Swing mechanism for semiconductor heat treatment equipment and semiconductor heat treatment equipment

Abstract

The invention provides a rotary mechanism for semiconductor heat treatment equipment and the semiconductor heat treatment equipment, the semiconductor heat treatment equipment further comprises a wafer boat, and the rotary mechanism comprises a supporting part used for bearing the wafer boat and provided with a first limiting part; the driving shaft is used for driving the supporting part to rotate, the driving shaft is provided with a second limiting part, the first limiting part and the second limiting part are detachably matched in an inserted mode, and the inserted matching of the first limiting part and the second limiting part is used for achieving driving matching in the circumferential direction; and the retainer is simultaneously matched with the supporting part and the driving shaft in an inserting manner so as to limit the position where the first limiting part and the second limiting part are separated from the inserting and matching position. According to the swing mechanism, the supporting part and the driving shaft are detachably connected in an inserted mode to achieve mounting and dismounting, an original small-size threaded fit connection mode is replaced with a large-size insertion fit mode, the stability of the fit relation can be guaranteed, and jamming is effectively avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a rotary mechanism for semiconductor heat treatment equipment and semiconductor heat treatment equipment. Background Art

[0002] Semiconductor heat treatment equipment is the core equipment of integrated circuit manufacturing, which is suitable for various oxidation, annealing and thin film growth processes in the integrated circuit manufacturing process. Among them, the vertical reactor is a semiconductor heat treatment equipment.

[0003] like Figure 1 As shown, the vertical reactor includes: a chamber body, a process door assembly, a rotary mechanism and a wafer boat. The chamber body is buckled on the process door assembly and encloses a process space, and the rotary mechanism is rotatably arranged on the process door assembly for placing the wafer boat. During the process, the wafer boat is placed on the rotary mechanism, and the rotary mechanism can drive the wafer boat to rotate in the process space, so that the wafers on the wafer boat are evenly heated.

[0004] The rotary mechanism used in the existing vertical reactor mainly includes a drive shaft and a support plate. The support plate is arranged in the process space. The drive shaft and the support plate are fixedly connected by bolts and screw holes so that the drive shaft drives the support plate to rotate. During the process, the temperature in the process chamber will rise and fall repeatedly, which will cause the external thread of the bolt and the internal thread of the screw hole to expand and contract repeatedly with the temperature rise and fall, resulting in the jamming or adhesion between the internal thread and the external thread. The drive shaft and the support plate cannot be separated, and they can only be separated by destruction, causing damage or scrapping of parts, which makes equipment maintenance extremely difficult. Summary of the invention

[0005] The present invention aims to at least solve the problem in the prior art that during the use of the rotary mechanism, parts become stuck and cannot be properly disassembled, which easily causes damage or scrapping of the parts. A rotary mechanism for semiconductor heat treatment equipment and semiconductor heat treatment equipment are proposed.

[0006] In order to achieve the purpose of the present invention, a rotating mechanism for semiconductor heat treatment equipment is provided, the semiconductor heat treatment equipment also includes a wafer boat, the rotating mechanism includes: a support part, used to carry the wafer boat, the support part has a first limit part; a drive shaft, used to drive the support part to rotate, the drive shaft has a second limit part, the first limit part and the second limit part are detachably plug-fitted, the plug-fitting of the first limit part and the second limit part is used to achieve driving cooperation in the circumferential direction; a stopper, plug-fitted with the support part and the drive shaft at the same time to limit the position where the first limit part and the second limit part are out of plug-fitting.

[0007] Optionally, the supporting portion has a bearing surface for bearing the crystal boat, the first limiting portion is arranged on the side of the supporting portion away from the bearing surface, the first limiting portion includes a plurality of limiting teeth, and the plurality of limiting teeth are circumferentially spaced; the driving shaft has a first end face facing the supporting portion, the second limiting portion includes a plurality of limiting grooves arranged on the first end face, the limiting grooves match the limiting teeth, and the limiting grooves and the limiting teeth are arranged in a one-to-one correspondence.

[0008] Optionally, the stop member is detachably connected to the support portion and the drive shaft; when the stop member is disengaged from the support portion and the drive shaft, the support portion and the drive shaft are relatively rotatable; the support portion drives the limit tooth to move by rotating relative to the drive shaft, so that the limit tooth and the limit groove are plug-fitted or disengaged from the plug-fitting.

[0009] Optionally, the support portion has a first rotation direction and a second rotation direction relative to the drive shaft, and the first rotation direction is opposite to the second rotation direction; the support portion is rotated along the first rotation direction relative to the drive shaft so that the limit tooth is plug-fitted into the limit groove; the support portion is rotated along the second rotation direction relative to the drive shaft so that the limit tooth is disengaged from the limit groove.

[0010] Optionally, the support portion has a first rotation direction and a second rotation direction relative to the driving shaft, the first rotation direction being opposite to the second rotation direction; the limiting groove has a first limiting surface that cooperates with the limiting tooth, and at the position where the limiting tooth and the limiting groove are plugged into each other, the limiting tooth and the first limiting surface abut against each other to limit the rotation of the limiting tooth in the first rotation direction; when the driving shaft rotates along the second rotation direction, the first limiting surface applies a driving force along the second rotation direction to the limiting tooth to drive the support portion to rotate in the same direction.

[0011] Optionally, the limiting groove has a first groove wall, the surface of the first groove wall forms the first limiting surface, and the first limiting surface forms an acute angle α with the groove bottom surface of the limiting groove.

[0012] Optionally, the limit groove also has a second groove wall corresponding to the first groove wall in the circumferential direction, an obtuse angle β is formed between the second groove wall and the groove bottom of the limit groove, and the surface of the second groove wall forms a guiding surface for guiding the limit tooth to engage or disengage from the limit groove.

[0013] Optionally, the limiting tooth is a ratchet tooth, and the ratchet tooth has a second limiting surface matching the first limiting surface, and when the limiting tooth is plugged into the limiting groove, the first limiting surface abuts against the second limiting surface.

[0014] Optionally, a first limiting hole is provided on the support portion, and the first limiting hole axially passes through the support portion from the bearing surface to the side of the support portion facing away from the bearing surface; a second limiting hole corresponding to the first limiting hole is provided on the first end face of the driving shaft connecting end, and the stop member is simultaneously inserted into the first limiting hole and the second limiting hole to limit the relative rotation of the support portion and the driving shaft.

[0015] Optionally, the first limiting hole and the second limiting hole are located on the rotation axis of the drive shaft, the radial cross-section of the stop member is non-circular, and the radial cross-sections of the first limiting hole and the second limiting hole match the radial cross-section of the stop member to limit the relative rotation of the support part and the drive shaft.

[0016] Optionally, the supporting portion has a bearing surface for bearing the crystal boat, and the first limiting portion is arranged on the side of the supporting portion away from the bearing surface, and the first limiting portion includes a plurality of limiting grooves, and the plurality of limiting grooves are circumferentially spaced apart; the driving shaft has a connecting end facing the supporting portion, and the second limiting portion includes a plurality of limiting teeth arranged on the end face of the connecting end, the limiting grooves match the limiting teeth, and the limiting grooves and the limiting teeth are arranged in a one-to-one correspondence.

[0017] According to a second aspect of the present invention, a semiconductor heat treatment equipment is also disclosed, including: a reaction chamber having an opening structure; a process door assembly, arranged at the position of the opening structure and used to seal the reaction chamber; a wafer boat, arranged in the reaction chamber; the above-mentioned rotating mechanism, the rotating mechanism being rotatably arranged on the process door assembly, the wafer boat being arranged on the rotating mechanism, and the rotating mechanism being used to drive the wafer boat to rotate.

[0018] The rotary mechanism of the present invention is provided with a first limiting part and a second limiting part, and the first limiting part and the second limiting part are detachably plugged and matched, so as to realize the installation and disassembly between the support part and the driving shaft. After the first limiting part and the second limiting part are plugged and matched, the surfaces that match each other are relatively smooth, and there is no small-sized matching thread. When the temperature is high, the first limiting part and the second limiting part will expand, and when the temperature is reduced, the first limiting part and the second limiting part will shrink. Therefore, under the condition of high temperature and repeated heating and cooling, the first limiting part and the second limiting part will not be repeatedly squeezed against each other, and the first limiting part and the second limiting part can be effectively prevented from sticking and getting stuck. In addition, by providing a stopper, the stability of the first limiting part and the second limiting part in the plug-in matching position can be ensured, thereby improving the reliability of the connection between the driving shaft and the support part. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of semiconductor heat treatment equipment in the prior art;

[0020] Figure 2 It is a structural schematic diagram of a rotary mechanism according to an embodiment of the present invention;

[0021] Figure 3 It is a structural schematic diagram of a support portion of a slewing mechanism according to an embodiment of the present invention;

[0022] Figure 4 A three-dimensional diagram of a support portion of a slewing mechanism according to an embodiment of the present invention;

[0023] Figure 5 It is a schematic structural diagram of a driving shaft of a rotary mechanism according to an embodiment of the present invention;

[0024] Figure 6 It is a structural schematic diagram of a support portion of a slewing mechanism according to an embodiment of the present invention, in which the limiting teeth are located in a first position;

[0025] Figure 7 It is a structural schematic diagram of the limiting teeth of the supporting part of the slewing mechanism according to an embodiment of the present invention being located at the second position;

[0026] Figure 8a Schematic diagram of the installation process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 1 ;

[0027] Figure 8b Schematic diagram of the installation process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 2 ;

[0028] Figure 8c Schematic diagram of the installation process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 3 ;

[0029] Figure 9a Schematic diagram of the disassembly process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 1 ;

[0030] Figure 9b Schematic diagram of the disassembly process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 2 ;

[0031] Fig.9c Schematic diagram of the disassembly process of the support part and the drive shaft of the rotary mechanism of the embodiment of the present invention Figure 3 ;

[0032] Fig.10 for Figure 6 A partial enlarged view of part A;

[0033] Fig.11It is a schematic structural diagram of a limit groove of a driving shaft of a rotary mechanism according to an embodiment of the present invention;

[0034] Fig.12 for Fig.11 A partial enlarged view of part B;

[0035] Fig.13 It is a structural schematic diagram of a stopper of a rotary mechanism according to an embodiment of the present invention;

[0036] Fig.14 A schematic structural diagram of a semiconductor heat treatment device according to an embodiment of the present invention;

[0037] List of reference numerals:

[0038] 10. Support part; 11. Bearing surface; 12. First limiting hole; 13. Lower bottom surface; 14. Connecting boss; 20. First limiting part; 21. Limiting tooth; 211. Second limiting surface; 30. Drive shaft; 31. First end surface; 32. Second limiting hole; 40. Second limiting part; 41. Limiting groove; 411. First limiting surface; 412. Guide surface; 413. Groove bottom surface; 50. Stopper; 51. Main body; 52. Limiting boss; 53. Handle; 100. Reaction chamber; 200. Process door assembly; 210. Process door; 220. Support arm; 300. Crystal boat. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the technical solution of the present invention, the rotary mechanism of the semiconductor heat treatment equipment and the semiconductor heat treatment equipment provided by the present invention are described in detail below in conjunction with the accompanying drawings.

[0040] Semiconductor heat treatment equipment is the core equipment in integrated circuit manufacturing. It is suitable for various oxidation, annealing and thin film growth processes in the integrated circuit manufacturing process. Among them, the vertical reactor is a semiconductor heat treatment equipment.

[0041] like Figure 1 As shown, the vertical reactor includes: a chamber body 1, a process door assembly 2, a rotating mechanism 3 and a wafer boat 4. The chamber body 1 is buckled on the process door assembly 2 to enclose a process space, and the rotating mechanism 3 is rotatably arranged on the process door assembly 2 to drive the wafer boat 4 to rotate. When in use, the wafer boat 4 is placed on the rotating mechanism 3, and the rotating mechanism 3 can drive the wafer boat 4 to rotate in the process space, so that the wafers on the wafer boat 4 are evenly heated.

[0042] The process door assembly 2 includes: a process door 5 and a support arm 6 connected below the process door 5. The slewing mechanism 3 mainly includes a driving shaft 7 and a support plate 8. The driving shaft 7 is rotatably connected to the support arm 6, and the driving shaft 7 passes through the top of the process door 5 and is fixedly connected to the support plate 8 located above the process door 5, so that the driving shaft 7 drives the support plate 8 to rotate.

[0043] It should be noted that in conventional vertical reactors, in order to ensure the reliability of the connection, screw holes are provided on the drive shaft 7 and the support plate 8, and the two screw holes are connected by bolts to achieve a fixed connection. However, during the heat treatment process, the temperature inside the chamber body 1 will reach 700℃ to 1000℃, and the temperature inside some chamber bodies 1 will even reach 1200℃. In such a high temperature environment, in addition to the test of the material of the components, higher requirements are also put forward for the connection method between the components inside the chamber body 1.

[0044] When the temperature is repeatedly increased and decreased during the process in the chamber body 1, the connection between the parts will repeatedly expand and contract with the increase and decrease of temperature, especially the small-size connection matching mode such as threaded connection. In this matching mode, the external thread is formed by rotating into the gap of the internal thread to form a match. Therefore, when the temperature in the chamber body 1 is high, the external thread of the bolt and the internal thread of the screw hole expand at high temperature, and the gap of the internal thread will be reduced, thereby squeezing the external thread. Similarly, the gap between the external threads will also be reduced, and the internal thread will be squeezed at the same time. That is to say, the internal and external threads will be squeezed and deformed against each other. After the process is completed, the temperature in the chamber body 1 is reduced, and the external thread of the bolt and the internal thread of the screw hole cool down and shrink. As the temperature in the chamber body 1 rises and falls repeatedly, the temperature of the external thread of the bolt and the internal thread of the screw hole repeatedly expands and contracts, and the threads are repeatedly squeezed, which eventually changes the matching relationship between the internal thread and the external thread, resulting in jamming and inability to disassemble. After the parts are jammed or adhered, the parts can only be removed by destruction, causing damage or scrapping of the parts, which causes great difficulties in equipment maintenance. When the equipment is being maintained, the quartz boat support plate 8 and the rotating device cannot be disassembled.

[0045] To avoid the above problems, Figure 2 The embodiment of the present invention shown in the figure discloses a rotary mechanism of a semiconductor heat treatment device, the semiconductor heat treatment device can be a vertical reaction furnace, the semiconductor heat treatment device also includes a wafer boat 300, and the rotary mechanism includes: a support part 10, a drive shaft 30 and a stopper 50. The support part 10 is used to carry the wafer boat 300 ( Figure 2(not shown in the figure), the support part 10 has a first limit part 20; the driving shaft 30 is used to drive the support part 10 to rotate, and the driving shaft 30 has a second limit part 40, the first limit part 20 and the second limit part 40 are detachably plugged together, and the support part 10 and the driving shaft 30 are plugged together by the first limit part 20 and the second limit part 40 to achieve circumferential driving cooperation; the stopper 50 is detachably plugged together with the support part 10 and the driving shaft 30 at the same time to limit the position where the first limit part 20 and the second limit part 40 are out of the plug-in cooperation.

[0046] During assembly, the first limiting part 20 and the second limiting part 40 are plugged together to form a driving fit between the support part 10 and the drive shaft 30 in the circumferential direction, so that the support part 10 is driven to rotate by the drive shaft 30. At the same time, by setting the stopper 50, the first limiting part 20 and the second limiting part 40 can be kept in the plugged-in fit position to avoid the two from being separated from the limit fit, thereby ensuring the reliability of the connection between the support part 10 and the drive shaft 30. When disassembly is required, the stopper 50 is first removed to release the limit lock of the stopper 50 on the first limiting part 20 and the second limiting part 40, so that the first limiting part 20 and the second limiting part 40 can be separated from the plugged-in fit position, so that the first limiting part 20 and the second limiting part 40 are separated from each other, and then the support part 10 is separated from the drive shaft 30.

[0047] It should be noted that plug-in fit refers to the fit between structures such as holes and pins, grooves and teeth, grooves and protrusions. It is different from the threaded connection method. After the above structures are plugged in, the large-sized mating surfaces fit each other, and the mating surface surface is relatively smooth. There is no small-sized mating structure like threads. Therefore, even in high temperature and repeated temperature rise and fall environment, there will be no problem of high-temperature jamming and adhesion like threaded fit.

[0048] The rotary mechanism of the present invention is provided with a first limiting part 20 and a second limiting part 40, and the first limiting part 20 and the second limiting part 40 are detachably plugged and matched, so as to realize the installation and disassembly between the support part 10 and the drive shaft 30. Since the surfaces of the first limiting part 20 and the second limiting part 40 are relatively smooth after being plugged and matched, and there is no small-sized thread matching, when the temperature is high, the first limiting part 20 and the second limiting part 40 will expand, and when the temperature is reduced, the first limiting part 20 and the second limiting part 40 will shrink. Therefore, under the condition of high temperature and repeated heating and cooling, the first limiting part 20 and the second limiting part will not be repeatedly squeezed against each other, and the first limiting part 20 and the second limiting part 40 can be effectively prevented from being stuck to each other. In addition, by providing a stopper 50, the stability of the first limiting part 20 and the second limiting part 40 in the plug-in matching position can be ensured, thereby improving the reliability of the connection between the drive shaft 30 and the support part 10.

[0049] Combine the following Figures 2 to 13 , the rotary mechanism for semiconductor heat treatment equipment of the present invention is specifically described.

[0050] like Figure 3 As shown, the support portion 10 is a support plate, and has a support plate for carrying the wafer boat 300 ( Figure 3 The bearing surface 11 and the lower bottom surface 13 are not shown in the figure, and the lower bottom surface 13 is away from the bearing surface 11. Figure 3 A connecting boss 14 is provided at the rotation center of the lower bottom surface 13 of the support portion 10. The connecting boss 14 extends in the axial direction, and the first limiting portion 20 is provided on the connecting boss 14. Figure 4 As shown, in this embodiment, the first limiting portion 20 includes a plurality of limiting teeth 21, each of which extends in the axial direction and is connected to the connecting boss 14. The plurality of limiting teeth 21 are spaced apart in the circumferential direction.

[0051] like Figure 5 As shown, the drive shaft 30 has a first end face 31 facing the support portion 10, and the second limiting portion 40 includes a plurality of limiting grooves 41 arranged on the first end face 31, and the limiting grooves 41 match the limiting teeth 21, and the limiting grooves 41 correspond to the limiting teeth 21 one by one. By adopting a plurality of limiting teeth 21 corresponding to the limiting grooves 41 one by one and plugging and matching each other, the stability of the connection can be improved while ensuring the simplicity of the disassembly and assembly process. Moreover, the design of the large-sized limiting teeth and the limiting grooves can ensure the stability of the structural dimensions, and will not cause the problem of jamming between the structural matching due to temperature rise and fall.

[0052] The stopper 50 is detachably connected to the support part 10 and the drive shaft 30. The stopper 50 can be plugged and matched with the support part 10 and the drive shaft 30 at the same time, or can be disengaged from the support part 10 and the drive shaft 30 at the same time.

[0053] When the stop member 50 is plugged into and matched with the support part 10 and the drive shaft 30 at the same time, the first limit part 20 and the second limit part 40 can be kept in the plugged-in position to prevent the two from being out of the limit fit, thereby ensuring the reliability of the connection between the support part 10 and the drive shaft 30.

[0054] When the stop member 50 is disengaged from the support portion 10 and the drive shaft 30 at the same time, the support portion 10 and the drive shaft 30 are relatively rotatable; the support portion 10 drives the limit tooth 21 to move by rotating relative to the drive shaft 30, so that the limit tooth 21 and the limit groove 41 are plugged in or out of engagement.

[0055] Therefore, when disassembly is necessary, the stop member 50 can be removed first to release the limit lock of the stop member 50 on the first limit portion 20 and the second limit portion 40, so that the first limit portion 20 and the second limit portion 40 can be separated from the plug-in mating position, thereby separating the first limit portion 20 and the second limit portion 40 from each other, and further separating the support portion 10 from the drive shaft 30.

[0056] Specifically, there is a first position and a second position on the moving path of the limiting tooth 21. Figure 6 As shown, at the first position on the moving path of the limiting tooth 21, the limiting tooth 21 is inserted into and limitedly matched with the limiting groove 41, and the limiting tooth 21 and the limiting groove 41 are limitedly matched to enable the driving shaft 30 to drive the supporting part 10 to rotate. Figure 7 As shown, at the second position on the moving path of the limiting tooth 21, the limiting tooth 21 is disengaged from the limiting groove 41, and in the axial direction of the drive shaft 30, the support portion 10 moves away from the drive shaft 30 ( Figure 7 The limiting tooth 21 and the limiting groove 41 can be disengaged from each other by moving in the first axis direction of the axis.

[0057] like Figures 8a to 8c As shown, during assembly, the support portion 10 rotates relative to the drive shaft 30 along the first rotation direction so that the limiting teeth 21 are plugged into and matched with the limiting grooves 41. The specific assembly process is as follows:

[0058] like Figure 8a As shown, first align the limiting tooth 21 with the limiting groove 41, and then move the support part 10 toward the direction close to the driving shaft 30 in the axial direction of the driving shaft 30 ( Figure 8a The second axis direction of the middle part) moves so that the limiting tooth 21 is located at Figure 8b After the limiting tooth 21 is located at the second position, the support portion 10 moves relative to the drive shaft 30 along the Figure 8b The support portion 10 will continue to rotate along the first rotation direction. Figure 8b The second axis direction of the position limiting tooth 21 moves from the second position to the position Figure 8c After the limiting tooth 21 is located at the second position, the stopper 50 is plugged into and matched with the support portion 10 and the drive shaft 30 to complete the axial limiting and the assembly is completed.

[0059] like Figures 9a to 9c As shown, during disassembly, the support portion 10 rotates relative to the drive shaft 30 along the second rotation direction to disengage the limiting teeth 21 from the limiting grooves 41. The specific disassembly process is as follows:

[0060] First, remove the stopper 50 to release the axis limit of the support part 10 and the drive shaft 30 by the stopper 50, so that the support part 10 can move relative to the drive shaft 30 along the axis. Figure 9aAfter the stopper 50 is removed, Figure 9a As shown, the support portion 10 rotates relative to the drive shaft 30 along the second rotation direction, and at the same time, in the direction of the axis of the drive shaft 30, the support portion 10 moves away from the drive shaft 30 ( Figure 9a The limiting tooth 21 moves from the first position to the first axis direction. Figure 9b After moving to the second position, the support portion 10 continues to move along Figure 9b The first axis direction of the position limiting tooth 21 and the position limiting groove 41 are completely separated from each other (such as Fig.9c Complete the disassembly.

[0061] It can be understood that in the above embodiment, the first rotation direction is opposite to the second rotation direction, the first rotation direction is counterclockwise, the second rotation direction is clockwise, and the first axis direction is opposite to the second axis direction. It is not difficult to see from the installation and disassembly process of the above support part 10 and the drive shaft 30 that during assembly, the support part 10 needs to be rotated relative to the drive shaft 30 along the first rotation direction, and since the rotation directions of the support part 10 and the drive shaft 30 are relative, during assembly, the drive shaft 30 can also be rotated relative to the support part 10 along the second rotation direction. Correspondingly, during disassembly, the support part 10 needs to be rotated relative to the drive shaft 30 along the second rotation direction, and the drive shaft 30 can also be rotated along the first rotation direction. During the heating process of the semiconductor heat treatment equipment, the rotary mechanism is mostly rotated in the clockwise direction, that is, the second rotation direction in the present invention. Therefore, during the rotation of the drive shaft 30, the limit teeth 21 and the limit grooves 41 form a self-locking relationship with each other, so that it can be ensured that during the operation of the rotary mechanism, the drive shaft 30 and the support part 10 always maintain driving cooperation.

[0062] like Fig.10 As shown, the limit groove 41 has a first limit surface 411 that cooperates with the limit tooth 21. In the first position of the limit tooth 21, the limit tooth 21 abuts against the first limit surface 411, and the limit groove 41 limits the rotation of the limit tooth 21 in the first rotation direction through the first limit surface 411; when the driving shaft 30 rotates along the second rotation direction, the limit groove 41 applies a driving force along the second rotation direction to the limit tooth 21 through the first limit surface 411 to drive the support part 10 to rotate in the same direction.

[0063] Please combine Figure 5 and Fig.12The limiting groove 41 has a first groove wall and a groove bottom. The groove bottom surface (i.e., groove bottom surface 413) of the limiting groove 41 is parallel to the radial surface of the drive shaft 30. The direction of the first groove wall intersects with the direction of the outer peripheral wall of the drive shaft 30. The first groove wall surface forms a first limiting surface 411. The first limiting surface 411 and the groove bottom surface 413 of the limiting groove 41 form an acute angle α. In the first position of the limiting tooth 21, since the first limiting surface 411 and the groove bottom surface 413 form an acute angle α, the first limiting surface 411 can not only limit the limiting tooth 21 along the radial direction, but also can limit the limiting tooth 21 from moving along the radial direction. Fig.12 The first rotation direction of the limit tooth 21 can also be limited to rotate along the Fig.12 That is, by making the first limiting surface 411 and the groove bottom surface 413 form an acute angle α, the first limiting surface 411 on the first groove wall can exert an angle of 0.05° on the limiting tooth 21. Fig.12 The force in the second rotation direction and the second axis direction can realize the circumferential limit and the axial limit at the same time, and the groove bottom surface 413 can be along Fig.12 The first axis direction provides a stable support force for the limiting tooth 21. Fig.12 To move in the direction of the first axis, the limiting tooth 21 must be relative to the limiting groove 41 along the Fig.12 The second direction of rotation, that is, the support portion 10 rotates relative to the drive shaft 30 along Fig.12 The stopper 50 just limits the relative rotation between the support portion 10 and the drive shaft 30, thereby effectively ensuring the stability of the plug-in fit between the limiting tooth 21 and the limiting groove 41.

[0064] It should be noted that, although in the present embodiment, the angle α is an acute angle, this is not restrictive, and in some other embodiments not shown in the figure, the angle α can also be a right angle, as long as the angle can form a limit in the first rotation direction after the limit tooth 21 abuts against the first limit surface 411, it is within the protection scope of the present invention.

[0065] like Fig.12 As shown, the limiting groove 41 also has a second groove wall corresponding to the first groove wall in the circumferential direction, and an obtuse angle β is formed between the second groove wall and the groove bottom of the limiting groove 41. The surface of the second groove wall forms a guide surface 412 for guiding the limiting tooth 21 to move between the first position and the second position member, thereby guiding the limiting tooth 21 to engage with or disengage from the limiting groove 41. Specifically, by providing the guide surface 412, during the assembly process, the guide surface 412 can guide the limiting tooth 21 along the Fig.12The first rotation direction of the position limiting tooth 21 is rotated in the first rotation direction, so that the position limiting tooth 21 moves from the second position to the first position; accordingly, during the disassembly process, the guide surface 412 can guide the position limiting tooth 21 to move from the first position to the second position, so as to facilitate the disengagement of the position limiting tooth 21 from the position limiting groove 41. By setting the guide surface 412, the position limiting tooth 21 can be guided, so that the assembly and disassembly process of the position limiting tooth 21 and the position limiting groove 41 is smoother, and the assembly efficiency is improved. Moreover, since an obtuse angle is formed between the guide surface 412 and the groove bottom, the size of the groove can be made larger, which is convenient for the insertion of the position limiting tooth 21.

[0066] like Fig.10 As shown, the limiting tooth 21 is a ratchet, and the ratchet has a second limiting surface 211 that matches the first limiting surface 411. In the first position of the limiting tooth 21, that is, the position where the limiting tooth 21 is plugged and matched with the limiting groove 41, the first limiting surface 411 abuts against the second limiting surface 211. The limiting tooth 21 is set as a ratchet, and the second limiting surface 211 of the ratchet abuts against the first limiting surface 411, so that the first limiting surface 411 and the second limiting surface 211 interact with each other, so that the first limiting surface 411 can limit the second limiting surface 211 in the first rotation direction and the first axis direction. At the same time, through the action force and the reaction force, the first limiting surface 411 can also apply a force in the second rotation direction to the second limiting surface 211, so that when the drive shaft 30 rotates in the second direction, the support part 10 is driven to rotate in the same direction. By setting the second limiting surface 211, the limiting tooth 21 and the limiting groove 41 can be more matched, thereby improving the stability and reliability of the connection.

[0067] like Figure 4 As shown, the support portion 10 is provided with a first limiting hole 12, and the first limiting hole 12 axially penetrates from the bearing surface 11 to the side of the support portion 10 away from the bearing surface 11. Figure 5 As shown, a second limiting hole 32 corresponding to the first limiting hole 12 is provided on the first end surface 31 of the connecting end of the driving shaft 30, and the stopper 50 is inserted into the first limiting hole 12 and the second limiting hole 32 at the same time to limit the relative rotation of the support portion 10 and the driving shaft 30. By limiting the relative rotation of the support portion 10 and the driving shaft 30, the limiting groove 41 and the limiting tooth 21 can be limited to the first position, so that the matching of the limiting groove 41 and the limiting tooth 21 is more firm and reliable.

[0068] The first limiting hole 12 and the second limiting hole 32 are located on the rotation axis of the drive shaft 30, and the radial cross section of the stopper 50 is non-circular. The radial cross sections of the first limiting hole 12 and the second limiting hole 32 match the radial cross section of the stopper 50 to limit the relative rotation of the support portion 10 and the drive shaft 30. In this embodiment, the radial cross section of the stopper 50 is a long strip, and the two ends in the length direction are arc-shaped, so as to form a limiting structure in the circumferential direction. However, this is not restrictive. In some other embodiments not shown in the figure, the cross section of the stopper 50 can also be a rectangular, triangular, polygonal or special-shaped structure. As long as it can limit the relative rotation of the drive shaft 30 and the support portion 10 in the circumferential direction, it is within the protection scope of the present invention.

[0069] like Fig.13 As shown, in order to facilitate the installation and removal of the stopper 50, in this embodiment, the stopper 50 is a limit pin, and the limit pin includes a body 51, a limit boss 52 and a handle 53. The body 51 is arranged in the first limit hole 12 and the second limit hole 32, and forms a circumferential limit fit with the first limit hole 12 and the second limit hole 32 through the body 51. The limit boss 52 is arranged at one end of the body 51 and abuts against the support part 10 to prevent the limit pin from entering the first limit hole 12 completely and being unable to be taken out. The handle is connected to the limit boss 52 to facilitate the installation and removal operations.

[0070] It should be noted that, in the above embodiment, the first limiting portion 20 is a plurality of limiting teeth 21, and the second limiting portion 40 is a limiting groove 41 corresponding to the limiting teeth 21, but this is not restrictive. In some other embodiments not shown in the figure, the structure is the same as the above embodiment, except that, in other embodiments, the first limiting portion 20 includes a plurality of limiting grooves 41, and the plurality of limiting grooves 41 are distributed at intervals in the circumferential direction; the second limiting portion 40 includes a plurality of limiting teeth 21 arranged on the end face of the connecting end, the limiting grooves 41 match the limiting teeth 21, and the limiting grooves 41 are arranged in a one-to-one correspondence with the limiting teeth 21. Without violating the inventive concept and working principle of the present invention, the above structure also belongs to the protection scope of the present invention.

[0071] like Fig.14As shown, the present invention also discloses a semiconductor heat treatment equipment, including: a reaction chamber 100, a process door assembly 200, a wafer boat 300 and the above-mentioned rotating mechanism. The bottom of the reaction chamber 100 has an opening structure; the process door assembly 200 is arranged at the position of the opening structure, and is used to seal the reaction chamber 100; the rotating mechanism is rotatably arranged on the process door assembly 200, and the wafer boat 300 is arranged on the rotating mechanism, and the rotating mechanism is used to drive the wafer boat 300 to rotate. Among them, the process door assembly 200 includes: a process door 210 and a support arm 220. The support part 10 is arranged above the process door 210, and a through hole is arranged on the process door 210. The drive shaft 30 is passed through the through hole of the process door 210, and the drive shaft 30 is rotatable relative to the process door 210; one end of the drive shaft 30 is connected to the support part 10, and the other end of the drive shaft 30 is drive-connected to the output shaft of the motor. The support arm 220 is arranged below the process door 210 and fixedly connected to the process door 210. The support arm 220 is a hollow structure, and the drive shaft 30 is passed through the inside of the support arm 220 and is rotatably connected to the support arm 220 through a bearing.

[0072] During assembly, the first limiting portion 20 of the support portion 10 is plugged into the second limiting portion 40 of the drive shaft 30, so that the first limiting portion 20 and the second limiting portion 40 are self-locking in the rotation direction of the drive shaft 30, so that when the drive shaft 30 rotates, the support portion 10 can be driven to rotate in the same direction, and then the wafer boat 300 can be driven to rotate through the support portion 10. By providing the stopper 50, the support portion 10 and the drive shaft 30 cannot rotate relative to each other, ensuring the stability and reliability of the plug-in cooperation between the first limiting portion 20 and the second limiting portion 40.

[0073] The semiconductor heat treatment equipment of the present invention realizes the installation and disassembly between the support part 10 and the drive shaft 30 through the rotary mechanism, because the first limit part 20 and the second limit part 40 are detachably plugged and matched. After the first limit part 20 and the second limit part 40 are plugged, the mating surfaces are relatively smooth, and there is no small-sized thread matching. When the temperature is high, the first limit part 20 and the second limit part 40 will expand, and when the temperature is reduced, the first limit part 20 and the second limit part 40 will shrink. Therefore, under high temperature and repeated temperature rise and fall, the first limit part 20 and the second limit part will not be repeatedly squeezed each other, which can effectively avoid the first limit part 20 and the second limit part 40 from sticking and getting stuck. In addition, by setting the stopper 50, the stability of the first limit part 20 and the second limit part 40 in the plug-in matching position can be ensured, thereby improving the reliability of the connection between the drive shaft 30 and the support part 10.

[0074] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A rotary mechanism of a semiconductor heat treatment equipment, characterized in that: The semiconductor heat treatment equipment further comprises a wafer boat (300), and the rotating mechanism comprises: A support portion (10) for carrying the wafer boat (300), the support portion (10) having a first limiting portion (20); A drive shaft (30) is used to drive the support portion (10) to rotate, the drive shaft (30) having a second limiting portion (40), the first limiting portion (20) and the second limiting portion (40) being detachably plugged in and matched, and the plugging and matching of the first limiting portion (20) and the second limiting portion (40) is used to achieve driving matching in the circumferential direction; The stopper (50) is simultaneously plug-fitted with the support portion (10) and the drive shaft (30) to limit the position where the first limiting portion (20) and the second limiting portion (40) are out of the plug-fitting state.

2. The rotary mechanism according to claim 1, characterized in that: The support portion (10) has a bearing surface (11) for bearing the wafer boat (300); the first limiting portion (20) is arranged on a side of the support portion (10) away from the bearing surface (11); the first limiting portion (20) comprises a plurality of limiting teeth (21); and the plurality of limiting teeth (21) are distributed at intervals in the circumferential direction; The driving shaft (30) has a first end surface (31) facing the supporting portion (10), and the second limiting portion (40) includes a plurality of limiting grooves (41) arranged on the first end surface (31), the limiting grooves (41) match the limiting teeth (21), and the limiting grooves (41) and the limiting teeth (21) are arranged in a one-to-one correspondence.

3. The rotary mechanism according to claim 2, characterized in that: The stopper (50) is detachably connected to the support portion (10) and the drive shaft (30); When the stopper (50) is disengaged from the support portion (10) and the drive shaft (30), the support portion (10) and the drive shaft (30) are relatively rotatable; The support portion (10) drives the limiting tooth (21) to move by rotating relative to the driving shaft (30), so that the limiting tooth (21) and the limiting groove (41) are plugged in or out of plugging.

4. The rotary mechanism according to claim 3, characterized in that: The support portion (10) has a first rotation direction and a second rotation direction relative to the drive shaft (30), and the first rotation direction is opposite to the second rotation direction; The support portion (10) rotates relative to the drive shaft (30) along the first rotation direction so that the limiting tooth (21) is plugged into and matched with the limiting groove (41); The support portion (10) is rotated relative to the drive shaft (30) along the second rotation direction, so that the limiting tooth (21) and the limiting groove (41) are disengaged from the plug-in fit.

5. The rotary mechanism according to claim 3, characterized in that: The support portion (10) has a first rotation direction and a second rotation direction relative to the drive shaft (30), and the first rotation direction is opposite to the second rotation direction; The limiting groove (41) has a first limiting surface (411) matched with the limiting tooth (21); when the limiting tooth (21) and the limiting groove (41) are plugged and matched, the limiting tooth (21) and the first limiting surface (411) abut against each other to limit the limiting tooth (21) from rotating in the first rotation direction; When the driving shaft (30) rotates along the second rotation direction, the first limiting surface (411) applies a driving force along the second rotation direction to the limiting tooth (21) to drive the supporting portion (10) to rotate in the same direction.

6. The rotary mechanism according to claim 5, characterized in that: The limiting groove (41) has a first groove wall, the surface of the first groove wall forms the first limiting surface (411), and the first limiting surface (411) forms an acute angle α with a groove bottom surface (413) of the limiting groove (41).

7. The rotary mechanism according to claim 6, characterized in that: The limiting groove (41) also has a second groove wall corresponding to the first groove wall in the circumferential direction, an obtuse angle β is formed between the second groove wall and the groove bottom of the limiting groove (41), and a surface of the second groove wall forms a guiding surface (412) for guiding the limiting tooth (21) to engage with or disengage from the engaging with the limiting groove (41).

8. The rotary mechanism according to claim 5, characterized in that: The limiting tooth (21) is a ratchet tooth having a second limiting surface (211) matching the first limiting surface (411); at a position where the limiting tooth (21) is plugged into and matched with the limiting groove (41), the first limiting surface (411) abuts against the second limiting surface (211).

9. The rotary mechanism according to claim 2, characterized in that: The support portion (10) is provided with a first limiting hole (12), and the first limiting hole (12) axially penetrates from the bearing surface (11) to a side of the support portion (10) away from the bearing surface (11); A second limiting hole (32) corresponding to the first limiting hole (12) is provided on the first end surface (31) of the connecting end of the driving shaft (30), and the stopper (50) is inserted into the first limiting hole (12) and the second limiting hole (32) at the same time to limit the relative rotation of the supporting portion (10) and the driving shaft (30).

10. The rotary mechanism according to claim 9, characterized in that: The first limiting hole (12) and the second limiting hole (32) are located on the rotation axis of the drive shaft (30); the radial cross section of the stop member (50) is non-circular; the radial cross sections of the first limiting hole (12) and the second limiting hole (32) match the radial cross section of the stop member (50) to limit the relative rotation of the support portion (10) and the drive shaft (30).

11. The rotary mechanism according to claim 1, characterized in that: The support portion (10) has a bearing surface (11) for bearing the wafer boat (300); the first limiting portion (20) is arranged on a side of the support portion (10) away from the bearing surface (11); the first limiting portion (20) comprises a plurality of limiting grooves (41); and the plurality of limiting grooves (41) are distributed at intervals in the circumferential direction; The drive shaft (30) has a connection end facing the support portion (10), the second limiting portion (40) includes a plurality of limiting teeth (21) arranged on the end surface of the connection end, the limiting groove (41) matches the limiting teeth (21), and the limiting groove (41) and the limiting teeth (21) are arranged in a one-to-one correspondence.

12. A semiconductor heat treatment device, characterized in that: include: A reaction chamber (100) having an open structure; A process door assembly (200), arranged at the position of the opening structure, and used for sealing the reaction chamber (100); A wafer boat (300) is disposed in the reaction chamber (100); According to the rotating mechanism according to any one of claims 1 to 11, the rotating mechanism is rotatably arranged on the process door assembly (200), the wafer boat (300) is arranged on the rotating mechanism, and the rotating mechanism is used to drive the wafer boat (300) to rotate.

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