Power module package with adjustable pins

Abstract

The invention provides a power module package with adjustable pins, and relates to the field of semiconductor package. A positioning frame is welded on the top end surface of the chip frame; a chip main body is arranged in the positioning frame; a PAD heat dissipation base island is arranged outside the chip frame; a chip main body is welded outside the PAD heat dissipation base island; the chip main body is aligned with the position of the positioning frame; a chip PAD copper sheet is welded outside the chip main body; and two pin PAD copper sheets are symmetrically welded at the rear part of the chip PAD copper sheet. In an initial state, the second chip pin is stored in the first chip pin, the locking clamping block is separated from the first locking clamping groove by pulling the control supporting column, and then the second chip pin is popped out of the first chip pin through a series of transmission, so that the problems that the pins are generally relatively long and thin, the length is relatively fixed, and the service life of the pins is influenced are solved. And great limitation exists in different use environments and different customer requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a power module packaging with adjustable pins. Background Art

[0002] With the development of science and technology, semiconductor chips are used more and more widely. In the process of semiconductor chip application, in order to avoid direct exposure of the chip to the external environment and improve the chip's anti-interference ability and service life, the semiconductor chip is usually packaged. Using power module packaging to package semiconductor chips is a common packaging method on the market. The existing power module packaging is usually composed of a chip frame, a chip PAD welding surface, a pin PAD welding surface and a pin.

[0003] For example: The utility model patent with application number CN202221754768.4 discloses a TO-220 internal insulation packaging structure, which specifically includes a chip frame, the front side of the chip frame is the chip PAD welding surface, on which the chip is welded; the thickness of the chip frame is set to 0.8mm, the back side of the chip frame is welded with an insulating substrate, and the front and back sides of the insulating substrate are plated with copper, and the back side of the insulating substrate is welded to the heat sink. In the utility model, the thickness of the chip frame is increased from the original 0.5mm to 0.8mm. The increased thickness can effectively improve the chip's stress resistance, and also greatly improve the product's heat dissipation capacity, effectively increase the product's power, and at the same time, the provision of insulation can basically achieve a good insulation effect.

[0004] However, the pins of existing power module packages are usually relatively slender and have a relatively fixed length, which has great limitations when facing different usage environments. For example, in some electronic devices with extremely high requirements for space layout, pins of fixed size may be too long or too wide, resulting in installation difficulties. Moreover, different customers have huge differences in product design and application scenarios, and fixed pin sizes are difficult to meet diverse needs. In addition, the pins of power module packages usually protrude outward from the chip frame by a certain length, which makes the power module package susceptible to external force impacts such as collision and extrusion during storage and installation, resulting in mechanical damage such as bending and deformation of the pins, which affects the conductivity of the pins and is also likely to affect the reliability of the subsequent connection between the pins and the circuit board, making it inconvenient to use. Summary of the invention

[0005] In view of this, the present invention provides a power module package with adjustable pins, which has a first chip pin and a second chip pin that are adapted to different use environments and customer needs. In an initial state, the second chip pin is received in the first chip pin. During the installation and use of the frame, the control pillar is pulled to drive the locking card block to move. As the locking card block moves, the locking card block is disengaged from the first locking card slot. In the initial state, the control spring is in a compressed state. After the locking card block is disengaged from the first locking card slot, the control spring loses the compression received. At this time, the control spring is in a compressed state. The spring will rebound under the action of its own elastic potential energy, and as the control spring rebounds, the second chip pin will be pushed out of the first chip pin. During the movement of the locking block, the guide slide will be driven to move along the guide slide bar. During the movement of the guide slide, the supporting spring will be stretched. After the second chip pin pops out of the first chip pin, the second locking slot will be aligned with the position of the locking block, and then the control pillar is released. At this time, the locking block will rebound under the action of the elastic potential energy of the support spring itself, so that the locking block is inserted into the second locking slot, thereby limiting and fixing the popped-out second chip pin.

[0006] The present invention provides a purpose and efficacy of a pin-adjustable power module package, which specifically includes: a chip frame; a positioning frame is welded on the top surface of the chip frame; a PAD heat dissipation base island is arranged outside the chip frame; a chip body is welded outside the PAD heat dissipation base island; the chip body is aligned with the positioning frame; a chip PAD copper sheet is welded outside the chip body; the chip body 104 is aligned with the positioning frame 103; two pin PAD copper sheets are symmetrically welded to the rear of the chip PAD copper sheet; three first chip pins are arranged at equal intervals in the horizontal direction; two pin PAD copper sheets are respectively welded to two outer first chip pins; a second chip pin is slidably connected to each of the three first chip pins; and a first locking slot is opened at the rear of each of the three second chip pins.

[0007] Furthermore, the bottom end surface of the chip frame is provided with a plurality of heat dissipation grooves; the plurality of heat dissipation grooves are all rectangular groove structures; the plurality of heat dissipation grooves are arranged equidistantly in the horizontal direction; and the plurality of heat dissipation grooves are formed by stamping.

[0008] Furthermore, the rear of the three first chip pins are slidably connected to a locking block; the three locking blocks are respectively inserted into the three first locking slots; and the top surfaces of the three locking blocks are fixedly connected to a control pillar.

[0009] Furthermore, a group of control springs are fixedly connected to the front of the three second chip pins; and the ends of the multiple groups of control springs are fixedly connected to the three first chip pins respectively.

[0010] Furthermore, the outside of the three locking blocks are fixedly connected to a group of guide slides; the top surfaces of the three first chip pins are fixedly connected to a group of guide slide rods; multiple groups of guide slides are respectively slidably connected to the outside of the multiple groups of guide slide rods; the bottom surfaces of the multiple groups of guide slides are fixedly connected to a group of support springs; the ends of the three groups of support springs are respectively fixedly connected to the top surfaces of the three first chip pins.

[0011] Furthermore, a second locking slot is provided at the front of each of the three second chip pins; the three second locking slots are aligned with the positions of the three first locking slots respectively; and the sizes of the three second locking slots are the same as those of the three first locking slots.

[0012] Furthermore, a positioning slot is provided at the front of the three locking blocks; a positioning slide is slidably connected to the rear of the three first chip pins; the three positioning slides are respectively inserted into the three positioning slots; a group of return springs are slidably connected to the front of the three positioning slides; the ends of the three groups of return springs are respectively fixedly connected to the three first chip pins.

[0013] Furthermore, the outside of the two pin PAD copper sheets and the outside of the chip PAD copper sheet are provided with connecting through holes; the three connecting through holes are all circular hole structures; the bottom end surfaces of the two pin PAD copper sheets and the bottom end surface of the chip PAD copper sheet are provided with guide grooves.

[0014] Beneficial effect: During the use of the present invention, in the initial state, the second chip pin is stored in the first chip pin, reducing the area of ​​the pin exposed to the external environment when not in use, so that external objects cannot directly contact the second chip pin, thereby avoiding problems such as pin deformation, bending, breakage or surface wear due to accidental collision or friction with other objects during transportation, storage and operation, providing good physical isolation protection for the pin, and during the installation and use of the frame, the locking block is disengaged from the first locking slot by pulling the control pillar. At this time, the control spring will push the second chip pin out of the first chip pin under the action of its own elastic potential energy, and then release the control pillar to allow the locking block to be inserted into the second locking slot with the rebound of the support spring, and the popped-up second chip pin is limited and fixed. The operation is simple and quick, which effectively improves the practicality of the power module package, enables the power module package to adapt to different usage environments and meet different customer needs, and is more convenient to use.

[0015] The heat dissipation area of ​​the frame is increased by setting the heat dissipation groove, while at the same time the use of copper materials can be reduced, the heat dissipation efficiency can be improved, the reliability level of the device can be improved, the cost of raw materials can be reduced, and the convenience of power module packaging can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0017] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0018] In the attached picture: Figure 1 It is a schematic diagram of the axonometric structure of the present invention when viewed from above.

[0019] Figure 2 It is an axonometric structural schematic diagram of the present invention.

[0020] Figure 3 It is a schematic diagram of the cross-sectional structure of the PAD heat dissipation base island of the present invention.

[0021] Figure 4 It is a schematic diagram of the axonometric structure of the chip PAD copper sheet of the present invention.

[0022] Figure 5 It is a schematic diagram of the isometric structure of the chip body of the present invention.

[0023] Figure 6 It is a schematic diagram of the isometric structure of the second chip after the pins of the present invention are ejected.

[0024] Figure 7 It is a schematic diagram of the axonometric structure of the control spring of the present invention.

[0025] Figure 8 It is a schematic diagram of the cross-sectional structure of the first chip pin of the present invention.

[0026] Fig. 9 It is a schematic diagram of the axonometric structure of the positioning slot of the present invention.

[0027] Reference numerals list 1. Chip frame; 101. Heat dissipation slot; 102. PAD heat dissipation base island; 103. Positioning frame; 104. Chip body; 105. First chip pin; 106. Pin PAD copper sheet; 107. Combination through hole; 108. Guide groove; 109. Second chip pin; 110. First locking slot; 111. Second locking slot; 112. Control spring; 113. Locking block; 114. Control pillar; 115. Guide slide bar; 116. Guide slide plate; 117. Support spring; 118. Positioning slide seat; 119. Reset spring; 120. Chip PAD copper sheet; 121. Positioning slot. DETAILED DESCRIPTION

[0028] Embodiment 1: The present invention provides a power module package with adjustable pins, please refer to Figures 1 to 9 As shown, it includes: a chip frame 1; A positioning frame 103 is welded to the top surface of the chip frame 1; a PAD heat dissipation base island 102 is arranged on the outside of the chip frame 1; a chip body 104 is welded to the outside of the PAD heat dissipation base island 102; the chip body 104 is aligned with the position of the positioning frame 103; a chip PAD copper sheet 120 is welded to the outside of the chip body 104; the chip body 104 is aligned with the position of the positioning frame 103; two pin PAD copper sheets 106 are symmetrically welded to the rear of the chip PAD copper sheet 120; three first chip pins 105 are arranged at equal intervals laterally; two pin PAD copper sheets 106 are respectively welded to the two outer first chip pins 105; a second chip pin 109 is slidably connected to each of the three first chip pins 105; a first locking slot 110 is opened at the rear of each of the three second chip pins 109.

[0029] The bottom surface of the chip frame 1 is provided with multiple heat dissipation grooves 101 ; the multiple heat dissipation grooves 101 are all rectangular groove structures; the multiple heat dissipation grooves 101 are arranged equidistantly in the horizontal direction; and the multiple heat dissipation grooves 101 are formed by stamping.

[0030] Among them, the rear parts of the three first chip pins 105 are slidably connected with a locking block 113; the three locking blocks 113 are respectively inserted into the three first locking slots 110; the top surfaces of the three locking blocks 113 are fixedly connected with a control pillar 114.

[0031] Among them, a group of control springs 112 are fixedly connected to the front of the three second chip pins 109 ; and the ends of the multiple groups of control springs 112 are fixedly connected to the three first chip pins 105 .

[0032] Among them, the outside of the three locking blocks 113 is fixedly connected with a group of guide slides 116; the top surfaces of the three first chip pins 105 are fixedly connected with a group of guide slide rods 115; multiple groups of guide slides 116 are respectively slidably connected to the outside of multiple groups of guide slide rods 115; the bottom surfaces of multiple groups of guide slides 116 are fixedly connected with a group of support springs 117; the ends of the three groups of support springs 117 are respectively fixedly connected to the top surfaces of the three first chip pins 105.

[0033] Among them, a second locking slot 111 is opened in the front of each of the three second chip pins 109; the three second locking slots 111 are aligned with the positions of the three first locking slots 110 respectively; the sizes of the three second locking slots 111 are the same as those of the three first locking slots 110.

[0034] Among them, a positioning slot 121 is provided at the front of each of the three locking blocks 113; a positioning slide 118 is slidably connected to the rear of each of the three first chip pins 105; the three positioning slides 118 are respectively inserted into the three positioning slots 121; a group of return springs 119 are slidably connected to the front of each of the three positioning slides 118; the ends of the three groups of return springs 119 are respectively fixedly connected to the three first chip pins 105.

[0035] The specific usage and function of this embodiment: the heat dissipation area of ​​the power module package is increased by setting the heat dissipation groove 101, and the use of copper material can also be reduced. In the initial state, the second chip pin 109 is accommodated in the first chip pin 105. In the process of installing and using the power module package, the control pillar 114 is pulled to drive the locking block 113 to move. As the locking block 113 moves, it will be separated from the first locking groove 110 by the locking block 113. In the initial state, the control spring 112 is in a compressed state. After the locking block 113 is separated from the first locking groove 110, the control spring 112 loses the compression. At this time, the control spring 112 will rebound under the action of its own elastic potential energy. As the control spring 112 rebounds, the second chip pin 109 will be pushed out of the first chip pin 105. In the process of the movement of the locking block 113, the guide slide 116 will be driven to move along the guide slide bar 115. When the guide slide 116 moves During the process, the support spring 117 will be stretched, and after the second chip pin 109 pops out from the first chip pin 105, the second locking slot 111 will be aligned with the position of the locking block 113, and then the control pillar 114 will be released. At this time, the locking block 113 will rebound under the action of the elastic potential energy of the support spring 117 itself, so that the locking block 113 is inserted into the second locking slot 111, and the popped-out second chip pin 109 is limited and fixed, and the locking block 113 is locked by the positioning slide 118. When pulling the locking block 113, it is necessary to first pull the positioning slide 118 to disengage the positioning slide 118 from the positioning slot 121. At this time, the locking block 113 can be pulled. After the locking block 113 is inserted into the second locking slot 111, the positioning slide 118 is released to reset the positioning slide 118 with the rebound of the reset spring 119, and the positioning slide 118 is reinserted into the positioning slot 121 to lock and fix the locking block 113, thereby ensuring the stability of the second chip pin 109.

[0036] Example 2: Based on Example 1, please refer to Figure 1 and Figure 4As shown, it includes: a combining through hole 107 and a guide groove 108. The outside of the two pin PAD copper sheets 106 and the outside of the chip PAD copper sheet 120 are both provided with a combining through hole 107; the three combining through holes 107 are all circular hole structures; the bottom end surfaces of the two pin PAD copper sheets 106 and the bottom end surface of the chip PAD copper sheet 120 are both provided with a guide groove 108.

[0037] Specific usage and function of this embodiment: In the present invention, the setting of the through hole 107 can better allow the epoxy material to pass through the through hole 107, so that the epoxy material and the copper sheet are completely connected together, which can strengthen the bonding force of the epoxy material and release part of the stress of the copper sheet. The setting of the guide groove 108 can guide the tin water produced by the melting of the solder paste at high temperature, so that excess tin flows out from the through hole 107 and the guide groove 108.

[0038] In this article, there are a few points to note: 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0039] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0040] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A pin-adjustable power module package, comprising: A chip frame (1); a positioning frame (103) is welded to the top surface of the chip frame (1); the chip frame (1) is characterized in that a PAD heat dissipation base island (102) is arranged outside the chip frame (1); a chip body (104) is welded to the outside of the PAD heat dissipation base island (102); the chip body (104) and the positioning frame (103) are aligned in position; a chip PAD copper sheet (120) is welded to the outside of the chip body (104); the chip body (104) and the positioning frame (103) are aligned in position; the chip PA Two pin PAD copper sheets (106) are symmetrically welded to the rear of the D copper sheet (120); three first chip pins (105) are arranged at the rear of the chip frame (1); the three first chip pins (105) are arranged equidistantly in the horizontal direction; the two pin PAD copper sheets (106) are respectively welded to the two outer first chip pins (105); a second chip pin (109) is slidably connected to each of the three first chip pins (105); and a first locking slot (110) is provided at the rear of each of the three second chip pins (109).

2. A power module package with adjustable pins as claimed in claim 1, characterized in that: The bottom end surface of the chip frame (1) is provided with a plurality of heat dissipation grooves (101); the plurality of heat dissipation grooves (101) are all rectangular groove structures; the plurality of heat dissipation grooves (101) are arranged at equal intervals in the horizontal direction; and the plurality of heat dissipation grooves (101) are formed by stamping.

3. A pin-adjustable power module package as claimed in claim 1, characterized in that: The rear parts of the three first chip pins (105) are all slidably connected to a locking block (113); the three locking blocks (113) are respectively inserted into the three first locking slots (110); and the top surfaces of the three locking blocks (113) are all fixedly connected to a control pillar (114).

4. A power module package with adjustable pins as claimed in claim 1, characterized in that: A group of control springs (112) are fixedly connected to the front of each of the three second chip pins (109); and the ends of the multiple groups of control springs (112) are fixedly connected to the inside of the three first chip pins (105), respectively.

5. A pin-adjustable power module package as claimed in claim 3, characterized in that: The outsides of the three locking blocks (113) are fixedly connected to a group of guide slides (116); the top surfaces of the three first chip pins (105) are fixedly connected to a group of guide slide bars (115); the multiple groups of guide slides (116) are respectively slidably connected to the outsides of the multiple groups of guide slide bars (115); the bottom surfaces of the multiple groups of guide slides (116) are fixedly connected to a group of support springs (117); the ends of the three groups of support springs (117) are respectively fixedly connected to the top surfaces of the three first chip pins (105).

6. A pin-adjustable power module package as claimed in claim 1, characterized in that: A second locking slot (111) is provided at the front of each of the three second chip pins (109); the three second locking slots (111) are aligned with the positions of the three first locking slots (110) respectively; and the sizes of the three second locking slots (111) are the same as those of the three first locking slots (110).

7. A pin-adjustable power module package as claimed in claim 3, characterized in that: A positioning slot (121) is provided at the front of each of the three locking blocks (113); a positioning slide (118) is slidably connected to the rear of each of the three first chip pins (105); the three positioning slides (118) are respectively inserted into the three positioning slots (121); a group of return springs (119) are slidably connected to the front of each of the three positioning slides (118); and the ends of the three groups of return springs (119) are respectively fixedly connected to the three first chip pins (105).

8. The pin-adjustable power module package according to claim 1, characterized in that: The exterior of the two pin PAD copper sheets (106) and the exterior of the chip PAD copper sheet (120) are both provided with connecting through holes (107); the three connecting through holes (107) are all circular hole structures; the bottom end surfaces of the two pin PAD copper sheets (106) and the bottom end surface of the chip PAD copper sheet (120) are both provided with flow guide grooves (108).

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