Battery with copper-plated nickel-to-nickel tab and preparation method of battery

Abstract

The invention provides a battery with a nickel-plated copper tab and a preparation method of the battery. The preparation method of the battery with the nickel-plated copper tab comprises the following steps: cleaning a copper base material; electroplating the copper base material to obtain a nickel-plated copper strip with a nickel-plated layer; carrying out ultrasonic welding on the nickel-plated copper strip and the nickel strip to form an overlapped welding area so as to obtain a nickel-to-copper-plated copper tab; heating a thermal plastic sheet and then covering the thermal plastic sheet on the nickel-to-copper-plated tab, so that a resin adhesive layer is formed on the surface of a part of the nickel-to-copper-plated tab; and welding the nickel-plated copper-to-nickel tab with a negative plate, and welding a positive aluminum tab with a positive plate to obtain the battery with the nickel-plated copper-to-nickel tab. The nickel-to-copper-plated tab is small in resistance and good in conductivity, and the resin adhesive layer wraps the part of the nickel-to-copper-plated tab, so that the height difference generated in an overlapped welding area is balanced, the mechanical strength of the nickel-to-copper-plated tab is improved, insulation protection is provided, the oxidation problem caused by uneven distribution of a nickel-plated layer is avoided, and the service life is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the technical field of lithium batteries, and in particular to a battery with a copper-nickel-plated-to-nickel tab and a preparation method thereof. Background Art

[0002] In the structure of lithium batteries, the tab is an important component that connects the electrode material inside the battery cell with the external circuit. For the negative electrode, the tab is not only responsible for conducting current, but also undertakes the key task of converting chemical energy into electrical energy and outputting it. Therefore, the design and material selection of the negative electrode tab directly affect the overall performance, safety and service life of the battery. At present, the negative electrode tabs of lithium batteries on the market mainly use nickel or copper-plated nickel as the base material, and are fixed to the electrode sheet by ultrasonic welding, laser welding or mechanical crimping.

[0003] Although these two metals have good conductivity, as the energy density and power requirements of batteries increase, traditional tab design faces challenges: on the one hand, when large current passes through, local high temperatures are easily generated at the tabs, especially near the welding points. If the heat is not dissipated in time, the excessive temperature will not only damage the tabs themselves, but may also cause safety hazards such as internal short circuits in the battery; on the other hand, since the battery undergoes repeated charge and discharge cycles during use, the tabs and their connections may be subject to periodic mechanical stress. In the long run, the tabs may suffer from fatigue fractures, leading to battery failure. Therefore, the development of new negative tabs with excellent heat resistance, bending resistance and corrosion resistance has become an urgent need for the development of the industry.

[0004] To solve the above problems of the negative electrode tabs, the current solutions include: changing the shape of the tabs, increasing the heat dissipation path or introducing flexible connectors. These solutions can effectively reduce heat accumulation to a certain extent and enhance the mechanical strength and fatigue resistance of the tabs, but they often require complex shape processing. This not only increases the manufacturing cost, but also increases the scrap rate in the production process. The use of copper-plated nickel as a substrate combines the advantages of copper and nickel, with good conductivity and certain corrosion resistance, but in the manufacturing process, it is difficult to ensure that the nickel coating is completely evenly distributed on the entire copper substrate. When the nickel coating is unevenly distributed on the copper substrate, local uneven thickness may occur. When the coating is damaged or the thickness is insufficient, the underlying copper will oxidize rapidly, especially in corrosive environments such as high humidity and salt spray, which will significantly shorten the service life of the tabs.

[0005] For example, the comparative document CN201710143817.8 discloses a method for electrolytic copper foil with nickel plating on four sides and a pole ear produced by the method. A special top anode plate is used to electroplate both sides of the electrolytic copper foil. Titanium-coated iridium is used as the electrolytic anode plate and the top anode plate. The electrolyte is made of analytically pure nickel sulfate and analytically pure boric acid. The crystal structure of the nickel plating layer on all four sides of this scheme is tight and uniform, and the distribution is neat. The pole ear surface has excellent weldability, high temperature resistance, and excellent corrosion resistance. However, during the manufacturing process, the nickel plating layer is unevenly thick on the copper substrate. When the nickel plating layer is damaged or the thickness is insufficient, the underlying copper is easily oxidized, thereby shortening the service life of the pole ear. Summary of the invention

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a battery having a copper-plated nickel-to-nickel tab with good conductivity, corrosion resistance and high mechanical strength and a preparation method thereof.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A method for preparing a battery with a copper-nickel-plated nickel-converted tab, comprising the following steps:

[0009] Cleaning the copper substrate;

[0010] Electroplating the copper substrate to obtain a copper nickel-plated strip with a nickel-plated layer;

[0011] Ultrasonic welding the copper-nickel-plated strip and the nickel strip to obtain a copper-nickel-plated-to-nickel electrode tab, wherein an overlapping welding area is formed at the welding point between the copper-nickel-plated strip and the nickel strip;

[0012] The thermoplastic sheet is heated and covered on the copper-nickel-plated-to-nickel tab, so that a resin adhesive layer is formed on the surface of the overlapping welding area and the copper-nickel-plated-to-nickel tab;

[0013] The copper-nickel-plated-to-nickel tab is welded to the negative electrode sheet, and the positive electrode aluminum tab is welded to the positive electrode sheet to obtain the copper-nickel-plated-to-nickel tab battery.

[0014] In one embodiment, cleaning the copper substrate comprises the following steps:

[0015] Removing dirt from the surface of the copper substrate by using an organic solvent or an alkaline degreasing agent;

[0016] Pickling the copper substrate with an acid solution;

[0017] The copper substrate is rinsed.

[0018] In one embodiment, electroplating the copper substrate comprises the following steps:

[0019] placing a pure nickel plate and the copper substrate into an electroplating solution;

[0020] Passing current to electroplate the copper substrate to obtain the copper nickel-plated strip with a nickel-plated layer;

[0021] The copper-nickel-plated strip with the nickel-plated layer is cleaned.

[0022] In one embodiment, the thickness of the nickel-plated layer of the copper-nickel-plated strip is 5 μm-20 μm.

[0023] In one embodiment, after the copper-nickel plated strip is cleaned, the following steps are further included:

[0024] Chromate or trivalent chromium passivating agent is added to passivate the surface of the copper-nickel-plated strip.

[0025] In one embodiment, heating the thermoplastic sheet and covering it on the copper-nickel-plated-to-nickel tab so that a resin adhesive layer is formed on the surface of the overlapping welding area and the copper-nickel-plated-to-nickel tab comprises the following steps:

[0026] Fixing and leveling the copper-nickel-plated-to-nickel electrode tab, and then moving the leveled copper-nickel-plated-to-nickel electrode tab to a heating area;

[0027] Heating and softening the thermoplastic sheet for the first time, and pasting the softened thermoplastic sheet on the surfaces of both sides of the overlapping welding area;

[0028] The pasted thermoplastic sheets are heated for a second time to be melted into glue liquid, so that the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer.

[0029] In one embodiment, the thermoplastic sheet includes at least one of CPP, PP, EVA and PE.

[0030] In one embodiment, before welding the positive electrode aluminum tab to the positive electrode sheet, the following steps are also included:

[0031] Coat UV glue on the surface of the positive aluminum tab;

[0032] The UV glue is irradiated by a UV lamp to obtain a positive aluminum electrode tab with a UV glue layer.

[0033] In one embodiment, the UV light irradiation time is 30s-60s.

[0034] A copper-nickel-plated-to-nickel-tab battery, wherein the copper-nickel-plated-to-nickel-tab battery is obtained by the copper-nickel-plated-to-nickel-tab battery preparation method described in any of the above embodiments, comprising a battery cell, a positive aluminum tab and a negative tab, wherein the battery cell is formed by winding or stacking a positive electrode sheet, a separator and a negative electrode sheet;

[0035] The negative electrode tab includes a copper-nickel-plated strip, a nickel strip and a resin glue layer, the copper-nickel-plated strip is welded to the negative electrode sheet, and the resin glue layer is coated on the overlapping welding area of ​​the nickel-plated layer and the nickel strip; the positive electrode aluminum tab includes a positive electrode aluminum tab and a UV glue layer, the positive electrode aluminum tab is welded to the positive electrode sheet, and the UV glue layer is coated on the positive electrode aluminum tab.

[0036] Compared with the prior art, the present invention has at least the following advantages:

[0037] The above-mentioned method for preparing a battery with copper-nickel-plated to nickel tabs, the copper-nickel-plated to nickel tabs are formed by welding a copper-nickel-plated strip and a nickel strip, the copper-nickel-plated strip makes the copper-nickel-plated to nickel tabs have a smaller resistance and better conductivity, and the nickel connecting end of the copper-nickel-plated to nickel tabs is convenient for welding with a discharge source or a power supply source; the overlapping welding area and the copper-nickel-plated to nickel tabs are coated with a resin adhesive layer, so that the height difference generated by the overlapping welding area is balanced, and the connection strength between the copper-nickel-plated strip and the nickel strip in the overlapping welding area is improved, thereby increasing the connection strength of the copper-nickel-plated to nickel tabs, and the resin adhesive layer provides insulation protection for the portion coating the overlapping welding area and the copper-nickel-plated to nickel tabs, preventing the occurrence of short circuits and avoiding the problem of easy oxidation when the nickel plating layer is unevenly distributed, thereby extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 The present invention is a flow chart of the steps of a method for preparing a battery having a copper-nickel-plated-to-nickel tab according to an embodiment. DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0041] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0043] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0044] See also Figure 1 , which is a method for preparing a battery with a copper-nickel-plated nickel-converted tab according to an embodiment of the present invention, comprising the following steps: cleaning a copper substrate with copper; electroplating the copper substrate to obtain a copper-nickel-plated strip; ultrasonically welding the copper-nickel-plated strip and the nickel strip to obtain a copper-nickel-plated nickel-converted tab, wherein an overlapping welding area is formed at the welding point between the copper-nickel-plated strip and the nickel strip; heating a thermoplastic sheet and covering the mineral in the overlapping welding area to form a resin glue layer on the copper-nickel-plated nickel-converted tab; welding the copper-nickel-plated nickel-converted tab to the negative electrode sheet, and welding the positive aluminum tab to the positive electrode sheet to obtain a battery cell with a copper-nickel-plated nickel-converted tab.

[0045] In one embodiment, a method for preparing a battery with a copper-nickel-plated nickel-converted tab comprises the following steps:

[0046] S101: Cleaning the copper substrate. In this embodiment, when there are residues attached to the surface of the copper substrate, the bonding strength of the nickel plating layer on the surface of the copper substrate will be affected, and the residues will become inclusions in the plating layer, causing defects such as cracks and peeling of the nickel plating layer. By cleaning the copper substrate, the surface of the copper substrate is made cleaner and tidier, so that a dense nickel plating layer is formed after the adsorption and deposition of nickel ions.

[0047] S103 electroplates the copper substrate to obtain a copper-nickel-plated strip with a nickel-plated layer. In this embodiment, the nickel ions are reduced to metallic nickel after obtaining electrons on the cathode through electroplating, and are deposited on the surface of the copper substrate to form a nickel-plated layer. The copper substrate makes the copper-nickel-plated strip have a small resistance and good conductivity; the nickel-plated layer has extremely strong chemical stability, and the nickel-plated layer protects the copper substrate, preventing corrosion and oxidation of the copper substrate. The nickel-plated layer is also convenient for welding with the nickel strip.

[0048] S105 ultrasonically welds the copper-nickel-plated strip and the nickel strip to obtain a copper-nickel-plated-to-nickel pole ear, wherein an overlapping welding area is formed at the welding point between the copper-nickel-plated strip and the nickel strip. In this embodiment, the copper-nickel-plated strip and the nickel strip are ultrasonically welded to obtain one end of the copper-nickel-plated-to-nickel pole ear as a nickel strip connection end, so that the nickel strip connection end of the copper-nickel-plated-to-nickel pole ear is convenient for welding with a discharge source or a power source made of other metal materials.

[0049] S107: Heat the thermoplastic sheet and cover it on the copper-nickel-plated nickel-converted tab, so that a resin adhesive layer is formed on the surface of the overlapping welding area and the copper-nickel-plated nickel-converted tab. In this embodiment, the overlapping welding area formed by the welding of the copper-nickel-plated strip and the nickel strip is uneven, the nickel plating layer is unevenly distributed after welding, and there are differences in thermal conductivity and stress between the copper-nickel-plated strip and the nickel strip, which makes the overlapping welding area prone to fatigue fracture. The resin adhesive layer helps to balance the height difference of the overlapping welding area and enhance the connection strength between the copper-nickel-plated strip and the nickel strip. The resin adhesive layer insulates and protects the overlapping welding area and the copper-nickel-plated nickel-converted tab to prevent oxidation of the copper-nickel-plated nickel-converted tab.

[0050] S109: welding the copper-plated nickel-converted nickel tab to the negative electrode sheet, and welding the positive aluminum tab to the positive electrode sheet, to obtain a battery with a copper-plated nickel-converted nickel tab. In this embodiment, the resistance between the copper-plated nickel-converted nickel tab and the negative electrode sheet is small, and the copper-plated nickel-converted nickel tab has high corrosion resistance and mechanical strength, and the nickel strip connection end of the copper-plated nickel-converted nickel tab is convenient for welding with other discharge sources or power sources.

[0051] The above-mentioned method for preparing a battery with copper-nickel-plated to nickel tabs, the copper-nickel-plated to nickel tabs are formed by welding a copper-nickel-plated strip and a nickel strip, the copper-nickel-plated strip makes the copper-nickel-plated to nickel tabs have a smaller resistance and better conductivity, and the nickel connecting end of the copper-nickel-plated to nickel tabs is convenient for welding with a discharge source or a power supply source; the overlapping welding area and the copper-nickel-plated to nickel tabs are coated with a resin adhesive layer, so that the height difference generated by the overlapping welding area is balanced, and the connection strength between the copper-nickel-plated strip and the nickel strip in the overlapping welding area is improved, thereby increasing the connection strength of the copper-nickel-plated to nickel tabs, and the resin adhesive layer provides insulation protection for the portion coating the overlapping welding area and the copper-nickel-plated to nickel tabs, preventing the occurrence of short circuits and avoiding the problem of easy oxidation when the nickel plating layer is unevenly distributed, thereby extending the service life.

[0052] In one embodiment, cleaning the copper substrate comprises the following steps:

[0053] Remove dirt from the surface of the copper substrate by using an organic solvent cleaner or an alkaline degreasing agent;

[0054] Pickling the copper substrate with an acid solution;

[0055] The copper substrate is rinsed. In this embodiment, the organic solvent includes acetone or alcohol, which has good solubility for dirt on the surface of the copper substrate. The alkaline degreasing agent is generally composed of an alkali, a chelating agent and a surfactant. The alkaline degreasing agent removes oil stains by saponifying and emulsifying the dirt on the surface of the copper substrate; the acid solution includes one of dilute sulfuric acid, hydrochloric acid or nitric acid, and the pickling time is 1min-3min. When the copper substrate is pickled, the acid solution removes the oxide layer on the surface of the copper substrate and activates the metal surface of the copper substrate, thereby improving the adhesion of the nickel plating layer; the surface of the copper substrate is rinsed with deionized water, so that the surface of the copper substrate is clean and free of residue.

[0056] In one embodiment, electroplating the copper substrate comprises the following steps:

[0057] Place the pure nickel plate and copper substrate into the electroplating solution;

[0058] Passing electric current to electroplate the copper substrate to obtain a copper-nickel-plated strip with a nickel-plated layer;

[0059] The copper nickel-plated strip with the nickel-plated layer is cleaned. In this embodiment, the electroplating solution uses an electroplating solution containing nickel ions, such as nickel sulfate, nickel chloride and the like. During the electroplating process, the pure nickel plate is used as the anode and the copper substrate is used as the cathode. A stable current is applied between the anode and the cathode through an external power supply, so that the nickel ions are reduced to metallic nickel after obtaining electrons at the cathode and are deposited on the surface of the copper substrate to form a nickel-plated layer. By controlling the electroplating time and current density, a nickel-plated layer of uniform thickness is obtained.

[0060] Furthermore, in one of the embodiments, the pH of the electroplating solution is between 4.5 and 5.5. In this embodiment, when the pH is greater than 5.5, the deposition efficiency of nickel ions is slow, and when the pH is less than 4.5, the copper substrate is easily corroded and dissolved during the electroplating process; when the pH of the electroplating solution is in the pH range of 4.5-5.5, the deposition efficiency of nickel ions is high, reducing the corrosion of the copper substrate by the electroplating solution, so that the surface of the copper substrate is covered with a uniform and dense nickel plating layer, thereby reducing the occurrence of local uneven nickel plating.

[0061] Furthermore, in one of the embodiments, the temperature of the electroplating solution is 50°C-60°C. In this embodiment, when the temperature of the electroplating solution is lower than 50°C, the electroplating speed of nickel ions in the electrolyte on the surface of the copper substrate is slow and the porosity is large, and when the temperature is higher than 60°C, the electroplating solution is easy to volatilize and corrode the copper substrate; by controlling the temperature of the electroplating solution at 50°C-60°C, a uniform and dense nickel plating layer is deposited on the surface of the copper substrate.

[0062] In one embodiment, the thickness of the nickel-plated layer of the copper-nickel-plated strip is 5 μm-20 μm. In this embodiment, the thickness of the nickel-plated layer is 5 μm-20 μm, which can maintain good uniformity and adhesion. The nickel-plated layer of sufficient thickness provides sufficient corrosion resistance, thereby protecting the copper substrate from environmental corrosion. When the nickel-plated layer is kept at a thickness of 5 μm-20 μm, the nickel-plated layer has little effect on the electrical conductivity of the copper substrate. The nickel-plated layer can increase the hardness and wear resistance of the plating layer, thereby increasing the service life of the plating layer.

[0063] In one embodiment, after cleaning the copper-nickel plated strip, the following steps are also included:

[0064] Chromate or trivalent chromium passivation agent is added to passivate the surface of the copper-nickel-plated strip. In this embodiment, chromate reacts chemically with nickel metal ions on the surface of the copper-nickel-plated strip to form a dense oxide film. The chromate passivation film has excellent corrosion resistance and hardness, and can well protect the copper-nickel-plated strip from environmental corrosion; the trivalent chromium passivation agent can also form a dense oxide film on the surface of the copper-nickel-plated strip, but its toxicity is low and it is environmentally friendly; by forming a dense oxide film, the copper-nickel-plated strip can be isolated from direct contact with the external environment, thereby improving the corrosion resistance, hardness and wear resistance of the copper-nickel-plated strip.

[0065] In one embodiment, heating the thermoplastic sheet and covering the overlapped welding area comprises the following steps:

[0066] Fixing and leveling the copper-nickel-plated-to-nickel electrode tab, and then moving the leveled copper-nickel-plated-to-nickel electrode tab to a heating area;

[0067] Heating the thermoplastic sheet for the first time, and pasting the heated thermoplastic sheet on the surfaces of both sides of the overlapping welding area;

[0068] The thermoplastic sheet is heated and melted into a glue liquid for a second time, so that the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer. In this embodiment, the copper-nickel-plated-to-nickel tab can be fixed on a fixed plane, and the copper-nickel-plated-to-nickel tab is leveled by a metal wheel to eliminate the ripples, wrinkles or unevenness of the copper-nickel-plated-to-nickel tab; when the thermoplastic sheet is heated for the first time, as the temperature rises, the thermoplastic sheet softens first, and the heated thermoplastic sheet is pasted on both sides of the overlapping welding area, so that the thermoplastic sheet covers the overlapping welding area; the thermoplastic sheet is melted into a glue liquid by the second heating, and the molten glue liquid can infiltrate and cover the copper-nickel-plated-to-nickel tab, and discharge the bubbles between the glue liquid and the copper-nickel-plated-to-nickel tab.

[0069] Furthermore, the temperature of the first heating is 80°C-165°C, the time of the first heating is 10s-15s, the temperature of the second heating is 150°C-175°C, and the time of the second heating is 4s-6s. In this embodiment, when the resin adhesive layer is heated at 80°C-165°C, the thermoplastic sheet begins to soften first, and as the temperature increases, the thermoplastic sheet melts and becomes sticky; when the thermoplastic sheet is heated to 150°C-175°C, the thermoplastic sheet remains in a molten state, and the molten adhesive liquid is formed to form a resin adhesive layer. The resin adhesive layer on the copper-plated nickel-to-nickel tab is relatively thin, and the heating time of 4s-6s ensures that the thermoplastic sheet can melt quickly, thereby improving production efficiency. The shorter heating time helps to reduce energy consumption and production costs.

[0070] Furthermore, the resin adhesive layer will shrink after cooling, and the uneven shrinkage may easily lead to an uneven surface. In the edge chamfered area, due to the limited fluidity of the resin adhesive, it is easy to form a cavity or depression during shrinkage. Therefore, after the thermoplastic sheet is heated for the second time to melt the thermoplastic sheet into adhesive liquid, so that the molten adhesive liquid covers the surfaces on both sides of the overlapping welding area to form a resin adhesive layer, the following steps are also included:

[0071] The resin adhesive layer is heated for a third time, the temperature of the third heating is 190° C.-220° C., and the time of the third heating is 4s-6s;

[0072] The resin adhesive layer is physically pressed, and then cooled and formed.

[0073] In this embodiment, the resin glue layer on the copper-nickel-plated nickel-to-nickel tab is heated for the third time so that the resin glue layer is melted again, and the shrunk space is filled by pressing. The molten glue after pressing also seals the voids and depressions produced at the chamfered parts, thereby making the resin glue layer smoother after cooling and molding.

[0074] In one embodiment, the thermoplastic film includes at least one of CPP film, PP film, EVA film and PE film. In this embodiment, CPP film is cast polypropylene film, PP is thermoplastic polypropylene film, EVA film is ethylene-vinyl acetate copolymer film, and PE is thermoplastic polyethylene film; CPP film, PP film, EVA film and PE film can form a resin adhesive layer on the surface of the copper-plated nickel-converted tab after being heated and melted, so that the resin adhesive layer has good insulation performance and improves the mechanical strength of the copper-plated inner nickel-converted tab.

[0075] In one embodiment, before welding the positive electrode aluminum tab to the positive electrode sheet, the following steps are also included:

[0076] Coat UV glue on the surface of the positive aluminum tab;

[0077] The coated UV glue is irradiated with UV light to obtain a positive aluminum pole ear with a UV glue layer. In this embodiment, the positive aluminum pole ear is usually made of aluminum metal, which is easy to oxidize. The surface energy of aluminum oxide is low, so that aluminum oxide is not easily infiltrated by the glue of the thermoplastic sheet, and the resin glue layer formed by the glue of the thermoplastic sheet has a relatively poor coating effect on the positive aluminum pole ear; since heating is not required during the UV glue coating process, the oxidation of the surface of the positive aluminum pole ear is reduced, and at the same time, a UV glue with low viscosity and small surface tension is selected, so that the UV glue is easier to spread on the aluminum surface, so that the effect of curing the UV glue layer to coat the positive aluminum pole ear is better, and the aluminum metal of the positive aluminum pole ear is isolated by the UV glue layer to prevent the oxidation of the aluminum metal of the positive aluminum pole ear, improve the insulation performance of the positive aluminum pole ear, and at the same time, the UV glue layer increases the strength of the positive aluminum pole ear.

[0078] In one embodiment, the illumination time of the UV irradiation is 30s-60s. In this embodiment, the illumination time of the UV lamp will affect the curing degree of the curing adhesive. When the illumination time is less than 30s, incomplete curing may occur. When the curing time is greater than 60s, too long an illumination time will waste energy and time. The illumination time of the UV irradiation is 30s-60s, so that the illumination time is kept within a reasonable range, thereby improving production efficiency.

[0079] Furthermore, the positive electrode ear glue is used to encapsulate the battery packaging shell and the positive aluminum ear to prevent the positive aluminum ear from contacting the packaging shell, and the negative electrode ear glue is used to encapsulate the battery packaging shell and the copper-plated nickel-converted nickel ear to prevent the positive aluminum ear from contacting the packaging shell. After the coated UV glue is subjected to UV irradiation by a UV lamp to obtain the positive aluminum ear with a UV glue layer, the following steps are also included:

[0080] The negative electrode ear glue is coated on a portion of the resin glue layer of the copper-nickel-plated nickel-converted ear.

[0081] The positive electrode ear glue is coated on a part of the UV glue layer of the positive electrode aluminum ear;

[0082] In this embodiment, the resin glue layer and the negative ear glue provide double-layer insulation and protection, further avoiding the contact between the positive aluminum ear and the packaging shell. At the same time, the resin glue layer and the negative ear glue have a high bonding strength, which improves the connection strength between the copper-nickel-plated nickel ear and the packaging shell. Similarly, the UV glue layer and the negative ear glue provide double-layer insulation and protection, further avoiding the contact between the positive aluminum ear and the packaging shell, which improves the connection strength between the positive aluminum ear and the packaging shell.

[0083] The present application also provides a battery with copper-plated nickel-to-nickel tabs, which is obtained by the method for preparing a battery with copper-plated nickel-to-nickel tabs described in any of the above embodiments, and comprises a battery cell, a positive aluminum tab and a negative tab, wherein the battery cell is formed by winding or stacking a positive electrode sheet, a diaphragm and a negative electrode sheet; the negative tab comprises a copper-plated nickel strip, a nickel strip and a resin adhesive layer, the copper-plated nickel strip is welded to the negative electrode sheet, and the resin adhesive layer is coated on the nickel-plated layer and the nickel strip; the positive aluminum tab comprises a positive aluminum tab, a UV adhesive layer and the positive electrode sheet, the positive aluminum tab is welded to the positive electrode sheet, and the UV adhesive layer is coated on the positive aluminum tab. In this embodiment, the copper-nickel-plated-to-nickel tab has a small resistance and good conductivity. The nickel-plated layer and the nickel strip are coated with a resin adhesive layer, which reduces the oxidation of the copper-nickel-plated-to-nickel tab and improves the corrosion resistance and mechanical properties of the copper-nickel-plated-to-nickel tab. The UV adhesive layer is coated on the positive aluminum tab, which improves the corrosion resistance and mechanical properties of the positive aluminum tab.

[0084] Compared with the prior art, the present invention has at least the following advantages:

[0085] The above-mentioned method for preparing a battery with copper-nickel-plated to nickel tabs, the copper-nickel-plated to nickel tabs are formed by welding a copper-nickel-plated strip and a nickel strip, the copper-nickel-plated strip makes the copper-nickel-plated to nickel tabs have a smaller resistance and better conductivity, and the nickel connecting end of the copper-nickel-plated to nickel tabs is convenient for welding with a discharge source or a power supply source; the overlapping welding area and the copper-nickel-plated to nickel tabs are coated with a resin adhesive layer, so that the height difference generated by the overlapping welding area is balanced, and the connection strength between the copper-nickel-plated strip and the nickel strip in the overlapping welding area is improved, thereby increasing the connection strength of the copper-nickel-plated to nickel tabs, and the resin adhesive layer provides insulation protection for the portion coating the overlapping welding area and the copper-nickel-plated to nickel tabs, preventing the occurrence of short circuits and avoiding the problem of easy oxidation when the nickel plating layer is unevenly distributed, thereby extending the service life.

[0086] Some specific examples are listed below, and if % is mentioned, it means percentage by weight. It should be noted that the following examples do not exhaust all possible situations, and the materials used in the following examples can be obtained from commercial sources unless otherwise specified.

[0087] Example 1

[0088] Select a high-purity copper substrate suitable for electroplating, use an organic solvent (such as acetone, alcohol) or an alkaline degreaser to clean the copper substrate to remove grease and dirt on the surface; pickle the copper substrate with dilute sulfuric acid, hydrochloric acid or nitric acid for 2 minutes to remove the surface oxide layer, activate the metal surface and improve the adhesion of the coating; rinse the copper substrate with deionized water to ensure that the surface is clean and free of residue.

[0089] Place the pure nickel plate and copper substrate into the electroplating tank, then add the electroplating solution into the tank; control the pH value between 4.0-5.5, maintain the temperature at 50℃-60℃, and control the current density at 1A / dm 2 -3A / dm 2 The electroplating time is ten minutes; the electrolytic cell is mechanically stirred during electroplating, and after the electroplating is completed, it is washed with water, and then a trivalent chromium passivator is used to form a protective film on the surface of the nickel plating layer, and finally dried to obtain a copper-nickel-plated strip.

[0090] The prepared copper-nickel-plated strip is welded to the nickel strip by ultrasonic welding, wherein an overlapping welding area is formed at the connection between the nickel strip and the copper-nickel-plated strip to obtain a copper-nickel-plated to nickel pole ear, the copper-nickel-plated to nickel pole ear is 3 mm wide, 0.1 mm thick and 40 mm long, wherein the copper-nickel-plated part of the copper-nickel-plated to nickel pole ear is 27 mm long.

[0091] The prepared copper-plated nickel-to-nickel tab is mounted on a fixture, the copper-plated nickel-to-nickel tab is leveled by a rotating wheel, and enters a heating area, and the CPP film is heated for the first time at a heating temperature of 160°C-165°C, and is heated until the CPP film softens and becomes sticky, and the softened CPP film is pasted to the upper and lower sides of the overlapping welding area of ​​the copper-plated nickel-to-nickel tab; the pasted CPP film is heated for a second time to be melted into a glue liquid, and the heating temperature is between 165°C and 175°C, and the heating time is 4-6 seconds, so that the bubbles between the copper-plated nickel-to-nickel tab and the film are discharged, and the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer; the resin glue layer is heated for a third time, and the heating temperature is 190°C-220°C, and the heating time is 4-6 seconds, and the resin glue layer is physically pressed, and after pressing, the temperature is lowered and formed, so that the film on the metal surface and the edge chamfered part melts and shrinks to form a heating line, and the hollow area of ​​the chamfered part is sealed.

[0092] Apply a layer of UV glue on the surface of the positive aluminum ear glue, and irradiate it with a UV lamp with a wavelength of 365nm for 1 minute until the UV glue is completely cured. Cut off the excess film to make the positive aluminum ear 3mm wide, 0.1mm thick and 40mm long.

[0093] The positive aluminum tab is ultrasonically welded to the positive electrode sheet, and the copper-plated nickel tab is ultrasonically welded to the negative electrode sheet to form a battery cell.

[0094] Example 2

[0095] Select a high-purity copper substrate suitable for electroplating, use an organic solvent (such as acetone, alcohol) or an alkaline degreaser to clean the copper substrate to remove grease and dirt on the surface; pickle the copper substrate with dilute sulfuric acid, hydrochloric acid or nitric acid for 2 minutes to remove the surface oxide layer, activate the metal surface and improve the adhesion of the coating; rinse the copper substrate with deionized water to ensure that the surface is clean and free of residue.

[0096] Place the pure nickel plate and copper substrate into the electroplating tank, then add the electroplating solution into the tank; control the pH value between 4.0-5.5, maintain the temperature at 50℃-60℃, and control the current density at 1A / dm 2 -3A / dm 2 The electroplating time is ten minutes; the electrolytic cell is mechanically stirred during electroplating, and after the electroplating is completed, it is washed with water, and then a trivalent chromium passivator is used to form a protective film on the surface of the nickel plating layer, and finally dried to obtain a copper-nickel-plated strip.

[0097] The prepared copper-nickel-plated strip is welded to the nickel strip by ultrasonic welding, wherein an overlapping welding area is formed at the connection between the nickel strip and the copper-nickel-plated strip to obtain a copper-nickel-plated to nickel pole ear, the copper-nickel-plated to nickel pole ear is 3 mm wide, 0.1 mm thick and 40 mm long, wherein the copper-nickel-plated part of the copper-nickel-plated to nickel pole ear is 27 mm long.

[0098] The prepared copper-plated nickel-to-nickel tab is mounted on a fixture, the copper-plated nickel-to-nickel tab is leveled by a rotating wheel, and enters a heating area, and the PP film is heated for the first time at a heating temperature of 155°C-160°C, and the PP film is heated until it softens and becomes sticky, and the softened PP film is pasted to the upper and lower sides of the overlapping welding area of ​​the copper-plated nickel-to-nickel tab; the pasted PP film is heated for a second time to melt into a glue liquid, and the heating temperature is between 160°C and 170°C, and the heating time is 4-6 seconds, so that the bubbles between the copper-plated nickel-to-nickel tab and the film are discharged, and the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer; the resin glue layer is heated for a third time, and the heating temperature is 190°C-220°C, and the heating time is 4-6 seconds, and the resin glue layer is physically pressed, and after pressing, the temperature is lowered and formed, so that the film on the metal surface and the edge chamfered part melts and shrinks to form a heating line, and the hollow area of ​​the chamfered part is sealed.

[0099] Apply a layer of UV glue on the surface of the positive aluminum ear glue, and irradiate it with a UV lamp with a wavelength of 365nm for 1 minute until the UV glue is completely cured. Cut off the excess film to make the positive aluminum ear 3mm wide, 0.1mm thick and 40mm long.

[0100] The positive aluminum tab is ultrasonically welded to the positive electrode sheet, and the copper-plated nickel tab is ultrasonically welded to the negative electrode sheet to form a battery cell.

[0101] Example 3

[0102] Select a high-purity copper substrate suitable for electroplating, use an organic solvent (such as acetone, alcohol) or an alkaline degreaser to clean the copper substrate to remove grease and dirt on the surface; pickle the copper substrate with dilute sulfuric acid, hydrochloric acid or nitric acid for 2 minutes to remove the surface oxide layer, activate the metal surface and improve the adhesion of the coating; rinse the copper substrate with deionized water to ensure that the surface is clean and free of residue.

[0103] Place the pure nickel plate and copper substrate into the electroplating tank, then add the electroplating solution into the tank; control the pH value between 4.0-5.5, maintain the temperature at 50℃-60℃, and control the current density at 1A / dm 2 -3A / dm 2 The electroplating time is ten minutes; the electrolytic cell is mechanically stirred during electroplating, and after the electroplating is completed, it is washed with water, and then a trivalent chromium passivator is used to form a protective film on the surface of the nickel plating layer, and finally dried to obtain a copper-nickel-plated strip.

[0104] The prepared copper-nickel-plated strip is welded to the nickel strip by ultrasonic welding, wherein an overlapping welding area is formed at the connection between the nickel strip and the copper-nickel-plated strip to obtain a copper-nickel-plated to nickel pole ear, the copper-nickel-plated to nickel pole ear is 3 mm wide, 0.1 mm thick and 40 mm long, wherein the copper-nickel-plated part of the copper-nickel-plated to nickel pole ear is 27 mm long.

[0105] The prepared copper-plated nickel-to-nickel tab is mounted on a fixture, the copper-plated nickel-to-nickel tab is leveled by a rotating wheel, and enters a heating area, and the EVA film is heated for the first time at a heating temperature of 145°C-150°C, and is heated until the EVA film softens and becomes sticky, and the softened EVA film is pasted to the upper and lower sides of the overlapping welding area of ​​the copper-plated nickel-to-nickel tab; the pasted EVA film is heated for a second time to be melted into a glue liquid, and the heating temperature is between 150°C and 160°C, and the heating time is 4-6 seconds, so that the bubbles between the copper-plated nickel-to-nickel tab and the film are discharged, and the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer; the resin glue layer is heated for a third time, and the heating temperature is 190°C-220°C, and the heating time is 4-6 seconds, and the resin glue layer is physically pressed, and then cooled and formed after pressing, so that the film on the metal surface and the edge chamfered part melts and shrinks to form a heating line, and the hollow area of ​​the chamfered part is sealed.

[0106] Apply a layer of UV glue on the surface of the positive aluminum ear glue, and irradiate it with a UV lamp with a wavelength of 365nm for 1 minute until the UV glue is completely cured. Cut off the excess film to make the positive aluminum ear 3mm wide, 0.1mm thick and 40mm long.

[0107] The positive aluminum tab is ultrasonically welded to the positive electrode sheet, and the copper-plated nickel tab is ultrasonically welded to the negative electrode sheet to form a battery cell.

[0108] Example 4

[0109] Select a high-purity copper substrate suitable for electroplating, use an organic solvent (such as acetone, alcohol) or an alkaline degreaser to clean the copper substrate to remove grease and dirt on the surface; pickle the copper substrate with dilute sulfuric acid, hydrochloric acid or nitric acid for 2 minutes to remove the surface oxide layer, activate the metal surface and improve the adhesion of the coating; rinse the copper substrate with deionized water to ensure that the surface is clean and free of residue.

[0110] Place the pure nickel plate and copper substrate into the electroplating tank, then add the electroplating solution into the tank; control the pH value between 4.0-5.5, maintain the temperature at 50℃-60℃, and control the current density at 1A / dm 2 -3A / dm 2 The electroplating time is ten minutes; the electrolytic cell is mechanically stirred during electroplating, and after the electroplating is completed, it is washed with water, and then a trivalent chromium passivator is used to form a protective film on the surface of the nickel plating layer, and finally dried to obtain a copper-nickel-plated strip.

[0111] The prepared copper-nickel-plated strip is welded to the nickel strip by ultrasonic welding, wherein an overlapping welding area is formed at the connection between the nickel strip and the copper-nickel-plated strip to obtain a copper-nickel-plated to nickel pole ear, the copper-nickel-plated to nickel pole ear is 3 mm wide, 0.1 mm thick and 40 mm long, wherein the copper-nickel-plated part of the copper-nickel-plated to nickel pole ear is 27 mm long.

[0112] The prepared copper-plated nickel-to-nickel tab is mounted on a fixture, the copper-plated nickel-to-nickel tab is leveled by a rotating wheel, and enters a heating area, and the PE film is heated for the first time at a heating temperature of 160°C-165°C, and the PE film is heated until it softens and becomes sticky, and the softened PE film is pasted to the upper and lower sides of the overlapping welding area of ​​the copper-plated nickel-to-nickel tab; the pasted PE film is heated for a second time to melt into a glue liquid, and the heating temperature is between 165°C and 175°C, and the heating time is 4-6 seconds, so that the bubbles between the copper-plated nickel-to-nickel tab and the film are discharged, and the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer; the resin glue layer is heated for a third time, and the heating temperature is 190°C-220°C, and the heating time is 4-6 seconds, and the resin glue layer is physically pressed, and then cooled and formed after pressing, so that the film on the metal surface and the edge chamfered part melts and shrinks to form a heating line, and the hollow area of ​​the chamfered part is sealed.

[0113] Apply a layer of UV glue on the surface of the positive aluminum ear glue, and irradiate it with a UV lamp with a wavelength of 365nm for 1 minute until the UV glue is completely cured. Cut off the excess film to make the positive aluminum ear 3mm wide, 0.1mm thick and 40mm long.

[0114] The positive aluminum tab is ultrasonically welded to the positive electrode sheet, and the copper-plated nickel tab is ultrasonically welded to the negative electrode sheet to form a battery cell.

[0115] Comparative Example 1

[0116] Select a high-purity copper substrate suitable for electroplating, use an organic solvent (such as acetone, alcohol) or an alkaline degreaser to clean the copper substrate to remove grease and dirt on the surface; pickle the copper substrate with dilute sulfuric acid, hydrochloric acid or nitric acid for 2 minutes to remove the surface oxide layer, activate the metal surface and improve the adhesion of the coating; rinse the copper substrate with deionized water to ensure that the surface is clean and free of residue.

[0117] Place the pure nickel plate and copper substrate into the electroplating tank, then add the electroplating solution into the tank; control the pH value between 4.0-5.5, maintain the temperature at 50℃-60℃, and control the current density at 1A / dm 2 -3A / dm 2 , the electroplating time is ten minutes; the electrolytic cell is mechanically stirred for electroplating, and after the electroplating is completed, it is washed with water, and then a trivalent chromium passivator is used to form a protective film on the surface of the nickel plating layer, and finally dried to obtain a copper-nickel-plated strip. The prepared copper-nickel-plated strip is welded to the nickel strip by ultrasonic welding, wherein an overlapping welding area is formed at the connection between the nickel strip and the copper-nickel-plated strip, and a copper-nickel-plated-to-nickel pole ear is obtained, and the copper-nickel-plated-to-nickel pole ear is 3mm wide, 0.1mm thick, and 40mm long, wherein the copper-nickel-plated portion of the copper-nickel-plated-to-nickel pole ear is 27mm long.

[0118] The positive aluminum lug is obtained by cutting so that the positive aluminum lug is 3 mm wide, 0.1 mm thick and 40 mm long; the positive aluminum lug is ultrasonically welded to the positive electrode sheet, and the copper-plated nickel-converted lug is ultrasonically welded to the negative electrode sheet to form a battery cell.

[0119] Comparative Example 2

[0120] The negative electrode nickel tab is obtained by cutting, and the tab of the negative electrode nickel tab is 3mm wide, 0.1mm thick and 40mm long. The positive electrode aluminum tab is obtained by cutting, so that the positive electrode aluminum tab is 3mm wide, 0.1mm thick and 40mm long.

[0121] The positive electrode aluminum tab and the positive electrode sheet are ultrasonically welded, and the negative electrode nickel tab and the negative electrode sheet are ultrasonically welded to form a battery cell.

[0122] Table 1 Performance test table of negative electrode ears of Examples 1-4 and Comparative Examples 1 and 2

[0123] sample Tensile strengthMpa 90 degree bending times Resistance mΩ Salt spray test Example 1 (CPP) 341 20 4.51 8 Example 2 (PP) 337 21 4.35 8 Example 3 (EVA) 331 20 4.43 8 Example 4 (PE) 329 22 4.38 8 Comparative Example 1 (copper nickel plating) 300 18 2.49 4 Comparative Example 2 (Pure Nickel) 365 17 11.34 8

[0124] Table 2 Performance test table of positive electrode aluminum tabs of Examples 1-4 and Comparative Examples 1 and 2

[0125] sample Tensile strengthMpa 90 degree bending times Resistance mΩ Salt spray test Embodiment 1 (UV glue) 227 9 3.61 8 Embodiment 2 (UV glue) 229 10 3.74 8 Embodiment 3 (UV glue) 221 9 3.67 8 Embodiment 4 (UV glue) 223 9 3.55 8 Comparative Example 1 201 7 3.66 8 Comparative Example 2 206 7 3.79 8

[0126] As can be seen from Table 1, compared with Comparative Example 2, the resistance of the copper-nickel-plated nickel-converted tabs in Examples 1-4 and Comparative Example 1 is lower, so that the heat generation of the negative tab is smaller and the conductive effect is better; thus, compared with Comparative Example 1, the tensile strength of the copper-nickel-plated nickel-converted tabs in Examples 1-4 is greater and the number of 90-degree bending resistance is more, indicating that after the resin adhesive layer is coated on the copper-nickel-plated nickel-converted tabs, the bending resistance and mechanical strength of the copper-nickel-plated nickel-converted tabs are increased, and Comparative Example 2 is an integrated nickel strip with a higher resistance; the salt spray test is to artificially prepare a salt solution of a certain concentration and spray it on the surface of the test sample in the form of atomization to simulate the corrosion process. Corrosion points appeared in the salt spray test of Comparative Example 1 for 4 hours, and no corrosion points appeared in the salt spray test of Examples 1-4 and Comparative Example 2 until 8 hours. Compared with Comparative Example 1, the salt spray test time of Examples 1-4 is longer, indicating that the corrosion resistance is increased after the resin adhesive layer is coated on the copper-nickel-plated nickel-converted tabs.

[0127] It can be seen from Table 2 that compared with Comparative Example 1-2, after the positive electrode aluminum tabs of Examples 1-4 are coated with the UV glue layer, the tensile strength of the positive electrode aluminum tabs is greater and the number of bending performance tests is greater, so that the bending performance and mechanical strength of the positive electrode aluminum tabs are increased. No corrosion spots appear in the salt spray test of the positive electrode aluminum tabs of Examples 1-4 and Comparative Example 1-2 for 8 hours.

[0128] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A method for preparing a battery with a copper-nickel-plated nickel-converted tab, characterized in that: The steps include: Cleaning the copper substrate; Electroplating the copper substrate to obtain a copper nickel-plated strip with a nickel-plated layer; Ultrasonic welding the copper-nickel-plated strip and the nickel strip to obtain a copper-nickel-plated-to-nickel electrode tab, wherein an overlapping welding area is formed at the welding point between the copper-nickel-plated strip and the nickel strip; The thermoplastic sheet is heated and covered on the copper-nickel-plated-to-nickel tab, so that a resin adhesive layer is formed on the surface of the overlapping welding area and the copper-nickel-plated-to-nickel tab; The copper-nickel-plated-to-nickel tab is welded to the negative electrode sheet, and the positive electrode aluminum tab is welded to the positive electrode sheet to obtain the copper-nickel-plated-to-nickel tab battery.

2. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: Cleaning the copper substrate comprises the following steps: Removing dirt from the surface of the copper substrate by using an organic solvent or an alkaline degreasing agent; Pickling the copper substrate with an acid solution; The copper substrate is rinsed.

3. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: Electroplating the copper substrate comprises the following steps: placing a pure nickel plate and the copper substrate into an electroplating solution; Passing current to electroplate the copper substrate to obtain the copper nickel-plated strip with a nickel-plated layer; The copper-nickel-plated strip with the nickel-plated layer is cleaned.

4. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 3, characterized in that: The thickness of the nickel-plated layer of the copper-nickel-plated strip is 5 μm-20 μm.

5. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: After the copper-nickel-plated strip is cleaned, the following steps are also included: Chromate or trivalent chromium passivating agent is added to passivate the surface of the copper-nickel-plated strip.

6. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: The steps of heating the thermoplastic sheet and covering it on the copper-nickel-plated-nickel-converted electrode tab so that a resin adhesive layer is formed on the surface of the overlapping welding area and the copper-nickel-plated-nickel-converted electrode tab include the following steps: Fixing and leveling the copper-nickel-plated-to-nickel electrode tab, and then moving the leveled copper-nickel-plated-to-nickel electrode tab to a heating area; Heating and softening the thermoplastic sheet for the first time, and pasting the softened thermoplastic sheet on the surfaces of both sides of the overlapping welding area; The pasted thermoplastic sheets are heated for a second time to be melted into glue liquid, so that the molten glue liquid covers the surfaces on both sides of the overlapping welding area to form a resin glue layer.

7. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: The thermoplastic sheet includes at least one of CPP, PP, EVA and PE.

8. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 1, characterized in that: Before welding the positive electrode aluminum tab to the positive electrode sheet, the following steps are also included: Coat UV glue on the surface of the positive aluminum tab; The UV glue is irradiated by a UV lamp to obtain a positive aluminum electrode tab with a UV glue layer.

9. The method for preparing a battery having a copper-nickel-plated nickel-converted tab according to claim 8, characterized in that: The illumination time of UV light is 30s-60s.

10. A battery with nickel-plated copper tabs, characterized in that: The copper-nickel-plated-to-nickel-tab battery is obtained by the copper-nickel-plated-to-nickel-tab battery preparation method according to any one of claims 1 to 9, comprising a battery cell, a positive aluminum tab and a negative tab, wherein the battery cell is formed by winding or stacking a positive electrode sheet, a separator and a negative electrode sheet; The negative electrode tab includes a copper-nickel-plated strip, a nickel strip and a resin glue layer, the copper-nickel-plated strip is welded to the negative electrode sheet, and the resin glue layer is coated on the overlapping welding area of ​​the nickel-plated layer and the nickel strip; the positive electrode aluminum tab includes a positive electrode aluminum tab and a UV glue layer, the positive electrode aluminum tab is welded to the positive electrode sheet, and the UV glue layer is coated on the positive electrode aluminum tab.

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