Circuit board assembly, communication equipment and preparation method of circuit board assembly

Abstract

The invention provides a circuit board assembly, communication equipment and a preparation method of the circuit board assembly, and relates to the technical field of communication. The circuit board assembly provided by the invention comprises a first circuit board and a second circuit board, the board edge end part of the first circuit board comprises at least three first metal connecting parts, and the board edge end part of the second circuit board comprises at least three second metal connecting parts. And each first metal connecting part is electrically connected with at least one second metal connecting part through a conducting medium. According to the circuit board assembly provided by the invention, the metal connecting part arranged at the end part of the board edge of the circuit board is used as the connecting terminal for realizing the electrical connection of the devices arranged on the two circuit boards, so that the occupied area of the part, used for electrical connection, of the circuit board is relatively small, and the size of the circuit board is favorably reduced; and the material consumption of the circuit board assembly can be reduced, so that the cost of the circuit board assembly is reduced, the cost of the communication equipment applying the circuit board assembly is further reduced, and the market competitiveness of the communication equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a circuit board assembly, a communication device, and a method for preparing the circuit board assembly. Background Art

[0002] As the main component of communication equipment, circuit boards are widely used in mobile terminals, base stations, radars, vehicle-mounted equipment and other fields. Circuit boards can provide mechanical support for fixing and assembling electrical components such as transistors, capacitors, resistors and inductors, and can also meet the needs of wiring and electrical connection between various electrical components.

[0003] In actual applications, two or more circuit boards are usually set in communication equipment. At present, multiple circuit boards are usually connected by connectors, connectors plus cables, or flexible circuit boards. However, the material cost and processing cost of the above connection methods are usually high, which will lead to high production costs of communication equipment, which is not conducive to improving the market competitiveness of communication equipment. Summary of the invention

[0004] The present application provides a circuit board assembly, a communication device, and a method for preparing the circuit board assembly, so as to reduce the cost of the circuit board assembly, thereby reducing the cost of the communication device using the circuit board assembly.

[0005] In a first aspect, the present application provides a circuit board assembly, the circuit board assembly comprising a first circuit board, a first device disposed on the first circuit board, a second circuit board, a second device disposed on the second circuit board, and a conductive medium, wherein the board edge end of the first circuit board comprises at least three first metal connecting parts, and the first device is electrically connected to at least one first metal connecting part. The board edge end of the second circuit board comprises at least three second metal connecting parts, and the second device is electrically connected to at least one second metal connecting part. At least one first metal connecting part is electrically connected to at least one second metal connecting part through a conductive medium, thereby realizing the electrical connection between the first device disposed on the first circuit board and the second device disposed on the second circuit board. Since in the circuit board assembly provided by the present application, the metal connecting part disposed on the board edge end of the circuit board is used as a connecting terminal for realizing the electrical connection of the devices disposed on the two circuit boards, it can make the board area of ​​the part of the circuit board used for electrical connection smaller, thereby facilitating the reduction of the size of the circuit board, so as to facilitate the reduction of the materials used in the circuit board assembly. In addition, there is only one conductive medium used to realize the electrical connection of the corresponding metal connecting parts of the devices disposed on the two circuit boards, which is also conducive to reducing the materials used in the circuit board assembly. Therefore, the structure of the circuit board assembly provided by the present application is relatively simple and the materials used are less, which is conducive to reducing the cost of the circuit board assembly.

[0006] In a possible implementation of the present application, the conductive medium can be used to transmit data signals or control signals, so that at least a pair of first metal connection parts and second metal connection parts connected by the conductive medium can be used to transmit data signals or control signals.

[0007] In a possible implementation of the present application, the first circuit board includes a first insulating dielectric layer and a first conductive layer that are stacked, and a portion of the first insulating dielectric layer located at the edge of the first circuit board includes a first slot, the notch of the first slot faces the second circuit board, and along the stacking direction of the first circuit board, the first slot runs through the first insulating dielectric layer. In this way, along the stacking direction of the first circuit board, the portion of the first conductive layer located within the contour of the first slot can be used as a first metal connection. This design can effectively reduce the material used in the circuit board assembly, thereby helping to reduce the cost of the circuit board assembly.

[0008] In addition, the groove wall of the first groove includes a first metal layer, and the first metal layer is electrically connected to the first metal connecting portion, so that the area of ​​the first circuit board used for achieving electrical connection can be increased, thereby facilitating the reliability of the electrical connection between the first circuit board and the conductive medium.

[0009] The present application does not limit the shape of the first slot, which may be a slot of a regular shape such as a semicircular slot or a rectangular slot, or may be a slot of any other possible irregular shape.

[0010] In another possible implementation of the present application, the first metal connection portion is a third metal layer disposed at the edge of the first circuit board, and the first circuit board includes a first conductive layer, and the third metal layer can cover the end surface of the first conductive layer, so that the third metal layer is electrically connected to the first conductive layer. This can help improve the flexibility of the first metal connection portion, so that the first metal connection portion is more convenient to set.

[0011] In order to ensure the reliability of the connection between the third metal layer and the conductive medium, in a possible implementation of the present application, the first circuit board further includes a first insulating medium layer, and the first insulating medium layer is stacked with the first conductive layer. Since the first insulating medium layer is not used for the transmission of electrical signals, the third metal layer can cover the end surface of the first insulating medium layer, so that the third metal layer has a larger setting area.

[0012] In the present application, the second metal connection portion can be set with reference to the first metal connection portion. For example, in one possible implementation, the second circuit board includes a second insulating dielectric layer and a second conductive layer that are stacked, and the portion of the second insulating dielectric layer located at the edge of the second circuit board includes a second slot, the notch of the second slot faces the first circuit board, and along the stacking direction of the second circuit board, the second slot runs through the second insulating dielectric layer. In this way, along the stacking direction of the second circuit board, the portion of the second conductive layer located within the contour of the second slot can serve as the second metal connection portion. With this design, the material used in the circuit board assembly can be effectively reduced, thereby helping to reduce the cost of the circuit board assembly.

[0013] In addition, the groove wall of the second groove includes a second metal layer, and the second metal layer is electrically connected to the second metal connection portion, so that the area of ​​the second circuit board used for achieving electrical connection can be increased, thereby facilitating the reliability of the electrical connection between the second circuit board and the conductive medium.

[0014] The present application does not limit the shape of the second slot, which may be a slot of a regular shape such as a semicircular slot or a rectangular slot, or may be a slot of any other possible irregular shape.

[0015] In another possible implementation, the second metal connection portion is a fourth metal layer disposed at the edge of the second circuit board, and the second circuit board includes a second conductive layer. The fourth metal layer can cover the end surface of the second conductive layer, so that the fourth metal layer is electrically connected to the second conductive layer of the second circuit board. This can help improve the flexibility of the second metal connection portion, making the second metal connection portion more convenient to set.

[0016] In addition, the second circuit board also includes a second insulating medium layer that is not used for electrical signal transmission. The second insulating medium layer and the second conductive layer are stacked. The fourth metal layer can also cover the second insulating medium layer, thereby making the fourth metal layer have a larger setting area, which is beneficial to improving the reliability of the connection between the fourth metal layer and the conductive medium.

[0017] In a possible implementation of the present application, the edge of the first circuit board also includes a third metal connection portion, and the third metal connection portion and the first metal connection portion are arranged along the stacking direction of the first circuit board. In addition, the edge of the second circuit board also includes a fourth metal connection portion, and the fourth metal connection portion and the second metal connection portion are arranged along the stacking direction of the second circuit board. The third metal connection portion and the fourth metal connection portion can also be connected by a conductive medium. In this way, the third metal connection portion and the fourth metal connection portion can also be used as connection terminals for signal transmission between the first circuit board and the second circuit board, which is conducive to increasing the number of connection terminals for signal transmission between the first circuit board and the second circuit board, thereby meeting the transmission requirements of multiple signals between circuit board components.

[0018] The third metal connection part can be set with reference to the first metal connection part. Specifically, the first circuit board also includes a third conductive layer. The third metal connection part can be a part of the third conductive layer located at the edge of the first circuit board, or the third metal connection part can be a fifth metal layer covering the end surface of the third conductive layer.

[0019] The fourth metal connection part can be set with reference to the second metal connection part. Specifically, the second circuit board also includes a fourth conductive layer. The fourth metal connection part can be a part of the fourth conductive layer located at the edge end of the second circuit board, or the fourth metal connection part is a sixth metal layer covering the end surface of the fourth conductive layer.

[0020] In the present application, the arrangement of the first circuit board and the second circuit board can be various. For example, in one possible implementation, the board surface of the first circuit board is arranged in parallel with the board surface of the second circuit board, so that the connection between the first circuit board and the second circuit board is more convenient. In addition, the board surface of the first circuit board is arranged in parallel with the board surface of the second circuit board, so that both the board surfaces of the first circuit board and the two board surfaces of the second circuit board can be used for the arrangement of devices, which can integrate more devices with the first circuit board and the second circuit board, thereby facilitating the improvement of the integration of the circuit board assembly.

[0021] As another example, in another possible implementation of the present application, the board surface of the first circuit board is arranged to intersect with the board surface of the second circuit board. The first circuit board includes a first board edge, and the first metal connection portion is arranged at the end of the first board edge; the second circuit board includes a second board edge, and the second metal connection portion is arranged at the end of the second board edge. In addition, the first board edge is parallel to or intersects with the second board edge. This can enhance the layout flexibility of the first circuit board and the second circuit board, so that the circuit board assembly can be reasonably arranged according to the layout space of the communication equipment. In addition, the board surface of the first circuit board is arranged to intersect with the board surface of the second circuit board, and the two board surfaces of the first circuit board and the two board surfaces of the second circuit board can also be used for the arrangement of devices, so that the first circuit board and the second circuit board can integrate more devices to achieve functional diversification of the circuit board assembly.

[0022] In a possible implementation of the present application, the edge of the first circuit board also includes a fifth metal connection portion, and the fifth metal connection portion and the first metal connection portion are arranged along the stacking direction of the first circuit board. In addition, the circuit board assembly also includes a third circuit board, and the edge of the third circuit board includes a sixth metal connection portion, and the fifth metal connection portion and the sixth metal connection portion are connected through a conductive medium. The design method of the circuit board assembly provided by the present application can meet the requirement that the first circuit board simultaneously transmits signals with the second circuit board and the third circuit board through the correspondingly connected metal connection portions, while also making the structure of the circuit board assembly relatively simple and the preparation cost relatively low.

[0023] The arrangement of the third circuit board and the first circuit board can refer to the arrangement of the first circuit board and the second circuit board. For example, the surface of the third circuit board is arranged parallel to the surface of the first circuit board or the surface of the third circuit board is arranged to intersect with the surface of the first circuit board.

[0024] Since there are usually multiple data signals or control signals transmitted between the connected circuit boards, in order to meet the signal transmission requirements, it is necessary to set enough metal connecting parts on the connected circuit boards. Specifically, in a possible implementation of the present application, the first circuit board includes a first board edge, and the first board edge is inclined in the direction from the first circuit board to the second circuit board. In this way, at least three first metal connecting parts can be set at the end of the first board edge. Since the length of the first board edge is longer, the space at the end of the board edge for setting the first metal connecting parts is larger, which can be conducive to meeting the setting requirements of more first metal connecting parts. Similarly, the second circuit board includes a second board edge, and the second board edge is inclined in the direction from the second circuit board to the first circuit board. Then at least three second metal connecting parts are set at the end of the second board edge. Since the length of the second board edge is longer, a larger number of second metal connecting parts can be set at the end of the second board edge. In this way, multiple signal transmission paths can be formed between the first circuit board and the second circuit board through the connection of the corresponding first metal connecting parts and the second metal connecting parts, thereby meeting the transmission requirements of multiple data signals or control signals.

[0025] In another possible implementation of the present application, at least three first metal connections may also be distributed on different board edges of the first circuit board. For example, the first circuit board includes adjacent first and third board edges, and a portion of at least three first metal connections may be arranged at the end of the first board edge, and another portion of at least three first metal connections may be arranged at the end of the third board edge. This can improve the flexibility of the setting position of the first metal connection and can help improve the setting density of the first metal connection. Similarly, the second circuit board includes adjacent second and fourth board edges, and a portion of at least three second metal connections may be arranged at the end of the second board edge, and another portion of at least three first metal connections may be arranged at the end of the fourth board edge, so as to improve the setting flexibility and setting density of the second metal connection. In addition, when the first circuit board and the second circuit board are connected, each first metal connection arranged at the end of the first board edge can be connected to at least one second metal connection arranged at the end of the second board edge through a conductive medium, and each first metal connection arranged at the end of the third board edge can be connected to at least one second metal connection arranged at the end of the fourth board edge through a conductive medium. In this way, a plurality of signal transmission paths can be formed between the first circuit board and the second circuit board through the connection of the corresponding first metal connection parts and the second metal connection parts, thereby meeting the transmission requirements of multiple data signals or control signals.

[0026] In the present application, the board edge of the first circuit board can be a shaped edge in addition to a straight edge. For example, in a possible implementation of the present application, the first circuit board includes a first board edge, the first board edge is a serpentine board edge, and at least three first metal connecting parts are arranged at the end of the first board edge. The second circuit board includes a second board edge, the second board edge is a serpentine board edge, and at least three second metal connecting parts are arranged at the end of the second board edge. Since the lengths of the first board edge and the second board edge are relatively long, they can be used to set more metal connecting parts, so that multiple signal transmission paths can be formed between the first circuit board and the second circuit board through the connection of the corresponding first metal connecting parts and the second metal connecting parts, thereby meeting the transmission requirements of multiple data signals or control signals.

[0027] In a possible implementation of the present application, the conductive medium may be, but is not limited to, conductive paste, conductive glue, conductive foam or conductive cloth. It can be seen from this that in the present application, there is only one conductive medium used to realize the first metal connection part and the second metal connection part, which can effectively reduce the materials used in the circuit board assembly, thereby reducing the cost of the circuit board assembly. In addition, when the conductive medium is a curable material such as conductive paste, the conductive medium can also be used to realize the rigid connection between the first circuit board and the second circuit board. At this time, there is no need to set a rigid connector between the first circuit board and the second circuit board, thereby reducing the materials used in the circuit board assembly and reducing the cost of the circuit board assembly.

[0028] In a second aspect, the present application further provides a communication device, which includes a housing and a circuit board assembly according to the first aspect, wherein the circuit board assembly is accommodated in the housing. The structure of the communication device is relatively simple, and the materials used for the circuit board assembly are good, which can help reduce the cost of the communication device and enhance the market competitiveness of the communication device.

[0029] In a third aspect, the present application further provides a method for preparing a circuit board assembly, the method comprising:

[0030] Providing a first circuit board, and forming a first metal connecting portion on a board edge of the first circuit board;

[0031] Providing a second circuit board, and forming a second metal connecting portion on a board edge of the second circuit board;

[0032] Each first metal connection is connected to at least one second metal connection via a conductive medium.

[0033] The circuit board assembly prepared by the method for preparing the circuit board assembly provided in the present application has a relatively simple structure and uses less materials, which is beneficial to reducing the cost of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application;

[0035] Figure 2 for Figure 1 AA cross-sectional view of the circuit board assembly shown in;

[0036] Figure 3 Another cross-sectional view of a circuit board assembly provided in an embodiment of the present application;

[0037] Figure 4 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0038] Figure 5 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0039] Figure 6 Another cross-sectional view of a circuit board assembly provided in an embodiment of the present application;

[0040] Figure 7 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0041] Figure 8 for Figure 7 BB cross-sectional view of the circuit board assembly shown in;

[0042] Figures 9a to 9cAnother structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0043] Fig.10 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0044] Fig.11 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0045] Fig.12 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0046] Fig.13 Another structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0047] Fig.14 A flow chart of a method for preparing a circuit board assembly provided in an embodiment of the present application;

[0048] Fig.15a A schematic diagram of the structure of a first circuit board provided in an embodiment of the present application;

[0049] Fig.15b Another structural schematic diagram of the first circuit board provided in an embodiment of the present application;

[0050] Fig.16a A schematic diagram of the structure of a second circuit board provided in an embodiment of the present application;

[0051] Fig.16b Another structural schematic diagram of the second circuit board provided in the embodiment of the present application;

[0052] Fig.17a A schematic diagram of an alignment process of a first metal connection portion and a second metal connection portion provided in an embodiment of the present application;

[0053] Fig.17b A schematic diagram of another alignment process of the first metal connection portion and the second metal connection portion provided in an embodiment of the present application;

[0054] Fig.17c A schematic diagram of another alignment process of the first metal connection portion and the second metal connection portion provided in an embodiment of the present application;

[0055] Fig.18 A schematic diagram of the structure of a communication device provided in an embodiment of the present application.

[0056] Reference numerals:

[0057] 100-circuit board assembly; 1-first circuit board; 101-first metal connection portion; 102-first insulating medium layer; 1021-first slot;

[0058] 10211 - first metal layer; 103 - first conductive layer; 104 - third metal connection portion; 105 - third conductive layer; 106 - third metal layer;

[0059] 107 - first board edge; 108 - third board edge; 109 - fifth metal connection portion; 2 - second circuit board; 201 - second metal connection portion;

[0060] 202 - second insulating dielectric layer; 2021 - second slot; 20211 - second metal layer; 203 - second conductive layer; 204 - fourth metal connecting portion;

[0061] 205 - fourth conductive layer; 206 - fourth metal layer; 207 - second board edge; 208 - fourth board edge;

[0062] 3-conductive medium; 4-third circuit board; 401-sixth metal connection part;

[0063] 200-Housing. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship, and they do not represent the true proportion.

[0065] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0066] In order to facilitate the understanding of the circuit board assembly and communication equipment provided by the present application, the application scenarios thereof are first introduced below. With the development of communication technology, more and more functional modules are integrated in communication equipment. The circuit board assembly can provide mechanical support for fixing and assembling these functional modules, and can also be used to realize the electrical connection between the functional modules. The circuit board assembly may include two or more circuit boards. The board material and the number of layers of the circuit board are usually limited by the performance requirements of the functional modules set therein. The circuit board used to set the functional module with high performance requirements usually requires the board material to be of higher grade and more layers, while the circuit board used to set the functional module with ordinary performance can use the board material of ordinary material and the number of layers of the circuit board is less. Since the higher the grade of the board material of the circuit board and the more layers, the higher the cost of the circuit board, based on cost considerations, the functional modules with high performance requirements and the functional modules with ordinary performance are usually set on different circuit boards respectively, and then the circuit boards are electrically connected to realize the electrical connection of the corresponding functional modules on each circuit board.

[0067] When considering the electrical connection between circuit boards, a variety of factors such as speed, reliability, and operating space are usually considered to select a suitable connection method. At present, the connection methods between circuit boards mainly include the connection between connectors, the connection of connectors plus cables plus connectors, or the use of flexible circuit boards for connection. These connection methods all require additional connecting devices. Since these connection methods have more connection relationships, the probability of failure during the connection process is high, and the maintenance cost is high. In addition, in the above-mentioned connection methods, the interconnection between the connecting device and the circuit board is achieved by crimping or welding, and the material cost and processing cost are both high.

[0068] In view of this, the circuit board assembly provided in the embodiment of the present application is provided with a metal connection part for electrical connection as a connection terminal at the edge end of the circuit board, and a conductive medium is used to directly interconnect the corresponding metal connection parts of the two circuit boards, so as to effectively reduce the connection cost between the circuit boards, which is conducive to reducing the cost of the circuit board assembly, thereby reducing the cost of the communication equipment using the circuit board assembly, so as to enhance the market competitiveness of the communication equipment. In order to facilitate the understanding of the technical solution of the present application, the circuit board assembly provided by the present application will be specifically described below in conjunction with the accompanying drawings and specific implementation methods.

[0069] Reference Figure 1 , Figure 1A schematic diagram of the structure of a circuit board assembly 100 provided in an embodiment of the present application. The circuit board assembly 100 includes a first circuit board 1 and a second circuit board 2, a first metal connection portion 101 is provided at an edge end of the first circuit board 1, a second metal connection portion 201 is provided at an edge end of the second circuit board 2, and the first metal connection portion 101 and the second metal connection portion 201 are connected via a conductive medium 3, thereby achieving electrical connection between the first circuit board 1 and the second circuit board 2.

[0070] In the present application, the number of the first metal connection part 101 of the first circuit board 1 and the second metal connection part 201 of the second circuit board 2 is not limited. For example, Figure 1 As shown, the edge of the first circuit board 1 includes at least three first metal connection parts 101, and the at least three first metal connection parts 101 are arranged in the same plane. The edge of the second circuit board 2 includes at least three second metal connection parts 201, and the three second metal connection parts 201 can be arranged in the same plane. And at least one first metal connection part 101 is connected to at least one second metal connection part 201 through a conductive medium 3. In this way, at least three signal transmission paths can be formed between the first circuit board 1 and the second circuit board 2, which can be used to realize the transmission of three types of electrical signals between the two circuit boards.

[0071] Reference Figure 2 , Figure 2 for Figure 1 The AA cross-sectional view of the circuit board assembly 100 shown in . Since the first circuit board 1 may generally include a first insulating dielectric layer 102 and a first conductive layer 103 which are stacked, wherein the first insulating dielectric layer 102 may be a material layer with insulating properties such as resin, and the first conductive layer 103 may be a metal layer with conductive properties such as a copper layer. When the first metal connecting portion 101 is specifically provided, a portion of the first insulating dielectric layer 102 located at the edge of the first circuit board 1 may be provided with a first groove 1021, and the groove of the first groove 1021 faces the second circuit board 2. In addition, along the stacking direction of the first circuit board 1, the first groove 1021 penetrates the first insulating dielectric layer 102, so that the first groove 1021 can expose a portion of the first conductive layer 103 located within the contour range of the first groove 1021 along the stacking direction of the first circuit board 1, as shown in FIG. Figure 2 As shown, the portion of the first conductive layer 103 that is located within the contour of the first slot 1021 along the stacking direction of the first circuit board 1 can be used as the first metal connection portion 101. With this design, the portion of the first conductive layer 103 of the first circuit board 1 is used as the first metal connection portion 101, which can effectively reduce the material used in the circuit board assembly 100, thereby helping to reduce the cost of the circuit board assembly 100.

[0072] exist Figure 1In the circuit board assembly 100 shown in FIG. 1 , the second circuit board 2 can be configured with reference to the first circuit board 1. Specifically, Figure 2 As shown, the second circuit board 2 includes a second insulating dielectric layer 202 and a second conductive layer 203 which are stacked, and a portion of the second insulating dielectric layer 202 located at the edge of the second circuit board 2 is provided with a second slot 2021, and the slot of the second slot 2021 faces the first circuit board 1. In addition, along the stacking direction of the second circuit board 2, the second slot 2021 penetrates the second insulating dielectric layer 202, so that the second slot 2021 can expose the portion of the second conductive layer 203 located within the contour range of the second slot 2021 along the stacking direction of the second circuit board 2, and the portion of the second conductive layer 203 located within the contour range of the second slot 2021 along the stacking direction of the second circuit board 2 can be used as the second metal connection portion 201. With this design, a portion of the second conductive layer 203 of the second circuit board 2 is used as the second metal connection portion 201, which can effectively reduce the material used in the circuit board assembly 100, thereby helping to reduce the cost of the circuit board assembly 100.

[0073] It can be understood that the first conductive layer 103 of the first circuit board 1 can be electrically connected to the first device disposed on the first circuit board 1 through a wiring, so that the first device and at least one first metal connection portion 101 of the first circuit board 1 are electrically connected, wherein the first device can be an active device, such as a chip, etc.; or the first device can be a passive device, such as a resistor or a capacitor, etc. The second conductive layer 203 of the second circuit board 2 can be electrically connected to the second device disposed on the second circuit board 2 through a wiring, so that the second device and at least one second metal connection portion 201 of the second circuit board 2 are electrically connected, wherein the second device can be an active device, such as a chip, etc.; or the second device can be a passive device, such as a resistor or a capacitor, etc. Then, in the circuit board assembly 100 provided in the embodiment of the present application, by electrically connecting the first metal connection portion 101 of the first circuit board 1 with the second metal connection portion 201 of the second circuit board 2, the electrical connection between the first device on the first circuit board 1 and the second device on the second circuit board 2 can be achieved.

[0074] In the circuit board assembly 100 provided in the embodiment of the present application, in order to realize the electrical connection between the first metal connection part 101 and the second metal connection part 201, the conductive medium 3 can be various. Figure 1 In the circuit board assembly 100 shown, the conductive medium 3 may be a conductive paste, which may be tin paste, etc. In addition, in some other embodiments of the present application, the conductive medium 3 may also be a conductive medium having adhesive properties, such as conductive glue, conductive foam or conductive cloth.

[0075] In the present application, the conductive medium 3 can be used to transmit data signals or control signals, so that at least one pair of the first metal connection part 101 and the second metal connection part 201 connected by the conductive medium 3 can be used for the transmission of data signals or control signals. In addition, in the embodiment of the present application, when the conductive medium 3 is a curable material such as conductive paste, the conductive medium 3 can also be used to achieve a rigid connection between the first circuit board 1 and the second circuit board 2. In this case, there is no need to set a rigid connector between the first circuit board 1 and the second circuit board 2, thereby reducing the materials used for the circuit board assembly 100 and reducing the cost of the circuit board assembly 100.

[0076] It can be seen from this that in the present application, only one conductive medium 3 is used to realize the first metal connection part 101 and the second metal connection part 201, which can effectively reduce the material used in the circuit board assembly 100, thereby reducing the cost of the circuit board assembly 100.

[0077] In addition, in the embodiment of the present application, the types of the first circuit board 1 and the second circuit board 2 are not limited. For example, the first circuit board 1 can be a printed circuit board or a flexible circuit board, and the second circuit board 2 can also be a printed circuit board or a flexible circuit board. The circuit board assembly 100 provided in the embodiment of the present application has a wider range of applications.

[0078] Reference Figure 3 , Figure 3 Another cross-sectional view of the circuit board assembly 100 provided in the embodiment of the present application. In the circuit board assembly 100 provided in the embodiment of the present application, the groove wall of the first groove 1021 may also be provided with a first metal layer 10211, and the first metal layer 10211 may be electrically connected to the first metal connecting portion 101, so that the area of ​​the region for realizing electrical connection of the first circuit board 1 can be increased, thereby being conducive to improving the reliability of the electrical connection between the first circuit board 1 and the conductive medium 3. Among them, since the material of the first conductive layer 103 of the first circuit board 1 may be, for example, copper, the material of the first metal connecting portion 101 may also be copper. The material of the first metal layer 10211 may also be copper, or the first metal layer 10211 may also be selected from metals with good conductive properties such as gold or silver, as long as the electrical connection between the first metal layer 10211 and the first metal connecting portion 101 can be realized.

[0079] In addition, the groove wall of the second groove 2021 may also be provided with a second metal layer 20211, and the second metal layer 20211 may be electrically connected to the second metal connection part 201, so as to increase the area of ​​the region of the second circuit board 2 for realizing electrical connection, so as to improve the reliability of the electrical connection between the second circuit board 2 and the conductive medium 3. Among them, the material of the second conductive layer 203 of the second circuit board 2 may be copper, for example, and the material of the second metal connection part 201 may also be copper. The material of the second metal layer 20211 may also be copper, or the second metal layer 20211 may also be selected from metals with good electrical conductivity such as gold or silver, as long as the electrical connection between the second metal layer 20211 and the second metal connection part 201 can be realized.

[0080] In the circuit board assembly 100 provided in the embodiment of the present application, the shapes of the first slot 1021 and the second slot 2021 can be various. Figure 1 In the circuit board assembly 100 shown, the first slot 1021 and the second slot 2021 may both be semicircular slots. Figure 4 In the circuit board assembly 100 shown, the first slot 1021 and the second slot 2021 may both be rectangular slots. In addition, in some embodiments of the present application, the first slot 1021 and the second slot 2021 may also be slots of any other possible regular or irregular shapes, and the shapes of the first slot 1021 and the second slot 2021 may be the same or different. They are not listed one by one here, but they should all be understood to fall within the protection scope of the present application.

[0081] In the present application, the number of the first slots 1021 and the second slots 2021 can be the same or different, that is, the number of the first metal connection part 101 and the second metal connection part 201 can be the same or different, which makes it possible to connect the first metal connection part 101 and the second metal connection part 201 in a variety of ways. Figure 1 and Figure 4 In the circuit board assembly 100 shown, the first circuit board 1 has five first metal connection parts 101, and the second circuit board 2 has five second metal connection parts 201. The number of the first metal connection parts 101 and the number of the second metal connection parts 201 are the same, and each first metal connection part 101 is electrically connected to each second metal connection part 201 in a one-to-one correspondence through the conductive medium 3.

[0082] Another example Figure 5 , Figure 5Another structural schematic diagram of a circuit board assembly 100 provided in an embodiment of the present application. In the circuit board assembly 100, the number of first metal connection parts 101 of the first circuit board 1 and the number of metal connection parts 201 of the second circuit board 2 are different, and there is a connection mode in which one first metal connection part 101 is electrically connected to two second metal connection parts 201.

[0083] In addition, the first slot 1021 and the second slot 2021 may also be electrically connected in other possible ways, which are not listed here one by one, but they should all be understood to fall within the protection scope of the present application.

[0084] Since there are usually multiple data signals or control signals transmitted between the connected circuit boards, in order to meet the signal transmission requirements, it is necessary to set up enough metal connecting parts on the connected circuit boards. Considering that the circuit boards are arranged in a stacked manner, in this application, the metal connecting parts of the circuit boards can also be arranged along the stacking direction to increase the setting density of the metal connecting parts of the circuit boards. Figure 6 , Figure 6 Another cross-sectional view of the circuit board assembly 100 provided in the embodiment of the present application can be used to illustrate the connection method of the first circuit board 1 and the second circuit board 2 in the stacking direction. The edge of the first circuit board 1 also includes a third metal connection portion 104, which is composed of Figure 6 It can be seen that the third metal connection part 104 and the first metal connection part 101 are arranged along the stacking direction of the first circuit board 1. In addition, the board edge end of the second circuit board 2 also includes a fourth metal connection part 204, and the fourth metal connection part 204 and the second metal connection part 201 are arranged along the stacking direction of the second circuit board 2. The third metal connection part 104 and the fourth metal connection part 204 can also be connected through the conductive medium 3, so that the third metal connection part 104 and the fourth metal connection part 204 can also serve as the connection terminals of the corresponding circuit boards, so as to realize the signal transmission between the two connected circuit boards, so as to meet the requirements of multi-channel signal transmission of the circuit board assembly 100.

[0085] It is worth mentioning that the present application does not limit the number of the third metal connection parts 104 and the fourth metal connection parts 204. For example, there may be at least three third metal connection parts 104 and at least three fourth metal connection parts 204, and each third metal connection part 104 is connected to at least one fourth metal connection part 204 through the conductive medium 3. In addition, when there are at least three third metal connection parts 104, the at least three third metal connection parts 104 may be coplanarly arranged. Similarly, when there are at least three fourth metal connection parts 204, the at least three fourth metal connection parts 204 may be coplanarly arranged.

[0086] In the present application, the third metal connection portion 104 may be configured with reference to the first metal connection portion 101, and the fourth metal connection portion 204 may be configured with reference to the second metal connection portion 201. Figure 6 As shown, the first circuit board 1 further includes a third conductive layer 105, and the third metal connection portion 104 can be a portion of the third conductive layer 105 located at the edge end of the first circuit board. In this case, the formation method of the third metal connection portion 104 is similar to the formation method of the first metal connection portion 101, and it is not repeated here. In addition, the second circuit board 2 further includes a fourth conductive layer 205, and the fourth metal connection portion 204 can be a portion of the fourth conductive layer 205 located at the edge end of the second circuit board 2, and the formation method of the fourth metal connection portion 204 is similar to the formation method of the second metal connection portion 201, and it is not repeated here.

[0087] It is understandable that the number of conductive layers of the first circuit board 1 and the number of conductive layers of the second circuit board 2 can be specifically set according to the devices set therein, and the number of conductive layers of the first circuit board 1 and the number of conductive layers of the second circuit board 2 can be the same or different. Figure 6 In the circuit board assembly 100 shown, the first circuit board 1 includes three conductive layers, and the second circuit board 2 includes three conductive layers. At this time, the three conductive layers of the first circuit board 1 are connected to the three conductive layers of the second circuit board 2 in a one-to-one correspondence. When the number of conductive layers of the first circuit board 1 and the second circuit board 2 are different, only part of the conductive layers of the first circuit board 1 and the second circuit board 2 are connected in a corresponding manner. Regardless of whether the number of conductive layers of the first circuit board 1 and the second circuit board 2 are the same, when the first circuit board 1 and the second circuit board 2 are electrically connected, the electrical connection between the conductive layers of the first circuit board 1 and the conductive layers of the second circuit board 2 can be achieved through the metal connecting portion arranged at the edge of the board, and the specific arrangement method can refer to any of the above embodiments, which will not be introduced one by one here.

[0088] Reference Figure 7 , Figure 7 FIG. 1 is another structural diagram of a circuit board assembly 100 provided in an embodiment of the present application. Different from the circuit board assembly 100 provided in the above embodiment, Figure 7 In the circuit board assembly 100 shown, the first metal connection part 101 is a third metal layer 106 disposed at the edge of the first circuit board 1. The third metal layer 106 covers the end surface of the first conductive layer 103, and the third metal layer 106 is electrically connected to the first conductive layer 103. Figure 8 , Figure 8 for Figure 7BB cross-sectional view of the circuit board assembly 100 is shown in FIG. In the embodiment of the present application, the third metal layer 106 can be formed on the edge of the first circuit board 1 by, but not limited to, electroplating, coating or bonding. The material of the third metal layer 106 can be a metal with good electrical conductivity such as copper, gold or silver, and the material of the third metal layer 106 and the first conductive layer 103 can be the same or different, as long as the electrical connection between the third metal layer 106 and the first conductive layer 103 can be achieved.

[0089] You can continue to refer to Figure 7 and Figure 8 The second metal connection part 201 is a fourth metal layer 206 disposed at the edge of the second circuit board 2, and the fourth metal layer 206 covers the end surface of the second conductive layer 203 to achieve electrical connection between the fourth metal layer 206 and the second conductive layer 203. The material of the fourth metal layer 206 can be copper, gold, silver or other metals with good conductivity, and the material of the fourth metal layer 206 and the second conductive layer 203 can be the same or different, as long as the electrical connection between the fourth metal layer 206 and the second conductive layer 203 can be achieved.

[0090] It is understandable that if Figure 8 As shown, in the present application, the third metal layer 106 can also cover the end surface of the first insulating medium layer 102 adjacent to the first conductive layer 103, and the fourth metal layer 206 can also cover the end surface of the second insulating medium layer 202 adjacent to the second conductive layer 203. This can increase the setting area of ​​the third metal layer 106 and the fourth metal layer 206, which is beneficial to improving the connection reliability between the third metal layer 106 and the fourth metal layer 206, thereby realizing a reliable connection between the first circuit board 1 and the second circuit board 2.

[0091] Figure 7 Other structures of the circuit board assembly 100 shown can be arranged with reference to any of the above embodiments, and will not be described in detail here.

[0092] In the above embodiment of the present application, the first metal connection portion 101 of the first circuit board 1 and the second metal connection portion 201 of the second circuit board 2 are arranged in the same manner. In some possible embodiments, the first metal connection portion 101 of the first circuit board 1 and the second metal connection portion 201 of the second circuit board 2 may be arranged in different directions. For example, the first metal connection portion 101 of the first circuit board 1 may be arranged in a Figure 1 , Figure 4 or Figure 5 The second metal connection portion 201 of the second circuit board 2 adopts Figure 7The arrangement shown can still enable the corresponding first metal connection part 101 to be electrically connected to the second metal connection part 201 through the conductive medium 3 , thereby achieving electrical connection between the first circuit board 1 and the second circuit board 2 .

[0093] It is worth mentioning that in the present application, each metal connection portion of the first circuit board 1 can be set with reference to the first metal connection portion 101 in any of the above embodiments. For example, when the first circuit board 1 includes the third metal connection portion 104, the third metal connection portion 104 can also be a fifth metal layer covering the end surface of the third conductive layer 105. Similarly, each metal connection portion of the second circuit board 2 can be set with reference to the second metal connection portion 201 in any of the above embodiments. For example, when the second circuit board 2 includes the fourth metal connection portion 204, the fourth metal connection portion 204 can also be a sixth metal layer covering the end surface of the fourth conductive layer 205.

[0094] In addition, in the above embodiments, the first metal connection part 101 is set on a right-angled side of the first circuit board 1, and the second metal connection part 201 is also set on a right-angled side of the second circuit board 2 as an example to demonstrate the connection method between the first circuit board 1 and the second circuit board 2. In other possible embodiments of the present application, the first metal connection part 101 can also be set on other forms of edges of the first circuit board 1, and the second metal connection part 201 can also be set on other forms of edges of the second circuit board 2. For example, in Figure 9a In the circuit board assembly 100 shown, the first circuit board 1 includes a first board edge 107, which is inclined along the direction from the first circuit board 1 to the second circuit board 2, and the first board edge 107 is a beveled edge of the first circuit board 1, and at least three first metal connecting parts 101 are all arranged on the first board edge 107. Since the length of the first board edge 107 is relatively long, the space at the end of the board edge for setting the first metal connecting parts 101 is relatively large, which can be conducive to meeting the requirements for setting more first metal connecting parts 101. Similarly, the second circuit board 2 includes a second board edge 207, which is inclined along the direction from the second circuit board 2 to the first circuit board 1, and the second board edge 207 is a beveled edge of the second circuit board 2, and at least three second metal connecting parts 201 are all arranged on the second board edge 207. Since the length of the second board edge 207 is relatively long, the space at the end of the board edge for setting the second metal connecting parts 201 is relatively large, which can be conducive to meeting the requirements for setting more second metal connecting parts 201. In this way, a plurality of signal transmission paths can be formed between the first circuit board 1 and the second circuit board 2 by connecting the corresponding first metal connection parts 101 and the second metal connection parts 201, thereby meeting the transmission requirements of multiple data signals or control signals.

[0095] As in Figure 9bIn the circuit board assembly 100 shown, the first metal connection part 101 is arranged at two adjacent board edges of the first circuit board 1. Specifically, the first circuit board 1 includes an adjacent first board edge 107 and a third board edge 108, at least three of the first metal connection parts 101 are partially arranged at the first board edge 107, and another part of the at least three first metal connection parts 101 are arranged at the third board edge 108, which can improve the flexibility of the arrangement position of the first metal connection parts 101 and can help improve the arrangement density of the first metal connection parts 101. Similarly, the second circuit board 2 includes an adjacent second board edge 207 and a fourth board edge 208, at least three of the second metal connection parts 201 are partially arranged at the second board edge 207, and another part of the at least three second metal connection parts 201 are arranged at the fourth board edge 208, which can improve the flexibility of the arrangement position of the second metal connection parts 201 and can help improve the arrangement density of the second metal connection parts 201. In addition, when connecting the first circuit board 1 and the second circuit board 2, each first metal connection part 101 disposed at the end of the first board edge 107 can be connected to at least one second metal connection part 201 disposed at the end of the second board edge 207 through the conductive medium 3, and each first metal connection part 101 disposed at the end of the third board edge 108 can be connected to at least one second metal connection part 201 disposed at the end of the fourth board edge 208 through the conductive medium. In this way, multiple signal transmission paths can be formed between the first circuit board 1 and the second circuit board 2 through the connection of the corresponding first metal connection parts 101 and the second metal connection parts 201, thereby meeting the transmission requirements of multiple data signals or control signals. In addition, in Figure 9b In the circuit board assembly 100 shown, the first circuit board 1 and the second circuit board 2 are spliced ​​into a regular shape, which is conducive to the miniaturized design of the circuit board assembly 100 .

[0096] It is worth mentioning that in Figure 9b In the embodiment, the first board edge 107 and the second board edge 207 of the first circuit board 1 are arranged perpendicularly, and the third board edge 108 and the fourth board edge 208 of the second circuit board 2 are arranged perpendicularly. In other possible embodiments, the angle between the first board edge 107 and the second board edge 207 may also be an acute angle or an obtuse angle, and the angle between the third board edge 108 and the fourth board edge 208 may also be an acute angle or an obtuse angle, which may be selected according to specific design requirements and are not limited here.

[0097] For example, Fig.9cIn the circuit board assembly 100 shown, the first board edge 107 of the first circuit board 1 is a serpentine board edge, and at least three first metal connecting parts 101 are arranged at the end of the first board edge 107. The second board edge 207 of the second circuit board 2 is also a serpentine board edge, and at least three second metal connecting parts 201 are arranged at the end of the second board edge 207. Since the lengths of the first board edge 107 and the second board edge 207 are relatively long, they can be used to set more metal connecting parts, so that multiple signal transmission paths can be formed between the first circuit board 1 and the second circuit board 2 through the connection of the corresponding first metal connecting parts 101 and the second metal connecting parts 201, thereby meeting the transmission requirements of multiple data signals or control signals.

[0098] In the circuit board assembly 100 shown in the above embodiment of the present application, the surface of the first circuit board 1 and the surface of the second circuit board 2 are arranged in parallel, so that the connection between the first circuit board 1 and the second circuit board 2 is more convenient, and the surface of the first circuit board 1 and the surface of the second circuit board 2 are arranged in parallel, so that both surfaces of the first circuit board 1 and the two surfaces of the second circuit board 2 can be used for the arrangement of devices, which can integrate more devices with the first circuit board 1 and the second circuit board 2, thereby helping to improve the integration of the circuit board assembly 100. In other possible embodiments of the present application, the surface of the first circuit board 1 and the surface of the second circuit board 2 can also be arranged to intersect. For example, refer to Fig.10 , Fig.10 Another structural schematic diagram of a circuit board assembly 100 provided in an embodiment of the present application. In the circuit board assembly 100, at least three first metal connecting parts 101 are arranged at the end of the first board edge 107 of the first circuit board 1, and at least three second metal connecting parts 201 are arranged at the second board edge 207 of the second circuit board 2, wherein the first board edge 107 and the second board edge 207 are arranged vertically, and the first board edge 107 of the first circuit board 1 and the second board edge 207 of the second circuit board 2 are parallel, which can improve the arrangement flexibility of the first circuit board 1 and the second circuit board 2, so that the circuit board assembly 100 can be reasonably arranged according to the layout space of the communication device.

[0099] As in Fig.11 In the circuit board assembly 100 shown in the figure, the board surface of the first circuit board 1 and the board surface of the second circuit board 2 are also arranged to intersect each other, but unlike the above Fig.10 The difference of the circuit board assembly 100 shown is that the first board edge 107 of the first circuit board 1 is perpendicular to the second board edge 207 of the second circuit board 2, and the corresponding metal connection parts at the intersection of the board edge of the first circuit board 1 and the board edge of the second circuit board 2 can be electrically connected through the conductive medium 3. With this design, the arrangement flexibility of the first circuit board 1 and the second circuit board 2 can also be improved, so that the circuit board assembly 100 can be reasonably arranged according to the layout space of the communication device.

[0100] exist Fig.10 and Fig.11 In the circuit board assembly 100 shown, both surfaces of the first circuit board 1 and both surfaces of the second circuit board 2 can also be used for device configuration, so as to improve the integration of the circuit board assembly 100 and thereby realize the functional diversification of the circuit board assembly 100 .

[0101] It is understandable that in the present application, the circuit board assembly 100 may include a third circuit board or more circuit boards in addition to the first circuit board 1 and the second circuit board 2, and each circuit board may be electrically connected in the manner provided in any of the above embodiments. Fig.12 , Fig.12 Another structural schematic diagram of a circuit board assembly 100 provided in an embodiment of the present application. The circuit board assembly 100 includes a first circuit board 1, a second circuit board 2, and a third circuit board 4, wherein the board surface of the first circuit board 1, the board surface of the second circuit board 2, and the board surface of the third circuit board 4 are parallel, the second circuit board 2 and the third circuit board 4 are stacked, and the second circuit board 2 and the third circuit board 4 are both electrically connected to the first circuit board 1. In specific implementation, the first circuit board 1 may also include a fifth metal connection portion 109, the fifth metal connection portion 109 and the first metal connection portion 101 are arranged along the stacking direction of the first circuit board 1, and the fifth metal connection portion 109 and the first metal connection portion 101 are arranged at intervals in the stacking direction of the first circuit board 1. The edge end of the third circuit board 4 includes a sixth metal connection portion 401, and the fifth metal connection portion 109 and the sixth metal connection portion 401 are connected through a conductive medium 3. Among them, the fifth metal connection portion 109 and the sixth metal connection portion 401 can be set with reference to the first metal connection portion 101 in any of the above embodiments, and will not be repeated here. In addition, the connection method of the first circuit board 1 and the second circuit board 2 can refer to any of the above embodiments, which will not be described in detail here. The design method of the circuit board assembly 100 provided in this embodiment of the present application can meet the requirements of the first circuit board 1 and the second circuit board 2 and the third circuit board 4 respectively transmitting signals through the corresponding metal connecting parts, while also making the structure of the circuit board assembly 100 simpler and the preparation cost lower.

[0102] As in Fig.13 In the circuit board assembly 100 shown, it still includes the first circuit board 1, the second circuit board 2 and the third circuit board 4, but the board surface of the first circuit board 1 is parallel to the board surface of the second circuit board 2, and the board surface of the first circuit board 1 intersects with the board surface of the third circuit board 4, wherein the specific implementation method of the intersection of the board surface of the first circuit board 1 and the board surface of the third circuit board 4 can be set with reference to the implementation method of the intersection of the board surface of the first circuit board 1 and the board surface of the second circuit board 2 in any of the above-mentioned embodiments, and will not be repeated here.

[0103] It is worth mentioning that in Fig.12 and Fig.13 In the circuit board assembly 100 shown, the spacing between the various circuit boards can be adjusted so that both surfaces of the first circuit board 1, the two surfaces of the second circuit board 2, and the two surfaces of the third circuit board 4 can be used for device settings, thereby improving the integration of the circuit board assembly 100 and achieving functional diversification of the circuit board assembly 100.

[0104] The circuit board assembly 100 provided in the embodiment of the present application realizes electrical connection between the circuit boards by setting a metal connection part on the edge of the circuit board and electrically connecting the metal connection parts of each circuit board through the conductive medium 3. This can reduce the material consumption of the circuit board assembly 100, thereby helping to reduce the cost of the circuit board assembly 100.

[0105] After understanding the structure of the circuit board assembly 100 provided in the embodiment of the present application, the preparation method of the circuit board assembly 100 is described below.

[0106] Reference Fig.14 , Fig.14 A flow chart of a method for preparing a circuit board assembly 100 provided in an embodiment of the present application. The method may include:

[0107] Step S1: providing a first circuit board, and forming at least three first metal connecting parts at the edge ends of the first circuit board.

[0108] In the embodiment of the present application, there are many ways to implement the step S1 of providing the first metal connection portion on the edge of the first circuit board.

[0109] For example, refer to Fig.15a , Fig.15a A schematic diagram of the structure of the first circuit board 1 provided in an embodiment of the present application. The first circuit board 1 may include a first insulating dielectric layer 102 and a first conductive layer 103 stacked in layers, and the first conductive layer 103 may be electrically connected to a first device disposed on the first circuit board 1 through a wiring, based on which, a portion of the first conductive layer 103 may be used as a first metal connection portion 101. Specifically, the first metal connection portion 101 is disposed on the edge of the first circuit board 1 and includes:

[0110] A first groove 1021 is opened in a portion of the first insulating medium layer 102 located at the edge of the first circuit board 1. Along the stacking direction of the first circuit board 1, the first groove 1021 penetrates the first insulating medium layer 102, and a portion of the first conductive layer 103 located within the contour of the first groove 1021 serves as the first metal connection portion 101.

[0111] It is worth mentioning that the forming method of the first slot 1021 is not limited in the present application, and it can be formed by a milling cutter.

[0112] Alternatively, the first metal connection portion 101 of the first circuit board 1 may be provided separately. Fig.15b , Fig.15b Another structural schematic diagram of the first circuit board 1 provided in an embodiment of the present application. In this embodiment, a first metal connecting portion 101 is provided at the edge of the first circuit board 1 and includes:

[0113] A third metal layer 106 is formed at the edge of the first circuit board 1 , and covers the end surface of the first conductive layer 103 . The third metal layer 106 is conductively connected to the first conductive layer 103 , and serves as the first metal connection portion 101 .

[0114] It is worth mentioning that in the present application, the third metal layer 106 can be formed on the edge of the first circuit board 1 by coating, printing or bonding, but is not limited to the above. In addition, the material of the third metal layer 106 and the first conductive layer 103 can be the same or different, as long as the electrical connection between the two can be achieved. In addition, the third metal layer 106 can also cover the end surface of the first insulating dielectric layer 102 adjacent to the first conductive layer 103 to increase the area of ​​the third metal layer 106.

[0115] Step S2: providing a second circuit board, and forming at least three second metal connecting parts at the edge ends of the second circuit board.

[0116] In the embodiment of the present application, there are many ways to implement the provision of the second metal connection portion on the edge of the second circuit board in the above step S2.

[0117] For example, refer to Fig.16a , Fig.16a A schematic diagram of the structure of the second circuit board 2 provided in an embodiment of the present application. The second circuit board 2 may include a second insulating medium layer 202 and a second conductive layer 203 stacked in layers, and the second conductive layer 203 may be electrically connected to a second device disposed on the second circuit board 2 through routing. Based on this, a portion of the second conductive layer 203 may be used as a second metal connection portion 201. Specifically, the second metal connection portion 201 is disposed on the edge of the second circuit board 2 and includes:

[0118] A second groove 2021 is opened in a portion of the second insulating medium layer 202 located at the edge of the second circuit board 2. Along the stacking direction of the second circuit board 2, the second groove 2021 penetrates the second insulating medium layer 202, and a portion of the second conductive layer 203 located within the contour of the second groove 2021 serves as a second metal connection portion 201.

[0119] The forming method of the second slot 2021 may refer to the first slot 1021 , and will not be described in detail here.

[0120] Alternatively, the second metal connection portion 201 of the second circuit board 2 can be provided separately. Fig.16b , Fig.16b Another structural schematic diagram of the second circuit board 2 provided in an embodiment of the present application. In this embodiment, the second metal connecting portion 201 is provided on the edge of the second circuit board 2 and includes:

[0121] A fourth metal layer 206 is disposed at the edge of the second circuit board 2 , covers the end surface of the second conductive layer 203 , is conductively connected to the second conductive layer 203 , and serves as the second metal connection portion 201 .

[0122] In this embodiment, the fourth metal layer 206 can be formed on the edge of the second circuit board 2 by coating, printing or bonding, but is not limited to the above. In addition, the fourth metal layer 206 and the second conductive layer 203 can be made of the same material or different materials, as long as they can be electrically connected. The fourth metal layer 206 can also cover the end surface of the second insulating medium layer 202 adjacent to the second conductive layer 203 to increase the area of ​​the fourth metal layer 206.

[0123] Step S3: aligning the first metal connection portion and the second metal connection portion.

[0124] It is understandable that in the embodiment of the present application, the first metal connection part 101 can be arranged at any edge of the first circuit board 1 according to specific connection requirements, and the second metal connection part 201 can be arranged at any edge of the second circuit board 2 according to specific connection requirements. Fig.17a , Fig.17a A schematic diagram of an alignment process of the first metal connection part 101 and the second metal connection part 201 provided in an embodiment of the present application. The first metal connection part 101 is arranged on the first board edge 107 of the first circuit board 1, and the second metal connection part 201 is arranged on the second board edge 207 of the second circuit board 2. The first board edge 107 and the second board edge 207 can refer to Figure 9a When aligning the first metal connection part 101 with the second metal connection part 201, the first board edge 107 of the first circuit board 1 with the first metal connection part 101 can be made to fit with the second board edge 207 of the second circuit board 2 with the second metal connection part 201, and the positions of the first metal connection part 101 and the second metal connection part 201 that are electrically connected to each other can be adjusted to align them as shown in the figure. Figure 9a The structure shown.

[0125] Another example Fig.17b , Fig.17b Another schematic diagram of the alignment process of the first metal connection part 101 and the second metal connection part 201 provided in the embodiment of the present application. The first metal connection part 101 is arranged on two adjacent first board edges 107 and the third board edge 108 of the first circuit board 1, and the second metal connection part 201 is arranged on two adjacent second board edges 207 and the fourth board edge 208 of the second circuit board 2. The first board edge 107, the second board edge 207, the third board edge 108 and the fourth board edge 208 can all refer to Figure 9b When aligning the first metal connection part 101 with the second metal connection part 201, the first board edge 107 and the second board edge 207, and the third board edge 108 and the fourth board edge 208 can be aligned, and the positions of the first metal connection part 101 and the second metal connection part 201 that are electrically connected correspondingly can be adjusted to align them as shown in the following figure. Figure 9b The structure shown.

[0126] For example Fig.17c , Fig.17c Another schematic diagram of the alignment process of the first metal connection part 101 and the second metal connection part 201 provided in the embodiment of the present application. The first metal connection part 101 is arranged on the first board edge 107 of the first circuit board 1, and the second metal connection part 201 is arranged on the second board edge 207 of the second circuit board 2. The first board edge 107 and the second board edge 207 can refer to Fig.9c When aligning the first metal connection part 101 with the second metal connection part 201, the first board edge 107 of the first circuit board 1 with the first metal connection part 101 can be made to fit with the second board edge 207 of the second circuit board 2 with the second metal connection part 201, and the positions of the first metal connection part 101 and the second metal connection part 201 that are electrically connected to each other can be adjusted to align them as shown in the figure. Fig.9c The structure shown.

[0127] In addition, the first metal connection portion 101 can also be arranged on other edges of the first circuit board 1, and the second metal connection portion 201 can also be arranged on other edges of the second circuit board 2, which can all be referred to Figures 17a to 17c The process shown is aligned and will not be described in detail here.

[0128] Step S4: connecting each first metal connection portion to at least one second metal connection portion via a conductive medium.

[0129] In step S4, depending on the type of the conductive medium, a corresponding process can be used to set the conductive medium on the first metal connection part and the second metal connection part. For example, when the conductive medium is a conductive paste such as solder paste, a soldering process such as reflow soldering or wave soldering can be used to allow the molten solder paste to remain on the first metal connection part and the second metal connection part under the wetting effect between the solder paste and the first metal connection part and the second metal connection part, thereby achieving the purpose of welding. For another example, when the conductive medium is a conductive glue, conductive foam or conductive tape, it can be electrically connected to the first metal conductive part and the second metal conductive part by crimping.

[0130] In addition, in the preparation method provided in the embodiment of the present application, when the prepared first circuit board 1 is Fig.15a In the structure shown, a first metal layer can also be provided on the groove wall of the first groove 1021. In this way, when the first metal connecting part and the second metal connecting part are connected by a welding process, the liquid solder paste can remain on the first metal welding part under the wetting effect and can also remain on the first metal layer, which is conducive to improving the reliability of the connection between the first metal welding part and the conductive medium.

[0131] Similarly, when the prepared second circuit board 2 is Fig.16a In the structure shown, a second metal layer can also be provided on the groove wall of the second groove 2021. In this way, when the second metal connecting part is connected to the second metal connecting part by a welding process, the liquid solder paste can remain on the second metal welding part under the wetting effect and also on the second metal layer, which is conducive to improving the reliability of the connection between the second metal welding part and the conductive medium.

[0132] It is understandable that in the actual preparation process of the circuit board assembly, the order of the above steps can be adjusted, added or omitted according to the specific situation. In addition, a circuit board assembly including three or more circuit boards can also be prepared according to the above method, which will not be described in detail here.

[0133] The preparation method of the circuit board assembly provided in the embodiment of the present application is relatively simple, and less materials are required to electrically connect the first circuit board and the second circuit board during the preparation process. Therefore, it can effectively reduce the cost of preparing the circuit board assembly, thereby reducing the cost of the circuit board assembly prepared using the preparation method of the circuit board assembly.

[0134] The circuit board assembly provided in the above embodiments of the present application can be used in communication devices such as mobile phones, laptop computers, base stations, radar devices, vehicle-mounted devices or switch devices. Fig.18 , Fig.18A schematic diagram of the structure of a communication device provided in an embodiment of the present application. The communication device may include a housing 200, and the circuit board assembly 100 may be accommodated in the housing 200. Since the circuit board assembly 100 provided in the embodiment of the present application has a low cost, it is conducive to reducing the cost of the communication device, thereby improving the market competitiveness of the communication device.

[0135] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board assembly, characterized in that: The invention comprises a first circuit board, a first device arranged on the first circuit board, a second circuit board, a second device arranged on the second circuit board and a conductive medium, wherein: The board edge end of the first circuit board includes at least three first metal connecting parts, and the first device is electrically connected to at least one of the first metal connecting parts; The board edge end of the second circuit board includes at least three second metal connecting parts, and the second device is electrically connected to at least one of the second metal connecting parts; At least one of the first metal connection parts is electrically connected to at least one of the second metal connection parts through the conductive medium.

2. The circuit board assembly according to claim 1, wherein: The conductive medium is used to transmit data signals or control signals.

3. The circuit board assembly according to claim 1 or 2, characterized in that: The first circuit board includes a first insulating dielectric layer and a first conductive layer which are stacked together. A portion of the first insulating dielectric layer located at the edge of the first circuit board includes a first groove. The opening of the first groove faces the second circuit board, and along the stacking direction of the first circuit board, the first groove penetrates the first insulating dielectric layer. Along the stacking direction of the first circuit board, a portion of the first conductive layer located within the outline of the first groove serves as the first metal connecting portion.

4. The circuit board assembly according to claim 3, wherein: The groove wall of the first groove includes a first metal layer, and the first metal layer is electrically connected to the first metal connecting portion.

5. The circuit board assembly according to claim 3 or 4, characterized in that: The first slot is a semicircular slot or a rectangular slot.

6. The circuit board assembly according to claim 1 or 2, characterized in that: The first metal connection portion is a third metal layer disposed at the edge of the first circuit board; the first circuit board includes a first conductive layer, and the third metal layer covers the end surface of the first conductive layer.

7. The circuit board assembly according to claim 6, wherein: The first circuit board further includes a first insulating dielectric layer, which is stacked with the first conductive layer; the third metal layer also covers an end surface of the first insulating dielectric layer adjacent to the first conductive layer.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The second circuit board includes a second insulating medium layer and a second conductive layer which are stacked together, and a portion of the second insulating medium layer located at the edge of the second circuit board includes a second groove, the notch of the second groove faces the first circuit board, and along the stacking direction of the second circuit board, the second groove penetrates the second insulating medium layer; along the stacking direction of the second circuit board, a portion of the second conductive layer located within the outline of the second groove serves as the second metal connecting portion.

9. The circuit board assembly according to claim 8, wherein: The groove wall of the second groove includes a second metal layer, and the second metal layer is electrically connected to the second metal connecting portion.

10. The circuit board assembly according to claim 8 or 9, characterized in that: The second slot is a semicircular slot or a rectangular slot.

11. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The second metal connection portion is a fourth metal layer disposed at the edge of the second circuit board; the second circuit board includes a second conductive layer, and the fourth metal layer covers the end surface of the second conductive layer.

12. The circuit board assembly according to claim 11, wherein: The second circuit board further includes a second insulating dielectric layer, which is stacked with the second conductive layer; the fourth metal layer also covers an end surface of the second insulating dielectric layer adjacent to the second conductive layer.

13. The circuit board assembly according to any one of claims 1 to 12, characterized in that: The edge of the first circuit board further includes a third metal connection portion, and the third metal connection portion and the first metal connection portion are arranged along the stacking direction of the first circuit board; The board edge end of the second circuit board further includes a fourth metal connecting portion, and the fourth metal connecting portion and the second metal connecting portion are arranged along the stacking direction of the second circuit board; The third metal connection portion is connected to the fourth metal connection portion through the conductive medium.

14. The circuit board assembly according to claim 13, wherein: The first circuit board further includes a third conductive layer, the third metal connection portion is a portion of the third conductive layer located at an edge of the first circuit board, or the third metal connection portion is a fifth metal layer covering an end surface of the third conductive layer; The second circuit board also includes a fourth conductive layer, the fourth metal connection portion is a portion of the fourth conductive layer located at the edge of the second circuit board, or the fourth metal connection portion is a sixth metal layer covering the end surface of the fourth conductive layer.

15. The circuit board assembly according to any one of claims 1 to 14, characterized in that: The board surface of the first circuit board is arranged parallel to the board surface of the second circuit board.

16. The circuit board assembly according to any one of claims 1 to 14, characterized in that: The board surface of the first circuit board is arranged to intersect with the board surface of the second circuit board; the first circuit board includes a first board edge, and the at least three first metal connecting parts are arranged at the end of the first board edge; the second circuit board includes a second board edge, and the second metal connecting part is arranged at the end of the second board edge; the first board edge is parallel to or intersects with the second board edge.

17. The circuit board assembly according to any one of claims 1 to 16, characterized in that: The edge of the first circuit board further includes a fifth metal connection portion, and the fifth metal connection portion and the first metal connection portion are arranged along the stacking direction of the first circuit board; The circuit board assembly further includes a third circuit board, and a board edge end portion of the third circuit board includes a sixth metal connecting portion; The fifth metal connection portion is connected to the sixth metal connection portion through the conductive medium.

18. The circuit board assembly according to claim 17, wherein: The board surface of the third circuit board is arranged parallel to the board surface of the first circuit board, or the board surface of the third circuit board is arranged to intersect with the board surface of the first circuit board.

19. The circuit board assembly according to any one of claims 1 to 18, characterized in that: The first circuit board includes a first board edge, the first board edge is inclined along the direction from the first circuit board to the second circuit board, and the at least three first metal connecting parts are arranged at the end of the first board edge; The second circuit board includes a second board edge, the second board edge is inclined along a direction from the second circuit board to the first circuit board, and the at least three second metal connecting parts are arranged at ends of the second board edge.

20. The circuit board assembly according to any one of claims 1 to 19, characterized in that: The first circuit board includes a first board edge and a third board edge adjacent to each other, a portion of the at least three first metal connecting portions is disposed at an end of the first board edge, and another portion of the at least three first metal connecting portions is disposed at an end of the third board edge; The second circuit board includes a second board edge and a fourth board edge adjacent to each other, a portion of the at least three second metal connecting portions is disposed at an end portion of the second board edge, and another portion of the at least three second metal connecting portions is disposed at an end portion of the fourth board edge; Each of the first metal connecting portions arranged at the end of the first board edge is connected to at least one of the second metal connecting portions arranged at the end of the second board edge through the conductive medium; each of the first metal connecting portions arranged at the end of the third board edge is connected to at least one of the second metal connecting portions arranged at the end of the fourth board edge through the conductive medium.

21. The circuit board assembly according to any one of claims 1 to 20, characterized in that: The first circuit board includes a first board edge, the first board edge is a serpentine board edge, and the at least three first metal connecting parts are arranged at the end of the first board edge; the second circuit board includes a second board edge, the second board edge is a serpentine board edge, and the at least three second metal connecting parts are arranged at the end of the second board edge.

22. The circuit board assembly according to any one of claims 1 to 21, characterized in that: The conductive medium is conductive paste, conductive glue, conductive foam or conductive cloth.

23. A communication device, characterized in that: It comprises a housing and the circuit board assembly according to any one of claims 1 to 22, wherein the circuit board assembly is accommodated in the housing.

24. A method for preparing a circuit board assembly, characterized in that: The method comprises: Providing a first circuit board, forming at least three first metal connecting parts at the edge ends of the first circuit board; Providing a second circuit board, and forming at least three second metal connecting parts at the edge ends of the second circuit board; Each of the first metal connection parts is connected to at least one of the second metal connection parts through a conductive medium.

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