Cooling device of storage server

Abstract

The invention provides a heat dissipation device of a storage server. The device comprises a first heat dissipation air duct, a second heat dissipation air duct and a third heat dissipation air duct, the first heat dissipation air duct is arranged in front of a storage server to dissipate heat of a first heat dissipation area in front of the storage server; the second heat dissipation air channels are arranged on the two sides of the storage server so as to dissipate heat of a second heat dissipation area behind the storage server. And the third heat dissipation air duct is arranged at the bottom of the storage server so as to dissipate heat of a second heat dissipation area behind the storage server. The heat dissipation problem of the hard disk array in the storage server can be solved, the highest temperature of the storage server can be efficiently reduced, and the number of supportable hard disks and the maximum power consumption can be improved.

Description

Technical Field

[0001] The present application belongs to the field of heat dissipation technology, and in particular, relates to a heat dissipation device for a storage server. Background Art

[0002] The heat dissipation of storage servers is a key factor in ensuring their stable operation and extending their service life. Existing storage server heat dissipation solutions mainly include air cooling and liquid cooling. Among them, air cooling is to increase airflow by equipping efficient chassis fans and radiator fans to help discharge heat in time, while liquid cooling is usually achieved by indirect contact between the coolant and the server's heating components to remove heat through heat conduction. For air cooling, it mainly relies on air flow to remove heat, and its heat dissipation efficiency is limited by the thermal conductivity of air. Therefore, how to improve the efficiency of air cooling has become a technical problem that needs to be solved urgently in this field. Summary of the invention

[0003] The present application provides a heat dissipation device for a storage server, which is used to solve the technical problem of how to improve the efficiency of air cooling and heat dissipation.

[0004] In a first aspect, the present application provides a heat dissipation device for a storage server, the device comprising a first heat dissipation air duct, a second heat dissipation air duct and a third heat dissipation air duct;

[0005] The first heat dissipation duct is arranged in front of the storage server to dissipate heat to a first heat dissipation area in front of the storage server;

[0006] The second heat dissipation duct is arranged on both sides of the storage server to dissipate heat to a second heat dissipation area behind the storage server;

[0007] The third heat dissipation duct is arranged at the bottom of the storage server to dissipate heat to a second heat dissipation area behind the storage server.

[0008] In an implementation of the first aspect, the device also includes an air guide structure; the air guide structure is arranged between the first heat dissipation area and the second heat dissipation area to divide the first heat dissipation area and the second heat dissipation area, and the airflow of the first heat dissipation duct is gathered to the isolation area through the air guide structure after dissipating the heat in the first heat dissipation area, and is discharged to the outside of the storage server through the isolation area.

[0009] In an implementation of the first aspect, the isolation zone includes a first isolation plate and a second isolation plate, and the first isolation plate and the second isolation plate are arranged in parallel in the middle of the second heat dissipation area to form the isolation zone in the middle of the second heat dissipation area, and the front of the isolation zone is connected to the first heat dissipation area, and the rear of the isolation zone is connected to the rear panel of the storage server.

[0010] In an implementation of the first aspect, the airflow of the first heat dissipation duct enters the isolation area from the connection between the isolation area and the first heat dissipation area after dissipating heat to the first heat dissipation area, and is discharged to the outside of the storage server from the connection between the isolation area and the rear panel.

[0011] In an implementation of the first aspect, an isolation air outlet is provided at the connection between the air guide structure and the isolation area. After dissipating heat in the first heat dissipation area, the airflow of the first heat dissipation duct enters the isolation area through the isolation air outlet, and is discharged to the outside of the storage server from the connection between the isolation area and the rear panel.

[0012] In an implementation of the first aspect, the wind guide structure includes a first wind guide plate and a second wind guide plate, a first isolation air outlet is provided at the connection between the first wind guide plate and the first isolation plate, and a second isolation air outlet is provided at the connection between the second wind guide plate and the second isolation plate.

[0013] In an implementation manner of the first aspect, the airflow of the second heat dissipation air duct and the airflow of the third heat dissipation air duct converge behind the air guide structure and dissipate heat to the second heat dissipation area.

[0014] In an implementation of the first aspect, air duct accommodating spaces are provided on both sides of the storage server, the air duct accommodating spaces are provided with openings inwardly, the second heat dissipation air duct is arranged in the air duct accommodating space and the airflow of the second heat dissipation air duct is output through the openings.

[0015] In an implementation of the first aspect, a PCB board is provided at the bottom of the storage server, the third heat dissipation duct is provided below the PCB board, and the airflow of the third heat dissipation duct is output through the interlayer space formed by the PCB board and the bottom plate of the storage server.

[0016] In an implementation manner of the first aspect, the device further includes a fan, which provides airflow for the first heat dissipation air duct, the second heat dissipation air duct, and the third heat dissipation air duct.

[0017] A heat dissipation device for a storage server described in the present application has the following beneficial effects: the present application can solve the heat dissipation problem of the hard disk array in the storage server, can effectively reduce the maximum temperature of the storage server, and increase the number of supported hard disks and the maximum power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic structural diagram of a heat dissipation device for a storage server according to an embodiment of the present application.

[0019] Figure 2 Shown is a top view of a heat dissipation device of a storage server described in an embodiment of the present application.

[0020] Figure 3 Shown is a side view of a heat dissipation device of a storage server according to an embodiment of the present application.

[0021] Figure 4 Shown is a front view of a heat dissipation device for a storage server according to an embodiment of the present application.

[0022] Figure 5 Shown is a schematic structural diagram of a heat dissipation device for a storage server according to an embodiment of the present application.

[0023] Figure 6 Shown is a schematic structural diagram of a heat dissipation device for a storage server according to an embodiment of the present application.

[0024] Component number description

[0025] 11. First cooling air duct

[0026] 12 Second cooling air duct

[0027] 13 Third cooling air duct

[0028] 14 Wind guide structure

[0029] 141 First air guide plate

[0030] 142 Second air guide plate

[0031] 143 Isolation outlet

[0032] 1431 First isolation air outlet

[0033] 1432 Second isolation air outlet

[0034] 15 Quarantine

[0035] 151 First isolation board

[0036] 152 Second isolation board

[0037] 21 First heat dissipation area

[0038] 22 Second heat dissipation area

[0039] 23 Air duct space

[0040] 231 Opening

[0041] 24 PCB board

[0042] 25 Mezzanine Space DETAILED DESCRIPTION

[0043] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0044] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application, and thus the drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0045] In addition, in this application, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0046] Air cooling is the main way to dissipate heat in storage servers. It helps to dissipate heat inside the server through airflow. In the usual design, cold air enters from the front of the chassis and gradually flows through each row of hard disks. The temperature of the hard disks in the back row will be higher than that of the hard disks in the front row, and then it is discharged from the back of the chassis. This means that when the airflow reaches the back of the server, it already carries a lot of heat, and it is difficult to effectively dissipate the heat of the last few rows or one row of hard disks. At this time, the temperature of the last row or rows of hard disks is the highest and becomes the bottleneck of the storage server's heat dissipation, which greatly restricts the number of hard disks that the product can support and the maximum power consumption.

[0047] In order to at least solve the above-mentioned problems, a heat dissipation device for a storage server is provided in an embodiment of the present application, which can improve the efficiency of air cooling and effectively realize the heat dissipation of the storage server as a whole.

[0048] See also Figures 1 to 4 As shown, a heat dissipation device of a storage server provided in one embodiment of the present application includes a first heat dissipation air duct 11 , a second heat dissipation air duct 12 and a third heat dissipation air duct 13 .

[0049] Among them, the first heat dissipation duct 11 is arranged in front of the storage server to dissipate heat to the first heat dissipation area 21 in front of the storage server; the second heat dissipation duct 12 is arranged on both sides of the storage server to dissipate heat to the second heat dissipation area 22 behind the storage server; the third heat dissipation duct 13 is arranged at the bottom of the storage server to dissipate heat to the second heat dissipation area 22 behind the storage server.

[0050] Furthermore, the heat dissipation device 1 of the storage server further includes a fan, which provides airflow for the first heat dissipation air duct 11, the second heat dissipation air duct 12, and the third heat dissipation air duct 13. That is, the fan provides independent airflow, which is divided into three airflows through the first heat dissipation air duct 11, the second heat dissipation air duct 12, and the third heat dissipation air duct 13 to dissipate heat for different areas of the storage server, thereby ensuring that the hard disks in the rear area of ​​the storage server can be effectively cooled by air.

[0051] Please continue reading Figures 1 to 4 As shown, the heat dissipation device 1 of the storage server further includes an air guide structure 14 .

[0052] The air guide structure 14 is arranged between the first heat dissipation area 21 and the second heat dissipation area 22 to divide the first heat dissipation area 21 and the second heat dissipation area 22. After dissipating the heat in the first heat dissipation area 21, the airflow of the first heat dissipation duct 11 is gathered to the isolation area 15 through the air guide structure 14 and discharged to the outside of the storage server through the isolation area 15.

[0053] Please continue reading Figures 1 to 4 As shown, the isolation area 15 includes a first isolation plate 151 and a second isolation plate 152, and the first isolation plate 151 and the second isolation plate 152 are arranged in parallel in the middle of the second heat dissipation area 22 to form the isolation area 15 in the middle of the second heat dissipation area 22, and the front of the isolation area 15 is connected to the first heat dissipation area 21, and the rear of the isolation area 15 is connected to the rear panel of the storage server.

[0054] Specifically, after dissipating heat to the first heat dissipation area 21 , the airflow of the first heat dissipation duct 11 enters the isolation area 15 from the connection between the isolation area 15 and the first heat dissipation area 21 , and is discharged to the outside of the storage server from the connection between the isolation area 15 and the rear panel.

[0055] For details, please continue to refer to Figures 1 to 4As shown, an isolation air outlet 143 is provided at the connection between the air guide structure 14 and the isolation area 15. The airflow of the first heat dissipation duct 11 enters the isolation area 15 through the isolation air outlet 143 after dissipating heat to the first heat dissipation area 21, and is discharged to the outside of the storage server from the connection between the isolation area 15 and the rear panel.

[0056] Please continue reading Figures 1 to 4 As shown, the wind guide structure 14 includes a first wind guide plate 141 and a second wind guide plate 142. A first isolation air outlet 1431 is provided at the connection between the first wind guide plate 141 and the first isolation plate 151, and a second isolation air outlet 1432 is provided at the connection between the second wind guide plate 142 and the second isolation plate 152.

[0057] When the fan is started, a part of the wind flow will enter the first heat dissipation duct 11. At this time, the wind flow of the first heat dissipation duct 11 will dissipate heat to the first heat dissipation area 21 in front of the storage server, for example, to dissipate heat to the hard disks in rows 1 to 5. After passing through the hard disks in row 5, the wind flow of the first heat dissipation duct 11 will enter the isolation area 15 from the connection between the isolation area 15 and the first heat dissipation area 21, and the wind flow that is not facing the connection will be guided to the isolation air outlet 143 through the air guide structure 14, so as to enter the isolation area 15 through the isolation air outlet 143.

[0058] Furthermore, a fan is actually provided at the connection point between the isolation area 15 and the rear panel of the storage server. The fan can quickly draw out the air in the isolation area 15 to discharge the hot gas after heat dissipation to the outside of the storage server.

[0059] Furthermore, when the fan is started, there will be wind flow that will enter the second heat dissipation duct 12 and the second heat dissipation duct 13 to cool the hard disks at the rear. The wind flow of the second heat dissipation duct 12 and the wind flow of the third heat dissipation duct 13 will converge behind the wind guide structure 14 and dissipate heat to the second heat dissipation area 22. That is, the wind flow of the second heat dissipation duct 12 and the second heat dissipation duct 13 will not dissipate heat to the first heat dissipation area 21 in front of the storage server, so as to maintain a low temperature to take away the heat at the rear. For example, when the storage server has 8 rows of hard disks, the hard disk array is divided into two parts, namely the first heat dissipation area 21 (1-5 rows of hard disks) and the second heat dissipation area 22 (6-8 rows of hard disks). At this time, the wind flow of the second heat dissipation duct 12 and the second heat dissipation duct 13 will converge behind the wind guide structure 14 to dissipate heat to the 6-8 rows of hard disks.

[0060] For details, please continue to refer to Figures 1 to 4As shown, the storage server is provided with air duct accommodating spaces 23 on both sides, the air duct accommodating spaces 23 are provided with openings 231 inwardly, the second heat dissipation air duct 12 is arranged in the air duct accommodating spaces 23, and the wind flow of the second heat dissipation air duct 12 is output through the openings 231. That is, when the fan is started, part of the wind flow enters the second heat dissipation air duct 12, flows directly to the rear of the wind guide structure 14, and is output to the second heat dissipation area 22 through the openings 231 for air cooling and heat dissipation.

[0061] For further information, please refer to Figures 1 to 4 As shown, the air duct accommodating space 23 is located in the upper half of the space on both sides of the storage server. That is, in fact, the second heat dissipation air duct 12 is arranged in the upper half of the space on both sides of the storage server, and outputs to the outside through the opening 231. At this time, due to the principle of cold air sinking, the air flow of the second heat dissipation air duct 12 will flow downward to achieve air cooling and heat dissipation of the second heat dissipation area 22.

[0062] For details, please continue to refer to Figures 1 to 4 As shown, a PCB board 24 is provided at the bottom of the storage server, the third heat dissipation duct 13 is provided below the PCB board 24, and the wind flow of the third heat dissipation duct 13 is output through the interlayer space 25 formed by the PCB board 24 and the bottom plate of the storage server. In fact, a PCB board 24 is provided at the bottom of the storage server, and the third heat dissipation duct 13 is located below the PCB board 24. Since the PCB board 24 and the bottom of the storage server are not firmly attached, when the fan is started, part of the wind flow enters the third heat dissipation duct 13, flows directly to the rear of the wind guide structure 14, and is output through the interlayer space 25 formed by the PCB board 24 and the bottom plate of the storage server.

[0063] Furthermore, the second heat dissipation duct 12 and the third heat dissipation duct 13 are both used to dissipate heat for the second heat dissipation area 22 behind the storage server. The second heat dissipation duct 12 is arranged in the upper half space on both sides of the storage server, and the third heat dissipation duct 13 is arranged at the bottom of the storage server. The wind flow of the second heat dissipation duct 12 sinks after being output to dissipate heat for the rear hard disks, and the wind flow of the third heat dissipation duct 13 can effectively take away the heat under the rear hard disks after being output from the bottom. That is, the combination of the second heat dissipation duct 12 and the third heat dissipation duct 13 can effectively achieve all-round heat dissipation for the second heat dissipation area 22 behind the storage server.

[0064] Furthermore, after dissipating heat in the second heat dissipation area 22 at the rear of the storage server, the airflow of the second heat dissipation duct 12 and the third heat dissipation duct 13 will be discharged to the outside of the storage server through the fan disposed at the rear of the storage server.

[0065] As described above, the heat dissipation device of the storage server provided in the present application can divide the airflow into a first heat dissipation duct, a second heat dissipation duct and a third heat dissipation duct. Wherein, the first heat dissipation duct is arranged in front of the storage server to dissipate the first heat dissipation area in front of the storage server, and after heat dissipation, it is guided by the air guide structure or directly enters the isolation area, and then discharged to the outside of the storage server through the isolation area. Wherein, the second heat dissipation duct is arranged on both sides of the storage server through the air duct accommodating space to flow directly to the rear of the air guide structure, and output through the opening to dissipate the heat to the second heat dissipation area at the rear. Wherein, the third heat dissipation duct is arranged below the PCB board at the bottom, and flows directly to the rear of the air guide structure, and outputs through the interlayer space between the PCB board and the bottom plate to dissipate the heat to the second heat dissipation area at the rear. It can be seen that the present application realizes air-cooled heat dissipation in different areas through different air duct designs, ensuring that the area behind the storage server can also receive cold air and achieve efficient heat dissipation.

[0066] The descriptions of the processes or structures corresponding to the above-mentioned figures have different emphases. For parts that are not described in detail in a certain process or structure, please refer to the relevant descriptions of other processes or structures.

[0067] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A heat dissipation device for a storage server, characterized in that: The device comprises a first heat dissipation air duct, a second heat dissipation air duct and a third heat dissipation air duct; The first heat dissipation duct is arranged in front of the storage server to dissipate heat to a first heat dissipation area in front of the storage server; The second heat dissipation duct is arranged on both sides of the storage server to dissipate heat to a second heat dissipation area behind the storage server; The third heat dissipation duct is arranged at the bottom of the storage server to dissipate heat to a second heat dissipation area behind the storage server.

2. The heat dissipation device of the storage server according to claim 1, characterized in that: The device also includes an air guide structure; the air guide structure is arranged between the first heat dissipation area and the second heat dissipation area to divide the first heat dissipation area and the second heat dissipation area, and the airflow of the first heat dissipation duct is collected to the isolation area through the air guide structure after dissipating heat in the first heat dissipation area, and is discharged to the outside of the storage server through the isolation area.

3. The heat dissipation device of the storage server according to claim 2, characterized in that: The isolation zone includes a first isolation plate and a second isolation plate, and the first isolation plate and the second isolation plate are arranged in parallel in the middle of the second heat dissipation area to form the isolation zone in the middle of the second heat dissipation area. The front of the isolation zone is connected to the first heat dissipation area, and the back of the isolation zone is connected to the rear panel of the storage server.

4. The heat dissipation device of the storage server according to claim 3, characterized in that: After dissipating heat to the first heat dissipation area, the wind flow of the first heat dissipation duct enters the isolation area from the connection between the isolation area and the first heat dissipation area, and is discharged to the outside of the storage server from the connection between the isolation area and the rear panel.

5. The heat dissipation device of the storage server according to claim 3, characterized in that: An isolation air outlet is provided at the connection between the air guide structure and the isolation area. The airflow of the first heat dissipation duct enters the isolation area through the isolation air outlet after dissipating heat in the first heat dissipation area, and is discharged to the outside of the storage server from the connection between the isolation area and the rear panel.

6. The heat dissipation device of the storage server according to claim 5, characterized in that: The wind guide structure includes a first wind guide plate and a second wind guide plate. A first isolation air outlet is provided at the connection between the first wind guide plate and the first isolation plate, and a second isolation air outlet is provided at the connection between the second wind guide plate and the second isolation plate.

7. The heat dissipation device of the storage server according to claim 2, characterized in that: The wind flow of the second heat dissipation air duct and the wind flow of the third heat dissipation air duct converge behind the air guide structure and dissipate heat to the second heat dissipation area.

8. The heat dissipation device of the storage server according to claim 1, characterized in that: Air duct accommodating spaces are provided on both sides of the storage server. The air duct accommodating spaces are provided with openings inwardly. The second heat dissipation air duct is arranged in the air duct accommodating spaces and the airflow of the second heat dissipation air duct is output through the openings.

9. The heat dissipation device of the storage server according to claim 7, characterized in that: A PCB board is provided at the bottom of the storage server, the third heat dissipation duct is provided below the PCB board, and the wind flow of the third heat dissipation duct is output through the interlayer space formed by the PCB board and the bottom plate of the storage server.

10. The heat dissipation device of the storage server according to claim 1, characterized in that: The device further includes a fan, which provides airflow for the first heat dissipation air duct, the second heat dissipation air duct, and the third heat dissipation air duct.

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