Multilayer electronic component, electronic component, and electronic device

Abstract

The invention provides a multilayer electronic component, an electronic component and an electronic device. The multilayer electronic component may include: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and an external electrode disposed on the main body. Each of a third surface and a fourth surface of the body opposite to each other in the second direction may include an exposed portion and a non-exposed portion other than the exposed portion. The external electrode may include: a base electrode layer including a metal disposed on the exposed portion and the non-exposed portion; an intermediate electrode layer disposed on the base electrode layer and disposed on the non-exposed portion; and an upper electrode layer disposed on the intermediate electrode layer and disposed on the non-exposed portion. The intermediate electrode layer may include a metal and a resin, and the upper electrode layer may include Sn and a resin.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0159463 filed on November 16, 2023, in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2024-0019765 filed on February 8, 2024, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein in their entirety by reference. Technical Field

[0002] The present disclosure relates to a multilayer electronic component, an electronic component, and an electronic device. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of any of various electronic products such as an imaging device, a display device (including a liquid crystal display (LCD) or a plasma display panel (PDP)), a computer, or a mobile phone (e.g., a smart phone) for charging or discharging therefrom.

[0004] Multilayer ceramic capacitors have a small size, achieve high capacitance, and are easily mounted on a board, so they can be used as components of various electronic devices. As various electronic devices such as computers, mobile devices, etc. have smaller sizes and higher outputs, the demand for miniaturization and higher capacitance of multilayer ceramic capacitors is increasing.

[0005] In addition, as the use of multilayer ceramic capacitors in automotive components increases, high reliability in various environments is required.

[0006] A sintered electrode formed by coating and sintering a paste including a conductive metal and glass is generally used as an external electrode of a multilayer ceramic capacitor.

[0007] However, in the case of sintered electrodes, there may be a problem that cracks are easily generated due to tensile stress occurring in a mechanical environment or a thermal environment. Therefore, a technology for coating a conductive resin layer on an external electrode is disclosed in order to absorb the tensile stress generated in a mechanical environment or a thermal environment and prevent cracks caused by the tensile stress.

[0008] The conductive resin layer serves to electrically and mechanically bond the sintered electrodes of the outer electrodes of the multilayer ceramic capacitor to the plating layer, and serves to protect the multilayer ceramic capacitor from mechanical and thermal stress caused by process temperature and bending impact of the circuit board during mounting of the circuit board.

[0009] However, since the conductive particles in the conductive resin layer are in a dispersed form, the conductive resin layer forms a polymer-metal bond with weak adhesion with the sintered electrode, which may cause warping or peeling at the interface. In addition, the conductive resin layer may have a problem of poor conductivity due to the dispersed form of the conductive particles.

[0010] In addition, since the sintered electrode and the conductive resin layer are generally formed using a dipping method, the thickness of the corner portion of the external electrode may become thinner, and thus there may be a risk of deterioration of moisture resistance reliability or increase in equivalent series resistance (ESR). Summary of the invention

[0011] An aspect of the present disclosure is to provide a multilayer electronic component having excellent reliability.

[0012] An aspect of the present disclosure is to provide a multilayer electronic component having excellent moisture resistance reliability.

[0013] An aspect of the present disclosure is to provide a multilayer electronic component having low equivalent series resistance (ESR).

[0014] An aspect of the present disclosure is to provide a multilayer electronic component having excellent bending strength.

[0015] However, the purpose of the present disclosure is not limited to the above contents and may be more easily understood in the course of explaining specific embodiments of the present disclosure.

[0016] According to one aspect of the present disclosure, a multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; and an external electrode arranged on the body, wherein each of the third surface and the fourth surface of the body may include an exposed portion that alternately exposes the internal electrodes and the dielectric layer located between the internal electrodes and a non-exposed portion other than the exposed portion, the external electrode may include a base electrode layer, an intermediate electrode layer arranged on the base electrode layer, and an upper electrode layer arranged on the intermediate electrode layer, the base electrode layer may be arranged on the exposed portion and the non-exposed portion, the intermediate electrode layer may be arranged on the non-exposed portion, and the upper electrode layer may be arranged on the non-exposed portion, the base electrode layer may include a first metal, the intermediate electrode layer may include a second metal and a first resin, and the upper electrode layer may include Sn and a second resin.

[0017] According to another aspect of the present disclosure, an electronic component may include a main body and an external electrode, and the external electrode may include: a basic electrode layer, including a first metal, disposed on the entire first surface of the main body and extending to a portion of at least one other surface of the main body connected to the first surface; an intermediate electrode layer, disposed on a portion of the first surface and on a corner connecting the first surface and the at least one other surface, and including a second metal and a first resin; and an upper electrode layer, disposed on the intermediate electrode layer and the basic electrode layer, and including Sn and a second resin.

[0018] According to yet another aspect of the present disclosure, an electronic device may include the electronic component as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through reference to the accompanying drawings and the following detailed description.

[0020] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0021] Figure 2 Schematically shows the Figure 1 A cross-sectional view taken along line II'.

[0022] Figure 3 Schematically shows the Figure 1 A cross-sectional view taken along line II-II'.

[0023] Figure 4 It is shown Figure 1 An exploded perspective view of a main body of the invention is in an exploded state.

[0024] Figure 5 yes Figure 2 An enlarged view of the first outer electrode in FIG.

[0025] Figure 6 It is shown Figure 2 Magnified view of area K1.

[0026] Figure 7 It is shown Figure 2 Magnified view of area K2.

[0027] Figure 8 is a diagram showing a method according to another embodiment Figure 2 Magnified view of area K1.

[0028] Fig. 9 is a diagram showing a method according to another embodiment Figure 2 Magnified view of area K1.

[0029] Fig.10 yes Figure 2 Image of area K2 scanned with a scanning electron microscope (SEM).

[0030] Fig.11A yes Fig.10 The enlarged image of area K3, Fig. 11B is Fig.10 The image of the Ag content in area K3 analyzed by SEM-energy dispersive spectrometer (EDS), and Fig. 11C is Fig.10 An image of the Cu element content in area K3 analyzed by SEM-EDS.

[0031] Fig.12 yes Figure 2 Scanning electron microscope image of region K1.

[0032] Fig.13A yes Fig.12 The enlarged image of area K4, Fig. 13B is Fig.12 Image of the content of the Ag element in area K4 analyzed by SEM-EDS, Fig. 13C is Fig.12 An image of the Cu element content in region K4 analyzed by SEM-EDS, and Fig.13D is Fig.12 An image of the content of the Sn element in area K4 analyzed by SEM-EDS.

[0033] Fig.14 is a multilayer electronic component according to another embodiment of the present disclosure corresponding to Figure 2 .

[0034] Fig.15 A multilayer electronic component according to another embodiment of the present disclosure corresponds to Figure 2 . DETAILED DESCRIPTION

[0035] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and the scope of the present disclosure will be fully conveyed to those skilled in the art. Therefore, for clear description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements indicated by the same or similar reference numerals in the accompanying drawings are the same or similar elements.

[0036] In the accompanying drawings, in order to clearly describe the present disclosure, irrelevant descriptions will be omitted, and in order to clearly represent multiple layers and multiple regions, the thickness may be exaggerated. The same or similar reference numerals will be used to describe the same or similar elements with the same functions within the scope of the same concept. Throughout the specification, unless otherwise specifically stated, when a component is referred to as "including" or "comprising", it means that the component may further include other components, rather than excluding other components.

[0037] In the drawings, the first direction may refer to a stacking direction or a thickness (T) direction, the second direction may refer to a length (L) direction, and the third direction may refer to a width (W) direction.

[0038] Multilayer electronic components Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is schematically shown.

[0039] Figure 2 Schematically shows the Figure 1 A cross-sectional view taken along line II'.

[0040] Figure 3 Schematically shows the Figure 1 A cross-sectional view taken along line II-II'.

[0041] Figure 4 It is shown Figure 1 An exploded stereogram of a main body of the invention is in an exploded state.

[0042] Figure 5 yes Figure 2 An enlarged view of the first outer electrode in FIG.

[0043] Figure 6 It is shown Figure 2 Magnified view of area K1.

[0044] Figure 7 It is shown Figure 2 Magnified view of area K2.

[0045] In the following, reference will be made to Figures 1 to 7 The multilayer electronic component 100 according to an embodiment of the present disclosure is described in detail. A multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the present disclosure is not limited thereto, and the multilayer electronic component may also include various multilayer electronic components using ceramic materials, or the multilayer electronic component may also include various electronic components such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0046] The multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer, the body 110 having a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and opposite to each other in a third direction; and external electrodes 131 and 132 disposed on the body, wherein each of the third surface and the fourth surface may include an exposed portion EP where the internal electrode and the dielectric layer located between the internal electrodes are exposed and other portions other than the exposed portion. The non-exposed portion NEP, the external electrode may include base electrode layers 131a and 132a, intermediate electrode layers 131b and 132b disposed on the base electrode layers, and upper electrode layers 131c and 132c disposed on the intermediate electrode layers, the base electrode layers 131a and 132a may be disposed on the exposed portion EP and the non-exposed portion NEP, the intermediate electrode layers 131b and 132b may be disposed on the non-exposed portion NEP, and the upper electrode layers 131c and 132c may be disposed on the non-exposed portion NEP, and the base electrode layers 131a and 132a may include metal, the intermediate electrode layers 131b and 132b may include metal and resin, and the upper electrode layers 131c and 132c may include Sn and resin. "A layer is disposed on the exposed portion or the non-exposed portion" may mean that the layer and the exposed portion or the non-exposed portion overlap each other in the second direction.

[0047] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present disclosure will be described.

[0048] The body 110 has dielectric layers 111 and internal electrodes 121 and 122 alternately stacked therein.

[0049] The body 110 is not limited to a specific shape and may have a hexahedral shape or a shape similar to a hexahedral shape as shown in the drawings. Since the ceramic powder included in the body 110 shrinks in the process of sintering the body, the body 110 may not have a hexahedral shape having perfect straight lines. However, the body 110 may have a substantially hexahedral shape.

[0050] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in a third direction. The first surface 1 may be a mounting surface disposed opposite to a substrate when the multilayer electronic component 100 is mounted on a substrate.

[0051] Since the edge regions of the dielectric layer 111 where the internal electrodes 121 and 122 are not provided overlap each other, a step may be formed due to the thickness of the internal electrodes 121 and 122, so that when viewed relative to the first surface, a corner connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is contracted toward the center of the body 110 in the first direction, and / or when viewed relative to the second surface, a corner connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is contracted toward the center of the body 110 in the first direction. Alternatively, due to shrinkage behavior during the sintering process of the body, when viewed relative to the first surface, a corner connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is contracted toward the center of the body 110 in the first direction, and / or when viewed relative to the second surface, a corner connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is contracted toward the center of the body 110 in the first direction. Optionally, since the edges connecting the various surfaces of the body 110 to each other are rounded by performing an additional process to prevent chipping defects, etc., the corners connecting the first surface with the third surface to the sixth surface and / or the corners connecting the second surface with the third surface to the sixth surface may have a rounded shape.

[0052] In addition, in order to suppress the steps formed by the internal electrodes 121 and 122, the stacked body is cut after the dielectric layer 111 on which the internal electrodes 121 and 122 are formed is stacked, so that the cut stacked body includes the capacitor forming portion Ac and the internal electrodes 121 and 122 are exposed to the two side surfaces of the capacitor forming portion Ac in the third direction, and then the edge portions 114 and 115 are formed by stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the cut stacked body in the third direction (width direction), so that the portion connecting the first surface to the fifth surface and the sixth surface and the portion connecting the second surface to the fifth surface and the sixth surface may not have a contracted form.

[0053] Each of the third and fourth surfaces of the body may include an exposure portion EP exposing the internal electrodes 121 and 122 and the dielectric layer 111 between the internal electrodes 121 and 122 , and a non-exposure portion NEP except the exposure portion.

[0054] In the exposed portion EP of the third surface 3 of the main body, the first internal electrode 121 and the dielectric layer may be alternately exposed, and in the exposed portion EP of the fourth surface 4 of the main body, the second internal electrode 122 and the dielectric layer 111 may be alternately exposed. Additionally, the exposed portion EP may refer to the area from the internal electrodes 121 and 122 located at the top in the first direction to the internal electrodes 121 and 122 located at the bottom in the first direction. Furthermore, in the present disclosure, the first surface, the second surface, the fifth surface, and the sixth surface of the main body may be substantially flat surfaces, and the main body may include corners connecting each of the third surface and the fourth surface to the first surface, the second surface, the fifth surface, and the sixth surface.

[0055] The plurality of dielectric layers 111 for forming the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that the boundary between adjacent dielectric layers 111 may not be easily distinguishable without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and may be determined in consideration of the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more dielectric layers.

[0056] The dielectric layer 111 may include a dielectric material and may be formed by the following method: preparing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, coating the slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient electrostatic capacitance can be obtained using it. However, for example, barium titanate (BaTiO3)-based powder may be used as the ceramic powder. For a more specific example, the ceramic powder may be barium titanate (BaTiO3)-based powder, CaZrO3-based paraelectric powder, etc. For a more specific example, the barium titanate (BaTiO3)-based powder may be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) and at least one of (Ca 1-x Sr x )(Zr 1- y Ti y )O3 (0 < x < 1, 0 < y < 1). The CaZrO3-based paraelectric powder may be (Ca

[0057] Therefore, the dielectric layer 111 may include at least one of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1). In an embodiment, the dielectric layer 111 may include (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) as a main component.

[0058] In addition, when a magnetic material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can be used as an inductor. The magnetic material may be, for example, ferrite and / or metal magnetic particles. When the multilayer electronic component is used as an inductor, the internal electrode may be a coil-type conductor.

[0059] In addition, when a piezoelectric material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can be used as a piezoelectric element. The piezoelectric material may be, for example, lead zirconate titanate (PZT).

[0060] In addition, when a ZnO-based material or a SiC-based material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can be used as a varistor, and when a spinel-based material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can be used as a thermistor.

[0061] That is, by appropriately changing the material or structure of the main body 110, the multilayer electronic component 100 according to the embodiments of the present disclosure can be used as an inductor, a piezoelectric element, a varistor, or a thermistor, as well as a multilayer ceramic capacitor.

[0062] The main body 110 may include: a capacitance forming portion Ac, provided in the main body 110, and including a first internal electrode 121 and a second internal electrode 122 arranged to face each other with the dielectric layer 111 interposed therebetween, and a capacitance is formed in the capacitance forming portion Ac; and covering portions 112 and 113, formed above and below the capacitance forming portion Ac in a first direction.

[0063] In addition, the capacitance forming portion Ac is a portion for contributing to the capacitance formation of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0064] The cover portions 112 and 113 may include an upper cover portion 112 disposed above the capacitance forming portion Ac in the first direction, and a lower cover portion 113 disposed below the capacitance forming portion Ac in the first direction.

[0065] The upper cover 112 and the lower cover 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming part Ac in the thickness direction, respectively, and the upper cover 112 and the lower cover 113 may be basically used to prevent damage to the internal electrode due to physical stress or chemical stress.

[0066] The upper cover 112 and the lower cover 113 do not include an internal electrode, and may include the same material as that of the dielectric layer 111 .

[0067] That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0068] In addition, the thickness of the covering parts 112 and 113 is not particularly limited. For example, the thickness tc of the covering parts 112 and 113 may be 100 μm or less, 30 μm or less, and 20 μm or less. Here, the average thickness of the covering parts 112 and 113 means the average thickness of each of the first covering part 112 and the second covering part 113.

[0069] The average thickness tc of the covering portions 112 and 113 may represent the dimensions of the covering portions 112 and 113 in the first direction, and may be a value obtained by averaging the dimensions of the covering portions 112 and 113 in the first direction measured at five points equally spaced in the second direction in a cross-section of the main body 110 in the first and second directions taken from the center of the main body 110 in the third direction.

[0070] In addition, edge portions 114 and 115 may be provided on the side surface of the capacitance forming portion Ac in the third direction.

[0071] The edge portions 114 and 115 may include: a first edge portion 114 disposed on one side surface of the capacitance forming portion Ac in the third direction; and a second edge portion 115 disposed on the other side surface of the capacitance forming portion Ac in the third direction. That is, the edge portions 114 and 115 may be disposed on both side surfaces of the capacitance forming portion Ac in the width direction.

[0072] Edges 114 and 115 may represent: Figure 3 The region between both ends of each of the first and second internal electrodes 121 and 122 and the outer surface of the body 110 in the cross section of the body 110 taken along the width-thickness (WT) direction is shown.

[0073] The edge portions 114 and 115 may serve to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0074] The edge portions 114 and 115 may be formed by applying a conductive paste to regions of the ceramic green sheet excluding regions where the edge portions are to be formed to form internal electrodes.

[0075] In addition, in order to suppress the steps formed by the internal electrodes 121 and 122, the stacked body is cut after stacking the dielectric layer 111 on which the internal electrodes 121 and 122 are formed, so that the cut stacked body includes the capacitor forming portion Ac and the internal electrodes 121 and 122 are exposed to the two side surfaces of the capacitor forming portion Ac in the third direction, and then the edge portions 114 and 115 can be formed by stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the cut stacked body in the third direction (width direction).

[0076] In addition, the width of the edge portions 114 and 115 is not particularly limited. For example, the average width of the edge portions 114 and 115 may be 100 μm or less, 20 μm or less, or 15 μm or less. Here, the average width of the edge portions 114 and 115 means the average width of each of the first edge portion 114 and the second edge portion 115.

[0077] The average width of the edge portions 114 and 115 may represent: an average size of an area where the inner electrode is spaced apart from the fifth surface in a third direction (i.e., a width direction) and / or an average size of an area where the inner electrode is spaced apart from the sixth surface in the third direction (i.e., a width direction), and may be a value obtained by averaging the sizes of the edge portions 114 and 115 in the third direction measured at five points equally spaced apart on the side surface of the capacitor forming portion Ac.

[0078] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed opposite to each other with the dielectric layer 111 interposed therebetween to form the body 110, and the first internal electrodes 121 and the second internal electrodes 122 may be exposed to the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0079] The first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. The first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0080] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance. In addition, each of the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth and sixth surfaces of the body 110.

[0081] The conductive metal included in the internal electrodes 121 and 122 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present disclosure is not limited thereto.

[0082] The average thickness td of the dielectric layer 111 is not particularly limited, but for example, the average thickness td of the dielectric layer 111 may be 0.01 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 is not particularly limited, but for example, the average thickness te of the internal electrodes 121 and 122 may be 0.05 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be arbitrarily set according to desired characteristics or purposes.

[0083] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 represent the size of the dielectric layer 111 in the first direction and the size of the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross section of the body 110 in the first direction and the second direction at a magnification of 10,000 times with a scanning electron microscope (SEM). More specifically, the average thickness td of the dielectric layer 111 can be obtained by measuring the thickness of the dielectric layer 111 at a plurality of points (for example, at 30 points equally spaced in the second direction) and averaging the measured thicknesses. In addition, the average thickness te of the internal electrodes 121 and 122 can be obtained in the same manner. 30 points equally spaced can be specified in the capacitor forming portion Ac. Furthermore, if the average thickness is obtained by extending the thickness measurement to 10 dielectric layers 111 and 10 internal electrodes 121 and 122 , the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be more generalized.

[0084] The external electrodes 131 and 132 may be disposed on the body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, which are respectively disposed on the third and fourth surfaces 3 and 4 of the body 110 and connected to the first and second internal electrodes 121 and 122, respectively.

[0085] The external electrodes 131 and 132 may include base electrode layers 131 a and 132 a , intermediate electrode layers 131 b and 132 b disposed on the base electrode layers, and upper electrode layers 131 c and 132 c disposed on the intermediate electrode layers.

[0086] In an embodiment, the external electrodes 131 and 132 may include band portions P1b and P2b extending to a portion of at least one of the first surface, the second surface, the fifth surface, and the sixth surface, and the band portions P1b and P2b may include a portion of the base electrode layers 131a and 132a, a portion of the intermediate electrode layers 131b and 132b, and a portion of the upper electrode layers 131c and 132c. Since the external electrodes 131 and 132 include the band portions P1b and P2b, the external electrodes 131 and 132 may be easily mounted on the substrate. In addition, the portions of the external electrodes 131 and 132 disposed on the exposed portion EP of the third surface and the exposed portion EP of the fourth surface may be referred to as connecting portions P1a and P2a, and the regions of the external electrodes 131 and 132 disposed between the extension line E1 of the first surface and the extension line E2 of the second surface except for the connecting portions may be referred to as corners P1c and P2c.

[0087] Figure 6 and Figure 7 1 and 13 are enlarged views showing the region K1 and the region K2 of the first external electrode 131, respectively. Since the difference between the first external electrode 131 and the second external electrode 132 is that the first external electrode 131 is disposed on the third surface and the second external electrode 132 is disposed on the fourth surface (other than that, the first external electrode 131 and the second external electrode 132 have similar structures and compositions), it is considered that Figure 6 and Figure 7 The configuration and composition of the first external electrode 131 shown in FIG. 1 are also applicable to the second external electrode 132. Figure 6 and Figure 7 Both the first external electrode 131 and the second external electrode 132 are described based on .

[0088] The base electrode layers 131a and 132a may include metal and may be disposed on both the exposure portion EP and the non-exposure portion NEP. The base electrode layers 131a and 132a may directly contact the internal electrodes 121 and 122 for electrically connecting the external electrodes 131 and 132 with the internal electrodes 121 and 122.

[0089] In an embodiment, the base electrode layers 131a and 132a may further include glass. Since the base electrode layers 131a and 132a further include glass, the bonding force with the body may be improved, thereby improving the bonding force between the external electrodes 131 and 132 and the body 110. The base electrode layers 131a and 132a may be sintered electrodes formed by applying a paste including glass and metal to the body and sintering it.

[0090] As the metal included in the base electrode layers 131a and 132a, a material having excellent conductivity can be used and the present disclosure is not particularly limited. For example, the metal included in the base electrode layers 131a and 132a may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and more preferably, may be Cu.

[0091] The intermediate electrode layers 131 b and 132 b may include metal 131 b - 2 (or hereinafter referred to as “metal particles 131 b - 2 ”) and resin 131 b - 1 , and may be disposed on the third surface non-exposed portion NEP and the fourth surface non-exposed portion NEP.

[0092] The intermediate electrode layers 131b and 132b may be disposed on the non-exposed portion NEP to prevent the corners of the external electrodes 131 and 132 from being thin. In addition, since the intermediate electrode layers 131b and 132b include the resin 131b-1, the intermediate electrode layers 131b and 132b may be used to improve the bending strength of the multilayer electronic component 100.

[0093] The method for forming the intermediate electrode layers 131b and 132b is not limited to a specific method. For example, the intermediate electrode layers 131b and 132b may be formed by applying a paste including a metal 131b-2 and a resin 131b-1 to the corners of the base electrode layers 131a and 132a and curing it.

[0094] The intermediate electrode layers 131b and 132b may be further disposed on a portion of the exposure portion EP. That is, the intermediate electrode layers 131b and 132b are not necessarily disposed only on the non-exposure portion NEP but may be disposed to extend from the non-exposure portion NEP to a portion of the exposure portion EP.

[0095] However, it is preferred that the intermediate electrode layers 131b and 132b are not disposed on the exposed portion EP. When the intermediate electrode layers 131b and 132b are disposed on the entire exposed portion EP, the thickness of the external electrode becomes thicker, which may reduce the capacitance per unit volume of the multilayer electronic component.

[0096] The resin 131 b - 1 included in the intermediate electrode layers 131 b and 132 b may include a thermosetting resin having electrical insulating properties.

[0097] In this case, the thermosetting resin may be, for example, an epoxy resin, but the present disclosure is not limited thereto, and may be, for example, a bisphenol A resin, an ethylene glycol epoxy resin, a noblock epoxy resin, or a derivative thereof having a low molecular weight and being liquid at room temperature.

[0098] In an embodiment, the metal 131 b - 2 included in the intermediate electrode layers 131 b and 132 b may include Ag.

[0099] Generally, in the case where the conductive resin layer includes metal and resin, since the metal included in the conductive resin layer is dispersed in the conductive resin layer in the form of particles, a problem of weak conductivity may occur. Ag has strong conductivity, so even if Ag is dispersed in the intermediate electrode layers 131b and 132b in the form of particles, the reduction of equivalent series resistance (ESR) can be suppressed. However, Ag is known to be the metal that is most susceptible to ion migration. Ion migration refers to the movement and precipitation of metal ions as metal dendrites when voltage is applied. If ion migration occurs, cracks may occur in the plating layer and the base electrode layer of the external electrode (even in the body), and deterioration of insulation resistance due to current leakage and short circuit between the first external electrode 131 and the second external electrode 132 may occur. According to an embodiment of the present disclosure, since the upper electrode layers 131c and 132c containing Sn and resin are disposed on the intermediate electrode layers 131b and 132b, even if the intermediate electrode layers 131b and 132b contain Ag, the occurrence of ion migration can be minimized and the reduction of ESR can be suppressed. Since Sn included in the upper electrode layers 131c and 132c has a low melting point, an intermetallic compound can be easily formed even at the solidification temperature of the upper electrode layers 131c and 132c, and the intermetallic compound of the upper electrode layers 131c and 132c can be used to suppress the movement of Ag ions in the intermediate electrode layers 131b and 132b.

[0100] In addition, when the metal included in the base electrode layers 131a and 132a is Cu and the intermediate electrode layers 131b and 132b contain Ag (Ag has a higher standard reduction potential than Cu included in the base electrode layers 131a and 132a), oxidation of the base electrode layers 131a and 132a can be prevented and moisture can be prevented from penetrating into the base electrode layers 131a and 132a. In addition, when the metal included in the base electrode layers 131a and 132a is Cu, a Cu-Ag alloy layer can be formed at the interface between the intermediate electrode layers 131b and 132b and the base electrode layers 131a and 132a, so that the mechanical bonding force and electrical connectivity of the base electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b can be improved, and moisture resistance reliability can be further improved.

[0101] The metal 131b-2 included in the intermediate electrode layers 131b and 132b may exist in the form of metal particles. The metal included in the intermediate electrode layers 131b and 132b may exist in the form of a plurality of randomly dispersed metal particles 131b-2. Figure 7As shown in , the plurality of metal particles 131b-2 may be a mixture of spherical particles SP and flake particles FP. Therefore, the conductivity of the intermediate electrode layers 131b and 132b may be further improved. However, the present disclosure is not limited thereto, and the plurality of metal particles 131b-2 may be formed using only spherical particles SP or may be formed using only flake particles FP. Alternatively, the metal 131b-2 may also have the form of an intermetallic compound or alloy. In this article, the metal particles may be represented by the reference numeral 131b-2 to facilitate the description of the position and shape of the metal particles.

[0102] The average size of the metal particles 131b-2 does not need to be particularly limited. For example, the average size of the metal particles 131b-2 can be 0.2μm to 20μm. In addition, the average size of the metal particles 131b-2 can be measured from an image obtained by scanning a cross section (LT cross section) in the first direction and the second direction taken from the central part of the body in the third direction of the multilayer electronic component 100 using an SEM. The sizes of 10 or more metal particles 131b-2 can be obtained from the above image and the sizes are averaged to obtain the average size of the metal particles 131b-2. In addition, assuming that the virtual circle has the same area as the area of ​​one metal particle 131b-2, the size of the one metal particle 131b-2 can be set to the diameter of the virtual circle.

[0103] Fig.10 yes Figure 2 Scanning electron microscope (SEM) image of region K2. Fig.10 It can be confirmed that the plurality of metal particles 131 b - 2 are a mixture of spherical particles SP and flake particles FP and are randomly dispersed and arranged.

[0104] In addition, it can be confirmed that the first alloy layer Lab is provided at the interface between the base electrode layer 131a and the intermediate electrode layer 131b. Fig.11A ( Fig.10 ), the first alloy layer Lab is clearly observed, and the first alloy layer Lab can be distinguished by the light and dark difference between the metal particles 131b-2 of the base electrode layer 131a and the intermediate electrode layer 131b.

[0105] Fig. 11B is Fig.10 An image of the content of the Ag element in the region K3 analyzed by SEM-EDS, and Fig. 11C is Fig.10 The image of the Cu content in the region K3 analyzed by SEM-EDS. Fig. 11B and Fig. 11C , it can be confirmed that the first alloy layer Lab is a Cu-Ag alloy.

[0106] Therefore, in an embodiment, a first alloy layer Lab including a Cu-Ag alloy may be provided at an interface between the base electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b. The first alloy layer Lab may be formed by interdiffusion of Cu contained in the base electrode layers 131a and 132a and Ag contained in the intermediate electrode layers 131b and 132b through heat treatment of the intermediate electrode layers 131b and 132b, heat treatment of the upper electrode layers 131c and 132c, or a separate heat treatment process. In this case, the Cu-Ag alloy may be Ag. 15 Cu6 and Ag 11 One or two of Cu4.

[0107] The first alloy layer Lab may be used to improve the mechanical bonding force and electrical connectivity between the base electrode layers 131 a and 132 a and the intermediate electrode layers 131 b and 132 b , and thus, the first alloy layer Lab may further improve the ESR reducing effect of the present disclosure.

[0108] In addition, the thickness of the first alloy layer Lab is not particularly limited, but may be, for example, greater than or equal to 10 nm and less than or equal to 500 nm.

[0109] In an embodiment, the first alloy layer Lab may be intermittently provided at the interface between the base electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b. However, the present disclosure is not limited thereto, and as Fig.14 and Fig.15 As shown in , it can be observed that the first alloy layers Lab' and Lab" are a single layer.

[0110] In an embodiment, when the length in the first direction from the extension line E1 of the first surface to the extension line E2 of the second surface is T, and the sum of the lengths in the first direction of the portion of each of the intermediate electrode layers 131b and 132b disposed between the extension line E1 of the first surface and the extension line E2 of the second surface is BS, BS / T may be greater than or equal to 0.2 and less than or equal to 0.6.

[0111] When BS / T is less than 0.2, there may be a risk that the effect of improving moisture resistance reliability may be insufficient, and when BS / T exceeds 0.6, the thickness of the external electrode may become too thick and the capacitance per unit volume may decrease.

[0112] Reference Figure 5, BS can be measured from a cross section of the multilayer electronic component 100 in the first direction and the second direction (the cross section is cut from the center of the body in the third direction), and BS represents the sum of BS1 and BS2, BS1 is the length in the first direction from the extension line E1 of the first surface to the position where the middle electrode layer is disconnected, and BS2 is the length in the first direction from the extension line E2 of the second surface to the position where the middle electrode layer is disconnected. Figure 5 The first external electrode 131 is shown, but the relevant dimensions of the second external electrode 132 can also be measured in the same manner.

[0113] Here, in a cross section (LT cross section) in the length-thickness direction taken from the center in the width direction of the multilayer electronic component 100, when there are seven straight lines parallel to the first direction that are evenly spaced from the third surface 3 to the fourth surface 4 in the length direction, a straight line passing through a point where the third straight line intersects the first surface and a point where the fifth straight line intersects the first surface can be defined as an extension line E1 of the first surface. An extension line E2 of the second surface can also be defined based on the second surface in the same manner as the extension line of the first surface.

[0114] In the embodiment, in the strip portions P1b and P2b, one end of the intermediate electrode layers 131b and 132b may be set to cover one end of the base electrode layers 131a and 132a. In addition, in the strip portions P1b and P2b, one end of the upper electrode layers 131c and 132c may be set to cover one end of the intermediate electrode layers 131b and 132b. Therefore, by hermetically sealing the base electrode layers 131a and 132a together with the upper electrode layers 131c and 132c through the intermediate electrode layers 131b and 132b, the bending strength of the multilayer electronic component can be further improved, and the moisture resistance reliability can be further improved.

[0115] In this case, the other ends of the intermediate electrode layers 131b and 132b may be disposed on the exposed portion EP. However, the present disclosure is not limited thereto, and the other ends of the intermediate electrode layers 131b and 132b may also be disposed on the non-exposed portion NEP.

[0116] The upper electrode layers 131c and 132c include tin (Sn) 131c-2 (or hereinafter referred to as "Sn 131c-2" or "intermetallic compound 131c-2 containing Sn") and resin 131c-1, and may be disposed on the non-exposed portion NEP of the third surface and the non-exposed portion NEP of the fourth surface. The upper electrode layers 131c and 132c may improve the bending strength of the multilayer electronic component 100, and play a role in minimizing ion migration caused by the metal included in the intermediate electrode layers 132b and 132b. Tin (Sn) 131c-2 represents a portion of the upper electrode layers 131c and 132c containing Sn, and may exist in the form of metal particles and / or an intermetallic compound.

[0117] In an embodiment, the upper electrode layers 131c and 132c may be further disposed on the exposed portion EP. That is, like the base electrode layers 131a and 132a, the upper electrode layers 131c and 132c may be disposed on both the non-exposed portion NEP and the exposed portion EP. The base electrode layers 131a and 132a and the upper electrode layers 131c and 132c are continuously disposed on both the non-exposed portion NEP and the exposed portion EP, while the intermediate electrode layers 131b and 132b are discontinuously disposed on both the non-exposed portion NEP and the exposed portion EP.

[0118] The resin 131 c - 1 included in the upper electrode layers 131 c and 132 c may include a thermosetting resin having electrical insulating properties.

[0119] In this case, the thermosetting resin may be, for example, an epoxy resin, but the present disclosure is not limited thereto, and may be, for example, a bisphenol A resin, an ethylene glycol epoxy resin, a non-block epoxy resin, or a derivative thereof having a low molecular weight and being liquid at room temperature.

[0120] In addition, the resin 131c-1 included in the upper electrode layers 131c and 132c may be the same type of resin as the resin 131b-1 included in the intermediate electrode layers 131b and 132b, but the present disclosure is not limited thereto. The resin 131c-1 included in the upper electrode layers 131c and 132c and the resin 131b-1 included in the intermediate electrode layers 131b and 132b may be different types of resins.

[0121] In an embodiment, the upper electrode layers 131c and 132c may include an intermetallic compound including Sn. That is, at least a portion of Sn131c-2 may exist in the form of an intermetallic compound.

[0122] Generally, in the case of forming a conductive resin layer by coating a paste including a metal and a resin and curing it, the melting point of the metal is higher than the curing temperature of the resin, so the metal is generally included in the form of metal particles. On the other hand, according to an embodiment of the present disclosure, since the upper electrode layers 131c and 132c contain Sn having a low melting point, Sn can be melted to easily form an intermetallic compound even at the curing temperature of the upper electrode layers 131c and 132c. The intermetallic compound of the upper electrode layers 131c and 132c can play a role in minimizing the occurrence of Ag ion migration by suppressing the movement of Ag ions in the intermediate electrode layers 131b and 132b.

[0123] In addition, in the case where the conductive resin layer includes Sn and resin, since Sn melts during the curing process, the corners may become thinner after the curing process than when applied before the curing process, and there may be a risk that the moisture resistance reliability will be reduced accordingly. That is, compared with the conductive resin layer without Sn, when the conductive resin layer including Sn and resin is formed on the sintered electrode, the conductive resin layer needs to be applied thicker to ensure the thickness of the corners. On the other hand, according to the embodiment of the present disclosure, since the intermediate electrode layers 131b and 132b are provided on the non-exposed portion NEP, the moisture resistance reliability can be ensured even if the upper electrode layers 131c and 132c including Sn and resin are not thickly applied.

[0124] The intermetallic compound containing Sn of the upper electrode layers 131 c and 132 c may be, for example, a tin (Sn)-bismuth (Bi) alloy, a tin (Sn)-lead (Pb) alloy, a tin (Sn)-copper (Cu) alloy, a tin (Sn)-silver (Ag) alloy, a tin (Sn)-silver (Ag)-copper (Cu) alloy, or the like.

[0125] In addition, if Figure 6 As shown in FIG. 1 , when observing the cross section of the upper electrode layers 131c and 132c, it can be observed that Sn 131c-2 is widely diffused and connected to each other. Therefore, compared with the case where the metal exists only in the form of metal particles in the conductive resin layer, the electrical connectivity can be improved and the ESR can be reduced.

[0126] In addition, the intermetallic compound 131 c - 2 including Sn may minimize internal stress within the body 110 , and may improve high temperature load characteristics and moisture resistance characteristics.

[0127] Fig.12 yes Figure 2 Scanning electron microscope image of region K1. Fig.12 It can be seen that Sn131c-2 does not exist in the form of metal particles but in a widely diffused and interconnected form.

[0128] In an embodiment, a second alloy layer Lac including a Cu—Sn alloy may be disposed at an interface between the base electrode layer 131 a and the upper electrode layer 131 c .

[0129] The second alloy layer Lac may be formed by mutual diffusion of Cu contained in the base electrode layers 131a and 132a and Sn contained in the intermediate electrode layers 131b and 132b through hardening heat treatment of the upper electrode layers 131c and 132c or a separate heat treatment process.

[0130] The second alloy layer Lac may be used to improve the mechanical bonding force and electrical connectivity between the base electrode layers 131 a and 132 a and the upper electrode layers 131 c and 132 c , and thus, the ESR reducing effect of the present disclosure may be further improved.

[0131] In this case, the Cu-Sn alloy of the second alloy layer Lac may be Cu3Sn. When the intermetallic compound 131c-2 of the upper electrode layer is Cu3Sn, it may be difficult to distinguish between the second alloy layer Lac and the intermetallic compound 131c-2. Herein, the intermetallic compound may be represented by the reference numeral 131c-2 to facilitate the description of the position and shape of the intermetallic compound containing Sn.

[0132] In an embodiment, the second alloy layer Lac may be intermittently disposed at the interface between the base electrode layers 131a and 132a and the upper electrode layers 131c and 132c. Fig.15 As shown, the second alloy layer Lac'' is disposed discontinuously. However, the present disclosure is not limited thereto, and as Fig.14 As shown in , it can be observed that the second alloy layer Lac' is a single layer.

[0133] Furthermore, the thickness of the second alloy layers Lac, Lac′, and Lac″ does not need to be particularly limited, but may be, for example, greater than or equal to 10 nm and less than or equal to 500 nm.

[0134] Fig.13A yes Fig.12 The enlarged image of area K4, Fig. 13B is Fig.12 Image of the content of the Ag element in area K4 analyzed by SEM-EDS, Fig. 13C is Fig.12 An image of the Cu element content in region K4 analyzed by SEM-EDS, and Fig.13D is Fig.12 The image of the content of Sn element in the area K4 analyzed by SEM-EDS. FIG. 13A to FIG. 13D It can be confirmed that a second alloy layer Lac including a Cu-Sn alloy is provided at the interface between the base electrode layer 131a and the upper electrode layer 131c. In addition, it can be confirmed that at least a portion of Sn 131c-2 forms an intermetallic compound with Ag and exists in the form of a tin (Sn)-silver (Ag) alloy.

[0135] In addition, the metal included in the upper electrode layers 131 c and 132 c is not limited to Sn 131 c - 2 and an intermetallic compound including Sn.

[0136] Reference Figure 8In an embodiment, the upper electrode layers 131c' and 132c' may further include a plurality of metal particles 131c-3', and Sn 131c-2' may be provided to connect at least a portion of the plurality of metal particles 131c-3'. That is, the upper electrode layers 131c' and 132c' may include: a plurality of metal particles 131c-3'; Sn 131c-2', provided to connect at least a portion of the plurality of metal particles 131c-3'; and resin 131c-1'.

[0137] In this case, the plurality of metal particles 131c-3' may include one or both of Ag particles and Cu particles. In addition, at least a portion of Sn 131c-2' may exist in the form of an intermetallic compound, for example, one or more of Ag3Sn, Cu6Sn5, and Cu3Sn.

[0138] Sn 131c-2' may be used to improve electrical connectivity by connecting at least a portion of the plurality of metal particles. In addition, even if the plurality of metal particles 131c-3' include Ag, ion migration may be suppressed by Sn 131c-2'. Sn 131c-2' may be provided to surround at least a portion of the plurality of metal particles 131c-3'. In addition, since at least a portion of Sn 131c-2' exists in the form of an intermetallic compound, internal stress within the body 110 may be minimized and high temperature load characteristics and moisture resistance characteristics may be improved.

[0139] In this case, the intermetallic compound may be an intermetallic compound between the low melting point metal and the metal particles. The low melting point metal included in the conductive resin layer paste may be partially melted during the drying and hardening heat treatment process and form the intermetallic compound with a portion of the metal particles.

[0140] For a more specific example, the low melting point metal may be selected from Sn, Sn 96.5 Ag 3.0 Cu 0.5 Sn 42 Bi 58 and Sn 72 Bi 28 After the paste for the conductive resin layer is applied to the body, Sn may melt during the drying and curing process, and the melted Sn may wet metal particles such as Ag or Cu having a high melting point by capillary action, and may react with a portion of the metal particles such as Ag or Cu to form an intermetallic compound such as Ag3Sn, Cu6Sn5, Cu3Sn, etc. The Ag or Cu that does not participate in the reaction remains in the form of metal particles 131c-3', such as Figure 8 as shown in .

[0141] Since Sn 131c-2' is provided to connect at least a portion of the plurality of metal particles 131c-3', electrical connectivity can be sufficiently ensured even if the metal particles 131c-3' exist only as spherical particles. Therefore, the metal particles 131c-3' may consist of only spherical particles. However, the present disclosure need not be limited thereto, and as Fig. 9 As shown in , the upper electrode layer 131c ″ may include: a plurality of metal particles 131c-3 ″, in which spherical particles SP and flake particles FP are mixed; Sn 131c-2 ″, which is configured to connect at least a portion of the plurality of metal particles 131c-3 ″; and a resin 131c-1 ″. In addition, the metal particles may include only flake particles.

[0142] like Figure 2 As shown, in an embodiment, the upper electrode layers 131c and 132c may be arranged to cover the middle electrode layers 131b and 132b. Since the upper electrode layers 131c and 132c are arranged to cover the middle electrode layers 131b and 132b (eg, to cover the entire middle electrode layers 131b and 132b), the effect of minimizing ion migration may be further improved.

[0143] Figure 2 It is illustrated that the upper electrode layers 131 c and 132 c cover both the exposed portion EP and the non-exposed portion NEP of each of the third and fourth surfaces and have a convex shape (the external electrodes 131 and 132 have a convex shape), but the present disclosure is not limited thereto.

[0144] For example, Fig.15 As shown in , the outer electrodes 231 and 232 may have a concave shape on the non-exposed portion NEP. The base electrode layers 231a and 232a may be disposed on the exposed portion EP and the non-exposed portion NEP, the intermediate electrode layers 231b and 232b may be disposed on the non-exposed portion NEP, and the upper electrode layers 231c and 232c may be disposed on the exposed portion EP and the non-exposed portion NEP (or may not be disposed on the exposed portion EP). Since the upper electrode layers 231c and 232c cover the intermediate electrode layers 231b and 232b, the occurrence of ion migration may be minimized, and the reduction of ESR may be suppressed.

[0145] In addition, the external electrodes 231 and 232 may further include plating layers 231d and 232d disposed on the upper electrode layers 231c and 232c. The plating layers 231d and 232d may contact the base electrode layers 231a and 232a on the portion of the exposed portion EP where the upper electrode layers 231c and 232c are not disposed, and the second alloy layer Lac″ may not be disposed on the portion of the exposed portion EP where the upper electrode layers 231c and 232c are not disposed.

[0146] Reference Figure 5, in an embodiment, the maximum thickness t3 of the upper electrode layer 131c may be greater than or equal to 10 μm and less than or equal to 30 μm. This may equally apply to the upper electrode layers 132c, 231c, and 232c.

[0147] When the maximum thickness t3 of the upper electrode layer 131c is less than 10 μm, the upper electrode layer 131c may not be able to cover a part of the intermediate electrode layer 131b, resulting in a risk that the effect of suppressing ion migration may be insufficient. When the maximum thickness t3 of the upper electrode layer 131c exceeds 30 μm, the thickness of the outer electrode becomes too thick, and there may be a risk that the capacitance per unit volume of the multi-layer electronic component decreases.

[0148] Referring to Figure 5 , in an embodiment, when the maximum thickness of the base electrode layer 131a is t1, the maximum thickness of the intermediate electrode layer 131b is t2, and the maximum thickness of the upper electrode layer 131c is t3, t2 < t1 < t3 may be satisfied. Therefore, the effect of reducing the ESR and suppressing ion migration while ensuring the bending strength and moisture resistance reliability can be further improved. Here, the content described regarding the first outer electrode 131 may equally apply to the second outer electrode 132.

[0149] In an embodiment, the base electrode layers 131a and 132a may include Cu as a metal component, the intermediate electrode layers 131b and 132b may include Ag as a metal component, and the upper electrode layers 131c and 132c may include Cu and Sn as metal components. Therefore, the ion migration of Ag contained in the intermediate electrode layers 131b and 132b can be further suppressed, and at the same time, the ESR can be further reduced.

[0150] In addition, the base electrode layers 131a and 132a may contain Cu as a main metal component, the intermediate electrode layers 131b and 132b may include Ag as a main metal component, and the upper electrode layers 131c and 132c may include Cu and Sn as main metal components. Here, the fact that the base electrode layers 131a and 132a include Cu as a main metal component may mean that when elemental analysis of the base electrode layers 131a and 132a is performed by SEM-EDS in the cross-sections of the base electrode layers 131a and 132a in the first direction and the second direction, the area occupied by the Cu element in the area occupied by all metal elements in the base electrode layers 131a and 132a is 80% or more. The explanation regarding the fact that the above base electrode layers 131a and 132a include Cu as a main metal component can be similarly applied to the fact that the intermediate electrode layers 131b and 132b include Ag as a main metal component and the fact that the upper electrode layers 131c and 132c include Cu and Sn as main metal components.

[0151] In addition, the metal components included in the intermediate electrode layers 131 b and 132 b may be in the form of metal particles, and at least a portion of the metal components included in the upper electrode layers 131 c and 132 c may be in the form of an intermetallic compound.

[0152] In an embodiment, the external electrodes 131 and 132 may further include plating layers 131 d and 132 d disposed on the upper electrode layers 131 c and 132 c .

[0153] The plating layers 131d and 132d are used to improve mounting characteristics. The type of the plating layers 131d and 132d is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed using a plurality of layers.

[0154] For a more specific example of the plating layers 131d and 132d, the plating layers 131d and 132d may be Ni plating layers or Sn plating layers, or have a form in which Ni plating layers and Sn plating layers are sequentially formed on the upper electrode layers 131c and 132c, or have a form in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on the upper electrode layers 131c and 132c. In addition, the plating layers 131d and 132d may include a plurality of Ni plating layers and / or a plurality of Sn plating layers. In this document, the contents described with respect to the external electrodes 131 and 132 may also apply to the external electrodes 231 and 232.

[0155] In addition, although it is described above that the two external electrodes of the multilayer electronic component have the above structure and composition, the present disclosure is not limited thereto, for example, a technical solution in which only one external electrode has the above structure and composition may also fall within the scope of the present disclosure. For example, the external electrode includes: a base electrode layer, which is arranged on the entire third surface (or the entire fourth surface) and extends to a portion of at least one of the first surface, the second surface, the fifth surface, and the sixth surface; an intermediate electrode layer, which is arranged on a portion of the third surface (or the fourth surface) and on a corner connecting the third surface (or the fourth surface) to the at least one surface; and an upper electrode layer, which is arranged on the intermediate electrode layer and the base electrode layer.

[0156] As set forth above, as one of various effects of the present disclosure, the reliability of a multilayer electronic component may be improved by providing an intermediate electrode layer including metal and resin between an upper electrode layer including Sn and resin and a base electrode layer.

[0157] As one of various effects of the present disclosure, the moisture resistance reliability of a multilayer electronic component can be improved.

[0158] As one of the various effects of the present disclosure, the equivalent series resistance (ESR) of a multilayer electronic component may be reduced.

[0159] As one of various effects of the present disclosure, the bending strength of a multilayer electronic component may be improved.

[0160] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited by the above embodiments and the accompanying drawings, and is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, it will be feasible for those skilled in the art to make various forms of substitutions, modifications and changes, which also fall within the scope of the present disclosure.

[0161] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, it is not excluded that one embodiment presented above is implemented in combination with the features of another embodiment. For example, unless there is a description that contradicts or conflicts with matters in another embodiment, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to another embodiment.

[0162] The terms used in the present disclosure are used only to describe one embodiment and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0163] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer, the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as an external electrode disposed on the body and including a base electrode layer including a first metal, an intermediate electrode layer disposed on the base electrode layer and including a second metal and a first resin, and an upper electrode layer disposed on the intermediate electrode layer and including Sn and a second resin, wherein each of the third surface and the fourth surface of the body includes an exposed portion that exposes the internal electrodes and a dielectric layer between the internal electrodes and a non-exposed portion other than the exposed portion, and The base electrode layer is disposed on the exposed portion and the non-exposed portion, the intermediate electrode layer is disposed on the non-exposed portion, and the upper electrode layer is disposed on the non-exposed portion.

2. The multilayer electronic component of claim 1, wherein: The outer electrode includes a band portion extending onto a portion of at least one of the first surface, the second surface, the fifth surface, and the sixth surface, and The strip portion includes a portion of the base electrode layer, a portion of the intermediate electrode layer, and a portion of the upper electrode layer.

3. The multilayer electronic component of claim 1, wherein: The intermediate electrode layer is also disposed on a portion of the exposed portion.

4. The multilayer electronic component of claim 1, wherein: The upper electrode layer is also disposed on the exposed portion.

5. The multilayer electronic component of claim 1, wherein: The first metal includes Cu.

6. The multilayer electronic component of claim 1, wherein: The second metal includes Ag.

7. The multilayer electronic component of claim 1, wherein: A first alloy layer including a Cu-Ag alloy is provided at an interface between the base electrode layer and the intermediate electrode layer.

8. The multilayer electronic component of claim 1, wherein: A portion of the base electrode layer is in contact with the upper electrode layer, and a second alloy layer including a Cu—Sn alloy is provided at an interface between the base electrode layer and the upper electrode layer.

9. The multilayer electronic component of claim 8, wherein: The second alloy layer is intermittently disposed at an interface between the base electrode layer and the upper electrode layer.

10. The multilayer electronic component of claim 8, wherein: The Cu-Sn alloy is Cu3Sn.

11. The multilayer electronic component of claim 1, wherein: A first alloy layer including a Cu-Ag alloy is provided at the interface between the base electrode layer and the intermediate electrode layer, and a portion of the base electrode layer contacts the upper electrode layer and a second alloy layer including a Cu-Sn alloy is provided at the interface between the base electrode layer and the upper electrode layer.

12. The multilayer electronic component of claim 1, wherein: The base electrode layer also includes glass.

13. The multilayer electronic component of claim 2, wherein: In the belt portion, one end of the intermediate electrode layer is provided to cover one end of the base electrode layer.

14. The multilayer electronic component of claim 13, wherein: The other end of the intermediate electrode layer is disposed on the exposed portion.

15. The multilayer electronic component of claim 1, wherein: When the length of the extension line from the first surface to the extension line of the second surface in the first direction is T, and the sum of the lengths of the portion of the intermediate electrode layer arranged between the extension line of the first surface and the extension line of the second surface in the first direction is Bs, Bs / T is greater than or equal to 0.2 and less than or equal to 0.

6.

16. The multilayer electronic component of claim 1, wherein: The upper electrode layer includes an intermetallic compound including Sn.

17. The multilayer electronic assembly of claim 1, wherein: The upper electrode layer further comprises a plurality of metal particles, and Sn is provided to connect at least a portion of the plurality of metal particles.

18. The multilayer electronic component of claim 17, wherein: The plurality of metal particles include at least one of Ag particles and Cu particles.

19. The multilayer electronic assembly of claim 1, wherein: The maximum thickness of the upper electrode layer is greater than or equal to 10 μm and less than or equal to 30 μm.

20. The multilayer electronic assembly of claim 1, wherein: The upper electrode layer is configured to cover the middle electrode layer.

21. The multilayer electronic assembly of claim 1, wherein: The outer electrode further includes a plating layer disposed on the upper electrode layer.

22. The multilayer electronic assembly of claim 1, wherein: When the maximum thickness of the base electrode layer is t1, the maximum thickness of the intermediate electrode layer is t2, and the maximum thickness of the upper electrode layer is t3, t2 is satisfied. <t1<t3。 23. The multilayer electronic assembly of claim 1, wherein: The base electrode layer includes Cu as a metal component, The intermediate electrode layer includes Ag as a metal component, and The upper electrode layer includes Cu and Sn as metal components.

24. An electronic assembly comprising: main body; External electrode, comprising: a base electrode layer including a first metal disposed on the entire first surface of the body and extending to a portion of at least one other surface of the body connected to the first surface; an intermediate electrode layer provided on a portion of the first surface and a corner connecting the first surface and the at least one other surface, and including a second metal and a first resin; and The upper electrode layer is disposed on the intermediate electrode layer and the base electrode layer and includes Sn and a second resin.

25. The electronic assembly of claim 24, further comprising: a first alloy layer disposed at an interface between the base electrode layer and the intermediate electrode layer; and a second alloy layer disposed at an interface between the base electrode layer and the upper electrode layer.

26. The electronic assembly of claim 24, wherein: The first metal includes Cu, and the second metal includes Ag.

27. The electronic assembly of claim 24, wherein: The upper electrode layer includes an intermetallic compound including Sn.

28. The electronic assembly of claim 24, wherein: The upper electrode layer covers the entire middle electrode layer.

29. An electronic device comprising the electronic component according to any one of claims 24 to 28.

30. The electronic device of claim 29, wherein: The electronic device is an imaging device, a display device, a computer or a mobile phone.

Images