Wafer transfer device and process equipment

Abstract

The invention provides a wafer transfer device and process equipment, the wafer transfer device comprises a support part and a plurality of end executors, the end executors are used for bearing wafers, and the end executors are sequentially arranged on the support part; the device comprises a base and a first driving part, the supporting part is arranged on the base and connected with the first driving part, and the first driving part is used for driving the supporting part to do reciprocating motion on the base in the first direction so as to drive the end effector to do synchronous reciprocating motion in the first direction; the first detection mechanism comprises a first distance sensor, the first distance sensor is obliquely arranged on the base, and when the end effector moves towards the first distance sensor, the first distance sensor is used for counting the number of wafers borne by the end effector. According to the invention, the wafer transfer efficiency can be ensured, and meanwhile, the device can transfer the wafer under a normal condition through monitoring in a wafer taking and placing process, so that the reliability of the device is ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer transfer device and process equipment. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. During the wafer manufacturing process, wafers are transferred between various workstations by dedicated wafer transfer robots. Wafer transfer robots are the core moving parts in semiconductor process equipment. With the rapid development of the semiconductor industry, wafer transfer technology has gradually become a key factor restricting the development of the industry. The quality of its performance directly affects the production efficiency and manufacturing quality of wafers.

[0003] The main indicators for judging wafer transfer robots are: transfer efficiency and reliability, that is, wafer transfer robots not only require high transfer efficiency, but also require reliable transfer of wafers while ensuring efficiency. Existing wafer transfer robots can only grab one or two wafers at a time. When placing 12-inch wafers in a 25-slot wafer box, the wafer transfer robot needs to perform multiple grabbing actions, resulting in low wafer transfer efficiency. In addition, during the process of wafer placement, there is no detection device to detect the reliability of the wafer transfer robot, which may cause the wafer transfer robot to work in an abnormal state and fail to reliably transfer wafers.

[0004] Therefore, it is necessary to provide a wafer transfer device and process equipment to solve the above-mentioned problems existing in the prior art. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a wafer transfer device and process equipment to solve the technical problem that the wafer transfer robot in the prior art cannot meet the indicators of transfer efficiency and reliability.

[0006] In order to solve the above technical problems, the present invention provides a wafer transfer device, comprising:

[0007] The pick-up and delivery mechanism comprises a support portion and a plurality of end effectors, wherein the end effectors are used to carry the wafers, and the plurality of end effectors are sequentially arranged on the support portion;

[0008] A first driving mechanism comprises a base and a first driving part, wherein the supporting part is arranged on the base and connected to the first driving part, and the first driving part is used to drive the supporting part to reciprocate along a first direction on the base, so as to drive the end effector to perform synchronous reciprocating motion in the first direction;

[0009] The first detection mechanism comprises a first distance sensor, the first distance sensor is tiltedly arranged on the base, and when the end effector moves toward the first distance sensor, the first distance sensor is used to count the number of wafers carried by the end effector.

[0010] The beneficial effects of the wafer transfer device provided by the present invention are as follows: by designing a pick-up and delivery mechanism and a first driving mechanism, the first driving part drives the support part to perform reciprocating motion along the first direction on the base, and the support part simultaneously drives multiple end effectors to perform synchronous reciprocating motion in the first direction, thereby realizing simultaneous pick-up and delivery actions on multiple wafers, completing the wafer pick-up and placement work at one time, and there is no need to perform the pick-up and delivery actions multiple times, thereby improving the wafer transfer efficiency; at the same time, in the process of the end effector grabbing the wafer and moving toward the first distance sensor, the signal emitted by the first distance sensor tilted on the base is irradiated onto each wafer in turn as the end effector moves, and by detecting the number of times the distance value changes, the wafers carried by the end effector are counted to ensure that the end effector grabs a preset number of wafers and that the device performs the wafer transfer action in a normal state. Therefore, the wafer transfer device of the present invention monitors the number of wafers carried by the end effector and the wafer offset while ensuring the wafer transfer efficiency, ensuring that the wafer pick-up and delivery action is performed in a normal state, and ensuring the reliability of the wafer pick-up and placement process.

[0011] Furthermore, it also includes a mounting frame, which includes a frame, a fixing rod and two support rods, the fixing rod is arranged across the frame, one end of the two support rods is respectively arranged at the relative position of the frame, and the other end of the two support rods is respectively arranged at the two sides of the base. Its beneficial effect is that by designing a mounting frame including a frame, a fixing rod and two support rods, the space layout requirements when installing the detection device can be met, and the space utilization is optimized.

[0012] Furthermore, the first detection mechanism further includes a second distance sensor, which is obliquely arranged on the fixed rod. Its beneficial effect is that: by designing the second distance sensor, in the process of the end effector sending out the wafer, the signal emitted by the second distance sensor obliquely arranged on the fixed rod is sequentially irradiated on each wafer, and the number of wafers carried by the end effector is counted by detecting the number of changes in the distance value, so that the number of wafers can be more comprehensively detected, and when the first distance sensor fails, the number of wafers can still be monitored to ensure that the wafers are transported in a normal state.

[0013] Furthermore, it also includes a second detection mechanism for detecting the deviation of the wafer carried by the end effector, and the second detection mechanism includes a first sensor group, a second sensor group, a third sensor group and a fourth sensor group, the first sensor group and the second sensor group are relatively arranged in the first direction, the third sensor group and the fourth sensor group are relatively arranged in the second direction, and the first direction and the second direction are orthogonal. Its beneficial effect is that by designing the first sensor group, the second sensor group, the third sensor group and the fourth sensor group, the positions of the four points of the wafer relative to the end effector are monitored respectively, so as to ensure that the wafer is in a normal state when placed on the end effector, and perform the wafer picking and sending action.

[0014] Furthermore, the first driving part includes a first driving member, a synchronous wheel set, a first synchronous belt and a connecting block, wherein the first driving member is connected to the synchronous wheel set, the first synchronous belt is sleeved on the synchronous wheel set, and the connecting block is connected to the first synchronous belt; a first guide rail is provided on the base, and the connecting block is slidably provided on the first guide rail and connected to the supporting part. The beneficial effect is that by designing the first driving part, the supporting part can move in the first direction along the first guide rail, thereby driving the end effector to move in the first direction.

[0015] Furthermore, it also includes a second driving mechanism, which includes a housing and a second driving part arranged in the housing, and the second driving part includes a second driving member, a first synchronous wheel, a second synchronous wheel, a second synchronous belt and a connecting shaft, the second driving member is connected to the first synchronous wheel, the second synchronous belt is sleeved on the first synchronous wheel and the second synchronous wheel, the second synchronous wheel is connected to one end of the connecting shaft, and the other end of the connecting shaft is connected to the base. Its beneficial effect is that by designing the second driving part, the base can be rotated, thereby driving the end effector to perform synchronous rotation.

[0016] Furthermore, the second driving mechanism also includes a third driving part arranged in the shell and located on one side of the second driving part, the third driving part includes a third driving member, a first screw rod and a mounting plate, the third driving member is connected to the first screw rod, and the first screw rod is connected to the mounting plate; a second guide rail is arranged on the inner wall of the shell, and the mounting plate is slidably arranged on the second guide rail; the mounting plate is connected to one end of the connecting shaft. Its beneficial effect is that by arranging the second driving part and the third driving part inside the shell at the same time, the space utilization rate is improved, and the structural design of the overall device is made more compact; at the same time, by designing the third driving part, the connecting shaft can be lifted and lowered, thereby driving the end effector to perform synchronous lifting and lowering movements.

[0017] Furthermore, it also includes a third driving mechanism, the third driving mechanism includes a mounting seat and a fourth driving part, the mounting seat is provided with a third guide rail, the fourth driving part includes a fourth driving member, a second screw rod and a slider, the fourth driving member is connected to the second screw rod, the second screw rod is connected to the slider, the slider is slidably arranged on the third guide rail and connected to the housing. Its beneficial effect is that by designing the fourth driving part, the housing is made to reciprocate in the second direction along the third guide rail, thereby driving the end effector to make synchronous reciprocating motion in the second direction.

[0018] Furthermore, the support part includes a box body, and a plurality of support members are arranged at equal distances in the box body; the pick-up and delivery mechanism includes a plurality of groups of end effector groups, each group of the end effector groups includes a plurality of the end effectors, and each group of the end effector groups is arranged on a corresponding support member. The beneficial effect is that by arranging each group of the end effector groups on a corresponding support member, convenient installation of each end effector is achieved.

[0019] The present invention also provides a process equipment, comprising: at least two wafer storage devices, and a wafer transfer device as described above arranged between the at least two wafer storage devices, wherein the wafer transfer device is used to transport wafers from one wafer storage device to another wafer storage device.

[0020] The beneficial effects of the process equipment provided by the present invention refer to the beneficial effects of the above-mentioned wafer transfer device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1-Figure 2 A schematic diagram showing a wafer transfer device according to an embodiment of the present invention;

[0022] Figure 3 Display as Figure 1 A magnified schematic diagram of part A;

[0023] Figure 4 It is a schematic diagram showing a part of the structure of a wafer transfer device according to an embodiment of the present invention;

[0024] Figure 5 Shown is a schematic diagram of an end effector carrying a wafer according to an embodiment of the present invention;

[0025] Figure 6 Shown is a schematic diagram of the internal structure of an end effector wafer transfer device according to an embodiment of the present invention;

[0026] Figure 7 Shown is a schematic diagram of a first driving mechanism according to an embodiment of the present invention;

[0027] Figure 8 Shown is a schematic diagram of a second driving mechanism according to an embodiment of the present invention;

[0028] Fig. 9 Shown is a schematic diagram of a third driving mechanism according to an embodiment of the present invention;

[0029] Fig.10 Shown is a schematic diagram of a pick-up and delivery mechanism carrying wafers according to an embodiment of the present invention.

[0030] Component number description

[0031] 1. Pick-up and delivery mechanism; 11. Supporting part; 111. Box body; 1111. Supporting member; 12. End effector group; 121. End effector; 1211. Boss; 1212. Fork finger; 1213. Connecting plate; 2. First driving mechanism; 21. Base; 211. First guide rail; 22. First driving part; 221. First driving member; 222. Synchronous wheel group; 223. First synchronous belt; 224. Connecting block; 3. First detection mechanism; 31. First distance sensor; 32. Second distance sensor; 33. Fixed base; 4. Mounting frame; 41. Frame; 42. Fixed rod; 43. Support rod; 5. Second detection mechanism ;51. First sensor group;52. Second sensor group;53. Third sensor group;54. Fourth sensor group;6. Second driving mechanism;61. Shell;611. Second guide rail;62. Second driving unit;621. Second driving member;622. First synchronous wheel;623. Second synchronous wheel;624. Second synchronous belt;625. Connecting shaft;63. Third driving unit;631. Third driving member;632. First screw rod;633. Mounting plate;7. Third driving mechanism;71. Mounting seat;711. Third guide rail;72. Fourth driving unit;721. Fourth driving member;722. Second screw rod;723. Slider. DETAILED DESCRIPTION

[0032] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0033] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification, so that people familiar with this technology can understand and read them, and are not used to limit the limiting conditions that the present invention can implement, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the present invention. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used here are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., can be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "hold" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions or operations is inherently mutually exclusive in some way.

[0036] like Figure 1-Figure 10As shown, an embodiment of the present invention provides a wafer transfer device, including: a pick-up and delivery mechanism 1, a first driving mechanism 2 and a first detection mechanism 3. The pick-up and delivery mechanism 1 is used to perform pick-up and delivery actions on wafers, that is, grabbing and sending actions. The first driving mechanism 2 is used to drive the pick-up and delivery mechanism 1 to perform reciprocating motions in a first direction, and perform wafer grabbing and wafer sending actions, thereby realizing the transfer of wafers between various workstations. The first detection mechanism 3 is used to detect the number of wafers grabbed and sent out by the pick-up and delivery mechanism 1 during the process in which the pick-up and delivery mechanism 1 is driven by the first driving mechanism 2 to perform the pick-up and delivery action, thereby monitoring whether the pick-up and delivery mechanism 1 picks up and sends a preset number of wafers, ensuring that the wafer transfer device is working in a normal state, and ensuring the reliability of the wafer transfer device.

[0037] The pick-up and delivery mechanism 1 includes a support portion 11 and a plurality of end effectors 121. The end effector 121 is used to carry wafers. The plurality of end effectors 121 are sequentially arranged on the support portion 11. Moreover, the distances between adjacent end effectors 121 are the same. The first driving mechanism 2 includes a base 21 and a first driving portion 22. The support portion 11 is arranged on the base 21 and is connected to the first driving portion 22. The first driving portion 22 is used to drive the support portion 11 to reciprocate along the first direction on the base 21, so as to drive the end effector 121 to reciprocate synchronously in the first direction. The first detection mechanism 3 includes a first distance sensor 31. The first distance sensor 31 is obliquely arranged on the base 21. When the end effector 121 moves toward the first distance sensor 31, the first distance sensor 31 is used to count the wafers carried by the end effector 121.

[0038] The first driving part 22 drives the support part 11 to reciprocate along the first direction on the base 21, and the support part 11 simultaneously drives multiple end effectors 121 to perform synchronous reciprocating motion in the first direction, so as to simultaneously perform pick-up and delivery actions on multiple wafers, complete the wafer pick-up and placement work at one time, and improve the wafer transmission efficiency; at the same time, the first detection mechanism 3 is designed to detect the number of wafers carried by the end effector 121 during the process of picking up and delivering the wafers. Further, the first detection mechanism 3 includes a first distance sensor 31. After the end effector 121 grabs the wafer from a workstation, since the first distance sensor 31 is tiltedly arranged on the base 21, the signal emitted by the first distance sensor 31 to the wafer carried by the end effector 121 presents a certain angle relative to the base 21, that is, the signal emitted by the first distance sensor 31 is irradiated obliquely upward, so as the first driving part 22 drives the support part 11 back to the origin, the signal is irradiated to each wafer in turn, so as to detect the number of changes in the distance value to detect the number of wafers carried on the end effector 121. For example, the first distance sensor 31 initially irradiates the top wafer, and as the wafer is driven to move toward the origin, the first distance sensor 31 irradiates each wafer from top to bottom in sequence (here, top and bottom are Figure 1 The upper and lower parts are shown in the figure, that is, every time the end effector 121 moves a certain distance, the first distance sensor 31 irradiates the signal of the upper wafer, and then moves to the lower wafer, and detects the number of wafers by detecting the number of times the distance value changes. In the process of grabbing the wafer from one station and returning to the origin, the number of wafers carried by the end effector 121 is completely detected, so as to check whether the end effector 121 grabs the preset number of wafers. If it does not meet the preset number, an alarm will be issued to stop the machine and detect machine failure; if it meets the preset number, subsequent actions will continue. It should be noted that the upper wafer and the lower wafer are relative.

[0039] like Figure 2 As shown, in some embodiments of the present invention, the wafer transfer device also includes a mounting frame 4. The mounting frame 4 includes a frame body 41, a fixing rod 42 and two support rods 43. The fixing rod 42 is arranged across the frame body 41. One ends of the two support rods 43 are respectively arranged at relative positions of the frame body 41. The other ends of the two support rods 43 are respectively arranged on both sides of the base 21. Exemplarily, the frame body 41 is an octagonal frame, and the fixing rod 42 is arranged across two opposite frames of the octagonal frame, and the two opposite frames are connected to one ends of the two support rods 43, and the other ends of the two support rods 43 are respectively arranged on both sides of the base 21. The structure of the mounting frame 4 is designed in this way to better meet the spatial layout requirements when the mounting frame 4 is installed with the detection device, optimize the space utilization, and ensure that the wafer detection is realized in the process of the wafer being driven through.

[0040] like Figure 1 and Figure 2As shown, in some embodiments of the present invention, the first detection mechanism 3 also includes a second distance sensor 32. The second distance sensor 32 is tilted on the fixed rod 42. By designing the second distance sensor 32, the number of wafers can be detected more comprehensively, and it is also ensured that if the first distance sensor 31 fails, the second distance sensor 32 can still detect the number of wafers. Since the second distance sensor 32 is tilted on the fixed rod 42, the signal emitted by the second distance sensor 32 to the wafer carried by the end effector 121 forms a certain angle relative to the fixed rod 42, that is, the signal emitted by the second distance sensor 32 is irradiated obliquely downward. In the process of the end effector 121 that has grasped the wafer and transferring the wafer from the origin to another station, the signal is irradiated to each wafer in turn, so as to detect the number of wafers carried by the end effector 121 by detecting the number of changes in the distance. Exemplarily, the second distance sensor 32 initially irradiates the bottommost wafer, and as the wafer is driven out, the second distance sensor 32 irradiates each wafer in turn from bottom to top (here, top and bottom are Figure 1 The end effector 121 moves a certain distance, and the second distance sensor 32 irradiates the signal of the lower wafer, and moves to the upper wafer. The number of wafers is detected by detecting the number of times the distance value changes. In the process of placing the wafer from the origin to another station, the number of wafers carried by the end effector 121 is completely detected, so as to check whether the end effector 121 grabs the preset number of wafers. If it does not meet the preset number, an alarm will be issued to stop the machine to detect machine failure; if it meets the preset number, the delivery action will continue.

[0041] like Figure 3As shown, in some embodiments of the present invention, the first detection mechanism 3 further includes a fixed base 33. The fixed base 33 is used to tilt the first distance sensor 31 and the second distance sensor 32 on the base 21 and the fixed rod 42, respectively, so that the signals emitted by the first distance sensor 31 and the second distance sensor 32 are tilted to ensure that each wafer can be irradiated. The first distance sensor 31 will be specifically described below, and the second distance sensor 32 is set similarly. The fixed base 33 includes an inclined surface, and the inclined surface has an inclination angle of 90°+α relative to the horizontal line of the base 21. The first distance sensor 31 is vertically fixed to the inclined surface of the fixed base 33, and then the installed first distance sensor 31 and the fixed base 33 are fixedly set on the base 21 as a whole. Then, the angle between the first distance sensor 31 and the horizontal line of the base 21 is α, so that during the detection process, the signal emitted by the first distance sensor 31 can irradiate all wafers carried by the end effector 121, and all wafers carried by the end effector 121 can be fully detected, and the number of wafers carried by the end effector 121 is obtained. The design of the angle α depends on the detection of all the wafers carried by the end effector 121 within the travel range of the end effector 121, so it should be specifically designed according to the actual situation.

[0042] In some specific embodiments, wafers are grabbed from a 25-slot wafer box storing 12-inch wafers. In order for the first distance sensor 31 to detect all 25 wafers carried by the end effector 121 within its travel range, the range of the angle α is designed to be 8° to 12°. Since the smaller the inclination angle of the first distance sensor 31, the smaller the distance moved by the end effector 121, the detection time of the first distance sensor 31 is short at this time, and it is difficult to obtain sufficient data for analysis and calculation, resulting in inaccurate data on the number of wafers detected. Therefore, the angle α is preferably 10°, which can ensure that sufficient data is obtained for analysis and calculation, and shorten the distance moved by the end effector 121.

[0043] like Figure 4 As shown, in some embodiments of the present invention, the wafer transfer device also includes a second detection mechanism 5 for detecting the deviation of the wafer carried by the end effector 121. The second detection mechanism 5 includes a first sensor group 51, a second sensor group 52, a third sensor group 53 and a fourth sensor group 54. The first sensor group 51 and the second sensor group 52 are arranged relative to each other in the first direction. The third sensor group 53 and the fourth sensor group 54 are arranged relative to each other in the second direction. The first direction and the second direction are orthogonal. When the wafer is driven to the second detection mechanism 5 by the end effector 121, the first sensor group 51, the second sensor group 52, the third sensor group 53 and the fourth sensor group 54 emit a signal for illumination. If the wafer deviates in a certain direction, the light flux will change, thereby detecting whether the wafer is deviated.

[0044] like Figure 5 As shown, in some embodiments of the present invention, the end effector 121 includes a boss 1211, a fork finger 1212 and a connecting plate 1213. The boss 1211 is disposed on the fork finger 1212. When a wafer is placed on the fork finger 1212, the boss 1211 is used to limit the wafer so that the center of the wafer coincides with the center of the fork finger 1212. The connecting plate 1213 is fixedly connected to the support portion 11 and allows the fork finger 1212 to extend outward.

[0045] like Figure 4 and Figure 5 As shown, in some embodiments of the present invention, the first sensor group 51 includes a first sensor and a second sensor arranged oppositely in the third direction. The first sensor is arranged on the frame 41, and the second sensor is arranged on the base 21 relative to the first sensor. The first sensor and the second sensor detect whether the wafer, for example, the first point, is offset relative to the fork finger 1212 by means of up and down shooting. If the offset occurs, the luminous flux will change at this time. The second sensor group 52 includes a third sensor and a fourth sensor arranged oppositely in the third direction. The third sensor is arranged on the frame 41 and opposite to the first sensor, and the fourth sensor is arranged on the base 21 relative to the third sensor and opposite to the second sensor. The third sensor and the fourth sensor detect whether the wafer, for example, the second point, is offset relative to the fork finger 1212 by means of up and down shooting. If the offset occurs, the luminous flux will change at this time. The third sensor group 53 includes a fifth sensor and a sixth sensor arranged oppositely in the third direction. The fifth sensor is arranged at one end of one of the support rods 43, and the sixth sensor is arranged at the other end of one of the support rods 43 and opposite to the fifth sensor. The fifth sensor and the sixth sensor detect whether the wafer, for example, the third point, is offset relative to the fork finger 1212 by means of up and down shooting. If offset occurs, the luminous flux will change at this time. The fourth sensor group 54 includes a seventh sensor and an eighth sensor arranged relatively in the third direction. The seventh sensor is arranged at one end of another support rod 43 and is opposite to the fifth sensor, and the eighth sensor is arranged at the other end of another support rod 43 and is opposite to the seventh sensor. The seventh sensor and the eighth sensor detect whether the wafer, for example, the fourth point, is offset relative to the fork finger 1212 by means of up and down shooting. If offset occurs, the luminous flux will change at this time.

[0046] The third direction is orthogonal to the first direction and the second direction. For example, the first direction is the X-axis direction, the second direction is the Y-axis direction, and the third direction is the Z-axis direction. The first point and the second point of the wafer are relatively located on the X-axis, and the third point and the fourth point are relatively located on the Y-axis. That is, when the wafer is driven through the second detection mechanism 5, the sensor group in the upper and lower shooting working mode respectively detects whether these four points of the wafer are offset relative to the fork finger 1211, thereby detecting the degree of offset of the wafer carried on the fork finger 1212. Under normal circumstances, the center of the wafer should be consistent with the center of the fork finger 1211 ( Figure 5 If the wafer is offset, the center of the wafer will be offset from the center of the fork finger 1211. At this time, the four points detected will also be offset relative to the fork finger 1212. This situation is an abnormal situation, and an alarm will be issued to stop the machine and inspect the machine for failure.

[0047] During the process of the wafer transfer device taking and delivering wafers, the first detection mechanism 3 and the second detection mechanism 5 are designed to monitor the number of wafers and the wafer offset respectively, ensuring that the wafer transfer device is in normal working condition to perform wafer transfer work, thereby ensuring the reliability of the wafer transfer device during operation.

[0048] like Figure 6 and Figure 7 As shown, in some embodiments of the present invention, the first driving part 22 includes a first driving member 221, a synchronous wheel set 222, a first synchronous belt 223 and a connecting block 224. The first driving member 221 is connected to the synchronous wheel set 222. The first synchronous belt 223 is sleeved on the synchronous wheel set 222. The connecting block 224 is connected to the first synchronous belt 223. A first guide rail 211 is provided on the base 21. The connecting block 224 is slidably provided on the first guide rail 211 and connected to the support portion 11. During operation, the first driving member 221, for example, a motor drives the synchronous wheel set 222 to rotate, and the synchronous wheel set 222 transmits power to the first synchronous belt 223. The first synchronous belt 223 drives the connecting block 224 to reciprocate along the first guide rail 211 in the X-axis direction, thereby driving the support part 11 to perform synchronous reciprocating motion along the first guide rail 211 in the X-axis direction, so as to drive the end effector 121 to extend in the X-axis direction, that is, to perform the action of grabbing or sending out the wafer; or drive the end effector 121 to retract in the X-axis direction, that is, to perform the reset action and return to the origin.

[0049] like Figure 6 and Figure 8As shown, in some embodiments of the present invention, the wafer transfer device further includes a second driving mechanism 6. The second driving mechanism 6 includes a housing 61 and a second driving part 62 disposed in the housing. The second driving part 62 includes a second driving member 621, a first synchronous wheel 622, a second synchronous wheel 623, a second synchronous belt 624 and a connecting shaft 625. The second driving member 621 is connected to the first synchronous wheel 622. The second synchronous belt 624 is sleeved on the first synchronous wheel 622 and the second synchronous wheel 623. The second synchronous wheel 623 is connected to one end of the connecting shaft 625, and the other end of the connecting shaft 625 is connected to the base 21. When working, the second driving member 621, such as a motor, drives the first synchronous wheel 622 to rotate, the first synchronous wheel 622 transmits power to the second synchronous wheel 623 through the second synchronous belt 624, and the second synchronous wheel 623 drives the connecting shaft 625 to rotate synchronously, so that the connecting shaft 625 drives the base 21 to rotate synchronously, thereby realizing the rotation of the pick-up and delivery mechanism 1.

[0050] like Figure 6 and Figure 8 As shown, in some embodiments of the present invention, the second drive mechanism 6 also includes a third drive part 63 disposed in the housing 61 and located on one side of the second drive part 62. The second drive part 62 and the third drive part 63 are both disposed inside the housing 61, so that the overall space of the device is compact, the space utilization rate is improved, and the installation space is saved. The third drive part 63 includes a third drive member 631, a first screw rod 632 and a mounting plate 633. The third drive member 631 is connected to the first screw rod 632. The first screw rod 632 is connected to the mounting plate 633. The inner wall of the housing 61 is provided with a second guide rail 611. The mounting plate 633 is slidably disposed on the second guide rail 611. The mounting plate 633 is connected to one end of the connecting shaft 625. Specifically, the mounting plate 633 includes a first mounting plate and a second mounting plate. One end of the first mounting plate is connected to one end of the second mounting plate, and is configured in an L shape. The first mounting plate is connected to the first screw rod 632 and is slidably disposed on the second guide rail 611. The first synchronous wheel 622, the second synchronous wheel 623 and the second synchronous belt 624 are installed on one side of the second mounting plate, and the connecting shaft 625 is installed on the other side, that is, the connecting shaft 625 passes through the second mounting plate and is installed with the second synchronous wheel 623. Such a design makes full use of the internal space of the housing 61, improves the space utilization rate inside the housing 61, and saves installation space.

[0051] During operation, the third driving member 631, such as a motor, drives the first screw rod 632 to rotate, and the first screw rod 632 drives the first mounting plate to perform up and down lifting movements along the second guide rail 611 in the Z-axis direction. The first mounting plate drives the second mounting plate to also perform lifting movements in the Z-axis direction. The second mounting plate drives the connecting shaft 625 to perform synchronous lifting movements in the Z-axis direction, thereby driving the base 21 to perform up and down lifting movements in the Z-axis direction, thereby realizing that the picking and delivering mechanism 1 can perform up and down lifting movements in the Z-axis direction.

[0052] like Figure 6 and Fig. 9 As shown, in some embodiments of the present invention, the wafer transfer device further includes a third driving mechanism 7. The third driving mechanism 7 includes a mounting seat 71 and a fourth driving part 72. A third guide rail 711 is provided on the mounting seat 71. The fourth driving part 72 includes a fourth driving member 721, a second screw rod 722 and a slider 723. The fourth driving member 721 is connected to the second screw rod 722. The second screw rod 722 is connected to the slider 723. The slider 723 is slidably arranged on the third guide rail 711 and is connected to the housing 61. During operation, the fourth driving member 721, such as a motor, drives the second screw rod 722 to rotate, the second screw rod 722 drives the slider 723 to reciprocate along the third guide rail in the Y-axis direction, and the slider 723 drives the housing 61 to reciprocate in the Y-axis direction, thereby realizing the reciprocating motion of the pick-up and delivery mechanism 1 in the Y-axis direction.

[0053] like Figure 2 and Fig.10 As shown, in some embodiments of the present invention, the support portion 11 includes a box body 111. A plurality of support members 1111 are arranged at equal distances in the box body 111. The pick-up and delivery mechanism 1 includes a plurality of end effector groups 12. Each end effector group 12 includes a plurality of end effectors 121. Each end effector group 12 is arranged on a corresponding support member 1111. Exemplarily, five end effectors 121 constitute a group of end effector groups 12, and there are a total of five groups of end effector groups 12. Correspondingly, five support members 1111 are arranged at equal distances in the box body 111. Five end effectors 121 are first installed to form a group of end effector groups 12, and then the five groups of end effector groups 12 are respectively placed on five support members 1111 for fixed installation. That is, for a wafer box with 25 slots for storing 12-inch wafers, 25 end effectors 121 are arranged to grab 25 wafers at the same time, and the pick-up and placement work is completed at one time, which greatly improves the wafer transmission efficiency.

[0054] like Figure 1-Figure 10 As shown, an embodiment of the present invention further provides a process equipment, comprising: at least two wafer storage devices, and the wafer transfer device as described above arranged between the at least two wafer storage devices. The wafer transfer device is used to transfer wafers from one wafer storage device to another wafer storage device.

[0055] Exemplarily, the wafer storage device is a wafer box. The wafer box is a 25-slot wafer box for storing 12-inch wafers. The end effector 121 of the wafer transfer device extends in the X-axis direction toward a 25-slot wafer box, performs a grabbing action, and grabs all 25 wafers at one time; after the grabbing action is completed, the end effector 121 performs a retraction action in the X-axis direction and returns to the origin; turning to another 25-slot wafer box, the end effector 121 extends in the X-axis direction toward another 25-slot wafer box, and performs a sending action, thereby transferring 25 wafers to another 25-slot wafer box at one time; after placing the wafers, reset to the origin again. In this process, 25 wafers can be grabbed and sent out at one time without having to perform the action multiple times, which greatly improves the wafer transfer efficiency.

[0056] Furthermore, by designing the first distance sensor 31 and the second distance sensor 32 of the first detection mechanism 3, the number of wafers carried by the end effector 121 is detected during the wafer picking and delivery process; and by designing the first sensor group 51, the second sensor group 52, the third sensor group 53 and the fourth sensor group 54 of the second detection mechanism 5, each sensor group detects whether the wafer is offset relative to the fork finger 1212 by the change of light flux through the upward and downward radiation, thereby ensuring that the wafer transfer device is in normal operation to transfer the wafer, that is, the wafer is transferred when the number of wafers carried by the end effector 1212 is the preset number and the wafer is not offset relative to the fork finger 1212, thereby ensuring the reliable transfer of the wafer while ensuring the transmission efficiency.

[0057] At the same time, the distance between adjacent end effectors 121 is designed to be the same, so that the distance between the end effectors 121 corresponds to the distance between each layer of the 25-slot wafer box, so that the end effector 121 can grab 25 wafers at a time; and it is also beneficial for the first distance sensor 31 and the second distance sensor 32 to detect the number of wafers by detecting the number of times the distance value changes. Exemplarily, the distance between each end effector 121 is 10 mm, so as to adapt to the 25-slot wafer box.

[0058] In summary, the present invention provides a wafer transfer device and process equipment. By designing a pick-up and delivery mechanism and a first driving mechanism, the first driving part drives the supporting part to make a reciprocating motion on the base along the first direction, and the supporting part simultaneously drives multiple end effectors to make a synchronous reciprocating motion in the first direction, thereby realizing the simultaneous pick-up and delivery actions on multiple wafers, completing the wafer pick-up and placement work at one time, and there is no need to perform the pick-up and delivery actions multiple times, thereby improving the wafer transmission efficiency; and the distances between adjacent end effectors are the same, which can match the distances between wafer layers stored in the wafer storage device, so as to facilitate the completion of the pick-up and placement actions at one time; at the same time, in the process of the end effector grabbing the wafer and moving toward the first distance sensor, the signal emitted by the first distance sensor tilted on the base is irradiated onto each wafer in turn as the end effector moves, and the number of times the distance value changes is detected, thereby the end effector is detected. The wafers carried on the actuator are counted to ensure that the end effector grabs a preset number of wafers and that the device is in a normal state to perform the wafer transfer action; and in the process of the end effector placing the wafer from the origin to another wafer storage device, the signal emitted by the second distance sensor obliquely arranged on the fixed rod is irradiated on each wafer in turn, and the number of times the distance value changes is detected, so as to calculate the wafers carried on the end effector. The design of the second distance sensor can detect the number of wafers more comprehensively, and also ensures that the wafer counting work can still be performed when the first distance sensor fails; at the same time, by designing the first sensor group, the second sensor group, the third sensor group and the fourth sensor group of the second detection mechanism, the four points of the wafer are detected to see if they are offset, so as to ensure that the wafer works without offsetting relative to the fork fingers. Therefore, the wafer transfer device of the present invention monitors the number and offset of wafers carried by the end effector while ensuring the wafer transfer efficiency, ensuring that the wafer pick-up and delivery action is performed in a normal state, that is, the number of wafers meets the preset number and the wafers are not offset relative to the fork fingers, ensuring the reliability of the wafer pick-up and placement process, and meeting the indicators of high transfer efficiency and reliable wafer transfer. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0059] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer transfer device, characterized in that: include: A pick-up and delivery mechanism (1) comprises a support portion (11) and a plurality of end effectors (121), wherein the end effectors (121) are used to carry wafers, and the plurality of end effectors (121) are sequentially arranged on the support portion (11); A first driving mechanism (2), comprising a base (21) and a first driving part (22), wherein the supporting part (11) is arranged on the base (21) and connected to the first driving part (22), and the first driving part (22) is used to drive the supporting part (11) to perform reciprocating motion on the base (21) along a first direction, so as to drive the end effector (121) to perform synchronous reciprocating motion in the first direction; A first detection mechanism (3), the first detection mechanism (3) comprising a first distance sensor (31), the first distance sensor (31) being arranged obliquely on the base (21), and when the end effector (121) moves toward the first distance sensor (31), the first distance sensor (31) is used to count the wafers carried by the end effector (121).

2. The wafer transfer device according to claim 1, characterized in that: The invention also comprises a mounting frame (4), wherein the mounting frame (4) comprises a frame (41), a fixing rod (42) and two supporting rods (43), wherein the fixing rod (42) is arranged across the frame (41), one end of the two supporting rods (43) are respectively arranged at relative positions of the frame (41), and the other ends of the two supporting rods (43) are respectively arranged at two sides of the base (21).

3. The wafer transfer device according to claim 2, characterized in that: The first detection mechanism (3) further comprises a second distance sensor (32), wherein the second distance sensor (32) is arranged obliquely on the fixing rod (42).

4. The wafer transfer device according to claim 1, characterized in that: The invention also includes a second detection mechanism (5) for detecting the deviation of the wafer carried by the end effector (121), wherein the second detection mechanism (5) includes a first sensor group (51), a second sensor group (52), a third sensor group (53) and a fourth sensor group (54), wherein the first sensor group (51) and the second sensor group (52) are arranged relative to each other in the first direction, and the third sensor group (53) and the fourth sensor group (54) are arranged relative to each other in the second direction, and the first direction and the second direction are orthogonal.

5. The wafer transfer device according to claim 1, characterized in that: The first driving part comprises (22) a first driving member (221), a synchronous wheel group (222), a first synchronous belt (223) and a connecting block (224); the first driving member (221) is connected to the synchronous wheel group (222); the first synchronous belt (223) is sleeved on the synchronous wheel group (222); and the connecting block (224) is connected to the first synchronous belt (223); a first guide rail (211) is provided on the base (21); the connecting block (224) is slidably provided on the first guide rail (211) and is connected to the supporting part (11).

6. The wafer transfer device according to claim 1, characterized in that: The invention also comprises a second driving mechanism (6), wherein the second driving mechanism (6) comprises a housing (61) and a second driving part (62) arranged in the housing (61), wherein the second driving part (62) comprises a second driving member (621), a first synchronous wheel (622), a second synchronous wheel (623), a second synchronous belt (624) and a connecting shaft (625), wherein the second driving member (621) is connected to the first synchronous wheel (622), the second synchronous belt (624) is sleeved on the first synchronous wheel (622) and the second synchronous wheel (623), the second synchronous wheel (623) is connected to one end of the connecting shaft (625), and the other end of the connecting shaft (625) is connected to the base (21).

7. The wafer transfer device according to claim 6, characterized in that: The second driving mechanism (6) further comprises a third driving part (63) which is arranged in the housing (61) and located on one side of the second driving part (62); the third driving part (63) comprises a third driving member (631), a first screw rod (632) and a mounting plate (633); the third driving member (631) is connected to the first screw rod (632), and the first screw rod (632) is connected to the mounting plate (633); a second guide rail (611) is arranged on the inner wall of the housing (61), and the mounting plate (633) is slidably arranged on the second guide rail (611); and the mounting plate (633) is connected to one end of the connecting shaft (625).

8. The wafer transfer device according to claim 6, characterized in that: The invention also comprises a third driving mechanism (7), wherein the third driving mechanism (7) comprises a mounting seat (71) and a fourth driving part (72), wherein the mounting seat (71) is provided with a third guide rail (711), and the fourth driving part (72) comprises a fourth driving member (721), a second screw rod (722) and a sliding block (723), wherein the fourth driving member (721) is connected to the second screw rod (722), the second screw rod (722) is connected to the sliding block (723), and the sliding block (723) is slidably arranged on the third guide rail (711) and is connected to the housing (61).

9. The wafer transfer device according to claim 1, characterized in that: The support portion (11) comprises a box body (111), wherein a plurality of support members (1111) are arranged at equal distances inside the box body (111); the pick-up and delivery mechanism (1) comprises a plurality of groups of end effector groups (12), each group of the end effector groups (12) comprises a plurality of the end effectors (121), and each group of the end effector groups (12) is arranged on a corresponding support member (1111).

10. A process equipment, characterized in that: It comprises at least two wafer storage devices, and a wafer transfer device as described in any one of claims 1 to 9 arranged between the at least two wafer storage devices, wherein the wafer transfer device is used to transport wafers from one of the wafer storage devices to another of the wafer storage devices.

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