer 13 is located between the circuit board 12 and the thin film circuit board 111 of the keyboard module 11. The spacer 13 is used to define a first gas flow space R1 between the circuit board 12 and the thin film circuit board 111. The first gas flow space R1 is connected to the first opening T1 of the housing 10. The first fan 14 is disposed in the housing 10 and corresponds to the first air flow space R1 . The first fan 14 includes a first air inlet 141 , and the first air inlet 141 of the first fan 14 is connected to the first air flow space R1 .

[0084] It should be noted that the housing 10 of the present embodiment can be regarded as the system end housing of the notebook computer. Therefore, in addition to accommodating the components related to the heat dissipation system 1 of the present embodiment, the housing 10 also accommodates other components that do not belong to the heat dissipation system 1, such as a touch panel, a central processing unit, a graphics processing unit, an input / output interface, and other devices or components. In the present embodiment, the first fan 14 is disposed between the first heat source H1 and the second heat source H2, and the first heat source H1 and the second heat source H2 are the aforementioned central processing unit (CPU) and graphics processing unit (GPU), respectively.

[0085] The following further describes other detailed structures of the heat dissipation system 1 of this embodiment.

[0086] like Figure 5 and Figure 8 As shown, the circuit board 12 of the present embodiment includes a first opening 121. The first fan 14 is disposed in the first opening 121 of the circuit board 12, and the first fan 14 is located below the thin film circuit board 111 of the keyboard module 11. In the present embodiment, the first fan 14 also includes a first top surface 140 facing the thin film circuit board 111, a first air inlet 141 of the first fan 14 is opened on the first top surface 140, and a first gap G1 is provided between the first top surface 140 and the thin film circuit board 111, and the above-mentioned first gas flow space R1 includes the first gap G1 defined between the first top surface 140 and the thin film circuit board 111, that is, the space between the first fan 14 and the thin film circuit board 111 is connected to the first gas flow space R1.

[0087] like Figure 1 , Figure 3 , Figure 6 and Figure 8 As shown, the heat dissipation system 1 of this embodiment further includes a second fan 15, and the top 101 of the housing 10 further includes at least one second opening T2. In this embodiment, the spacer 13 is used to define a second gas flow space R2 between the circuit board 12 and the thin film circuit board 111, the second gas flow space R2 is located on one side of the first gas flow space R1, and the second gas flow space R2 is connected to the second opening T2 of the housing 10. The second fan 15 is disposed in the housing 10 and corresponds to the second gas flow space R2. The second fan 15 includes a second air inlet 151, and the second air inlet 151 of the second fan 15 is connected to the second gas flow space R2.

[0088] like Figure 6 and Figure 8 As shown, the circuit board 12 of this embodiment further includes a second opening 122, and the second opening 122 is located on one side of the first opening 121. The second fan 15 is disposed in the second opening 122 of the circuit board 12, and the second fan 15 is located below the thin film circuit board 111 of the keyboard module 11. In this embodiment, the second fan 15 further includes a second top surface 150 facing the thin film circuit board 111, and a second air inlet 151 of the second fan 15 is opened on the second top surface 150, and a second gap G2 is provided between the second top surface 150 and the thin film circuit board 111. The second gas flow space R2 includes the second gap G2 defined between the second top surface 150 and the thin film circuit board 111, that is, the space between the second fan 15 and the thin film circuit board 111 is connected to the second gas flow space R2.

[0089] like Figure 1 , Figure 4 , Figure 7 and Figure 8 As shown, the heat dissipation system 1 of the present embodiment further includes a third fan 16, and the top 101 of the housing 10 further includes at least one third opening T3. In the present embodiment, the spacer 13 is used to define a third gas flow space R3 between the circuit board 12 and the thin film circuit board 111, and the third gas flow space R3 is located on the other side opposite to the first gas flow space R1, that is, the first gas flow space R1 is located between the second gas flow space R2 and the third gas flow space R3, and the third gas flow space R3 is connected to the third opening T3 of the housing 10. The third fan 16 is disposed in the housing 10 and corresponds to the third gas flow space R3. The third fan 16 includes a third air inlet 161, and the third air inlet 161 of the third fan 16 is connected to the third gas flow space R3.

[0090] like Figure 7 and Figure 8 As shown, the circuit board 12 of this embodiment further includes a third opening 123, and the third opening 123 is located on the other side opposite to the first opening 121. The third fan 16 is disposed in the third opening 123 of the circuit board 12, and the third fan 16 is located below the thin film circuit board 111 of the keyboard module 11. In this embodiment, the third fan 16 further includes a third top surface 160 facing the thin film circuit board 111, and the third air inlet 161 of the third fan 16 is opened on the third top surface 160, and a third gap G3 is provided between the third top surface 160 and the thin film circuit board 111. The third gas flow space R3 includes the third gap G3 defined between the third top surface 160 and the thin film circuit board 111, that is, the space between the third fan 16 and the thin film circuit board 111 is connected to the third gas flow space R3.

[0091] like Figure 1 and Figure 8 As shown, the housing 10 of this embodiment further includes at least one fourth opening T4 and at least one fifth opening T5. The fourth opening T4 of the housing 10 is connected to the second gas flow space R2, and the fourth opening T4 corresponds to the second air inlet 151 of the second fan 15. The fifth opening T5 of the housing 10 is connected to the third gas flow space R3, and the fifth opening T5 corresponds to the third air inlet 161 of the third fan 16.

[0092] like Figure 1 As shown, the top 101 of the housing 10 of this embodiment also includes a key configuration area R. The keys 112 of the keyboard module 11 are exposed to the outside of the housing 10 from the corresponding holes in the key configuration area R. In this embodiment, the number of the first openings T1 of the housing 10 is multiple, the number of the second openings T2 is multiple, the number of the third openings T3 is multiple, the number of the fourth openings T4 is multiple, and the number of the fifth openings T5 is multiple. The above openings are arranged along the periphery of the keyboard module 11. For example, the first openings T1 are arranged along the first side S1 of the key configuration area R, the second openings T2 are arranged along the second side S2 of the key configuration area R, the third openings T3 are arranged along the third side S3 of the key configuration area R, and the fourth openings T4 and the fifth openings T5 are arranged along the fourth side S4 of the key configuration area R. The first side S1 and the fourth side S4 of the key configuration area R are opposite to each other, and the second side S2 and the fourth side S4 are opposite to each other.

[0093] It should be particularly noted that the present invention does not limit the number of the above-mentioned openings. When there is at least one opening, the number of the openings can be increased or decreased according to actual needs.

[0094] like Figure 8As shown, the housing 10 of this embodiment further includes a plurality of side portions 103. These side portions 103 are connected between the top portion 101 and the bottom portion 102, and these side portions 103 include a first side opening area SH1, a second side opening area SH2, and a third side opening area SH3. In this embodiment, the first side opening area SH1 is connected to the first gas flow space R1 and corresponds to the first fan 14, the second side opening area SH2 is connected to the second gas flow space R2 and corresponds to the second fan 15, and the third side opening area SH3 is connected to the third gas flow space R3 and corresponds to the third fan 16.

[0095] like Figure 8 As shown, the first fan 14 of this embodiment further includes a first air outlet 142, the second fan 15 further includes a second air outlet 152, and the third fan 16 further includes a third air outlet 162. The first air outlet 142 of the first fan 14 corresponds to the first side opening area SH1 of the housing 10, the second air outlet 152 of the second fan 15 corresponds to the second side opening area SH2 of the housing 10, and the third air outlet 162 of the third fan 16 corresponds to the third side opening area SH3 of the housing 10.

[0096] like Figure 8 As shown, the heat dissipation system 1 of this embodiment further includes a first heat dissipation fin group 17, a second heat dissipation fin group 18 and a third heat dissipation fin group 19. The first heat dissipation fin group 17 is located between the first air outlet 142 of the first fan 14 and the first side opening area SH1. The second heat dissipation fin group 18 is located between the second air outlet 152 of the second fan 15 and the second side opening area SH2. The third heat dissipation fin group 19 is located between the third air outlet 162 of the third fan 16 and the third side opening area SH3.

[0097] In the present embodiment, when the first fan 14 starts to operate, the external cold air will be introduced into the housing 10 by the first fan 14. After the external cold air enters the housing 10 through the first openings T1 of the housing 10, the cold air will flow to the first air inlet 141 of the first fan 14 through the first gas flow space R1 between the thin film circuit board 111 and the circuit board 12. Since the cold air passing through the first openings T1 will be confined in the first gas flow space R1 and will not flow to other areas, the cold air entering from some of the first openings T1 that are farther away from the first fan 14 (such as the first openings T1 located at both ends of the upper side of the housing 10) can also smoothly pass through the first gas flow space R1 and flow to the first air inlet 141 of the first fan 14, thereby ensuring that more cold air enters the housing 10.

[0098] As mentioned above, when external cold air is introduced from the first air inlet 141 of the first fan 14, the first fan 14 blows the cold air radially along different air outlet directions to the first heat source H1, the second heat source H2, the heat spreader (not shown in this figure) or other high-power and high-heat electronic components located in the area below the circuit board 12. The cold air takes away the heat generated by the above-mentioned components and is discharged to the outside of the casing 10 through the first air outlet 142 of the first fan 14 and the first heat sink fin group 17.

[0099] Similarly, when the second fan 15 and the third fan 16 start to operate, external cold air will be introduced into the interior of the case 10 by the second fan 15 and the third fan 16. After the external cold air enters the interior of the case 10 through the second openings T2 and the third openings T3 of the case 10 respectively, the cold air will flow to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16 respectively through the second gas flow space R2 and the third gas flow space R3 located between the thin film circuit board 111 and the circuit board 12. Since the cold air passing through these second openings T2 and these third openings T3 will be confined in the first gas flow space R1 and the second gas flow space R2 respectively and will not flow to other areas, the cold air entering from the part of the second openings T2 that is farther away from the second fan 15 (such as the second openings T2 located at the upper left side of the casing 10) and the part of the third openings T3 that is farther away from the third fan 16 (such as the second openings T2 located at the upper right side of the casing 10) can also smoothly pass through the second gas flow space R2 and the third gas flow space R3 and flow to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16 respectively, thereby ensuring that more cold air enters the interior of the casing 10.

[0100] Furthermore, when the second fan 15 and the third fan 16 start to operate, since the fourth openings T4 and the fifth openings T5 correspond to the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16 respectively, the cold air passing through the fourth openings T4 and the fifth openings T5 will be directly introduced into the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16.

[0101] As mentioned above, when external cold air is introduced from the second air inlet 151 of the second fan 15 and the third air inlet 161 of the third fan 16, the second fan 15 and the third fan 16 blow the cold air radially along different air outlet directions to the heat spreader (not shown in this figure) or other high-power and high-heat electronic components located in the area below the circuit board 12. The cold air takes away the heat generated by the above-mentioned components and is discharged to the outside of the housing 10 through the second air outlet 152 of the second fan 15 and the second heat dissipation fin group 18, and is discharged to the outside of the housing 10 through the third air outlet 162 of the third fan 16 and the third heat dissipation fin group 19.

[0102] It is worth mentioning that Figure 1 and Figure 2 As shown, the bottom 102 of the housing 10 of the present embodiment includes a first bottom opening area BH1, a second bottom opening area BH2, and a third bottom opening area BH3. The first bottom opening area BH1 corresponds to the first fan 14, the second bottom opening area BH2 corresponds to the second fan 15, and the third bottom opening area BH3 corresponds to the third fan 16. The above-mentioned bottom opening areas are combined with the first openings T1, the second openings T2, the third openings T3, the fourth openings T4, and the fifth openings T5 located at the top 101 of the housing 10 along the periphery of the key configuration area R, so that the electronic device can not only inhale cold air through the bottom of the housing 10, but also inhale cold air through the top of the housing 10, so that the fan can play a higher role, thereby improving the use efficiency of the electronic device.

[0103] To summarize, the heat dissipation system of the embodiment of the present invention utilizes the opening design in the appearance and defines the first gas flow space, the second gas flow space and the third gas flow space between the film circuit board and the circuit board of the keyboard module through spacers. These gas flow spaces can ensure that the cold air passing through these first openings, these second openings and these third openings flows to the air inlet of the corresponding fan without dissipating to other areas, so that the efficiency of the fan to introduce cold air is greatly improved. When the efficiency of the fan to introduce cold air is improved, the heat dissipation efficiency of the overall system is greatly improved, and the use efficiency of the electronic device is effectively improved.

[0104] The embodiments selected and described are intended to explain the content of the present disclosure and their practical applications so as to inspire other persons skilled in the art to utilize the present disclosure and various embodiments, and to make various modifications to meet the specific intended use. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached invention claims, rather than being limited by the foregoing specification and the exemplary embodiments described therein.

Claims

1. A heat dissipation system, characterized in that: For an electronic device, the heat dissipation system comprises: A housing, comprising a top and a bottom opposite to each other, wherein the top comprises at least one first opening; a keyboard module, disposed in the housing, the keyboard module comprising a thin film circuit board and a plurality of keys disposed on the thin film circuit board, the plurality of keys being exposed from the top; a circuit board, disposed in the housing, and located below the film circuit board of the keyboard module; a spacer, disposed in the housing and located between the circuit board and the thin film circuit board, the spacer is used to define a first gas flow space between the circuit board and the thin film circuit board, the first gas flow space is connected to the at least one first opening of the housing; and A first fan is disposed in the housing and corresponds to the first gas flow space. The first fan includes a first air inlet, and the first air inlet is connected to the first gas flow space.

2. The heat dissipation system according to claim 1, characterized in that: The circuit board includes a first opening, the first fan is arranged in the first opening and is located below the thin film circuit board, the first fan also includes a first top surface facing the thin film circuit board, the first air inlet is opened on the first top surface, a first gap is provided between the first top surface and the thin film circuit board, and the first gas flow space includes the first gap.

3. The heat dissipation system according to claim 1, characterized in that: It also includes a second fan, and the top of the casing also includes at least one second opening. The spacer is used to define a second gas flow space between the circuit board and the film circuit board. The second gas flow space is located on one side of the first gas flow space. The second gas flow space is connected to the at least one second opening. The second fan is configured in the casing and corresponds to the second gas flow space. The second fan includes a second air inlet, and the second air inlet is connected to the second gas flow space.

4. The heat dissipation system according to claim 3, characterized in that: The circuit board includes a second opening, the second fan is configured in the second opening and is located below the thin film circuit board, the second fan also includes a second top surface facing the thin film circuit board, the second air inlet is opened on the second top surface, a second gap is provided between the second top surface and the thin film circuit board, and the second gas flow space includes the second gap.

5. The heat dissipation system according to claim 3, characterized in that: It also includes a third fan, and the top of the casing also includes at least one third opening. The spacer is used to define a third gas flow space between the circuit board and the film circuit board. The third gas flow space is located on the other side opposite to the first gas flow space. The third gas flow space is connected to the at least one third opening. The third fan is configured in the casing and corresponds to the third gas flow space. The third fan includes a third air inlet, and the third air inlet is connected to the second gas flow space.

6. The heat dissipation system according to claim 5, characterized in that: The circuit board also includes a third opening, the third fan is arranged in the third opening and is located below the thin film circuit board, the third fan also includes a third top surface facing the thin film circuit board, the third air inlet is opened on the third top surface, a third gap is provided between the third top surface and the thin film circuit board, and the third gas flow space includes the third gap.

7. The heat dissipation system according to claim 5, characterized in that: The top of the casing also includes at least one fourth opening and at least one fifth opening, the at least one fourth opening is connected to the second gas flow space, and the at least one fourth opening corresponds to the second air inlet of the second fan, and the at least one fifth opening is connected to the third gas flow space, and the at least one fifth opening corresponds to the third air inlet of the third fan.

8. The heat dissipation system according to claim 5, characterized in that: The top of the casing also includes a key configuration area, the multiple keys of the keyboard module are exposed from the key configuration area, the number of the at least one first opening is multiple, the number of the at least one second opening is multiple, the number of the at least one third opening is multiple, the number of the at least one fourth opening is multiple, the number of the at least one fifth opening is multiple, the multiple first openings are arranged along a first side of the key configuration area, the multiple second openings are arranged along a second side of the key configuration area, the multiple third openings are arranged along a third side of the key configuration area, the multiple fourth openings and the multiple fifth openings are respectively arranged along a fourth side of the key configuration area, and the first side is relative to the fourth side, and the second side is relative to the third side.

9. The heat dissipation system according to claim 5, characterized in that: The casing also includes multiple side portions, which are connected between the top and the bottom, and the multiple side portions include a first side opening area, a second side opening area and a third side opening area, the first side opening area is connected to the first gas flow space, the second side opening area is connected to the second gas flow space, and the third side opening area is connected to the third gas flow space.

10. The heat dissipation system according to claim 9, characterized in that: The first fan also includes a first air outlet, the second fan also includes a second air outlet, and the third fan also includes a third air outlet. The first air outlet corresponds to the first side opening area, the second air outlet corresponds to the second side opening area, and the third air outlet corresponds to the third side opening area.

11. The heat dissipation system according to claim 10, characterized in that: It also includes a first cooling fin group, a second cooling fin group and a third cooling fin group, the first cooling fin group is located between the first air outlet of the first fan and the first side opening area, the second cooling fin group is located between the second air outlet of the second fan and the second side opening area, and the third cooling fin group is located between the third air outlet of the third fan and the third side opening area.

12. The heat dissipation system according to claim 1, characterized in that: The electronic device includes a first heat source and a second heat source, and the first fan is located between the first heat source and the second heat source.

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