Method for managing and controlling separation blade in semiconductor process and semiconductor processing system

Abstract

The invention provides a method for managing and controlling a blocking piece in a semiconductor process manufacturing procedure and a semiconductor processing system.The management and control method is applied to semiconductor process equipment and used for improving the utilization rate of the blocking piece in a furnace and saving the production cost, and the management and control method comprises the steps that a sensing decision execution system receives alarm information from a machine table through a manufacturing execution system, the alarm information comprises the type and the number of the required separation blades; the perception decision execution system selects the available blocking pieces with the corresponding number through the manufacturing execution system; the manufacturing execution system defines the type of a selected available separation blade according to the separation blade type in the alarm information, and feeds back the type of the available separation blade to the machine table; and the manufacturing execution system controls the automatic material carrying system to convey the available blocking pieces with the corresponding number to the machine table.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method for controlling a baffle in a semiconductor process and a semiconductor processing system. Background Art

[0002] In the process of semiconductor chip production and manufacturing, the process from silicon wafer to final product is an extremely complex process, which involves hundreds of complex processes such as oxidation, photolithography, etching, doping, thin film deposition, metallization, etc. At this stage, semiconductor chip manufacturing is becoming more and more sophisticated, complex, and customized. The Manufacturing Execution System (MES) has become an indispensable management tool for semiconductor production. Its functions can control the entire process of semiconductor production and manufacturing, optimize the production process, ensure product performance is reliable, and meet user customization needs. The types of products managed in the MES system include product pieces (Production Lot) and non-product pieces (NonProduction Wafer, NPW) that actually need to be delivered. Furnace Dummy is one of the non-product pieces. Furnace Dummy can be divided into two types: edge Dummy and fill Dummy. Such as Figure 1 As shown, in addition to the product sheet 10, there are also filling baffles 20, edge baffles 30 and measuring sheets 40 in the furnace tube. When the machine needs to be fully loaded for the process, the filling baffles 20 are used to fill all the empty slots of the machine; when some furnace tube machines are performing the process, the edge baffles 30 are used to fill the slots at both ends of the furnace tube when controlling the product yield. In the semiconductor manufacturing process, the furnace baffles (FurnaceDummy) can be used to block the particles (Particle) in the furnace to ensure the thickness stability of the product. The edge baffles are mainly used to block particles from the side, while the filling baffles are used to fill the gaps to reduce the problems caused by particles in the film formation process. In the production process, the edge baffles and filling baffles need to be replaced regularly to maintain the stability of the process, thereby improving the product quality. Therefore, it is necessary to reserve a safe stock of these two furnace baffles, including edge baffles and filling baffles, in advance. However, the furnace baffles currently reserved in advance have the problem of insufficient utilization, which is not conducive to controlling production costs. Summary of the invention

[0003] The object of the present invention is to provide a method for controlling baffles in a semiconductor process and a semiconductor processing system, so as to improve the utilization rate of baffles in a furnace and save production costs.

[0004] The present invention provides a method for controlling baffles in a semiconductor process, which is applied to semiconductor process equipment, comprising: a perception decision execution system receives alarm information from a machine through a manufacturing execution system, wherein the alarm information includes the type and quantity of required baffles; the perception decision execution system selects available baffles corresponding to the quantity through the manufacturing execution system; the manufacturing execution system defines the type of available baffles selected according to the baffle type in the alarm information, and feeds back the type of available baffles to the machine; and the manufacturing execution system controls an automatic material handling system to transport the corresponding number of available baffles to the machine.

[0005] In a possible embodiment, the perception decision execution system receives alarm information reported from the machine through the manufacturing execution system, including: when the number of times a baffle in the machine is used exceeds a set threshold or there is a lack of baffles in the machine, the perception decision execution system receives alarm information from the machine through the manufacturing execution system.

[0006] In another possible embodiment, the perception decision execution system selects available baffles through the manufacturing execution system, including: according to the machine type or the semiconductor product type, the perception decision execution system selects a corresponding number of available baffles through the manufacturing execution system.

[0007] In another possible embodiment, after the manufacturing execution system controls the automatic material handling system to transport the corresponding number of available baffles to the machine, it also includes: after each available baffle completes the process task of the machine, the machine increments the number of times the available baffle is used, and transmits the incremented number to the manufacturing execution system.

[0008] In a second aspect, the present invention further provides a semiconductor processing system, comprising: a machine, a sensing decision execution system, a manufacturing execution system and an automatic material handling system, wherein:

[0009] A sensing decision execution system, configured to receive alarm information from the machine through a manufacturing execution system, and select available baffles corresponding to the number through the manufacturing execution system, wherein the alarm information includes the type and number of required baffles;

[0010] A manufacturing execution system is used to define the type of available baffles selected according to the baffle type in the alarm information, and feed back the type of available baffles to the machine; and control the automatic material handling system to transport the corresponding number of available baffles to the machine.

[0011] In a possible embodiment, the perception decision execution system receives alarm information from the machine through the manufacturing execution system, and is specifically used for: when the number of times the baffle in the machine is used exceeds a set threshold or there is a lack of baffles in the machine, the perception decision execution system receives alarm information from the machine through the manufacturing execution system.

[0012] In another possible embodiment, the perception decision execution system selects available baffles through the manufacturing execution system, specifically for: according to the machine type or semiconductor product type, the perception decision execution system selects a corresponding number of available baffles through the manufacturing execution system.

[0013] In another possible embodiment, after the manufacturing execution system controls the automatic material handling system to transport the corresponding number of available baffles to the machine, it is also used for: the machine, and is also used for incrementing the number of times the available baffles are used after each available baffle completes the process task of the machine, and transmitting the record of the incremented number to the manufacturing execution system.

[0014] The present invention provides a method for controlling baffles in a semiconductor process and a semiconductor processing system, which have the beneficial effects of: on the one hand, in the production process, edge baffles and filling baffles are replaced in time to maintain the stability of the process, thereby improving product quality; on the other hand, since there is no need to distinguish between edge baffles and filling baffles for safety stock, the reserved edge baffles and filling baffles can be fully utilized, which can improve the utilization rate of baffles in the furnace and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the spatial position of two types of furnace baffles in the furnace;

[0016] Figure 2 A schematic diagram of the structure of a semiconductor process equipment provided by an embodiment of the present invention;

[0017] Figure 3 A schematic flow chart of a method for controlling a baffle in a semiconductor process provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0019] One of the core concepts of the embodiments of the present invention is that the safety stock of furnace baffles no longer distinguishes between edge baffles and filling baffles. When the furnace baffles enter the machine, the type of furnace baffles entering the machine is determined by the system and the machine, which will not affect the normal process of the machine. Therefore, the reserved edge baffles and filling baffles can be fully utilized, which can improve the utilization rate of the furnace baffles and save production costs.

[0020] Reference Figure 2 , shows a flowchart of the steps of a method for controlling a baffle in a semiconductor process according to an embodiment of the present invention. The method can be performed by a semiconductor process device, and the method can specifically include the following steps:

[0021] S201, a sense decision execution system (SDR) receives alarm information from a machine through a manufacturing execution system (MES), wherein the alarm information includes the type and quantity of required baffles.

[0022] In a possible embodiment, when the number of times a baffle in the machine is used exceeds a set threshold or the machine lacks a baffle, the machine issues an alarm, and the SDR receives the alarm information from the machine through the MES.

[0023] S202, the SDR selects available baffles corresponding to the quantity through a manufacturing execution system (MES).

[0024] In a possible embodiment, different types of machines may require different baffles, or different types of semiconductor products may require different baffles during production. Therefore, the SDR can select a corresponding number of available baffles through the manufacturing execution system according to the type of machine or semiconductor product.

[0025] S203, the MES defines the type of available baffles selected according to the baffle type in the alarm information, and feeds back the type of available baffles to the machine.

[0026] Exemplarily, when the required baffle type in the alarm message is an edge baffle, the manufacturing execution system defines the type of the selected available baffle as an edge baffle, and then feeds back to the machine that the available baffle is an edge baffle; alternatively, when the required baffle type in the alarm message is a filling baffle, the manufacturing execution system defines the type of the selected available baffle as a filling baffle, and then feeds back to the machine that the available baffle is a filling baffle.

[0027] S204, MES controls the Automated Material Handling System (AMHS) to transport the corresponding number of available baffles to the machine.

[0028] Exemplarily, the manufacturing execution system controls the overhead crane to grab the available baffle to the machine, and then the machine performs the loading action of the available baffle, and then the MES completes the record.

[0029] In a possible embodiment, after the manufacturing execution system controls the automatic material handling system to transport the corresponding number of available baffles to the machine, the manufacturing execution system further includes: after each available baffle completes the process task of the machine, the manufacturing execution system increments the number of uses of the available baffle and records the incremented number of times. For example, after the available baffle completes the process task of the machine, the number of uses is automatically increased once. Subsequently, when the number of uses of the baffles in the machine exceeds a set threshold, for example, more than 10 times, the machine will report an alarm message again.

[0030] The present invention also provides a semiconductor processing system, such as Figure 3 As shown, it includes: a machine 10, a sense decision response system (SDR) 20, a manufacturing execution system (MES) 30 and an automatic material handling system (AMHS) 40, wherein:

[0031] A sensing decision execution system 20, configured to receive alarm information from the machine 10 through a manufacturing execution system 30, and select available baffles corresponding to the number through the manufacturing execution system, wherein the alarm information includes the type and number of required baffles;

[0032] The manufacturing execution system 30 is used to define the type of available baffles selected according to the baffle type in the alarm information, and feed back the type of available baffles to the machine 10; and control the automatic material handling system 40 to transport the corresponding number of available baffles to the machine 10.

[0033] In a possible embodiment, the perception decision execution system 20 receives alarm information from the machine 10 through the manufacturing execution system 30, and is specifically used for: when the number of times the baffle in the machine 10 is used exceeds a set threshold or there is a lack of baffles in the machine 10, the perception decision execution system 20 receives alarm information from the machine 10 through the manufacturing execution system 30.

[0034] In another possible embodiment, the perception decision execution system 20 selects available baffles through the manufacturing execution system 30, specifically for: according to the machine type or semiconductor product type, the perception decision execution system 20 selects a corresponding number of available baffles through the manufacturing execution system.

[0035] In another possible embodiment, after the manufacturing execution system 30 controls the automatic material handling system 40 to transport the corresponding number of available baffles to the machine 10, it is also used for: the machine 10, and is also used for incrementing the number of times the available baffles are used after each available baffle completes the process task of the machine 10, and transmitting the record of the incremented number to the manufacturing execution system 30.

[0036] The semiconductor processing system provided by the present invention, based on the design of the perception decision execution system 20, the manufacturing execution system 30 and the automatic material handling system 40, can replace the edge baffles and the filling baffles in time to maintain the stability of the process, thereby improving product quality and thus improving the overall efficiency.

[0037] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A method for controlling baffles in a semiconductor process, applied to semiconductor process equipment, characterized in that: include: The perception decision execution system receives alarm information from the machine through the manufacturing execution system, wherein the alarm information includes the type and quantity of the required baffles; The perception decision execution system selects the available baffles corresponding to the quantity through the manufacturing execution system; The manufacturing execution system defines the type of available baffles selected according to the baffle type in the alarm information, and feeds back the type of available baffles to the machine; The manufacturing execution system controls the automatic material handling system to deliver the available baffles corresponding to the quantity to the tool station.

2. The method according to claim 1, characterized in that The perception decision execution system receives alarm information from the machine through the manufacturing execution system, including: When the number of times the baffle in the machine is used exceeds a set threshold or there is a lack of baffles in the machine, the perception decision execution system receives alarm information from the machine through the manufacturing execution system.

3. The method according to claim 1, characterized in that: The perception decision execution system selects available blanks through the manufacturing execution system, including: According to the machine type or semiconductor product type, the perception decision execution system selects a corresponding number of available baffles through the manufacturing execution system.

4. The method according to any one of claims 1 to 3, characterized in that: After the manufacturing execution system controls the automatic material handling system to transport the available baffles corresponding to the number to the machine, the manufacturing execution system further includes: After each available baffle performs the process task of the machine, the machine increments the usage count of the available baffle, and transmits the incremented count to the manufacturing execution system.

5. The method according to any one of claims 1 to 3, characterized in that: The available baffle type is an edge baffle type or a filling baffle type.

6. The method according to any one of claims 1 to 3, characterized in that: The available baffles do not distinguish between types of baffles before being selected by the manufacturing execution system.

7. A semiconductor processing system, characterized in that: include: Machines, perception decision execution systems, manufacturing execution systems and automatic material handling systems, including: A sensing decision execution system, configured to receive alarm information from the machine through a manufacturing execution system, and select available baffles corresponding to the number through the manufacturing execution system, wherein the alarm information includes the type and number of required baffles; A manufacturing execution system is used to define the type of available baffles selected according to the baffle type in the alarm information, and feed back the type of available baffles to the machine; and control the automatic material handling system to transport the corresponding number of available baffles to the machine.

8. The semiconductor processing system according to claim 7, characterized in that: The perception decision execution system receives alarm information from the machine through the manufacturing execution system, and is specifically used for: When the number of times the baffle in the machine is used exceeds a set threshold or there is a lack of baffles in the machine, the perception decision execution system receives alarm information from the machine through the manufacturing execution system.

9. The semiconductor processing system according to claim 7, characterized in that: The perception decision execution system selects available baffles through the manufacturing execution system, specifically for: According to the machine type or semiconductor product type, the perception decision execution system selects a corresponding number of available baffles through the manufacturing execution system.

10. The semiconductor processing system according to any one of claims 7 to 9, characterized in that: After the manufacturing execution system controls the automatic material handling system to deliver the available baffles corresponding to the number to the machine, it is also used to: The machine is also used to increment the usage count of the available baffle after each available baffle completes the process task of the machine, and transmit the incremented count to the manufacturing execution system.

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